JP5813076B2 - Case mold type capacitor - Google Patents

Description

  The present invention relates to a case mold type capacitor in which a resin filler is filled in a resin case in which a capacitor element is accommodated.

  In the specifications of capacitors in recent power conversion devices, particularly in-vehicle power conversion devices, the voltage range to be used is as high as several hundred volts, so that a film capacitor having a large capacity and a high withstand voltage is often used.

  In a conventional case mold type capacitor, from the viewpoint of moisture resistance, heat cycle resistance, etc., a film capacitor is accommodated in a resin case, and the resin case is filled with a mold resin (see, for example, Patent Document 1). ).

JP 2010-16151 A

  In recent years, in-vehicle power converters are required to be small and low-profile, but there is a limit to downsizing capacitors with the same capacity and quality. Further, in the case of a case mold type capacitor, it is necessary to consider variation in the filling amount of the mold resin in order to ensure heat resistance and moisture resistance of the capacitor element. For this reason, it is necessary to make the thickness of the mold resin equal to or more than the lower limit of the variation in the filling amount, which hinders a reduction in the size and height of the power converter. In particular, when there is a protrusion on the capacitor side of a component adjacent to the capacitor, it is necessary to prevent the protrusion from interfering with the capacitor, which hinders a reduction in size and height.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a case mold type capacitor that can achieve a reduction in the size and height of the entire device to be applied with a simple configuration. To do.

  A case mold type capacitor according to the present invention includes a resin case having an opening, a capacitor element housed in the resin case, and a mold portion having a resin filler filled in the resin case. In the sealing surface of the mold part, there is formed a recess into which a part of the parts arranged adjacent to each other is inserted.

  Since the case mold type capacitor of the present invention has a recess in the mold part, the adjacent part can be placed lower by inserting a part of the adjacent part into the recess, and is applied with a simple configuration. The overall device can be reduced in size and height.

It is a perspective view which shows the case mold type capacitor | condenser by Embodiment 1 of this invention. It is sectional drawing of the case mold type capacitor | condenser of FIG. It is a disassembled perspective view which shows the state in the middle of manufacture of the case mold type capacitor | condenser of FIG. It is a perspective view which shows the state of the back | latter stage of FIG. It is a perspective view which shows the case mold type capacitor | condenser by Embodiment 2 of this invention. It is sectional drawing of the case mold type capacitor | condenser of FIG. It is a disassembled perspective view which shows the state in the middle of manufacture of the case mold type capacitor | condenser of FIG. It is a disassembled perspective view which shows the state in the middle of manufacture of the case mold type capacitor by Embodiment 3 of this invention. It is a perspective view which shows the state of the back | latter stage of FIG. It is a perspective view which shows the case mold type capacitor | condenser by Embodiment 4 of this invention. It is sectional drawing of the case mold type capacitor | condenser of FIG. It is a perspective view which shows the state in the middle of manufacture of the case mold type capacitor | condenser of FIG. It is a perspective view which shows the case mold type capacitor by Embodiment 5 of this invention. It is a perspective view which shows the state in the middle of manufacture of the case mold type capacitor | condenser of FIG.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
Embodiment 1 FIG.
1 is a perspective view showing a case mold type capacitor according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view of the case mold type capacitor of FIG. 1, where a case mold applied to an in-vehicle power converter is shown. A type capacitor is shown.

  In the figure, a capacitor element 2 is accommodated in a resin case 1 having an opening 1a. The capacitor element 2 is connected to a pair of metal bus bars 3 that are electrically connected to a power source.

  The capacitor element 2 is sealed by filling the resin case 1 with a filler 4 in order to improve heat resistance and moisture resistance. The mold part of the first embodiment is composed of the filler 4. Each bus bar 3 is an L-shaped component, one end is joined to the capacitor element 2 in the filler 4, and the other end is drawn out of the resin case 1 from the filler 4.

  On the surface (sealing surface) exposed from the opening 1a of the filler 4, a concave portion (dent) 4a is formed. A part of the adjacent component 5, which is a component disposed adjacent to the case mold type capacitor, here, the tip of the protruding portion 5 a is inserted into the recess 4 a. As the protrusion 5a, for example, a mounting screw or the like of the adjacent component 5 can be cited.

  Next, a manufacturing method of this case mold type capacitor will be described. First, as shown in FIG. 3, the capacitor element 2 to which the bus bar 3 is connected is set in the resin case 1.

  Thereafter, as shown in FIG. 4, the jig 6 is disposed above the capacitor element 2. The jig 6 is disposed with a gap between the jig 6 and the capacitor element 2. In addition, as the jig 6, a jig whose area facing the capacitor element 2 is slightly larger than the tip of the protrusion 5 a of the adjacent component 5 is selected.

  In this state, the filler 4 is filled into the resin case 1 in the resin case 1. After filling, the jig 6 is removed. Thereby, the recess 4 a is formed in the filler 4.

  In such a case mold type capacitor, since the recess 4a is provided in the filler 4, the adjacent component 5 can be arranged lower by inserting a part of the protrusion 5a into the recess 4a. Accordingly, the power converter can be reduced in size and height with a simple configuration.

  In addition, it is necessary to suppress the shape of the recessed part 4a to the magnitude | size which can ensure the heat resistance and moisture resistance of the capacitor | condenser element 2, considering the height variation of a sealing surface.

Embodiment 2. FIG.
5 is a perspective view showing a case mold type capacitor according to Embodiment 2 of the present invention, FIG. 6 is a cross-sectional view of the case mold type capacitor of FIG. 5, and FIG. 7 is in the process of manufacturing the case mold type capacitor of FIG. It is a disassembled perspective view which shows the state.

  In the second embodiment, a resin frame (plate) 7 provided with a recess (hollow) 7 a is inserted into the resin case 1 together with the capacitor element 2. The resin frame 7 is partially embedded in the filler 4, and the recess 7 a is exposed outside the filler 4. Further, the upper end portion of the wall portion around the recess 7 a protrudes outside the filler 4.

  Further, the resin frame 7 is fixed to the filler 4 by filling the resin case 1 with the filler 4 in a state of being spaced from the capacitor element 2. Thereby, the filler 4 is also filled between the bottom surface of the resin frame 7 and the capacitor element 2.

  The mold part 8 of the second embodiment has a filler 4 and a resin frame 7. The tip of the protrusion 5a of the adjacent component 5 is inserted into the recess 7a. Other configurations and manufacturing methods are the same as those in the first embodiment.

  Even in such a case mold type capacitor, since the concave portion 7a is provided in the mold portion 8, the power converter can be reduced in size and height with a simple configuration.

  Further, since the resin frame 7 provided with the recess 7a is used, even when it is difficult to install the jig 6 used in the first embodiment due to restrictions on the manufacturing equipment, it is possible to manufacture with the existing equipment. It becomes.

  Further, an adhesive resin such as an epoxy resin is generally used as the resin filled for sealing. For this reason, when forming the recessed part 4a with the jig | tool 6 like Embodiment 1, a mold release agent is used. On the other hand, in Embodiment 2, it is not necessary to use a release agent, and the influence of the release agent on the quality of the product can be eliminated.

  Furthermore, since the upper end part of the wall part around the recessed part 7a protrudes out of the filler 4, the filler 4 can be prevented from entering the recessed part 7a when the filler 4 is filled.

Embodiment 3 FIG.
Next, FIG. 8 is an exploded perspective view showing a state in the middle of manufacturing the case mold type capacitor according to the third embodiment of the present invention, and FIG. 9 is a perspective view showing a state in the latter stage of FIG.

  In the third embodiment, a pair of frame positioning portions 1b for positioning the resin frame 7 is provided on the inner wall surfaces of the resin case 1 facing each other. Each frame positioning portion 1b is formed by partially reducing the wall thickness of the resin case 1 and providing a stepped portion.

  The resin frame 7 is provided with a pair of flat engaging portions 7b that engage with the frame positioning portion 1b. The engaging part 7b is arrange | positioned at the both sides of the recessed part 7a. As shown in FIG. 9, the resin frame 7 is positioned in the horizontal direction and the depth direction of the resin case 1 by engaging the engaging portion 7 b with the frame positioning portion 1 b. Then, in the state of FIG. 9, the filler 4 is filled into the resin case 1. Other configurations and manufacturing methods are the same as those in the second embodiment.

  In such a case mold type capacitor, in addition to the same effects as those of the second embodiment, the resin frame 7 can be easily positioned with respect to the resin case 1 and the assemblability can be improved. An effect is obtained.

  Further, the appearance after filling with the filler 4 is the same as in FIG. 5, but the engaging portion 7 b is embedded in the filler 4 to prevent detachment. Omission is more reliably prevented.

Embodiment 4 FIG.
Next, FIG. 10 is a perspective view showing a case mold type capacitor according to Embodiment 4 of the present invention, FIG. 11 is a sectional view of the case mold type capacitor of FIG. 10, and FIG. 12 is in the process of manufacturing the case mold type capacitor of FIG. It is a perspective view which shows the state (before filling of the filler 4).

  In the fourth embodiment, a pair of adjacent component positioning portions (positioning holes) 7 c for positioning the adjacent component 5 with respect to the case mold type capacitor is provided in the resin frame 7. The adjacent component positioning portions 7c are disposed on both sides of the recess 7a.

  The adjacent component 5 is provided with a pair of positioning pins 5b that engage with the adjacent component positioning portion 7c. The adjacent component 5 is positioned with respect to the case mold type capacitor by fitting the positioning pin 5b to the adjacent component positioning portion 7c. Other configurations and manufacturing methods are the same as those in the third embodiment.

  In such a case mold type capacitor, in addition to the same effect as that of the third embodiment, an effect that the positional accuracy of the adjacent component 5 can be improved is obtained. Moreover, since the positioning part 7c for adjacent parts is arrange | positioned in the resin-made case 1, compared with the case where a positioning structure is provided out of the resin-made case 1, the whole can be comprised compactly.

Embodiment 5 FIG.
Next, FIG. 13 is a perspective view showing a case mold type capacitor according to Embodiment 5 of the present invention, and FIG. 14 is a perspective view showing a state during the manufacture of the case mold type capacitor of FIG.

  In the fifth embodiment, the resin frame 7 is rotatably connected to the resin case 1 via the hinge portion 9. Further, a protrusion 1 b is provided on the outer surface of the resin case 1. The resin frame 7 is provided with a claw 7d that is hooked on the protrusion 1b. The resin case 1 is not provided with the frame positioning portion 1b. Other configurations are the same as those of the third embodiment.

  When manufacturing the case mold type capacitor of the fifth embodiment, as shown in FIG. 14, the capacitor element 2 is set in the resin case 1 with the resin frame 7 unfolded. Thereafter, the resin frame 7 is rotated on the capacitor element 2, and the claw 7 d is hooked on the protrusion 1 b, thereby fixing the resin frame 7 to the resin case 1. At this time, the recess 7 a is positioned with respect to the resin case 1. Then, the filler 4 is filled into the resin case 1.

  In such a case mold type capacitor, since the resin case 1 and the resin frame 7 are integrated in advance, the number of components and the number of assembly steps can be reduced, and the cost can be reduced.

The adjacent part positioning portion 7c according to the fourth embodiment may be provided on the resin frame 7 according to the fifth embodiment.
Moreover, in Embodiment 1-5, although only one recessed part 4a, 7a was provided, you may provide two or more recessed parts in a mold part.
Furthermore, in Embodiment 1-5, although the planar shape of the recessed parts 4a and 7a was made into the rectangle, it is not limited to this, It is good also as another shape, for example, a circle.
In the first to fifth embodiments, the bottom surfaces of the recesses 4a and 7a are flat surfaces, but may be curved surfaces.

  DESCRIPTION OF SYMBOLS 1 Resin case, 1a opening, 1b Frame positioning part, 2 Capacitor element, 4 Filler, 5 Adjacent part, 7 Resin frame, 7a Recessed part, 7b Engagement part, 7c Adjacent part positioning part, 8 Mold part

Claims (4)

A resin case with an opening,
A capacitor element housed in the resin case, and a mold part having a resin filler filled in the resin case,
The sealing surface of the mold part is formed with a recess into which a part of the components arranged adjacent to each other is inserted ,
The mold part further has a resin frame provided with the recess,
The resin frame has a bottom surface,
A case mold type capacitor in which the filler is also filled between the bottom surface of the resin frame and the capacitor element . The resin case is provided with a frame positioning portion for positioning the resin frame,
Wherein the resin frame, case mold type capacitor according to claim 1, wherein the engaging portion engaged with the positioning portion for the frame is provided. The case mold type capacitor according to claim 1 or 2 , wherein the resin frame is provided with a positioning part for adjacent parts for positioning the adjacent parts. A resin case with an opening,
A capacitor element housed in the resin case, and
Mold part having a resin filler filled in the resin case
With
The sealing surface of the mold part is formed with a recess into which a part of the components arranged adjacent to each other is inserted,
The mold part further has a resin frame provided with the recess,
The resin frame, Luque Sumorudo type capacitor is pivotally connected to said resin case.

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