JP5618135B2 - Plating substrate holder - Google Patents

Description

  The present invention relates to an improvement of a plating substrate holder used mainly in a carrier type plating apparatus.

  Conventionally, as a substrate holding method using a substrate holder for plating, there are a tightening holding method, a spring holding method, a pinching holding method, a clip holding method, and the like as disclosed in Patent Document 1. The present invention is an improvement of a substrate holder for plating of a tightening holding system.

  In the clamping holding type plating substrate holder, a substrate is held by a substrate support and a fastening screw as described in Patent Document 2, or a substrate is connected from the front and back by a fastening screw as described in Patent Document 1. There was something to hold on the vertical plate. In any case, these were intended to hold the substrate by tightening the tightening screw. Further, normally, as shown in Patent Document 2, a fastening screw has played a role of a power feeding unit.

  Therefore, it is necessary to increase the number of tightening screws in order to ensure reliable holding of the substrate and reliable supply of power to the substrate with such a clamping and holding type plating substrate holder. However, when the number of tightening screws increases, the work of turning the tightening screws becomes a burden when the substrate is attached and detached.

Japanese Patent Laid-Open No. 2000-248400 Japanese Patent Laid-Open No. 4-337100

  The present invention is intended to solve the above-mentioned problems, and by using the normal screw portion and the reverse screw portion of the tightening screw, the substrate pressing body and the substrate pressing / feeding power supply at a larger interval than usual (interval more than double). The present invention provides a plating substrate holder that can be attached to and detached from the plating substrate holder in a short time with the tops being tightened or separated.

In order to solve the above problem, the first invention employs the following means for the plating substrate holder.
First , an electrode for sending the current taken from the carrier bar through the hook part to the back-side power feeding part formed on the substrate holding surface is embedded in the inner longitudinal direction, and the electrode and the back-side power feeding part are excluded except for the electrode and the back-side power feeding part. A vertical saddle-shaped substrate holding body made of a conductive material and a conductive circuit for sending a current to a surface-side power feeding part formed on the substrate clamping surface are embedded, and the non-conductive material is excluded except for the surface-side power feeding part and the conductive circuit. A board holding and feeding power piece, and a conductive fastening screw for mounting the board holding and feeding power piece on the substrate holding body, and a positive thread portion is formed at a screwed portion with the board holding body, A reverse screw portion is formed at a screwed portion with the substrate holding and feeding power supply piece, and includes a fastening screw connected to the electrode and the conductive circuit .
Secondly, power is supplied to the substrate from the front surface side and back surface side power supply units with respect to the held substrate.

  In a second invention, the plating substrate holder according to the first invention is obtained by attaching a plurality of substrate pressing / feeding pieces to a single independent substrate pressing body with a fastening screw. It is added that a plurality of tools are used to hold the substrate.

A third invention is obtained by adding that Oite the first or plating substrate holder in the second invention, the surface-side power supply section and the back-side power supply portion, which is formed at a position symmetrical.

  The present invention is such that a normal screw portion is formed in a screwed portion of the fastening screw with the substrate pressing body, and a reverse screw portion is formed in the screwed portion with the substrate pressing and feeding power piece. By one rotation, the substrate holding body and the substrate holding / feeding piece are tightened by the sum of one pitch of the forward screw portion and one pitch of the reverse screw portion, and the substrate holding by the substrate holding body and the substrate holding / feeding piece is completed in a short time. Allows tightening for.

  Further, when the substrate is removed from the plating substrate holder, the substrate pressing body and the substrate pressing / feeding piece are rotated at the sum of one pitch of the forward screw portion and one pitch of the reverse screw portion by one rotation of the fastening screw. And the substrate can be removed from the plating substrate holder in a short time. As a result, a substrate holder for plating that enables the substrate to be attached and detached by a simple and rapid substrate pressing body and a substrate pressing and feeding frame, and the work efficiency can be improved.

In addition, the present invention can supply the plating current from both the front and back sides of the substrate by supplying power to the substrate from the front and back side power feeding portions to the held substrate, thereby improving the efficiency and efficiency of plating. It became possible to plan.

  As an effect of the second invention, the plating substrate holder is obtained by attaching a plurality of substrate pressing / feeding pieces to a single independent substrate pressing body with fastening screws, and the plating substrate holder Thus, a substrate holder for plating that can be adjusted to the horizontal dimension of the substrate by simply changing the intervals of the substrate holder for plating is obtained.

Front explanatory view showing the usage state in the carrier type plating equipment It is explanatory drawing of the board | substrate holder for plating, (A) is side explanatory drawing, (B) is front explanatory drawing, (C) is back explanatory drawing. Illustration of tightening screw FIG. 2 is a diagram for explaining the principle of a substrate attachment / detachment state, where FIG. Side view illustrating the current supply state near the power supply top Front explanatory view showing the power feeding part of the board holding and power feeding top

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view showing a carrier type plating apparatus using a plating substrate holder according to the present embodiment. Reference numeral 1 in FIG. 1 denotes a plating substrate holder which is a feature of the present invention. Is a substrate to be plated, 3 is a carrier bar, 4 is an outer frame of the apparatus, and 11 is a fixed rail of the substrate holder 1 for plating. In addition, the dotted line part in FIG. 1 is a liquid level position of the plating solution when the plating is actually performed.

  The details of the substrate holder 1 for plating are shown in FIG. 2. FIG. 2A is a side view, FIG. 2B is a front view, and FIG. 2C is a back view. As apparent from FIG. 2, the plating substrate holder 1 is a single bowl-shaped independent piece elongated in the vertical direction.

  The substrate holder 1 for plating includes a substrate holding body 5 that is a single unit that is long in the vertical direction, a plurality of substrate holding / feeding pieces 6 that are mounted on the substrate holding body 5, and a substrate holding body 5. It comprises a fastening screw 7 for mounting the holding / feeding power supply piece 6, a hook 8 connected to the upper end of the substrate pressing body 5, and a jig guide 9 connected to the lower end of the substrate pressing body 5.

  Since the plating substrate holder 1 is not a frame body as in the conventional substrate holder but is an independent one as described above, the substrate 2 is held by two left and right as shown in FIG. The plating substrate holder 1 is used. In FIG. 1, four substrates 2 are held by five plating substrate holders 1. For this reason, substrate holding surfaces 13 and 14 and power feeding portions 15 and 16 are formed on both the left and right sides (up and down in FIG. 1) of the substrate holder 1 for plating.

  The substrate pressing body 5 is a bowl-like body that is long in the longitudinal direction of a non-conductive material, and a jig guide 9 is continuously provided at the lower end of the substrate pressing body 5. The jig guide 9 ensures verticality of the plating substrate holder 1 by engaging with the fixed rail 11. On the other hand, a hook 8 is connected to the upper end of the substrate pressing body 5. The hook 8 has conductivity, and is clamped to the carrier bar 3 by the clamp device 10 and is positioned and fixed and held suspended.

  Inside the substrate pressing body 5, a conductive electrode 12 that is connected to the conductive hook 8 is embedded in the longitudinal direction. The plating current flows from the carrier bar 3 to the electrode 12 through the hook 8.

  At a desired position on the front side of the substrate pressing body 5, a substrate pressing / feeding piece 6 is mounted. Similarly to the substrate pressing body 5, the substrate pressing / feeding piece 6 is also made of a non-conductive material. As shown in FIG. 4, the substrate 2 is held between the substrate holding surface 13 of the substrate holding body 5 and the substrate holding surface 14 of the substrate holding and feeding feeder 6. The board holding surfaces 13 and 14 are provided at two places on the left and right sides of the board holding body 5 and the board holding and feeding feeder piece 6 respectively. In the substrate pressing body 5, the substrate holding surface 13 is provided at the left and right positions of the central convex portion 21 shown in FIGS. 5 and 6 at a portion facing the substrate pressing / feeding piece 6. The substrate clamping surface 14 is formed on the lower surface of the substrate pressing / feeding piece 6 at a position corresponding to the substrate clamping surface 13.

  In the embodiment shown in FIG. 1 and FIG. 2, corresponding to the size of the substrate 2, substrate holding / feeding pieces 6 are mounted at four locations. The substrate pressing and feeding power supply piece 6 is attached to the substrate pressing body 5 with a fastening screw 7 which is one of the features of the present invention. The fastening screw 7 is also conductive.

  As shown in FIG. 3, the fastening screw 7 is formed with a normal screw portion 18 and a reverse screw portion 19. As shown in FIG. 4, the portion that is screwed into the screwing portion of the substrate pressing body 5 is formed as a normal screw portion 18, and the portion that is screwed into the screwing portion of the substrate pressing and feeding piece 6 is reverse. It is formed as a screw part 19. A wing nut 17 is fixed to the fastening screw 7 to assist rotation.

  Therefore, when the tightening screw 7 is turned clockwise by twisting the fixed wing nut 17, the positive screw portion 18 of the tightening screw 7 attached to the screwing portion of the substrate pressing body 5 becomes the substrate pressing member. It sinks into the threaded part of the main body 5. At the same time, the reverse screw portion 19 of the tightening screw 7 attached to the screwing portion of the board holding / feeding piece 6 is connected to the board holding body 5 side (left side in FIG. 4) in the fastening direction. Move to. In this manner, the substrate is shifted from the open state shown in FIG. 4A to the substrate holding state shown in FIG.

  When the substrate 2 is removed, the wing nut 17 is rotated on the open side, that is, in the direction opposite to the clockwise direction. At this time, it is the reverse of the above-described tightening operation, and the substrate pressing body 5 and the substrate pressing / feeding power supply piece 6 are separated from each other by one rotation of the tightening screw 7 at an interval more than twice as usual. It can be removed from the holder 1.

  Power supply units 15 and 16 are provided on the substrate holding surfaces 13 and 14 of the substrate pressing main body 5 and the substrate pressing and feeding power supply piece 6. The power supply units 15 and 16 are provided on the left and right substrate holding surfaces 13 and 14 in the same manner as the substrate holding surfaces 13 and 14 are provided at the two left and right positions of the substrate holding body 5 and the substrate holding and feeding power piece 6 respectively.

  The power feeding unit 15 provided on the substrate holding surface 13 of the substrate pressing body 5 is a power feeding unit that comes into contact with the back side of the substrate 2 and serves as the back side power feeding unit in the present invention. The power feeding part 16 provided on the board holding surface 14 of the board holding and feeding power piece 6 is a power feeding part in contact with the surface side of the board 2 and is a surface side power feeding part in the present invention.

  The power feeding section 15 on the side of the substrate pressing body 5 is formed by erecting a contact 20 exposed from the electrode 12 in the substrate pressing body 5 to the substrate clamping surface 13, as shown by a short arrow in the center of FIG. Power is supplied. On the other hand, as shown in FIG. 5 and FIG. 6, the power feeding section 16 of the board holding / feeding top 6 embeds the conductive circuit 22 so that the contacts 20 are arranged on the top, bottom, left, and right of the board clamping surface 14 of the fastening screw 7. Is formed. The conductive circuit 22 is connected to the fastening screw 7 in contact with the electrode 12 and is supplied with power as indicated by a long arrow from the center of FIG. 5 toward the right side.

  Hereinafter, a method of using the plating substrate holder 1 according to the illustrated embodiment will be described. First, the holding of the substrate 2 will be described. With the tightening screw 7 loosened, the substrate 2 is inserted between the substrate pressing body 5 and the substrate pressing / feeding piece 6. The board | substrate 2 contact | abuts to the center convex part 21 of the board | substrate holding | maintenance main body 5, and insertion is stopped. That is, the central convex portion 21 functions as a stopper at the side end of the substrate 2.

Here, the fastening screw 7 is turned clockwise by twisting the wing nut 17 to which it is fixed.
At this time, the screwed portion of the fastening screw 7 attached to the screwed portion of the substrate pressing body 5 is formed with the regular screw portion 18, and therefore sinks into the screwed portion of the substrate pressing body 5. At the same time, since the reverse screw portion 19 is formed in the screwing portion of the tightening screw 7 attached to the screwing portion of the substrate pressing and power feeding piece 6, the substrate pressing member screwed into the screwing portion is formed. The combined power supply piece 6 moves to the left in FIG. 4 with respect to the fastening screw 7.

  That is, by rotating the clamping screw 7 once, the clamping screw 7 bites into the substrate pressing body 5 by one pitch, and at the same time, the substrate pressing / feeding piece 6 mounted on the clamping screw 7 has 1 to the clamping screw 7. Move in the pitch tightening direction (move to the left in FIG. 4). Therefore, by one rotation of the tightening screw 7, the substrate pressing body 5 and the substrate pressing / feeding piece 6 are equivalent to two pitches, more precisely, the sum of one pitch of the normal screw portion 18 and one pitch of the reverse screw portion 19. The holding operation of the substrate 2 by the substrate pressing body 5 and the substrate pressing / feeding piece 6 is completed in a short time.

  This is also effective when removing the substrate 2 from the plating substrate holder 1. That is, when the tightening screw 7 is rotated in the open direction, that is, in the reverse direction to the clockwise direction, the above-described tightening operation is reversed. With one rotation of the tightening screw 7, the substrate pressing body 5 and the substrate are spaced at twice or more normal intervals. Since the holding / feeding piece 6 is separated, the substrate 2 can be easily and quickly detached from the plating substrate holder 1.

  Next, supply of the plating current will be described. The current supplied to the carrier bar 3 flows from the carrier bar 3 through the hook 8 to the electrode 12 inside the substrate pressing body 5. Power is fed to the back surface of the sandwiched substrate 2 from the power feeding portion 15 formed on the substrate clamping surface 13 of the substrate pressing body 5, and power is supplied to the surface of the substrate 2 supported by the power feeding portion 16 of the substrate pressing and power feeding top 6. . As a result, a current is supplied to the substrate 2 and the substrate 2 is plated.

DESCRIPTION OF SYMBOLS 1 ... Substrate holder for plating 2 ... Substrate 3 ... Carrier bar 4 ... Outer frame 5 ... Substrate pressing body 6 ... Substrate Feeding piece for pressing and holding 7 ... Tightening screw 8 ... Hook 9 ... Jig guide 10 ... Clamping device 11 ... Fixed rail 12 ... Electrode 13 14. Board holding surface 15, 16 Feeding part 17 ... Wing nut 18 ... Forward screw part 19 ... Reverse screw part 20 ... Contact 21 ... Central convex part 22 ... ... Conductive circuits

Claims (3)

An electrode for sending the current taken from the carrier bar through the hook portion to the power feeding portion on the back surface formed on the substrate holding surface is embedded in the internal longitudinal direction, and the electrode and the back surface power feeding portion are excluded from the non-conductive material. A vertical saddle-shaped substrate holding body,
A conductive circuit for sending a current to a surface-side power feeding portion formed on the substrate clamping surface is embedded, and a substrate pressing and power-feeding piece made of a non-conductive material except for the surface-side power feeding portion and the conductive circuit ,
A fastening screw having an electrically conductive mounting the substrate presser combined feed frame on the substrate holding body, a positive screw portion is formed on threaded portion of said substrate holding body, threaded between the substrate presser combined feed frame A reverse screw portion is formed at the joint, and a clamping screw connected to the electrode and the conductive circuit ;
A plating substrate holder comprising: a plating substrate holder, wherein a power is supplied to the substrate from the front-side and back-side power feeding portions with respect to the held substrate.   The above-mentioned plating substrate holder is obtained by attaching a plurality of substrate pressing / feeding pieces to the above-mentioned independent substrate holding body with the above-mentioned tightening screw, and using the plurality of plating substrate holders. The plating substrate holder according to claim 1, wherein the substrate holder for plating is held. The plating substrate holder according to claim 1, wherein the front-side power feeding portion is formed at a position symmetrical to the back-side power feeding portion.

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