JP5776092B2 - Compression molding method, compression molding apparatus, and resin supply handler - Google Patents

Description

  The present invention relates to a compression molding method, a compression molding apparatus, and a resin supply handler used therefor.

  In recent years, miniaturization and high integration of semiconductor chips have progressed, and SiP (System in Package) in which a plurality of semiconductor chips and electrical components are enclosed in one package and POP (Package) in which semiconductor chips are stacked in multiple layers. Demand for products such as On Package is increasing. As a result, since the thickness of the resin layer in the package portion in the height direction is reduced, it is difficult for the molding resin to flow into the narrow gap between the semiconductor chip and the cavity bottom in the transfer molding. In a molding method having a large amount of resin flow such as transfer molding, defects such as wire deformation and unfilling of the resin are likely to occur.

  Therefore, mold resin (powder resin, granule resin, liquid resin) is supplied to the cavity and melted in advance, and the mold is clamped while holding the workpiece to reduce the volume in the cavity. Compression molding is performed to drive the member. Thereby, resin can be filled into a narrow gap in the height direction of the package portion.

  For example, resin that is compressed according to the size and shape of the cavity is supplied to the cavity, or the supply unit is horizontally moved or vibrated so that resin consisting of granular materials is uniformly deposited in the cavity by the resin material supply unit. There has been proposed a resin sealing device that supplies the liquid while performing the process (see Patent Document 1).

JP 2004-174801 A

However, it takes time to melt a solid resin (resin tablet) like the mold resin used in the resin sealing device of the above-mentioned patent document, and it is difficult to use in a package having a thin package portion. As a result, a relatively expensive granular resin or liquid resin has to be used, resulting in an increase in manufacturing cost.
In the case of using a normal granular resin produced by crushing a solid resin, it is difficult to accurately measure it according to the cavity volume, and it is difficult to supply it to individual cavity recesses in a matrix shape. There was a problem in the maintainability such that the powdered resin was likely to scatter and adhered to the inside of the apparatus, requiring cleaning.

  In addition, when a liquid resin is used, the coating amount can be controlled with high accuracy, but the filler content is lower than that of a solid resin such as a granular resin, and flame retardancy becomes a problem. The possible shapes are limited and may not be applicable depending on the product shape. In addition, in order to reduce environmental load, resins that do not use halogen-based flame retardants have appeared, and flame retardancy may be a problem.

The present invention solves the problems of the prior art, the size and weight amount equal granular resin counting to Rukoto, improving maintainability of the resin amount commensurate with the cavity volume at low cost by supplying each cavity Another object of the present invention is to provide a compression molding method and a compression molding apparatus that can maintain high molding quality.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, in the compression molding method, the size and total number of in response to the cavity volume of the Weight is uniformly shaped granules resin, mold opening and mold dies each of a plurality of cavities for cavity formed is a step of clamping a resin supplying step of supplying simultaneously collectively for each cavity, the mold holding the workpiece at a position corresponding to the cavities in the mold, the supply to the cavity recess And a step of keeping the melted resin at a predetermined resin pressure and curing it by heating.
If the said compression molding method is used, a fine powder will not fly like normal granule resin, or heat curing will not advance like liquid resin, and a fillability will improve. Moreover, can be supplied depending on the volume of the cavity recess simply by the size and weight amount is uniformly shaped granules resin counting, the resin amount exactly like normal granules resins and liquid resins Weighing Since resin is supplied to a plurality of cavity recesses according to the capacity of each cavity, the resin supply operation can be performed efficiently, quickly and simply, and the amount of resin supplied for each cavity can be reduced. A uniform amount can be obtained with high accuracy. Therefore, flash flash can be prevented and molding quality can be improved.

In the step of clamping the mold, the pressure is reduced by degassing the inside of the mold.
Thereby, the air mixed in the molten resin can be removed to prevent generation of voids in the molded product.

Using the molding die having a movable cavity piece forming the bottom of the cavities, the movable cavity piece said granular material resin is supplied at the retracted position, the movable cavity piece after mold clamping to the forming position It is characterized by being moved and held at a predetermined resin pressure and cured by heating.
According to this method, since the gap is formed granules resin each other by supplying a granular resin commensurate with the amount of resin filled in the cavities counting to, assumed to be supplied to protrude the volume of the cavities but is is, by keeping to move to the retracted position so as to advance enlarge the bottom of the cavity recess, granules resin supplied in total number to prevent the filled resin flash as gather in the central portion of the cavities Thus, resin molding can be performed with a precise resin amount. In addition, since the movable cavity piece is moved to the molding position and cured by heating after the mold is clamped, it is possible to mold with the desired thickness of the package part.

  Furthermore, since the mold clamping surface including the movable cavity piece is covered with the release film, even if the movable cavity piece moves from the retracted position to the molding position in a state where the granular resin is supplied to the cavity recess and melted. Since the molten resin does not leak into the gap between the molds, flash flash can be reliably prevented.

Using a mold having a movable cavity piece forming the outer periphery of the bottom of the cavity recess, and covering the mold clamping surface including the movable cavity piece with a release film, wherein the movable cavity piece is in the retracted position. The granular resin is supplied, and after the mold is clamped, the movable cavity piece is moved to a molding position that is flush with the bottom of the cavity, and is heated and cured while maintaining a predetermined resin pressure.
According to this method, when the granular resin is supplied to the cavity concave portion, the movable cavity piece that forms the outer periphery of the bottom of the cavity concave portion is retracted so that the granular resin supplied to the cavity concave portion is within the cavity. By making the molten resin collect in advance at the outer peripheral position of the cavity bottom without a semiconductor chip, molding with less resin flow can be performed.

In the cavity recess, a relatively large particle resin is supplied to the outer peripheral side, and a relatively small particle resin is supplied in combination to the inside, and the total supply amount is counted according to the cavity capacity. It is characterized by being supplied.
According to this, a relatively large-diameter granular resin is supplied to a region having a large distance from the workpiece (semiconductor chip or substrate) facing the inside of the cavity recess, and a small-diameter particle is supplied to a region having a small interval. It is possible to efficiently supply the granular resin having a size corresponding to the resin capacity to be filled by supplying the body resin, thereby reducing the amount of movement of the resin as much as possible.

In the compression molding apparatus, one mold for holding the workpiece, a plurality of cavity recesses to which a granular resin molded uniformly in size and weight is counted and supplied according to the cavity volume, and the cavity recesses A mold having a movable cavity piece that forms the bottom of the mold and a release film that covers a mold clamping surface including the movable cavity piece, and the mold is opened. In the mold, the movable cavity piece is in the retracted position, and the counted granular resin is simultaneously supplied to the plurality of cavity recesses covered with the release film at the same time, and the one mold for holding the workpiece, The workpiece is clamped with the other mold and the movable cavity piece is moved to the molding position to heat and cure while keeping the molten resin at a predetermined resin pressure. And characterized in that.
By using the above compression molding apparatus, it is possible to supply the resin according to the capacity of the cavity recess only by counting the particle resin having a uniform size and weight, so that the amount of resin can be reduced like a normal granule resin or liquid resin. There is no need to strictly measure, resin powder does not scatter, and granular resin is simultaneously supplied to a plurality of cavity recesses at the same time, making it possible to efficiently and quickly simplify the resin supply operation. Moreover, the resin supply amount for each cavity can be made uniform with high accuracy. Therefore, flash flash can be prevented and molding quality can be improved. In addition, since molding is performed by forming a reduced pressure space that is cut off from the outside in the mold, voids are not generated and molding quality can be improved.
Furthermore, the mold clamping surface including the movable cavity piece is covered with a release film, and even if the movable cavity piece moves from the retracted position to the molding position in a state where the granular resin is supplied and melted in the cavity recess, Since the molten resin does not leak into the gaps between the molds, the resin can be molded with a target thickness while maintaining the resin amount of the package portion precisely.

When the one mold is closed to the other mold, a decompression mechanism is provided in which a decompression space is formed by blocking the interior space of the mold from the outside.
Thereby, the air mixed in the molten resin can be removed to prevent generation of voids in the molded product.

One mold for holding the workpiece, a plurality of cavity recesses to which a granular resin having a uniform size and weight is counted and supplied according to the cavity volume, and an outer periphery of the bottom of the cavity recess are formed. A mold having a movable cavity piece and a release film that covers a mold clamping surface including the movable cavity piece, and the movable mold in the mold mold opened. When the cavity piece is in the retracted position, the counted granular resin is simultaneously supplied to the plurality of cavity recesses covered with the release film at the same time, and the one mold and the other mold for holding the workpiece. The workpiece is clamped with a mold, and the movable cavity piece is moved to a molding position that is flush with the bottom of the cavity, and is heated and cured while maintaining a predetermined resin pressure. It is characterized in.
According to the above configuration, when the granular resin is supplied to the cavity concave portion, the movable cavity piece that forms the outer periphery of the bottom of the cavity concave portion is retracted so that the granular resin supplied to the cavity concave portion is within the cavity. By making the molten resin collect in advance at the outer peripheral position of the cavity bottom without a semiconductor chip, molding with less resin flow can be performed.

In the above-mentioned mold opening and mold dies while the formed resin supplied handlers supplied to each cavity recess is counting in accordance with size and weight amount is uniformly shaped granules resin into the cavity volume A hopper that individually accommodates each cavity, and a shutter that is arranged to be openable and closable below the hopper and that supplies the granular resin to the cavity by opening the hopper, and the shutters are collectively opened. Thus, the granular resin accommodated in the hopper is supplied for each cavity.
If this resin supply handler is used, the granular resin to be supplied to each cavity recess is individually accommodated in the hopper, so that the number of supplied granular resins can be reliably made the same, and the individual resin in each cavity The supply amount can be made uniform and supplied in a batch.

With the above-described compression molding method and apparatus, the size and weight amount equal granules resin counting to Rukoto, can supply the amount of resin commensurate with the cavity volume per cavity, maintenance at low cost It is possible to provide a compression molding method and a compression molding apparatus that can improve the quality and maintain high molding quality.

1 is a sectional view of a mold of a compression molding apparatus according to Embodiment 1. FIG. FIG. 3 is a mold cross-sectional view illustrating a compression molding operation according to the first embodiment. FIG. 3 is a mold cross-sectional view illustrating a compression molding operation according to the first embodiment. FIG. 6 is a mold cross-sectional view illustrating a molding operation of a compression molding apparatus according to a second embodiment. FIG. 6 is a mold cross-sectional view illustrating a molding operation of a compression molding apparatus according to a second embodiment. FIG. 6 is a lower plan view of a compression molding apparatus according to a second embodiment. 6 is a mold cross-sectional view illustrating a molding operation of a compression molding apparatus according to Embodiment 3. FIG. 6 is a mold cross-sectional view illustrating a molding operation of a compression molding apparatus according to Embodiment 3. FIG. It is sectional drawing of the resin supply method which concerns on another example. FIG. 10 is a mold cross-sectional view illustrating a molding operation of a compression molding apparatus according to Example 4. FIG. 10 is a mold cross-sectional view illustrating a molding operation of a compression molding apparatus according to Example 4.

DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a compression molding method and a compression molding apparatus according to the present invention will be described in detail with reference to the accompanying drawings. In the following compression molding direction and apparatus, a thermosetting resin (epoxy resin, silicone resin, etc.) a size and heavy weight are uniformly shaped granules resin is formed on the mold die opening is supplied to each cavity by a cavity capacitance depending on counting has been retained resin supply handler. Further, it is common to include a step of clamping the mold while holding the workpiece at a position corresponding to the cavity recess, and heating and curing the molten granular resin supplied into the cavity recess. Hereinafter, a specific compression molding method will be described together with the apparatus configuration.

[Example 1]
First, a schematic configuration of the compression molding apparatus will be described with reference to FIG.
In FIG. 1A, the schematic configuration of the upper mold 2 and the lower mold 3 constituting the mold 1 will be described. In the following description, the upper mold 2 is described as a fixed mold, and the lower mold 3 is described as a movable mold that moves toward and away from the upper mold 2. The mold clamping mechanism is configured to move up and down by a link mechanism such as a toggle link using a known electric motor as a drive source for driving the movable mold. The lower mold 3 may be a fixed mold, the upper mold 2 may be a movable mold that moves toward and away from the lower mold 3, and both the upper mold 2 and the lower mold 3 may be movable.

The workpiece W is sucked and held on the clamping surface (parting surface) of the upper mold 2. As the workpiece W, a substrate K on which a semiconductor chip T is mounted by wire bonding or flip-chip mounting by bumps is used. In addition, the structure which hold | grips the edge part of the workpiece | work W with a nail | claw-shaped holding member may be employ | adopted, and the structure which uses a suction mechanism and a holding mechanism together may be employ | adopted. Further, other holding configurations may be adopted.
A vacuum suction path 2a is formed in the upper mold 2 and one end thereof opens to the upper mold clamping surface 2b. A sealing material 2c (O-ring) is provided on the outer peripheral side of the vacuum suction path 2a that opens to the upper mold clamping surface 2b. The vacuum suction path 2 a is connected to a decompression mechanism 4 having a vacuum pump that performs deaeration from a closed space in the mold 1. In addition, you may employ | adopt the structure which can switch the pressure reduction mechanism 4 and a compressor.

  In the lower mold 3, a lower mold cavity recess 3b is provided on the lower mold clamping surface 3a. In this embodiment, a movable cavity piece 3c that is supported by a base (not shown) via a spring to form the bottom of the lower mold cavity recess 3b, and a lower mold that is supported by a base (not shown) via a spring and clamps the substrate K. 3, the release film 5 covering the lower clamp surface 3 a including the movable cavity piece 3 c is held by suction. The release film 5 is sucked and held on the mold clamping surface by a known suction mechanism. The release film 5 has heat resistance that can withstand the heating temperature of the mold 1 and is easily peeled off from the mold surface, and is a film material having flexibility and extensibility, such as PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidyne chloride and the like are preferably used. It should be noted that a roll-like release film may be used as the release film, and a configuration may be adopted in which a predetermined length is fed out from a feeding roll provided before and after the mold 1 and wound by a winding roll. You may employ | adopt the structure using what was cut | disconnected in the strip shape of the magnitude | size which covers the clamp surface.

As the granular resin 6, for example, a resin having the same resin characteristics (thermal conductivity, color, content of silica, etc.) and having a uniform size and weight is used. The granular resin 6 is carried into the mold 1 opened by the resin supply handler 7. In this embodiment, the granular resin 6 is formed in a sphere having the same diameter. For example, in the granular resin 6 having a diameter of 1 mm, 0.523 mm ³ of resin can be supplied by supplying one granular resin. Thus, if each volume (in other words, weight) of granular resin 6 is formed uniformly, it will be measured only by counting granular resin 6 supplied to a cavity. With the size of the granular resin 6 described above, for example, sufficient resin supply accuracy can be achieved even for a minute cavity such that one side of the rectangular size of the lower mold cavity recess 3b is □ 12 mm and the depth is 0.2 mm. It can be molded while keeping.

That is, such assume the volume of the case does not calculate the volume of the semiconductor chip in the cavity of the outer dimension is a 28.8 mm ^3, 28.77 mm ³ in the resin by the granules resin 6 that the diameter φ1mm use 55 Can supply. In this case, the molding thickness error can be 0.11 μm, and the molding thickness error can be extremely small. However, the volume of the resin component in the package expressed as a value obtained by subtracting the volume of the semiconductor chip or the like to be sealed from the volume of the cavity is actually the volume of the cavity (the amount necessary for one resin mold). Used. In the above-described example, since the molding thickness can be adjusted with an accuracy of about 4 μm by increasing / decreasing one granular resin 6, the molding thickness of the package is easily within the range of molding error depending on the number of supplied granular resins 6.

  Further, when the variation in the molding thickness due to the increase / decrease in the number of the granular resins 6 is small, the supply accuracy can be kept high even if, for example, the supply number is about 1, 2 grains away from the target value. For this reason, as a counting device for counting the granular resin 6, it is easy to count by filling the granular resin 6 in a container with a predetermined capacity opened at the top and dropping off the portion protruding from the container. It is good also as a simple structure.

  If the size of the granular resin 6 is small, the supply accuracy can be improved, but it becomes difficult to handle and the time required for counting becomes longer. On the contrary, if it is large, the handling accuracy becomes easier or the time required for counting becomes shorter. It becomes difficult to improve. For this reason, it is necessary to select the size of the granular resin 6 as appropriate in accordance with the allowable range of errors in the volume of the cavity and the thickness of the molded product, and the optimum size varies depending on the object to be molded. In the case of the POP package having the size as described above, the granular resin 6 having a diameter of about 0.5 mm to 2 mm can be used according to a required molding error. Further, if the package has a large cavity volume, the size of the granular resin 6 can be increased accordingly.

  As an example, the granular resin 6 according to the present invention is molded such that a raw material blended with an epoxy resin, a curing agent, an inorganic filler (filler) and the like is kneaded with a melt kneader and extruded and then passed through a molding roll. It can be manufactured through a process. In addition, the granular resin 6 needs to be uniformly molded in size or weight, but its accuracy can be adjusted with respect to this average particle size by producing a predetermined average particle size as a target value in the molding process. If it does not deviate greatly, molding is possible (however, it is preferable to measure the granular resin 6 individually and align the grains). That is, even if there is an error in each of the granular resins 6, the errors with respect to the respective average particle diameters cancel each other. For this reason, the error can be reduced as much as not causing a problem as a whole.

  A hopper 7a filled with the granular resin 6 is built in the resin supply handler 7, and the bottom of the hopper 7a is opened by opening the shutter 7b so that the granular resin 6 is placed in the lower mold cavity recess 3b. It can be supplied. The hopper 7 a is provided in the resin supply handler 7 according to the layout of the lower mold cavity recess 3 b of the lower mold 3. Each hopper 7a can accommodate an amount of granular resin 6 necessary for one resin mold according to the volume of the lower cavity cavity 3b. Thus, since the granular resin 6 supplied to each lower mold cavity recessed part 3b is separately accommodated in each hopper 7a, the supply number of granular resin 6 can be made the same number reliably, The individual resin supply amount can be made uniform. In addition, the structure which supplies to each hopper 7a via the pipe line from the storage apparatus of the granular resin 6 is employ | adopted as a structure for throwing in the quantity of granular resin 6 required for one resin mold to each hopper 7a. it can. In this case, if the number of discharges of the granular resin 6 is counted in the pipe and the pipe is closed when the supply number reaches a predetermined value, the accurate number can be counted. As described above, when the above-described granular resin 6 is used, the weighing of the granular resin 6 supplied to one cavity concave portion 3b can be completed in a short time. Therefore, when the mold 1 having many cavity concave portions 3b is used. The time required for resin weighing can be greatly reduced.

  Each hopper 7a is provided with a shutter 7b that can be opened and closed at its lower opening. The shutter 7b opens and closes the lower opening of the hopper 7a by moving a pair of plate bodies in contact with and away from each other at the center of the opening. The shutter 7b is capable of supplying the granular resin 6 to the center of the lower mold cavity recess 3b by opening from the center of the opening when supplying the granular resin 6.

Alternatively, the amount of resin required for one resin mold may be counted and supplied by opening and closing the shutter 7b. Furthermore, as the shutter 7b, other configurations may be adopted as long as the supply of the granular resin 6 from the hopper 7a can be stopped.
The resin supply handler 7 may supply not only the granular resin 6 but also the workpiece W to the upper mold 2. In addition, it is possible to adopt a configuration in which the lid body that can be opened when the granular resin 6 is filled is provided above the hopper 7a to prevent the granular resin 6 from melting in the hopper 7a by the radiant heat from the upper mold 2. . In order to prevent the granular resin 6 from melting in the hopper 7a before supplying the resin, a cooling mechanism for cooling the inside of the hopper 7a using a cooling element such as a Peltier element or other cooling means is provided. Alternatively, the resin supply handler 7 may have a heat insulating structure.

Next, the compression molding method will be described with reference to FIGS. In the following description, the resin in which the granular resin 6 is melted may be referred to as “molten resin 6”.
In FIG. 1 (a), a workpiece W is adsorbed and held on the upper mold clamping surface 2b by a conveying device (not shown) in the mold mold 1 which is opened, with the semiconductor chip mounting surface facing downward.
The granular resin 6 is carried into the lower mold 3 by the resin supply handler 7. The release film 5 is held by suction on the lower mold clamping surface 3a. The movable cavity piece 3c constituting the bottom part of the lower mold cavity recess 3b is in a retracted position retracted from the position (molding position) of the cavity bottom part during curing. As shown in the figure, the release film 5 is preferably adsorbed along the shape of the lower mold cavity recess 3b. Accordingly, the volume of the granular resin 6 that can be accommodated in the lower mold cavity recess 3b is minimized when the release film 5 is stretched to facilitate the supply of the granular resin 6, and the granular resin 6 It is easy to heat and the molding time can be shortened.

  As shown in FIG. 1A, with the hopper 7a and the lower mold cavity recess 3b aligned, the shutter 7b is opened synchronously as shown in FIG. Resin 6 is supplied to lower mold cavity recess 3b in a lump. In the hopper 7a, the granular resin 6 necessary for one molding is pre-counted and stored. The granular resin 6 does not spill out from the lower cavity cavity 3b because the movable cavity 3c is in the retracted position. Moreover, by simultaneously opening the shutter 7b and supplying the granular resin 6 simultaneously, heating can be started simultaneously in the lower mold cavity concave portion 3b, and uniform heating can be achieved. be able to. Further, the shutter 7b can be preferentially supplied to the center by opening and moving away from the center. For this reason, for example, compared to a configuration in which the shutter is opened in one direction, it can be supplied uniformly to the lower mold cavity recess 3b, and can be dropped outside the lower mold cavity recess 3b. The situation can be surely prevented.

  When the resin supply handler 7 moves away from the mold 1, the lower mold 3 is raised and the mold is closed while operating the pressure reducing mechanism 4 connected to the upper mold 2 as shown in FIG. When the sealing material 2c provided on the upper mold clamping surface 2b comes into contact with the lower mold clamping surface 3a via the release film 5, the decompression space is formed while the mold space is shut off from the outside and deaerated. As described above, since the temperature is raised in the reduced pressure space, the molding is performed after the excess components contained in the granular resin 6 are sufficiently discharged, so that the molten resin 6 can maintain high molding quality with few voids. Further, as shown in FIG. 2B, the granular resin 6 supplied to the lower mold cavity recess 3b is heated to a mold whose temperature has been raised and is in a molten state.

  In addition, when it is set as the structure provided with a compressor, the structure which blows in and fills a gas higher than mold temperature in a closed space, and is filled can assist the melt | dissolution of granular resin. In this case, since the granular resin 6 is used, there is almost no fine powder, and even if gas is blown into the closed space and convection occurs, the fine powder rises in the mold and adheres to the mold. It will not cause flash flashing or maintenance problems.

  As shown in FIG. 3A, the sealing material 2c is further compressed, and the mold closing operation is completed in a state where the workpiece W is sandwiched between the upper mold clamping surface 2b and the lower mold clamping surface 3a. At this time, the semiconductor chip T of the workpiece W starts to be immersed in the molten resin 6 in the lower mold cavity recess 3b.

  Next, as shown in FIG. 3 (b), the movable cavity piece 3c is lifted from the retracted position, and the cavity bottom is made of the molten resin 6 so that the depth of the cavity becomes the thickness of the package part to be molded on the substrate K. Is raised to a molding position where pressure is applied with a predetermined resin pressure. Thereby, the molten resin 6 melted in the cavity is kept at a predetermined resin pressure and is cured by heating (curing).

  As described above, in this embodiment, the fine powder is not scattered like a normal granule resin or the heat curing does not proceed like a liquid resin, and can be easily handled. In addition, it can be supplied according to the capacity of each cavity recess by simply counting the granular resin with the same resin characteristics and uniform size and weight. It is not necessary to measure the amount, and the resin supply operation can be quickly and simplified, and the resin supply amount for each cavity can be made uniform with high accuracy. Therefore, flash flash can be prevented and molding quality can be improved.

  Further, when the granular resin 6 is used, a gap is inevitably generated between the granular resins 6 due to the shape thereof, so that it is assumed that the volume of the lower mold cavity recess 3b is supplied. By moving the movable cavity piece 3c to the retracted position so as to enlarge the bottom of the lower mold cavity recess 3b in advance, the granular resin 6 is filled at a position lower than the edge of the lower mold cavity recess 3b. Resin flash can be prevented and resin molding can be performed with a precise resin amount. In addition, since the movable cavity piece 3c is moved to the molding position and cured by heating after the mold is clamped, it is possible to mold with the desired thickness of the package part.

  Since the mold clamping surface including the movable cavity piece 3c is covered with the release film 5, the movable cavity piece 3c is moved from the retracted position to the molding position in a state where the granular resin 6 is supplied to the lower mold cavity recess 3b and melted. Even if it moves, the molten resin does not leak into the gap between the molds. In addition, since the minute unevenness on the substrate K can be closed, the flash flash can be reliably prevented.

[Second Embodiment]
Next, another example of the compression molding method and apparatus will be described with reference to FIGS. The same members as those in the first embodiment are assigned the same reference numerals, and the description will be referred to. As the workpiece W, a substrate K on which a semiconductor chip T or the like is mounted is used. In the embodiment described above, the movable cavity piece 3c constituting the cavity bottom portion of the lower mold 3 is provided. In this embodiment, as shown in FIG. 6, a movable cavity piece 3c that forms the outer periphery of the bottom of the cavity recess 3b is provided. The lower mold clamping surface 3a including the movable cavity piece 3c is the same in that the release film 5 is covered as shown in FIG. Further, when the granular resin 6 is supplied to the cavity recess 3b, the movable cavity piece 3c is in the retracted position retracted downward from the cavity bottom.

  FIG. 4A shows a state in which the granular resin 6 is supplied to the lower mold cavity recess 3b by the resin supply handler 7 (not shown) and the mold 1 starts the mold closing operation. The granular resin 6 supplied to the cavity recess 3b is spilled from inside the cavity even if the granular resin 6 is piled up by retracting the movable cavity piece 3c that forms the outer periphery of the bottom of the cavity recess 3b. Can be supplied without.

  When the sealing material 2c provided on the upper mold clamping surface 2b comes into contact with the lower mold clamping surface 3a via the release film 5, the decompression space is formed while the mold space is shut off from the outside and deaerated. Thus, since it shape | molds in a pressure-reduced space, it can maintain high shaping | molding quality with few voids in molten resin. Moreover, as shown in FIG.4 (b), the granular resin 6 supplied to the lower mold | type cavity recessed part 3b fuse | melts with the metal mold | die by which temperature was raised.

  As shown in FIG. 5A, the mold closing operation is completed in a state where the sealing material 2c is further compressed and the workpiece W is sandwiched between the upper mold clamping surface 2b and the lower mold clamping surface 3a. At this time, the semiconductor chip T of the workpiece W starts to be immersed in the molten resin 6 in the lower mold cavity recess 3b.

Next, as shown in FIG. 5B, the movable cavity piece 3c is raised from the retracted position and raised to a molding position that is flush with the bottom of the cavity. Thereby, the filling of the molten resin 6 in the lower mold cavity recess 3b is completed. At this time, since the molten resin 6 that is thick on the movable cavity piece 3c provided on the outer peripheral side of the semiconductor chip T is filled in a region where the filling is not completed on the outer peripheral side, The filling of the molten resin 6 can be completed and the pressure can be maintained with almost no flow. Thereby, the molten resin 6 melted in the cavity is kept at a predetermined resin pressure and is cured by heating (curing).
According to the above configuration, by collecting the molten resin on the bottom outer peripheral side of the cavity recess 3b without the semiconductor chip T in advance, molding with less resin flow can be performed, and wire flow can be prevented.

[Example 3]
Next, another example of the compression molding method and apparatus will be described with reference to FIGS. The same members as those in the first embodiment are assigned the same reference numerals, and the description will be referred to. In this embodiment, the workpiece W is a substrate in which a semiconductor chip T or the like having a large thickness is mounted on a substrate K, such as a stack of semiconductor chips. In each of the above-described embodiments, the movable portion (movable cavity piece 3c) is provided in the lower mold 3. However, in the present embodiment, the movable portion such as the movable cavity piece 3c is not provided in the lower die 3. Also, the release film 5 covering the lower mold clamping surface 3a is also omitted, and it is possible to form at a low cost as much as the configuration is simplified.

  In FIG. 7A, in the mold mold 1 that has been opened, the workpiece W is held by suction on the upper clamp surface 2b with the semiconductor chip mounting surface facing downward. The granular resin 6 is supplied to the lower mold cavity recess 3 b of the lower mold 3 by the resin supply handler 7.

  When the resin supply handler 7 is retracted from the mold 1, the mold 1 starts a mold closing operation. As shown in FIG. 7B, the mold space is cut off from the outside when the sealing material 2c provided on the upper mold clamping surface 2b abuts on the lower mold clamping surface 3a while the decompression mechanism 4 is operated. A vacuum space is formed while deaeration. Thus, since it shape | molds in a pressure-reduced space, it can maintain high shaping | molding quality with few voids in molten resin. Moreover, as shown to Fig.8 (a), the granular resin 6 supplied to the lower mold cavity recessed part 3b fuse | melts with the metal mold | die by which temperature was raised.

  As shown in FIG. 8B, the sealing material 2c is further compressed, and the mold closing operation is completed in a state where the workpiece W is sandwiched between the upper mold clamping surface 2b and the lower mold clamping surface 3a. At this time, the semiconductor chip T of the workpiece W is immersed in the molten resin 6 in the lower mold cavity recess 3b. In this state, by further increasing the clamping force of the mold, the volume of the lower mold cavity recess 3b is reduced by the elasticity of the substrate K, so that the molten resin 6 melted in the cavity is maintained at a predetermined resin pressure and heated. Cure (cure). When sealing the semiconductor chip T having a large thickness and occupying a large portion in the volume in the lower mold cavity recess 3b as in the present embodiment, even if the movable cavity piece 3c is not provided, The mold cavity recess 3b can be filled with the molten resin 6 to hold the pressure.

  The molded product after heat curing can be released from the lower die 3 by providing the lower die 3 with a known ejector pin mechanism and pushing up the substrate K with the ejector pin. Unlike the above-described embodiment using the movable cavity piece 3c, the configuration as in this embodiment has a small amount of change in the volume in the lower mold cavity recess 3b, so that the semiconductor chip T having a uniform volume is mounted on the substrate. It is preferable to use the workpiece W.

9A to 9C are cross-sectional views of a resin supply method according to another example.
The resin supply handler 7 may be supplied with not only the granular resin 6 having the same particle diameter but also a plurality of types of granular resins 6 having different particle diameters. In the lower mold cavity recess 3b, the total volume or weight may be counted and supplied in accordance with the cavity capacity by combining the granular resins 6 having different particle diameters.

  For example, in FIG. 9A, a relatively large-diameter granular resin 6a is supplied to a region having a wide distance from the workpiece (semiconductor chip T or substrate K) that is supplied into the lower cavity cavity 3b. In addition, the small-diameter granular resin 6b may be supplied to a region where the interval is narrow, and the granular resin 6 having a size corresponding to the resin capacity to be filled may be efficiently supplied. In this case, for example, when a relatively large particle resin 6a is disposed on the outside and a relatively small particle resin 6b is disposed on the inside as shown in FIG. A configuration may be adopted in which a resin supply handler having adsorption portions capable of adsorbing the resins 6a and 6b as many as the number of the granular resins 6a and 6b is used and the adsorption is released on the lower cavity recess 3b. .

FIG. 9B shows a state in which the granule resins 6 a and 6 b supplied to the lower mold cavity recess 3 b are melted by the lower mold 3, and a concave meniscus is formed in the molten resin 6. FIG. 9C shows a state where the upper mold 2 and the lower mold 3 clamp the work W in this state. The semiconductor chip T is immersed in the molten resin 6 and is cured by heating while maintaining a predetermined resin pressure.
Thereby, the movement amount of the molten resin 6 can be reduced as much as possible during compression molding. As described above, even when a plurality of types of granular resins 6 are used, the resin can be supplied with high accuracy with a simple configuration in which each is counted.

[Fourth embodiment]
Next, another example of the compression molding method and apparatus will be described with reference to FIGS. The same members as those in the first embodiment are assigned the same reference numerals, and the description will be referred to. In the embodiment described above, the cavity 3 b is provided in the lower mold 3. In this embodiment, as shown in FIG. 10, a cavity plate 40 that forms the side wall of the cavity recess 3 b is provided, and the cavity recess 3 b is formed on the lower mold 30 side by the workpiece W placed on the lower mold 30 and the cavity plate 40. It is formed. The upper mold 20 includes a plurality of movable cavity pieces 21 corresponding to the arrangement of the cavities and individually movable up and down, and an upper mold clamper 22 having an insertion hole into which the movable cavity piece 21 can be inserted. I have. The movable cavity piece 21 and the upper mold clamper 22 are separately supported by a base (not shown) via a spring. The release film 5 is adsorbed and held on the parting surface of the upper mold 20 so as to follow its shape.

  A plurality of cavity holes 41 are provided in the cavity plate 40 so as to correspond to the arrangement of the semiconductor chips T mounted on the workpiece W on the substrate. The cavity hole 41 includes a molding portion 41 a that forms the side wall of the cavity recess 3 b below and a positioning recess 41 b for positioning the cavity hole 41 with respect to the movable cavity piece 21 of the upper mold 20. The positioning recess 41b has a larger cross-sectional shape (hole diameter) than the molding portion 41a, and the positioning protrusion 22a formed in a protruding shape around the insertion hole of the upper mold 20 in the mold closed state becomes the positioning recess 41b. The position of the cavity hole 41 (molding part 41a) with respect to the movable cavity piece 21 of the upper mold 20 is positioned by being inserted (concave and recessed). The lower mold 30 includes a lower mold insert 31 on which the workpiece W is placed, and a lower mold clamper 32 disposed so as to surround the lower mold insert 31. The lower mold insert 31 and the lower mold clamper 32 are separately supported by a base (not shown) via a spring. The lower mold clamper 32 is provided with a vacuum suction path 32a that opens to avoid the position where the cavity plate 40 is placed, and a seal member 32b is provided on the outer peripheral side thereof.

  FIG. 10A shows a state in which the granular resin 6 is supplied to the lower mold cavity recess 3b. At this time, the cavity plate 40 is overlaid on the workpiece W placed on the lower mold insert 31 of the lower mold 30, whereby the lower mold cavity recess capable of supplying the granular resin 6 to the lower mold 30 side. 3b is formed. In this case, the molding portion 41a of the cavity plate 40 is preferably set so that the granular resin 6 supplied to the cavity recess 3b does not exceed the height of the upper end portion of the molding portion 41a. It is necessary to set the height so that the resin 6 does not run over the positioning portion. Thereby, the granular resin 6 does not spill out of the cavity, and it is possible to reliably prevent the resin flash generated by sandwiching the spilled granular resin 6.

  As shown in FIG. 10 (b), when the sealing material 32b provided on the lower mold clamping surface comes into contact with the upper mold clamping surface via the release film 5, the mold space is shut off from the outside and deaerated. However, a decompression space is formed. The granular resin 6 is melted by the heated mold and the excess components are discharged. When the mold is further closed, the sealing material is further compressed as shown in FIG. 11A, and the cavity plate 40 is sandwiched between the upper mold clamping surface and the lower mold clamping surface, and the mold closing operation is completed. At this time, the positioning convex portion 22a of the upper mold 20 is inserted into the positioning concave portion 41b of the cavity plate 40, whereby the position of the cavity hole 41 (the molding portion 41a) with respect to the movable cavity piece 21 of the upper mold 20 is positioned. .

  Next, as shown in FIG. 11 (b), the movable cavity piece 21 is melted by being lowered from the initial position (corresponding to the “retraction position” described above) to the molding position and inserted into the molding portion 41 a of the cavity hole 41. The resin 6 is pressurized, and the filling of the molten resin 6 in the lower mold cavity recess 3b is completed. At this time, the molten resin 6 is kept at a predetermined resin pressure in the cavity and is heated and cured (cured). According to the above configuration, as in the above embodiment, the resin supply operation can be performed quickly and simply, the resin supply amount can be made uniform with high accuracy, and flash flash can be prevented to improve the molding quality. It can also be made. Moreover, the package thickness in a molded product can be easily changed by changing the thickness of the cavity plate 40 (specifically, the depth of the molding portion 41a).

  In addition, although the structure which adjusts the position of the cavity hole 41 using the positioning recessed part 41b and the positioning convex part 22a was employ | adopted, this invention is not limited to this, The positioning pin standingly arranged in the upper mold | type 20 or the lower mold | type 30 is used as a cavity. You may position by inserting in the positioning hole provided in the plate 40. FIG.

  The supply of the granular resin 6 can be performed in the mold 1 as in the above-described embodiment. Moreover, it is good also as a structure which supplies the granular resin 6 with respect to the workpiece | work W with which the cavity plate 40 was piled up on the exterior of the molding die 1, and is carried in into the molding die 1 collectively. In this case, the granule resin 6 may be simply supplied outside the mold 1, and the workpiece W and the granule resin 6 on which the cavity plate 40 is overlaid may be preheated and melted before being carried in. .

  Note that the upper mold 20 may be configured to have a convex portion that pressurizes the molten resin 6 by being inserted into the cavity hole 41 instead of the movable cavity piece 21 described above. In addition, a structure in which a flat cavity plate 40 is clamped without inserting a portion corresponding to the movable cavity piece 21 into the cavity recess 41 and the volume of the lower mold cavity recess 3b is reduced by the elasticity of the cavity plate 40 to apply resin pressure. It is good.

  In the above-described embodiment, a spherical resin is described as the granular resin 6. However, as long as the size and weight are uniform, the spherical resin is not limited to a spherical shape, and other shapes (polyhedral, aspherical, columnar, etc.) Also good. However, a form without an acute angle portion is preferable in order to prevent the occurrence of chipping during conveyance or counting. Further, the characteristics of the package can be adjusted by mixing and using a plurality of types of granular resins 6 having different characteristics at a predetermined ratio. For example, it is possible to appropriately adjust the blending amount of the filler in the package by using half of the two types of granular resins 6 with different blending amounts of the filler. In this way, by changing the blending ratio of various blending raw materials according to the required molding quality, mass production can be performed after confirming the optimal composition, or the composition required for individual products can be instructed and changed in the equipment It is also possible to use such as responding.

  In this case, when the granular resin 6 is charged into the hopper 7a, a plurality of types of granular resins 6 having different characteristics are charged and mixed at a predetermined ratio, and the mixed granular resin 6 is mixed into the lower mold cavity recess. What is necessary is just to supply to 3b. In addition, a granular resin 6 having uniform resin characteristics is introduced into each hopper 7a, and a plurality of types of granular resins 6 having different characteristics are supplied to the lower mold cavity recess 3b by introducing from a plurality of hoppers 7a. A configuration can also be adopted.

  In the above-described embodiment, the structure in which the granular resin 6 is supplied to the lower mold cavity recess 3b has been described. However, the present invention is not limited to this, and the grains are formed when molding using the cavity provided in the upper mold 2. You may employ | adopt the structure which uses the body resin 6. FIG. The plurality of cavities are not necessarily required, and the granular resin 6 may be supplied to the mold 1 provided with a single cavity and molded. Even in this case, the same effects as those of the above-described embodiments, such as prevention of flash flash, can be obtained, and the molding quality can be improved.

  In addition, in the Example mentioned above, although the structure which counts the granular resin 6 was demonstrated, this invention is not limited to this, You may employ | adopt the structure which measures the granular resin 6. FIG. That is, unlike a liquid resin or a normal granule resin, it is possible to discharge a minute amount in the measuring device by simply discharging the granular resin 6 one by one, which is simpler than a liquid resin or a granule resin. A highly accurate resin supply means can be configured. Further, the granular resin 6 may be counted and supplied after being counted. Thereby, you may employ | adopt the structure which improves reliability by measuring the granular resin 6 after a count.

  W Work 1 Mold 2 Upper mold 2a Vacuum suction path 2b Upper clamp surface 2c Sealing material 3 Lower mold 3a Lower clamp surface 3b Lower mold cavity recess 3c, 21 Movable cavity piece 4 Decompression mechanism 5 Release film 6, 6a, 6b Granule resin 7 Resin supply handler 7a Hopper 7b Shutter 20 Upper mold 22 Upper mold clamper 22a Positioning convex part 30 Lower mold 31 Lower mold insert 32 Lower mold clamper 32a Vacuum suction path 32b Sealing material 40 Cavity plate 41 Cavity hole 41a Molding part 41b Positioning recess

Claims (10)

Resin supply that supplies resin particles that are uniformly molded in size and weight according to the cavity capacity of a plurality of cavity recesses formed in the mold mold that is opened, and is simultaneously supplied to each cavity recess. Process,
Holding the workpiece at a position corresponding to the cavity recess in the mold and clamping the mold;
A step of holding and melting the resin supplied and melted in the cavity recess at a predetermined resin pressure; and
The compression molding method characterized by including.   The compression molding method according to claim 1, wherein in the step of clamping the mold, pressure is reduced by degassing the inside of the mold. Using a mold with a movable cavity piece that forms the bottom of the cavity recess,
3. The granule resin is supplied at the retracted position of the movable cavity piece, and after the mold is clamped, the movable cavity piece is moved to a molding position and held at a predetermined resin pressure to be cured by heating. Compression molding method.   The compression molding method according to claim 3, further comprising a step of covering a mold clamping surface including the movable cavity piece with a release film. Using a mold having a movable cavity piece forming the outer periphery of the bottom of the cavity recess, and having a step of covering a mold clamping surface including the movable cavity piece with a release film,
The granular resin is supplied at the retracted position of the movable cavity piece, and after the mold is clamped, the movable cavity piece is moved to a molding position that is flush with the bottom of the cavity and is heated and cured while maintaining a predetermined resin pressure. The compression molding method according to claim 1 or 2.   In the cavity recess, a relatively large particle resin is supplied to the outer peripheral side, and a relatively small particle resin is supplied in combination to the inside, and the total supply amount is counted according to the cavity capacity. The compression molding method according to any one of claims 1 to 5, wherein the compression molding method is supplied after being supplied. One mold to hold the workpiece,
A plurality of cavity recesses in which a granular resin having a uniform size and weight is counted and supplied according to the cavity volume, a movable cavity piece forming the bottom of the cavity recess, and the movable cavity piece are included. A release mold that covers the mold clamping surface, and a mold having the other mold, and
In the mold mold opened, the movable cavity piece is in the retracted position, and the counted granular resin is simultaneously supplied to the plurality of cavity recesses covered with the release film at the same time to hold the workpiece. Clamping a workpiece with the one mold and the other mold and moving the movable cavity piece to a molding position to heat and cure the molten resin while maintaining a predetermined resin pressure. apparatus. One mold to hold the workpiece,
A plurality of cavity recesses to which a granular resin molded uniformly in size and weight is counted and supplied according to the cavity volume, a movable cavity piece forming the outer periphery of the bottom of the cavity recess, and the movable cavity piece A mold having a release film that covers a mold clamping surface including the other mold, and
In the mold mold opened, the movable cavity piece is in the retracted position, and the counted granular resin is simultaneously supplied to the plurality of cavity recesses covered with the release film at the same time to hold the workpiece. The workpiece is clamped by the one mold and the other mold, and the movable cavity piece is moved to a molding position that is flush with the cavity bottom, and is heated and cured while maintaining a predetermined resin pressure. A compression molding device.   The compression molding apparatus according to claim 7 or 8, further comprising a decompression mechanism that forms a decompression space in which the interior space of the mold is blocked from the outside when the one mold is closed to the other mold. A resin supply handler for supplying each cavity recess formed in one of the mold dies opened according to claim 1 to claim 9,
A hopper that counts the particle resin, which is uniformly shaped and weighted, according to the cavity capacity and individually accommodates each cavity;
A shutter that is disposed so as to be openable and closable below the hopper and that supplies the granular resin to the cavity by opening the hopper,
The resin supply handler, wherein the granular resin accommodated in the hopper is supplied for each cavity when the shutter is collectively opened.

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