JP5652607B2 - Management method of electronic component mounting line - Google Patents

Description

  The present invention relates to an electronic component having a plurality of work devices having a work head for performing work related to mounting of the electronic component on a multi-sided board having a plurality of split substrate parts which are treated as independent substrates when divided. It relates to the management method of the mounting line.

  This type of electronic component mounting line management system is disclosed in, for example, Japanese Patent Application Laid-Open No. H10-228707. In general, since each work device recognizes the position of each split substrate portion of the multi-sided board, it is necessary to recognize this position in all work devices constituting the electronic component mounting line.

Japanese Patent Laid-Open No. 11-347859

  However, if the position of each split board portion of the multi-sided board is recognized for each work device, the overlapping position recognition work is performed, so that the productivity of the entire electronic component mounting line cannot be improved.

  Therefore, based on each split board part position information detected for the multi-sided board in the upstream work device, when working using the split board part position information for the multi-sided board inherited in the downstream side device An object is to improve the productivity of the multi-sided substrate.

For this reason, the first invention includes a plurality of work devices having work heads for performing work related to mounting of electronic components on a multi-sided board having a plurality of split board parts which are treated as independent boards when divided. In the management method of the equipped electronic component mounting line,
Each recognition camera captures the positioning mark of each split substrate portion of the first multi-sided substrate in the same lot and is recognized by each recognition processing device in each work device, and the recognition result is stored in the storage means. ,
For the second and subsequent multi-sided boards in the same lot, the recognition camera picks up the positioning mark of each divided board part only in the head work apparatus managed in the electronic component mounting line, and the recognition processing apparatus recognizes it. And
In the second and subsequent work devices, the recognition results of the first multi-sided substrate in each work device, the recognition results of the multi-sided substrate in the second and subsequent work devices, and the multi-sided substrate Based on the result of imaging and recognizing only the board recognition mark for recognizing the entire position, the second and subsequent multi-sided boards perform work related to mounting of electronic components.

According to a second aspect of the present invention, there is provided a plurality of work devices having a work head for performing work related to mounting of electronic components on a multi-sided board having a plurality of split board parts which are treated as independent boards when divided. In the management method of the equipped electronic component mounting line,
Each recognition camera captures the positioning mark of each split substrate portion of the first multi-sided substrate in the same lot and is recognized by each recognition processing device in each work device, and the recognition result is stored in the storage means. ,
For the second and subsequent multi-sided boards in the same lot, the recognition camera picks up the positioning mark of each divided board part only in the head work apparatus managed in the electronic component mounting line, and the recognition processing apparatus recognizes it. And
Calculating a difference between each recognition result in each working device of the first multi-sided board and the recognition result of the multi-sided board in the second and subsequent head working devices;
Substrate for recognizing the difference data in the second and subsequent working devices, the recognition result of the first multi-sided substrate in the second and subsequent working devices, and the overall position of the multi-sided substrate An operation related to mounting of an electronic component is performed on the second and subsequent multi-sided boards based on the result of imaging and recognizing only the recognition mark .

Furthermore, the third invention includes a plurality of work devices having work heads for performing work related to mounting of electronic components on a multi-sided board having a plurality of split board parts which are treated as independent boards when divided. In the electronic component mounting line management method,
Each recognition camera captures the positioning mark of each split substrate portion of the first multi-sided substrate in the same lot and is recognized by each recognition processing device in each work device, and the recognition result is stored in the storage means. ,
For the second and subsequent multi-sided boards in the same lot, the recognition camera picks up the positioning mark of each divided board part only in the head work apparatus managed in the electronic component mounting line, and the recognition processing apparatus recognizes it. And
Calculating the difference between the recognition result of the first working device of the first multi-sided substrate and each recognition result of the first work device in each working device;
Substrate recognition for recognizing the difference data in the second and subsequent work devices, each recognition result of the second and subsequent multi-sided substrates in the first work device, and the overall position of the multi-sided substrate. An operation related to mounting of an electronic component is performed on the second and subsequent multi-sided boards based on the result of imaging and recognizing only the mark .

  According to the present invention, based on each split substrate portion position information detected for the multi-planar substrate in the upstream work device, the downstream device works using the split substrate portion position information for the inherited multi-planar substrate. In this case, the productivity of the multi-sided substrate can be improved.

The schematic of the management system of an electronic component mounting line is shown. It is a top view of a multi-sided board. It is a top view of an electronic component mounting apparatus. It is a control block diagram of an electronic component mounting apparatus. It is explanatory drawing about the coordinate of the recognition mark of the split substrate part of a multi-sided board | substrate. It is explanatory drawing of the difference of the 1st sheet | seat and the 2nd sheet | seat of a multi-sided board | substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram of a management system for an electronic component mounting line for mounting electronic components on a multi-sided board having a plurality of split substrate portions that are treated as independent substrates when divided. A screen printing machine for applying solder cream on a multi-sided board, an adhesive application device for applying an adhesive on the multi-sided board, an electronic component mounting device 1, 2 for mounting an electronic component on the multi-sided board, However, the present invention is not limited to these devices, and other devices related to mounting electronic components may be included in the electronic component mounting line.

  As shown in FIG. 2 divided by dotted lines, the multi-planar substrate 6 is composed of six divided substrate portions 6A that can be divided, and when divided, the divided substrate portion 6A is an independent substrate. Be treated. In many cases, the same electronic component is mounted at the same position, and the same mounting pattern is often repeatedly arranged.

  The multi-sided board 6 is provided with a board recognition mark M1 for recognizing the position of the whole board and a board recognition mark M2 for recognizing the position of each of the divided board parts 6A. Yes.

  The electronic component mounting apparatuses 1, 2, 3, 4 can transmit and receive each other via the communication line 5, and are also connected to the data server 7 via the communication line 5, respectively. Can be sent to and received from.

  Next, an electronic component mounting apparatus 1 having the same structure as the other electronic component mounting apparatuses 2, 3, and 4 will be described as an example with reference to FIG. First, the electronic component mounting device 1 includes a transport device 12 for transporting the multi-sided substrate 6 and a component supply device 13 for supplying electronic components disposed on the near side and the back side across the transport device 12. A pair of beams 14A and 14B that can be moved in one direction (Y direction) by a driving source, and a plurality of (for example, twelve) holding nozzles 15 that are detachable, respectively. A mounting head 16 is provided as a work head that can be moved and rotated by each drive source in a direction along 14B.

  The transport device 12 is disposed in the middle part before and after the electronic component mounting device 1 and is sucked and held by the substrate supply unit 12A that inherits the multi-sided substrate 6 from the upstream device and the suction nozzles 15 of the mounting heads 16. A substrate positioning unit 12B for positioning and fixing the multi-sided substrate 6 supplied from the substrate supply unit 12A for mounting electronic components, and the multi-sided substrate 6 on which the electronic components are mounted by the substrate positioning unit 12B The substrate supply unit 12C transports to the apparatus, and the substrate supply unit 12A, the substrate positioning unit 12B, and the substrate discharge unit 12C are spaced according to the width of the multi-sided substrate 6 (the width in the direction perpendicular to the transport direction). It consists of a pair of conveyors that can be adjusted.

  The component supply device 13 includes a plurality of component supply units 13B arranged side by side on a feeder base 13A of a cart with casters, and a mounting device so that the tip portion on the component supply side faces the conveyance path of the multi-sided substrate 6. The main body is detachably disposed via a connector (not shown), and can be moved by a caster provided on the lower surface when the connector is released and the handle is pulled.

  The component supply unit 13B is equipped with a storage tape that covers a large number of electronic components with cover tapes that are stored at regular intervals in each storage section formed of a concave portion of the carrier tape. By peeling the cover tape, one electronic component is supplied to the component extraction position of the component supply unit 13B one by one and is extracted from each storage portion by the suction nozzle 15 of the mounting head 16.

  The pair of front and rear beams 14A and 14B that are long in the X direction are individually moved by sliding sliders fixed to the beams 14A and 14B along a pair of left and right front and rear guides driven by the Y direction linear motor 17. Move in the Y direction. The Y-direction linear motor 17 includes a pair of left and right stators fixed along a pair of left and right bases 11A and 11B, and a mover 17A fixed to lower portions of mounting plates provided at both ends of the beams 14A and 14B. It consists of.

  The beams 14A and 14B are provided with mounting heads 16 that move along guides in the longitudinal direction (X direction) by an X direction linear motor 19, respectively. A pair of front and rear stators fixed to the beams 14 </ b> A and 14 </ b> B, and a mover provided on the mounting head 16 located between the stators.

  Accordingly, the mounting heads 16 are provided inside the beams 14A and 14B so as to face each other, and move above the component pick-up positions of the multi-sided substrate 6 and the component supply unit 13B on the substrate positioning unit 12B of the transfer device 12.

  Each mounting head 16 is provided with twelve suction nozzles 15 urged downward by respective springs at predetermined intervals along the circumference. It is also possible to simultaneously take out electronic components from a plurality of component supply units 3B arranged in parallel by the suction nozzle 5 located at the 9 o'clock position. The suction nozzle 15 can be moved up and down by a vertical axis motor 20, and the mounting head 16 is rotated around the vertical axis by a θ-axis motor 21. As a result, each suction nozzle 15 of each mounting head 16 is moved in the X direction and Y direction. It can move in the direction, can rotate around a vertical line, and can move up and down.

  Reference numeral 18 denotes a component recognition camera that images the electronic component sucked and held by the suction nozzle 15, and reference numeral 22 denotes a substrate recognition camera for picking up the substrate recognition marks M <b> 1 and M <b> 2 attached to the multi-sided substrate 6. It is mounted on.

  23 is a nozzle stocker for storing various suction nozzles 15, two can be installed at the back side position of the transport device 12 and two at the near side position, and because the shape and size of the suction nozzle 15 are different, Different types are prepared.

  FIG. 4 is a control block diagram for controlling the electronic component mounting apparatus 1 according to electronic component mounting. The electronic component mounting apparatuses 2, 3, and 4 are also similar control block diagrams, which will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a control device 31 including a microcomputer as a control means and a determination means, and a storage device 33 is connected to the control device 31 via a bus line 34. Yes. Further, a monitor 35 as a display device for displaying an operation screen or the like and a touch panel switch 36 as an input means formed on the display screen of the monitor 35 are connected to the control device 31 via an interface 37. Further, the Y-direction linear motor 19 and the like are connected to the control device 31 via a drive circuit 38 and an interface 37.

  The storage device 33 stores pattern program data for moving the electronic component mounting apparatus 1 for each model of the multi-sided board 6 to be produced. Each pattern program data is stored in the X direction / Y direction of the multi-sided board 6. Substrate information data composed of size, thickness, presence / absence of substrate recognition, positions of the respective substrate recognition marks M1, M2, etc. Mounting data composed of angle information, an arrangement number of the component supply unit 13B, etc., component arrangement data which is information on the type of each electronic component corresponding to the arrangement number on the feeder base 13A of each component supply unit 13B, which mounting This is composed of nozzle arrangement data indicating which type of suction nozzle 15 is mounted at which position of the head 16.

  The storage device 33 stores component library data relating to the characteristics of the electronic component for each component ID representing the type of the electronic component. That is, the component library data is constituted of, for example, the size in the X direction and the Y direction, the type of the storage tape C (embossed tape, paper tape), etc. for each component ID.

  A recognition processing device 39 is connected to the control device 31 via an interface 37. The recognition processing device 39 performs recognition processing of an image captured by the board recognition camera 22 or the component recognition camera 18. The processing result is sent to the control device 31. That is, the control device 31 recognizes an image captured by the substrate recognition camera 22 or the component recognition camera 18 (calculation of the amount of displacement of the electronic component sucked and held by the suction nozzle 16 or the position of the multi-sided substrate 6 positioned). In addition to outputting an instruction to the recognition processing device 39, the recognition processing result is received from the recognition processing device 39.

  Next, an electronic component mounting line management system according to the present invention will be described with reference to FIG.

  First, the leading electronic component mounting apparatus 1 in the present management system receives the first multi-sided substrate 6 in a predetermined lot from its upstream work device (not shown), and this multi-sided surface is received by the substrate positioning unit 12B. The substrate 6 is positioned and fixed. When the multi-sided substrate 6 is positioned, one beam 4A provided in the electronic component mounting apparatus 1 moves in the Y direction by driving the Y-direction linear motor 17, and is provided in the beam 14A by the X-direction linear motor 19. The mounted head 16 is moved in the X direction, moved to above the component take-out position of the corresponding component supply unit 13B, and the vertical nozzle motor 20 is driven to lower the suction nozzle 15 provided in the mounting head 16 to supply the components. An electronic component is taken out from the unit 13B.

  After removal, the suction nozzle 15 of the mounting head 16 is raised and passed over the component recognition camera 18, and a plurality of electronic components sucked and held by the plurality of suction nozzles 15 during this movement are collectively imaged. Then, the recognition processing device 39 recognizes the captured image and grasps the positional deviation with respect to the suction nozzle 15.

  In addition, the substrate recognition camera 22 provided on each mounting head 16 moves to a position above the multi-sided substrate 6 to recognize the position of the whole multi-sided substrate 6 attached to the multi-sided substrate 6. The board recognition marks M2 and M2 for each of the divided board parts 6A for recognizing the positions of M1 and M1 and each of the divided board parts 6A are picked up, and the picked-up images are recognized and processed by the recognition processing device 39. The position of the substrate 6 and the position of each divided substrate portion 6 </ b> A are grasped and stored in the storage device 33. In this case, the position of each board recognition mark M2, M2 of each split board section 6A based on the recognition processing result is transmitted via the communication line 5 and stored in the data server 7. In this case, for example, when one substrate recognition mark M2-1 at the upper left of FIG. 2 among the six divided substrate portions 6A is taken as an example, the angle of the multi-sided substrate 6 (substrate recognition marks M1 and M1 are recognized). The coordinates (X11, Y11) (see FIG. 5) obtained by converting the measured angle into the data of a certain angle (for example, zero degree) are stored in the storage device 33 and the data. It is also stored in the server 7.

  Then, the suction nozzle 15 corrects the positional deviation by adding the recognition processing result of each of the positioning marks M1 and M1 of the multi-sided board 6 and each of the board recognition marks M2 and M2 and each part recognition processing result to the mounting coordinates of the mounting data. Meanwhile, each electronic component is mounted on the multi-sided substrate 6. When all the electronic components are mounted on the multi-sided board 6 in this way, the multi-sided board 6 is transferred from the board positioning unit 12B to the electronic component mounting device 2 via the board discharging unit 12C, and this multi-sided board 6 is mounted. The operation of mounting the electronic component on the substrate 6 is completed.

  Thereafter, similarly to the electronic component mounting apparatus 1, the electronic component mounting apparatus 2 that has inherited the first multi-surface substrate 6 from the electronic component mounting apparatus 1 positions and fixes the multi-surface substrate 6 and moves the mounting head 16. Thus, the suction nozzle 15 sequentially takes out the electronic components from the component supply unit 13B.

  Then, after taking out, the mounting head 16 is moved to pass above the component recognition camera 18, and a plurality of electronic components sucked and held by the plurality of suction nozzles 15 during the movement are collectively imaged. The recognition processing device 39 performs recognition processing on the obtained image and grasps the positional deviation with respect to the suction nozzle 15.

  In addition, the substrate recognition camera 22 provided in each mounting head 16 moves to a position above the multi-sided substrate 6 to recognize the position of the entire multi-sided substrate 6 and the substrate recognition marks M1 and M1 and each split substrate portion. The board recognition marks M2 and M2 for each split board 6A for recognizing the position of 6A are imaged, and the picked-up image is recognized by the recognition processing device 39 so that the position of the multi-chip board 6 and each split board The position of the unit 6A is grasped and stored in the storage device 33. In this case, the position of each board recognition mark M2, M2 of each split board section 6A based on the recognition processing result is transmitted via the communication line 5 and stored in the data server 7. In this case, for example, when one substrate recognition mark M2-1 at the upper left of FIG. 2 among the six divided substrate portions 6A is taken as an example, the angle of the multi-sided substrate 6 is set to a certain angle (for example, zero degrees). The coordinates (X21, Y21) (see FIG. 5) converted into the data of) are stored in the storage device 33, transmitted via the communication line 5, and also stored in the data server 7.

  Then, the suction nozzle 15 corrects the positional deviation by adding the recognition processing result of each of the positioning marks M1 and M1 of the multi-sided board 6 and each of the board recognition marks M2 and M2 and each part recognition processing result to the mounting coordinates of the mounting data. Meanwhile, each electronic component is mounted on the multi-sided substrate 6. When all the electronic components have been mounted on the multi-sided substrate 6 in this way, the multi-sided substrate 6 is transferred to the electronic component mounting device 3 and the mounting operation of the electronic component on the multi-sided substrate 6 is completed. To do.

  Hereinafter, as with the electronic component mounting apparatuses 1 and 2, the above-described operation is performed in the electronic component mounting apparatuses 3 and 4 and also in the Nth electronic component mounting apparatus. The positions of the board recognition marks M2 and M2 of each split board section 6A are stored in the storage device 33 and also in the data server 7. In the case of the Nth electronic component mounting apparatus, for example, when the one substrate recognition mark M2-1 in the upper left part of FIG. Coordinates (XN1, YN1) converted to data of a certain angle (for example, zero degree) are stored in the storage device 33 (see FIG. 5) and transmitted via the communication line 5 and stored in the data server 7. Is done.

  Next, the operation when the electronic component mounting apparatus 1 receives the second multi-sided substrate 6 in the same lot from the upstream work device will be described. First, the multi-sided substrate 6 is moved by the substrate positioning unit 12B. After positioning and fixing, the mounting head 16 is moved, and the suction nozzle 15 sequentially takes out the electronic components from the component supply unit 13B.

  Then, after taking out, the mounting head 16 is moved to pass above the component recognition camera 18, and a plurality of electronic components sucked and held by the plurality of suction nozzles 15 during the movement are collectively imaged. The recognition processing device 39 performs recognition processing on the obtained image and grasps the positional deviation with respect to the suction nozzle 15.

  In addition, the substrate recognition camera 22 provided in each mounting head 16 moves to a position above the multi-sided substrate 6 to recognize the position of the entire multi-sided substrate 6 and the substrate recognition marks M1 and M1 and each split substrate portion. The board recognition marks M2 and M2 for each split board 6A for recognizing the position of 6A are imaged, and the picked-up image is recognized by the recognition processing device 39 so that the position of the multi-chip board 6 and each split board The position of the part 6A is grasped. In this case, the position of each board recognition mark M2, M2 of each split board section 6A based on the recognition processing result is stored in the storage device 33 and also in the data server 7. In this case, for example, when one substrate recognition mark M2-1 at the upper left of FIG. 2 among the six divided substrate portions 6A is taken as an example, the angle of the multi-sided substrate 6 is set to a certain angle (for example, zero degrees). The coordinates (X12, Y12) (see FIG. 5) converted into the data of) are stored in the storage device 33 and transmitted via the communication line 5 and stored in the data server 7 as well.

  The coordinates of the first board recognition mark M2-1 and the second board recognition mark M2-1 of the first sheet in the electronic component mounting apparatus 1 stored in the data server 7 (also in the storage device 33). The control unit 31 of the electronic component mounting apparatus 1 calculates the difference from the coordinates of this and stores it in its own storage device 33, and is transmitted via the communication line 5 and stored in the data server 7, and the electronic component The mounting devices 2, 3, 4, and the Nth electronic component mounting device are also transmitted via the communication line 5 and stored in the storage device 33 of each electronic component mounting device. For example, when one substrate recognition mark M2-1 in the upper left part in FIG. 2 among the six divided substrate portions 6A is taken as an example, one coordinate (X11, Y11) of each first substrate recognition mark M2-1 is shown. ) And one coordinate (X12, Y12) of each of the second substrate recognition marks M2-1 becomes coordinates (X12-X11, Y12-Y11) (see FIGS. 5 and 6), and the data server 7 and It is stored in the storage device 33 of the electronic component mounting apparatus 1, 2, 3, 4, Nth electronic component mounting apparatus.

  In the electronic component mounting apparatus 1, the recognition processing result of the positioning marks M1 and M1 of the second multi-sided substrate 6 and the substrate recognition marks M2 and M2 and the component recognition processing result are added to the mounting coordinates of the mounting data. Thus, each of the electronic components is mounted on the second multi-sided substrate 6 while the suction nozzle 15 corrects the positional deviation. When all the electronic components have been mounted on the multi-sided substrate 6 in this way, the multi-sided substrate 6 is transferred to the electronic component mounting device 2 and the mounting operation of the electronic component on the multi-sided substrate 6 is completed. To do.

  Next, the operation when the electronic component mounting apparatus 2 receives the above-described second multi-sided substrate 6 from the upstream electronic component mounting device 1 will be described. The multi-sided substrate 6 is positioned and fixed, and the mounting head 16, the suction nozzle 15 sequentially takes out the electronic components from the component supply unit 13B.

  Then, after taking out, the mounting head 16 is moved to pass above the component recognition camera 18, and a plurality of electronic components sucked and held by the plurality of suction nozzles 15 during the movement are collectively imaged. The recognition processing device 39 performs recognition processing on the obtained image and grasps the positional deviation with respect to the suction nozzle 15.

  Further, the board recognition camera 22 provided in each mounting head 16 moves to a position above the multi-sided board 6 so that the board-recognizing marks M2 and M2 for each of the split board parts 6A are not imaged. Only the substrate recognition marks M1 and M1 for recognizing the entire position are imaged, and the captured image is recognized by the recognition processing device 39 to grasp the position of the multi-sided substrate 6 and stored in the storage device 33. The

  In this case, the electronic component mounting apparatus 2 does not capture and recognize the board recognition marks M2 and M2 for each of the divided board portions 6A, but the first board recognition marks M2 and M2 described above in the electronic component mounting apparatus 1 are not used. And the difference between the coordinates of the second board recognition marks M2 and M2 are also transmitted to the data server 7 and the electronic component mounting apparatus 2 and stored in the storage device 33 of the electronic component mounting apparatus 2. Based on the difference, the control device 31 of the electronic component mounting apparatus 2 calculates the positions of the board recognition marks M2 and M2 for each of the second divided board portions 6A and stores them in its own storage device 33.

  That is, when one substrate recognition mark M2-1 in the upper left part of FIG. 2 among the six divided substrate portions 6A is taken as an example, the angle of the multi-sided substrate 6 is data of a certain angle (for example, zero degree). The coordinates (X22, Y22) converted into are calculated and stored in the storage device 33 (see FIG. 5), but the coordinates (X21, Y2) of the first substrate recognition mark M2-1 in the electronic component mounting apparatus 2 are calculated. Y21) is calculated by adding the coordinates (X12−X11, Y12−Y11) of the difference between the first sheet and the second sheet in the electronic component mounting apparatus 1. Specifically, X22 = X21 + (X12−X11) and Y22 = Y21 + (Y12−Y11).

  In this case, with respect to the coordinates (X22, Y22), the coordinates of the board recognition marks M2 of the first board parts 6A of the first board of the electronic component mounting apparatus 1 and the first board of the electronic component mounting apparatus 2 are divided. The calculation may be performed in consideration of the difference between each board recognition mark M2 of the board part 6A and the coordinates of each board recognition mark M2 of each second board part 6A of the electronic component mounting apparatus 1.

  That is, when one substrate recognition mark M2-1 in the upper left part of FIG. 2 among the six divided substrate portions 6A is taken as an example, the angle of the multi-sided substrate 6 is data of a certain angle (for example, zero degree). The coordinates (X22, Y22) converted into the values are calculated and stored in the storage device 33 (see FIG. 5), but the coordinates (X11, Y11) of the first board recognition mark M2-1 of the electronic component mounting apparatus 1 are calculated. Similarly, the difference from the first board recognition mark M2 (X21, Y21) in the electronic component mounting apparatus 2 and the coordinates (X12, Y12) of the second board recognition mark M2-1 in the electronic component mounting apparatus 1 are obtained. In consideration, the coordinates (X22, Y22) are calculated. Specifically, X22 = (X21−X11) + X12 and Y22 = (Y21−Y11) + Y12. In this case, the recognition result (coordinates ((X11, Y11)) of the first electronic component mounting apparatus 1 of the first multi-sided substrate 6 and the second electronic component mounting apparatus 2 (X21-X11) and (Y21-Y11) of the same recognition results (coordinates ((X21, Y21)) are stored in the storage device 33 of the second electronic component mounting device 2, for example, the second side The calculation of the coordinates (X22, Y22) of the substrate recognition mark M2-1 of the substrate 6 is performed by using the recognition result (coordinates ((X12, Y12)) of the first electronic component mounting apparatus 1 from the electronic component mounting apparatus 1. Alternatively, the electronic component mounting apparatus 2 receives the data from the data server 7 received from the electronic component mounting apparatus 1. The electronic component mounting apparatus after the third electronic component mounting apparatus 3 also has its own storage device. From the electronic component mounting apparatus 1 to the stored difference or In consideration of the same recognition result (coordinates ((X12, Y12)) of the first electronic component mounting device 1 received from the data server 7 received from the child component mounting device 1, the same processing of the second multi-sided substrate 6 is performed. The electronic component mounting apparatus 2 calculates the coordinates of the board recognition mark M2-1.

  Then, in the electronic component mounting apparatus 2, the recognition processing result of the positioning marks M1 and M1 of the second multi-sided substrate 6, the coordinates (X22, Y22) and each component recognition processing result are added to the mounting coordinates of the mounting data. Thus, each of the electronic components is mounted on the second multi-sided substrate 6 while the suction nozzle 15 corrects the positional deviation. When all the electronic components have been mounted on the multi-sided substrate 6 in this way, the multi-sided substrate 6 is transferred to the electronic component mounting device 2 and the mounting operation of the electronic component on the multi-sided substrate 6 is completed. To do.

  In addition, in the electronic component mounting apparatuses 3 and 4 and the Nth electronic component mounting apparatus, similarly to the electronic component mounting apparatus 2, imaging and recognition of the board recognition marks M2 and M2 for each split board portion 6A is performed. However, the difference between the coordinates of the first board recognition marks M2 and M2 and the coordinates of the second board recognition marks M2 and M2 in the electronic component mounting apparatus 1 described above is added to the electronic component mounting apparatuses 3 and 4. In consideration of the coordinates of the first board recognition marks M2, M2 in the Nth electronic component mounting apparatus, or each of the first sheet in the electronic component mounting apparatuses 3, 4, and the Nth electronic component mounting apparatus The coordinates of the difference between the coordinates of each board recognition mark M2 of the split board section 6A and the coordinates of each board recognition mark M2 of each first board section 6A in the electronic component mounting apparatus 1 and 2 of the electronic component mounting apparatus 2 Each substrate of each split substrate portion 6A By adding the coordinates of the identification marks M2, further in consideration of the component recognition processing results, to mount the electronic component on the multi preparative substrate 6 of the second sheet.

  That is, in the N-th electronic component mounting apparatus in the electronic component mounting line, when one board recognition mark M2-1 at the upper left part in FIG. The coordinates (XN2, YN2) obtained by converting the angle of the substrate 6 into data of a certain angle (for example, zero degree) are one coordinate (the first substrate recognition mark M2-1 in the electronic component mounting apparatus 1 described above) X11, Y11) and the coordinate (X12-X11, Y12-Y11) of the difference between one coordinate (X12, Y12) of each second board recognition mark M2-1 (from the data server 7 or the electronic component mounting apparatus 1) Received)) and one coordinate (XN1, YN1) of the first board recognition mark M2-1 in the Nth electronic component mounting apparatus. Specifically, XN2 = XN1 + (X12−X11) and YN2 = YN1 + (Y12−Y11).

  Alternatively, one coordinate (XN1, YN1) of the substrate recognition mark M2-1 of the first divided substrate portion 6A of the Nth electronic component mounting apparatus and the first divided substrate portion 6A of the electronic component mounting apparatus 1 Difference coordinates (XN1-X11, YN-Y11) from one coordinate (X11, Y11) of the board recognition mark M2-1 and the board recognition mark M2 of the second divided board portion 6A of the electronic component mounting apparatus 1 The calculation may be performed by taking into account one coordinate (X12, Y12) of −1. Although omitted in the following description, the same applies.

  Then, by adding each component recognition processing result to the calculated result, the electronic component is mounted on the second multi-sided board 6 in the Nth electronic component mounting apparatus in the electronic component mounting line.

  Next, the operation when the electronic component mounting apparatus 1 receives the n-th multi-surface substrate 6 in the same lot from the upstream work device will be described. First, the multi-surface substrate 6 is positioned and fixed, and the mounting head The suction nozzle 15 provided in 16 takes out the electronic component from the component supply unit 13B.

  Then, after taking out, the suction nozzle 15 of the mounting head 16 is passed over the component recognition camera 18, and a plurality of electronic components sucked and held by the plurality of suction nozzles 15 during this movement are collectively imaged, The recognition processing device 39 recognizes the captured image and grasps the positional deviation with respect to the suction nozzle 15.

  Further, the substrate recognition camera 22 moves to a position above the multi-sided substrate 6 to recognize the positions of the substrate recognition marks M1 and M1 and the respective split-board portions 6A for recognizing the position of the whole multi-sided substrate 6. The board recognition marks M2 and M2 for each split board part 6A are imaged, and the picked-up image is recognized by the recognition processing device 39, and the position of the multi-chip board 6 and the position of each split board part 6A are grasped and stored. It is stored in the device 33. In this case, the position of each board recognition mark M2, M2 of each split board section 6A based on the recognition processing result is transmitted via the communication line 5 and stored in the data server 7. In this case, for example, when one substrate recognition mark M2-1 at the upper left of FIG. 2 among the six divided substrate portions 6A is taken as an example, the angle of the multi-sided substrate 6 is set to a certain angle (for example, zero degrees). The coordinates (X1n, Y1n) (see FIG. 5) converted into the data of) are stored in the storage device 33 and also stored in the data server 7.

  The coordinates of the first board recognition mark M2-1 and the nth board recognition mark M2-1 are stored in the data server 7 (also in the storage device 33). The control unit 31 of the electronic component mounting apparatus 1 calculates the difference from the coordinates of this and stores it in its own storage device 33, and is transmitted via the communication line 5 and stored in the data server 7, and the electronic component The mounting devices 2, 3, 4, and the Nth electronic component mounting device are also transmitted via the communication line 5 and stored in the storage device 33 of each electronic component mounting device. For example, when one substrate recognition mark M2-1 in the upper left part in FIG. 2 among the six divided substrate portions 6A is taken as an example, one coordinate (X11, Y11) of each first substrate recognition mark M2-1 is shown. ) And one coordinate (X1n, Y1n) of each of the n-th board recognition marks M2-1 becomes coordinates (X1n-X11, Y1n-Y11), and the data server 7 and the electronic component mounting apparatuses 1, 2, It is stored in the storage device 33 of the third, fourth, and Nth electronic component mounting devices.

  In the electronic component mounting apparatus 1, the recognition processing results of the positioning marks M 1 and M 1 of the n-th multi-sided substrate 6 and the substrate recognition marks M 2 and M 2 and the component recognition processing results are added to the mounting coordinates of the mounting data. Thus, each of the electronic components is mounted on the second multi-sided substrate 6 while the suction nozzle 15 corrects the positional deviation. When all the electronic components have been mounted on the multi-sided substrate 6 in this way, the multi-sided substrate 6 is transferred to the electronic component mounting device 2 and the mounting operation of the electronic component on the multi-sided substrate 6 is completed. To do.

  Next, the operation when the electronic component mounting apparatus 2 receives the above-mentioned n-th multi-surface substrate 6 from the electronic component mounting apparatus 1 upstream will be described. First, the multi-surface substrate 6 is positioned and fixed. The suction nozzle 15 provided in the mounting head 16 takes out the electronic component from the component supply unit 13B, passes the suction nozzle 15 over the component recognition camera 18, and a plurality of suction nozzles 15 held by the plurality of suction nozzles 15 during this movement. The electronic components are picked up in a lump, and the picked-up image is recognized by the recognition processing device 39 to grasp the positional deviation with respect to the suction nozzle 15.

  Further, the board recognition camera 22 provided in each mounting head 16 moves to a position above the multi-sided board 6 so that the board-recognizing marks M2 and M2 for each of the split board parts 6A are not imaged. Only the substrate recognition marks M1 and M1 for recognizing the entire position are imaged, and the recognition processing device 39 recognizes the captured image to grasp the position of the multi-sided substrate 6.

  In this case, the electronic component mounting apparatus 2 does not capture and recognize the board recognition marks M2 and M2 for each of the divided board portions 6A, but the first board recognition marks M2 and M2 described above in the electronic component mounting apparatus 1 are not used. And the coordinates of the n-th substrate recognition marks M2, M2 are also transmitted to the electronic component mounting apparatus 2 and stored in the storage device 33 of the electronic component mounting apparatus 2, and based on the difference. Then, the control device 31 of the electronic component mounting apparatus 2 calculates the positions of the board recognition marks M2 and M2 for each of the nth divided board portions 6A and stores them in its own storage device 33.

  That is, when one substrate recognition mark M2-1 in the upper left part of FIG. 2 among the six divided substrate portions 6A is taken as an example, the angle of the multi-sided substrate 6 is data of a certain angle (for example, zero degree). The coordinates (X2n, Y2n) converted into are calculated and stored in the storage device 33 (see FIG. 5), but the coordinates (X21, Y2) of the first substrate recognition mark M2-1 in the electronic component mounting apparatus 2 are calculated. Y21) is calculated by adding the difference coordinates (X1n−X11, Y1n−Y11). Specifically, X2n = X21 + (X1n−X11) and Y2n = Y21 + (Y1n−Y11).

  In this case, with respect to the coordinates (X2n, Y2n), the coordinates of the board recognition marks M2 of the first board parts 6A of the first board of the electronic component mounting apparatus 1 and the first board of the electronic component mounting apparatus 2 are divided. The calculation may be performed in consideration of the difference between each board recognition mark M2 of the board part 6A and the coordinates of each board recognition mark M2 of each nth board part 6A of the electronic component mounting apparatus 1.

  In the electronic component mounting apparatus 2, the recognition processing result of the positioning marks M1 and M1 of the n-th multi-sided substrate 6 and the coordinates (X2n, Y2n) and each component recognition processing result are added to the mounting coordinates of the mounting data. Thus, each of the electronic components is mounted on the second multi-sided substrate 6 while the suction nozzle 15 corrects the positional deviation. When all the electronic components are mounted on the multi-sided substrate 6 in this way, the multi-sided substrate 6 is transferred to the electronic component mounting device 2 and the mounting operation of the electronic component on the multi-sided substrate 6 is finished. End.

  In addition, in the electronic component mounting apparatuses 3 and 4 and the Nth electronic component mounting apparatus, similarly to the electronic component mounting apparatus 2, imaging and recognition of the board recognition marks M2 and M2 for each split board portion 6A is performed. However, the difference between the coordinates of the first board recognition marks M2 and M2 and the coordinates of the nth board recognition marks M2 and M2 in the electronic component mounting apparatus 1 described above is added to the electronic component mounting apparatuses 3 and 4. In consideration of the coordinates of the first board recognition marks M2, M2 in the Nth electronic component mounting apparatus, or each of the first sheet in the electronic component mounting apparatuses 3, 4, and the Nth electronic component mounting apparatus The coordinates of the difference between the coordinates of each board recognition mark M2 of the split board part 6A and the coordinates of each board recognition mark M2 of each first board part 6A in the electronic component mounting apparatus 1 and the n of the electronic component mounting apparatus 1 Each substrate of each split substrate portion 6A By adding the coordinates of the identification marks M2, further in consideration of the component recognition processing results, to mount the electronic component on the multi preparative substrate 6 of the second sheet.

  That is, in the N-th electronic component mounting apparatus in the electronic component mounting line, for the n-th multi-sided board 6, one of the six split board parts 6A, one board recognition mark M2- at the upper left in FIG. As an example, the coordinates (XNn, YNn) obtained by converting the angle of the multi-sided board 6 into data of a constant angle (for example, zero degree) are the above-described first board recognition in the electronic component mounting apparatus 1. N is the difference coordinate (X1n−X11, Y1n−Y11) between one coordinate (X11, Y11) of the mark M2-1 and one coordinate (X1n, Y1n) of each nth substrate recognition mark M2-1. This is calculated by taking into account one coordinate (XN1, YN1) of the first board recognition mark M2-1 in the first electronic component mounting apparatus.

  Alternatively, one coordinate (XN1, YN1) of the substrate recognition mark M2-1 of the first divided substrate portion 6A of the Nth electronic component mounting apparatus and the first divided substrate portion 6A of the electronic component mounting apparatus 1 Difference coordinates (XN1-X11, YN1-Y11) from one coordinate (X11, Y11) of the board recognition mark M2-1 and the board recognition mark M2 of the nth divided board portion 6A of the electronic component mounting apparatus 1 -1 may be calculated in consideration of one coordinate (X1n, Y1n), and although omitted in the following description, the same applies.

  Then, by adding each component recognition processing result to the calculated result, the electronic component is mounted on the n-th multi-sided board 6 in the Nth electronic component mounting apparatus in the electronic component mounting line.

  According to the above embodiment, since it is not necessary to perform position recognition of each divided board portion of the multi-sided board for each electronic component mounting device, it is possible to omit duplicate position recognition work, and to reduce the entire electronic component mounting line. Productivity can be improved.

  In addition, it is conceivable that each divided board part position recognition information detected for the multi-sided board produced by the upstream electronic component mounting apparatus is transmitted to the downstream electronic component mounting apparatus together with the delivery every time the board is delivered. However, in each electronic component mounting device, even if the mounting head performs an operation related to mounting of the electronic component based on the information on the position recognition of each divided substrate portion, the mounting error of each mounting head to the beam and the beam manufacturing accuracy Even if the mounting operation is performed with the downstream electronic component mounting device based only on the position information of each divided board portion detected by the upstream electronic component mounting device, the same mounting accuracy is not necessarily obtained. This problem can be solved.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

1, 2, 3, 4 Electronic component mounting device 5 Communication line 6 Multi-sided board 7 Data server 31 Control device 33 Storage device

Claims (3)

Management of an electronic component mounting line having a plurality of work devices having work heads for performing work related to mounting of electronic components on a multi-sided substrate having a plurality of split substrate parts that are treated as independent substrates when divided. In the method
Each recognition camera captures the positioning mark of each split substrate portion of the first multi-sided substrate in the same lot and is recognized by each recognition processing device in each work device, and the recognition result is stored in the storage means. ,
For the second and subsequent multi-sided boards in the same lot, the recognition camera picks up the positioning mark of each divided board part only in the head work apparatus managed in the electronic component mounting line, and the recognition processing apparatus recognizes it. And
In the second and subsequent work devices, the recognition results of the first multi-sided substrate in each work device, the recognition results of the multi-sided substrate in the second and subsequent work devices, and the multi-sided substrate An electronic component characterized in that an operation related to mounting of an electronic component is performed on the second and subsequent multi-sided boards based on a result of imaging and recognizing only a board recognition mark for recognizing the entire position. Implementation line management method. Management of an electronic component mounting line having a plurality of work devices having work heads for performing work related to mounting of electronic components on a multi-sided substrate having a plurality of split substrate parts that are treated as independent substrates when divided. In the method
Each recognition camera captures the positioning mark of each split substrate portion of the first multi-sided substrate in the same lot and is recognized by each recognition processing device in each work device, and the recognition result is stored in the storage means. ,
For the second and subsequent multi-sided boards in the same lot, the recognition camera picks up the positioning mark of each divided board part only in the head work apparatus managed in the electronic component mounting line, and the recognition processing apparatus recognizes it. And
Calculating a difference between each recognition result in each working device of the first multi-sided board and the recognition result of the multi-sided board in the second and subsequent head working devices;
Substrate for recognizing the difference data in the second and subsequent working devices, the recognition result of the first multi-sided substrate in the second and subsequent working devices, and the overall position of the multi-sided substrate An electronic component mounting line management method, comprising: performing an operation related to mounting of an electronic component on the second and subsequent multi-sided boards based on a result of imaging and recognizing only a recognition mark . Management of an electronic component mounting line having a plurality of work devices having work heads for performing work related to mounting of electronic components on a multi-sided substrate having a plurality of split substrate parts that are treated as independent substrates when divided. In the method
Each recognition camera captures the positioning mark of each split substrate portion of the first multi-sided substrate in the same lot and is recognized by each recognition processing device in each work device, and the recognition result is stored in the storage means. ,
For the second and subsequent multi-sided boards in the same lot, the recognition camera picks up the positioning mark of each divided board part only in the head work apparatus managed in the electronic component mounting line, and the recognition processing apparatus recognizes it. And
Calculating the difference between the recognition result of the first working device of the first multi-sided substrate and each recognition result of the first work device in each working device;
Substrate recognition for recognizing the difference data in the second and subsequent work devices, each recognition result of the second and subsequent multi-sided substrates in the first work device, and the overall position of the multi-sided substrate. A method of managing an electronic component mounting line, comprising performing an operation related to mounting of an electronic component on the second and subsequent multi-sided boards based on a result of imaging and recognizing only a mark .

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