JP5658707B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to a transport device that transports a printed circuit board, a component supply device that supplies electronic components, a pair of beams that can be moved in one direction by a drive source, and a direction along each of the beams provided with suction nozzles. The present invention also relates to an electronic component mounting apparatus including a mounting head movable by each drive source.

This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. In general, component supply devices for supplying electronic components are provided on both outer sides of a transfer device for transferring a printed circuit board, and a pair of beams provided with mounting heads are provided corresponding to the component supply devices. That is, each beam corresponds to each component supply device, and the mounting head of one beam generally takes out an electronic component from only the corresponding component supply device and mounts it on a printed board.
JP 2006-286707 A

  Therefore, it is not always necessary to associate each beam with each component supply device because of the type of electronic component supplied by the component supply device.

  In view of the above-described problems, an object of the present invention is to improve the operational efficiency of the beam to improve the production efficiency.

To this end, the first invention includes a transport device that transports a printed circuit board, a component supply device that supplies electronic components, a pair of beams that can be moved in one direction (Y direction) by a drive source, and a suction nozzle. The electronic component that is provided inside each beam and can be moved by each driving source in the direction along the beam (X direction) and taken out from the component supply device by the suction nozzle is mounted on the printed circuit board. A mounting head for driving the beam driving source and each driving source of the mounting head to move each mounting head between a printed circuit board on the transport device and the component supply device, and Electronic components are mounted on the printed circuit board in parallel at positions where the mounting heads collide when the mounting heads approach the direction along the beam by suction nozzles provided on the mounting heads. And the driving source of the mounting head and the drive source of the beam so as not to collide with the direction along the beam control in the case, the each beam is controlled away from the other said both mounting head does not collide The mounting head is moved in a direction along the beam at a position, and the beam is controlled to move and approach in the one direction .

The second aspect of the invention is a transfer device for transferring a printed circuit board, a component supply device that supplies electronic components and is provided on both sides of the transfer device, and is moved in one direction (Y direction) by a drive source. A pair of possible beams and electrons provided with suction nozzles, provided inside each of the beams, and movable by each drive source in the direction along each beam (X direction) and taken out by the suction nozzle A mounting head for mounting the component on the printed circuit board, and driving the beam driving source and the driving source of the mounting head to attach the electronic component to the printed circuit board by the suction nozzle of the mounting head. When the beam is mounted in parallel at a position where it collides as it approaches the direction along the beam, the beam drive source and the device are installed so as not to collide in the direction along the beam. By controlling the respective driving sources of the head, wherein each beam with the beam to move the respective mounting head in a direction along the beam at the point the control to the two mounting heads away from the other without collision the It is configured to control so as to move in one direction and approach .

  The present invention can improve the operational efficiency of the beam and improve the production efficiency.

It is a schematic plan view of an electronic component mounting apparatus. It is a side view of a lead float inspection apparatus.

  Hereinafter, an embodiment of an electronic component mounting apparatus for mounting electronic components on a printed circuit board will be described with reference to FIG. The electronic component mounting apparatus 1 includes a transport device 2 that transports the printed circuit board P, a component supply device that supplies electronic components, a pair of beams 4A and 4B that can be moved in one direction (Y direction) by a drive source, A mounting body 6 that is movable by each drive source in a direction (X direction) along each of the beams 4A and 4B is provided. Attaching head 7 provided with a plurality of suction nozzles 9 and a substrate recognition camera 8 for imaging a recognition mark attached to the printed circuit board P are attached to the attachment body 6.

  The transport device 2 is disposed so as to transport the printed circuit board P in the X direction (left and right direction in FIG. 1) to the middle part of the front and rear of the electronic component mounting device 1, and a substrate supply unit that inherits the printed circuit board P from the upstream device. A positioning unit for positioning and fixing the printed circuit board P supplied from the substrate supply unit for mounting the electronic component sucked and held by the suction nozzle 9 of each mounting head 7, and the electronic component is mounted by the positioning unit And a discharge unit that inherits the printed circuit board P and conveys it to the downstream apparatus.

  The component supply devices are respectively disposed on both the front and rear sides of the transport device 2, and a cart provided with casters is detachably attached to the device main body of the electronic component mounting device 1. A feeder base 3A on the upper surface of the cart is provided. A plurality of component supply units that supply various electronic components one by one to a component suction position (component extraction position) are arranged in parallel on 3B. This component supply unit peels off the cover tape and intermittently feeds the electronic components stored in the storage recesses formed on the storage tape at predetermined intervals so as to be sent to the component suction position so that the suction nozzle can be taken out. It is a thing.

  The pair of front and rear beams 4A and 4B, which are long in the X direction, are individually moved in the Y direction by the sliders fixed to the beams sliding along a pair of left and right front and rear guides driven by the Y direction linear motors. Move to. The Y-direction linear motor includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 10A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It consists of.

  Also, as described above, the beams 4A and 4B are each provided with the mounting head 7 that moves along the guide in the longitudinal direction (X direction) by the X direction linear motor, and the X direction linear motor Consists of a pair of front and rear stators fixed to the beams 4A and 4B, and a mover provided on the mounting head 7 between the stators.

  The suction nozzle 9 can be moved up and down by a vertical axis motor, and the mounting head 7 is rotated around the vertical axis by a θ-axis motor. As a result, each suction nozzle 9 of each mounting head 7 is moved in the X direction and Y direction. It can move in the direction, can rotate around a vertical line, and can move up and down.

  The mounting heads 7 are provided inside the beams 4A and 4B so as to face each other, and move above the printed circuit board P on the positioning unit of the transport device 2 and the component suction position of the component supply device. That is, the Y-direction linear motor and the X-direction linear motor corresponding to the beams 4A and 4B are controlled, and the suction nozzle 9 of the mounting head 7 provided on each of the beams 4A and 4B allows any component supply apparatus. Electronic parts can be taken out.

  Specifically, the suction nozzle 9 of the mounting head 7 provided on the back beam 4A takes out electronic components from the component supply unit on the back feeder base 3A and is mounted on the front beam 4B. 7 suction nozzle 9 takes out electronic components from the component supply unit on the feeder base 3B on the front side, but in addition to this, it is not limited to the installation area in which the printed circuit board with the longest Y direction can be installed. The common area where the heads 7 can move and enter each other is expanded. That is, the mounting heads 7 and 7 are provided not on the outside of the beams 4A and 4B but on the opposite side (inside), and the suction nozzle 9 of the mounting head 7 provided on the back beam 4A is the feeder base on the back side. The electronic component can be taken out from the component supply unit on the front feeder base 3B in addition to the component supply unit on 3A. Similarly, the suction nozzle of the mounting head 7 provided on the beam 4B on the front side 9 can expand the common area so that electronic components can be taken out from the component supply unit on the rear feeder base 3A in addition to the component supply unit on the feeder base 3B on the front side.

  In this case, the mounting heads 7 provided on both beams 4A and 4B are controlled so as not to collide with each other, and in particular, the suction nozzles 9 of both mounting heads 7 are juxtaposed to provide a component supply unit on one feeder base 3A or 3B. When the electronic components are taken out from, the mounting heads 7 can be separated from the component supply units in the left half or right half of each component supply unit, for example, so that they do not collide.

  The front and rear parts of the electronic component mounting apparatus 1 have a transparent part on the upper surface and both side surfaces so that the inside of the apparatus can be seen, and an open / close door having a handle is provided in the lower part of the outer surface so as to be opened and closed. Each open / close door opens and closes at least the top opening, and does not necessarily open and close the side opening.

  Reference numerals 12 and 12 denote component recognition cameras that collectively image the electronic components sucked and held by the suction nozzle 9 provided in each mounting head 7, and are provided for each corresponding mounting head 7 in the common area. .

  On the feeder base 3B on the front side, not only the component supply unit but also a lead float inspection device 13 for inspecting the lead float of the electronic component sucked and held by the suction nozzle is detachably provided in the common area. It is done. That is, in order to prevent the occurrence of poor soldering in the reflow process of the electronic component 21 having a large number of pins 22 (so-called lead floating, due to vertical bending of the lead), the electronic component 21 must be When the lead float inspection device 13 conducts a lead float inspection and the bending tolerance exceeds the allowable value, the lead float inspection apparatus 13 floats away from the board surface when mounted on the printed board P. Since it is not soldered to the land, such an electronic component is configured not to be mounted on the printed circuit board P.

  The lead float inspection device 13 will be described with reference to FIG. 2. A pair of line CCDs 25 are arranged on the same straight line, and light emitted from a plurality of light sources 26 such as LEDs is arranged in the same direction as the line CCD 25 1. The light that is irradiated to the lead group of the row from two directions and reflected from each lead 22 is irradiated onto the line CCD 25 through the lens 27, and the difference between the projection positions detected by the pair of line CCDs 25 for each lead 22 is the lead. Appears as 22 floats. That is, when only one lead 22 bends upward and its lower end position is above the other lead 22, how far the lower end position is from the reference plane formed by the lower end position of the other lead 22 It is detected as a floating amount.

  On the feeder base 3B on the front side, the electronic component collecting device 15 is detachably disposed so that the longitudinal direction is the front-rear direction. That is, it cannot be mounted on the printed circuit board as it is by the inspection of the component recognition cameras 12 and 12 as the inspection device for inspecting the state of the electronic component sucked and held by the suction nozzle 9 or the lead float inspection device 13. In this case, a collection device 15 that collects electronic components that have been inspected is detachably disposed on the feeder base 3B on the near side.

  The inspection device for inspecting the state of the electronic component sucked and held by the suction nozzle 9 is not limited to the component recognition cameras 12 and 12 and the lead float inspection device 13, but a line sensor provided in the mounting head 6 or the like. (Not shown) can also be used.

  The collection device 15 is composed of a drive motor, a pair of front and rear rollers rotated by the drive motor, and a collection belt 15A stretched between the pair of rollers, and the suction nozzle 9 is inspected. The electronic component 21 is placed at the innermost position (mounting position) of the collection belt 15A and collected, and each time this collection is performed, the drive motor of the collection device 15 operates for a certain period of time, and the electronic components are arranged at a certain pitch in the direction of the arrow. 21 is conveyed. It should be noted that at least the mounting position is within a common area where the mounting heads 7 of both beams 4A and 4B can move and enter each other, and the position on the front side (extraction position) of the recovery belt 15A is an open / close door It is located outside the opening of the main body for attaching and detaching the component supply unit which is not covered with.

  And an operator takes out the electronic component on the collection | recovery apparatus 15 from the position outside the opening of a main body, without opening the said opening-and-closing door, for example, correct | amends lead bending. Thereby, this electronic component can be reused.

  With the above configuration, the operation will be described below. First, when the printed circuit board P is inherited from the upstream device (not shown) and exists on the supply unit of the transport device 2, the printed circuit board P on the supply unit is moved to the positioning unit, and this printed circuit board P positioning is performed. And fix.

  When the printed circuit board P is positioned, the movable element 10A slides and moves in the Y direction along the guide extending forward and backward by the driving of the Y-direction linear motor by the beam 4B on the near side and linear in the X-direction. The mounting head 7 is moved in the X direction by the motor, moved to above the component suction position of the component supply unit on the feeder base 3B on the near side, and the suction nozzle 9 is lowered by driving the vertical axis motor. Take out electronic components one after another.

  In addition, after or after taking out the electronic component by the suction nozzle 9 of the mounting head 7 on the near side, the back beam 4A is moved in the Y direction by driving the Y direction linear motor and the X direction linear motor. As a result, the mounting head 7 moves in the X direction and moves not only to the component supply unit on the rear feeder base 3A but also to the upper part of the component supply position of the component supply unit on the front feeder base 3B to drive the vertical axis motor. Thus, the suction nozzle 9 can be lowered to take out electronic components one after another from the component supply unit. However, when the suction nozzle 9 of the front beam 4B and the back beam 4A performs the extraction operation in parallel, the corresponding Y-direction linear motors so that the mounting heads 7 of both beams 4B and 4A do not collide with each other. And the X direction linear motor is controlled.

  Further, the mounting head 7 of the beam 4B on the front side takes out the electronic components from the left half of the component supply unit of any of the front and rear component supply devices, and the mounting head 7 of the rear beam 4A is the right half of the components supply device. Not only when taking out the electronic components from the supply unit, but after moving the mounting heads 7 to the position where both the mounting heads 7 do not collide by moving in the Y direction so that the beams 4A and / or 4B move away from the other. And the beam 4A and / or 4B are moved in the Y direction so as to approach each other, and the mounting head 7 of the beam 4B on the near side takes out the electronic component from the component supply unit on the right half of the component supply apparatus. The mounting head 7 of the back beam 4A can take out the electronic component from the component supply unit on the left half of the component supply apparatus.

  That is, in the Y direction, both beams 4B and 4A are controlled so as not to be closer than necessary, and in the X direction, both mounting heads 7 are controlled so as not to be closer than necessary, so that both beams 4B and 4A are mounted. The collision of the head 7 is prevented.

  After removal, the suction nozzles 9 of both mounting heads 7 are raised so that the mounting heads 7 of both beams 4A and 4B pass over the corresponding component recognition cameras 12 and 12, and the component recognition camera is moved during this movement. Reference numerals 12 and 12 collectively image a plurality of electronic components sucked and held by the suction nozzle 9 of both the mounting heads 7, and the recognition processing device recognizes the picked-up images to detect the electronic components for the suction nozzle 9. The misalignment and the bending of each lead in the horizontal plane are recognized.

  Thereafter, the substrate recognition camera 8 of the beam 4A or 4B is moved above the printed circuit board P to image the positioning mark attached to the positioned printed circuit board P, and the recognition processing device recognizes the captured image. Thus, the position of the printed circuit board P is grasped. If the recognition error is not detected, the position recognition result of the printed circuit board P and the position recognition processing result of each component are added to the mounting coordinates of the mounting data, and the suction nozzle 9 of each mounting head 7 is displaced. While correcting, each electronic component is mounted on the printed circuit board P.

  In this case, after the mounting of the electronic component to the printed circuit board P by the suction nozzle 9 of the mounting head 7 of the mounting beam 7 on the back side or when the mounting is performed, the suction nozzle 9 of the mounting head 7 of the front beam 4B is mounted. Electronic components can be mounted on the printed circuit board P. However, when the suction nozzle 9 of the back beam 4A and the front beam 4B performs the mounting operation in parallel, the Y-direction linear motor and the corresponding motor so that the mounting heads 7 of both beams 4A and 4B do not collide with each other. The X direction linear motor is controlled.

  Further, the mounting head 7 of the front beam 4B mounts an electronic component on the left half area of the printed circuit board P, and the mounting head 7 of the rear beam 4A mounts an electronic component on the right half area of the printed circuit board P. In addition to moving the mounting heads 7 in the X direction, the beams 4A and / or 4B move in the Y direction so as to move away from the other and move to a position where the mounting heads 7 do not collide. The beam 4A and / or 4B is moved in the Y direction so as to approach, and the mounting head 7 of the beam 4B on the front side mounts electronic components on the right half region of the printed circuit board P and the mounting head of the beam 4A on the back side 7 can also mount an electronic component on the left half region of the printed circuit board P.

  As described above, in any of the component supply devices provided on both outer sides of the conveying device 2, the suction nozzle 9 of the mounting head 7 of the beam 4A or 4B can take out the electronic component, and at the same time Can be taken out. Further, the electronic components can be mounted on the printed circuit board P in parallel by the suction nozzle 9 of the mounting head 7 of the beam 4B on the near side and the suction nozzle 9 of the mounting head 7 of the beam 4A on the back side.

  In addition, the component recognition cameras 12 and 12 collectively image a plurality of electronic components sucked and held by the suction nozzle 9, and the recognition processing device recognizes the picked-up image in the horizontal plane of the lead. If the bend of the electronic device is not mounted on the printed circuit board P, the suction nozzle 9 is moved to place the electronic component determined to be inspected in the position on the innermost side (mounting) of the collection belt 15A. Place) and collect. In this case, the drive motor of the recovery device 15 operates for a certain time each time this recovery is performed, and the electronic components 21 are conveyed by a constant pitch in the direction of the arrow to prepare for the next recovery.

  When the electronic component is mounted on the printed circuit board P, if the electronic component sucked and held by the suction nozzle 9 is the electronic component 21 having a large number of pins 22, the electronic component 21 is sucked and held. The mounting head 7 provided on the beam 4A or 4B is moved above the lead float inspection device 13 provided on the feeder base 3B in the common area, and the lead float inspection is performed before component mounting.

  Electronic components that exceed the allowable value for bending are controlled so as not to be mounted on the printed circuit board P, and the suction nozzle 9 is moved and placed at the innermost position (mounting position) of the collection belt 15A and collected. The electronic components 21 of the same type are taken out again from any of the component supply units, and the electronic components that do not exceed the allowable value are controlled to be mounted. When placed on the collection device 15, the drive motor of the collection device 15 operates for a certain period of time to convey the electronic components 21 by a certain pitch in the direction of the arrow to prepare for the next collection.

  Then, the operator does not open the opening / closing door, stops the production operation of the electronic component mounting device, and transports the electronic components at a constant pitch, and removes the electronic components on the collection device 15 from the front side from the front side. Take out in order, for example, correct lead bending. As a result, the electronic component can be reused, and the effect is great particularly in an expensive electronic component.

  In the above embodiment, the collection device 15 is detachably provided on the feeder base 3B, but may be provided on the feeder base 3A without being provided on the feeder base 3B. Moreover, you may provide in the common area where both the mounting heads 7 can move mutually and enter other than the arrangement | positioning area (it is also a common area) in which the printed circuit board P can be arrange | positioned.

  As described above, each of the drive sources is driven and an electronic component can be taken out from any component supply device by the suction nozzle 9 of the mounting head 7 provided in each of the beams 4A and 4B. Since the recovery device 15 for recovering electronic components that cannot be mounted on the printed circuit board P in the state as they are after inspection is provided on the feeder base 3B, the upper surface provided on the front and rear portions of the electronic component mounting device 1 is provided. When the opening / closing door that opens and closes the opening is opened, the electronic component mounting device stops. However, without opening the opening / closing door, the electronic component on the collection device 15 is taken out through the opening of the main body and, for example, the lead including the lead floating Curvature etc. can be corrected and this electronic component can be reused. Similarly, the recovery device can be repaired and inspected without opening the door (without stopping the production operation of the electronic component mounting device).

  In addition, each drive source is driven so that the electronic component can be taken out from any component supply device by the suction nozzle 9 of the mounting head 7 provided in each beam 4A, 4B, and the print on which the electronic component is mounted In the state in which the mounting heads 7 other than the disposition area where the substrate P can be disposed can move and enter each other, the common area on the back side or the near side is left as it is by the inspection of the inspection apparatus. Since the recovery device 15 for recovering electronic components that cannot be mounted on the printed circuit board P is provided, in addition to the effects described above, the single recovery device 15 can support the mounting heads 7 provided on both beams 4A and 4B. It can be manufactured at low cost.

  It should be noted that both mounting heads 7 and 7 can move and enter each other with respect to any component supply device, so that the collection device 15 has only to be placed on one side, which saves space. May be placed on both sides.

  In addition, it is good to place the collecting device 15 on the feeder base even if both the mounting heads 7 and 7 are not allowed to move into each other and enter any of the component supply devices. Even when the distance between the upstream and downstream electronic component mounting devices constituting the device is narrow (when there is no substrate conveyor between the electronic component mounting devices or when the worker cannot enter the side of the device) The parts on the recovery device 15 can be easily taken out, and the recovery device 15 can be repaired and inspected.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 3A, 3B Feeder base 4A, 4B Beam 7 Mounting head 9 Adsorption nozzle 13 Lead float inspection apparatus 15 Recovery apparatus

Claims (2)

A transport device that transports the printed circuit board, a component supply device that supplies electronic components, a pair of beams that can be moved in one direction (Y direction) by a drive source, and a suction nozzle are provided inside each beam. And a mounting head that mounts an electronic component that can be moved by each driving source in the direction along the beam (X direction) and is taken out from the component supply device by the suction nozzle, on the printed circuit board, The drive source of the beam and each drive source of the mounting head are driven to move each mounting head between the printed circuit board on the transport device and the component supply device, and the suction provided on each mounting head In the case where the electronic components are mounted on the printed circuit board by nozzles in parallel at the positions where the mounting heads collide when approaching the direction along the beam, The controls the driving source and the respective drive sources of the mounting head of the beam so as not to collide with the direction Tsu, wherein each of the mounting heads in position each beam does not collide controlling the two mounting heads away from the other The electronic component mounting apparatus is configured to move the beam in a direction along the beam and to control each beam to move in the one direction . A transport device for transporting a printed circuit board, a component supply device for supplying electronic components and provided respectively on both sides of the transport device, and a pair of beams movable in one direction (Y direction) by a drive source; The suction nozzle is provided inside each of the beams, and can be moved by each drive source in the direction along the beam (X direction). The electronic component taken out by the suction nozzle is placed on the printed circuit board. A mounting head to be mounted, and driving the beam driving source and each driving source of the mounting head so that the mounting nozzles follow the beam with electronic components on the printed circuit board by suction nozzles of the mounting heads. When mounting in parallel at the position of collision when approaching the direction, the drive source of the beam and each drive of the mounting head are prevented so as not to collide in the direction along the beam. By controlling the source, moves the each beam in the one direction with each beam moves said each of the mounting heads in the direction along the beam at the point the control to the two mounting heads away from the other does not collide The electronic component mounting apparatus is configured to be controlled so as to approach .

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