JP5836604B2 - Module cooling structure - Google Patents

Description

  The present invention relates to a module cooling structure that cools a plurality of modules that perform transmission and reception, for example, in an antenna device.

There is an APAA (Active Phased Array Antenna) as an antenna device using a plurality of modules, and a flow path for guiding the refrigerant to be distributed to a plurality of modules mounted in parallel is formed in the housing.
On the other hand, according to Patent Document 1, in the module cooling structure, there is disclosed a structure of a module case having fins arranged so as to guide the air in the module case storing the module from the inlet to the outlet.

Special table 2009-512218 gazette

  However, the conventional module cooling structure requires a flow path for uniformly cooling a plurality of modules to be provided in the housing as a complicated component, so that the housing is large and difficult to downsize. was there. Moreover, the structure of the flow path formed in such a housing is complicated, resulting in an increase in the number of parts and a difficulty in weight reduction.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a module cooling structure that is reduced in size and weight.

Multiple modules cooling structure according to the present invention, and communicates with coolant inlet formed on one end side of the case bottom and case inflow path for guiding upward from below the coolant, between the one end and the other end of the case forms a parallel array of flat plate, a fin for cooling the module provided a refrigerant flowing in the inlet channel the case in minutes arranged in the case, is formed on the other end side of the case upper surface A module case having an outflow passage in the case that communicates with the refrigerant outlet, guides the refrigerant distributed by the fins to the refrigerant outlet, and an orifice that regulates the flow rate of the refrigerant, and a plurality of the module cases are fixed in parallel. And a housing having a fan for allowing the cooled refrigerant to flow out of the outflow passage in the case of the module case.

  According to the module cooling structure according to the present invention, by having the module case provided with the in-case inflow passage, the outflow passage in the case, the fin, and the orifice as described above, the refrigerant flow rate between the plurality of module cases is equalized, The refrigerant from the inflow path in the module case can be guided to be distributed to the fins, and the refrigerant that has passed through the fins can be gathered and discharged in the outflow path in the case. As a result, it is not necessary to provide a complicated flow path in the housing, and the module cooling structure can be reduced in size and weight.

It is a figure which shows the module cooling structure which concerns on Embodiment 1 of this invention. It is a figure which shows the structure of the module case in the module cooling structure which concerns on Embodiment 1 of this invention. It is a figure which shows the structure of the module case in the module cooling structure which concerns on Embodiment 2 of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 shows the internal configuration by allowing the inside of the module cooling structure 1 to permeate and cutting away a part thereof, and FIG. 2 shows the configuration of the module case 10 of the module cooling structure 1. As shown in FIG. 1, the module cooling structure 1 is configured by fixing a plurality of module cases 10 arranged in parallel in a housing 2, and is a structure used for, for example, air-cooled APAA.
The housing 2 includes a fan 3 that fixes a plurality of module cases 10 in parallel inside and discharges the refrigerant after cooling the modules 11 from the module cases 10 on the upper surface.

As shown in FIG. 2, the module case 10 includes a plurality of modules 11 provided in the case, a refrigerant inlet 12, an in-case inflow path 13, fins 14 (first fins), an in-case outflow path 15, and a refrigerant outlet 16. , The orifice 17.
The module 11 is an antenna module that performs a function as an APAA, for example, and has a heat generating part during operation.

The refrigerant inlet 12 is an inlet for the refrigerant flowing into the module case 10, and is formed at the lower part of the module case 10, for example.
The inflow passage 13 in the case communicates with the refrigerant inlet 12 and guides the refrigerant flowing in from the refrigerant inlet 12 to the inside of the module case 10.
The fin 14 has a flat plate shape arranged in parallel between the inflow passage 13 and the outflow passage 15 in the case, distributes the refrigerant flowing into the inflow passage 13 in the case, and guides it to the outflow passage 15 in the case. To function. Moreover, the fin 14 is comprised with a material with high heat conductivity, and functions to cool the several module 11 provided in the module case 10 by transferring the heat | fever of the module 11 to a refrigerant | coolant.
The in-case outflow passage 15 communicates with the refrigerant outlet 16, collects the refrigerant from the fins 14 and causes the refrigerant to flow out to the refrigerant outlet 16.
The refrigerant outlet 16 is an outlet for the refrigerant that flows out the refrigerant used for cooling the module 11 in the module case 10 to the outside of the case. For example, the refrigerant outlet 16 is formed in the upper part of the module case 10.
The orifice 17 functions to equalize the refrigerant flow rate in the module case 10 by reducing the cross-sectional area of the refrigerant flow path and regulating the refrigerant flow rate. For example, the orifice 17 is formed at the refrigerant outlet 16. In FIG. 2, the orifice 17 is described as being provided at the refrigerant outlet 16, but is arranged at a position where the refrigerant flow rate is regulated so that the refrigerant flow rate in the module case 10 can be made equal. I just need it.

Here, the flow of the refrigerant using the module cooling structure 1 according to the first embodiment will be described with reference to FIGS. The arrows in FIGS. 1 and 2 indicate the flow of the refrigerant.
The fan 3 of the casing 2 sucks refrigerant from the lower part of the casing 2 by rotating blades when electric power is supplied from a power source (not shown) to forcibly discharge the refrigerant in the casing 2 to the outside. The refrigerant sucked from the lower part of the housing 2 flows from the refrigerant inlet 12 of each module case 10 and is guided into the module case 10 by the inflow passage 13 in the case. The refrigerant guided to the inside of the module case 10 is distributed along the fins 14 to which the heat from the module 11 is transmitted, passes through the fins 14 while lowering the temperature of the fins 14, and is guided to the outflow passages 15 in the case and gathers. The refrigerant gathered in the in-case outflow passage 15 flows out of the module case 10 from the refrigerant outlet 16 through the orifice 17. At this time, the orifice 17 regulates the refrigerant flow rate by reducing the cross-sectional area of the refrigerant flow path, and makes the refrigerant flow rate out of each module case 10 uniform. The module-cooled refrigerant flowing out of each module case 10 is discharged from the fan 3 to the outside of the housing 2.

  As described above, the module cooling structure 1 according to the first embodiment fixes the module case 10 including the in-case inflow passage 13, the fin 14, the in-case outflow passage 15, and the orifice 17, and the module case 10 in parallel. By comprising the housing 2 provided with the fan 3, the refrigerant | coolant flow rate in each module case 10 can be made uniform. As a result, there is no need to provide a complicated flow path in the housing 2, and the module cooling structure 1 can be miniaturized by making the depth dimension of the housing 2 equal to the depth dimension of the module case 10. Moreover, since it is not necessary to provide a complicated flow path, the number of parts does not increase and the module cooling structure 1 can be reduced in weight.

Embodiment 2. FIG.
In the first embodiment, the configuration in which the module 11 is cooled by cooling the fins 14 has been described. In the second embodiment, a configuration for improving the cooling capacity will be described. The module cooling structure according to the second embodiment has the same configuration as that of the module cooling structure 1 according to the first embodiment except for the module case 20, and thus the description thereof is omitted. However, the second embodiment will be described as a module cooling structure 1 ′ in order to distinguish it from the first embodiment.

FIG. 3 shows the configuration of the module case 20 of the module cooling structure 1 ′ according to the second embodiment. In FIG. 3, the same components as those in the first embodiment will be described with the same reference numerals as those in FIG.
As shown in FIG. 3, the module case 20 of the module cooling structure 1 ′ includes a plurality of modules 11 provided in the case, a refrigerant inlet 12, an inflow passage 13 in the case, a fin 14 (first fin), and an outflow in the case. The passage 15, the refrigerant outlet 16, the orifice 17, the fin 28 (second fin), and the fin 29 (third fin) are configured. Since the configuration other than the fins 28 and 29 is the same as that of the first embodiment, the description thereof is omitted.

  The fins 28 are separated from the inflow passage 13 in the case by a predetermined interval, and the fins 29 are separated from the inflow passage 15 in the case by a predetermined interval. The fins 28 and 29 are formed in a shape having no directivity with respect to the flow of the refrigerant, and are formed in, for example, a cylindrical shape. The fins 28 and the fins 29 are made of a material having high thermal conductivity, and function to cool the plurality of modules 11 provided in the module case 20 by transferring the heat of the modules 11 to the refrigerant.

Here, the feature of the refrigerant flow using the module cooling structure 1 ′ according to the second embodiment will be described.
In the refrigerant flow using the module cooling structure 1 ′ according to the second embodiment, the refrigerant sucked from the lower part of the housing 2 flows in from the refrigerant inlet 12 of each module case 20, and is connected to the module case by the inflow passage 13 in the case. 20 is guided inside 20 and passes through while lowering the temperature of the fin 28 to which the heat from the module 11 is transmitted. At this time, since the fin 28 has a shape having no directivity with respect to the flow of the refrigerant, the refrigerant flow is not affected.
The refrigerant that has passed through the fins 28 inside the module case 20 is distributed along the fins 14 to which the heat from the module 11 is transmitted, passes through the fins 14 while lowering the temperature of the fins 14, and is guided to the outflow passage 15 in the case. The refrigerant guided to the in-case outflow passage 15 passes while lowering the temperature of the fin 29 to which the heat from the module 11 is transmitted. At this time, since the fin 29 has a shape having no directivity with respect to the flow of the refrigerant, the refrigerant flow is not affected.

  As described above, the module cooling structure 1 ′ according to the second embodiment is configured to include the module case 20 having the fins 28 and the fins 29 in addition to the effects of the first embodiment. The module 11 can be cooled by the refrigerant in the in-case inflow path 13 and the in-case outflow path 15 without affecting the flow. As a result, the effect that the cooling capacity with respect to the module 11 can be improved is acquired.

  In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

  1, 1 ′ module cooling structure, 2 housing, 3 fan, 10, 20 module case, 11 module, 12 refrigerant inlet, 13 inflow path in case, 14 fin (first fin), 15 outflow path in case, 16 refrigerant Outlet, 17 orifice, 28 fin (second fin), 29 fin (third fin).

Claims (2)

Communicated to the coolant inlet formed on one end side of the case bottom, forming a casing inlet path for guiding upward from below the coolant, a plurality parallel arrayed flat plate between the one end and the other end of the case and have a fin for cooling the module provided a refrigerant flowing in the inlet channel the case in minutes arranged by case, communication with the refrigerant outlet formed in the other end side of the case upper surface in the fin A module case having an outflow path in the case for guiding the distributed refrigerant to the refrigerant outlet and an orifice for regulating the flow rate of the refrigerant;
A module cooling structure comprising: a housing including a fan that fixes a plurality of the module cases in parallel, and causes the cooled refrigerant to flow out from an outflow passage in the case of the module cases.   2. The module cooling structure according to claim 1, wherein the module case includes fins having no directivity in the flow of the refrigerant in the inflow passage and the outflow passage in the case.

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