JP5750883B2 - Probe apparatus and probe measuring method - Google Patents

Description

  The present invention relates to a probe apparatus including a probe and a probe measurement method.

  In the manufacturing process of electronic devices such as semiconductor devices, the characteristics are evaluated. For example, a method is known in which a probe is brought into contact with a measurement pad provided on a wafer on which a chip is formed, and the electrical characteristics of the chip and the wafer are measured using the probe. Also known are a method for measuring electrical characteristics by connecting a connector to a circuit board such as a printed circuit board, and a method for measuring electrical characteristics by bringing a probe into contact with a measured pad on the circuit board.

  Regarding the measurement using a probe, a probe device that observes the surface of a sample to obtain a surface image by detecting secondary electrons generated from the sample by ion beam irradiation and the like, and the measurement of the sample characteristics using the probe It has been known. In such a probe device, when the probe is brought close to and in contact with the sample, secondary electrons and the like are shielded by the probe before reaching the detector, and the shadow of the probe displayed in the surface image is used. Techniques for determining the height of the probe from the sample are also known.

  Some probes used for measuring electrical characteristics are unitized into a single probe so that a plurality of probes (terminals) for ground and signals can be brought into contact with an object to be measured at a time.

International Publication No. WO2005 / 093437 Pamphlet JP-A-10-31850 Japanese Patent No. 4408538 JP 2001-133482 A

  In a relatively flat object to be measured such as a wafer, when measuring a plurality of measurement points using a probe including a plurality of terminals as described above, the distance between each terminal of the probe and the object to be measured is the same. Alternatively, the positional relationship between the two is adjusted in advance so as to be the same level. Thereby, it becomes easy to approach and contact the plurality of terminals of the probe at one time with each measurement location of the object to be measured.

On the other hand, when measuring a plurality of measurement points of a measurement object that is relatively non-flat using a probe including a plurality of terminals as described above, the following problems may occur.
For example, the circuit board may be warped or swelled. When the object to be measured is a relatively non-flat object such as this circuit board, the distance between each terminal of the probe and the object to be measured can vary depending on the measurement location. Therefore, unless the positional relationship is obtained for each measurement location, each terminal cannot be brought into contact with the object to be measured at one time, and one of the terminals may not come into contact with the object to be measured. There is also a method of giving elasticity to the terminals of the probe and pressing the probe against the object to be measured until all the terminals are in contact with the object to be measured. However, in this case, the probe terminal is deformed to a shape different from that at the time of calibration performed before measurement, and a terminal having a shape different from that of the other terminal appears in one probe. Measurement may not be possible.

  Even if the object to be measured is relatively flat, if adjustment of the distance between each terminal of the probe and the object to be measured is not appropriate, each terminal cannot be contacted at one time. Similar problems can occur, such as inability to measure.

According to one aspect of the present invention, a probe including a plurality of terminals disposed above the object to be measured and extending to one side of the object, a probe disposed above the object to be measured , a holding unit above and one side for holding the opposite other side of the disposed above the object to be measured, of the holding portion, provided on the side facing the object to be measured, the plurality of terminals of the probe towards the extending, the relative plurality of terminals, an irradiation unit for irradiating light, the disposed above the object to be measured, the plurality of terminals to be projected onto the object to be measured by the light A probe device is provided that includes an acquisition unit that acquires an image including a shadow from above the object to be measured .

  According to the disclosed probe device, it is possible to easily and appropriately obtain the positional relationship between each terminal of the probe and the object to be measured to perform the probe measurement.

It is a figure which shows the structural example of a probe apparatus. It is a top view of a probe apparatus. It is a figure which shows an example of the probe apparatus which concerns on 1st Embodiment. It is a figure which shows an example of the probe which concerns on 1st Embodiment. It is explanatory drawing (the 1) at the time of performing a probe measurement. It is explanatory drawing at the time of performing a probe measurement (the 2). It is explanatory drawing (the 3) at the time of performing a probe measurement. It is a figure explaining an example of parallelism adjustment. It is a figure explaining an example of the probe measurement of a circuit board. It is a figure explaining another example of the probe measurement of a circuit board. It is explanatory drawing (the 1) of the example which projects the shadow of a terminal on a circuit board. It is explanatory drawing (the 2) of the example which projects the shadow of a terminal on a circuit board. It is a figure explaining an example of parallelism adjustment in a probe apparatus. It is a figure which shows an example of the probe apparatus which concerns on 2nd Embodiment. It is explanatory drawing of the example which projects the shadow of a terminal on a to-be-measured object. It is a figure which shows an example of the probe which concerns on 3rd Embodiment.

FIG. 1 is a diagram showing a configuration example of the probe device, and FIG. 2 is a plan view of the probe device of FIG.
A probe apparatus 10 shown in FIGS. 1 and 2 includes a probe 11, a holding unit 12, an irradiation unit 13, and an acquisition unit 14.

  The probe 11 includes a plurality of terminals (probe terminals), here, as shown in FIG. 2 as an example, three terminals 11a, 11b, and 11c. For example, among such three terminals 11a, 11b, and 11c, the pair of terminals 11a and 11c at both ends are used as ground terminals, and the remaining central terminal 11b is used as a signal terminal. The probe 11 has terminals 11a, 11b, and 11c brought into contact with a predetermined position (measurement pad or the like) of the measurement object 20 placed on a stage or the like (not shown), whereby a signal is sent to the measurement object 20. Or a signal output from the DUT 20 is detected.

  The holding unit 12 holds the probe 11 including such terminals 11a, 11b, and 11c. Further, the holding unit 12 is provided with an irradiation unit 13. The irradiation unit 13 is provided, for example, on the side of the holding unit 12 that faces the object to be measured 20. The irradiation unit 13 irradiates the light 13a toward the probe 11.

  When the probe 13 is irradiated with light 13a from the irradiation unit 13, as shown in FIG. 2, shadows (projected images) 30 of the terminals 11a, 11b, and 11c of the probe 11 are projected onto the object 20 to be measured. . The shape of the shadow 30 projected on the device under test 20 varies depending on the distance between each terminal 11a, 11b, 11c of the probe 11 and the device under test 20. For example, if the distances between the terminals 11a, 11b, 11c having the tip positions equal to the object 20 to be measured are equal, the shadow 30a having the tip positions aligned on the object 20 as shown in FIG. 30b and 30c are projected. If the terminals 11a, 11b, and 11c are in contact with the object to be measured 20, the shadows 30a, 30b, and 30c extend from the tips of the terminals 11a, 11b, and 11c. The shadow 30 becomes clearer as the distance between the terminals 11a, 11b, and 11c and the DUT 20 decreases.

  The acquisition unit 14 acquires an image including the shadows 30 a, 30 b, and 30 c projected on the object to be measured 20 by the light 11 a irradiated from the terminals 11 a, 11 b, and 11 c and the irradiation unit 13. For example, the acquisition unit 14 acquires an image including the terminals 11a, 11b, and 11c and their shadows 30a, 30b, and 30c from above the DUT 20.

  In the probe measurement, the probe device 10 irradiates light 13a from the irradiation unit 13 toward the probe 11, and projects the shadow 30 of the terminals 11a, 11b, and 11c on the object 20 to be measured. Then, the probe device 10 acquires an image including the terminals 11a, 11b, and 11c and the shadows 30a, 30b, and 30c projected on the object to be measured 20 by the acquisition unit 14.

  The operator of the probe device 10 obtains the distance between each terminal 11a, 11b, 11c of the probe 11 and the object 20 to be measured by looking at the images of the shadows 30a, 30b, 30c thus acquired by the acquisition unit 14. be able to.

  That is, as described above, if the distances between the terminals 11a, 11b, and 11c with the aligned tip positions and the DUT 20 are equal, the shadows 30a, 30b, and 30c with the aligned tip positions are projected (FIG. 2). . If the distances between the terminals 11a, 11b, and 11c and the DUT 20 are not equal, differences also appear in the tip positions of the shadows 30a, 30b, and 30c according to the difference in the distances. If the terminals 11a, 11b, and 11c are in contact with the DUT 20, the shadows 30a, 30b, and 30c extend from the tips of the terminals 11a, 11b, and 11c. The operator can adjust the positional relationship between the probe 11 and the DUT 20 based on information obtained from the shadows 30a, 30b, and 30c.

Hereinafter, the probe device and probe measurement using the probe device will be described in more detail.
First, the first embodiment will be described.

  FIG. 3 is a diagram illustrating an example of the probe apparatus according to the first embodiment. 4A and 4B are diagrams showing an example of the probe according to the first embodiment, in which FIG. 4A is a plan view, FIG. 4B is a front view, and FIG. 4C is a side view.

A probe apparatus 100 illustrated in FIG. 3 includes a probe 110, an arm unit (holding unit) 120 that holds the probe 110, and an irradiation unit 130 provided on the arm unit 120.
As shown in FIG. 3, the probe 110 includes a probe housing part 111 and a terminal part 112 protruding from the probe housing part 111.

  As shown in FIG. 4, for example, as shown in FIG. 4, the probe 110 has three terminals 112a and 112b whose tip positions are aligned, that is, whose tips are located on a straight line (dotted line 113 in FIG. 4A). , 112c are provided. As the terminals 112a, 112b, and 112c, for example, the pair of terminals 112a and 112c at both ends are used as ground terminals, and the center terminal 112b is used as a signal terminal.

The probe casing 111 accommodates a coaxial cable (coaxial line), a circuit element, and the like for electrically connecting the terminals 112a, 112b, and 112c to the outside of the probe 110.
The probe 110 approaches and comes into contact with the measured pad unit 210 provided on the measured object 200 placed on a stage or the like (not shown), and detects a signal from the measured pad unit 210. For example, as shown in FIG. 4, the measured pad portion 210 is provided with measured pads 210 a, 210 b, and 210 c at positions corresponding to the tips of the terminals 112 a, 112 b, and 112 c of the probe 110. The terminal portion 112 of the probe 110 is formed so that the terminals 112a, 112b, and 112c can be brought into contact with the measured pads 210a, 210b, and 210c, respectively.

The arm part 120 includes an arm rotating part 121 provided on the probe 110 side and an arm fixing part 122 provided on the side of the arm rotating part 121 opposite to the probe 110 side.
The arm rotating portion 121 is pivotally supported by the arm fixing portion 122 and can rotate in the θ direction of FIG. 3 with the direction in which the terminal portion 112 of the probe 110 protrudes as an axis. The probe 110 is fixed to the arm rotating unit 121 and rotates together with the arm rotating unit 121. The arm fixing part 122 and the arm rotating part 121 of the arm part 120 and the probe 110 held by the arm part 120 are integrally movable in the x, y direction (horizontal direction) and the z direction (vertical direction).

  For example, the irradiation unit 130 is provided on the lower side of the arm unit 120, that is, on the side of the arm unit 120 facing the object to be measured 200. The irradiation unit 130 irradiates light 131 toward the probe 110 held by the arm unit 120. For the irradiation unit 130, for example, a parallel light source can be used. The irradiation unit 130 moves together with the arm unit 120 and the probe 110 held by the arm unit 120 in the x, y, and z directions.

The probe apparatus 100 further includes a signal processing unit 140, an acquisition unit 150, and a display unit 160.
The signal processing unit 140 is electrically connected to the probe 110. For example, the signal processing unit 140 processes signals detected from the pads to be measured 210 a, 210 b, and 210 c by the terminals 112 a, 112 b, and 112 c of the probe 110 and sent through the probe housing unit 111. The signal processing unit 140 uses the signal sent from the probe 110 to perform measurement processing of electrical characteristics such as current, voltage, frequency, and phase. For the signal processing unit 140, for example, various measuring instruments such as an oscilloscope and an analyzer can be used.

  The acquisition unit 150 acquires an image of a region on the device under test 200 including the devices under test 210a, 210b, and 210c of the device under test 200 and the terminals 112a, 112b, and 112c of the probe 110 that are in contact with the pads. When the shadows of the terminals 112 a, 112 b, and 112 c are projected on the DUT 200 by the light 131 from the irradiation unit 130, the shadow images are also acquired by the acquisition unit 150. Details of this point will be described later.

  The acquisition unit 150 acquires the images of the measured pads 210a, 210b, and 210c and the terminals 112a, 112b, and 112c or the shadow images of the terminals 112a, 112b, and 112c from above the measured object 200. As the acquisition unit 150, an optical microscope, a CCD (Charge Coupled Device) camera, or the like can be used.

The image data acquired by the acquisition unit 150 is displayed by the display unit 160 including a monitor such as a display device using a CRT (Cathode Ray Tube) or a liquid crystal display device.
For example, the probe measurement of the DUT 200 using the probe device 100 as described above is performed as follows.

  5 to 7 are explanatory diagrams when performing probe measurement. 5 is a plan view including the terminal portion of the probe, FIG. 6A is a side view including the terminal portion of the probe, and FIGS. 6B and 7 are front views including the terminal portion of the probe.

  In the probe measurement, first, the probe 110 is moved to the vicinity of the measurement pads 210a, 210b, and 210c at predetermined measurement locations on the measurement object 200. The probe 110 can be moved to the vicinity of predetermined measured pads 210a, 210b, and 210c by moving the arm portion 120.

  The movement of the probe 110 includes movement of the probe 110 in the x and y directions as shown in FIG. The movement of the probe 110 in the x and y directions can be performed, for example, while observing an image acquired by the acquisition unit 150 from above the DUT 200 and displayed on the display unit 160.

  The movement of the probe 110 further includes rotation of the probe 110 in the θ direction by the arm rotating unit 121 as shown in FIGS. 6 (A) and 6 (B). The rotation of the probe 110 is such that a line 113 (shown by a dotted line in FIG. 6B) connecting the tips of the terminals 112a, 112b, and 112c as shown in FIG. This is done so that the parallelism can be achieved.

  The movement of the probe 110 further includes movement of the probe 110 in the z direction as shown in FIG. By moving the probe 110 in the z direction, the tips of the terminals 112a, 112b, and 112c are brought close to or in contact with the measured pads 210a, 210b, and 210c of the measured object 200. If the parallelism between the terminals 112a, 112b, and 112c and the DUT 200 matches, the terminals 112a, 112b, and 112c come into contact with the DUTs 210a, 210b, and 210c at a time.

  After the terminals 112a, 112b, and 112c contact the pads to be measured 210a, 210b, and 210c, for example, a predetermined signal is input to the device to be measured 200, and the output is detected by the terminals 112a, 112b, and 112c. The probe device 100 uses the signal processing unit 140 to measure the electrical characteristics of the DUT 200 using the outputs detected at the terminals 112a, 112b, and 112c.

  When measurement is performed on another measurement location on the same measurement object 200 or another measurement object 200, the other measurement measurement points or measurement pads 210a, 210b, The probe 110 may be moved to 210c for measurement.

  By the way, in such probe measurement, the movement (alignment) in the x, y and z directions between the probe 110 and the DUT 200 is relatively observed while observing the image acquired by the acquisition unit 150. It can be done easily. On the other hand, it is difficult to determine the parallelism between the terminals 112a, 112b, and 112c and the device under test 200 from an image acquired by the acquisition unit 150 provided above the device under test 200. Note that the position where the rotation of the probe 110 in the θ direction can be observed has a spread in the x and y directions of the DUT 200, and an acquisition unit 150 using a camera or the like may be provided from the viewpoint of the focal length. difficult.

As a method for matching the parallelism between the probe 110 and the DUT 200, for example, the following can be considered.
FIG. 8 is a diagram for explaining an example of alignment adjustment. FIG. 8 is a plan view including the terminal portion of the probe.

  For example, a substrate 1000 having a shape similar to that of the DUT 200 and having a scratch (scratch) 1001 on the surface when the probe 110 is pressed and pulled is prepared. When the probe 110 is pressed against the substrate 1000 and pulled, a larger scratch 1001 is formed as the terminals 112a, 112b, and 112c are strongly pressed. In the example of FIG. 8, it can be seen that the terminal 112 a is most strongly pressed against the substrate 1000, and then the terminal 112 b and the terminal 112 c are not in contact with the substrate 1000.

  If the size of the scratches 1001 formed by the terminals 112a, 112b, and 112c is the same, the parallelism between the terminals 112a, 112b, and 112c and the substrate 1000 is matched. The probe 110 is rotated so that the sizes of the scratches 1001 are the same, thereby matching the parallelism between the terminals 112a, 112b, and 112c and the substrate 1000.

  After aligning the parallelism between the probe 110 and the substrate 1000 in this manner, the substrate 1000 and the DUT 200 are replaced while the rotational position (angle) of the probe 110 is maintained. Thus, if the probe 110 is moved in the x and y directions to align with the measured pad portion 210 and further moved in the z direction, the terminals 112a, 112b, and 112c are measured at a time in the measured pads 210a and 210b. 210c can be brought into contact with each other.

  In the method as shown in FIG. 8, when there is only one measurement location per measurement object 200, or even if there is a plurality of measurement locations in one measurement object 200, the measurement object 200 is It is easy to use when it is relatively flat such as a wafer. Once the angle of the probe 110 is adjusted using the substrate 1000, even if the measurement location changes, the terminal 112a, 112b, This is because 112c can be brought into contact with each measurement location at once.

  However, in the case of the DUT 200 whose parallelism with the probe 110 changes for each measurement location, the method as shown in FIG. 8 is difficult to use. This point will be described with reference to FIG. 9, taking a circuit board such as a printed board as an example.

FIG. 9 is a diagram illustrating an example of probe measurement of a circuit board.
When a circuit board 200A such as a printed board is used as the object to be measured 200, the circuit board 200A may be deformed such as warpage or swell. For example, as shown in FIG. 9, the circuit board 200 </ b> A is warped, and the measurement using the probe 110 is performed on different measurement locations 201, 202, and 203 of the circuit board 200 </ b> A warped in this way. Suppose. It is assumed that measured pads 210a, 210b, and 210c exist at each measurement location 201, 202, and 203.

  Here, if the probe 110 is preliminarily adjusted to a certain angle, and the angle 110 is maintained, the probe 110 may be brought into contact with the measurement points 201, 202, and 203, and the situation shown in FIG. 9 may occur.

  That is, in the measurement location 201 on one end side of the circuit board 200A that is greatly warped, the terminal 112a is in contact with the measured pad 210a, but the terminals 112b and 112c are not in contact with the measured pads 210b and 210c and are in a floating state. become. Similarly, in the measurement location 202 having a warp that is smaller than the measurement location 201, the terminal 112a is in contact with the measured pad 210a, but the terminals 112b and 112c are not in contact with the measured pads 210b and 210c. At the measurement location 203 on the other end side of the circuit board 200A, the terminal 112c contacts the measured pad 210c, but the terminals 112a and 112b do not contact the measured pads 210a and 210b.

  Thus, when the parallelism between the measured pads 210a, 210b, and 210c and the terminals 112a, 112b, and 112c varies depending on the measurement points 201, 202, and 203, the parallelism is determined for each of the measurement points 201, 202, and 203. adjust.

  At this time, if the degree of parallelism is adjusted by the method shown in FIG. 8, the warp of the circuit board 200A is different at each measurement location 201, 202, 203, and thus has the same shape as the circuit board 200A. It is difficult to prepare a substrate 1000 for forming scratches. It is also possible to place the substrate 1000 at an angle in accordance with each warp shape at each measurement location 201, 202, 203, and then adjust the parallelism by the method shown in FIG. However, for each measurement location 201, 202, 203, the tilt adjustment of the substrate 1000, the formation of scratches, and the angle (parallelism) adjustment of the probe 110 are performed, which complicates the probe measurement process.

  In addition to the method of adjusting the parallelism using the scratch-forming substrate 1000 in advance as described above, the terminals 112a, 112b, and 112c of the probe 110 are made elastic so that all contact with the pads 210a, 210b, and 210c to be measured. A method of pushing up to is also conceivable.

FIG. 10 is a diagram illustrating another example of probe measurement of a circuit board.
For example, at the measurement location 201 in FIG. 9, after the terminal 112 a comes into contact with the measured pad 210 a, the probe 110 is further moved in the z direction until the terminals 112 b and 112 c come into contact with the measured pads 210 b and 210 c. Thereby, as shown in FIG. 10, it is possible to obtain a state in which all of the terminals 112a, 112b, and 112c are in contact with the pads to be measured 210a, 210b, and 210c. At this time, at least the terminals 112a and 112b are deformed by being pressed until the terminal 112c contacts the pad to be measured 210c.

  The same measurement can be performed at the other measurement points 202 and 203. However, if the warp shape is different for each of the measurement points 201, 202, and 203, the degree of deformation of each of the terminals 112a, 112b, and 112c is different for each of the measurement points 201, 202, and 203.

  The probe 110 is calibrated in advance before measurement, but in the method as shown in FIG. 10, the shapes of the terminals 112a, 112b, and 112c may be different from those at the time of calibration due to the deformation. . Further, there may be a case where a terminal having a different shape from the other terminals appears in the probe 110 in contact with a certain measurement location. In these cases, the capacitance between the ground terminal and the signal terminal in the probe 110 may vary depending on the measurement locations 201, 202, and 203. In such a case, there is a possibility that an appropriate measurement result cannot be obtained for each of the measurement points 201, 202, and 203, and for the entire circuit board 200A.

  Although different measurement locations 201, 202, and 203 in one circuit board 200A have been described here, it may happen that an appropriate measurement result cannot be obtained between different circuit boards 200A as well.

  Therefore, in the probe measurement using the probe apparatus 100, the shadows of the terminals 112a, 112b, and 112c projected onto the circuit board 200A are used for adjusting the parallelism between the circuit board 200A and the probe 110.

11 and 12 are explanatory diagrams of an example in which the shadow of the terminal is projected on the circuit board, where (A) is a plan view, (B) is a front view, and (C) is a side view.
In the probe apparatus 100, as shown in FIG. 3, an irradiation unit 130 is provided below the arm unit 120, and light 131 is irradiated from the irradiation unit 130 toward the probe 110. The light 131 emitted from the irradiation unit 130 illuminates the probe 110 from the lower side (back side), and a shadow 300 of the terminals 112a, 112b, and 112c is projected onto the circuit board 200A by the light 131.

  For example, in the case of the measurement locations 201 and 202 in FIG. 9, as shown in FIG. 11A, each terminal 112 a, 112 b, The shadows 300a, 300b, and 300c of 112c are projected onto the circuit board 200A. The shadow 300a of the terminal 112a (FIG. 11B) that is closest to the circuit board 200A extends from the vicinity of the tip of the terminal 112a when viewed from above as shown in FIG. 11A. As shown in FIG. 11 (A), the distance between the tip of the terminal 112b (FIG. 11 (B)) and the tip of the shadow 300b of which the distance from the circuit board 200A is larger as seen from above. It is wider than the distance between the terminal 112a and its shadow 300a. The distance between the terminal 112c (FIG. 11B), which is the farthest from the circuit board 200A, and the tip of the shadow 300c when viewed from above is further as shown in FIG. 11A. spread.

  The same can be said for the measurement point 203 in FIG. That is, as shown in FIG. 12A, the shadows 300a, 300b, and 300c of the terminals 112a, 112b, and 112c are formed on the circuit board 200A by the light 131 from the irradiation unit 130 (FIG. 12C). Is projected. The shadow 300c of the terminal 112c (FIG. 12B) that is closest to the circuit board 200A extends from the vicinity of the tip of the terminal 112c when viewed from above as shown in FIG. 12A. Then, as shown in FIG. 12 (A), as the distance from the circuit board 200A increases in the order of the terminals 112b and 112a (FIG. 12 (B)), the tip of those and the tips of the shadows 300b and 300a, The interval when viewed from above increases.

  As described above, the shadows 300a, 300b, and 300c are projected onto the circuit board 200A in positions and shapes that reflect the difference in distance between the terminals 112a, 112b, and 112c and the circuit board 200A. In other words, if the positions and shapes of the shadows 300a, 300b, and 300c on the circuit board 200A are viewed, the positional relationship between the terminals 112a, 112b, and 112c and the circuit board 200A at that time can be obtained.

  Therefore, the probe apparatus 100 acquires an image of the region as shown in FIG. 11A or FIG. 12A from the upper side of the circuit board 200A by the acquisition unit 150 and displays it on the display unit 160. The operator can determine the positional relationship between the terminals 112a, 112b, and 112c and the circuit board 200A by viewing the image.

FIG. 13 is a diagram for explaining an example of adjusting the parallelism in the probe device.
For example, when matching the parallelism between the probe 110 and the circuit board 200A based on the image acquired by the acquisition unit 150 and displayed on the display unit 160, while looking at the positions and shapes of the shadows 300a, 300b, and 300c, The probe 110 is rotated by the arm rotating unit 121. Here, the probe 110 in which the tip positions of the terminals 112a, 112b, and 112c are aligned is used. However, as shown in FIG. Until the probe 110 is rotated. By rotating the probe 110 in this way, the parallelism between the probe 110 and the circuit board 200A can be matched.

  The images of the shadows 300a, 300b, and 300c become clearer as the distance between the terminals 112a, 112b, and 112c and the circuit board 200A becomes shorter. When the distance from the circuit board 200A is increased with the rotation of the probe 110 and the shadow image becomes unclear, the probe 110 is appropriately moved in the z direction and brought close to the circuit board 200A. You may make it rotate. Of course, as the probe 110 rotates, movement (position alignment) in the x and y directions may be performed.

  After adjusting the parallelism between the probe 110 and the circuit board 200A and aligning the terminals 112a, 112b, and 112c with the pads to be measured 210a, 210b, and 210c in the x and y directions, the probe 110 is moved in the z direction (the circuit board 200A). To the side). Thus, the terminals 112a, 112b, and 112c can be brought into contact with the measured pads 210a, 210b, and 210c at a time.

  After the terminals 112a, 112b, and 112c are brought into contact with the pads to be measured 210a, 210b, and 210c, for example, a predetermined signal is input to the circuit board 200A and the output is detected by the terminals 112a, 112b, and 112c. The probe device 100 measures the electrical characteristics of the circuit board 200 </ b> A by the signal processing unit 140 using the outputs detected by the terminals 112 a, 112 b, and 112 c.

  Thus, the parallelism can be appropriately adjusted by using the shadows 300a, 300b, and 300c of the terminals 112, 112b, and 112c for the parallelism of the probe 110 and the circuit board 200A. Further, the parallelism adjustment using the shadows 300a, 300b, and 300c can be easily and appropriately performed for each of the measurement locations 201, 202, and 203 having different deformation states. In order to adjust the parallelism, it is not necessary to separately use the scratch forming substrate 1000 as described above. Therefore, it is possible to adjust the parallelism with the probe 110 at various measurement locations including the measurement locations 201, 202, and 203 on the circuit board 200A and obtain appropriate measurement results.

  Here, the parallelism alignment between the probe 110 using the shadow 300 and the circuit board 200A has been described as an example. Such parallelism adjustment using the shadow 300 can also be applied to parallelism adjustment between the probe 110 and various objects 200 to be measured, for example, a relatively flat object such as a wafer.

  Even in a relatively flat object 200, if the distance between the terminals 112a, 112b, and 112c and the object 200 is not properly adjusted, an appropriate measurement result cannot be obtained. For example, a terminal that does not come into contact with the measured pad may appear in the probe 110, or deformation may occur when the terminal is pressed using elasticity. Even for a relatively flat object 200, by adjusting the parallelism using the shadow 300 as described above, it is possible to avoid non-contact and deformation of the terminal and obtain an appropriate measurement result. It becomes possible. In the case of a relatively flat object to be measured 200, the shadow 300 as described above is obtained after the parallelism is adjusted with the substrate 1000 for forming scratches, or without the parallelism adjustment with such a substrate 1000. It is possible to perform parallelism alignment using.

  In the probe device 100, the irradiation unit 130 is provided below the arm unit 120. Now, let α be the angle formed by the terminal portion 112 and the device under test 200 when the parallelism of the probe 110 and the device under test 200 matches, and the direction of irradiation of the light 131 from the irradiation unit 130 and the device under test 200. Let β be the angle between. At this time, in order to project the shadow 300 on the DUT 200 by the light 131 irradiated from the irradiation unit 130 toward the probe 110, it is desirable that the condition of tan β <tan α is satisfied. For example, when the angle α formed between the terminal portion 112 and the device under test 200 is tan α = about 0.3 to 0.4, the angle β formed between the irradiation direction of the light 131 and the device under test 200 is tan β = It should be about 0.2.

  In setting tan β, it is preferable to set the upper limit of tan β by setting the irradiation unit 130 at a position where the arm 131 and the probe housing unit 111 do not largely block the light 131. This is because as the light 131 is blocked before reaching the terminal portion 112, the shadow 300 projected on the object 200 to be measured becomes thinner and difficult to see. Further, the lower limit of tan β is set so that the shadow 300 cannot be projected due to the unevenness of the object 200 to be measured, or the shadow 300 is excessively spread on the object 200 and the clear shadow 300 is not projected. Good. Since the upper limit and the lower limit of tan β can vary depending on the structure of the probe 110 and the arm unit 120, the light reflection characteristics, unevenness, and the like of the object to be measured 200, it is desirable to be able to adjust as appropriate.

Next, a second embodiment will be described.
FIG. 14 is a diagram illustrating an example of a probe device according to the second embodiment.
In the probe device 100B shown in FIG. 14, the irradiation unit 130 is provided on the upper side of the arm unit 120, that is, on the side opposite to the side of the arm unit 120 facing the object to be measured 200. In the probe apparatus 100B, the light 131 is irradiated from the irradiation unit 130 provided on the upper side of the arm unit 120 toward the probe 110 in this way.

FIG. 15 is an explanatory diagram of an example in which the shadow of the terminal is projected onto the object to be measured, where (A) is a plan view, (B) is a front view, and (C) is a side view.
In the probe device 100B, as shown in FIGS. 14 and 15C, the probe 110 is illuminated with light 131 from above. Therefore, as shown in FIG. 15A, the shadows 300a, 300b, and 300c of the terminals 112a, 112b, and 112c are projected onto the DUT 200 so as to extend below and beyond the probe 110. become. Thus, even when the light 131 is irradiated from the upper side of the probe 110, the shadows 300a, 300b, and 300c are distances between the terminals 112a, 112b, and 112c as shown in FIG. Are projected onto the DUT 200 in a position and shape reflecting the difference.

  The probe device 100 </ b> B acquires an image as shown in FIG. 15A from the upper side of the DUT 200 by the acquisition unit 150 and displays it on the display unit 160. The operator looks at the image and obtains the positional relationship between the terminals 112a, 112b, and 112c and the DUT 200.

  For example, the operator rotates the probe 110 while viewing the positions and shapes of the shadows 300a, 300b, and 300c, and adjusts the parallelism with the DUT 200. Then, after adjusting the parallelism between the probe 110 and the DUT 200 and aligning the probe 110 in the x and y directions, the probe 110 is moved in the z direction and brought into contact with the DUT 200. Thereby, the terminals 112a, 112b, and 112c are brought into contact with the measured pads 210a, 210b, and 210c at a time. Thereafter, for example, a predetermined signal is input to the device under test 200, the output is detected by the terminals 112a, 112b, and 112c, and the electrical characteristics are measured by the signal processing unit 140.

  Also with such a probe device 100B, the parallelism between the probe 110 and the object to be measured 200 can be easily and appropriately performed for each measurement location of the object to be measured 200 according to the deformation. Thereby, it is possible to adjust the parallelism with the probe 110 at various measurement locations of the DUT 200 and obtain appropriate measurement results.

Next, a third embodiment will be described.
FIG. 16 is a diagram illustrating an example of a probe according to the third embodiment, in which (A) is a plan view, (B) is a front view, and (C) is a side view.

  In addition to the three terminals 112a, 112b, and 112c, the probe 110D shown in FIG. 16 is provided with a dummy terminal 112d that does not contribute to signal input / output and is aligned with the tip position at the outermost end. For example, in the probe apparatus 100 according to the first embodiment, a probe 110D provided with a dummy terminal 112d as shown in FIG. 16 is used instead of the probe 110. The DUT 200 is provided with a dummy pad 210d that does not contribute to signal input / output, for example, at a position corresponding to the dummy terminal 112d.

When such a probe 110D is used, the parallelism between the probe 110D and the DUT 200 can be adjusted as follows.
First, when the probe 110D is brought close to the device under test 200, the probe 110D is rotated to such an angle that the outermost dummy terminal 112d first contacts the device under test 200. That is, the probe 110D is rotated so that the distance between the dummy terminal 112d and the DUT 200 among the terminals 112a, 112b, 112c and the dummy terminal 112d of the probe 110D is the shortest. Then, the probe 110D is moved in the x and y directions, and the terminals 112a, 112b, 112c and the dummy terminal 112d are moved to the areas of the measured pads 210a, 210b, 210d and the dummy pad 210d. Next, the probe 110 </ b> D is moved in the z direction while irradiating the light 131 from the irradiating unit 130, and approaches or comes into contact with the DUT 200.

  By irradiation with light 131 (FIG. 16C), on the DUT 200, as shown in FIG. 16A, in addition to the shadows 300a, 300b, and 300c of the terminals 112a, 112b, and 112c, the dummy terminal 112d. A shadow 300d is also projected. Since the dummy terminal 112d is closest to the DUT 200 in the probe 110D (FIG. 16B), in the image displayed on the display unit 160, the distance between the dummy terminal 112d and the shadow 300d is the narrowest. If the dummy terminal 112d is in contact with the dummy pad 210d, the shadow 300d extends from the tip of the dummy terminal 112d.

  The operator rotates the probe 110D based on the positions and shapes of the shadows 300a, 300b, 300c, and 300d, and adjusts the parallelism with the DUT 200. Then, after adjusting the parallelism between the probe 110D and the DUT 200 and aligning the probe 110D in the x and y directions, the probe 110D is moved in the z direction and brought into contact with the DUT 200. Thereby, the terminals 112a, 112b, and 112c are brought into contact with the measured pads 210a, 210b, and 210c at a time. At this time, the dummy terminal 112d also comes into contact with the dummy pad 210d. Thereafter, for example, a predetermined signal is input to the device under test 200, the output is detected by the terminals 112a, 112b, and 112c, and the electrical characteristics are measured by the signal processing unit 140.

  As described above, even when the probe 110D provided with the dummy terminal 112d is used, it is possible to adjust the parallelism between the probe 110D and the DUT 200. The dummy terminal 112d itself is a dummy terminal that does not contribute to signal input / output, and it is also the dummy pad 210d that contacts it. Therefore, even when the parallelism is adjusted using the shadow 300d, even if the dummy terminal 112d comes into contact with the dummy pad 210d and as a result, some damage occurs, this is the fact that the electrical characteristics of the DUT 200 are measured. It is possible to suppress the influence on measurement results and quality.

  Here, the case where the probe 110D provided with the dummy terminal 112d is used instead of the probe 110 of the probe apparatus 100 according to the first embodiment has been described as an example. In addition, it is also possible to use a probe 110D provided with a dummy terminal 112d instead of the probe 110 of the probe apparatus 100B according to the second embodiment.

  In the probe devices 100 and 100B described above, the display unit 160 is not provided, an optical microscope is used for the acquisition unit 150, and an operator observes the optical microscope image while the probe 110, 110D and the DUT 200 are measured. It is also possible to adjust the parallelism.

  In the above description, the probe 110 in which the tip positions of the terminals 112a, 112b, and 112c are aligned, or the probe 110D in which the tip positions of the terminals 112a, 112b, 112c and the dummy terminal 112d are aligned is taken as an example. Not only the probes 110 and 110D in which the tip positions of the terminals are aligned but also the probes in which the tip positions of the terminals are not aligned, the positional relationship with the object to be measured can be obtained using the shadow. Is possible.

Regarding the embodiment described above, the following additional notes are further disclosed.
(Supplementary note 1) a probe including a plurality of terminals;
A holding unit for holding the probe;
An irradiating unit provided on the holding unit and irradiating light toward the probe;
An acquisition unit that acquires an image including shadows of the plurality of terminals projected onto the object to be measured by the light.

(Additional remark 2) The said holding | maintenance part contains the rotation part which rotates the said probe centering on the direction of this probe, The probe apparatus of Additional remark 1 characterized by the above-mentioned.
(Additional remark 3) The said holding | maintenance part is movable to a horizontal direction and a perpendicular direction,
The probe device according to appendix 1 or 2, wherein the irradiation unit is interlocked with the movement of the holding unit.

(Additional remark 4) The said irradiation part is provided in the side facing the said to-be-measured object of the said holding | maintenance part, The probe apparatus in any one of Additional remark 1 thru | or 3 characterized by the above-mentioned.
(Additional remark 5) The said acquisition part acquires the said image from the said to-be-measured object upper direction, The probe apparatus in any one of Additional remark 1 thru | or 4 characterized by the above-mentioned.

(Supplementary note 6) The probe device according to any one of supplementary notes 1 to 5, wherein the probe has tips of the plurality of terminals arranged in a straight line.
(Additional remark 7) The said irradiation part contains a parallel light source, The probe apparatus in any one of Additional remark 1 thru | or 6 characterized by the above-mentioned.

(Additional remark 8) The probe apparatus in any one of additional remark 1 thru | or 7 further including the display part which displays the said image acquired by the said acquisition part.
(Supplementary note 9) The probe device according to any one of supplementary notes 1 to 8, wherein an outermost terminal among the plurality of terminals is a dummy terminal.

(Additional remark 10) The process of irradiating light toward the said probe from the irradiation part provided in the holding | maintenance part holding the probe containing a some terminal,
And a step of acquiring, by an acquisition unit, an image including shadows of the plurality of terminals projected onto the object to be measured by the light.

  (Additional remark 11) The probe measuring method of Additional remark 10 characterized by further including the process of displaying the said image acquired by the said acquisition part by a display part.

10, 100, 100B Probe device 11, 110, 110D Probe 11a, 11b, 11c, 112a, 112b, 112c Terminal 12 Holding unit 13, 130 Irradiation unit 13a, 131 Light 14, 150 Acquisition unit 20, 200 Device under test 30, 30a, 30b, 30c, 300, 300a, 300b, 300c, 300d Shadow 111 Probe housing part 112 Terminal part 112d Dummy terminal 113 Dotted line 120 Arm part (holding part)
121 Arm Rotating Unit 122 Arm Fixing Unit 140 Signal Processing Unit 160 Display Unit 200A Circuit Board (Measurement Object)
201, 202, 203 Measurement point 210 Pad portion under measurement 210a, 210b, 210c Pad under measurement 210d Dummy pad 1000 Substrate 1001 Scratch

Claims (5)

A probe including a plurality of terminals disposed above the object to be measured and extending to one side of the side;
A holding unit disposed above the object to be measured and holding the other side of the probe opposite to the one side;
It is disposed above the object to be measured , provided on the side of the holding part facing the object to be measured, and is directed toward the plurality of terminals toward the direction in which the terminals of the probe extend. Irradiating part for irradiating
Characterized in that it comprises a said arranged above the object to be measured, obtaining an image including the shadow of the plurality of terminals to be projected onto the object to be measured by the light, to obtain from the top of the object to be measured unit The probe device.   The probe apparatus according to claim 1, wherein the holding unit includes a rotating unit that rotates the probe about the direction of the probe. The holding part is movable in the horizontal direction and the vertical direction,
The probe device according to claim 1, wherein the irradiation unit is interlocked with the movement of the holding unit. Probe device according to any one of claims 1 to 3, further comprising a display unit for displaying the image acquired by the acquisition unit. A probe including a plurality of terminals disposed above the object to be measured and extending to one side of the side;
A holding unit disposed above the object to be measured and holding the other side of the probe opposite to the one side;
An irradiation unit disposed above the object to be measured and provided on a side of the holding unit facing the object to be measured;
An acquisition unit disposed above the object to be measured;
A probe measurement method using a probe device including:
From the irradiation unit, towards the plurality of terminals of said probe extends, to the plurality of terminals, comprising the steps of irradiating light,
Probe measurement method which comprises a step of obtaining the image including the shadow of the plurality of terminals to be projected onto the object to be measured, by the acquisition section from above of the object to be measured by the light.

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