JP5635466B2 - Wiring board manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a wiring board.

  When manufacturing a wiring board, the process of printing on the surface of the wiring board in the middle of manufacture is widely performed. For example, in order to surface-mount electronic components on a land pattern formed on a wiring board, a method of printing a conductive paste such as cream solder in a predetermined pattern on a wiring board by a printing device such as a screen printing device is known. It has been. As described above, when printing is performed on the surface of a wiring board in the middle of manufacture, even if an attempt is made to improve the alignment accuracy with the wiring board in a printing machine used in the printing process, As a result, the printing accuracy may be insufficient as a result. Conventionally, in order to suppress a decrease in printing accuracy due to such warping of the wiring board, there is a configuration in which the warping is corrected by pressing the wiring board prior to the step of placing the printing mask plate on the wiring board. It has been proposed (see, for example, Patent Document 1).

JP 2011-20392 A

  However, in the case where the warping of the wiring board is corrected by pressing the wiring board prior to the printing process as described above, there may be cases where the suppression of the warping of the wiring board is not always sufficient during printing. Therefore, there has been a demand for a configuration that more sufficiently suppresses the warping of the wiring board in the printing process. Moreover, in order to improve the manufacturing efficiency of a wiring board, it has been desired to handle a plurality of wiring boards at the same time for use in a printing process. Conventionally, sufficient studies have not been made on a method of handling a plurality of wiring boards at the same time and providing them to the printing process while sufficiently suppressing warpage.

  The present invention has been made to solve the above-described conventional problems, and improves the efficiency of the printing process while suppressing the warpage of the wiring board when printing on the surface of the wiring board during manufacture. Objective.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
A method for manufacturing a wiring board, comprising:
(A) preparing a plurality of wiring board forming plates which are the wiring boards being manufactured, and preparing a frame portion capable of holding the plurality of wiring board forming plates in a plane;
(B) arranging a plurality of the wiring board forming plates at predetermined positions in the frame body;
(C) A step of attaching to the frame body a conveying jig having a pressing portion for pressing each of the wiring board forming plates arranged in the frame body section, and each wiring board at the pressing section. While pressing the forming plate, attaching the transport jig to the frame body part,
(D) The process of conveying the said conveyance jig attached to the said frame part on the printing table for printing on the said wiring board formation board,
(E) A step of causing each of the wiring board forming plates pressed by the pressing portion to be adsorbed on the printing table by generating a negative pressure between the printing table and each of the wiring board forming plates. When,
(F) removing the transport jig from the frame body;
(G) A step of performing printing on each of the wiring board forming plates adsorbed on the printing table in a state of being attached to the frame body part.

  According to the method for manufacturing a wiring board described in Application Example 1, a plurality of wiring board forming plates are arranged in a plane on the frame body, and are transported in a lump and sucked onto a printing table. The efficiency of the process for using the substrate forming plate for printing can be improved. Furthermore, since each wiring board formation board is pressed using the pressing part of a conveyance jig, it can convey to a printing table in the state which suppressed the curvature of each wiring board formation board, and each wiring board formation board Can be adsorbed on the printing table. As a result, even in the printing process after removing the conveying jig, it is possible to maintain the state in which the warpage of the wiring board forming plate is suppressed, and thus it is possible to ensure printing accuracy.

[Application Example 2]
In the method for manufacturing a wiring board according to Application Example 1, in the step (c), each of the wiring board forming plates is aligned with the frame body part, and the transfer jig is moved to the frame body part. The step (d) includes aligning the frame body portion to which the transport jig is mounted and the printing table, and positioning the transport jig attached to the frame body portion. A method for manufacturing a wiring board, including a step of arranging on a printing table. According to the method for manufacturing a wiring board described in Application Example 2, each wiring board forming plate is aligned with the printing table by a simple operation of performing alignment between members that perform attachment and placement operations each time. Printing accuracy can be ensured.

[Application Example 3]
In the method for manufacturing a wiring board according to Application Example 1 or 2, in the step (g), in the step (g), the surface of each wiring board forming plate protrudes from the surface of the frame body part. The manufacturing method of a wiring board provided with the base part which protrudes from the other area | region of the said printing table in the location where each said wiring board formation board is arrange | positioned. According to the method for manufacturing a wiring board described in Application Example 3, on the printing table, since the surface of each wiring board forming plate protrudes from the surface of the frame body part, when using a printing mask in the printing process, The printing mask can be arranged on the wiring board forming plate without any trouble. And when arrange | positioning a wiring board formation board on each base part, since the curvature of the wiring board formation board was suppressed by the press part, the operation | movement which adsorb | sucks a wiring board formation board on a printing table is performed without trouble. be able to. Further, since the wiring board forming plate can be adsorbed on the printing table in a state in which the warping of the wiring board forming board is suppressed, even when the surface of the wiring board forming board is protruded from the surface of the frame body portion Further, it is possible to suppress the wiring board forming plate from riding on the frame body portion, and it is possible to suppress the displacement of the wiring board forming board due to the riding.

[Application Example 4]
The method of manufacturing a wiring board according to any one of Application Examples 1 to 3, wherein the step (c) includes generating a negative pressure between the conveyance jig and the frame body portion, thereby Is attached to the frame body portion, and the step (f) releases the negative pressure and removes the conveyance jig from the frame body portion. A method of manufacturing a wiring board including a step of removing. According to the method for manufacturing a wiring board described in Application Example 4, the operation of attaching the conveyance jig to the frame body portion and the operation of removing the conveyance jig from the frame body portion are performed by a simple operation within a relatively short time. Is possible.

[Application Example 5]
5. The method for manufacturing a wiring board according to any one of application examples 1 to 4, wherein the step (b) is a step of placing a plurality of the wiring board forming plates on the frame body, ) Step is an elastic body provided on a surface of the transport jig facing the frame body portion by superimposing the transport jig on the surface of the frame body portion on which the wiring board forming plate is placed. A method of manufacturing a wiring board, comprising the step of leveling each of the wiring board forming plates by pressing the pressing portion provided to each of the wiring board forming plates. According to the method for manufacturing a wiring board described in Application Example 5, the operation of pressing the wiring board forming plate by the pressing portion can be performed by performing the operation of superimposing the conveying jig on the frame body portion. In addition, since the pressing portion includes an elastic body, it is possible to suppress the damage to the wiring board forming plate due to the pressing operation and enhance the effect of leveling the wiring board forming plate.

[Application Example 6]
6. The method of manufacturing a wiring board according to any one of Application Examples 1 to 5, wherein each of the wiring board forming plates is formed in a substantially rectangular shape, and the pressing portions are provided at four corners of each of the wiring board forming plates. The manufacturing method of the wiring board provided in the location which presses. According to the method for manufacturing a wiring board described in Application Example 6, it is possible to efficiently and reliably suppress warping of the wiring board forming plate. Further, since the pressed portions are the four corners of the wiring board forming plate, it is possible to suppress the freedom of design of the wiring pattern from being limited due to the pressing by the pressing portion in the wiring board forming plate.

  The present invention can be realized in various forms other than the above, for example, a wiring board manufactured by a manufacturing method of a wiring board, a transport jig for transporting a wiring board in the middle of manufacturing, or a wiring board It can be realized in the form of a printing apparatus.

It is explanatory drawing which shows the manufacturing process of a wiring board. It is explanatory drawing which shows a conveyance and printing process. 3 is an explanatory diagram illustrating a schematic configuration of a frame body portion 10. FIG. 4 is a cross-sectional view showing a state where a wiring board forming plate 30 is placed on a stepped portion 13. FIG. 3 is a plan view illustrating a schematic configuration of a conveying jig 20. FIG. It is explanatory drawing showing the structure of the spring type suction pad 23 and the frame part suction pad 22. FIG. FIG. 4 is a perspective view illustrating a state in which a conveyance jig 20 is attached to the frame body part 10. FIG. 3 is a plan view schematically showing a state where a conveying jig 20 is superimposed on a frame body part 10. It is explanatory drawing showing a mode that the wiring board formation board 30 is aligned. FIG. 3 is a schematic cross-sectional view showing a state in which a wiring board forming plate 30 is aligned. FIG. 3 is a schematic cross-sectional view illustrating a state where a conveyance jig 20 is attached to the frame body part 10. 3 is a perspective view illustrating a schematic configuration of a printing table 40. FIG. 4 is a schematic cross-sectional view showing a state in which a wiring board forming plate 30 is adsorbed on a pedestal portion 42. FIG. It is a cross-sectional schematic diagram showing a mode that the conveyance jig | tool 20 was removed.

  FIG. 1 is an explanatory view showing a manufacturing process of a wiring board as an embodiment according to the present invention. The wiring board is a component for surface mounting electronic components such as semiconductor chips, and in this embodiment, the component in the form immediately before being used for surface mounting of the electronic component is called a wiring substrate, It is called a wiring board forming board.

  In this embodiment, when manufacturing a wiring board, first, a connection wiring board is produced (step S100). Here, the connection wiring board refers to a structure in which a plurality of laminated bodies (wiring board forming plates) serving as wiring boards are connected vertically and horizontally. The wiring board is a build-up board formed by alternately laminating a plurality of conductor layers having a predetermined pattern and insulator layers (dielectric layers). In the present embodiment, such an operation of sequentially forming the conductor layer and the insulator layer is collectively performed for a plurality of wiring boards connected vertically and horizontally. In the present embodiment, a so-called coreless multilayer substrate that does not have a core layer (plate core) is particularly produced as a wiring substrate. As a method of forming each conductor layer constituting the wiring board, a full additive method or a subtractive method can be used in addition to the semi-additive method.

  In step S100, when a connection wiring board in which a predetermined number of conductor layers and insulating layers to be provided in each wiring board are alternately formed in a predetermined pattern is produced, the connection wiring board is then divided at predetermined positions. As a result, a plurality of wiring board forming plates that are the basis of the individual wiring boards are obtained (step S110).

  In step S110, a plurality of wiring board forming plates are obtained by division, and after performing a cleaning process and the like, each wiring board forming board is transported to a printing apparatus and used for a printing process (step S120). In the printing process of step S120, in order to surface-mount the electronic component on the land pattern formed on the wiring board, a conductive paste such as cream solder, which is a conductive paste, is applied on the wiring board using a screen printing apparatus. Apply on electrode pad. Note that the printing process in step S120 may be performed by a method other than screen printing. By completing the printing process in step S120, a wiring board for mounting electronic components is completed. In this embodiment, since there is a feature in the process of suppressing warpage of the wiring board forming plate in the transport / printing process of step S120, a detailed configuration of the transport / printing process will be described below.

  FIG. 2 is an explanatory diagram showing the transport / printing process of step S120. In the transport / printing process, first, a plurality of wiring board forming plates 30 to be used in the transport / printing process are prepared (step S200). The plurality of wiring board forming plates 30 prepared in step S200 are obtained by dividing the connection wiring board in step S110.

  Thereafter, the prepared plurality of wiring board forming plates 30 are fitted into the frame body portion 10 (step S210). The frame body part 10 is a member for handling a plurality of wiring board forming plates 30 in a lump and supplying them to the transporting and printing processes.

  FIG. 3 is an explanatory diagram illustrating a schematic configuration of the frame body portion 10. FIG. 3A is a plan view of the frame body portion 10. The frame body portion 10 is a thin plate member whose outer periphery is substantially rectangular. A plurality of fitting holes 12 that are slightly larger than the wiring board forming board 30 are formed in the frame body portion 10 so that the substantially rectangular wiring board forming boards 30 can be fitted one by one. In the present embodiment, the frame body portion 10 is provided with 24 fitting holes 12. In each fitting hole 12, a step portion 13 is formed at a position corresponding to the four corners of the wiring board forming plate 30 so as to be one step lower than the surface of the frame body portion 10. Therefore, the operation of fitting the wiring board forming plate 30 in step S210 is performed as an operation of placing the wiring board forming plate 30 on the step portion 13.

  FIG. 3B is an enlarged plan view showing a state where the wiring board forming plate 30 is placed on the stepped portion 13 with respect to one fitting hole 12, and FIG. 4 is a wiring board on the stepped portion 13. It is sectional drawing which shows a mode that the formation board 30 was mounted. In FIG. 3B, a portion of the step portion 13 that is covered with the wiring board forming plate 30 is indicated by a broken line. FIG. 4 shows an AA cross section in FIG. As described above, the wiring board of this embodiment is a coreless multilayer board, and is formed thinner than a wiring board having a core layer. Moreover, in each fitting hole 12, the depth of the level | step difference in the level | step-difference part 13 is fully ensured so that the operation | movement of the fitting of the wiring board formation board 30 may become easy. Therefore, when the wiring board forming plate 30 is placed on the stepped portion 13, the surface of the wiring board forming plate 30 is lower than the surface of the frame body portion 10 as shown in FIG. 4.

  In this manner, the plurality of wiring board forming plates 30 are planarly held by the frame body portion 10 by fitting the wiring board forming plates 30 into the respective fitting holes 12. Further, the frame body portion 10 is provided with positioning holes 14 in the vicinity of two opposing corners of the four corners (see FIG. 3A). The positioning hole 14 is a structure related to the positioning of the wiring board forming board 30 in the subsequent printing process, and will be described in detail later. Note that the frame body portion 10 has strength and rigidity capable of maintaining a sufficiently flat state without causing a dimensional change in a state where the wiring board forming plate 30 is placed in the conveyance / printing process. Good. In the present embodiment, the frame body portion 10 is formed of stainless steel.

  After step S210, the conveying jig 20 is attached to the frame body portion 10 on which the wiring board forming plate 30 is placed (step S220). The conveyance jig 20 is an apparatus for conveying the frame body portion 10 on which the wiring board forming plate 30 is placed onto a printing table provided in the printing apparatus. FIG. 5 is a plan view illustrating a schematic configuration of the conveying jig 20. The conveying jig 20 includes a plate-like portion 21 that is a substantially rectangular plate-like member. On one surface side of the plate-like portion 21 (the surface side shown in FIG. 5), a handle portion 26 is provided in the vicinity of each of the two opposing sides. In the present embodiment, the operation of transporting the wiring board forming plate 30 placed on the frame body portion 10 onto the printing table of the printing apparatus is manually performed by an operator. At that time, when the operator grips the handle portion 26, the frame body portion 10 integrated with the conveyance jig 20 is conveyed. In addition, the operation | movement which conveys the conveyance jig | tool 20 integrated with the frame part 10 to the printing table 40, and the operation | movement mentioned later which arrange | positions the conveyed conveyance jig | tool 20 on the printing table 40 are performed manually by an operator. Instead, it may be performed automatically using a machine.

  A plurality of spring-type suction pads 23 and a plurality of frame body suction pads 22 are attached to the plate-like portion 21 of the conveying jig 20. The spring-type suction pad 23 has a structure for pressing the wiring board forming plate 30 and suppressing warping of the wiring board forming plate. The frame body suction pad 22 has a structure for sucking the frame body portion 10 to the transport jig 20. The spring-type suction pad 23 corresponds to a “pressing portion” described in each claim.

  FIG. 6 is an explanatory diagram for explaining the configuration of the spring-type suction pad 23 and the frame body suction pad 22, and schematically shows a part of the side surface of the conveying jig 20. As shown in FIG. 6, the plate-like portion 21 is a hollow member. The frame body adsorption pad 22 is formed in a cup shape by an elastic body such as rubber or resin, and includes a pad portion 22p arranged with the opening side of the cup facing downward in the vertical direction. Further, the frame body suction pad 22 includes a shaft portion 22r having one end attached to the bottom of the cup-shaped pad portion 22p and the other end attached to the plate-like portion 21. One end of the shaft portion 22r is opened through the bottom of the pad portion 22p, and the other end of the shaft portion 22r is opened in a space in the plate-like portion 21. In this way, the space inside the pad portion 22p communicates with the inside of the plate-like portion 21. As shown in FIG. 5, in the present embodiment, the transport jig 20 includes 12 frame body suction pads 22. In the plate-like portion 21, a region where each frame body suction pad 22 is attached is partitioned from a region where the spring-type suction pad 23 is attached to form a suction space 25. As shown in FIG. 5, a suction pipe 24 communicating with the suction space 25 is attached to the transport jig 20. A vacuum pump (not shown) is attached to the suction pipe 24. Therefore, a suction force can be generated in the pad portion 22p by generating a negative pressure by a vacuum pump in the suction space 25. In the transport jig 20 of the present embodiment, a switching valve (not shown) that opens and closes the communication state between the space where the negative pressure is generated by the vacuum pump and the suction space 25 is provided in the suction pipe 24, and the switching described above. A conveyance jig switch (not shown) for opening and closing the valve is provided. By turning on the conveying jig switch, the space where the negative pressure is generated by the vacuum pump and the suction space 25 are communicated with each other, and a suction force is generated in the pad portion 22p. Further, by turning off the conveying jig switch, the space where the negative pressure is generated by the vacuum pump and the suction space 25 are brought into a non-communication state, and the suction space 25 is opened to the atmosphere. The generated suction force is released.

  Returning to FIG. 6, the spring-type suction pad 23 includes a shaft portion 23 r provided through the plate-like portion 21 so as to be slidable in the thickness direction of the plate-like portion 21. In FIG. 6, the direction in which the shaft portion 23r slides (moves) is indicated by an arrow. Further, the spring-type suction pad 23 is one end of the shaft portion 23r and is provided at the end on the same side as the pad portion 22p of the frame body portion suction pad 22, and is a pad formed of an elastic body such as rubber or resin. A portion 23p is provided. Further, a coil spring 23s is provided between the pad portion 23p and the plate-like portion 21 along the outer periphery of the shaft portion 23r. As will be described later, the coil spring 23s is a member for generating a pressing force for suppressing warpage of the wiring board forming plate 30. A bolt 23b is attached to the other end of the shaft portion 23r. FIG. 6 shows a state where the bolt 23b is engaged with the surface of the plate-like portion 21 and the spring-type suction pad 23 is moved most downward in the vertical direction. Thus, in the state in which the bolt 23b is engaged with the surface of the plate-like portion 21, the pad portion 23p is more distant from the plate-like portion 21 than the pad portion 22p. As shown in FIG. 5, the transport jig 20 of this embodiment includes 96 spring-type suction pads 23.

  FIG. 7 is a perspective view illustrating a state in which the conveyance jig 20 is attached to the frame body portion 10 in step S220. When the conveying jig 20 is attached to the frame body portion 10, the surface on the side where the pad portion 22 p of the frame body suction pad 22 and the pad portion 23 p of the spring-type suction pad 23 are provided faces the frame body portion 10. The conveying jig 20 is overlaid on the frame body portion 10 in such a direction. In FIG. 7, the suction pipe 24 attached to the conveying jig 20 is not shown.

  FIG. 8 is a plan view schematically showing a state in which the conveying jig 20 is superimposed on the frame body portion 10. In FIG. 8, the structure relating to the frame body portion 10 disposed under the conveying jig 20 is indicated by a broken line. As shown in FIG. 8, the spring-type suction pads 23 included in the transport jig 20 are provided at positions corresponding to the four corners of each wiring board forming plate 30 placed on the frame body portion 10. When the transport jig 20 is attached to the frame body portion 10, the positioning of each of the wiring board forming plates 30 fitted to the respective fitting holes 12 of the frame body portion 10 using the spring-type suction pads 23. To do. That is, in each fitting hole 12, each wiring board forming plate 30 is aligned with a corner corresponding to a corner B that is one corner of the frame body 10.

  FIG. 9 is an explanatory diagram showing a state in which the wiring board forming plate 30 is aligned in the fitting hole 12. FIG. 9A shows an example of a state in which the wiring board forming plate 30 is randomly fitted in the fitting holes 12 in step S210. A gap is formed around the four sides of the wiring board forming plate 30 with the inner wall of the fitting hole 12. Thereafter, by aligning with the corner corresponding to the corner B of the frame body portion 10 shown in FIG. 8, the wiring board forming board 30 in the fitting hole 12 has two sides as shown in FIG. 9B. Is brought into contact with the inner wall of the fitting hole 12.

  FIG. 10 is a schematic cross-sectional view illustrating a state where the wiring board forming plate 30 is aligned. When the conveyance jig 20 is superimposed on the frame body portion 10 with the handle portion 26 held, the tips of the pad portions 23 p of the spring-type suction pad 23 come into contact with the vicinity of the four corners of the wiring board forming plate 30. FIG. 10 shows a state in which the tip of the pad portion 23 p is in contact with the wiring board forming plate 30. In this state, when the conveying jig 20 is further pressed downward in the vertical direction to bring the plate-like portion 21 closer to the frame body portion 10, the shaft portion 23r of the spring-type suction pad 23 slides upward in the vertical direction, and the pad portion The distance between 23p and the plate-like portion 21 is reduced. Thereby, the force which presses the wiring board formation board 30 to the perpendicular direction downward | vertical by the coil spring 23s generate | occur | produces. In this way, the pad portion 23p is brought into contact with the wiring board forming plate 30 and the transfer jig 20 is moved in the X and Y directions shown in FIG. Apply horizontal force. The operation of applying forces in the X direction and the Y direction to the conveying jig 20 may be performed a plurality of times as necessary. Thereby, each wiring board formation board 30 mounted on the frame part 10 can be positioned as shown in FIG.9 (B).

  FIG. 11 is a schematic cross-sectional view illustrating a state where the conveying jig 20 is attached to the frame body portion 10 in step S220. As described above, after positioning the wiring board forming board 30 in the fitting hole 12 while pressing the pad portions 23p against the four corners of the wiring board forming board 30, the conveying jig 20 is further pressed downward in the vertical direction. Then, the tip of the pad portion 22 p of the frame body suction pad 22 comes into contact with the surface of the frame body portion 10. At this time, the transfer jig switch described above provided in the transfer jig 20 is turned on, and the negative pressure by the vacuum pump is generated in the suction space 25, thereby adsorbing the frame body portion 10 to the pad portion 22p. Can do. That is, the attachment of the conveyance jig 20 to the frame body portion 10 in step S <b> 220 is performed by adsorbing the frame body portion 10 to the conveyance jig 20. In FIG. 11, a state in which a force for adsorbing the frame body portion 10 is generated in the pad portion 22p is represented by an arrow superimposed on the frame body adsorption pad 22. By turning on the transfer jig switch described above, it is possible to instantaneously perform the operation of adsorbing the frame body portion 10 by generating a negative pressure in the suction space 25, and thus each wiring board forming plate 30. Are held in the respective fitting holes 12. In addition, if the conveyance jig switch for generating the negative pressure in the suction space 25 is, for example, a pedal type switch, even if there is only one operator, the pair of handle portions 26 are held with both hands. The operation of adsorbing the frame body portion 10 can be easily performed.

  As described above, the pad portion 23 p of the spring-type suction pad 23 is in contact with the vicinity of the four corners of each wiring board forming plate 30. In the spring-type suction pad 23, the coil spring 23s generates a downward pressing force in the vertical direction with respect to each wiring board forming plate 30. Therefore, in the frame body part 10 to which the conveying jig 20 is attached, the wiring board forming plates 30 are leveled with the warpage being suppressed by pressing the four corners against the pad part 23p. In FIG. 11, the state in which the wiring board forming plate 30 is pressed against the pad portion 23 p is represented by an arrow shown superimposed on the spring-type suction pad 23. The wiring board forming plate 30 to which a pressing force is applied from the spring-type suction pad 23 is supported from the back side by the step portion 13 of the frame body portion 10.

  When the transport jig 20 is attached to the frame body portion 10, the transport jig 20 is then transported to the printing apparatus, and the transport jig 20 is installed on the printing table 40 of the printing apparatus (step S230). In the present embodiment, such transport and installation operations are also performed manually by the operator holding the handle portion 26.

  FIG. 12 is a perspective view illustrating a schematic configuration of the printing table 40. The printing table 40 includes a flat plane portion 41, and a plurality of pedestal portions 42 that protrude from the plane portion 41 at a certain height are provided. Each pedestal portion 42 is formed in a substantially rectangular shape having substantially the same size as the wiring board forming plate 30 in plan view. And each base part 42 is the same as the place where each wiring board formation board 30 is arrange | positioned, when the frame part 10 which mounted the wiring board formation board 30 is arrange | positioned in the predetermined position on the printing table 40. In position. That is, when the conveying jig 20 is installed on the printing table 40, each wiring board forming plate 30 is placed on the corresponding pedestal portion 42 so as to overlap.

  These pedestal portions 42 have a structure for adsorbing the wiring board forming board 30 without a gap while maintaining the horizontal state of the wiring board forming board 30 in a printing process in the printing apparatus. Therefore, in the pedestal portion 42, a negative pressure is generated between the wiring substrate forming plate 30 disposed on the pedestal portion 42 and the pedestal portion 42 at a substantially central portion of the surface on which the wiring substrate forming plate 30 is placed. A suction port 44 is provided for this purpose. Each suction port 44 provided in each pedestal portion 42 is connected to a vacuum pump (not shown). Therefore, it is possible to attract the wiring board forming plate 30 onto the printing table 40 by generating a suction force by a vacuum pump at the suction port 44. In the pedestal portion 42, the surface on the side where the wiring board forming plate 30 is placed is a flat surface having no irregularities other than the suction port 44 so that the wiring board forming board 30 can be sucked without gaps. .

  Further, the printing table 40 is provided with a pair of positioning pins 46 that protrude from the flat surface portion 41. The positioning pin 46 has a structure for positioning the frame body portion 10 with respect to the printing table 40. When the conveyance jig 20 with the frame body portion 10 attached is installed on the printing table 40, the conveyance jig 20 is installed so that the positioning pins 46 penetrate the positioning holes 14 provided in the frame body portion 10. . Thereby, the frame body part 10 can be arranged on the print table 40 while positioning the frame body part 10 with respect to the print table 40. Here, each wiring board forming plate 30 is positioned with respect to the frame body portion 10 in each fitting hole 12 as described above. Therefore, each wiring board forming board 30 can be positioned with respect to the printing table 40 by positioning the frame body portion 10 with respect to the printing table 40 as described above. Thereby, each wiring board formation board 30 can be arrange | positioned on each base part 42 with sufficient precision. The number of positioning pins 46 provided in the printing table 40 and the positioning holes 14 provided in the frame body portion 10 may be a plurality other than two.

  Once the transport jig 20 is transported and placed on the print table 40, each wiring board forming plate 30 is then sucked onto the print table (step S240). Specifically, the print table switch for generating the suction force described above from the suction port 44 is turned on, and each wiring board forming plate 30 is sucked onto the pedestal portion 42. As described above, each wiring board forming plate 30 is restrained from being warped by being pressed by the spring-type suction pad 23, so that when the wiring board forming plate 30 is arranged on the pedestal part 42, it is placed on the pedestal part 42. It is almost in close contact. Therefore, by generating a suction force at the suction port 44, the wiring board forming plate 30 can be attracted to the pedestal portion 42 while maintaining the entire level of the wiring board forming board 30.

  FIG. 13 is a schematic cross-sectional view showing a state when the transport jig 20 is arranged on the printing table 40 and each wiring board forming plate 30 is sucked onto the pedestal portion 42. As described above, since each wiring board forming plate 30 is aligned with the printing table 40, the wiring board forming board 30 is arranged on the pedestal portion 42 with high accuracy. Since a suction force is generated through the suction port 44, the wiring board forming board 30 is adsorbed to the pedestal portion 42. In addition, at the pad portion 22p of the frame body suction pad 22, the suction force with respect to the frame body portion 10 is maintained. Therefore, the frame body portion 10 that is attracted to the pad portion 22 p is separated from the flat surface portion 41 of the printing table 40.

  Thereafter, the conveyance jig 20 is removed from the frame body portion 10 (step S250). Specifically, the conveyance jig 20 is removed by turning off the conveyance jig switch described above to open the suction space 25 to the atmosphere, and the adsorption force at the pad portion 22p of the frame body adsorption pad 22 is increased. After that, it is performed by removing the conveying jig 20.

  FIG. 14 is a schematic cross-sectional view illustrating a state where the transport jig 20 is removed in step S250. When the suction force in the pad portion 22p is released, the frame body portion 10 drops from the state of FIG. 13 and is placed on the flat surface portion 41 of the printing table 40. When the frame body part 10 is dropped, the surface of each wiring board forming plate 30 disposed on the pedestal part 42 is in a state of protruding from the surface of the frame body part 10. At this stage, the suction force through the suction port 44 is maintained.

  After removing the conveying jig 20, a printing process is performed (step S260). In the printing process, as described above, cream solder is applied using a screen printing apparatus. At that time, a metal mask (a metal thin plate having holes corresponding to electrode pads on the wiring board forming board 30) is placed on the wiring board forming board, and cream solder is applied using a squeegee. In the present embodiment, as described above, when the transport jig 20 is removed in step S250, the surface of the wiring board forming plate 30 protrudes from the surface of the frame body portion 10, and thus from above the printing table 40. Even if the frame 10 is not removed, a printing mask (the metal mask described above) can be disposed on the wiring board forming plate 30 without any trouble. Here, since each wiring board forming plate 30 is aligned with respect to the printing table 40, the printing mask and each wiring board forming plate 30 are aligned by aligning the printing mask and the printing table 40. Can be accurately aligned. At this time, since each wiring board forming plate 30 adsorbed on the pedestal portion 42 is sufficiently leveled, printing can be performed with high accuracy.

  By performing the printing process, a wiring board for use in surface mounting of electronic components is completed. The printed circuit board may be recovered from the print table 40 together with the frame body portion 10 by releasing the suction force generated at the suction port 44 by turning off the print table switch.

  As described above, when the transport jig 20 is attached to the frame body portion 10 and transported, various forces act on the frame body portion 10 and the transport jig 20. For example, the suction force generated in the frame body suction pad 22 is a vertical upward force, and the pressing force generated in the spring-type suction pad 23 is a vertical downward force. In the transport jig 20, in consideration of various forces applied during transport in the frame body 10 and the transport jig 20, selection of the coil spring 23 s and the suction surface of the pad section 22 p of the frame body suction pad 22 are selected. It is necessary to set the area and the number of the frame body suction pads 22 to be provided. Below, the force applied in the case of conveyance in the frame part 10 and the conveyance jig 20 is demonstrated.

The force F ₁ (N) applied downward in the vertical direction in the frame body portion 10 during conveyance can be expressed by the following equation (1).
F ₁ = Tm × (α + 9.8) + F ₁ ′ (1)
Here, Tm is the total mass (kg) of the frame body portion 10 and all the wiring board forming plates 30 placed on the frame body portion 10, and α is the vertical direction of the conveyance jig 20 during conveyance. The acceleration (m / s ² ) and F ₁ ′ when lifting upward are the force (N) applied from all the spring-type suction pads 23.

The force F ₁ ′ applied from all the spring-type suction pads 23 can be expressed by the following equation (2).
F ₁ ′ = k × δ × N ₁ (2)
Here, k is a spring constant (N / mm) of the coil spring 23s, δ is a displacement amount (mm) of the coil spring 23s when the frame body portion 10 is attracted to the conveying jig 20, and N ₁ is all The number of coil springs 23s (96 in this embodiment).

Further, F ₂ (N) can be expressed by the following equation (3) as the force applied vertically upward in the frame body portion 10 during conveyance.
F ₂ = P × S × N ₂ (3)
Here, P is the vacuum pressure (Pa) at the frame body suction pad 22, S is the area (m ² ) related to suction at the pad portion 22p, and N ₂ is the number of all the pad portions 22p (this embodiment). Then, 12).

In step S230, the following equation (4) needs to be satisfied in order to carry out the conveyance with the frame body portion 10 adsorbed to the conveyance jig 20.
F ₁ <F ₂ (4)
Here, when the masses of the frame 10 and the wiring board forming plate 30 are determined, the value Tm of the expression (1) is determined. In addition, the upper limit of the value α in the expression (1), which is the acceleration when lifting the conveying jig 20 upward in the vertical direction, can be set with sufficient accuracy. Further, if the coil spring 23s to be used is selected, the spring constant k in the equation (2) can be determined. Furthermore, if the size of each member is set, the displacement amount δ of the coil spring 23s when the frame body portion 10 and the conveying jig 20 are integrated as shown in the equation (2) can be determined. If the spring-type suction pads 23 are provided corresponding to the four corners of each wiring board forming plate 30, the value of the formula (2) can be obtained by determining the number of wiring board forming boards 30 placed on the frame body portion 10. N _{2 is} also determined. Furthermore, if the vacuum pump to be used is determined, the vacuum pressure P of the formula (3) is also determined. Therefore, as a value for causing hold the equation (4), the area of the pad portion 22p in (3) S, and the number N ₂ of the pad portions 22p, may be determined as appropriate. In that case, the reliability of the adsorption operation may be ensured by further considering the safety factor.

  According to the manufacturing method of the wiring board of the present embodiment configured as described above, the transport jig 20 is attached to the frame body portion 10 on which the plurality of wiring board forming plates 30 are placed, and the transport to the printing table 40 is performed. Since the placement is performed, the efficiency of the printing process can be improved while suppressing the warpage of the wiring board forming plate 30. That is, since the plurality of wiring board forming plates 30 are arranged in a plane on the frame body portion 10 and are collectively used for the transporting and printing processes, the efficiency of these processes can be improved. Furthermore, since each wiring board formation board 30 is pressed using the spring type suction pad 23 of the conveyance jig 20, conveyance to the printing table 40 and the printing table are performed in a state where warpage of each wiring board formation board 30 is suppressed. 40 can be mounted. Then, in a state in which the warpage of each wiring board forming plate 30 is suppressed as described above, each wiring board forming plate 30 can be sucked onto the printing table 40. As a result, even in the printing process after removing the conveying jig 20, it is possible to maintain a state in which the warpage of the wiring board forming plate 30 is suppressed, and thus it is possible to ensure printing accuracy.

  Here, when the wiring board forming plate 30 is warped when adsorbing the wiring board forming board 30 onto each pedestal portion 42 of the printing table 40, the surface of the pedestal portion 42 and the wiring board forming plate 30. , Even if suction is performed from the suction port 44, it may be difficult to sufficiently adsorb the wiring board forming plate 30 so as to be in close contact with the surface of the pedestal portion 42. . If the wiring board forming board 30 cannot be sufficiently adsorbed, the wiring board forming board 30 may be displaced with respect to the printing table 40, and as a result, the accuracy of printing performed on the printing table 40 is lowered. there is a possibility. For example, when a coreless multilayer board is manufactured as in the present embodiment, the wiring board forming plate 30 is thin, so that the holding force by the inner wall surface of the fitting hole 12 with respect to the wiring board forming board 30 is insufficient, and the frame body portion In some cases, a part of the wiring board forming board 30 rides on the board 10. In particular, as in this embodiment, when the pedestal portion 42 is provided to ensure contact with the printing mask and the surface of the wiring board forming plate 30 is lifted from the surface of the frame body portion 10, the fitting holes 12 are provided. The thickness of the hooking portion of the inner wall that contacts the wiring board forming plate 30 is reduced, and the wiring board forming plate 30 can easily ride on the frame body portion 10. When the wiring board forming plate 30 rides on the frame body portion 10 as described above, the positional deviation can be a problem. Further, the fact that the wiring board forming plate 30 is warped itself may cause a shift during printing, and the printing accuracy may be lowered. On the other hand, in the present embodiment, the wiring board forming plate 30 is attracted to the pedestal portion 42 in a state in which the warping of the wiring board forming plate 30 is suppressed in advance and is closely adhered to the pedestal portion 42. It is possible to suppress the above-described decrease in printing accuracy due to 30 warpage.

  Moreover, in this embodiment, since the operation | movement which suppresses the curvature of each wiring board formation board 30 using the spring type suction pad 23 which is a press part is performed by pressing the four corners of the wiring board formation board 30, a wiring board is performed. It becomes possible to efficiently and reliably suppress the warp of the forming plate 30. Furthermore, since the pressed portions are the four corners of the wiring board forming board 30, the degree of freedom in designing the wiring pattern is limited in the wiring board forming board 30 due to the pressing by the spring-type suction pads 23. Can be suppressed. Moreover, in this embodiment, since the pad part 23p of the spring type suction pad 23 which is a pressing part is formed with elastic bodies, such as rubber | gum and resin, suppressing damage to the wiring board formation board 30 by the pad part 23p. The effect of leveling the wiring board forming plate 30 can be enhanced.

  Further, in the present embodiment, the alignment of each wiring board forming plate 30 with respect to the frame body portion 10 is performed as the alignment of the wiring board forming plate 30 with respect to a specific corner portion of the fitting hole 12. Further, the positioning of the frame 10 with respect to the printing table 40 is performed by the operation of fitting the positioning holes 14 into the pair of positioning pins 46. Therefore, each wiring board forming board 30 can be aligned with respect to the printing table 40 by a simple operation of aligning each time between the members that perform the mounting and arranging operations, and the printing accuracy is ensured. can do.

  The method for manufacturing a wiring board according to the present embodiment can be particularly preferably applied when manufacturing a coreless multilayer board that is formed thinner than when the core board is provided. This is because, for example, the warping of the wiring board is likely to occur due to the division process in step S110, and in particular, the coreless multilayer board is likely to warp. However, this embodiment may be applied when manufacturing a substrate having a core layer.

  In addition, when the wiring board forming board is subjected to a printing process in order to manufacture a wiring board having a core layer, the use of the conveying jig 20 may be omitted if the wiring board forming board is warped. good. In other words, the plurality of wiring board forming plates are placed on the frame body portion 10 while being aligned, and conveyed to the printing apparatus as they are without using the conveying jig 20, and the frame body portion 10 and the printing table 40 are aligned. Then, each wiring board forming plate may be adsorbed on the pedestal portion 42. If the warpage of the wiring board forming plate is within an allowable range, the wiring board forming plate can be satisfactorily adsorbed onto the pedestal portion 42 without particularly suppressing the warping by the pressing portion provided in the conveying jig 20. Can do. As described above, even when the transport jig 20 is not used when the wiring having the core layer is manufactured, the printing table 40 and the frame in the printing apparatus are used when the coreless multilayer substrate is manufactured and when the wiring substrate having the core layer is manufactured. The body part 10 can be used in common.

  The present invention is not limited to the above-described examples and embodiments, and can be implemented in various modes without departing from the gist thereof. For example, the following modifications are possible.

Modification 1:
In the embodiment of the present invention, the positioning of the wiring board forming plate 30 with respect to the frame body portion 10 is performed by superimposing the conveying jig 20 on the frame body portion 10 and placing the pad portion 22p of the spring-type suction pad 23 on the wiring board forming plate. This was performed by applying a force that draws the conveying jig 20 to one corner of the frame body 10 while being in contact with 30. In addition to such a configuration, for example, when the wiring board forming plate 30 is fitted into the frame body portion 10, the wiring board forming plate 30 is brought into contact with a specific common corner in each fitting hole 12. It is good also as fitting. Prior to the transporting process, it is only necessary to align the individual wiring board forming plates 30 with respect to the frame body portion 10, more specifically, within the individual fitting holes 12 of the frame body portion 10.

Modification 2:
In the embodiment of the present invention, the spring-type suction pad 23 is used as a pressing portion that is provided on the conveying jig 20 and presses each wiring board forming plate 30. However, a different configuration may be used. For example, the conveying jig 20 may be provided with an air blowing device instead of the spring-type suction pad 23, and the wiring board forming plate 30 may be pressed using the pressure of air. It is only necessary to apply a pressing force for suppressing the warp of the wiring board forming board 30 until the wiring board forming board 30 is conveyed to the printing table 40 and adsorbed onto the printing table 40.

Modification 3:
In the embodiment of the present invention, a suction force using a vacuum pump is used to attach the conveying jig 20 to the frame body portion 10, but a different configuration may be used. For example, a mechanism for mechanically fixing the conveying jig 20 and the frame body portion 10 may be provided. However, when a vacuum pump is used, the operation of generating and releasing the suction force in the pad portion 22p of the frame body suction pad 22 can be instantaneously performed by turning on / off the transfer jig switch described above. It becomes easy. Further, since the operation of generating the suction force in the pad portion 22p can be performed within a short time, the wiring board forming plate 30 that has been aligned during the mounting operation of the transport jig 20 to the frame body portion 10 is performed. This is desirable because it can suppress the occurrence of misalignment.

Modification 4:
In the embodiment of the present invention, the positioning hole 14 of the frame body portion 10 is fitted into the positioning pin 46 of the printing table 40. However, a positioning hole is provided in the transport jig 20 instead of the frame body portion 10. Also good. When the conveyance jig 20 is attached to and integrated with the frame body portion 10, if positioning is also performed between the frame body portion 10 and the conveyance jig 20, at least one of the frame body portion 10 and the conveyance jig 20. And the print table 40 may be aligned. Since each wiring board forming plate 30 is positioned with respect to the frame body portion 10, each of the wiring board forming plates 30 is arranged with respect to the printing table 40 by adopting such a configuration as in the embodiment. Can be positioned.

DESCRIPTION OF SYMBOLS 10 ... Frame part 12 ... Insertion hole 13 ... Step part 14 ... Positioning hole 20 ... Conveying jig 21 ... Plate-like part 22 ... Frame body part adsorption pad 22p ... Pad part 22r ... Shaft part 23 ... Spring type adsorption pad 23b ... Bolt 23p ... Pad part 23r ... Shaft part 23s ... Coil spring 24 ... Suction pipe 25 ... Suction space 26 ... Handle part 26
DESCRIPTION OF SYMBOLS 30 ... Wiring board formation board 40 ... Printing table 41 ... Plane part 42 ... Base part 44 ... Suction port 46 ... Positioning pin

Claims (6)

A method for manufacturing a wiring board, comprising:
(A) preparing a plurality of wiring board forming plates which are the wiring boards being manufactured, and preparing a frame portion capable of holding the plurality of wiring board forming plates in a plane;
(B) arranging a plurality of the wiring board forming plates at predetermined positions in the frame body;
(C) A step of attaching to the frame body a conveying jig having a pressing portion for pressing each of the wiring board forming plates arranged in the frame body section, and each wiring board at the pressing section. While pressing the forming plate, attaching the transport jig to the frame body part,
(D) The process of conveying the said conveyance jig attached to the said frame part on the printing table for printing on the said wiring board formation board,
(E) A step of causing each of the wiring board forming plates pressed by the pressing portion to be adsorbed on the printing table by generating a negative pressure between the printing table and each of the wiring board forming plates. When,
(F) removing the transport jig from the frame body;
(G) A step of performing printing on each of the wiring board forming plates adsorbed on the printing table in a state of being attached to the frame body part. It is a manufacturing method of the wiring board according to claim 1,
The step (c) includes a step of positioning each of the wiring board forming plates with respect to the frame body portion and attaching the conveying jig to the frame body portion,
In the step (d), the frame body portion to which the conveyance jig is attached and the printing table are aligned, and the conveyance jig attached to the frame body portion is arranged on the printing table. A method of manufacturing a wiring board including steps. It is a manufacturing method of the wiring board according to claim 1 or 2,
In the step (g), the printing table is configured such that, in the step (g), the printed board is printed at a position where each wiring board forming plate is arranged so that the surface of each wiring board forming board protrudes from the surface of the frame body. A method of manufacturing a wiring board comprising a pedestal that protrudes from another area of a table. A method for manufacturing a wiring board according to any one of claims 1 to 3,
In the step (c), a negative pressure is generated between the transport jig and the frame body portion to adsorb the frame body portion to the transport jig, and the transport jig is attached to the frame body. Including the step of attaching to the part,
The step (f) includes a step of releasing the negative pressure and removing the transfer jig from the frame body part. A method for manufacturing a wiring board according to any one of claims 1 to 4,
The step (b) is a step of placing a plurality of the wiring board forming plates on the frame body portion,
In the step (c), the transport jig is overlaid on the surface of the frame body portion on which the wiring board forming plate is placed, and is provided on the surface of the transport jig facing the frame body portion. A method of manufacturing a wiring board, comprising the step of leveling each wiring board forming plate by pressing the pressing portion including the elastic body against each wiring board forming plate. A method for manufacturing a wiring board according to any one of claims 1 to 5,
Each of the wiring board forming plates is formed in a substantially rectangular shape,
The said press part is provided in the location which presses the four corners of each said wiring board formation board. The manufacturing method of a wiring board.

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