JP5752466B2 - Board inspection equipment - Google Patents

Description

  The present invention relates to a substrate inspection apparatus that performs an electrical inspection on a substrate based on an electrical signal input / output via an inspection probe probed on the substrate.

  As this type of substrate inspection apparatus, a contact probe movable substrate double-side inspection apparatus (hereinafter also referred to as “substrate inspection apparatus”) disclosed in Japanese Patent Laid-Open No. 7-35808 is known. The substrate inspection apparatus includes a plurality of XY robots, a plurality of vertical slide mechanisms, a plurality of contact probes, a calculator, a control information processing unit, and the like. In this board inspection apparatus, the control information processing unit controls each XY robot based on CAD data or the like, and individually moves each contact probe in the XY direction. In addition, the control information processing unit controls each vertical slide mechanism to move each contact probe upward (or downward), thereby causing each contact probe to contact (probing) the substrate. Further, the calculator measures the resistance value based on the electric signal input through each contact probe, and the control information processing unit organizes the measurement data.

JP-A-7-35808 (page 6, FIG. 1)

  However, this type of conventional substrate inspection apparatus including the above-described substrate inspection apparatus has the following problems. That is, in this type of substrate inspection apparatus, the control information processing unit controls each XY robot based on CAD data or the like input in advance, and performs probing by moving each contact probe individually. On the other hand, for example, when performing an inspection that is susceptible to noise, such as determining the quality of an object based on a slight difference in resistance value, using this type of substrate inspection apparatus, the influence of noise is suppressed. Therefore, the shields provided in the contact probes may be connected with a cable. Here, in order to reduce noise pickup by the cable itself, the length of this type of cable is defined to be relatively short. For this reason, when the distance between the contact probes exceeds the length of the cable (cable length), the cable is cut or the end of the cable is connected (the end of the contact probe or the contact There is a possibility that the holding portion holding the probe may be damaged by impact. In this case, the cable length is input in advance, and when the distance between each probing point where each contact probe should be probed is longer than the already input cable length, the contact probe is stopped (or moved). A method of eliminating such an inconvenience by controlling the XY robot by the control information processing unit (so as not to start) is also conceivable. However, for example, when two contact probes are moved from the initial position to two probing points, one contact probe is moved to the target probing point, and then the other contact probe is moved to the target probing point. When a movement control program is created (so that each contact probe is separated), even if the distance between each probing point that is the movement destination is shorter than the cable length, the movement of the contact probe Since the distance between the contact probes exceeds the cable length, there is still a problem that the cable may be cut or the contact probe may be broken.

  The present invention has been made in view of such problems, and each inspection probe is determined in advance while preventing breakage of a cable connecting the plurality of inspection probes, the probe holding portion, and the inspection probe. It is a main object to provide a substrate inspection apparatus that can be moved and inspected within a moving range.

In order to achieve the above object, the substrate inspection apparatus according to claim 1 holds the inspection probes and moves a pair of probe holders connected to each other by a cable along the surface of the substrate to be inspected. A probe for probing the probe for inspection, a controller for controlling the probe, and an electric signal to be input / output via each inspection probe probed by the probing unit. A substrate inspection apparatus including an inspection unit that performs an inspection, and detects a separation state in which a distance between each of the inspection probes held by each of the probe holding units is equal to or greater than a predetermined upper limit distance A detecting unit that performs the movement of the probe holding units along the surface of the substrate. The probing unit is controlled based on the detection result of the separation state by the detection unit, and the distance between the inspection probes held by the probe holding units is less than the upper limit distance. Let it be maintained.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the control unit moves the probe holding units along the surface of the substrate. A movement path for moving each probe holding portion from the initial position to the target position while maintaining the distance between the inspection probes held by each of the inspection probes to be equal to or less than a specified distance shorter than the upper limit distance. And when the distance between the inspection probes held by the probe holders during the movement of the probe holders along the movement path exceeds the specified distance, the movement path And the movement of each probe holding part is continued, and the separation by the detection part during the movement of each probe holding part along the movement path. When the condition is detected to stop the movement of the respective probe holder.

  The substrate inspection apparatus according to claim 3 is the substrate inspection apparatus according to claim 1 or 2, wherein the detection unit has a distance between the inspection probes held by the probe holding units in advance. A proximity state that is equal to or less than a determined lower limit distance is configured to be detected, and the control unit detects the proximity state by the detection unit when moving each probe holding unit along the surface of the substrate. The probing unit is controlled based on the above, and the state in which the distance between the inspection probes held by the probe holding units exceeds the lower limit distance is maintained.

  Further, the substrate inspection apparatus according to claim 4 is the substrate inspection apparatus according to any one of claims 1 to 3, wherein the detection unit is held between the inspection probes respectively held by the probe holding units. In the first direction between the inspection probes respectively held by the probe holding portions, and the first separation state as the separation state in which the distance along the first direction is not less than the first upper limit distance. The second separation state as the separation state in which the distance along the orthogonal second direction is equal to or greater than the second upper limit distance can be detected, and the control unit moves the probe holding units along the surface of the substrate. The probing unit is controlled based on the detection results of the first separation state and the second separation state by the detection unit, and the probe holding units respectively The distance between the inspection probes held in the first direction is less than the first upper limit distance, and the distance between the inspection probes in the second direction is less than the second upper limit distance. To maintain the state.

  The substrate inspection apparatus according to claim 5 is the substrate inspection apparatus according to any one of claims 1 to 4, wherein the detection unit is held between the inspection probes respectively held by the probe holding units. The first proximity state as the proximity state in which the distance along the A direction is equal to or less than the first lower limit distance, and the A direction between the inspection probes respectively held by the probe holding portions. The second proximity state as the proximity state in which the distance along the B direction is equal to or less than the second lower limit distance can be detected, and the control unit moves the probe holding units along the surface of the substrate. In this case, the probing unit is controlled based on the detection results of the first proximity state and the second proximity state by the detection unit, and each probe holding unit holds the probe. The distance along the A direction between the inspection probes that exceeds the first lower limit distance, and the distance along the B direction between the inspection probes exceeds the second lower limit distance. Let

  In the substrate inspection apparatus according to claim 1, when the control unit moves each probe holding unit along the surface of the substrate, the control unit is held by each probe holding unit based on the detection result of the separated state by the detection unit. The state in which the distance between the inspection probes is less than the upper limit distance is maintained. For this reason, according to this board inspection apparatus, for example, when a cable for shield connection is provided between the probe holding portions, the length of the cable (or a length slightly shorter than the length of the cable) As a result of prescribing as a predetermined distance, it is possible to reliably prevent movement of each inspection probe held by each probe holding portion beyond the length of the cable. Each inspection probe can be moved and inspected while reliably preventing damage to the cable and damage to the probe holding portion and the inspection probe to which the end of the cable is connected.

  In the substrate inspection apparatus according to claim 2, when the control unit moves each probe holding unit along the surface of the substrate, the control unit specifies a moving path and moves each probe holding unit along the moving path. When the distance between the probes for inspection held by each probe holding part exceeds the specified distance, the movement path is corrected and the movement of each probe holding part is continued, and each probe along the movement path is continued. When the detection unit detects a separation state during the movement of the holding unit, the movement of each probe holding unit is stopped. For this reason, according to this board inspection apparatus, when the distance between the probes for inspection exceeds the specified distance, that is, when the cable is disposed between the probe holding portions, the cable is disconnected. At the stage where there is still a margin, the movement path is corrected and the movement of the probe holding unit is continued, and the distance between each inspection probe exceeds the upper limit distance, that is, the stage where there is no margin before the cable is cut. The movement of the probe holder can be immediately stopped.

  In the substrate inspection apparatus according to claim 3, the detection unit is configured to be able to detect a proximity state in which the distance between the inspection probes held by the probe holding units is equal to or less than a lower limit distance, and the control unit However, when each probe holding part is moved along the surface of the substrate, the distance between the inspection probes is maintained in a state exceeding the lower limit distance based on the detection result by the detection part. For this reason, according to this board | substrate inspection apparatus, as a result which can prevent reliably the movement which each probe for each holding | maintenance by each probe holding part and each probe holding part contact, It is possible to reliably prevent the inspection probe and the probe holder from being damaged due to the contact.

  In the substrate inspection apparatus according to claim 4, the detection unit includes a first separation state in which the distance along the first direction between the inspection probes is equal to or greater than the first upper limit distance, and the first separation state between the inspection probes. The second separation state in which the distance along the two directions is equal to or greater than the second upper limit distance can be detected, and when the control unit moves each probe holding unit along the surface of the substrate, the detection result by the detection unit The distance along the first direction between the inspection probes is less than the first upper limit distance and the distance between the inspection probes along the second direction is less than the second upper limit distance. Therefore, according to this substrate inspection apparatus, for example, a detection unit having a simple configuration including two sensors, that is, a photoelectric sensor that performs detection in the first direction and a photoelectric sensor that performs detection in the second direction. As a result of reliably detecting the first separated state and the second separated state, the cable, the probe holding portion, and the inspection probe disposed between the probe holding portions are damaged while reducing the cost of the substrate inspection apparatus. Can be reliably prevented.

In the substrate inspection apparatus according to claim 5, the detection unit includes a first proximity state in which a distance along the A direction between the inspection probes is equal to or less than a first lower limit distance, and a B direction between the inspection probes. Is configured to be able to detect the second proximity state in which the distance along the distance is equal to or less than the second lower limit distance, and when the control unit moves each probe holding unit along the surface of the substrate, based on the detection result by the detection unit The distance along the A direction between the inspection probes exceeds the first lower limit distance, and the distance along the B direction between the inspection probes exceeds the second lower limit distance Lb2. Therefore, according to this substrate inspection apparatus, the first proximity state and the detection unit having a simple configuration including two sensors, that is, a photoelectric sensor that performs detection in the A direction and a photoelectric sensor that performs detection in the B direction, As a result of reliably detecting the second proximity state, it is possible to reliably prevent the inspection probe and the probe holding portion from being damaged due to mutual contact while reducing the cost of the substrate inspection apparatus.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. 3 is a plan view of a substrate holding unit 2 and a probing unit 3. FIG. FIG. 3 is a configuration diagram illustrating configurations of a detection unit 4 and a first moving mechanism 11. It is a figure which shows 1st tolerance | permissible_range R1 and 2nd tolerance | permissible_range R2. 5 is a flowchart of a probing control process 50. It is a 1st explanatory view explaining probing control processing 50. It is the 2nd explanatory view explaining probing control processing 50. FIG. 4 is an explanatory diagram illustrating the configuration and operation of a probing unit 3.

  Embodiments of a substrate inspection apparatus according to the present invention will be described below with reference to the accompanying drawings.

  Initially, the structure of the board | substrate inspection apparatus 1 shown in FIG. 1 as an example of a board | substrate inspection apparatus is demonstrated. As shown in the figure, the substrate inspection apparatus 1 includes a substrate holding unit 2, a probing unit 3, a detection unit 4, an inspection unit 5, an operation unit 6, a storage unit 7, a display unit 8, and a control unit 9, for example. 2 is configured to be able to perform an electrical inspection on the substrate 100 shown in FIG.

  Here, as an example, as shown in FIG. 2, the substrate 100 is a multi-sided substrate having a plurality of (in this example, 24) pieces 101 separated from each other after the inspection is completed, and is generally abbreviated as a whole. It is formed in a rectangle.

  The substrate holding unit 2 includes a mounting table 2a (see FIG. 2) on which the substrate 100 is mounted. In this case, the mounting table 2a is configured to be able to suck and hold the mounted substrate 100 as an example.

  As shown in FIGS. 1 and 2, the probing unit 3 includes a first moving mechanism 11, a plurality (two in this example) of second moving mechanisms 12 a and 12 b (hereinafter referred to as “second moving mechanism 12” unless otherwise distinguished). And the same number (two in this example) of probe holding portions 13a and 13b (hereinafter also referred to as “probe holding portion 13” when not distinguished), and the probe holding portions 13a and 13b. A probing process in which the tip portions of the inspection probes 41 and 41 held therein are brought into contact (probing) with a probing point on the substrate 100 is configured to be executable.

  As shown in FIG. 2, the first moving mechanism 11 is disposed above the substrate holding unit 2, and the surface of the substrate 100 held by the substrate holding unit 2 (that is, placing the mounting table on the substrate holding unit 2). Each probe holding portion 13 is configured to be movable along the plane (hereinafter, the direction along the plane is also referred to as “XY direction”). Specifically, as an example, the first moving mechanism 11 includes guide rails 21a to 21d (hereinafter, also referred to as “guide rail 21” when not distinguished) and sliders 22a to 22f (hereinafter, referred to as the figure). When not distinguished, it is also referred to as “slider 22”), and the first X-axis motor 23a, the first Y-axis motor 23b, the second X-axis motor 23c, and the second Y-axis motor 23d shown in FIG.

  As shown in FIG. 2, the guide rails 21a and 21b are arranged in parallel. The sliders 22a and 22b are disposed on the guide rail 21a so as to be slidable along the length direction of the guide rail 21a (corresponding to the first direction and the A direction and the X direction shown in the figure). The sliders 22c and 22d are The guide rail 21b is slidably disposed along the length direction (X direction) of the guide rail 21b. Both ends of the guide rail 21c are fixed to the sliders 22a and 22c so as to be orthogonal to the guide rails 21a and 21b, and the guide rail 21d is orthogonal to the guide rails 21a and 21b. Both ends thereof are fixed to the sliders 22b and 22d.

  As shown in FIG. 2, the slider 22e is along the length direction of the guide rail 21c (the second direction perpendicular to the first direction and the B direction perpendicular to the A direction, and the Y direction shown in FIG. 2). The slider 22f is disposed on the guide rail 21d so as to be slidable along the length direction (Y direction) of the guide rail 21d. In this case, the sliders 22a and 22c are driven by a first X-axis motor 23a (see FIG. 3), and the sliders 22b and 22d are driven by a second X-axis motor 23c (see FIG. 3), and each is disposed. It is slid along the guide rail 21 that is present. The slider 22e is driven by a first Y-axis motor 23b (see the same figure), and the slider 22f is driven by a second Y-axis motor 23d (see the same figure) to the guide rail 21 on which each is disposed. Slide along.

  As shown in FIG. 2, the second moving mechanism 12a is disposed on the slider 22e of the first moving mechanism 11, and moves the probe holding portion 13a in the vertical direction (Z direction orthogonal to the XY direction). Further, as shown in the figure, the second moving mechanism 12b is disposed on the slider 22f of the first moving mechanism 11, and moves the probe holding portion 13b in the vertical direction.

  Each of the probe holding portions 13a and 13b is configured to be able to hold the inspection probe 41 and is moved in the vertical direction by the second moving mechanism 12. Further, as shown in FIG. 2, a cable 42 is bridged between the probe holding portions 13a and 13b. This cable 42 is a cable for electrically connecting shields (not shown) provided in each probe 41 to be held by each probe holding portion 13a, 13b. It is connected to the end of each inspection probe 41 via the parts 13a and 13b.

  Here, when an electrical inspection is performed on each piece 101 in the multi-chamfer substrate 100 shown in FIG. 2, the maximum separation distance between the two inspection probes 41, 41 is set to the length of the diagonal line of the piece 101. Even if prescribed, each inspection probe 41, 41 can be probed to any two probing points on each piece 101. On the other hand, it is preferable to use a cable 42 that is as short as possible in order to reduce noise pick-up by the cable 42 itself. For this reason, in this example, a cable 42 having a length Ld slightly longer than the length of the diagonal line of the piece 101 of the substrate 100 is used.

  The detection unit 4 is configured to be able to detect a first separation state and a second separation state, which will be described later, and a first proximity state and a second proximity state, which will be described later. Specifically, as shown in FIG. 2, the detection unit 4 includes, as an example, arms 31a to 31d, photoelectric sensors 32a to 32d (see also FIG. 3; hereinafter referred to as “photoelectric sensor 32” when not distinguished) and Reflecting plates 33a and 33b (hereinafter also referred to as “reflecting plate 33” when not distinguished) are configured.

  In this case, as shown in FIG. 2, the arm 31a is attached to the slider 22a, and the arm 31b is attached to the slider 22b. The arm 31c is attached to the slider 22e, and the arm 31d is attached to the slider 22f. The photoelectric sensors 32a and 32b are attached to the arm 31a, and the photoelectric sensors 32c and 32d are attached to the arm 31c. The reflection plate 33a is attached to the arm 31b, and the reflection plate 33b is attached to the arm 31d.

  Each photoelectric sensor 32 is, for example, a reflective photoelectric sensor, and detects the presence or absence (strongness) of the reflected light by irradiating detection sensor light. In this case, the reflected light is strong when the reflecting plate 33 is located in front of the photoelectric sensor 32 (opposite position), and the reflected light is weak when the reflecting plate 33 is not located in front of the photoelectric sensor 32. 32 detects whether the reflecting plate 33 is located in front by the strength of reflected light. In the following description, a state in which the photoelectric sensor 32 detects that the reflector 33 is located on the front is also referred to as a “first detection state”, and that the reflector 33 is not located on the front. The detected state is also referred to as a “second detection state”.

  Moreover, in this detection part 4, the 1st separation along the X direction between each test | inspection probe 41 and 41 hold | maintained by each probe holding part 13a and 13b by photoelectric sensor 32a, 32b and the reflecting plate 33a, respectively. The first proximity state is detected, and the photoelectric sensors 32c and 32d and the reflection plate 33b are used to detect the first and second probes along the Y direction between the inspection probes 41 and 41 held by the probe holding portions 13a and 13b, respectively. Two separation states and a second proximity state are detected.

  Specifically, as shown in FIG. 2, the first distance Lm1 along the X direction between the inspection probes 41 and 41 held by the probe holders 13a and 13b is equal to or greater than the first upper limit distance La1. In this case, the photoelectric sensor 32a is in the second detection state, whereby the first separation state in which the first distance Lm1 is equal to or greater than the first upper limit distance La1 is detected. As shown in the figure, when the second distance Lm2 along the Y direction between the inspection probes 41 and 41 held by the probe holding portions 13a and 13b is equal to or greater than the second upper limit distance La2, The photoelectric sensor 32c enters the second detection state, thereby detecting a second separation state in which the second distance Lm2 is equal to or greater than the second upper limit distance La2.

  As shown in FIG. 8, when the first distance Lm1 between the inspection probes 41 and 41 held by the probe holders 13a and 13b is equal to or less than the first lower limit distance Lb1, the photoelectric sensor 32b is 1 detection state, whereby the first proximity state in which the first distance Lm1 is equal to or less than the first lower limit distance Lb1 is detected. As shown in the figure, when the second distance Lm2 between the inspection probes 41 and 41 held by the probe holders 13a and 13b is equal to or smaller than the second lower limit distance Lb2, the photoelectric sensor 32d is 1 detection state, whereby the second proximity state in which the second distance Lm2 is equal to or less than the second lower limit distance Lb2 is detected.

  In this case, the first upper limit distance La1 and the second upper limit distance La2 are the probe holding portions 13a and 13b over which the cable 42 is bridged (that is, the inspections held by the probe holding portions 13a and 13b, respectively). For example, the distance Ld of the cable 42 is multiplied by 1 / √2 and further 80%. The distance multiplied by the safety factor is determined in advance as the first upper limit distance La1 and the second upper limit distance La2. Further, the first lower limit distance Lb1 and the second lower limit distance Lb2 are distances that are defined so that the inspection probes 41 and 41 held by the probe holding portions 13a and 13b are not in contact with each other, It is determined in advance based on the shape of the probe holding portions 13a and 13b, the length of the inspection probe 41, and the like. In the following description, when the first separated state and the second separated state are not distinguished from each other, they are also referred to as “separated states”, and when the first adjacent state and the second separated states are not distinguished from each other, they are also referred to as “closed states”. Further, when the first distance Lm1 and the second distance Lm2 are not distinguished, they are also referred to as “distance Lm”. Further, when the first upper limit distance La1 and the second upper limit distance La2 are not distinguished, they are also referred to as “upper limit distance La”, and when the first lower limit distance Lb1 and the second lower limit distance Lb2 are not distinguished, they are also referred to as “lower limit distance Lb”.

  The inspection unit 5 performs a predetermined electrical inspection on the substrate 100 based on the electrical signal Si input through the inspection probe 41 probed on the substrate 100 under the control of the control unit 9. The operation unit 6 includes various operation switches, and outputs an operation signal when these operation switches are operated.

  The storage unit 7 stores probing data Dp for the substrate 100. In this case, the probing data Dp includes information indicating the position (XY coordinate) of the probing point at which the inspection probe 41 on the substrate 100 is to be probed. The storage unit 7 also includes a first specified distance Lc1 (see FIG. 4) defined shorter than the first upper limit distance La1 and a second specified distance Lc2 defined shorter than the second upper limit distance La2 (see FIG. 4). In the following, distance data Dd1 indicating the first specified distance Lc1 and the second specified distance Lc2 is also stored. In this case, the first specified distance Lc1 and the second specified distance Lc2 are used to determine whether or not to start the movement of the probe holding unit 13 along the XY direction, and to move the probe holding unit 13 along the moving path C (FIG. 6). , 7) is used to determine whether or not to change. Further, the storage unit 7 stores distance data Dd2 indicating the first lower limit distance Lb1 and the second lower limit distance Lb2. The display unit 8 displays the inspection result according to the control of the control unit 9.

  The control unit 9 controls each unit constituting the substrate inspection apparatus 1 according to the operation signal output from the operation unit 6. Moreover, the control part 9 performs the probing control process 50 shown in FIG. 5, controls the probing by the probing part 3, and moves each probe holding part 13. FIG. In the probing control process 50, the control unit 9, as shown in FIG. 7, sets a movement path C for moving each probe holding unit 13 along the XY direction from the initial position P1 toward the target position P2. It specifies based on the probing data Dp stored in the storage unit 7. In this case, the distance Lm between the inspection probes 41 held by the control unit 9 and each probe holding unit 13 is the first specified distance Lc1, the second specified distance Lc2, the first lower limit distance Lb1, and the second lower limit. This movement path C is specified so that each probe holding part 13 is moved while maintaining the state within the first allowable range R1 (range shown by hatching in FIG. 4) defined by the distance Lb2.

  In addition, the control unit 9 corrects the movement path C when the distance Lm between the inspection probes 41 is outside the first allowable range R1 during movement of the probe holding units 13 along the movement path C. Then, the movement of each probe holding part 13 is continued. Furthermore, the control unit 9 determines that the distance Lm between the inspection probes 41 is the first when the separation state is detected by the detection unit 4 during the movement of the probe holding units 13 along the movement path C, that is, Each probe holding portion when it is outside the second allowable range R2 defined by the upper limit distance La1, the second upper limit distance La2, the first lower limit distance Lb1 and the second lower limit distance Lb2 (the range indicated by the one-dot chain line in FIG. 4) The movement of 13 is stopped. In the drawing, a limit range R3 indicating a limit at which the cable 42 is cut by the separation of the inspection probes 41 is indicated by a broken line.

  Next, a method of performing an electrical inspection on the substrate 100 shown in FIG. 2 using the substrate inspection apparatus 1 and the operation of each part in the substrate inspection apparatus 1 at that time will be described with reference to the accompanying drawings. In the storage unit 7, the probing data Dp for the substrate 100, the distance data Dd1 indicating the first specified distance Lc1 and the second specified distance Lc2, and the distance data indicating the first lower limit distance Lb1 and the second lower limit distance Lb2. It is assumed that Dd2 is stored in advance.

  First, the substrate 100 is placed and held on the mounting table 2 a of the substrate holding unit 2. Subsequently, the operation unit 6 is operated to instruct the start of the inspection. At this time, the control unit 9 reads the probing data Dp and the distance data Dd1 and Dd2 from the storage unit 7 in accordance with the operation signal output from the operation unit 6.

  Next, the controller 9 executes a probing control process 50 shown in FIG. In the probing control process 50, the control unit 9 specifies the positions (XY coordinates) of two probing points at which the inspection probes 41 and 41 should first be probed based on the probing data Dp (step 51). Subsequently, based on the specified XY coordinates, the control unit 9 sets the distance between the two probing points along the X direction and the distance along the Y direction, that is, the inspection probes 41 and 41 at the two probing points. A first distance Lm1 and a second distance Lm2 are calculated when it is assumed that the probing is performed (step 52).

  Next, the controller 9 controls the first allowable range R1 defined by the first specified distance Lc1, the second specified distance Lc2, the first lower limit distance Lb1 and the second lower limit distance Lb2 indicated by the distance data Dd1 and Dd2 (FIG. 4). Compare the calculated first distance Lm1 and second distance Lm2 with each other, and determine whether the first distance Lm1 and the second distance Lm2 (distance Lm) are within the first allowable range R1 (step 53). ).

  When the control unit 9 determines that both the first distance Lm1 and the second distance Lm2 (distance Lm) are within the first allowable range R1 in step 53 described above, the control unit 9 continues to the first separation state described above, Whether any one of the second separation state, the first proximity state, and the second proximity state (separation state or proximity state) has been detected by the detection unit 4, that is, the distance Lm is the first upper limit distance La1 and the second upper limit. It is determined whether or not it is within the second allowable range R2 (see FIG. 4) defined by the distance La2, the first lower limit distance Lb1, and the second lower limit distance Lb2 (step 54).

  When the controller 9 determines that the distance Lm is within the second allowable range R2 in the above-described step 54, as shown in FIG. 7, the controller 9 starts from the initial position P1 of each probe holder 13 to the target position P2 (step 51). To move the probe holding unit 13 in a state in which the distance Lm between the inspection probes 41 is maintained within the first allowable range R1 toward the XY coordinates specified in (1) above the probing point. The route C is specified (step 55). Next, the control unit 9 instructs the first moving mechanism 11 of the probing unit 3 to start moving processing for moving the probe holding units 13a and 13b along the specified moving path C (step 56). In the description regarding both the probe holding portions 13a and 13b in the probing control process 50, hereinafter, the “probe holding portions 13a and 13b” will be described as “probe holding portion 13”.

  Next, the control unit 9 determines whether the distance Lm is within the second allowable range R2 (whether the separation state or the proximity state is detected by the detection unit 4) while the probe holding unit 13 is moving. (Step 57). When it is determined in step 57 that the distance Lm is within the second allowable range R2, the control unit 9 calculates the XY coordinates of the moving inspection probe 41 (step 58), and subsequently calculates the XY coordinates. Based on the above, it is determined whether or not the distance Lm is within the first allowable range R1 (step 59).

  When the control unit 9 determines that the distance Lm is within the first allowable range R1 in step 59 described above, the control unit 9 subsequently compares the XY coordinates of the inspection probe 41 with the XY coordinates of the probing point, for inspection. It is determined whether the probe 41 has reached above the probing point (step 60). When it is determined in step 60 that the inspection probe 41 has not reached the probing point, the control unit 9 executes step 57. That is, the control unit 9 repeatedly executes Steps 57 to 60 until the inspection probe 41 reaches above the probing point.

  Next, when the inspection probe 41 reaches above the probing point, the control unit 9 determines that in step 58, and then holds the probe along the movement path C with respect to the first movement mechanism 11. An instruction to stop the movement process of the unit 13 is given (step 61). Next, the control unit 9 moves the probe holding unit 13 downward (along the Z direction) by a predetermined distance toward the probing point on the substrate 100 with respect to the second moving mechanism 12 of the probing unit 3. The execution of the movement process to be performed is instructed (step 62). In response to this, the second moving mechanism 12 executes a downward movement process, and thereby the tip of the inspection probe 41 held by the probe holding unit 13 is probed (contacted) with the probing point.

  Subsequently, the control unit 9 instructs the inspection unit 5 to perform an electrical inspection (step 63). In response to this, the inspection unit 5 performs an electrical inspection on the substrate 100 based on the electrical signal Si input via the inspection probe 41. Next, the control unit 9 causes the display unit 8 to display the result of the inspection by the inspection unit 5. Subsequently, when the electrical inspection by the inspection unit 5 is completed, the control unit 9 moves the probe holding unit 13 upward (along the Z direction) by a predetermined distance with respect to the second moving mechanism 12. Instructing the execution of the movement process to be performed (step 64). In response to this, the second moving mechanism 12 executes an upward movement process, whereby the tip of the inspection probe 41 held by the probe holding unit 13 is separated from the probing point. Thus, the probing process for the first probing point and the electrical inspection for the probing point are completed. Next, the control unit 9 executes the above steps to execute a probing process for the next probing point and an electrical inspection for the probing point.

  On the other hand, when it is determined that the distance Lm (at least one of the first distance Lm1 and the second distance Lm2) is outside the first allowable range R1, the control unit 9 controls the probing unit 3 to determine the probe. The holding unit 13 is maintained in a stopped state, and then a display (coordinate error display) indicating that the distance Lm is outside the first allowable range R1 and that the probing point coordinates considered as the reason are incorrect is displayed. The probing control process 50 is terminated by causing the unit 8 to perform the process (step 65). Further, the control unit 9 also controls the probing unit 3 to maintain the probe holding unit 13 in the stopped state when it is determined in step 54 that the distance Lm is outside the second allowable range R2. Here, when the distance Lm is outside the second allowable range R2, there is a possibility that the inspection probes 41 are separated beyond the second allowable range R2 in the initial state for some reason. Therefore, in this case, the control unit 9 causes the display unit 8 to display that fact (current position error display) (step 66), and ends the probing control process 50.

  Further, the control unit 9 is moving (moving) the probe holding unit 13 along the movement path C from the initial position P1 shown in FIG. 6A, as shown in FIG. In addition, when the distance Lm is outside the second allowable range R2, it is determined in step 57 described above, and the probing unit 3 is controlled to stop (emergency stop) the movement of the probe holding unit 13 ( Step 67), the fact is displayed and the probing control process 50 is finished. Further, the control unit 9 is moving the probe holding unit 13 along the movement path C from the initial position P1 shown in FIG. 7A toward the target position P2 shown in FIG. When the distance Lm is within the second allowable range R2 and outside the first allowable range R1 for some reason, as shown in FIG. (Step 68), the process returns to step 57 to continue the movement of the probe holding unit 13. As a notification method of the fact that the movement of the probe holding unit 13 is stopped and the cause thereof, instead of the display by the display unit 8 described above (or in addition to the display), a sound or announcement for notifying the fact is given. It is also possible to employ a method of outputting from a sound generator not shown.

  Here, in this substrate inspection apparatus 1, as described above, in addition to performing the process of step 53 for determining whether or not the calculated distance Lm is within the first allowable range R1 before starting the movement process. Thus, the process of step 54 is performed to determine whether the distance Lm is within the second allowable range R2 (whether the separation state or the proximity state is detected by the detection unit 4). For this reason, in this board inspection apparatus 1, for example, an erroneous distance Lm is calculated due to a calculation error, and even if this distance Lm is within the first allowable range R1, the actual distance Lm is outside the second allowable range R2. In this case, as a result of the movement of the probe holders 13 not being started, the inspection probes 41 held by the probe holders 13 are moved apart from each other beyond the upper limit distance La (the length Ld of the cable 42). It is surely prevented.

  Further, in the substrate inspection apparatus 1, as described above, during the movement of the probe holding unit 13, the process of step 57 for determining whether the separation state or the proximity state is detected by the detection unit 4, that is, the actual state. Processing is performed to determine whether or not the distance Lm is within the second allowable range R2. For this reason, in this substrate inspection apparatus 1, for example, when the two probe holders 13 are moved from the initial position P1 to the two target positions P2, respectively, the distance between the two probe holders 13 is originally the same. A program for movement control should be created so that each of the two probe holders 13 is moved simultaneously while maintaining a state where Lm is within the first allowable range R1, and one probe holder 13 is brought to a target position. Even if an erroneous program for movement control is made such that the other probe holder 13 is moved to the target position after the movement (each probe holder 13 is separated), the probe holder When the actual distance Lm is outside the second allowable range R2 during the movement of 13, the movement of the probe holding unit 13 is stopped. Therefore, in this board inspection apparatus 1, even in such a case, the probe holding parts 13 are moved apart from each other beyond the length Ld of the cable 42, or the probe holding parts 13 and the probe holding parts are moved. The movements such that the inspection probes 41 held by the respective 13 are in contact with each other are reliably prevented.

  Thus, in this board | substrate inspection apparatus 1, when the control part 9 moves each probe holding part 13 along the surface of the board | substrate 100, based on the detection result of the separation state by the detection part 4, each probe holding part 13 maintains the state where the distance Lm between the respective inspection probes 41 respectively held by 13 is less than the upper limit distance La. For this reason, according to this board inspection apparatus 1, when the cable 42 for shield connection is provided between the probe holding portions 13, for example, 1 / √2 with respect to the length Ld of the cable 42. By defining the multiplied length (or a length slightly shorter than the length) as the upper limit distance La, each length for each inspection that is held by each probe holding portion 13 exceeds the length Ld of the cable 42. As a result of reliably preventing the probes 41 from moving apart from each other, the cable 42 and the probe holding part 13 to which the end of the cable 42 is connected and the inspection probe 41 are reliably prevented. However, each inspection probe 41 can be moved and inspected.

  Moreover, in this board | substrate inspection apparatus 1, when the control part 9 moves each probe holding | maintenance part 13 along the surface of the board | substrate 100, while specifying the movement path | route C, each probe holding | maintenance part along the movement path | route C is specified. When the distance Lm between the inspection probes 41 held by the probe holders 13 during the movement of 13 exceeds the specified distance Lc, the movement path C is corrected and the movement of the probe holders 13 is continued. When the separation state is detected by the detection unit 4 during the movement of each probe holding unit 13 along the movement path C, the movement of each probe holding unit 13 is stopped. For this reason, according to this board inspection apparatus 1, when the distance Lm exceeds the specified distance Lc, that is, when there is still a margin until the cable 42 is cut, the moving path C is corrected and the probe holding unit is corrected. The movement of the probe holder 13 can be immediately stopped at the stage where the distance Lm exceeds the upper limit distance La, that is, the stage where there is no allowance until the cable 42 is cut.

  Moreover, in this board | substrate inspection apparatus 1, the detection part 4 is comprised so that detection of the proximity state from which the distance Lm between each test | inspection probe 41 each hold | maintained by each probe holding | maintenance part 13 is below the lower limit distance Lb, When the control unit 9 moves each probe holding unit 13 along the surface of the substrate 100, the state in which the distance Lm exceeds the lower limit distance Lb based on the detection result by the detection unit 4 is maintained. For this reason, according to this board | substrate test | inspection apparatus 1, the movement which each probe 41 for each hold | maintained by each probe holding part 13 or each probe holding part 13 contacts can be prevented reliably. As a result, it is possible to reliably prevent the inspection probe 41 and the probe holder 13 from being damaged due to mutual contact.

  In the substrate inspection apparatus 1, the detection unit 4 includes the first separation state in which the first distance Lm1 along the X direction between the inspection probes 41 is equal to or greater than the first upper limit distance La1, and the inspection probes 41. The second separation state where the second distance Lm2 along the Y direction is equal to or greater than the second upper limit distance La2 can be detected, and the control unit 9 moves each probe holding unit 13 along the surface of the substrate 100. In this case, the state in which the first distance Lm1 is less than the first upper limit distance La1 and the second distance Lm2 is less than the second upper limit distance La2 based on the detection result by the detection unit 4 is maintained. For this reason, according to this board | substrate inspection apparatus 1, the detection part 4 of the simple structure provided with two sensors of the photoelectric sensor 32a which performs the detection about X direction, and the photoelectric sensor 32c which performs the detection about Y direction is 1st. As a result of reliably detecting the first separated state and the second separated state, the cable 42, the probe holding unit 13, and the inspection disposed between the probe holding units 13 while reducing the cost of the board inspection apparatus 1. Damage to the probe 41 can be reliably prevented.

  In the substrate inspection apparatus 1, the detection unit 4 includes the first proximity state in which the first distance Lm1 along the X direction between the inspection probes 41 is equal to or less than the first lower limit distance Lb1, and the inspection probes 41. The second proximity state in which the second distance Lm2 along the Y direction is equal to or less than the second lower limit distance Lb2 is configured to be detectable, and the control unit 9 moves each probe holding unit 13 along the surface of the substrate 100 In this case, the state in which the first distance Lm1 exceeds the first lower limit distance Lb1 and the second distance Lm2 exceeds the second lower limit distance Lb2 based on the detection result by the detection unit 4 is maintained. For this reason, according to this board | substrate inspection apparatus 1, the detection part 4 of the simple structure provided with two sensors of the photoelectric sensor 32b which performs the detection about X direction, and the photoelectric sensor 32d which performs the detection about Y direction is 1st. As a result of reliably detecting the first proximity state and the second proximity state, it is possible to reliably prevent the inspection probe 41 and the probe holding unit 13 from being damaged due to mutual contact while reducing the cost of the substrate inspection apparatus 1. can do.

  In addition, the structure of the board | substrate inspection apparatus 1 is not limited to said structure. For example, the example in which the detection unit 4 is configured by including the reflection type photoelectric sensor 32 and the reflection plate 33 has been described above. However, instead of the photoelectric sensor 32 and the reflection plate 33, a transmission type photoelectric sensor having a projector and a light receiver. The detection unit 4 can also be configured. In addition, a switch that outputs a signal when the distance Lm is equal to or greater than the upper limit distance La (or stops outputting the signal that has been output until then) and a signal that is output when the distance Lm is equal to or less than the lower limit distance Lb ( Alternatively, the detection unit 4 can be configured by providing a switch for stopping the output of the signal that has been output so far, instead of the photoelectric sensor 32 and the reflection plate 33.

  In addition, a detection unit 4 that separately detects a first separation state along the X direction (first direction) and a second separation state along the Y direction is provided, and the first separation state and the second separation state are provided. The configuration example in which each probe holding unit 13 is maintained in the stopped state when at least one is detected by the detection unit 4 has been described above. However, the distance between the inspection probes 41 in the X direction, and each inspection probe A detection unit that detects a separation state in which the shortest distance between the inspection probes 41 is not less than a distance between the inspection probes 41 and not less than a predetermined distance, and each probe is detected when the separation state is detected. A configuration in which the holding unit 13 is maintained in a stopped state can be employed. As an example, a distance sensor (laser displacement meter) that measures the shortest distance from the inspection probe 41 held by one probe holding unit 13 to the inspection probe 41 held by the other probe holding unit 13 in a non-contact manner. ) And the distance measured by the distance sensor is equal to or greater than a predetermined distance (for example, a distance obtained by multiplying the length Ld of the cable 42 by a safety factor of about 80%). However, it can be configured to control the probing unit 3 to maintain each probe holding unit 13 in a stopped state.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 3 Probing part 4 Detection part 5 Inspection part 9 Control part 13a, 13b Probe holding part 32a-32d Photoelectric sensor 41 Inspection probe 100 Substrate La upper limit distance La1 1st upper limit distance La2 2nd upper limit distance Lb Lower limit distance Lb1 1st minimum distance Lb2 2nd minimum distance Lm distance Lm1 1st distance Lm2 2nd distance Si Electric signal

Claims (5)

A probing unit for holding the inspection probes and connecting a pair of probe holding units connected to each other by a cable along the surface of the substrate to be inspected to probe the inspection probe on the substrate, and the probing unit A substrate inspection apparatus comprising: a control unit that controls; and an inspection unit that performs an electrical inspection on the substrate based on an electrical signal input and output through each inspection probe probed by the probing unit. ,
A detection unit for detecting a separation state in which a distance between the inspection probes held by the probe holding units is equal to or greater than a predetermined upper limit distance;
The control unit controls the probing unit based on a detection result of the separation state by the detection unit when moving the probe holding unit along the surface of the substrate, and the probe holding unit A substrate inspection apparatus that maintains a state in which the distance between the respective inspection probes that are held is less than the upper limit distance. The controller defines the distance between the inspection probes held by the probe holders to be shorter than the upper limit distance when moving the probe holders along the surface of the substrate. Specifying a movement path for moving each probe holder from the initial position to the target position while maintaining the distance below the specified distance,
When the distance between the inspection probes held by the probe holders during the movement of the probe holders along the movement path exceeds the specified distance, the movement path is corrected to Continue to move each probe holder,
The substrate inspection apparatus according to claim 1, wherein the movement of each probe holding unit is stopped when the detection unit detects the separation state during the movement of each probe holding unit along the movement path. The detection unit is configured to be able to detect a proximity state in which the distance between the inspection probes held by the probe holding units is equal to or less than a predetermined lower limit distance,
The control unit controls the probing unit based on a detection result of the proximity state by the detection unit when the probe holding unit is moved along the surface of the substrate, and the probe holding unit The substrate inspection apparatus according to claim 1 or 2, wherein a distance between the respective inspection probes held therein is maintained in a state exceeding the lower limit distance. The detection unit includes a first separation state as the separation state in which a distance along the first direction between the inspection probes held by the probe holding units is equal to or more than a first upper limit distance, and the The second separation state as the separation state in which the distance along the second direction orthogonal to the first direction between the inspection probes held by the probe holding portions is equal to or more than a second upper limit distance is detected. Configured and possible
The control unit controls the probing unit based on the detection results of the first separation state and the second separation state by the detection unit when the probe holding units are moved along the surface of the substrate. The distance along the first direction between the inspection probes held by the probe holders is less than the first upper limit distance and along the second direction between the inspection probes. The substrate inspection apparatus according to claim 1, wherein a state in which the distance is less than the second upper limit distance is maintained. The detection unit includes a first proximity state as the proximity state in which a distance along the A direction between the inspection probes held by the probe holding units is equal to or less than a first lower limit distance; and A configuration in which the second proximity state as the proximity state in which the distance along the B direction perpendicular to the A direction between the respective inspection probes held by the probe holding unit is equal to or less than a second lower limit distance can be detected. And
The control unit controls the probing unit based on the detection results of the first proximity state and the second proximity state by the detection unit when the probe holding units are moved along the surface of the substrate. The distance along the A direction between the inspection probes held by the probe holding portions exceeds the first lower limit distance, and the distance along the B direction between the inspection probes is The substrate inspection apparatus according to claim 1, wherein a state exceeding the second lower limit distance is maintained.

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