JP5773976B2 - refrigerator - Google Patents

Description

  The present invention relates to a power conversion device and a refrigerator including the power conversion device.

  A power converter provided in many electric products such as refrigerators includes a semiconductor device. Such a semiconductor device generates heat due to the operation of the power conversion device, and therefore requires a heat dissipation mechanism such as a heat sink. Patent Document 1 discloses a refrigerator that uses a metal cover that covers a control electronic component storage chamber as a heat sink.

Japanese Patent No. 3704250

  However, in the conventional technology, it is necessary to secure a space when a heat sink is used. In addition, when a metal cover that covers the electronic component storage chamber for control is used as a heat sink, the metal cover must be provided in contact with the heat-generating semiconductor device, the position where the component is mounted, and the component to be provided There is a problem that the degree of freedom of layout of parts is small due to restrictions on the size of the parts.

This invention is made | formed in view of the above, Comprising: It aims at obtaining the refrigerator with the high freedom degree of layout of components.

To solve the above problems and achieve the object, the refrigerator of the present invention, a power conversion device in which one or more semiconductor devices mounted on the electronic printed circuit board is housed in the electric component box shape that is bent A refrigerator including the inside, wherein the electrical box constitutes a part of a housing, a heat receiving portion provided in contact with the semiconductor device, a bent heat transfer provided in contact with the heat receiving portion And a heat pipe having a heat radiating part provided in contact with the heat transfer part, the semiconductor device and the heat receiving part are arranged on a side surface or a back surface of the housing, and a heat radiating surface of the heat radiating part is It is arranged along the upper surface of the casing, the heat dissipating part is arranged at a position higher than the heat receiving part, and the refrigerant in the heat pipe has a structure that circulates spontaneously by gravity and a temperature gradient. And

  According to the present invention, it is possible to obtain an electrical product with a high degree of freedom in component layout.

FIG. 1 is a diagram illustrating a configuration of the power conversion apparatus according to the first embodiment. FIG. 2 is a diagram illustrating the refrigerator according to the first embodiment. FIG. 3 is a diagram of a configuration of the power conversion device according to the second embodiment. FIG. 4 is a diagram illustrating the refrigerator according to the second embodiment. FIG. 5 is a diagram of a configuration of the power conversion apparatus according to the third embodiment. FIG. 6 is a diagram of a configuration of the power conversion device according to the fourth embodiment.

  Embodiments of a refrigerator according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a diagram illustrating a configuration of a first embodiment of a power conversion device mounted on an electrical product according to the present invention.

  The power conversion apparatus shown in FIG. 1 includes a cover 1, an electronic printed circuit board 2 fixed to the cover 1, a semiconductor device 3 fixed to the electronic printed circuit board 2, a fixed member 4, and a semiconductor using the fixed member 4. A heat receiving unit 5 fixed to the device 3, a heat transfer unit 6 that transmits heat of the heat receiving unit 5, and a heat dissipating unit 7 that is disposed at a position away from the heat receiving unit 5 and is in contact with the heat transfer unit 6. A high heat conduction plate 8a provided between the semiconductor device 3 and the heat receiving portion 5, a high heat conduction plate 8b provided in contact with the heat radiating surface of the heat radiating portion 7, and an electrical component box 9 in which all of these components are housed. And an aluminum electrolytic capacitor 11 provided on the electronic printed circuit board 2.

  The material of the cover 1 is an insulating material, and is a material having heat resistance and corrosion resistance enough to withstand the use environment. Examples of such materials include synthetic resins such as polyethylene and polypropylene.

  The electronic printed circuit board 2 is a plate-like component on which the semiconductor device 3 is arranged, and is fitted to the cover 1 as shown in FIG.

  The semiconductor device 3 performs control and the like for operating the power conversion device, and is attached to the electronic printed circuit board 2 using, for example, solder.

  An example of the fixing member 4 is a screw.

  The heat receiving unit 5 is a component that receives heat generated by the semiconductor device 3.

  The heat transfer unit 6 is a component that transfers the heat of the heat receiving unit 5 to the heat radiating unit 7 and includes a refrigerant therein.

  The heat radiating unit 7 is a component that releases heat conducted through the heat transfer unit 6. The heat dissipating part 7 does not have a fin-like structure or the like, and is a flat structure that is not subjected to uneven processing. Therefore, the occupied space can be made smaller than that of the heat dissipating part having the conventional fin-like structure.

  The high heat conductive plates 8a and 8b are provided so that the heat conduction between the semiconductor device 3 and the heat receiving portion 5 and between the heat radiating portion 7 and the electrical component box 9 is smooth. The material of the conductive plates 8a and 8b is a material having high thermal conductivity. In addition, when the calorific value of the semiconductor device 3 is not large, one or both of the high heat conductive plates 8a and 8b may not be provided.

  The electrical component box 9 only needs to have heat resistance, corrosion resistance, and mechanical strength that can withstand the use environment.

  The heat receiving part 5, the heat transfer part 6 and the heat radiating part 7 constitute a heat pipe, and the heat radiating part 7 is arranged at a position higher than the heat receiving part 5. The heat generated by the semiconductor device 3 is transferred from the heat receiving portion 5 to the heat radiating portion 7 via the heat transfer portion 6 and is released from the electrical component box 9.

  Since the heat radiating part 7 is arranged at a position higher than the heat receiving part 5, the refrigerant in the heat pipe heated by the heat receiving part 5 flows to the heat radiating part 7. Thus, since a refrigerant | coolant flows naturally from the heat receiving part 5 to the thermal radiation part 7, the pump for circulating a refrigerant | coolant is unnecessary.

  That is, the power conversion device according to the present embodiment is a power conversion device in which one or a plurality of semiconductor devices 3 mounted on the electronic printed circuit board 2 are housed in an electrical component box 9, and is in contact with the semiconductor device 3. The heat receiving portion 5 provided, the heat transfer portion 6 provided in contact with the heat receiving portion 5, and the heat pipe provided with the heat radiating portion 7 provided in contact with the heat transfer portion 6, It is arranged along the outline of the electrical component box 9, the heat radiating part 7 is arranged at a position higher than the heat receiving part 5, and the refrigerant in the heat pipe is structured to circulate spontaneously by gravity and a temperature gradient. Features. The heat radiation surface is a surface having the maximum area of the heat radiation portion 7 and is a surface opposite to the semiconductor device 3.

  As described above, since the heat receiving part 5 and the heat radiating part 7 are arranged away from each other using a heat pipe, components such as the semiconductor device 3 to which the heat receiving part 5 is attached can be arranged with a higher degree of freedom than in the past. it can. In addition, a precise tolerance is not required for fixing the position of the electronic printed circuit board 2, and the cost can be reduced.

  Moreover, since the heat receiving part 5 and the heat radiating part 7 are arranged at positions separated from each other, the semiconductor device 3 and the heat radiating part 7 are also arranged at positions separated from each other. It is also possible to use low parts. Therefore, the size of the electronic printed circuit board 2 can be reduced by arranging the components so as to minimize the loop through which the current flows. Further, by selecting a component that suppresses the generation of noise, a configuration that suppresses the influence of exogenous noise can be achieved.

  By the way, the power converter device of this Embodiment is applicable to a refrigerator. FIG. 2 is a diagram showing an arrangement when the power conversion device of FIG. 1 is applied to the refrigerator 13. Thus, the power converter device of this Embodiment is arrange | positioned so that a thermal radiation surface may become substantially parallel to the side surface or back surface of a refrigerator.

  Thus, by applying the power converter shown in FIG. 1, a highly efficient, inexpensive, and reliable refrigerator can be obtained.

Embodiment 2. FIG.
FIG. 3 is a diagram showing a configuration of a second embodiment of a power conversion device mounted on an electrical product according to the present invention.

  The power converter shown in FIG. 3 includes a bent heat transfer portion 6a instead of the heat transfer portion 6 of FIG. 1, and includes an electric component box 9a instead of the electric component box 9, and other configurations are illustrated in FIG. 1 is the same as the power converter shown in FIG.

  Since the power converter shown in FIG. 3 includes the bent heat transfer section 6a, the direction in which the high heat conduction plate 8b in contact with the heat radiating section 7 faces is different from the power converter shown in FIG. That is, the direction of the heat dissipation surface is different.

  FIG. 4 is a diagram showing an arrangement when the power conversion device of FIG. 3 is applied to the refrigerator 13a. Thus, in the power converter device of this Embodiment, it arrange | positions so that a thermal radiation surface may become substantially parallel to the upper surface of a refrigerator. Therefore, since the refrigerator 13a of this Embodiment can make a side surface or a back surface narrower than the refrigerator 13 of Embodiment 1, there exists a specific effect that height can be made low.

  Thus, by applying the power converter shown in FIG. 3, a highly efficient, inexpensive and reliable refrigerator can be obtained. Moreover, the freedom degree of the layout of the components to arrange | position increases and the volume in a refrigerator can be increased.

Embodiment 3 FIG.
FIG. 5 is a diagram showing a configuration of a third embodiment of a power conversion device mounted on an electrical product according to the present invention.

  The power converter shown in FIG. 5 is different in that the electronic printed circuit board 2 is covered with the exterior material 10, and the other configuration is the same as that of the power converter shown in FIG.

  The exterior material 10 is formed of an insulating and flame retardant (heat resistant) mold resin, and an epoxy resin can be exemplified as such a material. The exterior material 10 is provided so as to cover at least the components constituting the heat pipe and the large components on the electronic printed circuit board 2 such as the aluminum electrolytic capacitor 11.

  Since the power conversion device shown in FIG. 5 includes the exterior material 10, it is possible to prevent the power conversion device from malfunctioning due to dust or insects adhering to the current-carrying portion of the electronic printed circuit board 2. Therefore, the reliability of the power conversion device can be improved.

  The configuration of the present embodiment and the configuration of the second embodiment may be combined.

Embodiment 4 FIG.
FIG. 6 is a diagram showing a configuration of a power conversion device mounted on an electrical product according to a fourth embodiment of the present invention.

  The power converter shown in FIG. 6 has the heat sink 12 in contact with the semiconductor device 3, the side of the heat sink 12 in contact with the semiconductor device 3 is the heat receiving part, and the back side of the heat receiving part of the heat sink 12 is the heat sink. . Moreover, the electronic printed circuit board 2 is covered with the exterior material 10 similarly to FIG. Other configurations are the same as those of the power conversion apparatus shown in FIG.

  The heat radiating plate 12 is a heat radiating plate having a flat structure that does not have a fin-like structure or the like and is not subjected to uneven processing, and examples thereof include an aluminum plate. The heat radiating plate 12 receives heat generated in the semiconductor device 3 and radiates heat by natural heat radiation from a heat radiating portion on the opposite side to the semiconductor device 3.

  In the power conversion apparatus shown in FIG. 6, a wide gap semiconductor is used for the semiconductor device 3. Examples of wide gap semiconductors include SiC and GaN. By using a wide gap semiconductor for the semiconductor device 3, electrical loss in the semiconductor device 3 can be suppressed, and the heat radiation amount can be suppressed. Therefore, like the heat radiating plate 12, the heat radiating structure can be a simple structure, and the cost can be reduced. In addition, the size of the electrical component box 9 can be reduced.

  In addition, since the power conversion device shown in FIG. 6 includes the exterior material 10, as in Embodiment 3, dust or insects adhere to the current-carrying part of the electronic printed circuit board 2 and cause the power conversion device to malfunction. Can be prevented. Therefore, the reliability of the power conversion device can be improved.

  In the present embodiment, a mode in which a wide gap semiconductor is applied to the semiconductor device 3 included in the power conversion device illustrated in FIG. 6 has been described. However, the present invention is not limited to this, and the power illustrated in FIGS. A wide gap semiconductor may be applied to the conversion device. Even when a wide gap semiconductor is applied to the power conversion device shown in FIGS. 1, 3, and 5, electrical loss can be suppressed and the amount of heat radiation can be suppressed.

  As described above, the power conversion device according to the present invention is useful for an electrical product that is subject to restrictions on the arrangement of components due to heat generated by a semiconductor device, and is particularly suitable for a refrigerator.

  DESCRIPTION OF SYMBOLS 1 Cover, 2 Electronic printed circuit board, 3 Semiconductor device, 4 Fixing member, 5 Heat receiving part, 6, 6a Heat transfer part, 7 Heat radiation part, 8a, 8b High heat conduction board, 9, 9a Electrical component box, 10 Exterior material, 11 Aluminum electrolytic capacitor, 12 heat sink, 13, 13a refrigerator.

Claims (5)

A refrigerator including one or more semiconductor devices mounted on an electronic printed circuit board housed in a bent electrical component box , wherein the electrical component box constitutes a part of the housing Because
A heat pipe provided with a heat receiving portion provided in contact with the semiconductor device, a bent heat transfer portion provided in contact with the heat receiving portion, and a heat radiating portion provided in contact with the heat transfer portion;
The semiconductor device and the heat receiving part are arranged on a side surface or a back surface of the housing,
The heat radiating surface of the heat radiating portion is arranged along the upper surface of the housing ,
The heat dissipating part is arranged at a position higher than the heat receiving part,
Refrigerator, characterized in that the refrigerant in the heat pipe has a structure that spontaneously circulated by gravity and temperature gradients. The semiconductor device and the electronic printed circuit board are
The refrigerator according to claim 1, wherein the refrigerator is covered with an exterior material formed of an insulating and flame-retardant resin. The refrigerator according to claim 1 or 2, wherein the semiconductor element constituting the semiconductor device is a wide gap semiconductor. 4. The refrigerator according to claim 1, wherein the heat radiation surface of the heat radiation portion has a flat structure that is not processed to be uneven. 5. 5. The refrigerator according to claim 1, wherein a heat radiating surface of the heat radiating portion is in contact with the electrical component box via a heat conducting plate.

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