JP5844095B2 - Substrate inspection apparatus and correction information acquisition method - Google Patents

Description

  The present invention relates to a substrate inspection apparatus that electrically inspects an inspection target substrate by probing an inspection probe disposed on the probe unit to the inspection target substrate, and correction information for correcting probing information used during probing. The present invention relates to a correction information acquisition method to be acquired.

  As this type of board inspection apparatus, the applicant has a circuit board inspection apparatus (hereinafter simply referred to as “circuit board inspection apparatus”) that electrically inspects a circuit board to be inspected via a plurality of probe pins implanted in a pin board in a board inspection jig. Japanese Patent Laid-Open No. 2001-13189 discloses a “substrate inspection apparatus”. In this board inspection apparatus, the table on which the circuit board is placed is moved below the board inspection jig (pin board) by the X axis moving means and the Y axis moving means, and then the pin board is moved to the table (circuit board). ), The probe pins are brought into contact with the respective inspection points of the circuit board and electrically inspected.

  In this case, in this type of inspection apparatus, the moving amount and moving direction when the table (circuit board) is moved by the moving means, the moving amount when the substrate inspection jig (pin board) is lowered toward the table, and There are very small individual differences in the direction of movement. For this reason, in this type of inspection apparatus, the table (circuit board) is moved in accordance with the design value below the board inspection jig (pin board), and the board inspection jig ( Even if the pin board is lowered as designed, each probe pin may be displaced from a desired inspection point and contact the circuit board. Therefore, in the board inspection apparatus disclosed by the applicant, in order to accurately bring each probe pin into contact with a desired inspection point on the circuit board, the offset data obtained in advance is used for the above movement amount and movement direction. The structure which cancels an individual difference by correct | amending based on this is employ | adopted.

  Specifically, the offset data is acquired prior to the inspection of the circuit board. In this case, first, the table on which the dent sheet is placed instead of the circuit board is moved below the board inspection jig (pin board) according to the position designation data. Next, each probe pin is probed with respect to the dent sheet by lowering the pin board toward the table. At this time, a dent is formed in the contact area of the probe pin in the dent sheet. Subsequently, after the table (the dent sheet) is moved below the camera by the moving means, the dent sheet on the table is imaged by the camera. Next, the image data output from the camera is analyzed by the image processing means to obtain the dent position data.

  Subsequently, when the CPU moves the table below the substrate inspection jig, the position designation data output to the moving means, and the dent position data acquired by analyzing the image data obtained by imaging the dent sheet The difference (deviation) is calculated. Thereby, a calculation result is acquired as offset data. On the other hand, when the circuit board is inspected (probing with respect to the circuit board), the CPU adds offset data to the position designation data to control the amount of movement of the table by both moving means. As a result, according to the substrate inspection apparatus disclosed by the applicant, each probe pin can be accurately brought into contact with a desired inspection point, and as a result, it is possible to accurately inspect the quality of the circuit board. It has become.

JP 2001-13189 A (page 3-4, FIG. 1-3)

  However, the substrate inspection apparatus disclosed by the applicant has the following problems to be improved. That is, in the substrate inspection apparatus disclosed by the applicant, the position of the dent formed by probing each probe pin with respect to the dent sheet is acquired as the dent position data, and the acquired dent position data is acquired. A configuration is employed in which the difference (deviation) between the position designation data and the position designation data is acquired as offset data. In this case, as shown in FIG. 5, in the pin board used in this type of board inspection apparatus, in order to allow buckling and expansion / contraction of the probe pin, a main body part in the probe pin and a support part for supporting the main body part In addition, there is a small gap between each probe pin, and each probe pin has a very small bend or the like within an allowable range.

  For example, as shown in FIG. 5, test heads (pin boards) 5x used in this type of substrate inspection apparatus include, for example, inspection probes (probe pins) P1 to P26 (hereinafter referred to as “inspection probes” when not distinguished from each other). P ”). In this test head 5x, for example, the inspection probes P1 to P9 are arranged along the straight line L1, the inspection probes P9 to P14 are arranged along the straight line L4, and the inspection probes P14 to P22 are arranged along the straight line L3. The inspection probes P22 to P26, P1 are designed to be arranged along the straight line L2. However, even if the test head 5x designed in this way is used, it is formed on the dent sheet 30x by the contact of the inspection probes P1 to P26 as shown in FIG. The dents M1 to M26 (hereinafter, also referred to as “the dent M” when not distinguished) may be displaced from the straight lines L1 to L4. In FIG. 6, in order to facilitate understanding of the positional deviation of each dent M, the positional deviation amount of each dent M with respect to the straight lines L1 to L4 is exaggerated and greatly displaced.

  When acquiring offset data in the substrate inspection apparatus having such a test head 5x, as an example, when the inspection probe P1 is bent larger than the inspection probes P2 to P26, as shown in FIG. The dent M1a is formed so as to be largely displaced from the position of the normal dent M1 indicated by a broken line. Therefore, in the example shown in the figure, when the dent position data is acquired for the dent M1a and the offset data is calculated, the position designation data used for moving the table is set as the direction of the displacement of the dent M1a. In this case, offset data whose content is largely corrected in the opposite direction is acquired. When the position designation data is corrected using such offset data and the table (circuit board) is moved, not only the inspection probe P1 but also the contact positions of the inspection probes P2 to P26 are dents M1a. Thus, a large correction is made in the opposite direction to the direction of the positional deviation.

  For this reason, in the inspection probes P2 to P26 implanted in the test head 5x, a bending or the like that causes the contact position to shift in a direction opposite to the displacement direction of the dent M1a occurs. When the inspection probe P is present, the contact position of the inspection probe P is further displaced in the direction opposite to the displacement direction of the dent M1a. Therefore, the inspection probe P may be difficult to contact with a desired inspection point on the circuit board.

  The present invention has been made in view of such a problem to be improved, and a substrate capable of acquiring correction information capable of accurately bringing each inspection probe into contact with a desired inspection point on the inspection target substrate. The main object is to provide an inspection apparatus and a correction information acquisition method.

  In order to achieve the above object, a substrate inspection apparatus according to claim 1, wherein the probe unit is provided with a plurality of contact-type inspection probes, a substrate holding mechanism for holding a substrate to be inspected, the probe unit, and the substrate. A moving mechanism that moves at least one of the holding mechanisms relative to the other to probe the inspection probe onto the inspection target substrate, and captures the holding position of the inspection target substrate in the substrate holding mechanism, and outputs image data. An imaging unit, a storage unit that stores probing information that can specify a moving amount and a moving direction for moving at least one of the inspection target substrate with respect to the other during probing, imaging by the imaging unit, and the moving mechanism Controlling at least one of the movements by the probe and probing the substrate to be inspected And a processing unit that executes correction information acquisition processing for acquiring correction information for correcting the probing information used for the control, and the processing unit controls the moving mechanism according to the probing information during the correction information acquisition processing. Then, a dent forming process for probing the inspection probe to the dent sheet disposed at the holding position to form a dent on the dent sheet, and controlling the imaging unit to form the dent sheet A position relative to a reference probing position of the probing position of the inspection probe in the dent formation process based on an imaging process for capturing the image and a position of the dent specified based on the image data output from the imaging unit The misalignment state specifying process for specifying the misalignment amount and the misalignment direction is executed in this order, and the misalignment state specifying process is performed. In the substrate inspection apparatus for acquiring the positional deviation amount and the positional deviation direction specified as the correction information, the processing unit is arranged along a first straight line in the positional deviation state specifying process. A first approximate straight line that linearly approximates at least three of the plurality of dents formed by probing the plurality of inspection probes, and a plurality of lines disposed along the first curve. One of a first approximate curve obtained by curve approximation of at least three of the plurality of dents formed by probing the inspection probe and a plurality of dents arranged along a second straight line Along the second approximate straight line obtained by linearly approximating at least three of the plurality of dents formed by probing the inspection probe, and a second curve A first intersection where one of the second approximate curves obtained by curve approximation of at least three of the plurality of dents formed by probing the plurality of inspection probes disposed is intersected. Specifically, one of the first straight line and the first curve corresponding to the one intersects with one of the second straight line and the second curve corresponding to the one of the first curved line. The position shift amount and the position shift direction are specified based on the reference position information stored in the storage unit so that the first reference point to be specified can be specified and the position information of the specified first intersection point.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the processing unit includes a plurality of the plurality of the plurality of the plurality of the plurality of the plurality of the plurality of the plurality of the plurality of the plurality of the plurality of the plurality of processing units disposed along the first straight line. The first approximation obtained by linearly approximating the dents excluding a predetermined number of dents having a large separation distance from the approximate A line obtained by linearly approximating the plurality of dents formed by probing the inspection probe. A predetermined number having a large separation distance from an A approximate curve obtained by approximating a plurality of the dents formed by probing a straight line and a plurality of the inspection probes arranged along the first curve Formed by probing a plurality of the inspection probes arranged along the second straight line and any one of the first approximate curves obtained by approximating the dent except for the dent. The second approximate line obtained by linearly approximating the dents excluding a predetermined number of the dents having a large separation distance from the B approximate line obtained by linearly approximating the plurality of dents, and the second curve The stroke excluding a predetermined number of the dents having a large separation distance from a B approximate curve obtained by approximating the plurality of dents formed by probing the plurality of inspection probes disposed along the curve. The position shift amount and the position shift direction are specified by using the point at which one of the second approximate curves obtained by approximating the trace as a curve intersects the first intersection.

  Furthermore, the substrate inspection apparatus according to claim 3 is the substrate inspection apparatus according to claim 1 or 2, wherein the processing unit specifies the first intersection and is disposed along a third straight line. A third approximate straight line obtained by linearly approximating at least three of the plurality of dents formed by probing the plurality of inspection probes, and a plurality of lines arranged along a third curve One of a plurality of third approximate curves obtained by curve approximation of at least three of the plurality of dents formed by probing the inspection probe, and a plurality of dents arranged along a fourth straight line. A fourth approximate straight line obtained by linearly approximating at least three of the plurality of dents formed by probing the inspection probe, and a plurality of lines arranged along a fourth curve A second intersection point that intersects with any of the fourth approximate curves obtained by curve approximation of at least three of the plurality of dents formed by probing the inspection probe, and One reference point, one corresponding to the third straight line and the third curve, and one corresponding to the fourth straight line and the fourth curve The positional deviation amount based on the reference position information stored in the storage unit so as to be able to specify the second reference point that intersects with each other, and the position information of the specified first and second intersections And specifying the misalignment direction.

  The substrate inspection apparatus according to claim 4 is the substrate inspection apparatus according to claim 3, wherein the processing unit is formed by probing a plurality of the inspection probes arranged along the third straight line. The third approximate line obtained by linearly approximating the dents excluding a predetermined number of the dents having a large separation distance from the C approximate line obtained by linearly approximating the plurality of dents, and the third curve The stroke excluding a predetermined number of the dents having a large separation distance from a C approximate curve obtained by approximating the plurality of dents formed by probing the plurality of inspection probes disposed along the curve. D that approximates the plurality of dents formed by probing one of the third approximate curves obtained by approximating the traces and the plurality of inspection probes arranged along the fourth straight line. The fourth approximate straight line obtained by linearly approximating the dents excluding a predetermined number of the dents having a large separation distance from the similar straight line, and the plurality of inspections arranged along the fourth curve The fourth approximate curve obtained by curve approximation of the dents excluding a predetermined number of the dents having a large separation distance from the D approximation curve obtained by curve approximation of the plurality of dents formed by probing the probe The position deviation amount and the position deviation direction are specified with the point where any of the two intersect as the second intersection.

According to a fifth aspect of the present invention, there is provided a correction information acquisition method comprising: a probe unit having a plurality of contact-type inspection probes; a substrate holding mechanism that holds a substrate to be inspected; and the probe unit and the substrate holding mechanism. A moving mechanism for probing the inspection probe on the inspection target substrate by moving at least one relative to the other; an imaging unit for imaging a holding position of the inspection target substrate in the substrate holding mechanism and outputting image data; using the substrate inspection device provided with, we obtain the correction information for correcting the at least one possible probing information identifying the movement amount and movement direction to be moved relative to the other when probing for the inspection target board when, dents sea which is arranged in the holding position by controlling the moving mechanism according to the probing information The dent forming process for forming the dent on the dent sheet by probing the inspection probe, the imaging process for controlling the imaging unit to image the dent sheet, and the imaging unit Position shift state specifying process for specifying a position shift amount and a position shift direction with respect to a reference probing position of the probing position of the inspection probe in the mark forming process based on the position of the mark specified based on the image data Are executed in this order to acquire the positional deviation amount and the positional deviation direction specified in the positional deviation state specifying process as the correction information, and in the positional deviation state specifying process, A plurality of the dents formed by probing a plurality of the inspection probes arranged along the first straight line At least three of the plurality of dents formed by probing the plurality of inspection probes disposed along the first curve At least one of the plurality of dents formed by probing any one of the first approximate curves obtained by curve approximation of the three dents and the plurality of the inspection probes arranged along the second straight line. At least three of the plurality of dents formed by probing the plurality of inspection probes arranged along the second curve and the second approximate straight line obtained by linearly approximating the three dents A first intersection point that intersects one of the second approximate curves obtained by curve approximation of the dent is identified, and corresponds to any one of the first straight line and the first curve. Reference position information capable of specifying a first reference point at which one of the second line and one of the second curves corresponding to the one intersects, and the position of the specified first intersection The positional deviation amount and the positional deviation direction are specified based on the information.

  Furthermore, the correction information acquisition method according to claim 6 is the correction information acquisition method according to claim 5, wherein the plurality of inspection probes arranged along the first straight line in the misalignment state specifying process. A first approximate line obtained by linearly approximating the dents excluding a predetermined number of the dents having a large separation distance from an A approximate line obtained by linearly approximating a plurality of the dents formed by probing; A predetermined number of hits having a large separation distance from an approximate A curve obtained by approximating a plurality of the dents formed by probing a plurality of the inspection probes arranged along the first curve. It is formed by probing one of the first approximate curves obtained by curve approximation of the dents excluding the traces and a plurality of the inspection probes arranged along the second straight line. The second approximate line and the second curve obtained by linearly approximating the dents excluding a predetermined number of the dents having a large separation distance from the B approximate line obtained by linearly approximating the number of dents. The dents excluding a predetermined number of the dents having a large distance from a B approximation curve obtained by approximating the plurality of dents formed by probing the plurality of inspection probes arranged along the curve. The position shift amount and the position shift direction are specified by using the point at which one of the second approximate curves obtained by curve approximation intersects as the first intersection.

  The correction information acquisition method according to claim 7 is the correction information acquisition method according to claim 5 or 6, wherein in the misalignment state specification process, the first intersection point is specified and a third straight line is followed. Arranged along a third approximate line and a third curve obtained by linearly approximating at least three of the plurality of dents formed by probing the plurality of inspection probes arranged in a row. A third approximate curve obtained by curve approximation of at least three of the plurality of dents formed by probing the plurality of inspection probes provided, and a fourth straight line. A fourth approximate straight line obtained by linear approximation of at least three of the plurality of dents formed by probing the plurality of inspection probes provided, and a fourth music And a second approximate curve that approximates a curve of at least three of the plurality of dents formed by probing the plurality of inspection probes disposed along the second line. Of the first reference point, one of the third straight line and the third curve, and one of the fourth straight line and the fourth curved line. The position based on the reference position information that can specify the second reference point that intersects one of the two corresponding to the one of the above, and each position information of the specified first intersection and second intersection A shift amount and the position shift direction are specified.

  Furthermore, the correction information acquisition method according to claim 8 is the correction information acquisition method according to claim 7, wherein the plurality of inspection probes arranged along the third straight line in the misalignment state specifying process. A third approximate line obtained by linearly approximating the dents excluding a predetermined number of dents having a large separation distance from a C approximate line obtained by linearly approximating a plurality of the dents formed by probing, A predetermined number of strokes having a large separation distance from a C approximate curve obtained by approximating a plurality of the dents formed by probing the plurality of inspection probes arranged along the third curve. It is formed by probing one of the third approximate curves obtained by curve approximation of the dent excluding the trace, and a plurality of the inspection probes arranged along the fourth straight line. The fourth approximate line obtained by linearly approximating the dents excluding a predetermined number of the dents having a large separation distance from the D approximate line obtained by linearly approximating the number of dents, and the fourth curve. The dents excluding a predetermined number of the dents having a large distance from a D approximation curve obtained by approximating the plurality of dents formed by probing the plurality of inspection probes disposed along the curve. The position shift amount and the position shift direction are specified by using the point at which one of the fourth approximate curves obtained by curve approximation as the second intersection point.

  According to the substrate inspection apparatus according to claim 1 and the correction information acquisition method according to claim 5, the first approximate straight line obtained by linearly approximating at least three dents and the first approximated by curve approximation of at least three dents. A first intersection point at which one of the approximate curves intersects with any of the second approximate line obtained by linear approximation of at least three dents and the second approximate curve obtained by curve approximation of at least three dents. By specifying the positional deviation amount and the positional deviation direction of the probing position of the inspection probe with respect to the reference probing position based on the position information and the reference position information of the identified first intersection point, Even if there is a dent with a certain amount of misalignment from the reference probing position, it is not possible to Since the impact of the amount of dents is sufficiently small, by acquiring correction information based on the intersection of the approximate line specified by the linear approximation or the approximate curve specified by the curve approximation, the dent of a large misalignment amount Correction information with a sufficiently small influence can be acquired. Therefore, it is possible to avoid the situation where correction information that would correct the probing information more than necessary is obtained. Therefore, by controlling the moving mechanism based on the probing information and the correction information, each inspection probe can be inspected. As a result of being able to accurately contact a desired inspection point on the substrate, it is possible to accurately inspect the quality of the inspection target substrate.

  According to the substrate inspection apparatus according to claim 2 and the correction information acquisition method according to claim 6, when the first approximate line is specified, a predetermined number of dents having a large separation distance from the A approximate line are removed. And specifying the first approximate curve by removing a predetermined number of dents having a large distance from the A approximate curve, and specifying the second approximate line by the distance from the B approximate line. By specifying a number excluding a predetermined number of dents having a large value, and specifying a second approximate curve by excluding a predetermined number of dents having a large separation distance from the B approximate curve, When specifying any one of the first approximate line and the first approximate curve for obtaining one intersection point and either the second approximate line or the second approximate curve, Making the impact small enough Kill result, the influence of the dents of the large positional deviation amount can be acquired smaller correction information. Therefore, by controlling the moving mechanism based on the probing information and the correction information, each inspection probe can be more accurately brought into contact with a desired inspection point on the inspection target substrate. Can be more accurately inspected.

  According to the substrate inspection apparatus according to claim 3 and the correction information acquisition method according to claim 7, a third approximate straight line that specifies the first intersection point and linearly approximates at least three dents, and Any of a third approximate curve obtained by curve approximation of at least three dents, a fourth approximate line obtained by linear approximation of at least three dents, and a fourth approximate curve obtained by curve approximation of at least three dents The second crossing point where the heel intersects is specified, and based on the positional information and the reference position information of the specified first crossing point and the second crossing point, the positional deviation of the probing position of the inspection probe from the reference probing position Compared to the configuration (method) in which the correction information is acquired based only on the first intersection by specifying the amount and the position shift direction, the point to be compared with the reference position information is the first intersection and By the amount of increase in the second intersection, a positional displacement amount and a positional displacement direction with respect to the reference probing position of the probing position of the inspection probe can be more accurately specified.

  According to the substrate inspection apparatus according to claim 4 and the correction information acquisition method according to claim 8, when the third approximate line is specified, a predetermined number of dents having a large separation distance from the C approximate line are removed. And specifying the third approximate curve by removing a predetermined number of dents having a large distance from the C approximate curve, and specifying the fourth approximate line by the distance from the D approximate line. By specifying a large number excluding a predetermined number of dents, and specifying a fourth approximate curve by excluding a predetermined number of dents having a large separation distance from the D approximate curve. When specifying any one of the third approximate line and the third approximate curve for obtaining the intersection of the two and any one of the fourth approximate line and the fourth approximate curve, Making the impact small enough Kill result, the influence of the dents of the large positional deviation amount can be acquired smaller correction information.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. It is explanatory drawing for demonstrating the relationship between the formation position of dents Ma-Mf, the arrangement | positioning position of test | inspection probe Pa-Pf which formed dents Ma-Mf, and approximate straight line La, Lb, and the straight line L. FIG. . 4 is an explanatory diagram for explaining the arrangement of inspection probes P1 to P26 in the test head 5. FIG. FIG. 5 is an explanatory diagram for explaining formation positions of dents M <b> 1 to M <b> 26 formed on the dent sheet 30. It is explanatory drawing for demonstrating arrangement | positioning of the test probes P1-P26 in the test head 5x. It is explanatory drawing for demonstrating the formation position of the dents M1-M26 formed in the dent sheet | seat sheet 30x.

  Hereinafter, embodiments of a substrate inspection apparatus and a correction information acquisition method will be described with reference to the accompanying drawings.

  A substrate inspection apparatus 1 shown in FIG. 1 is an inspection apparatus configured to be able to electrically inspect a substrate 20 to be inspected, and includes a substrate holding mechanism 2, a transport mechanism 3, a camera 4, a test head 5, a moving mechanism 6, A measurement unit 7, an operation unit 8, a display unit 9, a processing unit 10 and a storage unit 11 are provided. The substrate holding mechanism 2 holds the inspection target substrate 20 placed at a predetermined holding position under the control of the processing unit 10. The transport mechanism 3 transports the substrate holding mechanism 2 to one of an imaging processing position by the camera 4 and a probing processing position (inspection processing position) by the moving mechanism 6 and the test head 5 according to control of the processing unit 10. The camera 4 corresponds to an “imaging unit”, and in accordance with the control of the processing unit 10, the inspection target substrate 20 held at the holding position or the dent sheet 30 arranged at the holding position as will be described later. Imaging is performed and imaging data D1 (an example of “image data”) is output.

  The test head 5 is an example of a “probe unit”, and as shown in FIG. 3, contact type inspection probes P1 to P26 (hereinafter also referred to as “inspection probe P” when not distinguished) are not shown. It is configured to be supported by a probe support plate. Note that the actual test head 5 has a smaller number of inspection probes P than the test head 5 shown in FIG. 3 or the test head 5 shown in FIG. 3 depending on the number of inspection points defined on the inspection target substrate 20. A larger number of inspection probes P are provided.

  In this case, in the test head 5 of this example, the inspection probes P1 to P9 are arranged along the straight line L1 (an example of “first straight line”), and the inspection probes P9 to P14 are orthogonal to the straight line L1. A straight line L3 ("third straight line") that is disposed along the straight line L4 (an example of a "fourth straight line") and the inspection probes P14 to P22 are orthogonal to the straight line L4 and parallel to the straight line L1. Along the straight line L2 (an example of “second straight line”) in which the inspection probes P22 to P26, P1 are orthogonal to the straight lines L1 and L3 and parallel to the straight line L4. It is arranged. Moreover, in this test head 5, the front-end | tip part of each test probe P1-P26 has shifted slightly from the straight lines L1-L4 due to the presence of the above-mentioned gaps and bends. In the figure, the tip of each inspection probe P is indicated by a black circle, and in order to facilitate understanding of the present invention, the amount of displacement of the tip of the inspection probe P relative to the straight lines L1 to L4. Is exaggerated and greatly displaced.

  The moving mechanism 6 moves the test head 5 toward the inspection target substrate 20 (or the dent sheet 30) on the substrate holding mechanism 2 that the transport mechanism 3 has transported to the probing position under the control of the processing unit 10. Each inspection probe P is brought into contact (probing) with the inspection target substrate 20 (or the dent sheet 30) (“at least one of the probe unit and the substrate holding mechanism” is the “probe unit”, and the “other” is Example of configuration of “substrate holding mechanism”). In this case, the moving mechanism 6 moves the test head 5 in the contact / separation direction (vertical direction in FIG. 1) with respect to the substrate holding mechanism 2 and in the X direction / Y direction on the upper surface of the substrate holding mechanism 2 and also the substrate holding mechanism 2. The test head 5 is configured to be rotated along the upper surface. The dent sheet 30 is, for example, a pressure-sensitive paper (sheet that changes color by applying pressure) affixed to the surface of a flat plate (not shown) having the same size and thickness as the inspection target substrate 20. ).

  The measurement unit 7, together with the processing unit 10, constitutes an “inspection unit” that inspects the quality of the inspection target substrate 20. The measurement unit 7 includes a power source that applies an inspection voltage to the inspection target substrate 20 via each inspection probe P of the test head 5, and a current flowing through the inspection target substrate 20 in a state where the inspection voltage is applied. A measurement process of measuring the value and outputting it as measurement data to the processing unit 10 is executed. The operation unit 8 includes various operation switches for setting and operating the operation conditions of the substrate inspection apparatus 1, and outputs an operation signal corresponding to the switch operation to the processing unit 10. The display unit 9 is an operation condition setting screen (not shown) for setting the operation condition of the substrate inspection apparatus 1 according to the control of the processing unit 10, an inspection result display screen (not shown) for the inspection target substrate 20, In addition, as will be described later, an image (not shown) of image data obtained by capturing the dent sheet 30 is displayed.

  The processing unit 10 comprehensively controls the substrate inspection apparatus 1. Specifically, the processing unit 10 controls the conveyance of the substrate holding mechanism 2 (the inspection target substrate 20 and the dent sheet 30) by the conveyance mechanism 3, the imaging by the camera 4, and the movement of the test head 5 by the movement mechanism 6. . In addition, the processing unit 10 executes a correction information acquisition process for acquiring correction information Dr for correcting the probing information Dp used when probing the inspection target substrate 20.

  In this case, the probing information Dp is configured by recording information that can specify the amount and direction of movement for moving the test head 5 toward the substrate holding mechanism 2 (inspection target substrate 20) when probing the inspection target substrate 20. Yes. Further, the correction information Dr specifies how much and in what direction the amount and direction of movement for moving the test head 5 toward the substrate holding mechanism 2 (inspection target substrate 20) when probing the inspection target substrate 20 are corrected. Possible information is recorded and configured. The correction information Dr is not stored in the substrate inspection apparatus 1 immediately after the start of use (immediately after the completion of manufacture), but is generated by the processing unit 10 by executing a “correction information acquisition process” described later and stored in the storage unit. 11 is stored.

  Specifically, in the substrate inspection apparatus 1, prior to the inspection of the inspection target substrate 20, the processing unit 10 executes the above correction information acquisition process to acquire the correction information Dr. In this correction information acquisition process, the processing unit 10 executes “dentation forming process”, “imaging process”, “dentation position specifying process”, and “misalignment state specifying process” in this order to obtain correction information Dr. get. More specifically, in the “dentation forming process”, the moving mechanism 6 is controlled according to the probing information Dp, and each inspection of the test head 5 is performed on the impression sheet 30 disposed at the holding position of the substrate holding mechanism 2. The probe P is probed to form the dent M on the dent sheet 30. In the “imaging process”, the camera 4 is controlled to image the dent sheet 30 on which the dent M is formed. Furthermore, in the “dent mark position specifying process”, the image of the imaging data D1 output from the camera 4 is subjected to image analysis to specify the position of the formed mark M.

  In the “misalignment state specifying process”, a reference probing position (described later) of the probing position of each inspection probe P in the above-described mark forming process based on the position of the mark M specified in the “print mark position specifying process”. The position deviation amount and the position deviation direction with respect to the position specified based on the reference position information D0) are specified. Further, the processing unit 10 acquires, as the correction information Dr, the positional shift amount and the positional shift direction specified in the “positional shift state specifying process”. Further, the processing unit 10 controls the measurement unit 7 to execute the above measurement process. Furthermore, the processing unit 10 inspects the quality of the inspection target substrate 20 based on the measurement data output from the measurement unit 7 and the inspection reference data stored in the storage unit 11.

  The storage unit 11 stores the reference position information D0, the probing information Dp, the correction information Dr, and the inspection reference data as well as the operation program of the processing unit 10. In this case, for example, the reference position information D0 is an intersection of a straight line L1 that is a reference line in the arrangement direction of the inspection probes P1 to P9 and a straight line L2 that is a reference line in the arrangement direction of the inspection probes P22 to P26 and P1. C1 (see FIG. 3), an intersection C2 (see FIG. 3) between a straight line L4 which is a reference line in the arrangement direction of the inspection probes P9 to P14 and a straight line L3 which is a reference line in the arrangement direction of the inspection probes P14 to P22. Information that can identify the four points of the intersection C3 (see FIG. 3) with the straight lines L1 and L4 and the intersection C4 (see FIG. 3) with the straight lines L3 and L2, and the reference probing for probing the inspection probes P1 to P26 Information that can specify relative positions of the positions with respect to the intersections C1 to C4 is recorded.

  When the substrate inspection apparatus 1 inspects the inspection target substrate 20, first, the correction information Dr is acquired. Specifically, the flat plate with the dent sheet 30 is placed and held at the holding position of the substrate holding mechanism 2 and the operation unit 8 is operated to start the correction information acquisition process. At this time, the processing unit 10 controls the transport mechanism 3 to move the substrate holding mechanism 2 to a probing position by the test head 5, and then controls the moving mechanism 6 according to the probing information Dp to thereby set the substrate holding mechanism 2. The test head 5 is lowered toward the dent sheet 30 held by the above. As a result, the inspection probes P1 to P26 come into contact with the surface of the dent sheet 30, and the contact positions of the inspection probes P1 to P26 are specified in the respective parts of the dent sheet 30 as shown in FIG. Possible dents M1 to M26 are formed (a dent formation process).

  Next, the processing unit 10 controls the transport mechanism 3 to move the substrate holding mechanism 2 to an imaging processing position by the camera 4, and then controls the camera 4 to move the dent sheet 30 on the substrate holding mechanism 2. Imaging is performed (imaging processing). Subsequently, the processing unit 10 performs image analysis on the image of the imaging data D1 output from the camera 4, thereby specifying the position of each dent M formed on the dent sheet 30 (the dent position specifying process). ). Instead of the configuration (method) for automatically specifying the position of each dent M by analyzing the image of the imaged data D1, for example, the image of the imaged data D1 is displayed on the display unit 9, and the operator Further, it is possible to adopt a configuration (method) for specifying the position of the dent M by pointing the position of the dent M on the screen with a pointing device.

  Next, the processing unit 10 executes “a misalignment state specifying process”. In this “misalignment state specifying process”, the processing unit 10 first sets the nine dents M1 to M9 formed by probing the nine inspection probes P1 to P9 that should be arranged along the straight line L1. An approximate straight line La1 (an example of “first approximate straight line”) obtained by linearly approximating eight of them, and formed by probing six inspection probes P22 to P26 and P1 that should be arranged along the straight line L2. An approximate straight line La2 (an example of a “second approximate straight line”) obtained by linearly approximating five of the six dents M22 to M26, M1, and nine inspection probes P14 that should be arranged along the straight line L3 Approximate straight line La3 (an example of “third approximate straight line”) obtained by linearly approximating eight of nine dents M14 to M22 formed by probing of ˜P22, and along straight line L4 Approximate straight line La4 (an example of “fourth approximate straight line”) obtained by linearly approximating five of six dents M9 to M14 formed by probing six inspection probes P9 to P14 to be arranged. Identify each.

  In this case, as shown in FIG. 2, among the six inspection probes Pa to Pf that should be arranged along the straight line L, when the inspection probe Pc is largely bent within the allowable range, When the six dents Ma to Mf formed by probing the inspection probes Pa to Pf are linearly approximated, the presence of the dent Mc formed by probing the inspection probe Pc that is greatly separated from the straight line L. As a result, the approximate straight line Lb that is greatly separated from the straight line L is specified. Therefore, in the substrate inspection apparatus 1, in the example of FIG. 2, first, all six dents Ma to Mf formed by probing the inspection probes Pa to Pf to be arranged along the straight line L are targeted. As an example, the approximate straight line Lb is obtained by performing linear approximation according to the least square method. Next, among the dents Ma to Mf, the smallest two of the dents Ma, Mb, and Md to Mf excluding the one having the largest separation distance from the approximate line Lb (in this example, the dent Mc). By approximating the straight line according to the multiplication method, an approximate straight line La used for specifying the “intersection point” later is obtained.

  Specifically, when specifying the approximate straight line La1, first, the approximate straight line corresponding to the “A approximate straight line” (to the approximate straight line Lb in the above example) is obtained by linearly approximating all of the dents M1 to M9. The corresponding straight line (not shown) is identified. Next, one of the dents M1 to M9 having the longest separation distance from the specified approximate straight line (in this example, the dent M1: “predetermined number” is an example of “1”) is excluded. By approximating the dents M2 to M9 with a straight line, an approximate straight line La1 is specified as shown in FIG. When specifying the approximate straight line La2, first, the approximate straight line corresponding to the “B approximate straight line” (corresponding to the approximate straight line Lb in the above example) is obtained by linearly approximating all of the dents M22 to M26, M1. Straight line (not shown). Next, one of the dents M22 to M26, M1 having the largest separation distance from the specified approximate straight line (in this example, the dent M1: “predetermined number” is an example where “1” is “1”). The approximate straight line La2 is specified by performing straight line approximation on the removed dents M22 to M26.

  Furthermore, when specifying the approximate straight line La3, first, the straight line approximation is performed for all of the dents M14 to M22, so that the approximate straight line corresponding to the “C approximate straight line” (the straight line corresponding to the approximate straight line Lb in the above example) is obtained. : Not shown). Next, one of the dents M14 to M22 having the longest separation distance from the specified approximate straight line (in this example, the dent M20: an example in which “predetermined number” is “1”) is excluded. An approximate straight line La3 is specified by performing linear approximation on the dents M14 to M19, M21, and M22. Further, when specifying the approximate straight line La4, first, the straight line approximation is performed for all of the dents M9 to M14, so that the approximate straight line corresponding to the “D approximate straight line” (the straight line corresponding to the approximate straight line Lb in the above example). : Not shown). Next, one of the dents M9 to M14 having the largest separation distance from the specified approximate straight line (in this example, the dent M11: an example in which “predetermined number” is “1”) is excluded. The approximate straight line La4 is specified by performing linear approximation on the dents M9, M10, and M12 to M14.

  The “predetermined number of dents” having a large separation distance from the “A approximate straight line”, “B approximate straight line”, “C approximate straight line”, and “D approximate straight line” The first approximation line, the second approximation line, and the third approximation line are not limited to the “dentation marks” but are approximated by a straight line except for “a plurality of impressions having a large separation distance”. A configuration (method) for obtaining the “fourth approximate straight line” can also be employed.

  Next, the processing unit 10 specifies an intersection point Ca1 of the approximate straight lines La1 and La2, an intersection point Ca2 of the approximate straight lines La3 and La4, an intersection point Ca3 of the approximate straight lines La1 and La4, and an intersection point Ca4 of the approximate straight lines La2 and La3. . Subsequently, the processing unit 10 determines, based on the position information of the specified intersection points Ca1 to Ca4 and the reference position information D0 read from the storage unit 11, the reference point where the intersection point Ca1 should be located (the intersection point C1 of the straight lines L1 and L2). Between the reference point (intersection C2 of the straight lines L3 and L4) and the reference point (intersection C3 of the straight lines L1 and L4). And the intersection Ca3, and the positional relationship between the intersection Ca4 and the reference point (the intersection C4 of the straight lines L2 and L3) where the intersection Ca4 should be located are specified. Accordingly, the displacement amount and the displacement direction of each of the inspection probes P1 to P26 when the dents M1 to M26 are formed by probing the test head 5 (inspection probes P1 to P26) on the dent sheet 30. Is specified, and the “positional deviation state specifying process” is completed.

  Next, the processing unit 10 generates correction information Dr based on the positional shift amount and the positional shift direction specified in the “positional shift state specifying process” and stores the correction information Dr in the storage unit 11. Thereby, the “correction information acquisition process” is completed. Thereafter, when inspecting the inspection target substrate 20, the processing unit 10 converts the probing information Dp to the correction information Dr in a state where the substrate holding mechanism 2 holding the inspection target substrate 20 is transported to the probing processing position by the transport mechanism 3. The test head 5 is lowered toward the inspection target substrate 20 by controlling the moving mechanism 6 with correction based on the above. At this time, in the substrate inspection apparatus 1, the probing information Dp is corrected based on the correction information Dr that has a sufficiently small influence of the inspection probe P1 that is brought into contact with a position greatly displaced from the reference position. A situation in which the contact positions of the probes P2 to P26 are changed more than necessary is avoided.

  As described above, according to the substrate inspection apparatus 1 and the method for acquiring the correction information Dr in the substrate inspection apparatus 1, the approximate straight line La1 obtained by linear approximation of at least three dents M and the linear approximation of at least three dents M are provided. The intersection Ca1 at which the approximate straight line La2 intersects is specified, and the reference probing of the probing position of the inspection probe P is performed based on the position information of the specified intersection Ca1 and the intersection C1 specified based on the reference position information D0. By specifying the positional deviation amount and the positional deviation direction with respect to the position, even if there is a dent M having a certain amount of positional deviation from the reference probing position among the plurality of dents M, each dent M is straightened. Since the influence of the dent M having a large misalignment amount is sufficiently reduced by the approximation, the intersection of the approximate lines specified by the linear approximation By acquiring a correction information Dr based, it can influence the dents M large positional shift amount to obtain a sufficiently small correction information Dr. Therefore, since the situation where the correction information Dr that will correct the probing information Dp larger than necessary is avoided, each inspection is performed by controlling the moving mechanism 6 based on the probing information Dp and the correction information Dr. As a result that the probes P1 to P26 can be accurately brought into contact with a desired inspection point on the inspection target substrate 20, the quality of the inspection target substrate 20 can be accurately inspected.

  In addition, according to the substrate inspection apparatus 1 and the method for acquiring the correction information Dr in the substrate inspection apparatus 1, a predetermined number (in this example, the separation distance from the “A approximate line” is large when specifying the approximate line La1. 1) except for the dent M, and excluding a predetermined number (one in this example) of dents M having a large separation distance from the “B approximate line” when specifying the approximate line La2. Thus, when the approximate lines La1 and La2 for obtaining the intersection point Ca1 are specified, the influence of the dent M having a large displacement amount can be sufficiently reduced. As a result, the dent M having a large displacement amount can be obtained. It is possible to acquire correction information Dr that has a smaller influence of. Therefore, by controlling the moving mechanism 6 based on the probing information Dp and the correction information Dr, each inspection probe P1 to P26 can be brought into contact with a desired inspection point on the inspection target substrate 20 more accurately. As a result, the quality of the inspection target substrate 20 can be inspected more accurately.

  Further, according to the substrate inspection apparatus 1 and the method for obtaining the correction information Dr in the substrate inspection apparatus 1, the intersection point Ca1 is specified, and the approximate straight line La3 obtained by linearly approximating at least three dents M, and at least 3 An intersection point Ca2 intersecting with an approximate straight line La4 obtained by linearly approximating two dents M is specified, and the probing position of the probe P for inspection P is determined based on the position information of the specified intersection points Ca1 and Ca2 and the reference position information D0. Compared with the configuration (method) in which the correction information Dr is obtained based only on the intersection point Ca1 by specifying the displacement amount and the displacement direction with respect to the reference probing position, the point to be compared with the reference position information D0 is the intersection point Ca1, The reference probe for the probing position of the probe P for inspection is increased by Ca2 (in this example, four points of intersection points Ca1 to Ca4). Positional displacement amount and a positional displacement direction with respect to the position it is possible to more accurately identify.

  In addition, according to the substrate inspection apparatus 1 and the acquisition method of the correction information Dr in the substrate inspection apparatus 1, a predetermined number (in this example, the separation distance from the “C approximate line” is large when specifying the approximate line La3. 1) except for the dent M, and excluding a predetermined number (one in this example) of dents M having a large distance from the “D approximate line” when specifying the approximate line La4. As a result, when the approximate lines La3 and La4 for obtaining the intersection C2 are specified, the influence of the dent M having a large positional deviation amount can be sufficiently reduced. As a result, the dent M having a large positional deviation amount can be obtained. It is possible to acquire correction information Dr that has a smaller influence of.

  The configuration of the “substrate inspection apparatus” and the specific method of the “correction information acquisition method” are not limited to the configuration of the substrate inspection apparatus 1 and the acquisition method of the correction information Dr in the substrate inspection apparatus 1. For example, instead of the configuration (method) for generating the correction information Dr based on the four points of the intersection points Ca1 to Ca4 and the reference position information D0, the correction information Dr based on the intersection point Ca1 and the reference position information D0 (intersection point C1). A configuration (method) for generating the correction information Dr based on the intersection points Ca1 and Ca2 and the reference position information D0 (intersection points C1 and C2), and any three of the intersection points Ca1 to Ca4 A configuration (method) for generating the correction information Dr based on the reference position information D0 (three corresponding points among the intersections C1 to C4) may be employed. Even when such a configuration is adopted, the same effects as those of the substrate inspection apparatus 1 can be obtained.

  Further, when acquiring the correction information Dr, instead of the “first approximate straight line”, “at least one of the plurality of dents formed by probing the plurality of inspection probes arranged along the first curve”. Using a first approximate curve obtained by approximating three dents in a curve, or by probing a plurality of inspection probes arranged along the second curve instead of the “second approximate line” The second approximate curve obtained by approximating at least three dents among the plurality of dents is used, or “a third approximate straight line” is used instead of “the third approximate line”. In addition, a third approximate curve obtained by approximating at least three dents among a plurality of dents formed by probing a plurality of inspection probes is used, or instead of the “fourth approximate line”, A plurality of lines arranged along the fourth curve; It may be or use a fourth approximation curve "that curve approximation at least three dents of the plurality of dents formed by probing 査用 probe. When such a configuration (method) is adopted, “approximate curve” may be specified by performing “curve approximation of each dent M” instead of the above-mentioned “linear approximation of each dent M”. . Therefore, even when such a configuration is adopted, the same effects as those of the substrate inspection apparatus 1 can be obtained.

  Furthermore, an intersection between the “first approximate line” and the “second approximate curve” is defined as a “first intersection”, or an intersection between the “first approximate curve” and the “second approximate line” is defined as “ The first intersection point, the intersection point between the third approximate line and the fourth approximate curve is the second intersection point, or the third approximate curve and the fourth approximate line. Or “second intersection point”. Even when such a configuration (method) is employed, the same effects as those of the substrate inspection apparatus 1 and the method for obtaining the correction information Dr in the substrate inspection apparatus 1 described above can be obtained. In addition, when probing the inspection target substrate 20 or the dent sheet 30, a “moving mechanism” that moves the substrate holding mechanism 2 toward the test head 5 that is fixedly arranged, or a test toward the substrate holding mechanism 2. A “substrate inspection apparatus” may be configured by including a “moving mechanism” that moves the head 5 and moves the substrate holding mechanism 2 toward the test head 5.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Board | substrate holding | maintenance mechanism 3 Conveyance mechanism 4 Camera 5 Test head 6 Movement mechanism 7 Measuring part 8 Operation part 9 Display part 10 Processing part 11 Memory | storage part 20 Board | substrate 30 to be inspected 30 Stamped sheet C1-C4, Ca1-Ca4 Intersection D0 Reference position information D1 Imaging data Dp Probing information Dr Correction information L, L1 to L4 Straight line La, Lb, La1 to La4 Approximate straight line M1 to M26, Ma to Mf Indentation P1 to P26 Inspection probe

Claims (8)

A probe unit provided with a plurality of contact-type inspection probes, a substrate holding mechanism for holding a substrate to be inspected, and at least one of the probe unit and the substrate holding mechanism is moved with respect to the other for the inspection; A moving mechanism for probing a probe on the substrate to be inspected, an imaging unit for imaging the holding position of the substrate to be inspected in the substrate holding mechanism and outputting image data, and at least one of the at least one during probing with respect to the substrate to be inspected A storage unit for storing probing information capable of specifying a movement amount and a movement direction to be moved with respect to the other, an image pickup by the image pickup unit, and the at least one movement by the movement mechanism; Compensation to correct the probing information used during probing And a processing unit that executes correction information acquisition processing for acquiring information, and the processing unit controls the moving mechanism according to the probing information and is disposed at the holding position in the correction information acquisition processing. Protrusion of the probe for inspection on a trace sheet to form a dent on the dent sheet, imaging processing for controlling the imaging unit to image the dent sheet, and output from the imaging unit A displacement state that specifies a displacement amount and a displacement direction with respect to a reference probing position of the probing position of the inspection probe in the dent formation process based on the position of the dent specified based on the image data that has been performed Specific processing is executed in this order, and the positional deviation amount and the positional deviation direction identified in the positional deviation state identification processing are determined. A substrate inspection apparatus for acquiring a serial correction information,
The processing unit includes at least three of the plurality of dents formed by probing the plurality of inspection probes arranged along the first straight line in the positional deviation state specifying process. A first approximate straight line obtained by linearly approximating and a curve of at least three of the plurality of dents formed by probing the plurality of inspection probes arranged along the first curve. One of the approximated first approximate curves and at least three of the plurality of dents formed by probing the plurality of inspection probes arranged along the second straight line are straight lines. At least one of the plurality of dents formed by probing the second approximate straight line and the plurality of inspection probes arranged along the second curve. One of the first straight line and the first curve corresponding to any one of the first straight line and the first curved line is specified by identifying a first intersection where one of the second approximate curves obtained by curve approximation of the three dents. Reference position information stored in the storage unit so that a first reference point at which one of the second line and the second curve and one corresponding to the second curve intersects can be specified, and the specified A substrate inspection apparatus that identifies the amount of displacement and the direction of displacement based on position information of a first intersection.   In the misalignment state specifying process, the processing unit uses an A approximate straight line obtained by linearly approximating the plurality of dents formed by probing the plurality of inspection probes arranged along the first straight line. Of the plurality of inspection probes arranged along the first approximate straight line obtained by linearly approximating the dents excluding a predetermined number of the dents having a large separation distance, and the first curve One of the first approximate curves obtained by curve approximation of the dents excluding a predetermined number of the dents having a large separation distance from the approximate A curve obtained by approximating the plurality of dents formed by probing. A predetermined distance is large from a B approximate straight line obtained by linearly approximating a plurality of the dents formed by probing a plurality of the inspection probes arranged along the second straight line. A plurality of the probe formed by probing the second approximate straight line obtained by linearly approximating the dents excluding the number of dents and the plurality of inspection probes arranged along the second curve. The point at which one of the second approximate curves obtained by curve approximation of the dents excluding a predetermined number of the dents having a large separation distance from the B approximate curve obtained by curve approximation of the dents intersects the first. The substrate inspection apparatus according to claim 1, wherein the positional deviation amount and the positional deviation direction are specified as intersections of one.   The processing unit specifies the first intersection and at least three of the plurality of dents formed by probing the plurality of inspection probes arranged along a third straight line. At least three of the plurality of dents formed by probing a plurality of the inspection probes arranged along a third curve, and a third approximate straight line obtained by linearly approximating the dent And at least three of the plurality of dents formed by probing the plurality of inspection probes arranged along the fourth straight line. At least a plurality of the dents formed by probing the plurality of inspection probes arranged along the fourth curve A second intersection point that intersects one of the fourth approximate curves obtained by curve approximation of the two dents, and includes the first reference point, the third straight line, and the third curve. And the second reference point at which one of the fourth line and one of the fourth curves corresponds to the one of the fourth line and the fourth curve is stored in the storage unit so as to be specified. The substrate inspection apparatus according to claim 1, wherein the positional deviation amount and the positional deviation direction are identified based on the reference position information and the positional information of the identified first intersection and second intersection.   The processing unit is defined in advance with a large separation distance from a C approximate straight line obtained by linearly approximating a plurality of the dents formed by probing a plurality of the inspection probes arranged along the third straight line. A plurality of the probe formed by probing the third approximate straight line obtained by linearly approximating the dents excluding the number of dents, and a plurality of the inspection probes arranged along the third curve. Along the fourth straight line and any one of the third approximate curves obtained by curve approximation of the dents excluding a predetermined number of the dents having a large separation distance from the C approximate curve obtained by curve approximation of the dents. The dents excluding a predetermined number of the dents having a large distance from a D approximate straight line obtained by linearly approximating the plurality of dents formed by probing the plurality of inspection probes arranged in a row. The fourth approximate straight line approximated by line and the distance from the D approximate curve obtained by approximating the plurality of dents formed by probing the plurality of inspection probes arranged along the fourth curve. The position shift amount and the position shift direction are defined as a point at which one of the fourth approximate curves obtained by curve approximation of the dents excluding a predetermined number of dents having a large distance intersects the second intersection. 4. The substrate inspection apparatus according to claim 3, wherein A probe unit provided with a plurality of contact-type inspection probes, a substrate holding mechanism for holding a substrate to be inspected, and at least one of the probe unit and the substrate holding mechanism is moved with respect to the other for the inspection; Using a substrate inspection apparatus comprising: a moving mechanism for probing a probe on the inspection target substrate; and an imaging unit for imaging a holding position of the inspection target substrate in the substrate holding mechanism and outputting image data. when you get a correction information for correcting the at least one possible probing information identifying the movement amount and movement direction to be moved relative to the other when probing for the substrate, the moving mechanism is controlled according to said probing information Probing the inspection probe to the dent sheet disposed at the holding position It is specified based on a dent formation process for forming a dent on the dent sheet, an imaging process for controlling the imaging unit to image the dent sheet, and the image data output from the imaging unit. Based on the position of the dent, a positional deviation state specifying process for specifying a positional deviation amount and a positional deviation direction with respect to a reference probing position of the probing position of the inspection probe in the dent forming process is executed in this order, A correction information acquisition method for acquiring the positional shift amount and the positional shift direction specified in the positional shift state specifying process as the correction information,
In the misalignment state specifying process, a first linear approximation of at least three of the plurality of dents formed by probing the plurality of inspection probes arranged along the first straight line. A first approximation line that approximates at least three of the plurality of dents formed by probing a plurality of the inspection probes disposed along the first approximate line and the first curve. A second approximation that linearly approximates at least three of the plurality of dents formed by probing any one of the approximate curves and the plurality of the inspection probes arranged along the second straight line. An approximate straight line and at least three of the plurality of dents formed by probing the plurality of inspection probes arranged along the second curve. A first intersection point that intersects one of the second approximate curves obtained by curve approximation of the first curve and the second curve corresponding to one of the first curve and the first curve and the second curve Based on the reference position information that can specify the first reference point that intersects one of the straight line and one of the second curves, and the position information of the specified first intersection point, A correction information acquisition method for specifying a displacement amount and the displacement direction.   In the misalignment state specifying process, a separation distance from an approximate A straight line obtained by linearly approximating a plurality of the dents formed by probing a plurality of the inspection probes arranged along the first straight line is large. The probe is formed by probing the first approximate straight line obtained by linearly approximating the dents excluding a predetermined number of the dents and a plurality of the inspection probes arranged along the first curve. One of the first approximate curves obtained by curve approximation of the dents excluding a predetermined number of the dents having a large separation distance from the A approximate curve obtained by curve approximation of the plurality of dents, and the second A predetermined number of the distances from a B approximate straight line that is a linear approximation of the plurality of dents formed by probing the plurality of inspection probes arranged along a straight line is large. The second approximate straight line obtained by linearly approximating the dent excluding the trace, and a plurality of the dents formed by probing the plurality of inspection probes arranged along the second curve are approximated by a curve. The position where the first intersection is the point where one of the second approximate curves obtained by curve approximation of the dents excluding a predetermined number of the dents having a large separation distance from the B approximate curve The correction information acquisition method according to claim 5, wherein a deviation amount and the positional deviation direction are specified.   In the misalignment state specifying process, at least one of the plurality of dents formed by probing the plurality of inspection probes arranged along the third straight line while specifying the first intersection. At least three of the plurality of dents formed by probing a plurality of the inspection probes arranged along a third curve, and a third approximate straight line obtained by linearly approximating the three dents At least three of the plurality of dents formed by probing any one of the third approximate curves obtained by curve approximation of the dents and the plurality of inspection probes arranged along the fourth straight line A plurality of the striking lines formed by probing a plurality of inspection probes arranged along a fourth approximate straight line that approximates the striking line linearly and a fourth curve. A second intersection that intersects any one of the fourth approximate curves obtained by curve approximation of at least three of the dents is determined, and the first reference point, the third straight line, and the first The reference that can specify a second reference point that intersects one of the three curves corresponding to one of the four curves and one of the fourth straight line and the fourth curve The correction information acquisition method according to claim 5 or 6, wherein the position shift amount and the position shift direction are specified based on position information and position information of the specified first and second intersections.   In the misalignment state specifying process, a separation distance from a C approximate straight line obtained by linearly approximating a plurality of the dents formed by probing a plurality of the inspection probes arranged along the third straight line is large. The probe is formed by probing the third approximate straight line obtained by linearly approximating the dents excluding a predetermined number of the dents, and a plurality of the inspection probes arranged along the third curve. Any one of the third approximate curves obtained by curve approximation of the dents excluding a predetermined number of the dents having a large separation distance from a C approximate curve obtained by curve approximation of a plurality of the dents, and the fourth A predetermined number of the distances from a D approximate straight line that is a linear approximation of a plurality of the dents formed by probing a plurality of the inspection probes arranged along a straight line. Curve-approximating the fourth approximate straight line obtained by linearly approximating the dent excluding the trace and a plurality of the dents formed by probing the plurality of inspection probes arranged along the fourth curve The position where the second intersection is defined as a point at which one of the fourth approximate curves obtained by curve approximation of the dents excluding a predetermined number of the dents having a large separation distance from the D approximate curve is the second intersection point The correction information acquisition method according to claim 7, wherein a deviation amount and the positional deviation direction are specified.

Images