JP5674201B2 - Substrate manufacturing method, mask blank manufacturing method, transfer mask manufacturing method, and correction carrier - Google Patents

Description

  The present invention relates to a substrate manufacturing method, a mask blank manufacturing method, a transfer mask manufacturing method, a correction carrier, and the like.

The shape accuracy (flatness) required for a mask blank substrate has become severe due to the recent increase in density and accuracy of VLSI devices, and an ultrahigh flatness mask blank substrate is required.
Conventionally, in a grinding process for a mask blank glass substrate, a glass substrate held by a carrier is sandwiched between two cast iron surface plates each having a lattice-like groove on the surface at a predetermined pressure, and a grinding liquid containing free abrasive grains ( While the slurry is supplied between the glass substrate and the surface plate, the glass substrate is caused to undergo planetary movement on the surface plate, whereby grinding (lapping) of both main surfaces of the substrate is performed. However, the flatness of the surface plate surface deteriorates as the number of processing batches increases due to the fact that the surface of the surface plate itself can be cut during grinding. For this reason, every time a predetermined number of batches are processed, the correction carrier (correction member is made of cast iron), which is a correction carrier, is used as a planet on the surface plate in the same manner as in the grinding process. The flatness of the surface plate is corrected by moving it.
On the other hand, in the grinding process of the glass substrate for magnetic disks, in recent years, a double-side grinding apparatus in which fixed abrasive grains containing diamond particles are arranged on the grinding surface of a surface plate has been used. Even when using a surface plate in which fixed abrasive grains containing diamond particles are arranged on the grinding surface, the flatness of the fixed abrasive particles (grind surface) of the surface plate due to an increase in the number of processing batches is unavoidable. For each number, the flatness of the surface plate surface is corrected by using a correction carrier and sequentially using metal and glass as correction members (Patent Document 1).

JP 2008-254166 A

In recent years, the use of a double-sided grinding apparatus in which fixed abrasive grains containing diamond particles are arranged on the grinding surface of a surface plate has also been studied in the grinding process of the mask blank substrate.
The present invention provides a substrate that is suitable for use in a grinding process of a glass substrate such as a mask blank substrate, when using a grinding apparatus in which fixed abrasive grains such as fixed abrasive grains including diamond particles are arranged on a grinding surface of a surface plate. The purpose is to provide manufacturing methods.

As a result of intensive studies, the present inventors have found the following.
As disclosed in Patent Document 1, in consideration of problems such as rotational friction force, the correction carrier has a configuration in which the correction member is arranged only on the outer peripheral side of the correction carrier main body (for example, in the ring-shaped correction carrier main body). In general, a plurality of correction members are arranged.
However, if the overhang amount is excessively large, the correction member is disposed only on the outer peripheral side of the carrier, or the fixed abrasive (grinding surface) is corrected by causing the correction carrier to perform a planetary motion. It has been found that problems arise. If the overhang is excessively large, the correction member once protrudes outside the outer peripheral edge of the fixed abrasive (grinding surface) of the surface plate, and then again, the fixed abrasive (grinding of the surface plate from the outer peripheral edge side). It starts to draw a trajectory that enters toward the surface. As the correction member enters from the outer peripheral end side toward the fixed abrasive (grinding surface) of the surface plate, the fixed abrasive (grinding surface) on the outer peripheral end side is scraped more than necessary. The present inventor has found that there are cases where the accuracy of correction of the flatness of the fixed abrasive grains (grinding surface) of the surface plate may be hindered. Once the correction member has jumped out of the inner peripheral edge of the fixed abrasive (grinding surface) of the surface plate, it enters the fixed abrasive (grinding surface) of the surface plate again from the inner peripheral edge. The same applies when drawing a trajectory.
Furthermore, in an arbitrary radial direction on the surface plate, the outer peripheral end portion of the correction member of the correction carrier is positioned on the outer peripheral side of the outer peripheral end portion of the fixed abrasive (grinding surface) of the surface plate, and the correction member of the correction carrier The correction member overhangs on the outer peripheral side of the surface plate so that the inner peripheral end portion is on the inner peripheral side with respect to the outer peripheral end portion of the fixed abrasive (grinding surface) of the surface plate, and the correction member of the correction carrier The outer peripheral end is on the inner peripheral side of the inner peripheral end of the fixed abrasive (grinding surface) of the surface plate, and the inner peripheral end of the correction member of the correction carrier is the fixed abrasive (grinding surface) of the surface plate. By correcting the flatness of the fixed abrasive grains (grinding surface) of the surface plate by overhanging the correction member on the inner periphery side of the surface plate so as to be on the outer peripheral side of the inner peripheral end, the surface plate The accuracy of the flatness correction of fixed abrasive grains (grinding surfaces) can be improved beyond the required value. Who was found.
The same applies to the case where fixed abrasive grains including diamond particles are arranged on a surface plate, and the case where the same action (for example, grinding action) is exhibited.

The present invention has the following configuration.
(Configuration 1)
A substrate manufacturing method comprising a grinding step of grinding a main surface of a glass substrate using a grinding apparatus having a surface plate in which fixed abrasive grains are arranged on a grinding surface,
While correcting the correction carrier having a main body portion and a correction member arranged along the outer peripheral side of the main body portion while rotating on the surface plate, the correction member of the correction carrier and the grinding surface of the surface plate Having a correction step of correcting the surface of the surface plate by pressing and sliding each other;
In the correcting step, the outer peripheral end portion of the correction member is positioned on the outer peripheral side of the outer peripheral end portion of the fixed abrasive, and the inner peripheral end portion of the correction member is inner peripheral than the outer peripheral end portion of the fixed abrasive. Overhang the correction member on the outer peripheral side of the surface plate so as to be on the side, and
The outer peripheral end of the correction member is on the inner peripheral side of the inner peripheral end of the fixed abrasive, and the inner peripheral end of the correction member is on the outer peripheral side of the inner peripheral end of the fixed abrasive. As described above, the correction member is caused to overhang on the inner peripheral side of the surface plate.
(Configuration 2)
2. The substrate manufacturing method according to Configuration 1, wherein the surface plate is provided with fixed abrasive grains including diamond particles on a grinding surface.
(Configuration 3)
The method for manufacturing a substrate according to Configuration 1 or 2, wherein the correction member is configured by disposing fixed abrasive grains including diamond particles.
(Configuration 4)
Any one of the configurations 1 to 3, wherein the correction step is performed by pressing and sliding the correction member and the grinding surface of the surface plate while supplying a grinding liquid containing loose abrasive grains. A method for manufacturing the substrate according to claim 1.
(Configuration 5)
5. The method of manufacturing a substrate according to any one of configurations 1 to 4, wherein the correcting step is performed subsequent to a fixed abrasive grain arranging step of arranging fixed abrasive grains on a ground surface of a surface plate.
(Configuration 6)
5. The substrate according to claim 1, wherein the correcting step is performed after a grinding step of grinding a main surface of the glass substrate using a surface plate in which fixed abrasive grains are arranged on a grinding surface. Production method.
(Configuration 7)
The correction carrier is provided with an outer gear on the outer periphery of the main body, and the correction gear on the surface plate is formed by engaging the outer gear with both gears between the sun gear and the internal gear of the grinding device. The method for manufacturing a substrate according to any one of Structures 1 to 6, wherein the carrier is revolved while rotating.
(Configuration 8)
The grinding device is arranged such that two surface plates are opposed to each other,
The correction carrier has two correction surfaces facing the main body, and a correction member is disposed along the outer peripheral side of both correction surfaces,
In the correction step, the correction carrier is sandwiched between the grinding surfaces of two surface plates, and the correction member of the correction carrier is slid while being pressed against both grinding surfaces of the two surface plates. 8. A method for manufacturing a substrate according to any one of configurations 1 to 7, wherein surface correction of two surface plates is performed.
(Configuration 9)
A method for producing a mask blank, comprising: forming a thin film for forming a transfer pattern on a main surface of a substrate produced by the method for producing a substrate according to any one of Structures 1 to 8.
(Configuration 10)
A method for producing a transfer mask, comprising: patterning the thin film in a mask blank produced by the method for producing a mask blank according to Configuration 9 to form a transfer pattern.
(Configuration 11)
A correction carrier used when correcting the surface of the surface plate with respect to a grinding apparatus having a surface plate in which fixed abrasive grains are arranged on the grinding surface,
It comprises a main body portion provided with outer gears that engage with both gears between the sun gear and the internal gear of the grinding device on the outer periphery, and a correction member disposed along the outer peripheral side of the main body portion,
When the correction carrier is installed in the grinding device, and the correction carrier revolves while rotating on the surface plate by the sun gear and the internal gear of the grinding device,
The outer peripheral end of the correction member is on the outer peripheral side of the outer peripheral end of the fixed abrasive, the inner peripheral end of the correction member is on the inner peripheral side of the outer peripheral end of the fixed abrasive, and
The outer peripheral end of the correction member is on the inner peripheral side of the inner peripheral end of the fixed abrasive, and the inner peripheral end of the correction member is on the outer peripheral side of the inner peripheral end of the fixed abrasive. In addition,
A correction carrier, wherein the correction member is arranged.
(Configuration 12)
The correction carrier according to Configuration 11, wherein the correction carrier has two correction surfaces facing the main body portion, and correction members are arranged along the outer peripheral sides of both correction surfaces.
(Configuration 13)
The correction carrier according to Configuration 11 or 12, wherein the correction member is configured by disposing fixed abrasive grains including diamond particles.

According to the present invention, the surface of a surface plate in which fixed abrasive grains are arranged on the grinding surface is corrected by a correction carrier, and a surface plate in which fixed abrasive particles are arranged on the grinding surface is prepared. Even when initial smoothness is imparted to the fixed abrasive grains (grind surface) (the initial correction is performed), the flatness of the fixed abrasive grains (grind surface) of the surface plate after correction is greater than the required value. The initial correction can be reliably performed with accuracy (initial smoothness can be prepared). As a result, the glass substrate or the like ground using this surface plate can be finished with a flatness of a predetermined value or more each time initial correction is performed.
In addition, after performing the grinding process of the glass substrate such as the mask blank substrate, even when the surface of the surface plate in which the fixed abrasive is arranged on the ground surface is corrected by the correction carrier, the fixed abrasive of the surface plate after correction The flatness of the (grind surface) can be reliably recovered to a value greater than the required value. Thereby, the glass substrate etc. ground using this surface plate can always be finished with a flatness of a predetermined value or more.
According to the present invention, even when the surface plate is provided with fixed abrasive grains such as fixed abrasive grains containing diamond particles on the grinding surface, the above effect can be obtained.

It is a typical top view for demonstrating the structure of the grinding / polishing apparatus of a general planetary gear system. It is a typical sectional view for explaining composition of a general planetary gear system grinding and polisher. It is a schematic plan view which shows the example of the correction carrier and correction member which are used for embodiment of this invention. It is a typical fragmentary sectional view which shows the example of the correction carrier and correction member which are used for embodiment of this invention. It is a schematic plan view which shows the example of the correction carrier and correction member which are used by a comparative example. It is a typical top view which shows the other aspect of the correction carrier and correction member of this invention. It is a graph which shows the cross-sectional profile of the upper surface plate immediately after bonding a diamond sheet. It is a graph which shows the cross-sectional profile of the lower surface plate immediately after affixing a diamond sheet. It is a graph which shows the cross-sectional profile of the upper surface plate after correction | amendment with the correction | amendment carrier of an Example. It is a graph which shows the cross-sectional profile of the lower surface plate after correction | amendment with the correction | amendment carrier of an Example. It is a graph which shows the cross-sectional profile of the upper surface plate after correction with the correction carrier of a comparative example. It is a graph which shows the cross-sectional profile of the lower surface plate after correction with the correction carrier of a comparative example.

  Hereinafter, the present invention will be described in detail.

The method for producing a substrate of the present invention is a method for producing a substrate having a grinding step of grinding a main surface of a glass substrate using a grinding apparatus having a surface plate in which fixed abrasive grains are arranged on a grinding surface,
While correcting the correction carrier having a main body portion and a correction member arranged along the outer peripheral side of the main body portion while rotating on the surface plate, the correction member of the correction carrier and the grinding surface of the surface plate Having a correction step of correcting the surface of the surface plate by pressing and sliding each other;
In the correcting step, the outer peripheral end portion of the correction member is positioned on the outer peripheral side of the outer peripheral end portion of the fixed abrasive, and the inner peripheral end portion of the correction member is inner peripheral than the outer peripheral end portion of the fixed abrasive. Overhang the correction member on the outer peripheral side of the surface plate so as to be on the side, and
The outer peripheral end of the correction member is on the inner peripheral side of the inner peripheral end of the fixed abrasive, and the inner peripheral end of the correction member is on the outer peripheral side of the inner peripheral end of the fixed abrasive. Thus, the correction member is overhanged on the inner peripheral side of the surface plate.
According to the above configuration, the correction member of the correction carrier (one of a plurality of correction members or a part of the correction member) is provided to the outer peripheral end and the inner peripheral end of the fixed abrasive grains (grinding surface) of the surface plate. It does not protrude completely. Therefore, the accuracy of the flatness correction of the fixed abrasive grains (grinding surface) of the surface plate is determined by the required numerical value (specifically, the height difference from the inner peripheral edge to the outer peripheral edge of the fixed abrasive grains (grinding surface)). Can be improved over about 20 μm).
An overhang occurs when a correction member (one of a plurality of correction members or a part of a correction member) passes near the outer peripheral edge of a fixed abrasive (grinding surface) of a surface plate. This occurs when the carrier correction member (one of the plurality of correction members or a part of the correction member) passes near the inner peripheral edge of the fixed abrasive (grind surface) of the surface plate.
In the present invention, the overhang is a correction carrier (a plurality of correction carriers) with respect to the outer peripheral end of the fixed abrasive (grind surface) of the surface plate in an arbitrary radial direction (one or more radial directions) on the surface plate. One of the correction members, or a part of the correction member, shifts (protrudes) toward the outer surface of the surface plate in the radial direction of the surface plate (but does not protrude completely). ) And the inner peripheral end of the fixed abrasive (grind surface) of the surface plate, the correction member of the correction carrier (one of the plurality of correction members or a part of the correction member) is in the radial direction of the surface plate. To be closer to the center of the surface plate (to the inner peripheral side of the surface plate) (but not to protrude completely).
As the correction member moves relative to the surface plate, the radial position on the surface plate where the correction member overhangs to the maximum also changes. In all the positional relationships that the correction member can take relative to the surface plate, the correction carrier correction member (a plurality of correction members) with respect to the outer peripheral end and inner peripheral end of the fixed abrasive (grind surface) of the surface plate Or a part of the correction member) must not protrude completely.
In the present invention, the outer peripheral end and the inner peripheral end of the fixed abrasive grains (grinding surface) of the surface plate are preferably arranged on the circumference of an equal distance (radius) from the center of the surface plate.
In the present invention, the fixed abrasive grains are obtained by fixing a large number of abrasive grains with an appropriate binder.
In the present invention, the abrasive grains (particles) constituting the fixed abrasive grains on the surface plate include abrasive grains (particles) such as diamond, CBN (cubic boron nitride), silicon carbide, and alumina.
In the present invention, the fixed abrasive on the surface plate may be any one as long as it exhibits an action (for example, a grinding action) equivalent to that of the surface plate provided with the fixed abrasive containing diamond particles.

In the present invention, the surface plate is preferably provided with fixed abrasive grains containing diamond particles on a grinding surface.
In the present invention, examples of the fixed abrasive grains containing diamond particles include diamond pellets and diamond sheets.
Diamond pellets are diamond abrasive grains (particles) consolidated with resin (resin bond), metal (metal bond), and clay-like binder (vitrified bond). is there. A plurality of these pellets are used on a surface plate with an adhesive.
The diamond sheet is obtained by solidifying diamond abrasive grains (particles) with a resin (resin bond) to form a sheet.
In the present invention, the diamond abrasive grains (particles) constituting the fixed abrasive on the surface plate are preferably about # 1000 to # 4000, more preferably about # 3000 (for example, # 2900 to # 3100).

In the present invention, it is preferable that the correction member is configured by disposing fixed abrasive grains including diamond particles.
Compared with the case of using other fixed abrasive grains, the flatness of the fixed abrasive grains (grind surface) of the surface plate after correction can be reliably corrected with an accuracy equal to or greater than the required numerical value. Also, the processing time is relatively short.
In the correction member, examples of the fixed abrasive grains containing diamond particles include diamond pellets and diamond sheets.
Diamond pellets are diamond abrasive grains (particles) consolidated with resin (resin bond), metal (metal bond), and clay-like binder (vitrified bond). is there. A plurality of these pellets are used on a surface plate with an adhesive.
The diamond sheet is obtained by solidifying diamond abrasive grains (particles) with a resin (resin bond) to form a sheet.
In the correction member, the diamond abrasive grains (particles) constituting the fixed abrasive grains preferably have a particle size of about # 1000 to # 4000, and more preferably about # 3000 (for example, # 2900 to # 3100).
In the present invention, the correction member may be made of synthetic quartz, a metal material, or the like. In this case, as compared with the case where the correction member is composed of fixed abrasive grains containing diamond particles, the grinding rate is lowered and the correction time is lengthened.
In the present invention, the correction member may be any member as long as it can correct the grinding surface of the surface plate provided with fixed abrasive grains including diamond particles.

In the present invention, from the viewpoint of avoiding that the frictional resistance of the correction member becomes too large and the correction member (correction carrier) becomes relatively inoperable with respect to the surface plate, from the viewpoint of ensuring good fluidity such as slurry, The correction member is preferably disposed intermittently on the main body of the correction carrier.
In the present invention, the correction member may have a plurality of correction members arranged at equal distances from the center of the correction carrier and equally spaced from each other on the main body of the correction carrier. In this case, the plurality of correction members can have the same shape. The plurality of correction members may have different shapes.
In the present invention, examples of the shape of the correction member include a circle, a sector, a rectangle, a substantially square whose corners are trimmed, a sector whose corners are trimmed, a rectangle whose corners are trimmed, and other arbitrary shapes. The same applies to each correction member in the plurality of correction members.

In the present invention, the correction member is preferably provided on both the lower surface plate side and the upper surface plate side in the main body portion of the correction carrier.
In the present invention, the correction member can be arranged on the lower surface plate side or the upper surface plate side in the main body portion of the correction carrier.

In the present invention, it is preferable that the correction step is performed by pressing and sliding the correction member and the grinding surface of the surface plate while supplying a grinding liquid containing loose abrasive grains.
For example, a surface plate in which fixed abrasive grains containing diamond particles are arranged on a grinding surface and a correction surface of a correction member configured by arranging fixed abrasive grains containing diamond particles are pressed against each other and slid. In this case, if both are diamond particles, the diamond particles on the surface layer are immediately clogged, and the resin bond (the ground surface of the surface plate) cannot be ground. When a grinding fluid containing loose abrasive grains is supplied, both resin bonds can be ground simultaneously.
Examples of the free abrasive grains include alumina, zirconia, silicon carbide and the like. As the loose abrasive, alumina is preferable.

In the present invention, the correction carrier is provided with an outer gear on the outer periphery of the main body portion, and the outer gear meshes with both gears between the sun gear and the internal gear of the grinding device, whereby the surface plate It is preferable that the correction carrier is revolved while rotating.
In the grinding apparatus, the structure of the grinding apparatus can be used when correcting the surface of the surface plate by replacing the carrier that holds the glass substrate that is the substrate to be ground.

In the present invention, the grinding device is arranged so that two surface plates are opposed to each other, both grinding surfaces,
The correction carrier has two correction surfaces facing the main body, and a correction member is disposed along the outer peripheral side of both correction surfaces,
In the correction step, the correction carrier is sandwiched between the grinding surfaces of two surface plates, and the correction member of the correction carrier is slid while being pressed against both grinding surfaces of the two surface plates. One surface plate can be corrected.
The fixed abrasive grains (grinding surfaces) of the upper and lower surface plates in the double-sided grinding apparatus can be flattened simultaneously, and the correction accuracy of the fixed abrasive grains (grinding surfaces) of the upper and lower surface plates can be improved as compared with the case of correcting one by one.

In this invention, the said correction process can be performed following the fixed abrasive grain arrangement | positioning process which arranges a fixed abrasive grain on the grinding surface of a surface plate.
The present invention is excellent in determining the initial conditions of the ground surface of the surface plate. For this reason, for example, each time the diamond sheet is replaced, the initial condition of the flatness of the ground surface of the surface plate can be determined with high accuracy and good reproducibility.

In this invention, the said correction process can be performed after the grinding process which grinds the main surface of a glass substrate using the surface plate by which the fixed abrasive grain was arrange | positioned by the grinding surface.
The present invention is also excellent in recovering the flatness of the ground surface of the surface plate. Every time a predetermined number of batches are processed, the flatness of the ground surface of the surface plate can be recovered with high accuracy and good reproducibility.

In the present invention, it is desirable that the main body (frame) of the correction carrier is formed of a highly rigid material in order to minimize the deformation of the correction carrier during the grinding surface correction process. For example, metal (SUS) is preferable.
In the present invention, the main body of the correction carrier is preferably ring-shaped (annular). When the main body portion of the correction carrier is ring-shaped, chips and the like are easily removed and the correction carrier is easily handled as compared with the case where the main body portion of the correction carrier is disk-shaped.

In the present invention, the correction carrier is a correction carrier used when correcting the surface of the surface plate with respect to a grinding apparatus including a surface plate in which fixed abrasive grains are arranged on the grinding surface,
It comprises a main body portion provided with outer gears that engage with both gears between the sun gear and the internal gear of the grinding device on the outer periphery, and a correction member disposed along the outer peripheral side of the main body portion,
When the correction carrier is installed in the grinding device, and the correction carrier revolves while rotating on the surface plate by the sun gear and the internal gear of the grinding device,
The outer peripheral end of the correction member is on the outer peripheral side of the outer peripheral end of the fixed abrasive, the inner peripheral end of the correction member is on the inner peripheral side of the outer peripheral end of the fixed abrasive, and
The outer peripheral end of the correction member is on the inner peripheral side of the inner peripheral end of the fixed abrasive, and the inner peripheral end of the correction member is on the outer peripheral side of the inner peripheral end of the fixed abrasive. In addition,
It can be set as the structure by which the said correction member is arrange | positioned.
According to the modified carrier having such a configuration, the grinding apparatus can be replaced with a carrier that holds a glass substrate that is a substrate to be ground. Available.
Further, according to the correction carrier having such a configuration, the accuracy of the flatness correction of the fixed abrasive grains (grinding surface) of the surface plate can be calculated by a numerical value (specifically, the inner peripheral edge of the fixed abrasive grains (grinding surface)). The height difference from the portion to the outer peripheral end can be improved more than about 20 μm.
In the present invention, the correction carrier may have two correction surfaces facing the main body, and a correction member may be arranged along the outer peripheral side of both correction surfaces. According to the modified carrier having such a configuration, the fixed abrasive grains (grinding surfaces) of the upper and lower surface plates in the double-side grinding apparatus can be simultaneously flattened.
In the present invention, the correction member may be configured by disposing fixed abrasive grains including diamond particles.

The present invention can be applied to grinding of substrates such as quartz glass, alkali-free glass, borosilicate glass, aluminosilicate glass, and soda lime glass. In addition, the present invention can be applied to grinding of a substrate such as crystallized glass on which β-quartz solid solution is precipitated, for example, if it is amorphous glass, SiO ₂ —TiO ₂ glass, or crystallized glass.
The substrate manufacturing method in the present invention can be applied to a mask blank glass substrate, a glass substrate for a display device using liquid crystal or organic EL, a glass substrate for a magnetic disk, and the like.
In the present invention, the case where the substrate is used a glass substrate for a mask blank is preferably a low thermal expansion glass such as synthetic quartz glass or SiO ₂ -TiO ₂ type glass.
This is because the present invention is particularly suitable for grinding a substrate made of low thermal expansion glass such as synthetic quartz glass or SiO ₂ —TiO ₂ glass.

The mask blank manufacturing method of the present invention is characterized in that a thin film for forming a transfer pattern is formed on the main surface of the mask blank substrate manufactured by the substrate manufacturing method of the present invention.
With the above configuration, it is possible to manufacture a mask blank having a substrate with a high flatness of a predetermined value or less.

The transfer mask manufacturing method of the present invention is characterized by patterning the thin film in the mask blank manufactured by the mask blank manufacturing method of the present invention to form a transfer pattern.
With the above configuration, it is possible to manufacture a transfer mask having a substrate with high flatness of a predetermined value or less.

  Next, an embodiment of a substrate manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings. In the following, the case of grinding a glass substrate for a mask blank will be described in particular, but the present invention can also be applied to the case of grinding a glass substrate for a display device using a liquid crystal or an organic EL and a glass substrate for a magnetic disk. In the figure, elements not directly related to the present invention are not shown. Similar elements are denoted by the same reference numerals.

  FIG. 1 is a schematic plan view for explaining a configuration of a general planetary gear type grinding / polishing apparatus, and is a view for explaining a planetary motion of a carrier. A ground / polished substrate (glass substrate) 100 is held on a lower surface plate 10 by a carrier 50 having an outer gear on its outer periphery. The outer gear of the carrier 50 is connected to a sun gear (sun gear) 30 and an internal gear. (Internal gear) 40 is engaged with both gears 30 and 40 respectively. For example, by rotating the sun gear 30 and the internal gear 40 in the directions of the arrows, the carriers 50 revolve while rotating as planetary gears in the directions of the arrows.

FIG. 2 is a schematic cross-sectional view for explaining the configuration of a general planetary gear type grinding / polishing apparatus. The upper surface plate 20 is movable in the vertical direction with respect to the lower surface plate 10. 2 illustrates a state in which both the main surfaces of the grinding / polishing substrate (glass substrate) 100 are ground and polished with the grinding / polishing substrate (glass substrate) 100 interposed therebetween. As shown in FIG. 2, the upper surface plate 20 and the lower surface plate 10 are each provided with fixed abrasive grains 11 and 21 on the grinding surface during grinding (or latticed grooves on the upper and lower surface plates). In this case, polishing pads (polishers) 11 and 21 are provided on the polishing surface. For example, the main surface of the glass substrate 100 is ground and polished by rotating the upper and lower surface plates 10 and 20.
The two-way method in which the upper and lower surface plates 10 and 20 are not driven and the sun gear 30 and the internal gear 40 are driven, and the three-way method in which the internal gear 40 is fixed and the upper and lower surface plates 10 and 20 and the sun gear 30 are driven ( Internal fixed type), three-way system (upper surface plate fixed type) for fixing the upper surface plate 20 and driving the lower surface plate 10, sun gear 30, and internal gear 40, upper and lower surface plates 10, 20, sun gear 30, internal A four-way system that drives all four axes of the gear 40 is applicable.
The planetary gear type grinding / polishing apparatus can be applied to a double-sided grinding / polishing apparatus and a single-sided grinding / polishing apparatus.

The object of the embodiment of the present invention is to perform surface correction of the upper and lower surface plates 10 and 20 in which the fixed abrasive grains 11 and 21 are provided on the grinding surface (see FIGS. 3 and 4).
In order to correct the surface of the surface plate, the flatness of the fixed abrasive grains (grind surface) of the surface plate is corrected using a correction member.

FIG. 3 is a diagram showing an example of a correction carrier and a correction member used in the embodiment of the present invention. 4 is a partial cross-sectional view of the surface plate, and is a cross-sectional view taken along the line AA of FIG.
The correction carrier 51 shown in FIGS. 3 and 4 has a configuration that can replace the carrier 50 shown in FIG. That is, the correction members 53 are attached to the upper and lower surfaces (two surfaces facing the main body portion) of the main body portion (metal frame) 52 of the correction carrier having the outer gear on the outer periphery.
As shown in FIG. 1, each carrier 50 is used as a planetary gear at the time of grinding / polishing of the substrate to be ground / polished (glass substrate) 100, and when the surface of the surface plate is corrected, each carrier 50 is replaced with each carrier 50 shown in FIGS. Can be installed as a planetary gear.
When the surface of the surface plate is corrected using the correction carrier, all the carriers 50 shown in FIG. 1 are removed, and the correction carrier 51 shown in FIG. At least one correction carrier 51 may be arranged on the surface plate, but a plurality of correction carriers 51 may be arranged when it is desired to shorten the correction time.

As shown in FIGS. 3 and 4, in the radial direction of the surface plates 10 and 20, fixed abrasive grains (specifically 5 to 100 mm) on the inner peripheral side of the outer peripheral end portions 10 a and 20 a of the surface plate (specifically 5 to 100 mm) Grinding surface) The outer peripheral end portions 11a, 21a of the 11, 21 are located, and are fixed to the outer peripheral side by an appropriate amount (specifically, 5-100 mm) from the inner peripheral end portions 10b, 20b of the surface plates 10, 20 It arrange | positions so that the inner peripheral edge parts 11b and 21b of the grain (grind surface) 11 and 21 may be located. By adopting such an arrangement, the substrate manufacturing method of the present invention can be applied even when a polishing apparatus or a grinding apparatus designed on the assumption that the substrate is not overhanged during polishing or grinding of the substrate is used.
In this case, the outer peripheral end portions 11a and 21a and the inner peripheral end portions 11b and 21b of the fixed abrasive grains (grinding surfaces) 11 and 21 on the surface plates 10 and 20 are respectively equal distances (radius) from the center O of the surface plate. Place on the circumference of.
As the fixed abrasive grains (grinding surfaces) 11 and 21 on the surface plates 10 and 20, a diamond sheet (diamond particle size # 3000) is used.

As shown in FIG. 3, a plurality of circular correction members 53 of the same size are attached along the circumference of the main body 52 of a ring (annular) correction carrier. The plurality of correction members 53 are arranged on the correction carrier main body 52 at equal distances from the correction carrier center O ′ at equal intervals. The central portion of the correction carrier main body 52 is a circular cavity.
As shown in FIG. 3, the correction member 53 is arranged along the circumference of the main body 52 of the correction carrier, and the entire carrier main body 52 is not covered with the correction member 53. This is because if the entire carrier body 52 is covered with the correction member 53, the frictional force becomes too large when contacting the surface plate, making it difficult to rotate the correction carrier relative to the surface plate, There is a risk that an excessive shearing force is applied to the grains, and the fixed abrasive drops from the sheet, or the sheet itself peels from the surface plate. In addition, the size, spacing, and arrangement (pasting position) of the correction member 53 must be adjusted from the viewpoint of the purpose of the correction itself, that is, the achievement of the objective of improving the smoothness of the ground surface of the surface plate by relative movement. There is.

As shown in FIGS. 3 and 4, the arrangement of the correction member 53 in the correction carrier 51 is in the radial direction of the surface plate passing through the center O of the surface plate and the center O ′ of the correction carrier 51.
The outer peripheral end 53a of the correction member 53 is on the outer peripheral side of the outer peripheral ends 11a and 21a of the fixed abrasive grains (grinding surfaces) 11 and 21, and the inner peripheral end portion 53b of the correction member 53 is the fixed abrasive grains (grinding surface). ) 11 and 21 are located on the inner peripheral side of the outer peripheral end portions 11a and 21a, and
The outer peripheral end 53a of the correction member 53 is on the inner peripheral side with respect to the inner peripheral ends 11b and 21b of the fixed abrasive grains (grinding surfaces) 11 and 21, and the inner peripheral end 53b of the correction member 53 (of the correction carrier 51). The arrangement is such that the end near the center O ′ is closer to the outer peripheral side than the inner peripheral end portions 11b and 21b of the fixed abrasive grains (grinding surfaces) 11 and 21.

As the correcting member 53, a diamond sheet (diamond particle size # 3000) is used.
The flatness of the correction surface of the correction member 53 (measurement area of 800 mm using a stylus type surface roughness measuring device) is preferably 20 μm or less, and more preferably 10 μm or less.

When the area of the correction member 53 is S, the maximum overhang amount is preferably 0.05 to 0.5S (the overhang amount is less than or equal to half of the total area S of the correction member).
Similarly, when the length h of the correction carrier in the correction member in the radial direction is set to h, the maximum value of the overhang amount is 0.5 h or less (the overhang amount is less than half of the length h of the correction carrier in the radial direction of the correction member) ) Is preferred (see FIG. 3).
The correction member is compressed by the pressure applied by the upper and lower surface plates. When the correction member overhangs from the ends of the fixed abrasive grains (grinding surfaces) 11 and 21 of the upper and lower surface plates (overhangs and jumps out), the overhanging portion of the correction member (the protruding portion and the portion protruding outward) ) Will release the pressure and increase the thickness. The overhanging portion (the protruding portion and the protruding portion) of the correction member whose thickness is increased by releasing the pressure enters toward the fixed abrasive grains (grinding surfaces) 11 and 21 of the upper and lower surface plates. When going, the fixed abrasive grains (grinding surface) of this part are shaved more than necessary, which hinders improvement in the accuracy of flatness correction of the fixed abrasive grains (grinding surface) of the surface plate.
From the viewpoint of reducing the influence of pressure release applied to the correction member by the upper and lower surface plates, the maximum value of the overhang amount is preferably 0.1 to 0.4 S, and preferably 0.2 to 0.00. 3S is more preferable.

When the radius of the correction carrier 51 is R, the radial width w of the correction carrier in the main body (frame) 52 of the correction carrier is preferably about 0.1 to 0.3R, and more preferably around 0.2R ( (See FIG. 3).
When the radial width of the correction carrier in the main body (frame) 52 of the correction carrier is w, the radial width h of the correction member 53 in the correction carrier is preferably about 0.2 to 0.5 w. More preferably around 3w (see FIG. 3).

As shown in FIG. 4, when correcting the smoothness of the grinding surfaces 11, 21 provided with the fixed abrasive grains of the upper and lower surface plates 10, 20, the correction carrier 51 is moved to the upper and lower surface plates 10, 20 in the same manner as during grinding. And are slid by pressing each other. As a result, the grinding surfaces 11 and 21 provided with fixed abrasive grains are shaved, and their heights become uniform. In other words, the ground surface that needs to be initially flattened in the preparation process of the surface plate and the flatness of the ground surface that has decreased in the grinding process have been corrected. The flatness of the ground surface can be imparted to and recovered from the substrate 100).
At this time, it is preferable to correct using a slurry containing free abrasive grains (for example, a particle size of 4 to 15 μm). As the loose abrasive, alumina is preferable.
In the correction step, the machining allowance of the grinding surfaces 11 and 21 provided with the fixed abrasive grains of the upper and lower surface plates 10 and 20 is preferably 5 to 50 μm.

The total thickness of the correction carrier main body 51 and the correction member 52 is preferably thicker than the substrate to be ground / polished (glass substrate) 100 shown in FIG.
The reason for providing such a thickness is to increase the correction capability of the correction carrier 51. In the case of a double-side polishing machine such as the upper and lower surface plates 10 and 20, the higher the thickness of the object to be processed that is sandwiched between them, the higher the bending strength, so that the correction carrier is less likely to be deformed, and high-precision correction processing. Easy to do. The same applies when the upper and lower surface plates 10 and 20 are corrected by the correction carrier 51, and the correction capability is improved as the thickness of the carrier main body 52 and the correction member 53 is increased.
While supplying the free abrasive grains, the correction surface of the correction member 53 of the correction carrier 51 having such a thickness and the grinding surfaces 11 and 21 of the upper and lower surface plates 10 and 20 are pressed against each other and slid. By making it move, the flatness of the grinding surfaces 11 and 21 of the upper and lower surface plates 10 and 20 can be improved.

FIG. 6 is a schematic plan view showing another embodiment of the correction carrier and the correction member.
In FIG. 6A, each correction member 53 has a rectangular shape with trimmed corners.
In FIG. 6 (2), two circumferences (parts) 53c and 53d that are concentric with and between the inner and outer circumferences of the main body 52 of the ring-shaped correction carrier, and the center O of the correction carrier It is a shape cut out by two radii 53e and 53f passing through '. As described above, the shape of each correction member can be a shape obtained by cutting a ring (ring) similar to the correction carrier with two radii passing through the center O ′ of the correction carrier.

As shown in FIGS. 3 and 4, the method for manufacturing a mask blank substrate of the present invention uses, for example, a grinding apparatus including a surface plate in which fixed abrasive grains (grinding surfaces) 11 and 21 are arranged on the grinding surface. A method for manufacturing a substrate such as a mask blank substrate having a grinding step of grinding a main surface of a glass substrate,
The correction carrier 51 including the main body 52 and the correction member 53 arranged along the outer peripheral side of the main body 52 is revolved while rotating on the surface plates 10 and 20, and the correction member of the correction carrier 51 is rotated. 53 and a grounding surface of the surface plate are pressed against each other and slid to correct the surface of the surface plate,
In the correcting step, the outer peripheral end portion 53a of the correcting member 53 is positioned on the outer peripheral side of the outer peripheral end portions 11a and 21a of the fixed abrasive grains (grinding surfaces) 11 and 21, and the inner peripheral end portion 53b of the correcting member 53 is The correction member 53 is overhanged on the outer peripheral side of the surface plate so as to be closer to the inner peripheral side than the outer peripheral end portions 11a, 21a of the fixed abrasive grains (grinding surfaces) 11, 21, and
The outer peripheral end 53a of the correction member 53 is on the inner peripheral side of the inner peripheral ends 11b and 21b of the fixed abrasive grains (grinding surfaces) 11 and 21, and the inner peripheral end 53b of the correction member 53 is fixed abrasive grains ( The correction member 53 is overhanged on the inner peripheral side of the surface plate so that it is closer to the outer peripheral side than the inner peripheral end portions 11b, 21b of the grinding surface) 11, 21.

  As shown in FIGS. 3 and 4, in the substrate manufacturing method of the present invention, for example, the correction carrier 51 is provided with an outer gear on the outer periphery of a main body 52, and the outer gear is connected to the grinding device. By engaging both the gears between the sun gear 30 and the internal gear 40, the correction carrier 51 can be rotated and revolved on the surface plates 10 and 20 while rotating.

As shown in FIGS. 3 and 4, according to the substrate manufacturing method of the present invention, for example, the correction carrier 51 has two correction surfaces opposed to the main body portion 52, and extends along the outer peripheral side of both correction surfaces. A correction member 53 is disposed;
In the correction step, the correction carrier is sandwiched between the grinding surfaces of the two surface plates 10 and 20, and the correction member 53 of the correction carrier 51 is slid in a state of being pressed against both the grinding surfaces of the two surface plates. By doing so, the surface of the two surface plates 10 and 20 can be corrected.

In the method for producing a mask blank substrate of the present invention, the grinding conditions are, for example, polishing liquid (alumina (average particle size 4 to 15 μm) + water), processing load 50 to 200 g / cm ² , polishing time 2 to 60 minutes. The corrected carrier rotation speed 0.5 to 10 rpm, the corrected carrier revolution speed 0.5 to 10 rpm, the polishing surface plate speed 2 to 20 rpm, and the like are preferable.

[Example]
(Example 1, Comparative Example 1)
Four diamond sheets (# 3000) were bonded as fixed abrasive grains (grinding surfaces) 11 and 21 to the upper and lower surface plates of a double-sided grinding (lapping) device (see FIG. 6).
The profile of the grinding surface of the upper and lower surface plates immediately after the diamond sheet was pasted (before correction) was measured. The results are shown in FIGS.
The initial correction was performed with the correction carrier shown in FIG. 3 (the correction member 53 was a diamond sheet (# 3000)) (Example 1). 9 and 10 show the results of measuring the profile of the ground surface of the upper and lower surface plates after the correction.
Initial correction was performed with the correction carrier shown in FIG. 5 (the correction member 53 was a diamond sheet (# 3000)) (Comparative Example 1). The result of measuring the profile of the ground surface of the upper and lower surface plate after correction is shown in FIGS.
The initial correction was performed under the following conditions.
Polishing liquid: Alumina (average particle size 10 μm) + water processing load: 100 g / cm ²
Polishing time: 10 minutes Corrected carrier rotation speed: 2 rpm
Corrected carrier revolution speed: 5 rpm
Polishing platen rotation speed: 12rpm
Surface plate radius: about 1800mm
Double-side grinding is a four-way method, and the rotation directions of the upper and lower surface plates are reversed, and the rotation directions of the sun gear and the internal gear are reversed.
Further, as shown in FIG. 6, since the sun gear 30 is at the center of the surface plate, the profile cannot be measured by a measuring machine in the diameter direction of the surface plate. For this reason, the profile (entire surface) was measured with a measuring machine at the measurement position shown in FIG. Based on the measurement data, a profile (left) and a profile (right) are obtained by a measuring machine. In this way, the measurement data shown in FIGS.
In Example 1 and Comparative Example 1, in the radial direction of the surface plate, the outer peripheral end portions 11a and 21a of the fixed abrasive grains (grinding surfaces) 11 and 21 are located on the inner peripheral side of 100 mm from the outer peripheral end portions 10a and 20a of the surface plate. And the inner peripheral ends 11b and 21b of the fixed abrasive grains (grinding surfaces) 11 and 21 are positioned 100 mm on the outer peripheral side of the inner peripheral ends 10b and 20b of the surface plate.

As shown in FIG. 7 and FIG. 8, when the diamond sheet is divided into several pieces on the surface plate, the step of the diamond sheet needs to be corrected (initial correction before polishing).
In Example 1, the flatness correction of the grinding surface provided with fixed abrasive grains including diamond particles could be corrected from the state shown in FIGS. 7 and 8 to the state shown in FIGS. 9 and 10. Further, the accuracy of flatness correction is equal to or greater than a required value (for example, a surface plate radius of about 800 mm and a surface plate surface flatness of about 20 μm) (for example, a surface plate radius of about 800 mm and a surface plate surface flatness of about 10 μm). I was able to improve.
In Comparative Example 1, as shown in FIG. 5, when the correction member 53 overhangs on the outer peripheral side of the surface plate 10 to the maximum with respect to the outer peripheral end portion 11 a of the fixed abrasive grains (grinding surface) 11 of the surface plate 10. The end 53 b on the inner peripheral side of the correction member 53 is located on the outer peripheral side of the outer peripheral end 11 a of the fixed abrasive (grinding surface) 11 of the surface plate 10, that is, the fixed abrasive of the surface plate 10. The entire correction member 53 protrudes from the outer peripheral end portion 11 a of the (grinding surface) 11. Similarly, when the correction member 53 overhangs at the maximum on the inner peripheral side of the surface plate 10 with respect to the inner peripheral end portion 11 b of the fixed abrasive (grinding surface) 11 of the surface plate 10, the correction member 53. The end 53b on the inner peripheral side of the surface plate 10 is located on the inner peripheral side of the inner peripheral end portion 11b of the fixed abrasive (grinding surface) 11 of the surface plate 10, that is, the fixed abrasive (grinding surface of the surface plate 10). ) The entire correction member 53 protrudes from the inner peripheral end portion 11 b of 11. For this reason, in Comparative Example 1, the flatness correction of the grinding surface provided with fixed abrasive grains including diamond particles can be corrected only from the state shown in FIGS. 7 and 8 to the state shown in FIGS. 11 and 12. Further, the accuracy of the flatness correction is inferior to the required value (for example, a surface plate radius of about 800 mm and a surface plate surface flatness of about 20 μm) (for example, a surface plate radius of about 800 mm and a surface plate surface flatness of about 35 μm). Met.

In order to correct the flatness (smoothness) of the ground surfaces of the surface plates 10 and 20 that were lowered in the grinding process after the grinding process of grinding the main surface of several tens of batches of glass substrates, correction was performed.
A tendency similar to the result of the initial correction was observed.

(Manufacture of mask blank substrate)
(1) Rough polishing process (first polishing)
The end surface of the synthetic quartz glass substrate (6 inches × 6 inches) is chamfered and the glass substrate that has been ground by the double-sided lapping device is set in the double-side polishing device described above, and the rough polishing step is performed under the following polishing conditions. went. The processing load and polishing time were adjusted as appropriate.
Polishing liquid: cerium oxide (average particle size 2 to 3 μm) + water polishing pad: hard polisher (urethane pad)
After the rough polishing step, the glass substrate was immersed in a cleaning tank (ultrasonic application) in order to remove the abrasive grains adhering to the glass substrate and cleaned.
(2) Precision polishing process (second polishing)
It set to the above-mentioned double-side polish apparatus, and the precision grinding | polishing process was performed on the following grinding | polishing conditions. The processing load and polishing time were adjusted as appropriate.
Polishing liquid: cerium oxide (average particle size 1 μm) + water polishing pad: soft polisher (suede type)
After completion of the precision polishing step, the glass substrate was immersed in a cleaning tank (ultrasonic application) in order to remove the abrasive grains adhering to the glass substrate and cleaned.

(3) Ultra-precision polishing process (third polishing)
It set to the above-mentioned double-side polish apparatus, and performed the ultraprecision polishing process on the following polishing conditions. The processing load and polishing time were adjusted as appropriate.
Polishing liquid: colloidal silica (average particle size 100 nm) + water polishing pad: super soft polisher (suede type)
After the completion of the ultraprecision polishing process, the glass substrate was immersed in a cleaning tank (ultrasonic application) in order to remove the abrasive grains adhering to the glass substrate, and cleaning was performed.

(5) Flatness measurement process About the board | substrate (each 12 sheets) of Example 1 after the ultraprecision grinding | polishing process was performed, and the flatness (TIR) in the 142-mm square area | region of a main surface. It measured with the measuring device (UltraFlat200M by Corning Tropel). As a result, for the substrate of Example 1, the shape of the main surface was a convex shape with a flatness in the range of 0 μm or more and within +0.2 μm. On the other hand, as for the substrate of Comparative Example 1, as for the shape of the main surface, the convex shape having a flatness (TIR) larger than +0.2 μm occupies the majority (average 9 sheets), resulting in poor yield. It became.

(Evaluation after producing mask blank and photomask)
On one main surface of each glass substrate obtained in Example 1 above, a light-shielding layer (MoSiN film) containing molybdenum, silicon and nitrogen, and an antireflection layer (MoSiN film) containing molybdenum, silicon and nitrogen A light shielding film (total film thickness: 60 nm) having a structure in which two layers are stacked was formed by sputtering, respectively, to manufacture a binary mask blank.
Next, a resist film was applied and formed on the light shielding film of each manufactured mask blank by spin coating. Subsequently, a desired fine pattern was formed on the resist film by exposure and development. Furthermore, by using the resist film as a mask, the light shielding film was dry-etched to form a transfer pattern on the light shielding film, thereby producing a binary transfer mask.

  Using each transfer mask produced from the substrate of Example 1, it was set on the mask stage of the exposure apparatus, and exposure transfer was performed by irradiating ArF excimer laser light onto the transfer object (resist film or the like on the wafer). As a result, it was confirmed that the desired pattern was normally transferred to the transfer object.

(Evaluation after manufacturing reflective mask blank and reflective mask)
A multilayer reflective film in which molybdenum (Mo layer) and silicon (Si layer) were alternately laminated was formed on one main surface of each glass substrate obtained in Example 1 above. Specifically, a Si layer of 4.2 nm and a Mo layer of 2.8 nm are formed from the glass substrate side, respectively, and this is repeated for 40 cycles, and finally a Si layer of 4.0 nm is formed to form a multilayer reflective film. did. Next, a protective film made of a material containing ruthenium was formed to 2.5 nm on the multilayer reflective film. Finally, an absorber film mainly composed of tantalum was formed on the protective film to manufacture a reflective mask blank.

  Next, a resist film was applied and formed on the light shielding film of each manufactured reflective mask blank by spin coating. Subsequently, a desired fine pattern was formed on the resist film by exposure and development. Furthermore, by performing dry etching on the absorber film using the resist film as a mask, a transfer pattern was formed on the absorber film, and a reflective mask was manufactured.

  Using each reflection type mask produced from the substrate of Example 1, it is set on the mask stage of the exposure apparatus, and exposure transfer is performed by irradiating the transfer object (resist film etc. on the wafer) with EUV (Extreme Ultra Violet) light. went. As a result, it was confirmed that the desired pattern was normally transferred to the transfer object.

10 Lower surface plate 20 Upper surface plate 30 Sun gear (sun gear)
40 Internal gear (internal gear)
50 Carrier 51 Correction carrier 52 Main body 53 Correction member 100 Grinding / polishing substrate (glass substrate)

Claims (17)

A substrate manufacturing method comprising a grinding step of grinding a main surface of a glass substrate using a grinding apparatus having a surface plate in which fixed abrasive grains are arranged on a grinding surface,
A correction carrier having a main body portion having two correction surfaces facing each other and a correction member arranged along the outer peripheral side of the two correction surfaces is rotated while revolving on the surface plate , Having a correction step of correcting the surface of the surface plate by pressing and sliding the correction member and the ground surface of the surface plate against each other;
The correction step is such that the outer peripheral end of the correction member viewed from the center of the correction carrier is on the outer peripheral side of the outer peripheral end of the fixed abrasive viewed from the center of the surface plate, and the center of the correction carrier The correction member is placed over the outer peripheral side of the surface plate so that the inner peripheral end portion of the correction member viewed from the inner side is closer to the inner peripheral side than the outer peripheral end portion of the fixed abrasive viewed from the center of the surface plate. Hang and
The outer peripheral end portion of the correction member viewed from the center of the correction carrier is on the inner peripheral side than the inner peripheral end portion of the fixed abrasive viewed from the center of the surface plate, and is viewed from the center of the correction carrier. The correction member is overhanged on the inner peripheral side of the surface plate so that the inner peripheral end portion of the correction member is on the outer peripheral side with respect to the inner peripheral end portion of the fixed abrasive as viewed from the center of the surface plate . A method for manufacturing a substrate, comprising:   The substrate manufacturing method according to claim 1, wherein the surface plate is provided with fixed abrasive grains including diamond particles on a grinding surface. The substrate manufacturing method according to claim 2, wherein the fixed abrasive grains provided on the surface plate are diamond particles consolidated by resin, metal, or clay binder. Said modified member, manufacturing method of a substrate according to any of claims 1 to 3, characterized in that fixing is configured by deploying the abrasive grains comprising diamond particles. 5. The method for manufacturing a substrate according to claim 4, wherein the fixed abrasive constituting the correction member is obtained by solidifying diamond particles with a resin, metal, or clay binder. The said correction carrier arrange | positions the said some correction member in the equal distance from the center of the said correction carrier with respect to each surface of the said two correction surfaces. A method for manufacturing a substrate. Said modifying step, while supplying a grinding fluid containing free abrasive grains, and modifying member, and the grinding surface of the plate, of claims 1 to 6, which comprises carrying out is slid by pressing together The manufacturing method of the board | substrate in any one. Said modifying step is a manufacturing method of a substrate according to any one of claims 1 7, characterized in that the fixed abrasive Following fixed abrasive deployment step for deploying on the grinding surface of the platen. The substrate according to any one of claims 1 to 7 , wherein the correction step is performed after a grinding step of grinding a main surface of the glass substrate using a surface plate in which fixed abrasive grains are arranged on a grinding surface. Manufacturing method. The correction carrier is provided with an outer gear on the outer periphery of the main body, and the correction gear on the surface plate is formed by engaging the outer gear with both gears between the sun gear and the internal gear of the grinding device. a method for manufacturing a substrate according to any one of claims 1-9, characterized in that revolving while rotating the carrier. The grinding device is arranged such that two surface plates are opposed to each other,
The correction carrier has two correction surfaces facing the main body, and a correction member is disposed along the outer peripheral side of both correction surfaces,
In the correction step, the correction carrier is sandwiched between the grinding surfaces of two surface plates, and the correction member of the correction carrier is slid while being pressed against both grinding surfaces of the two surface plates. a method for manufacturing a substrate according to any one of claims 1 10, characterized in that the surface modification of the one of the platen. Mask blank manufacturing method, characterized in that on the main surface of the substrate manufactured by the method for manufacturing a substrate according to any one of claims 1 to 11, to form a thin film for transfer pattern formation. A method for producing a transfer mask, comprising patterning the thin film in a mask blank produced by the method for producing a mask blank according to claim 12 to form a transfer pattern. A correction carrier used when correcting the surface of the surface plate with respect to a grinding apparatus having a surface plate in which fixed abrasive grains are arranged on the grinding surface,
Has two modified surfaces facing, disposed along the outer periphery of the body portion, the two balancing planes having an externally formic Ya meshing respectively the gears between the sun gear and the internal gear of the grinding device on the outer periphery A modified member,
When the correction carrier is installed in the grinding device, and the correction carrier revolves while rotating on the surface plate by the sun gear and the internal gear of the grinding device,
The outer peripheral end of the correction member viewed from the center of the correction carrier is on the outer peripheral side of the outer peripheral end of the fixed abrasive viewed from the center of the surface plate , and the correction viewed from the center of the correction carrier. The inner peripheral end of the member is closer to the inner peripheral side than the outer peripheral end of the fixed abrasive seen from the center of the surface plate , and
The outer peripheral end portion of the correction member viewed from the center of the correction carrier is on the inner peripheral side than the inner peripheral end portion of the fixed abrasive viewed from the center of the surface plate, and is viewed from the center of the correction carrier. The correction carrier, wherein the correction member is arranged such that an inner peripheral end portion of the correction member is located on an outer peripheral side with respect to an inner peripheral end portion of the fixed abrasive as viewed from the center of the surface plate. . The correction carrier according to claim 14 , wherein the correction member is configured by disposing fixed abrasive grains including diamond particles. 16. The correction carrier according to claim 15, wherein the fixed abrasive constituting the correction member is obtained by solidifying diamond particles with a resin, metal, or clay binder. The correction carrier has a plurality of correction members arranged at equal distances from the center of the correction carrier with respect to each of the two correction surfaces. Correction carrier.

Images