JP5658000B2 - Mixing ratio control apparatus and method, and abrasive liquid supply system and method - Google Patents

Description

  The present invention relates to a mixing ratio control device, a mixing ratio control method, an abrasive liquid supply system, and an abrasive liquid supply method.

  In a manufacturing process of a semiconductor integrated circuit, there is an abrasive liquid supply device that dilutes an abrasive liquid stock solution with a diluent to generate an abrasive liquid having a predetermined concentration and supplies the abrasive liquid to a polishing apparatus (for example, Patent Document 1). reference).

  In addition, a technique for reusing an abrasive liquid used for polishing is known (for example, see Patent Document 2).

Japanese Patent Laid-Open No. 11-126664 JP-A-11-10540

  By the way, in the abrasive liquid supply device that mixes the abrasive liquid stock solution from the stock liquid tank and the diluent at a predetermined ratio to generate the abrasive liquid, and supplies the abrasive liquid to the polishing apparatus, the mixing ratio of the diluent to each other is There is a desire to use two types of stock solution tanks for storing different stock solutions of abrasive fluids. In this case, it is conceivable to change the set value of the mixing ratio in the abrasive liquid supply device when exchanging with different types of stock solution tanks. However, the operation for changing the setting value of the mixing ratio may take time, or the setting value may not be changed depending on the apparatus.

  The present invention uses two types of stock solution tanks for storing abrasive liquid stocks that have different mixing ratios with the diluent without using an operation for changing the set value of the mixing rate in the abrasive fluid supply device. It is an object of the present invention to provide a mixing ratio control apparatus and method that can be used.

A mixing ratio control device according to the present invention includes a mixing tank, a raw solution supply means for supplying a polishing liquid stock solution from a replaceable stock solution tank to the mixing tank, and a diluent flow path for introducing the diluent into the mixing tank. A dilution liquid supply means for supplying the dilution liquid to the mixing tank through the dilution liquid flow path, and a polishing liquid in which the abrasive liquid stock solution and the dilution liquid are mixed at a predetermined ratio are generated in the mixing tank. As described above, a polishing liquid supply apparatus comprising: control means for controlling the stock solution supply means and the dilution liquid supply means; and abrasive liquid supply means for supplying the polishing liquid generated in the mixing tank to a polishing apparatus. a mixing ratio control device in, possess a discharging means for discharging the diluted solution flowing through the diluent channel upstream of the mixing tank, a discharge control unit for controlling the pre-Symbol discharge means, the said As a stock solution tank, A first type stock solution tank for storing a polishing solution stock solution to be mixed with the diluent at a predetermined ratio, and a second type stock solution tank for storing a polishing solution stock solution that does not require dilution with the dilution solution. And when the second type stock solution tank is used, the discharge control means prevents the dilution liquid from being supplied to the mixing tank when the control means is controlled. It is characterized by controlling .

The abrasive liquid supply system according to the present invention includes a mixing tank, a raw liquid supply means for supplying the mixing liquid from the replaceable raw liquid tank to the mixing tank, and a diluting liquid flow path for introducing the diluting liquid to the mixing tank. A dilution liquid supply means for supplying the dilution liquid to the mixing tank through the dilution liquid flow path, and a polishing liquid in which the abrasive liquid stock solution and the dilution liquid are mixed at a predetermined ratio are generated in the mixing tank. A control means for controlling the stock solution supply means and the dilution liquid supply means, an abrasive liquid supply means for supplying the polishing liquid generated in the mixing tank to a polishing apparatus, and the dilution liquid flow path. a discharging means for discharging the diluted solution flowing in the upstream side of the mixing tank, have a, a discharge control unit for controlling the pre-Symbol discharge means, as the stock solution tank, is mixed with the diluent at a predetermined ratio Collect the abrasive liquid stock There are a first type of stock solution tank and a second type of stock solution tank that contains a polishing solution stock solution that does not require dilution with the diluent, and the discharge control means includes the second type of stock solution tank. When used, when the control means is controlled, the discharge means is controlled so that the diluent is not supplied to the mixing tank .

  According to the present invention, two types of stock solution tanks containing abrasive solution stocks having different mixing ratios with the diluent are not required, without changing the setting value of the mixture rate in the abrasive fluid supply device. Can be used in.

It is the schematic which shows an example of a structure of the abrasive fluid supply system containing the mixing ratio control apparatus which concerns on embodiment. It is a flowchart which shows an example of operation | movement of an abrasive fluid supply apparatus. It is a flowchart which shows an example of operation | movement of the mixing ratio control apparatus which concerns on embodiment. It is a figure which shows the structure of the abrasive fluid supply apparatus which concerns on a 1st specific example. It is a time chart which shows operation | movement of the abrasive fluid supply apparatus which concerns on a 1st specific example. It is a figure which shows the structure of the abrasive fluid supply system which concerns on a 1st specific example. It is a time chart which shows operation | movement of the abrasive fluid supply system which concerns on a 1st specific example. It is a figure which shows the structure of the abrasive fluid supply system which concerns on a 2nd specific example. It is a time chart which shows operation | movement of the abrasive fluid supply system which concerns on a 2nd specific example. It is a figure which shows the structure of the abrasive fluid supply system which concerns on a 3rd specific example. It is a figure which shows the structure of the abrasive fluid supply system which concerns on a 4th specific example. It is a figure which shows the structure of the abrasive fluid supply apparatus which concerns on a 2nd specific example. It is a flowchart which shows operation | movement of the abrasive fluid supply apparatus which concerns on a 2nd specific example. It is a figure which shows the structure of the abrasive fluid supply system which concerns on a 5th example. It is a flowchart which shows operation | movement of the mixing ratio control apparatus which concerns on a 5th example. It is the schematic which shows the structure of the grinding | polishing system containing the abrasive fluid supply system which concerns on this Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic diagram illustrating an example of a configuration of an abrasive liquid supply system 100 including a mixing ratio control device 30 according to the present embodiment. The abrasive liquid supply system 100 mixes the abrasive liquid stock solution from the stock liquid tank T and the diluted liquid from the diluent supply source S to generate an abrasive liquid (also referred to as slurry), and supplies the abrasive liquid to the polishing apparatus 20. It is a supply system. In a specific aspect, the abrasive liquid supply system 100 is used in a manufacturing process of a semiconductor integrated circuit. The stock solution tank T is a container for storing a polishing solution stock solution (hereinafter simply referred to as “stock solution”) and is replaceable. The diluent is a liquid for diluting the stock solution, and is pure water, for example. The polishing apparatus 20 is an apparatus that polishes an object to be polished using the abrasive liquid supplied from the abrasive liquid supply system 100, and for example, polishes the surface of a semiconductor wafer. In FIG. 1, the abrasive liquid supply system 100 includes an abrasive liquid supply apparatus 10 and a mixing ratio control apparatus 30.
The abrasive liquid supply device 10 is an apparatus that mixes the stock solution from the stock solution tank T and the diluted solution from the diluent supply source S to generate an abrasive liquid, and supplies the abrasive liquid to the polishing apparatus 20. In FIG. 1, the abrasive liquid supply device 10 includes a mixing tank 11, a stock solution supply unit 12, a diluent supply unit 13, an abrasive liquid supply unit 14, and a control unit 15.

  The mixing tank 11 is a container for mixing the stock solution from the stock solution tank T and the diluent from the diluent supply source S to generate an abrasive solution. The mixing tank 11 may be provided with a liquid level sensor for detecting the level of the liquid level in the tank.

  The stock solution supply unit 12 supplies the stock solution from the stock solution tank T to the mixing tank 11. Specifically, the stock solution supply unit 12 includes a stock solution channel 12a that guides the stock solution from the stock solution tank T to the mixing tank 11, and an element for controlling the flow of the stock solution in the stock solution channel 12a. Elements for controlling the flow of the stock solution include, for example, an open / close valve that opens and closes the flow path, a flow rate control valve that controls the flow rate, a pump that sends liquid, and a flow meter that measures the flow rate.

  The diluent supply unit 13 includes a diluent channel 13a that guides the diluent from the diluent supply source S to the mixing tank 11, and supplies the diluent to the mixing tank 11 through the diluent channel 13a. Specifically, the diluent supply unit 13 includes an element for controlling the flow of the diluent in the diluent channel 13a. Elements for controlling the flow of the diluent include, for example, an open / close valve, a flow control valve, a pump, and a flow meter, as in the case of the stock solution supply unit 12.

  The abrasive liquid supply unit 14 supplies the polishing liquid generated in the mixing tank 11 to the polishing apparatus 20. Specifically, the abrasive liquid supply unit 14 includes an abrasive liquid flow path 14a that guides the abrasive liquid in the mixing tank 11 to the polishing apparatus 20, and elements for controlling the flow of the abrasive liquid in the abrasive liquid flow path 14a. Including. As elements for controlling the flow of the abrasive liquid, there are, for example, an open / close valve, a flow control valve, a pump, a flow meter, and the like, similar to the stock solution supply unit 12. In one embodiment, the abrasive liquid supply unit 14 includes a supply tank for temporarily storing the abrasive liquid from the mixing tank 11 and supplying the abrasive liquid to the polishing apparatus 20.

  The control unit 15 controls the operation of the abrasive liquid supply device 10. Specifically, the control unit 15 controls the stock solution supply unit 12 and the dilution solution supply unit 13 so that an abrasive solution in which the stock solution and the dilution solution are mixed in a predetermined ratio is generated in the mixing tank 11. Do. In other words, the control unit 15 supplies the stock solution supply unit 12 and the diluting solution so that the stock solution and the diluting solution are supplied to the mixing tank 11 at a predetermined ratio, and a polishing solution having a predetermined concentration is generated in the mixing tank 11. A polishing liquid generating process for controlling the unit 13 is performed. The “concentration” is the concentration of polishing components such as abrasive grains, and the same applies hereinafter.

  In one aspect, the control unit 15 is realized by cooperation of hardware resources and software. Specifically, the function of the control unit 15 is executed by a central processing unit (CPU) by reading a program recorded in a recording medium such as a ROM (Read Only Memory) into a main storage device. Is realized. However, the control unit 15 may be realized only by hardware.

  FIG. 2 is a flowchart showing an example of the operation of the abrasive liquid supply device 10. Hereinafter, with reference to FIG. 2, an example of the operation | movement regarding the production | generation of the abrasive fluid of the abrasive fluid supply apparatus 10 is demonstrated.

  The control unit 15 determines whether or not a condition for generating the abrasive liquid is satisfied (S11). As conditions for generating the abrasive liquid, for example, the level of the liquid level of the mixing tank 11 may be a predetermined value or less.

  The control unit 15 waits until it is determined that the above condition is satisfied (S11: NO). If it is determined that the above condition is satisfied (S11: YES), the control unit 15 executes an abrasive liquid generation process (S12). That is, the control unit 15 controls the stock solution supply unit 12 and the dilution solution supply unit 13 so that an abrasive solution in which the stock solution and the dilution solution are mixed in a predetermined ratio is generated in the mixing tank 11. As a result, a predetermined concentration of abrasive liquid is generated in the mixing tank 11.

  Next, the mixing ratio control device 30 will be described. In the present embodiment, there are at least two types of stock solution tanks as the stock solution tank T, and the mixing ratio control device 30 performs the abrasive fluid generation process of the abrasive fluid supply device 10 when a predetermined type of stock solution tank is used. Is performed, the stock solution and the diluted solution are mixed at a ratio different from the predetermined ratio. In FIG. 1, the mixing ratio control device 30 includes a discharge unit 31 and a discharge control unit 32.

  The discharge unit 31 discharges the diluent flowing through the diluent channel 13 a on the upstream side of the mixing tank 11. Specifically, the discharge unit 31 includes a discharge channel 31a that guides the diluent discharged from the diluent channel 13a, a flow rate that is discharged through the discharge channel 31a, and a flow rate that is supplied to the mixing tank 11. And an element for controlling the ratio. In the example of FIG. 1, the discharge unit 31 has a discharge flow rate control valve 31 b for controlling the flow rate discharged through the discharge flow path 31 a and a flow rate supplied to the mixing tank 11 as an element for controlling the ratio. Including a supply flow rate control valve 31c. Each of the discharge flow rate control valve 31b and the supply flow rate control valve 31c may be an open / close valve whose opening degree can be switched in two steps between an open state and a closed state, and the opening amount may be three or more steps or steplessly. It may be a flow rate control valve in which is controlled. Further, the functions of the discharge flow rate control valve 31b and the supply flow rate control valve 31c may be realized by a single physical valve such as a three-way valve or a flow rate adjustment valve. In addition, although the dilution liquid should just be discharged | emitted to a suitable discharge destination, in the example of FIG. 1, the waste liquid tank 35 is connected to the discharge flow path 31a as a discharge destination of a dilution liquid.

  In one embodiment, the abrasive liquid supply device 10 includes a flow rate detection unit 16 that detects the flow rate of the diluent in the diluent channel 13a, and the control unit 15 uses a flow rate when supplying the diluent to the mixing tank 11. When the flow of the diluent is not detected by the detection unit 16 or when the detection value of the flow rate detection unit 16 is equal to or less than a predetermined value, error processing is executed. For example, the control unit 15 generates an alarm or stops the abrasive liquid generation process. In such an aspect, the discharge unit 31 is configured to discharge the dilution solution downstream of the flow rate detection unit 16 from the viewpoint of avoiding a situation in which the flow rate of the dilution solution in the flow rate detection unit 16 becomes a predetermined value or less. Is done.

  When the control unit 15 performs control when a predetermined type of stock solution tank is used, the discharge control unit 32 is configured so that the stock solution and the diluted solution are mixed at a ratio different from the predetermined ratio. The discharge unit 31 is controlled. That is, when a predetermined type of stock solution tank is used, the discharge control unit 32 performs a polishing solution generation process by the polishing solution supply apparatus 10 so that the stock solution and the diluted solution have a ratio different from the predetermined ratio. A dilution liquid discharge process for controlling the discharge unit 31 is performed so as to be mixed.

  In the example of FIG. 1, the mixing ratio control device 30 includes an identification information acquisition unit 33 that acquires identification information for identifying the type of the stock solution tank T, and the discharge control unit 32 is acquired by the identification information acquisition unit 33. When the identified identification information indicates the predetermined type, the discharge unit 31 is controlled. In one aspect, the identification information acquisition unit 33 acquires identification information for identifying the type of the stock solution tank T from the stock solution tank T. For example, the identification information acquisition unit 33 is a reading device that reads identification information from a barcode or storage medium attached to the stock solution tank T. However, the identification information acquisition unit 33 may receive the identification information from the user by, for example, an identification code input operation or a switch on / off operation.

  The discharge controller 32 discharges all or part of the diluent that should be supplied to the mixing tank 11 under the control of the controller 15 so that the stock solution and the diluent are mixed at a ratio different from the predetermined ratio. The discharge unit 31 can be controlled by various methods. For example, the discharge control unit 32 may control the ratio between the time for which the diluent is supplied to the mixing tank 11 and the time for which the diluent is discharged, or discharges the flow rate of the diluent supplied to the mixing tank 11. The ratio with the flow rate of the diluent may be controlled.

  The “predetermined type stock solution tank” is a stock solution tank that contains a stock solution to be mixed with a diluent at a ratio different from a predetermined ratio. Specifically, a first type stock solution tank that contains a stock solution to be mixed with a diluent at a first ratio, and a stock solution to be mixed with a diluent at a second ratio different from the first ratio. When there is a second type of stock solution tank to be stored and the predetermined ratio of the abrasive fluid supply device 10 is set to the first ratio, the discharge control unit 32 uses the second type of stock solution tank. In this case, the discharge unit 31 is controlled so that the stock solution and the diluted solution are mixed at the second ratio.

  In one embodiment, as the stock solution tank T, a first type stock solution tank that contains a stock solution to be mixed with the diluent at the predetermined ratio, and a second type that contains a stock solution that does not need to be diluted with the diluent. There is a stock solution tank. Then, the discharge control unit 32 controls the discharge unit 31 so that the diluent is not supplied to the mixing tank 11 when the abrasive liquid generation process is performed when the second type stock solution tank is used. .

  In another aspect, as the stock solution tank T, a first type stock solution tank that contains a stock solution to be diluted m times (m> 1), and a stock solution to be diluted n times (1 <n <m) And a predetermined ratio in the abrasive liquid supply device 10 is set to 1: (m−1). And when the 2nd type stock solution tank is used, the discharge | emission control part 32 is a mixing tank with the dilution liquid of (n-1) / (m-1) among the dilution liquids supplied by the control part 15. 11, the discharge unit 31 is controlled so that the diluted solution of (mn) / (m−1) is discharged.

  In yet another aspect, the stock solution tank T includes a stock solution tank that contains unused stock solution, and a stock solution tank that contains reclaimed abrasive fluid regenerated from the abrasive fluid used in the polishing apparatus 20, and supplies abrasive fluid. The predetermined ratio in the apparatus 10 is set to a ratio corresponding to the unused stock solution. Then, when the stock solution tank for storing the regenerated abrasive liquid is used, the discharge control unit 32 is configured so that the regenerated abrasive liquid and the diluted liquid are mixed at a ratio corresponding to the regenerated abrasive liquid. Control. In this embodiment, when the concentration of the regenerated abrasive liquid is adjusted in advance to a concentration that does not require dilution (that is, the use concentration), the discharge control unit 32 performs mixing when the stock solution tank that stores the regenerated abrasive liquid is used. The discharge unit 31 is controlled so that the diluent is not supplied to the tank 11.

  The stock solution tank T is not limited to two types, and may be three or more types. That is, two or more types of stock solution tanks may exist as the “predetermined type stock solution tank”. In this case, the discharge control unit 32 identifies the type of the stock solution tank based on the identification information, and controls the discharge unit 31 to be mixed at a ratio according to the identified type.

  In one aspect, the discharge control unit 32 is realized by cooperation of hardware resources and software. Specifically, the function of the discharge control unit 32 is realized by reading a program recorded on a recording medium such as a ROM into the main storage device and executing it by the CPU. However, the discharge control unit 32 may be realized only by hardware.

  FIG. 3 is a flowchart showing an example of the operation of the mixing ratio control device 30 according to the present embodiment. Hereinafter, an example of the operation of the mixing ratio control device 30 will be described with reference to FIG.

  The discharge controller 32 acquires the identification information from the stock solution tank T via the identification information acquisition unit 33 (S21). For example, when detecting the replacement of the stock solution tank T, the discharge control unit 32 executes the acquisition of the identification information.

  Next, the discharge control unit 32 determines whether or not the stock solution tank T to be used is of a predetermined type based on the identification information (S22), and if it is determined that it is of a predetermined type (S22: YES) ), The process proceeds to step S23.

  In step S23, the discharge controller 32 determines whether or not the abrasive liquid generation process (step S12 in FIG. 2) of the abrasive liquid supply device 10 has been started, and waits until the abrasive liquid generation process is started (S23). : NO).

  When it is determined that the abrasive liquid generation process has been started (S23: YES), the discharge control unit 32 executes the diluent discharge process (S24). Thereby, when a predetermined type of stock solution tank is used, an abrasive solution in which the stock solution and the diluted solution are mixed at a ratio different from the predetermined ratio in the abrasive solution supply device 10 is generated in the mixing tank 11. The

  On the other hand, if it is determined in step S22 that the type is not the predetermined type (S22: NO), the discharge controller 32 ends the process without performing the diluent discharge process. Accordingly, when a stock solution tank other than a predetermined type is used, a polishing solution in which the stock solution and the diluted solution are mixed at a predetermined ratio in the polishing solution supply device 10 is generated in the mixing tank 11.

  Hereinafter, with reference to FIGS. 4-15, the more specific structural example is shown about the abrasive-fluid supply system 100. FIG.

[First Specific Example of Abrasive Liquid Supply Device]
FIG. 4 is a diagram showing a configuration of the abrasive liquid supply device 10 according to the first specific example. Hereinafter, the configuration of the abrasive fluid supply apparatus 10 according to the first specific example will be described with reference to FIG. 4.

  In FIG. 4, the abrasive liquid supply apparatus 10 temporarily stores the measuring tank 51 for measuring the amount of the stock solution, the adjustment tank 52 as the mixing tank 11, and the abrasive liquid from the adjustment tank 52 and supplies it to the polishing apparatus 20. Supply tank 53.

  In the upper part of the measuring tank 51, a raw liquid pipe La that guides the stock solution from the stock solution tank T to the measuring tank 51 and an ultrapure water that guides ultrapure water from the ultrapure water line W that is the diluent supply source S to the measuring tank 51 The water pipe Lb is connected. The stock solution pipe La is provided with a valve Va, a valve Vb, and a pump Pa in order from the stock solution tank T side. The ultrapure water pipe Lb is provided with a flow meter FM and a valve Vd in order from the ultrapure water line W side. The lower part of the measuring tank 51 is connected to the upper part of the adjustment tank 52 through a common pipe Lc. A valve Vc is provided in the common pipe Lc.

  The adjustment tank 52 is provided with a liquid level sensor LS that detects the level of the adjustment tank 52. The liquid level sensor LS outputs a low level signal when the level of the liquid level reaches a predetermined low level indicated by “L” in FIG. 4, and a predetermined high level indicated by “H” in FIG. When this happens, a high level signal is output.

  The lower part of the adjustment tank 52 is connected to the upper part of the supply tank 53 via the abrasive liquid pipe Ld. The abrasive fluid pipe Ld is provided with a pump Pb and a valve Vs in order from the adjustment tank 52 side.

  A lower portion of the supply tank 53 is connected to the polishing apparatus 20 via a supply pipe Ls, and a pump Ps is provided in the supply pipe Ls. In the example of FIG. 4, the supply pipe Ls includes a plurality of parallel pipes connected to the supply tank 53, and the plurality of pipes are connected to the corresponding polishing apparatuses 20. A pump Ps is provided for each of the plurality of pipes.

  Further, the abrasive liquid supply device 10 includes a main controller 54 that controls the operation of the abrasive liquid supply device 10. Specifically, the main controller 54 is connected to the measuring tank 51, the flow meter FM, and the liquid level sensor LS, and receives these outputs. The main controller 54 is connected to the valves Va, Vb, Vc, Vd and the pumps Pa, Pb, Ps, and controls the operation of the valves and pumps based on the outputs of various sensors.

  FIG. 5 is a time chart showing the operation of the abrasive fluid supply apparatus 10 according to the first specific example. Hereinafter, with reference to FIG. 5, operation | movement of the abrasive-fluid supply apparatus 10 which concerns on a 1st specific example is demonstrated.

  When the liquid level of the adjustment tank 52 becomes a low level, the supply operation of the stock solution is started. That is, when receiving the low level signal from the liquid level sensor LS of the adjustment tank 52, the main controller 54 outputs an opening operation signal to the valves Va and Vb. Thereby, the valves Va and Vb are opened, and the stock solution is supplied from the stock solution tank T to the measuring tank 51 by the pump Pa. Next, when the main controller 54 detects that a predetermined amount of stock solution has accumulated in the measuring tank 51, it outputs a closing operation signal to the valves Va and Vb, and then outputs an opening operation signal to the valve Vc. Thereby, after the valves Va and Vb are closed, the valve Vc is opened, and the stock solution is sent from the measuring tank 51 to the adjustment tank 52. When the liquid supply is completed, the main controller 54 outputs a closing operation signal to the valve Vc, thereby closing the valve Vc.

  Subsequently, the operation of supplying ultrapure water is started. That is, main controller 54 outputs an opening operation signal to valves Vc and Vd at time t1. Thereby, the valves Vc and Vd are opened, and the ultrapure water from the ultrapure water line W is supplied to the adjustment tank 52. When the main controller 54 detects that the same amount of ultrapure water as the stock solution is supplied based on the output of the flow meter FM, the main controller 54 outputs a closing operation signal to the valves Vc and Vd. Thereby, the valves Vc and Vd are closed.

  Here, in the case of M-fold dilution (M is an integer of 2 or more), the main controller 54 repeats the operation of supplying the ultra pure water (M−1) times.

  The main controller 54 repeats the stock solution supply operation and the ultrapure water supply operation for a preset number of times Y (Y is an integer equal to or greater than 1). As a result, a polishing solution in which the stock solution is diluted M times with ultrapure water is generated in the adjustment tank 52 by an amount corresponding to the Y times.

  In this specific example, the stock solution supply unit 12 is realized by a stock solution pipe La, a common pipe Lc, valves Va, Vb, Vc, a pump Pa, and a measuring tank 51. The diluent supply unit 13 is realized by an ultrapure water pipe Lb, a common pipe Lc, valves Vc and Vd, a measuring tank 51, and a flow meter FM. The abrasive liquid supply unit 14 is realized by the abrasive liquid pipe Ld, the supply pipe Ls, the valve Vs, the pumps Pb and Ps, and the supply tank 53. The control unit 15 is realized by the main control device 54.

[First Specific Example of Abrasive Supply System]
FIG. 6 is a diagram showing a configuration of the abrasive liquid supply system 100 according to the first specific example. Hereinafter, the configuration of the abrasive liquid supply system 100 according to the first specific example will be described with reference to FIG. 6.

  In this example, as the stock solution tank T, there are a stock solution tank that stores a stock solution of M-fold concentration (M is an integer of 2 or more) and a stock solution tank that stores a stock solution of N-fold concentration (1 ≦ N <M). . The N-fold concentrated stock solution is already adjusted to the use concentration, and does not require dilution. A bar code B for identifying the type of the stock solution tank is attached to both types of stock solution tanks.

  In the abrasive liquid supply system 100 of FIG. 6, a mixing ratio control device 30 is applied to the abrasive liquid supply apparatus 10 of FIG. 4. Specifically, a waste liquid pipe Le provided with a valve Ve and a sub-control device 61 are added.

  The waste liquid pipe Le is a pipe for discharging ultrapure water, one end of which is connected to the common pipe Lc between the measuring tank 51 and the valve Vc, and the other end is a discharge destination (in FIG. 6, a waste liquid tank). Te). A valve Ve is provided in the waste liquid pipe Le.

  The sub-control device 61 is connected to the valves Vc and Ve and controls them. The sub-control device 61 is configured to be able to receive an opening / closing operation signal for the valve Vd from the main control device 54. Further, the sub control device 61 is connected to the main control device 54 so that a signal can be output to the main control device 54. Further, the sub-control device 61 is connected to the liquid level sensor LS so that the detection signal of the liquid level sensor LS can be received. The sub-control device 61 is configured to be able to read the barcode B of the stock solution tank T.

  The operation of the abrasive liquid supply system 100 according to the first specific example will be described below. Here, the dilution factor of the abrasive fluid supply device 10 is set to M. That is, the predetermined ratio in the abrasive liquid supply device 10 is set to 1: (M−1).

  When the sub-control device 61 reads the barcode B of the stock solution tank T and recognizes the stock solution tank containing the stock solution concentrated M times, the sub-control device 61 does not perform ultrapure water discharge processing. Therefore, the abrasive fluid supply system 100 performs the operation shown in FIG. That is, when the liquid level becomes low, the stock solution is diluted M times to generate a polishing liquid.

  On the other hand, when recognizing the stock solution tank that stores the N-fold concentrated stock solution, the sub-control device 61 performs a process of discharging ultrapure water. Hereinafter, the operation of the abrasive liquid supply system 100 in this case will be described with reference to FIG.

  When the main controller 54 receives the low level signal from the liquid level sensor LS of the adjustment tank 52, the main controller 54 performs the supply operation of the stock solution as in the case of FIG. As a result, a predetermined amount of stock solution is supplied to the adjustment tank 52.

  After the supply operation of the stock solution is completed, the main controller 54 starts the operation of supplying ultrapure water. That is, main controller 54 outputs an opening operation signal to valves Vc and Vd at time t1. The opening operation signal for the valve Vd is also supplied to the sub-control device 61. Upon receiving the signal, the sub-control device 61 outputs a closing operation signal to the valve Vc and outputs an opening operation signal to the valve Ve. As a result, the valve Vc is closed, the valve Ve is opened, and ultrapure water from the ultrapure water line W flows into the waste liquid pipe Le and is discharged to the waste liquid tank Te.

  When the main controller 54 detects that the same amount of ultrapure water as the stock solution is supplied based on the output of the flow meter FM, the main controller 54 outputs a closing operation signal to the valves Vc and Vd. The closing operation signal for the valve Vd is also supplied to the sub-control device 61. When receiving the signal, the sub-control device 61 outputs a closing operation signal to the valve Ve after a predetermined delay time t. Thereby, after the valve Vd is closed, the valve Ve is closed after a predetermined delay time t. The delay time t is set so that no ultrapure water remains between the valve Vd and the valve Ve.

  The main controller 54 repeats the operation of supplying the ultrapure water (M-1) times. During this time, the ultrapure water is discharged to the waste liquid tank Te and not supplied to the adjustment tank 52 under the control of the sub-control device 61.

  The main controller 54 repeats the stock solution supply operation and the ultrapure water supply operation for a preset number of times Y (Y is an integer equal to or greater than 1). As a result, the N-fold concentrated stock solution from the stock solution tank T is not diluted with ultrapure water, but is supplied as an abrasive solution into the adjustment tank 52 in an amount corresponding to the Y times.

  After the undiluted solution supply operation and the ultrapure water supply operation are repeated Y times, the sub-control device 61 determines whether or not a predetermined end condition is satisfied. Here, the sub-control device 61 has received a high level signal from the liquid level sensor LS, and the number of times of repeating the supply operation of the stock solution and ultrapure water Y times is set to a preset number of times X (X is 1). It is determined whether at least one of the above-mentioned integers has been satisfied.

  When it is determined that the end condition is satisfied, the sub control device 61 ends the process.

  On the other hand, when it is determined that the termination condition is not satisfied, the sub control device 61 outputs a pseudo signal of the low level signal of the liquid level sensor LS to the main control device 54. As a result, the main controller 54 executes again the process of repeating the supply operation of the stock solution and the ultrapure water Y times. Therefore, the operation shown in FIG. 7 is repeatedly performed until the end condition is satisfied.

  In this specific example, the discharge unit 31 is realized by the waste liquid pipe Le and the valves Vc and Ve, and the discharge control unit 32 is realized by the sub-control device 61.

[Second Specific Example of Abrasive Liquid Supply System]
FIG. 8 is a diagram illustrating a configuration of an abrasive liquid supply system 100 according to a second specific example. The abrasive liquid supply system 100 is almost the same as the abrasive liquid supply system 100 according to the first specific example shown in FIG. 6, and the same reference numerals are used for the parts common to the first specific example, and the description will be made. Will be omitted.

  In this example, as the stock solution tank T, there are a stock solution tank that contains a stock solution that is M times concentrated, and a stock solution tank that contains a stock solution that is N times concentrated. In addition, although M and N are 1 or more and 5 or less, for example, it is not restricted to this.

  In this example, as shown in FIG. 8, the sub control device 61 is connected to the flow meter FM so that the detection signal of the flow meter FM can be received.

  Hereinafter, the operation of the abrasive liquid supply system 100 according to this example will be described. Here, the dilution rate of the abrasive liquid supply device 10 is set to Z (Z is an integer of 2 or more). That is, the predetermined ratio in the abrasive liquid supply device 10 is set to 1: (Z-1).

  When the sub-control device 61 reads the barcode B of the stock solution tank T and recognizes the stock solution tank containing the stock solution concentrated M times, the sub-control device 61 does not perform ultrapure water discharge processing. Therefore, the abrasive fluid supply system 100 performs the operation shown in FIG. That is, when the liquid level becomes low, a process for diluting the stock solution to generate an abrasive solution is performed. However, since the dilution factor is set to Z instead of M here, the supply operation of ultrapure water was repeated (Z-1) times instead of (M-1) times, and the stock solution was diluted Z times. Abrasive fluid is generated.

  On the other hand, when recognizing the stock solution tank that stores the N-fold concentrated stock solution, the sub-control device 61 performs a process of discharging ultrapure water. Hereinafter, the operation of the abrasive liquid supply system 100 in this case will be described with reference to FIG.

  When the main controller 54 receives the low level signal from the liquid level sensor LS of the adjustment tank 52, the main controller 54 performs the supply operation of the stock solution as in the case of FIG. As a result, a predetermined amount of stock solution is supplied to the adjustment tank 52.

  After the supply operation of the stock solution is completed, the main controller 54 starts the operation of supplying ultrapure water. That is, main controller 54 outputs an opening operation signal to valves Vc and Vd at time t1. Thereby, the valves Vc and Vd are opened, and the supply of the ultrapure water from the ultrapure water line W to the adjustment tank 52 is started.

  The opening operation signal for the valve Vd is also supplied to the sub-control device 61. When the sub-control device 61 receives the signal, the sub-control device 61 starts integrating the flow rate of ultrapure water detected by the flow meter FM. Then, the sub-control device 61 closes the valve Vc at time t2 when the integrated value of the flow rate reaches a value corresponding to (N · Z / M−1) / (Z−1) times the supply amount of the stock solution. An operation signal is output and an opening operation signal is output to the valve Ve. As a result, the valve Vc is closed and the valve Ve is opened, so that the ultrapure water from the ultrapure water line W flows into the waste liquid pipe Le and is discharged to the waste liquid tank Te.

  When the main controller 54 detects that the same amount of ultrapure water as the stock solution is supplied based on the output of the flow meter FM, the main controller 54 outputs a closing operation signal to the valves Vc and Vd. The closing operation signal for the valve Vd is also supplied to the sub-control device 61. When receiving the signal, the sub-control device 61 outputs a closing operation signal to the valve Ve after a predetermined delay time t. Thereby, after the valve Vd is closed, the valve Ve is closed after a predetermined delay time t. The delay time t is set so that no ultrapure water remains between the valve Vd and the valve Ve.

  The main control device 54 repeats the operation of supplying the ultrapure water (Z-1) times. As a result, the adjustment tank 52 is supplied with ultrapure water (N · Z / M−1) times that of the stock solution.

  The main controller 54 repeats the stock solution supply operation and the ultrapure water supply operation for a preset number of times Y (Y is an integer equal to or greater than 1). As a result, a polishing solution in which the stock solution is diluted N · Z / M times with ultrapure water is generated in the adjustment tank 52 by an amount corresponding to the Y times.

  After the undiluted solution supply operation and the ultrapure water supply operation are repeated Y times, the sub-control device 61 determines whether or not a predetermined end condition is satisfied. Here, the sub-control device 61 has received a high level signal from the liquid level sensor LS, and the number of times of repeating the supply operation of the stock solution and ultrapure water Y times is set to a preset number of times X (X is 1). It is determined whether at least one of the above-mentioned integers has been satisfied.

  When it is determined that the end condition is satisfied, the sub control device 61 ends the process.

  On the other hand, when it is determined that the termination condition is not satisfied, the sub control device 61 outputs a pseudo signal of the low level signal of the liquid level sensor LS to the main control device 54. As a result, the main controller 54 executes again the process of repeating the supply operation of the stock solution and the ultrapure water Y times. Therefore, the operation shown in FIG. 9 is repeated until the above end condition is satisfied.

  In this specific example, the discharge unit 31 is realized by the waste liquid pipe Le and the valves Vc and Ve, and the discharge control unit 32 is realized by the sub-control device 61.

[Third Specific Example of Abrasive Supply System]
FIG. 10 is a diagram illustrating a configuration of an abrasive liquid supply system 100 according to a third specific example. The abrasive liquid supply system 100 is almost the same as the abrasive liquid supply system 100 according to the first specific example shown in FIG. 6, and the same reference numerals are used for the parts common to the first specific example, and the description will be made. Will be omitted.

  In this example, as shown in FIG. 10, the valve Ve in FIG. 6 is eliminated, and the valve Vd provided in the ultrapure water pipe Lb is a three-way valve. The waste liquid pipe Le is not connected between the measuring tank 51 and the valve Vc but connected to the valve Vd.

  The valve Vd causes the ultrapure water from the ultrapure water line W to flow to the adjustment tank 52 side (the adjustment tank side open state) and causes the ultrapure water from the ultrapure water line W to flow to the waste liquid pipe Le side. It is configured to be switchable between a state (open state on the waste liquid piping side) and a state (closed state) that prevents the flow of ultrapure water from the ultrapure water line W.

  In this example, when a stock solution tank that contains N-fold concentrated stock solution is used, the abrasive solution supply system 100 operates as follows with respect to the supply of the stock solution and ultrapure water.

  When the main controller 54 receives the low level signal from the liquid level sensor LS of the adjustment tank 52, the main controller 54 performs the supply operation of the stock solution as in the case of FIG. As a result, a predetermined amount of stock solution is supplied to the adjustment tank 52.

  After the supply operation of the stock solution is completed, the main controller 54 starts the operation of supplying ultrapure water. That is, main controller 54 outputs an opening operation signal to valves Vc and Vd. The opening operation signal for the valve Vd is also supplied to the sub-control device 61. When the sub-control device 61 receives the signal, the sub-control device 61 outputs a waste pipe side opening operation signal to the valve Vd. As a result, the valve Vd is opened to the waste liquid pipe side, and the ultra pure water from the ultra pure water line W flows into the waste liquid pipe Le and is discharged to the waste liquid tank Te. In this case, the sub-control device 61 may or may not output a closing operation signal to the valve Vc.

  When the main controller 54 detects that the same amount of ultrapure water as the stock solution is supplied based on the output of the flow meter FM, the main controller 54 outputs a closing operation signal to the valves Vc and Vd. As a result, the valves Vc and Vd are closed.

  The main controller 54 repeats the operation of supplying the ultrapure water (M-1) times. During this time, the ultrapure water is discharged to the waste liquid tank Te and not supplied to the adjustment tank 52 under the control of the sub-control device 61.

  In this specific example, the discharge unit 31 is realized by the waste liquid pipe Le and the valve Vd, and the discharge control unit 32 is realized by the sub-control device 61.

[Fourth Specific Example of Abrasive Liquid Supply System]
FIG. 11 is a diagram illustrating a configuration of an abrasive liquid supply system 100 according to a fourth specific example. This abrasive liquid supply system 100 is almost the same as the abrasive liquid supply system 100 according to the second specific example shown in FIG. 8, and the same reference numerals are used for the parts common to the second specific example, and the description is made. Will be omitted.

  In this example, as shown in FIG. 11, the valve Ve in FIG. 8 is eliminated, and the valve Vd provided in the ultrapure water pipe Lb is a three-way valve. The waste liquid pipe Le is not connected between the measuring tank 51 and the valve Vc but connected to the valve Vd.

  The valve Vd causes the ultrapure water from the ultrapure water line W to flow to the adjustment tank 52 side (the adjustment tank side open state) and causes the ultrapure water from the ultrapure water line W to flow to the waste liquid pipe Le side. It is configured to be switchable between a state (open state on the waste liquid piping side) and a state (closed state) that prevents the flow of ultrapure water from the ultrapure water line W.

  In this example, when a stock solution tank that contains N-fold concentrated stock solution is used, the abrasive solution supply system 100 operates as follows with respect to the supply of the stock solution and ultrapure water.

  When the main controller 54 receives the low level signal from the liquid level sensor LS of the adjustment tank 52, the main controller 54 performs the supply operation of the stock solution as in the case of FIG. As a result, a predetermined amount of stock solution is supplied to the adjustment tank 52.

  After the supply operation of the stock solution is completed, the main controller 54 starts the operation of supplying ultrapure water. That is, main controller 54 outputs an opening operation signal to valves Vc and Vd. As a result, the valve Vc is opened and the valve Vd is opened on the adjustment tank side, and supply of ultrapure water from the ultrapure water line W to the adjustment tank 52 is started.

  The opening operation signal for the valve Vd is also supplied to the sub-control device 61. When the sub-control device 61 receives the signal, the sub-control device 61 starts integrating the flow rate of ultrapure water detected by the flow meter FM. Then, the sub-control device 61, when the integrated value of the flow rate reaches a value corresponding to (N · Z / M−1) / (Z−1) times the supply amount of the stock solution, Outputs waste pipe side open operation signal. As a result, the valve Vd is opened to the waste liquid pipe side, and the ultra pure water from the ultra pure water line W flows into the waste liquid pipe Le and is discharged to the waste liquid tank Te. In this case, the sub-control device 61 may or may not output a closing operation signal to the valve Vc.

  When the main controller 54 detects that the same amount of ultrapure water as the stock solution is supplied based on the output of the flow meter FM, the main controller 54 outputs a closing operation signal to the valves Vc and Vd. As a result, the valves Vc and Vd are closed.

  The main control device 54 repeats the operation of supplying the ultrapure water (Z-1) times. As a result, the adjustment tank 52 is supplied with ultrapure water (N · Z / M−1) times that of the stock solution.

  In this specific example, the discharge unit 31 is realized by the waste liquid pipe Le and the valve Vd, and the discharge control unit 32 is realized by the sub-control device 61.

[Second Specific Example of Abrasive Liquid Supply Device]
FIG. 12 is a diagram illustrating a configuration of the abrasive liquid supply device 10 according to the second specific example. The abrasive liquid supply apparatus 10 is almost the same as the abrasive liquid supply apparatus 10 according to the first specific example shown in FIG. 4, and the same reference numerals are used for the parts common to the first specific example, and the description is made. Will be omitted.

  In FIG. 12, the stock solution pipe La is provided with a stock solution flow meter FM2 between the valve Vb and the pump Pa. Moreover, the measuring tank 51 shown in FIG. 4 is abolished. In this example, the flow meter of the ultrapure water pipe Lb is referred to as “ultrapure water flow meter FM1”.

  FIG. 13 is a flowchart showing the operation of the abrasive fluid supply apparatus 10 according to the second specific example. Hereinafter, with reference to FIG. 13, the operation of the abrasive fluid supply apparatus 10 according to the second specific example will be described. Here, the dilution factor M (M> 2) is set, and the flow rates of the stock solution and the ultrapure water are set to the same flow rate.

  When the liquid level of the adjustment tank 52 becomes a low level, the supply operation of the stock solution is started. That is, when the main controller 54 detects that the liquid level is low based on the output of the liquid level sensor LS of the adjustment tank 52 (S31: YES), the main controller 54 opens the valves Va, Vb, Vc, Vd. A signal is output (S32). As a result, the valves Va, Vb, Vc, and Vd are opened, and the stock solution from the stock solution tank T and the ultrapure water from the ultrapure water line W are supplied to the adjustment tank 52.

  The main controller 54 waits until a preset time T elapses from the start of supply (S33: NO). When time T elapses from the start of supply (S33: YES), the main controller 54 sends a closing operation signal to the valves Va and Vb. Output (S34). Thereby, the valves Va and Vb are closed, and the supply of the stock solution is stopped.

  Main controller 54 waits until time T · (M−1) has elapsed from the start of supply (S35: NO), and when time T · (M−1) has elapsed from the start of supply (S35: YES), it is predetermined. It is determined whether or not the end condition is satisfied (S36). Here, the main controller 54 satisfies at least one of the fact that the high level is detected by the liquid level sensor LS and that the number of operations of supplying the stock solution and the ultrapure water has reached a preset number. It is judged whether it was done.

  When it is determined that the end condition is satisfied (S36: YES), the main control device 54 outputs a closing operation signal to the valves Vc and Vd (S37), and ends the process. As a result, the valves Vc and Vd are closed, and the polishing liquid generating process is completed.

  On the other hand, if it is determined that the termination condition is not satisfied (S36: NO), the main controller 54 outputs an opening operation signal to the valves Va and Vb (S38), and the process returns to step S33. Thereby, the valves Va and Vb are opened, and the supply of the stock solution from the stock solution tank T is started again. In the second and subsequent steps S33 and S35, the elapsed time from the start of supply of the stock solution in step S38 is to be determined.

  In the above operation example, the main controller 54 opens and closes the valve based on the elapsed time. However, even if the valve is opened and closed based on the supply amount using the flow rates of the flow meters FM1 and FM2. Good. Specifically, in step S33, it is determined whether or not the integrated value of the flow rate of the stock solution flow meter FM2 (stock solution supply amount) has reached a preset value A, and in step S35, for ultrapure water. It may be determined whether or not the integrated value of the flow rate of the flow meter FM1 (supply amount of ultrapure water) has reached A · (M−1). In this case, the flow rate of the stock solution and the flow rate of the diluent may be different from each other.

  In this specific example, the stock solution supply unit 12 is realized by a stock solution pipe La, a common pipe Lc, valves Va, Vb, and Vc, a pump Pa, and a stock solution flow meter FM2. The diluent supply unit 13 is realized by an ultrapure water pipe Lb, a common pipe Lc, valves Vc and Vd, and an ultrapure water flow meter FM1. The abrasive liquid supply unit 14 is realized by the abrasive liquid pipe Ld, the supply pipe Ls, the valve Vs, the pumps Pb and Ps, and the supply tank 53. The control unit 15 is realized by the main control device 54.

[Fifth Specific Example of Abrasive Liquid Supply System]
FIG. 14 is a diagram illustrating a configuration of an abrasive liquid supply system 100 according to a fifth specific example. Hereinafter, the configuration of the abrasive liquid supply system 100 according to the fifth specific example will be described with reference to FIG.

  In this example, as the stock solution tank T, there are a stock solution tank that stores a stock solution of M-fold concentration (M> 2) and a stock solution tank that stores a stock solution of N-fold concentration (1 ≦ N <M). A bar code B for identifying the type of the stock solution tank is attached to both types of stock solution tanks.

  In the abrasive liquid supply system 100 of FIG. 14, a mixing ratio control device 30 is applied to the abrasive liquid supply apparatus 10 according to the second specific example of FIG. 12. Specifically, in FIG. 14, the valve Vd is a three-way valve, and a waste liquid pipe Le is connected to the valve Vd. Further, the sub control device 61 is added.

  The valve Vd causes the ultrapure water from the ultrapure water line W to flow to the adjustment tank 52 side (the adjustment tank side open state) and causes the ultrapure water from the ultrapure water line W to flow to the waste liquid pipe Le side. It is configured to be switchable between a state (open state on the waste liquid piping side) and a state (closed state) that prevents the flow of ultrapure water from the ultrapure water line W.

  The sub-control device 61 is connected to the valve Vd and controls the valve Vd. The sub-control device 61 is configured to be able to receive an opening / closing operation signal for the valves Va and Vd from the main control device 54. The sub-control device 61 is configured to be able to read the barcode B of the stock solution tank T.

  Hereinafter, the operation of the abrasive liquid supply system 100 according to this example will be described. Here, the dilution factor of the abrasive fluid supply device 10 is set to M (M> 2). That is, the predetermined ratio in the abrasive liquid supply device 10 is set to 1: (M−1).

  When the sub-control device 61 reads the barcode B of the stock solution tank T and recognizes the stock solution tank containing the stock solution concentrated M times, the sub-control device 61 does not perform ultrapure water discharge processing. Therefore, the abrasive fluid supply system 100 performs the operation shown in FIG. That is, when the liquid level becomes low, the stock solution is diluted M times to generate a polishing liquid.

  On the other hand, when recognizing the stock solution tank that stores the N-fold concentrated stock solution, the sub-control device 61 performs a process of discharging ultrapure water. Hereinafter, the operation of the abrasive fluid supply system 100 in this case will be described with reference to FIGS. FIG. 13 shows the operation of the main control device 54, and FIG. 15 shows the operation of the sub control device 61.

  When the liquid level of the adjustment tank 52 becomes a low level, the supply operation of the stock solution is started. That is, when the main controller 54 detects that the liquid level is low based on the output of the liquid level sensor LS of the adjustment tank 52 (S31 in FIG. 13), the main controller 54 opens the valves Va, Vb, Vc, and Vd. An operation signal is output (S32 in FIG. 13). As a result, the valves Va, Vb, Vc, and Vd are opened, and the stock solution from the stock solution tank T and the ultrapure water from the ultrapure water line W are supplied to the adjustment tank 52.

  The main controller 54 waits until a preset time T elapses from the start of supply (S33: NO in FIG. 13), and when time T elapses from the start of supply (S33: YES in FIG. 13), the valves Va, A closing operation signal is output to Vb (S34 in FIG. 13). Thereby, the valves Va and Vb are closed, and the supply of the stock solution is stopped.

  When receiving the opening operation signal to the valve Va (S41: YES in FIG. 15), the sub-control device 61 waits until the time T · (N−1) has elapsed from that time (S42: NO in FIG. 15). When the time T · (N−1) has elapsed (S42 in FIG. 15: YES), a waste pipe side opening operation signal is output to the valve Vd (S43 in FIG. 15). As a result, the valve Vd is opened to the waste liquid pipe side, and the ultra pure water from the ultra pure water line W flows into the waste liquid pipe Le and is discharged to the waste liquid tank Te.

  Main controller 54 waits until time T · (M−1) has elapsed from the start of supply (S35: NO in FIG. 13), and when time T · (M−1) has elapsed from the start of supply (in FIG. 13). S35: YES), it is determined whether or not a predetermined end condition is satisfied (S36 in FIG. 13).

  When it is determined that the termination condition is satisfied (S36 in FIG. 13: YES), the main controller 54 outputs a closing operation signal to the valves Vc and Vd (S37 in FIG. 13), and ends the process. As a result, the valves Vc and Vd are closed, and the polishing liquid generating process is completed. When the sub control device 61 receives the closing operation signal to the valve Vd (S44 of FIG. 15: YES), the sub control device 61 ends the processing.

  On the other hand, when it is determined that the termination condition is not satisfied (S36 of FIG. 13: NO), the main controller 54 outputs an opening operation signal to the valves Va and Vb (S38 of FIG. 13), and the process is illustrated. Return to step S33 of step 13. Thereby, the valves Va and Vb are opened, and the supply of the stock solution from the stock solution tank T is started again. When receiving the opening operation signal to the valve Va (S45 in FIG. 15: YES), the sub-control device 61 outputs the adjustment tank side opening operation signal to the valve Vd (S46 in FIG. 15), and the processing is performed in FIG. Return to step S42. As a result, the valve Vd is opened on the adjustment tank side, and the supply of ultrapure water to the adjustment tank 52 is resumed. In the second and subsequent steps S42, the elapsed time from the time when the opening operation signal to the valve Va is received in step S45 is determined.

  The sub-control device 61 waits until it receives a closing operation signal to the valve Vd or an opening operation signal to the valve Va (S44: NO, S45: NO in FIG. 15).

  In the above operation example, the sub control device 61 opens and closes the valve based on the elapsed time. However, even if the flow rate of the flow meters FM1 and FM2 is used to open and close the valve based on the supply amount. Good. Specifically, the sub-control device 61 obtains the supply amount A of the stock solution by integrating the flow rate of the stock solution flow meter FM2, and in step S42, the integrated value of the flow rate of the ultra pure water flow meter FM1 (ultra pure water) It may be determined whether or not the supply amount of A) has reached A · (N−1).

  In this specific example, the discharge unit 31 is realized by the waste liquid pipe Le and the valve Vd, and the discharge control unit 32 is realized by the sub-control device 61.

  In the first to fifth specific examples of the above-described abrasive liquid supply system, the case where there are two types of stock solution tanks has been illustrated. However, for example, by adding identification information such as a barcode to various stock solution tanks, Applicable to the above stock solution tanks.

[Polishing system]
FIG. 16 is a schematic diagram showing a configuration of a polishing system 200 including an abrasive liquid supply system according to the present embodiment. Hereinafter, the polishing system 200 will be described with reference to FIG.

  The polishing system 200 includes an abrasive liquid supply system 100, a polishing apparatus 20, and a regeneration apparatus 40.

  When the stock solution tank TN containing unused stock solution is used, the abrasive solution supply system 100 converts the stock solution and dilution solution from the stock solution tank TN into the stock solution under the control of the control unit 15 of the abrasive solution supply apparatus 10. The mixture is mixed at a predetermined ratio and the generated abrasive liquid is supplied to the polishing apparatus 20.

  The polishing apparatus 20 performs a polishing process on an object to be polished (for example, a wafer) using the abrasive liquid supplied from the abrasive liquid supply system 100.

  The regeneration device 40 collects the abrasive liquid used in the polishing apparatus 20 and performs a regeneration process on the used abrasive liquid to generate a regenerated abrasive liquid. Examples of the regeneration process include a foreign substance removal process from a used abrasive liquid, a PH value adjustment process, and a density adjustment process.

  The regenerated abrasive liquid generated by the regenerator 40 is filled into the regenerated abrasive liquid stock tank TR by the regenerator 40 or by other methods.

  When the stock solution tank TR that stores the regenerated abrasive liquid is used, the abrasive liquid supply system 100 is controlled by the control unit 15 of the abrasive liquid supply apparatus 10 and the discharge control unit 32 of the mixing ratio control apparatus 30 to regenerate the abrasive liquid. The regenerated abrasive liquid and dilution liquid from TR are mixed at a ratio different from the predetermined ratio according to the regenerated abrasive liquid, and the generated abrasive liquid is supplied to the polishing apparatus 20.

  In one embodiment, the regeneration device 40 adjusts the concentration of the regenerated abrasive liquid to a predetermined use concentration, and generates a regenerated abrasive liquid that does not require dilution. Then, when the stock solution tank TR that stores the regenerated abrasive liquid is used, the abrasive liquid supply system 100 dilutes the regenerated abrasive liquid by discharging the diluted liquid supplied by the control unit 15 by the discharge control unit 32. Without being supplied to the polishing apparatus 20.

  In the above-described polishing system 200, in one usage mode, when the stock solution tank TR for storing the regenerated abrasive liquid is ready, when the stock solution tank in use is empty, the regenerated abrasive solution stock tank TR is preferentially used. Is done.

  According to the present embodiment described above, the following effects can be obtained.

  (1) The abrasive liquid supply device performs control so that the abrasive liquid in which the raw liquid and the diluted liquid from the raw liquid tank are mixed at a predetermined ratio is generated in the mixing tank. The mixing ratio control device is configured such that when a predetermined type of stock solution tank is used, when the above control is performed, the stock solution and the diluted solution are mixed at a ratio different from the predetermined ratio in the abrasive liquid supply device. Drain the diluent. Accordingly, when a stock solution tank other than a predetermined type is used, an abrasive liquid mixed at a predetermined ratio is generated, and when a predetermined type stock solution tank is used, it differs from the above-mentioned predetermined ratio. Abrasive liquid mixed at a ratio is generated. Therefore, according to the present embodiment, stock solutions having different mixing ratios with the dilution liquid (for example, stock solutions having different concentrations from each other) are accommodated without requiring an operation for changing the set value of the mixing ratio in the abrasive liquid supply device. It becomes possible to use two types of undiluted liquid tanks with the abrasive liquid supply device.

  (2) In one aspect, the mixing ratio control device acquires identification information for identifying the type of the stock solution tank from the stock solution tank, and discharges the diluent when the identification information indicates a predetermined type. Take control. According to this aspect, the user does not need to specify identification information, and the user's work man-hours or work time can be reduced. In addition, it is possible to avoid a malfunction due to a user's erroneous operation.

  (3) In one aspect, the 1st type stock solution tank which stores the stock solution which should be mixed with the diluent at a predetermined ratio in the abrasive fluid supply device, and the second which contains the stock solution which does not need to be diluted with the diluent. When the second type of stock solution tank is used, the mixing ratio control device controls the discharge so that the diluent is not supplied to the mix tank. According to this aspect, two types of stock solution tanks, that is, a stock solution tank that requires dilution and a stock solution tank that does not require dilution, can be used in a common abrasive fluid supply device. Further, since the stock solution of the second type stock solution tank is not required to be diluted, it is not necessary to adjust the supply amount of the diluent, and the configuration and control can be simplified.

  (4) In one embodiment, as a stock solution tank, a first type stock solution tank that contains a stock solution to be diluted m times (m> 1), and diluted n times (1 <n <m) There is a second type of stock solution tank that stores the stock solution to be used, and the predetermined ratio is set to 1: (m−1). And the mixing ratio control device is a (n-1) / (m-1) dilution liquid among the dilution liquids supplied by the control of the abrasive liquid supply device when the second type stock solution tank is used. Is supplied to the mixing tank, and the discharge of the diluent is controlled so that the (mn) / (m-1) diluent is discharged. In this aspect, two types of stock solution tanks containing stock solutions having different dilution rates can be used in a common abrasive fluid supply device.

  (5) In one embodiment, as the stock solution tank, there are a stock solution tank that contains an unused stock solution and a stock solution tank that contains a regenerated abrasive solution regenerated from the abrasive solution used in the polishing apparatus, and a predetermined ratio Is set to a ratio corresponding to the unused stock solution. Then, the mixing ratio control device is configured to discharge the diluted liquid so that the recycled abrasive liquid and the diluted liquid are mixed at a ratio corresponding to the regenerated abrasive liquid when a stock solution tank containing the regenerated abrasive liquid is used. Take control. In this aspect, two types of stock solution tanks of an unused stock solution and a regenerated abrasive solution can be used in a common abrasive solution supply device.

  (6) As illustrated in FIGS. 10, 11, and 14, in one embodiment, the discharge flow rate control valve and the supply flow rate control valve of the discharge unit are realized by one valve. According to the said aspect, a structure can be simplified compared with what is shown by FIG.

  (7) As illustrated in FIG. 14, in one embodiment, the stock solution and the diluted solution are supplied to the mixing tank simultaneously (or in parallel). According to this aspect, it is possible to shorten the time for the abrasive liquid generation process (that is, the dilution operation time).

  (8) As illustrated in FIG. 14, in one embodiment, a flow meter for measuring the flow rate of the stock solution in the stock solution flow path is provided, and the supply of the stock solution is controlled based on the detection result of the flow meter. According to the said aspect, a measurement tank can be abbreviate | omitted and a structure can be simplified.

  In addition, this invention is not limited to the said embodiment, It can change variously within the range which does not deviate from the summary of this invention.

  DESCRIPTION OF SYMBOLS 10 abrasive liquid supply apparatus, 11 mixing tank, 12 stock solution supply part, 12a stock solution flow path, 13 dilution liquid supply part, 13a dilution liquid flow path, 14 abrasive liquid supply part, 14a abrasive liquid flow path, 15 control part, 16 flow rate Detection unit, 20 polishing device, 30 mixing ratio control device, 31 discharge unit, 32 discharge control unit, 33 identification information acquisition unit, T stock solution tank, S dilution solution supply source.

Claims (6)

A mixing tank;
A stock solution supply means for supplying a polishing solution stock solution from a replaceable stock solution tank to the mixing tank;
A diluent supply means for introducing a diluent into the mixing tank, and supplying the diluent to the mixing tank through the diluent channel;
Control means for controlling the stock liquid supply means and the dilution liquid supply means so that a polishing liquid in which the abrasive liquid stock solution and the dilution liquid are mixed in a predetermined ratio is generated in the mixing tank;
Abrasive liquid supply means for supplying the polishing liquid generated in the mixing tank to a polishing apparatus;
A mixing ratio control device in an abrasive liquid supply device having
Discharging means for discharging the diluent flowing through the diluent channel on the upstream side of the mixing tank;
And the discharge control means for controlling the pre-Symbol discharge means,
I have a,
As the stock solution tank, a first type stock solution tank that contains a polishing solution stock solution to be mixed with the diluent at the predetermined ratio, and a second stock solution that contains a polishing solution stock solution that does not need to be diluted with the dilution solution. There are different types of concentrate tanks,
When the second type stock solution tank is used, the discharge control means controls the discharge means so that the diluent is not supplied to the mixing tank when the control means is controlled. Do,
A mixing ratio control device. The mixing ratio control device according to claim 1,
Further comprising identification information acquisition means for acquiring identification information for identifying the type of the stock solution tank from the stock solution tank,
The discharge control means controls the discharge means so that the diluent is not supplied to the mixing tank when the acquired identification information indicates the second type.
A mixing ratio control device. The mixing ratio control device according to claim 1 or 2,
The first type stock solution tank is a stock solution tank for storing an unused abrasive solution stock solution , and the second type stock solution tank is a regenerated abrasive solution regenerated from the abrasive solution used in the polishing apparatus. Is a stock tank that contains
A mixing ratio control device. A mixing tank;
A stock solution supply means for supplying a polishing solution stock solution from a replaceable stock solution tank to the mixing tank;
A diluent supply means for introducing a diluent into the mixing tank, and supplying the diluent to the mixing tank through the diluent channel;
Control means for controlling the stock liquid supply means and the dilution liquid supply means so that a polishing liquid in which the abrasive liquid stock solution and the dilution liquid are mixed in a predetermined ratio is generated in the mixing tank;
Abrasive liquid supply means for supplying the polishing liquid generated in the mixing tank to a polishing apparatus;
A mixing ratio control method in an abrasive liquid supply apparatus comprising:
A discharging step of discharging the diluent flowing through the diluent channel on the upstream side of the mixing tank;
And the discharge control step of performing control of the previous Symbol discharging process,
Only including,
As the stock solution tank, a first type stock solution tank that contains a polishing solution stock solution to be mixed with the diluent at the predetermined ratio, and a second stock solution that contains a polishing solution stock solution that does not need to be diluted with the dilution solution. There are different types of concentrate tanks,
The discharge control step controls the discharge step so that the diluent is not supplied to the mixing tank when the control means is controlled when the second type stock solution tank is used. Do,
The mixing ratio control method characterized by the above-mentioned. A mixing tank;
A stock solution supply means for supplying a polishing solution stock solution from a replaceable stock solution tank to the mixing tank;
A diluent supply means for introducing a diluent into the mixing tank, and supplying the diluent to the mixing tank through the diluent channel;
Control means for controlling the stock liquid supply means and the dilution liquid supply means so that a polishing liquid in which the abrasive liquid stock solution and the dilution liquid are mixed in a predetermined ratio is generated in the mixing tank;
Abrasive liquid supply means for supplying the polishing liquid generated in the mixing tank to a polishing apparatus;
Discharging means for discharging the diluent flowing through the diluent channel on the upstream side of the mixing tank;
And the discharge control means for controlling the pre-Symbol discharge means,
I have a,
As the stock solution tank, a first type stock solution tank that contains a polishing solution stock solution to be mixed with the diluent at the predetermined ratio, and a second stock solution that contains a polishing solution stock solution that does not need to be diluted with the dilution solution. There are different types of concentrate tanks,
When the second type stock solution tank is used, the discharge control means controls the discharge means so that the diluent is not supplied to the mixing tank when the control means is controlled. Do,
A polishing liquid supply system characterized by the above. A mixing tank;
A stock solution supply means for supplying a polishing solution stock solution from a replaceable stock solution tank to the mixing tank;
A diluent supply means for introducing a diluent into the mixing tank, and supplying the diluent to the mixing tank through the diluent channel;
A method for supplying an abrasive liquid in an apparatus comprising:
A control step of controlling the stock solution supply means and the dilution solution supply means so that a polishing solution in which the abrasive solution stock solution and the dilution solution are mixed in a predetermined ratio is generated in the mixing tank;
A polishing liquid supplying step of supplying the polishing liquid generated in the mixing tank to a polishing apparatus;
A discharging step of discharging the diluent flowing through the diluent channel on the upstream side of the mixing tank;
And the discharge control step of performing control of the previous Symbol discharging process,
Only including,
As the stock solution tank, a first type stock solution tank that contains a polishing solution stock solution to be mixed with the diluent at the predetermined ratio, and a second stock solution that contains a polishing solution stock solution that does not need to be diluted with the dilution solution. There are different types of concentrate tanks,
The discharge control step controls the discharge step so that the diluent is not supplied to the mixing tank when the control step is controlled when the second type stock solution tank is used. Do,
A method for supplying an abrasive liquid.

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