JP5744697B2 - Optoelectronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to an optoelectronic component having a lens and a method for manufacturing the same.

  Throughout this application document, the term “optoelectronic component” means an electronic component that has at least one of the function of light emission or light reception and is handled as a product. Electronic parts as products are often called packages. Examples of optoelectronic components include packages such as LEDs (light emitting diodes) and LDs (laser diodes). The term “optical chip” means a chip-like optical electronic component mounted on a substrate (including a substrate with a reflector). The optical chip includes an LED chip, an LD chip, and the like. An LED chip as an optical chip and an LED package as an optoelectronic component will be described as examples and will be described as appropriate.

  Conventionally, when manufacturing an LED package, it has been performed as follows. First, an upper mold, a lower mold disposed opposite to the upper mold and provided with a cavity having a plurality of recesses, an intermediate mold disposed between the upper mold and the lower mold, and a mold in the plurality of recesses A tensioning mechanism that stretches the release film between the lower mold cavity surface including the surface and the intermediate mold, and a covering mechanism that forms the cavity space by covering the lower mold cavity surface with the release film A resin sealing device is prepared.

  Next, a substrate (lead frame, printed circuit board, ceramic substrate, etc.) on which a plurality of optical chips (LED chips) are mounted is fixed to the lower surface of the upper mold. Next, the lower mold cavity surface is covered with a release film. Next, a resin material is supplied to the cavity in a state where the upper mold, the intermediate mold, and the lower mold are opened. Next, a resin material having fluidity and translucency (hereinafter referred to as “fluid resin”) is obtained by heating and melting the resin material or using a liquid resin that is liquid at room temperature. To fill the cavity. Next, the upper die, the intermediate die, and the lower die are clamped to immerse the plurality of optical chips in the fluid resin. Next, the resin material is cured to form a sealing resin made of a cured resin. Next, after opening the upper mold, the intermediate mold, and the lower mold, a molded product including the substrate, the plurality of optical chips, and the cured resin is taken out. Next, the molded product is singulated in units of regions corresponding to the plurality of optical chips. Through the steps so far, a plurality of optoelectronic components (LED packages) each including one optical chip are completed. In each optoelectronic component, one hemispherical lens made of a sealing resin is provided corresponding to one optical chip (see Patent Document 1).

Japanese Patent Laying-Open No. 2005-305954 (pages 5-11, FIGS. 1-5)

  As a sealing resin material (resin material) included in the optoelectronic component, a translucent silicone resin or epoxy resin is generally used. These resin materials are more expensive than resin materials used for resin sealing of general electronic components typified by semiconductor integrated circuits (ICs). In addition, in order to obtain desired optical characteristics, a phosphor may be mixed into a resin material used for manufacturing an optoelectronic component. This phosphor is very expensive.

  According to the conventional technique, one “electronic ball” is provided with one “substantially hemispherical” lens corresponding to one optical chip in one optoelectronic component (see paragraph [0013] of FIG. 1, FIG. 1). (See (1)). As a result, the amount of resin material used for one optoelectronic component (including a resin material mixed with a phosphor. The same shall apply hereinafter unless otherwise specified) is one “substantially hemispherical”. It is determined by the shape and dimensions of the part. Therefore, it is difficult to reduce the amount of resin material used for one optoelectronic component. In other words, it is difficult to reduce the amount of resin material used in conventional optoelectronic components. Therefore, it is difficult to reduce the cost of conventional optoelectronic components in terms of the amount of resin material used. Moreover, since effective use of resources cannot be achieved, it is contrary to the social demand for resource saving. Further, since one “substantially hemispherical” lens is provided in one optoelectronic component, it is difficult to reduce the thickness of the optoelectronic component.

  The problems to be solved are as follows. First, it is difficult to manufacture optoelectronic components at low cost. Second, effective use of resources cannot be achieved when manufacturing optoelectronic components. Third, it is difficult to reduce the thickness of the optoelectronic component.

  In order to solve the above-described problems, the optoelectronic component according to the present invention corresponds to L (K ≧ L ≧ 1) regions composed of at least a part of K (K ≧ 2) regions of the substrate body. The unit substrate, one or M (M ≧ 2) optical chips mounted in each of the L areas, and one or M optical chips in each of the L areas are covered with light transmission. An optical electronic component including a sealing resin having one flat plate portion formed in each of the L regions and made of the sealing resin, and one flat plate portion in each of the L regions. N optical elements formed of sealing resin (N ≧ 2) and side surfaces formed by separation from the sealed substrate provided with the sealing resin in K regions, respectively. Each of the N optical elements has a convex portion. , The sealing resin is compression-molded in the resin encapsulated substrate, injection molding, or, characterized in that it is formed by either transfer molding.

  The optoelectronic component according to the present invention is the above-described optoelectronic component in which M = N and all the optical axes of the optical axes of the M optical chips and the optical axes of the N optical elements are the same. Are arranged so as to coincide with each other in plan view.

  The optoelectronic component according to the present invention is characterized in that M ≠ N in the optoelectronic component described above.

  In the optoelectronic component according to the present invention, in the above-described optoelectronic component, all the optical axes of the optical axes of the M optical chips and the optical axes of the N optical elements are shifted in plan view. Are arranged.

  The optoelectronic component according to the present invention is the above-described optoelectronic component, wherein a part of the optical axes of the M optical chips and a part of the optical axes of the N optical elements Are arranged so as to coincide with each other in a plan view, and the remaining optical axes of the optical axes of the M optical chips and the remaining optical axes of the optical axes of the N optical elements are viewed in a plan view. It is characterized by being displaced.

  The optoelectronic component according to the present invention is the above-described optoelectronic component, wherein M = N, M optical chips and N optical elements correspond to each other in plan view, and It is arranged so as to surround the central part, and the optical axis of the N optical elements is arranged so as to be shifted toward the central part in plan view than the optical axis of the M optical chips. To do.

  The optoelectronic component according to the present invention is the above-described optoelectronic component, wherein M = N, M optical chips and N optical elements correspond to each other in plan view, and The optical axis of the N optical elements is arranged so as to surround the central part, and the optical axes of the N optical elements are arranged so as to be shifted in a direction away from the central part in plan view than the optical axes of the M optical chips. It is characterized by.

  In the optoelectronic component according to the present invention, in the above-described optoelectronic component, M = N, and M optical chips and N optical elements are arranged corresponding to each other in plan view. Among the optical axes of the optical chip, some of the optical axes and some of the optical axes of the N optical elements are arranged to coincide with each other in plan view, and the M optical chips have. The remaining optical axes of the optical axes and the remaining optical axes of the optical axes of the N optical elements are arranged so as to be shifted in plan view.

  The optoelectronic component according to the present invention is characterized in that in the optoelectronic component described above, at least some of the N optical elements are circumscribed in plan view.

  In the optoelectronic component according to the present invention, in the optoelectronic component described above, one flat plate portion is provided in all the portions around each of the N optical elements in plan view in each of the one region. It is characterized by being.

  The optoelectronic component according to the present invention is characterized in that, in the optoelectronic component described above, one flat plate portion and N optical elements are formed by different resin molding processes.

  The optoelectronic component according to the present invention is characterized in that, in the optoelectronic component described above, one flat plate portion includes a phosphor, and the N optical elements do not include a phosphor. And

  The optoelectronic component according to the present invention is the above-described optoelectronic component, wherein one flat plate portion in each of the K regions has a minimum thickness necessary for completely covering one or M optical chips. It is characterized by having.

  The optoelectronic component according to the present invention is characterized in that, in the optoelectronic component described above, the N optical elements are any one of a spherical lens, an aspherical lens, a Fresnel lens, and a prism.

  The optoelectronic component according to the present invention is characterized in that, in the optoelectronic component described above, some of the N optical elements have different specifications from the other optical elements.

  Moreover, the optoelectronic component according to the present invention is characterized in that, in the optoelectronic component described above, a reflecting member is provided in each of the K regions.

  The method for manufacturing an optoelectronic component according to the present invention includes a unit substrate corresponding to L (K ≧ L ≧ 1) regions composed of at least a part of K (K ≧ 2) regions of the substrate body, One or M (M ≧ 2) optical chips mounted in each of the L regions, and a sealing resin that covers the one or M optical chips in each of the L regions and has translucency An optoelectronic component manufacturing method for manufacturing an optoelectronic component comprising: a step of preparing a mounted substrate on which one or M optical chips are mounted in each of K regions; a cavity and the cavity A first molding die having N (N ≧ 2) small concave portions provided in unit portions respectively corresponding to the unit substrates, and a second molding die facing the first molding die. Preparation process and mounting on the mold surface of the second mold A step of fixing the substrate, a step of filling the cavity with the fluid resin in a state where the first mold and the second mold are opened, and the first mold and the second mold. A step of immersing one or M optical chips in each of the K regions by clamping the mold in the fluid resin, a step of curing the fluid resin to form a sealing resin, A step of opening the mold 1 and the second mold, a step of removing a sealed substrate made of a mounted substrate on which a sealing resin is formed in each of the K regions, and J And a step of dividing the sealed substrate into individual pieces (K ≧ J ≧ 1) as a unit.

  The optoelectronic component manufacturing method according to the present invention is the above-described manufacturing method, wherein the substrate body has L (K ≧ L ≧ 1) regions composed of at least a part of the K (K ≧ 2) regions of the substrate body. The corresponding unit substrate, one or M (M ≧ 2) optical chips mounted in each of the L areas, and one or M optical chips in each of the L areas are covered with light. A method for producing an optoelectronic component comprising a sealing resin having a property, comprising the steps of preparing a mounted substrate on which one or M optical chips are mounted in each of K regions A first molding die having a cavity corresponding to each unit substrate and N (N ≧ 2) small concave portions provided in unit portions respectively corresponding to the unit substrates in the cavity, and the first molding 2nd opposite to the mold A step of preparing a molding die, a step of fixing a mounted substrate to any one of the first molding die and the second molding die, and a first molding die and a second molding die. A step of clamping, a step of filling the cavity with the fluid resin in a state where the first mold and the second mold are clamped, and curing the fluid resin to obtain the sealing resin. Forming a sealed substrate composed of a mounted substrate on which a sealing resin is formed in each of the K regions, a step of forming, a step of opening the first molding die and the second molding die, And a step of dividing the sealed substrate into pieces in units of J (K ≧ J ≧ 1) regions.

  Also, the method for manufacturing an optoelectronic component according to the present invention is the above-described manufacturing method, wherein the seal member provided on at least one mold surface of the first mold and the second mold is brought into contact with the other mold surface. Forming a closed space including a cavity and shut off from the outside, and at least bringing the seal member into contact with the other mold surface and then completely clamping the first mold and the second mold And a step of sucking the closed space in a period until it is done.

  Also, the method for manufacturing an optoelectronic component according to the present invention includes a step of disposing a release film between the first mold and the second mold in the above-described manufacturing method, and a state in which the cavity is filled. And a step of closely attaching the release film to the mold surface in the cavity before the step of performing the step.

Further, the manufacturing method of the optoelectronic component according to the present invention is M = N in the manufacturing method described above, and before the step of fixing the mounted substrate, all of the optical axes of the M optical chips and N A step of aligning the mounted substrate and the first mold so that all of the central axes of the small concave portions have a predetermined positional relationship, and the predetermined positional relationship is any of the following: It is characterized by.
(1) All of the optical axes and all of the central axes match in plan view.
(2) All of the optical axes and all of the central axes are misaligned in plan view.
(3) Some of the optical axes and some of the central axes coincide with each other in plan view, and the remaining optical axes of the optical axes and the remaining central axes of the central axes And are misaligned in plan view.

Further, the manufacturing method of the optoelectronic component according to the present invention is such that M ≠ N in the manufacturing method described above, and all of the optical axes of the M optical chips and N before the step of fixing the mounted substrate. A step of aligning the mounted substrate and the first mold so that all of the central axes of the small concave portions have a predetermined positional relationship, and the predetermined positional relationship is any of the following: It is characterized by.
(1) All of the optical axes and all of the central axes are shifted in plan view.
(2) Some of the optical axes and some of the central axes coincide with each other in plan view, and the remaining optical axes of the optical axes and the remaining central axes of the central axes And are misaligned in plan view.

  According to the present invention, an optoelectronic component is manufactured by separating from a sealed substrate provided with a sealing resin in each of K regions (K ≧ 2). The optoelectronic component is formed and sealed in each region, with unit substrates corresponding to L (K ≧ L ≧ 1) regions, one or M (M ≧ 2) optical chips mounted in each region. It has one flat plate portion made of a stop resin and N (N ≧ 2) optical elements made of sealing resin formed on one flat plate portion in each region. Thereby, compared with the amount of the resin material corresponding to the sealing resin in the configuration in which one optical element made of the sealing resin is provided corresponding to one or M optical chips, one or M The amount of resin material corresponding to N optical elements corresponding to each optical chip can be greatly reduced. Therefore, the optoelectronic component can be manufactured at a low cost.

  According to the present invention, compared with the amount of the resin material corresponding to the sealing resin in the configuration in which one optical element made of the sealing resin is provided corresponding to one or M optical chips, The amount of resin material corresponding to N optical elements corresponding to one or M optical chips can be greatly reduced. Therefore, effective use of resources can be achieved when manufacturing optoelectronic components.

  According to the present invention, in comparison with the height of one optical element in a configuration in which one optical element made of a sealing resin is provided corresponding to one or M optical chips, The height of the N optical elements corresponding to the M optical chips can be suppressed. Therefore, the optoelectronic component can be thinned.

1 (1) to 1 (4) are partial cross-sectional views sequentially showing steps for manufacturing a first example of an optoelectronic component. 2 (1) and 2 (2) are a sectional view and a plan view showing a first example of the optoelectronic component, and FIGS. 2 (3) and 2 (4) are a sectional view and a plan view showing a second example of the optoelectronic component. FIG. FIGS. 3A and 3B are a sectional view and a plan view showing a third example of the optoelectronic component. FIGS. 4A and 4B are a cross-sectional view and a plan view showing a fourth example of the optoelectronic component, and FIGS. 4C and 4B are a cross-sectional view and a plan view showing the fifth example of the optoelectronic component. FIG. 5A and 5B are a sectional view and a plan view showing a sixth example of the optoelectronic component. 6 (1) to 6 (3) are partial cross-sectional views sequentially showing the steps of manufacturing the seventh example of the optoelectronic component up to the step of primary molding. 7 (1) to 7 (4) are partial cross-sectional views sequentially showing the steps of manufacturing the seventh example of the optoelectronic component from the secondary molding step to the individualized state. 8A and 8B are a sectional view and a plan view showing an eighth example of the optoelectronic component, and FIGS. 8C and 8D are a sectional view and a plan showing the ninth example of the optoelectronic component. FIG. 9 (1) to 9 (4) are partial cross-sectional views sequentially showing steps of manufacturing an eighth example of the optoelectronic component. 10 (1) and 10 (2) show the manufacturing method for manufacturing the first example of the optoelectronic component, from the state where the mold is opened to the state where the sandwiched release film is in close contact with the upper surface of the lower mold. It is a fragmentary sectional view shown. 11 (1) and 11 (2) illustrate a manufacturing method for manufacturing a first example of an optoelectronic component, in which a release film is sucked and the mold surface of the lower mold is covered with the release film, and then a fluid resin is placed in the cavity. FIG. 2 is a partial cross-sectional view showing a state in which the is supplied and a state immediately before the mold is completely clamped. FIGS. 12A and 12B are a cross-sectional view and a plan view showing a tenth example of the optoelectronic component. 13A and 13B are a sectional view and a plan view showing an eleventh example of the optoelectronic component. 14A and 14B are a sectional view and a plan view showing a twelfth example of the optoelectronic component.

  An optoelectronic component corresponding to a plurality of regions of the substrate body includes a unit substrate, a plurality of small optical chips, a flat plate portion made of a sealing resin which is a cured resin, and a plurality made of a sealing resin which is a cured resin. And a small convex lens portion. The optoelectronic component has, as a side surface, a separation surface (divided surface) formed by being separated from the sealed substrate into a plurality of region units. The optical axis of each small lens unit coincides with the optical axis of each small optical chip.

Example 1
With reference to FIG. 1, the manufacturing method of the optoelectronic component which manufactures the 1st example of the optoelectronic component which concerns on this invention is demonstrated. 1 (1) to 1 (4) are partial cross-sectional views sequentially illustrating steps for manufacturing a first example of an optoelectronic component. Any figure included in the present application document is schematically omitted or exaggerated as appropriate so that it can be easily understood.

  First, a substrate body 1 made of a lead frame, a printed circuit board, a ceramic substrate or the like is prepared. FIG. 1A shows a substrate body 1 in a state where a plurality of small optical chips (described later) are mounted and fixed to a mold. The substrate body 1 is provided with a plurality of (= K) regions 2 each having a rectangular shape (including a square, the same applies hereinafter) in a lattice shape. Each region 2 is partitioned by a virtual boundary line 3. The substrate body 1 shown in FIG. 1 (1) is provided with four regions 2 along the horizontal direction in the figure, and with four regions 2 along the front-back direction. Therefore, the substrate body 1 is provided with K = 16 (= 4 × 4) regions 2 in a lattice pattern.

  A plurality (= M) of small optical chips 4 are attached to each of the plurality of regions 2. In each region 2, the electrode of the small optical chip 4 and the electrode in that region are electrically connected. For this electrical connection, techniques such as wire bonding and flip chip bonding are used. The mounted substrate 5 is manufactured through the steps so far.

  Next, as shown in FIG. 1 (1), a mold having at least a lower mold 6 and an upper mold 7 facing the lower mold 6 is prepared. The lower mold 6 is provided with a cavity 8. A plurality (= N) of small concave portions 10 are provided in unit portions 9 corresponding to the plurality of regions 2 of the substrate body 1 in the cavity 8. The plurality of small recesses 10 are provided at positions corresponding to the plurality of small optical chips 4 mounted in each region 2 of the mounted substrate 5. In other words, the same number of the plurality of small optical chips 4 and the plurality of small recesses 10 are provided corresponding to each region 2.

  For example, each small recess 10 has a shape surrounded by a part of a spherical surface, a part of a spheroidal surface, a part of a paraboloid of revolution, and the like. The plurality of small recesses 10 are preferably formed by precise machining such as elliptical vibration cutting.

  Next, as shown in FIG. 1 (1), the mounted substrate 5 is fixed on the lower surface of the upper mold 7 with the plurality of small optical chips 4 facing downward. As shown in FIG. 1 (1), the mounted substrate 5 is arranged such that the rotation axis corresponding to the surface surrounding each small recess 10 and the optical axis (optical axis) of each small optical chip 4 coincide with each other. It is preferable to align the lower mold 6. The rotation axis and the optical axis are respectively indicated by two alternate long and short dash lines in FIG. The center line CL shown in FIG. 1 (2) matches the rotation axis corresponding to the surface surrounding each small recess 10 in the cavity 8 shown in FIG. 1 (1) and the optical axis of each small optical chip 4. It corresponds to the line segment.

  Next, the cavity 8 is filled with the fluid resin 11 (see FIG. 1B). The fluid resin 11 is made of a thermosetting resin such as a translucent silicone resin or epoxy resin. As a resin material that is a raw material of the fluid resin 11, a solid resin such as powder, fine granule, granule, lump, or sheet, or a jelly-like resin having high viscosity is used. In this case, the fluid resin 11 is formed by heating and melting the solid resin or the jelly-like resin using a heater (not shown) provided in the lower mold 6. As the resin material, a liquid resin that is liquid at room temperature can also be used. In this case, the fluid resin 11 made of a liquid resin is supplied to the cavity 8 (see FIG. 1 (1)) using a dispenser or the like.

  Next, as shown in FIG. 1 (2), the lower mold 6 and the upper mold 7 are clamped, and a plurality of small optical chips 4 are immersed in the fluid resin 11 (soaked). Subsequently, the fluid resin 11 is heated and cured to form a cured resin. Thus, the sealing resin 12 (see FIG. 1 (3)) made of a cured resin is formed by compression molding.

  Through the steps so far, as shown in FIG. 1C, the plurality of small optical chips 4 are resin-sealed with the sealing resin 12 to manufacture the sealed substrate 13. The sealing resin 12 functions as a protective member that protects the small optical chip 4 and as an optical element that transmits light generated by the small optical chip 4. The unnecessary portion 14 is a portion of the sealed substrate 13 that is not used as an optoelectronic component (product).

  Next, as shown in FIG. 1 (3), the lower mold 6 (not shown) and the upper mold 7 are opened, and the sealed substrate 13 is taken out from the lower surface of the upper mold 7. Thereafter, the sealed substrate 13 is separated (divided) along the boundary line 3 with each of the plurality of regions 2 as a unit. Specifically, the sealed substrate 13 is fully cut using a dicer, a laser processing machine, a water jet processing machine, a wire saw processing machine, or the like.

  Through the steps so far, the optoelectronic component (LED package) 15 corresponding to the plurality of regions 2 of the substrate body 1 shown in FIG. The optoelectronic component 15 includes a unit substrate 16, a plurality (= M) of small optical chips 4, a flat plate portion 17 made of a sealing resin 12 that is a cured resin, and a plurality (= N) made of a sealing resin 12. ) Convex small lens portions 18. The small lens unit 18 functions as an optical element. The optoelectronic component 15 has a separation surface (divided surface) DF formed by being separated from the sealed substrate 13 as a side surface.

  In the optoelectronic component 15 according to the present invention, a convex small lens portion 18 is provided corresponding to each small optical chip 4. As a result, the amount of the resin material corresponding to the portion used as the lens portion can be greatly reduced as compared with the conventional large lens portion 19 virtually shown by a broken line in FIG. . Therefore, the optoelectronic component 15 can be manufactured at low cost, and resources can be effectively used when the optoelectronic component 15 is manufactured.

  Further, in the optoelectronic component 15, the height of a portion used as a lens, that is, a plurality of convex shapes, compared to the conventional large lens portion 19 virtually shown by a broken line in FIG. The height of the sealing resin 12 including the small lens unit 18 can be suppressed. Therefore, it is possible to manufacture a thin optoelectronic component 15 that is advantageous when the electronic product is thinned.

  In addition, in a state where the mounted substrate 5 is fixed to the lower surface of the upper die 7, the rotation axis of the surface surrounding each small recess 10 in the cavity 8 and the optical axis (optical axis) of each small optical chip 4 are the same. (Refer to the center line CL in FIG. 1 (2) and two one-dot chain lines in FIG. 1 (1) located above it). The rotation axis of the surface surrounding each small concave portion 10 corresponds to the optical axis of each small lens portion 18. These mean that in the optoelectronic component 15, the optical axis of each small lens portion 18 and the optical axis of each small optical chip 4 coincide with each other as the center line CL shown in FIG. Therefore, the optoelectronic component 15 capable of efficiently guiding the light generated by the plurality of small optical chips 4 to the outside (upward in FIG. 1 (4)) can be manufactured.

(Example 2)
With reference to FIGS. 1-3, the 1st-3rd example of the optoelectronic component which concerns on this invention is demonstrated. The same components as those in the embodiments described so far are denoted by the same reference numerals, and description thereof will be omitted as appropriate (the same applies hereinafter).

  2 (1) and 2 (2) are a cross-sectional view and a plan view showing a first example of an optoelectronic component (see FIG. 1 (4)), and FIGS. 2 (3) and 2 (4) show a first example of the optoelectronic component. It is sectional drawing and a top view which show the example of 2. 2 (1) and (3) are AA cross-sectional views of FIGS. 2 (2) and (4), respectively. 3A and 3B are a cross-sectional view and a plan view showing a third example of the optoelectronic component. FIG. 3A is a cross-sectional view taken along the line AA in FIG.

  The optoelectronic component 15 shown in FIGS. 2 (1) and 2 (2) is the same as the optoelectronic component 15 shown in FIG. 1 (4), and corresponds to L = 1 region 2 (FIG. 1 ( 1)). The optoelectronic component 15 has twelve small optical chips 4 and twelve small lens portions 18. Sixteen optoelectronic components 15 are manufactured from the sealed substrate 13 shown in FIG.

  The optoelectronic component 20 shown in FIGS. 2 (3) and 2 (4) is a second example of the optoelectronic component according to the present invention. The optoelectronic component 20 corresponds to L = 4 (= 2 × 2) regions 2. The optoelectronic component 20 includes 48 small optical chips 4 and 48 small lens portions 18. Four optoelectronic components 20 are manufactured from the sealed substrate 13 shown in FIG.

  The optoelectronic component 21 shown in FIGS. 3 (1) and 3 (2) is a third example of the optoelectronic component according to the present invention. The optoelectronic component 21 corresponds to L = 16 (= 4 × 4) regions 2. The optoelectronic component 21 includes 192 small optical chips 4 and 192 small lens portions 18. One optoelectronic component 21 is manufactured from the sealed substrate 13 shown in FIG. In this case, the sealed substrate 13 is cut along the outermost boundary line 3 in the sealed substrate 13 shown in FIG. Thereby, the unnecessary portion 14 is removed from the sealed substrate 13 to manufacture one optoelectronic component 21. Therefore, a large package of optoelectronic components can be manufactured.

  In the present application document, the plurality of optoelectronic components 15, the plurality of optoelectronic components 20, or one optoelectronic device is separated from the sealed substrate 13 by separating the sealed substrate 13 along the boundary line 3. Manufacturing the component 21 or the like is called singulation.

  By changing the mode of separating the sealed substrate 13 along the boundary line 3, an optoelectronic component having a size and shape suitable for the application can be manufactured. For example, an elongated optoelectronic component corresponding to L = 4 (= 1 × 4 or = 4 × 1) region 2 (see FIG. 1A) is obtained.

  In the optoelectronic components 15, 20, and 21, the planar arrangement of the plurality of small optical chips 4 in one region 2 is a lattice shape along the X direction and the Y direction, respectively (see FIGS. 2 and 3). In these planar arrangements, the small optical chips 4 are not arranged at the four corners.

  According to the present embodiment, the same effect as in the first embodiment can be obtained. That is, first, the optoelectronic components 20 and 21 can be manufactured at a lower cost than the conventional large lens portion 19 virtually shown by a broken line in FIG. In addition, when the optoelectronic components 20 and 21 are manufactured, resources can be effectively used.

  Secondly, the height of the portion used as a lens can be suppressed as compared with the conventional large lens portion 19. Therefore, it is possible to obtain thin optoelectronic components 20 and 21 that are advantageous in reducing the thickness of electronic products.

  Thirdly, in the optoelectronic components 20 and 21, the optical axis of each small lens unit 18 and the optical axis of each small optical chip 4 coincide. Therefore, the light generated by the plurality of small optical chips 4 can be efficiently guided to the outside (upward in FIGS. 2 (3) and 3 (1)).

(Example 3)
With reference to FIG. 4 and FIG. 5, the 4th example-the 6th example of the optoelectronic component which concerns on this invention are demonstrated. FIGS. 4A and 4B are a cross-sectional view and a plan view showing a fourth example of the optoelectronic component, and FIGS. 4C and 4B are a cross-sectional view showing a fifth example of the optoelectronic component. It is a top view. 4 (1) and 4 (3) are AA cross-sectional views of FIGS. 4 (2) and 4 (4), respectively. FIGS. 5A and 5B are a sectional view and a plan view showing a sixth example of the optoelectronic component. FIG. 5A is a cross-sectional view taken along the line AA in FIG.

  According to the present embodiment, one large optical chip 22 is mounted in each region 2 in the substrate body 1 shown in FIG. The optoelectronic component 23 shown in FIGS. 4A and 4B is a fourth example of the optoelectronic component according to the present invention, and corresponds to L = 1 region 2 (see FIG. 1A). ). The optoelectronic component 24 shown in FIGS. 4 (3) and 4 (4) is a fifth example of the optoelectronic component according to the present invention, and corresponds to L = 4 (= 2 × 2) regions 2. The optoelectronic component 25 shown in FIGS. 5A and 5B is a sixth example of the optoelectronic component according to the present invention, and corresponds to L = 16 (= 4 × 4) regions 2.

  The optoelectronic components 23, 24, and 25 correspond to the optoelectronic components 15, 20, and 21 (see FIGS. 2 and 3), respectively. In the optoelectronic components 23, 24, and 25, one large optical chip 22 is mounted in each region 2. On the other hand, in the optoelectronic components 15, 20, 21, a plurality of small optical chips 4 are mounted in each region 2. Except for this point, the process of manufacturing the optoelectronic components 23, 24, 25 is the same as the process of manufacturing the optoelectronic components 15, 20, 21. Accordingly, the description of the manufacturing method for manufacturing the optoelectronic components 23, 24, and 25 is omitted.

  In the optoelectronic components 23, 24, and 25, a plurality of convex small lens portions 18 are formed above one large optical chip 22. The light generated by one large optical chip 22 is collected and emitted by a plurality of small lens units 18. As a result, similarly to the first embodiment, the light generated by one large optical chip 22 is efficiently transmitted to the outside (upward in FIGS. 4 (1), 4 (3), and 5 (1)). Can lead.

  According to the present embodiment, the following three effects can be obtained as in the first embodiment. First, the optoelectronic components 23, 24, and 25 can be manufactured at low cost, and resources can be effectively used when the optoelectronic components 23, 24, and 25 are manufactured. Secondly, it is possible to manufacture thin optoelectronic components 23, 24, and 25 that are advantageous in reducing the thickness of electronic products. Third, light generated by one large optical chip 22 can be efficiently guided to the outside.

Example 4
With reference to FIG. 6 and FIG. 7, the manufacturing method of the optoelectronic component which manufactures the 7th example of the optoelectronic component which concerns on this invention is demonstrated. 6 (1) to (3) and FIGS. 7 (1) to (4) are partial cross-sectional views sequentially illustrating steps for manufacturing the seventh example of the optoelectronic component. According to Example 1, the sealing resin is formed by one compression molding (see FIG. 1). On the other hand, according to the present embodiment, the sealing resin is formed by two compression moldings of primary molding and secondary molding.

  First, as shown in FIG. 6 (1), a molding die having at least a lower die 26 and an upper die 27 opposite to the lower die 26 is prepared. The lower mold 26 is provided with a cavity 28. The cavity 28 differs from the cavity 8 of FIG. 1 (1) in that it has a flat bottom. The depth of the cavity 28 is such that the first sealing resin 30 (see FIG. 6 (3)) formed by curing the first resin material 29 (see FIG. 6 (2)) in the cavity 28 is used for each small light. It is preferable to keep the chip 4 as shallow as possible within a range in which the chip 4 can be reliably covered. Note that the depth of the cavity 28 shown in FIG. 6 is exaggerated.

  Next, as shown in FIGS. 6 (2) and (3), the first resin material 29 is cured by compression molding (primary molding) to form the first sealing resin 30. In this way, the first sealed substrate 31 having the first sealing resin 30 is manufactured. These steps are the same as those shown in FIGS. 1 (2) and (3).

  Next, as shown in FIG. 7 (1), a forming die having at least a lower die 32 and an upper die 33 opposite to the lower die 32 is prepared. The lower mold 32 is provided with a cavity 34. The mold surface constituting the cavity 34 in the lower mold 32 is partitioned into unit portions 9 corresponding to the plurality of regions 2 of the substrate body 1. The cavity 34 includes a plurality (= N) of small concave portions 35. The shape of the plurality of small recesses 35 is the same as the shape of the plurality of small recesses 10 shown in FIG. It is preferable that the rotation axis corresponding to the surface surrounding each small recess 35 coincides with the optical axis (optical axis) of each small optical chip 4. This is the same as in the first embodiment.

  Next, as shown in FIG. 7 (2), the plurality of small recesses 35 (see FIG. 7 (1)) of the cavity 34 are filled with the fluid resin 11. Thereafter, the lower mold 32 and the upper mold 33 are clamped. Subsequently, the fluid resin 11 is heated and cured to form the second sealing resin 36 (see FIG. 7 (3)) by compression molding (secondary molding).

  Through the steps so far, the plurality of small optical chips 4 are resin-sealed with the sealing resin 37 (see FIG. 7C) composed of the first sealing resin 30 and the second sealing resin 36. Then, the sealed substrate 38 (see FIG. 7 (3)) is manufactured. The sealing resin 37 functions as a sealing resin that protects the small optical chip 4 and as an optical element that transmits light generated by the small optical chip 4.

  Next, as shown in FIG. 7 (3), the lower mold 32 (not shown) and the upper mold 33 are opened. Thereafter, the sealed substrate 38 is taken out from the lower surface of the upper mold 33. The sealed substrate 38 is separated along the boundary line 3 with each of the plurality of regions 2 as a unit.

  Through the steps so far, the optoelectronic component (LED package) 39 corresponding to one of the plurality of regions 2 of the substrate body 1 shown in FIG. The optoelectronic component 39 includes a unit substrate 16, a plurality (= M) of small optical chips 4, a flat plate portion 40 made of the first sealing resin 30, and a plurality (two) of the second sealing resin 36 ( = N) convex small lens portions 41. Moreover, the optoelectronic component 39 has a separation surface (divided surface) DF formed by being separated (separated) from the sealed substrate 38 as a side surface.

  According to the present embodiment, the following three effects can be obtained as in the first embodiment. First, the optoelectronic component 39 can be manufactured at low cost, and resources can be effectively used when the optoelectronic component 39 is manufactured. Secondly, it is possible to manufacture a thin optoelectronic component 39 that is advantageous when thinning an electronic product. Thirdly, it is possible to manufacture the optoelectronic component 39 capable of efficiently guiding the light generated by the plurality of small optical chips 4 to the outside.

  In addition, according to the present embodiment, the following effects can be obtained when a very expensive phosphor is mixed in the sealing resin. The depth of the cavity 28 used in the primary molding is made as shallow as possible as long as the first sealing resin 30 cured in the cavity 28 can reliably cover each small optical chip 4. Thus, the thickness of the first sealing resin 30 covering each small optical chip 4 can be made as thin as possible. Accordingly, the volume of the first sealing resin 30, that is, the amount of the first resin material 29 used can be reduced as much as possible. On the other hand, according to the present embodiment, instead of mixing the phosphor into the entire sealing resin (see the sealing resin 12 shown in FIG. 1 (3)), the second sealing resin 36 The phosphor can be mixed only in the first resin material 29 without mixing the phosphor. Therefore, since the amount of phosphor used can be reduced as much as possible, the optoelectronic component 39 can be manufactured at a lower cost.

  In this embodiment, a configuration in which one large optical chip 22 is mounted in each region 2 (see FIGS. 4 and 5) can be employed. As a result, an optoelectronic component (see FIGS. 4 and 5) in which a plurality of convex small lens portions 18 are formed above one large optical chip 22 is manufactured using even less phosphor. Can do.

(Example 5)
With reference to FIG. 8, the 8th example-the 9th example of the optoelectronic component which concerns on this invention are demonstrated. FIGS. 8A and 8B are a sectional view and a plan view showing an eighth example of the optoelectronic component, and FIGS. 8C and 8B are a sectional view and a plan view showing the ninth example of the optoelectronic component. is there. 8 (1) and (3) are AA cross-sectional views of FIGS. 8 (2) and (4), respectively.

  The optoelectronic component 42 shown in FIGS. 8 (1) and (2) corresponds to the optoelectronic component 15 shown in FIGS. 2 (1) and 2 (2), but includes the reflecting member 43. Is different. The optoelectronic component 44 shown in FIGS. 8 (3) and 8 (4) corresponds to the optoelectronic component 20 shown in FIGS. 2 (3) and 2 (4), but has an optoelectronic component 20 in that it has a reflecting member 45. Is different. In addition, it is also possible to manufacture the optoelectronic component which has a reflection member corresponding to the optoelectronic component 21 shown by FIG. 3 (1), (2).

  According to the present embodiment, the following three effects can be obtained as in the first embodiment. First, the optoelectronic components 42 and 44 having the reflecting members 43 and 45 can be manufactured at low cost, and resources can be effectively used when the optoelectronic components 42 and 44 are manufactured. Secondly, it is possible to manufacture thin optoelectronic components 42 and 44 that are advantageous in reducing the thickness of electronic products. Thirdly, the light generated by the plurality of small optical chips 4 can be efficiently guided to the outside.

(Example 6)
With reference to FIG. 9, the manufacturing method of the optoelectronic component which manufactures the 8th example of the optoelectronic component which concerns on this invention is demonstrated. 9 (1) to 9 (4) are partial cross-sectional views sequentially showing steps for manufacturing the eighth example of the optoelectronic component. This embodiment relates to a manufacturing method for manufacturing the optoelectronic component 42 (see FIGS. 8A and 8B) having the reflecting member 43 at a low cost.

  In this embodiment, a plurality of small optical chips 4 are mounted on a substrate with a reflecting member composed of a substrate body 1 having an overall reflecting member 46 to manufacture a mounted substrate 47. A sealed substrate 48 is manufactured using the mounted substrate 47. Since other points are the same as those in the first embodiment, the description thereof is omitted.

  According to the present embodiment, the following three effects can be obtained as in the first embodiment. First, the optoelectronic component 42 having the reflecting member 43 can be manufactured at low cost, and resources can be effectively used when the optoelectronic component 42 is manufactured. Secondly, it is possible to manufacture a thin optoelectronic component 42 that is advantageous in reducing the thickness of electronic products. Thirdly, the optoelectronic component 42 capable of efficiently guiding the light generated by the plurality of small optical chips 4 to the outside can be manufactured.

  In addition, the method (refer FIG. 6, 7) which forms sealing resin by two compression moldings with primary shaping | molding and secondary shaping | molding can be employ | adopted for a present Example. Thereby, the optoelectronic component (refer FIG. 9 (4)) which has the reflection member 43 can be manufactured using much less fluorescent substance.

(Example 7)
With reference to FIG. 10 and FIG. 11, the manufacturing method of the optoelectronic component which manufactures the 1st example of the optoelectronic component which concerns on this invention is demonstrated. A feature of the present embodiment is that, when forming an optoelectronic component, in addition to compression molding, a release film and vacuum molding (reduced pressure molding) are used in combination. Vacuum molding (reduced pressure molding) is to form a molded article in a decompressed state by reducing the space including the cavity filled with the fluid resin at least in the process of clamping the mold.

  As shown in FIG. 10, the manufacturing apparatus according to this embodiment includes a lower mold 49 and an upper mold 50. A cavity 51 is formed in the lower mold 49. In the unit portion 52 corresponding to the plurality of regions 2 of the substrate body 1 in the cavity 51, a plurality (= N) of small concave portions 53 are provided. A suction path 54 communicates with the inner bottom surface of the cavity 51. Each suction path 54 is connected to decompression means such as a suction pump and a decompression tank (both not shown) via pipes. On the upper surface side of the lower mold 49, a resin reservoir 55 formed of a recess communicating with the cavity 51 is formed at a position corresponding to the outside of the assembly of the regions 2 of the substrate body 1.

  A frame-shaped film pressing member 56 constituting a part of the lower die 49 is provided so as to surround the lower die 49 in plan view. The film pressing member 56 is provided so as to be movable up and down by driving means (not shown). A release film 57 is disposed between the lower surface of the film pressing member 56 and the lower mold 49. When the film pressing member 56 is lowered below the mold surface of the lower mold 49, the upper portion of the lower mold 49 enters the space inside the frame-shaped film pressing member 56.

  A frame-shaped film receiving member 58 is provided so as to surround the lower mold 49 in plan view. The film receiving member 58 includes a frame-shaped upper plate 59, a frame-shaped lower plate 60, and a plurality of rod-shaped members 61 that connect the upper plate 59 and the lower plate 60. The film receiving member 58 is supported by an elastic member 62 such as a coil spring. The frame-shaped portion of the film pressing member 56 and the upper plate 59 of the film receiving member 58 are provided so as to overlap in plan view.

  A seal member 63 made of an O-ring or the like is provided at a position overlapping the frame-shaped portion of the film pressing member 56 on the lower surface of the upper mold 50. On the lower surface of the upper mold 50, the suction path 64 communicates with the outside of the portion where the substrate body 1 is disposed and inside the seal member 63. Each suction path 64 is connected to decompression means such as a suction pump and a decompression tank (none of which are shown) via pipes.

  A manufacturing method for manufacturing an optoelectronic component will be described with reference to FIGS. As shown in FIG. 10A, first, the mounted substrate 5 is fixed to the lower surface of the lower mold 49. A release film 57 is supplied between the lower surface of the film pressing member 56 and the lower mold 49 and between the lower surface of the film pressing member 56 and the upper surface of the film receiving member 58. The release film 57 may be supplied in a roll shape or a strip shape. As the release film 57, it is preferable to use a fluororesin having low adhesion to a fluid resin and a cured resin.

  Next, the film pressing member 56 is lowered from the state shown in FIG. 10 (1), and the release film 57 is sandwiched between the lower surface of the film pressing member 56 and the upper surface of the film receiving member 58.

  Next, as shown in FIG. 10 (2), the film pressing member 56 is continuously lowered. Thereby, the release film 57 is adhered to the upper surface of the lower mold 49. The term “the upper surface of the lower die 49” means a surface of the lower die 49 on the side where the cavity 51 is provided and is present outside the cavity 51.

  The release film 57 is softened and stretched by being heated by at least a heater (not shown) provided in the lower mold 49. Further, the release film 57 is stretched by lowering the film pressing member 56.

  Next, the release film 57 is sucked through the suction path 54 with the softened release film 57 in close contact with the upper surface of the lower mold 49 (shown in FIGS. 11 (1) and 11 (2)). (See the thick downward dashed line.) As a result, as shown in FIG. 11 (1), the softened release film 57 is brought into close contact with the mold surface in the plurality of small concave portions 53 (see FIG. 10 (2)). In this step, the release film 57 may be brought into close contact with the mold surface in the plurality of small concave portions 53 (see FIG. 10B) by blowing high-pressure gas to the softened release film 57.

  In the present embodiment, a space that is a recess formed in the lower mold 49 and is to be filled with the fluid resin is referred to as a cavity 51 (see FIG. 10A). In addition, a space formed by a recess surrounded by the release film 57 except for the upper part in a state where the release film 57 is in close contact with the mold surface of the cavity 51 described above is also referred to as a cavity 51 for convenience. The cavity 51 in this case is a space that is surrounded by the release film 57 except for the upper part and should be filled with the fluid resin.

  Next, as shown in FIG. 11 (1), the cavity 51 (see FIG. 10 (2)) including the plurality of small concave portions 53 is filled with the fluid resin 65 in the same manner as in the first embodiment. To. In this step, it is preferable to fill the cavity 51 with the fluid resin 65 to such an extent that the surface of the fluid resin 65 is slightly raised from the upper surface of the lower mold 49 by using surface tension.

  Next, as shown in FIG. 11 (2), the upper mold 50 is lowered. By lowering the upper mold 50, the seal member 63 provided on the lower surface of the upper mold 50 comes into contact with the upper surface of the film pressing member 56 and deforms. Thus, the lower surface of the upper mold 50, the inner surface of the frame-shaped film pressing member 56, the upper surface of the release film 57, the upper surface of the fluid resin 65, and the surface of the substrate body 1 (the lower surface and the side surface in the figure). ) To form a closed space 66 composed of a space surrounded by. The closed space 66 is a space that is blocked from the outside of the mold. Thereafter, the closed space 66 is sucked through the suction path 64 provided in the upper mold 50. As a result, moisture, minute foreign matter, and the like contained in the closed space 66 are discharged to the outside of the closed space 66 (the upward direction shown in FIG. 11 (2)). See the thick dashed line).

  Next, as shown in FIG. 11 (2), the upper die 50 is continuously lowered, and the lower die 49 and the upper die 50 are completely clamped. As a result, a predetermined portion of the surface (lower surface in the figure) of the mounted substrate 5 is immersed (immersed) in the fluid resin 65 filled in the cavity 51.

  Next, the fluid resin 65 is cured by applying pressure (clamping pressure) and heat to the fluid resin 65. Thus, a sealing resin (see the sealing resin 12 in FIG. 1 (3)) is formed on the surface (the lower surface in the figure) of the mounted substrate 5. In the steps so far, the lower die 49 and the upper die 50 are clamped, and an excess amount of the fluid resin 65 filled in the cavity 51 is poured into the resin reservoir 55 formed in the lower die 49. . Thus, the sealing resin can be formed in a state where the cavity 51 is filled with an appropriate amount of the fluid resin 65.

  Next, in the same manner as in Example 1, after the lower mold 49 and the upper mold 50 are opened, the sealed substrate (see the sealed substrate 13 in FIG. 1 (3)) is removed from the upper mold 50. . Thereafter, the sealed substrate is separated along the boundary line 3 with each region 2 of the substrate body 1 as a unit (see FIGS. 1 (3) and (4)). As a result, the optoelectronic component 15 shown in FIG. 1 (4) is completed.

  According to the present embodiment, the following four effects can be obtained in addition to the same effects as the first embodiment. As an effect resulting from the use of the release film 57, first, a sealing resin having a smooth surface is obtained by transferring the surface of the release film 57 to the sealing resin. Secondly, by using the release film 57 having low adhesion to the fluid resin and the sealing resin, it is generated on the surface of the sealing resin due to the residual sealing resin on the mold surface of the cavity 51. Unevenness can be prevented. Due to these two effects, a sealing resin having a smooth surface is formed. Therefore, an optoelectronic component having excellent optical characteristics can be obtained.

  Third, when a soft resin material is used in a high temperature state after curing, the sealed substrate (see the sealed substrate 13 in FIG. 1 (3)) can be easily removed from the lower mold 49. . Fourth, the step of applying a release agent to the surface of the mold can be omitted. Conventionally, when a soft resin material is used in a high temperature state after curing, it is difficult to release the sealing resin from the surface of the mold, so a release agent is applied to the surface of the mold every few shots. There was a need. According to this embodiment, the step of applying the release agent can be omitted.

  As an effect resulting from the use of vacuum molding (reduced pressure molding), it is possible to prevent bubbles from forming in the sealing resin and the remaining of minute foreign matters and the like. In an optoelectronic component, the presence of bubbles, minute foreign matters, and the like in the sealing resin causes defects in two aspects: appearance and hindering light transmission. Therefore, according to the present embodiment, it is possible to improve the yield rate when manufacturing the optoelectronic component.

  In addition, the film pressing member 56 may have a planar shape in which a part of the frame is cut out instead of the frame shape. If the lower surfaces of a plurality of members formed by cutting out a part of the frame are present on the same surface in the height direction and can be moved up and down at the same time, those members function as the film pressing member 56. Similarly, with respect to the film receiving member 58, if the upper surfaces of a plurality of members formed by cutting out a part of the frame are present on the same surface in the height direction and are uniformly elastically supported, those members are It functions as a film receiving member 58.

  Further, depending on the depth of the cavity 51, the planar size, the number of the plurality of small concave portions 53, the strength with which the release film 57 is sandwiched between the lower surface of the film pressing member 56 and the upper surface of the film receiving member 58 may be increased. It is preferable to adjust. For example, when a deep and large cavity 51 is provided, or when many small recesses 53 are provided, it is preferable to suppress the strength with which the release film 57 is sandwiched. Thereby, when the release film 57 is sucked by the suction path 54, the release film 57 slides and moves between the lower surface of the film pressing member 56 and the upper surface of the film receiving member 58. Therefore, the release film 57 can be securely adhered to the bottom surface of the cavity 51 including the plurality of small concave portions 53.

  Further, by using a method such as blowing a high-pressure gas to the softened release film 57 without using the film pressing member 56, the release film 57 is brought into close contact with the mold surfaces in the plurality of small concave portions 53. Also good. In this case, the seal member 63 comes into contact with the upper surface of the lower mold 49 and deforms.

  Further, in the step of sucking the closed space 66, in the period from the time when the seal member 63 is brought into contact with the upper surface of the film pressing member 56 to the time when the first mold and the second mold are completely clamped, In other words, the closed space 66 is sucked in the intermediate clamping state. As a result, moisture or the like contained in the closed space 66 is discharged during a period until the mold is completely clamped. Accordingly, since the process of curing the resin can be started early, the efficiency of the resin sealing process can be improved.

  In this embodiment, the release film 57 and vacuum forming are used in combination. Not limited to this, any one of the release film 57 and vacuum forming may be used.

  Moreover, you may combine any one of Example 1 (refer FIG. 1), Example 4 (refer FIG. 6, 7), or Example 6 (refer FIG. 9), and a present Example. As a result, the same effects as in the present embodiment can be obtained in any one of the first embodiment, the fourth embodiment, and the sixth embodiment.

(Example 8)
A tenth example of the optoelectronic component according to the present invention will be described with reference to FIG. FIGS. 12A and 12B are a cross-sectional view and a plan view showing a tenth example of the optoelectronic component. FIG. 12A is a cross-sectional view taken along line AA in FIG.

  This embodiment is a modification of the embodiment shown in FIGS. 2 (1) and (2). In the present embodiment, the planar arrangement of the plurality of small optical chips 4 is a lattice shape along the X direction and the Y direction, respectively, similarly to the case shown in FIGS. . In this planar arrangement, the small optical chips 4 are also arranged at the four corners. In other words, the planar arrangement of the plurality of small optical chips 4 is an arrangement along two concentric squares.

  The optoelectronic component 67 according to the present embodiment corresponds to one region 2 shown in FIG. In the optoelectronic component 67, M = 16 small optical chips 4 are arranged. On the other hand, according to the optoelectronic component 15 shown in FIG. 2A, M = 12 small optical chips 4 are arranged. Thus, according to the present embodiment, many small optical chips 4 are arranged in a package having the same plane area. Therefore, the optoelectronic component 67 that emits a large amount of light can be obtained.

  The planar arrangement of the plurality of small optical chips 4 is not limited to the concentric square shown in FIG. For example, a plurality of small optical chips 4 can be arranged along shapes such as concentric polygons, concentric circles, and concentric ellipses.

Example 9
An eleventh example of the optoelectronic component according to the present invention will be described with reference to FIG. 13A and 13B are a sectional view and a plan view showing an eleventh example of the optoelectronic component. FIG. 13A is a cross-sectional view taken along the line AA in FIG.

  The optoelectronic component 68 according to the present embodiment corresponds to one region 2 shown in FIG. In the optoelectronic component 68, M = 16 small optical chips 4 are arranged in a lattice shape along the X direction and the Y direction, and N = 25 small lens portions 18 are arranged in the X direction and the Y direction. It is arranged in a grid along. In addition, the optical axes of all the small optical chips 4 and the optical axes of all the small lens portions 18 are shifted from each other. In FIG. 13B, the optical axis of the small optical chip 4 is indicated by a symbol “x”, and the optical axis of the small lens unit 18 is indicated by a symbol “+”.

  In the optoelectronic component 68 shown in FIG. 13B, the optical axis of the small lens portion 18 is located at the midpoint of the line segment connecting the optical axes of the small optical chips 4 adjacent in the oblique direction. When viewed from above, the outer edges of the adjacent small lens portions 18 are in contact with each other. In other words, the adjacent small lens portions 18 are circumscribed in a plan view. In FIG. 13B, the position of the small lens portion 18 arranged on the outermost side is determined on the assumption that the small optical chip 4 is arranged further outside the small optical chip 4 located on the outermost side.

  By arranging the plurality of small optical chips 4 and the plurality of small lens portions 18 in this way, the light generated by the plurality of small optical chips 4 located on the outermost side is the light of these small optical chips 4. The plurality of small lens portions 18 located on the outer side (the outermost side) spread and radiate in the direction of the outer side of the optoelectronic component 68 in plan view. Therefore, an optoelectronic component 68 that emits light having a spread is obtained.

  In the present embodiment, adjacent small lens portions 18 are circumscribed when viewed in plan. Not limited to this, the adjacent small lens portions 18 may not be circumscribed when viewed in plan. In this case, there is a flat plate portion 17 made of the sealing resin 12 around the entire periphery of the adjacent small lens portions 18.

(Example 10)
A twelfth example of the optoelectronic component according to the present invention will be described with reference to FIG. 14A and 14B are a sectional view and a plan view showing a twelfth example of the optoelectronic component. FIG. 14A is a cross-sectional view taken along the line AA in FIG.

  The optoelectronic component 69 according to the present embodiment corresponds to one region 2 shown in FIG. In the optoelectronic component 69, M = 16 small optical chips 4 and N = 16 small lens portions 18 are arranged along two concentric squares, respectively. The planar arrangement of the plurality of small optical chips 4 and the plurality of small lens portions 18 has the following characteristics.

  The plurality of small optical chips 4 are arranged in a lattice shape along the X direction and the Y direction, respectively. A part of the optical axes of the plurality of small optical chips 4 and a part of the optical axes of the plurality of small lens portions 18 are arranged to coincide with each other. In addition, another part of the optical axes of the plurality of small optical chips 4 and another part of the plurality of small lens portions 18 are arranged so as to be shifted from each other.

  Specifically, first, at least the innermost optical axes of the optical axes of the plurality of small optical chips 4 and the optical axes of the plurality of small lens portions 18 are arranged to coincide with each other. ing. Secondly, at least the outermost optical axes of the optical axes of the plurality of small optical chips 4 and the optical axes of the plurality of small lens portions 18 are shifted from each other. As shown in FIG. 14 (2), at least of the optical axes of the plurality of small lens portions 18 with respect to the optical axis positioned at least on the outermost side among the optical axes of the plurality of small optical chips 4. The outermost optical axis is arranged so as to be shifted toward the center of the optoelectronic component 69 (toward the center of the region 2 shown in FIG. 1 (1)).

  In FIG. 14 (2), the optical axis that is the center of the optoelectronic component 69 is indicated by a large “+” symbol, the optical axis of the small optical chip 4 is denoted by a “x” symbol, and the optical axis of the small lens unit 18 is small. Indicated by the symbol “+”. In addition, about the optical axis of the small lens part 18, the optical axis of the small lens part 18 located in four corners by planar view is shown.

  According to the optoelectronic component 69 according to the present embodiment, the light generated by the plurality of small optical chips 4 positioned on the outermost side is the plurality of small lens portions 18 positioned on the inner side of the small optical chips 4. The light is emitted toward the inside of the optoelectronic component 69 in plan view by the (smallest lens portion 18 located on the outermost side). Therefore, the optoelectronic component 69 that emits the collected light is obtained.

  In the optoelectronic component 69 shown in FIG. 14 (2), a plurality of small optical chips 4 are arranged along two concentric squares. Along the inner square, the optical axes of the plurality of small optical chips 4 and the optical axes of the plurality of small lens portions 18 are arranged to coincide with each other. Along the outer square, the optical axes of the plurality of small optical chips 4 and the optical axes of the plurality of small lens portions 18 are arranged so as to be shifted.

  Not only the optoelectronic component 69 shown in FIG. 14 (2), but also when a plurality of small optical chips 4 are arranged along three or more concentric squares, It suffices that at least the innermost optical axes of the optical axes and the optical axes of the plurality of small lens portions 18 are arranged to coincide with each other. In addition, the optical axis positioned at least on the outermost side among the optical axes of the plurality of small lens portions 18 is at least the optical axis positioned on the outermost side among the optical axes of the plurality of small optical chips 4. It suffices if they are arranged so as to be shifted toward the center of 69 (inward).

  Further, the mode in which the optical axes of the plurality of small optical chips 4 and the optical axes of the plurality of small lens portions 18 are not limited to being shifted toward the center of the optoelectronic component 69. It may be shifted in the X direction or Y direction shown in FIG. 14 (2), or may be shifted in an oblique direction. There may be a plurality of types of directions of deviation. There may be a plurality of types of shift distances.

  Further, as a modification of the present embodiment, at least the outermost optical axis of the plurality of small optical chips 4 is at least the outermost optical axis of the plurality of small optical chips 4. The positioned optical axis can be arranged so as to be shifted (outward) in a direction away from the center of the optoelectronic component 69. According to this modification, the light generated by the plurality of small optical chips 4 located on the outermost side is converted into the plurality of small lens portions 18 (the outermost positions on the outermost side) with respect to those small optical chips 4. Is irradiated toward the outside of the optoelectronic component 69 in plan view. Therefore, an optoelectronic component 69 that emits light having a spread is obtained.

  As another modification, all the optical axes of the plurality of small lens portions 18 are directed away from the center of the optoelectronic component 69 with respect to all the optical axes of the plurality of small optical chips 4. It can be shifted. According to this modification, the light generated by all the small optical chips 4 is emitted toward the outside of the optoelectronic component 69 in a plan view by all the small lens portions 18. Therefore, an optoelectronic component 69 that emits light having a further spread is obtained.

  As another modification, all of the optical axes of the plurality of small lens portions 18 are shifted toward the center of the optoelectronic component 69 with respect to all the optical axes of the plurality of small optical chips 4. can do. According to this modification, the light generated by all the small optical chips 4 is irradiated by all the small lens portions 18 toward the inside of the optoelectronic component 69 in plan view. Therefore, an optoelectronic component 69 that emits more concentrated light is obtained.

  As another modified example, a part of the optical axes of all the optical axes of the plurality of small optical chips 4 and all of the optical axes of the plurality of small lens portions 18 are arranged to coincide with each other. The remaining optical axes can be shifted from each other.

  In each of the embodiments described so far, the arrangement of the plurality of small optical chips 4 and the plurality of small lens portions 18 can be determined through experiments so that the desired light distribution characteristics can be obtained. Examples of the light distribution characteristics of the irradiated light include characteristics for converging light (convergence), characteristics for diffusing light (diffusivity), and the like. Further, the arrangement of the plurality of small optical chips 4 and the plurality of small lens portions 18 may be determined by performing a simulation according to optical theory. As for the arrangement of the plurality of small optical chips 4 and the plurality of small lens portions 18 determined by these, the optical axes of the plurality of small optical chips 4 and the optical axes of the plurality of small lens portions 18 coincide. Or not.

  Further, regardless of whether or not the optical axes of the plurality of small optical chips 4 are aligned with the optical axes of the plurality of small lens sections 18, the specifications of the plurality of small lens sections 18 differ from each other. You may employ | adopt the structure which has. The specifications of the plurality of small lens portions 18 include a planar size / shape, a cross-sectional size / shape, a curvature, and the like.

  Further, in the above-described embodiments, except for the ninth embodiment, the adjacent small lens portions 18 do not circumscribe each other when viewed in plan. In each of the embodiments other than the ninth embodiment, adjacent small lens portions 18 may be circumscribed when viewed in plan.

  In each of the embodiments described above, a plurality of convex small lens portions 18 as optical elements are surrounded by a part of a spherical surface, a part of a spheroid, a part of a paraboloid of revolution, and the like. It was formed using a plurality of small concave portions 10 having a different shape. A plurality of small concave portions having a spherical shape or an aspherical lens having an optimum shape may be formed by using a plurality of small concave portions having other shapes.

  In each of the above-described embodiments, a plurality of convex small lens portions 18 are employed as the specifications of the optical element. As a modification, other types of optical elements such as a plurality of Fresnel lenses may be adopted as different specifications of the optical elements. One Fresnel lens has a plurality of minute and concentric protrusions. According to this modification, the amount of the resin material in the portion used as the lens portion can be further greatly reduced as compared with the case where a plurality of convex small lens portions 18 are employed. Therefore, the optoelectronic component can be manufactured at a lower cost, and more effective use of resources can be achieved when manufacturing the optoelectronic component. Furthermore, a thinner optoelectronic component can be obtained. A plurality of prisms can also be employed.

  Further, in each of the above-described embodiments, an example has been described in which one substrate body 1 is provided with K = 16 regions 2 each having a rectangular shape. Not only this but the structure which can manufacture many optoelectronic components using the much larger board | substrate body 1 is also employable. For example, the substrate body 1 in which K = 256 (= 16 × 16) regions 2 or K = 1024 (= 32 × 32) regions 2 are provided in a lattice shape may be used. Further, for example, it is possible to use a substrate body 1 having long sides and short sides, in which K = 512 (= 16 × 32) regions 2 are provided in a lattice shape.

  Moreover, in each Example mentioned above, each area | region 4 is formed in the grid | lattice form by the virtual boundary line 3 which orthogonally crosses, and the planar shape of each area | region 4 is a rectangle. Not limited to this, the planar shape of each region 4 may be a quadrilateral other than a rectangle or a polygon other than a quadrangle (for example, a regular hexagon).

  Further, the boundary line may be a broken line or a curved line. When the planar shape of each region 4 is a regular hexagon, or when the boundary line is a polygonal line or a curve, use a laser processing machine, a water jet processing machine, a wire saw processing machine, etc., along the boundary line. The sealed substrate can be cut.

  Further, in each of the above-described embodiments, the sealed substrates 13, 38, and 48 are fully cut. Not limited to this, the sealed substrates 13, 38, 48 may be separated after half-cutting.

  Further, FIG. 1A and the like show an example in which one cavity 8 is provided over the entire K regions 2. In other words, the unit portions 9 in each region 2 are connected to each other to form the cavity 8. However, the present invention is not limited to this, and a configuration may be adopted in which independent recesses are provided in each region 2 and these independent recesses are handled as the cavities 8. According to this configuration, a portion where the sealing resin 12 does not exist in the boundary line 3 between the K regions 2, that is, a portion where the surface of the substrate body 1 is exposed can be formed. Thereby, only the board | substrate body 1 is cut | disconnected in the process of separating the sealed board | substrate 13 into pieces. Therefore, it is possible to increase the efficiency of the process of dividing into pieces and extend the life of the rotary blade used in the dicer.

  Further, a configuration may be adopted in which a cavity is formed in the upper mold and the mounted substrate is fixed to the lower mold. According to this configuration, after filling the cavity with a highly viscous jelly-like resin, the step of heating the jelly-like resin to produce a fluid resin in the cavity and the step of clamping the lower die and the upper die in parallel And implement.

  Moreover, in each Example mentioned above, forming sealing resin using compression molding was demonstrated. Instead of compression molding, injection molding or transfer molding may be used.

  In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

DESCRIPTION OF SYMBOLS 1 Substrate body 2 Area 3 Boundary line 4 Small optical chip (optical chip)
5, 47 Mounted substrate 6, 26, 32, 49 Lower mold (first mold)
7, 27, 33, 50 Upper mold (second mold)
8, 28, 34, 51 Cavity 9, 52 Unit portion 10, 35, 53 Small recess 11, 65 Flowable resin 12 Sealing resin 13, 38, 48 Sealed substrate 14 Unnecessary portion 15, 20, 21 Optoelectronic component 16 Unit substrate 17, 40 Flat plate part 18 Small lens part (optical element)
DESCRIPTION OF SYMBOLS 19 Large lens part 22 Large optical chip 23, 24, 25 Optoelectronic component 29 1st resin material 30 1st sealing resin 31 1st sealed substrate 36 2nd sealing resin 37 Sealing resin 39 Optoelectronic component 41 Small lens part (optical element)
42, 44 Optoelectronic parts 43, 45 Reflective member 46 Total reflective member 54, 64 Suction path 55 Resin pool 56 Film pressing member 57 Release film 58 Film receiving member 59 Upper plate 60 Lower plate 61 Bar-shaped member 62 Elastic member 63 Seal member 66 Closed space 67, 68, 69 Optoelectronic component DF Separation surface CL Center line

Claims (22)

A unit substrate corresponding to L (K ≧ L ≧ 1) regions consisting of at least a part of K (K ≧ 2) regions of the substrate body, and M mounted on each of the L regions. An optoelectronic component comprising an optical chip of (M ≧ 1) and a sealing resin that covers the M optical chips in each of the L regions and has translucency,
One flat plate portion formed in each of the L regions and made of the sealing resin;
N optical elements formed on the one flat plate portion in each of the L regions and made of the sealing resin (N ≧ 2);
A side surface formed by separating from the sealed substrate provided with the sealing resin in each of the K regions,
Each of the N optical elements has a convex portion,
The M optical chips are immersed in a flowable resin filled in a cavity of a molding die by any of compression molding, injection molding, or transfer molding , in the sealing resin in the sealed substrate . Formed by curing the flowable resin in a state ,
An optoelectronic component comprising: the optical axes of the M optical chips and the optical axes of the N optical elements, all of which are displaced from each other in plan view . In the optoelectronic component according to claim 1,
An optoelectronic component, wherein M ≠ N. In the optoelectronic component according to claim 1,
An optoelectronic component, wherein M = N. In the optoelectronic component according to claim 3,
The M optical chips and the N optical elements correspond to each other in a plan view and are arranged so as to surround the center of the region,
An optoelectronic component in which the optical axes of the N optical elements are arranged to be shifted toward the central portion in plan view with respect to the optical axes of the M optical chips. In the optoelectronic component according to claim 3,
The M optical chips and the N optical elements correspond to each other in a plan view and are arranged so as to surround the center of the region,
An optoelectronic component in which the optical axes of the N optical elements are shifted from the optical axis of the M optical chips in a direction away from the central portion in plan view. A unit substrate corresponding to L (K ≧ L ≧ 1) regions consisting of at least a part of K (K ≧ 2) regions of the substrate body, and M mounted on each of the L regions. An optoelectronic component comprising an optical chip of (M ≧ 1) and a sealing resin that covers the M optical chips in each of the L regions and has translucency,
One flat plate portion formed in each of the L regions and made of the sealing resin;
N optical elements formed on the one flat plate portion in each of the L regions and made of the sealing resin (N ≧ 2);
A side surface formed by separating from the sealed substrate provided with the sealing resin in each of the K regions,
Each of the N optical elements has a convex portion,
The M optical chips are immersed in a flowable resin filled in a cavity of a molding die by any of compression molding, injection molding, or transfer molding , in the sealing resin in the sealed substrate . Formed by curing the flowable resin in a state ,
M ≠ N and
A part of the optical axes of the optical axes of the M optical chips and a part of the optical axes of the N optical elements are arranged to coincide with each other in plan view.
Of the optical axes of the M optical chips, the remaining optical axes and the remaining optical axes of the N optical elements are arranged so as to be shifted in plan view. Optoelectronic components. A unit substrate corresponding to L (K ≧ L ≧ 1) regions consisting of at least a part of K (K ≧ 2) regions of the substrate body, and M mounted on each of the L regions. An optoelectronic component comprising an optical chip of (M ≧ 1) and a sealing resin that covers the M optical chips in each of the L regions and has translucency,
One flat plate portion formed in each of the L regions and made of the sealing resin;
N optical elements formed on the one flat plate portion in each of the L regions and made of the sealing resin (N ≧ 2);
A side surface formed by separating from the sealed substrate provided with the sealing resin in each of the K regions,
Each of the N optical elements has a convex portion,
The M optical chips are immersed in a flowable resin filled in a cavity of a molding die by any of compression molding, injection molding, or transfer molding , in the sealing resin in the sealed substrate . Formed by curing the flowable resin in a state ,
M = N and
A part of the optical axes of the optical axes of the M optical chips and a part of the optical axes of the N optical elements are arranged to coincide with each other in plan view.
Of the optical axes of the M optical chips, the remaining optical axes and the remaining optical axes of the N optical elements are arranged so as to be shifted in plan view. Optoelectronic components. In the optoelectronic component according to any one of claims 1 to 7 ,
An optoelectronic component wherein at least some of the N optical elements are circumscribed in plan view. In the optoelectronic component according to any one of claims 1 to 7 ,
An optoelectronic component, wherein the one flat plate portion is provided in all portions around each of the N optical elements in plan view in each of the one region. In the optoelectronic component according to any one of claims 1 to 9,
The optoelectronic component, wherein the one flat plate portion and the N optical elements are formed by the same resin molding process. In the optoelectronic component according to any one of claims 1 to 9 ,
The optoelectronic component, wherein the one flat plate portion and the N optical elements are formed by different resin molding processes. The optoelectronic component according to claim 11,
The optoelectronic component according to claim 1, wherein the one flat plate portion includes a phosphor, and the N optical elements do not include the phosphor. The optoelectronic component according to claim 12,
In each of the K regions, the one flat plate portion has a minimum thickness necessary to completely cover the M optical chips. In the optoelectronic component according to any one of claims 1 to 13,
The N optical elements are any one of a spherical lens, an aspherical lens, a Fresnel lens, and a prism. In the optoelectronic component according to any one of claims 1 to 14,
An optoelectronic component characterized in that some of the N optical elements have different specifications from other optical elements. In the optoelectronic component according to any one of claims 1 to 15,
An optoelectronic component comprising a reflecting member in each of the K regions. A unit substrate corresponding to L (K ≧ L ≧ 1) regions consisting of at least a part of K (K ≧ 2) regions of the substrate body, and M mounted on each of the L regions. An optoelectronic component manufacturing method for manufacturing an optoelectronic component comprising an optical chip of (M ≧ 1) and a sealing resin that covers the M optical chips in each of the L regions and has translucency. And
Preparing a mounted substrate on which the M optical chips are mounted in each of the K regions;
A first mold having a cavity and N (N ≧ 2) small concave portions provided in unit portions respectively corresponding to the unit substrates in the cavity, and a second mold opposed to the first mold Preparing a mold of
Fixing the mounted substrate to the mold surface of the second mold;
A step of filling the cavity with a fluid resin in a state where the first mold and the second mold are opened;
Immersing the M optical chips in the flowable resin filled in the cavity in each of the K regions by clamping the first mold and the second mold; ,
Curing the flowable resin to form the sealing resin;
Opening the first mold and the second mold; and
Removing the sealed substrate formed of the mounted substrate on which the sealing resin is formed in each of the K regions from the mold surface;
A step of separating the sealed substrate into units of J (K ≧ J ≧ 1) as a unit ,
In the step of forming the sealing resin, the M optical chips are attached to the fluid resin filled in the cavity in a state where the first mold and the second mold are clamped. Forming the sealing resin by curing the fluid resin in a state where
M = N and
Prior to the step of fixing the mounted substrate, the mounting is performed so that all of the optical axes of the M optical chips have a predetermined positional relationship with all of the central axes of the N small recesses. A step of aligning the substrate and the first mold,
The method for manufacturing an optoelectronic component, wherein the predetermined positional relationship is any of the following.
(1) All of the optical axes and all of the central axes are misaligned in plan view.
(2) A part of the optical axes and a part of the central axes coincide with each other in plan view, and the remaining optical axes of the optical axes and the central axes. Deviation from the remaining central axis in plan view. A unit substrate corresponding to L (K ≧ L ≧ 1) regions consisting of at least a part of K (K ≧ 2) regions of the substrate body, and M mounted on each of the L regions. An optoelectronic component manufacturing method for manufacturing an optoelectronic component comprising an optical chip of (M ≧ 1) and a sealing resin that covers the M optical chips in each of the L regions and has translucency. And
Preparing a mounted substrate on which the M optical chips are mounted in each of the K regions;
A first mold having a cavity and N (N ≧ 2) small concave portions provided in unit portions respectively corresponding to the unit substrates in the cavity, and a second mold opposed to the first mold Preparing a mold of
Fixing the mounted substrate to the mold surface of the second mold;
A step of filling the cavity with a fluid resin in a state where the first mold and the second mold are opened;
Immersing the M optical chips in the flowable resin filled in the cavity in each of the K regions by clamping the first mold and the second mold; ,
Curing the flowable resin to form the sealing resin;
Opening the first mold and the second mold; and
Removing the sealed substrate formed of the mounted substrate on which the sealing resin is formed in each of the K regions from the mold surface;
A step of separating the sealed substrate into units of J (K ≧ J ≧ 1) as a unit ,
In the step of forming the sealing resin, the M optical chips are attached to the fluid resin filled in the cavity in a state where the first mold and the second mold are clamped. Forming the sealing resin by curing the fluid resin in a state where
M ≠ N and
Prior to the step of fixing the mounted substrate, the mounting is performed so that all of the optical axes of the M optical chips have a predetermined positional relationship with all of the central axes of the N small recesses. A step of aligning the substrate and the first mold,
The method for manufacturing an optoelectronic component, wherein the predetermined positional relationship is any of the following.
(1) All of the optical axes and all of the central axes are misaligned in plan view.
(2) A part of the optical axes and a part of the central axes coincide with each other in plan view, and the remaining optical axes of the optical axes and the central axes. Deviation from the remaining central axis in plan view. A unit substrate corresponding to L (K ≧ L ≧ 1) regions consisting of at least a part of K (K ≧ 2) regions of the substrate body, and M mounted on each of the L regions. An optoelectronic component manufacturing method for manufacturing an optoelectronic component comprising an optical chip of (M ≧ 1) and a sealing resin that covers the M optical chips in each of the L regions and has translucency. And
Preparing a mounted substrate on which the M optical chips are mounted in each of the K regions;
A first mold having a cavity corresponding to each of the unit substrates and N (N ≧ 2) small concave portions provided in unit portions respectively corresponding to the unit substrates in the cavities; Preparing a second mold opposite to the mold;
Fixing the mounted substrate to the mold surface of either the first mold or the second mold;
Clamping the first mold and the second mold; and
A step of filling the cavity with a fluid resin in a state where the first mold and the second mold are clamped;
Curing the flowable resin to form the sealing resin;
Opening the first mold and the second mold; and
Removing the sealed substrate formed of the mounted substrate on which the sealing resin is formed in each of the K regions from the mold surface;
A step of separating the sealed substrate into units of J (K ≧ J ≧ 1) as a unit ,
In the step of forming the sealing resin, the M optical chips are attached to the fluid resin filled in the cavity in a state where the first mold and the second mold are clamped. Forming the sealing resin by curing the fluid resin in a state where
M = N and
Prior to the step of fixing the mounted substrate, the mounting is performed so that all of the optical axes of the M optical chips have a predetermined positional relationship with all of the central axes of the N small recesses. A step of aligning the substrate and the first mold,
The method for manufacturing an optoelectronic component, wherein the predetermined positional relationship is any of the following.
(1) All of the optical axes and all of the central axes are misaligned in plan view.
(2) A part of the optical axes and a part of the central axes coincide with each other in plan view, and the remaining optical axes of the optical axes and the central axes. Deviation from the remaining central axis in plan view. A unit substrate corresponding to L (K ≧ L ≧ 1) regions consisting of at least a part of K (K ≧ 2) regions of the substrate body, and M mounted on each of the L regions. An optoelectronic component manufacturing method for manufacturing an optoelectronic component comprising an optical chip of (M ≧ 1) and a sealing resin that covers the M optical chips in each of the L regions and has translucency. And
Preparing a mounted substrate on which the M optical chips are mounted in each of the K regions;
A first mold having a cavity corresponding to each of the unit substrates and N (N ≧ 2) small concave portions provided in unit portions respectively corresponding to the unit substrates in the cavities; Preparing a second mold opposite to the mold;
Fixing the mounted substrate to the mold surface of either the first mold or the second mold;
Clamping the first mold and the second mold; and
A step of filling the cavity with a fluid resin in a state where the first mold and the second mold are clamped;
Curing the flowable resin to form the sealing resin;
Opening the first mold and the second mold; and
Removing the sealed substrate formed of the mounted substrate on which the sealing resin is formed in each of the K regions from the mold surface;
A step of separating the sealed substrate into units of J (K ≧ J ≧ 1) as a unit ,
In the step of forming the sealing resin, the M optical chips are attached to the fluid resin filled in the cavity in a state where the first mold and the second mold are clamped. Forming the sealing resin by curing the fluid resin in a state where
M ≠ N and
Prior to the step of fixing the mounted substrate, the mounting is performed so that all of the optical axes of the M optical chips have a predetermined positional relationship with all of the central axes of the N small recesses. A step of aligning the substrate and the first mold,
The method for manufacturing an optoelectronic component, wherein the predetermined positional relationship is any of the following.
(1) All of the optical axes and all of the central axes are misaligned in plan view.
(2) A part of the optical axes and a part of the central axes coincide with each other in plan view, and the remaining optical axes of the optical axes and the central axes. Deviation from the remaining central axis in plan view. In the manufacturing method of the optoelectronic component as described in any one of Claims 17-20,
A seal member provided on at least one mold surface of the first mold and the second mold is brought into contact with the other mold surface, thereby forming a closed space including the cavity and shut off from the outside. And a process of
And a step of sucking the closed space in a period from when the seal member is brought into contact with the other mold surface until the first mold and the second mold are completely clamped. The manufacturing method of the optoelectronic component characterized by these. In the manufacturing method of the optoelectronic component as described in any one of Claims 17-20,
Disposing the release film between the first mold and the second mold;
And a step of bringing the release film into close contact with a mold surface in the cavity before the step of filling the cavity.

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