JP5588566B2 - Illumination light source and illumination device - Google Patents

Description

  The present invention relates to an illumination light source, and more particularly to an illumination light source and an illumination device that detect and turn on a person or the like.

  2. Description of the Related Art Conventionally, a lighting fixture including a so-called human sensor is known (for example, see Patent Document 1). Patent Document 1 discloses a lighting fixture that includes a socket on which a substantially straight tubular lamp is mounted, and a lighting control sensor at the bottom of the socket.

  And the lighting fixture of patent document 1 turns on a substantially straight tube lamp, when a person is detected with a sensor, and turns off a substantially straight tube lamp because the state which does not detect a person continued for a predetermined period. As a result, it is possible to prevent forgetting to turn off the light and to reduce power consumption.

JP 2001-291418 A

  However, in patent document 1, the sensor is attached to the lighting fixture side. For this reason, if lighting control is to be performed by a human sensor in an existing facility, a work for removing the existing lighting fixture and attaching the lighting fixture described in Patent Document 1 is required. Further, Patent Document 1 only discloses a substantially straight tube lamp, and does not disclose any illumination light source such as a bulb lamp.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide an illumination light source with a lighting control function that can be easily installed.

  An illumination light source according to an aspect of the present invention includes a base attached to a socket of a lighting fixture, a lamp body attached to the base, a sensor that detects a detection target, and a lamp body that is held by the lamp body. A light emitting element that is turned on when the detection target is detected. The lamp main body movably holds the sensor.

  For example, the lamp body may hold the sensor in a state where it can move from the surface of the lamp body to a predetermined range outside.

  As an example, the lamp body may further include a winding unit that holds the sensor in a movable state by releasing and winding a linear member having the sensor attached to the tip.

  As another example, the lamp main body further includes at least a first cylinder fixed to the lamp main body and a second cylinder holding the sensor at a tip, and the first and second cylinders are provided. The sensor may be held in a movable state by inserting or removing one of the cylinders with respect to the other.

  For example, the sensor may be configured by a detection element and a hemispherical lens covering the detection element, and the detection range may be asymmetric with respect to an axis passing through the center of the lens. And the said lamp body may hold | maintain the said sensor in the state which can rotate around the axis which passes along the center of the said lens.

  As an example, the lamp main body further includes at least a first cylindrical body fixed to the lamp main body and a second cylindrical body holding the sensor at a tip, and the first and second cylindrical bodies. The sensor may be held in a rotatable state by relative rotation with one of the two inserted into the other.

  For example, the light emitting element may be an LED (Light Emitting Diode).

  An illumination device according to an aspect of the present invention includes the illumination light source described above.

  According to the present invention, an illumination light source with a lighting control function that can be easily installed can be obtained.

FIG. 1 is a perspective view of a light bulb shaped lamp according to Embodiment 1 of the present invention. 2 is a partially cutaway side view of the light bulb shaped lamp of FIG. FIG. 3 is a plan view of the semiconductor light emitting module. FIG. 4 is a diagram illustrating an example of a movable range of a sensor mounted on the light bulb shaped lamp according to the first embodiment. FIG. 5 is a diagram illustrating an application example of the light bulb shaped lamp according to the first embodiment. FIG. 6 is a diagram illustrating an example of rotating a sensor mounted on the light bulb shaped lamp according to the first embodiment. FIG. 7 is a diagram showing another example of a light bulb shaped lamp that holds a sensor movably, and shows a state in which the sensor is closest to the globe. FIG. 8 shows another example of a light bulb shaped lamp that holds a sensor movably, and shows a state in which the sensor is furthest away from the globe. FIG. 9 is a schematic cross-sectional view of a lighting device according to an embodiment of the present invention. FIG. 10A is a perspective view of the LED unit according to Embodiment 2 when viewed from the light irradiation side. FIG. 10B is a perspective view of the LED unit according to Embodiment 2 when viewed from the base pin side. FIG. 11 is a side view and a cross-sectional view of the LED unit according to the second embodiment. FIG. 12 is a sectional view of an LED unit having another configuration according to the second embodiment. FIG. 13 is a diagram illustrating the LED unit in a state of being attached to the lighting fixture.

(Knowledge that became the basis of the present invention)
As a method for solving the above conventional problem, it is conceivable to attach a sensor to the illumination light source itself. However, if the sensor is fixed to the illumination light source, there arises a new problem that the detection range of the sensor cannot be adjusted adaptively according to the use environment of the illumination light source.

  Therefore, in order to solve such a problem, an illumination light source according to an embodiment of the present invention includes a base attached to a socket of a lighting fixture, a lamp body attached to the base, and a sensor that detects a detection target. And a light emitting element that is held by the lamp body and lights up in response to detection of the detection target by the sensor. The lamp main body movably holds the sensor.

  Hereinafter, an illumination light source according to an embodiment of the present invention will be specifically described with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. The numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements.

(Embodiment 1)
FIG. 1 is a perspective view of a light bulb shaped lamp 100 (illumination light source) according to Embodiment 1. FIG. FIG. 2 is a partially cutaway side view of the light bulb shaped lamp 100 of FIG. FIG. 3 is a plan view of the semiconductor light emitting module 140.

  As shown in FIG. 1, the light bulb shaped lamp 100 mainly includes a globe 110, a housing 120, a base 130, a semiconductor light emitting module 140, and a sensor 150. In the present specification, the globe 110 and the casing 120 may be collectively referred to as “lamp body”.

(Glove 110)
The globe 110 is a hemispherical light-transmitting cover for radiating light emitted from the semiconductor light emitting module 140 to the outside of the lamp. That is, the light emitted from the light emitting module passes through the globe 110 and is extracted to the outside.

  The globe 110 has a shape simulating a bulb of an A-type bulb that is a general bulb shape, and is attached by press-fitting the opening-side end portion of the globe 110 into the upper-side end portion of the housing 120. The shape of the globe 110 is not limited to the shape imitating a bulb of an A-type bulb, and may be any shape. The globe 110 may be fixed to the housing 120 with an adhesive or the like.

  Furthermore, the globe 110 is preferably subjected to a diffusion treatment for diffusing light emitted from the semiconductor light emitting module 140. For example, the globe 110 can be provided with a light diffusion function by forming a light diffusion film (light diffusion layer) on the inner surface or outer surface of the globe 110. Specifically, the light diffusing film can be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment or the like to the entire inner surface or outer surface of the globe 110.

  Alternatively, the globe 110 can be provided with a light diffusing function by forming light diffusing dots on the globe 110. For example, the globe 110 can be provided with a light diffusion function by forming a plurality of dots or forming minute depressions (dimples) by processing the surface of the resin globe 110. Moreover, the light diffusing function can be provided also by applying a texture to the globe 110.

  In addition, although globe 110 according to Embodiment 1 has a hemispherical shape, the present invention is not limited to this. The shape of the globe 110 may be, for example, a spheroid or an oblate sphere. Moreover, although the material of the globe 110 is not particularly limited, for example, a glass material or a resin material such as a synthetic resin can be employed.

(Case 120)
The housing 120 includes a main body portion 120a located on the globe 110 side and a proximal end portion 120b located on the base 130 side. The housing 120 also holds a base 121 for holding the semiconductor light emitting module 140 and a circuit holder 122 for holding the circuit unit 123 therein. More specifically, the housing 120 holds the semiconductor light emitting module 140 such that a main emission direction of a semiconductor light emitting element 142 described later faces the globe 110.

  The main body portion 120a has a truncated cone shape whose diameter gradually increases from the base end portion 120b side toward the globe 110 side, and has one end (small diameter side) connected to the base end portion 120b and the other end (large diameter side). ) Is open. And the glove | globe 110 is press-fit in the opening part of the main-body part 120a. The base end portion 120b has a truncated cone shape that gradually increases in diameter from the base 130 side toward the main body portion 120a side. One end (small diameter side) is open and the other end (large diameter side) is the main body portion 120a. It is connected to the. And the circuit holder 122 is connected to the opening part of the base end part 120b.

  The housing 120 is preferably made of a metal material. Thereby, the housing 120 functions as a heat sink that efficiently dissipates heat generated from the semiconductor light emitting module 140 and the circuit unit 123 to the outside of the light bulb shaped lamp 100.

  Specific examples of the metal material constituting the housing 120 include, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy composed of two or more of these, or an alloy of Cu and Ag. . Since such a metal material has good thermal conductivity, the heat propagated to the housing 120 can be efficiently propagated to the base 130 side. Therefore, the heat generated from the semiconductor light emitting module 140 and the circuit unit 123 can be dissipated to the lighting fixture side via the base 130.

  In addition, the housing | casing 120 which concerns on Embodiment 1 is comprised with the aluminum alloy material. In addition, in order to improve the thermal emissivity of the housing 120, the surface of the housing 120 may be anodized. In addition, the material of the housing | casing 120 is not limited to a metal, Resin may be sufficient. For example, the housing 120 can be made of a resin having high thermal conductivity.

(Base 121)
The base 121 has, for example, a substantially annular shape having a through-hole penetrating in the thickness direction at the center. In the first embodiment, the cylinder axis coincides with (is parallel to) the lamp axis J (axis of the base 130). ) Is arranged to be. The upper surface of the base 121 is a plane orthogonal to the lamp axis J and serves as a mounting surface for the semiconductor light emitting module 140.

  The “cylinder axis” refers to an axis that passes through the center of the base 121 and is orthogonal to the mounting surface, and generally coincides with the main emission direction of the semiconductor light emitting element 142. However, the cylinder axis of the base 121 is not necessarily parallel to the lamp axis J, and may be inclined in a predetermined direction with respect to the lamp axis J. That is, the cylinder axis can be set in any direction in which light output from the semiconductor light emitting element 142 is desired to be irradiated.

  The base 121 is made of, for example, a metal material having high thermal conductivity. As specific examples of the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, or an alloy composed of two or more of them, or an alloy of Cu and Ag can be considered. Thereby, the heat generated in the semiconductor light emitting module 140 can be efficiently conducted to the housing 120.

  As an example, the base 121 can be a substantially disk-shaped metal substrate molded by aluminum die casting. In this manner, by configuring the base 121 with a metal material, the base 121 can also function as a heat radiator for conducting heat generated from the semiconductor light emitting module 140 to the housing 120.

  Further, as a method for fixing the semiconductor light emitting module 140 to the upper surface of the base 121, for example, screwing, adhesion or engagement may be considered. Moreover, the base 121 is not limited to a substantially annular shape, and may have any shape. Further, the upper surface of the base 121 does not necessarily have to be entirely flat as long as the semiconductor light emitting module 140 can be arranged in a plane. Furthermore, the lamp axis J and the mounting surface do not necessarily need to be orthogonal to each other, and it is sufficient if they intersect at a predetermined angle.

(Circuit holder 122)
The circuit holder 122 includes a substantially cylindrical main body portion 122a having one end opened, and a connecting portion 122b having a thread groove formed on the outer peripheral surface. In the circuit holder 122, the open end of the main body portion 122 a is connected to the cap member 125, and the connecting portion 122 b is connected to the base 130. Although the material which comprises the circuit holder 122 is not specifically limited, For example, what is necessary is just to form with insulating materials, such as resin.

  Although the base 121 is located on the globe 110 side of the circuit holder 122, the circuit holder 122 and the base 121 are not in direct contact with each other, and a gap is provided between them. Further, the outer wall surface of the circuit holder 122 and the inner wall surface of the housing 120 are not in direct contact, and a gap is provided between them.

  As described above, by providing a gap between the circuit holder 122 and the base 121 (or the housing 120), the heat generated in the semiconductor light emitting module 140 is transmitted via the base 121 and the housing 120. Propagation can be suppressed. Thereby, since the temperature rise of the circuit holder 122 can be suppressed, the circuit unit 123 can be prevented from being thermally destroyed.

(Circuit unit 123)
The circuit unit 123 is for lighting the semiconductor light emitting element 142, and is composed of various electronic components (not shown) mounted on the circuit board 124. The circuit unit 123 is housed in the circuit holder 122 and the cap member 125. As a method of fixing the circuit unit 123 to the circuit holder 122 and the cap member 125, for example, screwing, adhesion, engagement, or the like can be considered.

  The circuit board 124 is arranged so that its main surface is parallel to the lamp axis J. In this way, the circuit unit 123 can be stored in the circuit holder 122 more compactly. Of the electronic components constituting the circuit unit 123, the relatively weak heat-sensitive electronic component is disposed below the circuit board 124 far from the semiconductor light emitting module 140. On the other hand, the relatively heat-resistant electronic component is disposed on the upper side of the circuit board 124 close to the semiconductor light emitting module 140. Thereby, it is possible to effectively prevent the electronic component from being thermally destroyed by the heat generated in the semiconductor light emitting module 140.

(Cap member 125)
The cap member 125 has a hollow, substantially truncated cone shape, and an open end portion on the large diameter side is connected to the circuit holder 122, and a through hole through which the wiring 155 is passed is formed on the end portion on the small diameter side. The cap member 125 can be formed of the same material as the circuit holder 122, for example.

(Base 130)
The base 130 is a power receiving unit for receiving AC power through two contact points, and is attached to a socket (not shown) of a lighting fixture. The base 130 according to Embodiment 1 conforms to the E17 base standard defined in JIS (Japanese Industrial Standards), but the present invention is not limited to this. In other words, the base 130 may be configured to conform to other standards (E26 base, etc.) defined by JIS so that it can be attached to a socket of another lighting fixture.

  The base 130 includes a cylindrical shell 131 having a thread groove formed on the outer peripheral surface and the inner peripheral surface, and an eyelet 132 attached to the tip of the shell 131. The thread groove on the outer peripheral surface of the shell 131 is screwed into the socket of the lighting fixture. Thereby, the light bulb shaped lamp 100 is fixed to the lighting fixture. Further, the thread groove on the inner peripheral surface of the shell 131 is screwed into the thread groove of the connecting portion 122 b of the circuit holder 122. As a result, the circuit holder 122 and the base 130 are fixed.

  Further, the circuit unit 123 and the base 130 are electrically connected by a stranded wire 160 including the first and second feeder lines 161 and 162. More specifically, the first power supply line 161 electrically connects the circuit unit 123 and the shell 131. The second power supply line 162 electrically connects the circuit unit 123 and the eyelet 132.

(Semiconductor light emitting module 140)
FIG. 3 is a plan view showing the semiconductor light emitting module 140 according to the first embodiment. The semiconductor light emitting module 140 shown in FIG. 3 is provided on the mounting substrate 141 so as to cover the mounting substrate 141, a plurality of semiconductor light emitting elements 142 as light sources mounted on the mounting substrate 141, and the semiconductor light emitting elements 142. Sealing body 143 provided.

  The semiconductor light emitting element 142 according to the first embodiment is an LED (Light Emitting Diode). That is, the semiconductor light emitting module 140 is an LED module. However, a semiconductor laser or the like may be used for the semiconductor light emitting element 142, for example. Further, a light emitting element such as an organic EL element or an inorganic EL element may be used instead of the semiconductor light emitting element 142.

  The mounting substrate 141 has a substantially annular shape having a substantially circular hole at the center, and the semiconductor light emitting element 142 is mounted on one surface (the upper surface in FIG. 2). Although the material which comprises the mounting substrate 141 is not specifically limited, For example, the ceramic substrate which consists of alumina etc. can be used.

  A tongue piece 144 extending toward the center of the hole is formed at one location on the inner peripheral edge of the mounting substrate 141. The tongue piece 144 is provided with a connector 146 to which the wiring 145 of the circuit unit 123 is connected. Then, as shown in FIG. 2, the semiconductor light emitting module 140 and the circuit unit 123 are electrically connected by connecting the wiring 145 to the connector 146. The semiconductor light emitting element 142 emits light when DC power is supplied from the circuit unit 123 through the wiring 145.

  The semiconductor light emitting elements 142 are sealed with, for example, a substantially rectangular parallelepiped sealing body 143 as a set of two. In the example of FIG. 3, 16 sets of sealing bodies 143 (that is, 32 semiconductor light emitting elements 142) are arranged in an annular shape on the surface of the mounting substrate 141 so as to be point-symmetric with respect to the lamp axis J. Has been. In other words, the longitudinal direction of each sealing body 143 coincides with the radial direction of the mounting substrate 141 and is arranged radially about the lamp axis J. The number of semiconductor light emitting elements 142 is not limited to a plurality, and may be one. Further, the arrangement of the semiconductor light emitting elements 142 is not limited to an annular shape, and may be a matrix, for example.

  The sealing body 143 is mainly made of a translucent material. In addition, when it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 142 to a predetermined wavelength, a wavelength conversion material that converts the wavelength of light is mixed into the translucent material. As the translucent material, for example, a silicone resin can be used. Moreover, as the wavelength conversion material, for example, phosphor particles can be used.

  In the first embodiment, a semiconductor light emitting element 142 that emits blue light and a sealing body 143 formed of a translucent material mixed with phosphor particles that convert the wavelength of blue light into yellow light are employed. . That is, a part of the blue light emitted from the semiconductor light emitting element 142 is wavelength-converted into yellow light by the sealing body 143, and white light generated by mixing the unconverted blue light and the converted yellow light is the semiconductor. The light is emitted from the light emitting module 140.

  Further, the semiconductor light emitting module 140 may be, for example, a combination of a semiconductor light emitting element that emits ultraviolet light and each color phosphor particle that emits light in three primary colors (red, green, and blue). Further, as the wavelength conversion material, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment may be used. The semiconductor light emitting element 142 is arranged with its main emission direction facing upward along the lamp axis J direction.

(Sensor 150)
The sensor 150 is typically a so-called human sensor that detects the presence or absence of a person in the vicinity (within the irradiation range) of the light bulb shaped lamp 100. As shown in FIG. 2, the sensor 150 includes a detection element 151, a lens 152, a control circuit 153, and a mounting board 154. The sensor 150 according to the first embodiment is held on the surface of the globe 110 so as to be positioned on the lamp axis J.

  The detection element 151 is an element that detects a detection target (in this example, a person), and detects far infrared rays emitted from the human body. The lens 152 has a translucent hemispherical shape and is disposed so as to cover the detection element 151. The lens 152 focuses external light (in this example, far infrared rays emitted from the outside toward the sensor 150) on the detection element 151. That is, the lens 152 determines the detection range (detection angle) of the sensor 150.

  The control circuit 153 is connected to the circuit unit 123 through a wiring 155 and notifies the circuit unit 123 of the detection result of the detection element 151 through the wiring 155. The mounting substrate 154 holds the detection element 151 and the control circuit 153. Specifically, the mounting substrate 154 holds the detection element 151 on one main surface and the control circuit 153 on the other main surface, and connects the detection element 151 and the control circuit 153 through a through hole (not shown). What is necessary is just to connect electrically. The mounting substrate 154 is fitted into the opening of the lens 152 with the detection element 151 facing the lens 152.

  The light bulb shaped lamp 100 including the sensor 150 configured as described above operates, for example, as follows.

  First, when the light bulb shaped lamp 100 is turned off and a person enters the detection range of the sensor 150, the detection element 151 detects far infrared rays emitted from the person. Next, the control circuit 153 notifies the circuit unit 123 that the far infrared ray (that is, a person) has been detected by the detection element 151. The circuit unit 123 that has received the notification from the control circuit 153 supplies power to the semiconductor light emitting module 140. Thereby, the semiconductor light emitting element 142 emits light (the light bulb shaped lamp 100 is lit).

  On the other hand, when the light bulb shaped lamp 100 is turned on and the state where the detection element 151 does not detect far infrared rays continues for a predetermined time, the circuit unit 123 stops supplying power to the semiconductor light emitting module 140. Thereby, the light bulb shaped lamp 100 is turned off.

  In this way, by turning on only when a person is detected and turning off when there is no person, it is possible to obtain a light bulb shaped lamp 100 that can prevent forgetting to turn off and at the same time reduce power consumption. Further, since the sensor 150 is mounted not on the lighting fixture but on the light bulb shaped lamp 100 itself, lighting control by the human sensor can be easily realized even with an existing lighting fixture (without a sensor).

  Further, since the light bulb shaped lamp 100 employs an LED having a very long life as a light emitting element, even if the sensor 150 is mounted on the light bulb shaped lamp 100 itself, it does not lead to a significant cost increase.

  Here, it is desirable that the detection range of the sensor 150 can be adaptively changed according to the use environment of the light bulb shaped lamp 100 (that is, the place where the light bulb shaped lamp 100 is installed). Specifically, it is desirable that the position of the sensor 150 can be changed (movable) or the direction of the sensor 150 can be changed (rotatable).

  Therefore, in the light bulb shaped lamp 100 according to Embodiment 1, the globe 110 (or the housing 120) holds the sensor 150 movably. FIG. 4 is a diagram illustrating an example of a movable range of the sensor 150 mounted on the light bulb shaped lamp 100 according to the first embodiment. FIG. 5 is a diagram illustrating an application example of the light bulb shaped lamp 100 according to the first embodiment.

  As shown in FIG. 4, the sensor 150 can move from the surface of the globe 110 to a predetermined range. The “predetermined range” in the example of FIG. 4 is a range determined by the length of the wiring 155 that is an example of a linear member. That is, in a state where the sensor 150 is attached to the surface of the globe 110, there is a margin in the length of the wiring 155 (a state where the wiring is not fully extended).

  The wiring 155 in this state may be bent in the globe 110 (or in the cap member 125), but may be wound up by the winding unit 156. In the example of FIG. 4, the winding unit 156 disposed in the cap member 125 releases the wiring 155 when the sensor 150 is pulled out, and winds the wiring 155 when the sensor 150 is moved closer to the globe 110. As a result, the wiring 155 is always pulled (tensioned) regardless of the position of the sensor 150.

  For example, as shown in FIG. 5, when the light bulb shaped lamp 100 is covered with a translucent cover 170, the sensor 150 is blocked by the cover and cannot detect far infrared rays. Therefore, the sensor 150 is pulled out from the surface of the globe 110 and exposed to the outside of the cover 170 through a through hole provided in the cover 170. Thereby, the lighting control by the sensor 150 is possible in a state where the light bulb shaped lamp 100 is covered with the cover 170.

  In addition, the globe 110 (or the housing 120) may hold the sensor 150 in a state where it can rotate around an axis passing through the center of the lens 152. FIG. 6 is a diagram illustrating an example of rotating the sensor 150 mounted on the light bulb shaped lamp 100 according to the first embodiment.

  For example, as shown in FIG. 6, the sensor 150 is pulled out from the surface of the globe 110, and the sensor 150 is moved at an arbitrary angle around an axis passing through the center of the lens 152 (in the example of FIG. 6, coincides with the lamp axis J). The sensor 150 can be attached to the surface of the globe 110 by rotating. This operation can be realized by the configuration of the light bulb shaped lamp 100 described with reference to FIGS.

  However, the light bulb shaped lamp 100 in this case preferably further includes a rotation restricting means for limiting the rotation range of the sensor 150 to a predetermined range (for example, 360 °) in order to prevent the wire 155 from being disconnected.

  Further, when the sensor 150 is rotated, it is desirable to configure the sensor 150 so that the detection range is asymmetric with respect to the lamp axis J. Specifically, the detection range on one side (left side in the example of FIG. 6) of the lamp axis J is widened, and the detection range on the opposite side (right side in the example of FIG. 6) is narrowed. Then, by rotating such a sensor 150 by an arbitrary angle as described above, it is possible to widen a detection range in a desired direction or narrow a detection range in a desired direction.

  In the example of FIG. 6, the detection range of the sensor 150 is made asymmetric with respect to the lamp axis J by making the light collection range (condensing angle) of the lens 152 of the sensor 150 asymmetric with respect to the lamp axis J. Yes. This can be realized, for example, by designing the lens 152 so that the light distribution is asymmetric with respect to the lamp axis J. Alternatively, this can also be realized by shielding the side of the lens 152 on which the condensing range is to be narrowed (the right side in the example of FIG. 6) with a seal or the like.

  However, the method of making the detection range of the sensor 150 asymmetric with respect to the lamp axis J is not limited to the above example. For example, the detection range of the sensor 150 can be asymmetric with respect to the lamp axis J by installing the sensor 150 at an angle with respect to the lamp axis J.

  Although FIG. 6 shows an example in which the sensor 150 is pulled out from the surface of the globe 110 and rotated, the present invention is not limited to this. That is, the sensor 150 may be rotated while being attached to the surface of the globe 110. 6 illustrates an example in which the sensor 150 is rotated around an axis passing through the center of the lens 152, the present invention is not limited to this. For example, the sensor 150 may be rotated around the center of the hemispherical lens 152 so that the axis passing through the center of the lens 152 is inclined with respect to the lamp axis J.

  In the above example, the sensor 150 is held movably by giving a margin to the length of the wiring 155, but the present invention is not limited to this. For example, the movable range of the sensor 150 may be limited by a linear member different from the wiring 155. Note that the linear member in this case is preferably shorter than the wiring 155. Thereby, it is possible to prevent the wiring 155 from being overloaded and disconnected.

  Further, the method of holding the sensor movably is not limited to the above example. 7 and 8 are other examples of a bulb-type lamp that holds the sensor movably, in a state where the sensor is closest to the globe (FIG. 7) and a state where the sensor is farthest from the globe (FIG. 8). ).

  7 and 8 includes first and second cylindrical bodies 271 and 272 having different diameters. In this example, the diameter of the first cylindrical body 271 is slightly larger than the diameter of the second cylindrical body 272. However, the present invention is not limited to this, and the diameter of the second cylindrical body 272 is the first diameter. The cylinder body 271 may be slightly larger.

  The first cylindrical body 271 has a cylindrical shape, and one end is fixed to the light bulb shaped lamp 200. The second cylinder 272 has a cylindrical shape, and a sensor 250 is attached to one end. In the example of FIG. 7, the second cylinder 272 is housed inside the first cylinder 271. The wiring 255 at this time is held inside the second cylindrical body 272 in a state having a margin in length (a bent state). However, unnecessary portions of the wiring 255 may be wound up by the winding unit described above.

  Then, when the sensor 250 is pulled out from the state of FIG. 7, the second cylinder 272 is pulled out from the first cylinder 271 as shown in FIG. 8, and the sensor 250 is separated from the surface of the globe 210. Will be held in. Thus, by inserting (withdrawing) the second cylinder 272 from the first cylinder 271 (sliding), the sensor 250 can be held in a movable state from the surface of the globe 210 to a predetermined range. .

  However, it is desirable to provide a restricting means for restricting the movement of the second cylinder 272 in the first cylinder 271 so that the second cylinder 272 does not completely fall out of the first cylinder 271. Although the specific example of a control means is not specifically limited, For example, it can be made to function as a control means by adjusting the length of the wiring 255. FIG. That is, the length of the wiring 255 may be adjusted before the second cylindrical body 272 is dropped from the first cylindrical body 271.

  Further, by rotating the second cylinder 272 within the first cylinder 271, the sensor 250 can be rotated by an arbitrary angle around an axis passing through the center of the lens 252. At this time, the configuration that makes the rotation of the sensor 250 within a predetermined range and the configuration in which the detection range of the sensor 250 is asymmetric with respect to the lamp axis J are the same as those already described. Omitted.

  7 and 8, the example in which the sensor 250 is movably held using two cylinders has been described, but it goes without saying that three or more cylinders may be used. That is, a cylindrical body on the side fixed to the light bulb shaped lamp 200 (in this example, the first cylindrical body 271), and a cylindrical body on the side holding the sensor 250 (in this example, the second cylindrical body 272), One or more cylinders may be arranged between the two.

  In this way, by increasing the number of stages of the cylinders, particularly when the sensor 250 is movably held, if the movable range of the sensor 250 is the same as the above example, the length of each cylinder is shortened. If the length of each cylinder is the same as that in the above example, the movable range of the sensor 250 can be extended.

  In the light bulb shaped lamps 100 and 200, the sensors 150 and 250 are arranged on the lamp axis J, but the present invention is not limited to this. That is, the sensor can be attached to any position of the globe. For example, in the case where the base is attached to be inclined with respect to the lamp axis J, the sensors 150 and 250 may be attached in the same manner. That is, it is desirable that the sensors 150 and 250 be mounted on an extension line of the cylindrical axis of the base (main emission direction of the semiconductor light emitting element).

  The attachment positions of the sensors 150 and 250 are not limited to the globes 110 and 210, and may be attached to the casings 120 and 220. That is, the sensors 150 and 250 can be attached to any position of the lamp body.

  Further, in each of the above examples, the passive sensors 150 and 250 that detect far infrared rays have been described, but the present invention is not limited to this. For example, an active sensor that detects a detection target (typically a person) by outputting an electromagnetic wave and detecting a reflected wave thereof may be used.

  The present invention can be realized not only as such light bulb shaped lamps 100 and 200 but also as an illumination device including such light bulb shaped lamps 100 and 200. Hereinafter, a lighting device according to an embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic cross-sectional view of a lighting device 300 according to an embodiment of the present invention.

  As shown in FIG. 9, the lighting device 300 according to one embodiment of the present invention is used by being mounted on an indoor ceiling 400, and includes a light bulb shaped lamp 100 according to one embodiment of the present invention and a lighting fixture 320. .

  The lighting fixture 320 turns off and turns on the light bulb shaped lamp 100 and includes a fixture main body 321 attached to the ceiling 400 and a lamp cover 322 that covers the light bulb shaped lamp 100. The instrument body 321 has a socket 321a. The base 130 of the light bulb shaped lamp 100 is screwed into the socket 321a. Electric power is supplied to the light bulb shaped lamp 100 through the socket 321a.

  Note that the lighting device 300 shown here is an example, and the present invention is not limited to this. In other words, the lighting device according to one embodiment of the present invention may have any form as long as it holds the light bulb shaped lamp 100 and includes at least a socket for supplying power to the light bulb shaped lamp 100. . Moreover, although the illuminating device 300 shown in FIG. 9 was provided with the one lightbulb-shaped lamp 100, you may provide the some lightbulb-shaped lamp 100. FIG. Furthermore, in addition to the light bulb shaped lamp 100, a light bulb shaped lamp 200 can be attached to the lighting device 300 shown in FIG.

(Embodiment 2)
In Embodiment 1, the present invention is realized as a light bulb shaped lamp and an illumination device including the same. However, the present invention can also be realized as another illumination light source or illumination device.

  For example, the present invention is also applicable to an LED unit having a flat thin structure, which is an illumination light source used in an LED illumination device such as a downlight or a spotlight. Hereinafter, Embodiment 2 demonstrates the example which implement | achieves this invention as an LED unit and an illuminating device provided with the same.

  10A is a perspective view when the LED unit according to Embodiment 2 is viewed from the light irradiation side, and FIG. 10B is a perspective view when the LED unit according to Embodiment 2 is viewed from the base pin side. is there.

  As shown in FIGS. 10A and 10B, the LED unit 500 according to Embodiment 2 is an LED unit 500 having a flat thin structure whose overall shape is a disk shape or a flat shape, and includes a translucent cover 510 and a housing. An envelope is constituted by the body 520 (lamp body) and the support base 530. As the base structure of the LED unit 500, for example, a GX53 base or a GH76p base is adopted.

  The LED unit 500 is attached to a lighting fixture by rotating in a predetermined rotation direction. In the second embodiment, the “predetermined rotation direction” is a direction when the LED unit 500 is rotated about the lamp axis J1 as a rotation axis. For example, as shown in FIGS. 10A and 10B, the LED unit 500 can be attached to the lighting fixture by rotating the LED unit 500 in the rotation direction R around the lamp axis J1. Moreover, the LED unit 500 can be removed from the lighting fixture by rotating the LED unit 500 in the direction opposite to the rotation direction R around the lamp axis J1.

  In the second embodiment, the light irradiation side is the side from which light is emitted, and is the side from which light is extracted from the LED unit 500 (light irradiation side) with reference to the LED unit 500. 10A, the light irradiation side is on the upper side, and in FIG. 10B, the light irradiation side is on the lower side.

  Next, a detailed configuration of the LED unit 500 according to Embodiment 2 will be described with reference to FIG. FIG. 11 is a side view and a cross-sectional view of the LED unit 500 according to the second embodiment. FIG. 11A is a side view of the LED unit 500, and FIG. 11B is a cross-sectional view of the LED unit. FIG. 11 is a diagram when the light irradiation side is the lower side.

  As shown in FIG. 11, the LED unit 500 according to the second embodiment includes a sensor 150, a translucent cover 510, a housing 520, a support base 530, an LED module 540, a circuit board 560 (drive). Circuit), a heat conductive sheet 570, and a connection pin 580.

  The translucent cover 510 is made of a translucent material in order to extract light emitted from the LED module 540 to the outside of the lamp. For example, a resin material such as acrylic (PMMA) or polycarbonate (PC) is used. It is configured. The translucent cover 510 may have a transparent structure without light diffusibility or a diffusion structure with light diffusibility. For example, a milky white light diffusing film may be formed by applying a resin or a white pigment containing a light diffusing material such as silica or calcium carbonate on the inner surface of the translucent cover 510, or minute irregularities may be formed on the translucent cover 510. Or the like, the translucent cover 510 having a light diffusion function can be configured.

  The translucent cover 510 is fixed to the housing 520 so as to close the first opening 520a in order to protect the LED module 540 and the circuit board 560 disposed inside the housing 520.

  The housing 520 is a flat plate-like cylindrical member that houses the LED module 540 and the circuit board 560. As shown in FIG. 11B, the first opening 520a formed on the light irradiation side and the light irradiation And a second opening 520b formed on the side opposite to the side. A translucent cover 510 is attached to the first opening 520a.

  The housing 520 is fixed to the support base 530 with, for example, three screws. The housing 520 is made of an insulating resin material such as PBT (polybutylene terephthalate). Note that the housing 520 may be made of metal instead of resin.

  The support base 530 is a support member that supports the circuit board 560 and the housing 520. The support base 530 also functions as a heat sink that dissipates heat generated by the LED module 540. Therefore, the support base 530 is preferably composed of a metal material such as aluminum or a resin material having high thermal conductivity. As shown in FIG. 11B, the support base 530 is disposed so as to close the second opening 520 b of the housing 520.

  In addition, the support base 530 is connected to the lighting fixture via the heat conductive sheet 570. The support base 530 functions as a predetermined base connected to the lighting fixture together with the housing 520 and the connection pins 580. The LED unit 500 has a standardized base structure that fits into a socket of a lighting fixture. Examples of such a base structure include a GX53 base and a GH76p base as described above.

  The LED module 540 is a light source in the LED unit 500 and emits light of a predetermined color (wavelength) such as white. The LED module 540 (substrate 541) is an annular (donut-shaped) substrate in which a circular opening is formed, and is disposed in the housing 520.

  The LED module 540 emits light by power supplied from the circuit board 560. The light emitted from the LED module 540 passes through the translucent cover 510 and is emitted outside the lamp.

  As shown in FIG. 11B, the LED module 540 can be configured by, for example, a substrate 541 and a light emitting unit 542.

  The LED module 540 has a so-called COB (Chip On Board) structure in which a bare chip (LED) is directly mounted on a substrate 541. However, the configuration of the LED module 540 is not limited to this configuration.

  For example, the light emitting unit 542 includes a package made of a resin container having a recess (cavity), an LED chip mounted in the recess, and a sealing member (phosphor-containing resin) sealed in the recess. LED elements (SMD type LED elements) may be used. That is, the LED module 540 may be an SMD type LED module configured by mounting a plurality of such LED elements on a substrate 541 on which metal wiring is formed.

  As the substrate 541, a ceramic substrate, a resin substrate, or a metal base substrate can be used. The LED module 540 is held in the housing 520 by screwing the substrate 541 and the housing 520, for example.

  The circuit board 560 is a printed board on which metal wiring is patterned. As shown in FIG. 11B, the circuit board 560 is placed on the support base 530 and fixed to the support base 530. For example, the circuit board 560 and the support base 530 can be fixed by applying an adhesive between the circuit board 560 and the support base 530.

  The circuit board 560 may have a rectangular shape in plan view, but may have a polygonal shape such as a hexagon or octagon or a circular shape in plan view.

  A driving circuit (not shown) for causing the LED module 540 (light emitting unit 542) to emit light is provided on the main surface of the circuit board 560 on the light irradiation side. For example, the drive circuit converts AC power (for example, power from an AC 100 V commercial power supply) supplied from the connection pin 580 into DC power, and supplies the DC power to the LED module 540. Note that the power supplied to the drive circuit (circuit board 560) may be DC power instead of AC power.

  Examples of circuit elements (not shown) constituting the drive circuit include capacitive elements such as electrolytic capacitors and ceramic capacitors, resistance elements, coil elements, choke coils (choke transformers), noise filters, diodes, and integrated circuit elements. A semiconductor element or the like. Many of the circuit elements are mounted on the main surface of the circuit board 560 on the light irradiation side.

  The drive circuit configured as described above is housed in the housing 520 and covered with a cover member 590. The cover member 590 is preferably an insulating member.

  The heat conductive sheet 570 is a sheet for releasing heat from the LED module 540 transmitted through the support base 530 to the lighting fixture side. Specifically, the heat conductive sheet 570 is a resin sheet having high heat conductivity, and for example, a silicon sheet or an acrylic sheet can be used.

  The connection pin 580 (cap pin) is a conductive pin and has a function of receiving power for causing the LED module 540 to emit light from the outside of the lamp. That is, the connection pin 580 is an electrical connection pin for supplying power.

  For example, predetermined AC power is received from the lighting fixture by the pair of connection pins 580. Each connection pin 580 and the circuit board 560 are connected by a lead wire (not shown), and the AC voltage received by the pair of connection pins 580 is supplied to the circuit board 560 (drive circuit) via the lead wire. The Note that the pair of connection pins 580 receive AC voltage, but may be configured to receive two different DC voltages.

  Moreover, the connection pin 580 functions also as an attachment part for attaching the LED unit 500 to a lighting fixture. Specifically, the LED pin 500 is held by the lighting fixture by connecting the connection pin 580 to the socket of the lighting fixture.

  The connection pin 580 is configured to protrude to the outside from a surface opposite to the light irradiation side surface of the housing 520. The connection pin 580 is fixed by being press-fitted into a through hole provided in the housing 520, for example.

  Two connection pins 580 are provided for power supply, but in addition to connection pins for power supply, electrical connection pins for signals for receiving electrical signals such as dimming signals, or others A connection pin having the above functions may be provided.

  The sensor 150 has the same configuration as that described in the first embodiment. The sensor 150 is connected to the circuit board 560 by a wiring 555. In the LED unit 500, the translucent cover 510 (or the housing 520) holds the sensor 150 in a movable and rotatable state. Specifically, the sensor 150 is held in an opening 515 provided at the center of the translucent cover 510 (a region near the lamp axis J1).

  As in the first embodiment, the sensor 150 can move from the surface of the translucent cover 510 to a predetermined range. In addition, the sensor 150 is pulled out from the surface of the translucent cover 510, rotated at an arbitrary angle, and attached to the surface of the translucent cover 510.

  In addition, when implement | achieving this invention as an LED unit, the structure of an LED unit is not limited to the above structures.

  FIG. 12 is a sectional view of an LED unit having another configuration according to the second embodiment. FIG. 12 is a cross-sectional view when the light irradiation side is the lower side. Note that the outer shape and the like of the LED unit shown in FIG. 12 are substantially the same as those described in FIG. 10A, FIG. 10B, and FIG.

  The LED unit 500a shown in FIG. 12 differs from the LED unit 500 in the LED module 540a, the circuit board 560a, and the arrangement of the sensor 150. The LED unit 500a is different from the LED unit 500 in that the reflection plate 550 is provided. Other configurations are almost the same as those of the LED unit 500. Hereinafter, the difference will be mainly described.

  The LED module 540a includes a substrate 541a and a light emitting unit 542a, and is mounted on the support base 530 and fixed to the support base 530. That is, the position of the LED module 540a in the LED unit 500a corresponds to the position of the circuit board 560 in the LED unit 500. The LED module 540a and the support base 530 are fixed by applying an adhesive between the LED module 540a and the support base 530, for example.

The shape of the substrate 541a is a plane view shape can be used as a rectangular shape, the plan view shape may be used as a polygonal shape or a circular shape such as a hexagon or octagon.

  The LED module 540a may be an SMD type as described above or a COB type.

  The circuit board 560a is an annular (doughnut-shaped) board in which a circular opening is formed, and is arranged inside the housing 520 and outside the reflector 550. That is, the position of the circuit board 560 a in the LED unit 500 a corresponds to the position of the LED module 540 in the LED unit 500.

  In the LED unit 500a, a reflecting plate 550 (reflecting mirror) is disposed between the translucent cover 510 and the LED module 540a. The reflection plate 550 is a reflection member having a reflection function, and includes an incident port that is an opening through which light from the LED module 540a is incident and an emission port that is an opening through which light incident from the incident port is emitted from the reflection plate 550. Have. Reflector plate 550 in the present embodiment has a truncated cone shape configured such that the inner diameter gradually increases from the entrance to the exit. Specifically, the reflecting plate 550 has a trumpet shape (funnel shape).

  The entrance is configured to surround the light emitting region (light emitting unit 542a) of the LED module 540a. Further, the opening area of the emission port is substantially the same as the area of the flat portion of the translucent cover 510.

  In addition, the inner surface of the reflecting plate 550 is a reflecting surface that reflects light from the LED module 540a. The reflection surface is configured to reflect the light incident from the incident port and output the light from the output port. The light from the LED module 540 a is guided to the translucent cover 510 by the reflector 550.

  The reflector 550 can be made of, for example, a hard white resin material having insulating properties. In order to improve the reflectance, the reflection surface may be configured by coating the inner surface of the resin-made reflection plate 550 with a metal vapor deposition film (metal reflection film) made of a metal material such as silver or aluminum. Absent. Moreover, you may shape | mold the whole reflecting plate 550 using metal materials, such as aluminum, without using a resin material.

  The sensor 150 is connected to the circuit board 560a by the wiring 555a, and is held in a movable and rotatable state by the translucent cover 510 (or the housing 520). Specifically, the sensor 150 is held in an opening 515 a provided in the peripheral portion of the translucent cover 510 and the reflection plate 550. As described above, since the sensor 150 is held at the peripheral portion of the translucent cover 510, there is an effect that the sensor 150 does not easily block the light of the LED unit 500a.

  Similarly to the LED unit 500, the sensor 150 can move from the surface of the translucent cover 510 to a predetermined range, is pulled out from the surface of the translucent cover 510, is rotated at an arbitrary angle, and is transmitted. Attached to the surface of the light cover 510.

  The position where the sensor 150 is attached is not limited to the translucent cover 510, and may be attached to the housing 520, for example. In addition, when the LED unit 500a is attached to a lighting fixture, the sensor 150 may be attached to the lighting fixture.

  FIG. 13 is a diagram showing the LED unit 500a attached to the lighting fixture.

  As shown in FIG. 13, the sensor 150 may be pulled out from the LED unit 500 a and attached to the lighting fixture 600.

  As described above, in the second embodiment, the example in which the present invention is applied to the LED unit having the flat thin structure has been described. However, the present invention can also be realized as another illumination light source. For example, the present invention can also be realized as a straight tube LED lamp or an annular LED lamp which is a light source for illumination.

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to the thing of illustrated embodiment. The above embodiment and the above modification examples can be arbitrarily combined. In addition, various modifications and variations can be made to the illustrated embodiment within the same range or equivalent range as the present invention.

  The present invention is advantageously used for a light bulb shaped lamp.

100,200 Light bulb shaped lamp (light source for illumination)
110,210 Grove 120,220,520 housing 120a, 122a body portion 120b proximal end 121 base plate 122 circuit holder 122b connecting portion 123 circuit unit 124,560,560a circuit board 125 cap member 130,23 0 mouthpiece 131 Shell 132 Eyelet 140 Semiconductor light emitting module 141 Mounting board 142 Semiconductor light emitting element 143 Sealed body 144 Tongue piece 145, 155, 255, 555, 555a Wiring 146 Connector 150, 250 Sensor 151 Detection element 152, 252 Lens 153 Control circuit 154 Mounting board 156 Winding unit 160 Stranded wire 161 First feeding line 162 Second feeding line 170 Cover 271 First cylinder 272 Second cylinder 300 Illuminating device 320 Lighting fixture 321 Appliance main body 321a Soke DOO 322 lamp cover 400 ceiling 500 and 500a LED unit (illumination light source)
510 Translucent Cover 515, 515a Opening 530 Support Base 540, 540a LED Module 541, 541a Substrate 542, 542a Light Emitting Unit 550 Reflector 555, 555a Wiring 570 Thermal Conductive Sheet 580 Connection Pin 590 Cover Member 600 Lighting Equipment

Claims (8)

A light source for illumination,
A base attached to a socket of a lighting fixture;
A lamp body attached to the base;
A sensor for detecting a detection target;
A light-emitting element that is held by the lamp body and that is turned on when the detection target is detected by the sensor;
The lamp body holds the sensor movably,
The sensor is configured by a detection element and a hemispherical lens that covers the detection element, and the detection range is configured to be asymmetric with respect to an axis passing through the center of the lens,
The lamp body holds the sensor in a state of being rotatable around an axis passing through the center of the lens. The illumination light source according to claim 1, wherein the lamp body holds the sensor in a state in which the lamp body is movable from a surface of the lamp body to a predetermined range outside. The illumination light source according to claim 2, wherein the lamp body further includes a winding unit that holds the sensor in a movable state by releasing and winding a linear member having the sensor attached to a tip. . The lamp main body further includes at least a first cylinder fixed to the lamp main body and a second cylinder holding the sensor at a tip, and one of the first and second cylinders is provided. The illumination light source according to claim 2, wherein the sensor is held in a movable state by being inserted into and removed from the other. The lamp main body further includes at least a first cylinder fixed to the lamp main body and a second cylinder holding the sensor at a tip, and one of the first and second cylinders is provided. The illumination light source according to claim 1, wherein the sensor is held in a rotatable state by being relatively rotated while being inserted into the other. The light emitting device, the illumination light source according to claim 1 is a LED (Light Emitting Diode). The lamp shape of the body, the illumination light source according to any one of claims 1 to 6 which is flat. An illumination device comprising the illumination light source according to any one of claims 1 to 7 .

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