JP5772324B2 - Test method, test apparatus and test board - Google Patents

Description

  The present invention relates to a test method, a test apparatus, and a test board. For example, the present invention relates to a test method, a test apparatus, and a test board for mounting a current measuring device for power supply current and a device to be inspected on the test board.

  There is a burn-in test as a method of selecting an initial defective product of a device such as a semiconductor device. The burn-in test is a test in which voltage acceleration and temperature acceleration are combined. For example, the device under test (DUT) is electrically operated in a high temperature environment. For example, if the characteristic falls outside the predetermined range within a predetermined time, the device is determined to be defective.

  When performing a burn-in test on a plurality of devices to be inspected, a method is known in which a current measuring device for measuring the power supply current of each device is provided and whether the device is good or bad is determined based on the power supply current (for example, Patent Document 1). ~ 4).

JP 2000-206176 A JP 2006-84369 A Japanese Patent Laid-Open No. 5-87874 JP 2005-531010 A

  However, for example, when the power supply current of the inspection target device is small, there is a problem that the power supply current of the inspection target device cannot be measured more accurately. For this reason, it is not possible to accurately determine whether the inspection target device is good or bad.

  The purpose of the present test method, test apparatus, and test board is to more accurately measure the power supply current of a device to be inspected and to determine whether the device to be inspected is good or bad.

For example, a plurality of devices to be inspected are mounted on a test board having a plurality of current measuring devices that respectively measure power supply currents of the plurality of devices to be inspected, a burn-in test of the devices to be inspected is performed, and the plurality of devices to be inspected A test for determining whether the burn-in test is good , defective, or pending for each of the plurality of devices to be inspected based on a slope of the plurality of devices to be inspected with respect to time measured by the current measuring apparatus. Use the method.

For example, a plurality of sockets each mounting a plurality of devices to be inspected, a plurality of current measuring devices that respectively measure power supply currents of the plurality of devices to be inspected, the plurality of sockets, and the plurality of current measuring devices. Based on the inclination with respect to time of the power supply current of the plurality of devices to be inspected measured by the test board and the plurality of current measuring devices , whether each of the plurality of devices to be inspected is judged as good , bad or pending. And a test device including a determination unit.

For example, a plurality of sockets and a plurality of current measuring device for measuring the power supply current of said plurality of device under test, respectively, the plurality of inspection object, wherein the plurality of current measuring devices to measure for mounting a plurality of the device under test, respectively A burn-in test board comprising: a determination unit configured to determine whether the burn-in test is good, defective, or suspended for each of the plurality of devices to be inspected based on a slope of a power supply current of the device with respect to time. Use.

  According to this test method, test apparatus, and test board, the power supply current of the device to be inspected can be measured more accurately, and the quality of the device to be inspected can be determined more accurately or not.

FIG. 1 is a schematic diagram of a burn-in test apparatus according to the first embodiment. FIG. 2 is a plan view of the burn-in board. FIG. 3 is an enlarged view of the socket and the current measurement determination unit. FIG. 4 is a flowchart illustrating the burn-in test method according to the first embodiment. FIG. 5 is a schematic diagram showing the power supply current of each device to be inspected. FIG. 6 is a schematic diagram showing the power supply current of each device to be inspected. FIG. 7 is a schematic diagram showing a power supply current with respect to time of a device to be inspected. FIG. 8 is a flowchart illustrating the burn-in test method according to the second embodiment. FIG. 9 is a schematic diagram showing a power supply current with respect to time of a device to be inspected which is defective. FIG. 10 is a flowchart illustrating the burn-in test method according to the third embodiment.

  Embodiments will be described below with reference to the drawings.

  FIG. 1 is a schematic diagram of a burn-in test apparatus according to the first embodiment. As shown in FIG. 1, the burn-in test apparatus 100 includes a heating chamber 30 and a power supply chamber 32. One or more burn-in boards 10 can be installed in the heating chamber 30. The burn-in board 10 is electrically connected to the power source 36 and the signal source 38 by inserting the connector 20 into the connector 37. A heating device 34 is provided in the heating chamber 30. The heating device 34 is a device that sends air heated by a heat source, for example. Thereby, each device to be inspected is kept at a constant temperature.

  FIG. 2 is a plan view of the burn-in board. Referring to FIG. 2, a plurality of sockets 12 and a plurality of current measurement determination units 14 are mounted on burn-in board 10 which is a test board for burn-in. The burn-in board 10 includes a plurality of sockets 12 and a plurality of current measurement determination units 14. An inspection target device 16 is mounted on the socket 12. The burn-in board 10 is a multilayer substrate in which a plurality of insulating layers such as glass epoxy resins are stacked. In each layer, wiring such as Cu is formed. A power line 22 is wired from the connector 20 to each socket 12 via the current measurement determination unit 14. The power supply line 22 supplies a power supply voltage from the power supply 36 of FIG. A signal line 24 is wired from the connector 20 to each socket 12. The signal line 24 supplies an operation signal from the signal source 38 of FIG. Thereby, the inspection target device 16 mounted on each socket 12 operates. A data line 26 is wired from the current measurement determination unit 14 to the processing unit 28. In FIG. 2, the power supply line 22, the signal line 24, and the data line 26 are described for some sockets 12, but the power supply line 22, the signal line 24, and the data line 26 are wired to all the sockets 12. Has been. In FIG. 2, the inspection target devices 16 are mounted on some of the sockets 12, but the inspection target devices 16 may be mounted on all the sockets 12.

  FIG. 3 is an enlarged view of the socket and the current measurement determination unit. As shown in FIG. 3, the current measurement determination unit 14 includes a current measurement device 18 and a determination unit 19. The current measuring device 18 is, for example, a DC ammeter or an AC ammeter. The current measuring device 18 measures the power supply current supplied to the device under test 16 via the socket 12. The determination unit 19 determines whether the burn-in test is good or bad for the inspection target device 16 based on the power supply current of the inspection target device 16 measured by the current measuring device 18. The determination unit 19 may be formed of hardware. An MPU (Micro Processing Unit) or the like may function as the determination unit 19 by software. The determination unit 19 outputs a determination result to the processing unit 28 via the data line 26. The processing unit 28 processes the determination result from the determination unit 19. The MPU may function as the processing unit 28 by software. The determination unit 19 may be provided in the processing unit 28. That is, the MPU that functions as the processing unit 28 may function as the determination unit 19. Further, the processing unit 28 may be provided outside the burn-in board 10.

  FIG. 4 is a flowchart illustrating the burn-in test method according to the first embodiment. As shown in FIG. 4, a plurality of devices 16 to be inspected are mounted on the burn-in board 10 on which a plurality of current measuring devices 18 are mounted (step S10). The plurality of current measuring devices 18 respectively measure the power supply currents of the plurality of devices 16 to be inspected. Next, a burn-in test is set (step S12). For example, the measurement range of the current measuring device 18 is set, the determination condition of the determination unit 19 is set, and the burn-in test time and temperature are set. Next, the inspection target device 16 is heated, and a power supply current and an operation signal are supplied to the inspection target device 16. Thereby, the burn-in test of the plurality of devices 16 to be inspected is started (step S14).

  Next, after the burn-in test time has elapsed, the current measurement device 18 measures the power supply current of the device 16 to be inspected (step S15). The determination unit 19 determines whether the burn-in test is good or defective for each of the plurality of inspection target devices 16 based on the power supply currents of the plurality of inspection target devices 16 measured by the plurality of current measuring devices 18 (step S16). In the case of good, the determination unit 19 sets the inspection target device 16 as a good product (step S18). If defective, the determination unit 19 sets the device 16 to be inspected as a defective product (step S20). For example, the determination unit 19 outputs information indicating whether the corresponding inspection target device 16 is a good product or a defective product to the processing unit 28. The processing unit 28 can recognize whether each of the plurality of inspection target devices 16 is a non-defective product or a defective product. Then, the process ends.

  As a temperature of the burn-in test, typically, for example, any temperature of 80 ° C. to 125 ° C. can be used. As shown in FIG. 1, the inspection target device 16 may be maintained at a high temperature by blowing heated air into the heating chamber 30, but a heater is provided for each inspection target device 16 to maintain the inspection target device 16 at a high temperature. May be. When the temperature of the burn-in test is high, the operations of the current measuring device 18 and the determination unit 19 may become unstable. In such a case, it is preferable to provide a heater for each device 16 to be inspected.

  According to the first embodiment, as in step S10 of FIG. 4, the burn-in board 10 on which the plurality of inspection target devices 16 and the plurality of current measuring devices 18 that respectively measure the power supply currents of the plurality of inspection target devices 16 are mounted. To be installed. As in step S <b> 16, whether the burn-in test is good or bad is determined for each of the plurality of inspection target devices 16 based on the power supply currents of the plurality of inspection target devices 16 measured by the plurality of current measuring apparatuses 18. In this way, the current measuring device 18 is mounted on the same burn-in board 10 as the device 16 to be inspected. As a result, even when the power supply current of each device 16 to be inspected is small (for example, several μA or less), the power supply current of the device 16 to be inspected can be measured more accurately.

  As shown in FIG. 2, the current measuring device corresponding to a certain inspection target device is arranged closer to the inspection target device adjacent to the certain inspection target device. For example, the current measuring device 18 corresponding to one inspection target device among the plurality of inspection target devices 16 is burn-in board so as to be closer to the one inspection target device than the inspection target device adjacent to the one inspection target device. 10 is arranged. Thereby, the current measuring device 18 can be arranged near the device 16 to be inspected. Therefore, the power supply current of the device 16 to be inspected can be measured more accurately.

  Next, a determination method for the burn-in test performed by the determination unit 19 will be described. FIG. 5 is a schematic diagram showing the power supply current of each device to be inspected. As shown in FIG. 5, after a predetermined burn-in test time has elapsed since the start of the burn-in test, each current measuring device 18 measures the power supply current of each device 16 to be inspected. The determination unit 19 determines that the inspection target device 16 is a non-defective product when the power supply current value of the inspection target device 16 is within a predetermined range (for example, the upper limit threshold or less and the lower limit threshold or more). In FIG. 5, white circles indicate that the products are non-defective. When the power supply current value of the device to be inspected 16 is outside a predetermined range (for example, greater than the upper threshold or less than the lower threshold), the determination unit 19 determines that the device 16 to be inspected is defective. In FIG. 5, black circles indicate defective products. The determination unit 19 outputs the determination result or / and the power supply current value of each inspection target device 16 to the processing unit 28 via the data line 26. The processing unit 28 can recognize whether each inspection target device 16 is good or bad. As described above, whether the burn-in test is good or bad can be determined based on whether the power supply currents of the plurality of devices 16 to be inspected are within a predetermined range.

  FIG. 6 is a schematic diagram showing the power supply current of each device to be inspected. As shown in FIG. 6, after the burn-in test time has elapsed since the start of the burn-in test, each current measuring device 18 measures the power supply current of each device 16 to be inspected. The current measuring device 18 outputs the power supply current value data of each inspection target device 16 to the processing unit 28 via the data line 26. The processing unit 28 calculates a good or bad determination criterion based on the power supply current value of each inspection target device 16. For example, the processing unit 28 calculates the average of the power supply current values of the plurality of inspection target devices 16. The processing unit 28 sets a value larger than the average value as an upper limit threshold and a value smaller than the average value as a lower limit threshold. For example, a value obtained by adding a predetermined value to the average value may be set as the upper limit threshold value, and a value obtained by subtracting the predetermined value from the average value may be set as the lower limit threshold value. Alternatively, the average value may be multiplied by a predetermined rate to obtain an upper limit threshold and a lower limit threshold. The determination unit 19 determines whether each inspection target device 16 is good or bad based on the range set by the processing unit 28. In this way, the range for determining whether the burn-in test is good or bad can be calculated from the power supply currents of the plurality of devices 16 to be inspected.

  Example 2 is an example in which the power supply current of the device 16 to be inspected is measured at regular or indefinite times. The burn-in test apparatus and the burn-in board have the same configurations as those shown in FIGS.

  FIG. 7 is a schematic diagram showing a power supply current with respect to time of a device to be inspected. After starting the burn-in test, the current measuring device 18 measures the power supply current of the device 16 to be inspected at regular or indefinite times. If the power supply current hardly changes even after the burn-in test time as shown by the white circles in FIG. 7, the determination unit 19 determines that the device 16 to be inspected is a non-defective product. When the power supply current has changed more than a predetermined amount from the previous power supply current as in the case of the black circle (when the inclination illustrated by the dotted line in FIG. 7 is large), the determination unit 19 determines that the inspection target device 16 is defective. For example, the determination unit 19 can also determine that the device 16 to be inspected is defective when the power supply current changes a predetermined number of times continuously for a predetermined number of times. Thus, the determination of good or bad can be made based on the slope of the power supply current of the plurality of devices 16 to be inspected with respect to time.

  Furthermore, as shown by the white triangle in FIG. 7, when the power supply current increases rapidly in the early time from the start of the burn-in test, there is a possibility that the device under test 16 and the socket 12 are short-circuited. As shown by the black triangle, when the power supply current sharply decreases at an early time from the start of the burn-in test, there is a possibility that the device under test 16 and the socket 12 are open for contact. In these cases, there is a problem of contact between the socket 12 and the inspection target device 16, and the inspection target device 16 may be a non-defective product.

  FIG. 8 is a flowchart illustrating the burn-in test method according to the second embodiment. As shown in FIG. 8, the device to be inspected (black circle device in FIG. 7) determined to be defective by the determination unit 19 in step S16 ends the burn-in test (step S22). It is determined whether or not the non-defective device has reached the burn-in test time (step S24). If yes, end. In No, it progresses to step S15 and a burn-in test is continued. In step S <b> 16, the determination unit 19 determines that the inspection target device 16 and the socket 12 are on hold when there is a possibility that the contact short circuit or the open state exists. In the case of hold, the burn-in test is interrupted, and the hold target device 16 is remounted in the socket 12 (step S26). Returning to step S14, a burn-in test is performed. As described above, among the plurality of devices 16 to be inspected, a device to be inspected whose power source current is equal to or higher than a predetermined value within a predetermined time from the start of the burn-in test is determined to be a pending product. The burn-in test will be performed again for the hold items. Thereby, it can suppress that the inspection object device of a contact defect is determined to be a defective product.

  Example 3 is an example in which the burn-in test time is changed after the burn-in test. FIG. 9 is a schematic diagram showing a power supply current with respect to time of a device to be inspected which is defective. Time t1 indicates the burn-in test time. As shown in FIG. 9, the device 16 to be inspected becomes defective before time t2. Therefore, the processing unit 28 changes the burn-in test time to time t2. Thereby, the burn-in test time can be shortened.

  FIG. 10 is a flowchart illustrating the burn-in test method according to the third embodiment. The processing unit 28 resets the burn-in test time after steps S18 and S20 as shown in FIG. 9 (step S30). For example, as shown in FIG. 9, when all the devices to be inspected that are defective in step S20 are defective before time t2, the time for performing the burn-in test is reset to time t2. Then exit. Next, when a burn-in test is performed, a new burn-in test time is set in step S12. Thus, the processing unit 28 sets the time for performing the burn-in test based on the time when the plurality of devices 16 to be inspected become defective. Thereby, the burn-in test time can be shortened.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

Regarding the embodiment including Examples 1 to 3, the following additional notes are disclosed.
Appendix 1:
A plurality of devices to be inspected are mounted on a test board having a plurality of current measuring devices that respectively measure power supply currents of the plurality of devices to be inspected, a burn-in test of the plurality of devices to be inspected is performed, and the plurality of current measurements A test method comprising: determining whether the burn-in test is good or defective for each of the plurality of devices to be inspected based on power supply currents of the plurality of devices to be inspected measured by the apparatus.
Appendix 2:
The current measuring device corresponding to one inspection target device among the plurality of inspection target devices is arranged on the test board at a position closer to the one inspection target device than the inspection target device adjacent to the one inspection target device. The test method according to appendix 1, wherein:
Appendix 3:
3. The test method according to appendix 1 or 2, wherein a time for performing a next burn-in test is set based on times when the plurality of devices to be inspected become defective.
Appendix 4:
The burn-in test is performed again on any of the plurality of devices to be inspected, wherein the device to be inspected whose power source current is equal to or higher than a predetermined value within a predetermined time after the start of burn-in is performed. Test method according to item.
Appendix 5:
The test method according to any one of appendices 1 to 4, wherein the determination is performed based on whether or not a power supply current of the plurality of devices to be inspected is within a predetermined range.
Appendix 6:
The test method according to claim 5, wherein the range is a range calculated based on a power supply current of the plurality of devices to be inspected.
Appendix 7:
The test method according to any one of appendices 1 to 3, wherein the determination is performed based on a slope of a power supply current of the plurality of devices to be inspected with respect to time.
Appendix 8:
A test board having a plurality of sockets each mounting a plurality of devices to be inspected, a plurality of current measuring devices that respectively measure power supply currents of the plurality of devices to be inspected, and the plurality of sockets and the plurality of current measuring devices And a determination unit that determines whether the burn-in test is good or defective for each of the plurality of inspection target devices based on the power supply currents of the plurality of inspection target devices measured by the plurality of current measuring devices. Test equipment characterized by
Appendix 9:
A burn-in test board comprising: a plurality of sockets each mounting a plurality of devices to be inspected; and a plurality of current measuring devices for respectively measuring power supply currents of the plurality of devices to be inspected.

DESCRIPTION OF SYMBOLS 10 Burn-in board 12 Socket 14 Current measurement judgment part 16 Inspection object device 18 Power supply measuring device 19 Judgment part 28 Processing part

Claims (6)

A plurality of devices to be inspected are mounted on a test board having a plurality of current measuring devices that respectively measure power supply currents of the plurality of devices to be inspected.
Perform a burn-in test of the plurality of devices to be inspected,
Determining whether the burn-in test is good , defective, or suspended for each of the plurality of devices to be inspected based on a slope of a power supply current of the plurality of devices to be inspected measured by the plurality of current measuring devices with respect to time; Test method.   The current measuring device corresponding to one inspection target device among the plurality of inspection target devices is arranged on the test board at a position closer to the one inspection target device than the inspection target device adjacent to the one inspection target device. The test method according to claim 1, wherein:   3. The test method according to claim 1, wherein a time for performing a next burn-in test is set based on times when the plurality of devices to be inspected become defective. 4. The test method according to claim 1, wherein a burn-in test is performed again on the inspection target device determined to be on hold among the plurality of inspection target devices. 5. A plurality of sockets each mounting a plurality of devices to be inspected;
A plurality of current measuring devices that respectively measure power supply currents of the plurality of devices to be inspected;
A test board having the plurality of sockets and the plurality of current measuring devices;
A determination unit that determines whether the burn-in test is good , defective, or on hold for each of the plurality of devices to be inspected, based on a slope of the plurality of devices to be inspected with respect to time measured by the plurality of current measuring devices,
A test apparatus comprising: A plurality of sockets each mounting a plurality of devices to be inspected;
A plurality of current measuring devices that respectively measure power supply currents of the plurality of devices to be inspected;
A determination unit that determines whether the burn-in test is good, defective, or on hold for each of the plurality of devices to be inspected, based on a slope of the plurality of devices to be inspected with respect to time measured by the plurality of current measuring devices,
A test board for burn-in, comprising:

Images