JP5805982B2 - Polyarylate resin film and gas separation membrane - Google Patents
Polyarylate resin film and gas separation membrane Download PDFInfo
- Publication number
- JP5805982B2 JP5805982B2 JP2011094115A JP2011094115A JP5805982B2 JP 5805982 B2 JP5805982 B2 JP 5805982B2 JP 2011094115 A JP2011094115 A JP 2011094115A JP 2011094115 A JP2011094115 A JP 2011094115A JP 5805982 B2 JP5805982 B2 JP 5805982B2
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- JP
- Japan
- Prior art keywords
- acid
- hydroxyphenyl
- film
- bis
- polyarylate resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 title claims description 34
- 239000011347 resin Substances 0.000 title claims description 34
- 229920001230 polyarylate Polymers 0.000 title claims description 26
- 238000000926 separation method Methods 0.000 title claims description 24
- 239000012528 membrane Substances 0.000 title claims description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 17
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 14
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 48
- 238000000034 method Methods 0.000 description 31
- 239000001569 carbon dioxide Substances 0.000 description 24
- 229910002092 carbon dioxide Inorganic materials 0.000 description 24
- 239000007789 gas Substances 0.000 description 21
- 239000000243 solution Substances 0.000 description 18
- -1 3,5-dimethyl-4-hydroxyphenyl Chemical group 0.000 description 16
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 15
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- 235000010290 biphenyl Nutrition 0.000 description 10
- 239000004305 biphenyl Substances 0.000 description 10
- 125000006267 biphenyl group Chemical group 0.000 description 10
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 238000005266 casting Methods 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000012074 organic phase Substances 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 6
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000008346 aqueous phase Substances 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 238000012695 Interfacial polymerization Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 3
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 235000006708 antioxidants Nutrition 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 239000012488 sample solution Substances 0.000 description 3
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- ASHGTJPOSUFTGB-UHFFFAOYSA-N 3-methoxyphenol Chemical compound COC1=CC=CC(O)=C1 ASHGTJPOSUFTGB-UHFFFAOYSA-N 0.000 description 2
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 235000019445 benzyl alcohol Nutrition 0.000 description 2
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical compound OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000005431 greenhouse gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- PFTAWBLQPZVEMU-DZGCQCFKSA-N (+)-catechin Chemical compound C1([C@H]2OC3=CC(O)=CC(O)=C3C[C@@H]2O)=CC=C(O)C(O)=C1 PFTAWBLQPZVEMU-DZGCQCFKSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- KUFFULVDNCHOFZ-UHFFFAOYSA-N 2,4-xylenol Chemical compound CC1=CC=C(O)C(C)=C1 KUFFULVDNCHOFZ-UHFFFAOYSA-N 0.000 description 1
- JRWCWHILGVMUTD-UHFFFAOYSA-N 2,6-dibromo-4-[1-(3,5-dibromo-4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=C(Br)C(O)=C(Br)C=1)C1=CC(Br)=C(O)C(Br)=C1 JRWCWHILGVMUTD-UHFFFAOYSA-N 0.000 description 1
- HHWOEAFLIJITGC-UHFFFAOYSA-N 2,6-dichloro-4-[1-(3,5-dichloro-4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=C(Cl)C(O)=C(Cl)C=1)C1=CC(Cl)=C(O)C(Cl)=C1 HHWOEAFLIJITGC-UHFFFAOYSA-N 0.000 description 1
- CJWNFAKWHDOUKL-UHFFFAOYSA-N 2-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC=C(O)C=1C(C)(C)C1=CC=CC=C1 CJWNFAKWHDOUKL-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- WLJVXDMOQOGPHL-PPJXEINESA-N 2-phenylacetic acid Chemical compound O[14C](=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-PPJXEINESA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- PARGHORKDQHVPM-UHFFFAOYSA-N 3-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC(O)=CC=1C(C)(C)C1=CC=CC=C1 PARGHORKDQHVPM-UHFFFAOYSA-N 0.000 description 1
- WZDLEYNMGWZAEJ-UHFFFAOYSA-N 4-[1-(4-hydroxy-3,5-dimethylphenyl)ethyl]-2,6-dimethylphenol Chemical compound C=1C(C)=C(O)C(C)=CC=1C(C)C1=CC(C)=C(O)C(C)=C1 WZDLEYNMGWZAEJ-UHFFFAOYSA-N 0.000 description 1
- AWTWLULBYMVNJP-UHFFFAOYSA-N 4-[1-(4-hydroxy-3,5-dimethylphenyl)hexyl]-2,6-dimethylphenol Chemical compound CC=1C=C(C=C(C1O)C)C(CCCCC)C1=CC(=C(C(=C1)C)O)C AWTWLULBYMVNJP-UHFFFAOYSA-N 0.000 description 1
- XOZBBYKQVOEIGK-UHFFFAOYSA-N 4-[1-(4-hydroxy-3,5-diphenylphenyl)-3,3,5-trimethylcyclohexyl]-2,6-diphenylphenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=C(C(O)=C(C=1)C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC(C=2C=CC=CC=2)=C(O)C(C=2C=CC=CC=2)=C1 XOZBBYKQVOEIGK-UHFFFAOYSA-N 0.000 description 1
- LWCLQDBHSKGGBC-UHFFFAOYSA-N 4-[1-(4-hydroxy-3-methylphenyl)hexyl]-2-methylphenol Chemical compound C=1C=C(O)C(C)=CC=1C(CCCCC)C1=CC=C(O)C(C)=C1 LWCLQDBHSKGGBC-UHFFFAOYSA-N 0.000 description 1
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 1
- WKGVDZYQWLBSQC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)hexyl]phenol Chemical compound C=1C=C(O)C=CC=1C(CCCCC)C1=CC=C(O)C=C1 WKGVDZYQWLBSQC-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- NRPFNQUDKRYCNX-UHFFFAOYSA-N 4-methoxyphenylacetic acid Chemical compound COC1=CC=C(CC(O)=O)C=C1 NRPFNQUDKRYCNX-UHFFFAOYSA-N 0.000 description 1
- KDVYCTOWXSLNNI-UHFFFAOYSA-N 4-t-Butylbenzoic acid Chemical compound CC(C)(C)C1=CC=C(C(O)=O)C=C1 KDVYCTOWXSLNNI-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- VQILAPOZMHWKAP-UHFFFAOYSA-N CC=1C=C(C=CC1O)CC1=CC(=C(C=C1)O)C.CC=1C=C(C=C(C1O)C)CC1=CC(=C(C(=C1)C)O)C Chemical compound CC=1C=C(C=CC1O)CC1=CC(=C(C=C1)O)C.CC=1C=C(C=C(C1O)C)CC1=CC(=C(C(=C1)C)O)C VQILAPOZMHWKAP-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- CIWBSHSKHKDKBQ-DUZGATOHSA-N D-araboascorbic acid Natural products OC[C@@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-DUZGATOHSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 1
- 239000002211 L-ascorbic acid Substances 0.000 description 1
- 235000000069 L-ascorbic acid Nutrition 0.000 description 1
- BELBBZDIHDAJOR-UHFFFAOYSA-N Phenolsulfonephthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2S(=O)(=O)O1 BELBBZDIHDAJOR-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 1
- JXHJDQLSVJLMAF-UHFFFAOYSA-N benzoyl chloride methanesulfonyl chloride Chemical compound C(C1=CC=CC=C1)(=O)Cl.CS(=O)(=O)Cl JXHJDQLSVJLMAF-UHFFFAOYSA-N 0.000 description 1
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- UBXYXCRCOKCZIT-UHFFFAOYSA-N biphenyl-3-ol Chemical compound OC1=CC=CC(C=2C=CC=CC=2)=C1 UBXYXCRCOKCZIT-UHFFFAOYSA-N 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 235000005487 catechin Nutrition 0.000 description 1
- ADRVNXBAWSRFAJ-UHFFFAOYSA-N catechin Natural products OC1Cc2cc(O)cc(O)c2OC1c3ccc(O)c(O)c3 ADRVNXBAWSRFAJ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229950001002 cianidanol Drugs 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 235000010350 erythorbic acid Nutrition 0.000 description 1
- 239000004318 erythorbic acid Substances 0.000 description 1
- FPIQZBQZKBKLEI-UHFFFAOYSA-N ethyl 1-[[2-chloroethyl(nitroso)carbamoyl]amino]cyclohexane-1-carboxylate Chemical compound ClCCN(N=O)C(=O)NC1(C(=O)OCC)CCCCC1 FPIQZBQZKBKLEI-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- LHGVFZTZFXWLCP-UHFFFAOYSA-N guaiacol Chemical compound COC1=CC=CC=C1O LHGVFZTZFXWLCP-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229940026239 isoascorbic acid Drugs 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- 235000010292 orthophenyl phenol Nutrition 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229960003531 phenolsulfonphthalein Drugs 0.000 description 1
- AHWALFGBDFAJAI-UHFFFAOYSA-N phenyl carbonochloridate Chemical compound ClC(=O)OC1=CC=CC=C1 AHWALFGBDFAJAI-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
- Polyesters Or Polycarbonates (AREA)
Description
本発明は、炭酸ガスの選択分離性と耐熱性に優れたポリアリレート樹脂フィルムに関するものである。 The present invention relates to a polyarylate resin film having excellent carbon dioxide selective separation and heat resistance.
近年、地球温暖化が問題となっており、温室効果ガスがその一因とされている。温室効果ガスの中でも、大気への放出が最も多い炭酸ガスは、その排出量の削減が強く求められている。排出量を削減するためには、排出量全体を減らすことや、排出ガスから炭酸ガスを選択的に回収することが考えられるが、産業活動を抑えることなくおこなうには、後者の方が好ましい。そのため、排出ガスから、炭酸ガスとその他の気体、特に空気中で最も多く含まれる窒素ガスとを分離する気体分離膜が盛んに開発されている。気体分離膜としては、セラミック、カーボン、ゼオライト等の無機系材料が知られているが、一方で、高分子気体分離膜は透過性や加工性に優れるため、注目されている。 In recent years, global warming has become a problem, and greenhouse gases are one of the causes. Of the greenhouse gases, carbon dioxide, which is the most released into the atmosphere, is strongly required to reduce its emissions. In order to reduce the emission amount, it is conceivable to reduce the entire emission amount or to selectively collect carbon dioxide gas from the emission gas, but the latter is preferable in order to carry out without suppressing the industrial activity. For this reason, gas separation membranes for separating carbon dioxide from other gases, particularly nitrogen gas, which is contained most in the air, from exhaust gas have been actively developed. As the gas separation membrane, inorganic materials such as ceramic, carbon, and zeolite are known. On the other hand, the polymer gas separation membrane is attracting attention because of its excellent permeability and workability.
排出ガスが高温であることを考慮すると、高分子気体分離膜としては耐熱性が高いことが好ましい。例えば、特許文献1〜3には、炭酸ガスの選択分離性が比較的高いポリカーボネート系の気体分離膜が開示されている。しかしながら、これらのポリカーボネート系気体分離膜は、耐熱性が不十分であった。 In view of the high temperature of the exhaust gas, the polymer gas separation membrane preferably has high heat resistance. For example, Patent Literatures 1 to 3 disclose polycarbonate-based gas separation membranes having relatively high carbon dioxide selective separation. However, these polycarbonate gas separation membranes have insufficient heat resistance.
また、非特許文献1、2には、2−ヒドロ−3,3−ビス(4−ヒドロキシフェニル)フタルイミジンまたは2−フェニル−3,3−ビス(4−ヒドロキシフェニル)フタルイミジンと、テレフタル酸またはイソフタル酸からなるポリアリレート樹脂が開示されている。しかしながら、これらのポリアリレート樹脂をフィルムにすることや、さらにそのフィルムを高分子気体膜として用いることは記載されていない。 Non-Patent Documents 1 and 2 include 2-hydro-3,3-bis (4-hydroxyphenyl) phthalimidine or 2-phenyl-3,3-bis (4-hydroxyphenyl) phthalimidine and terephthalic acid or isophthalate. An acid polyarylate resin is disclosed. However, it is not described that these polyarylate resins are made into a film, and further that the film is used as a polymer gas film.
本発明の目的は、炭酸ガスの選択分離性と耐熱性に優れたポリアリレート樹脂フィルムを提供することにある。 An object of the present invention is to provide a polyarylate resin film excellent in selective separation of carbon dioxide gas and heat resistance.
本発明者らは、前記課題を解決するため鋭意研究をおこなった結果、特定の二価フェノール骨格を有するポリアリレート樹脂を用いれば、上記課題が解決できることを見出し、本発明に到達した。 As a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved by using a polyarylate resin having a specific dihydric phenol skeleton, and have reached the present invention.
すなわち本発明の要旨は下記の通りである。
(1)化学式(1)で示される二価フェノールを10モル%以上含有する二価フェノール成分と芳香族ジカルボン酸成分からなるポリアリレート樹脂からなるフィルム。
(3)(1)または(2)記載のフィルムからなる気体分離膜。
That is, the gist of the present invention is as follows.
(1) A film comprising a polyarylate resin comprising a dihydric phenol component containing 10 mol% or more of the dihydric phenol represented by the chemical formula (1) and an aromatic dicarboxylic acid component.
(3) A gas separation membrane comprising the film according to (1) or (2).
本発明によれば、炭酸ガスの選択分離性と耐熱性に優れたポリアリレート樹脂フィルムを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the polyarylate resin film excellent in the selective separability of carbon dioxide gas and heat resistance can be provided.
本発明のポリアリレート樹脂は、二価フェノール成分と芳香族ジカルボン酸成分から構成される。 The polyarylate resin of the present invention is composed of a dihydric phenol component and an aromatic dicarboxylic acid component.
二価フェノール成分としては、化学式(1)で示される化合物(2−ヒドロ−3,3−ビス(4−ヒドロキシフェニル)フタルイミジン)を含有している必要がある。化学式(1)で示される化合物を含有していない場合、耐熱性が低下するので好ましくない。なお、化学式(1)の芳香環上の水素原子は、ハロゲン原子や炭化水素基等によって置換されていてもよい。化学式(1)で示される化合物は嵩高い構造を有するため、ポリマー主鎖の熱運動を抑制し、ポリマー中に多くのミクロボイドを作り出すことができる。ミクロボイドを通過する炭酸ガスと窒素ガスの速度が異なるため、両者を分離することができる。また、嵩高い構造を有するため溶剤溶解性が高く、さらに、芳香環を多く有するためガラス転移温度が高い。化学式(1)で示される化合物は、例えば、非特許文献1に記載されている方法にしたがって合成することができる。
As a dihydric phenol component, it is necessary to contain the compound (2-hydro-3,3-bis (4-hydroxyphenyl) phthalimidine) represented by the chemical formula (1). When the compound represented by the chemical formula (1) is not contained, the heat resistance is lowered, which is not preferable. Note that the hydrogen atom on the aromatic ring in the chemical formula (1) may be substituted with a halogen atom, a hydrocarbon group, or the like. Since the compound represented by the chemical formula (1) has a bulky structure, the thermal motion of the polymer main chain can be suppressed, and many microvoids can be created in the polymer. Since the speeds of carbon dioxide gas and nitrogen gas passing through the microvoids are different, both can be separated. Moreover, since it has a bulky structure, solvent solubility is high, and also because it has many aromatic rings, its glass transition temperature is high. The compound represented by the chemical formula (1) can be synthesized, for example, according to the method described in Non-Patent Document 1.
化学式(1)で示される化合物の含有量は、全二価フェノール成分に対して、10モル%以上とすることが必要で、20モル%以上とすることが好ましく、40モル%以上とすることが、耐熱性および気体選択性の観点より好ましい。化学式(1)で示される化合物の含有量が10%未満の場合、耐熱性や炭酸ガスの選択分離性が低くなるので好ましくない。
The content of the compound represented by the chemical formula (1) needs to be 10 mol% or more, preferably 20 mol% or more, and preferably 40 mol% or more with respect to the total dihydric phenol component. Is preferable from the viewpoints of heat resistance and gas selectivity. When the content of the compound represented by the chemical formula (1) is less than 10%, the heat resistance and the selective separation of carbon dioxide gas are lowered, which is not preferable.
二価フェノール成分を構成する他の二価フェノールとしては、2,2−ビス(4−ヒドロキシフェニル)プロパン〔ビスフェノールA〕、2,2−ビス(3,5−ジメチル−4−ヒドロキシフェニル)プロパン、2,2−ビス(3−メチル−4−ヒドロキシフェニル)プロパン、1,1−ビス(4−ヒドロキシフェニル)−1−フェニルエタン〔ビスフェノールAP〕、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン〔ビスフェノールZ〕、1,1−ビス(4−ヒドロキシフェニル)エタン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)エタン、1,1−ビス(3−メチル−4−ヒドロキシフェニル)エタン、ビス(4−ヒドロキシフェニル)メタン、ビス(3,5−ジメチル−4−ヒドロキシフェニル)メタン、ビス(3−メチル−4−ヒドロキシフェニル)メタン、1,1−ビス(4−ヒドロキシフェニル)ヘキサン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)ヘキサン、1,1−ビス(3−メチル−4−ヒドロキシフェニル)ヘキサン、1,1−ビス(4−ヒドロキシフェニル)−3,3,5−トリメチル−シクロヘキサン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)−3,3,5−トリメチル−シクロヘキサン、1,1−ビス(3,5−ジフェニル−4−ヒドロキシフェニル)−3,3,5−トリメチル−シクロヘキサン、1,1−ビス(3−メチル−4−ヒドロキシフェニル)−3,3,5−トリメチル−シクロヘキサン、1,1−ビス(3−フェニル−4−ヒドロキシフェニル)−3,3,5−トリメチル−シクロヘキサン、1,1−ビス(3,5−ジクロロ−4−ヒドロキシフェニル)−3,3,5−トリメチル−シクロヘキサン、1,1−ビス(3,5−ジブロモ−4−ヒドロキシフェニル)−3,3,5−トリメチル−シクロヘキサン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン〔ビスフェノールZ〕等が挙げられる。 Other dihydric phenols constituting the dihydric phenol component include 2,2-bis (4-hydroxyphenyl) propane [bisphenol A] and 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane. 2,2-bis (3-methyl-4-hydroxyphenyl) propane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane [bisphenol AP], 1,1-bis (4-hydroxyphenyl) Cyclohexane [bisphenol Z], 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) ethane, 1,1-bis (3-methyl-4-) Hydroxyphenyl) ethane, bis (4-hydroxyphenyl) methane, bis (3,5-dimethyl-4-hydroxyphenyl) methane Bis (3-methyl-4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) hexane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) hexane, 1,1-bis (3-methyl-4-hydroxyphenyl) hexane, 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethyl-cyclohexane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) ) -3,3,5-trimethyl-cyclohexane, 1,1-bis (3,5-diphenyl-4-hydroxyphenyl) -3,3,5-trimethyl-cyclohexane, 1,1-bis (3-methyl-) 4-hydroxyphenyl) -3,3,5-trimethyl-cyclohexane, 1,1-bis (3-phenyl-4-hydroxyphenyl) -3,3,5-tri Tyl-cyclohexane, 1,1-bis (3,5-dichloro-4-hydroxyphenyl) -3,3,5-trimethyl-cyclohexane, 1,1-bis (3,5-dibromo-4-hydroxyphenyl)- 3,3,5-trimethyl-cyclohexane, 1,1-bis (4-hydroxyphenyl) cyclohexane [bisphenol Z] and the like.
なお、二価フェノール成分には、本発明の効果を損なわない範囲で、他の水酸基を2つ有する化合物を含有してもよい。 The dihydric phenol component may contain a compound having two other hydroxyl groups as long as the effects of the present invention are not impaired.
中でも、耐熱性、溶剤溶解性および炭酸ガス選択分離性に優れている点から、2,2−ビス(4−ヒドロキシフェニル)プロパン〔ビスフェノールA〕、1,1−ビス(4−ヒドロキシフェニル)−1−フェニルエタン〔ビスフェノールAP〕、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン〔ビスフェノールZ〕が好ましい。これらは単独で用いてもよいし、2種以上を併用してもよい。 Among these, 2,2-bis (4-hydroxyphenyl) propane [bisphenol A], 1,1-bis (4-hydroxyphenyl)-is preferable because it has excellent heat resistance, solvent solubility, and carbon dioxide selective separation. 1-phenylethane [bisphenol AP] and 1,1-bis (4-hydroxyphenyl) cyclohexane [bisphenol Z] are preferred. These may be used alone or in combination of two or more.
芳香族ジカルボン酸成分としては、テレフタル酸、イソフタル酸、ジフェニルエーテル−2,2’−ジカルボン酸、ジフェニルエーテル−2,3’−ジカルボン酸、ジフェニルエーテル−2,4’−ジカルボン酸、ジフェニルエーテル−3,3’−ジカルボン酸、ジフェニルエーテル−3,4’−ジカルボン酸、ジフェニルエーテル−4,4’−ジカルボン酸、テレフタル酸、イソフタル酸、オルトフタル酸、2,6−ナフタレンジカルボン酸、ジフェン酸ビス(p−カルボキシフェニル)アルカン、ジフェニルエーテル−2,2’−ジカルボン酸、ジフェニルエーテル−2,3’−ジカルボン酸、ジフェニルエーテル−2,4’−ジカルボン酸、ジフェニルエーテル−3,3’−ジカルボン酸、ジフェニルエーテル−3,4’−ジカルボン酸、ジフェニルエーテル−4,4’−ジカルボン酸等が挙げられる。中でも、溶剤溶解性が高くなり流延法でフィルムを作製しやすくなるので、テレフタル酸とイソフタル酸を併用することが好ましい。 Examples of the aromatic dicarboxylic acid component include terephthalic acid, isophthalic acid, diphenyl ether-2,2′-dicarboxylic acid, diphenyl ether-2,3′-dicarboxylic acid, diphenyl ether-2,4′-dicarboxylic acid, diphenyl ether-3,3 ′. -Dicarboxylic acid, diphenyl ether-3,4'-dicarboxylic acid, diphenyl ether-4,4'-dicarboxylic acid, terephthalic acid, isophthalic acid, orthophthalic acid, 2,6-naphthalenedicarboxylic acid, bis (p-carboxyphenyl) diphenate Alkane, diphenyl ether-2,2'-dicarboxylic acid, diphenyl ether-2,3'-dicarboxylic acid, diphenyl ether-2,4'-dicarboxylic acid, diphenyl ether-3,3'-dicarboxylic acid, diphenyl ether-3,4'-dicarboxylic , Diphenyl ether-4,4'-dicarboxylic acid. Among them, it is preferable to use terephthalic acid and isophthalic acid in combination because the solvent solubility becomes high and the film can be easily produced by the casting method.
テレフタル酸とイソフタル酸を併用する場合、両者の含有比率は10/90〜90/10(モル比)とすることが好ましく、25/75〜75/25(モル比)とすることがより好ましく、35/65〜65/35(モル比)とすることがさらに好ましい。 When terephthalic acid and isophthalic acid are used in combination, the content ratio of both is preferably 10/90 to 90/10 (molar ratio), more preferably 25/75 to 75/25 (molar ratio), More preferably, it is 35/65 to 65/35 (molar ratio).
なお、芳香族ジカルボン酸成分には、本発明の効果を損なわない範囲で、脂肪族ジカルボン酸や脂環族ジカルボン酸を含有してもよい。 The aromatic dicarboxylic acid component may contain an aliphatic dicarboxylic acid or an alicyclic dicarboxylic acid as long as the effects of the present invention are not impaired.
ポリアリレート樹脂のインヘレント粘度は0.5を超え1.5以下であることが好ましい。インヘレント粘度は、末端封止剤の添加量等によって制御することができる。インヘレント粘度が0.5以下の場合、流延法において基材からフィルムを剥離する際、割れが生じる場合があったり、Tダイ法において、フィルム状に押出せなかったりする場合がある。一方、インヘレント粘度が1.5を超える場合、流延法において、溶液粘度が高くなりフィルムが形成されなかったり、Tダイ法において、フィルムの押出が困難になったりする場合がある。 The inherent viscosity of the polyarylate resin is preferably more than 0.5 and 1.5 or less. The inherent viscosity can be controlled by the amount of the end-capping agent added. When the inherent viscosity is 0.5 or less, cracking may occur when the film is peeled off from the base material in the casting method, or the film may not be extruded in the T-die method. On the other hand, when the inherent viscosity exceeds 1.5, the solution viscosity becomes high in the casting method and a film may not be formed, or the extrusion of the film may become difficult in the T-die method.
ポリアリレート樹脂の末端酸価は、50モル/トン以下であることが好ましく、20モル/トン以下であることがより好ましい。末端酸価を50モル/トン以下とすることで、溶剤溶解性が向上し、流延法でフィルムを作製することができる。一般に末端酸価が大きくなるほど、溶剤溶解性は悪くなる。 The terminal acid value of the polyarylate resin is preferably 50 mol / ton or less, and more preferably 20 mol / ton or less. By setting the terminal acid value to 50 mol / ton or less, the solvent solubility is improved, and a film can be produced by a casting method. Generally, the higher the terminal acid value, the worse the solvent solubility.
ポリアリレート樹脂を製造する方法としては、界面重合法、溶液重合法等が挙げられる。界面重合法は溶液重合法と比較すると、反応が速いため、酸ハライドの加水分解を抑えることができ、結果として高分子量のポリマーを得ることができる。 Examples of the method for producing the polyarylate resin include an interfacial polymerization method and a solution polymerization method. Since the interfacial polymerization method is faster than the solution polymerization method, hydrolysis of the acid halide can be suppressed, and as a result, a high molecular weight polymer can be obtained.
界面重合法としては、二価カルボン酸ハライドを水と相溶しない有機溶媒に溶解させた溶液(有機相)を、二価フェノール、末端封止剤、酸化防止剤および重合触媒を含むアルカリ水溶液(水相)に混合し、50℃以下の温度で1〜8時間撹拌しながら重合反応をおこなう方法が挙げられる。 As the interfacial polymerization method, a solution in which a divalent carboxylic acid halide is dissolved in an organic solvent incompatible with water (organic phase) is mixed with an aqueous alkaline solution containing a dihydric phenol, a terminal blocking agent, an antioxidant and a polymerization catalyst ( And a method of conducting a polymerization reaction while stirring at a temperature of 50 ° C. or lower for 1 to 8 hours.
有機相に用いる溶媒としては、水と相溶せずポリアリレート樹脂を溶解する溶媒が好ましい。そのような溶媒としては、塩化メチレン、クロロホルム等が挙げられ、製造上使用しやすいことから、塩化メチレンが好ましい。 As the solvent used for the organic phase, a solvent that is not compatible with water and dissolves the polyarylate resin is preferable. Examples of such a solvent include methylene chloride and chloroform. Methylene chloride is preferred because it is easy to use in production.
水相に用いるアルカリ水溶液としては、水酸化ナトリウムや水酸化カリウム等の水溶液が挙げられる。 Examples of the aqueous alkali solution used in the aqueous phase include aqueous solutions of sodium hydroxide and potassium hydroxide.
末端封止剤としては、一価フェノール、一価酸クロライド、一価アルコール、一価カルボン酸等が挙げられる。一価フェノールとしては、フェノール、o−クレゾール、m−クレゾール、p−クレゾール、p−tert−ブチルフェノール、o−フェニルフェノール、m−フェニルフェノール、p−フェニルフェノール、o−メトキシフェノール、m−メトキシフェノール、p−メトキシフェノール、2,3,6−トリメチルフェノール、2,3−キシレノール、2,4−キシレノール、2,5−キシレノール、2,6−キシレノール、3,4−キシレノール、3,5−キシレノール、2−フェニル−2−(4−ヒドロキシフェニル)プロパン、2−フェニル−2−(2−ヒドロキシフェニル)プロパン、2−フェニル−2−(3−ヒドロキシフェニル)プロパン等が挙げられ、一価酸クロライドとしては、ベンゾイルクロライド、安息香酸クロライド、メタンスルホニルクロライド、フェニルクロロホルメート等が挙げられ、一価アルコールとしては、メタノール、エタノール、n−プロパノール、イソプロパノール、n−ブタノール、2−ブタノール、ペンタノール、ヘキサノール、ドデシルアルコール、ステアリルアルコール、ベンジルアルコール、フェネチルアルコール等が挙げられ、一価カルボン酸としては、酢酸、プロピオン酸、オクタン酸、シクロヘキサンカルボン酸、安息香酸、トルイル酸、フェニル酢酸、p−tert−ブチル安息香酸、p−メトキシフェニル酢酸等が挙げられる。これらの中でも、反応性と熱安定性の点から、p−tert−ブチルフェノールが好ましい。 Examples of the end capping agent include monohydric phenol, monohydric acid chloride, monohydric alcohol, monohydric carboxylic acid and the like. As monohydric phenol, phenol, o-cresol, m-cresol, p-cresol, p-tert-butylphenol, o-phenylphenol, m-phenylphenol, p-phenylphenol, o-methoxyphenol, m-methoxyphenol P-methoxyphenol, 2,3,6-trimethylphenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol , 2-phenyl-2- (4-hydroxyphenyl) propane, 2-phenyl-2- (2-hydroxyphenyl) propane, 2-phenyl-2- (3-hydroxyphenyl) propane and the like, and monovalent acid As chloride, benzoyl chloride, benzoic acid chloride Methanesulfonyl chloride, phenyl chloroformate and the like can be mentioned. As monohydric alcohol, methanol, ethanol, n-propanol, isopropanol, n-butanol, 2-butanol, pentanol, hexanol, dodecyl alcohol, stearyl alcohol, benzyl alcohol Phenethyl alcohol, and the like. Examples of monovalent carboxylic acids include acetic acid, propionic acid, octanoic acid, cyclohexanecarboxylic acid, benzoic acid, toluic acid, phenylacetic acid, p-tert-butylbenzoic acid, p-methoxyphenylacetic acid, and the like. Is mentioned. Among these, p-tert-butylphenol is preferable from the viewpoints of reactivity and thermal stability.
酸化防止剤としては、ハイドロサルファイトナトリウム、L−アスコルビン酸、エリソルビン酸、カテキン、トコフェノール、ブチルヒドロキシアニソール等が挙げられ、速やかに水溶することからハイドロサルファイトナトリウムが好ましい。 Examples of the antioxidant include sodium hydrosulfite, L-ascorbic acid, erythorbic acid, catechin, tocophenol, butylhydroxyanisole and the like, and hydrosulfite sodium is preferred because it quickly dissolves in water.
重合触媒としては、トリブチルベンジルアンモニウムハライド、テトラブチルアンモニウムハライド、トリメチルベンジルアンモニウムハライド、トリエチルベンジルアンモニウムハライド等の第四級アンモニウム塩や、トリブチルベンジルホスホニウムハライド、テトラブチルホスホニウムハライド、トリメチルベンジルホスホニウムハライド、トリエチルベンジルホスホニウムハライド等の第四級ホスホニウム塩が挙げられる。中でも、高分子量で低末端酸価のポリマーを得ることができる点で、トリブチルベンジルアンモニウムハライド、テトラブチルアンモニウムハライド、トリブチルベンジルホスホニウムハライド、テトラブチルホスホニウムハライドが好ましい。 The polymerization catalyst includes quaternary ammonium salts such as tributylbenzylammonium halide, tetrabutylammonium halide, trimethylbenzylammonium halide, triethylbenzylammonium halide, tributylbenzylphosphonium halide, tetrabutylphosphonium halide, trimethylbenzylphosphonium halide, triethylbenzyl. Quaternary phosphonium salts such as phosphonium halides may be mentioned. Among them, tributylbenzylammonium halide, tetrabutylammonium halide, tributylbenzylphosphonium halide, and tetrabutylphosphonium halide are preferable in that a polymer having a high molecular weight and a low terminal acid value can be obtained.
本発明のフィルムは、ポリアリレート樹脂を流延法やTダイ法により加工することにより得ることができる。流延法とは、樹脂を有機溶剤に溶解した後、その樹脂溶液を基材に塗布し、乾燥した後、基材から剥離してフィルムを作製する方法である。一方、Tダイ法とは、乾燥した樹脂を押出機に投入し、溶融樹脂をTダイから冷却ロールに押出し、捲き取る方法である。熱分解による色調低下が生じないことから、流延法でフィルムを作製することが好ましい。 The film of the present invention can be obtained by processing a polyarylate resin by a casting method or a T-die method. The casting method is a method in which a resin is dissolved in an organic solvent, the resin solution is applied to a substrate, dried, and then peeled off from the substrate to produce a film. On the other hand, the T-die method is a method in which a dried resin is put into an extruder and a molten resin is extruded from a T-die to a cooling roll and scraped off. It is preferable to produce a film by a casting method because color tone deterioration due to thermal decomposition does not occur.
流延法に用いられる有機溶剤としては、クロロホルムや塩化メチレンが挙げられ、基材としては、PETフィルム、ポリイミドフィルム、ガラス等が挙げられる。乾燥方法は特に限定されないが、効率よく有機溶媒を除去するためには加熱乾燥することが好ましい。乾燥温度や乾燥時間は樹脂の物性や塗布基板の組み合わせにより適宜選択される。経済性を考慮した場合、乾燥温度は40〜150℃とすることが好ましく、40〜100℃とすることがより好ましく、乾燥時間は1〜30分とすることが好ましく、3〜15分とすることがより好ましい。なお、必要に応じて、室温で自然乾燥してもよい。塗布方法は特に限定されないが、ワイヤーバーコーター塗り、フィルムアプリケーター塗り、はけ塗りやスプレー塗り、グラビアロールコーティング法、スクリーン印刷法、リバースロールコーティング法、リップコーティング、エアナイフコーティング法、カーテンフローコーティング法、浸漬コーティング法を用いることができる。 Examples of the organic solvent used in the casting method include chloroform and methylene chloride, and examples of the substrate include PET film, polyimide film, and glass. The drying method is not particularly limited, but it is preferable to dry by heating in order to efficiently remove the organic solvent. The drying temperature and drying time are appropriately selected depending on the physical properties of the resin and the combination of the coated substrates. In consideration of economy, the drying temperature is preferably 40 to 150 ° C., more preferably 40 to 100 ° C., and the drying time is preferably 1 to 30 minutes, and 3 to 15 minutes. It is more preferable. In addition, you may dry naturally at room temperature as needed. Application method is not particularly limited, but wire bar coater coating, film applicator coating, brushing and spray coating, gravure roll coating method, screen printing method, reverse roll coating method, lip coating, air knife coating method, curtain flow coating method, A dip coating method can be used.
Tダイ法において、その条件は特に限定されないが、樹脂の溶融温度としては、(ガラス転移温度+100℃)以下の温度範囲が好ましく、また、冷却ロールの温度としては、40〜90℃の温度範囲が好ましい。冷却ロールにフィルムを密着させる方法としては、静電印加法やエアーナイフ法等、公知の方法を用いることができる。 In the T-die method, the conditions are not particularly limited, but the melting temperature of the resin is preferably a temperature range of (glass transition temperature + 100 ° C.) or lower, and the temperature of the cooling roll is 40 to 90 ° C. Is preferred. As a method of bringing the film into close contact with the cooling roll, a known method such as an electrostatic application method or an air knife method can be used.
工業的に生産するには、フィルムの引張強度は45MPa以上であることが好ましく、70MPa以上であることがより好ましい。
また、本発明のフィルムにおいては、二価フェノール成分として化学式(1)の化合物が10モル%以上含有されているため、弾性率が高くなる。具体的には、1950MPa以上とすることができる。
For industrial production, the tensile strength of the film is preferably 45 MPa or more, and more preferably 70 MPa or more.
Moreover, in the film of this invention, since the compound of Chemical formula (1) contains 10 mol% or more as a dihydric phenol component, an elasticity modulus becomes high. Specifically, it can be set to 1950 MPa or more.
本発明のフィルムは、後述する窒素ガスの透過係数に対する炭酸ガスの透過係数の比(以下、「炭酸ガス選択分離係数」と略称する場合がある。)が高いため、炭酸ガスの選択分離性に優れている。炭酸ガスの分離膜として工業的に使用するためには、炭酸ガス選択分離係数が31.0以上であればよい。 Since the film of the present invention has a high ratio of carbon dioxide gas permeability coefficient to nitrogen gas permeability coefficient, which will be described later (hereinafter may be abbreviated as “carbon dioxide selective separation coefficient”), the carbon dioxide gas is selectively separated. Are better. In order to use industrially as a carbon dioxide separation membrane, the carbon dioxide selective separation coefficient may be 31.0 or more.
本発明のフィルムは引張強度が高く、炭酸ガスの選択分離性や耐熱性に優れるため、各種分離膜として用いることができる。 Since the film of the present invention has high tensile strength and excellent carbon dioxide selective separation and heat resistance, it can be used as various separation membranes.
以下、本発明を実施例によって具体的に説明するが、本発明はこれらによって限定されるものではない。 EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.
1.評価項目
(1)インヘレント粘度
ポリアリレート樹脂をフェノール/1,1,2,2−テトラクロロエタン(6/4(質量比))に溶解し、濃度1g/dlの試料溶液を作製した。続いて、ウベローデ型粘度計を用い、30℃の温度にて試料溶液および溶媒の落下時間を測定し、以下の式を用いてインヘレント粘度を求めた。
インヘレント粘度=ln[(試料溶液の落下時間/溶媒のみの落下時間)/樹脂濃度(g/dl)]
1. Evaluation Item (1) Inherent Viscosity Polyarylate resin was dissolved in phenol / 1,1,2,2-tetrachloroethane (6/4 (mass ratio)) to prepare a sample solution having a concentration of 1 g / dl. Subsequently, the drop time of the sample solution and the solvent was measured at a temperature of 30 ° C. using an Ubbelohde viscometer, and the inherent viscosity was determined using the following equation.
Inherent viscosity = ln [(sample solution drop time / solvent only drop time) / resin concentration (g / dl)]
(2)末端酸価
ポリアリレート樹脂150mgを、ベンジルアルコール5mlに加温して溶解し、冷却後、クロロホルム10mlと混合した。フェノールレッドを指示薬として0.1Nの水酸化カリウムベンジルアルコール溶液で滴定した。その滴定した値を用いてポリアリレート樹脂1トン中に含まれる当量数を計算し、末端酸価とした。
(2) Terminal acid value 150 mg of polyarylate resin was dissolved by heating in 5 ml of benzyl alcohol, and after cooling, mixed with 10 ml of chloroform. The solution was titrated with 0.1N potassium hydroxide benzyl alcohol solution using phenol red as an indicator. Using the titrated value, the number of equivalents contained in 1 ton of polyarylate resin was calculated and used as the terminal acid value.
(3)ガラス転移温度
ポリアリレート樹脂10mgをサンプルとし、DSC(示差走査熱量測定)装置(パーキンエルマー社製DSC7)を用いて昇温速度10℃/分の条件で昇温し、昇温曲線中のガラス転移に由来する2つの折曲点温度の中間値をガラス転移温度とした。
(3) Glass transition temperature Using a polyarylate resin 10 mg as a sample, the temperature was raised using a DSC (Differential Scanning Calorimetry) apparatus (DSC7 manufactured by PerkinElmer Co., Ltd.) at a temperature rising rate of 10 ° C./min. An intermediate value between two bending point temperatures derived from the glass transition was taken as the glass transition temperature.
(4)溶剤溶解性
クロロホルムに、ポリアリレート樹脂を溶質濃度が15質量%となるように混合し、25℃において1日間攪拌した。攪拌後、溶解して無色透明溶液が得られた場合は、25℃において7日間静置し、このとき溶液が無色透明であった場合は、さらに同じ温度条件で24時間静置した。経時的な溶液状態を目視で観察し、以下の基準で評価した。
◎:攪拌直後に無色透明溶液が得られ、7日間静置後も無色透明であった。
○:攪拌直後に無色透明溶液が得られ、1日間静置後は無色透明であったが、48時間静置後には白濁していた。
△:攪拌直後に無色透明溶液が得られたが、1日間静置後には白濁していた。
×:溶解しなかった。
(4) Solvent solubility Polyarylate resin was mixed with chloroform so that the solute concentration was 15% by mass and stirred at 25 ° C. for 1 day. When a colorless transparent solution was obtained by dissolution after stirring, the solution was allowed to stand at 25 ° C. for 7 days. If the solution was colorless and transparent at this time, the solution was further allowed to stand at the same temperature for 24 hours. The solution state over time was visually observed and evaluated according to the following criteria.
A: A colorless and transparent solution was obtained immediately after stirring, and it was colorless and transparent after standing for 7 days.
◯: A colorless and transparent solution was obtained immediately after stirring. The solution was colorless and transparent after standing for 1 day, but was cloudy after standing for 48 hours.
Δ: A colorless transparent solution was obtained immediately after stirring, but it was cloudy after standing for 1 day.
X: Not dissolved.
(5)引張強度、引張弾性率
厚み100μmのフィルムを、JIS K−2318に準拠して、インテスコ社製引張圧縮試験機を用い、破断点での引張強度と引張弾性率を測定した。
(5) Tensile strength and tensile elastic modulus Tensile strength and tensile elastic modulus at the breaking point of a film having a thickness of 100 μm were measured using an Intesco tensile / compression tester in accordance with JIS K-2318.
(6)全光線透過率
厚み50μmのフィルムを、日本電色工業社製濁度計NDH2000を用い、波長350nmにおける全光線透過率を測定した。実用上、85%以上が好ましい。
(6) Total light transmittance The total light transmittance in wavelength 350nm was measured for the film of thickness 50 micrometers using the Nippon Denshoku Industries Co., Ltd. turbidimeter NDH2000. Practically, 85% or more is preferable.
(7)炭酸ガス透過係数、窒素ガス透過係数、炭酸ガス選択分離係数
厚み40μmのフィルムを、柳本製作所社製ガス透過係数測定装置GTR−10を用い、25℃における炭酸ガスと窒素ガスの透過係数を測定した。
また、炭酸ガス透過係数を窒素ガス透過係数で除した値を炭酸ガス選択分離係数とした。
(7) Carbon dioxide permeation coefficient, nitrogen gas permeation coefficient, carbon dioxide selective separation coefficient Using a gas permeation coefficient measuring apparatus GTR-10 manufactured by Yanagimoto Seisakusho Co., Ltd., a film having a thickness of 40 μm, the permeation coefficient of carbon dioxide and nitrogen gas at 25 ° C. Was measured.
A value obtained by dividing the carbon dioxide permeability coefficient by the nitrogen gas permeability coefficient was defined as the carbon dioxide selective separation coefficient.
2.原料
2−フェニル−3,3−ビス(4−ヒドロキシフェニル)フタルイミジンの合成
Dean Stark装置を備えた反応容器に、フェノールフタレイン31.8質量部、アニリン65質量部および濃塩酸20.5質量部を供給した後、160℃に加熱し水分を揮発させた。その後、温度は変更せずに15時間反応させた後、反応混合物を塩酸400質量部の入った反応容器に流し込み、沈殿物を生成させた。沈殿物を濾過により回収し、活性炭含有の水酸化ナトリウム水溶液に溶解させた後、30分間攪拌し、濾過により活性炭を除去し、濾過物を得た。その後、さらに1回、同様の活性炭処理をおこなった。得られた濾過物に中和のため濃塩酸を添加して沈殿物を生成させ、濾過後、粗成生物を払いだした。粗生成物100質量部とメタノール400質量部を混合し、加熱して1時間還流した後、濾過により2−フェニル−3,3−ビス(4−ヒドロキシフェニル)フタルイミジンを得た。
2. Synthesis of Raw Material 2-Phenyl-3,3-bis (4-hydroxyphenyl) phthalimidine In a reaction vessel equipped with a Dean Stark apparatus, 31.8 parts by mass of phenolphthalein, 65 parts by mass of aniline and 20.5 parts by mass of concentrated hydrochloric acid Then, it was heated to 160 ° C. to volatilize water. Thereafter, the reaction was carried out for 15 hours without changing the temperature, and then the reaction mixture was poured into a reaction vessel containing 400 parts by mass of hydrochloric acid to produce a precipitate. The precipitate was collected by filtration, dissolved in an aqueous sodium hydroxide solution containing activated carbon, stirred for 30 minutes, and the activated carbon was removed by filtration to obtain a filtrate. Thereafter, the same activated carbon treatment was performed once more. Concentrated hydrochloric acid was added to the obtained filtrate for neutralization to form a precipitate. After filtration, the crude product was removed. 100 parts by mass of the crude product and 400 parts by mass of methanol were mixed, heated and refluxed for 1 hour, and then 2-phenyl-3,3-bis (4-hydroxyphenyl) phthalimidine was obtained by filtration.
実施例1
攪拌装置を備えた反応容器中に、2−フェニル−3,3−ビス(4−ヒドロキシフェニル)フタルイミジン74.0質量部、末端封止剤としてp−tert−ブチルフェノール0.85質量部、アルカリとして水酸化ナトリウム22.9質量部、重合触媒としてトリエチルベンジルアンモニウムクロライド0.41質量部、酸化防止剤としてハイドロサルファイトナトリウム0.37質量部を仕込み、水1750質量部に溶解した(水相)。これとは別に、塩化メチレン1000質量部に、テレフタル酸クロライド(以下、TPCと略称する。)19.76質量部と、イソフタル酸クロライド(以下、IPCと略称する。)19.76質量部を溶解した(有機相)(TPC:IPC=50:50(モル比))。水相をあらかじめ攪拌しておき、有機相を水相中に強攪拌下で添加し、15℃で4時間、界面重合法で重合をおこなった。この後、攪拌を停止し、水相と有機相をデカンテーションして分離した。水相を除去した後、塩化メチレン500質量部、純水2000質量部と酢酸2質量部を添加して反応を停止し、15℃で30分間攪拌した。その後、有機相を純水で10回洗浄し、有機相をメタノール中に添加してポリマーを沈殿させた。沈殿させたポリマーを濾過し、乾燥し、ポリアリレート樹脂を得た。
得られたポリアリレート樹脂を、クロロホルムに、15質量%の濃度になるように溶解させ、クロロホルム溶液を得た。得られたクロロホルム溶液を、ガラス板上に流延塗布し、減圧下、120℃で、24時間乾燥し、所定の厚みになるようにフィルムを作製した。
Example 1
In a reaction vessel equipped with a stirrer, 74.0 parts by mass of 2-phenyl-3,3-bis (4-hydroxyphenyl) phthalimidine, 0.85 parts by mass of p-tert-butylphenol as an end-capping agent, and as an alkali 22.9 parts by mass of sodium hydroxide, 0.41 part by mass of triethylbenzylammonium chloride as a polymerization catalyst and 0.37 part by mass of hydrosulfite sodium as an antioxidant were charged and dissolved in 1750 parts by mass of water (aqueous phase). Separately, 19.76 parts by mass of terephthalic acid chloride (hereinafter abbreviated as TPC) and 19.76 parts by mass of isophthalic acid chloride (hereinafter abbreviated as IPC) are dissolved in 1000 parts by mass of methylene chloride. (Organic phase) (TPC: IPC = 50: 50 (molar ratio)). The aqueous phase was previously stirred, and the organic phase was added to the aqueous phase under strong stirring, and polymerization was performed at 15 ° C. for 4 hours by the interfacial polymerization method. Thereafter, stirring was stopped, and the aqueous phase and the organic phase were decanted and separated. After removing the aqueous phase, 500 parts by mass of methylene chloride, 2000 parts by mass of pure water and 2 parts by mass of acetic acid were added to stop the reaction, and the mixture was stirred at 15 ° C. for 30 minutes. Thereafter, the organic phase was washed 10 times with pure water, and the organic phase was added into methanol to precipitate the polymer. The precipitated polymer was filtered and dried to obtain a polyarylate resin.
The obtained polyarylate resin was dissolved in chloroform to a concentration of 15% by mass to obtain a chloroform solution. The obtained chloroform solution was cast-coated on a glass plate and dried under reduced pressure at 120 ° C. for 24 hours to produce a film having a predetermined thickness.
実施例2〜9、12、比較例1〜3
表1に示すように用いるモノマーを変更する以外は、実施例1と同様にポリアリレート樹脂を重合し、フィルムを得た。
Examples 2 to 9, 12 and Comparative Examples 1 to 3
A polyarylate resin was polymerized in the same manner as in Example 1 except that the monomer used was changed as shown in Table 1 to obtain a film.
実施例10、11、13
表1に示すようにモノマーを変更した以外は実施例1と同様にしてポリアリレート樹脂を得た後、これを330℃で溶融し、Tダイより50℃に設定した冷却ロール上に押出し、フィルムを作製した。
Examples 10, 11, 13
A polyarylate resin was obtained in the same manner as in Example 1 except that the monomers were changed as shown in Table 1, and then melted at 330 ° C. and extruded from a T-die onto a cooling roll set at 50 ° C. Was made.
表1に、樹脂組成、樹脂特性およびフィルム特性を示す。 Table 1 shows the resin composition, resin characteristics, and film characteristics.
実施例1〜13のフィルムは、炭酸ガス分離性や耐熱性に優れていた。 The films of Examples 1 to 13 were excellent in carbon dioxide separation and heat resistance.
比較例1、2のフィルムは、化学式(1)で示される二価フェノールを含有していないポリアリレート樹脂を用いたため、炭酸ガス選択分離係数が低かった。
比較例3のフィルムは、化学式(1)で示される二価フェノールの含有量が低いポリアリレート樹脂を用いたため、耐熱性が低く、炭酸ガス選択分離係数が低かった。
Since the films of Comparative Examples 1 and 2 used the polyarylate resin not containing dihydric phenol represented by the chemical formula (1), the carbon dioxide selective separation factor was low.
Since the film of Comparative Example 3 used a polyarylate resin having a low dihydric phenol content represented by the chemical formula (1), the heat resistance was low and the carbon dioxide selective separation factor was low.
Claims (3)
A gas separation membrane comprising the film according to claim 1.
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| CN112675714A (en) * | 2019-10-17 | 2021-04-20 | 滁州学院 | Polyarylester composite nanofiltration membrane and preparation method thereof |
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| CN113908696A (en) * | 2020-07-07 | 2022-01-11 | 沃顿科技股份有限公司 | Method for preparing reverse osmosis membrane and reverse osmosis membrane prepared thereby |
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