JP5730664B2 - Electronic component mounting machine - Google Patents

Description

  The present invention relates to an electronic component mounting machine that mounts electronic components on a workpiece such as a substrate or a wafer.

  The electronic component is mounted at predetermined coordinates on the substrate while being sucked by the suction nozzle. When the electronic component is lowered with respect to the substrate, a part of the electronic component first hits the substrate, and then the rest of the electronic component falls on the substrate. For this reason, the actual mounting position of the electronic component may be shifted with respect to the predetermined coordinates. That is, the mounting accuracy is lowered. Therefore, it is preferable that the substrate and the electronic component immediately before mounting are parallel to each other. That is, it is preferable that the substrate and the electronic component have high parallelism.

JP 2009-147027 A

  Patent Document 1 discloses a member support device that can stably support a substrate regardless of the unevenness of the lower surface of the substrate. The member support device of the same document includes a large number of support pins. A number of support pins support the lower surface of the substrate. Each of the multiple support pins is movable in the vertical direction. Each of the multiple support pins is inserted through the holding hole of the shaft holding body. An ER gel is disposed on the inner peripheral surface of the holding hole. According to the member support device of the same document, the friction force between the support pin and the holding hole is adjusted by applying a voltage to the ER gel. That is, the support pin is fixed at a predetermined height by increasing the frictional force. Further, the support pin is moved in the vertical direction by reducing the frictional force.

  Thus, according to the member support apparatus of the literature, the support pin can be fixed at a predetermined height. For this reason, the substrate can be stably supported by fixing the heights of a large number of support pins following the irregularities on the lower surface of the substrate.

  However, this document does not describe the parallelism between the substrate and the electronic component. Also, if the parallelism between the substrate and the electronic component is increased using the member support device of the same document, it is necessary to install an ER gel or a voltage application mechanism for the ER gel for all the support pins. is there. This complicates the structure of the member support device, and thus the electronic component mounting machine.

  The electronic component mounting machine of the present invention has been completed in view of the above problems. An object of the present invention is to provide an electronic component mounting machine capable of increasing the parallelism between a workpiece such as a substrate and an electronic component.

  (1) In order to solve the above-described problem, an electronic component mounting machine according to the present invention is disposed above the mounting region, a backup unit that supports a mounting region of the workpiece on which the electronic component is mounted from below, The suction nozzle for mounting the electronic component in the mounting region, and the back-up unit and the backup unit so that the upper surface of the mounting region and the lower surface of the electronic component are aligned substantially in parallel when the electronic component is mounted in the mounting region. And a tilting section that tilts at least one of the suction nozzles.

  The tilting unit of the electronic component mounting machine of the present invention can tilt at least one of the backup unit and the suction nozzle. For this reason, when the electronic component is mounted, the upper surface of the mounting area and the lower surface of the electronic component can be aligned substantially in parallel. Therefore, the parallelism between the workpiece mounting area and the electronic component can be increased. Therefore, the actual mounting position of the electronic component is less likely to shift with respect to the predetermined coordinates of the workpiece. That is, the mounting accuracy can be increased.

  (2) Preferably, in the configuration of the above (1), further comprising a proxy member having a proxy surface representing at least one of the upper surface of the mounting region and the lower surface of the electronic component, and the tilting portion includes: The backup is made so that the upper surface and the lower surface are aligned substantially parallel when the electronic component is mounted on the mounting region by causing the upper surface and the lower surface to contact each other in a pseudo manner via the surrogate surface. Preferably, at least one of the part and the suction nozzle is tilted.

  Here, “pseudo-contact the upper surface and the lower surface” means, for example, when there are two proxy members, the upper surface by contacting the upper surface and the lower surface. It means setting the same situation as when the lower surface is brought into contact. Further, for example, when there is one surrogate member, the upper surface and the lower surface are made to contact by bringing the upper surface and the lower surface into contact, or by bringing the upper surface and the lower surface into contact. This means setting the same situation as that in the case of contact.

  According to this configuration, the upper surface of the workpiece mounting area and the lower surface of the electronic component mounted in the mounting area are in pseudo contact with each other via the proxy surface of the proxy member. The tilting unit can tilt at least one of the backup unit and the suction nozzle. For this reason, when the upper surface and the lower surface are pseudo-contacted via the proxy surface, at least one of the backup unit and the suction nozzle is arranged so that the upper surface and the lower surface are substantially parallel when the electronic component is mounted. Tilt. Therefore, the upper surface and the lower surface can be aligned substantially in parallel.

  (3) Preferably, in the configuration of (2), the surrogate surface is at least one of the upper surface of the mounting region and the lower surface of the electronic component, and is substantially parallel to a surface represented by the surrogate surface. It is better to have a configuration of

  For example, when there are two surrogate members, the upper surface and the lower surface can be made substantially parallel by bringing a surrogate surface substantially parallel to the upper surface and a surrogate surface substantially parallel to the lower surface into contact with each other. Further, for example, when there is one surrogate member, by contacting the surrogate surface substantially parallel to the upper surface and the lower surface, or by contacting the surrogate surface approximately parallel to the upper surface and the lower surface The upper surface and the lower surface can be aligned substantially in parallel.

  (4) Preferably, in the configuration of (2) or (3), the backup portion has a partially spherical guided portion, and the tilting portion accommodates the guided portion so as to be tiltable. It is better to have a configuration having a back spherical guide. According to this configuration, the backup unit can be tilted by the tilting unit. For this reason, the parallelism between the work mounting area and the electronic component can be increased.

  (5) Preferably, in the configuration of (4), the backup unit supports the mounting region from below and has a support surface substantially parallel to the upper surface of the mounting region. The electronic component is sucked and has a suction surface substantially parallel to the lower surface of the electronic component, the backup portion and the suction nozzle are the proxy members, and the support surface and the suction surface are the proxy surfaces Before mounting the electronic component in the mounting area, it is preferable to tilt the support surface so as to follow the suction surface by bringing the support surface into contact with the suction surface.

  That is, in this configuration, the upper surface of the work mounting area and the lower surface of the electronic component are aligned substantially in parallel via the support surface of the backup unit and the suction surface of the suction nozzle. The backup unit and the proxy member are shared. Further, the suction nozzle and the proxy member are shared. The upper surface of the work mounting area and the support surface of the backup unit are substantially parallel. Further, the lower surface of the electronic component and the suction surface of the suction nozzle are substantially parallel.

  According to this configuration, the support surface and the suction surface are brought into contact with each other before the electronic component is mounted on the mounting region. That is, the support surface is tilted so as to follow the suction surface. As described above, when the support surface and the suction surface are brought into contact with each other, the support surface and the suction surface can be aligned substantially in parallel. For this reason, the upper surface of the mounting region substantially parallel to the support surface and the lower surface of the electronic component substantially parallel to the suction surface can be aligned substantially in parallel. When the electronic component is mounted on the mounting area in this state, the electronic component is lowered without hitting the mounting area. For this reason, the mounting accuracy can be increased.

  (6) Preferably, in the configuration of the above (4), the suction nozzle has a pressing member that has a pressing surface that is substantially parallel to the lower surface of the electronic component and disposed below the lower surface; A biasing member that biases the pressing member downward, the pressing member being the proxy member, the pressing surface being the proxy surface, and mounting the electronic component on the mounting region In this case, prior to the lower surface of the electronic component, the pressing surface and the upper surface of the mounting region are brought into contact with each other to tilt the upper surface so as to follow the pressing surface. Is good.

  In other words, in this configuration, the upper surface of the work mounting area and the lower surface of the electronic component are aligned substantially in parallel via the pressing surface of the pressing member. The pressing member and the proxy member are shared. The lower surface of the electronic component and the pressing surface of the pressing member are substantially parallel.

  According to this configuration, when the electronic component is mounted on the mounting area, the upper surface of the mounting area and the pressing surface are brought into contact with each other. That is, the upper surface of the mounting region is tilted so as to follow the pressing surface. As described above, when the upper surface of the mounting region and the pressing surface are brought into contact with each other, the upper surface of the mounting region and the pressing surface can be aligned substantially in parallel. For this reason, the upper surface of the mounting region and the lower surface of the electronic component substantially parallel to the pressing surface can be aligned substantially in parallel. When the electronic component is mounted on the mounting area in this state, the electronic component is lowered without hitting the mounting area. For this reason, the mounting accuracy can be increased.

  (7) Preferably, in the configuration according to any one of (1) to (6), the electronic component and the mounting are disposed in an imaging region disposed so that the electronic component and the mounting region overlap in the vertical direction. An illuminating device that emits transmitted light that can be transmitted through the region, and the imaging region that is irradiated with the transmitted light can be imaged to recognize the electronic component positioning feature and the workpiece positioning feature. It is better to have a configuration including an imaging device that acquires a transmission image.

  According to this configuration, it is possible to recognize the positional relationship in the horizontal direction between the feature for positioning the electronic component and the feature for positioning the workpiece from the transmission image. Therefore, the electronic component can be mounted on the mounting area after correcting the positional deviation between the electronic component and the mounting area. Therefore, the mounting accuracy can be increased. It should be noted that this configuration can be implemented regardless of any of the above configurations (1) to (6).

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component mounting machine which can make high the parallelism of a workpiece | work and an electronic component can be provided.

It is a perspective view of the electronic component mounting machine of 1st embodiment. It is a right view of the same electronic component mounting machine. It is an expansion perspective view of the mounting head of the electronic component mounting machine. It is an expanded sectional view in the frame IV of FIG. It is a block diagram of the same electronic component mounting machine. It is right side sectional drawing in the tilting process of the paralleling operation | work near the 1st board | substrate raising / lowering part of the same electronic component mounting machine. It is right side sectional drawing in the fixing process of the paralleling operation | work near the said 1st board | substrate raising / lowering part. It is right side sectional drawing in the mounting | wearing operation | work of an electronic component near the said 1st board | substrate raising / lowering part. It is right side sectional drawing in the front stage of component mounting work of the electronic component mounting machine of 2nd embodiment near the 1st board | substrate raising / lowering part. It is right side sectional drawing in the component mounting work middle stage of the 1st board | substrate raising / lowering vicinity vicinity. It is right side sectional drawing in the back | latter stage of component mounting work of the 1st board | substrate raising / lowering vicinity vicinity. It is a right view of the electronic component mounting machine of 3rd embodiment. It is an expanded sectional view in the frame XIII of FIG. It is an expanded sectional view in the imaging process in the frame XIII of FIG. It is a schematic diagram of a transmission image. It is an expanded sectional view in the mounting process in the frame XIII of FIG. (A) is the schematic diagram (the 1) of the transmission image of other embodiment. (B) is the schematic diagram (the 2) of the transmission image of other embodiment.

  Embodiments of an electronic component mounting machine according to the present invention will be described below.

<< First Embodiment >>
<Mechanical configuration of electronic component mounting machine>
First, the mechanical configuration of the electronic component mounting machine of this embodiment will be described. In the following drawings, the left side corresponds to the upstream side in the substrate transport direction. The right side corresponds to the downstream side in the substrate transport direction. FIG. 1 is a perspective view of the electronic component mounting machine according to the present embodiment. FIG. 2 shows a right side view of the electronic component mounting machine. 1, the housing of the module 3 and the substrates Bf and Br are shown in a transparent manner. The substrates Bf and Br are included in the concept of “work” of the present invention.

  As shown in FIGS. 1 and 2, the electronic component mounting machine 1 includes a base 2, a module 3, and a component supply device 4.

[Base 2, component supply device 4]
As shown in FIG. 2, the base 2 has a rectangular parallelepiped box shape. The base 2 is arranged on the factory floor. The component supply device 4 is disposed above the front portion of the base 2. The component supply device 4 supplies the electronic component P to be mounted on the boards Bf and Br. The component supply device 4 includes a plurality of cassette type feeders 40. The cassette type feeder 40 is wound with a tape 400 in which a large number of electronic components P are enclosed. At the rear end portion of the cassette feeder 40, the electronic component P is taken out from the tape 400 by a suction nozzle 37 described later.

[Module 3]
As shown in FIG. 2, the module 3 is replaceably disposed with respect to the base 2. The module 3 includes an XY robot 31, a mounting head 32, a substrate lifting device 35, a substrate transport device 36, a suction nozzle 37, a transport width changing device 39, a control device (not shown), and an image processing device (not shown). (Not shown).

(Transport width changing device 39)
As shown in FIGS. 1 and 2, the conveyance width changing device 39 includes a first wall portion 390f, a second wall portion 390m, a third wall portion 390r, a base portion 391, and a pair of left and right guide rails 392L and 392R. And.

  The base 391 has a rectangular plate shape. The base 391 is disposed on the upper surface of the base 2. Each of the pair of left and right guide rails 392L, 392R extends in the front-rear direction. The pair of left and right guide rails 392L and 392R are spaced apart from the left and right edges of the upper surface of the base 391.

  The first wall portion 390f, the second wall portion 390m, and the third wall portion 390r each have a C-shaped plate shape that opens downward. The C-shaped ends of the first wall portion 390f, the second wall portion 390m, and the third wall portion 390r are attached to a pair of left and right guide rails 392L and 392R so as to be slidable in the front-rear direction. The second wall portion 390m is juxtaposed behind the first wall portion 390f. The third wall portion 390r is juxtaposed behind the second wall portion 390m.

  The first wall portion 390f, the second wall portion 390m, and the third wall portion 390r can be moved in the front-rear direction by a wall portion moving motor (not shown). Therefore, as shown in FIG. 2, the conveyance width of the first lane Lf between the first wall portion 390f and the second wall portion 390m, and the second width between the second wall portion 390m and the third wall portion 390r. The conveyance width of the lane Lr can be changed according to the width in the front-rear direction of the substrates Bf and Br. The positions of the first lane Lf and the second lane Lr can also be changed in the front-rear direction.

(Substrate transfer device 36)
The substrate transport device 36 transports the substrates Bf and Br. The substrate transfer device 36 includes a first substrate transfer unit 360f and a second substrate transfer unit 360r. As shown in FIG. 2, the first substrate transport unit 360f is disposed in the first lane Lf, and the second substrate transport unit 360r is disposed in the second lane Lr.

  Each of the first substrate transport unit 360f and the second substrate transport unit 360r includes a pair of front and rear conveyor belts. The conveyor belt in front of the first substrate transport unit 360f is disposed on the rear surface of the first wall portion 390f, and the rear conveyor belt is disposed on the front surface of the second wall portion 390m. A board Bf is installed between the pair of front and rear conveyor belts. The conveyor belt in front of the second substrate transport unit 360r is disposed on the rear surface of the second wall portion 390m, and the rear conveyor belt is disposed on the front surface of the third wall portion 390r. A substrate Br is installed between the pair of front and rear conveyor belts. The pair of conveyor belts of the first substrate transport unit 360f and the pair of conveyor belts of the second substrate transport unit 360r can be driven in the left-right direction by a transport motor (not shown).

(XY robot 31)
The X direction corresponds to the left-right direction, the Y direction corresponds to the front-rear direction, and the Z direction corresponds to the up-down direction. The XY robot 31 includes a Y direction slider 310, an X direction slider 311, a pair of left and right Y direction guide rails 312, and a pair of upper and lower X direction guide rails 313.

  The pair of left and right Y-direction guide rails 312 are disposed on the upper surface of the housing internal space of the module 3. The Y-direction slider 310 has a long block shape in the left-right direction. The Y-direction slider 310 is attached to a pair of left and right Y-direction guide rails 312 so as to be slidable in the front-rear direction. The pair of upper and lower X-direction guide rails 313 is disposed on the front surface of the Y-direction slider 310. The X direction slider 311 has a rectangular plate shape. The X-direction slider 311 is attached to a pair of upper and lower X-direction guide rails 313 so as to be slidable in the left-right direction.

(Mounting head 32, suction nozzle 37)
The mounting head 32 is attached to the X direction slider 311. For this reason, the mounting head 32 can be moved in the front-rear and left-right directions by the XY robot 31. FIG. 3 is an enlarged perspective view of the mounting head of the electronic component mounting machine according to the present embodiment. The ball screw part 320, the Z-axis motor 321 and the lifting rod 322 are indicated by thin lines.

  As shown in FIG. 3, the mounting head 32 includes a ball screw part 320, a Z-axis motor 321, and a lifting rod 322. The ball screw portion 320 includes a shaft 320a and a nut 320b. The shaft 320a extends in the vertical direction. The shaft 320 a is connected to the rotation shaft of the Z-axis motor 321. The nut 320b is screwed to the shaft 320a. The nut 320b includes a pair of upper and lower clamping pieces 320c. The lifting rod 322 extends in the vertical direction. A sandwiched piece 322 a is disposed at the upper end of the lifting rod 322. The sandwiched piece 322a is sandwiched from above and below by a pair of sandwiching pieces 320c.

  When the rotating shaft of the Z-axis motor 321 rotates, the shaft 320a rotates around the axis, and the nut 320b moves in the vertical direction. The sandwiched piece 322a is sandwiched from above and below by a pair of sandwiching pieces 320c. For this reason, the raising / lowering rod 322 moves to an up-down direction with the nut 320b. The lifting rod 322 can be rotated about its axis by a θ-axis motor (not shown).

  The suction nozzle 37 is attached to the lower end of the lifting rod 322. As shown in FIG. 2, a suction surface 370 is disposed at the lower end of the suction nozzle 37. The adsorption surface 370 has a planar shape. The suction surface 370 is supplied with a negative pressure and an atmospheric pressure through a pipe (not shown) so as to be switched. For this reason, the suction surface 370 can suck and release the electronic component P.

(Substrate lifting device 35)
As shown in FIG. 2, the substrate elevating device 35 includes a first substrate elevating unit 350f and a second substrate elevating unit 350r. The first substrate elevating part 350f is disposed between the first wall part 390f and the second wall part 390m. The second substrate elevating part 350r is disposed between the second wall part 390m and the third wall part 390r. The configurations of the first substrate elevating part 350f and the second substrate elevating part 350r are the same. Hereinafter, the configuration of the first substrate elevating unit 350f will be described as a representative of the first substrate elevating unit 350f and the second substrate elevating unit 350r.

  FIG. 4 is an enlarged cross-sectional view in the frame IV of FIG. As shown in FIG. 4, the first substrate elevating part 350f includes a first backup part 351f, a first tilting part 352f, a first ball screw part 353f, a pump 354f, a vacuum pump 355f, and a vacuum pump 356f. It is equipped with. The first backup unit 351f is included in the concept of the “backup unit” of the present invention. The first tilting part 352f is included in the concept of the “tilting part” of the present invention.

  The first tilting part 352f has a rectangular parallelepiped block shape. The first tilting part 352f is movable in the vertical direction by the first ball screw part 353f. A guide portion 352fa is recessed in the upper surface of the first tilting portion 352f. The guide portion 352fa has a partially back spherical shape (a shape of a part of the back surface of the sphere).

  The first backup part 351f is disposed above the first tilt part 352f. The first backup part 351f includes a ball part 351fa and a support part 351fb. The ball portion 351fa has a hemispherical shape. A guided portion 351fc is disposed on the lower surface of the ball portion 351fa. The guided portion 351fc is accommodated in the guide portion 352fa of the first tilting portion 352f. For this reason, the ball part 351fa, that is, the first backup part 351f can be tilted in multiple axes with respect to the first tilting part 352f. The first backup portion 351f is movable in the vertical direction by the first ball screw portion 353f together with the first tilting portion 352f.

  The support portion 351fb has a short-axis columnar shape. The support portion 351fb protrudes upward from the upper surface of the ball portion 351fa. The support portion 351fb includes a support surface 351fd and a large number of suction holes 351fe. The support surface 351fd is disposed on the upper surface of the support portion 351fb. The support surface 351fd has a planar shape. The large number of suction holes 351fe penetrate the support portion 351fb in the vertical direction. A large number of suction holes 351fe are open to the support surface 351fd.

  Each of the pump 354f and the vacuum pump 355f is connected to a gap between the guided portion 351fc and the guide portion 352fa via a pipe. The pump 354f can supply positive pressure to the gap. The vacuum pump 355f can supply a negative pressure to the gap.

  When the first backup part 351f is tilted with respect to the first tilting part 352f, positive pressure is supplied to the gap by the pump 354f. When the first backup portion 351f is fixed to the first tilting portion 352f, negative pressure is supplied to the gap by the vacuum pump 355f.

  The vacuum pump 356f is connected to a number of suction holes 351fe through piping. The vacuum pump 356f can supply negative pressure to a number of suction holes 351fe, that is, the support surface 351fd. By the negative pressure, the support surface 351fd can adsorb the substrate Bf. That is, the support surface 351fd can fix the substrate Bf.

<Electrical configuration of electronic component mounting machine>
Next, the electrical configuration of the electronic component mounting machine of this embodiment will be described. FIG. 5 shows a block diagram of the electronic component mounting machine of the present embodiment. As shown in FIG. 5, the control device 7 includes a computer 70 and a plurality of drive circuits. The computer 70 includes an input / output interface 700, a calculation unit 701, and a storage unit 702.

  The input / output interface 700 is connected to the wall width moving motors 393f, 393m, and 393r of the transport width changing device 39, the transport motors 369f and 369r of the substrate transport device 36, and the lift motor 359f of the substrate lift device 35 via a drive circuit, respectively. , Vacuum pump 356f for fixing substrate Bf, pump 354f, vacuum pump 355f for fixing first backup portion 351f, X-axis motor 319a, Y-axis motor 319b of XY robot 31, Z-axis motor 321 of mounting head 32, θ-axis A motor 325 is electrically connected.

  Further, the image processing apparatus 8 is electrically connected to the input / output interface 700. A mark camera (not shown) and a parts camera (not shown) are electrically connected to the image processing apparatus 8.

  As shown in FIG. 2, the wall moving motor 393f is the first wall 390f, the wall moving motor 393m is the second wall 390m, and the wall moving motor 393r is the third wall 390r. To drive. The transport motor 369f drives the conveyor belt of the first substrate transport unit 360f, and the transport motor 369r drives the conveyor belt of the second substrate transport unit 360r in the left-right direction.

  Further, as shown in FIG. 4, the elevating motor 359f drives the first tilting part 352f in the vertical direction via the first ball screw part 353f. The vacuum pump 356f supplies negative pressure to the numerous suction holes 351fe. The pump 354f supplies positive pressure to the gap between the guided portion 351fc and the guide portion 352fa. Further, the vacuum pump 355f supplies a negative pressure to the gap between the guided portion 351fc and the guide portion 352fa.

  Further, as shown in FIG. 2, the X-axis motor 319a drives the X-direction slider 311 in the left-right direction. The Y-axis motor 319b drives the Y-direction slider 310 in the front-rear direction.

  As shown in FIG. 3, the Z-axis motor 321 drives the lifting rod 322, that is, the suction nozzle 37 in the vertical direction via the ball screw portion 320. Further, the θ-axis motor 325 drives the lifting rod 322, that is, the suction nozzle 37, in a direction rotating around its own axis.

<Parallel work between support surface and suction surface>
Next, the parallel operation of the support surface and the suction surface by the electronic component mounting machine of this embodiment will be described. When the parallelism between the upper surfaces of the substrates Bf and Br and the lower surface of the electronic component P is low, the mounting accuracy is lowered. For this reason, in order to increase the parallelism, a paralleling operation is performed prior to the production of the substrates Bf and Br.

  Hereinafter, the parallel operation of the first lane Lf will be described on behalf of the first lane Lf and the second lane Lr shown in FIG. The parallel operation includes a tilting process and a fixing process.

  FIG. 6 is a right side cross-sectional view in the tilting process of the parallel operation near the first board lifting part of the electronic component mounting machine of the present embodiment. FIG. 7 is a right side cross-sectional view in the fixing process of the parallel operation near the first substrate lifting part. 6 and 7 show a portion corresponding to the frame IV in FIG.

[Tilt process]
In this step, the suction surface 370 and the support surface 351fd are made parallel by causing the suction surface 370 of the suction nozzle 37 to follow the support surface 351fd. First, the X-axis motor 319a and the Y-axis motor 319b are appropriately driven by the control device 7 shown in FIG. And the suction nozzle 37 shown in FIG. 6 is arrange | positioned just above the 1st backup part 351f.

  Next, the pump 354f is driven by the control device 7 shown in FIG. And a positive pressure is supplied to the clearance gap between the to-be-guided part 351fc and the guide part 352fa shown in FIG. By supplying the positive pressure, the guided portion 351fc, that is, the first backup portion 351f, is easily tilted in multiple axes with respect to the guide portion 352fa, that is, the first tilting portion 352f.

  Then, the Z-axis motor 321 is driven by the control device 7 shown in FIG. Then, the suction nozzle 37 is lowered. As shown in FIG. 7, when the suction surface 370 of the suction nozzle 37 contacts the support surface 351fd of the first backup portion 351f, the first backup portion 351f tilts so that the support surface 351fd follows the suction surface 370. Then, the suction surface 370 and the support surface 351fd are in surface contact. That is, the suction surface 370 and the support surface 351fd are parallel to each other. Thus, in this step, the suction surface 370 and the support surface 351fd are made parallel by causing the suction surface 370 of the suction nozzle 37 to follow the support surface 351fd.

[Fixing process]
In this step, the tilting state of the support surface 351fd set in the tilting step is maintained. First, the pump 354f is stopped by the control device 7 shown in FIG. Next, the vacuum pump 355f is driven by the control device 7 shown in FIG. And a negative pressure is supplied to the clearance gap between the to-be-guided part 351fc and the guide part 352fa shown in FIG. By the supply of the negative pressure, the guided portion 351fc, that is, the first backup portion 351f is attracted to the guide portion 352fa, that is, the first tilting portion 352f. For this reason, the support surface 351fd is fixed in a state parallel to the suction surface 370. Thus, in this process, the tilting state of the support surface 351fd set in the tilting process is maintained.

<Electronic component mounting work>
Next, the mounting operation of the electronic component by the electronic component mounting machine of this embodiment will be described. FIG. 8 is a right side cross-sectional view in the electronic component mounting operation in the vicinity of the first substrate lifting portion of the electronic component mounter of the present embodiment. In addition, what is shown in FIG. 8 is a part corresponding to the inside of the frame IV in FIG.

  First, the wall motion motors 393f and 393m and the transport motor 369f are appropriately driven by the control device 7 shown in FIG. Then, as shown in FIG. 4, the mounting area A in which the electronic component P is mounted on the substrate Bf is arranged directly above the first backup portion 351f.

  Next, the vacuum pump 356f is driven by the control device 7 shown in FIG. And a negative pressure is supplied to many adsorption holes 351fe shown in FIG.

  Then, the lifting motor 359f is driven by the control device 7 shown in FIG. Then, as shown in FIG. 2, the substrate Bf is lifted from the pair of conveyor belts of the first substrate transport unit 360f to the component mounting height by the support surface 351fd of the first backup unit 351f. That is, the substrate Bf is lifted from the height of the substrate Br in FIG. 2 to the height of the substrate Bf. Here, negative pressure is supplied to the numerous suction holes 351fe. For this reason, the mounting area A of the substrate Bf is entirely adsorbed to the support surface 351fd. Therefore, the upper surface of the mounting area A follows the support surface 351fd. That is, the upper surface of the mounting area A and the support surface 351fd are parallel to each other.

  Subsequently, the X-axis motor 319a, the Y-axis motor 319b, the Z-axis motor 321 and the θ-axis motor 325 are appropriately driven by the control device 7 shown in FIG. Then, as shown in FIG. 2, the electronic component P is taken out from the component supply device 4 by the suction nozzle 37. As shown in FIG. 4, negative pressure is supplied to the suction surface 370. For this reason, the lower surface of the electronic component P follows the suction surface 370. That is, the lower surface of the electronic component P and the suction surface 370 are parallel.

  Then, the X-axis motor 319a, the Y-axis motor 319b, the Z-axis motor 321 and the θ-axis motor 325 are appropriately driven by the control device 7 shown in FIG. Then, as shown in FIG. 8, the electronic component P is mounted on the mounting area A of the substrate Bf by the suction nozzle 37.

  Here, the suction surface 370 and the support surface 351fd are set in parallel by the parallel operation. Further, the support surface 351fd and the upper surface of the mounting area A of the substrate Bf are parallel to each other. Further, the suction surface 370 and the lower surface of the electronic component P are parallel. For this reason, the upper surface of the mounting area A and the lower surface of the electronic component P are parallel.

  Thus, the parallelism between the upper surface of the mounting area A and the lower surface of the electronic component P is high. For this reason, as shown in FIG. 8, the electronic component P is mounted on the upper surface of the mounting area A without hitting it. By repeating the mounting operation, the substrate Bf is produced. The production of the substrate Br is performed in the same manner.

<Effect>
Next, the effect of the electronic component mounting machine of this embodiment is demonstrated. As shown in FIGS. 6 to 8, according to the electronic component mounting machine 1 of the present embodiment, the upper surface of the mounting area A of the board Bf and the lower surface of the electronic component P are brought into contact with the support surface 351fd and the suction surface 370. By making it, it is made to contact in a pseudo manner. For this reason, the parallelism between the mounting region A and the electronic component P can be increased. Therefore, the actual mounting position of the electronic component P is less likely to shift with respect to the predetermined coordinates of the board Bf. Therefore, the mounting accuracy can be increased.

  Moreover, as shown in FIGS. 6-8, the 1st backup part 351f can be tilted by the 1st tilting part 352f. For this reason, the support surface 351fd can be made to follow the suction surface 370. That is, the upper surface of the mounting area A of the board Bf can be made to follow the lower surface of the electronic component P.

  Further, as shown in FIGS. 6 to 8, before the electronic component P is mounted on the mounting area A, the support surface 351fd and the suction surface 370 are brought into surface contact. That is, the support surface 351fd is tilted so as to follow the suction surface 370. Thus, when the support surface 351fd and the suction surface 370 are brought into surface contact, the support surface 351fd and the suction surface 370 can be aligned in parallel. For this reason, the upper surface of the mounting area A substantially parallel to the support surface 351fd and the lower surface of the electronic component P substantially parallel to the suction surface 370 can be aligned in parallel. When the electronic component P is mounted on the mounting area A in this state, the electronic component P descends without hitting the mounting area A. For this reason, the mounting accuracy can be increased.

<< Second Reference Embodiment (hereinafter abbreviated as " second embodiment ") >>
The difference between the electronic component mounting machine of this embodiment and the electronic component mounting machine of the first embodiment is that a pressing member is arranged on the suction nozzle. In addition, a parallel operation is performed when an electronic component is mounted on the mounting area. Here, the differences will be described. In the description, FIG. 5 of the first embodiment is used.

<Configuration of suction nozzle>
First, the structure of the suction nozzle of the electronic component mounting machine of this embodiment will be described. FIG. 9 is a right-side cross-sectional view of the first stage of the electronic component mounting machine according to the present embodiment, in the vicinity of the first board lifting / lowering section, before the component mounting operation. FIG. 10 shows a right cross-sectional view in the middle stage of the component mounting work, in the vicinity of the first board lifting part. FIG. 11 is a right side cross-sectional view of the first substrate lifting part and its vicinity in the latter part mounting operation. In addition, what is shown in FIGS. 9-11 is a part corresponding to the inside of the frame IV of FIG. Moreover, about the site | part corresponding to FIG. 8, it shows with the same code | symbol.

  As shown in FIG. 9, the suction nozzle 37 includes a nozzle body 371, a head portion 372, a flange portion 373, a pressing member 374, and a coil spring 375. The coil spring 375 is included in the concept of the “biasing member” of the present invention.

  The nozzle body 371 has a cylindrical shape extending in the vertical direction. The head part 372 has a disk shape. The head portion 372 is fixed to the lower end of the nozzle body 371. A suction surface 370 is disposed on the circular lower surface of the head portion 372. The adsorption surface 370 has a planar shape. The flange portion 373 has an annular shape. The flange portion 373 is fixed to the outer peripheral surface of the nozzle body 371.

  The pressing member 374 has a bottomed cylindrical shape (cup shape) that opens downward. A pressing surface 374 a is disposed on the annular lower end surface of the pressing member 374. The pressing surface 374a has a planar shape. The pressing surface 374a is parallel to the suction surface 370. The pressing member 374 is mounted on the outer peripheral surface of the nozzle body 371 so as to be movable in the vertical direction. The pressing member 374 is interposed between the flange portion 373 and the head portion 372.

  The coil spring 375 is interposed between the flange portion 373 and the pressing member 374. The coil spring 375 urges the pressing member 374 downward by its own elastic force. For this reason, as shown in FIG. 9, the pressing surface 374 a is disposed below the suction surface 370 in a state where the suction nozzle 37 is not in contact with the substrate Br.

<Electronic component mounting work>
Next, the mounting operation of the electronic component by the electronic component mounting machine of this embodiment will be described. The mounting operation includes a parallel operation of the upper surface of the substrate mounting region and the pressing surface. The mounting operation includes a tilting process, a fixing process, and a mounting process.

[Tilt process]
In this step, the pressing surface 374a and the upper surface of the mounting area A are made parallel by causing the pressing surface 374a of the suction nozzle 37 to follow the upper surface of the mounting area A.

  First, the wall motion motors 393f and 393m and the transport motor 369f are appropriately driven by the control device 7 shown in FIG. Then, as shown in FIG. 9, the mounting area A of the substrate Bf is disposed immediately above the first backup portion 351f.

  Next, the lift motor 359f is driven by the control device 7 shown in FIG. Then, the board Bf is lifted to the component mounting height by the support surface 351fd of the first backup part 351f.

  Subsequently, the X-axis motor 319a, the Y-axis motor 319b, the Z-axis motor 321 and the θ-axis motor 325 are appropriately driven by the control device 7 shown in FIG. Then, the electronic component P is transported from the component supply device to just above the mounting area A by the suction nozzle 37. As shown in FIG. 9, negative pressure is supplied to the suction surface 370. For this reason, the lower surface of the electronic component P follows the suction surface 370. That is, the lower surface of the electronic component P and the suction surface 370 are parallel. As described above, the suction surface 370 and the pressing surface 374a are parallel to each other. For this reason, the lower surface of the electronic component P and the pressing surface 374a are parallel.

  Then, the pump 354f is driven by the control device 7 shown in FIG. And a positive pressure is supplied to the clearance gap between the to-be-guided part 351fc and the guide part 352fa shown in FIG. By supplying the positive pressure, the first backup part 351f is easily tilted in a multiaxial manner with respect to the first tilting part 352f.

  Thereafter, the Z-axis motor 321 is driven by the control device 7 shown in FIG. Then, the suction nozzle 37 is lowered. As shown in FIG. 10, when the pressing surface 374a of the suction nozzle 37 contacts the upper surface of the mounting area A, the first backup portion 351f tilts so that the upper surface of the mounting area A follows the pressing surface 374a. Then, the pressing surface 374a and the upper surface of the mounting area A are in surface contact. That is, the pressing surface 374a and the upper surface of the mounting area A are parallel. Thus, in this process, the pressing surface 374a and the upper surface of the mounting region A are made parallel by causing the pressing surface 374a of the suction nozzle 37 to follow the upper surface of the mounting region A.

[Fixing process]
In this step, the tilted state of the upper surface of the mounting area A set in the tilting step is maintained. First, the pump 354f is stopped by the control device 7 shown in FIG. Next, the vacuum pump 355f is driven by the control device 7 shown in FIG. And a negative pressure is supplied to the clearance gap between the to-be-guided part 351fc and the guide part 352fa shown in FIG. Due to the supply of the negative pressure, the first backup part 351f is attracted to the first tilting part 352f. For this reason, the upper surface of the mounting area A is fixed in a state parallel to the pressing surface 374a. Thus, in this process, the tilting state of the upper surface of the mounting area A set in the tilting process is maintained.

[Installation process]
In this step, the electronic component P is mounted on the upper surface of the mounting area A. First, the Z-axis motor 321 is driven by the control device 7 shown in FIG. Then, the suction nozzle 37 is further lowered from the state shown in FIG. Here, the pressing member 374 has already reached the upper surface of the mounting region A. For this reason, as shown in FIG. 11, portions of the suction nozzle 37 other than the pressing member 374 are lowered. By the descending, the interval between the flange portion 373 and the pressing member 374 becomes narrow. For this reason, the urging force is accumulated in the coil spring 375. Therefore, the pressing force of the pressing surface 374a against the upper surface of the mounting area A is increased. In this state, the electronic component P is mounted on the upper surface of the mounting area A.

  Here, the lower surface of the electronic component P and the pressing surface 374a are parallel. Further, the pressing surface 374a and the upper surface of the mounting area A are parallel. Therefore, the upper surface of the mounting area A and the lower surface of the electronic component P are parallel.

  Thus, the parallelism between the upper surface of the mounting area A and the lower surface of the electronic component P is high. For this reason, as shown in FIG. 11, the electronic component P is mounted on the upper surface of the mounting area A without hitting it. By repeating the mounting operation, the substrate Bf is produced. The production of the substrate Br is performed in the same manner.

  The electronic component mounting machine according to the present embodiment and the electronic component mounting machine according to the first embodiment have the same functions and effects with respect to parts having the same configuration. Further, as shown in FIG. 10, according to the electronic component mounting machine of the present embodiment, the upper surface of the mounting area A of the board Bf and the lower surface of the electronic component P are matched with the upper surface of the mounting area A and the pressing surface 374a. By making contact, the contact is made in a pseudo manner. For this reason, the parallelism between the mounting region A and the electronic component P can be increased.

  As shown in FIG. 11, according to the electronic component mounting machine of the present embodiment, when the electronic component P is mounted, the mounting area A is sandwiched from above and below by the pressing surface 374a and the support surface 351fd. . For this reason, as shown in FIG. 4, it is not necessary to arrange many adsorption holes 351fe on the support surface 351fd. In addition, there is no need to arrange the vacuum pump 356f for the suction hole 351fe.

  As shown in FIG. 10, according to the electronic component mounting machine of the present embodiment, the upper surface of the mounting area A is copied indirectly to the lower surface of the electronic component P through the pressing surface 374a of the suction nozzle 37. I am letting you. For this reason, when mounting the electronic component P in the mounting area A, it is possible to perform a parallel operation.

  When a plurality of suction nozzles 37 are attached to a single mounting head 32 (see FIG. 2), parallel projection cannot be performed prior to production of the substrate Bf as in the first embodiment. The reason is that the tilt angle of the support surface 351fd parallel to the suction surface 370 may be different for each suction nozzle 37.

  In this regard, when the suction nozzles 37 of this embodiment are employed as the plurality of suction nozzles 37 for the single mounting head 32, parallel mounting can be performed when the electronic component P is mounted by each suction nozzle 37. . For this reason, the suction nozzle 37 of this embodiment is particularly suitable when a plurality of suction nozzles 37 are attached to a single mounting head 32.

<< Third Reference Embodiment (hereinafter abbreviated as " Third Embodiment ") >>
The difference between the electronic component mounting machine of the present embodiment and the electronic component mounting machine of the second embodiment is that the electronic component mounting machine includes an illumination device and an imaging device. Here, only differences will be described. In the description, FIG. 5 of the first embodiment is used.

<Configuration of mounting head, suction nozzle, and first substrate elevating part>
First, the configuration of the mounting head, the suction nozzle, and the first substrate lifting unit of the electronic component mounting machine according to the present embodiment will be described. FIG. 12 shows a right side view of the electronic component mounting machine of the present embodiment. In addition, about the site | part corresponding to FIG. 2, it shows with the same code | symbol. FIG. 13 shows an enlarged cross-sectional view in the frame XIII of FIG. In addition, about the site | part corresponding to FIG. 9, it shows with the same code | symbol.

  As shown in FIG. 13, the coil spring 375 is interposed between the vicinity of the lower surface outer edge of the flange portion 373 and the vicinity of the upper surface outer edge of the pressing member 374. The coil spring 375 is disposed away from the outer peripheral surface of the nozzle body 371 in the radial direction.

  An illumination device 326 is disposed inside the mounting head 32. The illumination device 326 is controlled by the control device 7 shown in FIG. The illumination device 326 is disposed immediately above the suction nozzle 37. The lighting device 326 can irradiate X-rays directly below. The illumination range of the illumination device 326 includes a nozzle body 371 and a flange portion 373 that are radially inward of the coil spring 375, a pressing member 374 that is radially inward of the coil spring 375, a head portion 372, A nozzle raising / lowering mechanism (see FIG. 3) of the suction nozzle 37, a pipe for supplying a negative pressure to the suction nozzle 37, and the like are included. These members are all made of a resin that can transmit X-rays.

  An imaging device 357f is arranged inside the first tilting part 352f. The imaging device 357f is controlled by the control device 7 shown in FIG. Further, the imaging device 357f transmits the captured transmission image to the image processing device illustrated in FIG. An imaging hole 358f is opened directly above the imaging device 357f. The imaging hole 358f opens in the guide portion 352fa.

  The support portion 351fb includes a support portion main body 351fh and a transparent cover portion 351fk. The support body 351fh is disposed above the ball portion 351fa. The transparent cover portion 351fk is made of transparent glass, and is disposed above the support portion main body 351fh. A support surface 351fd is disposed on the upper surface of the transparent cover portion 351fk.

  An imaging hole 351fg passes through the ball portion 351fa and the support body 351fh. The imaging hole 351fg is disposed above the imaging hole 358f. The upper end opening of the imaging hole 351fg is covered with a transparent cover portion 351fk.

<Electronic component mounting work>
Next, the mounting operation of the electronic component by the electronic component mounting machine of this embodiment will be described. The mounting operation includes a tilting process, a fixing process, an imaging process, and a mounting process.

[Tilt process]
FIG. 14 is an enlarged cross-sectional view in the imaging process in the frame XIII in FIG. As shown in FIGS. 13 and 14, in this step, the upper surface of the mounting area A is made to follow the pressing surface 374a of the suction nozzle 37 while the pump 354f is driven by the control device 7 shown in FIG. And the pressing surface 374a and the upper surface of the mounting area A are made parallel.

[Fixing process]
In this step, the tilted state of the upper surface of the mounting area A set in the tilting step is maintained. First, the control device 7 shown in FIG. 5 stops the pump 354f and drives the vacuum pump 355f. And as shown in FIG. 14, the upper surface of the mounting area | region A is fixed in the state parallel to the pressing surface 374a.

[Imaging process]
In this process, before the electronic component P is mounted on the mounting area A, the horizontal positional relationship between the electronic component P and the mounting area A is inspected. First, the illumination device 326 is driven by the control device 7 shown in FIG. That is, X-rays are emitted from the lighting device 326 directly below. Subsequently, the imaging device 357f is driven by the control device 7 shown in FIG. That is, a transmission image is captured by the imaging device 357f. FIG. 15 shows a schematic diagram of a transmission image. The illumination device 326 and the imaging device 357f face each other in the vertical direction with the electronic component P and the mounting area A interposed therebetween. For this reason, as shown in FIG. 15, a “ten” -shaped mark MP on the lower surface of the electronic component P and a “rice” -shaped mark MA on the upper surface of the mounting area A are displayed on the transmission image G. “Mark MP” is included in the concept of “characteristic for positioning electronic component” of the present invention. “Mark MA” is included in the concept of “feature for positioning a workpiece” of the present invention.

  The transmission image G is transmitted to the image processing device 8 shown in FIG. In the image processing device 8, whether or not the electronic component P is misaligned with respect to the mounting area A is determined based on the relative positional relationship between the mark MP and the mark MA.

[Installation process]
FIG. 16 is an enlarged cross-sectional view in the mounting process in the frame XIII in FIG. As shown in FIG. 16, in this step, the electronic component P is mounted in the mounting area A. That is, if the electronic component P is not displaced from the mounting area A as a result of the positional deviation determination by the image processing apparatus 8, the electronic component P is mounted on the mounting area A as it is.

  On the other hand, if the electronic component P is misaligned with respect to the mounting area A as a result of the positional deviation determination by the image processing device 8, the suction nozzle 37 is driven in the horizontal direction to correct the misalignment and then the electronic component P is mounted. Attach to area A.

  The electronic component mounting machine 1 according to the present embodiment and the electronic component mounting machine according to the second embodiment have the same functions and effects with respect to parts having the same configuration. Further, according to the electronic component mounting machine 1 of the present embodiment, the relative positional relationship between the mark MP and the mark MA can be recognized from the transmission image G. For this reason, the electronic component P can be mounted on the mounting area A after correcting the positional deviation between the electronic component P and the mounting area A. Therefore, the mounting accuracy can be increased.

  Further, according to the electronic component mounting machine 1 of the present embodiment, the positional deviation between the mounting area A and the electronic component P is interposed between the mounting area A and the suction nozzle 37 (electronic component P) with an imaging device or a prism interposed. Compared with the case where the mounting area A and the electronic component P are close to each other (in a state immediately before mounting), the positional deviation between the mounting area A and the electronic component P can be inspected. For this reason, the moving distance of the electronic component P from an inspection to mounting | wearing becomes short. Therefore, the mounting accuracy can be increased. Further, it is not necessary to secure a space for imaging between the mounting area A and the electronic component P.

<< Other >>
The embodiment of the electronic component mounting machine according to the present invention has been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  As shown in FIGS. 1 and 2, the guide rails 392L and 392R function as Y-direction guide members. The first wall portion 390f, the second wall portion 390m, and the third wall portion 390r have a function as a Y-direction guided member guided by the Y-direction guide member in the Y direction. The concavo-convex relationship between the Y direction guide member and the Y direction guided member may be reversed.

  The first wall portion 390f, the second wall portion 390m, and the third wall portion 390r have a function as a conveyance width changing member capable of expanding and reducing the conveyance width of the substrates Bf and Br. The first wall portion 390f, the second wall portion 390m, and the third wall portion 390r have a function as a Y-direction moving member that can move the Y-direction positions of the substrates Bf and Br.

  The conveyor belts of the first substrate transport unit 360f and the second substrate transport unit 360r have a function as a transport body for the substrates Bf and Br. The first substrate transport unit 360f and the second substrate transport unit 360r function as X-direction moving members that can move the X-direction positions of the substrates Bf and Br.

  The Y direction guide rail 312 has a function as a Y direction guide member. The Y-direction slider 310 has a function as a Y-direction guided member guided in the Y direction by the Y-direction guide member. The concavo-convex relationship between the Y direction guide member and the Y direction guided member may be reversed.

  The X direction guide rail 313 has a function as an X direction guide member. The X-direction slider 311 has a function as an X-direction guided member guided in the X direction by the X-direction guide member. The concavo-convex relationship between the X direction guide member and the X direction guided member may be reversed. The first ball screw portion 353f has a function as a substrate lifting mechanism that moves the substrate Bf in the vertical direction.

  As shown in FIG. 3, the ball screw portion 320 has a function as a nozzle lifting mechanism that moves the suction nozzle 37 in the vertical direction. The suction nozzle 37 has a function as a carrier for the electronic component P.

  The many suction holes 351fe shown in FIG. 8, the pressing member 374, and the first backup part 351f shown in FIG. 11 have a function as a substrate fixture for fixing the substrates Bf and Br during substrate production. The fixing direction of the substrates Bf and Br by the substrate fixing tool may be the horizontal direction as well as the vertical direction.

  As shown in FIG. 2, in the above embodiment, a part of the substrate Bf is supported by the first backup part 351f. However, the entire substrate Bf may be supported. As shown in FIGS. 1 and 2, in the above embodiment, when the electronic component P is mounted, the substrate Bf is moved in the horizontal direction, but the first substrate elevating part 350f may be moved in the horizontal direction. . That is, when the electronic component P is mounted, the suction nozzle 37 may be disposed above the mounting area A, and the first backup unit 351f may be disposed below the mounting area A. As shown in FIG. 2, in the above embodiment, a so-called tape feeder is used as the component supply device 4, but a tray, a bowl feeder, or the like may be used. As shown in FIG. 4, in the above embodiment, the guide portion 352 fa is a partially spherical surface, and the guided portion 351 fc is a partially spherical shape, but this unevenness relationship may be reversed.

  In the third embodiment, X-rays are used as transmitted light, but infrared light or the like may be used. Further, the illumination device 326 may be disposed below the substrate Bf and the electronic component P. Further, the imaging device 357f may be disposed above the substrate Bf and the electronic component P.

  In FIG. 17, the schematic diagram of the transmission image of other embodiment is shown. In addition, about the site | part corresponding to FIG. 15, it shows with the same code | symbol. As shown in FIG. 17A, the positional deviation between the electronic component and the mounting area may be determined based on the two square marks MP and the convex mark MA. As shown in FIG. 17B, the positional deviation between the electronic component P and the mounting area A may be determined based on the circular mark MP and the annular mark MA. Thus, the positioning feature of the electronic component P and the positioning feature of the substrate Bf are not particularly limited. Anything such as characters, figures, symbols, characteristic shapes (such as corners) of the electronic component P, and patterns on the upper surface of the substrate Bf can be used as the characteristic portions. The mark MP may be disposed on the upper surface of the electronic component P. Further, the mark MA may be arranged on the lower surface of the mounting area A.

  In the above embodiment, the upper surface of the mounting area A of the board Bf is tilted by the first tilting part 352f. However, the lower surface of the electronic component P, that is, the suction surface 370 of the suction nozzle 37 may be tilted. . In this case, for example, a spherical plain bearing, a ball joint, a universal joint, or the like may be interposed as a tilting portion in the middle portion in the vertical direction of the suction nozzle 37 shown in FIG. Further, a tilting unit may be disposed on both the backup unit 351f and the suction nozzle 37. In the above embodiment, the substrates Bf and Br are used as the “workpiece” of the present invention, but a wafer before dicing may be used.

  As shown in FIG. 9, in the second embodiment, the coil spring 375 is used as the biasing member, but other springs such as a leaf spring and a disc spring may be used. Moreover, you may use elastic members, such as rubber | gum and a foam material.

  The proxy surface 370 may not be parallel to the lower surface of the electronic component P. Similarly, the proxy surface 351fd may not be parallel to the upper surface of the mounting area A. As shown in FIG. 7, by fixing the relative inclination angles of both surfaces in a state where the surrogate surface 370 and the surrogate surface 351 fd are in surface contact, the lower surface of the electronic component P and the upper surface of the mounting region A are May be in surface contact.

  In addition, the third embodiment can be carried out independently of the first embodiment and the second embodiment. That is, the illuminating device 326 and the imaging device 357f of the third embodiment may be incorporated in the electronic component mounting machine 1 that does not have a parallel function of the upper surface of the substrate Bf and the lower surface of the electronic component P. As the imaging device 357f, for example, a camera capable of acquiring a transmission image capable of recognizing a feature for positioning the electronic component P or a feature for positioning the workpiece, such as an X-ray camera or an infrared camera, can be used.

1: electronic component mounting machine, 2: base, 3: module, 4: component supply device, 7: control device, 8: image processing device.
31: XY robot, 32: mounting head, 35: substrate lifting device, 36: substrate transport device, 37: suction nozzle, 39: transport width changing device, 40: cassette type feeder, 70: computer.
310: Y direction slider, 311: X direction slider, 312: Y direction guide rail, 313: X direction guide rail, 319a: X axis motor, 319b: Y axis motor, 320: Ball screw part, 320a: Shaft, 320b: Nut, 320c: clamping piece, 321: Z-axis motor, 322: lifting rod, 322a: clamped piece, 325: θ-axis motor, 326: lighting device, 350f: first substrate lifting section, 350r: second substrate lifting section , 351f: first backup part (backup part), 351fa: ball part, 351fb: support part, 351fc: guided part, 351fd: support surface, 351fe: suction hole, 351fg: imaging hole, 351fh: support part body, 351fk : Transparent cover part, 352f: first tilting part (tilting part), 352fa: guide part, 353f: first Ball screw unit, 354f: pump, 355f: vacuum pump, 356f: vacuum pump, 357f: imaging device, 358f: imaging hole, 359f: lifting motor, 360f: first substrate transport unit, 360r: second substrate transport unit, 369f : Conveying motor, 369r: conveying motor, 370: suction surface, 371: nozzle body, 372: head portion, 373: flange portion, 374: pressing member, 374a: pressing surface, 375: coil spring (biasing member) 390f: first wall portion, 390m: second wall portion, 390r: third wall portion, 391: base portion, 392L: guide rail, 392R: guide rail, 393f: wall portion moving motor, 393m: wall portion moving motor, 393r: wall moving motor, 400: tape, 700: input / output interface, 701: arithmetic unit, 702: storage unit .
A: Mounting area, Bf: Substrate (work), Br: Substrate (work), G: Transmission image, Lf: First lane, Lr: Second lane, MA: Mark (characteristic for positioning electronic components), MP: mark (characteristic for positioning the workpiece), P: electronic component.

Claims (3)

A backup unit that supports a mounting area from which the electronic component is mounted in the workpiece from below;
A suction nozzle disposed above the mounting region and mounting the electronic component on the mounting region;
A tilting unit that tilts at least one of the backup unit and the suction nozzle so that the upper surface of the mounting region and the lower surface of the electronic component are aligned substantially parallel when the electronic component is mounted on the mounting region;
Equipped with a,
The backup unit supports the mounting region from below and has a support surface substantially parallel to the upper surface of the mounting region,
The suction nozzle sucks the electronic component and has a suction surface substantially parallel to the lower surface of the electronic component;
Before mounting the electronic component in the mounting area, the support surface and the suction surface are brought into contact with each other to tilt one surface of the support surface and the suction surface so as to follow the other surface. ,
An electronic component mounting machine that causes the upper surface of the mounting area to follow the support surface when the electronic component is mounted on the mounting area by causing the support surface to fully adsorb the lower surface of the mounting area.   The backup part has a partially spherical guided part,
  The electronic component mounting machine according to claim 1, wherein the tilting portion has a partially back spherical guide portion that accommodates the guided portion so as to be tiltable.   An illuminating device that irradiates the imaging region arranged so that the electronic component and the mounting region overlap in the vertical direction with transmitted light that can pass through the electronic component and the mounting region;
  An imaging device that images the imaging region irradiated with the transmitted light and acquires a transmission image capable of recognizing the positioning feature of the electronic component and the positioning feature of the workpiece;
The electronic component mounting machine according to claim 1, further comprising:

Images