JP5745504B2 - 研磨パッド窓の処理 - Google Patents
研磨パッド窓の処理 Download PDFInfo
- Publication number
- JP5745504B2 JP5745504B2 JP2012507436A JP2012507436A JP5745504B2 JP 5745504 B2 JP5745504 B2 JP 5745504B2 JP 2012507436 A JP2012507436 A JP 2012507436A JP 2012507436 A JP2012507436 A JP 2012507436A JP 5745504 B2 JP5745504 B2 JP 5745504B2
- Authority
- JP
- Japan
- Prior art keywords
- window
- polishing pad
- polishing
- solid
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Description
Claims (13)
- 研磨パッドに窓を形成する方法であって、
固体の光透過性高分子で窓を形成するステップと、
前記窓を研磨パッドに取り付けるステップと、
前記窓を研磨パッドに取り付けるステップの前に、前記窓の表面の少なくとも一方を処理して、前記少なくとも一方の表面の平滑度を高めるステップとを含み、前記処理は、加熱された固体の剛性部品で前記少なくとも一方の表面を加熱すること、および前記加熱された固体の剛性部品で前記窓をアイロン加工することにより前記加熱された固体の剛性部品で押圧することを含む方法。 - 前記固体の剛性部品は150℃以上の温度に加熱される請求項1に記載の方法。
- 前記温度は150℃から250℃の間である請求項2に記載の方法。
- 前記固体の光透過性高分子はポリウレタンを含む請求項2に記載の方法。
- 前記少なくとも一方の表面の加熱は、前記少なくとも一方の表面の温度を前記固体の光透過性高分子のガラス転移温度よりも高い温度に上昇させる請求項1に記載の方法。
- 前記研磨パッドは、微小球充填剤を有するポリウレタンで形成された研磨層を備える請求項1に記載の方法。
- 研磨パッドに窓を形成する方法であって、
研磨パッドに固体の光透過性高分子で窓を形成するステップであって、前記窓の形成は、型に固体の光透過性高分子体を配置するステップと、前記型内に液状の研磨パッド前駆体を注入するステップと、前記液状の前駆体を硬化させて、前記固体の光透過性高分子体に密着した固体の研磨材料を含む本体を形成するステップと、前記固体の研磨材料の部分と前記固体の光透過性高分子体の部分とを有する研磨パッドを切断するステップとを含む、ステップと、
前記窓の表面の少なくとも一方を処理して、前記少なくとも一方の表面の平滑度を高めるステップであって、前記処理は、加熱された固体の剛性部品で前記少なくとも一方の表面を加熱すること、および前記加熱された固体の剛性部品で前記窓をアイロン加工することにより前記加熱された固体の剛性部品で押圧する、ステップと、を含む、方法。 - 前記窓の少なくとも一方の表面の処理は、前記研磨パッドに前記窓が形成された後に行われる請求項7に記載の方法。
- 前記窓の形成は、前記窓の上面を前記研磨層の研磨面に接近させて形成するステップと、底面を前記研磨層の下面に接近させて形成するステップとを含む請求項7に記載の方法。
- 前記上面は前記研磨面と実質的に同一平面上にあり、前記底面は前記下面と実質的に同一平面上にある請求項9に記載の方法。
- 前記処理は、前記窓の前記上面を処理することを含む請求項9に記載の方法。
- 前記処理は、前記窓の前記底面を処理することを含む請求項9に記載の方法。
- 前記研磨パッドの研磨層を押圧することなく、前記窓は、処理される請求項7に記載の方法。
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17217209P | 2009-04-23 | 2009-04-23 | |
| US61/172,172 | 2009-04-23 | ||
| US12/761,334 | 2010-04-15 | ||
| US12/761,334 US8585790B2 (en) | 2009-04-23 | 2010-04-15 | Treatment of polishing pad window |
| PCT/US2010/032253 WO2010124217A2 (en) | 2009-04-23 | 2010-04-23 | Treatment of polishing pad window |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012524672A JP2012524672A (ja) | 2012-10-18 |
| JP5745504B2 true JP5745504B2 (ja) | 2015-07-08 |
Family
ID=42990837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012507436A Expired - Fee Related JP5745504B2 (ja) | 2009-04-23 | 2010-04-23 | 研磨パッド窓の処理 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8585790B2 (ja) |
| JP (1) | JP5745504B2 (ja) |
| KR (1) | KR101587821B1 (ja) |
| CN (1) | CN102449744B (ja) |
| TW (1) | TWI494191B (ja) |
| WO (1) | WO2010124217A2 (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8986585B2 (en) * | 2012-03-22 | 2015-03-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers having a window |
| US9034063B2 (en) * | 2012-09-27 | 2015-05-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing grooved chemical mechanical polishing layers |
| US20140370788A1 (en) * | 2013-06-13 | 2014-12-18 | Cabot Microelectronics Corporation | Low surface roughness polishing pad |
| US10478937B2 (en) * | 2015-03-05 | 2019-11-19 | Applied Materials, Inc. | Acoustic emission monitoring and endpoint for chemical mechanical polishing |
| US9868185B2 (en) * | 2015-11-03 | 2018-01-16 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and window attached thereto |
| WO2018045039A1 (en) * | 2016-08-31 | 2018-03-08 | Applied Materials, Inc. | Polishing system with annular platen or polishing pad |
| KR101945874B1 (ko) * | 2017-08-07 | 2019-02-11 | 에스케이씨 주식회사 | 표면 처리된 연마패드용 윈도우 및 이를 포함하는 연마패드 |
| WO2022202059A1 (ja) * | 2021-03-24 | 2022-09-29 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
| JP7721383B2 (ja) * | 2021-09-27 | 2025-08-12 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
| JP7624858B2 (ja) * | 2021-03-25 | 2025-01-31 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
| JP2023050503A (ja) * | 2021-09-30 | 2023-04-11 | 富士紡ホールディングス株式会社 | 終点検出用窓材の製造方法 |
| JP7678278B2 (ja) * | 2021-03-25 | 2025-05-16 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
| KR20230112387A (ko) * | 2022-01-20 | 2023-07-27 | 케이피엑스케미칼 주식회사 | 연마패드용 윈도우의 제조방법 및 이 방법으로 제조된 연마패드용 윈도우 |
| CN115308140A (zh) * | 2022-10-11 | 2022-11-08 | 杭州众硅电子科技有限公司 | 一种化学机械抛光的在线监测装置 |
| TWI901193B (zh) * | 2023-05-19 | 2025-10-11 | 智勝科技股份有限公司 | 研磨墊及其製造方法以及研磨方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3784655A (en) * | 1971-03-16 | 1974-01-08 | Ppg Industries Inc | Press polishing curved transparent polycarbonate sheet material |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US6994607B2 (en) * | 2001-12-28 | 2006-02-07 | Applied Materials, Inc. | Polishing pad with window |
| JP4570286B2 (ja) * | 2001-07-03 | 2010-10-27 | ニッタ・ハース株式会社 | 研磨パッド |
| US7311862B2 (en) * | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
| US6676483B1 (en) * | 2003-02-03 | 2004-01-13 | Rodel Holdings, Inc. | Anti-scattering layer for polishing pad windows |
| US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
| US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US7754315B2 (en) * | 2004-11-30 | 2010-07-13 | Eastman Kodak Company | Marking enhancement layer for toner receiver element |
| US7169017B1 (en) * | 2005-08-10 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a window with reduced surface roughness |
| US7306507B2 (en) * | 2005-08-22 | 2007-12-11 | Applied Materials, Inc. | Polishing pad assembly with glass or crystalline window |
| US7210980B2 (en) * | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
| JP2007260827A (ja) * | 2006-03-28 | 2007-10-11 | Toyo Tire & Rubber Co Ltd | 研磨パッドの製造方法 |
| WO2008047631A1 (fr) * | 2006-10-18 | 2008-04-24 | Toyo Tire & Rubber Co., Ltd. | Procédé pour produire un tampon à polir long |
| JP2008246960A (ja) * | 2007-03-30 | 2008-10-16 | Riso Kagaku Corp | スクリーン印刷用原版の作製方法 |
| JP4968912B2 (ja) | 2007-03-30 | 2012-07-04 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
-
2010
- 2010-04-15 US US12/761,334 patent/US8585790B2/en not_active Expired - Fee Related
- 2010-04-22 TW TW099112731A patent/TWI494191B/zh active
- 2010-04-23 CN CN201080023169.9A patent/CN102449744B/zh not_active Expired - Fee Related
- 2010-04-23 JP JP2012507436A patent/JP5745504B2/ja not_active Expired - Fee Related
- 2010-04-23 WO PCT/US2010/032253 patent/WO2010124217A2/en not_active Ceased
- 2010-04-23 KR KR1020117027972A patent/KR101587821B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102449744B (zh) | 2015-09-30 |
| WO2010124217A3 (en) | 2011-02-24 |
| WO2010124217A2 (en) | 2010-10-28 |
| KR101587821B1 (ko) | 2016-01-22 |
| KR20120026506A (ko) | 2012-03-19 |
| TW201039981A (en) | 2010-11-16 |
| TWI494191B (zh) | 2015-08-01 |
| CN102449744A (zh) | 2012-05-09 |
| US20100269417A1 (en) | 2010-10-28 |
| US8585790B2 (en) | 2013-11-19 |
| WO2010124217A4 (en) | 2011-05-05 |
| JP2012524672A (ja) | 2012-10-18 |
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