JP5709558B2 - Inspection method, imprint apparatus, and article manufacturing method - Google Patents

Description

  The present invention relates to an inspection method, an imprint apparatus, and an article manufacturing method.

  The imprint technique is attracting attention as a technique for forming a fine pattern because it does not require a large-scale apparatus such as a vacuum process and can mass-produce semiconductor devices at a low cost. In the imprint technology, the resin is cured in a state where a mold (original) having a fine pattern is pressed against the resin on a substrate such as a silicon wafer or a glass plate, and the mold is peeled off from the cured resin to form a fine pattern. Form.

  In an imprint apparatus using imprint technology, it is necessary to inspect the overlay of patterns formed by imprint, as with the exposure apparatus used in the manufacture of semiconductor devices, and related technologies are proposed. (See Patent Document 1). Patent Document 1 discloses a technique for inspecting misalignment between a base mark already formed on a substrate and a pattern formed by imprinting.

  On the other hand, in the exposure apparatus, a registration inspection method using resist-to-resist (RtoR) has been proposed (see Patent Document 2). In Patent Document 2, after the first mark is projected onto the resist on the substrate, the relative positional relationship between the substrate and the reticle is changed, and the second mark is projected in the vicinity of the first mark. . Then, the substrate on which the first mark and the second mark are projected is developed and introduced into the overlay inspection apparatus (or with an alignment scope provided in the exposure apparatus), and the first mark and the second mark Relative position (positional deviation between the first mark and the second mark) is measured. Based on the positional deviation between the first mark and the second mark thus measured, the exposure apparatus performs adjustment and calibration for improving the overlay performance.

JP 2009-088264 A Japanese Patent Publication No. 07-022099

  However, the inspection method proposed in Patent Document 2 cannot be applied to an imprint apparatus. This is due to the difference between the imprint apparatus and the exposure apparatus. In the exposure apparatus, on the substrate (the resist), the region other than the mark (first mark) is not irradiated with light (that is, the region other than the first mark is not exposed). Can be projected onto a non-exposed area on the substrate. On the other hand, in the imprint apparatus, a pattern (mark) is formed by curing the resin while pressing the mold against the resin on the substrate (that is, all the resins on the substrate are cured). The next mark cannot be formed continuously. In addition, after forming a 1st mark, apply | coating resin again and forming a 2nd mark is also considered. However, in this case, the first mark already formed on the substrate is crushed by the mold, or the position of the first mark cannot be measured with high accuracy by the resin covering the first mark. I will.

  Therefore, in the imprint apparatus, as proposed in Patent Document 1, it is realistic to form a mark on a substrate on which a base mark is previously formed by the imprint apparatus and perform overlay inspection. . However, in this case, since a film forming process and an etching process are required when forming the base mark, it takes time and cost to manufacture the substrate, and the mark position is increased due to errors such as process distortion. It becomes impossible to measure accurately.

  The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a technique advantageous for overlay inspection of an imprint apparatus.

In order to achieve the above object, an inspection method according to one aspect of the present invention is an inspection method for an imprint apparatus that performs imprint processing for forming a pattern on the substrate by forming an imprint material on the substrate with a mold. A first step of supplying a first imprint material onto a substrate; and curing the first imprint material supplied in the first step by molding with a mold. A second step of forming a first mark made of a printing material ; a third step of supplying a second imprinting material onto the substrate; and a second imprinting material supplied in the third step is molded by a mold. cured Te, fourth step and said fourth step and said first mark formed in the second step of forming a second mark consisting of the was cured second imprint material A fifth step of measuring a relative position with respect to the formed second mark, and in the third step, the second imprint material contacts the first mark formed in the second step. In order to prevent this, the second imprint material is supplied by setting conditions including the supply position and supply amount of the second imprint material.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide a technique advantageous for overlay inspection of an imprint apparatus.

It is the schematic which shows the structure of the imprint apparatus as 1 side surface of this invention. It is a figure for demonstrating the inspection method of the imprint apparatus as 1 side surface of this invention. It is a figure for demonstrating determination (S102) of the supply position of the resin which should be supplied on a board | substrate. It is a figure for demonstrating the inspection method of the imprint apparatus as 1 side surface of this invention. It is a figure for demonstrating determination (S102) of the supply position of the resin which should be supplied on a board | substrate. It is a figure for demonstrating the inspection method of the imprint apparatus as 1 side surface of this invention. It is a figure for demonstrating the inspection method of the imprint apparatus as 1 side surface of this invention.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

<First Embodiment>
FIG. 1 is a schematic diagram illustrating a configuration of an imprint apparatus 100 according to one aspect of the present invention. The imprint apparatus 100 performs an imprint process in which an imprint material on a substrate (typically a resin, hereinafter referred to as “resin”) is formed by a mold to form a pattern on the substrate.

  Referring to FIG. 1, a substrate (wafer) 1 is held by a chuck 2. The fine movement stage 3 has a function of correcting the rotation of the substrate 1 around the Z axis, a function of correcting the position of the substrate 1 in the Z axis direction, and a function of correcting the tilt of the substrate 1. The fine movement stage 3 is disposed on an XY stage 4 for positioning the substrate 1 at predetermined positions in the X-axis direction and the Y-axis direction. The fine movement stage 3 and the XY stage 4 constitute a substrate stage for moving the substrate 1.

  The XY stage 4 is placed on the base surface plate 5. The fine movement stage 3 is attached with a bar mirror (not shown) that reflects light from a laser interferometer that measures the position of the fine movement stage 3 in the X-axis direction and the Y-axis direction.

  The mold 10 has a pattern to be transferred to the substrate 1 on the surface, and is fixed to the mold chuck 11. The mold chuck 11 is placed on the mold stage 12. The mold stage 12 has a function of correcting the inclination of the mold 10 around the Z axis. The positions of the mold chuck 11 in the X-axis direction and the Y-axis direction are measured by a laser interferometer supported on the alignment shelf 18.

  Each of the mold chuck 11 and the mold stage 12 has an opening (not shown) that allows UV light irradiated from the UV light source 16 through the collimator lens to pass therethrough. The mold chuck 11 (or the mold stage 12) is provided with a load cell for detecting the pressing force (imprinting pressure) of the mold 10.

  One end of the guide bar plate 13 is fixed to the mold stage 12 and the other end of the guide bar 14 penetrating the top plate 9 is fixed. The mold lifting / lowering actuator 15 is composed of an air cylinder or a linear motor, and drives the guide bar 14 in the Z-axis direction to press the mold 10 held by the mold chuck 11 against the substrate 1 or to separate it from the substrate 1. . The alignment shelf 18 is suspended from the top plate 9 via a support column 19. The guide bar 14 passes through the alignment shelf 18. Further, the alignment shelf 18 is provided with a height measurement system (not shown) for measuring the height (flatness) of the substrate 1 held on the chuck 2 by using, for example, an oblique incident image shift method. ing.

  A TTM (through-the-mold) alignment scope 20 for mold alignment has an optical system and an imaging system for observing a reference mark on the substrate stage and an alignment mark provided on the mold 10. The TTM alignment scope 20 measures the positional deviation between the substrate stage and the mold 10 in the X-axis direction and the Y-axis direction.

  The resin supply unit 27 includes a dispenser head including a nozzle that drops liquid photo-curing resin (resist) onto the surface of the substrate 1 and has a function of supplying (applying) the resin onto the substrate. The resin supply unit 27 employs, for example, a piezo jet method or a micro solenoid method, and can supply a very small volume of resin of about 1 pL (picoliter) on the substrate. The dispenser head constituting the resin supply unit 27 may be a single nozzle or a linear nozzle array having more than 100 nozzles.

  The off-axis alignment (OA) scope 40 measures the alignment marks provided in a plurality of shots on the substrate and performs a global alignment process for determining the positions of the plurality of shots. By obtaining the positional relationship between the mold 10 and the substrate stage with the TTM alignment scope 20 and obtaining the positional relationship between the substrate stage and the substrate 1 with the OA scope 40, relative alignment between the mold 10 and the substrate 1 can be performed. it can.

  The control unit 50 includes a CPU, a memory, and the like, and controls the whole (operation) of the imprint apparatus 100. The control unit 50 controls an inspection process for inspecting performance (for example, overlay) of the imprint apparatus 100 that is necessary when adjusting an operation related to the imprint process. Further, the control unit 50 controls an operation related to the imprint process based on the inspection result of the inspection process.

  With reference to FIG. 2, the inspection process of the imprint apparatus 100 (that is, the inspection method of the imprint apparatus 100) by the control unit 50 will be described. 2A is a flowchart for explaining the inspection process of the imprint apparatus 100, and FIG. 2B shows the state of the substrate 1 and the mold in each process of the inspection process of the imprint apparatus 100. It is a schematic sectional drawing. In FIG. 2B, the mold pattern (step amount) and the mark (step amount) formed on the substrate 1 are exaggerated for easy understanding.

  In S100 (first step), the resin (first imprint material) R1 is supplied to the substrate 1 placed on the substrate stage using the resin supply unit 27. Note that, before S100, an adhesive may be supplied (applied) to the substrate 1 using spin coating or the like. Such an adhesive is used for the purpose of improving the adhesion between the substrate 1 and the resin.

  In S101 (second step), a first resin mark (first mark for inspection) WM1 is formed. Specifically, the resin R1 is irradiated with UV light in a state where the mold having the first mark pattern TM1 is pressed against the resin R1 supplied in S100, and the mold is peeled off from the cured resin R1. Thus, the first resin mark WM1 is formed. Thus, in S101, the first resin mark WM1 that is an inner mark is formed on the substrate. At this time, a remaining film determined by the pressing force of the mold and the supply amount of the resin R1 is generated in a region (non-mark region) where the first resin mark WM1 is not formed on the substrate. The remaining film generally has a thickness of about 10 nm to several tens of nm.

  In S102, the supply position (supply region) of the resin (second imprint material) R2 to be supplied on the substrate on which the first resin mark WM1 has been formed in S101 is determined. The determination of the supply position of the resin R2 will be described later in detail.

  In S103 (third step), the resin (second resin) R2 is supplied to the substrate 1 on which the first resin mark WM1 is formed based on the supply position determined in S102 using the resin supply unit 27. . As will be described later, in S103, the resin R2 is supplied so that the resin R2 does not come into contact with the first resin mark WM1 when the mold having the second mark pattern TM2 is pressed against the resin R2. In the present embodiment, as shown in FIG. 2B, the resin R2 is supplied to the outside of the first resin mark WM1 formed on the substrate 1. The supply amount of the resin R2 may be the same as the supply amount of the resin R1 supplied in S100. In FIG. 2B, the resin R1 and the resin R2 are distinguished from each other. However, the resin R1 and the resin R2 may be the same type of resin or different types of resins. .

  In S104 (fourth step), a second resin mark (second mark for inspection) WM2 is formed. Specifically, the resin R2 supplied in S103 is irradiated with UV light in a state where the mold having the second mark pattern TM2 is pressed, and the resin R2 is cured, and the mold is peeled from the cured resin R2. Then, the second resin mark WM2 is formed. Thus, in S104, the second resin mark WM2 that is the outer mark is formed on the substrate. At this time, the resin R2 spreads by pressing the mold, but does not contact the first resin mark WM1 as described above.

  As shown in FIG. 2B, a residual film generated when the first resin mark WM1 is formed exists on the substrate below the second mark pattern TM2. The mold having the second mark pattern TM2 prevents the first resin mark WM1 from being crushed on the first resin mark WM1 formed on the substrate 1 in a state where the mold is pressed against the resin R2. Concave portion A is included. The step amount of the concave portion A of the mold may be the same as the step amount of the other pattern (the step amount of the second mark pattern TM2) because the remaining film exists on the substrate 1, and the step amount is specially set. There is no need to make it bigger.

  In the present embodiment, the same mold is used in S101 and S104. Specifically, the first mark pattern TM1 and the second mark pattern TM2 are formed on the mold with a predetermined distance apart, and the substrate 1 (substrate stage) is moved by a predetermined distance between S101 and S104. It is moved. However, a mold having the first mark pattern TM1 and a mold having the second mark pattern TM2 may be prepared, and the mold may be exchanged between S101 and S103.

  In S105 (fifth step), the relative position between the first resin mark WM1 formed in S101 and the second resin mark WM2 formed in S104 (that is, the first resin mark WM1 and the second resin mark). WM2 relative displacement amount) is measured. Note that the relative position between the first resin mark WM1 and the second resin mark WM2 can be measured by using the OA scope 40, and thus the steps S100 to S100 can be performed while the substrate 1 is placed on the substrate stage. S105 can be implemented. However, the substrate 1 on which the first resin mark WM1 and the second resin mark WM2 are formed is taken out from the imprint apparatus 100 and introduced into the overlay inspection apparatus, and the first resin mark WM1 and the second resin mark WM2 are introduced. The relative position may be measured.

  The step of the mold pattern is generally formed with an aspect ratio of about 2 to 3 times the minimum line width of the semiconductor device pattern. For example, when the minimum line width is 28 nm and the aspect ratio is 2.5 times, the level difference of the mold pattern is 70 nm. The level difference (height) between the first resin mark WM1 and the second resin mark WM2 is 70 nm because it is the same as the level difference between the first mark pattern TM1 and the second mark pattern TM2 of the mold. The one mark pattern TM1 and the second mark pattern TM2 having a step of 70 nm can be measured with sufficient contrast in the OA scope 40 and the overlay inspection apparatus. Accordingly, the positions of the first mark pattern TM1 and the second mark pattern TM2 are specified using a known technique such as a template matching method or a symmetric processing method, and the first mark pattern TM1 and the second mark pattern TM2 are identified. Relative position can be obtained.

  Here, with reference to FIG. 3, the determination of the supply position of the resin R2 to be supplied onto the substrate (S102) will be described. In the present embodiment, when the resin R2 is supplied onto the substrate on which the first resin mark WM1 is formed to form the second resin mark WM2, the resin R2 does not come into contact with the first resin mark WM1. It is important to. Further, in order to form the second resin mark WM2 on the substrate, the second mark pattern TM2 of the mold is filled with the resin R2 (that is, the second mark pattern TM2 is completely filled with the resin R2). )There is a need.

  FIG. 3A shows the first resin marks WM1X and WM1Y that are inner marks, the second resin marks WM2X and WM2Y that are outer marks, the supply position of the second resin R2, and the second resin R2. Shows the relationship with the area where In the present embodiment, a case where the second resin R2 is supplied to four locations on the substrate will be described as an example.

The supply amount V of the resin R2 is as follows using the area S of the region where the resin R2 spreads, where t is the step of the mark pattern of the mold, tr is the thickness of the remaining film, and S 'is the area of one resin mark. (1).
V = S · (t + tr) −S ′ · t (1)
Equation (1) means that the volume of the resin R2 supplied onto the substrate is preserved even when the resin R2 spreads by pressing the mold. When the equation (1) is transformed, the area S of the region where the resin R2 spreads is expressed by the following equation (2). Further, the radius r of the region where the resin R2 spreads is expressed by the following formula (3).
S = (V + S ′ · t) / (t + tr) (2)
r = √ (S / π) (3)
When the resin R2 supplied to four locations on the substrate spreads, the resin R2 from the center position of the resin mark group (first resin mark WM1 and second resin mark WM2) from the condition that the respective resins R2 do not overlap. The distance Ds to the supply position is expressed by the following equation (4). The distance Dm from the center position of the resin mark group to the second resin mark WM2X is expressed by the following formula (5).
Ds = √2 · r (4)
Dm = (√2−1) r (5)
Therefore, the supply position of the resin R2 can be determined from the expressions (2), (3), and (4), and further, the position of the second resin mark WM2 can be determined from the expression (5). If there is a variation in the amount and position of the resin supplied by the resin supply unit 27, the supply position of the resin R2 and the position of the second resin mark WM2 are set to the center position of the resin mark group in consideration of such variation. It is good to keep away from.

Hereinafter, the supply position of the resin R2 and the position of the second resin mark WM2 will be described with numerical examples. The supply amount V of the resin R2 is 1 pL (1000 μm ³ ), the step t of the mark pattern of the mold is 70 nm, and the thickness tr of the remaining film is 15 nm. The resin mark has a width of 1 μm and a height of 20 μm, and an area S ′ of one resin mark is 20 μm ² .

  In this case, from the above equation, the radius r of the region where the resin R2 spreads is 61.2 μm, the distance Ds from the center position of the resin mark group to the supply position of the resin R2 is 86.6 μm, and the distance from the center position of the resin mark group is The distance Dm to the second resin mark WM2X is 25.4 μm.

  Next, consider the case where the variation in the amount of resin supplied by the resin supply unit 27 is ± 10%, that is, the case where the amount of resin supplied by the resin supply unit 27 varies in the range of 0.9 pL to 1.1 pL.

  First, the maximum resin supply amount Vmax by the resin supply unit 27 is substituted into V in Expression (2), the radius r_max of the region where the resin R2 spreads, and the distance Ds_max from the center position of the resin mark group to the supply position of the resin R2 Ask for. In the case of the numerical example described above, the radius r_max of the region where the resin R2 spreads is 64.2 μm, and the distance Ds_max from the center position of the resin mark group to the resin R2 supply position is 90.8 μm.

  Next, the minimum supply amount Vmax of the resin by the resin supply unit 27 is substituted into V in Expression (2), the radius r_min of the region where the resin R2 spreads, and the distance from the center position of the resin mark group to the supply position of the resin R2 Ds_min is obtained. In the numerical example described above, the radius r_min of the region where the resin R2 spreads is 58.1 μm, and the distance Ds_min from the center position of the resin mark group to the supply position of the resin R2 is 82.2 μm.

  As described above, the condition for determining the supply position of the resin R2 is that the resin R2 is not in contact with the first resin mark WM1 formed on the substrate, and the second resin mark WM2 is formed. Therefore, the second mark pattern TM2 is satisfied. When the resin supply amount V by the resin supply unit 27 is larger than the design amount, the radius r of the region where the resin R2 spreads increases, and the resin R2 comes into contact with the first resin mark WM1 formed on the substrate. there is a possibility. On the other hand, when the resin supply amount V by the resin supply unit 27 is smaller than the design amount, the resin R2 may not satisfy the second mark pattern TM2 for forming the second resin mark WM2.

Accordingly, when there is a variation in the amount of resin supplied by the resin supply unit 27, the distance Ds ′ from the center position of the resin mark group to the supply position of the resin R2 may be set to Ds_max. The distance Dm ′ from the center position of the resin mark group to the second resin mark WM2X can be obtained from the following equation (6).
Dm ′ = Ds_max−r_min (6)
In the numerical example described above, the distance Ds ′ from the center position of the resin mark group to the supply position of the resin R2 is 90.8 μm, and the distance Dm ′ from the center position of the resin mark group to the second resin mark WM2X is It is obtained as 32.9 μm.

Thus, when there is a variation in the amount of resin supplied by the resin supply unit 27, the area of the resin mark group on the substrate is large (in the case of the numerical example described above, approximately 66 μm ² ). However, if the field of view of the OA scope 40 at a high magnification is about 100 μm, the resin mark group (the first resin mark WM1 and the second resin mark WM2) can be sufficiently measured.

  The same applies to the case where the resin supply position by the resin supply unit 27 varies. Specifically, the supply position of the resin R2 and the center of the resin mark group are set so that the resin R2 does not contact the first resin mark WM1 formed on the substrate and satisfies the second mark pattern TM2. The distance from the position to the second resin mark WM2 is determined.

  Note that the position of the mold (second mark pattern TM2) and the resin supply unit 27 with respect to the substrate on which the first resin mark WM1 is formed remains on the substrate stage. It can be performed with high accuracy within the range of positioning accuracy. Further, even when the substrate on which the first resin mark WM1 is formed is taken out from the imprint apparatus 100, the mold and resin supply unit for the substrate can be measured by measuring the position of the first resin mark WM1 with the OA scope 40. 27 alignments can be performed.

  In the present embodiment, as shown in FIG. 3A, after forming the first resin marks WM1X and WM1Y as inner marks, the second resin marks WM2X and WM2Y as outer marks are formed. Explained. However, as shown in FIG. 3B, after forming the second resin marks WM2X and WM2Y as outer marks, the first resin marks WM1X and WM1Y as inner marks may be formed. In this case, when forming the first resin mark, the distance Ds1 from the center position of the resin mark group to the supply position of the resin R2 and the center of the resin mark group so that the resin R1 does not contact the second resin mark. It is necessary to determine the distance Dm1 from the position to the second resin mark WM2X.

  For example, if the radius of the region where the resin R1 spreads is r, the distance Ds1 from the center position of the resin mark group to the supply position of the resin R2 is 2r or more, and the distance from the center position of the resin mark group to the second resin mark WM2X Dm1 needs to be r or more. On the other hand, when forming the second resin mark as the outer mark after forming the first resin mark as the inner mark, the distance Ds from the center position of the resin mark group to the supply position of the resin R2 is as described above. Thus, (√2−1) r (see equation (5)). Therefore, in the case of forming the second resin mark as the outer mark after forming the first resin mark as the inner mark, the area of the resin mark group on the substrate can be made smaller (less than half). it can. If the area of the resin mark group is small, the magnification of the OA scope 40 can be set high (that is, the resolution becomes high), and the number of resin marks that can be formed in the shot area can be increased. Higher accuracy inspection is possible.

  Moreover, in this embodiment, supplying adhesive agent to the board | substrate 1 was demonstrated for the purpose of improving the adhesiveness of the board | substrate 1 and resin (resin R1). If the adhesion between the resin R1 and the resin R2 is insufficient, an adhesive is supplied after the first resin mark WM1 is formed (before the resin R2 is supplied to the substrate 1). It is also possible to improve the adhesion between the resin R1 and the resin R2.

  In the present embodiment, each of the first mark pattern TM1 and the second mark pattern TM2 has a concave shape and a convex shape, and the first resin mark WM1 and the second resin mark WM2 formed on the substrate are formed. Each has a convex shape and a concave shape. However, the shapes of the first resin mark WM1 and the second resin mark WM2 are not limited. For example, as shown in FIG. 4, the first mark pattern TM1 and the second mark pattern TM2 may be concave, and the first resin mark WM1 and the second resin mark WM2 formed on the substrate may be convex. Good. Also in this case, in the mold having the second mark pattern TM2, the first resin mark WM1 is crushed on the first resin mark WM1 formed on the substrate 1 in a state where the mold is pressed against the resin R2. A recess A that prevents the

  In the present embodiment, a case has been described in which the first resin mark WM1 and the second resin mark WM2 constitute a Bar in Bar inspection mark. However, the first resin mark WM1 and the second resin mark WM2 may constitute a Box in Box inspection mark.

  As described above, the imprint apparatus 100 according to the present embodiment supplies the resin R2 so as not to contact the first resin mark WM1 when the mold having the second mark pattern TM2 is pressed to supply the second resin mark. WM2 is formed. Therefore, the imprint apparatus 100 can perform the same inspection as the resist-to-resist (RtoR) (for example, the positional deviation inspection between the first resin mark WM1 and the second resin mark WM2) with high accuracy. . Further, the imprint apparatus 100 relates to the imprint process so that the relative positional deviation between the first resin mark WM1 and the second resin mark WM2 from the target relative position is reduced based on the inspection result. The operation can be controlled with high accuracy. The operation related to the imprint process includes, for example, setting of a driving pattern for the substrate stage and the mold stage 12 and calibration of a system offset.

<Second Embodiment>
In the first embodiment, the supply is made in S103 based on the position of the first resin mark WM1 formed in S101, the dimension of the second resin mark WM2 formed in S104, and the supply amount of the resin R2. The supply position (supply region) of the power resin R2 is obtained by calculation. In the second embodiment, the supply position and supply amount of the resin R2 to be supplied in S103 are obtained based on conditions. As will be described later, in the present embodiment, a plurality of different conditions including the distance between the position of the first resin mark WM1 and the supply position of the resin R2 and the supply amount of the resin of the resin R2 as variables are set. To do. Next, for each of the plurality of conditions, the second resin mark WM2 is formed on the substrate on which the first resin mark WM1 is formed. The supply of the resin R2 to be supplied in S103 based on the condition that the resin R2 does not contact the first resin mark WM1 and the shape of the second resin mark WM2 satisfies the reference shape among the plurality of conditions. Find position and supply.

  With reference to FIG. 5, the determination of the supply position of the resin R2 to be supplied onto the substrate (S102) will be described. In the present embodiment, as shown in FIGS. 5A and 5B, the first resin mark WM1 is formed in advance for each shot region on the substrate using the imprint apparatus 100.

  The distance between the position (center position) of the first resin mark WM1 and the supply position of the resin R2 and the supply amount of the resin R2 with respect to the substrates shown in FIGS. 5 (a) and 5 (b). Set the condition to include as a variable. Next, the second resin mark WM2 is formed by supplying the resin R2 to each shot region while changing the conditions. Next, the second resin mark WM2 is measured by the OA scope 40, the second resin R2 does not come into contact with the first resin mark WM1, and the shape of the second resin mark WM2 is within an allowable range. Identify the conditions. Then, the distance between the position (center position) of the first resin mark WM1 corresponding to the specified condition and the supply position of the resin R2, and the supply amount of the resin R2, the supply position of the resin R2 to be supplied in S103, and Determined as supply.

  In the present embodiment, since the supply position and supply amount of the resin R2 to be supplied onto the substrate are determined according to the conditions, the supply position and supply amount of the resin R2 to be supplied onto the substrate are more than those in the first embodiment. The decision will take time. However, since the second resin mark WM2 is actually formed in the present embodiment, the supply position of the resin R2 to be supplied onto the substrate can be determined more accurately than in the first embodiment.

<Third Embodiment>
With reference to FIG. 6, another inspection process of the imprint apparatus 100 by the control unit 50 will be described. FIG. 6A is a flowchart for explaining another inspection process of the imprint apparatus 100, and FIG. 6B shows the substrate 1 and the mold in each process of another inspection process of the imprint apparatus 100. It is a schematic sectional drawing which shows this state. In FIG. 6B, the mold pattern (step amount) and the mark (step amount) formed on the substrate 1 are exaggerated for easy understanding.

  In S200, the resin R1 is supplied to the substrate 1 placed on the substrate stage using the resin supply unit 27.

  In S201, the first resin mark WM1 and the alignment mark WMA are formed. Specifically, the resin R1 is cured by irradiating the resin R1 supplied in S200 with UV light while pressing a mold having the first mark pattern TM1 and the alignment mark pattern TMA. Then, the first resin mark WM1 and the alignment mark WMA are formed by peeling the mold from the cured resin R1. Thus, in S201, the first resin mark WM1 and the alignment mark WMA that are inner marks are formed on the substrate.

  In S202, the substrate 1 is aligned using the alignment mark WMA formed in S201. As the alignment of the substrate 1, in this embodiment, global alignment is performed in which the position of the alignment mark WMA formed in each shot region on the substrate is measured by the OA scope 40. However, as alignment of the substrate 1, die-by-die alignment may be performed in which the position of the alignment mark WMA is measured by the OA scope 40 for each shot region on the substrate and the positional deviation is corrected.

  In S203, the supply position (supply region) of the resin R2 to be supplied on the substrate on which the first resin mark WM1 and the alignment mark WMA are formed in S201 is determined. Since the determination of the supply position of the resin R2 is as described in the first embodiment, a detailed description thereof is omitted here.

  In S204, the resin supply unit 27 is used to supply the resin R2 to the substrate 1 on which the first resin mark WM1 and the alignment mark WMA are formed based on the supply position determined in S203. In the present embodiment, as shown in FIG. 6B, the resin R2 is supplied outside the first resin mark WM1 formed on the substrate 1 and inside the alignment mark WMA. The supply amount of the resin R2 may be the same as the supply amount of the resin R1 supplied in S200. In S204, the resin R2 is supplied so that the resin R2 does not come into contact with the first resin mark WM1 (and the alignment mark WMA) when the mold having the second mark pattern TM2 is pressed against the resin R2.

  In S205, the second resin mark WM2 is formed. More specifically, the resin R2 is irradiated with UV light while the mold having the second mark pattern TM2 is pressed against the resin R2 supplied in S204, and the mold is peeled off from the cured resin R2. Then, the second resin mark WM2 is formed. Thus, in S205, the second resin mark WM2 that is the outer mark is formed on the substrate. The mold having the second mark pattern TM2 prevents the first resin mark WM1 from being crushed on the first resin mark WM1 formed on the substrate 1 in a state where the mold is pressed against the resin R2. Concave portion A is included. Similarly, the mold having the second mark pattern TM2 has a recess B that prevents the alignment mark WMA from being crushed on the alignment mark WMA formed on the substrate 1 while the mold is pressed against the resin R2. Including.

  In S206, the relative position between the first resin mark WM1 formed in S201 and the second resin mark WM2 formed in S205 (that is, the relative relationship between the first resin mark WM1 and the second resin mark WM2). (Deviation amount) is measured.

  Thus, in the present embodiment, the substrate 1 is aligned using the alignment mark WMA before the second resin mark WM2 is formed. Therefore, it is possible to inspect the alignment accuracy of the imprint apparatus 100 (OA scope 40) by measuring the relative shift amount between the first resin mark WM1 and the second resin mark WM2. The inspection result is reflected on the imprint apparatus 100 (OA scope 40) as an alignment offset.

<Fourth Embodiment>
With reference to FIG. 7, another inspection process of the imprint apparatus 100 by the control unit 50 will be described. FIG. 7A is a flowchart for explaining still another inspection process of the imprint apparatus 100, and FIG. 7B shows the substrate 1 in each process of still another inspection process of the imprint apparatus 100. It is a schematic sectional drawing which shows the state of a mold. In FIG. 7B, the mold pattern (step amount) and the mark (step amount) formed on the substrate 1 are exaggerated for easy understanding.

  In step S300, the resin supply unit 27 is used to supply the resin R1 to the substrate 1 placed on the substrate stage.

  In S301, the first resin mark WM1 is formed. Specifically, the resin R1 is irradiated with UV light in a state where the mold having the first mark pattern TM1 is pressed against the resin R1 supplied in S300, and the mold is peeled off from the cured resin R1. Thus, the first resin mark WM1 is formed.

  In S302, the supply position (supply region) of the resin R2 to be supplied on the substrate on which the first resin mark WM1 is formed in S301 is determined. The determination of the supply position of the resin R2 is as described in the first embodiment. However, in the present embodiment, a position sufficiently separated from the first resin mark WM1 is determined as the supply position of the resin R2 for forming the second resin mark WM2. Note that the position sufficiently separated from the first resin mark WM1 is a position where the resin R1 and the resin R2 do not overlap when the first resin mark WM1 and the second resin mark WM2 are formed. .

  In S303, the resin supply unit 27 is used to supply the resin R2 to the substrate 1 on which the first resin mark WM1 is formed based on the supply position determined in S302.

  In S304, the second resin mark WM2 is formed. More specifically, the resin R2 is irradiated with UV light while the mold having the second mark pattern TM2 is pressed against the resin R2 supplied in S204, and the mold is peeled off from the cured resin R2. Then, the second resin mark WM2 is formed. In S304, as shown in FIG. 7B, the second resin mark WM2 is formed at a position sufficiently separated from the first resin mark WM1.

  In S305, the position of the first resin mark WM1 is measured. Specifically, using the substrate stage, the substrate 1 is moved so that the first resin mark WM1 is located within the field of view of the OA scope 40, and the position of the first resin mark WM1 formed in S301 is set to OA. Measure (detect) with the scope 40.

  In S306, using the substrate stage, the substrate 1 is moved by the design distance between the first resin mark WM1 and the second resin mark WM2 from the position where the position of the first resin mark WM1 is measured in S305. As a result, the second resin mark WM2 is positioned within the field of view of the OA scope 40.

  In S307, the position of the second resin mark WM2 formed in S304 is measured (detected) by the OA scope 40.

  In S308, relative to the first resin mark WM1 and the second resin mark WM2 based on the position of the first resin mark WM1 measured in S305 and the position of the second resin mark WM2 measured in S307. The position (positional deviation) is calculated.

  In the present embodiment, since the distance between the first resin mark WM1 and the second resin mark WM2 is sufficiently large, the resin R1 and the resin R2 do not overlap. Further, since the distance between the first resin mark WM1 and the second resin mark WM2 is sufficiently separated, the OA scope 40 measures the first resin mark WM1 and the second resin mark WM2 simultaneously. I can't. Therefore, the substrate 1 is moved using the substrate stage so that each of the first resin mark WM1 and the second resin mark WM2 is located within the field of view of the OA scope 40. Accordingly, the positional deviation between the first resin mark WM1 and the second resin mark WM2 includes a driving error of the substrate stage. However, by repeating the measurement and averaging, the driving error of the substrate stage is reduced. be able to.

  In addition, the first resin mark WM1 and the second resin mark WM2 can be directly formed on the substrate by preventing the resin R1 and the resin R2 from overlapping as in the present embodiment. Accordingly, if the adhesive is supplied on the substrate in advance, the resins R1 and R2 are in close contact with the substrate 1 through the adhesive, and therefore the resin (the first resin mark WM1 and the first resin mark WM1 and the second resin) It is possible to prevent the second resin mark WM2) from peeling off.

  When forming the second resin mark WM2, it is necessary to avoid contact between the mold having the second mark pattern TM2 and the first resin mark WM1. Therefore, in the mold having the second mark pattern TM2, the first resin mark WM1 is crushed on the first resin mark WM1 formed on the substrate 1 in a state where the mold is pressed against the resin R2. A recess A to be prevented is included. Further, by making the supply amount of the resin R2 larger than the supply amount of the resin R1, the thickness of the remaining film generated when the second resin mark WM2 is formed can be reduced when the first resin mark WM2 is formed. It is thicker than the thickness of the remaining film that is generated. Note that the thickness of the remaining film generated when forming the second resin mark WM2 is changed from the thickness of the remaining film generated when forming the first resin mark WM2 by changing the force for pressing the mold. It may be thicker. This makes it possible to more reliably avoid contact between the mold having the second mark pattern TM2 and the first resin mark WM1.

<Fifth Embodiment>
A method of manufacturing a device (semiconductor device, liquid crystal display element, etc.) as an article includes a step of transferring (forming) a pattern onto a substrate (wafer, glass plate, film-like substrate, etc.) using the imprint apparatus 100. The manufacturing method further includes a step of etching the substrate on which the pattern is transferred. In addition, when manufacturing other articles, such as a pattern dot media (recording medium) and an optical element, this manufacturing method includes the other process step which processes the board | substrate with which the pattern was transferred instead of an etching step. .

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

Claims (11)

An imprint apparatus inspection method for performing an imprint process for forming a pattern on the substrate by forming an imprint material on the substrate with a mold,
Supplying a first imprint material on the substrate;
A second step of forming the first imprint material supplied in the first step with a mold and curing, and forming a first mark made of the cured first imprint material ;
A third step of supplying a second imprint material onto the substrate;
A fourth step of forming and curing the second imprint material supplied in the third step with a mold and forming a second mark made of the cured second imprint material ;
And a fifth step of measuring a relative position between the first mark formed in the second step and the second mark formed in the fourth step,
In the third step, a condition including a supply position and a supply amount of the second imprint material is set so that the second imprint material does not contact the first mark formed in the second step. And supplying the second imprint material.   Based on the position of the first mark formed in the second step, the dimension of the second mark formed in the fourth step, and the supply amount of the second imprint material, in the third step The inspection method according to claim 1, further comprising a step of obtaining a supply area of the second imprint material to be supplied. The first mark is an inner mark,
The inspection method according to claim 1, wherein the second mark is an outer mark formed outside the inner mark. The distance between the position and the front bellflower feeding position of the first mark, and setting a plurality of conditions different from each other and a front platycodon supply amount as a variable, for each of the plurality of conditions, the first mark The second mark is formed by the imprint apparatus on the substrate on which the mark is formed, the second imprint material does not contact the first mark among the plurality of conditions, and the shape of the second mark There based on conditions to be within the allowable range, the inspection method according to any one of claims 1 to 3 before also include determining bellflower supply position and before bellflower supply amount, characterized in that .   5. The inspection method according to claim 1, wherein the mold used in the fourth step includes a recess so as not to crush the first mark. 6. The mold used in the second step has an alignment mark pattern,
In the second step, the first mark and the alignment mark are formed,
Before the third step, according to any one of claims 1 to 5, further comprising, wherein the step of performing an alignment of the substrate using the alignment mark formed in the second step Inspection method. The imprint apparatus includes a scope for detecting the first mark and the second mark, and a stage for holding the substrate,
The fifth step includes
Measuring the position of the first mark by moving the stage so that the first mark is located in the field of view of the scope and detecting the first mark with the scope;
Measuring the position of the second mark by moving the stage so that the second mark is positioned within the field of view of the scope and detecting the second mark with the scope. The inspection method according to any one of claims 1 to 6 .   2. The method according to claim 1, further comprising a step of supplying an adhesion agent for improving adhesion between the first imprint material and the second imprint material to the substrate before the first step. The inspection method according to any one of 1 to 7. An imprint apparatus that performs an imprint process for forming a pattern on the substrate by forming an imprint material on the substrate with a mold,
Based on the test results obtained by the inspection method according to any one of claims 1 to 8, having a control unit for controlling the operation for the previous SL imprinting, imprint and wherein the. An imprint apparatus that performs an imprint process for forming a pattern on the substrate by forming an imprint material on the substrate with a mold,
A scope for detecting a mark on the substrate;
An imprinting apparatus comprising: a control unit that controls an operation according to each step in the inspection method according to claim 1. Forming a pattern on a substrate using the imprint apparatus according to claim 9 or 10;
And a step of processing the substrate on which the pattern has been formed in the step.

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