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JP5646973B2 - Thermal conductivity measurement device, thermal conductivity calculation device, thermal conductivity calculation program, and thermal conductivity measurement method - Google Patents
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JP5646973B2 - Thermal conductivity measurement device, thermal conductivity calculation device, thermal conductivity calculation program, and thermal conductivity measurement method - Google Patents

Thermal conductivity measurement device, thermal conductivity calculation device, thermal conductivity calculation program, and thermal conductivity measurement method Download PDF

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JP5646973B2
JP5646973B2 JP2010268649A JP2010268649A JP5646973B2 JP 5646973 B2 JP5646973 B2 JP 5646973B2 JP 2010268649 A JP2010268649 A JP 2010268649A JP 2010268649 A JP2010268649 A JP 2010268649A JP 5646973 B2 JP5646973 B2 JP 5646973B2
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JP2012117939A (en
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田中 浩和
浩和 田中
拓哉 平田
拓哉 平田
大串 哲朗
哲朗 大串
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Espec Corp
Josho Gakuen Educational Foundation
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Description

本発明は、板状の被測定片の熱伝導率を測定するための熱伝導率測定装置、熱伝導率演算装置、熱伝導率算出プログラム、及び熱伝導率測定方法に関するものである。   The present invention relates to a thermal conductivity measuring device, a thermal conductivity computing device, a thermal conductivity calculating program, and a thermal conductivity measuring method for measuring the thermal conductivity of a plate-like piece to be measured.

従来、板状の被測定片の熱伝導率kを測定する方法として、以下の方法が知られている。   Conventionally, the following method is known as a method for measuring the thermal conductivity k of a plate-like piece to be measured.

この方法では、図20に示されるように、被測定片100をその主面部100aが垂直となる姿勢で配置(垂直配置)し、自然空冷下で一方の端部102をヒーターH等で加熱する。この被測定片100において、一方の端部102から他方の端部104に向かう方向に沿った複数箇所(図20では7箇所)x1,x2,…で被測定片100の温度をそれぞれ検出する。そして、求めた被測定片100の各位置での温度と、計算式(具体的には、垂直配置された平板の自然対流式と放射式)と、を用いて自然空冷下で垂直配置された被測定片100の熱伝達率hを算出する。この熱伝達率hは、他の姿勢で配置された平板の各位置での温度を検出して前記他の姿勢の平板に対する計算式によって求めた熱伝達率hに比べて誤差が少ない。そのため、上記の計算式(自然対流式及び放射式)によって求めた被測定片の熱伝達率hと、上記のようにして検出した被測定片100の各位置x1,x2,…での温度と、フィン効率を算出するための計算式とから被測定片100の熱伝導率kを精度よく導出することができる。   In this method, as shown in FIG. 20, the measured piece 100 is arranged in a posture in which the main surface portion 100a is vertical (vertical arrangement), and one end 102 is heated by a heater H or the like under natural air cooling. . In the measured piece 100, the temperature of the measured piece 100 is detected at a plurality of locations (seven locations in FIG. 20) x1, x2,... Along the direction from one end portion 102 to the other end portion 104. And it was vertically arranged under natural air cooling using the calculated temperature at each position of the measured piece 100 and a calculation formula (specifically, a natural convection type and a radial type of vertically arranged flat plates). The heat transfer coefficient h of the measured piece 100 is calculated. The heat transfer coefficient h has less error than the heat transfer coefficient h obtained by detecting the temperature at each position of the flat plate arranged in another posture and calculating the calculation for the flat plate in the other posture. Therefore, the heat transfer coefficient h of the measured piece obtained by the above calculation formula (natural convection formula and radiation formula), and the temperature at each position x1, x2,. The thermal conductivity k of the measured piece 100 can be accurately derived from the calculation formula for calculating the fin efficiency.

一方、板状の被測定片の熱伝導率kを測定する方法として、非特許文献1に記載の方法も知られている。この方法は、図21に示されるように、真空中に配置された被測定片100の一方の端部(基部)102を冷却部材106で挟み込み、被測定片100の他方の端部である先端部104、及び基部102側の冷却部材106の近傍にヒーターH1,H2をそれぞれ設ける。そして、ヒーターH1,H2によって被測定片100を加熱し、被測定片100の温度を基部102から先端部104に向う方向に沿って複数箇所(図21では3箇所)x1,x2,…で測定する。   On the other hand, a method described in Non-Patent Document 1 is also known as a method for measuring the thermal conductivity k of a plate-shaped measurement piece. In this method, as shown in FIG. 21, one end (base) 102 of a measured piece 100 arranged in a vacuum is sandwiched by a cooling member 106, and the tip which is the other end of the measured piece 100. Heaters H1 and H2 are provided in the vicinity of the cooling member 106 on the part 104 and base 102 side, respectively. Then, the measurement piece 100 is heated by the heaters H1, H2, and the temperature of the measurement piece 100 is measured at a plurality of locations (three locations in FIG. 21) x1, x2,... Along the direction from the base portion 102 to the tip portion 104. To do.

真空中に配置されているので被測定片100は、真空断熱状態となっている。このため、ヒーターH1,H2から冷却部材106に向けて被測定片100中を流れる熱の被測定片100表面から当該被測定片100の周囲の空間への放熱が無視できる。そのため、被測定片100の熱伝達率hを考慮することなく、被測定片100内の熱流Qと被測定片100の各位置x1,x2,…で測定された温度及び被測定片100のヒーターH1,H2の位置における温度に基づく温度勾配とから所定の計算式によって被測定片100の熱伝導率kを導出することができる。   Since it is arrange | positioned in the vacuum, the to-be-measured piece 100 is a vacuum heat insulation state. For this reason, heat radiation from the surface of the measured piece 100 to the space around the measured piece 100 by the heat flowing in the measured piece 100 from the heaters H1 and H2 toward the cooling member 106 can be ignored. Therefore, the temperature measured at each position x1, x2,... Of the measurement piece 100 and the heat flow Q in the measurement piece 100 and the heater of the measurement piece 100 without considering the heat transfer coefficient h of the measurement piece 100. The thermal conductivity k of the measured piece 100 can be derived from a temperature gradient based on the temperature at the positions of H1 and H2 by a predetermined calculation formula.

Journal of Heat Transfer, AUGUST 1997,Vol.119,P401-405Journal of Heat Transfer, AUGUST 1997, Vol.119, P401-405

上記一つ目の熱伝導率の測定方法では、熱伝達率hを算出する際に、垂直配置した平板の自然対流式及び放射式を用いて被測定片100の熱伝導率kを求めている。   In the first method for measuring the thermal conductivity, when calculating the heat transfer coefficient h, the thermal conductivity k of the piece 100 to be measured is obtained using the natural convection type and radiation type of flat plates arranged vertically. .

一方、上記二つ目の熱伝導率の測定方法(非特許文献1に記載の方法)では、熱伝達率hを求める代わりに、被測定片100を真空中に配置して真空断熱状態とし、これにより、被測定片100中を流れるヒーターH1,H2からの熱流Qの熱損が無視できる状態にして、この熱流Qと被測定片100の温度勾配とから熱伝導率kを求めている。そのため、被測定片100が空気中に配置されると、熱伝導率kを精度よく求めることができない。   On the other hand, in the second method for measuring the thermal conductivity (method described in Non-Patent Document 1), instead of obtaining the heat transfer coefficient h, the measured piece 100 is placed in a vacuum to be in a vacuum insulation state, As a result, the heat loss of the heat flow Q from the heaters H1 and H2 flowing in the measured piece 100 can be ignored, and the thermal conductivity k is obtained from the heat flow Q and the temperature gradient of the measured piece 100. Therefore, when the measured piece 100 is disposed in the air, the thermal conductivity k cannot be obtained with high accuracy.

そこで、板状の被測定片を垂直配置や真空中に配置しなくても、当該被測定片の熱伝導率を求めることができる熱伝導率測定装置、熱伝導率演算装置、熱伝導率算出プログラム、及び熱伝導率測定方法を提供する。   Therefore, a thermal conductivity measuring device, a thermal conductivity calculation device, and a thermal conductivity calculation that can determine the thermal conductivity of the measured piece without arranging the plate-like measured piece vertically or in a vacuum. A program and a thermal conductivity measurement method are provided.

そこで、上記課題を解消すべく、本発明は、板状の被測定片の熱伝導率を導出するための熱伝導率測定装置であって、前記被測定片の一端部を加熱する加熱部と、前記被側定片の一端部から他端部に向う方向に沿って連続的又は断続的に当該被測定片の温度分布を検出する温度分布検出部と、前記被測定片の熱伝導率を算出する演算装置と、を備える。そして、前記演算装置は、演算用熱伝達率を格納する記憶部と、前記被測定片の内部を一端部から他端部に向って熱が流れるときの抵抗である第1の熱伝導抵抗と前記被測定片の表面から当該被測定片の周囲の空間に熱が出るときの抵抗である第1の熱伝達抵抗との比である第1の熱抵抗比と、前記記憶部に格納される演算用熱伝達率と、前記温度分布検出部により検出された前記被測定片の温度分布と、から当該被測定片の熱伝導率を求める被測定片熱伝導率導出部と、を有し、前記演算用熱伝達率は、熱伝導率が既知の板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った板状部材温度分布に基づいている。   Therefore, in order to solve the above problems, the present invention is a thermal conductivity measuring device for deriving the thermal conductivity of a plate-like piece to be measured, a heating unit for heating one end of the piece to be measured, A temperature distribution detector that detects the temperature distribution of the measurement piece continuously or intermittently along the direction from one end of the measured piece to the other end, and the thermal conductivity of the measurement piece. An arithmetic device for calculating. And the said arithmetic unit is the memory | storage part which stores the heat transfer coefficient for a calculation, and the 1st heat conduction resistance which is resistance when heat flows inside the said to-be-measured piece from one end part to the other end part, A first thermal resistance ratio, which is a ratio to a first heat transfer resistance that is a resistance when heat is generated from the surface of the measurement piece to the space around the measurement piece, and stored in the storage unit. A measurement piece thermal conductivity deriving unit for obtaining the thermal conductivity of the measurement piece from the heat transfer coefficient for calculation and the temperature distribution of the measurement piece detected by the temperature distribution detection unit; The calculation heat transfer coefficient is based on a plate-like member temperature distribution along a direction from one end portion to the other end portion of the member when the one end portion of the plate-like member having a known thermal conductivity is heated. .

本発明の熱伝導率測定装置によれば、熱伝導率が既知の板状の部材の一端から他端に向かう方向に沿った温度分布(板状部材温度分布)に基づいて導出される熱伝達率(演算用熱伝達率)を利用することによって、垂直配置の板状の被測定片に対する自然対流式や放射式といった計算式を用いた演算によって被測定片の熱伝達率を算出しなくても、被測定片の熱伝導率を求めることができる。   According to the thermal conductivity measuring device of the present invention, the heat transfer derived based on the temperature distribution (plate-shaped member temperature distribution) along the direction from one end of the plate-shaped member having a known thermal conductivity toward the other end. By using the rate (heat transfer coefficient for calculation), it is necessary to calculate the heat transfer coefficient of the measured piece by calculation using a calculation formula such as a natural convection formula or a radiation formula for the plate-like measured piece arranged vertically. In addition, the thermal conductivity of the measured piece can be obtained.

具体的に、被測定片の熱伝達率と、被測定片の温度分布(各位置の温度)から求められる第1の熱抵抗比とが分れば、これらを利用して被測定片の熱伝導率を求めることができる。そこで、熱伝導率が既知の板状の部材の熱伝導率と温度分布とから求まる前記板状の部材の熱伝達率(演算用熱伝達率)を被測定片の熱伝達率と擬制することにより、この演算用熱伝達率と被測定片の温度分布とから被測定片の熱伝導率を求めることができる。   Specifically, if the heat transfer coefficient of the measured piece and the first thermal resistance ratio obtained from the temperature distribution (temperature at each position) of the measured piece are known, the heat of the measured piece can be obtained using these. Conductivity can be determined. Therefore, to simulate the heat transfer coefficient of the plate-like member (heat transfer coefficient for calculation) obtained from the heat conductivity and temperature distribution of the plate-like member whose heat conductivity is known with the heat transfer coefficient of the measured piece. Thus, the thermal conductivity of the measured piece can be obtained from the heat transfer coefficient for calculation and the temperature distribution of the measured piece.

このように、本発明の熱伝導率測定装置によれば、熱伝導率が既知の板状の部材の熱伝達率を被測定片の熱伝達率と擬制することにより、垂直配置の板状の被測定片に対する自然対流式や放射式を用いた演算を行わなくても被測定片の熱伝導率を導出することができるため、被測定片を垂直配置しなくてもよい。   As described above, according to the thermal conductivity measuring device of the present invention, the plate-shaped member having a vertical arrangement is obtained by imitating the heat transfer coefficient of the plate-shaped member having a known heat conductivity with the heat transfer coefficient of the measured piece. Since it is possible to derive the thermal conductivity of the measurement piece without performing a calculation using a natural convection formula or a radiation formula for the measurement piece, the measurement piece need not be arranged vertically.

しかも、被測定片と当該被測定片の周囲の空間との間の熱移動を扱うための係数である被測定片の熱伝達率(詳しくは、被測定片の熱伝達率として擬制した演算用熱伝達率)を用いて被測定片の熱伝導率を求めているため、演算結果には被測定片から周囲の空間への放熱の影響が含まれており、これにより、被測定片を真空中に配置して真空断熱状態としなくても被測定片の熱伝導率を求めることができる。   Moreover, the heat transfer coefficient of the measured piece, which is a coefficient for handling the heat transfer between the measured piece and the space around the measured piece (more specifically, for calculation that simulates the heat transfer coefficient of the measured piece Since the thermal conductivity of the measured piece is calculated using the heat transfer coefficient), the calculation result includes the effect of heat radiation from the measured piece to the surrounding space. The thermal conductivity of the piece to be measured can be obtained without placing it in a vacuum insulation state.

具体的に、前記演算用熱伝達率は、前記板状部材温度分布の関数として前記記憶部に格納されてもよい。このような温度分布の関数として記憶部に格納された演算用熱伝達率を利用すれば、被測定片の温度分布を測定するだけで、演算により被測定片の熱伝導率を求めることができる。   Specifically, the heat transfer coefficient for calculation may be stored in the storage unit as a function of the plate member temperature distribution. If the heat transfer coefficient for calculation stored in the storage unit as a function of such a temperature distribution is used, the thermal conductivity of the measured piece can be obtained by calculation only by measuring the temperature distribution of the measured piece. .

また、前記加熱部は、熱伝導率が既知の板状の部材である比較片の一端部を加熱可能であり、前記温度分布検出部は、前記比較片の一端部から他端部に向う方向に沿って連続的又は断続的に当該比較片の温度分布を検出可能であり、前記演算装置は、前記比較片の内部を一端部から他端部に向って熱が流れるときの抵抗である第2の熱伝導抵抗と前記比較片の表面から当該比較片の周囲の空間に熱が出るときの抵抗である第2の熱伝達抵抗との比である第2の熱抵抗比と、前記比較片の熱伝導率と、前記温度分布検出部により検出された前記比較片の温度分布と、から当該比較片の熱伝達率を求める比較片熱伝達率導出部を有し、前記記憶部は、前記比較片熱伝達率導出部で求めた比較片の熱伝達率を前記演算用熱伝達率として格納してもよい。このように、熱伝導率が既知の比較片を実際に加熱してその温度分布から求めた熱伝達率を演算用熱伝達率として利用することによっても、垂直配置の板状の被測定片に対する自然対流式や放射式といった計算式を用いた演算によって被測定片の熱伝達率を算出しなくても、被測定片の熱伝導率を求めることができる。   Further, the heating unit can heat one end portion of a comparison piece that is a plate-like member having a known thermal conductivity, and the temperature distribution detection unit is directed from one end portion to the other end portion of the comparison piece. The temperature distribution of the comparison piece can be detected continuously or intermittently along the line, and the arithmetic unit is a resistance when heat flows through the comparison piece from one end to the other end. A second heat resistance ratio that is a ratio of a heat conduction resistance of 2 and a second heat transfer resistance that is a resistance when heat is emitted from the surface of the comparison piece to the space around the comparison piece; A comparison piece heat transfer coefficient deriving unit for obtaining a heat transfer coefficient of the comparison piece from the heat conductivity of the comparison piece and the temperature distribution of the comparison piece detected by the temperature distribution detection unit, and the storage unit The heat transfer coefficient of the comparison piece obtained by the comparison piece heat transfer coefficient deriving unit may be stored as the heat transfer coefficient for calculation. . Thus, by actually heating a comparison piece having a known thermal conductivity and using the heat transfer coefficient obtained from the temperature distribution as a heat transfer coefficient for calculation, it is also possible to obtain a plate-like piece to be measured vertically arranged. The thermal conductivity of the measured piece can be obtained without calculating the heat transfer coefficient of the measured piece by calculation using a calculation formula such as a natural convection formula or a radiation formula.

この場合、一つの加熱部と一つの温度分布検出部とにより、比較片と被測定片との温度分布をそれぞれ求めて被測定物の熱伝導率を求めてもよく、また、異なる加熱部によって比較片と被測定片とを別々に加熱して異なる温度分布検出部によって比較片と被測定片との温度分布を別々に検出してもよい。   In this case, the thermal conductivity of the object to be measured may be obtained by obtaining the temperature distribution of the comparison piece and the piece to be measured by one heating unit and one temperature distribution detecting unit, respectively, or by different heating parts. The comparison piece and the measurement piece may be separately heated, and the temperature distributions of the comparison piece and the measurement piece may be separately detected by different temperature distribution detection units.

加熱と温度分布の検出とを別々に行う場合には、前記加熱部は、前記被測定片の一端部を加熱する被測定片加熱部と、熱伝導率が既知の板状の比較片の一端部を加熱する比較片加熱部とを有し、前記温度分布検出部は、被側定片の一端部から他端部に向う方向に沿って連続的又は断続的に当該被測定片の温度分布を検出する被測定片温度分布検出部と、前記比較片の一端部から他端部に向う方向に沿って連続的又は断続的に当該比較片の温度分布を検出する比較片温度分布検出部と、を有し、前記被測定片熱伝導率導出部は、前記第1の熱抵抗比と、前記記憶部に格納される演算用熱伝達率と、前記被測定片温度分布検出部により検出された前記被測定片の温度分布と、から当該被測定片の熱伝導率を求めるようにしてもよい。   When heating and temperature distribution detection are separately performed, the heating unit includes a measurement piece heating unit that heats one end of the measurement piece, and one end of a plate-like comparison piece having a known thermal conductivity. The temperature distribution detecting unit continuously or intermittently along the direction from one end portion of the side fixed piece to the other end portion, the temperature distribution of the piece to be measured. And a comparison piece temperature distribution detection unit for detecting the temperature distribution of the comparison piece continuously or intermittently along the direction from one end to the other end of the comparison piece. The measured piece thermal conductivity deriving unit is detected by the first thermal resistance ratio, the heat transfer coefficient for calculation stored in the storage unit, and the measured piece temperature distribution detecting unit. The thermal conductivity of the measurement piece may be obtained from the temperature distribution of the measurement piece.

本発明に係る熱伝導率測定装置においては、前記被測定片の周囲と前記比較片の周囲とを同じ雰囲気条件に制御するための雰囲気制御手段を備えてもよい。尚、本発明における雰囲気条件とは、被測定片の周囲及び比較片の周囲の風速や風向、温度等のことをいう。   The thermal conductivity measuring apparatus according to the present invention may include an atmosphere control means for controlling the periphery of the measured piece and the periphery of the comparison piece to the same atmospheric condition. The atmospheric condition in the present invention means the wind speed, wind direction, temperature, etc. around the measured piece and around the comparative piece.

かかる構成では、被測定片及び比較片の周囲の雰囲気条件を雰囲気制御手段によって制御することにより、同じ雰囲気条件下で被測定片の温度分布と比較片の温度分布とをそれぞれ検出することができる。これにより、比較片の熱伝達率を用いて求めた被測定片の熱伝導率から、被測定片及び比較片の温度分布を測定したときの雰囲気条件の差異に基づく影響を排除することができる。即ち、比較片の熱伝達率を用いて被測定片の熱伝導率を算出するときの演算において雰囲気条件の差異に基づく影響が排除されるため、被測定片の熱伝導率をより精度よく求めることができる。   In such a configuration, by controlling the atmospheric conditions around the measurement piece and the comparison piece by the atmosphere control means, it is possible to detect the temperature distribution of the measurement piece and the temperature distribution of the comparison piece under the same atmospheric conditions. . Thereby, the influence based on the difference in atmospheric conditions when measuring the temperature distribution of the measurement piece and the comparison piece can be eliminated from the thermal conductivity of the measurement piece obtained using the heat transfer coefficient of the comparison piece. . That is, since the influence based on the difference in the atmospheric condition is excluded in the calculation when calculating the thermal conductivity of the measurement piece using the heat transfer coefficient of the comparison piece, the thermal conductivity of the measurement piece can be obtained more accurately. be able to.

前記被測定片熱伝導率導出部は、前記第1の熱抵抗比と前記比較片熱伝達率導出部で求められた比較片の熱伝達率と前記被測定片温度分布検出部で検出された被測定片の温度分布とから当該被測定片の熱伝導率を求める第1導出部と、前記被測定片が被測定薄片と熱伝導率が既知で且つ板状の1又は複数の厚さ調整薄片とを積層することにより構成されている場合に、前記第1導出部で求められた被測定片の熱伝導率と当該被測定片の厚さと前記被測定薄片の厚さと前記厚さ調整薄片の熱伝導率と当該厚さ調整薄片の厚さとから、前記被測定薄片の熱伝導率を求める第2導出部と、を有してもよい。   The measurement piece thermal conductivity deriving unit is detected by the first piece of thermal resistance ratio and the heat transfer coefficient of the comparison piece obtained by the comparison piece heat transfer coefficient deriving unit and the measurement piece temperature distribution detection unit. A first derivation unit that obtains the thermal conductivity of the measured piece from the temperature distribution of the measured piece; and one or more thickness adjustments in which the measured piece has a known thermal conductivity with the measured thin piece and has a plate shape When configured by laminating thin pieces, the thermal conductivity of the piece to be measured, the thickness of the piece to be measured, the thickness of the piece to be measured, and the thickness adjusting piece obtained by the first derivation unit A second derivation unit that obtains the thermal conductivity of the measured thin piece from the thermal conductivity of the thin piece and the thickness of the thickness adjusting thin piece.

かかる構成によれば、薄く熱伝導率を求めることが困難な試験薄片であっても、当該試験薄片と厚さ調整薄片とを積層して被測定片とすることにより、試験薄片の熱伝導率を比較的正確に求めることができる。即ち、試験薄片と厚さ調整薄片とを積層して、一端部から他端部に向う熱流の通過する断面積を大きくすることにより一端部から他端部に向って流れる熱の温度勾配を演算に適した大きさとすることができ、これにより、薄く熱伝導率が小さな試験薄片の熱伝導率を求めることが可能となる。   According to such a configuration, even if the test thin piece is thin and it is difficult to obtain the thermal conductivity, the test thin piece and the thickness adjusting thin piece are laminated to form a measured piece, whereby the thermal conductivity of the test thin piece is obtained. Can be determined relatively accurately. In other words, the temperature gradient of heat flowing from one end to the other end is calculated by increasing the cross-sectional area through which the heat flow from one end to the other end passes by laminating the test flake and the thickness adjustment flake. Therefore, it is possible to obtain the thermal conductivity of a thin test piece having a small thermal conductivity.

また、厚さ調整薄片を用いることにより、試験薄片が1つあれば、この試験薄片の熱伝導率を求めることができる。   Further, by using the thickness adjusting thin piece, if there is one test thin piece, the thermal conductivity of this test thin piece can be obtained.

互いに同一又は異なる熱伝導率の複数の比較薄片を積層することにより構成される比較片を備えることが好ましい。   It is preferable to provide a comparison piece constituted by laminating a plurality of comparison thin pieces having the same or different thermal conductivity.

かかる構成によれば、複数の比較薄片を組み合わせることによって比較片の温度分布(温度勾配)を被測定片の温度分布(温度勾配)と近似させることにより、比較片の熱伝導率と被測定片の熱伝導率とが近似するため、この比較片の熱伝達率を用いて求めた被測定片の熱伝導率の精度がより向上する。   According to this configuration, by combining a plurality of comparative thin pieces, the temperature distribution (temperature gradient) of the comparison piece is approximated to the temperature distribution (temperature gradient) of the measurement piece, so that the thermal conductivity of the comparison piece and the measurement piece are compared. Therefore, the accuracy of the thermal conductivity of the measured piece obtained using the heat transfer coefficient of the comparative piece is further improved.

また、上記課題を解決すべく、本発明は、板状の被測定片の熱伝導率を算出するための熱伝導率演算装置であって、演算用熱伝達率を格納すると共に、前記被測定片の一端部が加熱された状態で当該被測定片の一端部から他端部に向う方向に沿って連続的又は断続的に検出された当該被測定片の温度分布を格納する記憶部と、前記被測定片の内部を一端部から他端部に向って熱が流れるときの抵抗である第1の熱伝導抵抗と前記被測定片の表面から当該被測定片の周囲の空間に熱が出るときの抵抗である第1の熱伝達抵抗との比である第1の熱抵抗比と、前記記憶部に格納される演算用熱伝達率と、前記記憶部に格納される前記被測定片の温度分布と、から当該被測定片の熱伝導率を求める被測定片熱伝導率導出部と、を備える。そして、前記演算用熱伝達率は、熱伝導率が既知の板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った板状部材温度分布に基づいている。   Further, in order to solve the above-mentioned problem, the present invention is a thermal conductivity calculation device for calculating the thermal conductivity of a plate-shaped measurement piece, storing a calculation heat transfer coefficient and measuring the measurement target. A storage unit for storing a temperature distribution of the measurement piece continuously or intermittently detected along a direction from the one end portion of the measurement piece to the other end portion in a state where one end portion of the piece is heated; Heat is emitted from the surface of the measurement piece to the space around the measurement piece, the first heat conduction resistance that is resistance when heat flows from one end to the other end of the measurement piece. A first heat resistance ratio that is a ratio to the first heat transfer resistance that is a resistance of the operation, a heat transfer coefficient for calculation stored in the storage unit, and the measured piece stored in the storage unit A measurement piece thermal conductivity deriving unit that obtains the thermal conductivity of the measurement piece from the temperature distribution; And the said heat transfer coefficient for calculation is based on the plate-shaped member temperature distribution along the direction which goes to the other end part from the one end part in the said member when the one end part of the plate-shaped member with known heat conductivity is heated. ing.

本発明の熱伝導率測定装置によれば、熱伝導率が既知の板状の部材の一端から他端に向かう方向に沿った板状部材温度分布に基づく演算用熱伝達率を利用することによって、垂直配置の板状の被測定片に対する自然対流式や放射式といった計算式を用いた演算によって被測定片の熱伝達率を算出しなくても、被測定片の熱伝導率を求めることができる。これにより、被測定片を垂直配置しなくても当該被測定片の熱伝導率を求めることができる。   According to the thermal conductivity measuring device of the present invention, by using the heat transfer coefficient for calculation based on the plate-like member temperature distribution along the direction from one end of the plate-like member whose heat conductivity is known to the other end. It is possible to obtain the thermal conductivity of a measured piece without calculating the heat transfer coefficient of the measured piece by calculation using a natural convection formula or a radiation formula for a plate-like measured piece arranged vertically. it can. Accordingly, the thermal conductivity of the measurement piece can be obtained without arranging the measurement piece vertically.

しかも、熱伝達率(演算用熱伝達率)を用いて被測定片の熱伝導率を求めているため、演算結果には被測定片から周囲の空間への放熱の影響が含まれており、これにより、被測定片を真空中に配置して真空断熱状態としなくても被測定片の熱伝導率を求めることができる。   Moreover, since the thermal conductivity of the measured piece is obtained using the heat transfer coefficient (heat transfer coefficient for calculation), the calculation result includes the influence of heat radiation from the measured piece to the surrounding space. Thus, the thermal conductivity of the measurement piece can be obtained without placing the measurement piece in a vacuum and bringing it into a vacuum heat insulation state.

具体的に、前記演算用熱伝達率は、前記板状部材温度分布の関数として前記記憶部に格納されてもよい。このような温度分布の関数として記憶部に格納される演算用熱伝達率を利用すれば、被測定片の温度分布が当該熱伝導率演算装置に入力されるだけで、被測定片の熱伝導率が求まる。   Specifically, the heat transfer coefficient for calculation may be stored in the storage unit as a function of the plate member temperature distribution. If the heat transfer coefficient for calculation stored in the storage unit as a function of the temperature distribution is used, the temperature distribution of the measured piece can be simply input to the thermal conductivity calculating device, and the heat transfer of the measured piece can be performed. The rate is determined.

また、前記記憶部は、熱伝導率が既知の板状の部材である比較片の当該熱伝達率と、前記比較片の一端部が加熱された状態で当該比較片の一端部から他端部に向う方向に沿って連続的又は断続的に検出された当該比較片の温度分布と、を格納し、前記演算部は、前記比較片の内部を一端部から他端部に向って熱が流れるときの抵抗である第2の熱伝導抵抗と前記比較片の表面から当該比較片の周囲の空間に熱が出るときの抵抗である第2の熱伝達抵抗との比である第2の熱抵抗比と、前記記憶部に格納される比較片の熱伝導率と、前記記憶部に格納される比較片の温度分布と、から当該比較片の熱伝達率を求める比較片熱伝達率導出部を有し、前記比較片熱伝達率導出部は、当該比較片熱伝達率導出部において求められた比較片の熱伝達率を前記演算用熱伝達率として前記記憶部に格納させてもよい。   In addition, the storage unit includes the heat transfer coefficient of the comparison piece, which is a plate-like member having a known thermal conductivity, and one end portion to the other end portion of the comparison piece in a state where one end portion of the comparison piece is heated. And the temperature distribution of the comparison piece detected continuously or intermittently along the direction toward, and the calculation unit heats the inside of the comparison piece from one end to the other end. Second thermal resistance which is the ratio of the second heat conduction resistance which is the resistance to the second heat transfer resistance which is the resistance when heat is emitted from the surface of the comparison piece to the space around the comparison piece A comparison piece heat transfer coefficient deriving unit for obtaining a heat transfer coefficient of the comparison piece from the ratio, the thermal conductivity of the comparison piece stored in the storage unit, and the temperature distribution of the comparison piece stored in the storage unit The comparison piece heat transfer coefficient deriving unit has the heat transfer coefficient of the comparison piece obtained in the comparison piece heat transfer coefficient deriving unit. It may be stored in the storage unit as a serial arithmetic heat transfer coefficient.

このように、熱伝導率が既知の比較片を実際に加熱してその温度分布から求めた熱伝達率を当該熱伝導率演算装置に入力し、これを演算用熱伝達率として利用することによっても、垂直配置の板状の被測定片に対する自然対流式や放射式といった計算式を用いた演算によって被測定片の熱伝達率を算出しなくても、被測定片の熱伝導率を求めることができる。   In this way, by actually heating a comparison piece having a known thermal conductivity and inputting the heat transfer coefficient obtained from the temperature distribution to the heat conductivity calculation device, and using this as the heat transfer coefficient for calculation. However, the thermal conductivity of the measured piece can be obtained without calculating the heat transfer coefficient of the measured piece by calculation using a natural convection formula or a radiation formula for a plate-like measured piece arranged vertically. Can do.

また、上記課題を解決すべく、本発明は、板状の被測定片の熱伝導率を算出するための熱伝導率算出プログラムであって、前記被測定片の一端部が加熱された状態で、当該被測定片の一端部から他端部に向う方向に沿って連続的又は断続的に検出された被測定片の温度分布と、板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った第1の温度分布に基づく演算用熱伝達率と、をコンピュータが受け取ることで、このコンピュータを、前記被測定片の内部を一端部から他端部に向って熱が流れるときの抵抗である第1の熱伝導抵抗と前記被測定片の表面から当該被測定片の周囲の空間に熱が出るときの抵抗である第1の熱伝達抵抗との比である第1の熱抵抗比と、前記演算用熱伝達率と、前記被測定片の温度分布と、から当該被測定片の熱伝導率を求める被測定片熱伝導率導出手段として機能させる。   Moreover, in order to solve the above-mentioned problem, the present invention is a thermal conductivity calculation program for calculating the thermal conductivity of a plate-like measurement piece, in a state where one end of the measurement piece is heated. In the member when the temperature distribution of the measured piece continuously or intermittently detected along the direction from the one end portion to the other end portion of the measured piece and one end portion of the plate-like member is heated The computer receives the heat transfer coefficient for calculation based on the first temperature distribution along the direction from the one end portion toward the other end portion, so that the computer can be connected to the inside of the measured piece from the one end portion to the other end portion. A first heat conduction resistance that is a resistance when heat flows toward the first and a first heat transfer resistance that is a resistance when heat is emitted from the surface of the measurement piece to the space around the measurement piece. First heat resistance ratio, the heat transfer coefficient for calculation, and the piece to be measured And temperature distribution, is from function as measured Katanetsu conductivity deriving means for obtaining a thermal conductivity of the measured piece.

このようなプログラムをコンピュータに読み込ませることにより、被測定片の温度分布と熱伝導率が既知の板状の部材の温度分布に基づく演算用熱伝達率とをコンピュータに入力すれば、当該コンピュータが被測定片の熱伝導率を算出する。   By causing the computer to read such a program, if the computer inputs the temperature distribution of the measured piece and the heat transfer coefficient for calculation based on the temperature distribution of the plate-like member whose thermal conductivity is known, the computer The thermal conductivity of the measured piece is calculated.

また、このプログラムでは、垂直配置の板状の被測定片に対する自然対流式や放射式といった計算式を用いた演算によって被測定片の熱伝達率を算出しなくても、被測定片の熱伝導率を求めることができる。そのため、コンピュータに入力される被測定片の温度分布は、垂直配置した被測定片の温度分布でなく他の姿勢(例えば、水平配置等)で配置した被測定片の温度分布でもよい。さらに、このプログラムでは、熱伝達率(演算用熱伝達率)を用いて被測定片の熱伝導率を求めているので、演算結果には被測定片から周囲の空間への放熱の影響が含まれているため、コンピュータに入力される被測定片の温度分布は、真空中でなく空気中に配置した被測定片の温度分布でもよい。   In addition, this program does not calculate the heat transfer coefficient of the measured piece by calculation using a natural convection formula or a radiation formula for the plate-shaped measured piece arranged vertically. The rate can be determined. Therefore, the temperature distribution of the measurement piece input to the computer may be the temperature distribution of the measurement piece arranged in another posture (for example, horizontal arrangement) instead of the temperature distribution of the measurement piece arranged vertically. In addition, in this program, the thermal conductivity of the measurement piece is obtained using the heat transfer coefficient (calculation heat transfer coefficient), so the calculation results include the effect of heat radiation from the measurement piece to the surrounding space. Therefore, the temperature distribution of the measurement piece input to the computer may be the temperature distribution of the measurement piece arranged in the air instead of in a vacuum.

また、上記課題を解決すべく、本発明は、板状の被測定片の熱伝導率を導出するための熱伝導率測定方法であって、前記被測定片の一端部を加熱し、この被測定片の一端部から他端部に向う方向に沿って連続又は断続した当該被測定片の温度分布を検出する被測定片温度分布検出工程と、前記被測定片の内部を一端部から他端部に向って熱が流れるときの抵抗である第1の熱伝導抵抗と前記被測定片の表面から当該被測定片の周囲の空間に熱が出るときの抵抗である第1の熱伝達抵抗との比である第1の熱抵抗比と、板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った板状部材温度分布に基づく演算用熱伝達率と、前記被測定片温度分布検出工程で検出された前記被測定片の温度分布と、から当該被測定片の熱伝導率を求める被測定片熱伝導率導出工程と、を備える。   Further, in order to solve the above problems, the present invention provides a thermal conductivity measurement method for deriving the thermal conductivity of a plate-like piece to be measured, comprising heating one end of the piece to be measured, A measurement piece temperature distribution detecting step for detecting a temperature distribution of the measurement piece continuously or intermittently along a direction from one end portion of the measurement piece to the other end portion, and the inside of the measurement piece from the one end portion to the other end A first heat conduction resistance which is a resistance when heat flows toward the part, and a first heat transfer resistance which is a resistance when heat is emitted from the surface of the measurement piece to the space around the measurement piece. Heat transfer for calculation based on the first thermal resistance ratio, which is the ratio of the plate member, and the plate member temperature distribution along the direction from one end to the other end of the member when one end of the plate member is heated And the temperature distribution of the measured piece detected in the measured piece temperature distribution detecting step It comprises a measured Katanetsu conductivity deriving step of determining the thermal conductivity of the measurement piece, a.

本発明の熱伝導率測定方法によれば、被測定片の温度分布を検出し、熱伝導率が既知の板状の部材の一端から他端に向かう方向に沿った板状部材温度分布に基づく演算用熱伝達率を利用することによって、垂直配置の板状の被測定片に対する自然対流式や放射式といった計算式を用いた演算によって被測定片の熱伝達率を算出しなくても、被測定片の熱伝導率を求めることができる。これにより、被測定片を垂直配置しなくても当該被測定片の熱伝導率を求めることができる。   According to the thermal conductivity measurement method of the present invention, the temperature distribution of the measured piece is detected, and based on the plate-like member temperature distribution along the direction from one end of the plate-like member having a known thermal conductivity to the other end. By using the heat transfer coefficient for calculation, it is possible to calculate the heat transfer coefficient of the measured piece without calculating the heat transfer coefficient of the measured piece by a calculation formula such as a natural convection formula or a radiation formula for a plate-like measured piece arranged vertically. The thermal conductivity of the measurement piece can be obtained. Accordingly, the thermal conductivity of the measurement piece can be obtained without arranging the measurement piece vertically.

しかも、熱伝達率(演算用熱伝達率)を用いて被測定片の熱伝導率を求めているため、演算結果には被測定片から周囲の空間への放熱の影響が含まれており、これにより、被測定片を真空中に配置して真空断熱状態としなくても被測定片の熱伝導率を求めることができる。   Moreover, since the thermal conductivity of the measured piece is obtained using the heat transfer coefficient (heat transfer coefficient for calculation), the calculation result includes the influence of heat radiation from the measured piece to the surrounding space. Thus, the thermal conductivity of the measurement piece can be obtained without placing the measurement piece in a vacuum and bringing it into a vacuum heat insulation state.

尚、演算用熱伝達率は、前記板状部材温度分布の関数として予め求められていてもよく、また、熱伝導率が既知の板状部材(比較片)を実際に加熱してその温度分布から求めてもよい。   The heat transfer coefficient for calculation may be obtained in advance as a function of the temperature distribution of the plate-like member, and the temperature distribution is obtained by actually heating a plate-like member (comparison piece) having a known thermal conductivity. You may ask for.

比較片を実際に加熱して得られた温度分布から演算用熱伝達率を求める場合、熱伝導率が既知の板状の比較片の一端部を加熱し、この比較片の一端部から他端部に向う方向に沿って連続又は断続した当該比較片の温度分布を検出する比較片温度分布検出工程と、前記比較片の内部を一端部から他端部に向って熱が流れるときの抵抗である第2の熱伝導抵抗と前記比較片の表面から当該比較片の周囲の空間に熱が出るときの抵抗である第2の熱伝達抵抗との比である第2の熱抵抗比と、前記比較片の熱伝導率と、前記比較片温度分布検出工程で検出された前記比較片の温度分布と、から当該比較片の熱伝達率を求める比較片熱伝達率導出工程と、をさらに備え、前記被測定片熱伝導率導出工程は、前記比較片熱伝達率導出工程で求められる前記比較片の熱伝達率を前記演算用熱伝達率として前記被測定片の熱伝導率を求めるようにしてもよい。   When calculating the heat transfer coefficient for calculation from the temperature distribution obtained by actually heating the comparison piece, one end of the plate-like comparison piece having a known thermal conductivity is heated, and the other end of the comparison piece is changed from one end to the other. A comparison piece temperature distribution detection step for detecting the temperature distribution of the comparison piece that is continuous or intermittent along the direction toward the portion, and resistance when heat flows from one end portion to the other end portion in the comparison piece. A second heat resistance ratio that is a ratio between a certain second heat conduction resistance and a second heat transfer resistance that is a resistance when heat is emitted from the surface of the comparison piece to the space around the comparison piece; A comparison piece heat transfer coefficient derivation step for obtaining a heat transfer coefficient of the comparison piece from the heat conductivity of the comparison piece and the temperature distribution of the comparison piece detected in the comparison piece temperature distribution detection step; The measured piece thermal conductivity deriving step is calculated in the comparative piece heat transfer coefficient deriving step. The heat transfer coefficient of 較片 as the arithmetic thermal conductivity may be obtained a thermal conductivity of the measured piece.

この場合、前記比較片温度分布検出工程の前に、互いに同一又は異なる熱伝導率の複数の比較薄片を積層することにより前記比較片を形成する比較片形成工程を備え、前記比較片形成工程では、前記比較片温度分布検出工程で検出される温度分布が前記被測定片温度分布検出工程で検出される被測定片の温度分布に近くなるように、前記互いに同一又は異なる熱伝導率の複数の比較薄片が組み合わされて前記比較片が形成されることが好ましい。   In this case, before the comparison piece temperature distribution detection step, a comparison piece forming step of forming the comparison piece by stacking a plurality of comparison thin pieces having the same or different thermal conductivity is provided. In the comparison piece formation step, A plurality of the same or different thermal conductivities so that the temperature distribution detected in the comparison piece temperature distribution detection step is close to the temperature distribution of the measurement piece detected in the measurement piece temperature distribution detection step. It is preferable that the comparison piece is formed by combining the comparison pieces.

かかる構成によれば、比較片の温度分布(温度勾配)が被測定片の温度分布(温度勾配)と近似するように複数の比較薄片を組み合わせて比較片を形成することにより、比較片の熱伝導率と被測定片の熱伝導率とが近似するため、この比較片の熱伝達率を用いて求めた被測定片の熱伝導率の精度がより向上する。   According to such a configuration, the heat of the comparison piece is obtained by combining the plurality of comparison thin pieces so that the temperature distribution (temperature gradient) of the comparison piece approximates the temperature distribution (temperature gradient) of the measurement piece. Since the conductivity and the thermal conductivity of the measurement piece are approximate, the accuracy of the thermal conductivity of the measurement piece obtained using the heat transfer coefficient of the comparison piece is further improved.

前記被測定片温度分布検出工程の前に、複数の被測定薄片を積層することにより前記被測定片を形成する被測定片作成工程を備えてもよい。   Before the measurement piece temperature distribution detection step, a measurement piece creation step of forming the measurement piece by stacking a plurality of measurement thin pieces may be provided.

かかる構成によれば、薄く又は熱伝導率の小さな試験薄片でも、これら試験薄片を複数積層して被測定片とすることにより、試験薄片の熱伝導率を求めることができる。即ち、同じ材質の板状部材であれば一枚で求めた熱伝導率も複数枚重ねて求めた熱伝導率も同じ値となることを利用し、複数の試験薄片を積層して被測定片を作成することによって、一端部から他端部に向う熱流の通過する断面積を大きくして一端部から他端部に向かって流れる熱の温度勾配を演算に適した大きさとし、これにより、薄く熱伝導率が小さな試験薄片の熱伝導率も求めることが可能となる。   According to such a configuration, even for a thin test piece having a small thermal conductivity, the thermal conductivity of the test thin piece can be obtained by laminating a plurality of these test pieces to form a measured piece. In other words, if the plate-like member is made of the same material, the fact that the thermal conductivity obtained by one sheet and the thermal conductivity obtained by stacking a plurality of sheets have the same value is utilized, and a plurality of test slices are laminated to be measured. By making the cross-sectional area through which the heat flow from one end to the other end passes, the temperature gradient of the heat flowing from one end to the other end is set to a size suitable for calculation. It is also possible to determine the thermal conductivity of a test flake having a small thermal conductivity.

また、前記被測定片温度分布検出工程の前に、被測定薄片と熱伝導率が既知で且つ板状の1又は複数の厚さ調整薄片とを積層することにより前記被測定片を形成する被測定片形成工程と、前記被測定片熱伝導率導出工程で求められた前記被測定片の熱伝導率と当該被測定片の厚さと前記被測定薄片の厚さと前記厚さ調整薄片の熱伝導率と当該厚さ調整薄片の厚さとから、前記被測定薄片の熱伝導率を求める被測定薄片熱伝導率導出工程と、を備えてもよい。   Further, before the measurement piece temperature distribution detecting step, the measurement piece is formed by laminating the measurement piece and one or more plate-shaped thickness adjustment pieces having a known thermal conductivity. The thermal conductivity of the measurement piece, the thickness of the measurement piece, the thickness of the measurement piece, and the heat conduction of the thickness adjustment piece obtained in the measurement piece forming step and the measurement piece thermal conductivity derivation step A measurement thin piece thermal conductivity deriving step for obtaining a thermal conductivity of the measurement target thin piece from the rate and the thickness of the thickness adjusting thin piece.

かかる構成によれば、被測定薄片と厚さ調整薄片とを積層して被測定片を作成することにより、一端部から他端部に向う熱流の通過する断面積を大きくして一端部から他端部まで流れる熱の温度勾配を演算に適した大きさとすることができ、これにより、薄く又は熱伝導率が小さな被測定片の熱伝導率も求めることができる。また、厚さ調整薄片を用いて被測定片を作成するため、被測定薄片が少なく被測定薄片のみを積層しても十分な厚さの被測定片を作成できない場合でも、この被測定薄片の熱伝導率を求めることができる。   According to such a configuration, the cross-sectional area through which the heat flow from one end to the other end is increased by laminating the measured thin piece and the thickness adjusting thin piece to create the measured piece. The temperature gradient of the heat flowing to the end can be set to a magnitude suitable for calculation, and thereby the thermal conductivity of the measurement piece that is thin or has a low thermal conductivity can also be obtained. In addition, since the specimen to be measured is prepared using the thickness adjustment thin piece, even when the specimen to be measured cannot be produced with a sufficient thickness even if only a few specimen thin pieces are laminated, Thermal conductivity can be determined.

以上より、本発明によれば、板状の被測定片を垂直配置や真空中に配置しなくても、当該被測定片の熱伝導率を求めることができる熱伝導率測定装置、熱伝導率演算装置、熱伝導率算出プログラム、及び熱伝導率測定方法を提供することができる。   As described above, according to the present invention, the thermal conductivity measuring device and the thermal conductivity capable of obtaining the thermal conductivity of the measurement piece without arranging the plate-like measurement piece in a vertical arrangement or in a vacuum. An arithmetic device, a thermal conductivity calculation program, and a thermal conductivity measurement method can be provided.

第1実施形態に係る熱伝導率測定装置に被測定片及び比較片を設置した状態の構造を概略的に示した平面図である。It is the top view which showed roughly the structure of the state which installed the to-be-measured piece and the comparison piece in the heat conductivity measuring apparatus which concerns on 1st Embodiment. 図1の熱伝導率測定装置の構造を概略的に示した正面図である。It is the front view which showed roughly the structure of the thermal conductivity measuring apparatus of FIG. 被測定片本体と厚さ調整薄片とを積層した被測定片の構成を説明するための図である。It is a figure for demonstrating the structure of the to-be-measured piece which laminated | stacked the to-be-measured piece main body and the thickness adjustment thin piece. 比較薄片を積層した比較片の構成を説明するための図である。It is a figure for demonstrating the structure of the comparison piece which laminated | stacked the comparison thin piece. 比較薄片を積層した比較片における比較薄片の組み合わせ毎の等価熱伝導率を示す図である。It is a figure which shows the equivalent thermal conductivity for every combination of the comparison thin piece in the comparison piece which laminated | stacked the comparison thin piece. 被測定片及び比較片の内部に温度センサを配置した構成を説明するための図である。It is a figure for demonstrating the structure which has arrange | positioned the temperature sensor inside a to-be-measured piece and a comparison piece. 被測定片及び比較片における各符号を説明するための図である。It is a figure for demonstrating each code | symbol in a to-be-measured piece and a comparison piece. 第2実施形態に係る熱伝導率測定装置に被測定片及び比較片を設置した状態の構造を概略的に示した平面図である。It is the top view which showed roughly the structure of the state which installed the to-be-measured piece and the comparison piece in the heat conductivity measuring apparatus which concerns on 2nd Embodiment. 図8の熱伝導率測定装置の構造を概略的に示した正面図である。It is the front view which showed schematically the structure of the thermal conductivity measuring apparatus of FIG. 図10(A)は、第3実施形態に係る熱伝導率測定装置に被測定片及び比較片を設置した状態の構造を概略的に示した正面図であり、図10(B)は、図10(A)の熱伝導率測定装置の測定部に断熱部材を設置した状態を示した図である。FIG. 10A is a front view schematically showing a structure in which a measurement piece and a comparison piece are installed in the thermal conductivity measurement device according to the third embodiment, and FIG. It is the figure which showed the state which installed the heat insulation member in the measurement part of the thermal conductivity measuring apparatus of 10 (A). 図10(B)のXI−XI断面図である。It is XI-XI sectional drawing of FIG. 10 (B). 第3実施形態の熱伝導率測定装置における温度センサ部の構造を概略的に示した平面図である。It is the top view which showed roughly the structure of the temperature sensor part in the thermal conductivity measuring apparatus of 3rd Embodiment. 他実施形態の温度検出部の構造を概略的に示した正面図である。It is the front view which showed schematically the structure of the temperature detection part of other embodiment. 他実施形態の温度検出部の構造を概略的に示した正面図である。It is the front view which showed schematically the structure of the temperature detection part of other embodiment. 他実施形態の測定部における取付部材を説明するための図であって、図15(A)は被測定片を設置する前の状態を示し、図15(B)は取付部材に被測定片を設置した状態を示す図である。It is a figure for demonstrating the attachment member in the measurement part of other embodiment, Comprising: FIG. 15 (A) shows the state before installing a to-be-measured piece, FIG.15 (B) shows a to-be-measured piece on an attachment member. It is a figure which shows the state installed. 他実施形態に係る熱伝導率測定装置に被測定片(又は比較片)を配置した状態の構造を概略的に示した平面図である。It is the top view which showed roughly the structure of the state which has arrange | positioned the to-be-measured piece (or comparison piece) in the thermal conductivity measuring apparatus which concerns on other embodiment. 他実施形態に係る熱伝導率測定装置に被測定片を配置した状態の構造を概略的に示した平面図である。It is the top view which showed roughly the structure of the state which has arrange | positioned the to-be-measured piece to the heat conductivity measuring apparatus which concerns on other embodiment. 軟質材料の熱伝導率を測定するときの被測定片の構造を説明するための図である。It is a figure for demonstrating the structure of the to-be-measured piece when measuring the heat conductivity of a soft material. 軟質材料の熱伝導率とこれを挟み込む厚さ調整薄片の厚さに対する被測定片の有効熱伝導率との関係を示す図である。It is a figure which shows the relationship between the thermal conductivity of a soft material, and the effective thermal conductivity of the to-be-measured piece with respect to the thickness of the thickness adjustment thin piece which pinches | interposes this. 従来の熱伝導率測定方法を説明するための図である。It is a figure for demonstrating the conventional thermal conductivity measuring method. 従来の熱伝導率測定方法を説明するための図である。It is a figure for demonstrating the conventional thermal conductivity measuring method.

以下、本発明の実施形態を図面を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<第1実施形態>
図1は、本発明の第1実施形態による熱伝導率測定装置に被測定片及び比較片を設置した状態の構造を概略的に示した平面図であり、図2は、図1に示した熱伝導率測定装置の構造を概略的に示した正面図である。
<First embodiment>
FIG. 1 is a plan view schematically showing a structure in which a measurement piece and a comparison piece are installed in the thermal conductivity measuring apparatus according to the first embodiment of the present invention, and FIG. 2 is shown in FIG. It is the front view which showed roughly the structure of the heat conductivity measuring apparatus.

まず、図1及び図2を参照して、本発明の第1実施形態による熱伝導率測定装置10の構成について説明する。   First, with reference to FIG.1 and FIG.2, the structure of the thermal conductivity measuring apparatus 10 by 1st Embodiment of this invention is demonstrated.

本実施形態の熱伝導率測定装置10は、板状の被測定片12の主面部12aに沿った方向の熱伝導率kを測定するものであり、図1及び図2に示すように、被測定片12と比較片16とを設置可能な測定部20と、被測定片12の熱伝導率kを算出する演算装置(熱伝導率演算装置)40と、を備える。 Thermal conductivity measuring apparatus 10 of the present embodiment is for measuring the thermal conductivity k 1 in the direction along the main surface portion 12a of the plate-shaped object to be measured pieces 12, as shown in FIGS. 1 and 2, A measurement unit 20 on which the measurement piece 12 and the comparison piece 16 can be installed, and a calculation device (thermal conductivity calculation device) 40 that calculates the thermal conductivity k 1 of the measurement piece 12 are provided.

測定部20に設置される被測定片12は、プリント基板や高熱伝導率のグラファイト板等の板状の部材である。被測定片12は、一方向に直線状に延びる細長い形状である。この被測定片12は、図1及び図2に示すように一端部13aが保持された状態で熱伝導率測定装置10に設置され、その長手方向の熱伝導率kが測定される。被測定片12は、単一の部材で構成される場合と、図3に示すように、被測定片本体(被測定薄片)14と、1又は複数の厚さ調整薄片15とを積層することにより構成される場合とがある。本実施形態の被測定片12は、図1において左右に長い矩形状を有し、例えば、長さが10mm〜1m、幅が5mm〜100mm、厚さが0.1mm〜10mmである。 The measurement target piece 12 installed in the measurement unit 20 is a plate-like member such as a printed board or a graphite plate having high thermal conductivity. The measurement target piece 12 has an elongated shape extending linearly in one direction. As shown in FIGS. 1 and 2, this piece 12 to be measured is installed in the thermal conductivity measuring device 10 with one end 13 a held, and the thermal conductivity k 1 in the longitudinal direction is measured. When the measured piece 12 is composed of a single member, and as shown in FIG. 3, the measured piece main body (measured thin piece) 14 and one or more thickness adjusting thin pieces 15 are laminated. May be configured. The to-be-measured piece 12 of this embodiment has a rectangular shape long in the left and right in FIG. 1, for example, a length of 10 mm to 1 m, a width of 5 mm to 100 mm, and a thickness of 0.1 mm to 10 mm.

厚さ調整薄片15は、被測定片本体14が薄くて当該熱伝導率k1aが測定できない場合又は被測定片本体14の熱伝導率k1aが小さ過ぎて当該熱伝導率k1aが測定できない場合に、この被測定片本体14と積層して被測定片本体14よりも熱伝導率kの大きな被測定片12を構成することにより、被測定片本体14の熱伝導率k1aの測定を可能にするためのものである。この厚さ調整薄片15は、熱伝導率kが既知の材質で形成されている。このため、被測定片本体14と厚さ調整薄片15とを積層した被測定片12の熱伝導率kを求めることができれば、この熱伝導率kから被測定片本体14の熱伝導率k1aを演算によって求めることができる。 Thickness adjusting flake 15 can not be measured is the thermal conductivity k 1a by the thermal conductivity k 1a of the measured piece body 14 thin or the thermal conductivity k 1a can not be measured under measurement element main body 14 is too small In this case, a measurement piece 12 having a larger thermal conductivity k than that of the measurement piece main body 14 is laminated with the measurement piece main body 14 to measure the thermal conductivity k 1a of the measurement piece main body 14. It is for making it possible. The thickness adjusting flake 15, the thermal conductivity k p is formed by a known material. Therefore, if the thermal conductivity k 1 of the measured piece 12 in which the measured piece main body 14 and the thickness adjusting thin piece 15 are laminated, the thermal conductivity of the measured piece main body 14 can be obtained from the thermal conductivity k 1. k 1a can be obtained by calculation.

本実施形態では、例えば、被測定片本体14は、長さが10mm〜1m、幅が5mm〜100mm、厚さが0.1mm〜10mmであり、厚さ調整薄片15は、長さが10mm〜1m、幅が5mm〜100mm、厚さが0.1mm〜10mmである。但し、被測定片本体14と厚さ調整薄片15とを積層した被測定片12が、上記のように、長さが10mm〜1m、幅が5mm〜100mm、厚さが0.1mm〜10mmとなるように、被測定片本体14と厚さ調整薄片15との長さ、幅、及び厚さがそれぞれ設定される。   In the present embodiment, for example, the measured piece main body 14 has a length of 10 mm to 1 m, a width of 5 mm to 100 mm, and a thickness of 0.1 mm to 10 mm, and the thickness adjusting flake 15 has a length of 10 mm to 10 mm. 1 m, width is 5 mm to 100 mm, and thickness is 0.1 mm to 10 mm. However, the measurement piece 12 in which the measurement piece main body 14 and the thickness adjusting thin piece 15 are laminated has a length of 10 mm to 1 m, a width of 5 mm to 100 mm, and a thickness of 0.1 mm to 10 mm as described above. In this manner, the length, width, and thickness of the measured piece main body 14 and the thickness adjusting thin piece 15 are set.

本実施形態の被測定片12では、被測定片本体14と厚さ調整薄片15とが両面テープ18により接着されているが、これに限定されず、接着剤等で接着されてもよい。   In the measured piece 12 of the present embodiment, the measured piece main body 14 and the thickness adjusting thin piece 15 are bonded by the double-sided tape 18, but the present invention is not limited thereto, and may be bonded by an adhesive or the like.

測定部20に設置される比較片16は、熱伝導率kが既知の板状部材であり、熱伝達率hを求めるために用いられる。即ち、本実施形態の熱伝導率測定装置10は、熱伝導率kが既知の比較片16から求めた当該比較片16の熱伝達率hを被測定片12の熱伝達率hと擬制し、この熱伝達率hを用いることで被測定片12の熱伝導率kを求める。これら熱伝達率hや熱伝導率kは部材の形状により変化するため、比較片16の形状は、被測定片12の形状と近似している(被測定片12と同じ形状を含む)ことが好ましい。 Comparison piece 16 installed in the measurement unit 20, the thermal conductivity k 2 are known plate-like member, used to determine the heat transfer coefficient h 2. That is, the thermal conductivity measuring device 10 of the present embodiment uses the heat transfer coefficient h 2 of the comparison piece 16 obtained from the comparison piece 16 having a known heat conductivity k 2 as the heat transfer coefficient h 1 of the measured piece 12. constructive and obtains a thermal conductivity k 1 of the measurement piece 12 by using the heat transfer coefficient h 2. Since the heat transfer coefficient h and the thermal conductivity k vary depending on the shape of the member, the shape of the comparison piece 16 may be approximate to the shape of the measurement piece 12 (including the same shape as the measurement piece 12). preferable.

比較片16は、図4(A)乃至図4(C)に示すように、熱伝導率kを調整することができるように複数(本実施形態では2枚)の比較薄片16a,16b,16c,…を積層することにより構成される。各比較薄片16a,16b,16c,…は、互いに熱伝導率k2a,k2b,k2c,…や厚さが異なる。このように互いに熱伝導率k2a,k2b,k2c,…や厚さの異なる比較薄片16a,16b,16c,…を組み合わせ可能とすることによって、後述する加熱時における比較片16の温度分布(温度勾配)を被測定片12の温度分布(温度勾配)に近づけることができる。これにより、比較片16の熱伝導率kと被測定片12の熱伝導率kとを近づけることができ、この熱伝導率kが既知の比較片16から求めた当該比較片16の熱伝達率hを利用して被測定片12の熱伝導率kを求めたときに、この被測定片12の熱伝導率kの精度を向上させることができる。 Comparison strip 16, as shown in FIG. 4 (A) through FIG. 4 (C), the plurality of (two in this embodiment) to be able to adjust the thermal conductivity k 2 comparison flakes 16a, 16b, It is comprised by laminating | stacking 16c. The comparative slices 16a, 16b, 16c,... Have different thermal conductivities k 2a , k 2b , k 2c,. As described above, the thermal conductivity k 2a , k 2b , k 2c ,... And the comparative thin pieces 16a, 16b, 16c,. The (temperature gradient) can be approximated to the temperature distribution (temperature gradient) of the measurement target piece 12. Thereby, the thermal conductivity k 2 of the comparison piece 16 and the thermal conductivity k 1 of the measurement piece 12 can be brought close to each other, and the thermal conductivity k 2 of the comparison piece 16 obtained from the known comparison piece 16 is obtained. When the thermal conductivity k 1 of the measured piece 12 is obtained using the heat transfer coefficient h 2 , the accuracy of the thermal conductivity k 1 of the measured piece 12 can be improved.

各比較薄片16a,16b,16c,…は、それぞれ熱伝導率k2a,k2b,k2c,…が既知の板状の部材である。これらの比較薄片16a,16b,16c,…は、互いに熱伝導率kや厚さが異なるように形成されている。本実施形態では、比較薄片として、銅板16aとアルミ板16bとSUS板16cとが用いられる。各比較薄片16a,16b,16cは、長さが15cm、幅が2cmであり、材質毎に1mmと0.5mmと0.2mmとの3種類の厚さのものが用意されている。 Each of the comparative slices 16a, 16b, 16c,... Is a plate-like member whose thermal conductivity k 2a , k 2b , k 2c,. These comparative thin pieces 16a, 16b, 16c,... Are formed so as to have different thermal conductivities k and thicknesses. In this embodiment, the copper plate 16a, the aluminum plate 16b, and the SUS plate 16c are used as a comparative thin piece. Each of the comparison thin pieces 16a, 16b, and 16c has a length of 15 cm and a width of 2 cm, and three types of thicknesses of 1 mm, 0.5 mm, and 0.2 mm are prepared for each material.

尚、本実施形態の熱伝導率測定装置10では、被測定片12の熱伝導率kを測定するときに比較片16の熱伝導率kが必要となるため、各比較薄片16a,16b,16cの組み合わせ毎に比較片16の等価熱伝導率kが予め求められている。本実施形態において各比較薄片16a,16b,16cを組み合わせたときの等価熱伝導率kは、図5及び以下の表1に示すような値となる。 In the thermal conductivity measuring apparatus 10 of the present embodiment, since the thermal conductivity k 2 of the comparative piece 16 is required when measuring the thermal conductivity k 1 of the measurement piece 12, the comparison slice 16a, 16b , equivalent thermal conductivity k 2 of the comparative piece 16 is obtained in advance for each combination of 16c. Equivalent thermal conductivity k 2 when combined each comparison slice 16a, 16b, and 16c in the present embodiment is a value as shown in Table 1 of FIG. 5 and the following.

Figure 0005646973
Figure 0005646973

本実施形態では、被測定片本体14と厚さ調整薄片15との接着と同様に、各比較薄片同士(例えば、16a,16b)が両面テープ18により接着されている。   In the present embodiment, each of the comparative thin pieces (for example, 16 a and 16 b) is bonded by the double-sided tape 18 in the same manner as the bonding of the measured piece main body 14 and the thickness adjusting thin piece 15.

測定部20は、被測定片12及び比較片16を保持する固定部22と、被測定片12及び比較片16の温度分布を検出する温度検出部(温度分布検出部)30と、固定部22に保持された被測定片12及び比較片16に送風するための送風手段37と、送風手段37から固定部22に保持された状態の被測定片12及び比較片16に向う空気の流れを均一にする整流板38と、を備える。   The measurement unit 20 includes a fixing unit 22 that holds the measurement piece 12 and the comparison piece 16, a temperature detection unit (temperature distribution detection unit) 30 that detects the temperature distribution of the measurement piece 12 and the comparison piece 16, and a fixation unit 22. The air flow toward the measurement piece 12 and the comparison piece 16 in a state of being held by the fixing unit 22 from the blower means 37 and the air blowing means 37 for blowing air to the measurement piece 12 and the comparison piece 16 held in And a rectifying plate 38.

固定部22は、被測定片12の長手方向の一端部(第1端部)13aを保持することにより当該被測定片12を固定する。また固定部22は、比較片16の長手方向の一端部(第3端部)17aを保持することにより当該比較片16を固定する。即ち、本実施形態の固定部22は、被測定片12と比較片16とを同時に保持することができる。具体的に、固定部22は、被測定片12と比較片16とが互いに平行で且つ主面部12a,16aが水平な姿勢となるように、被測定片12の第1端部13aと比較片16の第3端部17aとを上下方向から挟持することで当該被測定片12及び比較片16を固定する。このように、固定部22が被測定片12と比較片16とを並べて保持することにより、当該被測定片12及び比較片16の雰囲気条件が制御し易くなる。尚、本実施形態において、雰囲気条件とは被測定片12の周囲及び比較片16の周囲の風速や風向、温度等のことをいう。   The fixing portion 22 fixes the measurement piece 12 by holding one end portion (first end portion) 13a in the longitudinal direction of the measurement piece 12. The fixing portion 22 fixes the comparison piece 16 by holding one end portion (third end portion) 17 a in the longitudinal direction of the comparison piece 16. That is, the fixing portion 22 of this embodiment can hold the measured piece 12 and the comparison piece 16 at the same time. Specifically, the fixed portion 22 includes the first end portion 13a and the comparison piece of the measurement piece 12 such that the measurement piece 12 and the comparison piece 16 are parallel to each other and the main surface portions 12a and 16a are in a horizontal posture. The to-be-measured piece 12 and the comparison piece 16 are fixed by clamping the 16 3rd end part 17a from an up-down direction. As described above, the fixing portion 22 holds the measurement piece 12 and the comparison piece 16 side by side, so that the atmospheric conditions of the measurement piece 12 and the comparison piece 16 can be easily controlled. In the present embodiment, the atmospheric condition refers to the wind speed, wind direction, temperature, etc. around the measurement piece 12 and the comparison piece 16.

固定部22は、支持部23と押え部24とを有する。この固定部22では、支持部23の上端面23aに被測定片12の第1端部13a及び比較片16の第3端部17aを置いた状態で押え部24がこれら第1端部13a及び第3端部17aを上側から支持部23に対して押え付け、その状態で押え部24が支持部23に固定されることにより、被測定片12の第1端部13a及び比較片16の第3端部17aが挟持される。   The fixing part 22 has a support part 23 and a pressing part 24. In the fixing portion 22, the presser portion 24 has the first end portion 13 a and the first end portion 13 a of the measurement piece 12 and the third end portion 17 a of the comparison piece 16 placed on the upper end surface 23 a of the support portion 23. The third end portion 17a is pressed against the support portion 23 from above, and the presser portion 24 is fixed to the support portion 23 in this state, whereby the first end portion 13a of the measured piece 12 and the first end of the comparison piece 16 are fixed. The three end portions 17a are sandwiched.

支持部23は、台の上に載置され、又は、固定体に固定されている。本実施形態の支持部23は、断熱部材により形成されている。   The support portion 23 is placed on a table or fixed to a fixed body. The support part 23 of this embodiment is formed of a heat insulating member.

本実施形態の押え部24は、伝熱性を有する素材(例えば、金属等)で形成される押え部本体25と、通電等によって発熱する発熱体26と、を有する。押え部本体25は、図1において上下方向に長い直方体形状を有し、発熱体26は、柱形状を有する。そして、押え部本体25の中心部を長手方向に貫通する穴25aに発熱体26が嵌め込まれることで押え部24が構成される。これにより、固定部22が被測定片12の第1端部13a及び比較片16の第3端部17aを挟持(保持)した状態で発熱体26が発熱することにより、その熱が第1端部13a及び第3端部17aに伝わる。即ち、本実施形態の固定部22は、被測定片12の第1端部13a及び比較片16の第3端部17aを加熱する加熱部も兼ねている。この押え部24の四隅には、固定用ネジ27が配設されており、この固定用ネジ27によって押え部24が支持部23に対して着脱される。   The presser portion 24 of the present embodiment includes a presser portion main body 25 formed of a heat conductive material (for example, metal) and a heating element 26 that generates heat when energized. The presser body 25 has a rectangular parallelepiped shape that is long in the vertical direction in FIG. 1, and the heating element 26 has a column shape. The presser portion 24 is configured by fitting the heating element 26 into a hole 25a penetrating the central portion of the presser portion main body 25 in the longitudinal direction. Thereby, the heating element 26 generates heat in a state where the fixing portion 22 sandwiches (holds) the first end portion 13a of the measured piece 12 and the third end portion 17a of the comparison piece 16, so that the heat is transferred to the first end portion. It is transmitted to the portion 13a and the third end portion 17a. That is, the fixing portion 22 of the present embodiment also serves as a heating portion that heats the first end portion 13 a of the measurement target piece 12 and the third end portion 17 a of the comparison piece 16. Fixing screws 27 are disposed at the four corners of the pressing portion 24, and the pressing portion 24 is attached to and detached from the support portion 23 by the fixing screws 27.

温度検出部30は、被測定片12の温度分布を検出する第1検出部(被測定片温度分布検出部)32と、比較片16の温度分布を検出する第2検出部(比較片温度分布検出部)34と、を備える。   The temperature detection unit 30 includes a first detection unit (measurement piece temperature distribution detection unit) 32 that detects the temperature distribution of the measurement piece 12 and a second detection unit (comparison piece temperature distribution) that detects the temperature distribution of the comparison piece 16. Detection unit) 34.

第1検出部32は、被測定片12の第1端部13aから当該第1端部13aと反対側の端部(他端部)である第2端部13bに向う方向に沿って当該被測定片12の温度分布を検出し、第2検出部34は、比較片16の第3端部17aから当該第3端部17aと反対側の端部(他端部)である第4端部17bに向う方向に沿って当該比較片16の温度分布を検出する。   The first detection unit 32 extends along the direction from the first end 13a of the measured piece 12 toward the second end 13b that is the end (other end) opposite to the first end 13a. The temperature distribution of the measurement piece 12 is detected, and the second detection portion 34 is a fourth end portion that is an end portion (the other end portion) opposite to the third end portion 17a from the third end portion 17a of the comparison piece 16. The temperature distribution of the comparison piece 16 is detected along the direction toward 17b.

これら第1検出部32及び第2検出部34は、複数(本実施形態では5つ)の温度センサ36をそれぞれ有する。各温度センサ36は、被測定片12又は比較片16における当該温度センサ36の取り付けられた部位の温度を検出し、この温度に応じた信号を出力する。本実施形態の第1検出部32の各温度センサ36は、被測定片12に対して当該被測定片12の第1端部13aから第2端部13bに向かって間隔をおいて一列に並ぶように配置され、第2検出部34の各温度センサ36は、比較片16に対して当該比較片16の第3端部17aから第4端部17bに向って間隔をおいて一列に並ぶように配置される。これにより、本実施形態の第1検出部32は、被測定片12において、第1端部13aから第2端部13bに向って断続的な温度分布を検出する。同様に、本実施形態の第2検出部34は、比較片16において、第3端部17aから第4端部17bに向かって断続的な温度分布を検出する。   Each of the first detection unit 32 and the second detection unit 34 includes a plurality of (five in the present embodiment) temperature sensors 36. Each temperature sensor 36 detects the temperature of the part to which the temperature sensor 36 is attached in the measured piece 12 or the comparison piece 16, and outputs a signal corresponding to this temperature. The temperature sensors 36 of the first detection unit 32 according to the present embodiment are arranged in a line with respect to the measurement target piece 12 at an interval from the first end portion 13a of the measurement target piece 12 toward the second end portion 13b. The temperature sensors 36 of the second detection unit 34 are arranged in a line with respect to the comparison piece 16 at intervals from the third end 17a to the fourth end 17b of the comparison piece 16. Placed in. Thereby, the 1st detection part 32 of this embodiment detects intermittent temperature distribution in the to-be-measured piece 12 toward the 2nd end part 13b from the 1st end part 13a. Similarly, the second detection unit 34 of the present embodiment detects an intermittent temperature distribution from the third end 17a toward the fourth end 17b in the comparison piece 16.

これら各温度センサ36は、被測定片12又は比較片16の表面(主面部)12a,16aに接着等によって取り付けられるが、これに限定されず、図6に示すように、被測定片本体14と厚さ調整薄片15との間や、比較薄片(例えば16a,16b)同士の間に挟み込まれてもよい。このように温度センサ36が被測定片12や比較片16の内部に配設されると外乱の影響が抑えられ、これにより、被測定片12や比較片16の温度の検出精度が向上する。その結果、求める被測定片12の熱伝導率kの精度がより向上する。 Each of these temperature sensors 36 is attached to the surface (main surface portion) 12a, 16a of the measurement piece 12 or the comparison piece 16 by adhesion or the like, but is not limited thereto, and as shown in FIG. And the thickness adjusting thin piece 15 or between the comparative thin pieces (for example, 16a, 16b). Thus, when the temperature sensor 36 is disposed inside the measurement piece 12 or the comparison piece 16, the influence of disturbance is suppressed, thereby improving the temperature detection accuracy of the measurement piece 12 or the comparison piece 16. As a result, the accuracy of the thermal conductivity k 1 of the measured piece 12 to be obtained is further improved.

本実施形態では、温度センサ36として熱電対が用いられているが、これに限定されず、他の構成のセンサが用いられてもよい。また、本実施形態の温度センサ36は、接触式のセンサであるが、放射温度計等の非接触式のセンサであってもよい。   In the present embodiment, a thermocouple is used as the temperature sensor 36, but the present invention is not limited to this, and a sensor having another configuration may be used. The temperature sensor 36 of the present embodiment is a contact type sensor, but may be a non-contact type sensor such as a radiation thermometer.

送風手段37は、被測定片12及び比較片16の雰囲気条件を制御するものである。本実施形態では、送風手段37として送風ファンが用いられる。この送風ファン37は、風速を調整可能に構成され、固定部22に保持された状態の被測定片12及び比較片16の下方位置に配置される。具体的に、送風ファン37は、被測定片12及び比較片16の主面(下面)に対向するように配置、即ち、被測定片12及び比較片16の下面に向けて送風できるように配置されている。このため、送風ファン37が駆動することにより、被測定片12及び比較片16に対して下から上に向けて風が供給される。具体的に、送風ファン37は、被測定片12及び比較片16の固定部22に保持された部位以外の部位に対して下側から風を供給することにより、被測定片12及び比較片16の周囲の風速や風向き等を制御する。本実施形態の送風ファン37は、演算装置40に接続され、当該装置40の送風手段制御部48によって制御される。   The air blowing means 37 controls the atmospheric conditions of the measured piece 12 and the comparative piece 16. In the present embodiment, a blower fan is used as the blower unit 37. The blower fan 37 is configured to be capable of adjusting the wind speed, and is disposed at a position below the measurement piece 12 and the comparison piece 16 held by the fixing portion 22. Specifically, the blower fan 37 is disposed so as to face the main surface (lower surface) of the measured piece 12 and the comparison piece 16, that is, arranged so as to blow toward the lower surface of the measured piece 12 and the comparison piece 16. Has been. Therefore, when the blower fan 37 is driven, wind is supplied from the bottom to the top with respect to the measured piece 12 and the comparison piece 16. Specifically, the blower fan 37 supplies wind from the lower side to the parts other than the parts held by the fixing portions 22 of the measured piece 12 and the comparative piece 16, thereby measuring the measured piece 12 and the comparative piece 16. Controls the wind speed and direction around the. The blower fan 37 of the present embodiment is connected to the arithmetic device 40 and is controlled by the blower control unit 48 of the device 40.

整流板38は、送風ファン37から被測定片12の下面の各部位に供給される風、及び比較片16の下面の各部位に供給される風が一様となるようにするものであり、送風ファン37と共に被測定片12及び比較片16の雰囲気条件を制御するための雰囲気条件制御手段を構成する。   The rectifying plate 38 makes the air supplied from the blower fan 37 to each part on the lower surface of the measured piece 12 and the air supplied to each part on the lower surface of the comparison piece 16 uniform. Together with the blower fan 37, an atmospheric condition control means for controlling the atmospheric conditions of the measurement piece 12 and the comparison piece 16 is configured.

この整流板38は、送風ファン37と固定部22に保持された状態の被測定片12及び比較片16との間に配置される。詳しくは、整流板38は、送風ファン37と固定部22に保持された状態の被測定片12及び比較片16との中間位置において、送風ファン37と被測定片12及び比較片16との間を遮るように配置される。本実施形態では、整流板38として金網が用いられ、この整流板38は、送風ファン37と被測定片12及び比較片16との間で水平方向に沿って配置される。整流板38と送風ファン37との間に空間が形成されるように、整流板38と送風ファン37とは、互いに間隔をおいて配置される。この空間は、バッファー空間として機能する。即ち、バッファー空間が設けられることにより、整流板38を通過して被測定片12及び比較片16に供給される送風ファン37からの風がより均一になる。   The rectifying plate 38 is disposed between the measured piece 12 and the comparison piece 16 that are held by the blower fan 37 and the fixed portion 22. Specifically, the rectifying plate 38 is located between the blower fan 37 and the measured piece 12 and the comparison piece 16 at an intermediate position between the measured piece 12 and the comparison piece 16 held by the blower fan 37 and the fixing portion 22. It is arranged so as to block. In the present embodiment, a metal mesh is used as the rectifying plate 38, and the rectifying plate 38 is disposed along the horizontal direction between the blower fan 37, the measured piece 12, and the comparison piece 16. The rectifying plate 38 and the blower fan 37 are arranged at a distance from each other so that a space is formed between the rectifying plate 38 and the blower fan 37. This space functions as a buffer space. That is, by providing the buffer space, the wind from the blower fan 37 that passes through the rectifying plate 38 and is supplied to the measurement piece 12 and the comparison piece 16 becomes more uniform.

演算装置40は、測定部20で検出された被測定片12(又は、被測定片本体14)と比較片16との各温度分布から被測定片12(及び被測定片本体14)の熱伝導率k(及びk1a)を求める部位であり、記憶部42と、所定の演算を行う演算部50と、各種情報を入力するための入力部44と、演算部50での演算結果を表示する表示部46と、送風ファン37を制御するための送風手段制御部48と、を備える。 The arithmetic device 40 calculates the heat conduction of the measured piece 12 (and the measured piece main body 14) from each temperature distribution of the measured piece 12 (or the measured piece main body 14) and the comparison piece 16 detected by the measuring unit 20. This is a part for obtaining the rate k 1 (and k 1a ), and displays the storage unit 42, the calculation unit 50 that performs a predetermined calculation, the input unit 44 for inputting various information, and the calculation result in the calculation unit 50. And a blower control unit 48 for controlling the blower fan 37.

記憶部42は、各種情報が格納される部位であり、ハードディスク等で構成される。この記憶部42は、被測定片12の情報が格納される被測定片情報部42aと、比較片16の情報が格納される比較片情報部42bと、を有する。   The storage unit 42 is a part that stores various types of information, and includes a hard disk or the like. The storage unit 42 includes a measurement piece information unit 42 a in which information on the measurement piece 12 is stored, and a comparison piece information unit 42 b in which information on the comparison piece 16 is stored.

被測定片情報部42aは、被測定片12の形状に関する各値(以下、単に「被測定片12の形状」とも称する。)や物性値(例えば、被測定片12の厚さtや被測定片12の長さL等の後述する演算に必要な各値、また、被測定片12が被測定片本体14と厚さ調整薄片15とを積層したものである場合には、被測定片本体14の厚さt1aや被測定片本体14の長さL等の被測定片本体14の形状に関する各値、及び、各厚さ調整薄片15の物性値(熱伝導率k)や各厚さ調整薄片15の厚さt等の形状に関する各値)の情報が格納される。尚、被測定片12が被測定片本体14と厚さ調整薄片15とを積層したものである場合には、被測定片本体14と厚さ調整薄片15との各形状から求めることができる被測定片12の形状(例えば、被測定片12の厚さtや被測定片12の長さL等)は、入力部44から入力された被測定片本体14の形状と厚さ調整薄片15の形状とから演算部50において計算され、その演算結果が被測定片情報部42aに格納される。 Measured piece information unit 42a, each value relating to the shape of the measurement piece 12 (hereinafter, simply referred to as "profile of the measurement piece 12".) And physical properties (for example, the thickness t 1 of the measurement piece 12 to be Each value necessary for the later-described calculation such as the length L 1 of the measurement piece 12, and when the measurement piece 12 is a laminate of the measurement piece main body 14 and the thickness adjusting thin piece 15, the measurement target Values relating to the shape of the measured piece main body 14 such as the thickness t 1a of the piece main body 14 and the length L 1 of the measured piece main body 14, and physical properties (thermal conductivity k p ) of the respective thickness adjusting thin pieces 15 information of each value) are stored regarding or shape such as the thickness t p of each thickness adjusting slice 15. When the measured piece 12 is a laminate of the measured piece main body 14 and the thickness adjusting thin piece 15, the measured piece 12 can be obtained from each shape of the measured piece main body 14 and the thickness adjusting thin piece 15. The shape of the measurement piece 12 (for example, the thickness t 1 of the measurement piece 12, the length L 1 of the measurement piece 12, etc.) is the shape of the measurement piece main body 14 input from the input unit 44 and the thickness adjustment thin piece. The calculation result is calculated by the calculation unit 50 from the 15 shapes, and the calculation result is stored in the measured piece information unit 42a.

比較片情報部42bは、比較片16の形状に関する各値(以下、単に「比較片16の形状」とも称する。)や物性値(例えば、比較片の熱伝導率(等価熱伝導率)kや比較片16の厚さt等の各値、及び、比較片16を構成する各比較薄片16a,16b,16c,…の物性値や形状等)の情報が格納される。尚、各比較薄片16a,16b,16c,…の形状から求めることができる比較片16の形状(例えば、比較片16の厚さtや比較片16の長さL等)は、入力部44から入力された各比較薄片16a,16b,16c,…の形状に関する各値から演算部50において計算され、その演算結果が比較片情報部42bに格納される。 The comparison piece information section 42b has various values related to the shape of the comparison piece 16 (hereinafter also simply referred to as “the shape of the comparison piece 16”) and physical property values (for example, the thermal conductivity (equivalent thermal conductivity) of the comparison piece k 2. the thickness t 2 values, such as the and comparison piece 16, and, the comparison slice 16a constituting the comparison piece 16, 16b, 16c, is ... property value information and the shape) of the stored. The shape of the comparison piece 16 (for example, the thickness t 2 of the comparison piece 16 and the length L 2 of the comparison piece 16) that can be obtained from the shape of each of the comparison thin pieces 16a, 16b, 16c,. Are calculated in the calculation unit 50 from the values relating to the shapes of the respective comparison slices 16a, 16b, 16c,... Inputted from 44, and the calculation results are stored in the comparison piece information unit 42b.

演算部50は、種々の情報を処理可能ないわゆるコンピュータである。この演算部50には、所定のプログラムが組み込まれ、このプログラムの実行によって機能的に第1演算部(比較片熱伝達率導出部)52と、第2演算部(被測定片熱伝導率導出部)54と、出力部57と、が構成される。   The arithmetic unit 50 is a so-called computer capable of processing various types of information. A predetermined program is incorporated in the calculation unit 50, and the first calculation unit (comparison piece heat transfer coefficient deriving unit) 52 and the second calculation unit (derivation of measured piece heat conductivity) are functionally executed by executing the program. Part) 54 and an output part 57.

第1演算部52は、比較片16の単位長さ当たりの熱抵抗比(第1の熱抵抗比)mと、記憶部42(詳しくは比較片情報部42b)に格納されている比較片16の熱伝導率(等価熱伝導率)k等の物性値及び比較片16の形状と、第2検出部34により検出された比較片16の温度分布と、から当該比較片16の熱伝達率hを求める。 The first calculation unit 52 includes a comparison piece stored in the thermal resistance ratio (first thermal resistance ratio) m 2 per unit length of the comparison piece 16 and the storage unit 42 (specifically, the comparison piece information unit 42b). The heat transfer of the comparison piece 16 from the physical property value of the heat conductivity (equivalent heat conductivity) k 2 of 16 and the shape of the comparison piece 16 and the temperature distribution of the comparison piece 16 detected by the second detection unit 34. The rate h 2 is obtained.

具体的に、第1演算部52は、第2検出部34で検出された比較片16の長手方向の各位置における雰囲気温度(加熱していない状態の温度)からの上昇温度を測定して得られた上昇温度の温度分布と近似した曲線T(x)を最小二乗法により求め、以下の式(1)によって比較片16のフィン効率φexpを求める。

Figure 0005646973
ここで、Tは比較片16の固定部22側の根元温度であり、Lは、比較片16の長さである。 Specifically, the first calculation unit 52 is obtained by measuring the temperature rise from the ambient temperature (the temperature in the unheated state) at each position in the longitudinal direction of the comparison piece 16 detected by the second detection unit 34. A curve T (x) approximated to the temperature distribution of the obtained rising temperature is obtained by the least square method, and the fin efficiency φ exp of the comparison piece 16 is obtained by the following equation (1).
Figure 0005646973
Here, T 0 is the root temperature on the fixed portion 22 side of the comparison piece 16, and L 2 is the length of the comparison piece 16.

そして、第1演算部52は、この求められたフィン効率φexpと以下の式(2)とを比較することにより、比較片16の単位長さ当たりの熱抵抗比mを求める。

Figure 0005646973
ここで、Tは、比較片16の先端(第4の端部17b)の温度である。また、比較片16の熱抵抗比mは、比較片16の熱伝導抵抗(第2の熱伝導抵抗)Rcd2と、比較片16の熱伝達抵抗(第2の熱伝達抵抗)Rcv2との比に基づく値である。尚、図7に示すように、熱伝導抵抗(第2の熱伝導抵抗)Rcd2は、第3端部17aから第4端部17bに向って熱が流れるときの抵抗であり、熱伝達抵抗(第2の熱伝達抵抗)Rcv2は比較片16の表面から当該比較片16の周囲の空間に熱が出るときの抵抗である。これら、熱伝導抵抗Rcd2と熱伝達抵抗Rcv2とは、以下の式(3)及び式(4)から求めることができる。
Figure 0005646973
Figure 0005646973
ここで、図7に示すように、Aは比較片16の断面積であり、Sは比較片16の表面積であり、Pは比較片16の周囲長さ(=S/L)である。 The first operation unit 52, by comparing the thus determined fin efficiency phi exp with the following equation (2), determining the thermal resistance ratio m 2 per unit length of comparison piece 16.
Figure 0005646973
Here, TL is the temperature of the tip (fourth end 17 b) of the comparison piece 16. Further, the heat resistance ratio m 2 L 2 of the comparison piece 16 is equal to the heat conduction resistance (second heat conduction resistance) R cd2 of the comparison piece 16 and the heat transfer resistance (second heat transfer resistance) R of the comparison piece 16. It is a value based on the ratio with cv2 . As shown in FIG. 7, the heat conduction resistance (second heat conduction resistance) R cd2 is a resistance when heat flows from the third end portion 17a toward the fourth end portion 17b, and is a heat transfer resistance. (Second heat transfer resistance) R cv2 is a resistance when heat is generated from the surface of the comparison piece 16 to the space around the comparison piece 16. These heat conduction resistance R cd2 and heat transfer resistance R cv2 can be obtained from the following equations (3) and (4).
Figure 0005646973
Figure 0005646973
Here, as shown in FIG. 7, A 2 is the cross-sectional area of the comparison piece 16, S 2 is the surface area of the comparison piece 16, and P 2 is the peripheral length of the comparison piece 16 (= S 2 / L 2 ).

第1演算部52は、比較片16の単位長さ当たりの熱抵抗比mが求まると、この単位長さ当たりの熱抵抗比mと、比較片情報部42bに格納されている比較片16の熱伝導率(等価熱伝導率)kと形状と、から以下の式(5)により比較片16の熱伝達率hを算出する。

Figure 0005646973
First arithmetic unit 52, the thermal resistance ratio m 2 per unit length of comparison piece 16 is obtained, the thermal resistance ratio m 2 per the unit length, compared pieces stored in the comparison piece information unit 42b From the heat conductivity (equivalent heat conductivity) k 2 of 16 and the shape, the heat transfer coefficient h 2 of the comparison piece 16 is calculated by the following equation (5).
Figure 0005646973

第2演算部54は、被測定片12の単位長さ当たりの熱抵抗比mと、第1演算部52で求められた比較片16の熱伝達率(演算用熱伝達率)hと、第1検出部32により検出された被測定片12の温度分布(詳しくは、第1検出部32で検出された被測定片12の長さ方向の各位置における雰囲気温度(加熱していない状態の温度)からの上昇温度を測定して得られた上昇温度の温度分布)と、から当該被測定片12の熱伝導率kを求める。 The second calculation unit 54 includes a thermal resistance ratio m 1 per unit length of the measured piece 12, a heat transfer coefficient (calculation heat transfer coefficient) h 2 of the comparison piece 16 obtained by the first calculation unit 52, and , The temperature distribution of the measurement piece 12 detected by the first detection unit 32 (specifically, the ambient temperature at each position in the length direction of the measurement piece 12 detected by the first detection unit 32 (in an unheated state) and temperature distribution) of the elevated temperature and elevated temperature obtained by measuring from temperature) to obtain the thermal conductivity k 1 of the measured pieces 12 from.

具体的に、この第2演算部54は、第1導出部55と、第2導出部56と、を備える。ここで被測定片12の単位長さ当たりの熱抵抗比mは、比較片16の単位長さ当たりの熱抵抗比mと同様の以下の式(6)により定義される。

Figure 0005646973
ここで、図7に示すように、Lは被測定片12の長さであり、Aは被測定片12の断面積であり、Sは被測定片12の表面積であり、Pは被測定片12の周囲長さ(=S/L)である。また、被測定片12の熱抵抗比mは、被測定片12の熱伝導抵抗(第1の熱伝導抵抗)Rcd1と、被測定片12の熱伝達抵抗(第1の熱伝達抵抗)Rcv1との比に基づく値である。尚、熱伝導抵抗Rcd1は、第1端部13aから第2端部13bに向って熱が流れるときの抵抗であり、熱伝達抵抗Rcv1は被測定片12の表面から当該被測定片12の周囲の空間に熱が出るときの抵抗である。これら熱伝導抵抗Rcd1と熱伝達抵抗Rcv1とは、式(3)及び式(4)と同様の式から求められる。 Specifically, the second calculation unit 54 includes a first derivation unit 55 and a second derivation unit 56. Here, the thermal resistance ratio m 1 per unit length of the measured piece 12 is defined by the following equation (6) similar to the thermal resistance ratio m 2 per unit length of the comparison piece 16.
Figure 0005646973
Here, as shown in FIG. 7, L 1 is the length of the measured piece 12, A 1 is the cross-sectional area of the measured piece 12, S 1 is the surface area of the measured piece 12, and P 1 Is the peripheral length of the measurement piece 12 (= S 1 / L 1 ). Further, the thermal resistance ratio m 1 L 1 of the measured piece 12 is equal to the thermal conduction resistance (first thermal conduction resistance) R cd1 of the measured piece 12 and the heat transfer resistance (first heat transfer) of the measured piece 12. Resistance) A value based on a ratio to R cv1 . The heat conduction resistance R cd1 is a resistance when heat flows from the first end 13a to the second end 13b, and the heat transfer resistance R cv1 is from the surface of the measurement piece 12 to the measurement piece 12. It is the resistance when heat is generated in the space around. The heat conduction resistance R cd1 and the heat transfer resistance R cv1 are obtained from the same expressions as the expressions (3) and (4).

第1導出部55は、被測定片12の単位長さ当たりの熱抵抗比mと、第1演算部52で求められた比較片16の熱伝達率hと、第1検出部32で検出された被測定片12の温度分布と、から当該被測定片12の熱伝導率kを求める。詳しくは、第1導出部55は、第1検出部32で検出された被測定片12の温度分布から式(1)により被測定片12のフィン効率φexpを求める。そして、第1導出部55は、第1演算部52と同様に、求めたフィン効率φexpと式(2)とを比較することにより、被測定片12の単位長さ当たりの熱抵抗比mを求める。 The first deriving unit 55 includes the thermal resistance ratio m 1 per unit length of the measurement target piece 12, the heat transfer coefficient h 2 of the comparison piece 16 obtained by the first calculation unit 52, and the first detection unit 32. From the detected temperature distribution of the measured piece 12, the thermal conductivity k 1 of the measured piece 12 is obtained. Specifically, the first deriving unit 55 obtains the fin efficiency φ exp of the measurement target piece 12 from the temperature distribution of the measurement target piece 12 detected by the first detection unit 32 using Equation (1). Then, the first deriving unit 55 compares the calculated fin efficiency φ exp with the formula (2), similarly to the first calculation unit 52, to thereby determine the thermal resistance ratio m per unit length of the measurement target piece 12. Find 1

第1導出部55は、被測定片12の単位長さ当たりの熱抵抗比mが求まると、この単位長さ当たりの熱抵抗比mと、第1演算部52で求めた比較片16の熱伝達率(演算用熱伝達率)hと、被測定片情報部42aに格納されている被測定片12の形状とから、以下の式(7)により被測定片12の熱伝導率kを算出する。

Figure 0005646973
First derivation unit 55, the thermal resistance ratio m 1 per unit length of the measurement piece 12 is obtained, the thermal resistance ratio m 1 per the unit length, compared pieces obtained in the first arithmetic unit 52 16 heat transfer rate (the calculation heat transfer coefficient) h 2, the thermal conductivity of the measurement piece 12 by the shape of the measured pieces 12 that are stored in the measured piece information section 42a, the following equation (7) k 1 is calculated.
Figure 0005646973

第2導出部56は、被測定片12が被測定片本体14と1又は複数の厚さ調整薄片15とを積層することにより構成されている場合、即ち、被測定片本体14に関する情報(形状)や厚さ調整薄片15に関する情報(物性値及び形状)が記憶部42入力されている場合に、第1導出部55で求められた被測定片12の熱伝導率kに基づいて、被測定片本体14の熱伝導率k1aを求める。 The second derivation unit 56 is configured so that the measured piece 12 is configured by laminating the measured piece main body 14 and one or more thickness adjusting thin pieces 15, that is, information (shape) about the measured piece main body 14. ) if and information about thickness adjusting lamina 15 (physical properties and shape) are stored unit 42 inputs, based on the thermal conductivity k 1 of the measurement piece 12 obtained by the first derivation unit 55, the The thermal conductivity k 1a of the measurement piece main body 14 is obtained.

具体的に、第2導出部56は、記憶部42(被測定片情報部42a)に被測定片本体14の形状や厚さ調整薄片15の物性値及び形状が格納されていると判断した場合には、第1導出部55で求められた被測定片12の熱伝導率kと、被測定片情報部42aに格納されている被測定片12の厚さtと、被測定片本体14の厚さt1aと、厚さ調整薄片15の熱伝導率kと、厚さ調整薄片15の厚さtとから以下の式(8)により被測定片本体14の熱伝導率k1aを算出する。

Figure 0005646973
Specifically, when the second derivation unit 56 determines that the storage unit 42 (measurement piece information unit 42a) stores the shape of the measurement piece main body 14 and the physical property value and shape of the thickness adjustment thin piece 15. Includes the thermal conductivity k 1 of the measured piece 12 obtained by the first deriving unit 55, the thickness t 1 of the measured piece 12 stored in the measured piece information unit 42 a, and the measured piece body From the thickness t 1a of 14, the thermal conductivity k p of the thickness adjustment thin piece 15, and the thickness t p of the thickness adjustment thin piece 15, the thermal conductivity k of the measured piece main body 14 according to the following equation (8): 1a is calculated.
Figure 0005646973

尚、本実施形態では、第2演算部54(詳しくは第2導出部56)が記憶部42に被測定片本体14の形状等が格納されているか否かにより、被測定片12が単一の部材で形成されているか、被測定片本体14と厚さ調整薄片15とを積層したものかを判断しているが、切り換えスイッチ等を設け、これを切り換えることにより被測定片12が単一の部材か積層体かを熱伝導率測定装置10が判断するように構成されてもよい。   In the present embodiment, the second measuring unit 54 (specifically, the second deriving unit 56) determines whether the measured piece 12 is a single unit depending on whether or not the shape of the measured piece main body 14 is stored in the storage unit 42. It is determined whether it is formed of the above-mentioned members or a laminate of the measured piece main body 14 and the thickness adjusting thin piece 15. It may be configured such that the thermal conductivity measuring device 10 determines whether the member is a laminated body.

出力部57は、第1導出部55における演算結果又は第2導出部56における演算結果を表示部46に出力する。具体的に、出力部57は、入力部44から入力されて記憶部42に格納されている被測定片12の情報に基づき、被測定片12が単一の部材で形成されている場合には、第1導出部55の演算結果を表示部46に出力する一方、被測定片12が被測定片本体14と厚さ調整薄片15とを積層したものである場合には、第2導出部56の演算結果を表示部46に出力する。尚、出力部57は、被測定片12が被測定片本体14と厚さ調整薄片15とを積層したものである場合に、第2導出部56の演算結果と共に第1導出部55の演算結果を表示部46に出力してもよい。   The output unit 57 outputs the calculation result in the first derivation unit 55 or the calculation result in the second derivation unit 56 to the display unit 46. Specifically, the output unit 57 is based on the information of the measured piece 12 that is input from the input unit 44 and stored in the storage unit 42, when the measured piece 12 is formed of a single member. When the calculation result of the first deriving unit 55 is output to the display unit 46, while the measured piece 12 is a laminate of the measured piece main body 14 and the thickness adjusting thin piece 15, the second deriving unit 56. Is output to the display unit 46. The output unit 57 calculates the calculation result of the first derivation unit 55 together with the calculation result of the second derivation unit 56 when the measurement piece 12 is a laminate of the measurement piece main body 14 and the thickness adjusting thin piece 15. May be output to the display unit 46.

入力部44は、キーボードやタッチパネル等で構成され、被測定片12及び比較片16に関する情報等を入力する部位である。具体的に、入力部44は、被測定片12や比較片16の形状や物性値等の情報を入力し、これら情報を記憶部42に格納させる。本実施形態では、入力部44は、被測定片12の厚さt、被測定片本体14の厚さt1a、厚さ調整薄片15の熱伝導率k、厚さ調整薄片15の厚さt、比較片16の熱伝導率(等価熱伝導率)k、比較片16の厚さt等を入力する。 The input unit 44 includes a keyboard, a touch panel, and the like, and is a part for inputting information on the measurement target piece 12 and the comparison piece 16. Specifically, the input unit 44 inputs information such as the shape and physical property values of the measurement target piece 12 and the comparison piece 16 and stores the information in the storage unit 42. In the present embodiment, the input unit 44 includes the thickness t 1 of the measured piece 12, the thickness t 1a of the measured piece main body 14, the thermal conductivity k p of the thickness adjusting thin piece 15, and the thickness of the thickness adjusting thin piece 15. The length t p , the thermal conductivity (equivalent thermal conductivity) k 2 of the comparison piece 16, the thickness t 2 of the comparison piece 16, and the like are input.

表示部46は、演算装置40(演算部50)での演算結果を受けて被測定片12(及び被測定片本体14)の熱伝導率k(及びk1a)を出力(表示)する。本実施形態の表示部46は、演算結果を画面に表示するが、印字等によって出力(表示)するように構成されてもよい。 The display unit 46 outputs (displays) the thermal conductivity k 1 (and k 1a ) of the measurement target piece 12 (and the measurement target main body 14) in response to the calculation result of the calculation device 40 (calculation unit 50). The display unit 46 of the present embodiment displays the calculation result on the screen, but may be configured to output (display) by printing or the like.

送風手段制御部48は、被測定片12及び比較片16に所定の風速で風が供給されるように送風ファン37を制御する。本実施形態の送風手段制御部48は、演算装置40に設けられているが、これに限定されず、他の装置等に設けられてもよい。   The blower control unit 48 controls the blower fan 37 so that wind is supplied to the measured piece 12 and the comparison piece 16 at a predetermined wind speed. Although the air blower control part 48 of this embodiment is provided in the arithmetic unit 40, it is not limited to this, You may provide in another apparatus.

このように構成される熱伝導率測定装置10では、以下のようにして被測定片12(及び被測定片本体14)の熱伝導率k(及びk1a)が測定される。 In the thermal conductivity measuring device 10 configured as described above, the thermal conductivity k 1 (and k 1a ) of the measured piece 12 (and the measured piece main body 14) is measured as follows.

先ず、比較片16を構成する比較薄片16a,16b,…の組み合わせを決定する。   First, the combination of the comparison thin pieces 16a, 16b,... Constituting the comparison piece 16 is determined.

具体的に、被測定片12と、比較薄片16a,16b,…を任意に組み合わせた比較片16とが用意され、これら被測定片12と比較片16との温度を測定する各部位に温度センサ36がそれぞれ貼り付けられる。詳しくは、温度センサ36が被測定片12及び比較片16の主面部12a,16aにおいて一端部13a,17aから他端部13b,17bに向けて等間隔で一列に並ぶように貼り付けられる。各温度センサ36が貼り付けられた被測定片12及び比較片16は、被測定片12の第1端部13aと比較片16の第3端部17aとを固定部22に保持させ、これにより測定部20に設置される。この状態で、固定部22の発熱体26を発熱させることにより、被測定片12の第1端部13aと比較片16の第3端部17aとが加熱される。   Specifically, a measurement piece 12 and a comparison piece 16 in which comparison thin pieces 16a, 16b,... Are arbitrarily combined are prepared, and a temperature sensor is provided at each part for measuring the temperature of the measurement piece 12 and the comparison piece 16. 36 are pasted respectively. Specifically, the temperature sensors 36 are attached so as to be arranged in a line at equal intervals from the one end portions 13a, 17a to the other end portions 13b, 17b in the main surface portions 12a, 16a of the measured piece 12 and the comparison piece 16. The piece 12 to be measured and the comparison piece 16 to which each temperature sensor 36 is attached have the first end 13a of the piece 12 to be measured and the third end 17a of the comparison piece 16 held by the fixing portion 22, thereby Installed in the measurement unit 20. In this state, the first end portion 13a of the measurement piece 12 and the third end portion 17a of the comparison piece 16 are heated by causing the heating element 26 of the fixed portion 22 to generate heat.

演算装置40の送風手段制御部48は、被測定片12と比較片16との加熱が始まると、送風ファン37を駆動させて被測定片12及び比較片16に送風する。これにより、被測定片12と比較片16とにおける固定部22に保持された部位以外の部位、即ち、露出した部分には、水平方向において均一な風が供給され、同じ雰囲気条件下で被測定片12と比較片16とが加熱される。   When the measurement target piece 12 and the comparison piece 16 start to be heated, the blower control unit 48 of the arithmetic device 40 drives the blower fan 37 to blow air to the measurement piece 12 and the comparison piece 16. As a result, a portion other than the portion held by the fixing portion 22 in the measured piece 12 and the comparison piece 16, that is, the exposed portion, is supplied with uniform wind in the horizontal direction and is measured under the same atmospheric conditions. The piece 12 and the comparison piece 16 are heated.

この状態で、温度検出部30の第1検出部32が被測定片12の第1端部13aから第2端部13bまでの温度分布を検出すると共に、第2検出部34が比較片16の第3端部17aから第4端部17bまでの温度分布を検出する。詳しくは、第1検出部32の各温度センサ36が測定部位における雰囲気温度(加熱していない状態の温度)から上昇した分の温度(上昇温度)を検出することにより、第1検出部32は、被測定片12の第1端部13aから第2端部13bまでの上昇温度の温度分布を検出する。同様に、第2検出部34の各温度センサ36が測定部位における雰囲気温度(加熱していない状態の温度)から上昇した分の温度(上昇温度)を検出することにより、第2検出部34は、比較片16の第3端部17aから第4端部17bまでの上昇温度の温度分布を検出する。   In this state, the first detection unit 32 of the temperature detection unit 30 detects the temperature distribution from the first end 13a to the second end 13b of the measured piece 12, and the second detection unit 34 detects the temperature distribution of the comparison piece 16. A temperature distribution from the third end 17a to the fourth end 17b is detected. Specifically, each temperature sensor 36 of the first detection unit 32 detects the temperature (increased temperature) that is increased from the ambient temperature (the temperature in the unheated state) at the measurement site, whereby the first detection unit 32 is The temperature distribution of the rising temperature from the first end 13a to the second end 13b of the measured piece 12 is detected. Similarly, when each temperature sensor 36 of the second detection unit 34 detects the temperature (increased temperature) that is increased from the ambient temperature (temperature in a state of not being heated) at the measurement site, the second detection unit 34 is The temperature distribution of the rising temperature from the third end 17a to the fourth end 17b of the comparison piece 16 is detected.

このとき、被測定片12の温度分布の熱勾配と比較片16の温度分布の熱勾配とが大きく異なると、求める被測定片12の熱伝導率kの誤差が大きくなるため、比較片16を構成する比較薄片16a,16b,…の組み合わせが変更される。具体的には、上述のように予め求めておいた種々の組み合わせにおける等価熱伝導率(図5及び表1参照)から、温度分布が被測定片12の温度分布と近くなるような(詳しくは、長手方向の各位置における被測定片12と比較片16との温度差が所定の値以下となるような)組み合わせが選択され、比較片16を構成する比較薄片の組み合わせが決定される。 At this time, when the thermal gradient of the temperature distribution of the comparative piece 16 and the thermal gradient of the temperature distribution of the measurement piece 12 are significantly different, since the error of the thermal conductivity k 1 of the measurement piece 12 is increased to obtain, compared piece 16 The combination of the comparative thin pieces 16a, 16b,. Specifically, from the equivalent thermal conductivity (see FIG. 5 and Table 1) in various combinations obtained in advance as described above, the temperature distribution is close to the temperature distribution of the measurement target piece 12 (in detail, The combination is selected so that the temperature difference between the measured piece 12 and the comparison piece 16 at each position in the longitudinal direction is equal to or less than a predetermined value, and the combination of the comparison thin pieces constituting the comparison piece 16 is determined.

尚、比較片16を構成する比較薄片16a,16b,…の組み合わせを変更するときには、測定部20から比較片16が取り外され、この比較片16から当該比較片16に取り付けられている各温度センサ36が取り外される。そして、組み合わせを変更した後の比較片16の各温度測定位置に温度センサ36がそれぞれ取り付けられたあと、比較片16が測定部20に設置される。   When the combination of the comparison thin pieces 16a, 16b,... Constituting the comparison piece 16 is changed, each of the temperature sensors attached to the comparison piece 16 from the comparison piece 16 is removed from the measurement unit 20. 36 is removed. And after the temperature sensor 36 is each attached to each temperature measurement position of the comparison piece 16 after changing a combination, the comparison piece 16 is installed in the measurement part 20. FIG.

一方、被測定片12に関する情報と比較片16に関する情報とが入力部44から演算装置40に入力される。具体的に、被測定片12の形状(例えば、被測定片12の長さLと、被測定片12の断面積Aと、被測定片12の周囲の長さP(=S/L)等)が入力部44から入力され、記憶部42の被測定片情報部42aに格納される。 On the other hand, information regarding the measurement piece 12 and information regarding the comparison piece 16 are input from the input unit 44 to the arithmetic device 40. Specifically, the shape of the piece 12 to be measured (for example, the length L 1 of the piece 12 to be measured, the cross-sectional area A 1 of the piece 12 to be measured, and the length P 1 around the piece 12 to be measured (= S 1 / L 1 ) etc. is input from the input unit 44 and stored in the measured piece information unit 42 a of the storage unit 42.

被測定片12が被測定片本体14と厚さ調整薄片15との積層体の場合は、被測定片本体14の形状と厚さ調整薄片15の物性値及び形状とが入力部44からそれぞれ入力され、被測定片情報部42aに格納される。このとき、これら被測定片本体14と厚さ調整薄片15との形状から計算により求めることができる被測定片12の形状(例えば、被測定片12の厚さt等)は、前記入力された被測定片本体14の形状と厚さ調整薄片15の形状とから計算されて被測定片情報部42aに格納される。 When the measured piece 12 is a laminate of the measured piece main body 14 and the thickness adjusting thin piece 15, the shape of the measured piece main body 14 and the physical property value and shape of the thickness adjusting thin piece 15 are input from the input unit 44. And stored in the measured piece information section 42a. At this time, the shape of the measured piece 12 (for example, the thickness t 1 of the measured piece 12 etc.) that can be obtained by calculation from the shapes of the measured piece main body 14 and the thickness adjusting thin piece 15 is input as described above. The shape of the measured piece main body 14 and the shape of the thickness adjusting thin piece 15 are calculated and stored in the measured piece information section 42a.

また、比較片16の熱伝導率(等価熱伝導率)k、比較片16の長さLと、比較片16の断面積Aと、比較片16の周囲の長さP(=S/L)と、が入力部44から入力され、記憶部42の比較片情報部42bに格納される。 Further, the thermal conductivity (equivalent thermal conductivity) k 2 of the comparison piece 16, the length L 2 of the comparison piece 16, the cross-sectional area A 2 of the comparison piece 16, and the length P 2 around the comparison piece 16 (= S 2 / L 2 ) is input from the input unit 44 and stored in the comparison piece information unit 42 b of the storage unit 42.

次に、比較片16の組み合わせが決定され、この比較片16と被測定片12とが測定部20に設置されると、固定部22により、被測定片12の第1端部13a及び比較片16の第3端部17aが加熱される。このとき、前記同様、送風手段制御部48が送風ファン37を制御して被測定片12及び比較片16に送風を行う。そして、温度検出部30により被測定片12の温度分布と比較片16の温度分布とが検出される。   Next, when the combination of the comparison piece 16 is determined and the comparison piece 16 and the measurement piece 12 are installed in the measurement unit 20, the first end portion 13 a of the measurement piece 12 and the comparison piece are fixed by the fixing unit 22. Sixteen third end portions 17a are heated. At this time, similarly to the above, the blower control unit 48 controls the blower fan 37 to blow air to the measured piece 12 and the comparison piece 16. The temperature detection unit 30 detects the temperature distribution of the measurement piece 12 and the temperature distribution of the comparison piece 16.

このように、被測定片12及び比較片16の形状及び物性値が記憶部42に格納された状態で、被測定片12及び比較片16の温度分布が検出されると、第1演算部52は、第2検出部34が検出した比較片16の温度分布と式(1)とから比較片16のフィン効率φexpを求め、このフィン効率φexpと式(2)とから比較片16の単位長さ当たりの熱抵抗比mを求める。そして、第1演算部52は、この求めた単位長さ当たりの熱抵抗比mと記憶部42に格納されている比較片16の熱伝導率kとに基づいて式(5)から比較片16の熱伝達率hを算出する。 As described above, when the temperature distribution of the measurement piece 12 and the comparison piece 16 is detected in a state where the shape and the property values of the measurement piece 12 and the comparison piece 16 are stored in the storage unit 42, the first calculation unit 52. Calculates the fin efficiency φ exp of the comparison piece 16 from the temperature distribution of the comparison piece 16 detected by the second detection unit 34 and the equation (1), and the fin efficiency φ exp of the comparison piece 16 from the fin efficiency φ exp and the equation (2). The thermal resistance ratio m 2 per unit length is obtained. The first operation unit 52, compares the equation (5) based on the thermal resistance ratio m 2 per unit length thus determined and the thermal conductivity k 2 of the comparative pieces 16 stored in the storage unit 42 calculating a heat transfer coefficient h 2 pieces 16.

第1演算部52が比較片16の熱伝達率hを求めると、第2演算部54の第1導出部55は、第1検出部32が検出した被測定片12の温度分布と式(1)とから被測定片12のフィン効率φexpを求め、このフィン効率φexpと式(2)とから被測定片12の単位長さ当たりの熱抵抗比mを求める。第1導出部55は、この被測定片12の単位長さ当たりの熱抵抗比mが求まると、この単位長さ当たりの熱抵抗比mと第1演算部52が求めた比較片16の熱伝達率hとを用いて式(7)から被測定片12の熱伝導率kを算出する。 When the first calculation unit 52 calculates the heat transfer coefficient h 2 of the comparison piece 16, the first derivation unit 55 of the second calculation unit 54 calculates the temperature distribution of the measured piece 12 detected by the first detection unit 32 and the equation ( 1), the fin efficiency φ exp of the measured piece 12 is obtained, and the thermal resistance ratio m 1 per unit length of the measured piece 12 is obtained from the fin efficiency φ exp and the expression (2). First derivation unit 55, the thermal resistance ratio m 1 per unit length of the measured strip 12 is obtained, compared pieces with thermal resistance ratio m 1 per the unit length is first arithmetic unit 52 calculated 16 The thermal conductivity k 1 of the piece 12 to be measured is calculated from the equation (7) using the heat transfer coefficient h 2 .

被測定片12が単一の部材で構成されている場合には、第1導出部55が被測定片12の熱伝導率kを求めると、出力部57がこの演算結果を表示部46に出力する。そして、表示部46は、この出力部57から送られてきた演算結果を表示する。 When the measured piece 12 is composed of a single member, when the first derivation unit 55 obtains the thermal conductivity k 1 of the measured piece 12, the output unit 57 displays the calculation result on the display unit 46. Output. The display unit 46 displays the calculation result sent from the output unit 57.

一方、被測定片12が被測定片本体14と厚さ調整薄片15とを積層することにより構成されている場合には、第2導出部56がさらに演算を行って被測定片本体14の熱伝導率k1aを導出する。具体的に、第2導出部56は、記憶部42の被測定片情報部42aに格納されている情報に基づいて被測定片12が被測定片本体14と厚さ調整薄片15とにより構成されていると判断すると、第1導出部55が求めた被測定片12の熱伝導率kと、被測定片情報部42aに格納されている被測定片12の厚さtと、被測定片本体14の厚さt1aと、厚さ調整薄片15の熱伝導率k及び厚さtとを用いて式(8)から被測定片本体14の熱伝導率k1aを算出する。 On the other hand, when the measured piece 12 is configured by laminating the measured piece main body 14 and the thickness adjusting thin piece 15, the second derivation unit 56 performs further calculation to calculate the heat of the measured piece main body 14. The conductivity k 1a is derived. Specifically, in the second deriving unit 56, the measured piece 12 is configured by the measured piece main body 14 and the thickness adjusting thin piece 15 based on the information stored in the measured piece information unit 42 a of the storage unit 42. If it is determined, the thermal conductivity k 1 of the measured piece 12 obtained by the first deriving unit 55, the thickness t 1 of the measured piece 12 stored in the measured piece information section 42a, and the measured value the thickness t 1a pieces body 14, calculates the thermal conductivity k 1a of the measured element body 14 from the equation (8) using a thermal conductivity k p and the thickness t p of the thickness adjusting slice 15.

出力部57は、第2導出部56で演算が行われた場合には、第2導出部56の演算結果(被測定片本体14の熱伝導率k1a)を表示部46に出力する。このとき、出力部57が第2導出部56の演算結果(被測定片本体14の熱伝導率k1a)と共に第1導出部55の演算結果(被測定片12の熱伝導率k)を表示部46に出力するように構成されてもよい。そして、表示部46は、この出力部57から送られてきた演算結果(被測定片本体14の熱伝導率k1a、被測定片12の熱伝導率k)等を表示する。 When the calculation is performed by the second derivation unit 56, the output unit 57 outputs the calculation result of the second derivation unit 56 (the thermal conductivity k 1a of the measured piece main body 14) to the display unit 46. At this time, the output unit 57 outputs the calculation result of the second deriving unit 56 (the thermal conductivity k 1a of the measured piece main body 14) together with the calculation result of the first deriving unit 55 (the thermal conductivity k 1 of the measured piece 12). It may be configured to output to the display unit 46. Then, the display unit 46, (the thermal conductivity k 1a of the measured piece body 14, the thermal conductivity k 1 of the measurement piece 12) calculation result sent from the output unit 57 displays the like.

以上説明したように、第1実施形態の熱伝導率測定装置10によれば、熱伝導率kが既知の比較片16を利用して求めた当該比較片16の熱伝達率hを演算用熱伝達率として利用することにより、垂直配置の板状の被測定片に対する自然対流式や放射式といった計算式を用いた演算によって被測定片12の熱伝達率hを算出しなくても、被測定片12の熱伝導率kを求めることができる。 As described above, according to the thermal conductivity measuring device 10 of the first embodiment, the heat transfer coefficient h 2 of the comparison piece 16 obtained using the comparison piece 16 having the known thermal conductivity k 2 is calculated. By using this as the heat transfer coefficient for the operation, it is not necessary to calculate the heat transfer coefficient h 1 of the measured piece 12 by calculation using a calculation formula such as a natural convection formula or a radiation formula for the plate-shaped measured piece arranged vertically. The thermal conductivity k 1 of the measured piece 12 can be obtained.

具体的に、被測定片12の熱伝達率hと、被測定片12の温度分布から求められる被測定片12の単位長さ当たりの熱抵抗比mとが分れば、これらを利用して被測定片12の熱伝導率kを求めることができる。そこで、熱伝導率kが既知の比較片16を用いて、この比較片16の熱伝導率kと温度分布とから当該比較片16の熱伝達率hを求め、この熱伝達率(演算用熱伝達率)hを被測定片12の熱伝達率hと擬制することにより、この熱伝達率hと被測定片12の温度分布とから被測定片12の熱伝導率kを求めることができる。 Specifically, if the heat transfer coefficient h 1 of the measured piece 12 and the thermal resistance ratio m 1 per unit length of the measured piece 12 obtained from the temperature distribution of the measured piece 12 are known, these are used. Thus, the thermal conductivity k 1 of the measured piece 12 can be obtained. Therefore, the thermal conductivity k 2 by using a known comparison piece 16, determine the heat transfer coefficient h 2 of the comparison piece 16 and a thermal conductivity k 2 and the temperature distribution of the comparative piece 16, the heat transfer coefficient ( By imitating the heat transfer coefficient for calculation (h 2 ) with the heat transfer coefficient h 1 of the measured piece 12, the thermal conductivity k of the measured piece 12 is calculated from the heat transfer coefficient h 2 and the temperature distribution of the measured piece 12. 1 can be obtained.

このように、本実施形態の熱伝導率測定装置10によれば、熱伝導率kが既知の比較片16から求めた当該比較片16の熱伝達率hを被測定片12の熱伝達率hと擬制することにより、垂直配置の板状の被測定片に対する自然対流式や放射式を用いた演算を行わなくても被測定片12の熱伝導率kを導出することができる。即ち、熱伝導率測定装置10によれば、被測定片12を垂直配置しなくても当該被測定片12の熱伝導率kを求めることができる。 Thus, according to the thermal conductivity measuring apparatus 10 of the present embodiment, the heat transfer coefficient h 2 of the comparison piece 16 obtained from the comparison piece 16 having the known thermal conductivity k 2 is used as the heat transfer of the measurement piece 12. By imitating the rate h 1 , it is possible to derive the thermal conductivity k 1 of the measured piece 12 without performing a calculation using a natural convection type or a radiation type for the plate-like measured piece arranged vertically. . That is, according to the thermal conductivity measuring device 10 can without vertical arrangement to be measured piece 12 obtains a thermal conductivity k 1 of the measured pieces 12.

しかも、被測定片12と当該被測定片12の周囲の空間との間の熱移動を扱うための係数である被測定片12の熱伝達率h(詳しくは、被測定片12の熱伝達率hとして擬制した比較片16の熱伝達率h)を用いて被測定片12の熱伝導率kを求めているため、演算結果には被測定片12から周囲の空間への放熱の影響が含まれており、これにより、被測定片12を真空中に配置して真空断熱状態としなくても被測定片12の熱伝導率kを求めることができる。 Moreover, the heat transfer coefficient h 1 of the measurement piece 12 which is a coefficient for handling heat transfer between the measurement piece 12 and the space around the measurement piece 12 (more specifically, heat transfer of the measurement piece 12 Since the heat conductivity k 1 of the measurement piece 12 is obtained using the heat transfer coefficient h 2 ) of the comparison piece 16 assumed as the rate h 1 , the calculation result shows the heat radiation from the measurement piece 12 to the surrounding space. As a result, the thermal conductivity k 1 of the measurement piece 12 can be obtained without placing the measurement piece 12 in a vacuum and bringing it into a vacuum insulation state.

また、第1実施形態による熱伝導率測定装置10では、被測定片12の周囲の雰囲気条件及び比較片16の周囲の雰囲気条件を雰囲気制御手段(本実施例では、送風ファン37及び整流板38)によって制御することにより、同じ雰囲気条件下で被測定片12の温度分布と比較片16の温度分布とをそれぞれ検出することができる。これにより、比較片16の熱伝達率hを用いて求めた被測定片12の熱伝導率kから、被測定片12及び比較片16の温度分布を測定したときの雰囲気条件の差異に基づく影響を排除することができる。即ち、比較片16の熱伝達率hを用いて被測定片12の熱伝導率kを算出するときの演算において雰囲気条件の差異に基づく影響が排除され、被測定片12の熱伝導率kがより精度よく求まる。 Further, in the thermal conductivity measuring apparatus 10 according to the first embodiment, the atmospheric condition around the measurement piece 12 and the atmospheric condition around the comparison piece 16 are changed to atmospheric control means (in this embodiment, the blower fan 37 and the rectifying plate 38. ), It is possible to detect the temperature distribution of the measurement piece 12 and the temperature distribution of the comparison piece 16 under the same atmospheric conditions. Thus, the thermal conductivity k 1 of the measurement piece 12 obtained by using the heat transfer coefficient h 2 of the comparative piece 16, the difference in atmospheric conditions when measuring the temperature distribution of the measurement piece 12 and Comparative piece 16 The influence based on can be excluded. That is, the influence based on the difference in the atmospheric condition in the calculation when calculating the thermal conductivity k 1 of the measured piece 12 using the heat transfer coefficient h 2 of the comparison piece 16 is eliminated, and the thermal conductivity of the measured piece 12 is calculated. k 1 can be obtained more accurately.

また、第1実施形態による熱伝導率測定装置10では、送風ファン(送風手段)37によって被測定片12及び比較片16への風速を調整して当該被測定片12及び当該比較片16の周囲の風速(周囲風速)をそれぞれ同じにすることで、同じ雰囲気条件下で被測定片12及び比較片16の温度分布を検出することができる。   Further, in the thermal conductivity measuring apparatus 10 according to the first embodiment, the air flow to the measurement piece 12 and the comparison piece 16 is adjusted by the blower fan (blower unit) 37 to surround the measurement piece 12 and the comparison piece 16. By making the wind speeds (ambient wind speeds) equal to each other, the temperature distribution of the measured piece 12 and the comparison piece 16 can be detected under the same atmospheric conditions.

しかも、熱伝導率kの大きな被測定片12や比較片16の温度分布を検出する場合には、被測定片12や比較片16の周囲風速を大きくすることによって、一端部13a,17aから他端部13b,17bに向って流れる熱の温度勾配を大きくすることができ、これにより、被測定片12の熱伝導率kを精度よく求めることができる。即ち、被測定片12や比較片16の熱伝導率k,kが大きく一端部13a,17aから他端部13b,17bに向う方向への温度分布の温度勾配が小さいと被測定片12や比較片16の温度分布を用いて演算したときに演算結果の誤差が大きくなるため、求めた被測定片12の熱伝導率kの誤差が大きくなる。そのため、送風ファン37によって被測定片12や比較片16の周囲風速を大きくして一端部13a,17aから他端部13b,17bに向う方向の温度分布の温度勾配を大きくしてこの温度分布を計算に適した(即ち、前記演算結果の誤差が大きくならない程度の)温度勾配とすることにより、前記誤差を抑えることができる。 In addition, when detecting the temperature distribution of the measurement piece 12 or the comparison piece 16 having a large thermal conductivity k, the surrounding wind speed of the measurement piece 12 or the comparison piece 16 is increased to increase the temperature from the one end 13a or 17a. end 13b, it is possible to increase the temperature gradient of the heat flows toward the 17b, this makes it possible to obtain good thermal conductivity k 1 of the measurement piece 12 accuracy. That is, if the thermal conductivity k 1 , k 2 of the measurement piece 12 or the comparison piece 16 is large and the temperature gradient of the temperature distribution in the direction from the one end portion 13a, 17a to the other end portion 13b, 17b is small, the measurement piece 12 since the error in the calculation result is larger when calculated using the temperature distribution in and comparative pieces 16, the error of thermal conductivity k 1 of the measurement piece 12 obtained increases. Therefore, the air velocity around the measured piece 12 and the comparison piece 16 is increased by the blower fan 37 to increase the temperature gradient of the temperature distribution in the direction from the one end portion 13a, 17a to the other end portion 13b, 17b. By making the temperature gradient suitable for calculation (that is, the error of the calculation result does not increase), the error can be suppressed.

また、第1実施形態による熱伝導率測定装置10では、整流板38によって送風ファン37からの被測定片12及び比較片16の各部位に対する風速を一様にすることができ、これにより被測定片12及び比較片16において部分的に熱伝達率h,hが変化するのを防ぐことができる。その結果、被測定片12の熱伝導率kをより精度よく求めることができる。 Further, in the thermal conductivity measuring apparatus 10 according to the first embodiment, the rectifying plate 38 can make uniform the wind speed from the blower fan 37 to each part of the measured piece 12 and the comparative piece 16, thereby measuring the measured value. It is possible to prevent the heat transfer coefficients h 1 and h 2 from partially changing in the piece 12 and the comparison piece 16. As a result, it is possible to determine more accurately the thermal conductivity k 1 of the measurement piece 12.

また、第1実施形態による熱伝導率測定装置10では、第2演算部54が第1導出部55と第2導出部56とを有することによって、薄い被測定片本体14又は熱伝導率k1aの小さな被測定片本体14であっても、被測定片本体14と厚さ調整薄片15とを積層して被測定片12とすることにより、被測定片本体14の熱伝導率k1aを求めることができる。即ち、被測定片本体14と厚さ調整薄片15とを積層して、一端部13aから他端部13bに向う熱流の通過する断面積を大きくすることにより一端部13aから他端部13bに向って流れる熱の温度勾配を演算に適した大きさとすることができ、これにより、薄い又は熱伝導率が小さな被測定片本体14の熱伝導率k1aを求めることが可能となる。 Further, in the thermal conductivity measuring device 10 according to the first embodiment, since the second calculation unit 54 includes the first derivation unit 55 and the second derivation unit 56, the thin measured piece body 14 or the thermal conductivity k 1a. Even if the measured piece main body 14 is small, the measured piece main body 14 and the thickness adjusting thin piece 15 are laminated to form the measured piece 12, thereby obtaining the thermal conductivity k 1a of the measured piece main body 14. be able to. That is, by stacking the measured piece main body 14 and the thickness adjusting thin piece 15 and increasing the cross-sectional area through which the heat flow from the one end portion 13a to the other end portion 13b passes, the one end portion 13a is directed to the other end portion 13b. Thus, the temperature gradient of the flowing heat can be set to a size suitable for calculation, whereby the thermal conductivity k 1a of the measurement target main body 14 which is thin or has a small thermal conductivity can be obtained.

また、厚さ調整薄片15を用いることにより、被測定片本体14が1つあれば、この被測定片本体14の熱伝導率k1aを求めることができる。 Further, by using the thickness adjusting thin piece 15, if there is one measured piece main body 14, the thermal conductivity k 1a of the measured piece main body 14 can be obtained.

また、第1実施形態による熱伝導率測定装置10では、被測定片12を固定する固定部と比較片16を固定する固定部とが共通の固定部材(支持部23と押え部24)で構成されることにより、被測定片12の固定部と比較片16の固定部とが別々に構成される場合に比べて熱伝導率測定装置10の構成を簡略化することができる。しかも、被測定片12と比較片16とを並べて固定することにより、これら被測定片12及び比較片16の雰囲気条件の制御が容易になると共に、被測定片12と比較片16との温度分布を同時に測定することが可能となる。   In the thermal conductivity measuring device 10 according to the first embodiment, the fixing part for fixing the measurement piece 12 and the fixing part for fixing the comparison piece 16 are configured by a common fixing member (supporting part 23 and pressing part 24). By doing so, the configuration of the thermal conductivity measuring device 10 can be simplified as compared with the case where the fixing portion of the measurement piece 12 and the fixing portion of the comparison piece 16 are configured separately. Moreover, by arranging and fixing the measured piece 12 and the comparative piece 16 side by side, it becomes easy to control the atmospheric conditions of the measured piece 12 and the comparative piece 16 and the temperature distribution between the measured piece 12 and the comparative piece 16. Can be measured simultaneously.

<第2実施形態>
図8は、本発明の第2実施形態による熱伝導率測定装置に被測定片及び比較片を設置した状態の構造を概略的に示した平面図であり、図9は、図8に示した熱伝導率測定装置の構造を概略的に示した正面図である。
<Second Embodiment>
FIG. 8 is a plan view schematically showing a structure in which the measurement piece and the comparison piece are installed in the thermal conductivity measurement apparatus according to the second embodiment of the present invention, and FIG. 9 is shown in FIG. It is the front view which showed roughly the structure of the heat conductivity measuring apparatus.

次に、図8及び図9を参照して、本発明の第2実施形態による熱伝導率測定装置10aの構成について説明するが、上記第1実施形態と同様の構成には同一符号を用いると共に詳細な説明を省略し、異なる構成についてのみ詳細に説明する。   Next, the configuration of the thermal conductivity measuring apparatus 10a according to the second embodiment of the present invention will be described with reference to FIGS. 8 and 9, and the same reference numerals are used for the same configurations as in the first embodiment. Detailed description will be omitted, and only different configurations will be described in detail.

この第2実施形態に係る熱伝導率測定装置10aは、上記第1実施形態による熱伝導率測定装置10と異なり、被測定片12の第2端部側端面における境界条件と比較片16の第4端部側端面における境界条件とを断熱条件にするための断熱部60を備えている。   Unlike the thermal conductivity measurement device 10 according to the first embodiment, the thermal conductivity measurement device 10a according to the second embodiment differs from the boundary condition on the second end side end surface of the measurement target piece 12 and the first of the comparison piece 16. The heat insulation part 60 for making the boundary condition in a 4 end part side end surface into a heat insulation condition is provided.

具体的に、本実施形態による熱伝導率測定装置10aは、測定部20と演算装置40とを備える。測定部20は、固定部22と断熱部60と温度検出部30と送風ファン37と整流板38とを備える。   Specifically, the thermal conductivity measurement device 10 a according to the present embodiment includes a measurement unit 20 and a calculation device 40. The measuring unit 20 includes a fixed unit 22, a heat insulating unit 60, a temperature detecting unit 30, a blower fan 37, and a current plate 38.

断熱部60は、断熱性を有する素材により形成され、被測定片12と比較片16とを固定部22に保持させたときに、この被測定片12の第2端部13b側の端面(第2端部側端面)と比較片16の第4端部17b側の端面(第4端部側端面)とに当接する部材である。このように被測定片12の第2端部側端面及び比較片16の第4端部側端面に当接することにより、断熱部60は、これら第2端部側端面の境界条件と第4端部側端面の境界条件とを断熱条件にする。   The heat insulating portion 60 is formed of a material having heat insulating properties, and when the measured piece 12 and the comparison piece 16 are held by the fixing portion 22, an end face (second surface) of the measured piece 12 on the second end portion 13 b side. This is a member that comes into contact with the end face on the second end side) and the end face on the fourth end 17b side of the comparison piece 16 (end face on the fourth end side). In this way, by contacting the end face on the second end side of the measured piece 12 and the end face on the fourth end side of the comparison piece 16, the heat insulating part 60 can meet the boundary condition between the end face on the second end side and the fourth end. The boundary condition of the part side end face is set as the heat insulation condition.

演算装置40は、記憶部42と演算部50と入力部44と表示部46と送風手段制御部48と、を備え、演算部50は、第1演算部52aと第2演算部54と出力部57とを備える。   The computing device 40 includes a storage unit 42, a computing unit 50, an input unit 44, a display unit 46, and a blower control unit 48. The computing unit 50 includes a first computing unit 52a, a second computing unit 54, and an output unit. 57.

第1演算部52aは、比較片16の単位長さ当たりの熱抵抗比mと、比較片情報部42bに格納されている比較片16の熱伝導率(等価熱伝導率)kと、第2検出部34により検出された比較片16の温度分布と、比較片情報部42bに格納されている比較片16の形状と、から当該比較片16の熱伝達率hを求める。 The first calculation unit 52a includes a thermal resistance ratio m 2 per unit length of the comparison piece 16, a thermal conductivity (equivalent thermal conductivity) k 2 of the comparison piece 16 stored in the comparison piece information unit 42b, and the temperature distribution of the comparative piece 16 detected by the second detection unit 34, the shape of the comparison pieces 16 stored in the comparison piece information unit 42b, obtains the heat transfer coefficient h 2 of the comparison pieces 16.

具体的に、本実施形態の第1演算部52aは、第1実施形態と異なり、第4端部側端面の境界条件が断熱条件となっている状態で第2検出部34により検出された比較片16の温度分布と式(1)とから比較片16のフィン効率φexpを求める。そして、第1演算部52aは、このフィン効率φexpと以下の式(9)とを比較することにより、比較片16の単位長さ当たりの熱抵抗比mを求める。

Figure 0005646973
Specifically, unlike the first embodiment, the first calculation unit 52a of the present embodiment is a comparison detected by the second detection unit 34 in a state where the boundary condition of the end surface on the fourth end side is an adiabatic condition. The fin efficiency φ exp of the comparison piece 16 is obtained from the temperature distribution of the piece 16 and the equation (1). The first calculation unit 52a by comparing the expression follows the fin efficiency phi exp (9), determining the thermal resistance ratio m 2 per unit length of comparison piece 16.
Figure 0005646973

第1演算部52aは、比較片16の単位長さ当たりの熱抵抗比mが求まると、第1実施形態と同様に、この単位長さ当たりの熱抵抗比mと、比較片情報部42bに格納されている比較片16の熱伝導率(等価熱伝導率)k及び形状とを用いて式(5)から比較片16の熱伝達率hを算出する。 When the thermal resistance ratio m 2 per unit length of the comparison piece 16 is obtained, the first calculation unit 52a determines the thermal resistance ratio m 2 per unit length and the comparison piece information unit as in the first embodiment. the thermal conductivity of the comparative pieces 16 stored in the 42b by using the (equivalent thermal conductivity) k 2 and shaped to calculate the heat transfer coefficient h 2 of the comparative piece 16 from equation (5).

第2演算部54は、第1導出部55aと第2導出部56とを有する。第1導出部55aは、第1検出部32で検出された被測定片12の温度分布から式(1)により被測定片12のフィン効率φexpを求め、第1演算部52aと同様に、このフィン効率φexpと式(9)とを比較することにより、被測定片12の単位長さ当たりの熱抵抗比mを求める。 The second calculation unit 54 includes a first derivation unit 55 a and a second derivation unit 56. The first deriving unit 55a obtains the fin efficiency φ exp of the measurement target piece 12 from the temperature distribution of the measurement target piece 12 detected by the first detection unit 32 according to the equation (1), and similarly to the first calculation unit 52a, By comparing the fin efficiency φ exp and the equation (9), the thermal resistance ratio m 1 per unit length of the measured piece 12 is obtained.

そして、第1導出部55aは、被測定片12の単位長さ当たりの熱抵抗比mが求まると、この単位長さ当たりの熱抵抗比mと、第1演算部52aで求めた比較片16の熱伝達率hと、被測定片情報部42aに格納されている被測定片12の形状とから、式(7)により被測定片12の熱伝導率kを算出する。 The first derivation unit 55a, when the thermal resistance ratio m 1 per unit length of the measurement piece 12 is obtained, the thermal resistance ratio m 1 per the unit length was determined by first computing section 52a compares a heat transfer coefficient h 2 pieces 16, and a profile of the measurement piece 12 stored in the measured piece information section 42a, calculates the thermal conductivity k 1 of the measurement piece 12 by equation (7).

このように構成される熱伝導率測定装置10aでは、第1演算部52aにおいて単位長さ当たりの比較片16の熱抵抗比mを求めるときに式(2)の代わりに式(9)が用いられ、且つ第1導出部55aにおいて単位長さ当たりの被測定片12の熱抵抗比mを求めるときに式(2)の代わりに式(9)が用いられる以外は、第1実施形態の熱伝導率測定装置10と同様にして被測定片12(被測定片本体14)の熱伝導率k(k1a)が求められる。 In thus configured thermal conductivity measuring device 10a, the expression (9) instead of equation (2) when determining the thermal resistance ratio m 2 of the comparative piece 16 per unit length in the first arithmetic unit 52a The first embodiment is used except that the equation (9) is used instead of the equation (2) when the thermal resistance ratio m 1 of the measured piece 12 per unit length is obtained in the first derivation unit 55a. The thermal conductivity k 1 (k 1a ) of the measured piece 12 (measured piece main body 14) is obtained in the same manner as the thermal conductivity measuring apparatus 10 of FIG.

以上説明したように、第2実施形態の熱伝導率測定装置10aによっても、第1実施形態と同様に、熱伝導率kが既知の比較片16を利用して求めた当該比較片16の熱伝達率hを利用することにより、垂直配置の板状の被測定片に対する自然対流式や放射式といった計算式を用いた演算によって被測定片の熱伝達率を算出しなくても、被測定片12の熱伝導率kを求めることができる。しかも、被測定片12と当該被測定片12の周囲の空間との間の熱移動を扱うための係数である被測定片12の熱伝達率h(詳しくは、被測定片12の熱伝達率hとして擬制した比較片16の熱伝達率h)を用いて被測定片12の熱伝導率kを求めているため、演算結果には被測定片12から周囲の空間への放熱の影響が含まれており、これにより、被測定片12を真空中に配置して真空断熱状態としなくても被測定片12の熱伝導率kを求めることができる。 As described above, by the thermal conductivity measuring apparatus 10a of the second embodiment, like the first embodiment, the thermal conductivity k 2 is determined using known comparison piece 16 of the comparison piece 16 by using the heat transfer coefficient h 2, even without calculating the heat transfer coefficient of the measured pieces by a calculation using a formula such as natural convection and radiant against the plate to be measured pieces of vertical arrangement, the it can be obtained a thermal conductivity k 1 of the measurement piece 12. Moreover, the heat transfer coefficient h 1 of the measurement piece 12 which is a coefficient for handling heat transfer between the measurement piece 12 and the space around the measurement piece 12 (more specifically, heat transfer of the measurement piece 12 Since the heat conductivity k 1 of the measurement piece 12 is obtained using the heat transfer coefficient h 2 ) of the comparison piece 16 assumed as the rate h 1 , the calculation result shows the heat radiation from the measurement piece 12 to the surrounding space. As a result, the thermal conductivity k 1 of the measurement piece 12 can be obtained without placing the measurement piece 12 in a vacuum and bringing it into a vacuum insulation state.

<第3実施形態>
図10(A)は、本発明の第3実施形態による熱伝導率測定装置に被測定片及び比較片を設置し、断熱部材を取り除いた状態の構造を概略的に示した正面図であり、図10(B)は、図10(A)の熱伝導率測定装置に断熱部材を設置した状態の図であり、図11は、図10(B)のXI―XI断面図であり、図12は、第3実施形態の熱伝導率測定装置における温度センサ部の構造を概略的に示した平面図である。
<Third embodiment>
FIG. 10 (A) is a front view schematically showing the structure in a state in which the measurement piece and the comparison piece are installed in the thermal conductivity measurement device according to the third embodiment of the present invention and the heat insulating member is removed, FIG. 10B is a view showing a state where a heat insulating member is installed in the thermal conductivity measuring device shown in FIG. 10A, and FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. These are the top views which showed roughly the structure of the temperature sensor part in the thermal conductivity measuring apparatus of 3rd Embodiment.

次に、図10(A)乃至図12を参照して、本発明の第3実施形態による熱伝導率測定装置10bの構成について説明するが、上記第1実施形態及び第2実施形態と同様の構成には同一符号を用いると共に詳細な説明を省略し、異なる構成についてのみ詳細に説明する。   Next, the configuration of the thermal conductivity measuring device 10b according to the third embodiment of the present invention will be described with reference to FIGS. 10A to 12, but the same as in the first and second embodiments. The same reference numerals are used for the configurations, and detailed description is omitted, and only different configurations will be described in detail.

この第3実施形態による熱伝導率測定装置10bは、測定部20aと演算装置40とを備える。ここで、本実施形態の演算装置40は、第2実施形態の演算装置40と同様の構成であるため、説明を省略する。   The thermal conductivity measurement device 10b according to the third embodiment includes a measurement unit 20a and a calculation device 40. Here, since the arithmetic device 40 of this embodiment is the same structure as the arithmetic device 40 of 2nd Embodiment, description is abbreviate | omitted.

測定部20aは、固定部22aと、断熱部60と、温度検出部30aと、温度検出部30aを支持する温度センサ支持部70と、被測定片12及び比較片16の雰囲気条件を断熱条件にするための断熱部材72と、送風ファン37と、整流板38とを備える。固定部22aは、第1実施形態及び第2実施形態と異なり、被測定片12及び比較片16を保持したときに上側に支持部23が位置すると共に下側に押え部24が位置するように構成される。即ち、固定部22aにおいて、第1実施形態及び第2実施形態の固定部22に対して支持部23と押え部24とが上下反対に配置されている。   The measuring unit 20a is based on the atmospheric conditions of the fixing unit 22a, the heat insulating unit 60, the temperature detecting unit 30a, the temperature sensor supporting unit 70 that supports the temperature detecting unit 30a, and the measured piece 12 and the comparison piece 16. A heat insulating member 72, a blower fan 37, and a current plate 38. Unlike the first and second embodiments, the fixing portion 22a is configured such that when the measurement piece 12 and the comparison piece 16 are held, the support portion 23 is located on the upper side and the presser portion 24 is located on the lower side. Composed. That is, in the fixing portion 22a, the support portion 23 and the pressing portion 24 are disposed upside down with respect to the fixing portion 22 of the first embodiment and the second embodiment.

温度検出部30aは、第1検出部32aと、第2検出部34aと、を備える。これら第1検出部32a及び第2検出部34aは、第1実施形態及び第2実施形態と異なり、被測定片12及び比較片16の各温度測定部位に対して一度に温度センサ36を設置できるように構成される。具体的に、第1検出部32a及び第2検出部34aは、複数(本実施形態では5つ)の温度センサ36と、これら複数の温度センサ36が配置される配置用板材35とをそれぞれ有する(図12参照)。   The temperature detection unit 30a includes a first detection unit 32a and a second detection unit 34a. Unlike the first and second embodiments, the first detection unit 32 a and the second detection unit 34 a can install the temperature sensor 36 at a time for each temperature measurement portion of the measured piece 12 and the comparison piece 16. Configured as follows. Specifically, the first detection unit 32a and the second detection unit 34a each include a plurality of (five in the present embodiment) temperature sensors 36 and an arrangement plate member 35 on which the plurality of temperature sensors 36 are arranged. (See FIG. 12).

配置用板材35は、板状の部材であり、主面部35aに間隔をおいて一列に並ぶように複数の温度センサ36が配置されている。この主面部35aにおける温度センサ36の配置は、温度分布を検出するために第1検出部32a(第2検出部34a)の配置用板材35を被測定片12(比較片16)に重ねたときに、当該被測定片12(当該比較片16)の各温度測定部位に対応している。この配置用板材35は、熱伝導率kの小さな樹脂により形成されている。配置用板材35がこのような樹脂で形成されることにより、被測定片12及び比較片16の温度分布を測定するときに、この配置用板材35からの熱流による影響を抑えることができる。   The disposing plate member 35 is a plate-like member, and a plurality of temperature sensors 36 are disposed so as to be arranged in a line at intervals on the main surface portion 35a. The arrangement of the temperature sensor 36 on the main surface portion 35a is obtained when the arrangement plate 35 of the first detection unit 32a (second detection unit 34a) is overlapped on the measurement piece 12 (comparison piece 16) in order to detect the temperature distribution. Moreover, it corresponds to each temperature measurement site | part of the said to-be-measured piece 12 (the said comparison piece 16). The arranging plate material 35 is made of a resin having a small thermal conductivity k. By forming the placement plate 35 with such a resin, it is possible to suppress the influence of the heat flow from the placement plate 35 when measuring the temperature distribution of the measured piece 12 and the comparison piece 16.

このように構成される第1検出部32a(第2検出部34a)が被測定片12(比較片16)に取り付けられることで、被測定片12の各温度測定部位に対して温度センサ36がそれぞれ配置された状態となる。具体的に、第1検出部32a(第2検出部34a)は、当該第1検出部32a(第2検出部34a)の配置用板材35と被測定片12(比較片16)との間に主面部35aに配置された各温度センサ36が挟み込まれるように配置用板材35と被測定片12(比較片16)とが重ね合わされる。このとき、第1検出部32a(第2検出部34a)と被測定片12(比較片16)とは両面テープ等によって接着される。このように第1検出部32a(第2検出部34a)が被測定片12(比較片16)に取り付けられることで、被測定片12(比較片16)の温度測定位置に複数の温度センサ36が一度に配置される。   By attaching the first detection unit 32a (second detection unit 34a) configured in this way to the measurement piece 12 (comparison piece 16), the temperature sensor 36 is provided for each temperature measurement portion of the measurement piece 12. Each is placed. Specifically, the first detection unit 32a (second detection unit 34a) is arranged between the arrangement plate 35 of the first detection unit 32a (second detection unit 34a) and the measured piece 12 (comparison piece 16). The placement plate 35 and the measurement piece 12 (comparison piece 16) are overlapped so that the temperature sensors 36 arranged on the main surface portion 35a are sandwiched. At this time, the first detection unit 32a (second detection unit 34a) and the measurement target piece 12 (comparison piece 16) are bonded by a double-sided tape or the like. By attaching the first detection unit 32a (second detection unit 34a) to the measured piece 12 (comparison piece 16) in this way, a plurality of temperature sensors 36 are provided at the temperature measurement position of the measured piece 12 (comparative piece 16). Are placed at once.

温度センサ支持部70は、第1検出部32a及び第2検出部34aを下方側から支持する部材であり、断熱素材で形成されている。この温度センサ支持部70は、固定部22aに保持された状態の被測定片12(比較片16)に、第1検出部32a(第2検出部34a)の配置用板材35の各温度センサ36が密着するように下側から配置用板材35を支持する。   The temperature sensor support unit 70 is a member that supports the first detection unit 32a and the second detection unit 34a from the lower side, and is formed of a heat insulating material. The temperature sensor support unit 70 is provided on each piece 12 to be measured 12 (comparison piece 16) held by the fixing unit 22a, and each temperature sensor 36 of the placement plate 35 of the first detection unit 32a (second detection unit 34a). The placement plate 35 is supported from the lower side so as to be closely attached.

断熱部材72は、被測定片12及び比較片16を断熱状態とするためにその周囲を覆うものであり、被測定片12及び比較片16に対して着脱可能である。この断熱部材72は、通常、測定部20aから取り外されている(図10(A)参照)。そして、被測定片12の熱伝導率kが小さく、そのままの状態で温度分布を検出すると温度勾配が大きくなり過ぎ、この温度分布を用いて演算すると演算結果の誤差が大きくなるような被測定片12の場合に、断熱部材72は、被測定片12及び比較片16に対して取り付けられ(図10(B)参照)、被測定片12及び比較片16を断熱状態にする。このように断熱部材72によって被測定片12及び比較片16が断熱状態とされると、被測定片12及び比較片16から外部に熱が逃げなくなって温度勾配が小さくなるため、被測定片12及び比較片16から検出される温度分布が演算に適した温度勾配となる。 The heat insulating member 72 covers the periphery of the measurement piece 12 and the comparison piece 16 so as to be in a heat insulation state, and is detachable from the measurement piece 12 and the comparison piece 16. This heat insulation member 72 is normally removed from the measurement part 20a (refer FIG. 10 (A)). Then, the thermal conductivity k 1 of the measured piece 12 is small, and if the temperature distribution is detected as it is, the temperature gradient becomes too large, and if the calculation is performed using this temperature distribution, the error of the calculation result becomes large. In the case of the piece 12, the heat insulating member 72 is attached to the measured piece 12 and the comparative piece 16 (see FIG. 10B), and puts the measured piece 12 and the comparative piece 16 in a thermally insulated state. When the measurement piece 12 and the comparison piece 16 are in a heat insulation state by the heat insulating member 72 in this manner, heat does not escape from the measurement piece 12 and the comparison piece 16 to the outside, and the temperature gradient becomes small. And the temperature distribution detected from the comparison piece 16 becomes a temperature gradient suitable for calculation.

本実施形態の断熱部材72は、固定部22aに保持された状態の被測定片12及び比較片16において雰囲気中に露出している上面側を覆うように取り付けることで、被測定片12及び比較片16を断熱状態にする。尚、本実施形態の断熱部材72は、被測定片12及び比較片16の下側に第1検出部32a及び第2検出部34a並びに温度センサ支持部70が配置されているため、雰囲気中に露出した被測定片12及び比較片16の上面側を覆う形状を有しているが、第1実施形態や第2実施形態のように、被測定片12及び比較片16の固定部22に保持された部位以外の部位が雰囲気中に露出している場合には、この露出した部位全体を覆うような形状を有するように構成される。   The heat insulating member 72 of the present embodiment is attached so as to cover the upper surface side exposed in the atmosphere in the measured piece 12 and the comparative piece 16 held in the fixing portion 22a, so that the measured piece 12 and the comparative piece 16 are compared. The piece 16 is insulative. Note that the heat insulating member 72 of the present embodiment includes the first detection unit 32a, the second detection unit 34a, and the temperature sensor support unit 70 below the measured piece 12 and the comparison piece 16, and therefore, in the atmosphere. Although it has a shape that covers the exposed upper surface side of the measurement piece 12 and the comparison piece 16, it is held by the fixing portion 22 of the measurement piece 12 and the comparison piece 16 as in the first and second embodiments. When a part other than the exposed part is exposed to the atmosphere, the part is configured to cover the entire exposed part.

送風ファン37は、第1実施形態及び第2実施形態と異なり、固定部22aに保持された状態の被測定片12及び比較片16の上方位置に配置される。これにより、送風ファン37は、被測定片12及び比較片16に対して上方から下方に向けて風を供給する。   Unlike the first embodiment and the second embodiment, the blower fan 37 is disposed above the measurement target piece 12 and the comparison piece 16 that are held by the fixing portion 22a. As a result, the blower fan 37 supplies air to the measured piece 12 and the comparison piece 16 from above to below.

整流板38は、送風ファン37から被測定片12の上面の各部位に供給される風、及び比較片16の上面の各部位に供給される風が一様となるようにするものである。この整流板38は、送風ファン37と固定部22aに保持された状態の被測定片12及び比較片16との間に配置される。   The rectifying plate 38 makes the air supplied from the blower fan 37 to each part on the upper surface of the measured piece 12 and the air supplied to each part on the upper surface of the comparison piece 16 uniform. The rectifying plate 38 is disposed between the measured piece 12 and the comparison piece 16 that are held by the blower fan 37 and the fixed portion 22a.

このように構成される熱伝導率測定装置10bでは、第1検出部32a及び第2検出部34aの配置用板材35が被測定片12及び比較片16に貼り付けられ、この貼り付けられた被測定片12及び比較片16が固定部22aに保持されると共に温度センサ支持部70上に配置される(図10(A)参照)。このように、被測定片12及び比較片16が測定部20aに設置されると、固定部22aにより被測定片12の第1端部13aと比較片16の第3端部17aとが加熱されると共に送風ファン37が被測定片12と比較片16とに送風を開始する。そして、演算装置40が第2実施形態と同様にして被測定片12(被測定片本体14)の熱伝導率k(k1a)を求める。 In the thermal conductivity measuring device 10b configured as described above, the placement plate members 35 of the first detection unit 32a and the second detection unit 34a are attached to the measurement piece 12 and the comparison piece 16, and the attached object to be attached. The measurement piece 12 and the comparison piece 16 are held by the fixing portion 22a and are disposed on the temperature sensor support portion 70 (see FIG. 10A). As described above, when the measurement piece 12 and the comparison piece 16 are installed in the measurement unit 20a, the first end portion 13a of the measurement piece 12 and the third end portion 17a of the comparison piece 16 are heated by the fixing portion 22a. The blower fan 37 starts blowing air to the measured piece 12 and the comparison piece 16. Then, a thermal conductivity k 1 of the arithmetic unit 40 in the same manner as in the second embodiment to be measured pieces 12 (the measured element body 14) (k 1a).

一方、被測定片12の熱伝導率kが小さく、そのままの状態で温度分布を検出すると温度勾配が大きくなり過ぎ、この温度分布を用いて演算すると演算結果の誤差が大きくなるような被測定片12の場合には、送風ファン37を駆動させずに、被測定片12及び比較片16に対して断熱部材72が取り付けられる(図10(B)に示す状態)。具体的には、温度センサ支持部70の上に第1検出部32a及び第2検出部34aが貼り付けられた被測定片12及び比較片16が配置された状態で、その上側から被測定片12及び比較片16を覆うように断熱部材72が被せられる。この状態で固定部22aによって被測定片12及び比較片16が加熱され、第2実施形態と同様にして、被測定片12の熱伝導率kが測定される。このように断熱部材72によって被測定片12及び比較片16を断熱状態とすることで、外部に熱が逃げなくなって温度勾配が小さくなり、被測定片12及び比較片16から検出される温度分布を演算に適した温度勾配とすることができる。 On the other hand, the thermal conductivity k 1 of the measured piece 12 is small, and if the temperature distribution is detected as it is, the temperature gradient becomes too large, and if the calculation is performed using this temperature distribution, the error of the calculation result becomes large. In the case of the piece 12, the heat insulating member 72 is attached to the measured piece 12 and the comparison piece 16 without driving the blower fan 37 (the state shown in FIG. 10B). Specifically, the measurement piece 12 and the comparison piece 16 in which the first detection unit 32a and the second detection unit 34a are attached on the temperature sensor support unit 70 are arranged from above the measurement piece. A heat insulating member 72 is placed so as to cover 12 and the comparison piece 16. This by the fixing portion 22a in a state to be measured pieces 12 and Comparative piece 16 is heated, as in the second embodiment, the thermal conductivity k 1 of the measurement piece 12 is measured. In this way, by making the measured piece 12 and the comparison piece 16 in a heat-insulated state by the heat insulating member 72, heat does not escape to the outside, the temperature gradient becomes smaller, and the temperature distribution detected from the measured piece 12 and the comparison piece 16. Can be a temperature gradient suitable for calculation.

尚、本発明の熱伝導率測定装置、熱伝導率演算装置、熱伝導率算出プログラム、及び熱伝導率測定方法は、上記第1実施形態乃至第3実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることは勿論である。   The thermal conductivity measuring device, the thermal conductivity calculating device, the thermal conductivity calculating program, and the thermal conductivity measuring method of the present invention are not limited to the first to third embodiments, but Of course, various modifications can be made without departing from the scope of the invention.

被測定片12(比較片16)の温度分布から単位長さ当たりの熱抵抗比m(m)を求める具体的構成は限定されない。上記第1実施形態の第1導出部55(第1演算部52)では、被測定片12(比較片16)の温度分布から式(1)によりフィン効率φexpが求められ、このフィン効率φexpと式(2)とから単位長さ当たりの熱抵抗比m(m)が求められ、上記第2実施形態の第1導出部55a(第1演算部52a)では、被測定片12(比較片16)の温度分布から式(1)によりフィン効率φexpが求められ、このフィン効率φexpと式(9)とから単位長さ当たりの熱抵抗比m(m)が求められるが、例えば、以下の方法等によって単位長さ当たりの熱抵抗比m(m)が求められてもよい。 The specific configuration for obtaining the thermal resistance ratio m 1 (m 2 ) per unit length from the temperature distribution of the measured piece 12 (comparative piece 16) is not limited. In the first derivation unit 55 (first arithmetic unit 52) of the first embodiment, the fin efficiency φ exp is obtained from the temperature distribution of the measured piece 12 (comparison piece 16) by the equation (1), and this fin efficiency φ The thermal resistance ratio m 1 (m 2 ) per unit length is obtained from exp and the expression (2). In the first derivation unit 55a (the first calculation unit 52a) of the second embodiment, the measured piece 12 The fin efficiency φ exp is obtained from the temperature distribution of the (comparative piece 16) by the equation (1), and the thermal resistance ratio m 1 (m 2 ) per unit length is obtained from the fin efficiency φ exp and the equation (9). However, for example, the thermal resistance ratio m 1 (m 2 ) per unit length may be obtained by the following method or the like.

この方法において、被測定片12(比較片16)の両端温度を用いる場合(両端温度固定条件)には、以下の式(10−1)(式(10−2))で表されるフィン温度分布解析式から求められる。具体的に、式(10−1)(式(10−2))における各温度測定部位の温度と温度検出部30により実測(検出)された被測定片12(比較片16)の各温度測定部位の温度との標準偏差σを最小とする単位長さ当たりの熱抵抗比m(m)が求められる。

Figure 0005646973
ここで、Tは被測定片12(比較片16)の根元(第1端部13a(第3端部17a))温度であり、Tは先端(第2端部13b(第4端部17b))の温度であり、xは根元からの距離である。 In this method, when the temperature at both ends of the measured piece 12 (comparison piece 16) is used (fixed temperature at both ends), the fin temperature represented by the following formula (10-1) (formula (10-2)) It is obtained from the distribution analysis formula. Specifically, each temperature measurement of the measured piece 12 (comparative piece 16) actually measured (detected) by the temperature detection unit 30 and the temperature of each temperature measurement portion in the expression (10-1) (expression (10-2)). The thermal resistance ratio m 1 (m 2 ) per unit length that minimizes the standard deviation σ from the temperature of the part is obtained.
Figure 0005646973
Here, T 0 is the base (first end 13a (third end 17a)) temperature of the measured piece 12 (comparison piece 16), and TL is the tip (second end 13b (fourth end). 17b)), and x is the distance from the root.

また、標準偏差σは、以下の式(11)により定義される。

Figure 0005646973
ここで、nは測定点の数であり、iは各測定点(即ち、各温度測定部位)に被測定片12(比較片16)の根元側から先端に向かって順に番号をふったときの測定点の位置を示す番号である。 The standard deviation σ is defined by the following equation (11).
Figure 0005646973
Here, n is the number of measurement points, and i is the number when each measurement point (that is, each temperature measurement site) is numbered sequentially from the root side of the measurement target piece 12 (comparison piece 16) toward the tip. It is a number indicating the position of the measurement point.

尚、上記の方法は、第1実施形態のように被測定片12(比較片16)の加熱側と反対の端面が断熱条件でない場合の方法であって、第2実施形態のように被測定片12(比較片16)の加熱側と反対の端面が断熱条件の場合には、次のようにして単位長さ当たりの熱抵抗比m(m)が求められる。この場合、上記の方法と異なり、被測定片12及(比較片16)の各温度測定部位の温度が以下の式(12−1)(式(12−2))で表されるフィン温度分布解析式により求められる。そして、上記の方法と同様に、標準偏差σを最小とするような単位長さ当たりの熱抵抗比m(m)が求められる。

Figure 0005646973
In addition, said method is a method when the end surface on the opposite side to the heating side of the to-be-measured piece 12 (comparison piece 16) is not heat insulation conditions like 1st Embodiment, Comprising: It is to be measured like 2nd Embodiment. When the end surface opposite to the heating side of the piece 12 (comparison piece 16) is in a heat insulating condition, the thermal resistance ratio m 1 (m 2 ) per unit length is obtained as follows. In this case, unlike the above method, the fin temperature distribution in which the temperature of each temperature measurement portion of the measured piece 12 and the comparison piece 16 is represented by the following formula (12-1) (formula (12-2)) Calculated by analytical formula. Similarly to the above method, the thermal resistance ratio m 1 (m 2 ) per unit length that minimizes the standard deviation σ is obtained.
Figure 0005646973

上記第1実施形態乃至第3実施形態の第1検出部32,32a(第2検出部34,34a)は、被測定片12(比較片16)の第1端部13a(第3端部17a)から第2端部13b(第4端部17b)までの温度を断続的に検出するが、これに限定されず、連続的に温度を検出するように構成されてもよい。   The first detectors 32 and 32a (second detectors 34 and 34a) of the first to third embodiments are the first end 13a (third end 17a) of the measured piece 12 (comparison piece 16). ) To the second end portion 13b (fourth end portion 17b) is intermittently detected. However, the present invention is not limited to this, and the temperature may be continuously detected.

例えば、温度検出部は、赤外線センサ等の温度センサを移動させつつ被測定片12(比較片16)の温度を測定するように構成されてもよい。具体的に、図13に示すように、温度検出部130は、被測定片12(比較片16)の温度を検出する温度センサ136と、この温度センサ136を被測定片12(比較片16)の第1端部13a(第3端部17a)から第2端部13b(第4端部17b)に向う方向に沿って移動させる移動手段62とを備える。   For example, the temperature detection unit may be configured to measure the temperature of the measurement target piece 12 (comparison piece 16) while moving a temperature sensor such as an infrared sensor. Specifically, as shown in FIG. 13, the temperature detection unit 130 includes a temperature sensor 136 that detects the temperature of the measurement target piece 12 (comparison piece 16), and the temperature sensor 136 is used as the measurement piece 12 (comparison piece 16). Moving means 62 for moving along the direction from the first end portion 13a (third end portion 17a) to the second end portion 13b (fourth end portion 17b).

図13において温度センサ136は赤外線センサ等の放射温度計であるが、これに限定されず、被測定片12(比較片16)の温度を検出可能で且つ被測定片12(比較片16)に沿って移動させることが可能であれば、接触式の温度センサであってもよく、放射温度計以外の非接触式の温度センサであってもよい。   In FIG. 13, the temperature sensor 136 is a radiation thermometer such as an infrared sensor, but is not limited to this. The temperature sensor 136 can detect the temperature of the measurement piece 12 (comparison piece 16) and can be used as the measurement piece 12 (comparison piece 16). As long as it can be moved along, it may be a contact type temperature sensor or a non-contact type temperature sensor other than a radiation thermometer.

移動手段62は、被測定片12(比較片16)の第1端部13a(第3端部17a)から第2端部13b(第4端部17b)に向かう方向に沿って温度センサ136を案内する案内部材63と、温度センサ136を案内部材63に沿って往復移動させる駆動部64とを有する。案内部材63は、固定部22に保持された被測定片12(比較片16)の第1端部13a(第3端部17a)から第2端部13b(第4端部17b)に向う方向に沿って延び、温度センサ136がこの方向に往復移動自在に取り付けられている。   The moving means 62 moves the temperature sensor 136 along the direction from the first end 13a (third end 17a) to the second end 13b (fourth end 17b) of the measured piece 12 (comparison piece 16). A guide member 63 for guiding and a drive unit 64 for reciprocating the temperature sensor 136 along the guide member 63 are provided. The guide member 63 is a direction from the first end 13a (third end 17a) to the second end 13b (fourth end 17b) of the measurement target piece 12 (comparison piece 16) held by the fixed portion 22. A temperature sensor 136 is attached so as to be reciprocally movable in this direction.

このような温度検出部130によれば、上記第1実施形態や第2実施形態のように複数の熱電対36を被測定片12や比較片16に装着する手間がなくなる。また、この温度検出部130によれば、被測定片12及び比較片16における連続的な温度分布を検出することができるため、断続的な温度分布を検出する場合に比べ、熱伝導率測定装置における被測定片12の熱伝導率kの測定精度を向上させることができる。 According to such a temperature detection unit 130, there is no need to attach the plurality of thermocouples 36 to the measurement target piece 12 or the comparison piece 16 as in the first and second embodiments. Moreover, according to this temperature detection part 130, since the continuous temperature distribution in the to-be-measured piece 12 and the comparison piece 16 can be detected, compared with the case where an intermittent temperature distribution is detected, thermal conductivity measuring apparatus it is possible to improve the measurement accuracy of the thermal conductivity k 1 of the measurement piece 12 at.

尚、これら温度センサ136と移動手段62とで構成される温度検出部130は、被測定片12(比較片16)の第1端部13a(第3端部17a)から第2端部13b(第4端部17b)までの温度を連続的に検出するだけでなく、断続的に(例えば、図13におけるx=0、x1、x2、Lの位置等)検出してもよい。   Note that the temperature detection unit 130 including the temperature sensor 136 and the moving unit 62 includes a first end portion 13a (third end portion 17a) to a second end portion 13b (third end portion 17a) of the measurement target piece 12 (comparison piece 16). In addition to continuously detecting the temperature up to the fourth end portion 17b), the temperature may be detected intermittently (for example, positions x = 0, x1, x2, and L in FIG. 13).

また、温度検出部は、図14に示すように、例えば、赤外線カメラのような、被測定片12(比較片16)における加熱される部位から第2端部13b(第4端部17b)までの全体の温度を同時に測定できる構成であってもよい。この温度検出部130aを用いた場合でも、上記第1実施形態や第2実施形態のように複数の温度センサ36を被測定片12や比較片16に貼り付ける手間がなくなる。また、被測定片12及び比較片16における連続的な温度分布が検出できるため、被測定片12の熱伝導率kの測定精度を向上させることができる。 Further, as shown in FIG. 14, the temperature detection unit, for example, from a heated portion in the measurement target piece 12 (comparison piece 16) such as an infrared camera to the second end portion 13b (fourth end portion 17b). The structure which can measure the whole temperature of this simultaneously may be sufficient. Even when the temperature detection unit 130a is used, there is no need to stick the plurality of temperature sensors 36 to the measurement piece 12 or the comparison piece 16 as in the first and second embodiments. Further, since the detectable continuous temperature distribution in the measurement piece 12 and Comparative piece 16, it is possible to improve the measurement accuracy of the thermal conductivity k 1 of the measurement piece 12.

被測定片12及び比較片16の表面を塗装等によって黒色にしてもよい。この場合、図13及び図14に示すように、放射率と熱伝導率kとが既知の黒色テープ74が被測定片12及び比較片16の表面に貼り付けられてもよい。これにより、塗装によって表面を黒色にする場合に比べ、被測定片12及び比較片16の表面を黒色にすることが容易になる。尚、黒色テープ74を貼り付けた被測定片12が用いられると、求まった熱伝導率kが被測定片12と黒色テープ74との等価熱伝導率となるが、黒色テープ74の放射率と、熱伝導率kと、厚さtとが既知であるため、以下の式(13)から被測定片12の熱伝導率kが求まる。

Figure 0005646973
ここで、tallは、被測定片12の厚さtと、この被測定片12の両面にそれぞれ貼り付けられた黒色テープの厚さtとを合わせた厚さである。即ち、tall=t+2tである。 The surfaces of the measured piece 12 and the comparison piece 16 may be blackened by painting or the like. In this case, as shown in FIGS. 13 and 14, a black tape 74 whose emissivity and thermal conductivity k are known may be attached to the surfaces of the measurement target piece 12 and the comparison piece 16. Thereby, it becomes easy to make the surface of the to-be-measured piece 12 and the comparison piece 16 black, compared with the case where the surface is made black by painting. When the measured piece 12 to which the black tape 74 is attached is used, the obtained thermal conductivity k becomes the equivalent thermal conductivity between the measured piece 12 and the black tape 74, and the emissivity of the black tape 74 is Since the thermal conductivity k 3 and the thickness t 3 are known, the thermal conductivity k 1 of the measured piece 12 can be obtained from the following equation (13).
Figure 0005646973
Here, t all is a thickness obtained by combining the thickness t 1 of the measured piece 12 and the thickness t 3 of the black tape attached to both surfaces of the measured piece 12. That is, t all = t 1 + 2t 3 .

上記第1実施形態乃至第3実施形態では、被測定片12及び比較片16における第1端部13a及び第3端部17aが固定部22,22aに保持(挟持)されているが、図13及び図14に示すように、第1端部13a及び第3端部17aよりも第2端部13b及び第4端部17b側の部位が保持される、即ち、固定部22,22aから第1端部13a及び第3端部17aが突出した状態で被測定片12及び比較片16が測定部20に設置されてもよい。この場合、温度検出部130(130a,30)は、被測定片12及び比較片16の固定部22,22aに保持された部位(加熱される部位)から第2端部13b及び第4端部17bまでの温度分布を検出する。   In the first to third embodiments, the first end portion 13a and the third end portion 17a of the measurement target piece 12 and the comparison piece 16 are held (clamped) by the fixing portions 22 and 22a. And as shown in FIG. 14, the site | part of the 2nd end part 13b and the 4th end part 17b side rather than the 1st end part 13a and the 3rd end part 17a is hold | maintained, ie, 1st from the fixing | fixed part 22 and 22a. The measurement piece 12 and the comparison piece 16 may be installed in the measurement unit 20 in a state where the end portion 13a and the third end portion 17a protrude. In this case, the temperature detection unit 130 (130a, 30) includes the second end 13b and the fourth end from the parts (heated parts) held by the fixing parts 22 and 22a of the measured piece 12 and the comparison piece 16. Temperature distribution up to 17b is detected.

上記第1実施形態乃至第3実施形態では、固定部22,22aに被測定片12の一部を保持させることにより測定部20に被測定片12が設置されるが、被測定片12の設置方法はこれに限定されない。例えば、図15(A)及び図15(B)に示すように、熱伝導率k及び厚さtが既知の板状部材で形成された取付部材76に被測定片12が取り付けられることで、当該被測定片12が測定部20に設置されるように構成されてもよい。 In the first to third embodiments, the measurement piece 12 is installed in the measurement unit 20 by holding a part of the measurement piece 12 in the fixing portions 22 and 22a. The method is not limited to this. For example, as shown in FIG. 15 (A) and FIG. 15 (B), the possible measured pieces 12 to the mounting member 76 to the thermal conductivity k b and thickness t b is formed in a known plate-shaped member is attached Thus, the measurement target piece 12 may be configured to be installed in the measurement unit 20.

具体的に、取付部材76は、一方向(図15(A)において左右方向)に延びる矩形状の板状部材であり、一方の面上において取付部材76の一端部76aから他端部76bに向けて間隔をおいて一列に並ぶように複数の温度センサ36が配設されている。この取付部材76に配置された複数の温度センサ36が第1検出部32を構成する。本実施形態では、7つの温度センサ36が等間隔に並んでいる。この取付部材76の一端部76aは固定部22に保持されている。そして、この複数の温度センサ36が配設された面に接するように被測定片12が重ねられる。このとき、被測定片12と取付部材76とは、両面テープによって接着され、被測定片12は、第1端部13a側の端面が固定部22に接するように固定部22側に寄せて取り付けられる(図15(B)参照)。   Specifically, the attachment member 76 is a rectangular plate-like member extending in one direction (left-right direction in FIG. 15A), and from one end 76a of the attachment member 76 to the other end 76b on one surface. A plurality of temperature sensors 36 are arranged so as to be aligned in a row at intervals. A plurality of temperature sensors 36 arranged on the attachment member 76 constitute the first detection unit 32. In the present embodiment, seven temperature sensors 36 are arranged at equal intervals. One end portion 76 a of the attachment member 76 is held by the fixing portion 22. And the to-be-measured piece 12 is piled up so that the surface in which this several temperature sensor 36 was arrange | positioned may be contact | connected. At this time, the piece 12 to be measured and the attachment member 76 are bonded by a double-sided tape, and the piece 12 to be measured is attached to the fixed portion 22 side so that the end surface on the first end portion 13a side is in contact with the fixed portion 22. (See FIG. 15B).

この場合、取付部材76と被測定片12とが重なっている部分の温度分布が演算に用いられ、演算装置40の第2演算部54の第1導出部55は、被測定片12と取付部材76とを合わせた等価熱伝導率kを求める。そして、第2導出部56は、第1導出部55が求めた被測定片12と取付部材76との等価熱伝導率kと、被測定片情報部42aに格納されている被測定片12の厚さt、取付部材76の熱伝導率k、及び取付部材76の厚さtと、を用いて以下の式(14)から被測定片12の熱伝導率kを算出する。これにより、取付部材の長さよりも短ければ、種々の長さの被測定片12の熱伝導率kを容易に測定することができる。

Figure 0005646973
ここで、tは被測定片12の厚さtと取付部材76の厚さtとを合わせた厚さである。 In this case, the temperature distribution of the portion where the mounting member 76 and the measurement piece 12 overlap is used for the calculation, and the first derivation unit 55 of the second calculation unit 54 of the calculation device 40 is connected to the measurement piece 12 and the mounting member. Equivalent thermal conductivity k 4 is obtained by combining 76. The second deriving unit 56 then calculates the equivalent thermal conductivity k 4 between the measured piece 12 and the attachment member 76 obtained by the first deriving unit 55 and the measured piece 12 stored in the measured piece information unit 42a. The thermal conductivity k 1 of the piece 12 to be measured is calculated from the following equation (14) using the thickness t 1 , the thermal conductivity k b of the mounting member 76, and the thickness t b of the mounting member 76. . Thus, if shorter than the length of the mounting member, various lengths of the thermal conductivity k 1 of the measurement piece 12 can be easily measured.
Figure 0005646973
Here, t 4 is the combined thickness of the thickness t b of the thickness t 1 and the mounting member 76 of the measurement piece 12.

上記第1実施形態乃至第3実施形態では、被測定片12と比較片16とが共通の固定部22,22aに保持されているが、これに限定されず、被測定片12が保持される固定部と比較片16が保持される固定部とが別々の部材により構成されてもよい。また、固定部22,22aは、互いに平行に並ぶように被測定片12と比較片16とを保持しているが、これに限定されない。   In the first to third embodiments, the measurement piece 12 and the comparison piece 16 are held by the common fixing portions 22 and 22a. However, the present invention is not limited to this, and the measurement piece 12 is held. The fixing portion and the fixing portion where the comparison piece 16 is held may be configured by separate members. Moreover, although the fixing | fixed part 22 and 22a hold | maintain the to-be-measured piece 12 and the comparison piece 16 so that it may rank in parallel mutually, it is not limited to this.

上記第1実施形態乃至第3実施形態の測定部20,20aでは、被測定片12と比較片16との加熱及び温度分布の検出が同時に行われているが、これに限定されない。比較片16(被測定片12)の加熱及び温度分布の検出が行われたあと、被測定片12(比較片16)の加熱及び温度分布の検出が行われるように熱伝導率測定装置10,10a,10bが構成されてもよい。   In the measurement sections 20 and 20a of the first to third embodiments, the measurement piece 12 and the comparison piece 16 are heated and the temperature distribution is detected at the same time. However, the present invention is not limited to this. After the heating of the comparison piece 16 (measurement piece 12) and the detection of the temperature distribution, the thermal conductivity measuring device 10, so that the heating of the measurement piece 12 (comparison piece 16) and the detection of the temperature distribution are performed. 10a and 10b may be configured.

具体的に、熱伝導率測定装置は、図16に示されるように、測定部20を備え、この測定部20は、固定部22aと温度検出部30bとを備える。固定部22aは、被測定片12及び比較片16のいずれか一方を保持し、温度検出部30bは、固定部22aに保持された状態の被測定片12又は比較片16の長手方向の温度分布を検出する。   Specifically, as shown in FIG. 16, the thermal conductivity measurement device includes a measurement unit 20, and the measurement unit 20 includes a fixing unit 22a and a temperature detection unit 30b. The fixing portion 22a holds one of the measurement piece 12 and the comparison piece 16, and the temperature detection unit 30b is a temperature distribution in the longitudinal direction of the measurement piece 12 or the comparison piece 16 held by the fixation portion 22a. Is detected.

演算装置40は、第1演算部52と第2演算部54とを有する演算部50と、記憶部42と、送風手段制御部48と、表示部46とを備える。記憶部42は、第1演算部52で求められた比較片16の熱伝達率hを格納する熱伝達率記憶部42cを有する。 The computing device 40 includes a computing unit 50 having a first computing unit 52 and a second computing unit 54, a storage unit 42, a blower control unit 48, and a display unit 46. The storage unit 42 includes a heat transfer coefficient storage unit 42 c that stores the heat transfer coefficient h 2 of the comparison piece 16 obtained by the first calculation unit 52.

この熱伝導率測定装置10cでは、先ず、比較片16が固定部22aに固定された状態で加熱され、温度検出部30bにより比較片16の温度分布が検出される。演算装置40の第1演算部52(52a)は、この比較片16の温度分布と式(1)とからフィン効率φexpを求め、このフィン効率φexpと式(2)(第2実施形態のように比較片16の第4端部側端面が断熱条件のときは式(9))とを比較することにより、比較片16の単位長さあたりの熱抵抗比mを求める。第1演算部52(52a)は、比較片16の単位長さ当たりの熱抵抗比mが求まると、この単位長さ当たりの熱抵抗比mと、比較片情報部42bに格納されている比較片16の熱伝導率k及び形状とを用いて式(5)から比較片16の熱伝達率hを算出する。そして、第1演算部52(52a)は、この比較片16の熱伝達率hを出力して記憶部42の熱伝達率記憶部42cに格納させる。 In the thermal conductivity measuring device 10c, first, the comparison piece 16 is heated while being fixed to the fixing portion 22a, and the temperature distribution of the comparison piece 16 is detected by the temperature detection portion 30b. The first calculation unit 52 (52a) of the calculation device 40 obtains the fin efficiency φ exp from the temperature distribution of the comparison piece 16 and the equation (1), and the fin efficiency φ exp and the equation (2) (second embodiment). Thus, when the end face on the fourth end side of the comparison piece 16 is in a heat insulating condition, the thermal resistance ratio m 2 per unit length of the comparison piece 16 is obtained by comparing with the equation (9). First operation unit 52 (52a), when the thermal resistance ratio m 2 per unit length of comparison piece 16 is obtained, the thermal resistance ratio m 2 per the unit length, is stored in the comparison piece information unit 42b The heat transfer coefficient h 2 of the comparison piece 16 is calculated from the equation (5) using the thermal conductivity k 2 and the shape of the comparison piece 16. The first operation unit 52 (52a) outputs the heat transfer coefficient h 2 of the comparative piece 16 is stored in the heat transfer coefficient storage unit 42c of the storage unit 42.

次に、固定部22aに固定された比較片16が取り外され、被測定片12が固定部22aに固定される。そして、被測定片12が固定部22aに固定された状態で加熱され、温度検出部30bにより被測定片12の温度分布が検出される。演算装置40の第2演算部54(詳しくは、第1導出部55(55a))は、温度検出部30bで検出された被測定片12の温度分布と式(1)とから被測定片12のフィン効率φexpを求め、このフィン効率φexpと式(2)(第2実施形態のように被測定片12の第2端部側端面が断熱条件のときは式(9))とを比較することにより、被測定片12の単位長さ当たりの熱抵抗比mを求める。第1導出部55(55a)は、第1演算部52で求められて記憶部42の熱伝達率記憶部42cに格納されている比較片16の熱伝達率hを引き出し、この熱伝達率hと、被測定片12の単位長さ当たりの熱抵抗比mと、被測定片情報部42aに格納されている被測定片12の形状とを用いて式(7)から被測定片12の熱伝導率kを算出する。 Next, the comparison piece 16 fixed to the fixing portion 22a is removed, and the measured piece 12 is fixed to the fixing portion 22a. And the to-be-measured piece 12 is heated in the state fixed to the fixing | fixed part 22a, and the temperature distribution of the to-be-measured piece 12 is detected by the temperature detection part 30b. The second computing unit 54 (specifically, the first deriving unit 55 (55a)) of the computing device 40 calculates the measured piece 12 from the temperature distribution of the measured piece 12 detected by the temperature detecting unit 30b and the equation (1). The fin efficiency φ exp is obtained, and the fin efficiency φ exp and equation (2) (equation (9) when the end surface on the second end side of the measured piece 12 is adiabatic as in the second embodiment) are By comparing, the thermal resistance ratio m 1 per unit length of the measured piece 12 is obtained. First derivation unit 55 (55a), the heat transfer coefficient h 2 of the comparative pieces 16 stored calculated by the first calculating unit 52 to the heat transfer coefficient storage unit 42c of the storage unit 42 the drawer, the heat transfer coefficient The measured piece from Equation (7) using h 2 , the thermal resistance ratio m 1 per unit length of the measured piece 12, and the shape of the measured piece 12 stored in the measured piece information section 42 a. A thermal conductivity k 1 of 12 is calculated.

このように、比較片16と被測定片12とに対して、順に加熱及び温度分布検出が行われても、熱伝導率kが既知の比較片16を実際に加熱してその温度分布から求めた熱伝達率hを演算用熱伝達率として利用することによって、垂直配置の板状の被測定片に対する自然対流式や放射式といった計算式を用いた演算によって被測定片12の熱伝達率hを算出しなくても、被測定片12の熱伝導率kを求めることができる。 Thus, for a comparison piece 16 to be measured piece 12, even if carried out heating and temperature distribution detection in order, from the temperature distribution thermal conductivity k 2 is actually heated known comparison piece 16 by utilizing the heat transfer coefficient h 2 obtained as the calculation heat transfer coefficient, the heat transfer of the measurement piece 12 by a calculation using a formula such as natural convection and radiant against the plate to be measured pieces of vertical arrangement Even if the rate h 1 is not calculated, the thermal conductivity k 1 of the measured piece 12 can be obtained.

尚、被測定片12と比較片16とに対する加熱及び温度分布の検出が行われるときの当該被測定片12における雰囲気条件と比較片16における雰囲気条件とを同じにすることで、求める熱伝導率kの測定制度がより向上する。 Note that the thermal conductivity to be obtained is obtained by making the atmospheric condition in the measurement piece 12 and the atmospheric condition in the comparison piece 16 the same when the measurement piece 12 and the comparison piece 16 are heated and the temperature distribution is detected. measurement system of k 1 is further improved.

熱伝導率測定装置は、比較片16の加熱及び温度分布検出を行わずに、被測定片12の加熱及び温度分布検出を行うだけで、被測定片12の熱伝導率kを求めるように構成されてもよい。 The thermal conductivity measuring device obtains the thermal conductivity k 1 of the measured piece 12 only by heating the measured piece 12 and detecting the temperature distribution without heating the comparative piece 16 and detecting the temperature distribution. It may be configured.

例えば、上記第1実施形態の演算装置(例えば、コンピュータ等)40には、以下の熱伝導率算出プログラムが組み込まれている。   For example, the following thermal conductivity calculation program is incorporated in the arithmetic device (for example, a computer) 40 of the first embodiment.

被測定片12の一端部13aが加熱された状態で、当該被測定片12の一端部13aから他端部13bに向う方向に沿って連続的又は断続的に検出された被測定片12の温度分布と、熱伝導率kが既知の板状の比較片16の一端部17aが加熱された状態で、当該比較片16の一端部17aから他端部17bに向う方向に沿って連続又は断続に検出された比較片16の温度分布と、比較片16の熱伝導率kと、を演算装置40が受け取ることで、この演算装置40を、比較片16の単位長さ当たりの熱抵抗比mと、比較片16の熱伝導率kと、比較片16の温度分布と、から当該比較片16の熱伝達率hを求める第1演算部(比較片熱伝達率導出手段)52と、被測定片12の単位長さ当たりの熱抵抗比mと、第1演算部52で導出された比較片16の熱伝達率hと、被測定片12の温度分布と、から当該被測定片12の熱伝導率kを求める第2演算部54の第1導出部(被測定片熱伝導率導出手段)55と、して機能させる。 The temperature of the measurement piece 12 detected continuously or intermittently along the direction from the one end portion 13a of the measurement piece 12 to the other end portion 13b in a state where the one end portion 13a of the measurement piece 12 is heated. distribution and, with the thermal conductivity k 2 is one end 17a of a known plate-like comparison piece 16 is heated, continuously or intermittently along the direction toward the other end portion 17b from one end 17a of the comparison piece 16 The arithmetic device 40 receives the detected temperature distribution of the comparison piece 16 and the thermal conductivity k 2 of the comparison piece 16, so that the arithmetic device 40 has a thermal resistance ratio per unit length of the comparison piece 16. A first computing unit (comparison piece heat transfer coefficient deriving means) 52 for obtaining the heat transfer coefficient h 2 of the comparison piece 16 from m 2 , the thermal conductivity k 2 of the comparison piece 16, and the temperature distribution of the comparison piece 16. If a thermal resistance ratio m 1 per unit length of the measurement piece 12, the first operation unit 5 In the heat transfer coefficient h 2 of the comparative pieces 16 derived, first derivation unit of the second arithmetic unit 54 for obtaining the temperature distribution of the measurement piece 12, the thermal conductivity k 1 of the measured pieces 12 (the Measurement piece thermal conductivity deriving means) 55.

これに対し、演算装置(例えば、コンピュータ等)に、以下の熱伝導率算出プログラムが組み込まれてもよい。   On the other hand, the following thermal conductivity calculation program may be incorporated in an arithmetic device (for example, a computer etc.).

被測定片12の一端部13aが加熱された状態で、当該被測定片12の一端部13aから他端部13bに向う方向に沿って連続的又は断続的に検出された被測定片12の温度分布と、板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った温度分布に基づく演算用熱伝達率h2aと、を演算装置が受け取ることで、この演算装置を、被測定片12の単位長さ当たりの熱抵抗比mと、演算用熱伝達率h2aと、被測定片12の温度分布と、から当該被測定片12の熱伝導率kを求める第2演算部54aの第1導出部(被測定片熱伝導率導出手段)55として機能させる。 The temperature of the measurement piece 12 detected continuously or intermittently along the direction from the one end portion 13a of the measurement piece 12 to the other end portion 13b in a state where the one end portion 13a of the measurement piece 12 is heated. The arithmetic device receives the distribution and the heat transfer coefficient for calculation h 2a based on the temperature distribution along the direction from the one end to the other end of the member when the one end of the plate-like member is heated. The heat conduction of the measurement piece 12 is calculated from the thermal resistance ratio m 1 per unit length of the measurement piece 12, the heat transfer coefficient h 2a for calculation, and the temperature distribution of the measurement piece 12. first derivation unit of the second calculation unit 54a for obtaining the rate k 1 to function as (measured Katanetsu conductivity deriving means) 55.

具体的に、上記の熱伝導率算出プログラムが演算装置に組み込まれた熱伝導率測定装置は、図17に示されるように、測定部20と演算装置40とを備える。測定部20は、被測定片12を固定する固定部22aと、この固定部22aに固定された被測定片12の長手方向の温度分布を検出する温度検出部30bと、を有する。演算装置40は、第2演算部54aと、記憶部42と、送風手段制御部48と、表示部46とを備える。記憶部42は、演算用熱伝達率h2aを格納する熱伝達率記憶部142cを有する。演算用熱伝達率h2aは、熱伝導率kが既知の板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った板状部材の温度分布に基づくものであり、実験又はコンピュータ等での演算によって求められる。この演算用熱伝達率h2aは、入力部44等から予め記憶部42の熱伝達率記憶部142cに格納されている。具体的に、演算用熱伝達率h2aは、板状の部材の長手方向に沿った温度分布に対応する値であり、温度分布(温度分布を関数で近似したときにこの関数によって表される曲線の形状)が変化するとこれに対応して変化する。即ち、演算用熱伝達率h2aは、板状部材の温度分布の関数である。例えば、演算用熱伝達率h2aは、板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った板状部材の温度分布を関数f(x)で表した(又は近似した)ときにこの関数f(x)を変関数とする汎関数F(f(x))として表される。尚、熱伝達率記憶部142cに格納される演算用熱伝達率h2aは、板状部材の温度分布の関数に限定されない。例えば、異なる数千の板状部材における温度分布と、各温度分布が得られた板状部材の熱伝達率hとを関連付けて熱伝達率記憶部142cに格納させ、これら格納された温度分布から、検出した被測定片12の温度分布に近い温度分布を選択し、この選択した温度分布に対応する熱伝達率hを演算用熱伝達率h2aとして用いるように構成されてもよい。 Specifically, a thermal conductivity measurement device in which the above-described thermal conductivity calculation program is incorporated in an arithmetic device includes a measurement unit 20 and an arithmetic device 40 as shown in FIG. The measuring unit 20 includes a fixing unit 22a that fixes the measurement piece 12, and a temperature detection unit 30b that detects a temperature distribution in the longitudinal direction of the measurement piece 12 fixed to the fixing unit 22a. The calculation device 40 includes a second calculation unit 54 a, a storage unit 42, a blower unit control unit 48, and a display unit 46. Storage unit 42 has a heat transfer coefficient storage unit 142c that stores calculation heat transfer coefficient h 2a. The heat transfer coefficient for calculation h 2a is the temperature distribution of the plate member along the direction from one end portion to the other end portion of the member when the one end portion of the plate member having a known thermal conductivity k is heated. It is based on and is obtained by an experiment or calculation by a computer or the like. The calculation heat transfer coefficient h 2a is stored in advance in the heat transfer coefficient storage unit 142c of the storage unit 42 from the input unit 44 or the like. Specifically, the heat transfer coefficient for calculation h 2a is a value corresponding to the temperature distribution along the longitudinal direction of the plate-like member, and is expressed by this function when the temperature distribution (temperature distribution is approximated by a function). When the shape of the curve changes, it changes correspondingly. That is, the calculation heat transfer coefficient h 2a is a function of the temperature distribution of the plate member. For example, the heat transfer coefficient for calculation h 2a is a function f (x) of the temperature distribution of the plate member along the direction from one end portion to the other end portion of the member when the one end portion of the plate member is heated. Is expressed as a functional F (f (x)) having the function f (x) as a variable function. The calculation heat transfer coefficient h 2a stored in the heat transfer coefficient storage unit 142c is not limited to a function of the temperature distribution of the plate member. For example, the temperature distribution in thousands of different plate-like members and the heat transfer coefficient h of the plate-like member from which each temperature distribution is obtained are associated and stored in the heat transfer coefficient storage unit 142c, and from these stored temperature distributions The temperature distribution close to the detected temperature distribution of the measured piece 12 may be selected, and the heat transfer coefficient h corresponding to the selected temperature distribution may be used as the calculation heat transfer coefficient h 2a .

この熱伝導率測定装置10dでは、固定部22aに被測定片12が固定される。そして、被測定片12が固定部22aに固定された状態で加熱され、温度検出部30bによりその温度分布が検出される。演算装置40の第2演算部54a(詳しくは、第1導出部55)は、温度検出部30bで検出された被測定片12の温度分布と式(1)とから被測定片12のフィン効率φexpを求め、このフィン効率φexpと式(2)とを比較することにより、被測定片12の単位長さ当たりの熱抵抗比mを求める。第1導出部55は、記憶部42の熱伝達率記憶部142cに予め格納されている演算用熱伝達率h2aを引き出し、この演算用熱伝達率h2aと、被測定片12の単位長さ当たりの熱抵抗比mと、被測定片情報部42aに格納されている被測定片12の形状とを用いて式(7)から被測定片12の熱伝導率kを算出する。 In the thermal conductivity measuring device 10d, the measured piece 12 is fixed to the fixing portion 22a. And the to-be-measured piece 12 is heated in the state fixed to the fixing | fixed part 22a, and the temperature distribution is detected by the temperature detection part 30b. The second computing unit 54a (specifically, the first deriving unit 55) of the computing device 40 calculates the fin efficiency of the measured piece 12 from the temperature distribution of the measured piece 12 detected by the temperature detecting unit 30b and the equation (1). φ exp is obtained, and the thermal efficiency ratio m 1 per unit length of the measured piece 12 is obtained by comparing the fin efficiency φ exp with the formula (2). First derivation unit 55 draws calculation heat transfer coefficient h 2a which is previously stored in the heat transfer coefficient storage unit 142c of the storage unit 42, and this operation heat transfer coefficient h 2a, unit length of the measurement piece 12 The thermal conductivity k 1 of the measured piece 12 is calculated from the equation (7) using the thermal resistance ratio m 1 per unit and the shape of the measured piece 12 stored in the measured piece information section 42a.

この熱伝導率測定装置10dのように、温度分布の関数として記憶部42(詳しくは、熱伝達率記憶部142c)に格納される演算用熱伝達率h2aを利用しても、垂直配置の板状の被測定片12に対する自然対流式や放射式といった計算式を用いた演算によって被測定片12の熱伝達率hを算出しなくても、被測定片12の熱伝導率kを求めることができる。 As in the thermal conductivity measuring apparatus 10d, even if the calculation heat transfer coefficient h 2a stored in the storage unit 42 (specifically, the heat transfer coefficient storage unit 142c) is used as a function of the temperature distribution, Even if the heat transfer coefficient h 1 of the measured piece 12 is not calculated by a calculation using a calculation formula such as a natural convection formula or a radiation formula for the plate-like measured piece 12, the thermal conductivity k 1 of the measured piece 12 can be calculated. Can be sought.

また、温度分布の関数として記憶部に予め格納しておいた演算用熱伝達率h2aを用いることで、比較片(熱伝導率kが既知の板状の部材)16の温度分布を測定して比較片16の熱伝達率hを求める必要がないため、被測定片12の温度分布を測定するだけで、演算により被測定片12の熱伝導率kを求めることができる。これにより、装置構成の簡略化を図ることができる。 Further, the temperature distribution of the comparison piece (a plate-like member having a known thermal conductivity k) 16 is measured by using the calculation heat transfer coefficient h 2a stored in the storage unit in advance as a function of the temperature distribution. since it is not necessary to obtain the heat transfer coefficient h 2 of the comparative piece 16 Te, only measures the temperature distribution of the measurement piece 12, it is possible to determine the thermal conductivity k 1 of the measurement piece 12 by calculation. Thereby, simplification of an apparatus structure can be achieved.

上記第1実施形態乃至第3実施形態では、固定部22,22aが第1端部13a及び第3端部17aを加熱する加熱部を兼ねているが、これに限定されず、被測定片12(比較片16)を保持する固定部と、被測定片12(比較片16)の第1端部13a(第3端部17a)を加熱する加熱部とがそれぞれ設けられてもよい。   In the first to third embodiments, the fixing portions 22 and 22a also serve as a heating portion for heating the first end portion 13a and the third end portion 17a. A fixing portion that holds the (comparison piece 16) and a heating portion that heats the first end portion 13a (third end portion 17a) of the measurement target piece 12 (comparison piece 16) may be provided.

上記第1実施形態乃至第3実施形態では、熱伝導率kが測定される被測定物(被測定片12)は、定形性を有する素材であるが、これに限定されない。即ち、熱伝導率測定装置は、樹脂やグリース等の軟質材料の熱伝導率kを測定することも可能である。 In the first to third embodiments, the object to be measured thermal conductivity k 1 is measured (the measured piece 12) is a material having a fixed form, but is not limited thereto. That is, the thermal conductivity measuring device can also measure the thermal conductivity k of a soft material such as resin or grease.

具体的には、この場合、被測定片12が、図18に示すように、一対の厚さ調整薄片15,15の間に軟質材料19を挟み込むことにより構成される。   Specifically, in this case, the piece 12 to be measured is configured by sandwiching a soft material 19 between a pair of thickness adjusting thin pieces 15 and 15 as shown in FIG.

そして、入力部44から記憶部42の被測定片情報部42aに、軟質材料19の厚さ(即ち、一対の厚さ調整薄片15,15の間隔)tと、被測定片12の厚さt(=t+2t)と、が入力され、第2演算部54の第2導出部56が、第1導出部55が求めた被測定片12(軟質材料19を一対の厚さ調整薄片15,15で挟み込んだ被測定片12)の熱伝導率kに基づいて、軟質材料19の熱伝導率kを求める。具体的に、第2導出部56は、第1導出部55で求められた被測定片12の熱伝導率kと、被測定片12の厚さt(=t+2t)と、被測定片情報部42aに格納されている軟質材料19の厚さ(即ち、一対の厚さ調整薄片15,15の間隔)tと、被測定片情報部42aに格納されている厚さ調整薄片15の熱伝導率k及び厚さ調整薄片15の厚さtとから以下の式(15)により軟質材料19の熱伝導率kを算出する。

Figure 0005646973
Then, the measurement piece information section 42a of the storage unit 42 from the input unit 44, the thickness of the soft material 19 (i.e., distance between the pair of thickness adjusting lamina 15, 15) t s and the thickness of the measurement piece 12 t 1 (= t s + 2t p ) is input, and the second deriving unit 56 of the second computing unit 54 adjusts the pair of thicknesses of the measured piece 12 (soft material 19) obtained by the first deriving unit 55. Based on the thermal conductivity k 1 of the measured piece 12) sandwiched between the thin pieces 15, 15, the thermal conductivity k s of the soft material 19 is obtained. Specifically, the second derivation unit 56 includes the thermal conductivity k 1 of the measured piece 12 obtained by the first derivation unit 55, the thickness t 1 (= t s + 2t p ) of the measured piece 12, and the thickness of the soft material 19 stored in the measured piece information section 42a (i.e., the distance between the pair of thickness adjusting lamina 15, 15) t s and, adjusting the thickness stored in the measured piece information section 42a the equation (15) below and a thickness t p of the thermal conductivity k p and thickness control slices 15 slices 15 calculates the thermal conductivity k s soft material 19.
Figure 0005646973

このように測定することで、被測定片12における軟質材料19と厚さ調整薄片15との間の界面熱抵抗が影響しないため軟質材料19そのものの熱伝導率が得られる。即ち、従来の一方向熱流定常比較法では、得られる熱伝導率に界面熱抵抗成分の影響が大きく現れるが、上記のようにして得られた熱伝導率kに含まれている界面熱抵抗成分は、他の熱抵抗成分に比べて無視できるため軟質材料19の熱伝導率kがより高精度に得られる。 By measuring in this way, the thermal conductivity of the soft material 19 itself can be obtained because the interface thermal resistance between the soft material 19 and the thickness adjusting thin piece 15 in the measured piece 12 is not affected. That is, in the conventional one-way heat flow steady comparison method, the influence of the interfacial thermal resistance component appears greatly on the obtained thermal conductivity, but the interfacial thermal resistance included in the thermal conductivity k s obtained as described above. Since the component can be ignored as compared with other thermal resistance components, the thermal conductivity k s of the soft material 19 can be obtained with higher accuracy.

尚、軟質材料19の熱伝導率kを測定するための被測定片12では、厚さ調整薄片15の厚さが薄く且つ軟質材料19の厚さtが厚いほど、得られる熱伝導率kの精度が高くなる。詳しくは、以下の理由による。 In the measured piece 12 for measuring the thermal conductivity k s of soft material 19, as the thickness t s of the thickness of thin and soft material 19 in the thickness adjustment lamina 15 is thick, obtained thermal conductivity The accuracy of k s is increased. The details are as follows.

軟質材料(例えば、グリース)19の熱伝導率kとこれを挟む厚さ調整薄片(例えば、SUSで形成された板)15の厚さtに対する被測定片12の有効熱伝導率を求め、その結果を図19(A)及び図19(B)に示す。これらの図において、グラフにおける曲線の右上がり勾配が大きくなるほど軟質材料19の熱伝導率kを感度よく測定することができる。図19(A)及び図19(B)によれば、厚さが1mmの厚さ調整薄片15を表す曲線よりも厚さが0.1mmの厚さ調整薄片15を表す曲線の方が、曲線の右上がりの勾配が大きくなっていることがわかる。また、厚さが0.1mmの軟質材料19を表す曲線よりも厚さが0.5mmのグラフの方がグラフの右側が立ち上がり、この0.5mmのグラフよりも1mmの軟質材料19を表す曲線の方がさらに右上がりの勾配が大きくなっていることがわかる。従って、被測定片12を形成するときに、厚さ調整薄片15の厚さtをより薄くし且つ軟質材料19の厚さtをより厚くすることにより、得られる軟質材料19の熱伝導率kの精度がより向上する。 Soft material (e.g., grease) thermal conductivity of 19 k s and thickness control slices sandwiching the (e.g., a plate formed of SUS) seeking effective thermal conductivity of the measurement piece 12 with respect to the thickness t p of 15 The results are shown in FIGS. 19 (A) and 19 (B). In these figures, the thermal conductivity k s of the soft material 19 can be measured with higher sensitivity as the upward slope of the curve in the graph increases. According to FIGS. 19A and 19B, the curve representing the thickness adjusting flake 15 having a thickness of 0.1 mm is more curved than the curve representing the thickness adjusting flake 15 having a thickness of 1 mm. It can be seen that the slope of rising to the right is larger. Further, the right side of the graph with a thickness of 0.5 mm rises from the curve representing the soft material 19 having a thickness of 0.1 mm, and the curve representing the soft material 19 having a thickness of 1 mm than the graph having the thickness of 0.5 mm. It can be seen that the slope of the upward slope is larger. Therefore, when forming the measured pieces 12, by thicker thickness t s of the thinner the thickness t p of the thickness adjusting lamina 15 and the soft material 19, the thermal conductivity of the resulting soft material 19 The accuracy of the rate k s is further improved.

上記第1実施形態乃至第3実施形態では、熱伝導率の被測定物(被測定片本体)14の厚さが小さいときには、厚さ調整薄片15と積層して被測定片12を構成することにより、熱が流れる断面積を大きくして被測定物14の熱伝導率を測定しているが、複数の被測定物を積層して被測定片12を構成することにより熱が流れる断面積を大きくしてもよい。即ち、同じ材質の板状部材であれば一枚で求めた熱伝導率も複数枚重ねて求めた熱伝導率も同じ値となるため、複数の被測定物を積層して被測定片12を構成することによって、一端部13aから他端部13bに向う熱流の通過する断面積を大きくして一端部13aから他端部13bに向けて流れる熱の温度勾配を演算に適した大きさとし、これにより、薄い又は熱伝導率が小さな被測定物の熱伝導率を求めることが可能となる。   In the first to third embodiments, when the thickness of the object to be measured (measurement piece main body) 14 having a low thermal conductivity is small, the measurement piece 12 is configured by being laminated with the thickness adjusting thin piece 15. The thermal conductivity of the device under test 14 is measured by increasing the cross-sectional area through which heat flows. You may enlarge it. That is, in the case of a plate member of the same material, the thermal conductivity obtained by one sheet and the thermal conductivity obtained by stacking a plurality of sheets have the same value. By configuring, the cross-sectional area through which the heat flow from the one end portion 13a to the other end portion 13b passes is increased, and the temperature gradient of the heat flowing from the one end portion 13a to the other end portion 13b is set to a size suitable for calculation. Thus, it is possible to obtain the thermal conductivity of the object to be measured which is thin or has a small thermal conductivity.

10,10a,10b 熱伝導率測定装置
12 被測定片
13a 第1端部(被測定片の一端部)
13b 第2端部(被測定片の他端部)
14 被測定片本体
15 厚さ調整薄片
16 比較片
16a,16b,16c 比較薄片
17a 第3端部(比較片の一端部)
17b 第4端部(比較片の他端部)
22,22a 固定部
32,32a 第1検出部(被測定片温度分布検出部)
34,34a 第2検出部(比較片温度分布検出部)
36,136 温度センサ
37 送風ファン(送風手段)
38 整流板
40 演算装置
42 記憶部
44 入力部
52,52a 第1演算部(比較片熱伝達率導出部)
54,54a 第2演算部(被測定片熱伝導率導出部)
55,55a 第1導出部
56 第2導出部
被測定片の熱伝達率
比較片の熱伝達率
被測定片の熱伝導率
比較片の熱伝導率(等価熱伝導率)
厚さ調整薄片の熱伝導率
単位長さ当たりの被測定片の熱抵抗比
単位長さ当たりの比較片の熱抵抗比
cd1 被測定片の熱伝導抵抗
cd2 比較片の熱伝導抵抗
cv1 被測定片の熱伝達抵抗
cv2 比較片の熱伝達抵抗
φexp フィン効率
10, 10a, 10b Thermal conductivity measuring device 12 Test piece 13a First end (one end of the test piece)
13b Second end (the other end of the measured piece)
14 Measurement piece body 15 Thickness adjustment thin piece 16 Comparison piece 16a, 16b, 16c Comparison thin piece 17a Third end (one end of comparison piece)
17b Fourth end (the other end of the comparison piece)
22, 22a fixed part 32, 32a first detection part (measurement piece temperature distribution detection part)
34, 34a Second detector (comparison piece temperature distribution detector)
36, 136 Temperature sensor 37 Blower fan (Blower unit)
38 rectifier plate 40 arithmetic unit 42 storage unit 44 input units 52, 52a first arithmetic unit (comparison piece heat transfer coefficient deriving unit)
54, 54a Second calculation unit (measurement piece thermal conductivity deriving unit)
55, 55a 1st derivation part 56 2nd derivation part h 1 heat transfer coefficient h of the piece to be measured h 2 heat transfer coefficient k of the comparison piece 1 heat conductivity of the piece to be measured k 2 heat conductivity of the comparison piece (equivalent heat conduction) rate)
k p thickness adjusting thermal conductivity m 1 unit thermal resistivity R cd2 comparison piece of thermal resistance ratio R cd1 measured piece of Comparative pieces per thermal resistance ratio m 2 unit length of the measured pieces per length of the foil the heat transfer resistance phi exp fin efficiency of the thermal resistivity R cv1 heat transfer resistance R cv2 comparison pieces of the measurement piece

Claims (17)

板状の被測定片の熱伝導率を導出するための熱伝導率測定装置であって、
前記被測定片の一端部を加熱する加熱部と、
前記被側定片の一端部から他端部に向う方向に沿って連続的又は断続的に当該被測定片の温度分布を検出する温度分布検出部と、
前記被測定片の熱伝導率を算出する演算装置と、を備え、
前記演算装置は、演算用熱伝達率を格納する記憶部と、前記被測定片の内部を一端部から他端部に向って熱が流れるときの抵抗である第1の熱伝導抵抗と前記被測定片の表面から当該被測定片の周囲の空間に熱が出るときの抵抗である第1の熱伝達抵抗との比である第1の熱抵抗比と、前記記憶部に格納される演算用熱伝達率と、前記温度分布検出部により検出された前記被測定片の温度分布と、から当該被測定片の熱伝導率を求める被測定片熱伝導率導出部と、を有し、
前記演算用熱伝達率は、熱伝導率が既知の板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った板状部材温度分布に基づいている熱伝導率測定装置。
A thermal conductivity measuring device for deriving the thermal conductivity of a plate-like measured piece,
A heating unit that heats one end of the measured piece;
A temperature distribution detector that detects the temperature distribution of the measured piece continuously or intermittently along the direction from one end of the fixed piece to the other end;
An arithmetic unit for calculating the thermal conductivity of the measurement piece,
The computing device includes a storage unit that stores a heat transfer coefficient for computation, a first heat conduction resistance that is a resistance when heat flows from one end portion to the other end portion of the measured piece, and the measured target. A first thermal resistance ratio, which is a ratio of the first heat transfer resistance, which is a resistance when heat is generated from the surface of the measurement piece to the space around the measurement piece, and an operation stored in the storage unit A measured piece thermal conductivity deriving unit for obtaining a thermal conductivity of the measured piece from a heat transfer coefficient and a temperature distribution of the measured piece detected by the temperature distribution detecting unit;
The calculation heat transfer coefficient is based on a plate-like member temperature distribution along a direction from one end portion to the other end portion of the member when the one end portion of the plate-like member having a known thermal conductivity is heated. Thermal conductivity measuring device.
前記演算用熱伝達率は、前記板状部材温度分布の関数として前記記憶部に格納される請求項1に記載の熱伝導率測定装置。   The thermal conductivity measuring device according to claim 1, wherein the heat transfer coefficient for calculation is stored in the storage unit as a function of the temperature distribution of the plate member. 前記加熱部は、熱伝導率が既知の板状の部材である比較片の一端部を加熱可能であり、
前記温度分布検出部は、前記比較片の一端部から他端部に向う方向に沿って連続的又は断続的に当該比較片の温度分布を検出可能であり、
前記演算装置は、前記比較片の内部を一端部から他端部に向って熱が流れるときの抵抗である第2の熱伝導抵抗と前記比較片の表面から当該比較片の周囲の空間に熱が出るときの抵抗である第2の熱伝達抵抗との比である第2の熱抵抗比と、前記比較片の熱伝導率と、前記温度分布検出部により検出された前記比較片の温度分布と、から当該比較片の熱伝達率を求める比較片熱伝達率導出部を有し、
前記記憶部は、前記比較片熱伝達率導出部で求めた比較片の熱伝達率を前記演算用熱伝達率として格納する請求項1又は2に記載の熱伝導率測定装置。
The heating unit is capable of heating one end of a comparison piece that is a plate-like member having a known thermal conductivity,
The temperature distribution detector can detect the temperature distribution of the comparison piece continuously or intermittently along the direction from one end of the comparison piece to the other end,
The arithmetic unit heats the interior of the comparison piece from the surface of the comparison piece to the second heat conduction resistance, which is a resistance when heat flows from one end to the other end, and to the space around the comparison piece. The second heat resistance ratio, which is the ratio with the second heat transfer resistance, which is the resistance when the heat is emitted, the thermal conductivity of the comparison piece, and the temperature distribution of the comparison piece detected by the temperature distribution detector And a comparison piece heat transfer coefficient derivation unit for obtaining the heat transfer coefficient of the comparison piece from
The thermal conductivity measuring device according to claim 1, wherein the storage unit stores the heat transfer coefficient of the comparison piece obtained by the comparison piece heat transfer coefficient deriving unit as the heat transfer coefficient for calculation.
前記加熱部は、前記被測定片の一端部を加熱する被測定片加熱部と、熱伝導率が既知の板状の比較片の一端部を加熱する比較片加熱部とを有し、
前記温度分布検出部は、被側定片の一端部から他端部に向う方向に沿って連続的又は断続的に当該被測定片の温度分布を検出する被測定片温度分布検出部と、前記比較片の一端部から他端部に向う方向に沿って連続的又は断続的に当該比較片の温度分布を検出する比較片温度分布検出部と、を有し、
前記被測定片熱伝導率導出部は、前記第1の熱抵抗比と、前記記憶部に格納される演算用熱伝達率と、前記被測定片温度分布検出部により検出された前記被測定片の温度分布と、から当該被測定片の熱伝導率を求める請求項3に記載の熱伝導率測定装置。
The heating unit includes a measurement piece heating unit that heats one end of the measurement piece, and a comparison piece heating unit that heats one end of a plate-like comparison piece having a known thermal conductivity,
The temperature distribution detection unit is a measurement piece temperature distribution detection unit that detects the temperature distribution of the measurement piece continuously or intermittently along a direction from one end portion of the measurement target piece to the other end portion, and A comparison piece temperature distribution detection unit that detects the temperature distribution of the comparison piece continuously or intermittently along the direction from one end of the comparison piece to the other end;
The measured piece thermal conductivity deriving unit includes the first thermal resistance ratio, a calculation heat transfer coefficient stored in the storage unit, and the measured piece detected by the measured piece temperature distribution detecting unit. The thermal conductivity measuring device according to claim 3, wherein the thermal conductivity of the measured piece is obtained from the temperature distribution of the sample.
前記被測定片の周囲と前記比較片の周囲とを同じ雰囲気条件に制御するための雰囲気制御手段を備える請求項4に記載の熱伝導率測定装置。   The thermal conductivity measuring apparatus according to claim 4, further comprising an atmosphere control unit configured to control the periphery of the measurement piece and the periphery of the comparison piece under the same atmospheric condition. 前記被測定片熱伝導率導出部は、前記第1の熱抵抗比と前記比較片熱伝達率導出部で求められた比較片の熱伝達率と前記被測定片温度分布検出部で検出された被測定片の温度分布とから当該被測定片の熱伝導率を求める第1導出部と、
前記被測定片が被測定薄片と熱伝導率が既知で且つ板状の1又は複数の厚さ調整薄片とを積層することにより構成されている場合に、前記第1導出部で求められた被測定片の熱伝導率と当該被測定片の厚さと前記被測定薄片の厚さと前記厚さ調整薄片の熱伝導率と当該厚さ調整薄片の厚さとから、前記被測定薄片の熱伝導率を求める第2導出部と、を有する請求項3乃至5のいずれか1項に記載の熱伝導率測定装置。
The measurement piece thermal conductivity deriving unit is detected by the first piece of thermal resistance ratio and the heat transfer coefficient of the comparison piece obtained by the comparison piece heat transfer coefficient deriving unit and the measurement piece temperature distribution detection unit. A first derivation unit for obtaining the thermal conductivity of the measurement piece from the temperature distribution of the measurement piece;
When the measured piece is configured by laminating the measured thin piece and one or more plate-shaped thickness adjusting thin pieces with known thermal conductivity, the measured value obtained by the first deriving unit is obtained. From the thermal conductivity of the measurement piece, the thickness of the measurement piece, the thickness of the measurement piece, the thermal conductivity of the thickness adjustment piece, and the thickness of the thickness adjustment piece, the thermal conductivity of the measurement piece is determined. The thermal conductivity measuring device according to claim 3, further comprising a second derivation unit to be obtained.
互いに同一又は異なる熱伝導率の複数の比較薄片を積層することにより構成される比較片を備える請求項3乃至6のいずれか1項に記載の熱伝導率測定装置。   The thermal conductivity measuring device according to any one of claims 3 to 6, further comprising a comparative piece configured by stacking a plurality of comparative thin pieces having the same or different thermal conductivities. 板状の被測定片の熱伝導率を算出するための熱伝導率演算装置であって、
演算用熱伝達率を格納すると共に、前記被測定片の一端部が加熱された状態で当該被測定片の一端部から他端部に向う方向に沿って連続的又は断続的に検出された当該被測定片の温度分布を格納する記憶部と、
前記被測定片の内部を一端部から他端部に向って熱が流れるときの抵抗である第1の熱伝導抵抗と前記被測定片の表面から当該被測定片の周囲の空間に熱が出るときの抵抗である第1の熱伝達抵抗との比である第1の熱抵抗比と、前記記憶部に格納される演算用熱伝達率と、前記記憶部に格納される前記被測定片の温度分布と、から当該被測定片の熱伝導率を求める被測定片熱伝導率導出部と、を備え、
前記演算用熱伝達率は、熱伝導率が既知の板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った板状部材温度分布に基づいている熱伝導率演算装置。
A thermal conductivity calculation device for calculating the thermal conductivity of a plate-shaped measurement piece,
The heat transfer coefficient for calculation is stored, and the one end of the measurement piece is continuously or intermittently detected along the direction from one end to the other end of the measurement piece while being heated. A storage unit for storing the temperature distribution of the measured piece;
Heat is emitted from the surface of the measurement piece to the space around the measurement piece, the first heat conduction resistance that is resistance when heat flows from one end to the other end of the measurement piece. A first heat resistance ratio that is a ratio to the first heat transfer resistance that is a resistance of the operation, a heat transfer coefficient for calculation stored in the storage unit, and the measured piece stored in the storage unit A temperature distribution, and a measured piece thermal conductivity derivation unit for obtaining the thermal conductivity of the measured piece from the temperature distribution,
The calculation heat transfer coefficient is based on a plate-like member temperature distribution along a direction from one end portion to the other end portion of the member when the one end portion of the plate-like member having a known thermal conductivity is heated. Thermal conductivity calculator.
前記演算用熱伝達率は、前記板状部材温度分布を変数とする関数として前記記憶部に格納される請求項8に記載の熱伝導率演算装置。   The thermal conductivity calculation device according to claim 8, wherein the heat transfer coefficient for calculation is stored in the storage unit as a function having the plate member temperature distribution as a variable. 前記記憶部は、熱伝導率が既知の板状の部材である比較片の当該熱伝達率と、前記比較片の一端部が加熱された状態で当該比較片の一端部から他端部に向う方向に沿って連続的又は断続的に検出された当該比較片の温度分布と、を格納し、
前記演算部は、前記比較片の内部を一端部から他端部に向って熱が流れるときの抵抗である第2の熱伝導抵抗と前記比較片の表面から当該比較片の周囲の空間に熱が出るときの抵抗である第2の熱伝達抵抗との比である第2の熱抵抗比と、前記記憶部に格納される比較片の熱伝導率と、前記記憶部に格納される比較片の温度分布と、から当該比較片の熱伝達率を求める比較片熱伝達率導出部を有し、
前記比較片熱伝達率導出部は、当該比較片熱伝達率導出部において求められた比較片の熱伝達率を前記演算用熱伝達率として前記記憶部に格納させる請求項8又は9に記載の熱伝導率演算装置。
The storage unit is directed from the one end of the comparison piece to the other end in a state where the heat transfer coefficient of the comparison piece, which is a plate-like member having a known thermal conductivity, and one end of the comparison piece is heated. Storing the temperature distribution of the comparison piece detected continuously or intermittently along the direction,
The arithmetic unit heats the interior of the comparison piece from the surface of the comparison piece to the second heat conduction resistance which is a resistance when heat flows from one end to the other end and the space around the comparison piece. A second heat resistance ratio that is a ratio with a second heat transfer resistance that is a resistance at the time of occurrence of heat, a thermal conductivity of a comparison piece stored in the storage unit, and a comparison piece stored in the storage unit A heat distribution coefficient deriving section for obtaining the heat transfer coefficient of the comparison piece from the temperature distribution of
The comparison piece heat transfer coefficient derivation unit stores the heat transfer coefficient of the comparison piece obtained in the comparison piece heat transfer coefficient derivation unit in the storage unit as the heat transfer coefficient for calculation. Thermal conductivity calculator.
板状の被測定片の熱伝導率を算出するための熱伝導率算出プログラムであって、
前記被測定片の一端部が加熱された状態で、当該被測定片の一端部から他端部に向う方向に沿って連続的又は断続的に検出された被測定片の温度分布と、板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った第1の温度分布に基づく演算用熱伝達率と、をコンピュータが受け取ることで、
このコンピュータを、
前記被測定片の内部を一端部から他端部に向って熱が流れるときの抵抗である第1の熱伝導抵抗と前記被測定片の表面から当該被測定片の周囲の空間に熱が出るときの抵抗である第1の熱伝達抵抗との比である第1の熱抵抗比と、前記演算用熱伝達率と、前記被測定片の温度分布と、から当該被測定片の熱伝導率を求める被測定片熱伝導率導出手段として機能させるための熱伝導率算出プログラム。
A thermal conductivity calculation program for calculating the thermal conductivity of a plate-shaped object to be measured,
In a state where one end of the measured piece is heated, the temperature distribution of the measured piece detected continuously or intermittently along the direction from the one end to the other end of the measured piece, and a plate shape When the computer receives the heat transfer coefficient for calculation based on the first temperature distribution along the direction from one end to the other end of the member when one end of the member is heated,
This computer,
Heat is emitted from the surface of the measurement piece to the space around the measurement piece, the first heat conduction resistance that is resistance when heat flows from one end to the other end of the measurement piece. The thermal conductivity of the measured piece from the first thermal resistance ratio, which is a ratio to the first heat transfer resistance that is the resistance of the time, the heat transfer coefficient for calculation, and the temperature distribution of the measured piece The thermal conductivity calculation program for making it function as a to-be-measured piece thermal conductivity derivation means for calculating | requiring.
板状の被測定片の熱伝導率を導出するための熱伝導率測定方法であって、
前記被測定片の一端部を加熱し、この被測定片の一端部から他端部に向う方向に沿って連続又は断続した当該被測定片の温度分布を検出する被測定片温度分布検出工程と、
前記被測定片の内部を一端部から他端部に向って熱が流れるときの抵抗である第1の熱伝導抵抗と前記被測定片の表面から当該被測定片の周囲の空間に熱が出るときの抵抗である第1の熱伝達抵抗との比である第1の熱抵抗比と、板状の部材の一端部を加熱したときの当該部材における一端部から他端部に向かう方向に沿った板状部材温度分布に基づく演算用熱伝達率と、前記被測定片温度分布検出工程で検出された前記被測定片の温度分布と、から当該被測定片の熱伝導率を求める被測定片熱伝導率導出工程と、を備える熱伝導率測定方法。
A thermal conductivity measurement method for deriving the thermal conductivity of a plate-shaped measurement piece,
A measurement piece temperature distribution detection step of heating one end of the measurement piece and detecting a temperature distribution of the measurement piece continuously or intermittently along a direction from the one end to the other end of the measurement piece; ,
Heat is emitted from the surface of the measurement piece to the space around the measurement piece, the first heat conduction resistance that is resistance when heat flows from one end to the other end of the measurement piece. Along the direction from one end of the member to the other end when the one end of the plate-like member is heated, and the first heat resistance ratio that is the ratio of the first heat transfer resistance that is the resistance The measured piece for obtaining the thermal conductivity of the measured piece from the heat transfer coefficient for calculation based on the plate member temperature distribution and the temperature distribution of the measured piece detected in the measured piece temperature distribution detecting step A thermal conductivity measurement method comprising: a thermal conductivity derivation step.
前記演算用熱伝達率は、前記板状部材温度分布を変数とする関数として予め求められている請求項12に記載の熱伝導率測定方法。   The thermal conductivity measurement method according to claim 12, wherein the heat transfer coefficient for calculation is obtained in advance as a function having the plate member temperature distribution as a variable. 熱伝導率が既知の板状の部材である比較片の一端部を加熱し、この比較片の一端部から他端部に向う方向に沿って連続又は断続した当該比較片の温度分布を検出する比較片温度分布検出工程と、
前記比較片の内部を一端部から他端部に向って熱が流れるときの抵抗である第2の熱伝導抵抗と前記比較片の表面から当該比較片の周囲の空間に熱が出るときの抵抗である第2の熱伝達抵抗との比である第2の熱抵抗比と、前記比較片の熱伝導率と、前記比較片温度分布検出工程で検出された前記比較片の温度分布と、から当該比較片の熱伝達率を求める比較片熱伝達率導出工程と、を備え、
前記被測定片熱伝導率導出工程は、前記比較片熱伝達率導出工程で求められる前記比較片の熱伝達率を前記演算用熱伝達率として前記被測定片の熱伝導率を求める請求項16又は13に記載の熱伝導率測定方法。
One end of a comparison piece, which is a plate-like member having a known thermal conductivity, is heated, and the temperature distribution of the comparison piece that is continuous or intermittent along the direction from one end to the other end of the comparison piece is detected. A comparison piece temperature distribution detection step;
A second heat conduction resistance which is a resistance when heat flows from one end to the other end in the inside of the comparison piece and a resistance when heat is emitted from the surface of the comparison piece to the space around the comparison piece A second heat resistance ratio that is a ratio to the second heat transfer resistance, a thermal conductivity of the comparison piece, and a temperature distribution of the comparison piece detected in the comparison piece temperature distribution detection step. A comparison piece heat transfer coefficient derivation step for obtaining a heat transfer coefficient of the comparison piece,
17. The measurement piece thermal conductivity deriving step obtains the thermal conductivity of the measurement piece using the heat transfer coefficient of the comparison piece obtained in the comparison piece heat transfer coefficient deriving step as the heat transfer coefficient for calculation. Or the thermal conductivity measuring method of 13.
前記比較片温度分布検出工程の前に、互いに同一又は異なる熱伝導率の複数の比較薄片を積層することにより前記比較片を形成する比較片形成工程を備え、
前記比較片形成工程では、前記比較片温度分布検出工程で検出される温度分布が前記被測定片温度分布検出工程で検出される被測定片の温度分布に近くなるように、前記互いに同一又は異なる熱伝導率の複数の比較薄片が組み合わされて前記比較片が形成される請求項14に記載の熱伝導率測定方法。
Before the comparison piece temperature distribution detection step, comprising a comparison piece forming step of forming the comparison piece by laminating a plurality of comparison thin pieces having the same or different thermal conductivity,
In the comparison piece forming step, the temperature distribution detected in the comparison piece temperature distribution detection step is the same or different from each other so that the temperature distribution of the measurement piece detected in the measurement piece temperature distribution detection step is close to the temperature distribution of the measurement piece. The thermal conductivity measuring method according to claim 14, wherein a plurality of comparative thin pieces having thermal conductivity are combined to form the comparative piece.
前記被測定片温度分布検出工程の前に、複数の被測定薄片を積層することにより前記被測定片を形成する被測定片作成工程を備える請求項12乃至15のいずれか1項に記載の熱伝導率測定方法。   The heat according to any one of claims 12 to 15, further comprising a measurement piece creation step of forming the measurement piece by laminating a plurality of measurement thin pieces before the measurement piece temperature distribution detection step. Conductivity measurement method. 前記被測定片温度分布検出工程の前に、被測定薄片と熱伝導率が既知で且つ板状の1又は複数の厚さ調整薄片とを積層することにより前記被測定片を形成する被測定片形成工程と、
前記被測定片熱伝導率導出工程で求められた前記被測定片の熱伝導率と当該被測定片の厚さと前記被測定薄片の厚さと前記厚さ調整薄片の熱伝導率と当該厚さ調整薄片の厚さとから、前記被測定薄片の熱伝導率を求める被測定薄片熱伝導率導出工程と、を備える請求項12乃至15のいずれか1項に記載の熱伝導率測定方法。
Before the measurement piece temperature distribution detecting step, the measurement piece is formed by laminating the measurement piece and one or more plate-shaped thickness adjustment pieces with known thermal conductivity. Forming process;
The thermal conductivity of the measured piece, the thickness of the measured piece, the thickness of the measured thin piece, the thermal conductivity of the thickness adjustment thin piece, and the thickness adjustment obtained in the step of deriving the measured piece thermal conductivity The thermal conductivity measuring method according to any one of claims 12 to 15, further comprising: a measured thin piece thermal conductivity derivation step for obtaining a thermal conductivity of the measured thin piece from a thickness of the thin piece.
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