JP5598237B2 - Non-contact individual authentication booklet - Google Patents

Description

  The present invention relates to a booklet for individual authentication incorporating a non-contact IC chip containing personal information.

  In recent years, as non-contact IC cards and IC tags have become widespread, for example, a non-contact personal authentication booklet containing an IC inlet capable of entering personal information or the like in a passport or a savings passbook has been used.

  As an IC inlet incorporated in such a non-contact individual authentication booklet, an IC inlet formed by sandwiching both surfaces of an IC chip and an antenna sheet connected to the IC chip with a porous foamed resin sheet is known. ing.

  The porous foamed resin sheet has water absorbability, and it is said that water, alcohol-based paste, or the like can be used. For this reason, it is suitable for joining with cover members, such as paper, and it is supposed that the lamination process excellent in joining strength can be performed using a porous structure.

On the other hand, when a foamed resin sheet is used for the antenna sheet, it is also known that the absorbed moisture often hinders the antenna forming process due to its water absorption.
Therefore, proposals have been made to use a non-foamed resin sheet for the sheet in contact with the antenna.
US Patent No. 7059535

  However, since the thing of patent document 1 employ | adopts the non-foaming resin for the sheet | seat of the side which contact | connects an antenna, and the foaming resin which has high heat-shrinkability for the sheet | seat of the other side, due to the different heat shrinkability between both sheets When bonding is performed by applying heat and pressure, wrinkles and curls like swells and waves are likely to occur on the surface of the IC inlet. There was a problem that wrinkles and curls that looked like swords were confirmed from the surface of the cover material, and the quality of the appearance deteriorated.

In addition, since the foamed resin has lower tear resistance than the non-foamed resin, it is easy to tear the IC inlet intentionally, and it is easy to take out the IC inlet for the purpose of impersonation, which is also a problem from the viewpoint of security. It was.
Accordingly, the present invention has been made in consideration of such problems, and an object of the present invention is to provide a non-contact individual authentication booklet that maintains a good appearance and has high security.

  The non-contact individual authentication booklet of the present invention solves the above problems by means described in the following embodiments.

According to a first aspect of the present invention, there is provided an IC inlet formed by laminating first and second intermediate sheets on the front and back of a non-contact IC module via an adhesive, and a surface cover sheet on one surface of the IC inlet. , A booklet having a cover portion formed by laminating turning sheet sheets on the other side through an adhesive, wherein the first and second intermediate sheets have substantially the same thickness and substantially paper made of the same material, synthetic paper, or Ru der either resin films.

The non-contact IC module is
A sheet-like member having an antenna and an IC part connected to the antenna, a first intermediate sheet is laminated on a surface of the sheet-like member on which the IC part is provided, and the first intermediate sheet An opening of a size that allows the IC part to enter is provided at a position corresponding to the IC part of the sheet, and the IC
Top parts are that are bonded to the front cover sheet via an adhesive or dial sheet.

Furthermore, the IC unit is formed on the top surface of the IC chip and the IC chip, Ri Do and a surface protection plate, the surface protection plate is peeled off when the surface cover sheet or the dial sheet is peeled so that the IC chip is broken, the surface cover sheet or said dial sheet is a characterized that you have been bonded directly to the IC portion.

  According to the present invention, since the intermediate sheet sandwiching the front and back of the non-contact IC module is made of the same thickness and the same member, it is possible to prevent the occurrence of swell, rippling and curling, so that the quality in appearance is improved. To do.

Further, the intermediate sheet on the side where the IC part is provided is provided with an opening of a size corresponding to the position where the IC part is provided so that the IC part can be inserted. Since the IC portion (IC chip) is destroyed when it is torn by being adhered to the sheet or the turn-back sheet, the IC chip cannot be diverted and high security can be provided.

FIG. 3A is a plan view of the non-contact IC module 10. FIG. 2B is a cross-sectional view of the non-contact IC module 10. 2 is a cross-sectional view of an IC inlet 20. FIG. (A) is sectional drawing which shows the structure of the cover part which adhere | attaches the IC chip 11 and the surface cover sheet 30. FIG. FIG. 4B is a cross-sectional view showing the structure of the cover part for bonding the IC chip 11 and the payback sheet 40. (A) is a figure of the state which inserts the IC inlet 20 with the surface cover sheet 30 and the return sheet 40, and produces the cover part 100 or 110. FIG. FIG. 4B is a booklet in which the content page portion 120 is attached to the cover portions 100 and 110 of FIG.

1 Non-contact individual authentication booklet 5 Adhesive 10 Non-contact IC module 11 IC chip 12 Antenna sheet 13 Surface protection plate 14 IC section 20 IC inlet 21 First intermediate sheet 22 Second intermediate sheet 30 Front cover sheet 40 Return sheet 100 Cover Part 110 Cover

Hereinafter, embodiments of the present invention will be described with reference to FIGS.
FIG. 1A is a plan view of a non-contact IC module 10 used for a non-contact individual authentication booklet according to an embodiment of the present invention. FIG. 2B is a cross-sectional view of the non-contact IC module 10. The non-contact IC module 10 includes an antenna sheet 12 on which an antenna is formed, an IC chip 11 attached to the antenna sheet 12, and a surface protection plate 13 formed on the top surface of the IC chip 11. The IC chip 11 and the surface protection plate 13 are combined to form an IC unit 14.

  As the material of the antenna sheet 12, various resin films made of PET (Polyethylene Terephthalate), PVC (Polyvinyl Chloride), ABS (Acrylonitril Butadiene Styrene), or the like can be suitably used.

  The IC chip 11 is electrically connected to the antenna of the antenna sheet 12, whereby the non-contact IC module 10 can transmit / receive data to / from an external data reader without contact.

  FIG. 2 is a cross-sectional view of the IC inlet. The IC inlet 20 of FIG. 2 is formed by sandwiching and bonding the front and back of the non-contact IC module 10 between the first intermediate sheet 21 and the second intermediate sheet 22 via the adhesive 5.

The first intermediate sheet 21 has an opening having a size into which an IC part corresponding to the position of the IC part including the IC chip 11 and the surface protection plate 13 of the non-contact IC module 10 can be inserted.
The first intermediate sheet 21 and the second intermediate sheet 22 employ the same material made of a non-foamed resin typified by, for example, an olefin-based resin sheet. Since the olefin resin sheet is less likely to be charged with static electricity, it has an effect of preventing malfunction and destruction of the IC chip 11 and is also a suitable material for a booklet as a final product because of its light weight.

  The first intermediate sheet 21 and the second intermediate sheet 22 have substantially the same thickness, and the thickness is equal to or greater than the thickness d1 of the antenna sheet 12, so that undulation, wavy wrinkles, and curling of the IC inlet 20 occur. Can be prevented. Further, by setting the thickness d2 of the IC chip 11 and the thickness d3 of the surface protection plate 13 to be equal to or greater than (d2 + d3), a depression can be made on the surface protection plate 13 in the IC inlet 20, and the surface cover sheet 30 and At the time of bonding with the turning sheet 40, the adhesive 5 is filled in the recess, and the bonding becomes strong.

In general, the thickness d1 of the antenna sheet 12 is approximately 70 μm, the thickness d2 of the IC chip 11 is 30 μm to 50 μm, and the thickness d3 of the surface protection plate 13 is 30 μm to 150 μm. The thickness of the intermediate sheet 21 and the second intermediate sheet 22 is 200 μm or more.

  As the adhesive 5, an organic filler, silica, a high boiling point steep solvent, trimethylbenzene, propylene glycol monomethyl ether acetate, hexamethylene, and a thermoplastic resin can be suitably used. The adhesive 5 preferably has a low temperature thermosetting type.

  The thickness of the adhesive applied when the first intermediate sheet 21 and the second intermediate sheet 22 are bonded to the non-contact IC module 10 by the adhesive 5 is approximately 10 μm or more. As a result, the first intermediate sheet 21 and the second intermediate sheet 22 and the non-contact IC module 10 can obtain a strong adhesion effect, high weather resistance, and light resistance due to the low temperature thermosetting characteristics of the adhesive 5.

  3A and 3B are cross-sectional views showing the structure of the cover part. 3A, the cover sheet 30 is bonded to the surface of the IC inlet 20 on which the first intermediate sheet 21 is bonded, and the return sheet 40 is bonded to the surface of the second intermediate sheet 22 on the surface. It is laminated and formed through the agent 5. Further, the surface protection plate 13 formed on the top surface of the IC chip 11 passes through the opening of the first intermediate sheet 21 and is bonded to the surface cover sheet 30 via the adhesive 5.

  3B, the cover sheet 110 is bonded to the surface of the IC inlet 20 on which the first intermediate sheet 21 is bonded, and the surface cover sheet 30 is bonded to the surface of the second intermediate sheet 22 on the surface. It is laminated and formed through the agent 5. Further, the surface protection plate 13 formed on the top surface of the IC chip 11 passes through the opening of the first intermediate sheet 21 and is bonded to the turning sheet 40 through the adhesive 5.

For the surface cover sheet 30, cloth cloth, paper cloth, PVC (polyvinyl chloride) cloth having a thickness of about 100 to 200 μm can be used.
As the payback sheet 40, a paper member having a thickness of about 100 to 150 μm can be used.

  According to the present invention, in the cover portion 100 or the cover portion 110, neither the surface cover sheet 30 nor the return sheet 40 is prone to waviness, rippling, or curling, and there is no unevenness, resulting in a high quality appearance. To be kept. In addition, since the surface protection plate 13 formed on the top surface of the IC chip 11 is directly bonded to the surface cover sheet 30 or the payback sheet 40, the non-contact IC module is destroyed at the time of tearing. It prevents unauthorized use such as diversion and has high security.

FIG. 4 is a diagram showing an example of creating the non-contact individual authentication booklet 1 according to the present invention.
FIG. 4A is a diagram illustrating a state in which the IC inlet 20 is sandwiched between the front cover sheet 30 and the return sheet 40 to create the cover part 100 or 110. In creating the cover portion 100 or the cover portion 110, the return sheet 40 forms a slit 41 corresponding to the folding position of the booklet cover, and the IC inlet 20 is sandwiched between the front cover sheet 30 and the return sheet 40, and the adhesive 5 Glue through.

  FIG. 4B is a booklet in which the content page portion 120 is attached to the cover portions 100 and 110 of FIG. 4A and cut to a specified size. The content page portion 120 is stitched together with the cover portions 100 and 110 by a sewing machine or the like, and cut into a specified size by a hollowing machine or a cutting machine to become a booklet. By providing the slit 41, the folded portion of the booklet becomes thin, and it is easy to fold, and the effect of reducing the load on the sewing machine to be sewn can be obtained.

Example 1
In the cover part 100 of FIG. 3A, the booklet of the present invention was created with the following configuration. As a result, a booklet with good appearance quality without swells and waves was obtained.
Further, when the surface cover sheet was peeled off and the IC part was taken out, the surface protection plate of the IC chip was peeled off and the IC chip was destroyed.

(1) First and second intermediate sheet thickness 203 μm, material: polyolefin resin, trade name “Teslin” manufactured by PPG (2) antenna sheet thickness 70 μm, material: PET
(3) IC chip IC chip thickness (d2): 50 μm
Surface protective plate thickness (d3): 100 μm
(4) Surface cover sheet thickness 150 μm, material: PVC-impregnated cloth sheet (5) reward sheet thickness 110 μm, material: fine paper (6) adhesive 10 μm thick on each sheet. Fill the top of the IC section.
Adhesive: Low temperature curing adhesive (main agent RCA-2000LT210) manufactured by Taiyo Ink Co., Ltd.
(Curing agent AD-100LT110)

  The above sheets were overlapped, and the front and back sides were sandwiched between stainless plates and pressure bonded. As a result, the total thickness of the cover portion was 650 μm.

(Example 2)
In the cover part 110 of FIG. 3B, a booklet was created in the same manner as in Example 1. As a result, a booklet with good appearance quality without swells and waves was obtained.
Further, when the surface cover sheet was peeled off and the IC part was taken out, the surface protection plate of the IC chip was peeled off and the IC chip was destroyed.

Claims (1)

IC inlet formed by laminating first and second intermediate sheets on the front and back of a non-contact IC module via an adhesive, a surface cover sheet on one side of the IC inlet, and a return paper sheet on the other side and a booklet with a cover portion formed by laminating respectively via an adhesive,
It said first and second intermediate sheet is in substantially the same thickness, and a paper made of substantially the same material, synthetic paper, or Ri der either resin film,
The non-contact IC module includes a sheet-like member including an antenna and an IC part connected to the antenna, and a first intermediate sheet is laminated on a surface of the sheet-like member on the side where the IC part is provided. An opening having a size that allows the IC portion to enter the position corresponding to the IC portion of the first intermediate sheet, and the top surface of the IC portion is a surface cover sheet or a facing sheet via an adhesive. Glued,
The IC part includes an IC chip and a surface protection plate formed on the top surface of the IC chip. When the surface cover sheet or the facing sheet is peeled off, the surface protection plate peels off and the IC chip. The booklet for non-contact individual authentication, wherein the surface cover sheet or the facing sheet is directly bonded to the IC part so that the sheet is destroyed.

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