JP5707350B2 - Capacitive touch panel and method for manufacturing capacitive touch panel - Google Patents

Description

  The present disclosure relates to a touch panel. In particular, the present disclosure relates to a capacitive touch panel and a method for manufacturing a capacitive touch panel.

  In recent years, touch sensing technology has been widely used. For example, in the application of touch sensing technology, the touch input interface is gradually becoming a general human-machine interface used by humans to input information. Furthermore, at present, capacitive touch sensing technology is the mainstream for realizing multiple touch functions between various touch sensing technologies.

  The structure of the capacitive touch panel can be mainly classified into two modes. The first mode is shown in FIG. 1 as a schematic cross-sectional view of a conventional two-layer capacitive touch panel. A plurality of first axis (for example, Y axis) detection electrodes 81 and a plurality of second axis (for example, X axis) detection electrodes 82 are formed on both surfaces of the substrate 80, respectively. The first axis detection electrode 81 and the second axis detection electrode 82 are separated by a substrate 80, and the substrate 80 prevents the first axis detection electrode 81 and the second axis detection electrode 82 from crossing each other. The touch point is determined by processing the combined charge between the first axis detection electrode 81 and the second axis detection electrode 82 before and after the capacitive touch panel is touched.

  The second mode is shown in FIG. 2 as a schematic cross-sectional view of a single-layer capacitive touch panel according to the prior art. The plurality of first axis (for example, Y axis) detection electrodes (not shown) and the plurality of second axis (for example, X axis) detection electrodes 92 are formed on the same surface of the substrate 90. Each first axis detection electrode is composed of a plurality of first axis conductive elements (not shown), and adjacent first axis conductive elements are connected by a first axis wiring 912. Similarly, each second axis detection electrode 92 includes a plurality of second axis conductive elements 921, and adjacent second axis conductive elements 921 are connected by a second axis wiring 922. Further, an insulating material 93 is provided between each first axis wiring 912 and the corresponding second axis wiring 922, and the second axis wiring 922 forms a jumper. The touch point is determined by processing the combined charge between the first axis detection electrode and the second axis detection electrode 92 before and after the capacitive touch panel is touched.

Taiwan Patent Application Publication No. 20103111 Chinese Patent Application No. 101261561

  However, the structure of the above-described conventional capacitive touch panel and the corresponding manufacturing process are complex, and there is a need for a new capacitive touch panel design that is simpler and more efficient.

  In order to solve the above technical problem, in the present disclosure, the touch sensor structure of the capacitive touch panel has a single layer on one surface of the touch panel substrate in order to obtain a signal change of the detection axis of the sensing matrix. This is improved by forming a planar sensing matrix.

  According to one aspect of the present disclosure, the capacitive touch panel is disposed on one surface of the substrate so as to form a substrate and a sensing matrix that generates sense signals from the first axis and the second axis. And a touch sensor having a plurality of conductive elements.

  According to another aspect of the present disclosure, a method for manufacturing a capacitive touch panel includes forming a sensing matrix by arranging a plurality of conductive elements on a surface of a substrate, and providing an input bus as a first axis of the sensing matrix. And electrically connecting an output bus to one end of the second axis of the sensing matrix.

  As a result, the effects that can be achieved by the present disclosure not only simplify the overall structure of the touch panel to reduce the manufacturing steps and accelerate the manufacturing speed, but also greatly reduce the manufacturing cost and improve the manufacturing yield. That is.

  The foregoing summary, the following detailed description, and the drawings are made to further illustrate the modes, means, and advantages employed to accomplish the disclosed objectives. Other objects and advantages of the present disclosure will be explained in the following description and drawings.

It is typical sectional drawing of the two-layer electrostatic capacitance type touch panel by a prior art. It is typical sectional drawing of the single layer capacitive touch panel by a prior art. It is a mimetic diagram of the capacitive touch panel by the mode of this indication. It is a typical sectional view of the capacitive touch panel by the mode of this indication. FIG. 6 is an equivalent circuit diagram of a set of parasitic capacitances of a touch sensor according to aspects of the present disclosure. It is a schematic diagram of the signal change of the touch sensor by the aspect of this indication. It is a flowchart of the manufacturing method of the capacitive touch panel by the 1st aspect of this indication. It is a flowchart of the manufacturing method of the capacitive touch panel by the 2nd aspect of this indication.

  The present disclosure improves the touch sensor structure of a capacitive touch panel by forming a single layer planar sensing matrix directly on one surface of the touch panel substrate. Thereby, the signal change of the detection axis of the sensing matrix is obtained through the directly designated single-layer planar sensing matrix. Moreover, the touch point on the capacitive touch panel touched by the user can be detected based on the present disclosure.

The touch sensor structure of the present disclosure can be applied to the following drive-detect operation.
1. 1. Drive a single axis (eg, X axis) during detection of another axis (eg, Y axis) 2. Drive a single axis (eg X axis) during detection of both different axes (X axis and Y axis) Drives both different axes (X and Y axes) while detecting both different axes (X and Y axes)

  In an embodiment, the first drive-detect operation drives one axis of the sensing matrix and detects the other axis. In actual application, in order to detect the position of the touch point more accurately, the second or third drive-detection operation can be adopted to detect the position of the touch point by detecting two different axes. The following embodiments will be described and explained based on the second drive-detect operation.

  FIG. 3 is a schematic diagram of a capacitive touch panel according to an embodiment of the present disclosure. As shown in the figure, the present embodiment is a capacitive touch panel 1 including a substrate 10, a touch sensor 11, and a control unit 12. The substrate 10 functions as a support base for the capacitive touch panel 1 and can be formed of a transparent material such as glass or plastic.

  The touch sensor 11 is provided on the substrate 10. In an actual design, the touch sensor 11 may be provided on the upper surface or the lower surface of the substrate 10, but is not limited thereto. Furthermore, the “upper” and “lower” positions of the substrate 10 in the present embodiment only represent the corresponding positional relationship. In the drawings of this specification, the upper surface of the substrate 10 is closer to the user and the lower surface is farther from the user. Furthermore, the structure of the touch sensor 11 further includes a plurality of conductive elements 110, an input bus 111, and an output bus 112.

  The conductive elements 110 are arranged so as to form a sensing matrix on the same surface of the substrate 10. According to the principle of electrical characteristics, a parasitic capacitance that is not a physical capacitance can be formed between two common conductors. For this reason, in the sensing matrix of the present embodiment, each of the two adjacent conductive elements 110 induces the first parasitic capacitance 113 between the first axis and the second axis of the sensing matrix. Accordingly, the conductive elements 110 that are initially independent of each other form a connected reticular mode due to the effect of the first parasitic capacitance 113. On the other hand, each conductive element 110 further induces a ground and a second parasitic capacitance 114.

Furthermore, the material of the conductive element 110 is indium tin oxide (ITO), indium zinc oxide (IZO), gallium zinc oxide (GZO), conductive polymer, carbon nanotube thin film (CNT), ITO nanoparticles, nanowires, Mg (OH ) ₂ : C, graphene, or zinc oxide (ZnO) may be included. Furthermore, the shape of the conductive element 110 of the present embodiment is designed as a rhombus. Circular, elliptical, polygonal or cross shapes can also be employed. The material or shape of the conductive element 110 is not limited to the present disclosure.

  The input bus 111 is electrically connected to one end of the first axis (for example, the X axis) of the sensing matrix. The output bus 112 is electrically connected to the other end of the first axis of the sensing matrix, and is electrically connected to one end of the second axis (for example, the Y axis) of the sensing matrix. For this reason, the sensing matrix of the embodiment can be applied to the second drive-detection operation. Referring to FIG. 3, the sensing matrix of the present embodiment is simplified to a 5 × 4 matrix. In other words, the input bus 111 includes four wiring channels that are electrically connected to one ends of four conductive element groups on the first axis formed by the connection of the conductive elements 110. The output bus 112 includes the other end of the four conductive element groups on the first axis formed by the connection of the conductive elements 110 and the five conductive element groups on the second axis formed by the connection of the conductive elements 110. 9 wiring channels that are electrically connected to one end of each.

  In other embodiments, the input bus 111 can also be electrically connected to the other end of the second axis of the sensing matrix. This allows the sensing matrix to be applied to the third drive-detection operation.

  The control unit 12 is electrically connected to the input bus 111 and the output bus 112. The control unit 12 is used to generate a drive signal Drive_Sig to the input bus 111 and receive at least one detection signal Sense_Sig via the output bus 112. More specifically, the control unit 12 includes at least two multiplexers 121 and 122. The multiplexer 121 is electrically connected to the input bus 111 and sequentially switches and outputs the drive signal Drive_Sig to different wiring channels of the input bus 111. The other multiplexer 122 is electrically connected to the output bus 112 and sequentially switches and receives the detection signal Sense_Sig transmitted by different wiring channels of the output bus 112.

  FIG. 4 is a schematic cross-sectional view of a capacitive touch panel according to an embodiment of the present disclosure. FIG. 4 further shows the stacking relationship between the substrate 10 and the conductive element 110. As shown in FIG. 4, the sensing matrix arranged and formed by the conductive elements 110 is directly provided on the same plane on the upper surface of the substrate 10. For this reason, under the simplified structure of the capacitive touch panel 1, the present embodiment can obtain signal changes on the first axis and the second axis via the single-layer sensing matrix.

  Next, in order to explain the operation of the touch sensor 11 according to the present embodiment, reference is made to FIG. 5 based on the structure of FIG. FIG. 5 shows an equivalent circuit of the parasitic capacitance set of the touch sensor according to the embodiment of the present disclosure. As shown in FIG. 5, each first parasitic capacitance 113 formed in the sensing matrix is equivalent to an RC series circuit, and the second parasitic capacitance 114 is equivalent to an RC parallel circuit.

  In another embodiment, the control unit 12 generates a 10 MHz drive signal Drive_Sig to the input bus 111, and the touch sensor 11 operates at an operating frequency of 10 MHz. The frequency of the drive signal Drive_Sig determines the penetration capability of the signal. This can be designed without limitation depending on the actual application.

  When there is no touch point, the RC series circuit equivalent to the first parasitic capacitor 113 may be, for example, a 50Ω resistor connected in series with a 1 pF capacitor. The RC parallel circuit equivalent to the second parasitic capacitor 114 can be, for example, a 100 MΩ resistor connected in parallel to a 1 pF capacitor. When the user performs a touch operation and at least one touch point is generated, the first parasitic capacitance 113 and the second parasitic capacitance 114 corresponding to the touch point and the surrounding charges are absorbed, and the equivalent capacitance The value decreases. According to the simulated data, the equivalent capacitance values of the first parasitic capacitance 113 and the second parasitic capacitance 114 corresponding to the touch point are reduced from about 1 pF to 0.8 pF. As the distance from the touch point increases, the charge is not absorbed and the equivalent capacitance value decreases less. It is understood that the actual change in capacitance value can be an error due to the influence of environmental factors. According to the above, at least one row and one column with the largest voltage change is obtained by detecting the voltage change in all the rows and columns of the sensing matrix before and after the touch. Thereby, the touch point can be detected by calculating the intersection of the row and column of maximum change.

  FIG. 6 is a schematic diagram of a signal change of the touch sensor according to the embodiment of the present disclosure. As illustrated, one end of the sensing matrix on the X axis (row) of the present embodiment is used to receive the drive signal Drive_Sig. One end of the sensing matrix on the Y axis (row) and the other end of the sensing matrix on the X axis are used to output detection signals Sense_Sig1 and Sense_Sig2, respectively. Further, the embodiment includes an M × N sensing matrix having a first detection row Col1, a second detection row Col2, a third detection row Col3, a first detection column Row1, a second detection column Row2, and a third detection column Row3. The difference in signal change will be described under the conditions used.

  First, as shown in Table 1 below, the description is made by comparing the detection signal Sense_Sig1 between different columns. The drive signal Drive_Sig of the present embodiment is input to the sensing matrix from the left side of FIG. 6, and the signal attenuation of the first detection row Col1, the second detection row Col2, and the third detection row Col3 is based on the electrical principle of signal attenuation. The amount gradually increases. When the touch point is not generated, the measured signal amounts are −32 dBm, −36 dBm, and −41 dBm. When a touch point is generated, the signal amounts detected in the first detection row Col1, the second detection row Col2, and the third detection row Col3 are attenuated to -33 dBm, -44 dBm, and -44 dBm, respectively. As a result, signal changes (attenuation amounts) of the first detection row Col1, the second detection row Col2, and the third detection row Col3 before and after the touch point is generated are obtained, and the signal change of the second detection row Col2 is the largest. It becomes.

  On the other hand, the description is made by comparing the detection signals Sense_Sig2 between different rows. Similarly, the drive signal Drive_Sig is input from the left side of the sensing matrix of FIG. As shown in Table 2 below, theoretically, the signal amounts detected by the first detection row Row1, the second detection row Row2, and the third detection row Row3 are equal when the touch point is not generated, The amount is -34 dBm. When a touch point is generated, the amount of new words detected in the first detection row Row1, the second detection row Row2, and the third detection row Row3 is attenuated to −40 dBm, −45 dBm, and −40 dBm, respectively. As a result, signal changes in the first detection row Row1, the second detection row Row2, and the third detection row Row3 before and after the touch point is generated are obtained, and the signal change in the second detection row Row2 is the largest. .

  As a result, using the obtained signal changes in all rows and columns, the actual position of the touch point (indicated by a broken-line circle in FIG. 6) shows the maximum change in the second detection column Col2 and the second detection column Col2. It is detected by calculating the intersection of the detection row Row2.

FIG. 7 is a flowchart of the method for manufacturing the capacitive touch panel according to the first embodiment of the present disclosure. As shown in the figure, the method of manufacturing the capacitive touch panel according to the present embodiment includes the following steps. A substrate to be used as a support base for subsequent steps is prepared (S701). The surface of the substrate is covered with a conductive film (S703). Whether to cover the upper surface or the lower surface of the substrate is determined without limitation by the actual design. Examples of the conductive film material include indium tin oxide (ITO), indium zinc oxide (IZO), gallium zinc oxide (GZO), conductive polymer, carbon nanotube thin film (CNT), ITO nanoparticles, nanowires, and Mg (OH). ₂ : Can be selected from C, graphene, or zinc oxide (ZnO).

  Next, the method further includes patterning the conductive film to form a sensing matrix by disposing a plurality of conductive elements. It is known to those skilled in the art that the conductive film patterning process generally includes baking, photomask alignment, exposure, development, etching, and the like. These are called photoprocesses and will not be described in further detail here. In the present disclosure, the patterning process is performed once on the single-layer conductive film to obtain a desired sensing matrix structure.

  Thereafter, the subsequent metal wiring process places an input bus electrically connected to one end of the first axis of the sensing matrix (S707), and the other end of the first axis of the sensing matrix and the second axis of the sensing matrix. This is continued by placing an output bus electrically connected to one end of the terminal (S709). The order of steps S707 and S709 is not limited to this disclosure, and can be changed and adjusted according to the actual requirements of the process.

  Steps S703 to S709 describe a procedure for forming a touch sensor on the substrate.

  Finally, the method further includes an arrangement of control units that are electrically connected to the input bus and the output bus (S711). The control unit is formed on, for example, a printed circuit board or a flexible circuit board, and is electrically connected to an input bus and an output bus. Thereby, the manufacture of the capacitive touch panel according to the present embodiment can be completed.

  FIG. 8 is a flowchart of a method for manufacturing a capacitive touch panel according to the second embodiment of the present disclosure. The difference between the flowchart of the present embodiment and the flowchart of the first embodiment is that, after the substrate is prepared (S801), the substrate is used to form a sensing matrix by arranging conductive elements, and the substrate is used. The conductive element is directly printed on the surface (upper surface or lower surface) of the substrate (S803). As a result, the process required in the present embodiment is further simplified than in the first embodiment.

  Subsequent steps S850 to S809 are a metal wiring process step for arranging an input bus and an output bus, and a process for arranging a control unit, and will not be described in detail here.

  In conclusion, the present disclosure devised a planar matrix mode of the sensing matrix as the structure of the touch sensor. This not only effectively simplifies the overall structure of the touch panel to reduce the manufacturing process and accelerate the manufacturing speed, but also reduces the material consumption and the complexity of the manufacturing process, significantly increasing the manufacturing cost. It is possible to reduce the manufacturing yield. Furthermore, the capacitive touch panel of the present disclosure can be easily applied to various types of display screens in actual products.

  Although the present disclosure has been described with reference to the embodiments and the best mode for carrying out the present disclosure, those skilled in the art will recognize that various methods defined by the appended claims without departing from the scope of the present disclosure. Improvements and changes are possible.

DESCRIPTION OF SYMBOLS 1 Capacitive touch panel 10 Board | substrate 11 Touch sensor 12 Control unit 110 Conductive element 111 Input bus 112 Output bus 113 1st parasitic capacitance 114 2nd parasitic capacitance 121 Multiplexer 122 Multiplexer

Claims (9)

A substrate,
A on one surface of the substrate, a touch sensor having a plurality of conductive elements arranged independently of one another so as to form a sensing matrix to generate a sense signal from the first and second shafts,
Equipped with a,
The touch sensor is
An input bus electrically connected to one end of the first shaft and outputting a drive signal to one end of the first shaft;
An output bus electrically connected to the other end of the first shaft and one end of the second shaft, and outputting the generated sense signal from the other end of the first shaft and one end of the second shaft;
Have
The plurality of conductive elements are connected between the adjacent conductive elements by a first parasitic capacitance induced between the adjacent conductive elements on the first axis and the second axis. you form the sensing matrix,
Capacitive touch panel. Each of the conductive elements induces a second parasitic capacitance between the conductive element and the ground.
The capacitive touch panel according to claim 1. The capacitive touch panel according to claim 1 or 2 , wherein the input bus is electrically connected to the other end of the second axis of the sensing matrix. The electrostatic device according to claim 3 , further comprising a control unit that is electrically connected to the input bus and the output bus, generates a drive signal to the input bus, and receives a detection signal from the output bus. Capacitive touch panel. A sensing matrix is formed by arranging a plurality of conductive elements on one surface of the substrate independently of each other ,
An input bus connected to one end is arranged on the first axis of the sensing matrix,
An output bus connected to the other end of the first axis and one end of the second axis of the sensing matrix ;
The sensing matrix is formed by connecting between the adjacent conductive elements by a first parasitic capacitance induced between the adjacent conductive elements on the first axis and the second axis. The
A method for manufacturing a capacitive touch panel. The capacitive touch panel manufacturing method according to claim 5 , wherein the input bus is further electrically connected to the other end of the second axis of the sensing matrix. The method for manufacturing a capacitive touch panel according to claim 5 or 6, wherein a control unit electrically connected to the input bus and the output bus is disposed. In the step of forming the sensing matrix,
Coating a conductive film on the substrate;
The manufacturing method of the electrostatic capacitance type touch panel of any one of Claims 5-7 including the step which patterns the said electrically conductive film. In the step of forming the sensing matrix,
The method for manufacturing a capacitive touch panel according to claim 5, comprising a step of printing the conductive element on the surface of the substrate by a printing technique.

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