JP5589313B2 - Integrated electronic components - Google Patents

Description

The present invention relates to an integrated electronic component in which a plurality of electronic components are integrated.

  In information processing devices such as large computers, personal computers, and mobile communication terminals that support the information society, speeding up of processing speed, downsizing, multi-functionality, and low power consumption of devices are being promoted. . Such performance improvement is achieved mainly by higher integration and higher performance of electronic components such as a large number of semiconductor devices incorporated in the apparatus. An integrated electronic component in which a plurality of electronic components are integrated includes, for example, a wiring substrate with wiring on the surface and a plurality of mounting components mounted on the wiring substrate with functional elements. Electronic device integration techniques are described in, for example, Patent Documents 1 and 2 below.

JP 2002-203939 A JP 2003-115561 A

The present invention provides an integrated electronic component suitable for suppressing the occurrence of parasitic capacitance due to capacitive coupling between a wiring on a wiring board and a functional element on the mounting component side mounted on the wiring board. That is the purpose.

  According to one aspect of the present invention, an integrated electronic component is provided. The integrated electronic component includes a wiring board and at least one mounting component mounted on the wiring board. The wiring board has a first surface, and a first wiring and a second wiring provided on the first surface. The mounting component includes an element substrate having a second surface facing the first surface of the wiring substrate, a functional element provided on the second surface side, and at least one connection wiring provided on the second surface. . The functional element of the mounting component is electrically connected to the first wiring. The second wiring of the wiring board includes at least one set of two partial wirings that are electrically connected via one connection wiring of the mounted component.

  The integrated electronic component includes a first wiring that is electrically connected to a functional element on the mounting component side and capable of propagating a signal, and a second wiring different from the first wiring on the wiring board. It is suitable for avoiding the two wirings and the functional element on the mounting component side to face each other. Since the two partial wirings in the second wiring on the first surface of the wiring substrate are electrically connected via the connection wiring on the second surface of the element substrate of the mounting component, the mounting component on the first surface This is because it is not necessary to provide a wiring that connects the two partial wirings through a region where the element on the side faces. That is, in the present integrated electronic component, it is not necessary to route the second wiring so as to pass through the region where the functional element on the mounting component side faces on the first surface of the wiring board. Such an integrated electronic component suitable for avoiding the second wiring and the functional element on the mounting component side to oppose each other has a parasitic capacitance due to capacitive coupling between the second wiring and the functional element on the mounting component side. Suitable for suppressing the occurrence of Specifically, in the present integrated electronic component, a second wiring on a wiring board different from the first wiring on the wiring board that is electrically connected to the functional element on the mounting component side and can transmit a signal, and mounting It is possible to suppress the occurrence of parasitic capacitance due to capacitive coupling between the functional elements on the component side. Such an integrated electronic component is suitable for preventing deterioration of characteristics of the integrated electronic component (including the mounting component and the functional element).

1 is a plan view (partially schematic) of an integrated electronic component (variable bandpass filter) according to a first embodiment. 1 is a plan view (partially schematic, partly transparent) of an integrated electronic component according to a first embodiment. 1 is a partially enlarged plan view (partially schematic, partly transparent) of an integrated electronic component according to a first embodiment. 1 is a partially enlarged plan view (partially see through) of an integrated electronic component according to a first embodiment. FIG. 5 is a partial cross-sectional view taken along line VV in FIG. 4. FIG. 5 is a partial cross-sectional view taken along line VI-VI in FIG. 4. It is a fragmentary sectional view in alignment with line VII-VII of FIG. It is a fragmentary sectional view in alignment with line VIII-VIII of FIG. It is a fragmentary sectional view in alignment with line IX-IX of FIG. FIG. 5 is a partial cross-sectional view taken along line XX in FIG. 4. It is a top view of a switching element and its vicinity. It is sectional drawing along line XII-XII of FIG. FIG. 6 is a plan view (partially modeled, partly transparent) of an integrated electronic component (variable band elimination filter) according to a second embodiment. FIG. 6 is a partially enlarged plan view (partially schematic, partly transparent) of an integrated electronic component according to a second embodiment. FIG. 6 is a partially enlarged plan view (partially see through) of an integrated electronic component according to a second embodiment. FIG. 16 is a partial cross-sectional view taken along line XVI-XVI in FIG. 15. It is a fragmentary sectional view in alignment with line XVII-XVII of FIG. FIG. 16 is a partial cross-sectional view taken along line XVIII-XVIII in FIG. 15. It is a top view (partially modeled) of the integrated electronic component (variable bandpass filter) which concerns on 3rd Embodiment. FIG. 6 is a plan view (partially schematic, partly transparent) of an integrated electronic component according to a third embodiment. FIG. 10 is a partially enlarged plan view (partially schematic, partly transparent) of an integrated electronic component according to a third embodiment. FIG. 10 is a partially enlarged plan view (partially schematic, partly transparent) of an integrated electronic component according to a third embodiment. FIG. 10 is a partially enlarged plan view (partially see through) of an integrated electronic component according to a third embodiment. FIG. 24 is a partial cross-sectional view taken along line XXIV-XXIV in FIG. 23. FIG. 24 is a partial cross-sectional view taken along line XXV-XXV in FIG. 23. It is a fragmentary sectional view in alignment with line XXVI-XXVI of FIG. FIG. 10 is a partially enlarged plan view (partially see through) of an integrated electronic component according to a third embodiment. FIG. 28 is a partial cross-sectional view taken along line XXVIII-XXVIII in FIG. 27. FIG. 28 is a partial sectional view taken along line XXIX-XXIX in FIG. 27. FIG. 28 is a partial cross-sectional view taken along line XXX-XXX in FIG. 27. It is a top view (partially modeled) of the integrated electronic component (variable phase shifter) which concerns on 4th Embodiment. FIG. 9 is a plan view (partially schematic, partly transparent) of an integrated electronic component according to a fourth embodiment. FIG. 10 is a partially enlarged plan view (partially see through) of an integrated electronic component according to a fourth embodiment. FIG. 34 is a partial cross-sectional view taken along line XXXIV-XXXIV in FIG. 33. FIG. 34 is a partial cross-sectional view taken along line XXXV-XXXV in FIG. 33. It is a fragmentary sectional view in alignment with line XXXVI-XXXVI of FIG. FIG. 10 is a partially enlarged plan view (partially see through) of an integrated electronic component according to a fourth embodiment. It is a fragmentary sectional view in alignment with line XXXVIII-XXXVIII of FIG. It is a fragmentary sectional view in alignment with line XXXIX-XXXIX of FIG. FIG. 38 is a partial cross-sectional view taken along line XL-XL in FIG. 37. FIG. 10 is a plan view (partially modeled, partly transparent) of an integrated electronic component (variable inductor) according to a fifth embodiment. FIG. 9 is a partially enlarged plan view (partially see through) of an integrated electronic component according to a fifth embodiment. FIG. 43 is a partial cross-sectional view taken along line XLIII-XLIII in FIG. 42. FIG. 43 is a partial cross-sectional view taken along line XLIV-XLIV in FIG. 42. FIG. 43 is a partial cross-sectional view taken along line XLV-XLV in FIG. 42. FIG. 16 is a plan view (partially schematic, partly transparent) of an integrated electronic component (capacitor bank) according to a sixth embodiment. FIG. 10 is a partially enlarged plan view (partially schematic, partly transparent) of an integrated electronic component according to a sixth embodiment. FIG. 10 is a partially enlarged plan view (partially see through) of an integrated electronic component according to a sixth embodiment. FIG. 49 is a partial cross-sectional view taken along line XLIX-XLIX in FIG. 48. It is a fragmentary sectional view in alignment with line LL of FIG. It is a fragmentary sectional view in alignment with line LI-LI of FIG.

  1 and 2 show an integrated electronic component X1 according to the first embodiment of the present invention. FIG. 1 is a plan view (partially modeled) of the integrated electronic component X1, and FIG. 2 is a plan view (partially modeled and partially see-through) of the integrated electronic component X1. FIG. 3 is a partially enlarged plan view (partially modeled, partly see-through) of the integrated electronic component X1. In addition, FIG. 4 is a partially enlarged plan view (partially see through) of the integrated electronic component X1. 5 to 10 are partial sectional views taken along lines VV, VI-VI, VII-VII, VIII-VIII, IX-IX, and XX in FIG. 4, respectively. It is.

  The integrated electronic component X1 is a bandpass filter in which the frequency band of a signal that allows passage is variable, and includes a wiring board 10 and a plurality of mounting components 20 (some mounting components 20 are omitted in FIGS. 1 and 2). And a plurality of switching elements 30 (represented schematically in FIGS. 1 to 3). The variable bandpass filter can be used as a component of an RF circuit unit in a wireless communication device such as a mobile phone, for example.

  The wiring substrate 10 includes a substrate 11 and wirings 12, 13, and 14. The substrate 11 is, for example, a silicon substrate and has a mounting target surface 11a. The wiring 12 is a signal line patterned on the mounting target surface 11a of the substrate 11, and has terminal portions 12a and 12b. The wiring 13 is a drive line patterned on the mounting target surface 11a, includes a plurality of partial wirings 13a that are separated from each other, and has a plurality of terminal portions 13b. The wiring 14 is a ground line patterned on the mounting target surface 11a, includes a plurality of partial wirings 14a that are separated from each other, and has a terminal portion 14b. The wiring 14 is grounded at the terminal portion 14b. 1 and 2, the wiring structure (wirings 12 to 14) in the wiring board 10 is partly omitted and is represented by an equivalent circuit diagram.

  3 to 10, the mounting component 20 includes an element substrate 21, a band pass filter (BPF) element 22, and connection wirings 23 and 24. The mounting component 20 is connected to the wiring substrate 10 via bumps 25. It is joined. In FIG. 2, the element substrate 21 is shown in a perspective manner for each mounted component 20. In FIG. 3, the element substrate 21 is shown in perspective with respect to two specific adjacent mounting components 20. In FIG. 4, the element substrate 21 is shown in a perspective view for one mounting component 20.

  The element substrate 21 of the mounting component 20 is, for example, a silicon substrate, and has a main surface 21a facing the wiring substrate 10 (or the mounting target surface 11a of the substrate 11). The BPF element 22 and the connection wirings 23 and 24 are provided on the main surface 21 a of the element substrate 21. In FIG. 2, the BPF element 22 provided on the main surface 21a side of the element substrate 21 is schematically shown, and a part of the connection wirings 23 and 24 on the main surface 21a is omitted and shown in an equivalent circuit diagram. . In FIG. 3, the BPF element 22 and the connection wirings 23 and 24 provided on the main surface 21a side of the element substrate 21 are represented by an equivalent circuit diagram.

  The BPF element 22 of the mounting component 20 is an element that allows passage of signals within a certain range of frequency bands. As shown in FIGS. 3 and 4, capacitors C1, C2, C3, inductors D1, D2, D3, And terminal portions E1 and E2. In the present embodiment, the capacitors C1, C2, and C3 include capacitor electrodes 22a and 22b that face each other and a dielectric film 22c interposed therebetween, as shown in FIGS. 5 to 8, for example. The inductors D1, D2, and D3 are lines having specific lengths and widths. The capacitor electrode 22a of the capacitor C2, the inductors D1 and D2, and the terminal portion E1 are electrically connected via the wiring portion 22d. The inductor D1 is electrically connected to the capacitor electrode 22a of the capacitor C1. The capacitor electrode 22b of the capacitor C1, the capacitor electrode 22a of the capacitor C3, the inductor D3, and the terminal portion E2 are electrically connected via the wiring portion 22e. The capacitor electrodes 22b and 22b of the capacitors C2 and C3 and the inductors D2 and D3 are electrically connected via the wiring portion 22f. As shown in FIG. 5, the terminal portions E <b> 1 and E <b> 2 are electrically connected to the wiring 12 on the wiring board 10 side through bumps 25. The specific structures of the capacitors C1, C2, C3, the inductors D1, D2, D3, and the terminal portions E1, E2 are limited if the equivalent circuit shown in FIG. 3 of the BPF element 22 is formed on the element substrate 21. Not. The plurality of BPF elements 22 in the integrated electronic component X1 are arranged in parallel in the circuit configuration, and the frequency bands of signals that are allowed to pass between the BPF elements 22 are different or do not match. Such a BPF element 22 can be formed by a combination of thin film formation and patterning on the main surface 21 a of the element substrate 21.

  Each connection wiring 23 of the mounting component 20 is for electrically connecting two specific sets of partial wirings 13a included in the wiring 13 (drive line) of the wiring board 10 described above. As shown in FIG. 9, the connection wiring 23 is electrically connected to the partial wiring 13 a via the bump 25. That is, two specific sets of partial wirings 13 a included in the wiring 13 of the wiring board 10 are electrically connected via the bumps 25 and the connection wirings 23 of the mounting component 20. Each mounting component 20 is provided with a necessary number of connection wirings 23 (in FIG. 2, the mounting component located on the outermost side in the circuit configuration of the integrated electronic component X1 among the plurality of mounting components 20). 20, a part of the connection wiring 23 is omitted). The number of connection wirings 23 that one mounting component 20 should have tends to increase as the mounting component 20 is positioned on the outer side in the circuit configuration of the integrated electronic component X1. Such connection wiring 23 is formed by patterning on the main surface 21 a of the element substrate 21.

  The connection wiring 24 of the mounting component 20 is for electrically connecting a plurality of specific partial wirings 14a included in the wiring 14 (ground line) of the wiring board 10 described above. As shown in FIGS. 6 and 10, the connection wiring 24 is electrically connected to the partial wiring 14 a via the bump 25. That is, the specific partial wirings 14 a included in the wiring 14 of the wiring substrate 10 are electrically connected via the bumps 25 and the connection wiring 24 of the mounting component 20. In the mounting component 20, the connection wiring 24 is electrically connected to the BPF element 22 described above. Specifically, as shown in FIG. 4, the above-described wiring portion 22 f of the BPF element 22 and the connection wiring 24 are connected. Such connection wiring 24 is formed by patterning on the main surface 21 a of the element substrate 21.

  Each switching element 30 is for cutting off the middle of the wiring 12 (signal line), and has the structure shown in FIGS. Specifically, the switching element 30 includes an anchor portion 31, a movable portion 32, a contact electrode 33, and a pair of drive electrodes 34 and 35. The anchor portion 31 is erected on the substrate 11 of the wiring substrate 10. The movable portion 32 has a cantilever shape and extends from the anchor portion 31 along the substrate 11. The contact electrode 33 is provided on the side of the substrate 11 in the movable part 32 so as to face a part 12 c of the wiring 12 (signal line) of the wiring substrate 10. The drive electrode 34 is patterned over the movable portion 32, the anchor portion 31, and the substrate 11. The drive electrode 35 is patterned on the substrate 11 so as to have a portion facing the drive electrode 34 as shown in FIG. The drive electrode 34 is connected to the wiring 13 (drive line) of the wiring board 10, and the drive electrode 35 is connected to the wiring 14 (ground line) (the specific connection mode is not shown). Such a switching element 30 can be formed by a combination of material film formation and patterning using MEMS (micro-electromechanical systems) technology. Further, in the integrated electronic component X 1, all the switching elements 30 are arranged in a region substantially surrounded by the wiring 12.

  In the switching element 30, when a driving potential is applied to the driving electrode 34 and a driving voltage is applied between the driving electrodes 34 and 35, an electrostatic attractive force is generated between the driving electrodes 34 and 35. As a result, the movable portion 32 is elastically deformed so that the contact electrode 33 contacts the part 12 c of the wiring 12. In this way, the closed state of the switching element 30 is achieved. In the closed state, a part 12 c of the wiring 12 is electrically bridged by the contact electrode 33. On the other hand, in the switching element 30 in the closed state, when the electrostatic attractive force acting between the drive electrodes 34 and 35 is extinguished, the movable portion 32 returns to its natural state, and the contact electrode 33 is part of the wiring 12. Separate from. In this way, the open state of the switching element 30 is achieved.

  At the time of driving the integrated electronic component X1 (variable bandpass filter) having the above configuration, one BPF element 22 is selected from the plurality of BPF elements 22 and electrically connected to the terminal portions 12a and 12b. Specifically, a pair of switching elements 30 arranged in series with the BPF element 22 to be selected and having the BPF element 22 interposed therebetween are selected, and both the switching elements 30 are closed. A method for realizing the closed state of the target switching element 30 in the integrated electronic component X1 is as follows.

  Of a plurality of conductive paths (each having a terminal portion 13b) formed by the wiring 13 of the wiring board 10, the connection wiring 23 of the mounting component 20, and the bumps 25 connecting them, the target switching element 30 A conductive path connected to the drive electrode 34 is selected. Then, a drive potential is applied from the terminal portion 13b of the selected conductive path to the drive electrode 34 of the target switching element 30 via the conductive path. Thereby, in the target switching element 30, an electrostatic attractive force is generated between the drive electrodes 34 and 35, and the movable portion 32 is elastically deformed so that the contact electrode 33 contacts the part 12 c of the wiring 12, thereby achieving the closed state. Is done.

  When the closed state of the selected pair of switching elements 30 is realized as described above, the frequency of the signal that can pass between the terminal portions 12a and 12b of the wiring 12 is limited to the frequency band related to the selected BPF element 22. Will be.

  The integrated electronic component X1 has a wiring 13 (drive line) different from the wiring 12 on the substrate 11 together with the wiring 12 (signal line) electrically connected to the BPF element 22 provided in the mounting component 20. In the integrated electronic component X1, it is possible to avoid the wiring 13 and the BPF element 22 of the mounting component 20 from facing each other. Since the two partial wirings 13 a included in the wiring 13 are electrically connected via the connection wiring 23 of the mounting component 20, the substrate 11 passes through a region where the BPF element 22 of the mounting component 20 faces. This is because there is no need to route the wiring 13. In the integrated electronic component X1, the BPF element 22 is opposed to the substrate 11 when the wiring 13 used to operate the switching element 30 in the region substantially surrounded by the wiring 12 is pulled out of the region. Therefore, it is not necessary to route the wiring 13 so as to pass through the region to be processed. Such an integrated electronic component X1 that can avoid the wiring 13 and the BPF element 22 of the mounting component 20 from facing each other is parasitic between the wiring 13 and the BPF element 22 of the mounting component 20 due to capacitive coupling. Suitable for suppressing the generation of capacity. Such an integrated electronic component X1 is suitable for preventing characteristic deterioration of the integrated BPF element 22.

  Further, the integrated electronic component X1 has a wiring 12 (signal line) electrically connected to the BPF element 22 provided on the mounting component 20 and a wiring 14 (ground line) different from the wiring 12 on the substrate 11. Have. In the integrated electronic component X1, it can be avoided that the wiring 14 and the BPF element 22 of the mounting component 20 face each other. Since the plurality of partial wirings 14 a included in the wiring 14 are electrically connected via the connection wiring 24 of the mounting component 20, the substrate 11 passes through a region where the BPF element 22 of the mounting component 20 faces. This is because there is no need to route the wiring 14. In the integrated electronic component X1, the BPF element 22 is opposed to the substrate 11 when the wiring 14 used to operate the switching element 30 in the region substantially surrounded by the wiring 12 is pulled out of the region. Therefore, it is not necessary to route the wiring 14 so as to pass through the region to be processed. Such an integrated electronic component X1 capable of avoiding the facing of the wiring 14 and the BPF element 22 of the mounting component 20 is a parasitic due to capacitive coupling between the wiring 14 and the BPF element 22 of the mounting component 20. Suitable for suppressing the generation of capacity. Such an integrated electronic component X1 is suitable for preventing characteristic deterioration of the integrated BPF element 22.

  In addition, the integrated electronic component X1 is suitable for obtaining high bonding reliability with respect to the bonding of the wiring board 10 and the mounting component 20. This is because it is not always necessary to interpose a tall bump or a stacked bump between the wiring board 10 and the mounting component 20 to ensure a large separation distance between the wiring board 10 and the mounting component 20. When mounting a mounting component face-down on a wiring board that has been routed in the mounting area via bumps, ensure a separation distance between the wiring on the opposing wiring board side and the element on the mounting component side. It is conceivable to reduce the parasitic capacitance generated by capacitive coupling between the wiring and the element. On the other hand, in the integrated electronic component X1, since it is not necessary to route the wirings 13 and 14 in the region facing the BPF element 22 of the wiring board 10, from the viewpoint of reducing parasitic capacitance due to capacitive coupling, the wiring board 10 -It is not necessary to secure a large separation distance between the mounted components 20. Therefore, in the integrated electronic component X1, it is not always necessary to provide tall bumps or stacked bumps between the wiring board 10 and the mounting component 20, and high bonding reliability can be achieved for the bonding of the wiring board 10 and the mounting component 20. It is suitable to get.

  As described above, the integrated electronic component X1 is suitable for suppressing the generation of parasitic capacitance due to capacitive coupling between the wirings 13 and 14 and the BPF element 22 of the mounting component 20, and the wiring board 10 and the mounting component. It is suitable for obtaining high joint reliability for joining the parts 20.

  FIG. 13 is a plan view (partially schematic, partly transparent) of the integrated electronic component X2 according to the second embodiment of the present invention. 14 is a partially enlarged plan view (partially modeled, partially transparent) of the integrated electronic component X2, and FIG. 15 is a partially enlarged plan view (partially transparent) of the integrated electronic component X2. It is. 16 to 18 are partial cross-sectional views taken along line XVI-XVI, line XVII-XVII, and line XVIII-XVIII in FIG. 15, respectively.

  The integrated electronic component X2 is a band elimination filter in which the frequency band of a signal that prohibits passage is variable, and includes a wiring board 10, a plurality of mounting components 20A (some mounting components 20A are omitted in FIG. 13), And a plurality of switching elements 30 (represented schematically in FIGS. 13 and 14). The variable band elimination filter can be used, for example, as a component of the RF circuit unit in a wireless communication device such as a mobile phone.

  The wiring substrate 10 includes a substrate 11, a wiring 12 having terminal portions 12a and 12b, a wiring 13 including a plurality of partial wirings 13a and having a plurality of terminal portions 13b, a plurality of partial wirings 14a and a terminal portion 14b. Wiring 14 having The configuration of the wiring board 10 is the same as the above-described configuration of the wiring board 10 of the integrated electronic component X1. In FIG. 13, a part of the wiring structure (wirings 12 to 14) in the wiring substrate 10 is omitted and represented by an equivalent circuit diagram.

  Each mounting component 20A includes, for example, an element substrate 21, a band elimination filter (BEF) element 22A, and connection wirings 23 and 24 as shown in FIGS. 10 is joined. In FIG. 13, the element substrate 21 is shown in a perspective manner for each mounted component 20A. In FIG. 14, the element substrate 21 is shown in perspective with respect to two specific adjacent mounting components 20 </ b> A. In FIG. 15, the element substrate 21 is shown in a perspective view for one mounting component 20 </ b> A.

  The element substrate 21 of the mounting component 20A is a silicon substrate, for example, and has a main surface 21a facing the wiring substrate 10 (or the mounting target surface 11a of the substrate 11). The BEF element 22A and the connection wirings 23 and 24 are provided on the main surface 21a of the element substrate 21. In FIG. 13, the BEF element 22A provided on the main surface 21a side of the element substrate 21 is schematically shown, and a part of the connection wirings 23 and 24 on the main surface 21a is omitted and shown in an equivalent circuit diagram. . In FIG. 14, the BEF element 22A provided on the main surface 21a side of the element substrate 21 is schematically shown with an equivalent circuit diagram, and the connection wirings 23 and 24 on the main surface 21a are shown in an equivalent circuit diagram. Represent. In FIG. 15, the BEF element 22A provided on the main surface 21a side of the element substrate 21 is schematically illustrated with an equivalent circuit diagram.

  The BEF element 22A of the mounting component 20A is an element that prohibits the passage of signals within a certain frequency band. As shown in FIGS. 14 and 15, the capacitor C, the inductor D, the resistor R, and the terminal portion E1, Includes E2. The terminal portions E1 and E2 are electrically connected to the wiring 12 on the wiring board 10 side via bumps 25 shown in FIG. The specific structures of the capacitor C, the inductor D, the resistor R, and the terminal portions E1 and E2 are not limited as long as the equivalent circuit shown in FIGS. 14 and 15 of the BEF element 22A is established on the element substrate 21. In addition, the plurality of BEF elements 22A in the integrated electronic component X2 are arranged in parallel in the circuit configuration, and the frequency bands of signals prohibited from passing between the BEF elements 22A are different or do not match.

  Each connection wiring 23 of the mounting component 20A is for electrically connecting two specific sets of partial wirings 13a included in the wiring 13 (drive line) of the wiring board 10 described above. As shown in FIG. 18, the connection wiring 23 is electrically connected to the partial wiring 13 a via the bump 25. That is, a specific pair of partial wirings 13a included in the wiring 13 of the wiring board 10 are electrically connected via the bumps 25 and the connection wirings 23 of the mounting component 20A. Each mounting component 20A is provided with a necessary number of connection wirings 23 (in FIG. 13, the mounting component located on the outermost side in the circuit configuration of the integrated electronic component X2 among the plurality of mounting components 20A). 20A, a part of the connection wiring 23 is omitted). The number of connection wirings 23 that one mounting component 20A should have tends to increase as the mounting component 20A is located on the outer side in the circuit configuration of the integrated electronic component X2. Such connection wiring 23 is formed by patterning on the main surface 21 a of the element substrate 21.

  The connection wiring 24 of the mounting component 20A is for electrically connecting a plurality of specific partial wirings 14a included in the wiring 14 (ground line) of the wiring board 10 described above. As shown in FIG. 17, the connection wiring 24 is electrically connected to the partial wiring 14 a via the bump 25. That is, the specific partial wirings 14a included in the wiring 14 of the wiring board 10 are electrically connected via the bumps 25 and the connection wiring 24 of the mounting component 20A. Further, in the mounting component 20A, the connection wiring 24 is electrically connected to the BEF element 22A described above. Such connection wiring 24 is formed by patterning on the main surface 21 a of the element substrate 21.

  Each switching element 30 is for cutting off the middle of the wiring 12 (signal line), and has the same structure as described above with respect to the switching element 30 of the integrated electronic component X1 with reference to FIGS. Have The drive electrode 34 in the switching element 30 is connected to the wiring 13 (drive line) of the wiring board 10, and the drive electrode 35 is connected to the wiring 14 (ground line). In the integrated electronic component X <b> 2, all the switching elements 30 are arranged in a region substantially surrounded by the wiring 12.

  At the time of driving the integrated electronic component X2 (variable band elimination filter) having the above configuration, one BEF element 22A is selected from the plurality of BEF elements 22A and electrically connected to the terminal portions 12a and 12b. . Specifically, a pair of switching elements 30 arranged in series with the BEF element 22A to be selected and arranged between the BEF elements 22A are selected, and both the switching elements 30 are closed. A method for realizing the closed state of the target switching element 30 in the integrated electronic component X2 is as follows.

  Of a plurality of conductive paths (each having a terminal portion 13b) formed of the wiring 13 of the wiring board 10, the connection wiring 23 of the mounting component 20A, and the bump 25 connecting them, the target switching element 30 A conductive path connected to the drive electrode 34 is selected. Then, a drive potential is applied from the terminal portion 13b of the selected conductive path to the drive electrode 34 of the target switching element 30 via the conductive path. Thereby, in the target switching element 30, an electrostatic attractive force is generated between the drive electrodes 34 and 35, and the movable portion 32 is elastically deformed so that the contact electrode 33 contacts the part 12 c of the wiring 12, thereby achieving the closed state. Is done.

  When the closed state is realized for the selected pair of switching elements 30 as described above, the frequency of the signal that is prohibited from passing between the terminal portions 12a and 12b of the wiring 12 is a frequency band related to the selected BEF element 22A. It will be limited to.

  The integrated electronic component X2 includes a wiring 12 (signal line) electrically connected to the BEF element 22A provided on the mounting component 20A, and a wiring 13 (drive line) different from the wiring 12 on the substrate 11. In the integrated electronic component X2, it can be avoided that the wiring 13 and the BEF element 22A of the mounting component 20A face each other. Since the two partial wirings 13a included in the wiring 13 are electrically connected via the connection wiring 23 of the mounting component 20A, the BEF element 22A of the mounting component 20A passes through a region facing the substrate 11. This is because there is no need to route the wiring 13. In the integrated electronic component X2, the BEF element 22A is opposed to the substrate 11 when the wiring 13 used for operating the switching element 30 in the region substantially surrounded by the wiring 12 is pulled out of the region. Therefore, it is not necessary to route the wiring 13 so as to pass through the region to be processed. Such an integrated electronic component X2 that can avoid the wiring 13 and the BEF element 22A of the mounting component 20A from facing each other is a parasitic due to capacitive coupling between the wiring 13 and the BEF element 22A of the mounting component 20A. Suitable for suppressing the generation of capacity. Such an integrated electronic component X2 is suitable for preventing characteristic deterioration of the integrated BEF element 22A.

  In addition, the integrated electronic component X2 includes a wiring 12 (signal line) electrically connected to the BEF element 22A provided on the mounting component 20A and a wiring 14 (ground line) different from the wiring 12 on the substrate 11. Have. In the integrated electronic component X2, it can be avoided that the wiring 14 and the BEF element 22A of the mounting component 20A face each other. Since the plurality of partial wirings 14a included in the wiring 14 are electrically connected via the connection wiring 24 of the mounting component 20A, the substrate 11 passes through the region where the BEF element 22A of the mounting component 20A faces. This is because there is no need to route the wiring 14. In the integrated electronic component X2, the BEF element 22A is opposed to the substrate 11 when the wiring 14 used to operate the switching element 30 in the region substantially surrounded by the wiring 12 is pulled out of the region. Therefore, it is not necessary to route the wiring 14 so as to pass through the region to be processed. Such an integrated electronic component X2 that can avoid the wiring 14 and the BEF element 22A of the mounting component 20A from facing each other is a parasitic due to capacitive coupling between the wiring 14 and the BEF element 22A of the mounting component 20A. Suitable for suppressing the generation of capacity. Such an integrated electronic component X2 is suitable for preventing characteristic deterioration of the integrated BEF element 22A.

  In addition, the integrated electronic component X2 is suitable for obtaining high bonding reliability with respect to the bonding of the wiring board 10 and the mounting component 20A. This is because it is not always necessary to provide tall bumps or stacked bumps between the wiring board 10 and the mounting component 20A to ensure a large separation distance between the wiring board 10 and the mounting component 20A.

  As described above, the integrated electronic component X2 is suitable for suppressing the generation of parasitic capacitance due to capacitive coupling between the wirings 13 and 14 and the BEF element 22A of the mounting component 20A. This is suitable for obtaining high bonding reliability for the bonding of the mounting component 20A.

  19 and 20 show an integrated electronic component X3 according to the third embodiment of the present invention. FIG. 19 is a plan view (partially modeled) of the integrated electronic component X3. FIG. 20 is a plan view (partially schematic, partly transparent) of the integrated electronic component X3. 21 and 22 are partially enlarged plan views (partially modeled and partly transparent) of the integrated electronic component X3, respectively. In addition, FIG. 23 is a partially enlarged plan view (partially see through) of the integrated electronic component X3. 24 to 26 are partial cross-sectional views taken along line XXIV-XXIV, line XXV-XXV, and line XXVI-XXVI in FIG. 23, respectively. In addition, FIG. 27 is a partially enlarged plan view (partially see through) of the integrated electronic component X3. 28 to 30 are partial cross-sectional views taken along line XXVIII-XXVIII, line XXIX-XXIX, and line XXX-XXX in FIG. 27, respectively.

  The integrated electronic component X3 is a band-pass filter in which the frequency band of a signal that allows passage is variable, and includes a wiring board 10 and a plurality of mounting components 20B and 20C (in FIG. 19 and FIG. 20C is omitted) and a plurality of switching elements 30 (represented schematically in FIGS. 19 to 22).

  The wiring substrate 10 includes a substrate 11, a wiring 12 having terminal portions 12a and 12b, a wiring 13 including a plurality of partial wirings 13a and having a plurality of terminal portions 13b, a plurality of partial wirings 14a and a terminal portion 14b. Wiring 14 having The configuration of the wiring board 10 is the same as the above-described configuration of the wiring board 10 of the integrated electronic component X1. 19 and 20, the wiring structure (wirings 12 to 14) in the wiring board 10 is partly omitted and is represented by an equivalent circuit diagram.

  Each mounting component 20B includes, for example, an element substrate 21, a high-pass filter (HPF) element 22B, and connection wirings 23 and 24 as shown in FIGS. 21 and 23 to 26. Bonded to the substrate 10. In FIG. 20, the element substrate 21 is shown in a perspective manner for each mounting component 20B. In FIG. 21, the element substrate 21 is shown in perspective with respect to two specific adjacent mounting components 20 </ b> B. In FIG. 23, the element substrate 21 is shown in a perspective view with respect to one mounting component 20B.

  The element substrate 21 of the mounting component 20B is, for example, a silicon substrate, and has a main surface 21a facing the wiring substrate 10 (or the mounting target surface 11a of the substrate 11). The HPF element 22 </ b> B and the connection wirings 23 and 24 are provided on the main surface 21 a of the element substrate 21. In FIG. 20, the HPF element 22B provided on the main surface 21a side of the element substrate 21 is schematically shown, and a part of the connection wirings 23 and 24 on the main surface 21a is omitted and shown in an equivalent circuit diagram. . In FIG. 21, the HPF element 22B provided on the main surface 21a side of the element substrate 21 is schematically illustrated with an equivalent circuit diagram, and the connection wirings 23 and 24 on the main surface 21a are illustrated in an equivalent circuit diagram. Represent. In FIG. 23, the HPF element 22B provided on the main surface 21a side of the element substrate 21 is schematically illustrated with an equivalent circuit diagram.

  The HPF element 22B of the mounting component 20B is an element that allows passage of a signal having a specific threshold frequency or higher, and includes a capacitor C, inductors D1 and D2, and terminal portions E1 and E2 as shown in FIGS. Including. The terminal portions E1 and E2 are electrically connected to the wiring 12 on the wiring board 10 side via bumps 25 shown in FIG. The specific structures of the capacitor C, the inductors D1 and D2, and the terminal portions E1 and E2 are not limited as long as the equivalent circuit shown in FIGS. 21 and 23 of the HPF element 22B is established on the element substrate 21. In addition, the plurality of HPF elements 22B in the integrated electronic component X3 are arranged in parallel in the circuit configuration, and the threshold frequency is different between the HPF elements 22B.

  Each connection wiring 23 of the mounting component 20B is for electrically connecting two specific sets of partial wirings 13a included in the wiring 13 (drive line) of the wiring board 10 described above. As shown in FIG. 26, the connection wiring 23 is electrically connected to the partial wiring 13 a via the bump 25. That is, two specific sets of partial wirings 13a included in the wiring 13 of the wiring board 10 are electrically connected via the bumps 25 and the connection wirings 23 of the mounting component 20B. Each mounting component 20B is provided with a necessary number of connection wirings 23 (in FIG. 20, the mounting component located on the outermost side in the circuit configuration of the integrated electronic component X3 among the plurality of mounting components 20B). 20B, a part of the connection wiring 23 is omitted). The number of connection wirings 23 that one mounting component 20B should have tends to increase as the mounting component 20B is located on the outer side in the circuit configuration of the integrated electronic component X3. Such connection wiring 23 is formed by patterning on the main surface 21 a of the element substrate 21.

  The connection wiring 24 of the mounting component 20B is for electrically connecting a plurality of specific partial wirings 14a included in the wiring 14 (ground line) of the wiring board 10 described above. As shown in FIG. 25, the connection wiring 24 is electrically connected to the partial wiring 14 a via the bump 25. That is, the specific partial wirings 14a included in the wiring 14 of the wiring board 10 are electrically connected via the bumps 25 and the connection wiring 24 of the mounting component 20B. Further, in the mounting component 20B, the connection wiring 24 is electrically connected to the above-described HPF element 22B. Such connection wiring 24 is formed by patterning on the main surface 21 a of the element substrate 21.

  Each mounting component 20C includes, for example, an element substrate 21, a low-pass filter (LPF) element 22C, and connection wirings 23 and 24 as shown in FIGS. 22 and 27 to 30. Bonded to the substrate 10. In FIG. 20, the element substrate 21 is shown in a perspective manner for each mounting component 20C. In FIG. 22, the element substrate 21 is shown in perspective with respect to two specific mounting components 20 </ b> C adjacent to each other. In FIG. 27, the element substrate 21 is shown in a perspective view with respect to one mounting component 20C.

  The element substrate 21 of the mounting component 20C is, for example, a silicon substrate, and has a main surface 21a facing the wiring substrate 10 (or the mounting target surface 11a of the substrate 11). The LPF element 22 </ b> C and the connection wirings 23 and 24 are provided on the main surface 21 a of the element substrate 21. In FIG. 20, the LPF element 22C provided on the main surface 21a side of the element substrate 21 is schematically shown, and a part of the connection wirings 23 and 24 on the main surface 21a is omitted and shown in an equivalent circuit diagram. . In FIG. 22, the LPF element 22C provided on the main surface 21a side of the element substrate 21 is schematically shown with an equivalent circuit diagram, and the connection wirings 23 and 24 on the main surface 21a are shown in an equivalent circuit diagram. Represent. In FIG. 27, the LPF element 22C provided on the main surface 21a side of the element substrate 21 is schematically shown with an equivalent circuit diagram.

  The LPF element 22C of the mounting component 20C is an element that allows passage of a signal having a specific threshold frequency or lower. As shown in FIGS. 22 and 27, the capacitors C1 and C2, the inductor D, and the terminal portions E1 and E2 are included. Including. The terminal portions E1 and E2 are electrically connected to the wiring 12 on the wiring board 10 side via bumps 25 shown in FIG. The specific structures of the capacitors C1 and C2, the inductor D, and the terminal portions E1 and E2 are not limited as long as the equivalent circuits shown in FIGS. 22 and 27 of the LPF element 22C are established on the element substrate 21. Further, the plurality of LPF elements 22C in the integrated electronic component X3 are arranged in parallel with each other in terms of circuit configuration, and the threshold frequency is different between the LPF elements 22C. In both cases, the LPF element 22C group arranged in parallel and the above-described HPF element 22B group arranged in parallel are arranged in series in terms of the circuit configuration.

  Each connection wiring 23 of the mounting component 20C is for electrically connecting two specific sets of partial wirings 13a included in the wiring 13 (drive line) of the wiring board 10 described above. As shown in FIG. 30, the connection wiring 23 is electrically connected to the partial wiring 13 a via the bump 25. That is, a specific pair of partial wirings 13a included in the wiring 13 of the wiring board 10 are electrically connected via the bumps 25 and the connection wirings 23 of the mounting component 20C. Each mounting component 20C is provided with a necessary number of connection wirings 23 (in FIG. 20, the mounting component located on the outermost side in the circuit configuration of the integrated electronic component X3 among the plurality of mounting components 20C). 20C, a part of the connection wiring 23 is omitted). The number of connection wirings 23 that one mounting component 20C should have tends to increase as the mounting component 20C is located on the outer side in the circuit configuration of the integrated electronic component X3. Such connection wiring 23 is formed by patterning on the main surface 21 a of the element substrate 21.

  The connection wiring 24 of the mounting component 20C is for electrically connecting a plurality of specific partial wirings 14a included in the wiring 14 (ground line) of the wiring board 10 described above. As shown in FIG. 29, the connection wiring 24 is electrically connected to the partial wiring 14 a via the bump 25. That is, the specific partial wirings 14a included in the wiring 14 of the wiring board 10 are electrically connected via the bumps 25 and the connection wiring 24 of the mounting component 20C. Further, in the mounting component 20C, the connection wiring 24 is electrically connected to the above-described LPF element 22C. Such connection wiring 24 is formed by patterning on the main surface 21 a of the element substrate 21.

  Each switching element 30 is for cutting off the middle of the wiring 12 (signal line), and has the same structure as described above with respect to the switching element 30 of the integrated electronic component X1 with reference to FIGS. Have The drive electrode 34 in the switching element 30 is connected to the wiring 13 (drive line) of the wiring board 10, and the drive electrode 35 is connected to the wiring 14 (ground line). In the integrated electronic component X <b> 3, all the switching elements 30 are arranged in a region substantially surrounded by the wiring 12.

  When driving the integrated electronic component X3 (variable bandpass filter) having the above-described configuration, one HPF element 22B is selected from the plurality of HPF elements 22B and the plurality of LPF elements between the terminal portions 12a and 12b. One LPF element 22C is selected from 22C. Specifically, a pair of switching elements 30 arranged in series with respect to the HPF element 22B to be selected and interposing the HPF element 22B are selected, and both the switching elements 30 are closed. At the same time, a pair of switching elements 30 arranged in series with respect to the LPF element 22C to be selected and disposed between the LPF elements 22C is selected, and both the switching elements 30 are closed. A method for realizing the closed state of the target switching element 30 in the integrated electronic component X3 is as follows.

  Of a plurality of conductive paths (each having a terminal portion 13b) formed of the wiring 13 of the wiring board 10, the connection wiring 23 of the mounting components 20B and 20C, and the bump 25 connecting them, the target switching element A conductive path connected to 30 drive electrodes 34 is selected. Then, a drive potential is applied from the terminal portion 13b of the selected conductive path to the drive electrode 34 of the target switching element 30 via the conductive path. Thereby, in the target switching element 30, an electrostatic attractive force is generated between the drive electrodes 34 and 35, and the movable portion 32 is elastically deformed so that the contact electrode 33 contacts the part 12 c of the wiring 12, thereby achieving the closed state. Is done.

  When the closed state of the selected switching element 30 is realized as described above, the frequency of the signal that is allowed to pass between the terminal portions 12a and 12b of the wiring 12 is equal to or higher than the threshold value of the selected HPF element 22B and is selected LPF. This is limited to a band equal to or less than the threshold value of the element 22C. The threshold frequency of the selected LPF element 22C is larger than the threshold frequency of the selected HPF element 22B.

  The integrated electronic component X3 includes a wiring 12 (signal line) electrically connected to the HPF element 22B and the LPF element 22C provided on the mounting components 20B and 20C, and a wiring 13 (drive line) different from the wiring 12 On the substrate 11. In the integrated electronic component X3, it is possible to prevent the wiring 13 and the HPF element 22B and the LPF element 22C of the mounting components 20B and 20C from facing each other. Since the two partial wirings 13a included in the wiring 13 are electrically connected via the connection wirings 23 of the mounting components 20B and 20C, the HPF element 22B and the LPF element 22C pass through the region of the substrate 11 facing each other. This is because the wiring 13 does not need to be routed. In the integrated electronic component X <b> 3, the elements 22 </ b> B and 22 </ b> C are formed on the substrate 11 when the wiring 13 used for operating the switching element 30 in the region substantially surrounded by the wiring 12 is pulled out of the region. It is not necessary to route the wiring 13 so as to pass through the opposing regions. Such an integrated electronic component X3 that can avoid the wiring 13 and the HPF element 22B and the LPF element 22C from facing each other is parasitic between the wiring 13 and the HPF element 22B and the LPF element 22C due to capacitive coupling. Suitable for suppressing the generation of capacity. Such an integrated electronic component X3 is suitable for preventing deterioration of characteristics of the HPF element 22B and the LPF element 22C to be integrated.

  Also, the integrated electronic component X3 includes a wiring 12 (signal line) electrically connected to the HPF element 22B and the LPF element 22C provided on the mounting components 20B and 20C, and a wiring 14 (ground line) different from the wiring 12 ) On the substrate 11. In the integrated electronic component X3, it is possible to prevent the wiring 14 and the HPF element 22B and the LPF element 22C of the mounting components 20B and 20C from facing each other. Since the plurality of partial wirings 14a included in the wiring 14 are electrically connected via the connection wirings 24 of the mounting components 20B and 20C, the HPF element 22B and the LPF element 22C pass through a region of the substrate 11 facing each other. This is because it is not necessary to route the wiring 14. In the integrated electronic component X <b> 3, the elements 22 </ b> B and 22 </ b> C are formed on the substrate 11 when the wiring 14 used to operate the switching element 30 in the region substantially surrounded by the wiring 12 is pulled out of the region. It is not necessary to route the wiring 14 so as to pass through the opposing regions. Such an integrated electronic component X3 capable of avoiding the wiring 14 and the HPF element 22B and the LPF element 22C from facing each other is a parasitic due to capacitive coupling between the wiring 14 and the HPF element 22B and the LPF element 22C. Suitable for suppressing the generation of capacity. Such an integrated electronic component X3 is suitable for preventing deterioration of characteristics of the HPF element 22B and the LPF element 22C to be integrated.

  In addition, the integrated electronic component X3 is suitable for obtaining high bonding reliability with respect to the bonding of the wiring board 10 and the mounting components 20B and 20C. It is not always necessary to provide tall bumps or stacked bumps between the wiring board 10 and the mounting components 20B and 20C in order to ensure a large separation distance between the wiring board 10 and the mounting components 20B and 20C. Because.

  As described above, the integrated electronic component X3 is suitable for suppressing the generation of parasitic capacitance due to capacitive coupling between the wirings 13 and 14 and the HPF element 22B and the LPF element 22C. It is suitable for obtaining high joint reliability for joints 20B and 20C.

  The BPF element 22, the BEF element 22A, the HPF element 22B, and the LPF element 22C in the integrated electronic components X1 to X3 are LC filters in the above-described embodiment, but are SAW filters, boundary wave filters, FBAR filters, dielectrics It may be a filter.

  31 and 32 show an integrated electronic component X4 according to the fourth embodiment of the present invention. FIG. 31 is a plan view (partially schematic) of the integrated electronic component X4. FIG. 32 is a plan view (partially schematic, partly transparent) of the integrated electronic component X4. FIG. 33 is a partially enlarged plan view (partially see through) of the integrated electronic component X4. 34 to 36 are partial cross-sectional views taken along line XXXIV-XXXIV, line XXXV-XXXV, and line XXXVI-XXXVI in FIG. 33, respectively. In addition, FIG. 37 is a partially enlarged plan view (partially see through) of the integrated electronic component X4. 38 to 40 are partial cross-sectional views taken along line XXXVIII-XXXVIII, line XXXIX-XXXIX, and line XL-XL in FIG. 37, respectively.

  The integrated electronic component X4 is a variable phase shifter capable of changing the amount of phase shift, and includes a wiring board 10, a plurality of mounting components 20D and 20E, and a plurality of switching elements 30 (in FIGS. 31 and 32). (Schematically represented). The variable phase shifter can be used as a component of the RF circuit unit in a wireless communication device such as a mobile phone, for example.

  The wiring substrate 10 includes a substrate 11, a wiring 12 having terminal portions 12a and 12b, a wiring 13 including a plurality of partial wirings 13a and having a plurality of terminal portions 13b, a plurality of partial wirings 14a and a terminal portion 14b. Wiring 14 having The configuration of the wiring board 10 is the same as the above-described configuration of the wiring board 10 of the integrated electronic component X1. 31 and 32, the wiring structure (wirings 12 to 14) in the wiring board 10 is represented by an equivalent circuit diagram.

  Each mounting component 20D has an element substrate 21, an HPF element 22D, and connection wirings 23 and 24 as shown in FIGS. 33 to 36, for example, and is bonded to the wiring substrate 10 via bumps 25. . In FIG. 32, the element substrate 21 is shown in a perspective manner for each mounting component 20D. In FIG. 33, the element substrate 21 is shown in a transparent manner for one mounting component 20D.

  The element substrate 21 of the mounting component 20D is, for example, a silicon substrate, and has a main surface 21a facing the wiring substrate 10 (or the mounting target surface 11a of the substrate 11). The HPF element 22 </ b> D and the connection wirings 23 and 24 are provided on the main surface 21 a of the element substrate 21. In FIG. 32, the HPF element 22D provided on the main surface 21a side of the element substrate 21 is schematically illustrated, and the connection wirings 23 and 24 on the main surface 21a are illustrated in an equivalent circuit diagram. In FIG. 33, the HPF element 22D provided on the main surface 21a side of the element substrate 21 is schematically illustrated with an equivalent circuit diagram.

  The HPF element 22D of the mounting component 20D includes a capacitor C, inductors D1 and D2, and terminal portions E1 and E2, as shown in FIG. The terminal portions E1 and E2 are electrically connected to the wiring 12 on the wiring board 10 side via bumps 25 shown in FIG. The specific structures of the capacitor C, the inductors D1 and D2, and the terminal portions E1 and E2 are not limited as long as the equivalent circuit shown in FIG. 33 of the HPF element 22D is established on the element substrate 21.

  Each connection wiring 23 of the mounting component 20D is for electrically connecting two specific sets of partial wirings 13a included in the wiring 13 (drive line) of the wiring board 10 described above. As shown in FIG. 36, the connection wiring 23 is electrically connected to the partial wiring 13 a via the bump 25. That is, a specific pair of partial wirings 13a included in the wiring 13 of the wiring board 10 are electrically connected via the bumps 25 and the connection wirings 23 of the mounting component 20D. Such connection wiring 23 is formed by patterning on the main surface 21 a of the element substrate 21.

  The connection wiring 24 of the mounting component 20D is for electrically connecting a plurality of specific partial wirings 14a included in the wiring 14 (ground line) of the wiring board 10 described above. As shown in FIG. 35, the connection wiring 24 is electrically connected to the partial wiring 14 a via the bump 25. That is, the specific partial wirings 14a included in the wiring 14 of the wiring board 10 are electrically connected via the bumps 25 and the connection wiring 24 of the mounting component 20D. Such connection wiring 24 is formed by patterning on the main surface 21 a of the element substrate 21.

  For example, as shown in FIGS. 37 to 40, each mounting component 20E has an element substrate 21, an LPF element 22E, and connection wirings 23 and 24, and is joined to the wiring substrate 10 via bumps 25. . In FIG. 32, the element substrate 21 is shown in a perspective manner for each mounting component 20E. In FIG. 37, the element substrate 21 is shown in a perspective view with respect to one mounting component 20E.

  The element substrate 21 of the mounting component 20E is a silicon substrate, for example, and has a main surface 21a facing the wiring substrate 10 (or the mounting target surface 11a of the substrate 11). The LPF element 22E and the connection wirings 23 and 24 are provided on the main surface 21a of the element substrate 21. In FIG. 32, the LPF element 22E provided on the main surface 21a side of the element substrate 21 is schematically shown, and the connection wirings 23 and 24 on the main surface 21a are shown in an equivalent circuit diagram. In FIG. 37, the LPF element 22E provided on the main surface 21a side of the element substrate 21 is schematically shown with an equivalent circuit diagram.

  As shown in FIG. 37, the LPF element 22E of the mounting component 20E includes capacitors C1 and C2, an inductor D, and terminal portions E1 and E2. The terminal portions E1 and E2 are electrically connected to the wiring 12 on the wiring board 10 side via the bumps 25 shown in FIG. The specific structures of the capacitors C1 and C2, the inductor D, and the terminal portions E1 and E2 are not limited as long as the equivalent circuit shown in FIG. 37 of the LPF element 22E is established on the element substrate 21.

  Each connection wiring 23 of the mounting component 20E is for electrically connecting two specific sets of partial wirings 13a included in the wiring 13 (drive line) of the wiring board 10 described above. As shown in FIG. 40, the connection wiring 23 is electrically connected to the partial wiring 13 a via the bump 25. That is, a specific pair of partial wirings 13a included in the wiring 13 of the wiring board 10 are electrically connected via the bumps 25 and the connection wirings 23 of the mounting component 20E. Such connection wiring 23 is formed by patterning on the main surface 21 a of the element substrate 21.

  The connection wiring 24 of the mounting component 20E is for electrically connecting a plurality of specific partial wirings 14a included in the wiring 14 (ground line) of the wiring board 10 described above. As shown in FIG. 39, the connection wiring 24 is electrically connected to the partial wiring 14 a via the bump 25. That is, the specific partial wirings 14a included in the wiring 14 of the wiring board 10 are electrically connected via the bumps 25 and the connection wiring 24 of the mounting component 20E. Further, in the mounting component 20E, the connection wiring 24 is electrically connected to the LPF element 22E described above. Such connection wiring 24 is formed by patterning on the main surface 21 a of the element substrate 21.

  Each switching element 30 is for cutting off the middle of the wiring 12 (signal line), and has the same structure as described above with respect to the switching element 30 of the integrated electronic component X1 with reference to FIGS. Have The drive electrode 34 in the switching element 30 is connected to the wiring 13 (drive line) of the wiring board 10, and the drive electrode 35 is connected to the wiring 14 (ground line). Further, in the integrated electronic component X4, all the switching elements 30 are arranged in a region substantially surrounded by the wiring 12.

  In the integrated electronic component X4, as shown in FIG. 32, three element groups each including the HPF element 22D and the LPF element 22E arranged in parallel are arranged in series in the circuit configuration between the terminal portions 12a and 12b. Has been.

  When driving the integrated electronic component X4 (variable phase shifter) having the above configuration, the HPF element 22D or the LPF element 22E is selected in each element group. Specifically, a pair of switching elements 30 arranged in series with respect to the HPF element 22D to be selected and disposed between the HPF elements 22D is selected, and both the switching elements 30 are closed. At the same time, or alternatively, a pair of switching elements 30 arranged in series with the LPF element 22E to be selected and interposed between the LPF elements 22E is selected, and both the switching elements 30 are closed. And A method for realizing the closed state of the target switching element 30 in the integrated electronic component X4 is as follows.

  Of a plurality of conductive paths (each having a terminal portion 13b) formed from the wiring 13 of the wiring board 10, the connection wiring 23 of the mounting components 20D and 20E, and the bump 25 connecting them, the target switching element A conductive path connected to 30 drive electrodes 34 is selected. Then, a drive potential is applied from the terminal portion 13b of the selected conductive path to the drive electrode 34 of the target switching element 30 via the conductive path. Thereby, in the target switching element 30, an electrostatic attractive force is generated between the drive electrodes 34 and 35, and the movable portion 32 is elastically deformed so that the contact electrode 33 contacts the part 12 c of the wiring 12, thereby achieving the closed state. Is done.

  When the closed state is realized for the selected three pairs of switching elements 30 as described above, the phase of the signal passing between the terminal portions 12a and 12b changes.

  In the integrated electronic component X4, as shown in FIG. 32, the three HPF elements 22D are distinguished from HPF1 to HPF3, and the three LPF elements 22E are distinguished from LPF1 to LPF3. When the electrostatic capacity of the capacitor C is set to 0.6 pF and the inductances of the inductors D1 and D2 are both set to 1.6 nH in the HPF 1, the phase shift amount related to the HPF 1 becomes +90 deg. When the capacitance of the capacitor C is set to 1.0 pF, the inductance of the inductor D1 is set to 3.2 nH, and the inductance of the inductor D2 is set to 3.9 nH in the HPF2, the phase shift amount related to the HPF2 becomes +45 deg. When the capacitance of the capacitor C is set to 2.4 pF, the inductance of the inductor D1 is set to 3.1 nH, and the inductance of the inductor D2 is set to a minimum value (for example, 0 nH) in the HPF 3, the amount of phase shift related to the HPF 3 is +22. .5deg. In LPF1, when the capacitances of capacitors C1 and C2 are both set to 0.6 pF and the inductance of inductor D is set to 1.6 nH, the phase shift amount related to LPF1 is −90 deg. When the capacitances of the capacitors C1 and C2 are both set to 0.3 pF and the inductance of the inductor D is set to 1.1 nH in the LPF2, the amount of phase shift related to the LPF2 is −45 deg. When the capacitance of the capacitor C1 is set to 0.2 pF, the minimum value that can set the capacitance of the capacitor C2 (for example, 0 pF), and the inductance of the inductor D is set to 0.8 nH in the LPF 3, the phase shift amount related to the LPF 3 Becomes −22.5 deg. When the phase shift amounts according to HPF 1 to 3 and LPF 1 to 3 are set as described above, in integrated electronic component X4, the phase shift amount is changed between eight values in the range of -157.5 deg to +157.5 deg. Can be made.

  The integrated electronic component X4 includes a wiring 12 (signal line) electrically connected to the HPF element 22D and the LPF element 22E provided on the mounting components 20D and 20E, and a wiring 13 (drive line) different from the wiring 12 On the substrate 11. In the integrated electronic component X4, it is possible to avoid the wiring 13 and the HPF element 22D and the LPF element 22E of the mounting components 20D and 20E from facing each other. Since the two partial wirings 13a included in the wiring 13 are electrically connected via the connection wirings 23 of the mounting components 20D and 20E, the HPF element 22D and the LPF element 22E pass through a region of the substrate 11 facing each other. This is because the wiring 13 does not need to be routed. A region where the HPF element 22D and the LPF element 22E are opposed to each other on the substrate 11 when the wiring 13 used to operate the switching element 30 in the region substantially surrounded by the wiring 12 is pulled out of the region. It is not necessary to route the wiring 13 so as to pass through. Such an integrated electronic component X4 that can avoid the wiring 13 and the HPF element 22D and the LPF element 22E from facing each other is parasitic between the wiring 13 and the HPF element 22D and the LPF element 22E due to capacitive coupling. Suitable for suppressing the generation of capacity. Such an integrated electronic component X4 is suitable for preventing deterioration of characteristics of the HPF element 22D and the LPF element 22E to be integrated.

  The integrated electronic component X4 includes a wiring 12 (signal line) electrically connected to the HPF element 22D and the LPF element 22E provided in the mounting components 20D and 20E, and a wiring 14 (ground line) different from the wiring 12 On the substrate 11. In the integrated electronic component X4, it can be avoided that the wiring 14 and the HPF element 22D and the LPF element 22E of the mounting components 20D and 20E face each other. Since the plurality of partial wirings 14a included in the wiring 14 are electrically connected via the connection wirings 24 of the mounting components 20D and 20E, the HPF element 22D and the LPF element 22E pass through the region of the substrate 11 facing each other. This is because it is not necessary to route the wiring 14. A region where the HPF element 22D and the LPF element 22E are opposed to each other on the substrate 11 when the wiring 14 used to operate the switching element 30 in a region substantially surrounded by the wiring 12 is pulled out of the region. It is not necessary to route the wiring 14 so as to pass through. Such an integrated electronic component X4 capable of avoiding the wiring 14 and the HPF element 22D and the LPF element 22E from facing each other is a parasitic due to capacitive coupling between the wiring 14 and the HPF element 22D and the LPF element 22E. Suitable for suppressing the generation of capacity. Such an integrated electronic component X4 is suitable for preventing deterioration of characteristics of the HPF element 22D and the LPF element 22E to be integrated.

  The integrated electronic component X4 is suitable for obtaining high bonding reliability with respect to the bonding of the wiring board 10 and the mounting components 20D and 20E. It is not always necessary to provide tall bumps or stacked bumps between the wiring board 10 and the mounting components 20D and 20E to ensure a large separation distance between the wiring board 10 and the mounting components 20D and 20E. Because.

  As described above, the integrated electronic component X4 is suitable for suppressing the generation of parasitic capacitance due to capacitive coupling between the wirings 13 and 14 and the HPF element 22D and the LPF element 22E. This is suitable for obtaining high bonding reliability for the mounting component 20D.

  In addition, the integrated electronic component X4 is suitable for downsizing. This is because, as described above, all the switching elements 30 for interrupting the middle of the wiring 12 are arranged in a region substantially surrounded by the wiring 12.

  FIG. 41 is a plan view (partially schematic, partly transparent) of an integrated electronic component X5 according to the fifth embodiment of the present invention. FIG. 42 is a partially enlarged plan view (partially see through) of the integrated electronic component X5. 43 to 45 are partial cross-sectional views taken along line XLIII-XLIII, line XLIV-XLIV, and line XLV-XLV in FIG. 42, respectively.

  The integrated electronic component X5 is a variable inductor capable of changing the inductance, and includes the wiring board 10, a plurality of mounting components 20F, and a plurality of switching elements 30A and 30B (represented schematically in FIG. 41). Prepare. The variable inductor can be used as a component of an RF circuit unit in a wireless communication device such as a mobile phone.

  The wiring substrate 10 includes a substrate 11, a wiring 12 having terminal portions 12a and 12b, a wiring 13 including a plurality of partial wirings 13a and having a plurality of terminal portions 13b, a plurality of partial wirings 14a and a terminal portion 14b. Wiring 14 having The configuration of the wiring board 10 is the same as the above-described configuration of the wiring board 10 of the integrated electronic component X1. In FIG. 41, the wiring structure (wirings 12 to 14) in the wiring board 10 is represented by an equivalent circuit diagram.

  For example, as shown in FIGS. 42 to 45, each mounting component 20 </ b> F has an element substrate 21, an inductor element 22 </ b> F, and connection wirings 23 and 24, and is joined to the wiring substrate 10 via bumps 25. . In FIG. 41, the element substrate 21 is shown in a perspective manner for each mounting component 20F. In FIG. 42, the element substrate 21 is shown in perspective with respect to one mounting component 20F.

  The element substrate 21 of the mounting component 20F is a silicon substrate, for example, and has a main surface 21a facing the wiring substrate 10 (or the mounting target surface 11a of the substrate 11). The inductor element 22F and the connection wirings 23 and 24 are provided on the main surface 21a of the element substrate 21. In FIG. 41, the inductor element 22F provided on the main surface 21a side of the element substrate 21 is schematically illustrated, and the connection wirings 23 and 24 on the main surface 21a are illustrated in an equivalent circuit diagram. In FIG. 42, the inductor element 22F provided on the main surface 21a side of the element substrate 21 is schematically illustrated with an equivalent circuit diagram.

  The inductor element 22F of the mounting component 20F is an element having a specific inductance, and includes an inductor D and terminal portions E1 and E2, as shown in FIG. The terminal portions E1 and E2 are electrically connected to the wiring 12 on the wiring board 10 side via bumps 25 shown in FIG. The specific structures of the inductor D and the terminal portions E1 and E2 are not limited as long as the equivalent circuit shown in FIG. 42 of the inductor element 22F is established on the element substrate 21.

  Each connection wiring 23 of the mounting component 20F is for electrically connecting two specific sets of partial wirings 13a included in the wiring 13 (drive line) of the wiring board 10 described above. As shown in FIG. 45, the connection wiring 23 is electrically connected to the partial wiring 13 a via the bump 25. That is, a specific pair of partial wirings 13a included in the wiring 13 of the wiring board 10 are electrically connected via the bumps 25 and the connection wiring 23 of the mounting component 20F. Such connection wiring 23 is formed by patterning on the main surface 21 a of the element substrate 21.

  The connection wiring 24 of the mounting component 20F is for electrically connecting a plurality of specific partial wirings 14a included in the wiring 14 (ground line) of the wiring board 10 described above. As shown in FIG. 44, the connection wiring 24 is electrically connected to the partial wiring 14 a via the bump 25. That is, the specific partial wirings 14a included in the wiring 14 of the wiring board 10 are electrically connected via the bumps 25 and the connection wiring 24 of the mounting component 20F. Such connection wiring 24 is formed by patterning on the main surface 21 a of the element substrate 21.

  The switching elements 30A and 30B are used to cut off the middle of the wiring 12 (signal line), respectively, and are described above with reference to the switching element 30 of the integrated electronic component X1 with reference to FIGS. It has a similar structure. The driving electrodes 34 in the switching elements 30A and 30B are connected to the wiring 13 (driving line) of the wiring board 10, and the driving electrode 35 is connected to the wiring 14 (ground line). In the integrated electronic component X <b> 5, all the switching elements 30 </ b> A and 30 </ b> B are arranged in a region substantially surrounded by the wiring 12.

  In the integrated electronic component X5, as shown in FIG. 41, a plurality of annular circuits (some annular circuits are omitted) each including one inductor element 22F are connected in series between the terminal portions 12a and 12b. It is arranged in. Each annular circuit includes a pair of switching elements 30A and a pair of switching elements 30B.

  When driving the integrated electronic component X5 (variable inductor) having the above configuration, for example, one inductor element 22F is selected from the plurality of inductor elements 22F, or an appropriate combination is selected from the plurality of inductor elements 22F. Two or more inductor elements 22F are selected. Specifically, the pair of switching elements 30A is closed in the annular circuit to which the inductor element 22F to be selected belongs, and the pair of switching elements 30B is closed in the annular circuit to which the inductor element 22F that should not be selected belongs. And Thereby, a specific inductance is set between the terminal portions 12a and 12b in the integrated electronic component X5. A method for realizing the closed state of the target switching elements 30A and 30B in the integrated electronic component X5 is as follows.

  Of a plurality of conductive paths (each having a terminal portion 13b) formed by the wiring 13 of the wiring board 10, the connection wiring 23 of the mounting component 20F, and the bump 25 connecting them, the target switching element 30A, A conductive path connected to the drive electrode 34 of 30B is selected. Then, a drive potential is applied from the terminal portion 13b of the selected conductive path to the drive electrode 34 of the target switching elements 30A and 30B via the conductive path. As a result, in the target switching elements 30A and 30B, an electrostatic attractive force is generated between the drive electrodes 34 and 35, and the movable portion 32 is elastically deformed so that the contact electrode 33 contacts the part 12c of the wiring 12, and the closed state Is achieved.

  The integrated electronic component X5 includes the wiring 12 (signal line) electrically connected to the inductor element 22F provided on the mounting component 20F and the wiring 13 (drive line) different from the wiring 12 on the substrate 11. In the integrated electronic component X5, it is possible to avoid the wiring 13 and the inductor element 22F of the mounting component 20F from facing each other. Since the two partial wirings 13a included in the wiring 13 are electrically connected via the connection wiring 23 of the mounting component 20F, it is necessary to route the wiring 13 so as to pass through a region where the inductor element 22F is opposed to the substrate 11. Because there is no. When the wiring 13 used to operate the switching elements 30A and 30B in the region substantially surrounded by the wiring 12 is pulled out of the region, the substrate 11 passes through the region facing the inductor element 22F. Thus, the wiring 13 does not need to be routed. Such an integrated electronic component X5 that can avoid the wiring 13 and the inductor element 22F from facing each other suppresses the occurrence of parasitic capacitance due to capacitive coupling between the wiring 13 and the inductor element 22F. Suitable for doing. Such an integrated electronic component X5 is suitable for preventing characteristic deterioration of the integrated inductor element 22F.

  The integrated electronic component X5 includes the wiring 12 (signal line) electrically connected to the inductor element 22F provided on the mounting component 20F, and the wiring 14 (ground line) different from the wiring 12 on the substrate 11. In the integrated electronic component X5, it is possible to avoid the wiring 14 and the inductor element 22F of the mounting component 20F from facing each other. Since the plurality of partial wirings 14a included in the wiring 14 are electrically connected via the connection wiring 24 of the mounting component 20F, it is necessary to route the wiring 14 so that the inductor element 22F passes through the region facing the substrate 11. Because there is no. When the wiring 14 used for operating the switching elements 30A and 30B in the region substantially surrounded by the wiring 12 is drawn out of the region, the substrate 11 passes through the region facing the inductor element 22F. Thus, there is no need to route the wiring 14 as described above. Such an integrated electronic component X5 that can avoid the wiring 14 and the inductor element 22F from facing each other suppresses the occurrence of parasitic capacitance due to capacitive coupling between the wiring 14 and the inductor element 22F. Suitable for doing. Such an integrated electronic component X5 is suitable for preventing characteristic deterioration of the integrated inductor element 22F.

  The integrated electronic component X5 is suitable for obtaining high bonding reliability with respect to the bonding of the wiring board 10 and the mounting component 20F. This is because tall bumps or stacked bumps for securing a large separation distance between the wiring board 10 and the mounting component 20F do not necessarily have to be interposed between the wiring board 10 and the mounting component 20F.

  As described above, the integrated electronic component X5 is suitable for suppressing the generation of parasitic capacitance due to capacitive coupling between the wirings 13 and 14 and the inductor element 22F, and is suitable for the wiring board 10 and the mounting component 20F. It is suitable for obtaining high joint reliability.

  In addition, the integrated electronic component X5 is suitable for downsizing. This is because all the switching elements 30 </ b> A and 30 </ b> B for cutting off the middle of the wiring 12 are arranged in a region substantially surrounded by the wiring 12 as described above.

  FIG. 46 is a plan view (partially schematic, partly transparent) of an integrated electronic component X6 according to the sixth embodiment of the present invention. FIG. 47 is a partial enlarged plan view (partially schematic, partly transparent) of the integrated electronic component X6. FIG. 48 is a partially enlarged plan view (partially see through) of the integrated electronic component X6. 49 to 51 are partial cross-sectional views taken along line XLIX-XLIX, line L-L, and line LI-LI in FIG. 48, respectively.

  The integrated electronic component X6 is a capacitor bank, and includes a wiring board 10, a plurality of mounting components 20G (some mounting components 20G are omitted in FIG. 46), and a plurality of switching elements 30 (schematic in FIGS. 46 and 47). Express). The capacitor bank can function as a variable capacitor as a whole, and can be used, for example, as a component of an RF circuit unit in a wireless communication device such as a mobile phone.

  The wiring board 10 includes a substrate 11, a wiring 12 having terminal portions 12a and 12b, a wiring 13 including a plurality of partial wirings 13a and including a terminal portion 13b, a plurality of partial wirings 14a and including a terminal portion 14b. Wiring 14. The configuration of the wiring board 10 is the same as the above-described configuration of the wiring board 10 of the integrated electronic component X1. In FIG. 46, a part of the wiring structure (wirings 12 to 14) in the wiring board 10 is omitted and shown in an equivalent circuit diagram.

  Each mounting component 20G has an element substrate 21, a capacitor element 22G, and connection wirings 23 and 24 as shown in FIGS. 47 to 51, for example, and is bonded to the wiring substrate 10 via bumps 25. . In FIG. 46, the element substrate 21 is shown in a perspective manner for each mounting component 20G. In FIG. 47, the element substrate 21 is shown in perspective with respect to two specific adjacent mounting components 20G. In FIG. 48, the element substrate 21 is shown in perspective with respect to one mounting component 20G.

  The element substrate 21 of the mounting component 20G is, for example, a silicon substrate, and has a main surface 21a facing the wiring substrate 10 (or the mounting target surface 11a of the substrate 11). Capacitor element 22 </ b> G and connecting wires 23 and 24 are provided on main surface 21 a of element substrate 21. In FIG. 46, the capacitor element 22G provided on the main surface 21a side of the element substrate 21 is schematically shown, and a part of the connection wirings 23 and 24 on the main surface 21a is omitted in an equivalent circuit diagram. Represent. 47, the capacitor element 22G provided on the main surface 21a side of the element substrate 21 is schematically represented with an equivalent circuit diagram, and the connection wirings 23 and 24 on the main surface 21a are illustrated in an equivalent circuit diagram. Represent. 48, the capacitor element 22G provided on the main surface 21a side of the element substrate 21 is schematically illustrated with an equivalent circuit diagram.

  The capacitor element 22G of the mounting component 20G is an element having a specific capacitance, and includes a capacitor C and terminal portions E1 and E2, as shown in FIGS. The terminal portions E1 and E2 are electrically connected to the wiring 12 on the wiring board 10 side via bumps 25 shown in FIG. The specific structures of the capacitor C and the terminal portions E1 and E2 are not limited as long as the equivalent circuits shown in FIGS. 47 and 48 of the capacitor element 22G are established on the element substrate 21. Further, the plurality of capacitor elements 22G in the integrated electronic component X6 are arranged in parallel in the circuit configuration. The capacitances of the plurality of capacitor elements 22G are all the same, for example.

  Each connection wiring 23 of the mounting component 20G is for electrically connecting two specific sets of partial wirings 13a included in the wiring 13 (drive line) of the wiring board 10 described above. As shown in FIG. 51, the connection wiring 23 is electrically connected to the partial wiring 13 a via the bump 25. That is, a specific pair of partial wirings 13a included in the wiring 13 of the wiring board 10 are electrically connected via the bumps 25 and the connection wirings 23 of the mounting component 20G. Each mounting component 20G is provided with a necessary number of connection wirings 23 (in FIG. 46, the mounting component located on the outermost side in the circuit configuration of the integrated electronic component X6 among the plurality of mounting components 20G). A part of the connection wiring 23 is omitted for 20G). The number of connection wirings 23 that one mounting component 20G should have tends to increase as the mounting component 20G is located on the outer side in the circuit configuration of the integrated electronic component X6. Such connection wiring 23 is formed by patterning on the main surface 21 a of the element substrate 21.

  The connection wiring 24 of the mounting component 20G is for electrically connecting a plurality of specific partial wirings 14a included in the wiring 14 (ground line) of the wiring board 10 described above. As shown in FIG. 50, the connection wiring 24 is electrically connected to the partial wiring 14 a via the bump 25. That is, the specific partial wirings 14a included in the wiring 14 of the wiring board 10 are electrically connected via the bumps 25 and the connection wiring 24 of the mounting component 20G. Further, in the mounting component 20G, the connection wiring 24 is electrically connected to the above-described capacitor element 22G. Such connection wiring 24 is formed by patterning on the main surface 21 a of the element substrate 21.

  Each switching element 30 is for cutting off the middle of the wiring 12 (signal line), and has the same structure as described above with respect to the switching element 30 of the integrated electronic component X1 with reference to FIGS. Have The drive electrode 34 in the switching element 30 is connected to the wiring 13 (drive line) of the wiring board 10, and the drive electrode 35 is connected to the wiring 14 (ground line). Further, in the integrated electronic component X6, all the switching elements 30 are arranged in a region substantially surrounded by the wiring 12.

  At the time of driving the integrated electronic component X6 (capacitor bank) having the above configuration, at least one capacitor element 22G is selected from the plurality of capacitor elements 22G and electrically connected to the terminal portions 12a and 12b. Specifically, a pair of switching elements 30 arranged in series with the capacitor element 22G to be selected and having the capacitor element 22G interposed therebetween are selected, and both the switching elements 30 are closed. A method for realizing the closed state of the target switching element 30 in the integrated electronic component X6 is as follows.

  Of a plurality of conductive paths (each having a terminal portion 13b) formed by the wiring 13 of the wiring board 10, the connection wiring 23 of the mounting component 20G, and the bump 25 connecting them, the target switching element 30 A conductive path connected to the drive electrode 34 is selected. Then, a drive potential is applied from the terminal portion 13b of the selected conductive path to the drive electrode 34 of the target switching element 30 via the conductive path. Thereby, in the target switching element 30, an electrostatic attractive force is generated between the drive electrodes 34 and 35, and the movable portion 32 is elastically deformed so that the contact electrode 33 contacts the part 12 c of the wiring 12, thereby achieving the closed state. Is done.

  After realizing the closed state of the selected switching element 30 as described above, it is possible to charge the selected capacitor element 22G by applying a voltage between the terminal portions 12a and 12b.

  The integrated electronic component X6 includes the wiring 12 (signal line) electrically connected to the capacitor element 22G provided on the mounting component 20G and the wiring 13 (driving line) different from the wiring 12 on the substrate 11. In the integrated electronic component X6, it can be avoided that the wiring 13 and the capacitor element 22G of the mounting component 20G face each other. Since the two partial wirings 13a included in the wiring 13 are electrically connected via the connection wiring 23 of the mounting component 20G, the substrate 11 passes through a region where the capacitor element 22G of the mounting component 20G faces. This is because there is no need to route the wiring 13. In the integrated electronic component X6, the capacitor element 22G is opposed to the substrate 11 when the wiring 13 used to operate the switching element 30 in the region substantially surrounded by the wiring 12 is pulled out of the region. Therefore, it is not necessary to route the wiring 13 so as to pass through the region to be processed. Such an integrated electronic component X6 that can avoid the wiring 13 and the capacitor element 22G of the mounting component 20G from facing each other is a parasitic due to capacitive coupling between the wiring 13 and the capacitor element 22G of the mounting component 20G. Suitable for suppressing the generation of capacity. Such an integrated electronic component X6 is suitable for preventing characteristic deterioration of the capacitor element 22G to be integrated.

  Further, the integrated electronic component X6 has a wiring 14 (ground line) different from the wiring 12 on the substrate 11 together with the wiring 12 (signal line) electrically connected to the capacitor element 22G provided in the mounting component 20G. Have. In the integrated electronic component X6, it can be avoided that the wiring 14 and the capacitor element 22G of the mounting component 20G face each other. Since the plurality of partial wirings 14a included in the wiring 14 are electrically connected via the connection wiring 24 of the mounting component 20G, the substrate 11 passes through a region where the capacitor element 22G of the mounting component 20G faces. This is because there is no need to route the wiring 14. In the integrated electronic component X6, the capacitor element 22G is opposed to the substrate 11 when the wiring 14 used to operate the switching element 30 in the region substantially surrounded by the wiring 12 is pulled out of the region. Therefore, it is not necessary to route the wiring 14 so as to pass through the region to be processed. Such an integrated electronic component X6 that can avoid the wiring 14 and the capacitor element 22G of the mounting component 20G from facing each other is a parasitic due to capacitive coupling between the wiring 14 and the capacitor element 22G of the mounting component 20G. Suitable for suppressing the generation of capacity. Such an integrated electronic component X6 is suitable for preventing characteristic deterioration of the capacitor element 22G to be integrated.

  In addition, the integrated electronic component X6 is suitable for obtaining high bonding reliability with respect to the bonding of the wiring board 10 and the mounting component 20G. This is because it is not always necessary to interpose a tall bump or a stacked bump between the wiring board 10 and the mounting component 20G to ensure a large separation distance between the wiring board 10 and the mounting component 20G.

  As described above, the integrated electronic component X6 is suitable for suppressing the generation of parasitic capacitance due to capacitive coupling between the wirings 13 and 14 and the capacitor element 22G, and is a junction between the wiring board 10 and the mounting component 20G. Therefore, it is suitable for obtaining high bonding reliability.

  As a summary of the above, the configurations of the present invention and variations thereof are listed below as supplementary notes.

(Appendix 1) A wiring board having a first surface, and a first wiring and a second wiring provided on the first surface;
An element substrate having a second surface facing the first surface; a functional element provided on the second surface side; and at least one connection wiring provided on the second surface. And at least one mounting component mounted on the board,
The functional element of the mounting component is electrically connected to the first wiring,
The second wiring is an integrated electronic component that includes at least one set of two partial wirings that are electrically connected via one connection wiring of the mounting component.
(Appendix 2) The wiring board further includes a third wiring,
The mounting component further includes additional connection wiring provided on the second surface of the element substrate,
The integrated electronic component according to appendix 1, wherein the third wiring includes at least two partial wirings that are electrically connected via the additional connection wiring of the mounting component.
(Supplementary note 3) The integrated electronic component according to supplementary note 2, wherein the functional element of the mounting component is electrically connected to the additional connection wiring.
(Supplementary note 4) The integrated electronic component according to any one of Supplementary notes 1 to 3, further comprising at least one switching element on the wiring substrate for interrupting the middle of the first wiring.
(Supplementary Note 5) The wiring board further includes at least one switching element for interrupting the middle of the first wiring, and the switching element generates a movable part and a driving force for the movable part. A first drive electrode and a second drive electrode; the first drive electrode is electrically connected to the second wiring; and the second drive electrode is electrically connected to the third wiring. The integrated electronic component according to Supplementary Note 2 or 3.
(Supplementary note 6) The functional element of the mounting component is an element selected from the group consisting of a bandpass filter element, a band elimination filter element, a highpass filter element, a lowpass filter element, an inductor element, and a capacitor element. The integrated electronic component according to any one of 1 to 5.
(Appendix 7) an element substrate having a main surface;
A functional element provided on the main surface side;
A mounting component including at least one connection wiring provided on the main surface.
(Additional remark 8) The mounting component of Additional remark 7 further provided with the additional connection wiring provided on the said main surface.
(Supplementary note 9) The mounting component according to supplementary note 8, wherein the functional element is electrically connected to the additional connection wiring.
(Supplementary Note 10) The functional element is an element selected from the group consisting of a bandpass filter element, a band elimination filter element, a highpass filter element, a lowpass filter element, an inductor element, and a capacitor element. The mounting component according to any one of the above.

X1 to X6 Integrated electronic component 10 Wiring board 11 Substrate 11a Mounting target surface 12, 13, 14 Wiring 13a, 14a Partial wiring 12a, 12b, 13b, 14b Terminal portion 20, 20A-20G Mounting component 21 Element substrate 21a Main surface 22 Band pass filter (BPF) element 22A Band elimination filter (BEF) element 22B, 22D High pass filter (HPF) element 22C, 22E Low pass filter (LPF) element 22F Inductor element 22G Capacitor element 23, 24 Connection wiring 23a, 24a Terminal portion 25 Bump C1, C2, C3, C Capacitor D1, D2, D3, D Inductor E1, E2 Terminal

Claims (2)

A wiring board having a first surface, and a first wiring , a second wiring, and a third wiring provided on the first surface;
An element substrate having a second surface facing the first surface; a functional element provided on the second surface side; and at least a communication wiring and an additional communication wiring provided on the second surface. And at least one mounting component mounted on the wiring board,
The functional element of the mounting component is electrically connected to the first wiring,
The second wiring is electrically connected to at least see one set including two pair of partial wiring and via the communication line of the mounting parts,
The third wiring includes at least one set of two partial wirings that are electrically connected via the additional connection wiring of the mounting component,
The wiring board further includes at least one switching element for interrupting the middle of the first wiring. The switching element includes a movable part and a first drive electrode for generating a driving force of the movable part. And the second drive electrode, the first drive electrode is electrically connected to the second wiring, and the second drive electrode is electrically connected to the third wiring. Type electronic components. The integrated electronic component according to claim 1 , wherein the functional element of the mounting component is electrically connected to the additional connection wiring.

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