JP5689752B2 - Volume measuring apparatus and volume change measuring method - Google Patents

Description

  The present invention relates to a technique for evaluating physical properties of a resin, for example, a volume measuring device and a volume for measuring expansion of a thermosetting resin by heating and subsequent shrinkage due to curing, and shrinkage due to cooling after completion of curing. It relates to a change measurement method.

  As a protective material in a semiconductor device in which a semiconductor element is flip-chip connected on a substrate, an underfill material that fills a gap between the substrate and the semiconductor element and is thermally cured is used.

  As this underfill material, a material having a lower elastic modulus is required in order to relieve the thermal stress generated in the use of the semiconductor device, and a material having a small volume shrinkage due to the chemical reaction at the time of thermosetting is more preferably used. Is done. This is because when the chemical reaction shrinkage due to thermosetting is large, the semiconductor element surface, the circuit board surface, or a bump connection part used as a connection part thereof or a metal wire shrinks while being in close contact. This is because it becomes a cause of stress generation in the semiconductor device.

  In general, an inorganic filler is contained in a resin material such as an underfill material to reduce the amount of shrinkage due to curing or cooling, but the shrinkage cannot be completely eliminated.

  Therefore, the linear expansion coefficient, elastic modulus, and glass transition temperature of these base materials including the cured resin are measured by a separately known method, and the amount of strain at each location in the semiconductor device is calculated from those values, The magnitude of the stress can be determined.

  However, the amount of strain cannot be completely calculated unless the amount of cure shrinkage associated with the polymerization due to the chemical reaction during heating of the thermosetting resin is measured and taken into account.

  Therefore, as a curing / shrinkage measuring apparatus that measures the amount of shrinkage that accompanies curing of the thermosetting resin, for example, a part that measures the degree of curing progress in the apparatus disclosed in Patent Document 1 can be used. I think that the. FIG. 11 is a configuration diagram of an apparatus for measuring the amount of shrinkage using a portion for measuring the degree of curing progress. In the apparatus shown in FIG. 11, the coating 102 is applied as a coating film on a heatable measurement stage 101, and a change in the coating film thickness due to curing by heating is measured by a laser displacement meter 103.

JP 2006-038533 A

  However, the curing shrinkage measuring apparatus as described above has the following problems in measuring a material having a low viscosity at a high temperature such as underfill.

  First, because the underfill material has a low viscosity at high temperatures, the liquid spreads greatly when heated on the measurement stage, and changes in the coating thickness due to spreading, as well as changes in coating thickness due to expansion and contraction. Therefore, the amount of expansion and contraction cannot be measured accurately.

  Secondly, since the underfill material is a material with high adhesion, the measurement stage and the underfill are in close contact with each other during the curing process, and the portion of the underfill that is restricted by the close contact with the air and due to the close contact with the air The part which is not restrained arises, and it is difficult to measure the volume change accurately.

  An object of the present invention is to provide a volume measuring apparatus and a volume change measuring method capable of measuring a volume change more accurately in consideration of a problem of a conventional curing shrinkage measuring apparatus.

In order to achieve the above object, the first present invention provides:
A volume measuring device for measuring a volume in thermosetting of a thermosetting resin whose main raw material is an epoxy resin ,
A heating pedestal for heating the thermosetting resin;
The thermosetting resin, which is formed in a concave shape on the upper surface of the heating pedestal portion and at least the concave inner surface is formed of a material having an interfacial tension energy of greater than 15 mN / m and smaller than 30 mN / m, is placed. A mounting unit;
A heating unit for heating the pedestal for heating;
A temperature measuring unit for measuring the temperature of the heating pedestal, and
A temperature control unit that controls the temperature of the heating unit based on the temperature measured by the temperature measurement unit;
At each temperature, the height of each position of the mounting part including the thermosetting resin placed on the mounting part is measured by a non-contact type three-dimensional shape measuring part, and the volume of the thermosetting resin is measured. It is a volume measuring apparatus provided with the volume measuring part to calculate .

The second aspect of the present invention
A volume measuring device for measuring a volume in thermosetting of a thermosetting resin whose main raw material is an epoxy resin ,
A heating pedestal for heating the thermosetting resin;
A mounting portion on which the thermosetting resin is placed, wherein the heating pedestal portion is formed in a concave shape on the upper surface, and at least the concave inner surface is formed of a fluorocarbon resin;
A heating unit for heating the pedestal for heating;
A temperature measuring unit for measuring the temperature of the heating pedestal, and
A temperature control unit that controls the temperature of the heating unit based on the temperature measured by the temperature measurement unit;
At each temperature, the height of each position of the mounting part including the thermosetting resin placed on the mounting part is measured by a non-contact type three-dimensional shape measuring part, and the volume of the thermosetting resin is measured. It is a volume measuring apparatus provided with the volume measuring part to calculate .

The third aspect of the present invention provides
The volume measuring unit is the volume measuring device according to the first or second aspect of the present invention that calculates a volume change based on the measured volume.

The fourth invention relates to
The volume measuring unit, using the volume of the recessed portion of the mounting table was measured by using the non-contact three-dimensional shape measuring section, measuring the volume of the thermosetting resin, the first or second It is the volume measuring apparatus of this invention.

The fifth aspect of the present invention relates to
The volume measuring device according to any one of the first to fourth aspects of the present invention, comprising a chamber for sealing the heating pedestal.

The sixth invention relates to
The chamber is
It is a volume measuring device of the 5th present invention which has a glass window which permeate | transmits the light irradiated toward the said mounting part from the said non-contact-type three-dimensional shape measurement part.

The seventh invention relates to
The chamber has an exhaust port;
The exhaust port further includes a decompression pump connected to the decompression port,
In the volume measuring device according to the fifth or sixth aspect of the present invention, the inside of the chamber is decompressed by the operation of the decompression pump.

The eighth invention relates to
The shape of the mounting part is
In plan view, the shape of the edge is line symmetric or point symmetric,
The cross-sectional shape parallel to the upper surface of the heating pedestal portion is similar to the shape of the edge of the mounting portion,
The volume measuring device according to any one of the first to seventh aspects of the present invention, wherein a position of a symmetry line or a symmetry point of the cross-sectional shape coincides with a position of the symmetry line or the symmetry point of the edge shape.

The ninth invention relates to
The constituent molecules on the inner surface of the mounting part form a fractal structure having fine irregularities,
The volume measuring device according to any one of the first to eighth aspects of the present invention, wherein the unevenness has a width and height greater than 10 nm and less than 800 μm.

The tenth aspect of the present invention is
The fractal structure is the volume measuring apparatus according to the ninth aspect of the present invention, which is formed by a polyfluorinated alkyl compound film.

The eleventh aspect of the present invention is
The heating pedestal is
A heating stage;
A fluorocarbon resin plate disposed on the upper surface of the heating stage;
The volume measuring device according to any one of the first to tenth aspects of the present invention, wherein the mounting portion is formed on the fluorocarbon resin plate.

The twelfth aspect of the present invention is
The heating pedestal is the volume measuring device according to any one of the first to tenth aspects of the present invention, which is made of a fluorocarbon resin.

The thirteenth aspect of the present invention is
A heating pedestal for heating the thermosetting resin whose main raw material is an epoxy resin, and a recess formed on the upper surface of the heating pedestal, and at least the recess-shaped inner surface has an interfacial tension energy of 15 mN / m The mounting section including a mounting section on which the thermosetting resin is mounted and formed of a material smaller than 30 mN / m, and the thermosetting resin mounted on the mounting section at each temperature. Thermosetting the thermosetting resin using a volume measuring device having a volume measuring unit that measures the height of each position of the unit with a non-contact type three-dimensional shape measuring unit and calculates the volume of the thermosetting resin A volume change measuring method for measuring a volume change in
Performing temperature control to cure the thermosetting resin, and placing part volume change measurement calculation step of measuring and calculating the volume change of the recessed part of the placement part,
A placing step of placing the thermosetting resin on the placing portion;
Using the volume change data obtained in the placement volume change measurement calculation step described above, temperature control is performed to cure the thermosetting resin, and thermosetting to measure and calculate the volume change of the thermosetting resin. It is a volume change measuring method provided with the resin volume change measurement calculation process.

The fourteenth aspect of the present invention is
A heating pedestal for heating the thermosetting resin whose main raw material is an epoxy resin, and a recess formed on the upper surface of the heating pedestal, and at least the recess-shaped inner surface was formed of a fluorocarbon resin. The height of each position of the mounting portion including the thermosetting resin mounted on the mounting portion on which the thermosetting resin is mounted on the mounting portion on which the thermosetting resin is mounted at each temperature. A volume change measuring method for measuring a volume change in thermosetting of the thermosetting resin by using a volume measuring device having a volume measuring unit that measures the volume of the thermosetting resin by measuring with a three-dimensional shape measuring unit. There,
Performing temperature control to cure the thermosetting resin, and placing part volume change measurement calculation step of measuring and calculating the volume change of the recessed part of the placement part,
A placing step of placing the thermosetting resin on the placing portion;
Using the volume change data obtained in the placement volume change measurement calculation step described above, temperature control is performed to cure the thermosetting resin, and thermosetting to measure and calculate the volume change of the thermosetting resin. It is a volume change measuring method provided with the resin volume change measurement calculation process.

  ADVANTAGE OF THE INVENTION According to this invention, the volume measuring apparatus and volume change measuring method which can measure a more exact volume change can be provided.

1 is a configuration diagram of a volume measuring device according to a first embodiment of the present invention. (A) Front cross-sectional block diagram of the fluororesin plate of the volume measuring device in Embodiment 1 concerning this invention, (b) Plane block diagram of the fluororesin plate of the volume measuring device in Embodiment 1 concerning this invention The figure which shows the process of the volume change measuring method in Embodiment 1 concerning this invention. Sectional block diagram of the vicinity of the mounting portion for explaining the state of the thermosetting resin in the volume change measuring method according to the first embodiment of the present invention. Configuration diagram of volume measuring apparatus according to Embodiment 2 of the present invention Partial configuration diagram of a volume measuring device of a modification of the first and second embodiments according to the present invention (A) Plane | planar block diagram of the mounting part of the modification of Embodiment 1, 2 concerning this invention, (b) Sectional block diagram of the mounting part of the modification of Embodiment 1, 2 concerning this invention (A) Plane | planar block diagram of the mounting part of the modification of Embodiment 1, 2 concerning this invention, (b) Sectional block diagram of the mounting part of the modification of Embodiment 1, 2 concerning this invention (A) Plane | planar block diagram of the mounting part of the modification of Embodiment 1, 2 concerning this invention, (b) Sectional block diagram of the mounting part of the modification of Embodiment 1, 2 concerning this invention The partial expanded block diagram which showed that the convex part of the fine unevenness | corrugation formed on the polyfluorinated alkyl compound film and the thermosetting resin are contacting in the volume measuring apparatus in Embodiment 3 concerning this invention Configuration diagram of a conventional volume measuring device

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 1 is a configuration diagram of the volume measuring apparatus according to the first embodiment of the present invention, and the inside of the chamber is shown as a cross-sectional view. In FIG. 1, the direction of the arrow A pointing downward toward the paper surface indicates the direction in which gravity is applied.

  In the volume measuring apparatus according to the first embodiment, a heating stage 10, a fluorocarbon resin plate 11 attached to the heating stage 10, and a chamber 12 for sealing the heating stage 10 attached with the fluorocarbon resin plate 11, It has. At this time, a known heat conductive silicone grease may be applied between the fluorocarbon resin plate 11 and the heating stage 10 for the purpose of reducing the thermal resistance of the heat transmitted from the heating stage 10. In FIG. 1, silicone grease is not shown.

  2A is a cross-sectional configuration diagram of the fluorocarbon resin plate 11, and FIG. 2B is a plan configuration diagram of the fluorocarbon resin plate 11. As will be described in detail later, the fluorocarbon resin plate 11 is formed with a concave mounting portion 13 on the upper surface 11a on which an underfill material 18 corresponding to an example of the thermosetting resin of the present invention is mounted. Has been. A laser displacement meter 20 for measuring the volume of the underfill material 18 placed on the placement unit 13 is provided above the placement unit 13 and outside the chamber 12 as shown in FIG. Yes. The laser displacement meter 20 is a known device capable of non-contact type three-dimensional surface shape measurement, and has a laser head, a CCD camera, and the like. And the glass window 15 which permeate | transmits the light irradiated toward the mounting part 13 from the laser head of the laser displacement meter 20 is formed in a part of upper surface of the chamber 12 facing the mounting part 13. FIG. The glass window 15 is attached so that the mounting portion 13 can be seen from a direction perpendicular to the upper surface 11 a of the fluorocarbon resin plate 11.

  Although the opening / closing location of the chamber 12 is not particularly limited, it is preferable that the wall including the glass window 15 functions as an upper lid from the viewpoint of good workability when placing a droplet of an underfill material described later. Further, for example, if the four corners of the upper lid have a shape fixed to a specific portion of the chamber other than the upper lid of the chamber and are configured to be rotatable about the fixed location as an axis, the operation is performed. Since it is easy, it is more preferable.

  A heater 16 and a thermocouple 17 are inserted in the heating stage 10, and these conductive wires are arranged through appropriate holes 22 formed in at least one place of the chamber 12. It is connected to a temperature controller 19 provided outside. The inside of the hole 22 is in close contact with the conductive wire connected to the heater 16 and the thermocouple 17.

  Further, the chamber 12 is provided with an exhaust port 21, and the intake port 14 a of the decompression pump 14 is directly connected to the exhaust port 21, so that the gas sealed in the chamber 12 can be sucked under reduced pressure. Further, a control unit 26 is provided that acquires volume data of the underfill material at each temperature based on the volume data measured by the laser displacement meter 20 and the temperature data by the thermocouple 17.

An example of the heating pedestal portion of the present invention corresponds to the heating stage 10 and the fluorocarbon resin plate 11 of the present embodiment, and an example of the heating portion of the present invention corresponds to the heater 16 of the present embodiment. To do. An example of the temperature measurement unit of the present invention corresponds to the thermocouple 17 of the present embodiment, and an example of the temperature control unit of the present invention corresponds to the temperature controller 19 of the present embodiment. An example of the non-contact type three-dimensional shape measuring unit of the present invention corresponds to the laser displacement meter 20 of the present embodiment, and an example of the volume measuring unit of the present invention is the laser displacement meter 20 of the present embodiment. This corresponds to the control unit 26. In addition, a well-known thing can be used for the heater 16, the thermocouple 17, the temperature controller 19, and the pressure reduction pump 14. FIG.

  The fluorocarbon resin plate 11 mounted on the heating stage 10 in this configuration and the recessed mounting portion 13 formed on the surface thereof are important parts of the present invention, and details thereof will be described below.

  First, the fluorocarbon resin plate 11 is not particularly limited. For example, polytetrafluoroethylene is used, and Teflon (registered trademark) manufactured by DuPont is preferably used. The interfacial tension energy of polytetrafluoroethylene is 18.5 mN / m, whereas the general interfacial tension energy of the epoxy resin that is the main raw material for underfill is 46 to 47 mN / m. Due to the chemical stability of the fluorocarbon resin, adhesion of the underfill to the fluorocarbon resin is reduced. From such a viewpoint, a silicone resin having an interfacial tension energy of 20 mN / m can also be suitably used as a resin plate attached to the heating stage 10. The hollow inner surface is preferably made of a material having an interfacial tension energy greater than 15 mN / m and less than 30 mN / m. When the interfacial tension energy is less than 15 mN / m, voids are often involved under the thermosetting resin, and accurate volume change measurement is somewhat difficult. On the other hand, if it is larger than 30 mN / m, the adhesive force with the thermosetting resin becomes strong, and it becomes somewhat difficult to measure the volume change accurately.

  The thickness of the fluorocarbon resin plate 11 is not particularly limited, but is preferably thicker than 1 mm and thinner than 5 mm. If it is thinner than 1 mm, the strength is reduced, and thermal deformation during heating of the fluorocarbon resin plate itself is increased, which causes inaccuracy of measurement. On the other hand, if it is thicker than 5 mm, the heat from the heating stage is not sufficiently transmitted to the underfill material 18 and it is not preferable in that it is difficult to raise the temperature uniformly.

  The mounting portion 13 formed on the fluorocarbon resin plate 11 is generated by the movement of a known laser displacement meter 20 capable of measuring a three-dimensional surface shape during measurement of a droplet of the underfill material 18 disposed thereon. It is provided to prevent the position from being changed by slight vibrations generated when the chamber 12 is installed on a movable stage or the like, or by slight vibrations generated when the chamber 12 is moved.

  The shape of the recess of the mounting portion 13 is not particularly limited, but when the underfill material 18 is disposed, it is necessary to prevent a gap from being generated between the lowermost portion of the recess and the underfill material 18. is there. This is because if there is a gap between the lowermost part of the recess and the underfill material 18, the air in the gap expands due to the temperature rise due to heating, and the volume change of the underfill material cannot be measured accurately.

  Further, the shape of the edge 25 (see FIGS. 2 (a) and 2 (b)) of the mounting portion 13 is not particularly limited, but the symmetry of the droplet of the underfill material is maintained and more accurate. From the viewpoint of easy measurement, a shape that is line-symmetric or point-symmetric is desirable, and a circle or an ellipse is more desirable. In FIG. 2B, the edge 25 is formed in a circular shape. From the same point of view, the shape obtained by cutting the recess at an arbitrary depth and in a plane parallel to the upper surface 11a of the fluorocarbon resin plate 11 in plan view is similar to the shape of the edge 25 of the recess. It is desirable that the positions of the symmetry line and the symmetry center point coincide with the symmetry line and symmetry center of the edge shape of the recess when the surface of the fluorocarbon resin plate 11 is looked down vertically. In the first embodiment, as shown in FIGS. 2 (a) and 2 (b), the cross section of the recess has a spindle shape.

  The volume measuring apparatus according to the first embodiment is configured as described above.

  Next, the volume change measuring method of the first embodiment will be described.

  First, an outline of a method for measuring the volume change of the underfill material will be described. When heating is performed under a certain temperature rise condition, the underfill material undergoes expansion of the liquid by heating, and when the temperature exceeds a certain temperature, the underfill material begins to shrink with the start of the curing reaction. And shrinkage | contraction is complete | finished by leaving for a fixed time at the fixed temperature exceeding hardening reaction start temperature. Further, when the heating is stopped and the cooling is performed in the natural standing state, this time, the shrinkage occurs as the temperature decreases.

  In this heating and cooling process, the underfill is measured by measuring the shape change of the underfill material 18 through the glass window 15 at a constant temperature rise interval, for example, every 5 ° C. rise, with the laser head and the CCD camera in the known laser displacement meter 20. Thus, the temperature dependence of the volume is obtained as a measurement result.

  Here, as the heating and cooling process, heating is performed from 25 ° C. to 175 ° C. at a rate of temperature increase of 5 ° C. per minute, and maintained at 175 ° C. until the shrinkage due to the thermosetting reaction is completed. It can be a process of stopping the function and cooling naturally.

  Next, it explains in more detail using a figure. As a measuring method of the volume change of the underfill material in the heating and cooling process, for example, the following measuring method is possible.

  FIG. 3 is a diagram showing the steps of the volume change measuring method according to the first embodiment of the present invention.

  First, as shown in step S1 of FIG. 3, a hollow mounting portion formed on the surface of the fluorocarbon resin plate 11 by heating from 25 ° C. to 175 ° C. at a heating rate of 5 ° C. per minute. Thirteen volume data are measured by the laser displacement meter 20 through the glass window 15. This measurement is performed every 5 ° C. At each temperature, the height data of each position of the placement unit 13 is sent to the control unit 26, and the control unit 26 calculates the volume data. Since the laser displacement meter 20 can measure the distance to the object, the volume of the space in the recessed portion below the upper surface 11a is measured and calculated.

  Next, in step S <b> 2, the volume is maintained at 175 ° C. for a certain period of time, and the hollow volume data of the placement unit 13 is acquired every predetermined time. Here, the control unit 26 has a timer (not shown), operates the timer from the time when the temperature reaches 175 ° C., and the height data of each position of the mounting unit 13 is obtained every predetermined time. Measured and volume data is calculated. Further, the fixed time is a time sufficient for the underfill material 18 to be thermally cured, for example, 120 minutes. The measurement time interval can be 5 minutes.

  Subsequently, when a certain time has elapsed, in step S3, the heater 16 is stopped and naturally cooled from 175 ° C. to 25 ° C., and the control unit 26 obtains the height data of each position of the mounting unit 13 every 5 ° C. Acquire and calculate volume data.

  By these steps, it is possible to measure the volume change of the recessed portion of the mounting portion 13 during the heating and cooling process. An example of the placement portion volume change measurement process of the present invention corresponds to steps S1, S2, and S3 of the present embodiment.

  Thereafter, as shown in step S4, the temperature is set again to 25 ° C., the lid portion of the chamber 12 is removed, and the droplet of the underfill material 18 changes in shape during the heating and cooling process of the surface of the fluorocarbon resin plate 11. It is dripped so that it may fall within the range of the mounting part 13 which measured. This step S4 corresponds to an example of the placing process of the present invention.

  At this time, it is desirable that the diameter of the droplet of the underfill material 18 is dripped so that the symmetry is as high as possible using the interfacial tension. Although it does not specifically limit from this viewpoint, It is desirable for the longest diameter when it sees through the glass window 15 to be 2 mm or more and 5 mm or less. When the longest diameter is smaller than 2 mm, the volume change amount is also small, and the measurement variation is large. Further, when the thickness is 5 mm or more, the droplet is deformed and spread greatly due to its own weight, and it is difficult to measure an accurate volume.

  In this manner, with the droplet of the underfill material 18 dropped on the mounting portion 13 of the fluorocarbon resin plate 11, the lid of the chamber 12 is closed and sealed, the decompression pump 14 is operated, and the inside of the chamber is atmospheric pressure. Lower atmospheric pressure.

  At this time, the atmospheric pressure in the chamber 12 is not particularly limited, but can be set to 5.6 kPa from the viewpoint of efficiently sucking volatile components from the underfill material 18. In this state, the above heating and cooling process is reproduced with a known temperature controller 19, heater 16, and thermocouple 17, and is not in contact with the fluorocarbon resin plate 11 of the underfill material 18 every 5 ° C., for example. The shape of the surface is measured through the glass window 15 with a known laser displacement meter 20 capable of non-contact, for example, three-dimensional surface shape measurement.

  More specifically, in step S5, in the same manner as in step S1 in a decompressed state, the temperature is increased from 25 ° C. to 175 ° C. at a rate of temperature increase of 5 ° C. per minute, and placed on the placement unit 13 at that time. The height data at each position on the surface of the underfill material 18 being measured is measured by the laser displacement meter 20 through the glass window 15 every 5 ° C. Then, the height data at each position in the horizontal direction on the surface of each underfill material 18 is sent to the control unit 26, and the control unit 26 calculates the volume data.

  Then, in step S6, the controller 26 operates the timer from the time when the temperature reaches 175 ° C. in the decompressed state in the same manner as in step S2, and each position on the surface of the underfill material 18 every predetermined time. The height data at is acquired and the volume data is calculated.

  Subsequently, in step S7, similarly to step S3, the heater 16 is stopped in a decompressed state, and is naturally cooled from 175 ° C. to 25 ° C., and the surface of the underfill material 18 is controlled by the control unit 26 every 5 ° C. Height data at each position is acquired, and volume data is calculated from the position data.

  In the measurement in these steps S5, S6, and S7, the laser displacement meter 20 can measure the distance to the target object, so that it is more than the edge 25 of the upper surface 11a of the fluorocarbon resin plate 11 of the mounting portion 13. The volume of the upper underfill material 18 is measured and calculated. In addition, the thermosetting resin volume change measurement calculation process of this invention respond | corresponds to step S5, S6, S7 of this Embodiment.

  FIG. 4 is a cross-sectional configuration diagram showing a state in which the underfill material 18 is placed on the placement portion 13. As shown in FIG. 4, the portion of the underfill material 18 above the edge 25 where the underfill material 18, the fluorocarbon resin, and air simultaneously contact each other is the upper portion 23, and the underfill material 18 below the edge 25. This portion is referred to as a lower portion 24. The lower portion 24 shares the edge with the upper portion 23 and is not in contact with air. In addition, the broken line in FIG. 4 is a line for convenience in the figure for distinguishing the upper part and lower part of an underfill material.

  That is, in the measurement, the volume of the upper part 23 at each measurement temperature in the heating and cooling process is measured.

  In step S8, the control unit 26 determines the volume of the recessed portion of the mounting unit 13 at each measurement temperature in the heating and cooling process previously measured in steps S1, S2, and S3 as the lower portion 24 of the underfill material 18. The volume of the underfill material 18 at each temperature can be obtained by adding the volume of the upper portion 23 at each temperature and the volume of the recessed portion of the mounting portion 13. In addition, about the volume in step S3, S6, the volume of the upper part 23 and the volume of the hollow part of the mounting part 13 are added for every measurement timing.

  As described above, by the above operation, the amount of expansion of the underfill material due to heating, the amount of shrinkage due to thermosetting, and the amount of shrinkage due to cooling after completion of thermosetting can be measured, and the respective volume changes can be obtained. it can.

  Moreover, the underfill material 18 before hardening is prepared as curable resin, and the underfill material 18 is arrange | positioned on the hollow mounting part 13. FIG. By disposing the underfill material 18 on the fluorocarbon resin plate having poor wettability with the underfill and in the recess, the underfill material 18 does not adhere to the fluorocarbon resin plate 11 when cured, and the viscosity is low. Even if it is low, it does not spread and does not change its position.

  Since the underfill material 18 is arranged under the above-described configuration, the underfill material 18 does not adhere to the fluorocarbon resin plate in the course of the heating / cooling process and does not change its position.

  As described above, in the volume measuring apparatus according to the first embodiment, compared with the apparatus shown in Patent Document 1, the adhesion between the thermosetting resin and the measurement stage, and the spread of the liquid due to the low viscosity at the time of temperature rise. Uncertainty in volume change measurement can be reduced.

  Further, in the conventional volume measuring apparatus described in Patent Document 1, since it is performed in a state where it is not sealed and is in contact with the atmosphere, it is close to air in the underfill material by heat radiation from the surface of the underfill material. It was not possible to control the temperature non-uniformity between the part and the other part. For this reason, uniform heating is not performed in the phase of the underfill material, and curing is not uniform, and there is a problem that it is difficult to accurately measure the volume change. However, in the first embodiment, since the chamber is sealed in the chamber 12, the underfill material 18 follows a uniform temperature rise and temperature drop in the droplet. Therefore, it is possible to measure the volume change of the thermosetting resin more accurately than the apparatus shown in Patent Document 1.

  Further, in the heating and cooling process, the low-pressure volatile matter from the underfill material does not stay above a certain concentration in the chamber by operating the vacuum pump 14 from the beginning and exhausting under reduced pressure through the exhaust port 21. Since the glass window does not fog up, errors in measurement values are unlikely to occur.

  In the present embodiment, the interior of the chamber 12 is not depressurized in the steps S1, S2, and S3. However, the depressurization may be performed as in steps S5, S6, and S7.

  In step S3, the same time measurement as in step S6 is performed. However, if the shape of the mounting portion 13 does not change, the measurement may be completed in a shorter time than in step S6.

  In the volume measuring apparatus of the present embodiment, the control unit 26 calculates the volume of the underfill material 18 at each temperature. The control unit 26 further calculates the volume change rate from the obtained volume. May be. For example, the volume change rate in each of the expansion process by heating, the contraction process by curing, and the contraction process by cooling can be calculated.

(Embodiment 2)
Next, the volume measuring apparatus in Embodiment 2 concerning this invention is demonstrated. The volume measuring apparatus according to the second embodiment has the same basic configuration as that of the first embodiment, but is different in the configuration of the heating stage. Therefore, this difference will be mainly described.

  FIG. 5 is a cross-sectional view showing the structure of the volume measuring apparatus according to the second embodiment of the present invention, and the inside of the chamber is shown as a cross-sectional view. In FIG. 5, it is assumed that a vertically downward arrow A indicates the direction of gravity toward the paper surface.

  The volume measuring apparatus according to the second embodiment includes a heating stage 110 made of a fluorocarbon resin, and the heating stage 110 is sealed in the chamber 12.

  On the heating stage 110 formed of a fluorocarbon resin, the above-described recessed mounting portion 13 is formed, and the mounting portion 13 plays the same role as in the first embodiment of the present invention.

  The decompression through the exhaust port 21 by the decompression pump 14 in the chamber 12, the laser displacement meter 20, the temperature controller 19, the recess shape of the placement unit 13, and the measurement method are the same as in the first embodiment of the present invention. can do.

  In the case of this second embodiment, unlike the first embodiment of the present invention, the heating part is a single phase of a fluorocarbon resin, so that the apparatus can be simplified and made of metal as in the first embodiment. Inaccuracies due to thermal deformation of the fluorocarbon resin plate when the fluorocarbon resin plate is fixed to the stage can be further reduced.

  An example of the pedestal for heating according to the present invention corresponds to the heating stage 10 and the fluorocarbon resin plate 11 in the first embodiment, and corresponds to the heating stage 110 in the second embodiment. And in the said Embodiment 1, the fluorocarbon resin board 11 is arrange | positioned on the heating stage 10, and the mounting part 13 is formed in the fluorocarbon resin board 11, In this Embodiment 2, Although the mounting portion 13 is formed on the heating stage 110 formed of a fluorocarbon resin, it is only necessary that at least the inner surface of the mounting portion 13 is formed of a fluorocarbon resin. FIG. 6 is a partial cross-sectional configuration diagram of the heating stage 111 having such a configuration. As shown in FIG. 6, a mounting portion 13 similar to that of Embodiments 1 and 2 is formed on the heating stage 111 corresponding to an example of the heating pedestal portion of the present invention. The inner surface is formed by a fluorocarbon resin 27.

  Further, in the first and second embodiments, only one recessed mounting portion 13 is formed, but a plurality of mounting portions 13 may be formed.

  Moreover, the shape of the mounting portion 13 in the first and second embodiments is a circular shape in a plan view, and the cross section is a spindle shape. However, the shape is not limited to this, but various shapes are possible. As described above, in a plan view, the shape obtained by cutting the mounting portion at an arbitrary depth by a plane parallel to the upper surface 11a of the fluorocarbon resin plate 11 is similar to the shape of the edge 25 of the mounting portion. It is desirable that the positions of the symmetry line and the symmetry center point coincide with the symmetry line and the symmetry center of the edge shape of the placement portion when the upper surface 11a of the fluorocarbon resin plate 11 is looked down vertically.

  FIG. 7A is a plan configuration diagram of the placement portion 131 of the edge 251 having an elliptical shape in plan view, and FIG. 7B is a cross-sectional configuration diagram of the placement portion 131. As shown in FIGS. 7A and 7B, the shape of the edge 251 of the mounting portion 131 is point-symmetric with the point 131a as a symmetric point, and the mounting portion 131 has an arbitrary depth on the upper surface 11a. The shape cut by the parallel plane is similar to the shape of the edge 251 and the position of the symmetry point coincides with the point 131a.

  8A is a plan configuration diagram of the placement portion 132 of the edge 252 having a rhombus shape in plan view, and FIG. 8B is a cross-sectional configuration diagram of the placement portion 132. The rhombus shape of the edge 252 of the mounting portion 132 is point-symmetric with respect to the point 132a. And the shape which cut | disconnected the mounting part 132 by the surface parallel to the upper surface 11a by arbitrary depths is similar to the shape of the edge 252, and the position of the symmetrical point corresponds with the point 132a.

  9A is a plan configuration diagram of the mounting portion 133 of the edge 253 having a triangular shape in plan view, and FIG. 9B is a cross-sectional configuration diagram of the mounting portion 133. The triangular shape of the edge 253 of the mounting portion 133 is line symmetric with respect to the line 133S. And the shape which cut | disconnected the mounting part 133 by the surface parallel to the upper surface 11a by arbitrary depth is similar to the shape of the edge 253, and the symmetrical line corresponds with the line 133S.

(Embodiment 3)
Next, the volume measuring apparatus in Embodiment 3 concerning this invention is demonstrated. In the volume measuring apparatus according to the third embodiment, the inner surface of the mounting portion 13 has a fractal structure composed of a polyfluorinated alkyl compound.

  The polyfluorinated alkyl compound is not particularly limited as long as it is a polymer having a fluorine-containing hydrophobic group. For example, as shown in JP-A-2008-189705, an alkyl group or an alkenyl group can be A fluorine-containing component in which at least a part of the atoms is substituted with fluorine atoms can be used.

  Since the polyfluorinated alkyl compound has poor wettability with the underfill material, the surface area of the polyfluorinated alkyl compound has a fractal structure as shown in FIG. It can be made even smaller than a normal fluorocarbon resin.

  Accordingly, the adhesion with the underfill material 18 is reduced, and the measurement inaccuracy due to the restraint due to the adhesion can be further reduced.

  The range of the width and height of the fractal structure is not particularly limited, but it is desirable that the fractal structure has fine irregularities larger than 10 nm and smaller than 800 μm. If the thickness is smaller than 10 nm, the surface thereof is close to a flat surface and is not uneven. If the thickness is larger than 800 μm, the underfill enters the concave portion due to its own weight, and the contact area cannot be sufficiently reduced.

  In addition, the shape of each unevenness forming the fractal structure is not limited, and any shape such as a scale shape, a prism shape, a column shape, a pyramid shape, a cone shape, or a needle shape may be used. May be mixed. Formation of the surface fractal structure by the polyfluorinated alkyl compound can be formed by a polyfluorinated alkylpyrrole film as described in the above document (Japanese Patent Laid-Open No. 2008-189705). The decompression through the exhaust port 21 by the decompression pump 14 in the chamber 12, the shape of the indentation of the laser displacement meter 20, the temperature controller 19, the placement unit 13, and the measurement method are the same as those in the first embodiment. be able to.

  As described above, in the volume measuring apparatus according to the first to third embodiments, measurement by adhesion is performed on a thermosetting resin having low adhesion and strong adhesion to a base material such as an underfill. In the process of volume expansion due to heating, volume contraction due to curing, and volume contraction due to cooling after curing without causing inaccuracies, the amount of change in volume at each temperature can be accurately measured.

  Therefore, based on the values measured by the volume measuring devices of the first to third embodiments, it is possible to accurately and predictably calculate the stress generated in the semiconductor device, for example, in the resin filling and curing process of the semiconductor package. Thus, the semiconductor device designed based on the above can be made highly reliable with reduced internal stress.

  According to the volume measuring device and the volume change measuring method of the present invention, it is possible to measure the volume change more accurately, which is useful as a volume measuring device and a volume change measuring method for measuring the volume change of the thermosetting resin. is there.

DESCRIPTION OF SYMBOLS 10, 110, 111 Heating stage 11 Fluorocarbon resin board 12 Chamber 13, 131, 132, 133 Mounting part 14 Depressurization pump 15 Glass window 16 Heater 17 Thermocouple 18 Underfill material 19 Temperature controller 20 Laser displacement meter 21 Exhaust Mouth 22 Hole 23 Polyfluorinated alkyl compound film 24 Concavity and convexity 25, 251, 252, 253 Edge 26 Control unit 27 Fluorocarbon resin 101 Measurement stage 102 Paint 103 Laser displacement meter

Claims (14)

A volume measuring device for measuring a volume in thermosetting of a thermosetting resin whose main raw material is an epoxy resin ,
A heating pedestal for heating the thermosetting resin;
The thermosetting resin, which is formed in a concave shape on the upper surface of the heating pedestal portion and at least the concave inner surface is formed of a material having an interfacial tension energy of greater than 15 mN / m and smaller than 30 mN / m, is placed. A mounting unit;
A heating unit for heating the pedestal for heating;
A temperature measuring unit for measuring the temperature of the heating pedestal, and
A temperature control unit that controls the temperature of the heating unit based on the temperature measured by the temperature measurement unit;
At each temperature, the height of each position of the mounting part including the thermosetting resin placed on the mounting part is measured by a non-contact type three-dimensional shape measuring part, and the volume of the thermosetting resin is measured. A volume measuring device comprising a volume measuring unit for calculation . A volume measuring device for measuring a volume in thermosetting of a thermosetting resin whose main raw material is an epoxy resin ,
A heating pedestal for heating the thermosetting resin;
A mounting portion on which the thermosetting resin is placed, wherein the heating pedestal portion is formed in a concave shape on the upper surface, and at least the concave inner surface is formed of a fluorocarbon resin;
A heating unit for heating the pedestal for heating;
A temperature measuring unit for measuring the temperature of the heating pedestal, and
A temperature control unit that controls the temperature of the heating unit based on the temperature measured by the temperature measurement unit;
At each temperature, the height of each position of the mounting part including the thermosetting resin placed on the mounting part is measured by a non-contact type three-dimensional shape measuring part, and the volume of the thermosetting resin is measured. A volume measuring device comprising a volume measuring unit for calculation .   The volume measuring device according to claim 1, wherein the volume measuring unit calculates a volume change based on the measured volume. The said volume measurement part measures the volume of the said thermosetting resin using the volume of the hollow part of the said mounting part measured using the said non-contact-type three-dimensional shape measurement part. The volume measuring apparatus described.   The volume measuring apparatus in any one of Claims 1-4 provided with the chamber which seals the said base for heating. The chamber is
The volume measuring apparatus according to claim 5, further comprising a glass window through which light irradiated from the non-contact type three-dimensional shape measuring unit toward the mounting unit is transmitted. The chamber has an exhaust port;
The exhaust port further includes a decompression pump connected to the decompression port,
The volume measuring apparatus according to claim 5 or 6, wherein the inside of the chamber is depressurized by the operation of the decompression pump. The shape of the mounting part is
In plan view, the shape of the edge is line symmetric or point symmetric,
The cross-sectional shape parallel to the upper surface of the heating pedestal portion is similar to the shape of the edge of the mounting portion,
The volume measuring device according to claim 1, wherein a position of a symmetry line or a symmetry point of the cross-sectional shape is coincident with a position of a symmetry line or a symmetry point of the edge shape. The constituent molecules on the inner surface of the mounting part form a fractal structure having fine irregularities,
The volume measuring apparatus according to any one of claims 1 to 8, wherein a width and a height of the unevenness are larger than 10 nm and smaller than 800 µm.   The volume measuring apparatus according to claim 9, wherein the fractal structure is formed of a polyfluorinated alkyl compound film. The heating pedestal is
A heating stage;
A fluorocarbon resin plate disposed on the upper surface of the heating stage;
The volume measuring device according to claim 1, wherein the placement portion is formed on the fluorocarbon resin plate.   The volume measuring device according to claim 1, wherein the heating pedestal is formed of a fluorocarbon resin. A heating pedestal for heating the thermosetting resin whose main raw material is an epoxy resin, and a recess formed on the upper surface of the heating pedestal, and at least the recess-shaped inner surface has an interfacial tension energy of 15 mN / m The mounting section including a mounting section on which the thermosetting resin is mounted and formed of a material smaller than 30 mN / m, and the thermosetting resin mounted on the mounting section at each temperature. Thermosetting the thermosetting resin using a volume measuring device having a volume measuring unit that measures the height of each position of the unit with a non-contact type three-dimensional shape measuring unit and calculates the volume of the thermosetting resin A volume change measuring method for measuring a volume change in
Performing temperature control to cure the thermosetting resin, and placing part volume change measurement calculation step of measuring and calculating the volume change of the recessed part of the placement part,
A placing step of placing the thermosetting resin on the placing portion;
Using the volume change data obtained in the placement volume change measurement calculation step described above, temperature control is performed to cure the thermosetting resin, and thermosetting to measure and calculate the volume change of the thermosetting resin. A volume change measurement method comprising: a resin volume change measurement calculation step. A heating pedestal for heating the thermosetting resin whose main raw material is an epoxy resin, and a recess formed on the upper surface of the heating pedestal, and at least the recess-shaped inner surface was formed of a fluorocarbon resin. The height of each position of the mounting portion including the thermosetting resin mounted on the mounting portion on which the thermosetting resin is mounted on the mounting portion on which the thermosetting resin is mounted at each temperature. A volume change measuring method for measuring a volume change in thermosetting of the thermosetting resin by using a volume measuring device having a volume measuring unit that measures the volume of the thermosetting resin by measuring with a three-dimensional shape measuring unit. There,
Performing temperature control to cure the thermosetting resin, and placing part volume change measurement calculation step of measuring and calculating the volume change of the recessed part of the placement part,
A placing step of placing the thermosetting resin on the placing portion;
Using the volume change data obtained in the placement volume change measurement calculation step described above, temperature control is performed to cure the thermosetting resin, and thermosetting to measure and calculate the volume change of the thermosetting resin. A volume change measurement method comprising: a resin volume change measurement calculation step.

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