JP5776700B2 - Thermoelectric conversion module - Google Patents

Description

  The present invention relates to a thermoelectric conversion module that converts heat into electricity using a temperature difference, and more particularly, to a thermoelectric conversion module that can improve the conventional problems of low power generation and low manufacturing efficiency.

  As global warming advances, active use of renewable energy and energy conservation are indispensable in existing energy. In particular, in the situation where more than 60% of the energy used by mankind is thrown away as heat, the use of exhaust heat is considered particularly important.

  One of the methods is a thermoelectric conversion element that generates power from exhaust heat. If 5% of the discarded heat can be converted into electricity, an increase of about 10% in the amount of electricity currently used can be expected. Considering the construction of a power plant that generates this amount of electricity, the power generation using the exhaust heat will make a huge contribution.

  By the way, a conventional thermoelectric conversion element using the Seebeck effect has a structure in which a p-type element and an n-type element are coupled in a shape of “π” and stand vertically with respect to the lower substrate. And it is necessary to connect each element in series like n-type-p-type-n-type-p type, and the temperature difference is made by making one end a high temperature part and the other end is a low temperature part. Power was generated accordingly. However, the material of the thermoelectric conversion element generally used is a Bi-Te system. Since this material is a brittle material and it is difficult to join with solder, the thermoelectric conversion element is almost handmade. It was not made. For this reason, there was a situation where it was not used in large quantities for power generation purposes.

  Under such a technical background, Patent Literature 1 and Non-Patent Literature 1 propose a thermoelectric conversion element that can generate power efficiently. That is, this thermoelectric conversion element is formed such that a thin film p-type thermoelectric conversion element made of p-type material and a thin film n-type thermoelectric conversion element made of n-type material are connected in series, and electrodes are formed on both sides thereof. A thermoelectric conversion unit is formed by forming a film, and has a structure in which a flexible film-like substrate composed of two kinds of materials having different thermal conductivities is provided on both surfaces of the thermoelectric conversion unit. A film is formed on the side with a material such as polyimide resin, which is an insulator with low thermal conductivity, and a metal material such as copper with high thermal conductivity on the side opposite to the bonding surface of the thermoelectric conversion unit is formed on the outer surface of the film-like substrate. It was provided so that it might be located in a part.

  By adopting such a structure, a temperature difference is generated inside the film-like substrate from the difference in heat flux of each layer when a temperature difference is applied to the upper and lower surfaces of the film-like substrate. The temperature gradient is efficiently converted into a temperature gradient in the in-plane direction of the film-like substrate, and power generation is efficiently performed by the thermoelectric conversion unit using the temperature gradient. The inventions described in Patent Document 1 and Non-Patent Document 1 have high mechanical strength, excellent workability, are easy to automate, can be mass-produced, and are flexible to curved surfaces. The object of the present invention is to provide a thermoelectric conversion element with high power generation efficiency that can be installed and is not limited in installation location.

  Specifically, using a mask, a thermoelectric conversion unit is formed by depositing p-type and n-type thermoelectric materials on the resin sheet constituting the film-like substrate by sputtering while controlling the element structure. In addition, the thermoelectric conversion unit is sandwiched by attaching another resin sheet (the other film-like substrate) on the thermoelectric conversion unit. Next, on the both outer side surfaces of the bonded resin sheet and in a portion corresponding to the joint portion of the p-type and n-type thermoelectric conversion elements, the same shape as the joint portion is formed with a metal having good heat conductivity such as copper. The pattern is formed.

  Actually, using a polyimide sheet (shown as material-A in FIG. 1) coated or affixed with copper (shown as material-B in FIG. 1) on one side, p-type and n-type on the back side The thermoelectric conversion unit (shown as TE material in FIG. 1) is formed, and the back side of the other polyimide sheet not attached with copper is bonded onto the thermoelectric conversion unit, and both surfaces of the laminated sheet Etch the copper thin film on the substrate to cut the desired pattern. A cross section of this structure is shown in FIG. This copper portion comes into contact with the high temperature portion and the low temperature portion. Due to the heat conduction from there, there was a temperature difference in the thermoelectric conversion unit parallel to the resin sheet surface, and power was generated.

  However, in the above methods described in Patent Document 1 and Non-Patent Document 1, heat conduction from the high temperature side and low temperature side temperature contact portions (hereinafter referred to as temperature contact portions) is performed in the resin (polyimide sheet). There is a problem that the amount of power generation is reduced because the thermal conductivity to the thermoelectric conversion unit is low due to only the heat conduction by diffusion, and the temperature gradient in the thermoelectric conversion unit is difficult to be attached.

  In order to solve this problem, the present inventor has studied a large number of thermoelectric conversion structures. As a result, in the sheet type thermoelectric conversion unit, the temperature difference in the vertical direction is converted into the temperature difference in the horizontal direction in the sheet. For example, a column-shaped heat transfer rod (a high heat conduction part made of a material such as copper having a high thermal conductivity) is installed so that it penetrates substantially through the heat insulating material (substrate). A conversion module has been proposed (see FIGS. 8 and 16 of Patent Document 2). By adopting such a structure, the temperature of the high-temperature part and the low-temperature part can be efficiently transmitted to the thermoelectric conversion unit through each temperature contact part and each substrate, and thereby a large lateral temperature in the thermoelectric conversion module. As a result, the amount of power generation can be increased and improved.

  However, since the structure of the thermoelectric conversion module described in Patent Document 2 in which the heat transfer rod substantially penetrates the heat insulating material is complicated, there is a problem that the efficiency in manufacturing the thermoelectric conversion module is poor accordingly. There was still room for improvement.

JP 2006-186255 A JP 2009-16812 A

NEDO 2006 Research Grants Project Results Report Industrial Technology Research Grants Project “Energy / Environmental Technology” Project ID: 03B70010c = Presentation of “Research and development of sheet-like flexible thermoelectric conversion elements for low-temperature waste heat utilization”

  The present invention has been made paying attention to such a problem. Since the heat conduction from the temperature contact portion is only the heat conduction by the thermal diffusion in the resin, the temperature gradient is added due to the low heat conductivity. The above-mentioned problem of Patent Document 1 that the power generation amount is small due to difficulty is improved, and the problem that the manufacturing efficiency of the thermoelectric conversion module of Patent Document 2 is low due to the complicated structure can be solved. It is to provide a thermoelectric conversion module.

  Therefore, in order to solve this problem, the present inventor examined the following new structure instead of the structure of Patent Document 2 in which the heat transfer rod with high thermal conductivity passes through the heat insulating material (substrate). did. That is, first, a heat transfer structural member having a simple structure composed of a long heat conductive part having a rectangular parallelepiped shape and a high heat conductive part having a substantially L-shaped cross section or a substantially U-shaped cross-section partially covering the side surface is manufactured. A heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged two-dimensionally is manufactured.

  And when this heat-transfer structural member aggregate | assembly is arrange | positioned on both surfaces of the thermoelectric conversion unit to which the p-type thermoelectric conversion element which consists of p-type material, and the n-type thermoelectric conversion element which consists of n-type material were connected, the said heat insulating material ( To find out that a thermoelectric conversion module that functions substantially the same as the thermoelectric conversion module described in Patent Document 2 can be easily obtained without going through a complicated manufacturing process of penetrating a high thermal conductivity heat transfer rod in the substrate). It came. The present invention has been completed based on such technical findings.

That is, the thermoelectric conversion module according to the first invention is
A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. on both sides thermoelectric conversion unit alone or aggregates thereof, substrate which is formed by combining a material having high thermal conductivity and low material are respectively provided, arranged the other substrate and the one substrate to a high temperature side to low temperature side structure In a thermoelectric conversion module having
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and an entire second side surface adjacent to the first side surface And a high thermal conductivity portion having a substantially L-shaped cross section comprising a whole surface covering portion formed over a portion and a partial covering portion formed over an adjacent partial surface of the third side surface adjacent to the second side surface. In addition, the heat transfer structure member aggregates are respectively arranged with the third side surface side of the low heat conduction part in each heat transfer structure member of the heat transfer structure member assembly facing the thermoelectric conversion unit alone or its assembly side, Third side of the low heat conduction part in each heat transfer structural member Portion covering portion which is covered by the high thermal conductivity portion is thermally connected or close to the connection site or near the site of the p-type thermoelectric conversion element, or n-type thermoelectric conversion element, and the heat transfer structural member assembly The whole surface covering portion covered with the high heat conductive portion on the first side facing the third side surface of the low heat conductive portion in each of the heat transfer structural members is connected to a temperature contact portion made of a material having high thermal conductivity. It is characterized by
The thermoelectric conversion module according to the second invention is
A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. on both sides thermoelectric conversion unit alone or aggregates thereof, substrate which is formed by combining a material having high thermal conductivity and low material are respectively provided, arranged the other substrate and the one substrate to a high temperature side to low temperature side structure In a thermoelectric conversion module having
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and a second side surface respectively adjacent to the first side surface A whole surface covering portion formed over the entire surface and the entire fourth side surface, a whole surface covering portion, and a partial covering portion formed over the second side surface and each adjacent side partial surface of the third side surface adjacent to the fourth side surface; And a third side surface side of the low heat conduction portion of each heat transfer structure member of the heat transfer structure member assembly facing the thermoelectric conversion unit alone or its assembly side. The heat transfer structure member assemblies are respectively arranged. Rutotomoni, to the connection site or a site near the third side surface of the high thermal conductive portion in the part covered by the covering portion is p-type thermoelectric conversion element, or n-type thermoelectric conversion element of the low thermal conductive portion of the heat transfer structure member thermally And the entire covering portion covered with the high heat conduction portion on the first side facing the third side surface of the low heat conduction portion in each heat transfer structure member of the heat transfer structure member assembly is heated. It is connected to a temperature contact portion made of a material having high conductivity.

Next, the thermoelectric conversion module according to the third invention is
A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. A structure in which a substrate composed of a combination of a material with high and low thermal conductivity is provided on both sides of a single thermoelectric conversion unit or its assembly, and one substrate is placed on the high temperature side and the other substrate is placed on the low temperature side In a thermoelectric conversion module having
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and an entire second side surface adjacent to the first side surface A substantially L-shaped cross section comprising a partially missing covering portion formed over and partially missing and a partially covering portion formed over the adjacent partial surface of the third side surface adjacent to the second side surface And the heat transfer structure with the third side surface side of the heat transfer structure member of each heat transfer structure member of the heat transfer structure member assembly facing the thermoelectric conversion unit alone or its assembly side. Each member assembly is arranged, and each heat transfer structure member The partial covering portion covered with the high thermal conductivity portion on the third side surface of the low thermal conductivity portion is thermally connected to or close to the connection portion of the p-type thermoelectric conversion element or the n-type thermoelectric conversion element or the vicinity thereof, And the whole surface covering part covered with the high heat conduction part of the 1st side opposite to the 3rd side of the low heat conduction part in each heat transfer structure member of the above-mentioned heat transfer structure member aggregate is constituted with material with high heat conductivity. It is connected to the temperature contact part ,
The thermoelectric conversion module according to the fourth invention is:
A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. A structure in which a substrate composed of a combination of a material with high and low thermal conductivity is provided on both sides of a single thermoelectric conversion unit or its assembly, and one substrate is placed on the high temperature side and the other substrate is placed on the low temperature side In a thermoelectric conversion module having
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and a second side surface respectively adjacent to the first side surface A partial defect covering portion formed over the entire surface and the entire fourth side surface and one of which is partially defective; and the other surface covering portion or a partial defect covering portion which is partially defective; Each of the heat transfer structural member aggregates, and a high heat conduction portion having a substantially U-shaped cross section formed of a partial covering portion formed over each adjacent partial surface of the third side surface adjacent to the four side surfaces. The third side of the low thermal conductivity part of the thermal structural member The heat transfer structure member aggregates are respectively disposed toward the unit alone or the assembly side, and the partial covering portion covered with the high heat conduction portion on the third side surface of the low heat conduction portion in each heat transfer structure member is p-type The third of the low heat conduction parts in each heat transfer structure member of the heat transfer structure member assembly that is thermally connected to or close to the connection part of the thermoelectric conversion element or the n-type thermoelectric conversion element or its vicinity. The entire surface covering portion covered with the high thermal conductivity portion on the first side surface facing the side surface is connected to a temperature contact portion made of a material having high thermal conductivity .

According to the thermoelectric conversion module according to the first and third inventions,
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and an entire second side surface adjacent to the first side surface High thermal conductivity having a substantially L-shaped cross section comprising a full-surface covering portion or a partial defect covering portion formed over the entire surface and a partial covering portion formed over the adjacent partial surface of the third side surface adjacent to the second side surface And the heat transfer structure member assembly with the third side surface side of the low heat conduction portion of each heat transfer structure member of the heat transfer structure member assembly facing the thermoelectric conversion unit alone or its assembly side. Are arranged in each heat transfer structural member. Third portion covering portion which is covered by the high thermal conductive portion of the side surface of the low thermal conductivity portion is thermally connected or close to the connection site or near the site of the p-type thermoelectric conversion element, or n-type thermoelectric conversion element, and The entire covering portion covered with the high thermal conductivity portion on the first side facing the third side surface of the low thermal conductivity portion in each of the heat transfer structural members of the heat transfer structural member assembly is made of a material having high thermal conductivity. Since it is connected to the temperature contact portion, it is substantially the same as the thermoelectric conversion module described in Patent Document 2 without going through a complicated manufacturing process that penetrates a heat transfer rod with high thermal conductivity into the heat insulating material (substrate). Since a thermoelectric conversion module that functions in a straight line can be obtained, by mass-producing a heat transfer structural member having a simple structure composed of a long rectangular parallelepiped low heat conduction part and a high heat conduction part having a substantially L-shaped cross section In Patent Document 2 The thermoelectric conversion module which serves to mount has been substantially equal to the thermoelectric conversion module it is possible to easily manufacture.

Also in the thermoelectric conversion module according to the second and fourth inventions,
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and a second side surface respectively adjacent to the first side surface Each of the adjacent side partial surfaces of the whole surface covering portion or the partial defect covering portion and the whole surface covering portion or the partial defect covering portion and the third side surface adjacent to the second side surface and the fourth side surface formed over the entire surface and the entire fourth side surface. And a high heat conduction part having a substantially U-shaped cross section formed of a partial covering part formed over the third side surface side of the low heat conduction part in each heat transfer structure member of the heat transfer structure member assembly On the thermoelectric conversion unit alone or on its assembly side Only in conjunction with the heat transfer structural member assembly is arranged, the low thermal conductive portion third aspect of the high thermal conductive portion in the part covered by the covering portion is p-type thermoelectric conversion element, or n-type thermoelectric of in each heat transfer structure member A first side surface that is thermally connected to or close to the connection portion of the conversion element or its vicinity, and that faces the third side surface of the low heat conduction portion in each heat transfer structure member of the heat transfer structure member assembly Since the whole surface covering portion covered with the high thermal conductivity portion is connected to the temperature contact portion made of a material having high thermal conductivity, the high thermal conductivity heat transfer rod is made to penetrate through the heat insulating material (substrate). Since a thermoelectric conversion module that functions substantially the same as the thermoelectric conversion module described in Patent Document 2 can be obtained without going through a complicated manufacturing process, it has a long rectangular parallelepiped-shaped low heat conduction portion and a substantially U-shaped cross section. High thermal conductivity By keeping mass-produced heat transfer structure member of a simple structure composed of a, it is possible to easily produce a thermoelectric conversion module that functions substantially equal to the thermoelectric conversion module described in Patent Document 2.

Sectional drawing which shows the principal part structure of the thermoelectric conversion element which concerns on the prior art example of patent document 1. FIG. FIG. 2A is a schematic perspective view of a heat transfer structure member incorporated in the thermoelectric conversion module according to the first invention, and FIG. 2B is a heat transfer structure member incorporated in the thermoelectric conversion module according to the second invention. FIG. 2C is a schematic perspective view, FIG. 2C is a schematic perspective view of a heat transfer structural member incorporated in the thermoelectric conversion module according to the third invention, and FIG. 2D is a power transfer incorporated in the thermoelectric conversion module according to the fourth invention. The schematic perspective view of a thermal structure member. FIG. 3A is a schematic plan view of the thermoelectric conversion module according to the first invention, and FIG. 3B is a schematic cross-sectional view of FIG. 4A is a schematic plan view of the thermoelectric conversion module according to the second invention, and FIG. 4B is a schematic cross-sectional view of FIG. FIG. 5A is a plan view showing an example of a p-type material mask used in manufacturing the thermoelectric conversion module according to the present invention, and FIG. 5B is formed using the p-type material mask. The schematic perspective view which shows the pattern of a p-type thermoelectric conversion element. 6A is a plan view showing an example of an n-type material mask used when manufacturing the thermoelectric conversion module according to the present invention, and FIG. 6B is formed using the n-type material mask. The schematic perspective view which shows the pattern of an n-type thermoelectric conversion element. FIG. 7A is a plan view of a thermoelectric conversion unit assembly in which a plurality of thermoelectric conversion units in which p-type thermoelectric conversion elements and n-type thermoelectric conversion elements are connected are two-dimensionally arranged, and FIG. The schematic perspective view which shows the pattern of the thermoelectric conversion unit in which the type thermoelectric conversion element and the n-type thermoelectric conversion element were directly connected. Explanatory drawing which shows the connection site | part of the p-type thermoelectric conversion element or n-type thermoelectric conversion element of the thermoelectric conversion module which concerns on this invention, or its vicinity site | part. 1 is a schematic perspective view of a heat transfer structure member applied in Embodiment 1. FIG. FIG. 3 is a schematic cross-sectional view showing a position where a temperature measurement is performed by a thermocouple of the thermoelectric conversion module according to the first embodiment.

  Hereinafter, embodiments of the present invention will be described in detail.

  First, a thermoelectric conversion module according to the present invention includes a plurality of substrates (for example, a film-like substrate of Patent Document 1) that are provided on both surfaces of a single thermoelectric conversion unit or an assembly thereof and are made of materials having different thermal conductivities. The most characteristic feature is to apply a heat transfer structure member assembly in which the heat transfer structure members are continuously arranged two-dimensionally.

Hereinafter, the heat transfer structure member constituting the heat transfer structure member assembly will be described.
1. Heat transfer structure member The heat transfer structure member of the heat transfer structure member provided on both sides of the thermoelectric conversion unit alone or its assembly is composed of a low heat conduction part made of a material having a low thermal conductivity and a material having a high heat conductivity. It is preferable that it has a simple structure so that it can be easily mass-produced, and includes, for example, the following structures.

(1) 2.5-surface heat transfer structure member As shown in FIG. 2A, the heat transfer structure member 100 of the first example temporarily named “2.5-surface heat transfer structure member” An elongated rectangular parallelepiped-shaped low heat conducting portion 20 having a first side surface 1, a second side surface 2, a third side surface 3 and a fourth side surface 4 extending over the entire first side surface 1 of the low heat conducting portion 20 . A full-surface covering portion and a full-surface covering portion formed over the entire surface of the second side surface 2 adjacent to the first side surface 1 and a partial side surface of the third side surface 3 adjacent to the second side surface 2 were formed. It is comprised with the high heat conduction part 21 of a cross-section substantially L shape comprised from the partial coating | coated part 3a .

Then, in order to assemble the 2.5-surface heat transfer structural member 100 and incorporate it into the thermoelectric conversion module, the second side surface 2 and the fourth side surface of the plurality of heat transfer structural members 100 as shown in FIG. The heat transfer structure member aggregate 110 is configured by two-dimensionally arranging them so that the four are in contact with each other, and the third side surface 3 side of the low heat conduction portion 20 in each heat transfer structure member 100 is shown in FIG. The heat transfer structure member assembly 110 is arranged toward the thermoelectric conversion unit assembly 200 side shown in B) and is covered with the high heat conduction portion 21 on the third side surface 3 of the low heat conduction portion 20 in each heat transfer structure member 100. The partially covered portion 3a may be adjusted so as to be thermally connected to or close to the connection site of the p-type thermoelectric conversion element or the n-type thermoelectric conversion element of the thermoelectric conversion unit assembly 200 or its vicinity.

  In order to configure the heat transfer structure member assembly 110 by two-dimensionally arranging a plurality of heat transfer structure members 100 such that the second side face 2 and the fourth side face 4 are in contact with each other, for example, FIG. As shown to B), the method to affix the heat-transfer structural member 100 on the sheet | seat 201 which consists of a polyimide resin etc. via an adhesive agent is mentioned. Moreover, about the length of the short side of the 3rd side surface 3 in the low heat conductive part 20 of the heat-transfer structural member 100 arrange | positioned toward the said thermoelectric conversion unit aggregate | assembly 200 side, FIG. 3 (A) (B), for example. The thermoelectric conversion unit aggregate 200 in the thermoelectric conversion unit assembly 200 may be set approximately equal to the length of two rows in the width direction as shown in FIG.

(2) 3.5-plane heat transfer structural member The second example of the heat transfer structural member 101 tentatively referred to as “3.5-plane heat transfer structural member” has a length direction as shown in FIG. first side 1 extending, a second side 2, the low thermal conductive portion 20 of the elongated rectangular parallelepiped shape having a third side face 3 and the fourth side face 4, is formed over the first side 1 the entire surface of the low thermal conductive portion 20 The entire covering portion and the entire covering portion formed over the entire second side surface 2 and the entire fourth side surface 4 adjacent to the first side surface 1, the entire covering portion, the second side surface 2, and the fourth side surface 4. It is comprised with the high heat conduction part 21 of the cross-sectional substantially U-shape comprised from the partial coating | coated part 3a formed over each adjacent side partial surface of the adjacent 3rd side surface 3. FIG .

Then, in order to assemble the 3.5-plane heat transfer structural member 101 into a thermoelectric conversion module, the second side surface 2 and the fourth side surface of the plurality of heat transfer structural members 101 as shown in FIG. The heat transfer structure member assembly 111 is configured by two-dimensionally arranging them so that the four are in contact with each other, and the third side surface 3 side of the low heat conduction portion 20 in each heat transfer structure member 101 is shown in FIG. The heat transfer structure member assembly 111 is arranged toward the thermoelectric conversion unit assembly 210 side shown in B), and is covered with the high heat conduction portion 21 on the third side surface 3 of the low heat conduction portion 20 in each heat transfer structure member 101. The partially covered portion 3a may be adjusted so as to be thermally connected to or close to the connection site of the p-type thermoelectric conversion element or the n-type thermoelectric conversion element of the thermoelectric conversion unit assembly 210 or its vicinity.

  In order to configure the heat transfer structure member assembly 111 by two-dimensionally arranging a plurality of heat transfer structure members 101 such that the second side surface 2 and the fourth side surface 4 are in contact with each other, for example, FIG. As shown in B), there is a method in which the heat transfer structural member 101 is stuck on a sheet 211 made of polyimide resin or the like via an adhesive. Moreover, about the length of the short side of the 3rd side surface 3 in the low heat conductive part 20 of the heat-transfer structural member 101 arrange | positioned toward the said thermoelectric conversion unit aggregate | assembly 210 side, FIG. 4 (A) (B), for example. The thermoelectric conversion unit aggregate 210 in the thermoelectric conversion unit aggregate 210 may be set substantially equal to the length of two rows in the width direction as shown in FIG.

(3) Partially defective 2.5 surface heat transfer structural member The third example of the heat transfer structural member 102 tentatively called “partially defective 2.5 surface heat transfer structural member” is as shown in FIG. A long rectangular parallelepiped-shaped low heat conduction portion 20 having a first side surface 1, a second side surface 2, a third side surface 3 and a fourth side surface 4 extending in the length direction, and the entire first side surface 1 of the low heat conduction portion 20. A partially covered covering portion formed over the entire surface of the second side surface 2 adjacent to the first side surface 1 and partially missing, and a third portion adjacent to the second side surface 2 It is composed of a cross-section substantially L-shape of the high thermal conductive portion 21 composed of the side surface 3 of the adjacent side portion surface portion covering portion formed over. The reason why the high heat conduction portion 21 on the second side surface 2 is partially lost in the heat transfer structure member 102 of the third example is that the partial defect covering portion on the second side surface 2 and the high heat are about a plurality of heat transfer structure members. When the four side surfaces 4 that are not covered with the conductive portion 21 are arranged two-dimensionally continuously so that they are in contact with each other , the high heat conductive portion 21 on the second side surface 2 is partially lost, and the heat transfer conversion unit set This is because the thermal conductivity between the body and the body is adjusted to obtain an optimum thermal conduction state.

  The method of assembling the partially defective 2.5-plane heat transfer structure member 103 into the thermoelectric conversion module is the same as that of the 2.5-plane heat transfer structure member.

(4) Partially-defect 3.5-plane heat transfer structure member A fourth example of the heat-transfer structure member 103 tentatively called “partially-defect 3.5-plane heat transfer structure member” is as shown in FIG. , first side 1 and which extends in the longitudinal direction, a second side 2, and the low thermal conductive portion 20 of the elongated rectangular parallelepiped shape having a third side surface 3 and the fourth side surface 4, the first side 1 the entire surface of the low thermal conductive portion 20 An entire covering portion formed over the entire surface, the entire second side surface 2 adjacent to the first side surface, and the entire fourth side surface 4; From the entire covering portion or the partially missing covering portion that is partially missing, and the partial covering portion that is formed across the adjacent side partial surfaces of the second side face 2 and the third side face 3 adjacent to the fourth side face 4. is a structure which consists of a highly thermal conductive portion 21 of a substantially U shape composed. The reason why at least one of the high heat conducting portions 21 of the second side surface 2 and the fourth side surface 4 is partially lost is the same as that of the “partially missing 2.5 surface type heat transfer structure member”.

(5) High thermal conductivity material that constitutes the high thermal conductivity part (high thermal conductivity material)
The material having high thermal conductivity (high thermal conductivity material) constituting the high thermal conductivity portion of the heat transfer structure member according to the present invention is preferably a metal or the like, specifically, a metal such as copper or aluminum, or Cu-Ni-Si. Examples thereof include alloys having high thermal conductivity such as Al alloys, Al-Zn-Mg alloys, and Be-Cu alloys, and ceramics. Among these, it is preferable that it is 1 type chosen from aluminum and copper.

  Also, the high heat conduction material constituting the heat transfer structure member assembly arranged on the low temperature side and the high heat conduction part of the heat transfer structure member assembly arranged on the high temperature side may both be made of the same material. It may be configured using different materials or may be arbitrary.

(6) Low thermal conductivity material constituting the low thermal conductivity part (low thermal conductivity material)
Examples of the low thermal conductivity material (low thermal conductivity material) constituting the low thermal conductivity portion of the heat transfer structure member according to the present invention include resins such as polyimide and foamed polystyrene, glass, and the like. As in the case of the high heat conduction material, both the heat transfer structure member assembly arranged on the low temperature side and the low heat conduction material constituting the low heat conduction part of the heat transfer structure member assembly arranged on the high temperature side are both It may be composed of the same material or may be composed of different materials, and is arbitrary.

  Further, the material constituting the low thermal conductivity portion is preferably an electrically insulating material having a low thermal conductivity as much as possible, and the above-described resin materials such as polyimide and foamed polystyrene, or glass materials can be properly used depending on the purpose. Further, the low thermal conductivity part desirably has a low thermal conductivity, and in particular, the thermal conductivity is preferably 0.1 W / mK or less. In addition, as for the thickness of the low thermal conduction part, a thicker one is desirable because a temperature difference between thermoelectric conversion elements becomes large. However, if the low heat conduction part becomes too thick, when the thermoelectric conversion module according to the present invention is applied to the back surface of the solar cell to generate power, the temperature rise of the solar cell itself may become a problem. When the thickness of the part is about several mm, the influence of the temperature rise is not so great.

  In addition, the heat transfer structural member according to the present invention fixes the high heat conducting portion having a substantially L-shaped or substantially U-shaped cross section using an adhesive to the long rectangular parallelepiped low heat conducting portion. There is no particular limitation on the thermal conductivity, and there is no particular limitation.

2. Thermoelectric Conversion Module Next, the thermoelectric conversion module of the present invention in which the heat transfer structural member assembly is applied to a substrate will be described.

(1) Thermoelectric conversion module to which 2.5-plane heat transfer structure member is applied As shown in FIGS. 3 (A) and 3 (B), the thermoelectric conversion module to which 2.5-plane heat transfer structure member is applied, A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. the thermoelectric conversion unit alone or aggregates thereof (FIG thermoelectric conversion unit assembly 200 in 3) double-sided, with the substrate that is configured by combining a high material and a material having low thermal conductivity are respectively provided, one of the substrate temperature side And the other substrate is disposed on the low temperature side. Moreover, the said board | substrate is comprised by the heat-transfer structural member aggregate | assembly 110 which arranged the several heat-transfer structural member 100 continuously two-dimensionally. Each of the heat transfer structural members 100 includes a long rectangular parallelepiped-shaped low heat conducting portion 20 having a first side surface 1, a second side surface 2, a third side surface 3, and a fourth side surface 4 extending in the length direction. The entire covering portion formed over the entire first side surface 1 of the conductive portion 20 and the entire covering portion formed over the entire second side surface 2 adjacent to the first side surface 1 are adjacent to the second side surface 2. It is comprised by the high heat conductive part 21 of the cross-sectional substantially L shape which consists of the partial coating | coated part 3a formed over the adjacent side partial surface of the 3rd side surface 3. As shown in FIG. And the said heat-transfer structural member assembly 110 each faces the 3rd side 3 side of the low heat conduction part 20 in each heat-transfer structural member 100 of the said heat-transfer structural member assembly 110 toward the said thermoelectric conversion unit assembly 200 side, respectively. The partial covering portion 3a that is arranged and covered with the high heat conduction portion of the third side surface 3 of the low heat conduction portion 20 in each heat transfer structural member 100 is the connection portion of the p-type thermoelectric conversion element or the n-type thermoelectric conversion device or the vicinity thereof. The high heat conduction portion of the first side surface 1 that is thermally connected to or close to the site and faces the third side surface 3 of the low heat conduction portion 20 in each heat transfer structure member 100 of the heat transfer structure member assembly 110. The whole surface covering portion covered with 21 is connected to a temperature contact portion (not shown) made of a material having high thermal conductivity.

According to the thermoelectric conversion module according to the first invention to which the 2.5-surface heat transfer structure member is applied, as shown in FIGS. 3 (A) and 3 (B), the high heat conduction of the third side surface 3 of the low heat conducting portion 20 is achieved. The partially covered portion 3 a covered with the portion 21 is thermally connected to or in close proximity to the connection site of the p-type thermoelectric conversion element or the n-type thermoelectric conversion element of the thermoelectric conversion unit assembly 200 or its vicinity. For this reason, the heat (temperature) from the first side surface 1 of the low thermal conduction part 20 in which the entire surface covering part (high thermal conduction part 21) is connected to the high temperature side temperature contact part (not shown) is It is transmitted to the p-type thermoelectric conversion element or the n-type thermoelectric conversion element via the high thermal conduction portion 21 covering the entire surface of the second side face 2 and the partial covering portion 3a of the third side face 3, and is also transmitted to the p-type thermoelectric conversion element or the n-type thermoelectric conversion element. The heat (temperature) from the element is also a low temperature side temperature contact portion (not shown) located on the opposite side via the high thermal conduction portion 21 covering the partial covering portion 3a on the other side surface 3 and the entire second side surface 2. since efficiently transmitted to the entire surface covering portion of the first side 1 (highly thermal conductive portion 21) which is connected without), it is possible to realize a large temperature difference to the thermoelectric conversion unit assembly 200.

(2) Thermoelectric conversion module to which a 3.5-plane heat transfer structure member is applied A thermoelectric conversion module to which a 3.5-plane heat transfer structure member is applied, as shown in FIGS. A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. the thermoelectric conversion unit alone or aggregates thereof (FIG. 4 thermoelectric conversion unit assembly 210 in) double-sided, with the substrate that is configured by combining a high material and a material having low thermal conductivity are respectively provided, one of the substrate temperature side And the other substrate is disposed on the low temperature side. Moreover, the said board | substrate is comprised by the heat-transfer structural member aggregate | assembly 111 which arranged the several heat-transfer structural member 101 continuously two-dimensionally. Each of the heat transfer structural members 101 includes a long rectangular parallelepiped-shaped low heat conducting portion 20 having a first side surface 1, a second side surface 2, a third side surface 3, and a fourth side surface 4 extending in the length direction. The entire covering portion formed over the entire first side surface 1 of the conductive portion 20, the entire covering portion formed over the entire second side surface 2 and the entire fourth side surface 4 respectively adjacent to the first side surface 1, and the entire surface. A highly heat-conductive portion 21 having a substantially U-shaped cross section comprising a covering portion and a partial covering portion 3 a formed over each adjacent partial surface of the third side surface 3 adjacent to the second side surface 2 and the fourth side surface 4 ; It consists of And the said heat-transfer structural member aggregate 111 each faces the 3rd side 3 side of the low heat conduction part 20 in each heat-transfer structural member 101 of the said heat-transfer structural member aggregate 111 toward the said thermoelectric conversion unit aggregate 210 side, respectively. The partial covering portion 3a disposed and covered with the high heat conduction portion 21 on the third side surface 3 of the low heat conduction portion 20 in each heat transfer structural member 101 is the connection portion of the p-type thermoelectric conversion element or the n-type thermoelectric conversion element or its High thermal conductivity of the first side surface 1 that is thermally connected to or in close proximity to the vicinity and that faces the third side surface 3 of the low thermal conductivity portion 20 in each heat transfer structural member 101 of the heat transfer structural member assembly 111. The whole surface covering portion covered with the portion 21 is connected to a temperature contact portion (not shown) made of a material having high thermal conductivity.

According to the thermoelectric conversion module according to the second invention to which the 3.5-plane heat transfer structural member is applied, as shown in FIGS. 4 (A) and 4 (B), the high heat conduction of the third side surface 3 of the low heat conducting portion 20. The partially covered portion 3a covered with the portion 21 is thermally connected to or close to the connection site of the p-type thermoelectric conversion element or the n-type thermoelectric conversion element of the thermoelectric conversion unit assembly 210 or its vicinity. For this reason, the heat (temperature) from the first side surface 1 of the low thermal conduction part 20 in which the entire surface covering part (high thermal conduction part 21) is connected to the high temperature side temperature contact part (not shown) is It is transmitted to the p-type thermoelectric conversion element or the n-type thermoelectric conversion element via the high thermal conductivity portion 21 covering the entire surfaces of the second side surface 2 and the fourth side surface 4 and the partial covering portion 3a of the third side surface 3, heat from the conversion element or n-type thermoelectric conversion element (temperature) also via a highly thermal conductive portion 21 which covers the portion covering portion of the third side surface 3 of the other side 3a and the second side 2 of each entire surface of the fourth side surface 4 Since it is efficiently transmitted to the entire surface covering portion (high heat conduction portion 21) of the first side face 1 connected to the low temperature side temperature contact portion (not shown) located on the opposite side, it is large in the thermoelectric conversion unit assembly 210. A temperature difference can be realized.

(3) Thermoelectric conversion material Examples of p-type and n-type thermoelectric conversion materials applied to the thermoelectric conversion unit according to the present invention include thermoelectric compounds such as IrSb ₃ , Bi ₂ Te ₃ , and PbTe having high performance, as well as thermoelectric conversion materials. Examples include silicides such as FeSi ₂ and SiGe, which have low properties but are abundant in resources. In addition, by adjusting the amount of various additive elements such as P, B, and Al alone or combined so that the carrier concentration in the Si semiconductor is about 10 ²⁴ (1 / m ³ ) and the amount added, the Seebeck coefficient can be increased. Si-based thermoelectric conversion materials that are extremely large and have significantly improved thermoelectric conversion efficiency can also be used.

(4) Temperature contact part It coat | covers with the high heat conduction part 21 of the 1st side surface 1 which opposes the 3rd side surface 3 of the low heat conduction part 20 in each heat-transfer structural member 100,101,102,103 of the thermoelectric conversion module which concerns on this invention. It is preferable that the surface of the temperature contact portion to which the entire surface covering portion is connected is covered with a substantially black oxide film or a material having high thermal conductivity. Examples of the above materials include copper oxides and resin materials with high thermal conductivity and high environmental resistance. This makes it easy to follow the temperature of the high temperature part and the low temperature part, and the temperature inside the thermoelectric conversion module. This is preferable because the gradient becomes large and large power generation is possible.

Moreover, in the thermoelectric conversion module which concerns on this invention, it is preferable to roughen the whole surface coating | coated part surface of the 1st side surface 1 arrange | positioned at the low temperature side and coat | covered with the high heat conductive part 21. FIG. In order to roughen the surface, the surface may be scratched with sandblasting or a file. The surface roughness is rough so that the effective surface area is twice or more than the apparent area. If this is the case, the effect is great, and the heat transfer coefficient is more than doubled, which is effective.

Moreover, in the thermoelectric conversion module which concerns on this invention, it is also possible to take the structure which added the heat sink to the whole surface coating | coated part surface of the 1st side surface 1 arrange | positioned at the low temperature side and coat | covered with the high heat conductive part 21. By adopting such a configuration, it is possible to make the effective surface area more than twice the apparent surface area (simply seen from the dimensions), and obtain a large heat transfer coefficient (20 W / m ² K or more). Therefore, a large temperature difference between the high temperature part and the low temperature part can be obtained, and the power generation amount can be increased.

3. Manufacture of Thermoelectric Conversion Module A thermoelectric conversion module according to the present invention is composed of a long rectangular parallelepiped-shaped low heat conducting portion and a high heat conducting portion having a substantially L-shaped cross section or a substantially U-shaped cross section partially covering the side surface. A heat transfer structure member assembly obtained by arranging a plurality of heat transfer structure members two-dimensionally in succession, as described above, the p-type thermoelectric conversion element and the n-type thermoelectric conversion element are directly or via a metal material. Two or more connected thermoelectric conversion units are arranged on one or more thermoelectric conversion units alone or on both sides of the assembly, one heat transfer structure member assembly is arranged on the high temperature side, and the other heat transfer The structure has a structure in which the structural member aggregates are arranged on the low temperature side.

  In order to form the thermoelectric conversion unit, for example, a p-type mask as shown in FIG. 5A is fixed to one surface of a polyimide resin sheet having a thickness of about 50 μm, and in this state, a sputtering apparatus is used. As shown in FIG. 5B, a p-type material is deposited to a thickness of about 1 μm, for example.

  Thereafter, an n-type mask as shown in FIG. 6A is fixed, and an n-type material is formed to a thickness of about 1 μm so as to have the same film thickness as the p-type material. A thermoelectric conversion unit assembly (FIG. 7A) in which a plurality of thermoelectric conversion units 10 shown in FIG. 7B to which a thin film p-type thermoelectric conversion element 11 and a thin film n-type thermoelectric conversion element 12 are connected are two-dimensionally arranged. Further, as shown in FIG. 7A, electrodes 13 and 14 are attached to each row in which a plurality of thermoelectric conversion units 10 are arranged in series to obtain a thermoelectric conversion unit assembly having electrodes.

  For example, in order to manufacture a thermoelectric conversion module to which a 2.5-surface heat transfer structure member is applied, first, the plurality of 2.5-surface heat transfer structure members 100 shown in FIG. A pair of heat transfer structural member assemblies 110 are manufactured by two-dimensionally continuously arranging the second side surface 2 and the fourth side surface 4 in contact with each other.

Next, with respect to the obtained pair of heat transfer structure members 110, the thermoelectric conversion unit assembly 200 shown in FIG. 7A, which corresponds to a thermoelectric conversion unit assembly in which a plurality of thermoelectric conversion units indicated by reference numeral 10 in FIG. 7A are two-dimensionally arranged, and the low heat conduction portion 20 of each heat transfer structural member 100 The partial covering portion 3a covered with the high thermal conductivity portion 21 of the third side surface 3 is a connection portion of the p-type thermoelectric conversion element or the n-type thermoelectric conversion element of the thermoelectric conversion unit assembly 200 or a vicinity thereof (reference numeral 15 in FIG. 8). After being adjusted so as to be thermally connected to or in close proximity to the portion shown by (3), the heat transfer structure member 100 was covered with the high heat conduction portion 21 on the first side surface 1 facing the third side surface 3 of the low heat conduction portion 20. whole surface It is connected to one of the covering portion temperature contact portion (high temperature side), to produce a thermoelectric conversion module which 2.5 surface type heat transfer structural member is applied to connect to the temperature contact portion (low temperature side) other Can do.

In addition, in the high heat conduction portion 21 on the third side surface 3 in each low heat conduction portion 20 that is thermally connected to or close to the connection portion of the p-type thermoelectric conversion element or the n-type thermoelectric conversion element of the thermoelectric conversion unit assembly or the vicinity thereof. About the contact width of the covered partial coating | coated part 3a , it does not necessarily correspond with the high temperature side and low temperature side which are shown in FIG.3 (B), and is arbitrary.

  Further, a plurality of 2.5-surface heat transfer structural members 100 are two-dimensionally arranged so that the second side surface 2 and the fourth side surface 4 are in contact with each other to manufacture a pair of heat transfer structure member assemblies 110. For example, as shown in FIG. 3B, the heat transfer structure member 100 can be obtained by attaching the heat transfer structural member 100 to a sheet 201 made of polyimide resin having a thickness of about 50 μm via an adhesive. In this case, it is desirable that the thermoelectric conversion unit assembly having the electrode is formed on the back surface side of the one sheet 201 to which the heat transfer structural member 100 is attached, but the thermoelectric conversion unit assembly is separated from another sheet ( A method of arranging a pair of heat transfer structural member assemblies 110 from both sides of the polyimide resin sheet) in advance may be used.

  Next, for example, in order to manufacture a thermoelectric conversion module to which a 3.5-plane heat transfer structure member is applied, first, a plurality of 3.5-plane heat transfer structure members 101 shown in FIG. The second side surface 2 and the fourth side surface 4 are two-dimensionally continuously arranged so as to be in contact with each other to manufacture a pair of heat transfer structure member assemblies 111.

And about the obtained pair of heat-transfer structural member aggregate 111, the thermoelectric conversion unit aggregate | assembly 210 (FIG. 4B) which showed the 3rd side surface 3 side of the low heat conductive part 20 in each heat-transfer structural member 101 in FIG. 7A corresponding to a thermoelectric conversion unit assembly in which a plurality of thermoelectric conversion units 10 indicated by reference numeral 10 are two-dimensionally arranged, and the low heat conduction portion 20 of each heat transfer structural member 101 The partial covering portion 3a covered with the high heat conducting portion 21 on the three side surfaces 3 is connected to the p-type thermoelectric conversion element or the n-type thermoelectric conversion element of the thermoelectric conversion unit assembly 210 or its vicinity (reference numeral 15 in FIG. 8). All of the heat transfer structure members 101 covered with the high heat conduction portion 21 on the first side surface 1 facing the third side surface 3 of the low heat conduction portion 20 in each heat transfer structure member 101. One of the cover portion is connected to a temperature contact portion (high temperature side), to produce a thermoelectric conversion module 3.5 surface type heat transfer structure member is applied is connected to the temperature contact portion (low temperature side) other Can do.

  Examples of the present invention will be specifically described below.

[Example 1]
The following materials were applied as materials constituting the thermoelectric conversion module according to Example 1.

(1) Thermoelectric conversion unit The size of one unit of the thermoelectric conversion unit (minimum constituent part composed of one p-type thermoelectric conversion element and one n-type thermoelectric conversion element) was set to 5 mm × 5 mm.

  The thermoelectric conversion units were electrically connected in series or appropriately in parallel to form a module of 10 cm × 10 cm.

(2) 2.5-plane heat transfer structural member (2-1) Low thermal conductivity part Styrofoam (thermal conductivity is about 0.03 W / mK) is used as a material constituting the low thermal conduction part, and the foam thickness is 2 mm. The plate is cut into a strip of 10 mm × 100 mm, and the low heat conduction part 20 of the “2.5-plane heat transfer structure member” having the first side face 1, the second side face 2, the third side face 3 and the fourth side face 4. It was.

(2-2) High heat conduction portion A 0.05 mm thick copper plate was used as a material constituting the high heat conduction portion, and this copper plate was cut into 13 mm x 100 mm.

  Then, a crease was made in parallel at two locations with respect to the long side of the copper plate, a crease was passed through a point of 10 mm on the short side, and a crease was made at an angle of 90 ° inside 2 mm.

(2-3) 2.5-plane heat transfer structural member And, the copper plate (high heat conduction portion 21) and the polystyrene foam (low heat conduction portion 20) are fixed using an adhesive, and in Example 1 shown in FIG. Such a “2.5-plane heat transfer structure member” was produced.

  Of the obtained “2.5-plane heat transfer structural member” shown in FIG. 9, the partially covered portion (partial surface) 3 a of the copper plate (high heat conduction portion 21) having a width of 1 mm and extending in the long side direction is described above. A thermoelectric conversion module is obtained by arranging and bonding toward the thermoelectric conversion unit side.

(3) 2.5-plane heat transfer structural member assembly Ten “2.5-plane heat transfer structural members” shown in FIG. 9 are two-dimensionally arranged in series, and as shown in FIG. A “2.5-plane heat transfer structure member assembly” according to Example 1 was prepared by pasting on a 50 μm polyimide sheet 91. Here, when adhering the “2.5-surface heat transfer structure member” onto the polyimide sheet 91, it is preferable to apply a highly heat conductive adhesive. In Example 1, the adhesive manufactured by Dietmat of the United States is used. The agent “DM440K2” was used.

  Similarly, ten “2.5-plane heat transfer structural members” are two-dimensionally attached on the polyimide sheet 91 having a thickness of 50 μm, and another set of “2.5-plane heat transfer structures” is attached. “Thermal structural member assembly” was produced.

(4) Heat transfer test Next, with respect to the obtained pair of “2.5-plane heat transfer structure member assemblies”, the partial covering portion (partial surface) 3a side of the copper plate (high heat conduction portion 21) is opposed to each other. Without arranging the thermoelectric conversion unit assembly, after arranging each partial covering portion (partial surface) 3a to be shifted by 5 mm as shown in FIG. 10, each partial covering portion (partial surface) 3a For a “heat transfer test”, a pair of “2.5-plane heat transfer structural member assemblies” are joined in the vicinity (locations indicated by reference signs A and B in FIG. 10) with a thermocouple interposed. The medium was obtained.

  Then, as shown in FIG. 10, the first side surface 1 side that is entirely covered with the high heat conduction portion 21 of the low heat conduction portion 20 in one “2.5-plane heat transfer structure member assembly” is 100 on the high temperature side. Adhering to a metal plate kept at ° C., the first side 1 side entirely covered with the high heat conduction part 21 of the low heat conduction part 20 in the other “2.5 surface heat transfer structure member assembly” is the low temperature side. It connected to the metal plate hold | maintained at 30 degreeC. The point A in FIG. 10 corresponds to the high temperature part, and the point B in FIG. 10 corresponds to the low temperature part.

  When the temperature at the point A and the point B was measured under such an arrangement condition, the temperature at the point A was 82 ° C., the temperature at the point B was 47 ° C., and the temperature difference between the point A and the point B Was 35 ° C.

  As a result, when a thermoelectric conversion module is configured by interposing a thermoelectric conversion unit assembly between a pair of “2.5 plane heat transfer structure member assemblies”, a thermoelectric conversion unit assembly (1 module: 10 cm × 10 cm) It has been confirmed that it is possible to make a large temperature difference in the plane to be disposed.

(5) Thermoelectric Conversion Module Next, a thermoelectric conversion module according to Example 1 was manufactured by interposing a thermoelectric conversion unit assembly between the “2.5 plane heat transfer structure member assemblies”.

  Specifically, the thermoelectric conversion is performed on a polyimide sheet having a thickness of 50 μm before manufacturing one “2.5-plane heat transfer structure member assembly” according to the above-described method shown in FIGS. After the units were formed electrically in series to obtain a 10 cm × 10 cm thermoelectric conversion unit assembly (one module), 10 “2. On the back side of the polyimide sheet on which the thermoelectric conversion unit assembly was formed. A “5-surface heat transfer structure member assembly” having a thermoelectric conversion unit assembly on the back surface was manufactured by two-dimensionally affixing the “5-surface heat transfer structure member” continuously.

The thermoelectric conversion unit includes a p-type thermoelectric conversion element made of a p-type material [(BiSb) ₂ Te ₃ ] having a thickness of 1 μm and an n-type thermoelectric conversion made of an n-type material (Bi ₂ Te ₃ ) having a thickness of 1 μm. The minimum component part composed of the elements is one unit.

And about the "2.5 surface type heat-transfer structural member assembly" which does not have the thermoelectric conversion unit assembly on the back surface, and the "2.5 surface type heat transfer structure member assembly" of the copper plate (high heat conduction part 21) The partial covering portions (partial surfaces) 3a are opposed to each other and arranged so that each partial covering portion (partial surface) 3a is displaced by 5 mm as shown in FIG. 10 with the thermoelectric conversion unit assembly interposed therebetween. After joining, the metal which hold | maintained the 1st side surface 1 side covered with the high heat conductive part 21 of the low heat conductive part 20 in one "2.5 surface type heat-transfer structural member aggregate | assembly" on the high temperature side at 100 degreeC. Metal bonded to a plate and having the first side surface 1 side entirely covered with the high heat conductive portion 21 of the low heat conductive portion 20 in the other “2.5-plane heat transfer structural member assembly” held at 30 ° C. on the low temperature side When power was generated by connecting to the board, there was a 0.4W power generation. .

  The temperature conditions are assumed to be the temperature (about 100 ° C.) and the atmospheric temperature (about 30 ° C.) of the back surface of the solar cell in midsummer.

  From this result, it was confirmed that when converted to the amount of power generated when the thermoelectric conversion module according to Example 1 was pasted on the back side of the solar cell, this corresponds to an increase in performance of about 4%.

  That is, it was originally found that the silicon solar cell with a conversion efficiency of 15% realized a conversion efficiency of 19%, and the contribution of the thermoelectric conversion module according to Example 1 was large.

  According to the present invention, it becomes possible to easily manufacture a thermoelectric conversion module having an increased and improved power generation amount, and by effectively bonding the thermoelectric conversion module to the back side of the solar cell, effective power generation of the solar cell is achieved. Efficiency can be increased. Therefore, the thermoelectric conversion module according to the present invention has industrial applicability to be used by being incorporated in a solar cell.

DESCRIPTION OF SYMBOLS 1 1st side surface 2 2nd side surface 3 3rd side surface 3a Partial coating | coated part 4 4th side surface 10 Thermoelectric conversion unit 11 p-type thermoelectric conversion element 12 n-type thermoelectric conversion element 13 Electrode 14 Electrode 15 Connection site | part or vicinity of each thermoelectric conversion element Part 20 Low heat conduction part 21 High heat conduction part 100 2.5 face type heat transfer structure member 101 3.5 face type heat transfer structure member 102 Partial defect 2.5 face type heat transfer structure member 103 Partial defect 3.5 face type transfer Thermal structure member 110 Heat transfer structure member assembly 111 Heat transfer structure member assembly 200 Thermoelectric conversion unit assembly 201 Sheet 210 Thermoelectric conversion unit assembly 211 Sheet

Claims (7)

A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. on both sides thermoelectric conversion unit alone or aggregates thereof, substrate which is formed by combining a material having high thermal conductivity and low material are respectively provided, arranged the other substrate and the one substrate to a high temperature side to low temperature side structure In a thermoelectric conversion module having
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and an entire second side surface adjacent to the first side surface And a high thermal conductivity portion having a substantially L-shaped cross section comprising a whole surface covering portion formed over a portion and a partial covering portion formed over an adjacent partial surface of the third side surface adjacent to the second side surface. In addition, the heat transfer structure member aggregates are respectively arranged with the third side surface side of the low heat conduction part in each heat transfer structure member of the heat transfer structure member assembly facing the thermoelectric conversion unit alone or its assembly side, Third side of the low heat conduction part in each heat transfer structural member Portion covering portion which is covered by the high thermal conductivity portion is thermally connected or close to the connection site or near the site of the p-type thermoelectric conversion element, or n-type thermoelectric conversion element, and the heat transfer structural member assembly The whole surface covering portion covered with the high heat conductive portion on the first side facing the third side surface of the low heat conductive portion in each of the heat transfer structural members is connected to a temperature contact portion made of a material having high thermal conductivity. A thermoelectric conversion module characterized by that. A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. on both sides thermoelectric conversion unit alone or aggregates thereof, substrate which is formed by combining a material having high thermal conductivity and low material are respectively provided, arranged the other substrate and the one substrate to a high temperature side to low temperature side structure In a thermoelectric conversion module having
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and a second side surface respectively adjacent to the first side surface A whole surface covering portion formed over the entire surface and the entire fourth side surface, a whole surface covering portion, and a partial covering portion formed over the second side surface and each adjacent side partial surface of the third side surface adjacent to the fourth side surface; And a third side surface side of the low heat conduction portion of each heat transfer structure member of the heat transfer structure member assembly facing the thermoelectric conversion unit alone or its assembly side. The heat transfer structure member assemblies are respectively arranged. Rutotomoni, to the connection site or a site near the third side surface of the high thermal conductive portion in the part covered by the covering portion is p-type thermoelectric conversion element, or n-type thermoelectric conversion element of the low thermal conductive portion of the heat transfer structure member thermally And the entire covering portion covered with the high heat conduction portion on the first side facing the third side surface of the low heat conduction portion in each heat transfer structure member of the heat transfer structure member assembly is heated. A thermoelectric conversion module, characterized in that it is connected to a temperature contact portion made of a material having high conductivity. A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. A structure in which a substrate composed of a combination of a material with high and low thermal conductivity is provided on both sides of a single thermoelectric conversion unit or its assembly, and one substrate is placed on the high temperature side and the other substrate is placed on the low temperature side In a thermoelectric conversion module having
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and an entire second side surface adjacent to the first side surface A substantially L-shaped cross section comprising a partially missing covering portion formed over and partially missing and a partially covering portion formed over the adjacent partial surface of the third side surface adjacent to the second side surface And the heat transfer structure with the third side surface side of the heat transfer structure member of each heat transfer structure member of the heat transfer structure member assembly facing the thermoelectric conversion unit alone or its assembly side. Each member assembly is arranged, and each heat transfer structure member The partial covering portion covered with the high thermal conductivity portion on the third side surface of the low thermal conductivity portion is thermally connected to or close to the connection portion of the p-type thermoelectric conversion element or the n-type thermoelectric conversion element or the vicinity thereof, And the whole surface covering part covered with the high heat conduction part of the 1st side opposite to the 3rd side of the low heat conduction part in each heat transfer structure member of the above-mentioned heat transfer structure member aggregate is constituted with material with high heat conductivity. A thermoelectric conversion module, characterized in that it is connected to a temperature contact portion . A thin-film p-type thermoelectric conversion element made of a p-type material and a thin-film n-type thermoelectric conversion element made of an n-type material are connected directly or via a metal material, two-dimensionally arranging one or more thermoelectric conversion units. A structure in which a substrate composed of a combination of a material with high and low thermal conductivity is provided on both sides of a single thermoelectric conversion unit or its assembly, and one substrate is placed on the high temperature side and the other substrate is placed on the low temperature side In a thermoelectric conversion module having
The heat transfer structure member assembly in which a plurality of heat transfer structure members are continuously arranged in a two-dimensional manner constitutes the substrate, and each heat transfer structure member extends in the length direction. An elongated rectangular parallelepiped-shaped low heat conduction portion having a third side surface and a fourth side surface, a whole surface covering portion formed over the entire first side surface of the low heat conduction portion, and a second side surface respectively adjacent to the first side surface A partial defect covering portion formed over the entire surface and the entire fourth side surface and one of which is partially defective; and the other surface covering portion or a partial defect covering portion which is partially defective; Each of the heat transfer structural member aggregates, and a high heat conduction portion having a substantially U-shaped cross section formed of a partial covering portion formed over each adjacent partial surface of the third side surface adjacent to the four side surfaces. The third side of the low thermal conductivity part of the thermal structural member The heat transfer structure member aggregates are respectively disposed toward the unit alone or the assembly side, and the partial covering portion covered with the high heat conduction portion on the third side surface of the low heat conduction portion in each heat transfer structure member is p-type The third of the low heat conduction parts in each heat transfer structure member of the heat transfer structure member assembly that is thermally connected to or close to the connection part of the thermoelectric conversion element or the n-type thermoelectric conversion element or its vicinity. A thermoelectric conversion module, characterized in that a whole surface coating portion covered with a high thermal conductivity portion on the first side surface facing the side surface is connected to a temperature contact portion made of a material having high thermal conductivity .   The thermoelectric conversion module according to any one of claims 1 to 4, wherein the high heat conductive portion of the heat transfer structure member is one selected from aluminum and copper.   The thermoelectric conversion module according to any one of claims 1 to 4, wherein the heat conductivity of the low heat conducting portion in the heat transfer structure member is 0.1 W / mK or less.   The length of the short side of the third side surface in the low heat conducting portion of the heat transfer structure member arranged toward the thermoelectric conversion unit alone or the aggregate thereof is two rows in the width direction of the thermoelectric conversion units alone in the thermoelectric conversion unit aggregate. The thermoelectric conversion module according to claim 1, wherein the thermoelectric conversion module is substantially equal to a minute length.

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