JP5635574B2 - Cutting die manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a punching die.

  A punching die having a band blade (also referred to as a Thomson blade) is used to punch out a product of a predetermined shape from a sheet material, or to make a crease or a perforation. Specific examples of products include stickers for use in paper container packages (for example, food cases such as packaging cases and caramel cases, medicine and cosmetic cases), circuit boards, and electrical appliances. The punching die is typically manufactured by forming an insertion groove corresponding to the shape of the band blade (product shape) on the band blade holding base by laser processing and fitting the band blade into the insertion groove. .

  The band blade holder is typically made of plywood. Therefore, the moisture content is different for each band blade holder. Therefore, even when laser processing is performed under the same conditions, when the dimension of the insertion groove to be formed differs for each band blade holder, or when the dimension of the insertion groove does not match the thickness of the band blade There is a problem that the band blade falls off during the punching process, and the band blade is not fitted vertically to the band blade holding base, resulting in a punching defect. On the other hand, a technique has been proposed in which the moisture content is calculated from the weight of the band blade holder and the laser processing conditions are adjusted in accordance with the moisture content (Patent Document 1). However, in the technique described in Patent Document 1, since the moisture content is calculated by measuring the weight of the entire band blade holding table, only the average moisture content of the entire band blade holding table can be calculated. Therefore, there is no particular problem when the moisture content of the band blade holder is uniform throughout, but when the moisture content distribution is not uniform, the dimensional accuracy of the insertion groove may be insufficient.

  In order to solve such problems, a database that acquires steam explosion sound generated at the start of laser beam irradiation according to the moisture content of the band blade holder and stores the optimum processing conditions according to the value of the explosion sound Has been proposed (Patent Document 2), in which a machining condition is calculated and corrected to an optimum condition, and machining is performed by reflecting local moisture content. However, such an apparatus is not practical because it requires a complicated and expensive configuration and mechanical noise removal in order to accurately collect explosion sounds. Furthermore, even if a precise sound collection mechanism is used, the explosion sound value may not correspond to the actual moisture content, and conditions different from the optimized favorable conditions may be adopted, which increases the processing accuracy of the insertion groove. There is room for further improvement.

Japanese Patent No. 2528587 Patent No. 3975236

  The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a manufacturing method of a punching die which is excellent in processing accuracy and is simple and inexpensive.

In the manufacturing method of the punching die according to the present invention, a laser beam is irradiated while moving an irradiation position on a wooden and flat plate-shaped holding table to form a band blade insertion groove having a predetermined shape on the holding table. The manufacturing method defines a predetermined number of regions obtained by subdividing the holding table into a matrix; selecting a region corresponding to the shape of the band blade from the predetermined number of regions; Measuring the water content of each region, and irradiating the laser beam with conditions set for each region in accordance with the measured water content.
In one embodiment, the irradiation condition of the laser beam is selected from a moving speed and power.

  According to the punching die manufacturing method of the present invention, the moisture content of the region to be machined is directly measured according to the shape of the band blade, and the optimum laser processing conditions are set according to the measured moisture content. A punching die can be produced with excellent processing accuracy. Furthermore, since the moisture content can be measured using a simple apparatus, the apparatus can be prevented from becoming complicated and expensive, and a die can be produced easily and inexpensively.

It is a schematic block diagram explaining the typical form of the laser processing apparatus which can be used for this invention. (A) is the schematic for demonstrating the procedure which prescribes | regulates the area | region fragmented in the band blade holding stand, (b) is for demonstrating the procedure which selects an area | region according to the shape of a band blade. FIG. It is a principal part expanded sectional view for demonstrating the detail of the laser processing of a fitting groove. It is a schematic perspective view for demonstrating the procedure which inserts a band blade in a fitting groove.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to these specific embodiments.

  Initially, the laser processing apparatus which can be used for the manufacturing method of the punching die of this invention is demonstrated. In the manufacturing method of the punching die of the present invention, any appropriate laser processing device for manufacturing a punching die can be used as it is, or a moisture content measuring device can be incorporated in such a device. FIG. 1 is a schematic configuration diagram illustrating a typical form of a laser processing apparatus that can be used in the present invention. The laser processing apparatus 100 includes a laser processing mechanism 11 that irradiates a laser beam L toward a wooden flat plate-shaped blade holder 19 that is a processing target, and a condensing lens 15 of the laser processing mechanism 11 in a vertical direction (Z Z table 24 to be moved (in the direction), XY table 21 to move the band blade holding base 19 in the horizontal direction (XY direction), and standing on the upper surface of the XY table 21 to directly support the band blade holding base 19 A moisture content measuring device configured to measure the moisture content at a predetermined position of the band blade holder 19 and the needle-shaped support member 20 to be controlled, the NC controller 23 that drives and controls the XY table 21 via the AC servo 22 30 and a computer 25 connected to the moisture content measuring device 30 and the NC controller 23 and having a database 27.

The laser processing mechanism 11 includes a laser oscillator 12 that generates a laser (for example, a CO ₂ laser), a laser passage portion 13 that allows the laser light L from the laser oscillator 12 to pass through, and the laser light L that is bent from a horizontal direction to a vertical direction. A bend mirror 14 for focusing, a condensing lens 15 for condensing the laser light L, a control unit 16 for controlling the laser oscillator 12 and a control device 18 having an operation control panel 17. The laser beam L is condensed and irradiated from the opening 13a at a predetermined angle.

  The computer 25 includes calculation control means 26 for performing various calculations and temporary storage, input means 28 that is an interface connected to the moisture content measuring device 30, output means 29 that is an interface connected to the NC controller 23, and moisture content. And a database 27 storing the relationship between the optimum machining conditions.

  The database 27 stores optimum conditions corresponding to each value of the moisture content with respect to the processing conditions of the band blade holder 19 for the laser light L. Examples of the processing conditions include a moving speed in the horizontal direction (XY direction), an irradiation focal spot diameter, and power. The database 27 stores these optimum conditions and combinations thereof according to the water content.

  As the moisture content measuring device 30, any appropriate configuration that can be incorporated into a laser processing device can be adopted. Specifically, the moisture content measuring device includes an electric resistance method in which electric resistance is measured and replaced with moisture, a capacitance method in which capacitance is measured and replaced with moisture, and moisture is calculated from the degree of light absorption. A near infrared method, and a microwave method in which microwaves converted into heat (absorbed in water) are measured and replaced with moisture. The moisture content measuring device 30 is movable relative to the horizontal direction (X-Y direction) with respect to the band blade holder 19 that is the object to be processed, and at a predetermined position of the band blade holder 19. As long as it is measurable, it is attached via any suitable means (eg arm).

  Hereinafter, an example of the manufacturing method of the punching die of the present invention using the laser processing apparatus as described above will be described.

  First, as shown in FIG. 2A, the band blade holder 19 is subdivided into a matrix to define the region. In the illustrated example, n rows of X1, X2... Xn are defined in the X direction, and n columns of Y1, Y2... Yn are defined in the Y direction, and as a result, (n × n) regions are obtained. It is prescribed. Each region is defined by specifying the position on the band blade holder using region names such as (X1, Y1), (X1, Y2), (X3, Y4), (Xn, Yn), for example. Can be done. If the subdivided area is defined in this way, it is possible to select the area so as to have a high degree of matching with the shape even if the band edge shape is complicated in the area selecting step (described later). it can. As a result, the moisture content can be measured with very high accuracy in accordance with the band edge shape, so that a punching die can be produced with very good processing accuracy.

  Next, an area corresponding to the band edge shape is selected from the areas defined above. For example, FIG.2 (b) shows the area | region selected when the band blade shape is a rectangle. 2A and 2B, the region is defined as a square section surrounded by a straight line in the X direction and a straight line in the Y direction, and is selected in FIG. 2B. However, in the actual manufacture of the punching die, in many cases, the section is not actually written on the band blade holder and the area is not marked. In actual punching die manufacture, for example, the number of areas according to the size of the band blade holding table, the position information of the area on the band blade holding table, and the area name corresponding to the position are stored in the database of the computer 25, The area can be automatically selected in association with the shape data (for example, CAD data) of the band blade.

  Next, the water content of each of the areas selected above is measured. The moisture content measuring device 30 is aligned with the region selected as described above by the movement of the band blade holder 19 by the XY table 21 and the movement of the moisture content measuring device 30 by the arm. For example, an electrical resistance type moisture content measuring device inserts an electrode into a band blade holding table and measures the moisture content inside the vicinity of the surface of the band blade holding table. In the manufacturing method of the punching die of the present invention, the insertion hole of the electrode formed at the time of measurement does not cause a problem in the resulting punching die, so that the moisture content of the electric resistance method that can measure the moisture content locally with a simple configuration A measuring device is the preferred method. After measuring the moisture content of the first selected region as described above, the measurement can be repeated in the same procedure, and the moisture content of all the selected regions can be measured.

  Next, the irradiation condition of the laser beam is set for each region according to the moisture content measured above. Specifically, based on the moisture content measured for each region, the optimum condition corresponding to each value of the moisture content stored in the database 27 is selected. That is, based on the moisture content, processing conditions (for example, movement speed in the XY direction, power, and / or a combination thereof) are optimized for each region and automatically corrected. More specifically, as shown in FIG. 3, the irradiation condition of the laser beam is set such that the focal length (irradiation focal spot diameter) is set based on a predetermined width dimension t set in advance on the surface side of the band blade holder 19. The moving speed in the XY direction is set so that the width dimension d on the back side is equal to the width dimension t, and the power density is set in consideration of the overall balance. In general, for reference, when the moisture content is relatively high, the movement speed in the XY direction is relatively slow, and when the moisture content is relatively small, the movement in the XY direction. The speed is relatively increased. Further, when the moisture content is relatively large, the power is relatively increased, and when the moisture content is relatively small, the power is relatively decreased.

  As described above, a predetermined shape (rectangular in the example of FIG. 2) insertion groove 30 is formed in the band blade holder 19. Finally, as shown in FIG. 4, a cutting die is obtained by fitting a band blade 31 into the fitting groove 30. In the actual manufacturing of the punching die, a plurality of bridges (not shown) for fitting notches (not shown) of the band blades are intermittently provided, and the cutting portion is cut even if the insertion groove penetrates by laser processing. Is prevented from falling out.

  Up to this point, the embodiment in which the moisture content measuring device is incorporated in the laser processing device has been described. However, any appropriate laser processing device for manufacturing a punching die that can be used in the art may be used as it is. In this case, the moisture content measurement can be performed manually. For example, when an area is selected as shown in FIG. 2, the area may be actually marked, and the moisture content of the marked area may be measured. The moisture content measurement data may be input manually or transferred to the laser processing apparatus computer via any suitable data transfer means. Such a method can be applied when manufacturing a punching die having a simple shaped band blade.

  The above embodiments may be combined as appropriate, and the above embodiments may be combined with a configuration well known in the art.

  The punching die obtained by the manufacturing method of the present invention can be suitably used for punching paper container packages such as cigarette paper boxes (cases) and candy / caramel paper boxes (cases), and circuit boards.

DESCRIPTION OF SYMBOLS 11 Laser processing mechanism 12 Laser oscillator 13 Laser passage part 14 Bend mirror 15 Condensing lens 19 Band blade holding stand 20 Needle-shaped support material 21 XY table 24 Z table 25 Computer 27 Database 30 Insertion groove 31 Band blade 100 Laser processing apparatus

Claims (2)

A method for manufacturing a punching die, in which a laser beam is irradiated while moving an irradiation position on a wooden and flat plate-shaped holding table to form a band blade insertion groove of a predetermined shape on the holding table,
Defining a predetermined number of regions obtained by subdividing the holding table into a matrix;
Selecting a region corresponding to the shape of the band blade from the predetermined number of regions;
Measuring the water content of each of the selected areas;
Irradiating a laser beam with setting conditions according to the moisture content measured in each of the respective regions ;
A method for manufacturing a punching die. The punching die manufacturing method according to claim 1, wherein the laser light irradiation condition is selected from a moving speed and a power.

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