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JP5698804B2 - Molding device for injection molding machine with temperature control function - Google Patents
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JP5698804B2 - Molding device for injection molding machine with temperature control function - Google Patents

Molding device for injection molding machine with temperature control function Download PDF

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Publication number
JP5698804B2
JP5698804B2 JP2013139000A JP2013139000A JP5698804B2 JP 5698804 B2 JP5698804 B2 JP 5698804B2 JP 2013139000 A JP2013139000 A JP 2013139000A JP 2013139000 A JP2013139000 A JP 2013139000A JP 5698804 B2 JP5698804 B2 JP 5698804B2
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Prior art keywords
temperature
platen
mold
target
mold plate
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JP2015009547A (en
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信篤 土屋
信篤 土屋
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Fanuc Corp
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Fanuc Corp
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Priority to DE102014009423.5A priority patent/DE102014009423B4/en
Priority to CN201410312056.0A priority patent/CN104275781B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/78Measuring, controlling or regulating of temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76003Measured parameter
    • B29C2945/7604Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76177Location of measurement
    • B29C2945/76224Closure or clamping unit
    • B29C2945/76227Closure or clamping unit mould platen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76531Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76655Location of control
    • B29C2945/76732Mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76929Controlling method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76929Controlling method
    • B29C2945/76989Extrapolating

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

本発明は射出成形機において、型締装置の固定盤と可動盤の一方の温度を検出し、他方の目標温度を算出して、他方の温度を制御する型締装置に関する。   The present invention relates to a mold clamping device that detects the temperature of one of a fixed plate and a movable plate of a mold clamping device, calculates a target temperature of the other, and controls the other temperature in an injection molding machine.

レンズ成形などの精密成形では、金型固定側と可動側の僅かな芯ずれは成形品に影響を及ぼす。芯ずれの原因として、固定盤と可動盤の温度差が挙げられる。レンズなどの精密成形では、金型温度を80℃〜130℃に加温し、成形が行われることがある。その際に、固定盤と可動盤の温度差により、熱膨張の程度が異なり、可動盤と固定盤の中心位置に差が生じることが、芯ずれの原因となっている。
そこで、固定盤と可動盤の温度差を解消する必要がある。
In precision molding such as lens molding, slight misalignment between the fixed side of the mold and the movable side affects the molded product. A cause of misalignment is a temperature difference between the fixed platen and the movable platen. In precision molding of a lens or the like, molding may be performed by heating the mold temperature to 80 ° C to 130 ° C. At that time, the degree of thermal expansion varies depending on the temperature difference between the fixed platen and the movable platen, and the difference between the center positions of the movable platen and the fixed platen causes the misalignment.
Therefore, it is necessary to eliminate the temperature difference between the fixed platen and the movable platen.

特許文献1には、型盤が上下左右対称に形成されており、全域に渡って温度を一定に保持する仕組みであり、金型の温度を一定に制御する技術が開示されている。特許文献2には、型盤の上下の温度差を積極的に解消する技術が開示されている。特許文献3には、機構部の温度差に起因する軸ずれを解消するため、部品間の温度差が所定の値に収まる様に制御する技術が開示されている。   Patent Document 1 discloses a technique in which the mold plate is formed symmetrically in the vertical and horizontal directions and the temperature is kept constant over the entire area, and the temperature of the mold is controlled to be constant. Patent Document 2 discloses a technique that positively eliminates the temperature difference between the upper and lower sides of the mold platen. Patent Document 3 discloses a technique for controlling the temperature difference between components to be within a predetermined value in order to eliminate the axis deviation caused by the temperature difference of the mechanism unit.

特開昭62−264921号公報JP-A-62-264921 特開2000−271981号公報JP 2000-271981 A 特開2006−212980号公報JP 2006-221980 A

特許文献1は、型盤の熱変位を制御するために型盤温度を変化させている本発明とは異なる。特許文献2は、型盤の上下の温度差を解消するものであり、固定盤と可動盤の中心軸のずれを解消するものではなく、固定盤と可動盤との間の温度差を調整していない。特許文献3は、機構部の温度差に起因する軸ずれを解消するため、部品間の温度差が所定の値に収まる様に制御しているが、各部分の熱膨張が同じとは限らないため、芯ずれが発生する可能性がある。
そこで、本発明の目的は、上記従来技術の問題点に鑑み、実験値もしくは解析による理論値に基き、固定盤と可動盤の中心軸が一致する温度に調整する温度調節機能を備えた射出成形機の型締装置を提供することである。
Patent Document 1 is different from the present invention in which the temperature of the platen is changed in order to control the thermal displacement of the platen. Patent Document 2 eliminates the temperature difference between the upper and lower sides of the mold platen, and does not eliminate the deviation of the central axis between the fixed platen and the movable platen, but adjusts the temperature difference between the fixed platen and the movable platen. Not. In Patent Document 3, control is performed so that the temperature difference between components falls within a predetermined value in order to eliminate the axial deviation caused by the temperature difference of the mechanism unit, but the thermal expansion of each part is not always the same. Therefore, misalignment may occur.
Therefore, in view of the above-described problems of the prior art, an object of the present invention is an injection molding equipped with a temperature adjustment function for adjusting the center axis of the fixed platen and the movable platen to a temperature based on experimental values or theoretical values obtained by analysis. Is to provide a mold clamping device.

本願の請求項1に係る発明は、固定側金型を保持する固定盤と、可動側金型を保持する可動盤を有する射出成形機の型締装置において、前記可動盤及び前記固定盤の何れか一方を温度基準対象型盤とし、他方を温度制御対象型盤とし、前記温度基準対象型盤には第1の温度検出部を設け、前記温度制御対象型盤には第2の温度検出部と温度調節部を設け、温度基準対象型盤の温度と温度基準対象型盤の中心高さとの関係を第1の関係として記憶し、温度制御対象型盤の温度と温度制御対象型盤の中心高さとの関係を第2の関係として記憶する記憶部を設け、前記第1の温度検出部で検出した温度基準対象型盤の温度と第1の関係から温度基準対象型盤の中心高さを求め、該求めた温度基準対象型盤の中心高さと第2の関係とから温度制御対象型盤の中心高さが温度基準対象型盤の中心高さと同一となる温度制御対象型盤の目標温度を求める目標温度算出部とを有し、前記温度調節部により、前記温度制御対象型盤の温度が前記目標温度になるよう制御することを特徴とする射出成形機の型締装置である。   The invention according to claim 1 of the present application is a mold clamping device for an injection molding machine having a fixed plate for holding a fixed side mold and a movable plate for holding a movable side mold. One of these is a temperature reference target mold, the other is a temperature control target mold, the temperature reference target mold is provided with a first temperature detector, and the temperature control target mold is a second temperature detector. And a temperature control unit, and stores the relationship between the temperature of the temperature reference target mold plate and the center height of the temperature reference target mold plate as a first relationship, and the temperature of the temperature control target mold plate and the center of the temperature control target mold plate. A storage unit for storing the relationship with the height as the second relationship is provided, and the center height of the temperature reference target platen is determined from the temperature and the first relationship between the temperature of the temperature reference target platen detected by the first temperature detection unit. The temperature control target is determined from the center height of the determined temperature reference target platen and the second relationship. A target temperature calculation unit for obtaining a target temperature of a temperature control target mold plate in which the center height of the panel is the same as the center height of the temperature reference target mold plate, and the temperature control unit allows the temperature control target mold plate to A mold clamping device for an injection molding machine, wherein the temperature is controlled to be the target temperature.

請求項2に係る発明は、固定側金型を保持する固定盤と、可動側金型を保持する可動盤を有する射出成形機の型締装置において、前記可動盤及び前記固定盤の何れか一方を温度基準対象型盤とし、他方を温度制御対象型盤とし、前記温度基準対象型盤には第1の温度検出部を設け、前記温度制御対象型盤には第2の温度検出部と温度調節部を設け、温度制御対象型盤の中心高さが温度基準対象型盤の中心高さと同一となる時の温度基準対象型盤の温度と温度制御対象型盤の温度との関係を第3の関係として記憶する記憶部を設け、
温度基準対象型盤の温度と第3の関係とから温度制御対象型盤の中心高さが温度基準対象型盤の中心高さと同一となる温度制御対象型盤の目標温度を求める目標温度算出部とを有し、前記温度調節部により、前記温度制御対象型盤の温度が前記目標温度になるよう制御することを特徴とする射出成形機の型締装置である。
According to a second aspect of the present invention, there is provided a mold clamping device for an injection molding machine having a fixed plate for holding a fixed side mold and a movable plate for holding a movable side mold, and one of the movable plate and the fixed plate. Is a temperature reference target mold, the other is a temperature control target mold, the temperature reference target mold is provided with a first temperature detector, and the temperature control target mold is provided with a second temperature detector and a temperature. An adjustment unit is provided, and the relationship between the temperature of the temperature reference target mold and the temperature of the temperature control target mold when the center height of the temperature control target mold is equal to the center height of the temperature reference target mold is third. A storage unit is provided for storing the relationship as
A target temperature calculation unit for obtaining a target temperature of the temperature control target mold plate where the center height of the temperature control target mold plate is the same as the center height of the temperature reference target mold plate from the temperature of the temperature reference target mold plate and the third relationship. A mold clamping device of an injection molding machine, wherein the temperature adjusting unit controls the temperature of the temperature control target mold plate to be the target temperature.

請求項3に係る発明は、前記温度基準対象型盤は型盤の両側面に支持脚を有し、該支持脚の少なくとも一方に第1の温度検出部を設けたことを特徴とする請求項1または2に記載の射出成形機の型締装置である。
請求項4に係る発明は、前記温度制御対象型盤は型盤の両側面に支持脚を有し、該支持脚の少なくとも一方に第2の温度検出部と温度調節部を設けたことを特徴とする請求項1または2に記載の射出成形機の型締装置である。
請求項5に係る発明は、前記温度調節部は、電気ヒータ、電熱冷却素子、流体による温度調節器の何れか一つであることを特徴とする請求項1〜4いずれか一つに記載の射出成形機の型締装置である。
The invention according to claim 3 is characterized in that the temperature reference object pattern board has support legs on both side surfaces of the pattern board, and a first temperature detector is provided on at least one of the support legs. 3. A mold clamping device for an injection molding machine according to 1 or 2.
The invention according to claim 4 is characterized in that the temperature control target pattern has support legs on both side surfaces of the pattern, and a second temperature detector and a temperature adjuster are provided on at least one of the support legs. A mold clamping device for an injection molding machine according to claim 1 or 2.
The invention according to claim 5 is characterized in that the temperature adjusting part is any one of an electric heater, an electrothermal cooling element, and a temperature controller using fluid. A mold clamping device of an injection molding machine.

本発明により、実験値もしくは解析による理論値に基き、固定盤と可動盤の中心軸が一致する温度に調整する温度調節機能を備えた射出成形機の型締装置を提供できる。   According to the present invention, it is possible to provide a mold clamping device for an injection molding machine having a temperature adjusting function for adjusting the temperature so that the central axes of the fixed platen and the movable platen coincide with each other based on experimental values or theoretical values obtained by analysis.

温度調節機能を備えた射出成形機の型締装置を説明する図である(実施形態1)。It is a figure explaining the mold clamping apparatus of the injection molding machine provided with the temperature control function (Embodiment 1). 固定盤の構成を説明する図である。It is a figure explaining the structure of a stationary platen. 温度上昇時に発生する芯ずれを説明する図である。It is a figure explaining misalignment which generate | occur | produces at the time of a temperature rise. 温度調節機による芯ずれの補正を説明する図である。It is a figure explaining the correction | amendment of misalignment by a temperature controller. 温度調節機の位置を説明する図である。It is a figure explaining the position of a temperature controller. 温度調節機能を備えた射出成形機の型締装置を説明する図である(実施形態2)。It is a figure explaining the mold clamping apparatus of the injection molding machine provided with the temperature control function (Embodiment 2). 温度制御のフローチャートである。It is a flowchart of temperature control. 型盤の温度と中心高さとの関係式を説明する図である。It is a figure explaining the relational expression of the temperature of a pattern board, and center height. 温度基準対象型盤の温度と温度制御対象型盤の温度の関係を説明する図である。It is a figure explaining the relationship between the temperature of a temperature reference object template, and the temperature of a temperature control object template.

以下、本発明の実施形態を図面と共に説明する。
<実施形態1>
図1は温度調節機能を備えた射出成形機の型締装置を説明する図である(実施形態1)。図2は固定盤の構成を説明する図である。射出成形機は、図示しない機台上に射出機構部と型締機構部とを対向配置し、制御装置により射出機構部と型締機構部を制御し、成形サイクルを実行する。型締機構部は、固定側金型3aを取り付ける固定盤1、可動側金型3bを取り付ける可動盤2を備えている。固定盤1は、水平方向両側部の中心を支持脚5,5によって支持されている。ここで、支持脚5により固定盤1を支持する点を固定点6という。固定盤1と図示しないリアプラテンとはタイバー4によって連結されている。可動盤2はタイバー4の軸方向に沿って移動可能であり、固定盤1に対して進退自在に構成されている。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<Embodiment 1>
FIG. 1 is a view for explaining a mold clamping device of an injection molding machine having a temperature adjusting function (Embodiment 1). FIG. 2 is a diagram illustrating the configuration of the fixed platen. In an injection molding machine, an injection mechanism unit and a mold clamping mechanism unit are arranged opposite to each other on a machine base (not shown), and the injection mechanism unit and the mold clamping mechanism unit are controlled by a control device to execute a molding cycle. The mold clamping mechanism includes a stationary platen 1 to which the stationary mold 3a is attached and a movable platen 2 to which the movable mold 3b is attached. The fixed platen 1 is supported by support legs 5 and 5 at the center of both sides in the horizontal direction. Here, the point at which the stationary platen 1 is supported by the support legs 5 is referred to as a fixed point 6. The stationary platen 1 and a rear platen (not shown) are connected by a tie bar 4. The movable platen 2 is movable along the axial direction of the tie bar 4 and is configured to be movable back and forth with respect to the fixed platen 1.

固定盤1を支持する支持脚5に温度検出部8と温度調節部7が取り付けられている。温度調節部7として、電気ヒータ、電熱冷却素子、流体による温度調節器の何れかを用いることができる。温度検出部8は固定盤1からの熱が伝わり易い固定点6の近傍に取り付けられている。また、可動盤2には温度検出部9が取り付けられている。温度検出部8で検出された固定盤1の検出温度(信号)と、温度検出部9で検出された可動盤2の検出温度(信号)は、それぞれ温度制御部10に入力される。温度制御部10は、記憶部10aと目標温度算出部10bを備え、温度検出部8と温度検出部9によって検出された温度情報に基づいて温度調節部7の温度制御を行う。   A temperature detection unit 8 and a temperature adjustment unit 7 are attached to a support leg 5 that supports the fixed platen 1. Any one of an electric heater, an electrothermal cooling element, and a fluid temperature controller can be used as the temperature controller 7. The temperature detector 8 is attached in the vicinity of a fixed point 6 where heat from the fixed platen 1 is easily transmitted. Further, a temperature detector 9 is attached to the movable platen 2. The detected temperature (signal) of the stationary platen 1 detected by the temperature detector 8 and the detected temperature (signal) of the movable platen 2 detected by the temperature detector 9 are respectively input to the temperature controller 10. The temperature control unit 10 includes a storage unit 10a and a target temperature calculation unit 10b, and performs temperature control of the temperature adjustment unit 7 based on temperature information detected by the temperature detection unit 8 and the temperature detection unit 9.

図1、図2に示す型締機構部においては、固定盤1を温度制御対象型盤とし、可動盤2を温度基準対象型盤としている。固定盤1と可動盤2に温度差が生じると、図3のように固定盤1と可動盤2の熱膨張の差により固定盤1と可動盤2の中心軸がずれる。符号11は固定盤1の中心軸を表し、符号12は可動盤2の中心軸を表す。   In the mold clamping mechanism shown in FIGS. 1 and 2, the stationary platen 1 is a temperature control target die plate and the movable platen 2 is a temperature reference target die plate. When a temperature difference occurs between the fixed platen 1 and the movable platen 2, the central axes of the fixed platen 1 and the movable platen 2 are shifted due to a difference in thermal expansion between the fixed platen 1 and the movable platen 2 as shown in FIG. Reference numeral 11 represents the central axis of the fixed platen 1, and reference numeral 12 represents the central axis of the movable platen 2.

そこで、図7のフローチャートに示す方法により、中心軸のずれを解消する。可動盤2(温度基準対象型盤)の温度を検出し、固定盤1(温度制御対象型盤)の目標温度を算出する。可動盤2の温度検出部9が温度を検出する(SA01)。可動盤2の温度と可動盤の中心軸高さの関係(SA02)と、固定盤1の温度と固定盤1の中心軸高さの関係と(SA03)から、固定盤1の中心軸11が可動盤の中心軸12と同じ高さになるような目標温度を算出する(SA04)。温度制御部10の制御により温度調節部7を目標温度にすることにより固定盤1の支持脚5の熱膨張を調整し(SA05)、図4のように固定盤1との固定点6の位置ならびに固定盤1の中心軸11を補正する。固定盤1の支持脚5が目標温度に到達したら(SA06)、終了する。   Therefore, the deviation of the central axis is eliminated by the method shown in the flowchart of FIG. The temperature of the movable platen 2 (temperature reference target platen) is detected, and the target temperature of the fixed platen 1 (temperature control target platen) is calculated. The temperature detector 9 of the movable platen 2 detects the temperature (SA01). From the relationship between the temperature of the movable platen 2 and the central axis height of the movable platen (SA02) and the relationship between the temperature of the fixed platen 1 and the central axis height of the fixed platen (SA03), the central axis 11 of the fixed platen 1 is A target temperature is calculated so as to be the same height as the central axis 12 of the movable platen (SA04). The thermal expansion of the support leg 5 of the fixed platen 1 is adjusted by setting the temperature adjusting unit 7 to the target temperature under the control of the temperature control unit 10 (SA05), and the position of the fixing point 6 with the fixed platen 1 as shown in FIG. In addition, the center axis 11 of the fixed platen 1 is corrected. When the support leg 5 of the fixed platen 1 reaches the target temperature (SA06), the process ends.

目標温度の算出例を図8の温度−高さグラフにて示す。まず、機械の組立調整時の可動盤2の中心高さ、温度をHM0、TM0とする。可動盤2の温度変化と可動盤2の中心高さ変化が比例関係にある場合、温度と中心高さの関係は傾きaMの直線Lで表される。可動盤2の現在温度がTの時の可動盤の中心高さHは数1式で算出される。 A calculation example of the target temperature is shown in the temperature-height graph of FIG. First, the center height and temperature of the movable platen 2 during assembly adjustment of the machine are set to H M0 and T M0 . When the center height change of the temperature change and the movable platen 2 of the movable platen 2 is proportional, relationship between the temperature and the height of the center is represented by a straight line L M inclination aM. Current temperature of the movable platen 2 is center height H M of the movable platen when the T M is calculated by the equation (1).

Figure 0005698804
Figure 0005698804

また、固定盤1の温度変化と固定盤の中心高さ変化が比例関係にある場合、温度と中心高さの関係は傾きaSの直線Lで表される。機械の組立調整時の固定盤1の中心高さ、温度をHS0、TS0とし、固定盤1の中心高さHを可動盤2の中心高さHと同じにするための固定盤温度をTS1とすると、可動盤2の中心高さHは数2式で算出される。 In addition, when the temperature change of the fixed platen 1 and the center height change of the fixed platen are in a proportional relationship, the relationship between the temperature and the center height is represented by a straight line L S with an inclination aS. Center height of the stationary platen 1 during assembly and adjustment of the machine, the temperature of H S0, T S0, fixed platen to the center height H S of the stationary platen 1 equal to the center height H M of the movable platen 2 Assuming that the temperature is T S1 , the center height HM of the movable platen 2 is calculated by Equation 2.

Figure 0005698804
Figure 0005698804

数1式、数2式からTS1を求めると、TS1は数3式で表される。 When T S1 is obtained from Equation 1 and Equation 2, T S1 is expressed by Equation 3.

Figure 0005698804
Figure 0005698804

M0ならびにTM0、HS0、TS0は機械の組立調整時に測定し、機械(温度制御部10)の記憶部10aに記憶させる。aMならびにaSは、変位計もしくは渦電流計と温度検出器により測定してもよく、型盤(固定盤1、可動盤2)の膨張係数や熱伝導率から解析により理論値として求めてもよい。aMとaSも予め機械に記憶させる。数1式〜数3式により温度制御対象型盤(固定盤1)の目標温度を求めることは、温度制御部10の目標温度算出部で実行される。 H M0, T M0 , H S0 , and T S0 are measured during assembly adjustment of the machine and are stored in the storage unit 10 a of the machine (temperature control unit 10). aM and aS may be measured by a displacement meter or an eddy current meter and a temperature detector, or may be obtained as a theoretical value by analysis from the expansion coefficient and thermal conductivity of the mold platen (fixed platen 1 and movable platen 2). . aM and aS are also stored in the machine in advance. The target temperature calculation unit of the temperature control unit 10 obtains the target temperature of the temperature control target mold platen (fixed platen 1) using Equations 1 to 3.

数1式、数2式の型盤の温度と中心高さとの関係は数式の形で記憶してもよく、型盤の温度と中心高さとの対応を示す数表の形式で記憶してもよい。温度調節部7の制御方法は、ON・OFF制御でも、電流値制御でもよい。温度検出部8は固定盤1に、温度検出部9は可動盤2に取り付ける。固定盤1が支持脚5を有する場合には支持脚5に取付け、支持脚5を有さない場合には固定盤1の本体に取り付ける。   The relationship between the temperature and the center height of the expression 1 and expression 2 may be stored in the form of a mathematical expression, or may be stored in the form of a numerical table indicating the correspondence between the temperature of the pattern and the center height. Good. The control method of the temperature adjusting unit 7 may be ON / OFF control or current value control. The temperature detector 8 is attached to the fixed platen 1 and the temperature detector 9 is attached to the movable platen 2. When the fixed platen 1 has the support leg 5, it is attached to the support leg 5, and when it does not have the support leg 5, it is attached to the main body of the fixed platen 1.

<実施形態2>
図6は、温度調節機能を備えた射出成形機の型締装置を説明する図である。温度が変動しやすい部位は型締装置によって異なるため、温度調節部7や温度検出部8,9に適した部位も異なってくる。そのため、図6に示すように固定盤1を温度基準対象型盤とし、可動盤2を温度制御対象型盤としてもよい。ただし、支持脚5を有する型盤に取付ける場合には、支持脚5の熱膨張の方が型盤の本体の熱膨張よりも支配的であるため、型盤の本体ではなく支持脚5に取付ける。例えば、温度調節部7の取付け位置は図5のように可動盤2上でもよいが、図6のように支持脚5が可動盤2に設けられている場合には可動盤2の支持脚13上に設ける。
<Embodiment 2>
FIG. 6 is a diagram illustrating a mold clamping device of an injection molding machine having a temperature adjustment function. Since the part where the temperature is likely to vary varies depending on the mold clamping device, the part suitable for the temperature adjustment unit 7 and the temperature detection units 8 and 9 also varies. Therefore, as shown in FIG. 6, the fixed platen 1 may be a temperature reference target type platen, and the movable platen 2 may be a temperature control target type platen. However, in the case of mounting on the mold platen having the support legs 5, the thermal expansion of the support legs 5 is more dominant than the thermal expansion of the main body of the pattern board, so that the mounting is not performed on the main body of the pattern board. . For example, the temperature adjusting unit 7 may be mounted on the movable platen 2 as shown in FIG. 5, but when the support leg 5 is provided on the movable platen 2 as shown in FIG. Provide on top.

<実施形態3>
図9のように、数3式を用いて、可動盤2の中心高さと固定盤1の中心高さが同一となる可動盤温度と固定盤温度の組を表で機械に記憶させ、温度基準対象型盤の温度から温度制御対象型盤の目標温度を照らし合わせてもよい。また、数3式は数式として機械に記憶させてもよい。
なお、上述した実施形態において、温度基準対象基盤の両側面の支持脚の少なくとも一方に第一の温度検出部を設ける。温度制御対象基盤の両側面の支持脚の少なくとも一方に温度検出部と温度調節部を設ける。
<Embodiment 3>
As shown in FIG. 9, a set of a movable platen temperature and a fixed platen temperature in which the center height of the movable platen 2 and the central height of the fixed platen 1 are the same is stored in a table by using the equation (3). The target temperature of the temperature control target mold plate may be compared with the temperature of the target mold plate. Further, Equation 3 may be stored in the machine as an equation.
In the above-described embodiment, the first temperature detection unit is provided on at least one of the support legs on both sides of the temperature reference target base. A temperature detection unit and a temperature adjustment unit are provided on at least one of the support legs on both sides of the temperature control base.

1 固定盤
2 可動盤
3 金型
3a 固定側金型
3b 可動側金型
4 タイバー
5 支持脚
6 固定点
7 温度調節部
8 温度検出部
9 温度検出部
10 温度制御部
10a 記憶部
10b 目標温度算出部
11 中心軸
12 中心軸
13 支持脚
DESCRIPTION OF SYMBOLS 1 Fixed platen 2 Movable platen 3 Mold 3a Fixed side die 3b Movable side die 4 Tie bar 5 Support leg 6 Fixing point 7 Temperature adjustment part 8 Temperature detection part 9 Temperature detection part 10 Temperature control part 10a Storage part 10b Target temperature calculation Part 11 Central axis 12 Central axis 13 Support leg

Claims (5)

固定側金型を保持する固定盤と、可動側金型を保持する可動盤を有する射出成形機の型締装置において、
前記可動盤及び前記固定盤の何れか一方を温度基準対象型盤とし、他方を温度制御対象型盤とし、前記温度基準対象型盤には第1の温度検出部を設け、
前記温度制御対象型盤には第2の温度検出部と温度調節部を設け、
温度基準対象型盤の温度と温度基準対象型盤の中心高さとの関係を第1の関係として記憶し、温度制御対象型盤の温度と温度制御対象型盤の中心高さとの関係を第2の関係として記憶する記憶部を設け、
前記第1の温度検出部で検出した温度基準対象型盤の温度と第1の関係から温度基準対象型盤の中心高さを求め、該求めた温度基準対象型盤の中心高さと第2の関係とから温度制御対象型盤の中心高さが温度基準対象型盤の中心高さと同一となる温度制御対象型盤の目標温度を求める目標温度算出部とを有し、
前記温度調節部により、前記温度制御対象型盤の温度が前記目標温度になるよう制御することを特徴とする射出成形機の型締装置。
In a mold clamping device of an injection molding machine having a fixed platen for holding a fixed side mold and a movable platen for holding a movable side die,
Either one of the movable platen and the fixed platen is a temperature reference target type platen, the other is a temperature control target type platen, and the temperature reference target type platen is provided with a first temperature detection unit,
The temperature control target mold plate is provided with a second temperature detecting unit and a temperature adjusting unit,
The relationship between the temperature of the temperature reference target mold and the center height of the temperature reference target mold is stored as the first relationship, and the relationship between the temperature of the temperature control target mold and the center height of the temperature control target mold is second. A storage unit is provided for storing the relationship as
The center height of the temperature reference target mold plate is obtained from the first relationship with the temperature of the temperature reference target mold plate detected by the first temperature detection unit, and the center height of the obtained temperature reference target mold plate and the second height are determined. A target temperature calculation unit for obtaining a target temperature of the temperature control target mold plate in which the center height of the temperature control target mold plate is the same as the center height of the temperature reference target mold plate from the relationship,
A mold clamping device for an injection molding machine, wherein the temperature adjusting unit controls the temperature of the temperature control target mold plate to be the target temperature.
固定側金型を保持する固定盤と、可動側金型を保持する可動盤を有する射出成形機の型締装置において、
前記可動盤及び前記固定盤の何れか一方を温度基準対象型盤とし、他方を温度制御対象型盤とし、
前記温度基準対象型盤には第1の温度検出部を設け、
前記温度制御対象型盤には第2の温度検出部と温度調節部を設け、
温度制御対象型盤の中心高さが温度基準対象型盤の中心高さと同一となる時の温度基準対象型盤の温度と温度制御対象型盤の温度との関係を第3の関係として記憶する記憶部を設け、
温度基準対象型盤の温度と第3の関係とから温度制御対象型盤の中心高さが温度基準対象型盤の中心高さと同一となる温度制御対象型盤の目標温度を求める目標温度算出部とを有し、
前記温度調節部により、前記温度制御対象型盤の温度が前記目標温度になるよう制御することを特徴とする射出成形機の型締装置。
In a mold clamping device of an injection molding machine having a fixed platen for holding a fixed side mold and a movable platen for holding a movable side die,
Either one of the movable platen and the fixed platen is a temperature reference target type platen, and the other is a temperature control target type platen,
The temperature reference target mold plate is provided with a first temperature detection unit,
The temperature control target mold plate is provided with a second temperature detecting unit and a temperature adjusting unit,
The relationship between the temperature of the temperature reference target mold and the temperature of the temperature control target mold when the center height of the temperature control target mold is the same as the center height of the temperature reference target mold is stored as a third relationship. A storage unit,
A target temperature calculation unit for obtaining a target temperature of the temperature control target mold plate where the center height of the temperature control target mold plate is the same as the center height of the temperature reference target mold plate from the temperature of the temperature reference target mold plate and the third relationship. And
A mold clamping device for an injection molding machine, wherein the temperature adjusting unit controls the temperature of the temperature control target mold plate to be the target temperature.
前記温度基準対象型盤は型盤の両側面に支持脚を有し、該支持脚の少なくとも一方に第1の温度検出部を設けたことを特徴とする請求項1または2に記載の射出成形機の型締装置。   The injection molding according to claim 1 or 2, wherein the temperature reference target mold plate has support legs on both side surfaces of the mold plate, and a first temperature detection unit is provided on at least one of the support legs. Machine clamping device. 前記温度制御対象型盤は型盤の両側面に支持脚を有し、該支持脚の少なくとも一方に第2の温度検出部と温度調節部を設けたことを特徴とする請求項1または2に記載の射出成形機の型締装置。   3. The temperature control target pattern board has support legs on both side surfaces of the pattern board, and a second temperature detection part and a temperature adjustment part are provided on at least one of the support legs. The mold clamping apparatus of the injection molding machine as described. 前記温度調節部は、電気ヒータ、電熱冷却素子、流体による温度調節器の何れか一つであることを特徴とする請求項1〜4いずれか一つに記載の射出成形機の型締装置。   The mold clamping device for an injection molding machine according to any one of claims 1 to 4, wherein the temperature adjusting unit is any one of an electric heater, an electrothermal cooling element, and a fluid temperature controller.
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