JP5658887B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus for processing a substrate to be processed used in a solar cell having a substrate and a thin film disposed on the substrate.

  A substrate to be processed 60 used in the thin film solar cell includes a glass substrate 61, a transparent electrode film 62 provided on the glass substrate 61, a photoelectric conversion layer 63 containing Si or the like provided on the transparent electrode film 62, It has the back surface metal electrode film 64 provided in this photoelectric converting layer 63 (refer FIG. 8). In order to obtain a desired voltage, it is necessary to divide the transparent electrode film 62, the photoelectric conversion layer 63, and the back surface metal electrode film 64 into cells and connect them in series. There is a method of forming such a series connection by alternately performing film formation and laser patterning to obtain a three-dimensional connection structure of each layer (film). This connection structure portion is called an integrated line 65 (see FIG. 9).

Since these integrated lines 65 do not contribute to power generation (photoelectric conversion), the three scribe lines constituting the integrated line 65 are preferable because the conversion efficiency as a solar cell substrate becomes higher as they are closer to each other. Therefore, an Si scribe (patterning) line 63 _S is formed in the photoelectric conversion layer 63 along the TCO scribe (patterning) line 62 _T formed in the transparent electrode film 62, and a metal scribe is formed in the back surface metal electrode film 64. it is preferable to form a (patterned) line 64 _M. Conventionally, each scribe line has been processed at a position separated by a predetermined distance with reference to the substrate outer shape and alignment marks.

  However, there is a limit in bringing the scribe lines close to each other due to expansion / contraction of the substrate to be processed 60 due to a temperature change accompanying an increase in the size of the substrate to be processed 60 and problems with accuracy of the laser processing apparatus. In addition, when laser patterning is performed based on the substrate outer shape and alignment marks due to an increase in the size of the substrate to be processed 60, the distance from the reference to the processing line is increased, and it is necessary to increase the mechanical accuracy. Also, since film formation and laser patterning are repeated, laser patterning is not necessarily performed in the same environment (especially temperature conditions), and a large deviation may occur based on the same substrate outer shape and alignment mark. Correction is necessary. Furthermore, since such correction is required every time during laser patterning, it takes much time and effort.

Further, since the normal processing program is based on the linear interpolation method, a temperature distribution is generated in the substrate 60 to be processed, and the TCO scribe line 62 _{T to} be used as a reference performs the subsequent process (forms the Si scribe line 63 _S) . If you are and when forming the Metals scribe line 64 _M) has become a curved when the distance between lines varies depending on the location.

  Conventionally, a second scribe line corresponding to the first scribe line formed on the first layer is formed on the second layer stacked on the first layer in a form along the first scribe line. It is also known to control the relative movement mechanism (see Patent Document 1). According to this method, since each of the processed lines is directly detected and each laser patterning is corrected, laser patterning can be performed with high accuracy.

  However, in the aspect described in Patent Document 1, a plurality of scribe lines cannot be formed simultaneously. Although it is possible to use a plurality of laser processing apparatuses, the use of a plurality of laser processing apparatuses not only increases the size of the apparatus, but also increases the price of the apparatus and requires maintenance. In the first place, when a plurality of laser processing apparatuses are used, it is difficult to perform laser patterning by approaching each processed line in a certain degree.

JP 2007-048835 A

  The present invention has been made in consideration of such points, and a plurality of scribe lines to be processed can be simultaneously formed at a constant distance from a reference scribe line (processed line). An object is to provide a laser processing apparatus.

The laser processing apparatus according to the present invention comprises:
A laser processing apparatus for processing a substrate to be used for a solar cell having a substrate and a thin film disposed on the substrate,
A holding unit for holding the substrate to be processed;
A laser oscillator that oscillates laser light;
A plurality of optical fibers for guiding laser light oscillated from the laser oscillator and irradiating the laser light to the outside from an end face;
A processing moving unit that moves at least one of the holding unit and the end face of the optical fiber along a processing progress direction; and
A detection unit for detecting position information of the end face of the optical fiber with respect to the thin film;
A fiber moving unit that is coupled to at least one of the plurality of optical fibers and moves an end face of the optical fiber in a direction including a component orthogonal to the processing progress direction based on information from the detection unit;
It has.

In the laser processing apparatus according to the present invention,
The position information is obtained based on already processed lines,
The detection unit detects the position of the processed line corresponding to the end face of each optical fiber,
The fiber moving unit may move the end face of each optical fiber based on the position of the processed line corresponding to the end face of the optical fiber.

In the laser processing apparatus according to the present invention,
The position information is obtained based on already processed lines,
The detection unit detects a position of a processed line corresponding to at least one end face of the optical fiber,
The fiber moving unit may move the end face of each optical fiber based on position information of the processed line.

In the laser processing apparatus according to the present invention,
The detection unit has a data acquisition unit for acquiring information about the thin film,
The data acquisition unit includes a first data acquisition unit positioned on one side along the processing progress direction with respect to the end surface of the optical fiber, and the other side along the processing progress direction with respect to the end surface of the optical fiber. You may have the 2nd data acquisition part located in.

In the laser processing apparatus according to the present invention,
The detection unit has a data acquisition unit for acquiring information about the thin film,
The data acquisition unit is disposed on one side along the processing direction with respect to the end face of the optical fiber,
The positional relationship between the data acquisition unit and the end face of the optical fiber may be reversible.

In the laser processing apparatus according to the present invention,
The detection unit includes a data acquisition unit that acquires information about the thin film, an information processing unit that processes information about the thin film acquired by the data acquisition unit, and the information processed by the information processing unit. A determination unit that determines a position of the end face of the optical fiber with respect to the thin film.

In the laser processing apparatus according to the present invention,
The detection unit also detects information about obstacles on the substrate to be processed,
The fiber moving unit may move the end face of the optical fiber so as to avoid the obstacle based on information detected by the detecting unit.

  According to the present invention, the end faces of a plurality of optical fibers can be moved in a direction including a component orthogonal to the processing progress direction based on information from the detection unit. For this reason, it is possible to simultaneously form a plurality of scribe lines to be processed while maintaining a certain distance from a reference scribe line (processed line). And since the next scribe line can be processed in the immediate vicinity of the existing scribe line with high accuracy, the scribe line can be formed in an extremely close state. For this reason, the area | region which an integrated line occupies can be made small, and by extension, a solar cell substrate with high electric power generation efficiency can be provided.

The side view which showed the structure of the laser processing apparatus by the 1st Embodiment of this invention. The upper top view which showed the structure in the fiber holding housing | casing of the laser processing apparatus by the 1st Embodiment of this invention. The side view which showed the structure in the fiber holding housing | casing of the laser processing apparatus by the 1st Embodiment of this invention. The perspective view which showed the aspect which processes a to-be-processed substrate with the laser processing apparatus by the 1st Embodiment of this invention. The upper top view which showed an example of the aspect which processes a to-be-processed substrate with the laser processing apparatus by the 1st Embodiment of this invention. The upper top view which showed another example of the aspect which processes a to-be-processed substrate with the laser processing apparatus by the 1st Embodiment of this invention. The upper top view which showed the movement aspect of the process moving part in the laser processing apparatus by the 1st Embodiment of this invention. The upper top view which showed the movement aspect of the process moving part in the laser processing apparatus by the modification of the 1st Embodiment of this invention. The side sectional view showing the processing mode of the processed substrate in the 1st embodiment of the present invention. The side sectional view showing the layer composition of the substrate to be processed. The upper top view which showed the processed board | substrate processed.

First Embodiment Hereinafter, a first embodiment of a laser processing apparatus according to the present invention will be described with reference to the drawings. Here, FIG. 1 to FIG. 7 are diagrams showing a first embodiment of the present invention.

  The laser processing apparatus of this embodiment is for processing a substrate to be processed 60 used in a solar cell having a glass substrate (substrate) 61 and thin films 62, 63, 64 disposed on the glass substrate 61. Yes (see FIG. 8). Among these, the thin film was provided on the transparent electrode film 62 provided on the glass substrate 61, the photoelectric conversion layer 63 including Si and the like provided on the transparent electrode film 62, and the photoelectric conversion layer 63. And a back metal electrode film 64.

  As shown in FIG. 1, the laser processing apparatus guides the laser beam L oscillated from the laser oscillator 21, the laser oscillator 21 that oscillates the laser beam L, the holding unit 1 that holds the substrate 60 to be processed, and A plurality of optical fibers 25 that irradiate laser light L from the end face to the outside, a processing moving portion 35 that moves the end face of the optical fiber 25 along the processing progress direction PD (see FIG. 2), and a thin film on the end face of the optical fiber 25 Is connected to each of a detection unit (refer to reference numerals 41, 42, 43, and 45 in FIG. 4A) and a plurality of (four in the present embodiment) optical fibers 25, and information from the detection unit And an actuator (fiber moving part) 10 (see FIG. 2) for moving the end face of the optical fiber 25 in a direction orthogonal to the processing progress direction PD.

  Among these, the end face of the optical fiber 25 is disposed in the fiber holding casing 11. And the end surface of the optical fiber 25 will be moved along the process advancing direction PD by the fiber moving housing | casing 11 being moved along the process advancing direction PD by the process moving part 35. FIG. As shown in FIG. 2, the actuator 10 is also arranged in the fiber holding casing 11, and the end face of the optical fiber 25 is moved in the fiber holding casing 11 by the actuator 10.

  In this embodiment, the actuator 10 is used as the fiber moving unit. However, a piezoelectric element, a linear motor, a linear coil, a cylinder, or the like can be used as the actuator 10. However, it is preferable that the fiber moving unit is small in size, and has a high operation response and a high operation speed.

  Further, as shown in FIG. 2, each of the actuators 10 is disposed at a position shifted from each other along the processing progress direction PD, and drives the end face of the optical fiber 25 in a direction orthogonal to the processing progress direction PD. Is configured to do.

  In the present embodiment, the end face of the optical fiber 25 is described using an aspect in which the end face of the optical fiber 25 is moved along the processing progress direction PD. However, the end face of the optical fiber 25 is moved relative to the substrate 60 to be processed. If it is, it will not be restricted to this. For example, the holding unit 1 may be moved along the processing progress direction PD, or both the holding unit 1 and the end face of the optical fiber 25 may be moved along the processing progress direction PD. In the present embodiment, the end face of the optical fiber 25 is described using an aspect in which the end face is moved in a direction orthogonal to the machining progress direction PD. However, as long as the movement direction includes a component orthogonal to the machining progress direction PD. However, it is not limited to this. For example, the aspect which moves the end surface of the optical fiber 25 in the diagonal direction with respect to the process progress direction PD may be sufficient.

As shown in FIG. 4A, the detection unit described above includes an imaging unit 41 including a CCD camera that acquires an image of a thin film by imaging a thin film, and image processing that processes an image of the thin film captured by the imaging unit 41. A display unit (information processing unit) 42, a determination unit 43 that determines the position of the end face of the optical fiber 25 with respect to the thin film based on the image processed by the image processing unit 42, and an image processed by the image processing unit 42 And an image display unit 45. Note these, imaging unit 41 constitutes a data acquisition unit that acquires information about the thin film acquires the position information of the TCO scribe line 62 to be described later _T and Si scribe line 63 _S.

  Further, the photographing unit 41 is provided in the processing moving unit 35 so as to be disposed on one side along the processing progress direction PD with respect to the end face of the optical fiber 25 (see FIG. 5). Note that the processing moving unit 35 can be reversed by 180 °, and the positional relationship between the photographing unit 41 and the end face of the optical fiber 25 can be reversed by 180 ° with respect to the conventional processing progress direction. For this reason, the photographing unit 41 can always be positioned in front of the processing progress direction PD with respect to the end face of the optical fiber 25, and the position information or defect information of the processed line can be obtained before processing.

In the present embodiment, position information is obtained based on already processed lines (for example, the TCO scribe line 62 _T and the Si scribe line 63 _S ). Then, the photographing unit 41 acquires the position information of the TCO scribe line (processed line) 62 _T and the Si scribe line (processed line) 63 _S corresponding to the end face of each optical fiber 25 and makes a determination based on the position information. The unit 43 detects the position of the TCO scribe line (processed line) 62 _T or Si scribe line (processed line) 63 _S corresponding to the end face of each optical fiber 25, and based on the detection result, the actuator 10 is configured to move the end face of each optical fiber 25 based on the position of the processed line corresponding to the end face of the optical fiber 25.

  As shown in FIG. 1, a condensing lens 22 for condensing the laser light L oscillated from the laser oscillator 21 is provided between the laser oscillator 21 and the optical fiber 25. As shown in FIG. 3, an imaging lens 17 that condenses the laser light L emitted from the end face of the optical fiber 25 is provided below the end face of each optical fiber 25. In the present embodiment, a film forming apparatus (not shown) for forming the photoelectric conversion layer 63 and the back surface metal electrode film 64 is provided. The film forming apparatus may be configured to form the transparent electrode film 62.

  In the above description, the image forming lens 17 is composed of a single element. However, the present invention is not limited to this. The image forming lens 17 is composed of a plurality of lenses, and a laser is formed by the plurality of lenses. The light L may be imaged.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, a substrate to be processed 60 having a glass substrate 61 and a transparent electrode film 62 disposed on the glass substrate 61 is prepared (see FIG. 7A). Thereafter, the substrate to be processed 60 is held by the holding unit 1. At this time, in the present embodiment, the substrate to be processed 60 is held by the holding unit 1 so that the transparent electrode film 62 is positioned below the glass substrate 61. However, the present invention is not limited to this, and the substrate to be processed 60 may be held by the holding unit 1 so that the transparent electrode film 62 is positioned above the glass substrate 61.

Next, laser light L is oscillated from the laser oscillator 21 (see FIG. 1). Then, after the laser light L has passed through the condenser lens 22, the laser light L is guided in a plurality (four in the present embodiment) of optical fibers 25. Thereafter, the laser light L is irradiated to the outside from the end face of the optical fiber 25, and the transparent electrode film 62 is processed (see FIG. 7B). At this time, the end face of the optical fiber 25 is moved along the processing progress direction PD by the processing moving unit 35. As a result, the transparent electrode film 62 is processed along the processing progress direction PD, and a plurality of transparent electrode films 62 are formed on the transparent electrode film 62. so that the TCO scribe lines 62 _T is formed.

  Next, a photoelectric conversion layer 63 containing Si or the like is formed on the transparent electrode film 62 provided on the glass substrate 61 by a film forming apparatus (see FIG. 7C). Thereafter, the laser beam L is again oscillated from the laser oscillator 21 (see FIG. 1). Then, the laser light L is guided through the plurality of optical fibers 25 after passing through the condenser lens 22. Thereafter, the laser beam L is irradiated to the outside from the end face of the optical fiber 25, and the photoelectric conversion layer 63 is processed.

At this time as well, the end face of the optical fiber 25 is moved along the processing progress direction PD by the processing moving unit 35, and as a result, the photoelectric conversion layer 63 is processed along the processing progress direction PD. so that the plurality of Si scribe line 63 _S is formed (see FIG. 7 (d)).

  Thus, when the photoelectric conversion layer 63 is processed along the processing progress direction PD, the following steps are performed in the present embodiment.

First, prior to the irradiation of the laser beam L to the photoelectric conversion layer 63, an image of the transparent electrode film 62 is acquired by the imaging unit 41, and an image of the transparent electrode film 62 captured by the imaging unit 41 by the image processing unit 42 is obtained. Then, the position of the end face of the optical fiber 25 relative to the transparent electrode film 62 is determined based on the image by the determination unit 43 (see FIG. 4A). More specifically, the determination unit 43 determines the positions of the already processed TCO scribe lines 62 _T (in the present embodiment, each of the four TCO scribe lines 62 _T ), and the TCO scribe lines 62 _T. The positions of the end faces of the optical fibers 25 corresponding to (the end faces of the four optical fibers 25 in the present embodiment) are determined. Then, the actuator 10 moves the end face of each optical fiber 25 based on the position of the TCO scribe line (processed line) 62 _T corresponding to the end face of the optical fiber 25 (see FIG. 2).

According to this embodiment, the TCO scribing line 62 _T already formed on the basis, at all times, it is possible to correct the position of the end faces of the optical fibers 25. Therefore, even if the TCO scribing line 62 _T is formed in a curved shape, as close over the entire TCO scribe lines 62 _T, it is possible to form a Si scribe lines 63 _S, thus, integrated line The area occupied by 65 can be reduced. In addition, since the position of the end face of each optical fiber 25 can be always corrected in this way, it is possible to reduce the specifications regarding the temperature management of the surroundings and the accuracy of the processing apparatus. Further, it is possible to each of the TCO scribing line 62 _T even though the different bending ways, in accordance with the respective TCO scribe lines 62 _T forms a Si scribe line 63 _S (see FIG. 4B).

Moreover, according to this Embodiment, each of the end surface of the some optical fiber 25 can be moved to the direction orthogonal to a process advancing direction based on the information from a detection part. Therefore, the Si scribe line 63 _S to be processed is kept a certain distance with respect to serving as a reference TCO scribe line 62 _T can be more simultaneously formed.

Furthermore, according to the present embodiment, as shown in FIG. 2, each of the actuators 10 is disposed at a position shifted from each other along the machining progress direction PD, and is perpendicular to the machining progress direction PD. The end face of the optical fiber 25 is driven. Therefore, even if the distance of Si scribe line 63 _S to be formed is narrow, it can be close to each other the end face of the optical fiber 25 in a direction perpendicular to the machining direction of travel PD.

When the processing moving unit 35 is moved to one end of the substrate 60 to be processed and the laser scribing process is completed, the processing moving unit 35 is inverted by 180 °, and the positional relationship between the photographing unit 41 and the end face of the optical fiber 25 has been changed so far. Is reversed 180 ° with respect to the machining progress direction (see FIG. 5). Therefore, according to the present embodiment, even when the laser scribing process is performed by reciprocation of the processing moving unit 35 and the processing is performed more efficiently than the laser scribing process in the same direction each time, the photographing unit 41 is provided. can always be positioned on the front side of the working traveling direction PD to the end face of the optical fiber 25, based on the TCO scribing line 62 _T, constantly, it is possible to correct the position of the end faces of the optical fibers 25.

It is the photoelectric conversion layer 63 in the manner of processing above, the photoelectric conversion layer 63 Si scribe line 63 _S is formed, then, by a film forming device, provided in the transparent electrode film 62 photoelectric conversion layer 63 above A back metal electrode film 64 is formed on the substrate (see FIG. 7E). Thereafter, the laser beam L is again oscillated from the laser oscillator 21. Then, the laser light L is guided through the plurality of optical fibers 25 after passing through the condenser lens 22. Thereafter, the laser beam L is irradiated to the outside from the end face of the optical fiber 25, and the photoelectric conversion layer 63 and the back surface metal electrode film 64 are processed (see FIG. 7F).

Also at this time, the end face of the optical fiber 25 is moved along the processing progress direction PD by the processing moving unit 35. As a result, the photoelectric conversion layer 63 and the back surface metal electrode film 64 are processed along the processing progress direction PD. , so that the photoelectric conversion layer 63 and the back metal electrode film 64 metals scribe line 64 _M is formed.

Incidentally, when this way photoelectric conversion layer 63 and the back metal electrode film 64 is processed along the processing direction of travel PD, in this embodiment, the same process as when forming the Si scribe line 63 _S is performed . In this respect, since the contents overlapped with the description of the time of forming the Si scribe lines 63 _S, described only below the main function and effect.

First, according to this embodiment, the previously Si scribe lines 63 formed _S or TCO scribe lines 62 _T as a reference, always it is possible to correct the position of the end faces of the optical fibers 25. For this reason, the metal scribe line 64 _M is also formed in close proximity to the entire area of the Si scribe line 63 _S even when the Si scribe line 63 _S or the TCO scribe line 62 _T is formed in a curved shape. Therefore, the area occupied by the integrated line 65 can be reduced. In addition, since the position of the end face of each optical fiber 25 can be always corrected in this way, it is possible to reduce the specifications regarding the temperature management of the surroundings and the accuracy of the processing apparatus.

Moreover, according to this Embodiment, each of the end surface of the some optical fiber 25 can be moved to the direction orthogonal to a process advancing direction based on the information from a detection part. Therefore, it is possible to keep a constant distance relative to a reference Si scribe line 63 _S form the Metals scribe line 64 _M to be processed several at the same time.

Further, as shown in FIG. 2, each of the actuators 10 is disposed at a position shifted from each other along the processing progress direction PD, and drives the end face of the optical fiber 25 in a direction orthogonal to the processing progress direction PD. which is configured as, even if the spacing Metals scribe line 64 _M to be formed is narrow, can be close to each other the end face of the optical fiber 25 in a direction perpendicular to the machining direction of travel PD.

  By the way, in the above, the imaging unit 41 is provided in the processing moving unit 35 so as to be arranged on one side along the processing progress direction PD with respect to the end face of the optical fiber 25, and the processing moving unit 35 is inverted by 180 °. Thus, the description has been made using the aspect in which the photographing unit 41 is always positioned on the front side in the processing progress direction PD with respect to the end face of the optical fiber 25.

  However, the present invention is not limited to this, and as shown in FIG. 6, the first imaging in which the imaging unit (data acquisition unit) 41 is located on one side of the end face of the optical fiber 25 along the processing progress direction PD. Using the aspect which has the part (1st data acquisition part) 41a and the 2nd imaging | photography part (2nd data acquisition part) 41b located in the other side along process progress direction PD with respect to the end surface of the optical fiber 25 Also good. According to such an aspect, the imaging unit 41 can always be positioned on the front side in the processing progress direction PD with respect to the end face of the optical fiber 25 without inverting the processing moving unit 35 by 180 °.

  Moreover, according to the aspect as shown in FIG. 6, the processing state of the line and the reference are set by the imaging unit (the first imaging unit 41 a or the second imaging unit 41 b) located on the rear side of the processing advance direction PD. The degree of proximity of the processed line to the line can always be confirmed. If the line is not sufficiently processed, only the corresponding part can be processed again with the laser beam L. For this reason, the to-be-processed substrate 60 can be processed more accurately.

  Moreover, in the above, it demonstrated using the imaging | photography part 41 which acquires the image of a thin film by imaging | photography a thin film as a data acquisition part (refer FIG. 4A). However, the present invention is not limited to this, and for example, a line sensor or a laser scan can be used as the data acquisition unit.

  In the above description, the actuator 10 is connected to each optical fiber 25 and each end face of the optical fiber 25 is moved in a direction orthogonal to the processing progress direction PD. However, the present invention is not limited to this. In addition, one of the plurality of optical fibers 25 is fixed without moving in the direction perpendicular to the processing progress direction PD with respect to the processing moving unit 35, and the optical fiber 25 fixed in this way A mode in which the optical fiber 25 is moved in a direction orthogonal to the processing progress direction PD may be used. In this case, the end face of the fixed optical fiber 25 is moved in a direction orthogonal to the processing progress direction PD by the movement of the processing moving unit 35.

  In FIG. 2, an optical fiber having a circular end surface is shown, but the present invention is not limited to this, and the end surface of the optical fiber 25 may be a rectangular shape. Thus, when using the optical fiber 25 which consists of a rectangular end surface, the linearity of the both edges of the scribe line formed in a thin film can be implement | achieved, and it is preferable.

  By the way, the imaging unit 41 which is a data acquisition unit of the present embodiment can also acquire information related to an obstacle D (see FIG. 4C) such as dust on the workpiece substrate 60. When the determination unit 43 determines that there is an obstacle D such as dust from the information from the imaging unit 41, the actuator 10 avoids the obstacle D based on the information acquired by the imaging unit 41. The end face of the corresponding optical fiber 25 is moved (see FIG. 4C).

  For this reason, it is possible to prevent the laser light L from being blocked by the obstacle D such as dust and the thin film from being processed. Moreover, since the end surface of the optical fiber 25 can be moved individually, the deviation from the place which should be processed originally among thin films can be suppressed to the minimum.

  In the above description, the laser scribing process is performed using the reciprocation of the processing moving unit 35. However, the present invention is not limited to this, and the laser scribing process may be performed in the same direction every time. In this case, it is not necessary to reverse the processing moving unit 35 by 180 °, and it is not necessary to use the two photographing units 41a and 41b.

Second Embodiment Next, a second embodiment of the present invention will be described. In the first embodiment, the detection unit detects the position of a TCO scribe line (processed line) 62 _T or a Si scribe line (processed line) 63 _S corresponding to the end face of each optical fiber 25, and the actuator 10 In this mode, the end face of each optical fiber 25 is moved based on the position of the processed line corresponding to the end face of the optical fiber 25. On the other hand, in the second embodiment, the detection unit detects the position of the processed line corresponding to one end face of the optical fiber 25, and the processed line where the actuator 10 detects the end face of each optical fiber 25. It is made to move based on the position information. Other configurations are substantially the same as those of the first embodiment.

In the case where it can be determined that the meandering state of the TCO scribe line 62 _T and the Si scribe line 63 _S due to the temperature change of the substrate 60 to be processed has the same tendency in the substrate 60 to be processed, as in the present embodiment. The actuator 10 may move the end face of each optical fiber 25 based on the positional information of the processed lines such as the TCO scribe line 62 _T and the Si scribe line 63 _S corresponding to one end face of the optical fiber 25.

According to such an aspect, since the information source used as a reference can be reduced, the end faces of the optical fibers 25 can be easily and quickly aligned. In addition, the range captured by the imaging unit 41 can be reduced, or the range scanned by a line sensor or laser scan can be shortened. As a result, a simple and inexpensive member can be used. Therefore, as described above, when it is possible to determine that the meandering state of the TCO scribe line 62 _T and the Si scribe line 63 _S has the same tendency in the substrate 60 to be processed, the aspect of the present embodiment can be used. preferable.

  By the way, in the above, the thin film is provided on the transparent electrode film 62 provided on the glass substrate 61, the photoelectric conversion layer 63 containing Si or the like provided on the transparent electrode film 62, and the photoelectric conversion layer 63. However, the present invention is not limited to this, and the thin film may be composed of two layers, or may be composed of four or more layers.

  In the above description, a plurality of laser oscillators 21 are used. However, the present invention is not limited to this. The laser light L emitted from one laser oscillator 21 is branched, and the branched laser lights L are separated from each other. An embodiment in which the light is irradiated from the end face through the optical fiber 25 may be employed.

1 Holding part 10 Fiber moving part (actuator)
21 Laser Oscillator 25 Optical Fiber 35 Processing Moving Unit 41 Imaging Unit (Data Acquisition Unit)
41a First imaging unit (first data acquisition unit)
41b Second imaging unit (second data acquisition unit)
42 Image processing unit (information processing unit)
43 Judgment Unit 60 Substrate 61 Glass Substrate (Substrate)
62 Transparent electrode film (thin film)
62 _T TCO scribe line (processed line)
63 Photoelectric conversion layer (thin film)
63 _S Si scribe line (processed line)
64 Back side metal electrode film (thin film)
64 _M metal scribe line (processed line)
L Laser light

Claims (7)

In a laser processing apparatus for processing a substrate to be used for a solar cell having a substrate and a thin film disposed on the substrate,
A holding unit for holding the substrate to be processed;
A laser oscillator that oscillates laser light;
A plurality of optical fibers for guiding laser light oscillated from the laser oscillator and irradiating the laser light to the outside from an end face;
A processing moving unit that moves at least one of the holding unit and the end face of the optical fiber along a processing progress direction; and
A detection unit for detecting position information about the thin film;
A fiber moving unit that is coupled to at least one of the plurality of optical fibers and moves an end face of the optical fiber in a direction including a component orthogonal to the processing progress direction based on information from the detection unit;
With
Based on information from the detection unit, the fiber moving portion, so that while maintaining its distance from the previously processed processed line as a reference to form a scribe line to be processed more simultaneously, the laser beam The laser processing apparatus characterized by moving the end surface of the optical fiber which is irradiating the optical fiber . The position information is obtained based on already processed lines,
The detection unit detects the position of the processed line corresponding to the end face of each optical fiber,
The laser processing apparatus according to claim 1, wherein the fiber moving unit moves the end face of each optical fiber based on the position of the processed line corresponding to the end face of the optical fiber. The position information is obtained based on already processed lines,
The detection unit detects a position of a processed line corresponding to at least one end face of the optical fiber,
The laser processing apparatus according to claim 1, wherein the fiber moving unit moves an end face of each optical fiber based on position information of the processed line. The detection unit has a data acquisition unit that acquires position information about the thin film;
The data acquisition unit includes a first data acquisition unit positioned on one side along the processing progress direction with respect to the end surface of the optical fiber, and the other side along the processing progress direction with respect to the end surface of the optical fiber. The laser processing apparatus according to claim 1, further comprising a second data acquisition unit located in The detection unit has a data acquisition unit that acquires position information about the thin film;
The data acquisition unit is disposed on one side along the processing direction with respect to the end face of the optical fiber,
The laser processing apparatus according to claim 1, wherein a positional relationship between the data acquisition unit and the end face of the optical fiber is reversible.   The detection unit is based on a data acquisition unit that acquires position information about the thin film, an information processing unit that processes information about the thin film acquired by the data acquisition unit, and information processed by the information processing unit The laser processing apparatus according to claim 1, further comprising: a determination unit that determines a position of the end face of the optical fiber with respect to the thin film. In a laser processing apparatus for processing a substrate to be used for a solar cell having a substrate and a thin film disposed on the substrate,
A holding unit for holding the substrate to be processed;
A laser oscillator that oscillates laser light;
A plurality of optical fibers for guiding laser light oscillated from the laser oscillator and irradiating the laser light to the outside from an end face;
A processing moving unit that moves at least one of the holding unit and the end face of the optical fiber along a processing progress direction; and
A detection unit for detecting position information about the thin film;
A fiber moving unit that is coupled to at least one of the plurality of optical fibers and moves an end face of the optical fiber in a direction including a component orthogonal to the processing progress direction based on information from the detection unit;
With
The detection unit also detects information about obstacles on the substrate to be processed,
The laser processing apparatus, wherein the fiber moving unit moves an end face of the optical fiber so as to avoid the obstacle based on information detected by the detecting unit.

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