JP5736879B2 - Manufacturing method of organic EL device - Google Patents

Description

  The present invention relates to an organic EL device manufacturing method and an organic EL device manufacturing apparatus.

  The organic EL (electroluminescence) device has a structure in which an organic film such as a light emitting layer is sandwiched between an anode and a cathode. As a method for manufacturing the organic EL device, banks (partition walls) are formed so as to surround an anode provided on a substrate. Next, a functional liquid containing an organic film forming material is applied into the opening hole (light emitting region) surrounded by the bank using an inkjet method or the like. Next, as described in Patent Document 1, for example, the functional liquid is dried in an inert gas atmosphere, or the functional liquid is subjected to heat treatment to form an organic layer (functional layer).

  However, when this organic layer comes into contact with oxygen, characteristics (for example, lifetime and light efficiency) as an organic EL device may be greatly reduced. Therefore, after the organic layer is formed, it is necessary to use a glove box or the like to keep it from the atmosphere (oxygen) so that the organic layer does not come into contact with oxygen.

JP 2006-278005 A

  However, in the mass production process, if the organic layer is to be maintained in a state of being cut off from the atmosphere (oxygen) (storing), it is necessary to enlarge a manufacturing apparatus such as a glove box. When the size is increased, there is a problem in that the environment in the glove box varies and the quality of the organic EL device is deteriorated or the cost for capital investment is increased.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] In a method for manufacturing an organic EL device according to this application example, a partition wall forming step for forming a partition wall to partition a light emitting region on a substrate, and a functional liquid is discharged to the region surrounded by the partition wall. A discharge layer; a functional layer forming step for drying the functional liquid to form a functional layer; and a laminating step for laminating the film on the substrate so that the partition wall and the film are in contact with each other. And

  According to this method, since the functional layer is laminated (sealed) with a film and shielded from the atmosphere, the characteristics (quality) of the functional layer due to contact between the functional layer and the atmosphere (oxygen and moisture) are reduced. Can be suppressed. In addition, since the functional layer is shielded from the atmosphere, it is possible to store the organic EL device in the atmosphere in the mass production process, and this cost can be reduced without newly investing in equipment for shielding from the atmosphere. Can be suppressed. In addition, since it can be stored in the air, process management in mass production becomes easy.

  Application Example 2 In the method for manufacturing an organic EL device according to the application example, it is preferable that the laminating step is performed under a reduced pressure.

  According to this method, since the substrate is laminated under a reduced pressure, air can be prevented from entering between the functional layer and the film. Therefore, it can suppress that the characteristic (quality) of a functional layer by the functional layer and air | atmosphere (oxygen and moisture) contacting falls.

  Application Example 3 In the method for manufacturing an organic EL device according to the application example described above, it is preferable to include a baking process step for baking the functional layer after the laminating process step.

  According to this method, since the functional layer is shielded from the atmosphere by the film, it is possible to prevent the functional layer from coming into contact with oxygen or moisture in the baking process even in an atmosphere in the air. Therefore, defects such as the functional layer not emitting light due to contact with oxygen or moisture can be suppressed. Furthermore, the insolubilizing function in an organic solvent can be added by baking.

  Application Example 4 In the method of manufacturing an organic EL device according to the application example, after the laminating process, a peeling process for peeling the laminated film, and a surface treatment is performed on the substrate from which the film has been peeled. It is preferable to have a surface treatment step and a re-lamination treatment step of laminating a film again on the substrate that has been subjected to the surface treatment.

  According to this method, since the film is removed by peeling, it is possible to prevent adverse effects on the already formed functional layer as in the case of dissolving using a liquid. Therefore, it can prevent that the characteristic of a functional layer falls.

  Application Example 5 In the method for manufacturing an organic EL device according to the application example, it is preferable that the film is formed using polyethylene terephthalate.

  According to this method, since polyethylene terephthalate is used as the film, it is possible to prevent oxygen and moisture from permeating. Therefore, by laminating a film on the substrate, it becomes possible to keep the upper side of the functional layer in a state of being shielded from the atmosphere, and then the functional layer can come into contact with oxygen and moisture even when stored in the atmosphere. Can be prevented. Therefore, it can suppress that the characteristic of a functional layer falls.

  Application Example 6 An organic EL device manufacturing apparatus according to this application example includes a laminating unit that laminates a film for preventing the functional layer and the air from coming into contact with the functional layer provided in the light emitting region on the substrate. And a baking processing unit for heat-treating the substrate on which the film is laminated.

  According to this configuration, since the film is laminated on the functional layer by the laminating unit, it is possible to prevent the functional layer from coming into contact with oxygen or moisture. Furthermore, since the functional layer is subjected to heat treatment in a state where the functional layer is shielded from the atmosphere by the bake treatment unit, an insolubilizing function in an organic solvent can be added without deteriorating the characteristics. Furthermore, unlike the case where the processing is always performed in a vacuum (inert gas atmosphere), it is not necessary to newly increase the size of the manufacturing apparatus, so that the capital investment can be suppressed and the cost can be suppressed.

  Application Example 7 In the organic EL device manufacturing apparatus according to the application example, it is preferable that the laminating unit is adjusted under reduced pressure.

  According to this configuration, since the substrate is laminated in the laminating section adjusted under reduced pressure, it is possible to suppress the air from entering between the functional layer and the film. Therefore, it can suppress that the characteristic (quality) of a functional layer by the functional layer and air | atmosphere (oxygen and moisture) contacting falls.

FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of the organic EL device. The schematic plan view which shows the structure of an organic electroluminescent apparatus. The schematic cross section which shows the structure of an organic electroluminescent apparatus. Process drawing which shows the manufacturing method of an organic electroluminescent apparatus. The schematic cross section which shows a one part process among the manufacturing methods of an organic electroluminescent apparatus. The schematic side view which shows a part of manufacturing method of an organic electroluminescent apparatus, and the structure of a manufacturing apparatus. The schematic side view which shows a part of manufacturing method of an organic electroluminescent apparatus, and the structure of a manufacturing apparatus.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized. Further, the organic EL device of the present embodiment may have a top emission structure or a bottom emission structure.

<Configuration of organic EL device>
FIG. 1 is an equivalent circuit diagram showing an electrical configuration of the organic EL device. Hereinafter, the configuration of the organic EL device will be described with reference to FIG.

  As shown in FIG. 1, the organic EL device 11 includes a plurality of scanning lines 12, a plurality of signal lines 13 extending in a direction intersecting the scanning lines 12, and a plurality of power supply lines 14 extending in parallel to the signal lines 13. And. An area partitioned by the scanning line 12 and the signal line 13 is configured as a pixel area. The signal line 13 is connected to the signal line drive circuit 15. The scanning line 12 is connected to the scanning line driving circuit 16.

  Each pixel region holds a switching TFT (Thin Film Transistor) 21 to which a scanning signal is supplied to the gate electrode via the scanning line 12 and a pixel signal supplied from the signal line 13 via the switching TFT 21. A storage capacitor 22 is provided, and a driving TFT 23 to which a pixel signal held by the storage capacitor 22 is supplied to the gate electrode is provided. Further, in each pixel region, when electrically connected to the power supply line 14 via the driving TFT 23, an anode 24 into which a drive current flows from the power supply line 14, a cathode 25, and the anode 24 and the cathode 25 A functional layer 26 sandwiched therebetween is provided.

  The organic EL device 11 includes a plurality of light emitting elements 27 including an anode 24, a cathode 25, and a functional layer 26. In addition, the organic EL device 11 includes a display area composed of a plurality of light emitting elements 27.

  According to this configuration, when the scanning line 12 is driven and the switching TFT 21 is turned on, the potential of the signal line 13 at that time is held in the holding capacitor 22, and the driving TFT 23 depends on the state of the holding capacitor 22. ON / OFF state is determined. A current flows from the power supply line 14 to the anode 24 through the channel of the driving TFT 23, and further a current flows to the cathode 25 through the functional layer 26. The functional layer 26 emits light with a luminance corresponding to the amount of current flowing therethrough.

  FIG. 2 is a schematic plan view showing the configuration of the organic EL device. Hereinafter, the configuration of the organic EL device will be described with reference to FIG.

  As shown in FIG. 2, the organic EL device 11 includes a display region 32 (a region inside a one-dot chain line in the drawing) and a non-display region 33 (a region outside a one-dot chain line) on a substrate 31 made of glass or the like. It has become. The display area 32 is provided with an actual display area 32a (area inside the two-dot chain line) and a dummy area 32b (area outside the two-dot chain line in the figure).

  In the actual display area 32a, sub-pixels 34 (light emitting areas) from which light is emitted are arranged in a matrix. Each of the sub-pixels 34 emits light of R (red), G (green), and B (blue) in accordance with the operation of the switching TFT 21 and the driving TFT 23 (see FIG. 1). .

  In the dummy area 32b, a circuit for mainly causing each sub-pixel 34 to emit light is provided. For example, the scanning line driving circuit 16 is disposed along the left side and the right side of the actual display region 32a in the drawing, and the inspection circuit 35 is disposed along the upper side of the actual display region 32a in the drawing.

  A flexible substrate 36 is provided on the lower side of the substrate 31. The flexible substrate 36 is provided with a driving IC 37 connected to each wiring.

  FIG. 3 is a schematic cross-sectional view showing the structure of the organic EL device. Hereinafter, the structure of the organic EL device will be described with reference to FIG. FIG. 3 shows the cross-sectional positional relationship of each component and is represented on a scale that can be clearly shown.

  As shown in FIG. 3, the organic EL device 11 emits light in the light emitting region 42, and is formed on the substrate 31, the circuit element layer 43 formed on the substrate 31, and the circuit element layer 43. The light emitting element layer 44, a laminate film 38 as a film formed on the light emitting element layer 44, and a cathode (common electrode) 25 formed on the laminate film 38. Examples of the substrate 31 include a glass substrate having translucency.

In the circuit element layer 43, a base protective film 45 made of a silicon oxide film (SiO ₂ ) is formed on the substrate 31, and a driving TFT 23 is formed on the base protective film 45. Specifically, an island-shaped semiconductor film 46 made of a polysilicon film is formed on the base protective film 45. A source region 47 and a drain region 48 are formed in the semiconductor film 46 by introducing impurities. A portion where no impurity is introduced is a channel region 51.

  Further, a transparent gate insulating film 52 made of a silicon oxide film or the like that covers the base protective film 45 and the semiconductor film 46 is formed in the circuit element layer 43. A gate electrode 53 (scanning line) made of aluminum (Al), molybdenum (Mo), tantalum (Ta), titanium (Ti), tungsten (W), or the like is formed on the gate insulating film 52.

A transparent first interlayer insulating film 54 and a second interlayer insulating film 55 are formed on the gate insulating film 52 and the gate electrode 53. The first interlayer insulating film 54 and the second interlayer insulating film 55 are composed of, for example, a silicon oxide film (SiO ₂ ), a titanium oxide film (TiO ₂ ), or the like. The gate electrode 53 is provided at a position corresponding to the channel region 51 of the semiconductor film 46.

  The source region 47 of the semiconductor film 46 is electrically connected to the signal line 13 formed on the first interlayer insulating film 54 through a contact hole 56 provided through the gate insulating film 52 and the first interlayer insulating film 54. Connected. On the other hand, the drain region 48 is formed on the second interlayer insulating film 55 through a contact hole 57 provided through the gate insulating film 52, the first interlayer insulating film 54, and the second interlayer insulating film 55. It is electrically connected to the anode 24.

  The anode 24 is formed for each light emitting region 42, for example. The anode 24 is made of a transparent ITO (Indium Tin Oxide) film, and has, for example, a substantially rectangular shape in plan view. In the circuit element layer 43, a storage capacitor and a switching transistor (not shown) are formed. Further, as described above, in the circuit element layer 43, driving transistors (driving TFTs 23) connected to the respective anodes 24 are formed.

  The light emitting element layer 44 includes the light emitting elements 27 arranged in a matrix and is formed on the substrate 31. More specifically, the light emitting element layer 44 is mainly composed of a functional layer 26 formed on the anode 24 and banks (partition walls) 62 that partition the functional layer 26. The functional layer 26 includes, for example, a hole injection layer 63, a light emitting layer 64, and the like.

An insulating layer 66 is formed between the circuit element layer 43 and the bank 62. Examples of the insulating layer 66 include an inorganic material such as a silicon oxide film (SiO ₂ ). The insulating layer 66 is formed so as to run on the peripheral edge of the anode 24 in order to ensure insulation between the adjacent anodes 24 and to make the light emitting region 42 have a desired shape (for example, a track shape). ing. That is, the anode 24 and the insulating layer 66 have a structure in which they are arranged so as to partially overlap each other in plan view. In other words, the insulating layer 66 is formed in a region excluding the light emitting region 42.

  For example, the bank 62 has a trapezoidal shape having an inclined surface when viewed in cross section, and is formed so as to surround the light emitting region 42 (light emitting element 27). That is, the enclosed area becomes the opening 67 of the bank 62. Examples of the material of the bank 62 include organic materials having heat resistance and solvent resistance such as acrylic resin and polyimide resin.

  As described above, the functional layer 26 is configured to include the hole injection layer 63 and the light emitting layer 64, and in the region surrounded by the bank 62, that is, in the opening 67 (the light emitting region 42), an inkjet method. Are formed in order.

  The hole injection layer 63 is composed of a conductive polymer layer containing a dopant in a conductive polymer material. Such a hole injection layer 63 can be composed of, for example, 3,4-polyethylenedioxythiophene (PEDOT-PSS) containing polystyrene sulfonic acid as a dopant.

  The light emitting layer 64 is formed on the hole injection layer 63 and is a layer of an organic light emitting material that exhibits an electroluminescence phenomenon. A laminate film 38 for maintaining the space on the functional layer 26 in a reduced-pressure atmosphere (inert gas atmosphere) is attached to the entire surface of the substrate 31 including the bank 62 and above the functional layer 26. ing. On the laminate film 38, the cathode 25 is formed on the entire surface (solid film formation).

  Examples of the cathode 25 include a structure in which a lithium fluoride (LiF) layer, a calcium (Ca) layer, and an aluminum (Al) layer are stacked, and an alloy such as magnesium silver (MgAg). In addition, simple substances or alloys such as lithium, sodium, potassium, rubidium, cesium, magnesium, calcium, strontium, barium, aluminum, copper, silver, and gold may be used. Further, cesium carbonate (Cs2CO3) may be used.

  On the cathode 25, a sealing member (not shown) made of resin or the like for preventing water and oxygen from entering is laminated. The anode 24, the functional layer 26, and the cathode 25 constitute a light emitting element 27.

  In the light emitting layer 64 described above, a voltage is applied between the anode 24 and the cathode 25, whereby holes are injected from the hole injection layer 63 and electrons are injected from the cathode 25 into the light emitting layer 64. The light emitting layer 64 emits light when they are combined.

  Thus, by sealing the upper side of the functional layer 26 with the laminate film 38, for example, it is possible to prevent the functional layer 26 and the atmosphere from coming into contact with each other in the manufacturing process, and the characteristics of the functional layer 26 are deteriorated. Can be suppressed. Hereinafter, a method for manufacturing the organic EL device 11 will be described.

<Method for manufacturing organic EL device>
FIG. 4 is a process diagram showing a method for manufacturing an organic EL device. FIG. 5 is a schematic cross-sectional view showing some steps in the method of manufacturing the organic EL device. 6 and 7 are schematic side views showing a part of the manufacturing method of the organic EL device and the configuration of the manufacturing device of the organic EL device. Hereinafter, the manufacturing method of the organic EL device and the configuration of the manufacturing device of the organic EL device will be described with reference to FIGS. 5-7, illustration of the circuit element layer 43, the insulating layer 66, etc. is abbreviate | omitted.

  First, in step S11, the circuit element layer 43 is formed on the substrate 31 using a known film forming technique (see FIG. 3). Specifically, the driving TFT 23, the scanning line 12, the signal line 13, and the like are formed on the substrate 31.

  In step S12, an anode 24 made of ITO as shown in FIG. 5A is formed around the light emitting region 42 on the second interlayer insulating film 55.

  In step S <b> 13 (partition wall forming step), a bank 62 is formed on the peripheral edge of the anode 24. Specifically, first, an organic material that is a material of the bank 62 is formed to cover the substrate 31 by, for example, a coating method. Next, the part except the peripheral part of the anode 24 is removed among organic materials using a photolithographic technique and an etching technique. Thereby, the bank 62 as shown in FIG. 5A is completed. Examples of the organic material include polyimide and acrylic. The height of the bank 62 is 2 μm, for example.

  In step S <b> 14 (discharge process), the functional liquid 26 a is discharged to the opening 67 of the bank 62. Specifically, first, the substrate 31 on which the bank 62 is formed is cleaned. After that, as shown in FIG. 5B, the droplet of the functional liquid 26a is discharged toward the recess having the anode 24 as the bottom and the bank 62 as the side wall, using a droplet discharge method (for example, an ink jet method). To do. The functional liquid 26 a is a functional liquid containing the material for the hole injection layer 63.

  In step S15 (functional layer forming step), as shown in FIG. 5C, the functional liquid 26a is dried to form the hole injection layer 63. Specifically, the functional liquid 26a is dried in a high-temperature environment or under reduced pressure to evaporate the solvent and solidify. Thereby, the hole injection layer 63 is formed in the opening 67.

  Next, a light emitting layer 64 is formed on the hole injection layer 63 in the same manner. Specifically, as shown in FIG. 5 (d), the droplet of the functional liquid 26b is discharged toward the recess having the bank 62 as a side wall by using a droplet discharge method. The functional liquid 26b is a functional liquid 26b containing the material of the light emitting layer 64. Next, as illustrated in FIG. 5E, the functional liquid 26 b is dried to form the light emitting layer 64.

  In step S16 (lamination process), a laminate film 38 for maintaining the atmosphere of the region surrounded by the opening 67 above the light emitting layer 64 and on the bank 62 in an inert gas atmosphere (for example, a nitrogen atmosphere). Is laminated. The laminating process is performed by, for example, a laminator 71 (one constituting the manufacturing apparatus of the organic EL device 11) shown in FIG.

  The laminator 71 includes a transport belt 72 and a transport roller 73 that transport the substrate 11a at the stage before becoming the organic EL device 11, a supply roller 75 that supplies a laminate film 38, a tension roller 76, a pressure roller 77, A pressure roller 78. The laminating process is performed in a vacuum (inert gas atmosphere).

  As the laminate film 38, a film that does not transmit oxygen or moisture is used. For example, a film in which an acrylic pressure-sensitive adhesive layer having a thickness of 25 μm is laminated on a PET (polyethylene terephthalate) film having a thickness of 5 μm to 1000 μm is used. It is done.

  Examples of the material of the laminate film 38 include polyethylene, polystyrene, polyvinyl chloride, nylon, polyvinyl alcohol, nylon, polyethylene terephthalate, polyester, polycarbonate, polyurethane, polyimide, and polypropylene.

  The substrate 11 a is placed on the transport belt 72 and is transported in a predetermined direction by a plurality of transport rollers 73 and a pressure roller 78. The laminate film 38 is supplied from the supply roller 75, and the conveyance direction is defined by the tension roller 76. The laminate film 38 is bonded to the laminate film 38 and the substrate 11a (for example, thermocompression bonding) by moving the pressure roller 77 toward the pressure roller 78, and the laminate film 38 is laminated on the substrate 11a.

  The pressure of the pressure roller 77 is, for example, 0.1 MPa to 10 MPa. The temperature at the time of pressure bonding is, for example, 80 ° C to 150 ° C. The laminate film 38 has a separator laminated as a protective film. The separator can be peeled off and laminated for easy adhesion.

  According to this, the atmosphere in the opening 67 of the bank 62 covered with the laminate film 38 is filled with an inert gas atmosphere (such as a nitrogen atmosphere). Therefore, the functional layer 26 does not come into contact with oxygen, and deterioration of the characteristics of the functional layer 26 can be suppressed.

  In step S17, the substrate 11a that has been laminated on the functional layer 26 is stored (for example, due to the convenience of the processing step). In addition, when mass-producing the organic EL device 11, it is preferable to store it in this step, and it may be stored after performing Step S18. In addition, the place to store may be in air | atmosphere and it is more preferable if it is in a vacuum. According to this, since the functional layer 26 and the atmosphere do not come into contact with each other during storage, it is possible to prevent the characteristics of the functional layer 26 from deteriorating.

  In step S18 (baking process), the functional layer 26 is baked (heated). Specifically, in the baking apparatus 81 (one of the apparatuses for manufacturing the organic EL device 11) shown in FIG. 7, the substrate 11a is placed on the hot plate 82, and the substrate 11a is heated. The temperature to heat is 100 degreeC-200 degreeC, for example.

  As described above, by performing the baking treatment, the solvent contained in the functional layer 26 is further evaporated, and the functional layer 26 is solidified, thereby adding an insolubilizing function to the organic solvent. As another insolubilization mechanism, individual molecules constituting the film receive thermal energy and undergo a crosslinking reaction, so that the entire thin film forms a network, resulting in poor solubility in an organic solvent. There is.

  Further, since the functional layer 26 is laminated (sealed) with the laminate film 38, the functional layer 26 and the atmosphere do not contact each other. Therefore, the functional layer 26 is not oxidized by oxygen or moisture contained in the atmosphere, and defects such as dark spots can be suppressed. In order to increase the processing capacity, it is desirable to use a multistage heating device (hot plate). Further, since the baking process can be performed in the atmosphere (the inside of the opening 67 of the bank 62 is an inert gas atmosphere), it is not necessary to enlarge the apparatus in order to create an inert gas atmosphere.

  In step S19, in order to form the cathode 25 in the next step, the laminate film 38 formed on the substrate 11a is peeled off.

  In step S20, the cathode 25 (see FIG. 3) is formed by laminating a calcium film and an aluminum film in this order, for example, by vapor deposition on substantially the entire surface of the substrate 11a.

  In step S21, the organic EL device 11 is completed by sealing on the cathode 25 using, for example, an adhesive and a glass substrate.

  In addition, after step S18, for example, when it is necessary to form a film below the laminate film 38 (in the opening 67), the process proceeds to step S22 (peeling process), and the laminate film 38 is peeled off. As a peeling method, it is physically (mechanically) (for example, peeled off by hand). This process is performed in a vacuum. Thereafter, necessary film formation is performed.

  In step S23 (re-lamination process), the lamination process is performed again. In addition, it carries out in a vacuum similarly to the lamination process mentioned above. Thereafter, the process proceeds to step S19. For example, the substrate 11a may be stored thereafter.

  The material of the functional layer 26 described above may be a material that can form a multilayer structure, and may be a low molecular material or a polymer material.

  In the present embodiment, the functional layer 26 is formed using a polymer material. Specifically, the functional layer 26 is formed by an inkjet method using a solution obtained by dissolving a polymer material (solute) in a solvent as ink. In addition, application | coating of a solution is not limited to the inkjet method, What is necessary is just the method which can apply | coat a solution. For example, a dispenser method such as a jet dispenser method or a needle dispenser method can also be used. Alternatively, a casting method or a spin coating method may be used.

  Hereinafter, suitable examples of the polymer material as the material of the functional layer 26 will be listed. First, the solvent of the solution will be described. Note that the concentration of the ink used in the ink jet method is preferably about 0.05 wt% to 2 wt%.

  As the solvent, aromatic solvents such as toluene, benzene, xylene, trimethylbenzene, tetralin, 3-phenoxytoluene, cyclohexylbenzene, dichlorobenzene, and trichlorobenzene can be used. Further, ether solvents such as tetrahydrofuran, ethyl ether, diisopropyl ether, ethylene glycol, ethylene glycol diethyl ether, dioxane, and anisole, and halogenated hydrocarbon solvents such as methylene chloride, chloroform, and carbon tetrachloride may be used. Also, hydrocarbon solvents such as pentane, hexane, heptane and cyclohexane, ketone solvents such as acetone, N-methyl-2-pyrrolidinone, methyl ethyl ketone, tetralone and cyclohexanone, and ester solvents such as ethyl acetate and butyl acetate. Also good. Further, alcohol solvents such as methanol, ethanol and isopropyl alcohol, nitrile solvents such as acetonitrile, amide solvents such as dimethylformamide and dimethylacetamide, sulfur compound solvents such as dimethyl sulfoxide, and water may be used. A solution obtained by mixing two or more of these solvents may be used as the solvent.

  Subsequently, the material of the hole injection layer 63 will be described. The material of the hole injection layer 63 includes the above-described materials, and polythiophene, polyaniline, polypyrrole, and 3,4-polyethylenediosithiophene / polystyrene sulfonic acid (PEDOT / PSS) can be used. Further, these substances are used as a solution in a glycol solvent such as ethylene glycol or diethylene glycol. As a preferred example, PEDOT / PSS is dissolved in an ether solvent.

  Also, copper phthalocyanine TAPC, (1,1-bis [4- (di-p-tolyl) ami.nophenyl] cyclohexane)) TPD N, N'-diphenyl-N, N'-bis- (3-methylphenyl) -1,1′biphenyl-4,4′-diamine, α-NPDN, N′-diphenyl-N, N′-bis- (1-naphthyl) -1,1′biphenyl-4,4′-diamine, m -MTDATA, 4,4 ', 4 "-tris (3-methylphenylphenylamino) triphenylamine 2-TNATA, 4,4', 4" -tris (N, N- (2-naphthyl) phenylamino) tri Phenylamine TCTA, Tris- (4-carbazoyl-9-yl-phenyl) -amine spiro TAD, (DTP) DPPD, HTM1, Tri-p-tolylamineHTM2,1,1-bis [(di-4-tolylamino) phenyl] CyclohexaneTPT1, 1,3,5-tris (4-pyridyl) -2,4,6-triazinTPTE, triphenylamine-tetramer, and the like can also be used.

  Next, although not shown, the material of the hole transport layer will be described. The hole transport layer is formed on the hole injection layer 63. Materials for the hole transport layer include polyfluorene derivatives (PF), polyparaphenylene vinylene derivatives (PPV), polyparaphenylene derivatives (PPP), polyvinylcarbazole (PVK), polythiophene derivatives, and polymethylphenylsilane (PMPS). A high molecular organic material such as polysilane containing can be used. Further, the material used for the hole injection layer 63, for example, a material such as TAPC, TPD, α-NPD, m-MTDATA, 2-TNATA, TCTA, spiro TAD, (DTP) DPPD, HTM1, and TPTE may be used. good.

  Next, the material of the light emitting layer 64 will be described. The light emitting layer 64 is formed on the hole transport layer. First, a polyfluorene derivative, a polyphenylin derivative, or a polyphenylene vinylene derivative can be used as the high-molecular fluorescent material. Preferable examples include ADS109GE, ADS111RE, and ADS136BE (all are trademarks) manufactured by American Dice Source.

  When a low molecular material is used, the light emitting layer 64 is composed of a host material and a guest material. As host materials, CBP (4,4′-bis (9-dicarbazolyl) -2,2′-biphenyl), BAlq (Bis- (2-methyl-8-quinolinolate) -4- (phenylphenolate) aluminium), mCP (N, N-dicarbazolyl-3,5-benzene: CBP derivative), CDBP (4,4'-bis (9-carbazolyl) -2,2'-dimethyl-biphenyl), DCB (N, N'-Dicarbazolyl- 1,4-dimethene-benzene), P06 (2,7-bis (diphenylphosphine oxide) -9,9-dimethylfluorene), SimCP (3,5-bis (9-carbazolyl) tetraphenylsilane), UGH3 (W-bis (triphenylsilyl) ) benzene) or the like.

  As phosphorescent materials in guest materials, Ir (ppy) 3 (Fac-tris (2-phenypyridine) iridium), Ppy2Ir (acac) (Bis (2-phenyl-pyridinato-N, C2) iridium (acetylacetone), Bt2Ir (acacone) ) (Bis (2-phenylbenxothiozolato-N, C2 ') iridium (III) (acetylacetonate)), Btp2Ir (acac) (Bis (2-2'-benzothienyl) -pyridinato-N, C3) Iridium (acetylacetonate), FIrpic ( Iridium-bis (4,6difluorophenyl-pyridinato-N, C.2.)-Picolinate), Ir (pmb) 3 (Iridium-tris (1-phenyl-3-methylbenzimidazolin-2-ylidene-C, C (2) ' ), FIrN4 ((((Iridium (III) bis (4,6-difluorophenylpyridinato) (5- (pyridin-2-yl) -tetrazolate), Firaz ((Iridium (III) bis (4,6-difluorophenylpyridinato) (5- (pyridine-2-yl) -1,2,4-triazo-late), PtOEP (2,3,7,8,12,13,17,18-Octaethyl-21H, 23H-porphine, platinum (II), etc. Can be used.

  As the fluorescent material in the guest material, Alq3 (8-hydroxyquinolinate) aluminum, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone, and the like can be used. Note that the host material is not limited to the method of doping the guest material, and these materials may be used alone as the light emitting layer 64.

  Next, a material for a hole blocking layer (not shown) will be described. As the hole blocking layer, BALq, OXD-1, 1,3,5-tri (5- (4-tert-butylphenyl) -1,3,4-oxadiazole), BCP (Bathocuproine), PBD (2 -(4-biphenyl) -5- (4-tert-butylphenyl) -1,2,4-oxadiazole, TAZ (3- (4-biphenyl) -5- (4-tert-butylphenyl) -1 , 2,4-triazole, DPVBi4,4'-bis (1,1-diphenylethenyl) biphenyl, BND 2,5-bis (1-naphthyl) -1,3,4-oxadiazole, DTVBi 4,4 '-Bis (1,1-bis (4-methylphenyl) ethenyl) biphenyl, BBD 2,5-bis (4-biphenylyl) -1,3,4-oxadiazole, etc. can be used. Diazole polymer compounds and triazole polymer compounds may be used.

  Next, materials for an electron transport layer (not shown) will be described. As an electron transport layer, Alq3 (8-hydroxyquinolinate) aluminum, oxadiazole derivative, oxazole derivative, phenanthoroline derivative, anthraquinodimethane derivative, benzoquinone derivative, naphthoquinone derivative, anthraquinone derivative, tetracyanoanthraquinodimethane derivative Fluorenone derivatives, diphenyldicyanoethylene derivatives, diphenoquinone derivatives, hydroxyquinoline derivatives, and the like can be used. Moreover, the material of the hole blocking layer described above can also be used as the material of the electron transport layer.

  The organic EL device 11 described above can be used in various electronic devices such as a television, a mobile phone, a display, a mobile computer, a digital camera, a digital video camera, an in-vehicle device, an audio device, a lighting device, and a light source of an optical printer. .

  As described above in detail, according to the method for manufacturing the organic EL device 11 and the device for manufacturing the organic EL device of the present embodiment, the following effects can be obtained.

  (1) According to the manufacturing method of the organic EL device 11 of the present embodiment, the functional layer 26 is laminated (sealed) with the laminate film 38 and shielded from the atmosphere, so that the functional layer 26 and the atmosphere (oxygen) are separated from each other. It can suppress that the characteristic (quality) of the functional layer 26 by contact falls. Moreover, since the functional layer 26 is shielded from the atmosphere, the organic EL device 11 can be stored in the atmosphere in the mass production process, and a device for shielding from the atmosphere is not newly invested. Such costs can be reduced. In addition, since it can be stored in the air, process management in mass production becomes easy.

  (2) According to the method for manufacturing the organic EL device 11 of the present embodiment, since the functional layer 26 is laminated by the laminate film 38, the functional layer 26 comes into contact with the atmosphere when the functional layer 26 is baked. Can be prevented. Therefore, defects such as the functional layer 26 not emitting light due to oxygen or moisture can be suppressed. Furthermore, the insolubilizing function in an organic solvent can be added by baking.

  (3) According to the method of manufacturing the organic EL device 11 of the present embodiment, since the laminate film 38 is removed by peeling, there is an adverse effect on the already formed functional layer 26 as in the case of dissolving using a liquid. Can be prevented. Therefore, it is possible to prevent the characteristics of the functional layer 26 from deteriorating.

  (4) According to the manufacturing apparatus of the organic EL device 11 of the present embodiment, since the laminator 71 laminates the laminate film 38 on the functional layer 26, it is possible to prevent the functional layer 26 from coming into contact with oxygen or moisture. . Furthermore, since the functional layer 26 is baked by the baking device 81 in a state where the functional layer 26 is shielded from the atmosphere, an insolubilizing function in an organic solvent can be added. Thereby, it can suppress that the characteristic of the functional layer 26 by the functional layer 26 and oxygen contacting falls. Furthermore, unlike the case where the processing is always performed in a vacuum (inert gas atmosphere), it is not necessary to newly increase the size of the manufacturing apparatus, so that the capital investment can be suppressed and the cost can be suppressed.

  In addition, embodiment is not limited above, It can also implement with the following forms.

(Modification 1)
As described above, the organic EL device 11 is not limited to the one having the light emitting element 27 capable of emitting red (R), green (G), and blue (B) light. For example, the present invention may be applied to a lighting device capable of emitting monochromatic light such as white. Alternatively, the light emitting element 27 may have a top emission structure that emits white light and may include a color filter above the light emitting element 27.

(Modification 2)
In the above-described embodiment, the method for manufacturing the functional layer 26 in the organic EL device 11 has been described as an example. However, the method is not limited thereto, and the method may be applied to a method for manufacturing a color filter such as a liquid crystal device.

(Modification 3)
As described above, the baking process is not limited to being performed using the baking apparatus 81, and may be performed using infrared rays, for example.

  DESCRIPTION OF SYMBOLS 11 ... Organic EL device, 11a ... Board | substrate, 12 ... Scan line, 13 ... Signal line, 14 ... Power supply line, 15 ... Signal line drive circuit, 16 ... Scan line drive circuit, 21 ... Switching TFT, 22 ... Retention capacity, 23 ... Driving TFT, 24 ... Anode, 25 ... Cathode, 26 ... Functional layer, 26a, 26b ... Functional liquid, 27 ... Light emitting element, 31 ... Substrate, 32 ... Display area, 32a ... Real display area, 32b ... Dummy area , 33 ... Non-display area, 34 ... Sub-pixel, 35 ... Inspection circuit, 36 ... Flexible substrate, 37 ... Driving IC, 38 ... Laminate film as film, 42 ... Light emitting area, 43 ... Circuit element layer, 44 ... Light emission Element layer 45... Base protective film 46... Semiconductor film 47. Source region 48. Drain region 51. Channel region 52. Gate insulating film 53 53 Gate electrode 54 54 First interlayer insulating film 55 ... second interlayer insulating film, 56, 57 ... contact hole, 62 ... bank as a partition wall, 63 ... hole injection layer, 64 ... light emitting layer, 66 ... insulating layer, 67 ... opening, 71 ... laminator, 72 ... Conveying belt, 73 ... conveying roller, 75 ... supply roller, 76 ... tension roller, 77 ... pressure roller, 78 ... compression roller, 81 ... baking device, 82 ... hot plate.

Claims (5)

A partition formation step of forming a partition to partition the light emitting region on the substrate;
A discharge step of discharging the functional liquid to the region surrounded by the partition;
A functional layer forming step of drying the functional liquid to form a functional layer;
In an inert gas atmosphere, the film is laminated on the substrate so that the partition and the film are in contact with each other, and the region surrounded by the film and the partition is filled with the inert gas. Laminating process;
A method for producing an organic EL device, comprising: It is a manufacturing method of the organic EL device according to claim 1,
In the laminating step, the organic EL device is produced by laminating under reduced pressure. It is a manufacturing method of the organic EL device according to claim 1 or 2,
A method for manufacturing an organic EL device, comprising a baking process step of baking the functional layer after the laminating process. It is a manufacturing method of the organic EL device according to any one of claims 1 to 3,
After the laminating step, a peeling step for peeling the laminated film,
A surface treatment step of performing a surface treatment on the substrate from which the film has been peeled;
A relaminating process for laminating a film again on the substrate that has been subjected to the surface treatment;
A method for producing an organic EL device, comprising: It is a manufacturing method of the organic EL device according to any one of claims 1 to 4,
The said film is comprised using the polyethylene terephthalate, The manufacturing method of the organic EL apparatus characterized by the above-mentioned.

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