JP5654911B2 - Rolled copper foil for lithium ion secondary battery current collector - Google Patents
Rolled copper foil for lithium ion secondary battery current collector Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
- H01M4/662—Alloys
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/134—Electrodes based on metals, Si or alloys
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Description
本発明は、リチウムイオン二次電池の集電体に好適な樹脂密着性を有するリチウムイオン二次電池集電体用圧延銅箔に関するものである。 The present invention relates to a rolled copper foil for a lithium ion secondary battery current collector having resin adhesion suitable for a current collector of a lithium ion secondary battery.
リチウムイオン二次電池は、高い電圧が得られ、エネルギー密度も高いことから、モバイルパソコンや携帯端末などの電子機器のバッテリーとして利用されている。更にはハイブリッド自動車や電気自動車の駆動用電池としても、研究開発が活発に行われている。 Lithium ion secondary batteries are used as batteries for electronic devices such as mobile personal computers and portable terminals because they can obtain high voltage and have high energy density. In addition, research and development are actively conducted as driving batteries for hybrid vehicles and electric vehicles.
このリチウムイオン二次電池は、電解質中のリチウムイオンがセパレータによって絶縁された正極板と負極板の間を移動することによって充放電を繰り返す仕組みを基本としている。この仕組みを高いサイクル特性で実現できる電解質、セパレータ、正極板、及び負極板の材料を見出すことが重要である。 This lithium ion secondary battery is based on a mechanism in which charging and discharging are repeated by moving lithium ions in an electrolyte between a positive electrode plate and a negative electrode plate insulated by a separator. It is important to find materials for electrolytes, separators, positive plates, and negative plates that can realize this mechanism with high cycle characteristics.
リチウムイオン二次電池に使用する負極板としては、銅箔を材料とする負極集電体と、その集電体上に形成される負極活物質層とによって構成されるのが一般的である。この負極集電体を構成する銅箔には、鋳造で製造した肉厚の素条に圧延加工を施して製造する圧延銅箔や銅イオンを含む電解液から金属銅を電析させて製造する電解銅箔が使用されている。この圧延銅箔には、圧延加工と加熱処理を組み合わせることによって、銅箔や銅合金箔の銅結晶組織を制御できるという特徴がある。 A negative electrode plate used for a lithium ion secondary battery is generally composed of a negative electrode current collector made of copper foil and a negative electrode active material layer formed on the current collector. The copper foil constituting this negative electrode current collector is produced by electrodepositing metal copper from a rolled copper foil produced by casting a thick strip produced by casting or an electrolytic solution containing copper ions. Electrolytic copper foil is used. This rolled copper foil is characterized in that the copper crystal structure of the copper foil or copper alloy foil can be controlled by combining rolling and heat treatment.
銅箔の表面に形成される負極活物質層は、100μm程度の膜厚に形成される。この負極活物質層は、人工黒鉛、天然黒鉛、あるいはコークス等のカーボン粒をポリ弗化ビニリデン(PVdF)等のバインダ及び導電助剤と一緒にN−メチル2−ピロリドン(NMP)等の溶剤に混合してスラリ状にした後、これを銅箔の表面に塗布し、乾燥固化させることによって得られる。 The negative electrode active material layer formed on the surface of the copper foil is formed with a film thickness of about 100 μm. This negative electrode active material layer is obtained by adding carbon particles such as artificial graphite, natural graphite, or coke together with a binder such as polyvinylidene fluoride (PVdF) and a conductive additive to a solvent such as N-methyl 2-pyrrolidone (NMP). After mixing to make a slurry, this is applied to the surface of the copper foil and dried and solidified.
リチウムイオン二次電池では、充放電を繰り返すと、リチウムの吸蔵・放出に伴うカーボン粒の膨張・収縮によってカーボンが銅箔から剥離しやすく、電極間の短絡電池容量の低下やサイクル特性の劣化等を招くおそれがある。このため、負極集電体用銅箔としては、負極活物質層を構成するカーボンとの高い密着性が要求されている。カーボンとの密着性は、スラリ中のバインダの割合を多くすれば、ある程度向上できるが、電極の導電性が低下してしまうため、有効な手段ではない。 In lithium-ion secondary batteries, when charging and discharging are repeated, carbon easily peels from the copper foil due to the expansion and contraction of carbon particles accompanying the insertion and extraction of lithium, and the short-circuit battery capacity between electrodes and cycle characteristics deteriorate. May be incurred. For this reason, as copper foil for negative electrode collectors, the high adhesiveness with the carbon which comprises a negative electrode active material layer is requested | required. The adhesion with carbon can be improved to some extent if the binder ratio in the slurry is increased, but it is not an effective means because the conductivity of the electrode is lowered.
そこで、この問題を解決するため、銅箔表面に凹凸を形成する粗化処理を施すことが行われている。この粗化処理の方法としては、ブラスト処理、粗面ロールによる圧延、機械研磨、電解研磨、化学研磨、及び電着粒のめっき等の方法が知られており、これらの中でも、特に電着粒のめっきが多用されている。 Therefore, in order to solve this problem, a roughening process for forming irregularities on the surface of the copper foil is performed. As a method of this roughening treatment, methods such as blasting, rolling with a rough surface roll, mechanical polishing, electrolytic polishing, chemical polishing, and plating of electrodeposited grains are known, and among these, electrodeposited grains are particularly preferable. Is often used.
しかしながら、不均一で粗度が高い粗化粒子は逆に投錨効果が弱くなり、負極集電体と負極活物質との間に高い密着性が得られなくなる。そこで、低粗度性の粗化粒子で、銅箔表面上に複雑な構造を持たせるため、複数回のめっき処理やリフロー処理を施す手法が取られている(例えば、特許文献1参照。)。 However, non-uniform and high-roughness roughened particles, on the contrary, have a poor anchoring effect, and high adhesion cannot be obtained between the negative electrode current collector and the negative electrode active material. Therefore, a technique of performing a plurality of plating treatments and reflow treatments has been taken in order to give a rough structure on the surface of the copper foil with low-roughness roughening particles (see, for example, Patent Document 1). .
しかしながら、上記特許文献1記載の手法は、高コストであるため、リチウムイオン二次電池の高価格化につながり、電子機器や電気自動車などへのリチウムイオン二次電池の一般普及の妨げになる。 However, since the method described in Patent Document 1 is expensive, it leads to an increase in the price of the lithium ion secondary battery, which hinders the general spread of the lithium ion secondary battery to electronic devices and electric vehicles.
本発明の目的は、安定して効率よく、樹脂との密着性を向上させたリチウムイオン二次電池集電体用圧延銅箔を提供することにある。 The objective of this invention is providing the rolled copper foil for lithium ion secondary battery electrical power collectors which improved the adhesiveness with resin stably and efficiently.
本件発明者等は上記目的を達成すべく熱意検討を行ったところ、圧延銅箔における圧延面の結晶粒の方位・配向状態と銅箔の樹脂密着性との間に、ある特定の相関関係を利用すれば、例えば銅箔表面に電着粒のめっき等の粗化処理を施すことなく、銅箔の樹脂密着性が高くなることが判明し、予想外の成果を挙げることができ、実用上に問題が生じない優れた製品が形成できることを知った。 The inventors of the present invention conducted an eager study to achieve the above object, and found that there was a certain correlation between the orientation and orientation state of the crystal grains on the rolled surface in the rolled copper foil and the resin adhesion of the copper foil. If used, it becomes clear that the resin adhesion of the copper foil is increased without subjecting the copper foil surface to a roughening treatment such as plating of electrodeposited grains, and an unexpected result can be obtained. I learned that an excellent product that does not cause problems can be formed.
[1]即ち、本発明は、Cuを主成分とし、Cr、Zr、Sn、Mg、Ag、Fe、Co、Ni、Zn、Ti、Si、B、Bi、Sb、及びMnからなる元素群の中から選択される1種以上の添加元素と不可避不純物とを含有する銅合金組成を有し、X線回折2θ/θ測定によって得られる銅結晶の{220}Cu方向の回折ピーク強度I{220}と{200}Cu方向の回折ピーク強度I{200}との比がI{220}/I{200}>2であることを特徴とするリチウムイオン二次電池集電体用圧延銅箔にある。 [1] That is, the present invention is an element group consisting mainly of Cu and consisting of Cr, Zr, Sn, Mg, Ag, Fe, Co, Ni, Zn, Ti, Si, B, Bi, Sb, and Mn. a copper alloy composition containing and one or more additive elements and inevitable impurities selected from among diffraction peak intensity of {220} Cu direction of the copper crystals obtained by the X-ray diffraction 2 [theta] / theta measured I {220 } To {200} Cu- direction diffraction peak intensity I {200} is a rolled copper foil for a lithium ion secondary battery current collector, characterized in that I {220} / I {200} > 2. is there.
[2]上記[1]記載の発明にあって、200℃以下の温度で1分〜20時間加熱した後に、X線回折2θ/θ測定によって得られる銅結晶の{220}Cu方向の回折ピーク強度I{220}と{200}Cu方向の回折ピーク強度I{200}との比がI{220}/I{200}>2であることを特徴とする。 [2] The diffraction peak in the {220} Cu direction of the copper crystal obtained by X-ray diffraction 2θ / θ measurement after heating at a temperature of 200 ° C. or less for 1 minute to 20 hours in the invention according to [1] above The ratio between the intensity I {220} and the diffraction peak intensity I {200} in the {200} Cu direction is I {220} / I {200} > 2.
[3]上記[1]又は[2]記載の発明にあって、前記添加元素の総量が0.5重量%以下であることを特徴とする。 [3] In the invention described in [1] or [2] above, the total amount of the additive elements is 0.5% by weight or less.
[4]上記[1]〜[3]のいずれかに記載の発明にあって、リチウムイオン二次電池集電体用圧延銅箔が20μm以下の厚さを有することを特徴とする。 [4] The invention according to any one of [1] to [3] above, wherein the rolled copper foil for a lithium ion secondary battery current collector has a thickness of 20 μm or less.
本発明によれば、樹脂との密着性が良好であり、安定して効率的に実現できるリチウムイオン二次電池集電体用圧延銅箔が得られる。 ADVANTAGE OF THE INVENTION According to this invention, the adhesiveness with resin is favorable and the rolled copper foil for lithium ion secondary battery collectors which can be implement | achieved stably and efficiently is obtained.
以下、本発明の好適な実施の形態を添付図面に基づいて具体的に説明する。 Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings.
(圧延銅箔の成分)
この実施の形態における圧延銅箔は、リチウムイオン二次電池集電体用の材料として好適に用いられる。この圧延銅箔は、Cu(銅)を母相として、Cr(クロム)、Zr(ジルコニウム)、Sn(スズ)、Mg(マグネシウム)、Ag(銀)、Fe(鉄)、Co(コバルト)、Ni(ニッケル)、Zn(亜鉛)、Ti(チタン)、Si(ケイ素)、B(ホウ素)、Bi(ビスマス)、Sb(アンチモン)、及びMn(マンガン)からなる元素群の中から選択される1種以上の添加元素を含有し、残部が不可避的不純物からなる構成を基本組成成分としている。Cuとしては、タフピッチ銅や無酸素銅を用いることができる。
(Rolled copper foil components)
The rolled copper foil in this embodiment is suitably used as a material for a lithium ion secondary battery current collector. This rolled copper foil has Cu (copper) as a parent phase, Cr (chromium), Zr (zirconium), Sn (tin), Mg (magnesium), Ag (silver), Fe (iron), Co (cobalt), Selected from the element group consisting of Ni (nickel), Zn (zinc), Ti (titanium), Si (silicon), B (boron), Bi (bismuth), Sb (antimony), and Mn (manganese) A basic composition component includes one or more additive elements and the balance of inevitable impurities. As Cu, tough pitch copper or oxygen-free copper can be used.
(添加元素のより好ましい上限値について)
Cr、Zr、Sn、Mg、Ag、Fe、Co、Ni、Zn、Ti、Si、B、Bi、Sb、及びMnからなる元素群の中から選択される1種以上の添加元素の総量は0.5重量%以下であることが好適である。この添加元素の総量を0.5重量%よりも多く添加しても、それ以上耐熱性を向上させる効果がない。
(About more preferable upper limit value of additive element)
The total amount of one or more additional elements selected from the element group consisting of Cr, Zr, Sn, Mg, Ag, Fe, Co, Ni, Zn, Ti, Si, B, Bi, Sb, and Mn is 0. It is preferable that the amount be 5% by weight or less. Even if the total amount of these additive elements is more than 0.5% by weight, there is no further effect of improving the heat resistance.
さらに、0.5重量%より多く添加した場合、抵抗は上昇するため、この銅箔を用いて製造されたリチウムイオン二次電池の放電レート特性などのリチウムイオン二次電池の特性の劣化を招くおそれがある。 Furthermore, since resistance increases when adding more than 0.5 weight%, it causes deterioration of the characteristics of the lithium ion secondary battery such as the discharge rate characteristics of the lithium ion secondary battery manufactured using this copper foil. There is a fear.
(添加元素のより好ましい下限値について)
これらの添加元素のうち、Cr、Zr、Sn、Ag、Ti、及びSbの含有量を0.02重量%以上に設定することが望ましい。これらの添加元素の含有量が0.02重量%よりも少なくなると、十分な耐熱性が得られなくなる。
(About more preferable lower limit value of additive element)
Among these additive elements, the content of Cr, Zr, Sn, Ag, Ti, and Sb is preferably set to 0.02% by weight or more. When the content of these additive elements is less than 0.02% by weight, sufficient heat resistance cannot be obtained.
一方、Mg、Fe、Co、Ni、Zn、Si、B、Bi、及びMnの含有量にあっては、0.1重量%以上に設定することが更に望ましい。これらの添加元素が、0.1重量%より少ない場合は、耐熱性が低下するおそれがあるためである。 On the other hand, the contents of Mg, Fe, Co, Ni, Zn, Si, B, Bi, and Mn are more preferably set to 0.1% by weight or more. This is because when these additive elements are less than 0.1% by weight, the heat resistance may be lowered.
圧延銅箔の厚さは20μm以下であることが好ましい。この圧延銅箔の厚さが20μmを超える圧延銅箔を用いて製造されたリチウムイオン二次電池は、圧延銅箔の占める体積率が大きくなり、負極活物質を十分に充填できない。そのため、体積エネルギー密度の低下を招くおそれがあり、好ましくない。 The thickness of the rolled copper foil is preferably 20 μm or less. The lithium ion secondary battery manufactured using the rolled copper foil having a thickness of the rolled copper foil exceeding 20 μm has a large volume ratio occupied by the rolled copper foil and cannot be sufficiently filled with the negative electrode active material. Therefore, the volume energy density may be lowered, which is not preferable.
(圧延銅箔の製造方法)
図1を参照すると、図1には、この実施の形態に係る圧延銅箔を製造するための典型的な製造工程が示されている。この圧延銅箔を製造する工程は、溶製工程、熱間圧延工程、冷間圧延工程、中間焼鈍工程、生地焼鈍工程、最終冷間圧延工程(仕上げ圧延工程)、及び負極板製造工程の一連の工程(ステップ100〜106、以下、ステップを「S」と称する。)を有する。これらの工程で順番に処理を行うことで初期の目的とする圧延銅箔が効果的に得られる。
(Method for producing rolled copper foil)
Referring to FIG. 1, FIG. 1 shows a typical manufacturing process for manufacturing a rolled copper foil according to this embodiment. The process of manufacturing this rolled copper foil includes a series of a melting process, a hot rolling process, a cold rolling process, an intermediate annealing process, a dough annealing process, a final cold rolling process (finish rolling process), and a negative electrode plate manufacturing process. (
(溶製工程)
この溶製工程では、Cuと、0.5重量%以下のCr、Zr、Sn、Mg、Ag、Fe、Co、Ni、Zn、Ti、Si、B、Bi、Sb、及びMnからなる元素群の中から選択される1種以上の添加元素とを溶解炉を用いて溶製し、銅合金素材となるインゴット(鋳塊)を製造する(図1のS100)。
(Melting process)
In this melting step, an element group consisting of Cu and 0.5 wt% or less of Cr, Zr, Sn, Mg, Ag, Fe, Co, Ni, Zn, Ti, Si, B, Bi, Sb, and Mn One or more additive elements selected from the above are melted using a melting furnace to produce an ingot (ingot) that becomes a copper alloy material (S100 in FIG. 1).
(熱間圧延工程)
この熱間圧延工程においては、インゴットを所定の温度で熱間圧延を施して板材を形成する(図1のS101)。
(Hot rolling process)
In this hot rolling step, the ingot is hot rolled at a predetermined temperature to form a plate material (S101 in FIG. 1).
(冷間圧延工程、中間焼鈍工程、及び生地焼鈍工程)
この冷間圧延工程、及び中間焼鈍工程においては、熱間圧延後の板材に、冷間圧延と、冷間圧延による加工硬化を緩和する中間焼鈍とを適宜繰り返し行う(図1のS102〜S104)。これにより、「生地」と呼ばれる銅条を製造する。この生地焼鈍工程においては、生地焼鈍工程以前の加工ひずみが充分に緩和されることが望ましい。
(Cold rolling process, intermediate annealing process, and dough annealing process)
In this cold rolling step and intermediate annealing step, cold rolling and intermediate annealing that alleviates work hardening by cold rolling are appropriately repeated on the plate after hot rolling (S102 to S104 in FIG. 1). . Thereby, a copper strip called “dough” is manufactured. In this dough annealing process, it is desirable that the processing strain before the dough annealing process is sufficiently relaxed.
(最終冷間圧延工程)
この最終冷間圧延工程では、焼鈍した生地に対して仕上げ圧延工程を施す(図1のS105)。これにより、所定厚さの圧延銅箔(仕上げ銅箔)が製造される。総加工度としては85%以上95%未満とすることが好ましい。これにより、従来の高加工度圧延銅箔に対して圧延工程の総パス数を低減できる。これに加えて、過度の加工硬化による圧延加工制御の困難性を回避できるとともに、製造設備への負荷低減と製造の低コスト化とに寄与できる。圧延銅箔における高い樹脂密着性と低コスト化とを両立することができる。
(Final cold rolling process)
In this final cold rolling process, a finish rolling process is performed on the annealed material (S105 in FIG. 1). Thereby, the rolled copper foil (finished copper foil) of predetermined thickness is manufactured. The total degree of processing is preferably 85% or more and less than 95%. Thereby, the total number of passes of a rolling process can be reduced with respect to the conventional high workability rolling copper foil. In addition to this, it is possible to avoid the difficulty of controlling the rolling process due to excessive work hardening, and to contribute to reducing the load on the manufacturing facility and reducing the manufacturing cost. It is possible to achieve both high resin adhesion and reduced cost in the rolled copper foil.
(負極板製造工程)
最終冷間圧延工程後の圧延銅箔は、電着粒のめっき等の粗化処理を施すことなく、次の負極板の製造を行う。この負極板製造工程においては、例えば負極活物質塗布後の乾燥工程やリチウムイオン二次電池組み込み後の乾燥工程において、100〜200℃の熱処理が行われる(図1のS106)。
(Negative electrode plate manufacturing process)
The rolled copper foil after the final cold rolling process produces the next negative electrode plate without performing a roughening treatment such as plating of electrodeposited grains. In this negative electrode plate manufacturing process, for example, a heat treatment at 100 to 200 ° C. is performed in a drying process after application of the negative electrode active material and a drying process after incorporation of the lithium ion secondary battery (S106 in FIG. 1).
上記圧延銅箔の製造方法においては、最終冷間圧延工程の直後、あるいはその後に200℃以下の温度で1分〜20時間加熱された状態において、X線回折2θ/θ測定によって得られる銅結晶の{220}Cu方向の回折ピーク強度I{220}と{200}Cu方向の回折ピーク強度I{200}との比(以下、「回折強度比」という。)がI{220}/I{200}>2の関係を有するように制御することが肝要である。ここで、I{220}及びI{200}は、圧延銅箔の圧延面における{220}結晶面及び{200}結晶面のX線回折強度である。 In the manufacturing method of the rolled copper foil, a copper crystal obtained by X-ray diffraction 2θ / θ measurement immediately after the final cold rolling step or after that is heated at a temperature of 200 ° C. or lower for 1 minute to 20 hours. Of {220} Cu direction diffraction peak intensity I {220} and {200} Cu direction diffraction peak intensity I {200} (hereinafter referred to as “diffraction intensity ratio”) is I {220} / I { 200} > 2 is important to control. Here, I {220} and I {200} are the X-ray diffraction intensities of the {220} crystal plane and {200} crystal plane in the rolled surface of the rolled copper foil.
上記最終冷間圧延工程において、85%以上95%未満の高加工度での冷間圧延を施すことで、最終冷間圧延工程直後の状態において、銅箔の圧延面で{220}Cu面の配向が強く、{200}Cu面の配向が弱くなり、回折強度比の上限は特に制限はないが、回折強度比I{220}/I{200}>2の関係が満たされる。更に好ましくは、回折強度比I{220}/I{200}>5の関係を満たすことが望ましい。この配向性は、θ−2θ法等のX線回折法等で求めることができる。 In the final cold rolling step, by performing cold rolling at a high workability of 85% or more and less than 95%, in the state immediately after the final cold rolling step, the rolled surface of the copper foil has a {220} Cu surface. The orientation is strong and the orientation of the {200} Cu plane is weak, and the upper limit of the diffraction intensity ratio is not particularly limited, but the relationship of the diffraction intensity ratio I {220} / I {200} > 2 is satisfied. More preferably, it is desirable to satisfy the relationship of the diffraction intensity ratio I {220} / I {200} > 5. This orientation can be determined by an X-ray diffraction method such as the θ-2θ method.
図2を参照すると、図2にはX線回折における入射X線、検出器、試料、及び走査軸の関係が示されている。X線回折装置において、θ軸は一般的に試料軸と呼ばれている。入射X線に対して、試料1と検出器2とをθ軸で走査し、試料1の走査角をθ、検出器2の走査角を2θで走査する測定を2θ/θ測定という。この2θ/θ測定による回折ピークの強度によって、多結晶体である圧延銅箔の試料面(圧延面)において、どの結晶面が優勢であるのかを評価することができる。なお、銅の結晶構造は立方晶であることから、{200}Cu面と{220}Cu面とのなす角度は45°である。また、「{ }」は等価な面を表す。
Referring to FIG. 2, FIG. 2 shows the relationship among incident X-rays, detectors, samples, and scanning axes in X-ray diffraction. In the X-ray diffraction apparatus, the θ axis is generally called a sample axis. The measurement in which the sample 1 and the
この圧延銅箔は、上述したように、Cr、Zr、Sn、Mg、Ag、Fe、Co、Ni、Zn、Ti、Si、B、Bi、Sb、及びMnからなる元素群の中から選択される1種以上の添加元素の総量を0.5重量%以下で添加することで耐熱性の向上が得られる。そのため、最終冷間圧延工程後に200℃以下の温度で1分〜20時間加熱された後の状態においても、{200}Cu方向への配向が起こりにくく、回折強度比I{220}/I{200}>2の関係が満たされる。 As described above, this rolled copper foil is selected from the element group consisting of Cr, Zr, Sn, Mg, Ag, Fe, Co, Ni, Zn, Ti, Si, B, Bi, Sb, and Mn. The heat resistance can be improved by adding the total amount of one or more additional elements at 0.5% by weight or less. Therefore, even in the state after heating for 1 minute to 20 hours at a temperature of 200 ° C. or lower after the final cold rolling step, orientation in the {200} Cu direction hardly occurs, and the diffraction intensity ratio I {220} / I { 200} > 2 is satisfied.
最終冷間圧延工程において、圧延集合組織{220}Cu方向へのより強い配向を得ることにより、最終冷間圧延工程の直後、あるいはその後に200℃以下の温度で1分〜20時間加熱された状態においても、圧延面に{200}Cu方向への配向が起こりにくく、良好な樹脂密着性特性を有する圧延銅箔が安定して得られる。 In the final cold rolling process, by obtaining a stronger orientation in the rolling texture {220} Cu direction, it was heated immediately after or after the final cold rolling process at a temperature of 200 ° C. for 1 minute to 20 hours. Even in the state, orientation in the {200} Cu direction hardly occurs on the rolled surface, and a rolled copper foil having good resin adhesion characteristics can be stably obtained.
(高い樹脂密着性のメカニズムに関する考察)
圧延銅箔における圧延面の結晶粒の方位・配向状態によって、銅箔表面で見られる原子配列の状態が異なり、銅箔表面の原子間距離が変化する。{220}Cu面では、図3に示すように、ある方向とそれに垂直な方向に対して最近接間の距離で原子が配列することになる。一方、{200}Cu面では、図4に示すように、ある方向に対しては最近接間の距離、それに垂直な方向に対しては次近接間の距離で原子が配列することになる。
(Discussion on the mechanism of high resin adhesion)
Depending on the orientation and orientation state of the crystal grains on the rolled surface in the rolled copper foil, the state of atomic arrangement seen on the copper foil surface varies, and the interatomic distance on the copper foil surface changes. On the {220} Cu plane, as shown in FIG. 3, atoms are arranged at a distance between the closest points in a certain direction and a direction perpendicular thereto. On the other hand, on the {200} Cu plane, as shown in FIG. 4, atoms are arranged at a distance between nearest neighbors in a certain direction and at a distance between next neighbors in a direction perpendicular thereto.
銅箔表面に塗布された樹脂は、銅箔表面の原子と樹脂を構成する原子との問の原子間力、及び樹脂同士の分子間力によって決定される安定状態で銅箔表面上に固化されると考えられる。 The resin applied to the copper foil surface is solidified on the copper foil surface in a stable state determined by the atomic force between the atoms on the copper foil surface and the atoms constituting the resin, and the intermolecular force between the resins. It is thought.
そこで、有機化合物である樹脂が有しているある特定の周期的な分子構造と銅箔表面の原子間距離とのマッチングを良くすることで、銅箔表面上に固化される樹脂の安定状態の安定性を更に向上させることができるようになり、銅箔の樹脂密着性を向上させることにつながったと考えられる。 Therefore, by improving the matching between the specific periodic molecular structure of the resin, which is an organic compound, and the interatomic distance of the copper foil surface, the stable state of the resin solidified on the copper foil surface can be improved. It is considered that the stability can be further improved, and the resin adhesion of the copper foil is improved.
以下に、本発明の更に具体的な実施の形態として、実施例及び比較例を挙げて詳細に説明する。なお、この実施例では、上記実施の形態である圧延銅箔の典型的な一例を挙げており、本発明は、これらの実施例及び比較例に限定されるものではないことは勿論である。 Hereinafter, examples and comparative examples will be described in detail as more specific embodiments of the present invention. In addition, in this Example, a typical example of the rolled copper foil which is the said embodiment is given, and it is needless to say that the present invention is not limited to these Examples and Comparative Examples.
実施例1〜15の圧延銅箔、及び比較例1〜4の圧延銅箔を電着粒のめっき等の粗化処理を行うことなく製造し、得られた圧延銅箔について比較と評価を行った。実施例1〜15、及び比較例1〜4における圧延銅箔の組成と、最終冷間圧延後の熱処理条件、X線回折強度比I{220}/I{200}、ピール強度、及び碁盤目試験の結果とを下記の表1にまとめて示す。 The rolled copper foil of Examples 1 to 15 and the rolled copper foil of Comparative Examples 1 to 4 were produced without performing a roughening treatment such as plating of electrodeposited grains, and the obtained rolled copper foil was compared and evaluated. It was. Compositions of rolled copper foils in Examples 1 to 15 and Comparative Examples 1 to 4, heat treatment conditions after final cold rolling, X-ray diffraction intensity ratio I {220} / I {200} , peel strength, and grid The test results are summarized in Table 1 below.
密着性の評価方法としては、実施例1〜15の圧延銅箔、及び比較例1〜4の圧延銅箔に対して、バインダの樹脂溶媒として代表的なポリ弗化ビニリデン(PVdF)を塗布した後に乾燥させ、銅箔表面上にバインダを乾燥固化させたもの(以下、「バインダ塗布銅箔」と称する。)に対して、ピール試験と碁盤目試験とを行った。 As a method for evaluating adhesion, a representative polyvinylidene fluoride (PVdF) was applied as a binder resin solvent to the rolled copper foils of Examples 1 to 15 and Comparative Examples 1 to 4. A peel test and a cross-cut test were performed on what was dried and the binder was dried and solidified on the copper foil surface (hereinafter referred to as “binder-coated copper foil”).
(圧延銅箔の製作)
無酸素銅を母材にして、下記の表1に示す合金成分の銅合金を溶製し、インゴットに鋳造した。このインゴットに熱間圧延を施した板材に対して、冷間圧延、及び生地焼鈍を順に施した後、85%以上95%未満の高加工度で最終冷間圧延を施した。これにより、厚さ10μmの圧延銅箔である実施例1〜15、及び比較例1〜4を得た。
(Production of rolled copper foil)
Using oxygen-free copper as a base material, copper alloys having the alloy components shown in Table 1 below were melted and cast into ingots. The plate material obtained by hot rolling the ingot was subjected to cold rolling and fabric annealing in order, and then subjected to final cold rolling at a high workability of 85% or more and less than 95%. Thereby, Examples 1-15 which are rolled copper foil of thickness 10 micrometers, and Comparative Examples 1-4 were obtained.
(圧延銅箔に対するX線回折)
圧延銅箔の圧延面に対するX線回折2θ/θ測定には、X線回折装置(Rigaku製、型式Ultima IV)を用いた。その測定結果を下記の表1にまとめて示す。
(X-ray diffraction for rolled copper foil)
For the X-ray diffraction 2θ / θ measurement on the rolled surface of the rolled copper foil, an X-ray diffraction apparatus (manufactured by Rigaku, model Ultimate IV) was used. The measurement results are summarized in Table 1 below.
(ピール試験)
図5にピール試験片の作製手順の一例を模式的に示す。バインダ膜3を塗布した銅箔(バインダ塗布銅箔)4を幅12.5mm×長さ80mmの短冊矩形状に切り、補強板5に短冊状のバインダ塗布銅箔4を接着した。強粘着力テープ6をバインダ塗布銅箔4の短冊の長さの半分に貼り付ける。強粘着力テープ6を引っ張ることで、バインダ塗布銅箔4からバインダ膜3の一部を引き剥がし、ピール試験片を得た。そして、引き剥がした部分のバインダ膜3を強粘着力テープ6と一緒にピール試験機のチャックに掴み、垂直方向に引き上げるときの速度を5mm/分としてピール強度を測定した。その測定結果を下記の表1にまとめて示す。
(Peel test)
FIG. 5 schematically shows an example of a procedure for producing a peel test piece. A copper foil (binder-coated copper foil) 4 coated with the binder film 3 was cut into a rectangular strip having a width of 12.5 mm and a length of 80 mm, and the strip-shaped binder-coated copper foil 4 was bonded to the reinforcing plate 5. A strong adhesive tape 6 is affixed to half the length of the strip of the binder-coated copper foil 4. By pulling the strong adhesive tape 6, a part of the binder film 3 was peeled off from the binder-coated copper foil 4 to obtain a peel test piece. Then, the peeled portion of the binder film 3 was grasped together with the strong adhesive tape 6 by the chuck of the peel tester, and the peel strength was measured by setting the speed at the time of pulling up in the vertical direction to 5 mm / min. The measurement results are summarized in Table 1 below.
(碁盤目試験)
実施例1〜15の圧延銅箔、及び比較例1〜4の圧延銅箔を試験片として、100個ずつ作製した。各試験片を100個ずつ使用して、JIS H 8602に準拠して、カッターでバインダ塗布銅箔4のバインダ膜3に25個(1mm角)のマス目を作り、そのバインダ膜3にセロハンテープを貼着して密着させた後、バインダ膜3を剥がし、剥がれなかった碁盤目の個数により接着性を評価した。ここでは、1マスも剥離しなかったものを○印とし、1〜5マスだけ剥離したものを△印とし、6マス以上剥離したものを×印として評価した。その評価結果を下記の表1にまとめて示す。
(Cross cut test)
100 pieces of each of the rolled copper foils of Examples 1 to 15 and the rolled copper foils of Comparative Examples 1 to 4 were prepared as test pieces. In accordance with JIS H 8602, 25 test pieces (1 mm square) were formed on the binder film 3 of the binder-coated copper foil 4 by using 100 test pieces, and cellophane tape was applied to the binder film 3. After sticking and adhering, the binder film 3 was peeled off, and the adhesiveness was evaluated by the number of grids that were not peeled off. Here, the case where none of the squares were peeled was evaluated as “◯”, the case where only 1 to 5 squares were peeled was regarded as “Δ”, and the case where 6 squares or more were peeled off was evaluated as “X”. The evaluation results are summarized in Table 1 below.
下記の表1に示す結果から、実施例1〜15は、Cr、Zr、Sn、Mg、Ag、Fe、Co、Ni、Zn、Ti、Si、B、Bi、Sb、及びMnからなる元素群の中から選択される1種以上の添加元素を0.5重量%以下に設定し、最終冷間圧延工程の直後、あるいはその後に200℃以下の温度で1分〜20時間加熱された状態における回折強度比がI{220}/I{200}>2の関係を有するように制御することで、初期の目的とする圧延銅箔が安定して得られ、良好な樹脂密着性を実現できるということが分かった。 From the results shown in Table 1 below, Examples 1 to 15 are elements of Cr, Zr, Sn, Mg, Ag, Fe, Co, Ni, Zn, Ti, Si, B, Bi, Sb, and Mn. One or more additive elements selected from the above are set to 0.5% by weight or less, and immediately after the final cold rolling step or after that, heated at a temperature of 200 ° C. or less for 1 minute to 20 hours. By controlling the diffraction intensity ratio to have a relationship of I {220} / I {200} > 2, the initial intended rolled copper foil can be stably obtained, and good resin adhesion can be realized. I understood that.
一方、比較例1及び2のように、上記Crなどの添加元素を含有しない場合は、最終冷間圧延工程後に200℃以下の温度で1分〜20時間加熱された後の状態においても、{200}Cu方向への配向が起こり、回折強度比がI{220}/I{200}>2の関係を満たすことはできない。その結果、比較例1及び2においては、実施例1〜15に比べてピール強度が低下し、良好な樹脂密着性を実現することは困難であるということが理解できる。 On the other hand, as in Comparative Examples 1 and 2, when the additive element such as Cr is not contained, even after the final cold rolling step, after being heated at a temperature of 200 ° C. or lower for 1 minute to 20 hours, { 200} Orientation in the Cu direction occurs, and the diffraction intensity ratio cannot satisfy the relationship of I {220} / I {200} > 2. As a result, in Comparative Examples 1 and 2, it can be understood that the peel strength is lower than in Examples 1 to 15 and it is difficult to achieve good resin adhesion.
また、比較例3及び4のように、上記Crなどの添加元素を規定範囲内に含有させても、最終冷間圧延工程後における熱処理条件が初期の目的とする規定から外れると、回折強度比がI{220}/I{200}>2の関係を満たすことはできない。その結果、比較例3及び4では、実施例1〜15に比べてピール強度が低下し、良好な樹脂密着性を実現することは困難であるということが理解できる。 Further, as in Comparative Examples 3 and 4, even when the additive element such as Cr is included within the specified range, if the heat treatment conditions after the final cold rolling process deviate from the initial target specification, the diffraction intensity ratio Cannot satisfy the relationship of I {220} / I {200} > 2. As a result, in Comparative Examples 3 and 4, it can be understood that the peel strength is lower than in Examples 1 to 15 and it is difficult to achieve good resin adhesion.
従って、比較例1〜4のように、上記添加元素の含有量が規定範囲内にあっても、最終冷間圧延工程後における熱処理温度・時間の条件が初期の目的とする規定から外れると、樹脂との密着性が良好な圧延銅箔が安定して得られないということが分かった。 Therefore, as in Comparative Examples 1 to 4, even if the content of the additive element is within the specified range, if the heat treatment temperature and time conditions after the final cold rolling step deviate from the initial target specification, It turned out that the rolled copper foil with favorable adhesiveness with resin cannot be obtained stably.
以上より、本発明のリチウムイオン二次電池集電体用圧延銅箔は、樹脂との密着性が良好な銅箔であり、リチウムイオン電池の長寿命化と安全性に寄与し得るなどの産業上極めて有効な効果を有するということが実証された。 From the above, the rolled copper foil for the lithium ion secondary battery current collector of the present invention is a copper foil having good adhesion to the resin, and can contribute to the long life and safety of the lithium ion battery. It was proved to have a very effective effect.
以上の説明からも明らかなように、本発明のリチウムイオン二次電池集電体用圧延銅箔の代表的な構成例を上記実施の形態、実施例、及び図示例を挙げて説明したが、上記実施の形態、実施例、及び図示例は特許請求の範囲に係る発明を限定するものではない。上記実施の形態、実施例、及び図示例の中で説明した特徴の組合せの全てが本発明の課題を解決するための手段に必須であるとは限らない点に留意すべきであり、本発明の技術思想の範囲内において種々の構成が可能であることは勿論である。
As is clear from the above description, a typical configuration example of the rolled copper foil for a lithium ion secondary battery current collector of the present invention has been described with reference to the above embodiment, examples, and illustrated examples. The above-described embodiments, examples, and illustrated examples do not limit the invention according to the claims. It should be noted that not all the combinations of features described in the above embodiments, examples, and illustrated examples are essential to the means for solving the problems of the present invention. Of course, various configurations are possible within the scope of this technical idea.
1…試料、2…検出器、3…バインダ膜、4…銅箔、5…補強板、6…強粘着力テープ DESCRIPTION OF SYMBOLS 1 ... Sample, 2 ... Detector, 3 ... Binder film, 4 ... Copper foil, 5 ... Reinforcement board, 6 ... Strong adhesive tape
Claims (3)
X線回折2θ/θ測定によって得られる銅結晶の{220}Cu方向の回折ピーク強度I{220}と{200}Cu方向の回折ピーク強度I{200}との比がI{220}/I{200}>2であり、
前記添加元素の総量は0.1〜0.5重量%であることを特徴とするリチウムイオン二次電池集電体用圧延銅箔。 The Cu as the main component, Cr, Zr, Sn, Mg , C o, Ni, Zn, Ti, Si, B, Bi, and one or more additive element selected from the element group consisting of Sb, and Mn Having a copper alloy composition containing inevitable impurities,
The ratio of the diffraction peak intensity I {220} in the {220} Cu direction and the diffraction peak intensity I {200} in the {200} Cu direction of the copper crystal obtained by X-ray diffraction 2θ / θ measurement is I {220} / I {200}> are two der,
Lithium-ion secondary battery current collector rolled copper foil total amount of the additional element, wherein 0.1 to 0.5 wt% der Rukoto.
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| JP5718426B2 (en) * | 2012-10-31 | 2015-05-13 | 古河電気工業株式会社 | Copper foil, negative electrode for non-aqueous electrolyte secondary battery, and non-aqueous electrolyte secondary battery |
| WO2014119582A1 (en) * | 2013-01-29 | 2014-08-07 | 古河電気工業株式会社 | Electrolytic copper foil, electrode obtained using said electrolytic copper foil for lithium-ion secondary battery, and lithium-ion secondary battery obtained using said electrode |
| KR101864904B1 (en) * | 2013-05-09 | 2018-06-05 | 주식회사 엘지화학 | Methode for measuring electrode density and porosity |
| JP6041779B2 (en) * | 2013-09-20 | 2016-12-14 | Jx金属株式会社 | Copper alloy foil |
| CN105779808B (en) * | 2014-12-16 | 2018-06-22 | 北京有色金属研究总院 | A kind of power battery high-adhesiveness copper alloy foil and its processing method |
| CN105063413A (en) * | 2015-07-29 | 2015-11-18 | 温州银泰合金材料有限公司 | Copper-based electric contact material and manufacturing technology thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11339811A (en) * | 1998-05-25 | 1999-12-10 | Nippaku Sangyo Kk | Copper alloy foil current collector for secondary battery |
| JP2000328159A (en) * | 1999-05-19 | 2000-11-28 | Kobe Steel Ltd | Copper alloy foil |
| JP2004060018A (en) * | 2002-07-30 | 2004-02-26 | Hitachi Cable Ltd | Copper foil for electronic components |
| JP4743020B2 (en) * | 2006-06-26 | 2011-08-10 | ソニー株式会社 | Electrode current collector and manufacturing method thereof, battery electrode and manufacturing method thereof, and secondary battery |
| JP2008024995A (en) * | 2006-07-21 | 2008-02-07 | Kobe Steel Ltd | Copper alloy plate for electrical/electronic component having excellent heat resistance |
| JP4466688B2 (en) * | 2007-07-11 | 2010-05-26 | 日立電線株式会社 | Rolled copper foil |
| JP2009185364A (en) * | 2008-02-08 | 2009-08-20 | Hitachi Cable Ltd | Rolled copper foil for flexible printed wiring boards and rolled copper foil for conductive members |
-
2011
- 2011-03-17 JP JP2011058926A patent/JP5654911B2/en active Active
- 2011-06-13 KR KR1020110057074A patent/KR20120106512A/en not_active Ceased
- 2011-07-12 CN CN2011101995776A patent/CN102683713A/en active Pending
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160117195A (en) | 2015-03-30 | 2016-10-10 | 제이엑스금속주식회사 | Rolled copper foil for secondary battery, and lithium ion secondary battery and lithium ion capacitor using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120106512A (en) | 2012-09-26 |
| JP2012195192A (en) | 2012-10-11 |
| KR20140053079A (en) | 2014-05-07 |
| CN102683713A (en) | 2012-09-19 |
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