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JP5697145B2 - Birefringence phase matching wavelength conversion device and method for manufacturing the device - Google Patents
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JP5697145B2 - Birefringence phase matching wavelength conversion device and method for manufacturing the device - Google Patents

Birefringence phase matching wavelength conversion device and method for manufacturing the device Download PDF

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JP5697145B2
JP5697145B2 JP2011045454A JP2011045454A JP5697145B2 JP 5697145 B2 JP5697145 B2 JP 5697145B2 JP 2011045454 A JP2011045454 A JP 2011045454A JP 2011045454 A JP2011045454 A JP 2011045454A JP 5697145 B2 JP5697145 B2 JP 5697145B2
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一郎 庄司
庄司  一郎
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Chuo University
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Description

本発明は、レーザー光の波長を変換する波長変換デバイスとその製造方法に関し、特に非線形光学結晶から成る複数のプレートを積層して成る複屈折位相整合波長変換デバイスに関する。   The present invention relates to a wavelength conversion device for converting the wavelength of laser light and a method for manufacturing the same, and more particularly to a birefringence phase matching wavelength conversion device formed by laminating a plurality of plates made of nonlinear optical crystals.

深紫外光発生用の非線形光学結晶として、紫外領域で透明であり高い非線形光学定数を有するβ−BaB24(以下、BBOという)が広く用いられている。
しかし、BBOは大きな複屈折性を有するため、図8(a)に示すように、波長変換デバイス50としてバルク状の結晶50Bを用いた場合には、同図の実線で示す常光(o-ray)が入射光軸に沿って出射されるのに対し、同図の太い実線で示す異常光(e-ray)の出射方向が入射光軸からずれてしまう、いわゆる、ウォークオフが大きくなるため、位相整合に必要な相互作用長が制限されるという問題点があった。
このウォークオフを補償する方法として、図8(b)に示すように、結晶のc軸が光の入射光軸に対して位相整合角θだけ傾く複数枚のプレート(ここでは、プレート枚数をN=2とした)を、互いに隣接するプレート51a,51bの結晶のc軸の方向を反転させて配置することで相互作用長を長くしてウォークオフ量ΔZを小さくする方法が提案されている(例えば、非特許文献1参照)。
波長変換デバイス50の全長が同じ場合には、図8(c)に示すように、厚さの薄いプレート52a,52bを、隣接するプレート52a,52bの結晶のc軸の方向が反転するよう多数(N=8)配置した方がウォークオフ補償(WOC;Walk-Off Compensating)効果が大きく、変換効率も高い。
As a nonlinear optical crystal for generating deep ultraviolet light, β-BaB 2 O 4 (hereinafter referred to as BBO) that is transparent in the ultraviolet region and has a high nonlinear optical constant is widely used.
However, since BBO has a large birefringence, as shown in FIG. 8A, when a bulk crystal 50B is used as the wavelength conversion device 50, ordinary light (o-ray) indicated by a solid line in FIG. ) Is emitted along the incident optical axis, whereas the emission direction of the extraordinary light (e-ray) indicated by the thick solid line in FIG. There is a problem that the interaction length necessary for phase matching is limited.
As a method for compensating for this walk-off, as shown in FIG. 8 (b), a plurality of plates (here, the number of plates is defined as N) where the c-axis of the crystal is inclined by the phase matching angle θ with respect to the incident optical axis of light. = 2) is arranged by reversing the c-axis direction of the crystals of the plates 51a and 51b adjacent to each other to increase the interaction length and reduce the walk-off amount ΔZ ( For example, refer nonpatent literature 1).
When the total length of the wavelength conversion device 50 is the same, as shown in FIG. 8C, a large number of thin plates 52a and 52b are arranged so that the c-axis direction of the crystals of the adjacent plates 52a and 52b is reversed. The (N = 8) arrangement has a larger walk-off compensation (WOC) effect and higher conversion efficiency.

J.-J.Zondy ,Ch.Bonnin and D.Lupinski ,J.Opt.Soc. Am.B 20,1675(2003)J.-J.Zondy, Ch.Bonnin and D.Lupinski, J.Opt.Soc. Am.B 20,1675 (2003)

しかしながら、上記従来の波長変換デバイスでは、ウォークオフ量ΔZを小さくするためには、厚さの薄いプレートを多数準備する必要があり、産業用等のデバイスとして広く活用するには生産性の点で難がある。また、上記波長変換デバイスは、単にプレート同士を当接させているだけなので、プレート接合面で隙間ができるだけでなく、c軸の傾きと位相整合角θとの間にずれが生じてしまい、結果として変換効率が大幅に低下するといった問題点があった。
2枚のプレート同士を接合する方法としては、表面をケミカルエッチングした後に圧着させる方法などが考えられるが、この場合にも、2枚のプレートの界面に原子レベル以上の隙間ができてしまい、そのため、光が界面で散乱されて十分な変換効率を得ることが困難であった。
However, in the conventional wavelength conversion device, in order to reduce the walk-off amount ΔZ, it is necessary to prepare a large number of thin plates, and in terms of productivity to be widely used as industrial devices. There are difficulties. In addition, since the wavelength conversion device is simply contacting the plates, not only can there be a gap at the plate joint surface, but a deviation occurs between the inclination of the c-axis and the phase matching angle θ. As a result, there is a problem that the conversion efficiency is greatly reduced.
As a method of joining two plates together, a method of performing pressure etching after chemically etching the surface is conceivable. However, in this case as well, a gap of an atomic level or more is formed at the interface between the two plates. It is difficult to obtain sufficient conversion efficiency because light is scattered at the interface.

本発明は、従来の問題点に鑑みてなされたもので、少ないプレート数で効率良くウォークオフを低減することのできる複屈折位相整合波長変換デバイスと、変換効率の高い複屈折位相整合波長変換デバイスを容易に製造する方法を提供することを目的とする。   The present invention has been made in view of the conventional problems, and a birefringence phase matching wavelength conversion device capable of efficiently reducing the walk-off with a small number of plates and a birefringence phase matching wavelength conversion device having high conversion efficiency. An object of the present invention is to provide a method for easily manufacturing the above.

上記課題を解決するため本願発明の構成として、互いに接合され、結晶のc軸が厚さ方向に平行な面内において厚さ方向に対して傾く非線形光学結晶から成る複数のプレートを備え、複数のプレートの配置が互いに隣接するプレートのc軸の方向が接合面に対して面対称であり、複数のプレートにおけるレーザー光の入射側端部の入射側プレートと、レーザー光の高調波を出射する出射側端部の出射側プレートとの間に位置するプレートの厚さが同一であり、入射側プレート及び出射側プレートの厚さが、入射側プレートと出射側プレートとの間に位置するプレートの厚さの1/2である構成とした。
本構成によれば、波長変換デバイスのウォークオフ量を厚さの薄い(結晶長の短い)入射側プレート及び出射側プレートのウォークオフ量と同じにできるので、少ないプレート数でウォークオフを効果的に低減することができる。
In order to solve the above-mentioned problems, the present invention includes a plurality of plates made of nonlinear optical crystals that are bonded to each other and in which the c-axis of the crystal is inclined with respect to the thickness direction in a plane parallel to the thickness direction. The c-axis directions of the plates adjacent to each other are plane-symmetric with respect to the joining surface, and the incident side plate at the incident side end of the laser beam and the emission of the harmonics of the laser beam in a plurality of plates The thickness of the plate located between the exit side plate at the side end is the same, and the thickness of the entrance side plate and the exit side plate is the thickness of the plate located between the entrance side plate and the exit side plate. It was set as the structure which is 1/2.
According to this configuration, the walk-off amount of the wavelength conversion device can be made the same as the walk-off amount of the incident side plate and the emission side plate with a thin thickness (short crystal length), so the walk-off is effective with a small number of plates. Can be reduced.

また、本願発明の他の構成として、非線形光学結晶がβ−BBO結晶又はLBO結晶である構成とした。
本願構成によれば、非線形光学結晶として、高品質の結晶が得られ易く損傷閾値の高いβ−BBO結晶やLBO結晶を用いることにより変換効率の高くかつ安定した性能を有する複屈折位相整合波長変換デバイスを得ることができる。
As another configuration of the present invention, the nonlinear optical crystal is a β-BBO crystal or an LBO crystal.
According to the configuration of the present application, a birefringence phase matching wavelength conversion having a high conversion efficiency and a stable performance by using a β-BBO crystal or an LBO crystal, which is easy to obtain a high quality crystal as a nonlinear optical crystal and has a high damage threshold. You can get a device.

また、製造方法に係る態様として、結晶のc軸が厚さ方向に平行な面内において厚さ方向に対して傾く非線形光学結晶から成る同一な厚さのプレート同士をc軸の方向が接合面に対して面対称となるように対向させ、プレート同士の接合面となる表面に原子ビーム、分子ビーム、イオンビームのうちいずれかを照射して表面を活性化処理する工程と、活性化処理されたプレート同士の表面を常温にて接合する工程と、接合されたプレート群の両端部に、当該プレート群を構成する前記各プレートの1/2の厚さを有し、結晶のc軸が厚さ方向に平行な面内において厚さ方向に対して傾く非線形光学結晶から成るプレートを接合するに際し、当該1/2の厚さを有するプレートをc軸の方向が接合面に対して面対称となるように対向させ、プレート同士の接合面となる表面に原子ビーム、分子ビーム、イオンビームのうちいずれかを照射して表面を活性化処理する工程と、活性化処理されたプレート同士の表面を常温にて接合する工程とを備えた態様とした。
本願態様によれば、結晶のc軸が厚さ方向に平行な面内において厚さ方向に対して傾く非線形光学結晶から成るプレート同士を短時間のうちに原子レベルで接合できるので、変換効率の高い複屈折位相整合波長変換デバイスを容易に製造できる。また、プレート群を構成する各プレートの1/2の厚さを有し、結晶のc軸が厚さ方向に平行な面内において厚さ方向に対して傾く非線形光学結晶から成るプレート同士を短時間のうちに原子レベルで接合でき、さらに波長変換デバイスのウォークオフ量を入射側プレート及び出射側プレートのウォークオフ量と同じにできるので、変換効率の高い複屈折位相整合波長変換デバイスを容易に製造できる。
Further, as an aspect related to the manufacturing method, the plates having the same thickness made of nonlinear optical crystals in which the c-axis of the crystal is inclined with respect to the thickness direction in a plane parallel to the thickness direction are bonded to each other in the c-axis direction. A process of activating the surface by irradiating one of an atomic beam, a molecular beam, and an ion beam on the surface that is a plane of symmetry with respect to the plate and irradiating the surface to be a bonding surface between the plates. Bonding the surfaces of the plates at room temperature , and having both thicknesses of the plates constituting the plate group at both ends of the joined plate group, and the c-axis of the crystal being thick When joining a plate made of a nonlinear optical crystal that is inclined with respect to the thickness direction in a plane parallel to the thickness direction, the plate having the thickness of 1/2 is symmetrical with respect to the joining surface in the c-axis direction. Facing each other and pre- A process of activating the surface by irradiating one of an atomic beam, a molecular beam, or an ion beam onto the surface to be a joint surface between the two, and a process of joining the surfaces of the activated plates at room temperature It was set as the aspect provided with.
According to the aspect of the present application, since the plates made of the nonlinear optical crystal in which the c-axis of the crystal is inclined with respect to the thickness direction in a plane parallel to the thickness direction can be joined at an atomic level in a short time, conversion efficiency is improved. A high birefringence phase matching wavelength conversion device can be easily manufactured. Further, the plates made of a nonlinear optical crystal having a thickness that is 1/2 that of each plate constituting the plate group and in which the c-axis of the crystal is inclined with respect to the thickness direction in a plane parallel to the thickness direction are short. It can be bonded at the atomic level in time, and the walk-off amount of the wavelength conversion device can be made the same as the walk-off amount of the entrance side plate and the exit side plate, making it easy to create a birefringence phase matching wavelength conversion device with high conversion efficiency. Can be manufactured.

また、製造方法に係る他の態様として、1/2の厚さを有するプレートにおける入射端面となる面と出射端面となる面をのみを無反射コーティング処理する工程を備えた態様とした。
本願態様によれば、入射側に配置されるプレートと出射側に配置されるプレートの入射端面と出射端面のみをコーティング処理しているので、各接合面での損失を大幅に低減できるとともに、中間プレートの枚数を増やす場合にも同じ常温接合条件で済むので、生産効率が向上する。
なお、前記発明の概要は、本発明の必要な全ての特徴を列挙したものではなく、これらの特徴群のサブコンビネーションもまた、発明となり得る。
Further, as another aspect relating to the manufacturing method, an aspect is provided that includes a step of applying a non-reflective coating only to the surface serving as the incident end face and the surface serving as the exit end face of the plate having a thickness of 1/2.
According to the aspect of the present application, since only the incident end face and the exit end face of the plate arranged on the incident side and the plate arranged on the exit side are coated, the loss at each joint surface can be greatly reduced, and the intermediate When the number of plates is increased, the same room temperature bonding condition is sufficient, so that the production efficiency is improved.
The summary of the invention does not list all necessary features of the present invention, and sub-combinations of these feature groups can also be the invention.

本発明の実施の形態に係る複屈折位相整合波長変換デバイスの構成を示す図である。It is a figure which shows the structure of the birefringent phase matching wavelength conversion device which concerns on embodiment of this invention. 複屈折位相整合波長変換デバイスの動作を説明するための図である。It is a figure for demonstrating operation | movement of a birefringence phase matching wavelength conversion device. 本実施の形態に係る複屈折位相整合波長変換デバイスの製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the birefringence phase matching wavelength conversion device which concerns on this Embodiment. プレートの切り出し方法の一例を示す図である。It is a figure which shows an example of the cutting method of a plate. 常温接合装置の構成を示す模式図である。It is a schematic diagram which shows the structure of a room temperature bonding apparatus. プレートの接合方法を示す図である。It is a figure which shows the joining method of a plate. 複屈折位相整合波長変換デバイスの変換特性を示す図である。It is a figure which shows the conversion characteristic of a birefringence phase matching wavelength conversion device. 従来の複屈折位相整合波長変換デバイスの構成を示す図である。It is a figure which shows the structure of the conventional birefringence phase matching wavelength conversion device.

以下、実施の形態を通じて本発明を詳説するが、以下の実施の形態は特許請求の範囲に係る発明を限定するものでなく、また、実施の形態の中で説明される特徴の組み合わせの全てが発明の解決手段に必須であるとは限らない。   Hereinafter, the present invention will be described in detail through embodiments, but the following embodiments do not limit the invention according to the claims, and all combinations of features described in the embodiments are included. It is not necessarily essential for the solution of the invention.

図1は本発明の実施の形態を示す図で、(a)図は複屈折位相整合波長変換デバイス(以下、波長変換デバイスという)を示す図、(b)図は波長変換デバイスの各プレートと結晶のc軸との関係を示す図、(c)図は入射光及び常光の光軸方向とプレートの結晶のc軸との関係を示す図である。
本例の波長変換デバイス10は、非線形光学結晶であるβ−BaB24の単結晶(以下、BBOという)から成る複数枚のプレートを備え、レーザー装置20から入射された波長がλ1=532nmのレーザー光(基本波)を波長変換して、前記基本波の第2高調波(SH)である波長がλ2=266nmのレーザー光を出射する。各プレートは、互いに隣接する板面同士を接合面として、後述する常温接合法により接合されている。
波長変換デバイス10を構成するプレートは、厚さがdの4枚のプレート11(111〜114)と厚さがd/2の2枚のプレート12(121,122)とを備え、プレート121がレーザー装置20の入射側に配置され、プレート122がレーザー装置20の波長変換デバイス10の出射側に配置される。
プレート111〜114はプレート121とプレート122との間に配置される。以下、必要に応じて、プレート121を入射側プレート、プレート122を出射側プレート、プレート111〜114を中間プレートと呼ぶ。
プレート11,12及びプレート11,11は、互いに隣接するプレートの結晶のc軸の方向が接合面に対して面対称になるように配置される。
ここで、図1(a)の左右方向である常光の光軸方向であるプレートの板面に垂直な方向を厚さ方向もしくはx軸方向、紙面に垂直な方向を幅方向もしくはy軸方向、上下方向を高さ方向もしくはz軸方向とすると、プレート121のc軸とプレート112,114のc軸とは、厚さ方向に平行な面(z-x面)内において、厚さ方向に対し反時計回りに位相整合角θだけ傾いている。一方、プレート122のc軸とプレート111,113のc軸とは、厚さ方向に平行な面(z-x面)内において、厚さ方向に対し(π−θ)だけ傾いている。位相整合角θは非線形光学結晶の種類や入射する波長によっても異なるが、BBOの場合位相整合角θは例えば45°〜50°の範囲にある。
1A and 1B are diagrams showing an embodiment of the present invention, in which FIG. 1A shows a birefringence phase matching wavelength conversion device (hereinafter referred to as a wavelength conversion device), and FIG. 1B shows each plate of the wavelength conversion device. The figure which shows the relationship with the c-axis of a crystal | crystallization, (c) A figure is a figure which shows the relationship between the optical axis direction of incident light and normal light, and the c-axis of the crystal | crystallization of a plate.
The wavelength conversion device 10 of this example includes a plurality of plates made of a single crystal (hereinafter referred to as BBO) of β-BaB 2 O 4 which is a nonlinear optical crystal, and the wavelength incident from the laser device 20 is λ 1 = A wavelength of 532 nm laser light (fundamental wave) is converted, and a laser light having a wavelength of λ 2 = 266 nm, which is the second harmonic (SH) of the fundamental wave, is emitted. Each plate is joined by a room temperature joining method to be described later with plate surfaces adjacent to each other as joining surfaces.
The plate constituting the wavelength conversion device 10 includes four plates 11 (111 to 114) having a thickness of d and two plates 12 (121, 122) having a thickness of d / 2. The plate 122 is disposed on the incident side of the laser device 20, and the plate 122 is disposed on the emission side of the wavelength conversion device 10 of the laser device 20.
The plates 111 to 114 are disposed between the plate 121 and the plate 122. Hereinafter, as necessary, the plate 121 is referred to as an incident side plate, the plate 122 is referred to as an output side plate, and the plates 111 to 114 are referred to as intermediate plates.
The plates 11 and 12 and the plates 11 and 11 are arranged so that the c-axis directions of the crystals of the plates adjacent to each other are plane-symmetric with respect to the bonding surface.
Here, the direction perpendicular to the plate surface of the plate that is the optical axis direction of ordinary light that is the left-right direction in FIG. 1A is the thickness direction or the x-axis direction, and the direction perpendicular to the paper surface is the width direction or the y-axis direction. When the vertical direction is the height direction or the z-axis direction, the c-axis of the plate 121 and the c-axis of the plates 112 and 114 are counterclockwise with respect to the thickness direction in a plane parallel to the thickness direction (zx plane). It is tilted around the phase matching angle θ. On the other hand, the c-axis of the plate 122 and the c-axis of the plates 111 and 113 are inclined by (π−θ) with respect to the thickness direction in a plane parallel to the thickness direction (zx plane). The phase matching angle θ varies depending on the type of nonlinear optical crystal and the incident wavelength, but in the case of BBO, the phase matching angle θ is in the range of 45 ° to 50 °, for example.

次に、図2を参照して上記構成からなる波長変換デバイス10の動作を説明する。
レーザー装置20から照射された波長がλ1=532nmのレーザー光は、波長変換デバイス10の入射端面である入射側プレート121のレーザー装置20側の板面に垂直に入射する。この入射光は入射側プレート121の入射端面において複屈折して常光(o-ray)と異常光(e-ray)とに分離する。常光(o-ray)の屈折率noは入射光の光軸に対する角度依存はないが、異常光(e-ray)の屈折率neは入射光の光軸と結晶の光学軸であるc軸との成す角度によって変化するので、常光(o-ray)はレーザー光の入射方向に直進し、異常光(e-ray)は−z方向に屈折する。
入射側プレート121のc軸はBBOの位相整合角θだけ傾いているので、常光(o-ray)と異常光(e-ray)とは位相整合する。その結果、第2のプレート111の出射端面からは基本波であるλ1=532nmのレーザー光の第2高調波(SH;波長λ2=266nm)が出射される。常光(o-ray)と異常光(e-ray)との成す角度であるウォークオフ角をρとすると、入射側プレート121におけるウォークオフ量はΔZ=(d/2)・tanρとなる。
入射側プレート121から出射した常光(o-ray)と異常光(e-ray)とはレーザー装置20側の中間プレート111に入射し、常光(o-ray)はレーザー光の入射方向に直進する。
一方、中間プレート111では、c軸の方向が隣接する入射側プレート121のc軸と接合面に対して面対称になるように配置されているので、異常光(e-ray)は+z方向、すなわち、常光(o-ray)の進行方向に屈折する。これにより、相互作用長が長くなるので変換効率が向上する。
中間プレート111での異常光(e-ray)のズレ量はΔz’=d・tanρと入射側プレート121のウォークオフ量ΔZの2倍になるが、常光(o-ray)の光軸方向とのズレ量であるウォークオフ量ΔZ’はΔZ’=(d/2)・tanρで入射側プレート121におけるウォークオフ量ΔZと等しい。
Next, the operation of the wavelength conversion device 10 having the above configuration will be described with reference to FIG.
Laser light with a wavelength of λ 1 = 532 nm emitted from the laser device 20 is perpendicularly incident on the plate surface on the laser device 20 side of the incident side plate 121 that is the incident end surface of the wavelength conversion device 10. This incident light is birefringent at the incident end face of the incident side plate 121 and separated into ordinary light (o-ray) and extraordinary light (e-ray). Ordinary (o-ray) refractive index n o of is not angular dependence with respect to the optical axis of the incident light, the refractive index n e of the extraordinary light (e-ray) is an optical axis of the crystal and the optical axis of the incident light c Since it varies depending on the angle formed with the axis, ordinary light (o-ray) travels straight in the direction of incidence of laser light, and extraordinary light (e-ray) is refracted in the −z direction.
Since the c-axis of the incident side plate 121 is inclined by the BBO phase matching angle θ, the ordinary light (o-ray) and the extraordinary light (e-ray) are phase-matched. As a result, the second harmonic (SH; wavelength λ 2 = 266 nm) of the laser light having a fundamental wave of λ 1 = 532 nm is emitted from the emission end face of the second plate 111. When the walk-off angle that is an angle formed by ordinary light (o-ray) and extraordinary light (e-ray) is ρ, the walk-off amount in the incident side plate 121 is ΔZ = (d / 2) · tan ρ.
The ordinary light (o-ray) and extraordinary light (e-ray) emitted from the incident side plate 121 are incident on the intermediate plate 111 on the laser device 20 side, and the ordinary light (o-ray) travels straight in the incident direction of the laser light. .
On the other hand, in the intermediate plate 111, the c-axis direction is arranged so as to be plane-symmetric with respect to the c-axis and the joint surface of the adjacent incident-side plate 121, so abnormal light (e-ray) is in the + z direction, That is, the light is refracted in the traveling direction of ordinary light (o-ray). Thereby, since the interaction length becomes long, the conversion efficiency is improved.
The amount of deviation of the extraordinary light (e-ray) at the intermediate plate 111 is twice the amount of Δz ′ = d · tanρ and the walk-off amount ΔZ of the incident side plate 121, but the optical axis direction of ordinary light (o-ray) The walk-off amount ΔZ ′, which is a deviation amount, is equal to the walk-off amount ΔZ in the incident side plate 121 at ΔZ ′ = (d / 2) · tanρ.

同様に、中間プレート112,113,114では、それぞれ、c軸の方向が隣接する中間プレート111,112,113のc軸の方向と接合面に対して面対称になるように配置されているので、異常光(e-ray)は、中間プレート112では−z方向に、中間プレート113では+z方向に、中間プレート114では−z方向に屈折する。このとき、中間プレート112,113,114での異常光(e-ray)のズレ量はいずれも、Δz’=d・tanρとなる。また、ウォークオフ量ΔZ’は入射側プレート121及び中間プレート111におけるウォークオフ量ΔZと等しくなる。
端部側の中間プレート114から出射した常光(o-ray)と異常光(e-ray)とは出射側プレート122に入射し、常光(o-ray)はレーザー光の入射方向に直進して出射側プレート122のレーザー装置20とは反対側の板面から出射される。出射側プレート122の結晶のc軸の方向は端部側の中間プレート114のc軸と接合面に対して面対称になるように配置されているので、異常光(e-ray)は+z方向に屈折して出射される。
出射側プレート122は、厚さが中間プレート114の半分であるので、異常光(e-ray)のズレ量Δzもウォークオフ量ΔZもΔz=ΔZ=(d/2)・tanρとなる。
このように、波長変換デバイス10では、中間プレートとして4枚の厚さがdのプレート111〜114を使用していても、ウォークオフ量を厚さがd/2のプレートを使用した場合と同じΔZ=(d/2)・tanρにすることができるので、少ないプレート数でウォークオフを効果的に低減することができる。
Similarly, the intermediate plates 112, 113, and 114 are disposed so that the c-axis direction is plane-symmetric with respect to the c-axis direction and the joint surface of the adjacent intermediate plates 111, 112, and 113, respectively. The extraordinary light (e-ray) is refracted in the −z direction in the intermediate plate 112, in the + z direction in the intermediate plate 113, and in the −z direction in the intermediate plate 114. At this time, the amount of deviation of the extraordinary light (e-ray) at the intermediate plates 112, 113, 114 is Δz ′ = d · tanρ. Further, the walk-off amount ΔZ ′ is equal to the walk-off amount ΔZ in the incident side plate 121 and the intermediate plate 111.
The ordinary light (o-ray) and extraordinary light (e-ray) emitted from the end side intermediate plate 114 are incident on the emission-side plate 122, and the ordinary light (o-ray) travels straight in the incident direction of the laser light. The light is emitted from a plate surface of the emission side plate 122 opposite to the laser device 20. Since the c-axis direction of the crystal of the emission side plate 122 is arranged so as to be plane-symmetric with respect to the c-axis and the joint surface of the intermediate plate 114 on the end side, the extraordinary light (e-ray) is in the + z direction. Refracted and emitted.
Since the emission side plate 122 is half the thickness of the intermediate plate 114, both the amount of abnormal light (e-ray) deviation Δz and the amount of walk-off ΔZ are Δz = ΔZ = (d / 2) · tanρ.
Thus, in the wavelength conversion device 10, even when four plates 111 to 114 having a thickness of d are used as intermediate plates, the walk-off amount is the same as that when a plate having a thickness of d / 2 is used. Since ΔZ = (d / 2) · tanρ, the walk-off can be effectively reduced with a small number of plates.

次に、本発明の波長変換デバイス10の製造方法について、図3のフローチャートに基づき説明する。始めに、CZ法(チョコラスキー法)もしくはフラックス法で成長させたBBOの単結晶から厚さがdとd/2(ここでは、1mmと0.5mm)の所定の面積(ここでは、一辺が5mm)の正方形板状のプレートを複数枚切り出す(ステップS10)。
BBOの結晶のウエハーは、通常、図4に示すように、c軸の方向がウエハー55の厚さ方向であるp方向を向いているので、切り出し方向をq方向とすると、p方向とq方向のなす角度が(90°−θ)となるように切り出せばよい。これにより、切り出し後のc軸の方向が接合面となる切り出し面に垂直な面内で厚さ方向xに対して位相整合角θだけ傾いたプレートを得ることができる。
なお、ここでは、厚さがdの4枚のプレートを中間プレートとし、厚さがd/2の2枚のプレートを端部側(入射側と出射側)プレートとし、これらのプレートを、図5に示すような、真空チャンバー31と、真空チャンバー31内に設置された第1及び第2の試料ホルダー32,33と、第1及び第2の試料ホルダー32,33の側面側に設置されたビーム源34とを備えた常温接合装置30を用いて接合する。
まず、前記プレートのうち中間プレートとなる2枚のプレート111,112を第1及び第2の試料ホルダー32,33の試料取付面32a,33aにそれぞれ取付ける(ステップS11)。このとき、プレート111,112を当該プレート111,112の結晶のc軸の方向が接合面に対して対称になるように対向して取付ける。ここで、第1及び第2の試料ホルダー32,33の試料取付面32a,33aを水平面とし、この面に垂直な方向を上下方向とする。なお、本例では、第1の試料ホルダー32を可動ホルダーとし、第2の試料ホルダー33を固定ホルダーとした。第1の試料ホルダー32は、図示しない昇降機構により、第2の試料ホルダー33方向に上下動する。
ビーム源34は、プレートの接合予定面にArビームを照射する装置で、照射されるArビームの中心が固定ホルダーである第2の試料ホルダー33の試料取付面33aから所定距離離れた位置になるよう配置される。
Next, the manufacturing method of the wavelength conversion device 10 of this invention is demonstrated based on the flowchart of FIG. First, from a BBO single crystal grown by the CZ method (chocolasky method) or the flux method, a predetermined area (here, one side is d and d / 2 (here, 1 mm and 0.5 mm) in thickness) A plurality of 5 mm square plate plates are cut out (step S10).
As shown in FIG. 4, the BBO crystal wafer usually has the c-axis direction oriented in the p-direction, which is the thickness direction of the wafer 55. What is necessary is just to cut out so that the angle which becomes may become (90 degrees-(theta)). As a result, it is possible to obtain a plate that is inclined by the phase matching angle θ with respect to the thickness direction x in a plane perpendicular to the cut-out surface where the c-axis direction after cut-out is a bonding surface.
Here, four plates with a thickness of d are used as intermediate plates, and two plates with a thickness of d / 2 are used as end side (incident side and outgoing side) plates. 5, the vacuum chamber 31, the first and second sample holders 32 and 33 installed in the vacuum chamber 31, and the side surfaces of the first and second sample holders 32 and 33. Bonding is performed using a room temperature bonding apparatus 30 provided with a beam source 34.
First, the two plates 111 and 112 serving as intermediate plates among the plates are attached to the sample attachment surfaces 32a and 33a of the first and second sample holders 32 and 33, respectively (step S11). At this time, the plates 111 and 112 are mounted facing each other so that the c-axis direction of the crystals of the plates 111 and 112 is symmetric with respect to the bonding surface. Here, the sample mounting surfaces 32a and 33a of the first and second sample holders 32 and 33 are horizontal surfaces, and the direction perpendicular to these surfaces is the vertical direction. In this example, the first sample holder 32 is a movable holder, and the second sample holder 33 is a fixed holder. The first sample holder 32 moves up and down in the direction of the second sample holder 33 by an elevator mechanism (not shown).
The beam source 34 is an apparatus that irradiates an Ar beam onto the planned joining surface of the plate, and the center of the irradiated Ar beam is at a position away from the sample mounting surface 33a of the second sample holder 33, which is a fixed holder. Arranged so that.

プレート111,112の取付けが終了すると、真空チャンバー31を閉じ、図示しない真空ポンプにより、真空チャンバー31内を10-5Pa以下の高真空になるまで真空引きする(ステップS12)とともに、可動ホルダーである第1の試料ホルダー32を、固定ホルダーである第2の試料ホルダー33方向に下降させた後、プレート111の表面111aとプレート112の表面112aとの距離が所定の距離dになった位置で保持する(ステップS13)。
そして、真空チャンバー31内が所定の真空度に到達してから、図6(a)に示すように、ビーム源34を作動させて、Arビームをプレート111,112の表面111a,112aに所定時間照射して、表面111a,112aをエッチングする(ステップS14)。これにより、プレート111,112の表面111a,112aを活性化処理することができる。
前記活性化処理の条件としては、Arビームの広がり角をω=10°〜30°、2枚のプレート111,112の間隔dを1〜5mm、Arビームの照射エネルギー密度としては90〜1200J/cm2の範囲とすることが好ましい。これにより、プレート111,112の表面111a,112aを均一にエッチングできるだけでなく、ケミカルエッチングのように、不要に深くエッチングすることがないので、表面111a,112aを適正に活性化処理することができる。したがって、原子レベルでの接合を確実に行うことができ、変換効率を向上させることができる。
When the attachment of the plates 111 and 112 is completed, the vacuum chamber 31 is closed, and the vacuum chamber 31 is evacuated by a vacuum pump (not shown) until a high vacuum of 10 −5 Pa or less is reached (step S12). After a certain first sample holder 32 is lowered in the direction of the second sample holder 33, which is a fixed holder, the distance between the surface 111a of the plate 111 and the surface 112a of the plate 112 becomes a predetermined distance d. Hold (step S13).
Then, after the inside of the vacuum chamber 31 reaches a predetermined degree of vacuum, as shown in FIG. 6A, the beam source 34 is operated, and the Ar beam is applied to the surfaces 111a and 112a of the plates 111 and 112 for a predetermined time. Irradiation is performed to etch the surfaces 111a and 112a (step S14). Thereby, the surface 111a, 112a of the plates 111, 112 can be activated.
The conditions for the activation treatment are as follows: the spread angle of the Ar beam is ω = 10 ° to 30 °, the distance d between the two plates 111 and 112 is 1 to 5 mm, and the irradiation energy density of the Ar beam is 90 to 1200 J / A range of cm 2 is preferable. Thereby, not only the surfaces 111a and 112a of the plates 111 and 112 can be uniformly etched, but also the surface 111a and 112a can be appropriately activated since they are not etched deeply unnecessarily as in the case of chemical etching. . Therefore, bonding at the atomic level can be reliably performed, and conversion efficiency can be improved.

前記プレート111,112の表面111a,112aの活性化処理が終了すると、図6(b)に示すように、Arビームの照射を停止するとともに、第2の試料ホルダー33を第1の試料ホルダー32方向に下降させて、プレート111の表面111aとプレート112の表面112aとを密着させて、プレート111とプレート112とを常温接合する(ステップS15)。本例では、2枚のプレート111,112の間隔dを1〜5mmとしているので、接合を1〜3秒程度の短時間で行うことができる。
その後、真空ポンプを停止させるとともに、真空チャンバー31内に不活性ガスを導入して、真空チャンバー31内を大気圧に戻した後、前記真空チャンバー31を開けて、プレート111とプレート112とが接合された複合プレート10Aを取り出す(ステップS16)。
When the activation processing of the surfaces 111a and 112a of the plates 111 and 112 is completed, the irradiation of the Ar beam is stopped and the second sample holder 33 is moved to the first sample holder 32 as shown in FIG. The surface 111a of the plate 111 and the surface 112a of the plate 112 are brought into close contact with each other, and the plate 111 and the plate 112 are joined at room temperature (step S15). In this example, since the interval d between the two plates 111 and 112 is 1 to 5 mm, the joining can be performed in a short time of about 1 to 3 seconds.
Thereafter, the vacuum pump is stopped, an inert gas is introduced into the vacuum chamber 31, the interior of the vacuum chamber 31 is returned to atmospheric pressure, the vacuum chamber 31 is opened, and the plate 111 and the plate 112 are joined. The composite plate 10A thus taken out is taken out (step S16).

次に、この複合プレート10Aを第1の試料ホルダー32に取付け、第2の試料ホルダー33には、新たなプレート113を取り付ける(ステップS17)。このとき、第2の試料ホルダー33に取付けられた新たなプレート113の結晶のc軸の方向と第1の試料ホルダー32に取付けられた複合プレート10Aの接合予定面側のプレート112のc軸の方向とが接合面に対して対称になるように対向して取付ける。
そして、前記ステップS12〜ステップS14までの操作を行い、図6(c)に示すように、新たなプレート113の表面113aと複合プレート10Aの表面とを活性化処理した後、ステップS15に進み、図6(d)に示すように、新たなプレート113と複合プレート10Aとを常温接合して3枚のプレート111,112,113を接合した複合プレート10Bを得る。
同様の操作を繰り返すことにより、4枚の中間プレート111〜114を接合した複合プレート10Cを得る(複合プレート10Cについては、図6(e)を参照)。
Next, the composite plate 10A is attached to the first sample holder 32, and a new plate 113 is attached to the second sample holder 33 (step S17). At this time, the direction of the c-axis of the crystal of the new plate 113 attached to the second sample holder 33 and the c-axis of the plate 112 on the planned joining surface side of the composite plate 10A attached to the first sample holder 32 It is mounted so that the direction is symmetrical with respect to the joint surface.
Then, the operations from Step S12 to Step S14 are performed, and as shown in FIG. 6C, after the surface 113a of the new plate 113 and the surface of the composite plate 10A are activated, the process proceeds to Step S15. As shown in FIG. 6D, a new plate 113 and a composite plate 10A are joined at room temperature to obtain a composite plate 10B in which three plates 111, 112, 113 are joined.
By repeating the same operation, a composite plate 10C obtained by joining the four intermediate plates 111 to 114 is obtained (see FIG. 6E for the composite plate 10C).

次に、図6(e)に示すように、複合プレート10Cと端部側プレート12のうちの一方の(入射側プレート121もしくは出射側プレート122)を常温接合する(ステップS18)。このとき、端部側プレート12の入射端面もしくは出射端面となる面を予め無反射コーティング処理する。そして、端部側プレート12の結晶のc軸の方向と第1の試料ホルダー32に取付けられた複合プレート10Cの接合予定面側のプレート111のc軸の方向とが接合面に対して対称になるように、複合プレート10Cを第1の試料ホルダー32に取付け、前記ステップS12〜ステップS14までの操作を行うことで、端部側プレート12の表面と複合プレート11aの表面とを活性化処理する。その後、ステップS15に進み、端部側プレート12と複合プレート11bとを常温接合して、端部側プレート12と中間プレート111〜114とから成る複合プレート10Dを得る。
最後に、図6(f)に示すように、端部側プレート12のうちの他方のプレートと複合プレート10Dとを常温接合する(ステップS19)ことで、図1に示すような、波長変換デバイス10を得ることができる。
Next, as shown in FIG. 6E, one of the composite plate 10C and the end side plate 12 (incident side plate 121 or outgoing side plate 122) is joined at room temperature (step S18). At this time, the non-reflective coating process is performed in advance on the surface to be the incident end surface or the output end surface of the end portion side plate 12. Then, the c-axis direction of the crystal of the end side plate 12 and the c-axis direction of the plate 111 on the planned joining surface side of the composite plate 10C attached to the first sample holder 32 are symmetrical with respect to the joining surface. As described above, the composite plate 10C is attached to the first sample holder 32, and the operations from step S12 to step S14 are performed, so that the surface of the end plate 12 and the surface of the composite plate 11a are activated. . Then, it progresses to step S15 and the edge part side plate 12 and the composite plate 11b are joined at normal temperature, and the composite plate 10D which consists of the edge part side plate 12 and the intermediate | middle plates 111-114 is obtained.
Finally, as shown in FIG. 6 (f), the other plate of the end side plates 12 and the composite plate 10D are joined at room temperature (step S19), so that the wavelength conversion device as shown in FIG. 10 can be obtained.

図7は、常温接合装置30を用いて作製した、厚さが1mmの4枚のプレートと厚さが0.5mmの2枚のプレートから成る全長が5mmの波長変換デバイスに、波長がλ1=532nmのレーザー光(基本波)を入射し、波長がλ2=266nmである前記レーザー光の第2高調波(SH)を発生させたときの基本波のパワー(Fundamental Power;[W]) と第2高調波(SH)のパワー(SH Power;[μW])との関係を示すグラフで、比較例として、バルク結晶を用いて作製した波長変換デバイスの測定結果を合わせて記した。なお、この時のウォークオフ角は、約4.8°である。
また、本発明による波長変換デバイスの作製条件は以下の通りである。
真空度……2.0×10-6Torr
Arビーム……電流:2mA、電圧:5kV、
広がり角:20°、照射時間:60秒
試料間距離……2mm
ビーム−試料間の距離……10mm
接合時間……2秒
図7のグラフから、本願発明による波長変換デバイスは、バルク状の結晶を用いて作製した波長変換デバイスに比較して約2倍の出力が得られることがわかる。これにより、少ないプレート数で効率良くウォークオフを低減することのできる複屈折位相整合波長変換デバイスを容易に製造することができることが確認された。
7 was produced using a room temperature bonding apparatus 30, the thickness of the four plates and thickness two wavelength conversion device of the full-length consisting plate of 5mm of 0.5mm of 1 mm, wavelength lambda 1 = 532 nm laser light (fundamental wave) is incident, and the fundamental power (Fundamental Power; [W]) when the second harmonic (SH) of the laser light having a wavelength of λ 2 = 266 nm is generated. As a comparative example, the graph also shows the measurement results of a wavelength conversion device manufactured using a bulk crystal as a comparative example, and shows the relationship between the power of the second harmonic (SH) (SH Power; [μW]). The walk-off angle at this time is about 4.8 °.
Moreover, the manufacturing conditions of the wavelength conversion device according to the present invention are as follows.
Degree of vacuum ... 2.0 × 10 -6 Torr
Ar beam: current: 2 mA, voltage: 5 kV,
Spreading angle: 20 °, irradiation time: 60 seconds Distance between samples: 2 mm
Beam-sample distance: 10 mm
Bonding time: 2 seconds It can be seen from the graph of FIG. 7 that the wavelength conversion device according to the present invention can provide an output that is approximately twice that of a wavelength conversion device manufactured using a bulk crystal. Thus, it was confirmed that a birefringence phase matching wavelength conversion device capable of efficiently reducing the walk-off with a small number of plates can be easily manufactured.

なお、前記実施の形態では、2枚の端部側プレートと4枚の中間プレート11とにより波長変換デバイス10を構成したが、これに限るものではなく、プレートの厚さを薄くして接合枚数を更に増やすようにすれば、ウォークオフを更に低減して変換効率を向上させることができる。なお、この場合にも、結晶のc軸を厚さ方向に平行な面内において厚さ方向に対して位相整合角θだけ傾かせ、かつ、互いに隣接する2枚のプレートのc軸の方向が接合される面に対して面対称になるように配置するとともに、端部側プレート12の厚さを中間プレート11の厚さの半分に設定することはいうまでもない。
また、前記例では、始めに中間プレート12を常温接合し、その後、常温接合した中間プレートと端部側プレートとを常温接合したが、常温接合する順番はこれに限るものではなく、端部側プレートから順に常温接合してもよい。
また、前記例では、非線形光学結晶としてβ−BBO結晶を用いたが、LBO結晶、CLBO結晶、あるいは、KTP結晶などの他の非線形光学結晶を用いてもよい。中でも、β−BBO結晶やLBO結晶は、高品質の結晶が得られ易く損傷閾値も高いので、変換効率の高くかつ安定した性能を得ることができる。
また、前記例では、プレート11,12の表面をArの原子ビームでエッチングしたが、分子ビーム、もしくは、イオンビームを用いてもよい。
In the above-described embodiment, the wavelength conversion device 10 is configured by the two end side plates and the four intermediate plates 11. However, the present invention is not limited to this. If the number is further increased, the walk-off can be further reduced and the conversion efficiency can be improved. Also in this case, the c-axis of the crystal is tilted by the phase matching angle θ with respect to the thickness direction in a plane parallel to the thickness direction, and the directions of the c-axis of two plates adjacent to each other are Needless to say, they are arranged so as to be plane-symmetric with respect to the surfaces to be joined, and the thickness of the end side plate 12 is set to half the thickness of the intermediate plate 11.
In the above example, the intermediate plate 12 is first joined at room temperature, and then the room temperature joined intermediate plate and the end side plate are joined at room temperature, but the order of room temperature joining is not limited to this, and the end side Room temperature bonding may be performed in order from the plate.
In the above example, the β-BBO crystal is used as the nonlinear optical crystal, but another nonlinear optical crystal such as an LBO crystal, a CLBO crystal, or a KTP crystal may be used. Among these, β-BBO crystals and LBO crystals are easy to obtain high-quality crystals, and have a high damage threshold, so that high conversion efficiency and stable performance can be obtained.
In the above example, the surfaces of the plates 11 and 12 are etched with an Ar atomic beam, but a molecular beam or an ion beam may be used.

以上、本発明を実施の形態を用いて説明したが、本発明の技術的範囲は前記実施の形態に記載の範囲には限定されない。前記実施の形態に、多様な変更または改良を加えることが可能であることが当業者にも明らかである。そのような変更または改良を加えた形態も本発明の技術的範囲に含まれ得ることが、特許請求の範囲から明らかである。   As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the embodiment. It is apparent from the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

本発明によれば、少ないプレート数でウォークオフを効果的に低減することができるので、複屈折位相整合波長変換デバイスの生産性を向上させることができる。また、プレート同士を常温接合したので、変換効率の高くかつ安定した性能を有する複屈折位相整合波長変換デバイスを容易に提供することができる。   According to the present invention, since the walk-off can be effectively reduced with a small number of plates, the productivity of the birefringence phase matching wavelength conversion device can be improved. In addition, since the plates are joined at room temperature, a birefringence phase matching wavelength conversion device having high conversion efficiency and stable performance can be easily provided.

10 複屈折位相整合波長変換デバイス、11,111〜114 中間プレート、
12,121,122 端部側プレート、20 レーザー装置。
10 birefringence phase matching wavelength conversion device, 11, 111-114 intermediate plate,
12, 121, 122 End side plate, 20 laser device.

Claims (4)

互いに接合され、結晶のc軸が厚さ方向に平行な面内において厚さ方向に対して傾く非線形光学結晶から成る複数のプレートを備え、
前記複数のプレートの配置が互いに隣接するプレートのc軸の方向が接合面に対して面対称であり、
前記複数のプレートにおけるレーザー光の入射側端部の入射側プレートと、前記レーザー光の高調波を出射する出射側端部の出射側プレートとの間に位置するプレートの厚さが同一であり、前記入射側プレート及び出射側プレートの厚さが、入射側プレートと出射側プレートとの間に位置するプレートの厚さの1/2である
複屈折位相整合波長変換デバイス。
A plurality of plates composed of nonlinear optical crystals that are bonded together and in which the c-axis of the crystal is inclined with respect to the thickness direction in a plane parallel to the thickness direction;
The c-axis directions of the plates adjacent to each other in the arrangement of the plurality of plates are plane symmetric with respect to the joint surface
The thickness of the plate located between the incident side plate of the incident side end of the laser beam in the plurality of plates and the emission side plate of the emission side end that emits harmonics of the laser beam is the same, A birefringence phase-matching wavelength conversion device, wherein the incident side plate and the outgoing side plate have a thickness that is ½ of the thickness of the plate located between the incident side plate and the outgoing side plate.
前記非線形光学結晶がβ−BBO結晶又はLBO結晶である請求項1に記載の複屈折位相整合波長変換デバイス。   The birefringence phase matching wavelength conversion device according to claim 1, wherein the nonlinear optical crystal is a β-BBO crystal or an LBO crystal. 結晶のc軸が厚さ方向に平行な面内において厚さ方向に対して傾く非線形光学結晶から成る同一な厚さのプレート同士をc軸の方向が接合面に対して面対称となるように対向させ、前記プレート同士の接合面となる表面に原子ビーム、分子ビーム、イオンビームのうちいずれかを照射して表面を活性化処理する工程と、
活性化処理されたプレート同士の表面を常温にて接合する工程と、
前記接合されたプレート群の両端部に、当該プレート群を構成する前記各プレートの1/2の厚さを有し、結晶のc軸が厚さ方向に平行な面内において厚さ方向に対して傾く非線形光学結晶から成るプレートを接合するに際し、当該1/2の厚さを有するプレートをc軸の方向が接合面に対して面対称となるように対向させ、プレート同士の接合面となる表面に原子ビーム、分子ビーム、イオンビームのうちいずれかを照射して表面を活性化処理する工程と、
活性化処理されたプレート同士の表面を常温にて接合する工程と、
を備えた複屈折位相整合波長変換デバイスの製造方法。
Plates of the same thickness made of nonlinear optical crystals in which the c-axis of the crystal is inclined with respect to the thickness direction in a plane parallel to the thickness direction are arranged so that the c-axis direction is plane-symmetric with respect to the bonding surface. A process of activating the surface by irradiating any one of an atomic beam, a molecular beam, and an ion beam on the surface to be a bonding surface between the plates;
Joining the surfaces of the activated plates at room temperature;
At both ends of the joined plate group, the plate group has a half thickness of each plate constituting the plate group, and the c-axis of the crystal is parallel to the thickness direction with respect to the thickness direction. When a plate made of a nonlinear optical crystal tilting is joined, the plate having the thickness of 1/2 is opposed so that the c-axis direction is plane-symmetric with respect to the joining surface to form a joining surface between the plates. Irradiating the surface with either an atomic beam, molecular beam, or ion beam to activate the surface; and
Joining the surfaces of the activated plates at room temperature;
A method of manufacturing a birefringence phase matching wavelength conversion device comprising:
記1/2の厚さを有するプレートにおける入射端面となる面と出射端面となる面のみを無反射コーティング処理する工程を備えた請求項記載の複屈折位相整合波長変換デバイスの製造方法。 Method for producing a birefringent phase matching wavelength conversion device of claim 3, further comprising the step of only surface to be the entrance end face the surface from the emitting end face processing antireflection coating in the plate having a thickness before Symbol 1/2.
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