JP5770071B2

JP5770071B2 - Manufacturing method of electronic component mounting module

Info

Publication number: JP5770071B2
Application number: JP2011248790A
Authority: JP
Inventors: 高橋　正明; 正明高橋
Original assignee: Shindengen Electric Manufacturing Co Ltd
Current assignee: Shindengen Electric Manufacturing Co Ltd
Priority date: 2011-11-14
Filing date: 2011-11-14
Publication date: 2015-08-26
Anticipated expiration: 2031-11-14
Also published as: JP2013105893A

Description

本発明は、底面に凹部を有する挿入型の電子部品がはんだ付けされた電子部品実装モジュールの製造方法、および該製造方法により製造された電子部品実装モジュールに関する。 The present invention relates to a method for manufacturing an electronic component mounting module in which an insertion type electronic component having a recess on a bottom surface is soldered, and an electronic component mounting module manufactured by the manufacturing method.

プリント配線板にはんだ付けされる電子部品の中には、底面に凹部を有するものがある。例えば、大容量の電解コンデンサの場合、円柱状の本体部の底面に凹部が設けられている。この凹部は本体部の側面によって包囲されているため、電解コンデンサをプリント配線板に載置すると、凹部はプリント配線板によって蓋をされた状態となる。 Some electronic components soldered to a printed wiring board have a recess on the bottom surface. For example, in the case of a large-capacity electrolytic capacitor, a concave portion is provided on the bottom surface of a cylindrical main body. Since the concave portion is surrounded by the side surface of the main body portion, when the electrolytic capacitor is placed on the printed wiring board, the concave portion is covered with the printed wiring board.

従来、電解コンデンサは以下の工程によりプリント配線板にはんだ付けされる。 Conventionally, an electrolytic capacitor is soldered to a printed wiring board by the following process.

まず、電解コンデンサの２本のリード線をプリント配線板の挿通孔に挿通し、電解コンデンサをプリント配線板の実装面に搭載する。リード線が鉤爪状に形成されている場合には、電解コンデンサはリード線の曲がりによりプリント配線板に固定される。そうでない場合には、リード線を挿通孔に通した後、リード線の先端を曲げて電解コンデンサをプリント配線板に固定する。このように電解コンデンサがプリント配線板に固定された状態では、凹部はプリント配線板によって蓋をされる。このため、凹部は挿通孔のみを介して外部の空間と連通することになる。 First, the two lead wires of the electrolytic capacitor are inserted into the insertion hole of the printed wiring board, and the electrolytic capacitor is mounted on the mounting surface of the printed wiring board. When the lead wire is formed in a claw shape, the electrolytic capacitor is fixed to the printed wiring board by bending the lead wire. Otherwise, after passing the lead wire through the insertion hole, the tip of the lead wire is bent to fix the electrolytic capacitor to the printed wiring board. Thus, in a state where the electrolytic capacitor is fixed to the printed wiring board, the concave portion is covered with the printed wiring board. For this reason, the concave portion communicates with the external space only through the insertion hole.

次いで、電解コンデンサが搭載されたプリント配線板を所定のリフローはんだ用の治具に固定し、その後、プリント配線版のはんだ面（裏面）が溶融はんだと接するようにプリント配線板を溶融はんだ槽に浸漬してはんだ付けを行う。この際、凹部内の気体が溶融はんだにより加熱されて膨張し、挿通孔を通ってプリント配線板のはんだ面側に噴出し、はんだブローホールが発生するという問題があった。 Next, the printed circuit board on which the electrolytic capacitor is mounted is fixed to a predetermined reflow soldering jig, and then the printed circuit board is placed in the molten solder bath so that the solder surface (back surface) of the printed circuit board is in contact with the molten solder. Immerse and solder. At this time, there is a problem that the gas in the concave portion is heated and expanded by the molten solder and is ejected through the insertion hole to the solder surface side of the printed wiring board, thereby generating a solder blow hole.

これに対し、特許文献１に記載された方法では、細長いスリット孔８をプリント基板２に貫通して設けておき、電解コンデンサ１を、スリット孔８の一部が電解コンデンサ１の底に位置するように搭載してはんだ付けを行う。この方法によれば、膨張した凹部内の気体はスリット孔８を通って外部に排出されるため、はんだブローホールの発生が防止される。 On the other hand, in the method described in Patent Document 1, an elongated slit hole 8 is provided so as to penetrate the printed circuit board 2, and the electrolytic capacitor 1 is located at a part of the slit hole 8 at the bottom of the electrolytic capacitor 1. Install and solder. According to this method, since the gas in the expanded recess is discharged to the outside through the slit hole 8, generation of solder blow holes is prevented.

特開２００１−３３９１４９号公報JP 2001-339149 A

しかしながら、特許文献１の場合、スリット孔はプリント基板を貫通しているため、溶融はんだがスリット孔８を通ってプリント配線板の実装面に達し、実装部品のリード線やプリント配線板上の配線パターンをショートさせるおそれがある。また、細長いスリット孔８を設ける必要があるため、配線パターンの配置に対して大きな制限を加えることがある。特に、大容量の電解コンデンサを実装する場合には、大電流に対応するため比較的幅の広い配線パターンを設ける必要があり、配線パターンがスリット孔と干渉する可能性が高い。 However, in the case of Patent Document 1, since the slit hole penetrates the printed board, the molten solder passes through the slit hole 8 to reach the mounting surface of the printed wiring board, and leads on the mounted component and wiring on the printed wiring board. There is a risk of shorting the pattern. In addition, since it is necessary to provide the elongated slit hole 8, there may be a great restriction on the arrangement of the wiring pattern. In particular, when a large-capacity electrolytic capacitor is mounted, it is necessary to provide a relatively wide wiring pattern to cope with a large current, and there is a high possibility that the wiring pattern interferes with the slit hole.

本発明は、上述の技術的認識に基づいてなされたものであり、配線パターンの配置自由度を制限することなく、はんだブローホールの発生を防止可能であるとともに、はんだによるショートを防止することが可能な電子部品実装モジュールの製造方法、および該方法による電子部品実装モジュールを提供することを目的とする。 The present invention has been made on the basis of the above technical recognition, and can prevent the occurrence of solder blowholes without restricting the degree of freedom of arrangement of wiring patterns, and can prevent a short circuit due to solder. It is an object of the present invention to provide a method for manufacturing a possible electronic component mounting module and an electronic component mounting module according to the method.

本発明の一態様に係る、底面に凹部を有する挿入型の電子部品がはんだ付けされた電子部品実装モジュールを製造する方法は、
前記電子部品のリード線をプリント配線板の挿通孔に挿通し、前記電子部品を前記プリント配線板の実装領域に搭載する、電子部品搭載工程と、
前記プリント配線板を治具板に固定し、前記プリント配線板の前記挿通孔を、前記治具板を厚さ方向に貫通する開口部に露出させるとともに、前記プリント配線板の前記実装領域の内側に設けられた第１の貫通孔および前記実装領域の外側に設けられた第２の貫通孔が、前記プリント配線板が載置される前記治具板の上面から凹むように形成された流路部と連通することにより前記凹部を前記プリント配線板の上側の空間と連通させる、プリント配線板固定工程と、
前記プリント配線板が固定された前記治具板を、前記開口部に露出した前記プリント配線板の裏面が溶融はんだと接触するように溶融はんだ槽に浸漬して、前記電子部品を前記プリント配線板にはんだ付けする、はんだ付け工程と、
を備えることを特徴とする。 According to one aspect of the present invention, a method for manufacturing an electronic component mounting module in which an insertion type electronic component having a recess on a bottom surface is soldered,
Inserting the lead wire of the electronic component into the insertion hole of the printed wiring board, and mounting the electronic component on the mounting region of the printed wiring board,
The printed wiring board is fixed to a jig board, and the insertion hole of the printed wiring board is exposed to an opening that penetrates the jig board in the thickness direction, and the inside of the mounting area of the printed wiring board. The first through hole provided in the second and the second through hole provided outside the mounting region are formed so as to be recessed from the upper surface of the jig plate on which the printed wiring board is placed. A printed wiring board fixing step of communicating the recess with the upper space of the printed wiring board by communicating with a portion;
The jig board to which the printed wiring board is fixed is immersed in a molten solder bath so that the back surface of the printed wiring board exposed to the opening is in contact with the molten solder, and the electronic component is placed in the printed wiring board. Soldering to the soldering process,
It is characterized by providing.

前記電子部品実装モジュールの製造方法において、
前記プリント配線板には、前記第２の貫通孔に代えて、前記プリント配線板の端部に、前記治具板の流路部と、前記プリント配線板の上側の空間とを連通させる切り欠き部が設けられていてもよい。 In the method for manufacturing the electronic component mounting module,
In the printed wiring board, instead of the second through hole, a notch for communicating the flow path portion of the jig plate and the space above the printed wiring board at the end of the printed wiring board A part may be provided.

前記電子部品実装モジュールの製造方法において、
前記プリント配線板の前記第２の貫通孔に代えて、前記治具板に、前記流路部と、前記プリント配線板の上側の空間とを連通させるための気体放出手段が設けられていてもよい。 In the method for manufacturing the electronic component mounting module,
Instead of the second through hole of the printed wiring board, the jig plate may be provided with a gas release means for communicating the flow path portion and the space above the printed wiring board. Good.

前記電子部品実装モジュールの製造方法において、
前記プリント配線板には、前記実装領域の外側に樹脂注入口が設けられ、かつ前記実装領域の内側に第３の貫通孔がさらに設けられ、
前記第３の貫通孔と前記樹脂注入口との間の距離は、前記第１の貫通孔と前記樹脂注入口との間の距離よりも長く、
前記はんだ付け工程の後、前記プリント配線板を前記治具板から取り外して前記電子部品が実装された面を上側にして樹脂注入用容器内に配置し、前記樹脂注入口を介して溶融樹脂を前記プリント配線板の上側から前記プリント配線板と前記容器の底面との間の隙間に注入することにより、前記プリント配線板の裏面を前記溶融樹脂で覆うとともに、前記第３の貫通孔を介して前記電子部品の前記凹部内の気体を外部に放出させながら前記第１の貫通孔を介して前記溶融樹脂を前記凹部に注入する樹脂封止工程をさらに備えてもよい。 In the method for manufacturing the electronic component mounting module,
In the printed wiring board, a resin injection port is provided outside the mounting region, and a third through hole is further provided inside the mounting region,
The distance between the third through hole and the resin injection port is longer than the distance between the first through hole and the resin injection port,
After the soldering step, the printed wiring board is removed from the jig plate and placed in the resin injection container with the surface on which the electronic component is mounted facing upward, and the molten resin is injected through the resin injection port. By injecting into the gap between the printed wiring board and the bottom surface of the container from the upper side of the printed wiring board, the back surface of the printed wiring board is covered with the molten resin, and through the third through hole. You may further provide the resin sealing process which inject | pours the said molten resin into the said recessed part through the said 1st through-hole, releasing the gas in the said recessed part of the said electronic component outside.

前記電子部品実装モジュールの製造方法において、
前記プリント配線板には、前記実装領域の内側に第３の貫通孔がさらに設けられ、前記第３の貫通孔と前記第２の貫通孔との間の距離は、前記第１の貫通孔と前記第２の貫通孔との間の距離よりも長く、
前記はんだ付け工程の後、前記プリント配線板を前記治具板から取り外して前記電子部品が実装された面を上側にして樹脂注入用容器内に配置し、前記第２の貫通孔を介して溶融樹脂を前記プリント配線板の上側から前記プリント配線板と前記容器の底面との間の隙間に注入することにより、前記プリント配線板の裏面を前記溶融樹脂で覆うとともに、前記第３の貫通孔を介して前記電子部品の前記凹部内の気体を外部に放出させながら前記第１の貫通孔を介して前記溶融樹脂を前記凹部に注入する樹脂封止工程をさらに備えてもよい。 In the method for manufacturing the electronic component mounting module,
The printed wiring board is further provided with a third through hole inside the mounting region, and the distance between the third through hole and the second through hole is the same as the first through hole. Longer than the distance between the second through holes,
After the soldering step, the printed wiring board is removed from the jig plate, placed in the resin injection container with the surface on which the electronic component is mounted facing upward, and melted through the second through hole. By injecting resin into the gap between the printed wiring board and the bottom surface of the container from above the printed wiring board, the back surface of the printed wiring board is covered with the molten resin, and the third through hole is formed. A resin sealing step of injecting the molten resin into the recess through the first through hole while releasing the gas in the recess of the electronic component to the outside via the first through hole may be further provided.

前記電子部品実装モジュールの製造方法において、
前記電子部品搭載工程の前に、表面実装型の電子部品を、前記プリント配線板が前記治具板に固定された状態において前記治具板の前記流路部によって蓋をされる前記プリント配線板の裏面の領域にはんだ付けする工程をさらに備えてもよい。 In the method for manufacturing the electronic component mounting module,
Prior to the electronic component mounting step, the surface mounted electronic component is covered with the flow path portion of the jig plate in a state where the printed wiring board is fixed to the jig plate. You may further provide the process of soldering to the area | region of the back surface.

前記電子部品実装モジュールの製造方法において、
前記挿入型の電子部品は、電解コンデンサ、または、トランスの上面および側面がカバー体により覆われ、前記カバー体と前記トランスとの間に樹脂が充填されているカバー付きトランスであってもよい。 In the method for manufacturing the electronic component mounting module,
The insertion type electronic component may be an electrolytic capacitor or a transformer with a cover in which a top surface and a side surface of the transformer are covered with a cover body, and a resin is filled between the cover body and the transformer.

前記電子部品実装モジュールの製造方法において、
前記第１の貫通孔および前記第２の貫通孔のうち少なくともいずれか一方として、前記プリント配線板の異なる層に設けられた配線パターンを電気的に接続するビアホールを利用してもよい。 In the method for manufacturing the electronic component mounting module,
A via hole that electrically connects wiring patterns provided in different layers of the printed wiring board may be used as at least one of the first through hole and the second through hole.

本発明の一態様に係る電子部品実装モジュールは、
実装領域の内側に挿通孔および第１の貫通孔が設けられ、かつ前記実装領域の外側に第２の貫通孔が設けられたプリント配線板と、
前記プリント配線板の前記実装領域にはんだ付けされた挿入形の電子部品であって、前記挿通孔に挿通されたリード線を有するとともに、底面に設けられた凹部が前記プリント配線板により蓋をされた挿入形の電子部品と、
を備える電子部品実装モジュールであって、
前記電子部品を前記プリント配線板にはんだ付けする際に、前記プリント配線板は、厚さ方向に貫通する開口部と、前記プリント配線板が載置される面から凹むように形成された流路部とを有する治具板に固定され、その状態において、前記挿通孔は前記治具板の前記開口部に露出するとともに、前記第１および第２の貫通孔は前記治具板の前記流路部と連通することを特徴とする。 An electronic component mounting module according to an aspect of the present invention is provided.
A printed wiring board in which an insertion hole and a first through hole are provided inside the mounting region, and a second through hole is provided outside the mounting region;
An insertion-type electronic component soldered to the mounting area of the printed wiring board, having a lead wire inserted through the insertion hole, and having a recess provided on the bottom surface covered with the printed wiring board. Inserted electronic parts,
An electronic component mounting module comprising:
When the electronic component is soldered to the printed wiring board, the printed wiring board has an opening that penetrates in the thickness direction and a flow path that is recessed from the surface on which the printed wiring board is placed. The insertion hole is exposed to the opening of the jig plate, and the first and second through holes are the flow paths of the jig plate. It is characterized by communicating with the part.

前記電子部品実装モジュールにおいて、
前記治具板に固定された状態において前記流路部により蓋をされる前記プリント配線板の裏面の領域に、表面実装形の電子部品が実装されていてもよい。 In the electronic component mounting module,
A surface-mount type electronic component may be mounted in a region on the back surface of the printed wiring board that is covered by the flow path portion while being fixed to the jig plate.

前記電子部品実装モジュールにおいて、
前記電子部品は、電解コンデンサ、または、トランスの上面および側面がカバー体により覆われ、前記カバー体と前記トランスとの間に樹脂が充填されているカバー付きトランスであってもよい。 In the electronic component mounting module,
The electronic component may be an electrolytic capacitor or a transformer with a cover in which an upper surface and a side surface of the transformer are covered with a cover body and a resin is filled between the cover body and the transformer.

本発明の一態様に係る電子部品実装モジュールの製造方法では、プリント配線板を治具に固定した際に、プリント配線板の実装領域の内側に設けられた第１の貫通孔および実装領域の外側に設けられた第２の貫通孔が治具板の流路部と連通し、これにより、電子部品の底面の凹部はプリント配線板の上側の空間と連通する。 In the method for manufacturing an electronic component mounting module according to one aspect of the present invention, when the printed wiring board is fixed to a jig, the first through hole provided inside the mounting area of the printed wiring board and the outside of the mounting area The second through-hole provided in the upper surface of the electronic component communicates with the flow path portion of the jig plate, whereby the concave portion on the bottom surface of the electronic component communicates with the space above the printed wiring board.

したがって、はんだ付け工程において、溶融はんだにより加熱され、膨張した凹部内の気体は、挿通孔からでなく、第１の貫通孔、流路部、第２の貫通孔の順に通って、プリント配線板の上側の空間に放出される。その結果、はんだブローホールの発生を防止することができる。 Accordingly, in the soldering process, the gas in the recessed portion heated and expanded by the molten solder passes through the first through hole, the flow path portion, and the second through hole in this order, not through the insertion hole. Is released into the space above. As a result, the occurrence of solder blow holes can be prevented.

また、第１および第２の貫通孔は互いに独立して配置可能であるため、配線パターンと干渉しないように配置することが容易である。 Further, since the first and second through holes can be arranged independently of each other, it is easy to arrange them so as not to interfere with the wiring pattern.

さらに、第１および第２の貫通孔は治具板で覆われるため、はんだ付け工程において溶融はんだがこれらの貫通孔を通ってプリント配線板の表面側に上がってくることがない。したがって、配線パターンや電子部品のリード線が溶融はんだによりショートすることを防止できる。 Furthermore, since the first and second through holes are covered with the jig plate, molten solder does not go up to the surface side of the printed wiring board through these through holes in the soldering process. Therefore, it is possible to prevent the wiring pattern or the lead wire of the electronic component from being short-circuited by the molten solder.

本発明の実施形態に係る電子部品実装モジュールのプリント配線板の平面図である。It is a top view of the printed wiring board of the electronic component mounting module which concerns on embodiment of this invention. 電解コンデンサが搭載されたプリント配線板の断面図である。It is sectional drawing of the printed wiring board with which the electrolytic capacitor is mounted. 治具板および該治具板に固定されたプリント配線板の断面図である。It is sectional drawing of the printed wiring board fixed to the jig | tool board and this jig | tool board. 端部に切り欠き部が設けられたプリント配線板、および該プリント配線板が固定された治具板の平面図である。It is a top view of the printed wiring board by which the notch part was provided in the edge part, and the jig board to which this printed wiring board was fixed. 切り欠き部が設けられた治具板の平面図である。It is a top view of the jig board provided with the notch part. 樹脂封止用容器および該樹脂封止用容器に固定されたプリント配線板の断面図である。It is sectional drawing of the printed wiring board fixed to the container for resin sealing, and this container for resin sealing. ビアホールが設けられたプリント配線板、および該プリント配線板が固定された治具板の断面図である。It is sectional drawing of the printed wiring board provided with the via hole, and the jig board to which this printed wiring board was fixed.

以下、図面を参照しつつ、本発明の実施形態について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

まず、本実施形態に係る電子部品実装モジュールのプリント配線板１０について説明する。図１はプリント配線板１０の平面図である。図１において破線で示す実装領域Ａは、電解コンデンサが実装される領域を示している。２つの挿通孔１１は、電解コンデンサの２本のリード線を挿通するための挿通孔である。 First, the printed wiring board 10 of the electronic component mounting module according to the present embodiment will be described. FIG. 1 is a plan view of the printed wiring board 10. A mounting area A indicated by a broken line in FIG. 1 indicates an area where an electrolytic capacitor is mounted. The two insertion holes 11 are insertion holes for inserting the two lead wires of the electrolytic capacitor.

また、貫通孔１２および貫通孔１３はプリント配線板を貫通する貫通孔であり、貫通孔１２は実装領域Ａの内側に、貫通孔１３は実装領域Ａの外側にそれぞれ設けられている。 Further, the through hole 12 and the through hole 13 are through holes that penetrate the printed wiring board. The through hole 12 is provided inside the mounting area A, and the through hole 13 is provided outside the mounting area A, respectively.

次に、図２〜図６を参照して本実施形態に係る電子部品実装モジュールの製造方法について説明する。図２は、電解コンデンサが搭載されたプリント配線板の断面図である。図３は、治具板と、該治具板に固定されたプリント配線板の断面図である。図４は、端部に切り欠き部が設けられたプリント配線板と、該プリント配線板が固定された治具板の平面図である。図５は、切り欠き部が設けられた治具板の平面図である。図６は、樹脂封止用容器と、該樹脂封止用容器に固定されたプリント配線板の断面図である。 Next, a method for manufacturing the electronic component mounting module according to the present embodiment will be described with reference to FIGS. FIG. 2 is a cross-sectional view of a printed wiring board on which an electrolytic capacitor is mounted. FIG. 3 is a cross-sectional view of a jig plate and a printed wiring board fixed to the jig plate. FIG. 4 is a plan view of a printed wiring board having a notch at the end, and a jig plate to which the printed wiring board is fixed. FIG. 5 is a plan view of a jig plate provided with a notch. FIG. 6 is a cross-sectional view of a resin sealing container and a printed wiring board fixed to the resin sealing container.

（１）まず、図２に示すように、底面に凹部１ｂを有する電解コンデンサ１のリード線１ａをプリント配線板１０の挿通孔１１に挿通し、電解コンデンサ１をプリント配線板１０の実装領域Ａに搭載する。これにより、電解コンデンサ１の凹部１ｂはプリント配線板１０で閉塞される。 (1) First, as shown in FIG. 2, the lead wire 1 a of the electrolytic capacitor 1 having the recess 1 b on the bottom surface is inserted into the insertion hole 11 of the printed wiring board 10, and the electrolytic capacitor 1 is mounted in the mounting area A of the printed wiring board 10. To be installed. As a result, the concave portion 1 b of the electrolytic capacitor 1 is closed by the printed wiring board 10.

なお、電解コンデンサ１等の挿入型の電子部品を搭載する前に、図２に示すように、治具板２０の流路部２３（後述）によって蓋をされるプリント配線板１０の裏面の領域に、チップ抵抗などの表面実装型の電子部品１４をはんだ付けしておいてもよい。 Before the insertion type electronic component such as the electrolytic capacitor 1 is mounted, as shown in FIG. 2, the area of the back surface of the printed wiring board 10 that is covered by the flow path portion 23 (described later) of the jig plate 20. In addition, a surface mount electronic component 14 such as a chip resistor may be soldered.

（２）次に、電解コンデンサ１が搭載されたプリント配線板１０を、はんだ付け用の治具板２０に固定する。この治具板２０の構成について、図３を用いて説明する。治具板２０には、プリント配線板１０を格納可能なように凹設された格納部２１が設けられている。また、治具板２０を厚さ方向に貫通するように開口部２２が設けられている。図３に示すように、プリント配線板１０が治具板２０に固定された状態では、プリント配線板１０の挿通孔１１が開口部２２に露出する。 (2) Next, the printed wiring board 10 on which the electrolytic capacitor 1 is mounted is fixed to a jig plate 20 for soldering. The configuration of the jig plate 20 will be described with reference to FIG. The jig plate 20 is provided with a storage portion 21 that is recessed so that the printed wiring board 10 can be stored. An opening 22 is provided so as to penetrate the jig plate 20 in the thickness direction. As shown in FIG. 3, when the printed wiring board 10 is fixed to the jig plate 20, the insertion hole 11 of the printed wiring board 10 is exposed to the opening 22.

さらに、治具板２０には、治具板２０の上面（プリント配線板１０が載置される面）から凹むように形成された溝状の流路部２３が設けられている。図３に示すように、プリント配線板１０が治具板２０に固定された状態では、貫通孔１２および貫通孔１３が流路部２３と連通することにより、電解コンデンサ１の凹部１ｂをプリント配線板１０の上側の空間と連通させる。 Further, the jig plate 20 is provided with a groove-shaped channel portion 23 formed so as to be recessed from the upper surface of the jig plate 20 (the surface on which the printed wiring board 10 is placed). As shown in FIG. 3, in a state where the printed wiring board 10 is fixed to the jig plate 20, the through hole 12 and the through hole 13 communicate with the flow path portion 23, whereby the concave portion 1 b of the electrolytic capacitor 1 is printed wiring. It communicates with the space above the plate 10.

このように、本工程では、プリント配線板１０の挿通孔１１が治具板２０の開口部２２に露出し、かつプリント配線板１０の貫通孔１２および貫通孔１３が治具板２０の流路部２３と連通するように、プリント配線板１０を治具板２０に固定する。これにより、凹部１ｂは、プリント配線板１０の上側（実装面側）の空間と連通する。 Thus, in this step, the insertion hole 11 of the printed wiring board 10 is exposed to the opening 22 of the jig board 20, and the through hole 12 and the through hole 13 of the printed wiring board 10 are the flow paths of the jig board 20. The printed wiring board 10 is fixed to the jig plate 20 so as to communicate with the portion 23. Thereby, the recessed part 1b is connected with the space of the upper side (mounting surface side) of the printed wiring board 10. FIG.

なお、貫通孔１３を設けない構成も可能である。例えば、図４に示すように、貫通孔１３に代えて、プリント配線板１０の端部に、凹部１ｂ内の気体を外部に放出するための切り欠き部１７を設ける。この切り欠き部１７は、流路部２３と、プリント配線板１０の上側の空間とを連通させる。その他、貫通孔１３に代えて、治具板２０に、流路部２３と、プリント配線板１０の上側の空間とを連通させるための気体放出手段を設けてもよい。例えば、図５に示すように、治具板２０の収納部２１に、流路部２３とプリント配線板１０の上側の空間とを連通させるための切り欠き部２４を設けてもよい。 In addition, the structure which does not provide the through-hole 13 is also possible. For example, as shown in FIG. 4, a cutout portion 17 for releasing the gas in the recess 1 b to the outside is provided at the end portion of the printed wiring board 10 instead of the through hole 13. The notch 17 communicates the flow path 23 with the space above the printed wiring board 10. In addition, instead of the through-hole 13, a gas discharge means may be provided in the jig plate 20 for communicating the flow path portion 23 and the space above the printed wiring board 10. For example, as shown in FIG. 5, a cutout portion 24 may be provided in the storage portion 21 of the jig plate 20 to allow the flow path portion 23 and the space above the printed wiring board 10 to communicate with each other.

上記のように、本工程では、電解コンデンサ１が搭載されたプリント配線板１０を治具板２０に固定し、プリント配線板１０の挿通孔１１が治具板２０を厚さ方向に貫通する開口部２１に露出させるとともに、貫通孔１２および貫通孔１３が治具板２０の流路部２２と連通することにより電解コンデンサ１の凹部１ｂをプリント配線板１０の上側の空間と連通させる。 As described above, in this step, the printed wiring board 10 on which the electrolytic capacitor 1 is mounted is fixed to the jig board 20, and the insertion hole 11 of the printed wiring board 10 is an opening through the jig board 20 in the thickness direction. While being exposed to the part 21, the through hole 12 and the through hole 13 communicate with the flow path part 22 of the jig plate 20, thereby allowing the concave portion 1 b of the electrolytic capacitor 1 to communicate with the space above the printed wiring board 10.

（３）次に、プリント配線板１０が固定された治具板２０を、開口部２２に露出したプリント配線板１０の裏面が溶融はんだと接触するように溶融はんだ槽に浸漬して、電解コンデンサ１をプリント配線板１０にはんだ付けする。これにより、電解コンデンサ１は、図６に示すように、はんだ１８によりプリント配線板１０に接合される。 (3) Next, the jig plate 20 to which the printed wiring board 10 is fixed is immersed in a molten solder bath so that the back surface of the printed wiring board 10 exposed to the opening 22 is in contact with the molten solder. 1 is soldered to the printed wiring board 10. Thereby, the electrolytic capacitor 1 is joined to the printed wiring board 10 by the solder 18, as shown in FIG.

本工程において、凹部１ｂ内の気体は溶融はんだにより加熱され膨張するが、膨張した気体は、挿通孔１１からでなく、貫通孔１２、流路部２３、貫通孔１３の順に通って、プリント配線板１０の上側に空間に放出される。したがって、はんだブローホールの発生を防止することができる。 In this step, the gas in the recess 1b is heated and expanded by the molten solder, but the expanded gas passes through the through hole 12, the flow path portion 23, and the through hole 13 in this order, not through the insertion hole 11, and the printed wiring. It is discharged into the space above the plate 10. Therefore, it is possible to prevent the occurrence of solder blow holes.

また、貫通孔１２，１３は互いに独立してプリント配線板１０に配置可能であるため、配線パターンと干渉しないように配置することが容易である。 Further, since the through holes 12 and 13 can be arranged on the printed wiring board 10 independently of each other, it is easy to arrange them so as not to interfere with the wiring pattern.

さらに、図３からわかるように、貫通孔１２，１３は治具板２０で覆われるため、はんだ付けの際に溶融はんだが貫通孔１２，１３を通ってプリント配線板１０の表面側に上がってくることがない。したがって、配線パターンや電子部品のリード線が溶融はんだによりショートすることや、電解コンデンサ１外周の樹脂被膜が溶融はんだで溶けることに起因する不具合を防止できる。 Further, as can be seen from FIG. 3, since the through holes 12 and 13 are covered with the jig plate 20, the molten solder passes through the through holes 12 and 13 and rises to the surface side of the printed wiring board 10 during soldering. Never come. Therefore, it is possible to prevent problems caused by short-circuiting of the wiring pattern or the lead wire of the electronic component by the molten solder, or melting of the resin film on the outer periphery of the electrolytic capacitor 1 by the molten solder.

上記の工程を経て、本実施形態に係る電子部品実装モジュールが作製される。この電子部品実装モジュールは、実装領域Ａの内側に挿通孔１１および貫通孔１２が設けられ、かつ実装領域Ａの外側に貫通孔１３が設けられたプリント配線板１０と、実装領域Ａにはんだ付けされた挿入形の電子部品である電解コンデンサ１とを備える。この電解コンデンサ１は挿通孔１１に挿通されたリード線１ａを有するとともに、底面に設けられた凹部１ｂがプリント配線板１０により蓋をされている。さらに、プリント配線板１０は、電解コンデンサ１をプリント配線板１０にはんだ付けする際に、厚さ方向に貫通する開口部２２と流路部２３とを有する治具板２０に固定され、その状態において、挿通孔１１は治具板２０の開口部２２に露出するとともに、貫通孔１２および貫通孔１３は治具板２０の流路部２３と連通する。 The electronic component mounting module according to this embodiment is manufactured through the above steps. This electronic component mounting module is soldered to the mounting area A and the printed wiring board 10 in which the insertion hole 11 and the through hole 12 are provided inside the mounting area A and the through hole 13 is provided outside the mounting area A. And an electrolytic capacitor 1 which is an inserted electronic component. The electrolytic capacitor 1 has a lead wire 1 a inserted through an insertion hole 11, and a concave portion 1 b provided on the bottom surface is covered with a printed wiring board 10. Furthermore, when the electrolytic capacitor 1 is soldered to the printed wiring board 10, the printed wiring board 10 is fixed to a jig plate 20 having an opening 22 and a flow path portion 23 that penetrates in the thickness direction. The through hole 11 is exposed to the opening 22 of the jig plate 20, and the through hole 12 and the through hole 13 communicate with the flow path portion 23 of the jig plate 20.

次に、電解コンデンサ１がはんだ付けされたプリント配線板１０を樹脂封止する場合について説明する。 Next, a case where the printed wiring board 10 to which the electrolytic capacitor 1 is soldered is resin-sealed will be described.

この場合、図６に示すように、プリント配線板１０には、実装領域Ａの外側に樹脂注入口１５が設けられ、かつ実装領域Ａの内側に貫通孔１６がさらに設けられる。樹脂注入口１５および貫通孔１６は、貫通孔１６と樹脂注入口１５との間の距離が貫通孔１２と樹脂注入口１５との間の距離よりも長くなるように設けられる。 In this case, as shown in FIG. 6, the printed wiring board 10 is provided with a resin injection port 15 on the outer side of the mounting region A and further provided with a through hole 16 on the inner side of the mounting region A. The resin injection port 15 and the through hole 16 are provided such that the distance between the through hole 16 and the resin injection port 15 is longer than the distance between the through hole 12 and the resin injection port 15.

前述のはんだ付け工程の後、プリント配線板１０を治具板２０から取り外し、図６に示すように、電解コンデンサ１が実装された面を上側にして樹脂封止用容器３０内にプリント配線板１０を配置する。そして、樹脂注入口１５を介して溶融樹脂３１をプリント配線板１０の上側からプリント配線板１０と樹脂封止用容器３０の底面との間の隙間Ｓに注入する。これにより、プリント配線板１０の裏面を溶融樹脂３１で覆うとともに、貫通孔１６を介して凹部１ｂ内の気体を外部に放出させながら貫通孔１２を介して溶融樹脂３１を凹部１ｂに注入する。なお、プリント配線板１０の裏面に放出された凹部１ｂ内の気体は、プリント配線板１０と樹脂封止用容器３０との間の隙間（図示せず）を通って外部に放出される。 After the above-described soldering process, the printed wiring board 10 is removed from the jig plate 20, and as shown in FIG. 6, the printed wiring board is placed in the resin sealing container 30 with the surface on which the electrolytic capacitor 1 is mounted facing upward. 10 is arranged. Then, the molten resin 31 is injected into the gap S between the printed wiring board 10 and the bottom surface of the resin sealing container 30 from the upper side of the printed wiring board 10 through the resin injection port 15. Accordingly, the back surface of the printed wiring board 10 is covered with the molten resin 31 and the molten resin 31 is injected into the concave portion 1b through the through hole 12 while releasing the gas in the concave portion 1b to the outside through the through hole 16. The gas in the recess 1b released to the back surface of the printed wiring board 10 is released to the outside through a gap (not shown) between the printed wiring board 10 and the resin sealing container 30.

このように貫通孔１６を設けておくことにより、樹脂封止後に凹部１ｂ内に気体が残留することを防止できる。その結果、熱硬化性の溶融樹脂３１を硬化させるための加熱工程において、凹部１ｂ内に残留した気体が電解コンデンサ１の底面とプリント配線板１０の実装面との間を通って外部に出ることで発生するモールドボイドを防ぐことが可能となる。その結果、モールドボイドを樹脂で埋めるリペア工程が不要になり、製造工数・コストを削減することができる。 By providing the through hole 16 in this way, it is possible to prevent gas from remaining in the recess 1b after resin sealing. As a result, in the heating step for curing the thermosetting molten resin 31, the gas remaining in the recess 1 b passes outside between the bottom surface of the electrolytic capacitor 1 and the mounting surface of the printed wiring board 10. It is possible to prevent mold voids generated in the process. As a result, a repair process for filling the mold void with the resin becomes unnecessary, and the number of manufacturing steps and costs can be reduced.

なお、樹脂注入口１５を設けずに、貫通孔１３から溶融樹脂を注入してもよい。この場合、貫通孔１６は、貫通孔１６と貫通孔１３との間の距離が貫通孔１２と貫通孔１３との間の距離よりも長くなる位置に設けられる。 Note that the molten resin may be injected from the through hole 13 without providing the resin injection port 15. In this case, the through hole 16 is provided at a position where the distance between the through hole 16 and the through hole 13 is longer than the distance between the through hole 12 and the through hole 13.

上述した実施形態では、底面に凹部を有する挿入型の電子部品として電解コンデンサを挙げたが、本発明はこれに限らず、底面に凹部を有する他の挿入型の電子部品を実装する場合にも適用可能である。そのような電子部品として、例えば、下面からリード線が突出したトランスの上面および側面がカバー体により覆われ、カバー体とトランスとの間に樹脂が充填されているカバー付きトランスが挙げられる。このようなカバー付きトランスでは、下面に露出した樹脂が凹んで、電解コンデンサ１の凹部１ｂに相当する凹部が形成される。 In the above-described embodiment, an electrolytic capacitor is cited as an insertion type electronic component having a recess on the bottom surface. However, the present invention is not limited to this, and the present invention is not limited to this, and also when other insertion type electronic components having a recess on the bottom surface are mounted. Applicable. As such an electronic component, for example, a transformer with a cover in which a top surface and a side surface of a transformer from which a lead wire protrudes from a bottom surface is covered with a cover body, and a resin is filled between the cover body and the transformer. In such a transformer with a cover, the resin exposed on the lower surface is recessed, and a recess corresponding to the recess 1b of the electrolytic capacitor 1 is formed.

また、ビアホールを上述の貫通孔として利用してもよい。例えば、図７に示すように、プリント配線板１０の異なる層に設けられた配線パターン４１，４２を電気的に接続するビアホール１９を、凹部１ｂ内の気体を放出する貫通孔として利用してもよい。この例では、ビアホール１９は実装領域Ａの内側に設けられており、前述の貫通孔１２の機能を果たす。このような手法は、実際のプリント配線板の設計の観点から言えば、ビアホールを実装領域Ａ内に設けて前述の貫通孔１２として機能させることに相当する。なお、同様に、実装領域Ａの外側にビアホールを設けて、前述の貫通孔１３として機能させてもよい。 A via hole may be used as the above-described through hole. For example, as shown in FIG. 7, the via hole 19 that electrically connects the wiring patterns 41 and 42 provided in different layers of the printed wiring board 10 may be used as a through hole that releases the gas in the recess 1 b. Good. In this example, the via hole 19 is provided inside the mounting area A and functions as the above-described through hole 12. From the viewpoint of actual printed wiring board design, such a method corresponds to providing a via hole in the mounting area A and functioning as the above-described through hole 12. Similarly, via holes may be provided outside the mounting area A so as to function as the aforementioned through holes 13.

上記の記載に基づいて、当業者であれば、本発明の追加の効果や種々の変形を想到できるかもしれないが、本発明の態様は、上述した個々の実施形態に限定されるものではない。異なる実施形態にわたる構成要素を適宜組み合わせてもよい。特許請求の範囲に規定された内容及びその均等物から導き出される本発明の概念的な思想と趣旨を逸脱しない範囲で種々の追加、変更及び部分的削除が可能である。 Based on the above description, those skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. . You may combine suitably the component covering different embodiment. Various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

１電解コンデンサ
１ａリード線
１ｂ凹部
１０プリント配線板
１１挿通孔
１２，１３貫通孔
１４電子部品
１５樹脂注入口
１６貫通孔
１７切り欠き部
１８はんだ
１９ビアホール
２０治具板
２１格納部
２２開口部
２３流路部
２４切り欠き部
３０樹脂封止用容器
３１溶融樹脂
４１，４２配線パターン
Ａ実装領域
Ｓ隙間 DESCRIPTION OF SYMBOLS 1 Electrolytic capacitor 1a Lead wire 1b Recessed part 10 Printed wiring board 11 Insertion hole 12, 13 Through hole 14 Electronic component 15 Resin injection port 16 Through hole 17 Notch part 18 Solder 19 Via hole 20 Jig board 21 Storage part 22 Opening part 23 Current Road portion 24 Notch portion 30 Resin sealing container 31 Molten resin 41, 42 Wiring pattern A Mounting region S Clearance

Claims

A method of manufacturing an electronic component mounting module in which an insertion type electronic component having a recess on a bottom surface is soldered,
Inserting the lead wire of the electronic component into the insertion hole of the printed wiring board, and mounting the electronic component on the mounting region of the printed wiring board,
The printed wiring board is fixed to a jig board, and the insertion hole of the printed wiring board is exposed to an opening that penetrates the jig board in the thickness direction, and the inside of the mounting area of the printed wiring board. The first through hole provided in the second and the second through hole provided outside the mounting region are formed so as to be recessed from the upper surface of the jig plate on which the printed wiring board is placed. A printed wiring board fixing step of communicating the recess with the upper space of the printed wiring board by communicating with a portion;
The jig board to which the printed wiring board is fixed is immersed in a molten solder bath so that the back surface of the printed wiring board exposed to the opening is in contact with the molten solder, and the electronic component is placed in the printed wiring board. Soldering to the soldering process,
An electronic component mounting module manufacturing method comprising:

In the printed wiring board, instead of the second through hole, a notch for communicating the flow path portion of the jig plate and the space above the printed wiring board at the end of the printed wiring board The method for manufacturing an electronic component mounting module according to claim 1, wherein a portion is provided.

In place of the second through-hole of the printed wiring board, a gas discharge means is provided in the jig plate for communicating the flow path portion and the space above the printed wiring board. The manufacturing method of the electronic component mounting module of Claim 1 characterized by these.

In the printed wiring board, a resin injection port is provided outside the mounting region, and a third through hole is further provided inside the mounting region,
The distance between the third through hole and the resin injection port is longer than the distance between the first through hole and the resin injection port,
After the soldering step, the printed wiring board is removed from the jig plate and placed in the resin injection container with the surface on which the electronic component is mounted facing upward, and the molten resin is injected through the resin injection port. By injecting into the gap between the printed wiring board and the bottom surface of the container from the upper side of the printed wiring board, the back surface of the printed wiring board is covered with the molten resin, and through the third through hole. 4. A resin sealing step of injecting the molten resin into the recess through the first through hole while releasing the gas in the recess of the electronic component to the outside. The manufacturing method of the electronic component mounting module in any one of.

The printed wiring board is further provided with a third through hole inside the mounting region, and the distance between the third through hole and the second through hole is the same as the first through hole. Longer than the distance between the second through holes,
After the soldering step, the printed wiring board is removed from the jig plate, placed in the resin injection container with the surface on which the electronic component is mounted facing upward, and melted through the second through hole. By injecting resin into the gap between the printed wiring board and the bottom surface of the container from above the printed wiring board, the back surface of the printed wiring board is covered with the molten resin, and the third through hole is formed. 2. A resin sealing step of injecting the molten resin into the recess through the first through hole while releasing the gas in the recess of the electronic component to the outside via the first through hole. The manufacturing method of the electronic component mounting module of description.

Prior to the electronic component mounting step, the surface mounted electronic component is covered with the flow path portion of the jig plate in a state where the printed wiring board is fixed to the jig plate. The method of manufacturing an electronic component mounting module according to claim 1, further comprising a step of soldering to a region of the back surface of the electronic component mounting module.

The insertion-type electronic component is an electrolytic capacitor or a transformer with a cover in which a top surface and a side surface of a transformer are covered with a cover body, and a resin is filled between the cover body and the transformer. The manufacturing method of the electronic component mounting module in any one of Claim 1 thru | or 6.

A via hole that electrically connects wiring patterns provided in different layers of the printed wiring board is used as at least one of the first through hole and the second through hole. Item 8. A method for manufacturing an electronic component mounting module according to any one of Items 1 to 7.