JP5791908B2 - ADJUSTMENT DEVICE, LASER PROCESSING DEVICE, AND ADJUSTMENT METHOD - Google Patents

Description

  The present invention relates to an adjustment device, a laser processing device, and an adjustment method for adjusting irradiation of laser light spatially modulated by a spatial modulation element.

  Conventionally, a laser processing apparatus for processing a workpiece by irradiating the workpiece with laser light has been used. Examples of the processing include drawing of characters and pictures, exposure, repair of defects generated in the manufacturing process of the substrate (repair), and the like. In addition, as a substrate, a liquid crystal display (LCD), a plasma display panel (PDP), a flat panel display (FPD: Flat Panel Display) such as an organic EL display, a semiconductor wafer, a multilayer printed circuit board, etc. There is.

  Such a laser processing apparatus is provided with a mechanism for irradiating laser light at a designated position, direction, and shape. As the mechanism, a slit or the like is used. In recent years, a spatial modulation element (DMD: Digital Micromirror Device) in which micromirrors are arranged in an array is used as the mechanism. This spatial modulation element is also called a spatial light modulator (SLM).

  However, the designated position, direction, and shape may be different from the position, direction, and shape where the laser beam is actually irradiated as a result. This is because there are a plurality of optical components on the optical path from the laser light source to the workpiece, and the distortion of these optical components, the shift of the mounting position, the shift of the mounting direction, and the like have an effect.

  Therefore, it is necessary to perform calibration and adjust the method of laser light irradiation so that the designated position, direction, and shape match the actual position, direction, and shape of the laser light irradiation.

  As the adjustment technique, for example, a parameter for converting an image irradiated with guide light into an output pattern of laser light for processing is calculated, and an irradiation position of the laser light is calculated based on the calculated conversion parameter. Is disclosed (for example, refer to Patent Document 1).

JP 2009-82966 A

  When processing the workpiece by the laser processing apparatus as described above, the workpiece is irradiated with guide light composed of visible light in order to confirm in advance whether the specified position, direction, or shape is as it is. Things have been done.

  However, since the laser light and the guide light having different wavelengths pass through the same optical path, a slight deviation occurs between the laser light and the guide light. Therefore, when the calibration is performed using the guide light, there is a problem that a deviation occurs between the position to be processed confirmed by the guide light and the actual irradiation position of the laser light.

  In particular, when higher-precision machining is required, there is a problem that the deviation greatly affects the quality of a workpiece that is a product.

  The present invention has been made in view of the above-described actual situation, and improves the accuracy of laser processing by executing laser calibration based on laser marks irradiated on a photoconductor with a predetermined calibration pattern. It is an object of the present invention to provide an adjustment device, a laser processing device, and an adjustment method that are capable of performing the above.

The present invention employs the following configuration in order to solve the above problems.
That is, according to one aspect of the present invention, the adjustment device according to the present invention is in accordance with a spatial modulation unit in which a plurality of micro movable elements that form laser light emitted from a laser light source into a desired shape are arranged, and an input pattern. Control means for generating transfer data for instructing to individually switch the micro movable elements constituting the spatial modulation means between the on state and the off state, and the transfer data transferred from the control means to the spatial modulation means An area setting unit that is designated as an input pattern, a laser beam irradiation unit that irradiates the workpiece with the laser beam formed by the spatial modulation unit, an imaging unit that images the surface of the workpiece, and the input A calibration pattern composed of a plurality of different figures is used as a pattern, and the laser beam irradiation hand for the calibration pattern is used. Wherein a conversion parameter calculating means that to calculate the conversion parameter indicating a modification to the shape of the output pattern imaged by the imaging unit of the laser mark of the laser beam irradiated to the workpiece, the at the work piece by An inverse conversion parameter calculating means for inversely converting the conversion parameter to calculate an inverse conversion parameter in order to correct the irradiation shape of the laser light to match the shape of the calibration pattern, and the output pattern is the input pattern The transfer data is converted with the inverse conversion parameter so as to match the above, and the transfer data converted here is instructed to the spatial modulation unit via the region setting unit as an input pattern to the spatial modulation unit. wherein the adjusting means for adjusting the irradiation of the laser beam to the workpiece, the laser light adjusted by said adjusting means On the image of the workpiece captured by the imaging means prior morphism, further comprising a display means for the laser light based on the converted data transferred by the inverse transformation parameter is displayed by superimposing the area irradiated It is characterized by.

According to another aspect of the present invention, a laser processing apparatus according to the present invention includes a laser light source that processes a workpiece, an optical system that guides laser light emitted from the laser light source to the workpiece, Spatial modulation means arranged on the optical path of the optical system and arranged with a plurality of minute movable elements for shaping the laser light into the shape of an input pattern, and each minute movable element constituting the spatial modulation means according to the input pattern individually Control means for generating transfer data for instructing to switch between an on state and an off state, an area setting means for designating the transfer data transferred by the control means as the input pattern to the spatial modulation means, and the workpiece in the laser processing apparatus provided with an imaging means for imaging the surface, using a calibration pattern comprising a plurality of different shapes as the input pattern, prior to Transformation parameters to calculate a conversion parameter indicating a variation of the input pattern and the output pattern imaged by the imaging unit of the laser beam traces the irradiated the laser beam said to be work piece by said laser beam irradiation means for the calibration pattern Inverse conversion parameter calculation for inversely converting the conversion parameter and calculating an inverse conversion parameter in order to correct the calculation means and the irradiation shape of the laser light on the workpiece to match the shape of the calibration pattern Means for converting the transfer data with the inverse conversion parameter so that the output pattern matches the input pattern, and setting the region as the input pattern to the spatial modulation means By instructing the spatial modulation means via the means to the workpiece on the workpiece. And adjusting means for adjusting the irradiation of light, on the image of the workpiece captured by the image pickup means before the irradiation of the adjusted the laser beam by the adjusting means, the converted data transferred by the inverse transformation parameter And a display means for displaying the region irradiated with the laser beam based thereon in a superimposed manner.

According to a further aspect of the present invention, the adjustment method of the present invention is a method of adjusting the spatial modulating means for shaping the laser beam emitted from the laser light source to the shape of the input pattern, a plurality of different shapes as the input pattern An output obtained by imaging an image of a laser beam trace on a workpiece irradiated with the laser beam shaped into the shape of the calibration pattern by the spatial modulation unit for the calibration pattern A conversion parameter indicating deformation into a pattern shape is calculated, and an inverse conversion parameter obtained by inversely converting the conversion parameter is calculated. The irradiation shape of the laser light on the workpiece is changed to the shape of the calibration pattern. the space each micro movable device in the oN state and oFF of the modulation means as matching Wherein by instructing a region of the transfer data for instructing switching to state that the laser beam is irradiated to the spatial modulation means as an input pattern to the spatial modulating means adjusts the irradiation of the laser beam to the workpiece, A region irradiated with the laser beam based on the transfer data converted by the inverse conversion parameter is superimposed on the image of the workpiece imaged by the imaging unit before the adjusted laser beam irradiation. It is characterized by being displayed .

  According to the present invention, since calibration is performed between the laser light actually used for processing and the spatial modulation element, laser processing can be performed with higher accuracy than the calibration with the conventional guide light.

Further, according to the present invention, since an arbitrary calibration pattern can be projected by the spatial modulation element, it is possible to execute calibration efficiently at a time.
In addition, according to the present invention, since a calibration pattern having an arbitrary shape can be projected by the spatial modulation element, even if there is a component that distorts the shape of the calibration pattern in the irradiation target region, It is possible to set the spatial modulation element in a pattern arrangement that avoids the above.

It is a figure which shows the structure of the laser processing apparatus for implementing this invention. It is a figure which shows the example of a calibration pattern. It is a figure which shows the modification from an input pattern to an output pattern. It is a flowchart which shows the flow of a calibration pattern coordinate detection process. It is a flowchart which shows the calculation procedure of the conversion matrix T as a conversion parameter in 1st Embodiment. It is a figure for demonstrating the adjustment method. It is a figure for demonstrating 2nd Embodiment. It is a figure which shows the structure of the laser processing apparatus in 3rd Embodiment. It is a figure for demonstrating the calibration of the guide light and laser beam in 3rd Embodiment. It is a figure for demonstrating 5th Embodiment. It is a figure for demonstrating 6th Embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
Note that the term “calibration” is sometimes used to mean “adjustment”, but in the following description, “calibration” does not include “adjustment”. Unless otherwise specified, “adjustment” means “adjustment based on the result of calibration”.

(First embodiment)
FIG. 1 is a diagram showing a configuration of a laser processing apparatus for carrying out the present invention.
The adjustment apparatus to which the present invention is applied is an apparatus that controls a laser processing apparatus 100 as shown in FIG.

  An outline of the laser processing apparatus 100 is as follows. An optical system for guiding laser light emitted from a laser light source 103 onto a stage 101 on which the workpiece 102 is placed, and light from the laser light source 103 to the workpiece 102. Spatial modulation means DMD, which is provided on the road and includes a plurality of micro movable elements arranged in order to irradiate the workpiece 102 with laser light in a desired input pattern, is provided. The laser processing apparatus 100 includes an irradiating unit that irradiates the workpiece 102 with laser light shaped into the shape of the input pattern by the spatial modulation unit DMD.

This will be described more specifically.
In FIG. 1, a laser processing apparatus 100 includes a camera 112 that captures an image of the surface of a workpiece 102 placed on a stage 101, an illumination light source 111 that irradiates illumination light to the surface of the workpiece 102, To control the laser light source 103 that irradiates the surface of the workpiece 102 with laser light, the spatial modulation element (DMD) 106 that deforms the laser light emitted from the laser light source 103 into an arbitrary spatial shape, and the entire laser processing apparatus 100. Control PC 113, stage control unit 118 that controls the processing position so that laser processing can be performed at an arbitrary position, input unit 114 for operating control PC 113, and image processing unit 116 that processes an image captured from camera 112. , An image processed by the image processing unit 116, or an image of the surface of the workpiece 102 captured by the camera 112, as a live image Display unit 115, region setting unit 117 that can adjust DMD 106 to an arbitrary shape, conversion parameter calculation unit 120 that calculates a conversion parameter to be described later, conversion parameters calculated by conversion parameter calculation unit 120, and arbitrary calibration A storage unit 119 for storing the pattern is provided.

  The laser processing apparatus 100 removes a defect on the workpiece 102 placed on the stage 101 by a laser beam having an arbitrary shape emitted from the laser light source 103, and converts the circuit pattern having the defect into a normal circuit pattern. It is a processing device. Here, the workpiece 102 may be an FPD substrate, a semiconductor wafer, a laminated printed board, or the like, or may be another general sample.

In such a laser processing apparatus 100, the laser light emitted from the laser light source 103 is reflected by the mirror 105 and enters the DMD 106.
The DMD 106 is a spatial modulation element in which minute mirrors (minute movable elements) are arranged in a two-dimensional array. The inclination angle of the micromirror can be switched between at least two types. The state of the micromirror when the tilt angle is the first and second angles is hereinafter referred to as “on state” and “off state”, respectively.

  Based on an instruction from the control PC 113, the DMD 106 switches the inclination angle of each micromirror, that is, the state of each micromirror independently. The instruction to the DMD 106 is represented by, for example, data in which binary data indicating whether or not to irradiate laser light is arranged in a two-dimensional array, and is transmitted from the control PC 113.

  The laser light source 103, the mirror 105, and the DMD 106 are arranged so that the incident light that has entered the DMD 106 from the mirror 105 is reflected by the micro mirror in the on state so that the direction of the reflected light is in the vertical direction. Then, the imaging lens 108, the half mirror 109, and the objective lens 110 are arranged on the optical path where the laser light reflected by the micro mirror in the on state and reflected by the mirror 121 and the half mirror 107 reaches the surface of the workpiece 102. Are arranged. The laser beam reflected by the micro mirror in the on state is projected, that is, irradiated onto the surface of the workpiece 102 through this projection optical system. This projection optical system is configured so that the surface of the workpiece 102 and the DMD 106 are in a conjugate position.

  The micro mirror in the off state is different from that in the on state. Therefore, incident light incident on the DMD 106 from the mirror 105 is reflected in a direction different from the direction reaching the mirror 121 in the off-state micromirror, and is not irradiated onto the workpiece 102. In FIG. 1, the optical path of the reflected light by the micro mirror in the off state is indicated by a broken line arrow.

  Therefore, by controlling the individual micromirrors to the on state or the off state, it is possible to control whether or not to irradiate the laser beam to the position on the workpiece 102 corresponding to each micromirror. That is, by using the DMD 106, the workpiece 102 can be irradiated with laser light at an arbitrary position, direction, and shape.

In addition, the laser processing apparatus 100 includes an illumination light source 111.
When illumination light is necessary for imaging the workpiece 102, the illumination light from the illumination light source 111 is reflected by the half mirror 109 via the lens 122 and irradiated onto the surface of the workpiece 102 via the objective lens 110. Is done. Note that an imaging device such as a CMOS (Complementary Mental-Oxide Semiconductor) camera may be used instead of the camera 112.

  The reflected light of the laser light and the illumination light on the surface of the workpiece 102 are all connected to the camera 112 via an optical system having the objective lens 110, the half mirror 109, the imaging lens 108, the half mirror 107, and the lens 123. Incident on the photoelectric conversion element. Thereby, the camera 112 images the surface of the workpiece 102.

  The control PC 113 controls the entire laser processing apparatus 100. The input unit 114 is realized by an input device such as a keyboard or a pointing device. The instruction input from the input unit 114 is sent to the control PC 113.

  The display unit 115 displays images, characters, and the like in accordance with instructions from the control PC 113. The display unit 115 displays, for example, an image of the workpiece 102 captured by the camera 112 in almost real time. Here, an image captured by the camera 112 and captured by the control PC 113 may be referred to as a “live image”.

  In the present embodiment, the control PC 113 may be a general-purpose computer or a dedicated control device. The function of the control PC 113 may be realized by any one of hardware, software, firmware, or a combination thereof. For example, a CPU (Central Processing Unit), a non-volatile memory such as a ROM (Read Only Memory), a RAM (Random Access Memory) used as a working area, an external storage device such as a hard disk device, and a connection to an external device The control PC 113 may be realized by a computer such as a PC (Personal Computer) that includes an interface and is connected to each other via a bus. The CPU implements the function of the control PC 113 by loading a program stored in a hard disk device or a computer-readable portable storage medium into the RAM and executing it.

  Next, using the specific example in which the workpiece 102 is a substrate and the laser processing apparatus 100 is a laser repair apparatus that repairs a defect by irradiating a defect on the surface of the substrate with a laser beam, The outline | summary of operation | movement of the laser processing apparatus 100 of a form is demonstrated.

The calibration applied in the present invention takes the correspondence of the positional relationship between the pattern formed by the DMD 106 and the pattern formed on the workpiece 102.
And the laser processing apparatus 100 as mentioned above performs the following processes.

  First, an arbitrary photoconductor is irradiated with the laser light shaped into an arbitrary calibration pattern by the DMD 106, and an image of the photoconductor irradiated with the laser light is captured using a camera 112. Then, the captured calibration pattern image is extracted by the image processing unit 116, and each pattern position is detected.

FIG. 2 is a diagram illustrating an example of a calibration pattern.
As shown in FIG. 2, the calibration pattern is composed of several figures with different areas. For example, the example of the calibration pattern shown in (1) of FIG. 2 is composed of four circles.

  In addition, as a photosensitive member that sensitizes the calibration mark, for example, raw glass can be used if laser light having a wavelength of 1.355 nm is irradiated with high energy. In the case of laser light having a wavelength of 2.266 nm, the calibration mark can be exposed by irradiating the glass on which the resist is uniformly applied.

  The laser processing apparatus 100 that has captured the image of the photoconductor executes calibration. That is, the conversion parameter calculation unit 120 calculates a deviation value between the shape of the laser mark of the captured image and the shape of the calibration pattern, and based on the calculated deviation value, the object of the laser light is calculated. A conversion parameter for correcting the shape on the workpiece so as to match the shape of the input pattern is calculated. Then, based on the calculated conversion parameter, the irradiation of the laser beam to the workpiece 102 according to the input pattern is adjusted.

Here, a calibration target will be described.
FIG. 3 is a diagram illustrating a modification example from an input pattern to an output pattern.
For convenience of explanation, the horizontal coordinate axis of an image captured by the camera 112 is hereinafter referred to as an x-axis, and the vertical coordinate axis is referred to as a y-axis. The size of the image is arbitrary, but in the present embodiment, it is assumed that it is 640 pixels in the x direction and 480 pixels in the y direction. This size is expressed as “640 × 480 pixels”. The position of each pixel in the image is represented by a set of x and y coordinates (x, y). That is, the coordinates of the upper left corner and the lower right corner of the irradiation pattern 310 in FIG. 3 are (0, 0) and (639, 479), respectively.

  The irradiation pattern 310 in FIG. 3 is a pattern that indicates which part of an image captured by the camera 112 should be irradiated with laser light. Therefore, the position in the irradiation pattern 310 can also be represented by a set of x and y coordinates (x, y), and the size of the irradiation pattern 310 is 640 × 480 pixels, which is the same as the image captured by the camera 112. .

  In the example of FIG. 3, the irradiation pattern 310 is composed of a white cross shape in which the thick line parallel to the x-axis and the thick line parallel to the y-axis intersect at the center of the image, and the background black, and corresponds to the white cross-shape. This represents that the portion on the workpiece 102 should be irradiated with the laser beam.

In the present embodiment, the irradiation pattern 310 is instructed from the input unit 114 as follows.
First, the camera 112 captures an image of the workpiece 102 under the illumination by the illumination light from the illumination light source 111 without irradiating the laser beam. Then, the image processing unit 116 captures the captured image and outputs it to the display unit 115.

  After that, the operator looks at the image output on the display unit 115 and instructs the range to be irradiated with the laser beam from the input unit 114. The instruction is given to the control PC 113 through the interface connecting the input unit 114 and the control PC 113 in the form of data of the irradiation pattern 310 having a size of 640 × 480 pixels.

  The data of the irradiation pattern 310 may be sent from the external device to the control PC 113. For example, when the laser processing apparatus 100 is a laser repair apparatus such as an FPD substrate, the data of the irradiation pattern 310 may be sent from the defect inspection apparatus to the control PC 113. Alternatively, the laser repair device may include an image recognition unit, and the image recognition unit may recognize the shape of the defect by image recognition processing, generate irradiation pattern 310 data representing the recognized shape, and output the data to the control PC 113.

  In any case, the data of the irradiation pattern 310 is given to the control PC 113. Then, the control PC 113 generates DMD transfer data 320 for instructing the DMD 106 to turn on and off individual micromirrors from the irradiation pattern 310. The DMD transfer data 320 is data representing an input pattern, and is transferred (that is, transmitted) to the DMD 106.

  In the DMD 106, micromirrors are arranged in a two-dimensional array, and the position of the micromirrors can be represented by a set of u coordinates and v coordinates (u, v). In the following, for the sake of simplicity, it is assumed that the coordinates (x, y) of the pixels in the image and the coordinates (u, v) of the micromirror have a relationship of x = u and y = v. Since this relationship is established only by appropriately arranging the micromirrors and appropriately determining the origin of the uv coordinate system, the generality of the following explanation is not lost.

  Here, similarly to the irradiation pattern 310, if the laser light irradiation is expressed in white and the non-irradiation is expressed in black, the DMD transfer data 320 can also be expressed as a monochrome binary image. In other words, DMD transfer data as a black and white binary image representing a point at position (u, v) with white indicating that the micromirror is turned on or black indicating that the micromirror is turned off. 320 can be expressed.

  In the present embodiment, it is assumed that 800 × 600 micromirrors are arranged on DMD 106. That is, the number of micromirrors is larger than the number of pixels of the image captured by the camera 112. Therefore, the image representing the DMD transfer data 320 is an image in which the periphery of the image representing the irradiation pattern 310 is surrounded by a black margin. The reason for such a margin will be described later.

  That is, the color (white or black) at the position (x, y) of the image representing the irradiation pattern 310 and the color at the position (u, v) where u = x, v = y of the image representing the DMD transfer data 320. Are equal. When the position (u, v) is in a range where u <0 or 640 ≦ u or v <0 or 480 ≦ v, the color at the position (u, v) of the image representing the DMD transfer data 320 is Black.

  In FIG. 3, the DMD transfer data 320 has a white rectangular frame line. For convenience of explanation, this frame line displays a range of 640 × 480 pixels corresponding to the irradiation pattern 310. It does not indicate that the minute mirror on the white frame line is turned on.

  In the present embodiment, in DMD transfer data 320, the margins above and below the white frame are the same, and the right margin and the left margin are also equal. However, the margin width may be determined as appropriate.

  Based on the above relationship between the irradiation pattern 310 and the DMD transfer data 320, the control PC 113 generates DMD transfer data 320 from the irradiation pattern 310 data. As described above, in order to generate the DMD transfer data 320, the control PC 113 simply adds a black margin around the irradiation pattern 310.

  Then, the region setting unit 117 in the control PC 113 outputs the DMD transfer data 320 to the DMD 106, thereby giving an ON / OFF instruction to each of the 800 × 600 micromirrors.

  Here, it is assumed that the fine mirror of the DMD 106 is turned on or off according to the given DMD transfer data 320 itself without performing adjustment based on calibration, and the laser light is emitted from the laser oscillator 103.

  In this case, generally, the pattern of the laser light irradiated onto the workpiece 102 is different from the desired irradiation pattern 310. This is because the optical system and / or the imaging system of the laser processing apparatus 100 has a deviation or distortion.

  For example, the mirror or the lens may be distorted, the mounting position of each component of the laser processing apparatus 100 may be shifted, or the mounting angle may be shifted and there may be a component that is mounted by rotating from the original angle.

  A live image 330 in FIG. 3 is an example of an image captured by the camera 112 when a pattern different from the desired irradiation pattern 310 is irradiated onto the workpiece 102 as described above. Therefore, the position on the live image 330 can also be represented by the xy coordinate system, and the size of the live image 330 is 640 × 480 pixels.

  In the live image 330 of FIG. 3, the portion actually irradiated with the laser light is represented in white, and the portion not irradiated is represented in black. When the live image 330 is compared with the irradiation pattern 310, the white cross shape moves in the positive direction of the x axis, and further rotates about 15 degrees counterclockwise. Deformation from the irradiation pattern 310 to the live image 330 actually includes not only such translation (shift) and rotation, but also enlargement / reduction, that is, scale conversion, and distortion of a shape such as shear strain. .

Therefore, in order to prevent such deformation, it is necessary to perform calibration and adjust the laser light irradiation based on the result of the calibration.
In the present embodiment, the above-described deformation of the irradiation pattern caused by deviation or distortion existing in the laser processing apparatus 100 is regarded as a result of a kind of conversion, and the conversion is mathematically modeled.

Next, a description will be given of a process of acquiring parameters representing the mathematically modeled transformation by calibration and adjusting based on the acquired parameters.
First, the calibration method will be described.

  The control PC 113 gives the area setting unit 117 a calibration pattern composed of several figures having different areas as shown in FIG. Different areas facilitate the identification between the calibration pattern given to the region setting unit 117 by image processing and the figure of the calibration pattern printed on the surface of the photoreceptor. Therefore, the calibration pattern may be any shape pattern as long as the three points can be distinguished.

  Next, the calibration pattern burned onto the surface of the photoconductor is imaged by the camera 112. The image processing unit 116 detects the centroid position and area of each figure from the acquired calibration pattern image. Similarly, the image processing unit 116 detects the barycentric position and area of each figure from the calibration pattern image given to the region setting unit 117.

  Then, based on the positional relationship between the three points from the calibration pattern given to the region setting unit 117 and the three points from the calibration pattern burned on the surface of the photosensitive member, the region setting unit 117 transfers the distance between the photosensitive member surfaces. Create a transformation matrix.

The transformation matrix is created as follows.
That is, a mirror position turned on by the region setting unit 117 is a mirror coordinate value, and a position corresponding to the mirror position burned on the surface of the photosensitive member by the laser light source 103 is an irradiation coordinate value.

Then, a conversion matrix is obtained by the following two steps.
First, as a first step, several mirror coordinate values and corresponding irradiation coordinate values are obtained.

  The DMD 106 can be adjusted by providing the region setting unit 117 with a predetermined two-dimensional binary image that has a one-to-one correspondence with ON and OFF of all the micromirrors on the DMD 106. Therefore, the shape of the pattern formed by the DMD 106 is adjusted by passing a binary image including several figures having different positions and areas as shown in FIG. 2 to the region setting unit 117. The laser light source 103 irradiates a spatially modulated laser beam, thereby printing a pattern corresponding to the binary image on the surface of the photoreceptor. An image of the surface of the photoreceptor including the pattern printed by the camera 112 is taken. The binary image given to the region setting unit 117 and the pattern image printed on the surface of the photosensitive member are transferred to the image processing unit 116, and calibration pattern coordinate detection processing is executed.

FIG. 4 is a flowchart showing the flow of calibration pattern coordinate detection processing.
In step S401, the image processing unit 116 performs binarization on the pattern image printed on the surface of the photosensitive member with white as a pattern and black as a background. As a binarization method, a known method such as a floating binarization process may be used. The binary image given to the region setting unit 117 is also created with white as a pattern and black as a background.

  In step S402, the binarized image is subjected to a contraction process and then an expansion process to obtain a foreground binarized image for the pattern. The shrinking process is a process of shrinking the background area, and the shrinking process erases a portion whose line width is equal to or smaller than a predetermined width. Then, the area of the pattern remaining in the contraction process is returned to the original size area by the expansion process.

In step S403, an isolated region of the binarized image that has been subjected to the expansion / contraction process is labeled. The labeling method is arbitrary, and a known method may be applied.
Next, in step S404, the barycentric position of each pattern is calculated, and in step S405, the area of each pattern is calculated. Then, in step S406, by sorting by the size of the area calculated in step S405, several patterns on the binary image given to the region setting unit 117 and several points burned on the surface of the photoreceptor are obtained. Make each pattern correspond. For example, among the several patterns on the binary image given to the region setting unit 117, the pattern with the largest area corresponds to the pattern with the largest area among the several patterns printed on the surface of the photoconductor. It is considered to be.

In this way, the correspondence between several patterns on the binary image given to the area setting unit 117 and several patterns printed on the surface of the photoreceptor is acquired.
Next, as a second step, an affine transformation matrix is obtained based on several mirror coordinate values and several corresponding irradiation coordinate values.

  For example, in FIG. 3, the DMD transfer data 320 is the same as the irradiation pattern 310 except for the margin. Therefore, it can be said that the irradiation pattern 310 is effectively an input pattern designated for the DMD 106. The live image 330 is an output pattern generated in an image when the workpiece 102 is irradiated with laser light that is deformed without any adjustment corresponding to the input pattern. Therefore, the deformation from the irradiation pattern 310 to the live image 330 can be considered as a result of conversion from the input pattern to the output pattern.

  In the present embodiment, a mathematical model is adopted in which this transformation is an affine transformation represented by a transformation matrix T. That is, each element of the transformation matrix T is a transformation parameter to be calculated in calibration.

  As described above, both the input pattern and the output pattern can be expressed in the xy coordinate system. Since u = x and v = y are always set, even if the uv coordinate system and the xy coordinate system are regarded as the same, conversion is possible. There is no problem in parameter calculation.

  That is, the mathematical model in the present embodiment indicates that “the irradiation coordinates (x, y) in the irradiation pattern 310 equal to the coordinates (u, v) in the DMD transfer data 320 are live by the transformation matrix T representing the affine transformation. It is converted into mirror coordinates (x ′, y ′) in the image 330 ”.

This mathematical model is expressed as follows:

Here, if the affine transformation matrix is T,

It becomes.

  This affine transformation matrix T represents a transformation from an arbitrary position on the DMD image to a unique position on the laser irradiation image. Therefore, once the DMD image is converted by the inverse transformation matrix T ′, it is possible to execute laser irradiation similar to an arbitrary image shape set in the DMD image.

Next, a process for calculating the transformation matrix T using the calibration pattern as described above will be described.
FIG. 5 is a flowchart showing a procedure for calculating a transformation matrix T as a transformation parameter in the first embodiment.

  First, in step S <b> 401, the control PC 113 creates a calibration pattern as exemplified in FIG. 2 and outputs it to the region setting unit 117. Note that the control PC 113 may read a calibration pattern stored in advance in the storage unit 119 instead of creating a calibration pattern.

In step S402, the calibration pattern created in step S401 is designated as an input pattern to the DMD 106.
In step S403, the control PC 113 acquires coordinates from calibration pattern data. For example, in the case of the calibration pattern of (1) in FIG. 2, the control PC 113 recognizes four circles from the calibration pattern by the image recognition processing executed by the image processing unit 116, and the centers of the recognized four circles ( That is, the coordinates of the center of gravity) are calculated and acquired. These four coordinates are set as coordinates a, b, c, and d.

  In step S404, laser light is irradiated. That is, the region setting unit 117 controls the DMD 106 so as to switch between the on state and the off state of the micromirror according to the calibration pattern. As a result, the laser light emitted from the laser light source 103 is spatially modulated according to the calibration pattern and projected (that is, irradiated) onto the surface of the photoconductor via the DMD 106.

  Subsequently, in step S405, the camera 112 images the photoconductor, and captures (that is, captures) image data captured by the control PC 113 from the camera 112. This image has an output pattern corresponding to the calibration pattern.

  Next, in step S406, the control PC 113 acquires the coordinates of the four points a ′, b ′, c ′, and d ′ from the image output pattern captured in step S405 as follows.

That is, the control PC 113 first converts the captured image into a monochrome binary image. This binarization is performed, for example, based on a comparison between the luminance value of each pixel and a threshold value. In the converted black and white binary image, the white area is the area irradiated with the laser beam, and the black area is the area not irradiated with the laser beam. The control PC 113 performs the following processing using the converted monochrome binary image.

  For example, when the calibration pattern (1) in FIG. 2 is used, the control PC 113 recognizes the presence and position of a shape close to a circle or an ellipse through image recognition processing. As a result, four shapes are recognized. In the example of the calibration pattern of (1) in FIG. 2, it is assumed that the four circles correspond to points a, b, c, and d in ascending order of area. Therefore, the control PC 113 calculates the areas of the four recognized shapes, and associates the shapes with the points a ′, b ′, c ′, and d ′ in ascending order of the areas. Further, the control PC 113 calculates the coordinates of the center of gravity of each of the four recognized shapes, and acquires these four coordinates as the coordinates of four points a ′, b ′, c ′, and d ′.

  Subsequently, in step S407, the control PC 113 calculates the conversion matrix T as described above. Then, the data of the created transformation matrix T is stored in a storage unit 119 such as a RAM or a hard disk.

Next, the adjustment method in the first embodiment will be described.
FIG. 6 is a diagram for explaining the adjustment method.
The irradiation pattern 310 and the DMD transfer data 320 shown in FIG. 6 are the same as those shown in FIG. FIG. 6 is a diagram for explaining using the same transformation matrix T as in FIG.

In the first embodiment, the control PC 113 in FIG. 2 reads the transformation matrix T and the inverse transformation matrix T ′ that have already been calculated and stored in the storage unit 119. Note that the inverse transformation matrix T ′ is calculated as an inverse matrix (= T ⁻¹ ) of the transformation matrix T. That is, the inverse transformation matrix T ′ is an inverse transformation parameter that represents the inverse transformation of the transformation by the transformation matrix T as the transformation parameter. Note that the data of the inverse transformation matrix T ′ is also stored in the storage unit 119.

  In addition, the control PC 113 receives the irradiation pattern 310 from the input unit 114 and generates DMD transfer data 320. Further, the DMD transfer data 320 is converted by the inverse transformation matrix T ′ to generate DMD transfer data 621, which is output to the region setting unit 117.

  Then, the area setting unit 117 specifies the DMD transfer data 621 as an input pattern to the DMD 106 and controls the DMD 106. That is, the control PC 113 has a function of designating DMD transfer data 621 as an input pattern to the DMD 106 via the area setting unit 117.

  In the example shown in FIG. 6, as in FIG. 3, the transformation matrix T represents a transformation obtained by combining the movement of the x axis in the plus direction and the rotation of about 15 degrees counterclockwise. Therefore, in FIG. 6, the DMD transfer data 621 converted by the inverse conversion matrix T ′ is a pattern obtained by rotating the pattern of the DMD transfer data 320 about 15 degrees clockwise and moving in the minus direction of the x axis. .

  In order to correct the defect, when laser light is emitted from the laser light source 103, the laser light is irradiated onto the workpiece 102 through the DMD 106 in which the DMD transfer data 621 is designated as an input pattern. . In this embodiment mode, the camera 112 captures an image of the workpiece 102 and captures an image from the camera 112. The captured image is the live image 631 in FIG.

  As shown in FIG. 6, the output pattern appearing in the live image 631 is the same pattern as the irradiation pattern 310 because the deformation by the inverse transformation matrix T ′ and the deformation by the transformation matrix T are offset.

  Thus, the fact that the output pattern on the live image 631 is equal to the irradiation pattern 310 means that the adjustment by the control PC 113 correctly irradiates the laser beam in the shape to be processed at the position to be processed, and the correct irradiation is the live image. 631 was picked up.

  As can be seen from a comparison between the DMD transfer data 320 and the DMD transfer data 621, the white portion indicating that the micromirror should be turned on as a result of the conversion by the inverse conversion matrix T ′ is the DMD transfer data 621. , There is a possibility that it falls outside the range of u <0 or 640 ≦ u or v <0 or 480 ≦ v. For this reason, in the present embodiment, the DMD 106 having a minute mirror (for example, 800 × 600 pixels) larger than the number of pixels (for example, 640 × 480 pixels) of the image representing the irradiation pattern 310 is used. In this case, as shown in FIGS. 3 and 6, the image representing the DMD transfer data 320 that is the input pattern designated by the DMD 106 is black around the image representing the irradiation pattern 310 (that is, no light is irradiated). This is an image surrounded by a margin.

The above is the description of the first embodiment to which the present invention is applied.
According to the present embodiment, since calibration is performed between the laser light actually used for processing and the DMD 106, high-precision laser processing is possible as compared with the calibration with the conventional guide light.

Next, a second embodiment to which the present invention is applied will be described.
(Second Embodiment)
In the second embodiment, after the processing executed in the first embodiment, a planned position of laser light irradiation used in processing for defect correction is displayed on the display unit 115.

FIG. 7 is a diagram for explaining the second embodiment.
That is, the surface of the workpiece 102 is imaged by the camera 112 before irradiation with the laser light adjusted as in the first embodiment. Then, on the captured image, the region 702 irradiated with the laser light is superimposed on the image of the workpiece 102 on which the pattern 701 is formed as shown in FIG. To display. Here, the region 702 to be irradiated with the laser beam may be an outer frame as shown in (2) of FIG. 7, may be painted as shown in (3), or is semitransparent and overlapped as shown in (4). You may let them.

Thus, since the irradiation planned area is displayed on the display unit 115, it is not necessary to add a light source for guide light as in the conventional case to the configuration.
Next, a third embodiment to which the present invention is applied will be described.

(Third embodiment)
In the third embodiment, a light source to be used as guide light is added to the configuration of the first embodiment.
FIG. 8 is a diagram illustrating a configuration of a laser processing apparatus according to the third embodiment.

  The laser processing apparatus 800 includes a guide LED (Light Emitting Diode) light source 801 in addition to the laser processing apparatus 100 described with reference to FIG. Light emitted from the LED light source 801 (hereinafter referred to as “guide light”) is reflected by the half mirror 802 and enters the mirror 105. This guide light is used to indicate in advance the laser processing position to the operator.

  Here, the laser light source 103, the half mirror 802, and the LED light source 801 are arranged so that the optical axes of the laser light transmitted through the half mirror 802 and the guide light reflected by the half mirror 802 coincide. Therefore, the optical path of the guide light after being reflected by the half mirror 802 is the same as the optical path of the laser light from the laser light source 103, and the workpiece 102 is irradiated with the guide light as well as the laser light.

  The guide light and the laser light follow the same optical path, but have a slight deviation on the surface of the workpiece 102 when the in-focus adjustment is not executed. For this reason, if processing is performed with laser light after performing calibration using conventional guide light as disclosed in Patent Document 1, processing is performed with a slight shift.

In the present embodiment, highly accurate laser processing is performed by executing calibration between the guide light and the laser light.
That is, in order to confirm that the laser beam is irradiated to the workpiece 102 in the shape of the input pattern, the workpiece 102 is irradiated via an optical system that constitutes the same optical path that the guide light and the laser beam follow. The guide light is shaped into the shape of a calibration pattern and irradiated to the photosensitive member, and an image of the photosensitive member irradiated with the guide light is taken. Then, a deviation value between the shape of the guide light mark and the shape of the laser mark in the captured image is calculated, and the difference between the shape of the laser mark and the shape of the calibration pattern calculated in the same manner as in the first embodiment. The conversion parameter is calculated based on the value and the deviation value between the shape of the guide light trace and the shape of the laser mark.

FIG. 9 is a diagram for explaining calibration of guide light and laser light in the third embodiment.
First, images obtained by irradiating the surface of the workpiece 102 with light with guide light (white) and laser light (black) with the calibration pattern adjusted on the DMD 106 are acquired ((5) in FIG. 9). .

  Next, the coordinates of each calibration pattern are acquired for the acquired image by the method used in the first embodiment ((1) and (2) in FIG. 9). Based on the acquired calibration pattern coordinates, the correspondence between the guide light and the laser light is acquired as a conversion matrix T2 ((6) in FIG. 9).

  Next, the correspondence relationship between the DMD 106 and the guide light is acquired as a transformation matrix T1 by the method described in the first embodiment ((3) and (4) in FIG. 9). By applying the transformation matrix T1 to the mask image to be adjusted to the DMD 106 ((8) in FIG. 9), it is possible to simulate a state in which the processing target is irradiated with the guide light (FIG. 9). (9)). Furthermore, by applying the transformation matrix T2, it is possible to simulate the state in which the laser beam is irradiated on the processing surface ((10) in FIG. 9).

  Then, by calculating the conversion matrix T2 by multiplying the conversion matrix T1 by the conversion matrix T2, it is possible to execute calibration between the DMD 106 and the laser light using only the guide light without irradiating the laser light. Become.

In contrast to the above, the guide light may be simulated from laser light.
Next, a fourth embodiment to which the present invention is applied will be described.
(Fourth embodiment)

The fourth embodiment is executed by a laser processing apparatus having the same configuration as that of the above-described third embodiment.
In the case of the configuration using guide light as in the third embodiment described above, the guide light and the laser processing shape are displaced due to the influence of the diffraction angle on the DMD 106. For this reason, when the operator confirms the machining position on the display unit 115 or the like, the guide light may appear to deviate from the actual machining position.

  Therefore, in the fourth embodiment, a guide light mask pattern is set in the DMD 106 before processing, and a processing mask pattern is set in the DMD 106 immediately before processing. This makes it possible to eliminate the apparent shift between the guide light and the laser processing position.

  That is, by controlling the stage 101 on which the workpiece 102 is placed in accordance with an instruction from the stage control unit 118, the surface of the workpiece 102 is imaged after the workpiece 102 is moved to the machining position. Then, a mask image that masks areas other than the processable region is created by image processing executed by the image processing unit 116. Next, a guide light mask and a processing mask are created by a conversion matrix created by the guide light and the laser processing trace.

  Then, the prepared guide light mask is adjusted to the DMD 106. Then, since the mask for the guide light is adjusted, the guide light in a state where there is no deviation on the display unit 115 indicates the processing position of the workpiece 102.

  When the laser beam emission preparation is OK, the processing mask is adjusted to the DMD 106, and after the laser irradiation, the guide light mask is adjusted to the DMD 106, so that the accuracy of the processing position can be confirmed.

Next, a fifth embodiment to which the present invention is applied will be described.
(Fifth embodiment)
FIG. 10 is a diagram for explaining the fifth embodiment.

  In each of the above-described embodiments, there is no obstacle that distorts the irradiation shape such as the pattern 1001 in the region 1002 (FIG. 10 (1)) to which the calibration pattern is irradiated in order to execute calibration with high accuracy. Is desirable. When laser light is irradiated onto a three-dimensional object such as the pattern 1001 ((2) in FIG. 10), the processing state of the calibration pattern image captured by the camera 112 becomes uneven and distorted.

  Since such an image has a non-uniform and distorted calibration pattern, the calibration pattern position and the center of gravity measured by the image processing by the image processing unit 116 have an error in units of pixels, so that the calibration is performed with high accuracy. It becomes difficult to perform.

  Therefore, in order to perform calibration with high accuracy, a substrate on which the pattern 1001 is not formed is prepared, and calibration is performed on the areas 1002A, 1002B, 1002C, and 1002D (FIG. 10 (3)) where the pattern 1001 is not formed. It is necessary to irradiate the pattern.

In the fifth embodiment, the following processing is executed.
First, the background portion is detected by means for detecting the background. The background detecting means is, for example, a pattern that floats by subtracting the background image ((4) in FIG. 10) from which the pattern 1001 has been deleted by the blur filter and the captured image ((5) in FIG. 10). A method of detecting a region other than 1001 (four black rectangular regions in (6) of FIG. 10) is raised.

Then, as performed in each of the above-described embodiments, the calibration pattern is arranged at a position that falls within the background portion ((7) in FIG. 10).
In other words, the laser light emitted from the laser light source 103 is obtained from the captured image so that the portion other than the circuit pattern portion is irradiated on the surface of the workpiece 102 on which the circuit pattern is formed as the photosensitive member. The calibration pattern is created based on the surface information to be obtained. For example, a calibration pattern is created so as to avoid a circuit pattern or a defect as information on the surface.

Next, a sixth embodiment to which the present invention is applied will be described.
(Sixth embodiment)
The sixth embodiment to which the present invention is applied is an embodiment in which calibration is executed again after calibration is executed once. Alternatively, after the calibration is performed with the guide light, the calibration is performed with the laser.

FIG. 11 is a diagram for explaining the sixth embodiment.
If the uniformity of the light quantity distribution of the laser beam is lost, when the entire surface of the workpiece 102 is irradiated with the laser beam with all the mirrors of the DMD 106 turned on ((1) in FIG. 11), the workpiece 102 Processing unevenness occurs on the surface ((2) in FIG. 11).

  If calibration is executed in the presence of such processing unevenness ((3) in FIG. 11), unevenness such as gradation occurs in the processed calibration pattern ((4) in FIG. 11). When the calibration pattern detection by the conversion is executed, it is difficult to accurately detect the calibration pattern shape ((5) in FIG. 11).

  Therefore, a portion where unevenness occurs is identified in advance ((6) in FIG. 11), and a calibration pattern is arranged so as to avoid unevenness ((7) in FIG. 11), thereby creating a calibration pattern without unevenness. The calibration pattern shape can be accurately detected ((9) in FIG. 11).

  As a specific process, first, a difference image is created by taking a difference between images before and after processing. Since only the part changed by processing is detected in the created difference image, it is possible to acquire the entire irradiation shape of the laser light.

  Next, by performing binarization processing on the difference image, a good processed portion and a processed portion affected by unevenness are separated. The calibration pattern is desirably arranged in an area where a laser beam with a constant light amount distribution is processed satisfactorily. Therefore, the position of the calibration pattern is moved so as to be arranged on the region to be processed favorably detected by the binarization processing. Specifically, the difference between the calibration pattern and the region where the light amount distribution of the laser light is constant decreases, and the calibration pattern is moved in a direction that does not approach the center of the circle. If there is no difference between the calibration pattern and the region where the light quantity distribution of the laser light is constant, the process is complete.

  By arranging the patterns so as to avoid unevenness in this way, a good laser processing result can be obtained ((8) in FIG. 11), and the calibration pattern shape can be detected satisfactorily ( (9) in FIG.

Next, a seventh embodiment to which the present invention is applied will be described.
(Seventh embodiment)
In the first to sixth embodiments described above, the number of figures constituting the calibration pattern has been described as four points. However, instead of four points, the transformation matrix may be obtained as two points. In general, an affine transformation matrix, a pseudo affine transformation matrix, or a projective transformation matrix may be obtained as N points.

  As described above, according to each embodiment to which the present invention is applied, calibration is performed between the laser light actually used for processing and the spatial modulation element, so that calibration with conventional guide light is performed. Compared to the above, high-precision laser processing becomes possible.

In addition, since an arbitrary calibration pattern can be projected by the spatial modulation element, it is possible to execute calibration efficiently at a time.
In addition, since a calibration pattern with an arbitrary shape can be projected by the spatial modulation element, even if there is a component that distorts the shape of the calibration pattern in the irradiation target area, a pattern arrangement that avoids it It is possible to set to a spatial modulation element.

  Note that the present invention is not limited to the above-described embodiments and the like, and can take various configurations or shapes without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 100,800 Laser processing apparatus 101 Stage 102 Work piece 103 Laser light source 105, 121 Mirror 106 DMD (spatial modulation element)
107, 109, 802 Half mirror 108 Imaging lens 110 Objective lens 111 Light source for illumination 112 Camera 113 Control PC
114 Input unit 115 Display unit 116 Image processing unit 117 Area setting unit 118 Stage control unit 119 Storage unit 120 Conversion parameter calculation unit 122, 123 Lens 310 Irradiation pattern 320, 621 DMD transfer data 330, 631 Live image 701 pattern 702 area 801 LED light source 1001 pattern 1002 (1002A, 1002B, 1002C, 1002D) area

Claims (4)

Spatial modulation means in which a plurality of micro movable elements for forming laser light emitted from a laser light source into a desired shape are arranged;
Control means for generating transfer data instructing to individually switch each micro movable element constituting the spatial modulation means according to an input pattern between an on state and an off state;
Area setting means for designating the transfer data transferred from the control means as the input pattern to the spatial modulation means;
Laser light irradiation means for irradiating the workpiece with the laser light formed by the spatial modulation means;
Imaging means for imaging the surface of the workpiece;
An output pattern in which a laser trace of the laser beam irradiated on the workpiece by the laser beam irradiation unit with respect to the calibration pattern is imaged by the imaging unit using a calibration pattern composed of a plurality of different figures as the input pattern. a conversion parameter calculating means that to calculate the conversion parameter indicating a modification to the shape of,
Inverse conversion parameter calculation means for calculating an inverse conversion parameter by inversely converting the conversion parameter in order to correct the irradiation shape of the laser light on the workpiece to match the shape of the calibration pattern ;
The transfer data is converted by the inverse conversion parameter so that the output pattern matches the input pattern, and the converted transfer data is input as an input pattern to the spatial modulation means through the area setting means. Adjusting means for adjusting the irradiation of the laser beam to the workpiece by instructing a modulating means ;
A region irradiated with the laser beam based on the transfer data converted by the inverse conversion parameter on the image of the workpiece imaged by the imaging unit before the irradiation of the laser beam adjusted by the adjusting unit. Display means for superimposing and displaying;
Adjustment device characterized by comprising a. The conversion parameter means is obtained by performing a contraction / expansion process after binarizing an image obtained by imaging the laser mark burned on the workpiece with a laser beam shaped according to the calibration pattern. The conversion matrix is calculated as the conversion parameter based on the barycentric position of each graphic of the calibration pattern and each graphic of the output pattern corresponding to the output pattern. Adjustment device. A laser light source that processes a workpiece, an optical system that guides laser light emitted from the laser light source to the workpiece, and a laser light that is disposed on the optical path of the optical system and shapes the laser light into an input pattern shape Spatial modulation means in which a plurality of minute movable elements are arranged, and control means for generating transfer data for instructing to individually switch each minute movable element constituting the spatial modulation means according to the input pattern between an on state and an off state; In a laser processing apparatus comprising region setting means for designating transfer data transferred by the control means as the input pattern to the spatial modulation means, and imaging means for imaging the surface of the workpiece,
A calibration pattern composed of a plurality of different figures is used as the input pattern, and the laser beam trace of the laser beam irradiated onto the workpiece by the laser beam irradiation unit for the calibration pattern is imaged by the imaging unit. Conversion parameter calculation means for calculating a conversion parameter indicating deformation of the output pattern into a shape ;
In order to correct the irradiation shape of the laser beam on the workpiece so as to match the shape of the calibration pattern, there is provided an inverse conversion parameter calculation means for inversely converting the conversion parameter and calculating an inverse conversion parameter. And
The transfer data is converted by the inverse conversion parameter so that the output pattern matches the input pattern, and the converted transfer data is input as an input pattern to the spatial modulation means through the area setting means. Adjusting means for adjusting the irradiation of the laser beam to the workpiece by instructing a modulating means ;
A region irradiated with the laser beam based on the transfer data converted by the inverse conversion parameter on the image of the workpiece imaged by the imaging unit before the irradiation of the laser beam adjusted by the adjusting unit. Display means for superimposing and displaying;
A laser processing apparatus comprising: In the adjustment method of the spatial modulation means for shaping the laser light emitted from the laser light source into the shape of the input pattern,
A laser beam on a workpiece irradiated with the laser beam shaped into the shape of the calibration pattern by the spatial modulation means for the calibration pattern using a calibration pattern made of a plurality of different figures as the input pattern While calculating a conversion parameter indicating the deformation to the shape of the output pattern obtained by imaging the trace by the imaging means, calculating an inverse conversion parameter obtained by inversely converting the conversion parameter,
The laser transfer data to which the irradiation shape of the laser beam at the work piece and instructs switching to the individual micro movable device on and off states of the spatial modulation means to conform to the shape of the calibration pattern Adjust the irradiation of the laser beam to the workpiece by instructing the spatial modulation unit as an input pattern to the spatial modulation unit the region irradiated with light ,
A region irradiated with the laser beam based on the transfer data converted by the inverse conversion parameter is superimposed on the image of the workpiece imaged by the imaging unit before the adjusted laser beam irradiation. An adjustment method characterized by displaying .