JP5818754B2 - DC-DC converter device - Google Patents

Description

  The present invention relates to a DC-DC converter device.

  An electric vehicle and a plug-in hybrid vehicle include an inverter device for driving a motor with a high-voltage storage battery for driving power and a low-voltage storage battery for operating auxiliary equipment such as a vehicle light and a radio. Such a vehicle is equipped with a DC-DC converter device that performs power conversion from a high voltage storage battery to a low voltage storage battery or power conversion from a low voltage storage battery to a high voltage storage battery.

  The DC-DC converter device includes a high-voltage side switching circuit that converts a high-voltage direct current into an alternating current, a transformer that converts the alternating high voltage into an alternating low voltage, and a low-voltage switching circuit that converts the low-voltage alternating voltage into a direct current. It has. In addition, capacitor elements having different functions such as a smoothing capacitor element and a noise filter capacitor element for smoothing an input current input to the high voltage side switching circuit are provided.

  As a conventional DC-DC converter device, a structure in which electronic components constituting a transformer, a high-voltage side switching circuit and a low-voltage side switching circuit are mounted on a wiring board, and the wiring board is fixed to a cooling block having heat radiation fins Is known (see, for example, Patent Document 1).

JP 2005-143215 A

  In the above-mentioned patent document 1, since all the electronic components constituting the DC-DC converter device are arranged on one wiring board, a large storage space is required. In order to obtain a large output, it is necessary to use a large-capacity electronic component such as a capacitor element. However, this increases the weight of the electronic component and decreases the vibration resistance or impact resistance. .

The DC-DC converter device of the present invention includes a transformer, a resonant capacitor element connected to the primary side of the transformer, a high-voltage side switching circuit unit connected to the primary side of the transformer via the resonant capacitor element, A low-voltage side switching circuit unit connected to the secondary side, and a case member that houses the transformer, the resonant capacitor element, the high-voltage side switching circuit unit, and the low-voltage side switching circuit unit.
The high-voltage side switching circuit section smoothes DC power input to the bridge circuit board having a plurality of power semiconductor modules, a wiring to which each switching element of the plurality of power semiconductor modules is connected to the bridge circuit, and the bridge circuit A smoothing capacitor element and a noise filter capacitor element.
The smoothing capacitor element and the noise filter capacitor element are housed in a capacitor case, a plurality of power semiconductor modules are disposed on the bottom inner surface of the case member, the capacitor case is disposed above the power semiconductor module, and the bridge circuit board is a capacitor In a direction crossing the bottom of the case, it is arranged so as to straddle the capacitor case and the power semiconductor module.

  According to the present invention, since the bridge circuit board is raised and arranged in the direction intersecting the bottom of the capacitor case, the storage space can be reduced. Further, since the smoothing capacitor element and the noise filter capacitor element are housed in the capacitor case, it is possible to improve vibration resistance or shock resistance.

The external appearance perspective view of a power converter device provided with the DC-DC converter apparatus of this invention. The figure which shows one Embodiment of the circuit structure of a DC-DC converter apparatus. The disassembled perspective view of the DC-DC converter apparatus as one embodiment of this invention. FIG. 4 is an exploded perspective view of a high voltage module housed in the DC-DC converter device illustrated in FIG. 3. FIG. 3 is a cross-sectional view of the high voltage module shown in FIG. FIG. 5 is an external perspective view of the capacitor module illustrated in FIG. 4. The top view of a capacitor | condenser module.

[Power converter]
Hereinafter, an embodiment of a DC-DC converter device of the present invention will be described with reference to the drawings.
FIG. 1 is an external perspective view of a power conversion device including the DC-DC converter device of the present invention.
The power conversion device 1 is obtained by integrating the DC-DC converter device 100 and the inverter device 200. FIG. 1 shows the DC-DC converter device 100 and the inverter device 200 in a separated state. The DC-DC converter device 100 is fixed to the upper surface side of the case of the inverter device 200 with a plurality of bolts.

  The power conversion device 1 is applied to a vehicle such as an electric vehicle or a plug-in hybrid vehicle, and the inverter device 200 drives a traveling motor with electric power from an on-vehicle high voltage storage battery. The vehicle is equipped with a low voltage storage battery for operating an auxiliary machine such as a light or a radio, and the DC-DC converter device 100 performs power conversion from a high voltage storage battery to a low voltage storage battery or a high voltage from a low voltage storage battery. Perform power conversion to storage battery.

  The case 201 of the inverter device 200 is formed with a cooling flow path 204 through which a refrigerant flows in order to cool the heat generating components in the inverter device 200. The refrigerant flows into the flow path from the inlet pipe 202 and flows out from the outlet pipe 203. On the other hand, the bottom surface of the case member 101 of the DC-DC converter device 100 is fixed so as to face the inverter device 200. In the DC-DC converter device 100, the bottom surface portion of the DC-DC converter device 100 also constitutes a part of the cooling channel 204 when the inverter device 200 is fixed. That is, it is a wall surface on the upper surface side of the cooling channel 204. As a result, the DC-DC converter device 100 is directly cooled by the refrigerant flowing through the cooling flow path 204. A seal (not shown) such as an O-ring is provided between the bottom surface portion of the case member 101 of the DC-DC converter device 100 and the top surface portion of the inverter device 200 so that the refrigerant in the cooling flow path 204 does not leak out. Is provided.

In the present embodiment, a mixture of antifreeze and water in a ratio of 1: 1 is generally suitable as the refrigerant. However, other refrigerants can be used.
The cooling device that cools the inverter device 200 and the DC-DC converter device 100 is shown as an embodiment. In addition, a cooling device using a cooling gas such as air may be used. Absent. Moreover, the inverter apparatus 200 shows one Embodiment of the power converter device comprised with the DC-DC converter apparatus 100, A shape, a structure, etc. can be applied with various deformation | transformation.

[Circuit Configuration of DC-DC Converter Device]
Next, the DC-DC converter device 100 will be described. FIG. 2 is a diagram showing an embodiment of a circuit configuration of the DC-DC converter device 100.
As shown in FIG. 2, a DC-DC converter device 100 shown as an embodiment of the present invention is a bidirectional DC-DC converter. The DC-DC converter device 100 includes a high voltage side switching circuit unit 106, a low voltage side switching circuit unit 150, and a transformer (Tr) provided between the high voltage side switching circuit unit 106 and the low voltage side switching circuit unit 150. 104). The high voltage side switching circuit unit 106 and the low voltage side switching circuit unit 150 are switch-controlled by a control circuit unit CRT provided on the control circuit board 108.

  The high voltage side switching circuit unit 106 includes MOSFETs (switching elements) H1 to H4 connected as an H bridge type switching circuit, a smoothing capacitor Cn, noise filter capacitor elements Cy1 and Cy2, a resonance capacitor element Cr, A coil Lr, a choke coil Lc, a shunt resistor Ri, a gate resistor R, and an IGBT switch Ho are provided.

A smoothing capacitor element Cn and noise filter capacitor elements Cy1 and Cy2 for smoothing an input current input to the high voltage side switching circuit unit 106 are connected to the input side of the H-bridge type switching circuit.
On the primary side of the main transformer Tr, a resonance capacitor element Cr and a resonance coil Lr constituting a resonance circuit are connected in series.
A shunt resistor Ri and a choke coil Lc are connected to the IGBT switch H0. The control circuit unit CTR can measure a potential difference between both ends of the shunt resistor Ri and detect a high-voltage current. The choke coil Lc is disposed between the high voltage power supply HV (−) and the shunt resistor Ri and functions as a normal mode filter.
A gate resistor R is connected to the gate terminals of the switching elements H1 to H4 and S1 to S4 made of MOSFET.

  In switching control, zero voltage switching (ZVS) is performed at a high switching frequency (100 kHz) using an LC circuit (Cr, Lr) to reduce switching loss and improve conversion efficiency. In correspondence with bidirectional operation (step-down mode operation and step-up mode operation), an IGBT switch H0 is provided as a changeover switch that is turned on during step-down mode operation and turned off during step-up mode operation.

  The low voltage side switching circuit unit 150 includes MOSFETs (switching elements) S3 and S4 constituting a synchronous rectifier circuit and switching elements S1 and S2 constituting an active clamp circuit in order to ensure a high output on the low voltage side. , MOSFETs S1 and S2, gate resistors R, reactors L1 and L2 configured as a full-wave rectification type double current (current doubler), a resistor Rs, and a capacitor Co.

  High output is achieved by arranging the small-sized reactors (L1, L2) of the switching circuit and the smoothing reactor in parallel so as to have symmetry. As described above, by arranging the small reactors in two circuits, it is possible to reduce the size of the entire DC-DC converter device as compared with the case where one large reactor is disposed. In addition, an active clamp circuit using MOSFETs S1 and S2 having freewheeling diodes is provided to suppress the occurrence of surge voltage during switching and reduce the breakdown voltage of the switching element, thereby reducing the breakdown voltage of circuit components. The device is downsized.

[Structure of DC-DC converter device]
FIG. 3 is an exploded perspective view of a DC-DC converter device as an embodiment of the present invention.
The DC-DC converter device 100 includes a case member 101 made of metal (for example, made of aluminum die casting).
The case member 101 houses the main transformer 104, the inductor element 105, the high voltage module 106 constituting the high voltage side switching circuit unit, the low voltage side switching circuit unit 150, and the like.
The AC bus bar 110 is fixed with bolts to a plurality of support portions (not shown) protruding upward from the bottom surface portion of the case member 101, and electrically connects the high voltage module 106 and the main transformer 104. The main heat generating components are the main transformer 104, the inductor element 105, and the switching elements H1 to H4 and S1 to S4.

  When the correspondence with the circuit diagram of FIG. 2 is described, the main transformer 104 corresponds to the main transformer Tr, and the inductor element 105 corresponds to the reactors L1 and L2 of the current doubler.

  As will be described later, the high voltage module 106 includes power semiconductor modules 35 and 36 that are switching elements H1 to H4, a capacitor module 10 that will be described later, and a wiring that connects the switching elements H1 to H4 to a bridge circuit. A substrate, ie, a bridge circuit board 40 is included. A choke coil Lc and a shunt resistor Ri are mounted on the high voltage circuit board 40. That is, on the high voltage circuit board 40, electronic components other than the switching elements H1 to H4 are mounted among the electronic components in the region surrounded by the dotted line in FIG.

  On the low-voltage circuit board 107, switching elements S1 and S2 of the active clamp circuit of FIG. 2 and switching elements S3 and S4 of the synchronous rectification circuit are also mounted. Electronic components in the region surrounded by the dotted line in FIG. Are all implemented. Although not shown, the switching elements S1 to S4 mounted on the low-voltage circuit board 107 have one surface pressed against the metal substrate, and the other surface of the metal substrate is in close contact with the bottom of the metal case member 101. Is fixed.

  The main transformer 104, the inductor element 105, the high voltage module 106, and the low voltage circuit board 107 are fixed to the bottom of the case member 101, and a metal is formed on the main transformer 104, the inductor element 105, and the low voltage circuit board 107. A base plate 109 made of metal is attached. The base plate 109 has a size and shape that does not cover the high voltage module 106. In the case member 101, the base plate 109 is fixed to a boss portion (not shown) provided at the peripheral edge portion of the bottom portion of the case member 101 by a fastening member such as a bolt. As a result, heat generated from components that generate a large amount of heat, such as the low-voltage circuit board 107 (particularly the switching elements S1 to S4), the main transformer 104, and the inductor element 105, is radiated from the case member 101 via the base plate 109. And cooled.

A control circuit board 108 is disposed on the base plate 109.
The control circuit board 108 is disposed substantially parallel to the bottom of the case member 101. Since the base plate 109 is not interposed between the control circuit board 108 and the high voltage module 106, electrical connection between the control circuit board 108 and the high voltage module 106 is facilitated. The control circuit board 108 is provided with a control circuit unit CTR for controlling the switching elements H1 to H4 provided in the high voltage side switching circuit unit 106 and the switching elements S1 to S4 provided in the low voltage side switching circuit unit 150. ing. The control circuit board 108 is fixed to a convex portion formed on the upper surface of the metal base plate 109 by a fastening member such as a bolt.

The base plate 109 has an effect of increasing the mechanical resonance frequency of the control circuit board 108.
In other words, screwing portions for fixing the control circuit board 108 to the base plate 109 are arranged at short intervals to shorten the distance between the support points of the control circuit board 108. As a result, the resonance frequency of the control circuit board 108 can be increased with respect to the vibration frequency transmitted from the engine or the like, thereby making it less susceptible to vibration.

  The base plate 109 also functions as a shielding member for radiant heat from the heat-generating components provided at the bottom of the case member 101, and also functions as a shield for shielding switching radiation noise from the switching elements H1 to H4 and S1 to S4. To do.

  A case cover 102 is attached to the opening of the case member 101 by a fastening member such as a bolt. The case cover 102 is formed of a metal member such as aluminum, and closes the inside of the case member 101 in which the base plate 109 and the control circuit board 108 are accommodated.

A female screw 101 a is provided on the side surface of the bottom portion of the case member 101. A fastening member for attaching to the chassis or the like of the vehicle body having the same potential as the (−) terminal of the low voltage storage battery is screwed into the female screw 101a. For this reason, the internal thread 101a has a function as a GND terminal.
Further, a male screw 120 that penetrates the bottom of the case member 101 and protrudes from the inside is provided. The male screw 120 is insulated from the case member 101 and is fastened to a portion having the same potential as the (+) terminal of the low voltage storage battery. For this reason, the male screw 120 has a function as a positive electrode terminal.

  The signal connector 121, the (+) electric wire 122, and the (−) electric wire 123 are connected to the inverter device 200, and the signal connector and the high voltage connector (not shown) of the inverter device 200 are electrically connected to the vehicle control device and the high voltage storage battery, respectively. Connected.

[High voltage module]
4 is an exploded perspective view of the high voltage module 106 housed in the DC-DC converter device shown in FIG.
The high voltage module 106 includes a high voltage circuit board 40, a capacitor module 10, power semiconductor modules 35 and 36, a metal base (base member) 30, a leaf spring 33, and a temperature sensor 34. The power semiconductor module 35 corresponds to the MOSFETs H1 to H4 in FIG. 2, and the power semiconductor module 36 corresponds to the IGBT switch H0 in FIG.

  The metal base 30 is formed by, for example, aluminum die casting or the like, and is fixed to a bottom inner surface of the case member 101 by a fastening member such as a screw. The metal base 30 has a recess 30a formed in the upper part, and power semiconductor modules 35 and 36 are disposed in the recess 30a. The power semiconductor modules 35 and 36 are pressed against each other by a leaf spring 33 disposed above the power semiconductor modules 35 and 36, and are in contact with the bottom surface of the concave portion of the metal base 30 through an insulating sheet 31 having good thermal conductivity. The leaf spring 33 is fixed to the bottom of the case member 101 by a fastening member such as a screw.

  By using a material having high thermal conductivity such as A6063 as the metal base 30, for example, a general aluminum die casting material such as ADC12 type can be used for the case member 101. Thereby, compared with the case where the metal base 30 is not attached and the entire case member 101 is formed of a material having high thermal conductivity, the material cost can be reduced.

  Thermal conductive grease (not shown) is applied between the inner bottom surface of the case member 101 and the metal base 30, between the metal base 30 and the insulating sheet 31, and between the insulating sheet 31 and the power semiconductor modules 35 and 36. ing. As described above, the bottom surface portion of the case member 101 forms the cooling flow path 204 together with the inverter device 200, and the heat generated from the heat generating members such as the power semiconductor modules 35 and 36 is a refrigerant circulating in the cooling flow path 204. Cooled by.

  The temperature sensor 34 is fixed to the metal base 30 by a fastening member such as a screw. The temperature sensor 34 is connected to the control circuit board 108 shown in FIG. 3 by a harness. The temperature sensor 34 detects the temperature of the power semiconductor modules 35 and 36 via the metal base 30 and transmits the detection signal to the control circuit unit CTR configured on the control circuit board 108. The control circuit unit CTR determines whether or not an abnormality has occurred based on the temperature information transmitted from the temperature sensor 34. If it is determined that there is an abnormality, the output from the DC-DC converter device 100 is limited. Perform protection control.

FIG. 5 is a cross-sectional view of the high voltage module 106 shown in FIG. However, the resin 25 is not shown in FIG.
The capacitor module 10 is disposed above the leaf spring 33 that press-contacts the power semiconductor modules 35 and 35 with a slight gap from the leaf spring 33. The capacitor module 10 includes a capacitor case 11 that accommodates capacitor elements 12, 13A, 13B, and 14, and a metal base is formed by a fastening member such as a screw through a plurality of mounting portions 11a provided on the side of the capacitor case 11. 30.
That is, the metal base 30 is disposed in close contact with the inner surface of the bottom portion of the case member 101 via thermal conductive grease, and the power semiconductor module 35 is disposed in the recess 30a of the metal base 30 via the insulating sheet 31 having good thermal conductivity. 36 is arranged. Thermally conductive grease is applied to and between the insulating sheet 31 and the power semiconductor module 35, 36 between the bottom surface and the insulating sheet 31 in the recess 30a of the metal base 30. The power semiconductor modules 35 and 36 are pressed by the leaf spring 33 and are pressed against the insulating sheet 31. The bottom surface of the capacitor case 11 of the capacitor module 10 is disposed above the leaf spring 33 with a gap from the leaf spring 33.

Although details will be described later, a smoothing capacitor element 12 (corresponding to Cn in FIG. 2; the same applies hereinafter), noise filter capacitor elements 13A and 13B (Cy1, Cy2), and resonance are provided in the capacitor case 11 of the capacitor module 10. A capacitor element 14 (Cr) is accommodated. The plurality of capacitor elements are solidified with a sealing resin 25 filled in the capacitor case 11.
Referring also to FIG. 4, a high-voltage circuit board 40 is provided on one side surface extending in the longitudinal direction of the capacitor case 11 (the direction perpendicular to the paper surface of FIG. 5 and the left-right direction of FIG. 7). That is, the high voltage circuit board 40 is attached to the metal base 30 by a fastening member such as a screw. The high-voltage circuit board 40 is arranged so as to rise substantially perpendicularly to the bottom of the case member 101, and the capacitor case 11 is positioned from a position corresponding to the power semiconductor modules 35 and 36 arranged in the recess 30 a of the metal base 30. It is provided across the position of the upper end of the side surface. The high voltage circuit board 40 is dimensioned from the vicinity of the lower end surface of the metal base 30 to the upper end portion of the capacitor case 11, thereby increasing the area of the high voltage circuit board 40 and effectively utilizing the internal space of the case member 101. doing.

  As shown in FIG. 5, the lead terminal 35 a of the power semiconductor module 35 is connected to the high voltage circuit board 40. Although not shown in FIG. 5, twelve lead terminals 36 a (see FIG. 4) of the four power semiconductor modules 36 are also connected to the high voltage circuit board 40. A lead terminal guide 50 shown in detail in FIG. 4 is attached to the surface of the high voltage circuit board 40 facing the power semiconductor modules 35 and 36. The lead terminals 35a and 36a of the power semiconductor modules 35 and 36 are inserted into the terminal holes 40a provided in the high voltage circuit board 40 and soldered.

  The lead terminal guide 50 has a function as a guide for the lead terminals 35a and 36a when the lead terminals 35a and 36a of the power semiconductor modules 35 and 36 are inserted into the terminal holes 40a of the high-voltage circuit board 40. Referring to FIG. 4, the lead terminal guide 50 extends with a length substantially equal to the longitudinal width of the high voltage circuit board 40, and guides the 15 lead terminals 35a, 36a of the power semiconductor modules 35, 36. It has 15 half-cone guide surfaces. The lead terminals 35 a and 36 a of the power semiconductor modules 35 and 36 can be easily inserted into the terminal holes 40 a along the conical guide surface of the lead terminal guide 50. For this reason, even if there is a slight displacement between the lead terminals 35a and 36a of the power semiconductor modules 35 and 36 and the terminal holes 40a of the high-voltage circuit board 40, the lead terminals 35a and 36a are caught. And can work efficiently.

As described above, the switching elements H1 to H4 of the four power semiconductor modules 36 connected to the high voltage circuit board 40 are connected as an H bridge circuit by wiring provided on the high voltage circuit board 40.
Referring to FIG. 4, a connector 41 having a plurality of connector pins on the upper side is mounted on the high voltage circuit board 40. Each connector pin of the connector 41 is provided in a pin hole provided in a control circuit board 108 (see FIG. 3) which is arranged substantially parallel to the bottom of the case member 101 and arranged substantially perpendicular to the high voltage circuit board 40. Is inserted and soldered. The control circuit unit CTR (see FIG. 2) provided on the control circuit board 108 and the power semiconductor modules 35 and 36 are electrically connected by a connector 41. Switching control and power semiconductors of the power semiconductor module 35 are performed by the control circuit unit CTR. On / off control of the module 36 is performed.

  A choke coil 42 (Lc in FIG. 2) is mounted on the high voltage circuit board 40. The choke coil 42 is electrically connected between the (+) or (−) of the high voltage power supply and the H bridge circuit, and functions as a normal mode filter.

  As shown in FIG. 2, a gate resistor R electrically connected between the gate terminals of the power semiconductor modules 35 and 36 and the control circuit board 108 is mounted on the high voltage circuit board 40. A gate voltage is output from the control circuit board 108 to the gate resistor R. By providing the gate resistor R on the high voltage circuit board 40 without providing it on the control circuit board 108 and arranging it near the gate terminal, malfunctions due to the influence of external noise can be suppressed.

  In addition to the gate resistor R, a high-voltage circuit component (not shown) is mounted on the high-voltage circuit board 40. Circuit components to be mounted include switching circuit components, circuit components for monitoring high voltage currents and voltages, and the like.

A plurality of bus bars indicated by reference numerals 15, 15 </ b> A, and 16 to 20 in FIG. 2 are attached to the capacitor module 10. These bus bars include the smoothing capacitor element 12, the noise filter capacitor elements 13A and 13B (Cy1, Cy2), and the resonance capacitor element 14 (Cr) housed in the capacitor case 11, the high voltage circuit board 40, or a predetermined one. Used to connect to terminals.
Next, details of the capacitor module 10 will be described.

[Capacitor module]
6 is an external perspective view of the capacitor module 10 illustrated in FIG. 4, and FIG. 7 is a plan view of the capacitor module 10. 6 and 7, the resin 25 is not shown.
The capacitor case 11 is formed of a conductive metal member, and has an outer peripheral side wall that rises substantially perpendicularly to the bottom. The capacitor case 11 is partitioned into three capacitor storage chambers 11b, 11c, and 11d by the inner surface of the outer peripheral side wall. In the capacitor storage chamber 11b located in the center, three smoothing capacitor elements 12 (corresponding to Cn in FIG. 2) are connected and stored in parallel. The three smoothing capacitor elements 12 have the same shape and the same size, and are arranged linearly in the width direction of the capacitor case 11 (vertical direction in FIG. 7).

  Two capacitor elements 13A and 13B (Cy1, Cy2) for noise filter are stored in the capacitor storage chamber 11c disposed on one side of the capacitor storage chamber 11b. One of the two noise filter capacitor elements 13 is for (+) polarity, and the other is for (−) polarity. The two elements have the same shape and size, and are longitudinally perpendicular to the width direction of the capacitor case 11. It is arranged linearly in the direction (left-right direction in FIG. 7). Four resonant capacitor elements 14 (Cr) are connected and stored in parallel in the capacitor storage chamber 11d disposed on the other side of the capacitor storage chamber 11b. The four resonant capacitor elements 14 have the same shape and the same size, and are linearly arranged in the longitudinal direction (left-right direction in FIG. 7) orthogonal to the width direction of the capacitor case 11.

  The three smoothing capacitor elements 12 housed in the capacitor housing chamber 11b ensure a large capacity with the three capacitor elements, and can increase the output of the DC-DC converter device. In FIG. 7, the (+) terminal of the smoothing capacitor element 12 is located on the right side, and the (−) terminal is located on the left side. In FIG. 7, the (+) terminal of the smoothing capacitor element 12 is connected in parallel to an end 15 a that is bent from the right side of the fourth bus bar 15 to the case bottom. The fourth bus bar 15 extends across the width direction of the capacitor case 11, and the tip portion 15 b protrudes toward the high voltage circuit board 40. The tip 15b is electrically connected to the high voltage circuit board 40 (see FIG. 5).

  In FIG. 7, the (−) terminal of the smoothing capacitor element 12 is connected in parallel to an end 18 a that is bent from the left side of the fifth bus bar 18 to the case bottom. The fifth bus bar 18 (see FIGS. 5 and 7) extends across the width direction of the capacitor case 11, and its tip end 18 b protrudes toward the high voltage circuit board 40 to electrically connect to the high voltage circuit board 40. Connected (see FIG. 5).

  One of the two noise filter capacitor elements 13A and 13B housed in the capacitor housing chamber 11c has a (+) terminal connected to the first bus bar 15A. The first bus bar 15A is connected to the third terminal portion 15c of the fourth bus bar 15 by a fastening member such as a screw. The (+) electric wire 122 shown in FIG. 3 is also connected to the first bus bar 15A and the fourth bus bar by a fastening member such as a screw connecting the first bus bar 15A and the third terminal portion 15c of the fourth bus bar 15. 15 is electrically connected.

  The other noise filter capacitor element 13 </ b> B has a (−) terminal connected to the second bus bar 16. One end 16a of the second bus bar 16 is connected to a (−) electric wire 123 shown in FIG. 3 by a fastening member such as a screw. The (+) electric wire 122 and the (−) electric wire 123 correspond to the terminals HV + and HV− in FIG. 2, respectively, and are electrically connected to the high voltage storage battery via the inverter device 200. The second bus bar 16 extends across the width direction of the capacitor case 11, and the tip end portion 16 b protrudes toward the high voltage circuit board 40 and is electrically connected to the high voltage circuit board 40.

  The (−) terminal (upper side in FIG. 7) of the noise filter capacitor element 13A and the (+) terminal (upper side in FIG. 7) of the noise filter capacitor element 13B are connected by a third bus bar 17. One end portion 17a of the third bus bar 17 is overlaid on a mounting portion 11a (see FIG. 6) formed on a side portion of the capacitor case 11, and is fixed to the metal base 30 together with the capacitor case 11 by a fastening member such as a screw. Connected to the case member 101. As a result, the third bus bar 17 has the same GND potential as that of the case member 101, and the noise filter capacitor elements 13A and 13B function as noise filter elements.

  A sixth bus bar 19 and a seventh bus bar 20 are electrically connected to the four resonant capacitor elements 14 stored in the capacitor storage chamber 11d. One end portion of the sixth bus bar 19 extends to the high voltage circuit board 40 side and is electrically connected to the high voltage circuit board 40. Further, the terminal portion 20a of the seventh bus bar 20 is electrically connected to the resonance coil Lr shown in FIG.

  Further, an eighth bus bar 21 is attached to the capacitor case 11. The eighth bus bar 21 extends across the width direction of the capacitor case 11, and one end 21 a thereof is electrically connected to the high voltage circuit board 40. The other terminal portion 21b of the eighth bus bar 21 is electrically connected to the AC bus bar 110 shown in FIG. Therefore, the high voltage circuit board 40 and the main transformer 104 are connected via the eighth bus bar 21 and the AC bus bar 110. Therefore, the eighth bus bar 21 is not a bus bar for connecting to any capacitor element housed in the capacitor case 11.

  The AC bus bar 110 is composed of two conductors (not shown) of input and output insulated with resin. The high-voltage current converted into alternating current by the H-bridge circuit of the high-voltage circuit board 40 passes from the sixth bus bar 19 through the resonant capacitor element 14 and from the seventh bus bar 20 to the resonant coil Lr and the AC bus bar shown in FIG. It flows to the primary side coil of the main transformer 104 via the input side conductor 110. The current passing through the primary side coil of the main transformer 104 passes through the conductor on the output side of the AC bus bar 110, passes through the eighth bus bar 21, and returns to the H bridge circuit in the high voltage module.

According to one embodiment of the present invention, the following effects are obtained.
(1) The high voltage circuit board 40 is arranged so as to rise substantially vertically to the bottom of the case member 101, in other words, the bottom of the capacitor case 11, and the control circuit board 108 is almost perpendicular to the high voltage circuit board 40. Arranged. For this reason, the area of the case member 101 can be reduced. The height of the case member 101 accommodates components such as the main transformer 104 and needs to be equal to or higher than the height of these components. For this reason, by arranging the high voltage circuit board 40 so as to rise substantially perpendicularly to the bottom of the case member 101, the space of the case member 101 can be used effectively, so that the case member 101, in other words, the DC-DC converter device. The whole can be reduced in size.

(2) The smoothing capacitor element 12, the noise filter capacitor elements 13A and 13B, and the resonance capacitor element 14 were accommodated in capacitor chambers 11b, 11c, and 11d provided in the capacitor case 11, respectively. For this reason, vibration resistance or impact resistance can be improved.

(3) Each of the smoothing capacitor element 12 and the resonant capacitor element 14 is constituted by a plurality of capacitor elements. For this reason, a small capacitor element can be used, and the capacitor case 11, that is, the entire DC-DC converter device can be downsized.

(4) The area of the high voltage circuit board 40 is increased as the width (height) from the vicinity of the lower end surface of the metal base 30 to the upper end portion of the capacitor case 11. Thereby, the internal space of the case member 101 is effectively utilized.

(5) The gate resistor R connected to the gate terminal of the power semiconductor module 35 is provided on the high voltage circuit board 40 disposed in the vicinity of the capacitor module 10. For this reason, as compared with the case where the gate resistor R is provided on the control circuit board 108, malfunction due to the influence of noise from the outside can be suppressed.

(6) A metal base plate 109 is disposed on the low voltage circuit board 107, the main transformer 104, and the inductor element 105. As a result, heat generated from components that generate a large amount of heat, such as the low-voltage circuit board 107, the main transformer 104, and the inductor element 105, can be dissipated from the case member 101 via the base plate 109 and cooled.

(7) The screwing portions for fixing the control circuit board 108 to the base plate 109 are arranged at short intervals to shorten the distance between the support points of the control circuit board 108. As a result, the resonance frequency of the control circuit board 108 can be increased with respect to the vibration frequency transmitted from the engine or the like, thereby making it less susceptible to vibration.
(8) In addition, the base plate 109 functions as a shielding member for radiant heat from the heat generating components provided at the bottom of the case member 101, and shields switching radiation noise from the switching elements H1 to H4 and S1 to S4. Also works.

(9) The lead terminal guide 50 is attached to the surface where the high voltage circuit board 40 faces the power semiconductor modules 35 and 36. Thereby, the efficiency of the process of inserting each lead terminal of the power semiconductor modules 35 and 36 into the terminal hole of the high voltage circuit board 40 can be improved.

(10) A material having high thermal conductivity is used as the metal base 30, and a general aluminum die casting material is used as the case member 101. Thereby, compared with the case where the metal base 30 is not attached and the entire case member 101 is formed of a material having high thermal conductivity, the material cost can be reduced.

  In the above-described embodiment, the capacitor case 11 is illustrated as a structure in which the smoothing capacitor element 12, the noise filter capacitor elements 13A and 13B, and the resonance capacitor element 14 are accommodated. However, the resonant capacitor element 14 may be arranged at a different position in the case member 101 or housed in another case.

  In the above embodiment, each of the smoothing capacitor element 12 and the resonance capacitor element 14 is constituted by a plurality of capacitor elements. However, one or both of the smoothing capacitor element 12 and the resonant capacitor element 14 may be constituted by a single capacitor element.

  In the above embodiment, the resonance coil Lr is exemplified as a structure that is not housed in the capacitor case 11. However, the resonance coil Lr can be accommodated in the capacitor case 11. As described above, the type and number of electronic components stored in the capacitor case 11 can be arbitrarily changed. In short, at least the smoothing capacitor element 12 and the noise filter capacitor element are included in the capacitor case 11. What is necessary is just to accommodate 13A, 13B.

  In the above embodiment, the power semiconductor modules 35 and 35 are exemplified as a structure that conducts heat to the case member 101 via the metal base 30, but heat conduction is performed to the case member 101 without using the metal base 30. May be.

In the above embodiment, the outer peripheral side wall of the capacitor case 11 is raised substantially perpendicular to the bottom, and the high voltage circuit board 40 is attached via the metal case 30 so as to face one side wall of the outer peripheral side wall. It was illustrated as a structure.
However, the outer peripheral side wall of the capacitor case 11 and / or the high-voltage circuit board 40 may be raised with respect to the bottom of the high-voltage circuit board 40, and is not necessarily limited to the bottom of the high-voltage circuit board 40. There is no need to stand up vertically. Further, the high voltage circuit board 40 may not have a structure attached to the capacitor case 11.

  In the above embodiment, the lead terminal guide 50 for guiding the lead terminals of the power semiconductor modules 35 and 36 is provided on the high voltage circuit board 40, but the lead terminal guide 50 is not necessarily required.

The number and arrangement of the smoothing capacitor element 12, the noise filter capacitor elements 13A and 13B, and the resonance capacitor element 14 housed in the capacitor case 11 are not limited to the above-described embodiment, and may be arbitrarily set. It is possible to change.
The capacitor elements 12, 13, and 14 are connected to the high voltage circuit board 40, the first to seventh bus bars 15 to 20 for connecting to other electronic components, and the AC bus bar for connecting the high voltage circuit board 40 to the main transformer 104. The number, shape, mounting position, etc. of 110 can be arbitrarily changed.

  In the said one Embodiment, it illustrated as the DC-DC converter apparatus 100 which is integrated with the inverter apparatus 200 and comprises the power converter device 1. FIG. However, the DC-DC converter device 100 of the present invention can be integrated into a device other than the inverter device, or can be mounted alone at a predetermined mounting position. In the above-described embodiment, the power conversion device mounted on a vehicle such as an electric vehicle or a plug-in hybrid vehicle has been described as an example. However, the present invention is not limited thereto, and the power conversion device used for a vehicle such as a construction machine is used. It can also be applied to devices.

  In addition, the present invention can be applied in various modifications within the scope of the gist of the present invention. In short, a power semiconductor module having a plurality of power semiconductor elements, and the power semiconductor elements in a bridge circuit. A bridge circuit board having wiring to be connected, a smoothing capacitor element, and a noise filter capacitor element. The smoothing capacitor element and the noise filter capacitor element are housed in a capacitor case. What is necessary is just to raise and arrange | position so that it may straddle a capacitor | condenser case and a power semiconductor module in the direction which cross | intersects the bottom part.

10 Capacitor Module 11 Capacitor Case 12 Smoothing Capacitor Element (Cn)
13A, 13B Noise filter capacitor elements (Cy1, cy2)
14 Resonant capacitor element (Cr)
15, 15A, 16-21 Bus bar 30 Metal base (base member)
33 Leaf spring 35, 36 Power semiconductor module (H1-H4, H0)
40 High-voltage circuit board (bridge circuit board)
41 Connector 42 Choke coil (Lc)
50 Lead terminal guide 100 DC-DC converter device 101 Case member 102 Case cover 104 Main transformer (Tr)
105 Inductor element (L1, L2)
106 High voltage module (High voltage side switching circuit)
107 Low voltage circuit board 108 Control circuit board 109 Base board 110 AC bus bar 150 Low voltage side switching circuit part 200 Inverter device CTR Control circuit part R Gate resistance Ri Shunt resistance Lr Resonant coil

Claims (15)

With a transformer,
A resonant capacitor element connected to the primary side of the transformer;
A high-voltage side switching circuit connected to the primary side of the transformer via the resonant capacitor element;
A low voltage side switching circuit connected to the secondary side of the transformer;
A case member that houses the transformer, the resonant capacitor element, the high-voltage side switching circuit unit, and the low-voltage side switching circuit unit;
The high voltage side switching circuit unit includes a plurality of power semiconductor modules, a bridge circuit board having wiring for connecting the switching elements of the plurality of power semiconductor modules as a bridge circuit, and a direct current input to the bridge circuit A smoothing capacitor element that smoothes the current and a noise filter capacitor element,
Storing the smoothing capacitor element and the noise filter capacitor element in a capacitor case;
The plurality of power semiconductor modules are arranged on the bottom inner surface of the case member,
Placing the capacitor case above the power semiconductor module;
The DC-DC converter device according to claim 1, wherein the bridge circuit board is disposed so as to straddle the capacitor case and the power semiconductor module in a direction intersecting a bottom portion of the capacitor case. The DC-DC converter device according to claim 1,
The DC-DC converter device, wherein the smoothing capacitor element and the noise filter capacitor element are disposed in respective storage chambers formed on an inner surface of the capacitor case. The DC-DC converter apparatus according to claim 2,
The DC-DC converter device according to claim 1, wherein the resonant capacitor element is disposed in a storage chamber formed on an inner surface of the capacitor case. The DC-DC converter device according to claim 1,
Further, the power semiconductor module includes a base member disposed between the power semiconductor module and the bottom of the case member, and each power semiconductor module has one surface pressed against the base member. Converter device. The DC-DC converter device according to claim 1,
The DC-DC converter device further comprises a choke coil provided between the noise filter capacitor element and the bridge circuit, wherein the choke coil is provided on the bridge circuit board. The DC-DC converter device according to claim 1,
The DC-DC converter device further comprises a gate resistor electrically connected to a gate terminal of each power semiconductor module, and each of the gate resistors is provided on the bridge circuit board. The DC-DC converter device according to claim 6,
Further, on the upper part of the transformer and the low-voltage side switching circuit unit, at least a base plate arranged to open corresponding to the upper part of the bridge circuit board, and arranged on the upper part of the base plate, A DC-DC converter device comprising: a control circuit board having a control circuit unit connected to the bridge circuit board via the part of the base plate and outputting a gate voltage to the gate resistor. The DC-DC converter device according to claim 1,
Each of the power semiconductor modules has a lead terminal arranged toward the bridge circuit board side, and the bridge circuit board is provided with a through hole through which the lead terminal is inserted, and the bridge circuit board is connected to the power supply module. A DC-DC converter device, wherein a lead terminal guide for guiding the lead terminal to the through hole is provided on a surface facing the semiconductor module. The DC-DC converter device according to claim 1,
The DC-DC converter device characterized in that the smoothing capacitor element and the noise filter capacitor element housed in the capacitor case are plural in number. The DC-DC converter device according to claim 9,
Further, a first bus bar having one end connected to one of the capacitor elements for noise filter and the other end connected to the bridge circuit and an external device, and another one of the capacitor element for noise filter One end is connected between one end of the noise filter capacitor element and the second bus bar, one end of which is connected and the other end connected to the bridge circuit and the external device, And a third bus bar whose other end is connected to a portion having a GND potential. The DC-DC converter device according to claim 10,
Further, one end of each smoothing capacitor element is connected to one electrode, the other end is connected to the bridge circuit board, and one end is connected to the other electrode of each smoothing capacitor element. And a fifth bus bar having the other end connected to the bridge circuit board. The DC-DC converter apparatus according to claim 11,
The fourth bus bar has a third end connected to the first bus bar, and is a DC-DC converter device. The DC-DC converter apparatus according to claim 3,
The DC-DC converter device according to claim 1, wherein a plurality of the resonant capacitor elements housed in the capacitor case are arranged adjacent to each other. The DC-DC converter device according to claim 13,
A resonance coil that forms a resonance circuit with the resonance capacitor element; a sixth bus bar having one end connected to one electrode of each resonance capacitor element and the other end connected to the bridge circuit board; A DC-DC converter device comprising: a seventh bus bar having one end connected to the other electrode of each resonance capacitor element and the other end connected to the resonance coil. The DC-DC converter device according to claim 1,
An AC bus bar connected to the transformer, and an eighth bus bar having one end connected to the AC bus bar and the other end connected to the bridge circuit board, the eighth bus bar being the capacitor case The DC-DC converter apparatus characterized by being attached to.

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