JP5656821B2 - Holding device - Google Patents

Description

  The present invention relates to a holding device that holds and holds a workpiece.

  2. Description of the Related Art Conventionally, laser processing apparatuses that process a workpiece held on a table with laser light are known. In such a laser processing apparatus, a plurality of holes are formed on a table on which a workpiece is placed. By sucking air from a plurality of holes formed on the table, the workpiece is adsorbed and held on the table.

  In processing of a workpiece by a laser processing apparatus, it may be required not only to form non-through holes but also to form through holes. When the through hole is formed in the workpiece, the table may be damaged by the laser beam penetrating the workpiece.

  Therefore, for example, Patent Document 1 discloses a configuration in which a table is not provided on the back surface of the workpiece by pulling both ends of the workpiece to hold the workpiece.

JP 2009-6356 A

  However, according to the configuration disclosed in Patent Document 1, a mechanism for pulling both ends of the workpiece is required, which complicates the apparatus. Further, in the processing of a workpiece by laser light, high flatness may be required for the workpiece being processed, but it is difficult to ensure high flatness by pulling both ends. Moreover, in order to ensure flatness while suppressing the breakage and deformation of the workpiece, it is necessary to adjust the tensile strength and the like, and there is a problem that the apparatus may be complicated and the operation may be complicated.

  The present invention has been made in view of the above, and can prevent damage to the apparatus during penetration processing into a workpiece, and facilitate recombination of the apparatus during non-penetration processing and during penetration processing. It is an object of the present invention to provide a holding device that can achieve a simpler configuration.

  In order to solve the above-described problems and achieve the object, the present invention provides a holding device for holding a workpiece, and a table for adsorbing the workpiece on a first surface on which a plurality of holes are formed. The hole has a plurality of first holes formed for sucking and adsorbing the workpiece, and a second hole formed with an opening area larger than the first hole. The second hole portion is configured to be substantially flush with the first surface of the table by the first closing means that is inserted into the second hole and closes the second hole. To do.

  According to the present invention, the second hole can be closed by the first closing means, and at the time of closing, the second hole portion is substantially flush with the first surface of the table, so that the workpiece can be machined through. The device can be prevented from being damaged, and the device can be easily recombined with a simpler structure during non-penetration processing and during penetration processing.

FIG. 1 is a block diagram illustrating a schematic configuration of a laser processing apparatus including a holding device according to a first embodiment of the present invention. FIG. 2 is a block diagram illustrating a schematic configuration of the holding device. FIG. 3 is a partial plan view showing a schematic configuration of the table. FIG. 4 is a partial cross-sectional view of the table. FIG. 5 is a partially enlarged cross-sectional view of a portion A shown in FIG. 4 and shows a state where the through hole is closed by the first closing means. FIG. 6 is a side view of the first closing means. FIG. 7 is a plan view of the first closing means viewed from the head side. FIG. 8 is a partially enlarged cross-sectional view of a portion A shown in FIG. 4 and shows a state in which a through hole is opened. FIG. 9 is a partially enlarged cross-sectional view of a portion A shown in FIG. 4 and shows a state where the through hole is closed by the second closing means. FIG. 10A is a side view of the second closing means. FIG. 10-2 is a side view of the second closing means. FIG. 11 is a side view showing a modification of the second closing means. FIG. 12 is a cross-sectional view of a table provided in the holding device according to the second embodiment of the present invention. FIG. 13 is a partial enlarged cross-sectional view in which the portion B shown in FIG. 12 is enlarged, and shows a state during non-penetrating processing. FIG. 14 is a partial enlarged cross-sectional view in which the portion B shown in FIG. 12 is enlarged, and shows a state during penetration processing. FIG. 15 is a partial enlarged cross-sectional view in which the portion B shown in FIG. 12 is enlarged, and is a view showing another example of the state during the penetration processing.

  Below, the holding device concerning an embodiment of the invention is explained in detail based on a drawing. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a block diagram showing a schematic configuration of a laser processing apparatus including a holding device according to Embodiment 1 of the present invention. The laser processing device 1 includes a laser irradiation device 2 and a holding device 3. The laser processing apparatus 1 forms a through hole or a stop hole in a workpiece 4 such as a ceramic green sheet held by a holding device 3 using a laser beam.

  The laser irradiation device 2 includes a laser oscillator 5, a reflection mirror 6, and a condenser lens 7. The laser oscillator 5 generates laser light. The reflection mirror 6 reflects the laser beam generated by the laser oscillator 5 toward the condenser lens 7. The condensing lens 7 condenses the incident laser light. The workpiece 4 is processed by the condensed laser light.

  FIG. 2 is a block diagram illustrating a schematic configuration of the holding device. The holding device 3 includes a table 8 and a suction pump 9. The holding device 3 holds the workpiece 4 when the workpiece 4 is laser processed.

  FIG. 3 is a partial plan view showing a schematic configuration of the table. FIG. 4 is a partial cross-sectional view of the table. The table 8 includes a placement unit 10 on which the workpiece 4 is placed on a surface (first surface) 10 a and a base 18 provided on the opposite side of the surface 10 a of the placement unit 10. The placement unit 10 and the base unit 18 may be integrally formed.

  A hole 11 is formed in the surface 10 a of the mounting portion 10. The hole 11 includes a suction hole (first hole) 11a and a through hole (second hole) 11b. As shown in FIG. 3, a plurality of suction holes 11a are formed over substantially the entire surface 10a. As shown in FIG. 4, a suction path 12 surrounded by the placement portion 10 and the base portion 18 is formed inside the table 8.

  The suction hole 11 a is connected to the suction path 12 inside the table 8. The suction path 12 is connected to the suction pump 9. By sucking the air in the suction passage 12 by the suction pump 9 and reducing the pressure inside the suction hole 11a, the workpiece 4 placed on the surface 10a of the placement portion 10 is adsorbed. Can do.

  The through hole 11b is formed with a larger opening area than the suction hole 11a. The through hole 11b is formed at a position corresponding to a position where a through hole such as an alignment mark or a guide hole is formed on the workpiece 4 placed on the surface 10a of the placing portion 10. . When a through hole is formed in the workpiece 4, a through hole 11 b is provided to prevent the laser irradiated from the laser irradiation device 2 from penetrating the workpiece 4 and damaging the table 8. .

  The through hole 11b is connected to the suction path 12 inside the table 8 in the same manner as the suction hole 11a, and a section generated when the through hole is formed can be collected through the suction path 12. ing. Although not shown, a filter is provided in front of the suction pump 9 in order to prevent the suction pump 9 from being broken due to a section or the like.

  FIG. 5 is a partial enlarged cross-sectional view of a portion A shown in FIG. 4 and shows a state where the through hole 11b is closed by the first closing means. As shown in FIG. 5, the through hole 11 b can be closed by the first closing means 13.

  FIG. 6 is a side view of the first closing means 13. FIG. 7 is a plan view of the first closing means 13 viewed from the head side. As shown in FIGS. 6 and 7, the first closing means has a shaft portion 13 a and a head portion 13 b and has a bolt shape as a whole. An external screw is formed on the shaft portion 13a. The head portion 13b is provided on one end side of the shaft portion 13a and has a larger outer diameter than the shaft portion 13a.

  According to the shape of the first closing means 13, the through hole 11b has a shaft insertion portion 15 into which the shaft portion 13a is inserted and a head insertion portion 16 into which the head portion 13b is inserted. The The head insertion portion 16 is formed closer to the surface 10 a than the shaft portion insertion portion 15. The inner wall of the shaft portion insertion portion 15 is formed with an inner screw for enabling the shaft portion 13a to be screwed. The inner diameter of the head insertion portion 16 is formed larger than the inner diameter of the shaft insertion portion 15.

  The height of the head portion 13b and the height of the head insertion portion 16 are substantially equal. When the first closing means 13 is screwed into the through hole 11b, the bottom surface 16a of the head insertion portion 16 and the head 13b come into contact with each other, and further screwing is restricted. Here, since the height of the head portion 13b and the height of the head insertion portion 16 are substantially equal, the surface 10a of the placement portion 10 and the top surface 13c of the head portion 13b constitute substantially the same plane.

  Therefore, the surface 10a of the mounting portion 10 and the top surface 13c of the head portion 13b can be configured in substantially the same plane by screwing the first closing means 13 as much as possible. The head 13b is formed with a recess 13d for fitting a tool such as a screwdriver (not shown) into which the first closing means 13 is screwed.

  FIG. 8 is a partially enlarged cross-sectional view of a portion A shown in FIG. 4 and shows a state where the through hole 11b is opened. As shown in FIG. 8, the through hole 11 b is opened by removing the first closing means 13. In the case of performing the penetration process on the workpiece 4, the workpiece 4 is placed so that the penetration portion overlaps the penetration hole 11b after opening the penetration hole 11b.

  By forming the through hole 11b, the laser beam penetrating the workpiece 4 during the penetrating process reaches the wall surface of the base portion 18 without being irradiated to the mounting portion 10 almost. Since the irradiation area of the laser light reaching the wall surface of the base 18 is expanded to some extent, the wall surface of the base 18 is hardly damaged.

  Of the wall surface constituting the suction path 12, the wall portion 18a, which is a portion facing the through hole 11b, that is, a portion obtained by projecting the through hole 11b on the insertion direction side of the first closing means to be described later, has a conical shape. To form a tapered recess. Since the wall portion 18a has a tapered shape, the laser beam reflected by the wall portion 18a is less likely to be directly irradiated onto the workpiece 4. Thereby, damage to the workpiece 4 due to the reflected laser beam can be suppressed.

  FIG. 9 is a partially enlarged cross-sectional view of a portion A shown in FIG. 4 and shows a state where the through hole is closed by the second closing means. FIG. 10A is a side view of the second closing means. FIG. 10-2 is a side view of the second closing means. As shown in FIG. 9, it is also possible to perform the penetration process on the workpiece 4 with the second blocking means 14 closing the penetration hole 11 b.

  The second closing means 14 is formed with an external screw so as to be screwed into the shaft insertion portion 15 of the through hole 11b. The second closing means 14 is not provided with a head 13b like the first closing means 13. Therefore, as shown in FIG. 9, the through hole 11b can be screwed in such a manner that the through hole 11b is recessed from the surface 10a of the mounting portion 10, and the through hole 11b is formed as a depression. Can do.

  When performing the penetration process on the workpiece 4, the workpiece 4 is placed so that the penetration portion overlaps the penetration hole 11b portion where the depression is formed. Since the through hole 11b portion is a depression, the laser beam that has penetrated the workpiece 4 during the penetration process is hardly irradiated to the mounting portion 10 and the end surface along the insertion direction of the second closing means 14 To reach. Since the irradiation area of the laser light reaching the end face of the second closing means 14 is expanded to some extent, the end face of the second closing means 14 is hardly damaged.

  The end surface of the second closing means 14 is cut on a cone to form a tapered recess. Since the end surface of the second closing means 14 has a tapered shape, the laser beam reflected by the end surface is difficult to be directly irradiated onto the workpiece 4. Thereby, damage to the workpiece 4 due to the reflected laser beam can be suppressed.

  Since the tapered recesses are formed on both end faces of the second closing means 14, the effect of suppressing damage to the workpiece 4 due to the reflected laser light even if the second closing means 14 is inserted from either end face side. Can be obtained. Therefore, the user of the laser processing apparatus 1 can use the second closing means 14 without worrying about the insertion direction. The end surface of the second closing means 14 is formed with a recess 14a for fitting a tool such as a screwdriver (not shown) into which the second closing means 14 is screwed.

  FIG. 11 is a side view showing a modification of the second closing means 14. As shown in FIG. 11, a tapered recess may be formed only on one end surface of the second closing means 14.

  As described above, according to the holding device 3 according to the first embodiment, when the non-penetrating process is performed on the workpiece 4, the penetrating hole 11 b can be blocked by the first closing means 13. it can. If the first closing means 13 is used, the flatness between the surface 10a of the mounting portion 10 and the top surface 13c of the first closing means 13 can be easily ensured. By ensuring the flatness between the surface 10a of the mounting portion 10 and the top surface 13c of the first closing means 13, the deformation of the workpiece 4 can be suppressed, and the decrease in processing accuracy can be suppressed.

  Further, when the workpiece 4 is subjected to penetration processing, a predetermined space can be secured on the back surface of the penetration portion by simply removing the first closing means 13 or replacing it with the second closing means 14. Damage to the placement unit 10 can be suppressed. Moreover, since it is only necessary to remove the first closing means 13 or replace it with the second closing means 14, the recombination of the apparatus can be facilitated with a simpler configuration.

  Further, when the second closing means 14 is used, the second blocking means 14 isolates the through hole 11b from the suction path 12, so that the section generated during processing is sucked into the suction path 12. Can be prevented. When the section vigorously passes through the suction passage 12, there is a risk of damaging a filter (not shown) provided in front of the suction pump 9 or damaging the suction pump 9 itself. By using the second closing means 14, such damage can be suppressed.

  Further, by providing a tapered recess in the wall 18a of the suction path 12 and the end surface of the second closing means 14, it is possible to suppress the workpiece 4 from being damaged by the reflected laser light.

  In addition, although the external thread is formed in the axial part 13a of the 1st obstruction | occlusion means 13, it is good also as a structure which does not form an external thread in the axial part 13a. In this case, if the outer diameter of the shaft portion 13a is slightly smaller than the inner diameter of the shaft insertion portion 15 of the through hole 11b, the first closing means 13 can be simply inserted into the through hole 11b. . Further, a hooking portion or the like may be formed on the head 13b so that the inserted first closing means 13 can be easily pulled out.

Embodiment 2. FIG.
FIG. 12 is a cross-sectional view of a table provided in the holding device according to the second embodiment of the present invention. FIG. 13 is a partial enlarged cross-sectional view in which the portion B shown in FIG. 12 is enlarged, and shows a state during non-penetrating processing. FIG. 14 is a partial enlarged cross-sectional view in which the portion B shown in FIG. 12 is enlarged, and shows a state during penetration processing. In addition, about the structure similar to the said Embodiment 1, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  In the second embodiment, as in the first embodiment, the first closing means 113 has a shaft portion 113a and a head portion 113b. Further, the through hole (second hole) 111 b includes a shaft portion insertion portion 115 and a head portion insertion portion 116.

  As shown in FIG. 13 and FIG. 14, in the second embodiment, the head insertion portion 116 is formed on the opposite side of the surface 10 a of the placement portion 10 with respect to the shaft portion insertion portion 115. And the 1st obstruction | occlusion means 113 is screwed in from the opposite surface side of the surface 10a of the mounting part 10 with respect to the hole 111b for penetration.

  Further, a recess 113d for fitting a tool such as a screwdriver (not shown) and screwing the first closing means 113 is formed on the end surface opposite to the side of the shaft portion 113a where the head portion 113b is provided. ing. Thereby, the screwing amount of the first closing means 113 screwed from the opposite surface side of the surface 10a of the mounting portion 10 can be adjusted by an operation from the surface 10a side.

  The height of the shaft portion 113a is substantially equal to the height of the shaft portion insertion portion 115. Therefore, if the first closing means 113 is screwed in until the bottom surface 116a of the head insertion portion 116 and the head 113b come into contact with each other, as shown in FIG. 13, the surface 10a of the mounting portion 10 and the end surface of the shaft portion 113a Can be configured in the same plane.

  Moreover, if the 1st obstruction | occlusion means 113 is moved to the opposite surface side of the surface 10a of the mounting part 10, as shown in FIG. 111b portion can be provided. As described above, since the screwing amount may be adjusted without attaching or removing the first closing means 113 between the penetration process and the non-penetration process, the work can be simplified. Moreover, since it is not necessary to remove the 1st obstruction | occlusion means 113, the 1st obstruction | occlusion means 113 can be made hard to lose.

  FIG. 15 is a partial enlarged cross-sectional view in which the portion B shown in FIG. 12 is enlarged, and is a view showing another example of the state during the penetration processing. As shown in FIG. 15, the second closing means 14 having a tapered end face as shown in the first embodiment may be used in a state where a recess is provided in the through hole 111b.

  Rather than reflecting the laser beam on the end face of the first closing means 113, the reflected laser light is less likely to be directly irradiated onto the workpiece 4 by reflecting the laser light on the end face of the second closing means 14. Thereby, the damage of the workpiece 4 by the laser beam reflected after penetrating the workpiece 4 can be suppressed. As in the first embodiment, the second closing means 14 may be formed with a tapered recess only on one end surface.

  As described above, the holding device according to the present invention is suitable for a holding device of a laser processing apparatus that performs penetration processing and non-penetration processing on a workpiece.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 2 Laser irradiation apparatus 3 Holding apparatus 4 Work piece 5 Laser oscillator 6 Reflecting mirror 7 Condensing lens 8 Table 9 Suction pump 10 Mounting part 10a Surface (1st surface)
11 hole 11a Suction hole (first hole)
11b Penetration hole (second hole)
12 Suction Path 13 First Closing Means 13a Shaft 13b Head 13c Top 13d Recess 14 Second Closure 14a Recess 15 Shaft Insert 16 Head Insert 16a Bottom 18 Base 18a Wall 111b 2 holes)
113 First closing means 113a Shaft portion 113b Head portion 113d Recess 115 Shaft portion insertion portion 116 Head insertion portion 116a Bottom surface

Claims (6)

A holding device for holding a workpiece,
A table for adsorbing the workpiece on the first surface on which a plurality of holes are formed;
The hole has a plurality of first holes formed to suck and adsorb the workpiece, and a second hole formed with an opening area larger than the first hole. Configured
The second hole portion can be substantially flush with the first surface of the table by first closing means that is inserted into the second hole and closes the second hole. A holding device characterized. The first closing means has a bolt shape having a shaft portion and a head portion provided on one end side of the shaft portion and having a larger outer diameter than the shaft portion,
The second hole includes a shaft portion insertion portion into which the shaft portion is inserted, and a head insertion portion that is formed with an inner diameter that is substantially the same as the outer diameter of the head portion and into which the head portion can be inserted. And configured with
The head insertion portion is formed closer to the first surface than the shaft insertion portion,
The holding device according to claim 1, wherein a height of the head insertion portion is substantially equal to a height of the head of the first closing means. The shaft portion is formed with an external screw,
The holding device according to claim 2, wherein an inner screw into which the shaft portion is screwed is formed in the shaft portion insertion portion. The table has a wall portion at a portion where the second hole is projected on the insertion direction side of the first closing means,
The holding device according to claim 1, wherein the wall portion has a tapered shape that is recessed toward the insertion direction side of the first closing means. The first closing means has a bolt shape having a shaft portion and a head portion provided on one end side of the shaft portion and having a larger outer diameter than the shaft portion,
The second hole includes a shaft portion insertion portion into which the shaft portion is inserted, and a head insertion portion that is formed with an inner diameter that is substantially the same as the outer diameter of the head portion and into which the head portion can be inserted. And configured with
The shaft portion is formed with an external screw,
An inner screw into which the shaft portion is screwed is formed in the shaft portion insertion portion,
The head insertion portion is formed on the opposite side of the first surface than the shaft insertion portion,
The height of the shaft insertion portion is substantially equal to the height of the shaft portion of the first closing means,
A recess for inserting a tool and screwing the first closing means is formed at an end of the shaft portion opposite to the side on which the head is provided. The holding device according to 1.   The second hole portion may be a recess recessed from the first surface of the table by a second closing means that is inserted into the second hole and closes the second hole. The holding device according to any one of claims 1 to 5.

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