JP5672686B2 - Infrared temperature sensor - Google Patents

Description

  The present invention relates to an infrared temperature sensor for non-contact measurement of a temperature of a heat source.

  As a temperature sensor for measuring the temperature of the heat source in a non-contact manner, for example, an infrared temperature sensor disclosed in Japanese Patent Laid-Open No. 2003-194630 is known. The infrared temperature sensor detects an increase in the temperature of an infrared absorption film that absorbs infrared rays radiated from a heat source by means of an infrared detection thermal element, and measures the temperature of the heat source based on the amount of heat of the emitted infrared rays. The infrared detection thermal element has a temperature characteristic in which the electrical characteristics change according to the amount of heat received, not only by the amount of infrared heat absorbed by the infrared absorption film, but also by the amount of heat given to the infrared detection thermal element by the external environment. Its electrical characteristics change. For this reason, the infrared temperature sensor includes a temperature compensating thermosensitive element for detecting the amount of heat flowing in and out between the external environment and the infrared detecting thermosensitive element and correcting the measurement result of the infrared detecting thermosensitive element.

JP 2003-194630 A

  In the infrared temperature sensor disclosed in this publication, screw holes for screwing screws for fixing the infrared temperature sensor to a predetermined mounting surface are thermally conductive to the infrared detecting thermal element and the temperature compensating thermal element, respectively. Are provided at asymmetric positions. Since heat flows in and out between the infrared sensor and the external environment through the screw holes, the screw is located at a position thermally asymmetric with respect to each of the infrared detecting thermal element and the temperature compensating thermal element. When the hole is formed, an unbalanced heat distribution is generated in the sensor body starting from the screw hole, and the temperature distribution of the infrared detecting thermal element and the temperature compensating thermal element may be non-uniform. Under such a non-uniform temperature distribution environment, the temperature-compensating thermosensitive element cannot accurately measure the amount of heat that the external environment gives to the infrared detecting thermosensitive element, and may cause a temperature compensation error. .

  In addition, in the infrared temperature sensor disclosed in the publication, since the infrared detecting thermal element and the temperature compensating thermal element share the same space, the heat radiation from the infrared detecting thermal element that has generated heat is reduced. May receive heat, and accurate temperature compensation may not be possible.

  In view of the above problems, an object of the present invention is to provide an infrared temperature sensor capable of realizing accurate temperature compensation.

  In order to solve the above-mentioned problems, an infrared temperature sensor according to the present invention is an infrared temperature sensor that measures the temperature of a heat source in a non-contact manner, and an infrared detection thermal element that detects the amount of infrared radiation emitted from the heat source; A thermosensitive element for temperature compensation that detects the amount of heat from the external environment, and a heat inflow / outflow part where heat flows in / out between the external environment and the infrared temperature sensor, and the infrared detecting thermosensitive element and temperature from the heat inflow / outflow part The heat conduction to the compensating thermosensitive element is configured to be substantially uniform.

  In this way, by designing the heat conduction from the heat inflow / outflow site to the infrared detecting thermosensitive element and the temperature compensating thermosensitive element substantially uniformly, the heat distribution from the heat inflow / outflow site to the sensor body becomes uniform, and infrared detection is performed. It is possible to equalize the amount of heat exchanged between the thermosensitive element for temperature and the thermosensitive element for temperature compensation with the external environment. This makes it possible to consider that the amount of heat exchanged between the temperature compensation thermal element and the external environment is substantially the same as the amount of heat exchanged between the infrared detection thermal element and the external environment. Temperature compensation can be realized.

  In the present invention, a structure in which the heat inflow / outflow site is located between the infrared detecting thermal element and the temperature compensating thermal element is preferable. Such a structure is not only a structure in which the heat inflow / outflow site is located on the line connecting the infrared detecting thermal element and the temperature compensating thermal element, but also perpendicular to the line connecting the infrared detecting thermal element and the temperature compensating thermal element. The projection point when the heat inflow / outflow portion is projected onto the sensor includes a structure in which the projection point is located between the infrared detecting thermal element and the temperature compensating thermal element.

  It is preferable that the infrared detecting thermal element and the temperature compensating thermal element are arranged symmetrically with respect to the heat inflow / outflow part. According to such an arrangement, the heat conduction from the heat inflow / outflow site to the infrared detecting thermal element and the temperature compensating thermal element can be made substantially uniform.

  The infrared temperature sensor may include a plurality of heat inflow / outflow portions where heat flows in / out between the external environment and the infrared temperature sensor. The heat inflow / outflow site may be a fixing means for fixing the infrared temperature sensor to the mounting surface. In this case, the heat inflow / outflow portion allows heat to flow in / out between the infrared temperature sensor and the mounting surface. The heat inflow / outflow portion may include a convex portion for making point contact with the attachment surface. Since the contact location between the sensor body and the mounting surface is limited to only the convex portion, the sensor body has an advantage that it is not affected by the temperature distribution of the mounting surface.

  The infrared temperature sensor further includes a first recess for accommodating the infrared detecting thermal element and a second recess for accommodating the temperature compensating thermal element, and the first and second recesses are separated from each other. An independent space may be formed. According to such a configuration, it is possible to prevent the temperature-compensating thermal element from being affected by the heat radiation from the infrared-sensitive thermal element that has generated heat due to the reception of the radiated infrared radiation.

  ADVANTAGE OF THE INVENTION According to this invention, the infrared temperature sensor which can implement | achieve exact temperature compensation can be provided.

FIG. 3 is an explanatory diagram showing a structure of an infrared temperature sensor according to Example 1. 3 is an explanatory diagram of an infrared absorption film according to Example 1. FIG. FIG. 3 is a partial cross-sectional view illustrating a mounting cross-sectional structure of the infrared temperature sensor according to the first embodiment. 1 is a circuit diagram of a temperature detection circuit according to Embodiment 1. FIG. 3 is an explanatory diagram of an infrared absorption film according to Example 1. FIG. It is explanatory drawing which shows the structure of the infrared temperature sensor concerning Example 2. FIG. It is a partial cross section figure which shows the attachment cross-section of the infrared temperature sensor concerning Example 2. FIG. It is explanatory drawing which shows the structure of the infrared temperature sensor concerning Example 3. FIG. It is explanatory drawing which shows the structure of the infrared temperature sensor concerning Example 4. FIG. It is explanatory drawing which shows the structure of the infrared temperature sensor concerning Example 5. FIG. It is explanatory drawing which shows the structure of the infrared temperature sensor concerning Example 6. FIG. It is explanatory drawing which shows the structure of the infrared temperature sensor concerning Example 7. FIG. FIG. 10 is an explanatory diagram illustrating a structure of an infrared temperature sensor according to an eighth embodiment. It is explanatory drawing which shows the structure of the infrared temperature sensor concerning Example 9. FIG. It is explanatory drawing which shows the structure of the infrared temperature sensor concerning Example 10. FIG. It is explanatory drawing which shows the structure of the infrared temperature sensor concerning Example 11. FIG.

  Embodiments according to the present invention will be described below with reference to the drawings. About the same member, the same code | symbol shall be attached | subjected and the overlapping description is abbreviate | omitted. The drawings are schematic, and for convenience of explanation, the relationship between the thickness and the planar dimension and the ratio of the thickness between members are different from the actual sensor structure.

  The structure of the infrared temperature sensor 101 according to the first embodiment will be described with reference to FIGS. 1 to 5. 1A is a top view of the infrared temperature sensor 101 according to this embodiment, FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A, and FIG. 2, FIG. 2 is an explanatory diagram of the infrared absorption films 41 and 42, FIG. 3 is a partial cross-sectional view showing a mounting cross-sectional structure of the infrared temperature sensor 101, FIG. 4 is a circuit diagram of the temperature detection circuit 70, and FIG. 43 is an explanatory diagram of 43. FIG.

  As shown in FIG. 1, two bottomed recesses 21 and 22 are formed in the sensor body 20 of the infrared temperature sensor 101. The bottomed recess 21 has an opening 21a exposed to the external environment where the heat source exists, an infrared absorbing film 41 that generates heat by absorbing radiant infrared rays, and a guide that guides the radiated infrared rays from the heat source to the infrared absorbing film 41. An optical part 21b is formed. The surface of the infrared absorbing film 41 is exposed to the external environment, and the infrared detecting heat sensitive element 51 for detecting the amount of heat of the radiated infrared is fixed to the back surface of the infrared absorbing film 41. The infrared detecting thermal element 51 exists in a space 21 c between the back surface of the infrared absorption film 41 and the bottom surface of the bottomed recess 21. The bottomed recess 22 is formed with an opening 22a that is exposed to the external environment where the heat source exists, an infrared absorption film 42, and a light shielding plate 23 that shields the infrared absorption film 42 from radiation infrared rays from the heat source. The surface of the infrared absorption film 42 faces the light shielding plate 23 and is not exposed to the external environment. A temperature-compensating thermal element 52 that detects the amount of heat transferred from the external environment via the heat transfer path of the sensor body 20 is fixed to the back surface of the infrared absorption film 42. The temperature compensating thermosensitive element 52 exists in a space 22 c between the back surface of the infrared absorption film 42 and the bottom surface of the bottomed recess 22.

  As shown in FIG. 2, lead patterns 61 and connection terminals 85 for connecting the infrared detecting thermal element 51 and the temperature detection circuit 70 are formed on the back surface of the infrared absorption film 41. Similarly, a lead pattern 62 and a connection terminal 85 for connecting the temperature compensating thermal element 52 and the temperature detection circuit 70 are formed on the back surface of the infrared absorption film 42. The material of the infrared absorption films 41 and 42 may be any material that generates heat by absorbing radiant infrared rays from a heat source, and is not particularly limited, but has a wavelength of 4 μm to 10 μm called far infrared rays. A material having an absorption spectrum for light is desirable. For example, a resin made of a polymer material such as fluorine, silicone, polyester, polyimide, polyethylene, polycarbonate, or PPS (polyphenylene sulfide) is preferable. In addition, the infrared detecting thermal element 51 and the temperature compensating thermal element 52 are not particularly limited as long as they are electronic elements whose electrical characteristics change according to the amount of heat received. A thermistor, a thermopile, a metal thermometer or the like is suitable. In addition, the material of the sensor body 20 is preferably a material having a high thermal conductivity and a large heat capacity, for example, aluminum.

  As shown in FIG. 3, a screw hole 30 for screwing a screw 100 for fixing the sensor body 20 to the mounting surface 90 is formed between the two bottomed recesses 21 and 22 from the top surface to the bottom surface of the sensor body 20. This screw hole 30 functions as a fixing means for fixing the sensor body 20 to the mounting surface 90. Since heat flows in and out only through the screw hole 30 between the external environment and the sensor body 20, the screw hole 30 also functions as a heat inflow and outflow portion, and heat inflow and outflow through a portion other than the screw hole 30. Is not done. For this reason, the screw hole 30 functions as a reference point of the temperature distribution of the sensor body 20 (hereinafter referred to as a thermal reference point).

  The shape and material of each part of the infrared temperature sensor 101 are designed so that the heat conduction from the thermal reference point to the infrared detecting thermal element 51 and the temperature compensating thermal element 52 is substantially uniform. Specifically, the positions, shapes, and sizes of the two bottomed recesses 21 and 22 are centered on the thermal reference point so that they are both thermally conductively symmetric (for example, geometrically point-symmetric). Designed. Further, the mounting positions of the infrared detecting thermal element 51 and the temperature compensating thermal element 52 are designed to be thermally conductively symmetrical (for example, geometrically point symmetrical) around the thermal reference point. In addition, the positions, shapes, and sizes of the infrared absorption films 41 and 42 are designed to be thermally conductively symmetric (for example, geometrically point-symmetric) with respect to the thermal reference point. Further, the positions and shapes of the lead patterns 61 and 62 with respect to the thermal reference point are designed to be thermally conductively symmetric (for example, geometrically point-symmetric). The infrared absorbing films 41 and 42 are selected from the same material. Moreover, it is preferable that the temperature characteristics (for example, resistance temperature characteristics) of the infrared detecting thermal element 51 and the temperature compensating thermal element 52 are the same. Note that “thermally symmetric” is not intended for geometric symmetry, but means the symmetry of the heat transfer path taking into account the thermal resistance from the thermal reference point.

  As described above, the heat distribution from the thermal reference point to the infrared detecting thermal element 51 and the temperature compensating thermal element 52 is designed to be substantially uniform, so that the heat distribution from the thermal reference point to the sensor body 20 becomes uniform. The amount of heat exchanged between the infrared detecting thermal element 51 and the temperature compensating thermal element 52 with the external environment can be equalized. This makes it possible to consider that the amount of heat exchanged between the temperature compensation thermal element 52 and the external environment is substantially the same as the amount of heat exchanged between the infrared detection thermal element 51 and the external environment. Accurate temperature compensation can be realized.

  Even if the entire bottom surface of the sensor body 20 is in close contact with the mounting surface 90, the thermal resistance of the screw 100 is relatively smaller than the thermal resistance of the bottom surface of the sensor body 20. It should be noted that the heat inflow and outflow occurs through the screw holes 30.

  As shown in FIG. 4, the temperature detection circuit 70 includes a bridge circuit 73 and a memory circuit 79 as main components. The bridge circuit 73 includes a first half bridge circuit in which a resistor 71 and an infrared detection thermal element 51 are connected in series, and a second half bridge in which a resistor 72 and a temperature compensation thermal element 52 are connected in series. And a circuit configuration in which the first and second half-bridge circuits are connected in parallel. The connection point of the resistors 71 and 72 is connected to the power source 74, while the connection point of the infrared detecting thermal element 51 and the temperature compensating thermal element 52 is connected to the ground. Changes in the respective electrical resistances of the infrared detecting thermal element 51 and the temperature compensating thermal element 52 accompanying the temperature change appear as changes in the respective output voltages. The differential amplifier 81 differentially amplifies the output voltage of the infrared detecting thermal element 51 and the output voltage of the temperature compensating thermal element 52. The differential output signal of the differential amplifier 81 is converted into digital data 80 by the A / D converter 76. Further, the output voltage of the temperature compensating thermal element 52 is amplified by an amplifier 77 and converted into digital data 81 by an A / D converter 78. The memory circuit 79 stores a data table in which the combination of the digital data 80 and 81 is associated with the temperature of the heat source, and outputs the temperature 82 of the heat source corresponding to the combination of the digital data 80 and 81.

  In the above description, an example in which two separated infrared absorption films 41 and 42 are used has been described. However, as shown in FIG. 5, a single infrared absorption film 43 may be used. Thereby, manufacturing cost can be reduced.

  According to this embodiment, since the heat conduction from the thermal reference point to the infrared detecting thermal element 51 and the temperature compensating thermal element 52 is designed to be substantially uniform, accurate temperature compensation can be realized. In addition, since the infrared detecting thermal element 51 and the temperature compensating thermal element 52 exist in independent spaces 21c and 22c, which are separated from each other in terms of heat conduction, the infrared detecting thermal element 51 generates heat from the received infrared radiation. It is possible to prevent the temperature compensating thermosensitive element 52 from being affected by heat radiation.

  Next, the structure of the infrared temperature sensor 102 according to the second embodiment will be described with reference to FIGS. 6A is a top view of the infrared temperature sensor 102 according to this embodiment, FIG. 6B is a cross-sectional view taken along the line AA of FIG. 6A, and FIG. 6C is a bottom surface of the infrared temperature sensor 102. 7 and 7 are partial cross-sectional views showing the mounting cross-sectional structure of the infrared temperature sensor 102. FIG.

  The infrared temperature sensor 102 is different from the infrared temperature sensor 101 according to the first embodiment in that the peripheral portion of the screw hole 30 that opens on the bottom surface of the sensor body 20 includes a convex portion 24 that protrudes in a convex shape in cross section. In common. Since the contact portion between the sensor main body 20 and the mounting surface 90 is limited only to the convex portion 24, the sensor main body 20 is not affected by the temperature distribution of the mounting surface 90. Since heat flows in and out between the sensor body 20 and the external environment through the convex portion 24 and the screw hole 30, the convex portion 24 and the screw hole 30 function as a heat reference point. The cross-sectional shape when the convex portion 24 is cut along a plane parallel to the bottom surface of the sensor main body 20 is preferably a point-symmetrical shape (for example, circular) in terms of heat conduction with respect to the opening center of the screw hole 30. According to the present embodiment, it is possible to design the heat conduction from the thermal reference point to the infrared detecting thermal element 51 and the temperature compensating thermal element 52 more uniformly.

  Next, the structure of the infrared temperature sensor 103 according to the third embodiment will be described with reference to FIG. FIG. 8A is a bottom view of the infrared temperature sensor 103 according to the present embodiment, and FIGS. 8B and 8C are partial cross-sectional views showing a mounting cross-sectional structure of the infrared temperature sensor 103.

  The infrared temperature sensor 103 is different from the infrared temperature sensor 102 according to the second embodiment in that it includes a concave portion 25 that engages with the convex portion 91 of the mounting surface 90, and is common in other points. If the sensor main body 20 and the mounting surface 90 are brought into contact at one point via the convex portion 24, the sensor main body 20 rotates around the axis of the screw 100, and stable fixing may not be realized. As in the example, since the rotation of the sensor body 20 around the axis of the screw 100 can be restricted by engaging the recess 25 and the protrusion 91, the sensor body 20 can be stably fixed to the mounting surface 90. Since the concave portion 25 also transfers heat to and from the mounting surface 90 via the convex portion 91, the concave portion 25 is orthogonal to the line segment connecting the central point of the infrared detecting thermal element 51 and the central point of the temperature compensating thermal element 52. It is preferable to form a recess 25 on the straight line, and to design heat conduction from the recess 25 as a thermal reference point to the infrared detecting thermal element 51 and the temperature compensating thermal element 52 substantially uniformly.

  As shown in FIG. 8C, a convex portion 26 that engages with the concave portion 92 of the attachment surface 90 may be formed on the bottom surface of the sensor body 20. Since the convex portion 26 also transfers heat to and from the mounting surface 90 via the concave portion 92, the convex portion 26 is orthogonal to the line segment connecting the central point of the infrared detecting thermal element 51 and the central point of the temperature compensating thermal element 52. It is preferable to form the convex part 26 on the straight line.

  Next, the structure of the infrared temperature sensor 104 according to the fourth embodiment will be described with reference to FIG. 9A is a top view of the infrared temperature sensor 104 according to this embodiment, FIG. 9B is a cross-sectional view taken along line AA of FIG. 9A, and FIG. 9C is a bottom surface of the infrared temperature sensor 104. FIG.

  The infrared temperature sensor 104 is different from the infrared temperature sensor 101 according to the first embodiment in that it includes two screw holes 31 and 32 that function as thermal reference points, and is common in other points. In this embodiment, it is preferable to design the heat conduction from the screw holes 31 and 32 to the infrared detecting thermal element 51 and the temperature compensating thermal element 52 substantially uniformly. Specifically, a line segment passing through the two screw holes 31 and 32 and a line segment passing through the center point of the infrared detecting thermal element 51 and the center point of the temperature compensating thermal element 52 are orthogonal at the respective midpoints. The screw holes 31 and 32 are preferably formed as described above. According to the present embodiment, stable fixing can be realized by screwing the screw 100 into the respective screw holes 31 and 32 and fixing the sensor main body 20 to the mounting surface 90.

  Next, the structure of the infrared temperature sensor 105 according to the fifth embodiment will be described with reference to FIG. FIG. 10A is a top view of the infrared temperature sensor 105 according to this embodiment, and FIG. 10B is a cross-sectional view taken along the line AA of FIG.

  The infrared temperature sensor 105 is different from the infrared temperature sensor 102 according to the second embodiment in that it includes a spacer 27 as a means for bringing the attachment surface 90 and the sensor body 20 into point contact, and is common in other points. The spacer 27 is a component having a hole for inserting the screw 100 (for example, a component separate from the sensor body 20 such as a washer).

  Next, the structure of the infrared temperature sensor 106 according to the sixth embodiment will be described with reference to FIG. 11A is a top view of the infrared temperature sensor 106 according to the present embodiment, and FIG. 11B is a cross-sectional view taken along the line AA of FIG. 11A.

  The infrared temperature sensor 106 is different from the infrared temperature sensor 101 according to the first embodiment in that the peripheral portion of the screw hole 30 that opens on the upper surface of the sensor body 20 includes a convex portion 24 that protrudes into a convex cross section. In common. The attachment surface 90 includes a first main surface 90A that faces the heat source and a second main surface 90B that is the back surface thereof. An opening 94 for guiding infrared rays from the heat source to the bottomed recess 21 is formed in the attachment surface 90. When the screw 100 is screwed into the screw hole 30 and the sensor body 20 is fixed to the second main surface 90B, the convex portion 24 and the second main surface 90B are configured to be in point contact. The convex portion 24 functions as a heat reference point where heat is exchanged between the mounting surface 90 and the sensor body 20.

  Next, the structure of the infrared temperature sensor 107 according to the seventh embodiment will be described with reference to FIG. 12A is a bottom view of the infrared temperature sensor 107 according to this embodiment, FIG. 12B is a side view of the infrared temperature sensor 107, and FIG. FIG.

  The infrared degree sensor 107 is different from the infrared temperature sensor 102 according to the second embodiment in that it includes two screw holes 30 and 33 whose opening directions are orthogonal to each other, and is common in other points. The sensor body has a screw hole 30 through which a screw 100 for fixing the sensor body 20 to the mounting surface 90 is screwed from the upper surface to the bottom surface of the sensor body 20. A screw hole 33 for screwing the screw 100 for fixing penetrates from the right side surface of the sensor body 20 to the left side surface. FIG. 12C shows a state in which the sensor body 20 is fixed to the mounting surface 90 by screwing the screw 100 into the screw hole 33. According to the present embodiment, since the sensor body 20 can be fixed to the mounting surface 90 using either one of the two screw holes 30 and 33 whose opening directions are orthogonal to each other, a flexible mounting structure can be provided. .

  Next, the structure of the infrared temperature sensor 108 according to the eighth embodiment will be described with reference to FIG. FIG. 13A is a top view of the infrared temperature sensor 108 according to this embodiment, and FIG. 13B is a cross-sectional view taken along line AA of FIG.

  The infrared temperature sensor 108 is different from the infrared temperature sensor 101 according to the first embodiment in that the peripheral portion of the screw hole 30 opened on the bottom surface of the sensor body 20 is provided with a recess 28 that is recessed in a cross-sectional shape. Common. The mounting surface 90 has a hole through which the screw 100 is inserted and protrudes a convex portion 95 that engages with the concave portion 28, and the screw hole 30 with the concave portion 28 and the convex portion 95 engaged with each other. The sensor body 20 is fixed to the mounting surface 90 by screwing the screw 100 into the mounting surface 90. Since the flow of heat between the sensor body 20 and the external environment is performed through the recess 28 and the screw hole 30, the recess 28 and the screw hole 30 function as a heat reference point. When the concave portion 28 is cut along a plane parallel to the bottom surface of the sensor body 20, the cross-sectional shape is polygonal, so that when the sensor body 20 is fixed using the screw 100, the sensor body around the axis of the screw 100. 20 rotations can be suppressed. In particular, if the cross-sectional shape when the recess 28 is cut along a plane parallel to the bottom surface of the sensor body 20 is a polygon that is point-symmetric with respect to the center point of the screw hole 30, the infrared sensitive thermal element 51 from the thermal reference point and This is effective in making the heat conduction to the temperature compensating thermal element 52 substantially uniform.

  Next, the structure of the infrared temperature sensor 109 according to the ninth embodiment will be described with reference to FIG. FIG. 14 is a partial cross-sectional view showing a mounting cross-sectional structure of the infrared temperature sensor 109 according to the present embodiment. In the infrared temperature sensor 109, screw holes 34 and 35 for screwing a screw 100 for fixing the sensor body 20 to the mounting surface 90 do not penetrate the sensor body 20, but on the upper surface and the bottom surface of the sensor body 20. The infrared temperature sensor 106 according to the sixth embodiment is different from the infrared temperature sensor 106 according to the sixth embodiment in that each has a concave shape, and the other points are common.

  Next, the structure of the infrared temperature sensor 110 according to the tenth embodiment will be described with reference to FIG. FIG. 15 is a partial cross-sectional view showing a mounting cross-sectional structure of the infrared temperature sensor 110 according to the present embodiment. The infrared temperature sensor 110 is different from the infrared temperature sensor 101 according to the first embodiment in that the screw 100 is fixed to the sensor body 20 in advance, and is common in other points. According to the present embodiment, the sensor body 20 can be fixed to the mounting surface 90 by inserting the screw 100 through the screw hole 96 opened in the mounting surface 90 and screwing the nut 120 into the screw 100.

  Next, the structure of the infrared temperature sensor 111 according to the eleventh embodiment will be described with reference to FIG. FIG. 16 is a partial cross-sectional view showing a mounting cross-sectional structure of the infrared temperature sensor 111 according to the present embodiment. The infrared temperature sensor 111 is different from the infrared temperature sensor 101 according to the first embodiment in that the clip 130 is fixed to the sensor body 20 in advance, and is common in other points. According to the present embodiment, the sensor main body 20 can be fixed to the mounting surface 90 by inserting the clip 130 into the hole 97 opened in the mounting surface 90.

  The infrared temperature sensor according to the present invention can be used for non-contact measurement of the temperature of a heat source.

DESCRIPTION OF SYMBOLS 100 ... Screw 101-111 ... Infrared temperature sensor 20 ... Sensor main body 21,22 ... Bottomed recessed part 30 ... Screw hole 41, 42 ... Infrared absorption film 51 ... Infrared detection thermal element 52 ... Temperature compensation thermal element

Claims (5)

An infrared temperature sensor for non-contact measurement of the temperature of the heat source,
A thermosensitive element for detecting infrared rays for detecting the amount of infrared rays emitted from the heat source; and
A temperature-compensating thermal element that detects the amount of heat from the external environment;
A heat inflow / outflow region where heat flows in / out between the external environment and the infrared temperature sensor,
Each of the heat conduction from the heat inflow and outflow region to the infrared detecting thermal sensitive element and the temperature compensating thermal sensitive element is configured so as to be substantially equal,
The heat inflow / outflow part is an infrared temperature sensor which is a fixing means for fixing the infrared temperature sensor to a mounting surface . The infrared temperature sensor according to claim 1,
An infrared temperature sensor in which the infrared detecting thermal element and the temperature compensating thermal element are arranged symmetrically with respect to the heat inflow / outflow site. The infrared temperature sensor according to claim 1,
An infrared temperature sensor comprising a plurality of heat inflow / outflow portions where heat flows in / out between the external environment and the infrared temperature sensor. The infrared temperature sensor according to claim 1 ,
The heat inflow / outflow portion is an infrared temperature sensor including a convex portion for making point contact with the mounting surface. The infrared temperature sensor according to any one of claims 1 to 4 ,
A first recess housing the infrared detecting thermal element;
A second recess for accommodating the temperature-compensating thermosensitive element, and
The first and second recesses are infrared temperature sensors that form separate and independent spaces.

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