JP5615022B2 - Mobile device - Google Patents

Description

  The present invention relates to a movable device having a main body portion and a movable portion movable relative to the main body portion, such as a processing device that performs processing such as grinding or cutting on a workpiece such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a large number of electronic circuits such as IC and LSI are formed on the surface of a substantially disk-shaped wafer made of semiconductor, and then the back surface of the wafer is ground and processed to a predetermined thickness. In addition, dicing is performed to cut the device region in which the electronic circuit is formed along a predetermined division line, thereby obtaining a large number of semiconductor chips as devices from one wafer.

  As an apparatus for dicing a wafer, a cutting apparatus that cuts a cutting blade into a work is known. The cutting apparatus includes a chuck table that adsorbs and holds a workpiece with a negative pressure to expose a machining surface, and a cutting mechanism that includes the cutting blade that cuts the workpiece held on the chuck table ( For example, Patent Document 1). In such a cutting apparatus, since a high-precision machining position such as a micron order is required, a scale for measuring the position of the cutting blade relative to the chuck table on which the workpiece is held has a plurality of cutting blades. It is attached along the operation axis (see Patent Document 2).

JP-A-8-25209 Japanese Patent Laid-Open No. 62-173147

  Thus, when cutting a workpiece with a cutting blade, cutting water is supplied to the processing point for the purpose of lubrication and cooling. The cutting water is mixed with fine machining scraps called “contamination” generated in the cutting process, and when the cutting blade rotating at high speed comes into contact with the cutting water, the mist rises into the apparatus. When a large amount of mist containing processing waste is generated and filled in the device, the mist adheres to the scale and becomes contaminated, and the scale position information (scale) cannot be read accurately by the reading means. Arise. For this reason, it was necessary to frequently clean the scale.

  The present invention has been made in view of the above circumstances, and a main technical problem thereof is to provide a movable device that can accurately read a scale even if the frequency of cleaning is lower than that in the past.

The movable device of the present invention is provided with a main body, a movable part movable with respect to the main body, a scale disposed in the main body along the movable direction of the movable part, and the movable part. A movable unit having a reading unit for reading the value of the scale, wherein the movable unit is provided with a wiping cleaning unit for wiping and cleaning the scale, and the wiping cleaning unit is attached to the movable unit. and the holder portion, to the holder portion, and a loaded wiping member so as resiliently abuts on the scale Rukoto biased to the scale side by the spring, the movable portion relative to the body portion The wiping member of the wiping and cleaning means wipes and cleans the scale when moved.

  According to the present invention, since the scale is cleaned by the wiping cleaning means when the movable part moves relative to the main body, the scale is easily maintained in a clean state. Therefore, even if the frequency of cleaning the scale is lowered, the scale Position information can be read accurately.

  The present invention is suitably applied to an apparatus for processing a plate workpiece such as a semiconductor wafer. Examples of such a processing apparatus include the cutting apparatus, a grinding apparatus, a polishing apparatus, and a laser processing apparatus that performs processing such as fusing by irradiating a laser beam.

The workpieces in these processing apparatuses are not particularly limited. For example, as a workpiece to be processed by a cutting apparatus, a semiconductor wafer made of silicon, gallium arsenide (GaAs), or the like, a DAF (Die Attach) provided on the back surface of the wafer for chip mounting. Adhesive materials such as film), semiconductor product packages, ceramics, glass, sapphire (Al ₂ O ₃ ) -based inorganic material substrates, various electronic components such as LCD drivers for controlling and driving liquid crystal display devices, micron-order processing position accuracy Various processing materials and the like that are required.

For example, as a workpiece to be processed by a grinding apparatus, a semiconductor wafer made of silicon or gallium arsenide (GaAs), ceramic, glass, a sapphire (Al ₂ O ₃ ) -based inorganic material substrate, a plate-like metal or a resin ductile material, Requires flatness on the order of micron to submicron (TTV: total thickness variation-the difference between the maximum value and the minimum value of the entire surface to be ground of the workpiece measured in the thickness direction based on the surface to be ground of the workpiece) And various processed materials.

  According to the present invention, there is an effect that it is possible to provide a movable device that can accurately read the position information of the scale even if the frequency of cleaning the scale is lowered.

It is a perspective view which shows the state which supported the workpiece | work (semiconductor wafer) of the cutting device which concerns on one Embodiment of this invention to the cyclic | annular flame | frame via the adhesive tape. It is the whole cutting device perspective view of one embodiment. It is a side view which shows typically the movement amount detection means of the X * Y * Z direction with which the cutting device of one Embodiment is provided. It is a front view which shows the 1st Y-axis movement means with which the cutting device of one Embodiment is equipped, the 2nd Y-axis movement means, and the Y direction movement amount detection means. It is a side view which shows the state by which the wiping cleaning means which concerns on one Embodiment was attached to the Y-axis movable base part of a Y-axis movement means. It is VI-VI sectional drawing of FIG. It is an enlarged view of the area | region shown by VII of FIG. 2, Comprising: The state to which the wiping cleaning means was attached to the Y-axis movable base part of the Y-axis movement means is shown. It is a perspective view which shows the wiping cleaning means which concerns on one Embodiment, Comprising: The state removed from the Y-axis movable base part of the Y-axis movement means is shown. It is a top view which shows the state in which the wiping cleaning means of one Embodiment was attached to the X-axis movable base part of an X-axis movement means.

  Hereinafter, an embodiment in which the present invention is applied to a cutting apparatus for dicing a semiconductor wafer will be described.

(1) Semiconductor Wafer First, a disk-shaped semiconductor wafer (hereinafter referred to as wafer) 1 which is a workpiece in one embodiment shown in FIG. 1 will be described. The wafer 1 is a silicon wafer having a thickness of, for example, about 100 μm, and a large number of rectangular device regions 3 partitioned by grid-like division planned lines 2 are formed on the surface. On the surface of each device region 3, an electronic circuit such as an IC or LSI (not shown) is formed. A linear notch (orientation flat) 4 indicating the crystal orientation of the semiconductor is formed at a predetermined location on the peripheral surface of the wafer 1.

  The wafer 1 is subjected to back grinding and thinned to a predetermined thickness, and is cut and divided along a division line 2 by a cutting apparatus (movable apparatus) 10 shown in FIG. Dicing is performed as individual chips.

  As shown in FIG. 1, the wafer 1 is supplied to the cutting device 10 in a state in which the wafer 1 is concentrically and integrally supported by an opening 5 a inside the annular frame 5 via an adhesive tape 6. The adhesive tape 6 has an adhesive surface on one side, and the frame 5 and the back surface of the wafer 1 are attached to the adhesive surface. The frame 5 has rigidity made of a plate material such as metal, and the wafer 1 is conveyed by supporting the frame 5. Hereinafter, the whole wafer 1 supported on the frame 5 via the adhesive tape 6 is referred to as a work unit 7.

(2) Cutting Device Next, the cutting device 10 shown in FIG. 2 will be described. The cutting apparatus 10 is a biaxially opposed type in which a pair of cutting means (first cutting means 40A and second cutting means 40B) are arranged to face each other, and the wafer 1 of the work unit 7 held on the chuck table 32 is Dicing is performed by the cutting means 40A and 40B. Operations relating to cutting are automatically controlled by the control means 80.

(2-1) Configuration of Cutting Device Reference numeral 11 in FIG. 2 is a base, and an X-axis moving means 20 that supports the chuck table 32 so as to be movable in the X direction is provided on the upper surface of the base 11. Yes. The X-axis moving means 20 includes a pair of X-axis linear guides 21 fixed on the base 11 and extending in the X direction, an X-axis movable base portion 22 slidably incorporated in these X-axis linear guides 21, A ball screw 23 that is rotatably disposed between the X-axis linear guides 21 and that is screwed to and coupled to the X-axis movable base portion 22 and extends in the X direction, and a drive unit 24 that includes a motor that rotates the ball screw 23. It is composed of According to the X-axis moving means 20, when the drive unit 24 is operated, the ball screw 23 rotates in either the forward or reverse direction, and the X-axis movable base unit 22 moves in a direction (X1 direction or (X2 direction) is moved on the X-axis linear guide 21.

  A holding means 30 is provided on the upper surface of the X-axis movable base portion 22. The holding means 30 includes a cylindrical table base 31 fixed to the X-axis movable base portion 22, and a disk-shaped chuck table 32 that is rotatably supported on the table base 31. The chuck table 32 is of a generally known vacuum chuck type that sucks and holds a workpiece (in this case, the wafer 1) placed on the holding surface 32a on the horizontal upper surface by a negative pressure action generated by sucking air. . The holding surface 32 a has the same diameter as the wafer 1, and the wafer 1 is placed concentrically on the holding surface 32 a via the adhesive tape 6 and is sucked and held.

  The chuck table 32 is provided with a plurality of clamps 35 for holding the frame 5 of the work unit 7. The chuck table 32 is rotated in one direction or both directions by a rotation drive mechanism (not shown) provided in the table base 31. The holding means 30 is reciprocated between the loading / unloading position on the near side (X1 side) in the X direction and the processing position on the far side (X2 side) by the X-axis moving means 20.

  In FIG. 2, a gate-type column 12 straddling the processing position is fixed to the X2 side on the base 11. The portal column 12 includes a pair of leg portions 12a erected side by side in the Y direction on both sides of the machining position, and a beam portion (main body portion) 12b horizontally spanned between the upper ends of the leg portions 12a. have. The first cutting means 40A is provided on the Y1 side of the front surface (X1 side surface) of the beam portion 12b so as to be movable in the Y direction and the Z direction via the first Y axis moving means 50A and the first Z axis moving means 60A. On the Y2 side of the front surface of the beam portion 12b, the second cutting means 40B is provided so as to be movable in the Y direction and the Z direction via the second Y axis moving means 50B and the second Z axis moving means 60B.

  The first Y-axis moving unit 50A and the second Y-axis moving unit 50B have the same configuration, and a pair of upper and lower Y-axis linear guides 51 fixed to the beam portion 12b are used as a common component. A linear guide 51, a Y-axis movable base portion (movable portion) 52 slidably incorporated in the Y-axis linear guide 51, and a ball screw extending in the Y direction rotatably disposed between the Y-axis linear guides 51 53 and a drive unit 54 (which is not shown in FIG. 2 for the second Y-axis moving means 50B side, see FIG. 4), which includes a motor for rotating the ball screw 53. One ball screw 53 is provided for each of the first Y-axis moving means 50A and one for the second Y-axis moving means 50B. One ball screw 53 is a Y-axis movable base of the first Y-axis moving means 50A. The other ball screw 53 is screwed and connected to the Y-axis movable base portion 52 of the second Y-axis moving means 50B.

  A first Z-axis moving unit 60A and a second Z-axis moving unit 60B are provided on the front surface of the Y-axis movable base 52 in the first Y-axis moving unit 50A and the second Y-axis moving unit 50B, respectively. The first Z-axis moving means 60A and the second Z-axis moving means 60B have the same configuration, and are a pair of Z-axis linear guides 61 that are fixed to the Y-axis movable base portion 52 and that are separated in the Y direction, and these Z-axis linear guides Z-axis movable base 62 slidably incorporated in 61 and a Z-axis (vertical direction) rotatably disposed between Z-axis linear guide 61 and screwed to and coupled to Z-axis movable base 62 ) And a drive unit 64 including a motor that rotates the ball screw 63.

  The first cutting means 40A is fixed to the lower end of the Z-axis movable base 62 of the first Z-axis moving means 60A, and the second cutting is applied to the lower end of the Z-axis movable base 62 of the second Z-axis moving means 60B. The means 40B is fixed. The first cutting means 40A and the second cutting means 40B have the same configuration, and a cutting blade 43 is provided at the tip of a rectangular parallelepiped spindle housing 41. The spindle housing 41 accommodates a spindle shaft and a motor for rotating the spindle shaft (both not shown), and a disc-shaped cutting blade is provided at the tip of the spindle shaft protruding from the tip opening of the spindle housing 41. 43 is attached.

  In these cutting means 40A and 40B, the spindle housing 41 is in a state where the spindle shaft is parallel to the Y direction and coaxial with each other, and the tips to which the cutting blades 43 are attached face each other. The shaft moving means 60B is fixed to the lower end of each Z-axis movable base 62. A blade cover 44 is attached to the tip of the spindle housing 41. The blade cover 44 includes a cutting water supply nozzle (not shown) that supplies cutting water to a processing point where the cutting blade 43 cuts into the wafer 1. The cutting water is supplied not only for lubrication and cooling, but also for the purpose of cleaning the chips to flow from the processing point. The cutting water is splashed by the rotating cutting blade 43, and the cutting water is prevented from being scattered by the blade cover 44.

  According to the first Y-axis moving unit 50A and the second Y-axis moving unit 50B, when each drive unit 54 operates, the ball screw 53 rotates in either the forward or reverse direction, and the Y-axis movable base unit 52 rotates the ball screw 53. It moves along the Y-axis linear guide 51 in a direction (Y1 direction or Y2 direction) according to the direction. Accordingly, the first cutting means 40A and the second cutting means 40B move along the Y direction so as to approach or separate from each other.

  Further, according to the first Z-axis moving means 60A and the second Z-axis moving means 60B, when the respective drive parts 64 are operated, the ball screw 63 rotates in either the forward or reverse direction, and the Z-axis movable base part 62 becomes the ball screw 53. Ascending / descending along the Z-axis linear guide 61 in a direction (upward: Z1 direction or downward: Z2 direction) according to the rotation direction. Thereby, the first cutting means 40A and the second cutting means 40B move up and down along the Z direction.

  An imaging means 49 for imaging the division line 2 of the wafer 1 held on the chuck table 32 is fixed at a position near the blade cover 44 on the front surface (X1 side surface) of the spindle housing 41. The image picked up by the image pickup means 49 is supplied to the control means 80, and the control means 80 performs alignment for positioning the planned division lines to be cut based on the image picked up by the image pickup means 49.

  As shown in FIG. 2, the cutting apparatus 10 includes an X-direction movement amount detection means 71 that detects the position and movement amount of the X-axis movable base portion 22 on which the holding means 30 is supported, and first and first 2 Y-axis movement means 50A, 50B, Y-direction movement amount detection means 72 for detecting the Y-axis movable base portion 52 in the Y-direction and the amount of movement, and the first and second Z-axis movement means 60A, 60B Z-direction movement amount detection means 73 for detecting the position and movement amount of the movable base 62 in the Z direction is provided.

  As shown in FIG. 3, these movement amount detection means 71, 72, 73 in each direction are fixed to be opposed to the back surface of each movable base portion 22 (52, 62), and each movable base portion 22 (52, 62). ) Of the scale 74 extending along the moving direction (the front and back of the drawing in FIG. 3) and the position information (scale) displayed on the surface of the scale 74, fixed to the back surface of each movable base portion 22 (52, 62). It is the structure provided with the reading means 75 which reads.

  As the movement amount detection means 71 to 73, for example, an optical type in which the reading means 75 reads the reflected light of the scale formed on the scale 74 is suitable. In addition to this, the scale 74 holds a magnetic signal that changes in the longitudinal direction, and the reading means 75 is applicable to a magnetic detection means that reads the magnetic signal and converts it into position information. Specifically, for example, a linear scale such as LIP471 manufactured by HEIDENHAIN can be used.

  As shown in FIG. 2, the scale 74 of the X-direction movement amount detection means 71 is fixed to the upper surface of the base 11 and to the side of one (Y1 side) X-axis linear guide 21. It extends along the linear guide 21. The reading means 75 shown in FIG. 3 for reading the position information of the scale 74 is fixed to the back surface of the X-axis movable base portion 22 of the X-axis moving means 20.

  The scale 74 of the Y-direction movement amount detection means 72 is fixed to the upper portion of the upper Y-axis linear guide 51 on the front surface of the beam portion 12 b of the portal column 12, and extends along the Y-axis linear guide 51. ing. The reading means 75 shown in FIG. 3 for reading the position information of the scale 74 is fixed to the back surfaces of the Y-axis movable base portions 52 of the first and second Y-axis moving means 50A and 50B. As shown in FIG. 4, the reading means 75 of the Y-direction movement amount detection means 72 is closer to the outside of the Y-axis movable base 52 (in the first Y-axis movement means 50A, closer to the Y1 side, in the second Y-axis movement means 50B, closer to the Y2 side). ).

  Further, as shown in FIG. 2, the scale 74 of the Z-direction movement amount detection means 73 has one (Y1 side) Z on the front surface of each Y-axis movable base portion 52 of the first and second Y-axis movement means 50A, 50B. It is fixed to the side of the shaft linear guide 61 and extends along the Z-axis linear guide 61. The reading means 75 shown in FIG. 3 for reading the position information of the scale 74 is fixed to the back surfaces of the Z-axis movable base portions 62 of the first and second Z-axis moving means 60A and 60B.

  The position information read by the movement amount detection means 71 to 73 in each direction is supplied to the control means 80. That is, the position and amount of movement of the X-axis movable base portion 22 are supplied to the control unit 80 as the relative position and amount of movement of the cutting blade 43 in the X direction with respect to the wafer 1 held by the holding unit 30. The position and amount of movement of the Y-axis movable base portion 52 are supplied as the position and amount of movement of the cutting blade 43 in the Y direction, and the position and amount of movement of the Z-axis movable base portion 62 are the same as the position of the cutting blade 43 in the Z direction. Supplied as a moving amount. The control means 80 controls the cutting operation on the wafer 1 based on the supplied position information.

(2-2) Wiping Cleaning Means In this embodiment, as shown in FIG. 4, the wiping cleaning means 100 that wipes and cleans the scale 74 of the Y-direction movement amount detection means 72 is the first and second Y-axis moving means 50A. , 50B are detachably attached to the outside of the reading means 75 of each Y-axis movable base 52.

  5-8 has shown the wiping cleaning means 100 attached to the Y-axis movable base part 52 by the side of the 1st Y-axis moving means 50A. The wiping and cleaning means 100 attached to the Y-axis movable base portion 52 on the second Y-axis moving means 50B side has the same symmetrical configuration and is attached to the Y-axis movable base portion 52 in the same manner.

  The wiping and cleaning means 100 includes a block portion 110 that is detachably attached to a corner portion of the Y-axis movable base portion 52 on the Y1 side in FIG. 2 extending from the side surface 52a to the back surface 52b, and a holder portion that is attached to the block portion 110. 120 and a wiping member 130 detachably attached to the holder portion 120.

  The block portion 110 is attached to the Y-axis movable base portion 52 with a space between the scale 74 and a facing surface 111 facing the scale 74 in parallel, and outer and inner side surfaces 112 connected to the facing surface 111. 113, a front surface 114 on the front side between the side surfaces 112, 113, an upper surface 115 and a lower surface 116. The facing surface 111, the side surfaces 112 and 113, and the front surface 114 are all vertical surfaces, but the front surface 114 is formed on a slope that recedes toward the outside, that is, toward the Y1 side in FIG. The upper surface 115 and the lower surface 116 are horizontal, and grooves 115a and 116a that are parallel to the slope and open to the side surfaces 112 and 113 are formed on the upper and lower surfaces 115 and 116, respectively. A fixed piece 117 extending forward (X1 direction in FIG. 2) is formed on the outer side surface 112 of the block 110. A bolt insertion hole 117 a is formed in the fixed piece 117. A screw hole 52c into which the bolt 105 is screwed corresponding to the bolt insertion hole 117a is formed in the side surface 52a of the Y-axis movable base portion 52.

  A notch 200 in which the block portion 110 is slidably fitted is formed above the upper Y-axis linear guide 51 in the corner portion of the Y-axis movable base portion 52. This notch 200 has substantially the same shape as the outer shape of the block part 110 excluding the fixed piece part 117, and extends along the upper and lower inner surfaces 201, 202 and the front surface 114 of the block part 110, and the Y-axis movable base part. The inner surface 203 is continuous with the side surface 52 a of the block 52, and the inner surface 204 is formed along the side surface 113 on the inner side of the block portion 110 and is continuous with the back surface 52 b of the Y-axis movable base portion 52. Guides 201a and 202a into which the grooves 115a and 116a of the block portion 110 are slidably fitted are formed on the upper and lower inner surfaces 201 and 202 of the notch 200, respectively.

  As shown in FIGS. 5 and 6, the holder portion 120 of the wiping cleaning means 100 is formed with a flange 121, and the flange 121 is formed in the insertion recess 118 formed on the opposing surface 111 of the block 110. Are inserted and supported so as to be movable in the front-rear direction (X direction in FIG. 2). The holder portion 120 has a facing surface 122 to the scale 74, and a clip 123 that holds the wiping member 130 in a removable manner is formed above and below the facing surface 122. The wiping member 130 is sandwiched between the clips 123 and attached in a state of covering the facing surface 122 of the holder portion 120. A compression spring 124 is provided between the holder portion 120 and the flange portion 121 to constantly urge the holder portion 120 toward the scale 74 side.

  The wiping member 130 contacts the surface of the scale 74 and wipes and cleans the scale 74. The material of the wiping member 130 is not limited as long as it can clean the scale 74, and for example, Lens Cleaning Tissue manufactured by Tiffen is used.

  As shown in FIG. 8, the wiping and cleaning means 100 has the wiping member 130 directed to the scale 74 side (X2 side in FIG. 2) on the side of the Y-axis movable base portion 52, and the grooves 115a and 116a are guided to the guide 201a. , 202a, the grooves 115a, 116a are fitted into the guides 201a, 202a and fitted into the notches 200, and the grooves 115a, 116a are guided by the guides 201a, 202a and gradually. The wiping member 130 comes into contact with the surface of the scale 74 as it approaches the scale 74. When the inner side surface 113 of the block portion 110 abuts the inner surface 204, the bolt insertion hole 117a coincides with the screw hole 52c. Therefore, the bolt 105 passed through the bolt insertion hole 117a is screwed into the screw hole 52c and the block portion 110 is Fastened to the movable shaft base 52. As described above, the wiping cleaning means 100 is attached to the Y-axis movable base 52, and in this attached state, the wiping member 130 is urged by the compression spring 124 and elastically contacts the surface of the scale 74.

  The wiping and cleaning means 100 is similarly attached to the end portion on the Y2 side in FIG. 2 of the Y-axis movable base portion 52 on the second Y-axis moving means 50B side. That is, the wiping and cleaning means 100 is attached to the outer ends of the Y-axis movable base portions 52 of the first and second Y-axis moving means 50A and 50B in a symmetric state.

  According to these wiping and cleaning means 100, when each Y-axis movable base portion 52 moves in the Y direction along the Y-axis linear guide 51, the wiping member 130 wipes the surface of the scale 74, and the scale 74 is cleaned.

(2-3) Operation of Cutting Device Next, the operation of the cutting device 10 controlled by the control means 80 will be described.
First, the X-axis movable base portion 22 of the X-axis moving means 20 moves in the X1 direction in FIG. 2, the holding means 30 is positioned at the carry-in / out position, and the chuck table 32 is operated in vacuum. Then, the work unit 7 having the wafer 1 placed on the upper side and the adhesive tape 6 placed on the lower side is transported on the holding means 30 by the operator, and the wafer 1 is concentrically arranged on the chuck table 32 via the adhesive tape 6. Placed on. Then, the wafer 1 is attracted and held on the holding surface 32 a of the chuck table 32 via the adhesive tape 6. Further, the frame 5 is held by the clamp 35, and the work unit 7 is held by the holding means 30.

  Next, the X-axis movable base portion 22 moves in the X2 direction in FIG. 2, and the wafer 1 is transferred to the processing position together with the holding means 30. At this processing position, first, the surface of the wafer 1 is imaged by the imaging means 49, the position of the division line 2 is grasped by the control means 80, and alignment is performed. Then, the division | segmentation scheduled line 2 is cut | disconnected by the 1st and 2nd cutting means 40A and 40B according to alignment. At the time of cutting, cutting water is supplied from the cutting water supply nozzle toward the processing point.

  Cutting the scheduled division line 2 is performed by rotating the chuck table 32 to rotate the wafer 1 so that the planned division line 2 is parallel to the X direction, and the chuck table 32 is moved in the X direction together with the X-axis movable base portion 22. The cutting edge 43 is cut by feeding the cutting edge of the lower end of the cutting blade 43 into the wafer 1. Moreover, selection of the division | segmentation scheduled line 2 to cut | disconnect is made | formed by the index feed which moves the 1st and 2nd cutting means 40A and 40B to a Y direction.

  The control means 80 includes position information supplied from the X-direction movement amount detection means 71 (X-axis movable base portion 22 of the X-axis movement means 20, that is, relative X-direction position information of the cutting blade 43 with respect to the wafer 1), Position information (Y-axis movable base 52 of the first and second cutting means 40A and 40B, that is, Y-direction position information of the cutting blade 43) supplied from the Y-direction movement amount detection means 72, and Z-direction movement amount detection means Based on the position information supplied from 73 (Z-axis movable base 62 of the first and second cutting means 40A and 40B, that is, Z-direction position information of the cutting blade 43), the division line 2 is cut according to the alignment. As described above, the movable base portions 22, 52, 62 are moved, and cutting is performed by the first and second cutting means 40A, 40B.

  When all the division lines 2 are cut and the wafer 1 is diced into each device region 3, that is, a device (semiconductor chip), the cutting blade 43 is retracted upward, and the holding means 30 returns to the loading / unloading position and the chuck table The vacuum operation 32 is stopped, and the holding of the frame 5 by the clamp 35 is released. Thereafter, the work unit 7 is picked up from the chuck table 32 by the operator, and the wafer 1 is moved to the next process (for example, a cleaning process).

(2-4) Effect of Wiping Cleaning Means While the cutting blade 43 is cut into the wafer 1 and cutting such as cutting is being performed, the cutting blade 43 rotating at high speed is being supplied to the processing point Mist is generated by contact with water. Since the cutting water is mixed with fine processing scraps called “contamination” generated in the cutting process, the mist is contaminated. The mist soars upward and may adhere to the scale 74 as the amount of machining increases. Then, the reading unit 75 cannot read the position information of the scale 74 accurately.

  However, in the present embodiment, the reading means 75 of the Y-direction movement amount detection means 72 reads the position information of the scale 74 during the indexing feed for moving the first and second cutting means 40A, 40B in the Y direction. At the same time, the wiping member 130 of the wiping cleaning means 100 attached to each Y-axis movable base portion 52 moves while wiping the surface of the scale 74, whereby the scale 74 is cleaned. For this reason, it is easy to keep the scale 74 in a clean state by cutting. As a result, it is possible to obtain an effect that the position information of the scale 74 can be read accurately even if the frequency of cleaning the scale 74 is lowered. As the cleaning is performed, the wiping member 130 becomes dirty, and the cleaning effect is lowered. At that time, the wiping cleaning means 100 is detached from the Y-axis movable base portion 52, is replaced with a new wiping member 130, and becomes the Y-axis movable base portion 52 again. It only has to be attached.

  The cleaning of the scale 74 by the wiping cleaning means 100 is performed not only during the cutting process but also in a scale cleaning mode in which each Y-axis movable base 52 is periodically moved in the Y direction during the cutting process only for the purpose of cleaning. It may be set and controlled so that the scale 74 is cleaned over the entire length by the two wiping cleaning means 100. In order to clean the entire length of the scale 74 by the two wiping cleaning means 100b, the Y-axis movable base 52 is appropriately moved so that the area that cannot be cleaned by one wiping cleaning means 100 is cleaned by the other wiping cleaning means 100. Just do it.

  Moreover, in the said embodiment, the wiping cleaning means 100 shall be attached to each Y-axis movable base part 52 of 1st and 2nd Y-axis moving means 50A, 50B, and the scale 74 of the Y direction movement amount detection means 72 shall be cleaned. However, the wiping cleaning means 100 may be provided so as to clean the scale 74 of the X direction movement amount detection means 71 and the Z direction movement amount detection means 73. When cleaning the scale 74 of the X-direction movement amount detection means 71, the wiping cleaning means 100 is attached to the X-axis movable base portion 22, and when cleaning the scale 74 of the Z-direction movement amount detection means 73, wiping is performed. The cleaning means 100 is attached to the Z-axis movable base part 62.

  FIG. 9 shows an example in which the wiping cleaning means 100 is attached at a position facing the scale 74 on the back surface of the X-axis movable base portion 22 in order to clean the scale 74 of the X-direction movement amount detection means 71. In this case, the wiping cleaning means 100 is disposed one by one at both ends in the moving direction of the X-axis movable base portion 22, and the reading means 75 is disposed at the intermediate portion. By disposing the wiping cleaning means 100 at both ends, the scale 74 can be cleaned by any of the wiping cleaning means 100 over the entire length.

  In addition, the said embodiment is an example which applied this invention to the cutting device, and this invention is not only this kind of cutting device but a grinding device, a polishing device, or a laser beam which processes plate-shaped workpieces, such as a semiconductor wafer, for example. As described above, the present invention can be applied to a laser processing apparatus or the like that performs processing such as fusing by irradiation.

1 ... Semiconductor wafer (work)
10 ... Cutting device (movable device)
12b ... Beam (main body)
52. Each Y-axis movable base (movable part)
74 ... Scale 75 ... Reading means 100 ... Wiping cleaning means

Claims (1)

A main body part and a movable part movable relative to the main body part;
A scale disposed in the main body along the movable direction of the movable part,
Reading means for reading the value of the scale disposed in the movable part;
A movable device comprising:
Wipe cleaning means for wiping and cleaning the scale on the movable part is disposed,
該拭cleaning means, a holder portion attached to the movable part, to the holder portion, and the loaded wiping member so as resiliently abuts on the scale Rukoto biased to the scale side by the spring With
The movable device characterized in that the wiping member of the wiping cleaning means wipes and cleans the scale when the movable portion moves relative to the main body portion.

Images