JP5844589B2 - Anisotropic conductive film, connection method using the same, and connection structure - Google Patents

Description

The present invention relates to an anisotropic conductive film , a connection method for connecting a pair of circuit members using the anisotropic conductive film , and a connection structure obtained by the connection method.

  Conventionally, when a pair of circuit members are electrically connected, a circuit connection member in which conductive particles are dispersed has been used. Examples of the circuit connection member include an anisotropic conductive film (ACF). A connection surface on which a wiring electrode of a substrate is formed via an anisotropic conductive film and a terminal electrode (bump) of an electronic component. There is a method of connecting the connecting surface formed with a). In the connection method using the anisotropic conductive film, the anisotropic conductive film is temporarily attached on the connection surface of the substrate, and the anisotropic conductive film and the connection surface of the electronic component are opposed to each other on the anisotropic conductive film. An electronic component is placed on and heat-pressed. Thereby, the electroconductive particle in an anisotropic conductive film is inserted | pinched between the terminal electrode of an electronic component, and the wiring electrode of a board | substrate, and is crushed. As a result, the terminal electrode of the electronic component and the wiring electrode of the substrate are electrically connected via the conductive particles.

  Conductive particles that are not between the terminal electrode and the wiring electrode are present in the insulating adhesive composition of the anisotropic conductive film and maintain an electrically insulated state. That is, electrical continuity is achieved only between the terminal electrode and the wiring electrode.

  As an adhesive composition constituting such a circuit connecting member, there has heretofore been one containing an epoxy resin or the like. This adhesive composition generally contains an epoxy resin, a curing agent such as a phenol resin that reacts with the epoxy resin, a latent curing agent that accelerates the reaction between the epoxy resin and the curing agent, and the like.

  In recent years, an anisotropic conductive film is required to have an adhesive composition that cures at a low temperature in a short time in order to shorten the production time. In order to meet this demand, a radical curable adhesive composition containing a radical polymerization initiator such as a (meth) acrylate derivative and a peroxide has attracted attention. The radical curing type circuit connection material is advantageous in shortening the production time because the curing reaction proceeds in a short time due to radicals rich in reactivity (see Patent Documents 1 and 2).

JP 2008-291199 A JP 2011-37953 A

  However, (meth) acrylate derivatives tend to have a large shrinkage during curing and a large internal stress after curing compared to epoxy resins and the like. For this reason, generally, when a circuit connection material containing a radical curable adhesive composition is used, bubbles may be generated at the interface between the adhesive layer and a substrate such as an LCD panel, which may reduce connection reliability. is there. In particular, in the TFT (Thin Film Transistor) type LCD panel, the generation of bubbles becomes remarkable at the interface with the silicon nitride (SiN) film used as an insulating film on the panel wiring, resulting in poor adhesion, resulting in connection reliability. May be greatly reduced.

The present invention has been proposed in view of such a conventional situation, and when subjected to a high-temperature and high-humidity treatment, the adhesion with the interface with the silicon nitride film is improved to provide excellent connection reliability. An object of the present invention is to provide an anisotropic conductive film that can be exhibited, a connection method for connecting a pair of circuit members using the anisotropic conductive film , and a connection structure obtained by the connection method. .

In order to solve the above-described problems, the anisotropic conductive film of the present invention comprises (1) a polyfunctional (meth) acrylate monomer, (2) a radical polymerization initiator that generates free radicals by heat or light, 3) A monofunctional (meth) acrylate monomer containing a monofunctional (meth) acrylate monomer having a blending amount of 3 to 20% by mass in the insulating adhesive composition and (4) metal-coated resin particles. Is represented by the chemical formula (1), in which R is a biphenyl group or a naphthalene group, and the bonding position between R and an oxygen atom bonded thereto is an ortho position, a meta position, or a para position, n is 1-10.

In order to solve the above-described problems, the connection structure according to the present invention is opposed to each other with an anisotropic conductive film interposed between a pair of circuit members arranged so that circuit electrodes face each other. In the connection structure in which the circuit members are electrically and mechanically connected, one of the circuit members is covered with a silicon nitride film, and the anisotropic conductive film has (1) polyfunctional (meta) An acrylate monomer, (2) a radical polymerization initiator that generates free radicals by heat or light, and (3) a monofunctional (meth) content in the insulating adhesive composition of 3 to 20% by mass. A monofunctional (meth) acrylate monomer containing an acrylate monomer and (4) metal-coated resin particles is represented by the chemical formula (1). In the chemical formula (1), R is a biphenyl group or a naphthalene group, and R And it Bonding position to the oxygen atom if the ortho, meta, or para, n represents characterized in that 1 to 10.

In addition, in order to solve the above-described problem, the connection method of the present invention is a method in which an anisotropic conductive film is interposed between a pair of circuit members arranged so that circuit electrodes face each other, and heat pressing is performed. Thus, in the connection method of electrically and mechanically connecting the circuit members facing each other, one of the circuit members is covered with a silicon nitride film, and the anisotropic conductive film is (1) polyfunctional ( A monofunctional (meth) acrylate monomer, (2) a radical polymerization initiator that generates free radicals by heat or light, and (3) a blending amount in the insulating adhesive composition is 3 to 20% by mass ( A (meth) acrylate monomer and (4) metal-coated resin particles are contained, and the monofunctional (meth) acrylate monomer is represented by the chemical formula (1), and in the chemical formula (1), R is a biphenyl group or a naphthalene group. , R Bonding position to the oxygen atom bonded thereto is ortho, meta, or para, n represents characterized in that 1 to 10.

According to the present invention, an anisotropic conductive film capable of improving adhesion with an interface with a silicon nitride film and exhibiting excellent connection reliability when subjected to a high temperature and high humidity treatment, and this A connection method for connecting a pair of circuit members using an anisotropic conductive film, and a connection structure obtained by the connection method can be provided.

Hereinafter, a specific embodiment of the present invention (hereinafter referred to as “the present embodiment”) will be described in detail in the following order with reference to the drawings.
<1. Circuit connection material>
<2. Connection method>
<3. Example>

<1. Circuit connection material>
The circuit connecting material in the present embodiment is interposed between a pair of circuit members arranged so that circuit electrodes face each other, and electrically and mechanically connects the facing circuit members. The circuit connection material in the present embodiment is applied to an anisotropic conductive film formed into a film shape by dispersing a plurality of conductive particles in an insulating adhesive composition.

  The insulating adhesive composition contains a polyfunctional (meth) acrylate compound, a monofunctional (meth) acrylate monomer, a radical polymerization initiator that generates free radicals by heat or light, and a film-forming resin. Here, (meth) acrylate includes acrylate and methacrylate.

  Both polyfunctional (meth) acrylate compounds and monofunctional (meth) acrylate monomers are radical polymerizable resins and form a crosslinked structure in the insulating adhesive composition when the anisotropic conductive film is heated. Thus, the adhesive composition is cured.

  The monofunctional (meth) acrylate monomer is represented by the chemical formula (1).

  In chemical formula (1), R is a biphenyl group or a naphthalene group. The bonding position between R and the oxygen atom O bonded thereto is the ortho, meta, or para position. n is 1 to 10, and 1 to 3 is particularly preferable. When n is too large, the cross-linked structure becomes loose, and the adhesion (adhesiveness) of the anisotropic conductive film to the silicon nitride film is lowered.

The monofunctional (meth) acrylate monomer thus has a bulky R, an appropriate length of (CH ₂ CH ₂ 0) _n, and a radical polymerization —COCH═CH _{2, so} that during polymerization, Since the shrinkage during curing is reduced and the internal stress after curing is also reduced, the generation of bubbles at the interface between the adhesive layer and the silicon nitride film of the substrate is suppressed during connection, and the connection is made with high adhesion. Can do. That is, by including such a monofunctional (meth) acrylate monomer in the anisotropic conductive film, it is possible to obtain high connection reliability in a connection structure formed by using this anisotropic conductive film. it can.

  Examples of the monofunctional (meth) acrylate monomer include ethoxylated o-phenylphenol acrylate represented by the chemical formula (2).

  The bonding position between the biphenyl group and the oxygen atom bonded thereto is not limited to the ortho position as shown in chemical formula (2), but is meta-position (ethoxylated m-phenylphenol acrylate) or para-position (ethoxylated p-phenyl). Phenol acrylate).

  Further, when R is a naphthalene group, the bonding position between the naphthalene group and the oxygen atom bonded thereto may be any of the ortho position, the meta position, and the para position.

  The compounding amount of the monofunctional (meth) acrylate monomer in the insulating adhesive composition is 3 to 20% by mass (3 to 20 parts by mass with respect to 100 parts by mass of the insulating adhesive composition). preferable. When the content is less than 3% by mass, the effect of the monofunctional (meth) acrylate monomer is difficult to obtain, and the adhesive strength is weakened. On the other hand, when it exceeds 20 mass%, it will become a hardened | cured material inferior to heat resistance, and a conduction | electrical_connection resistance value will become high.

  By including such a monofunctional (meth) acrylic monomer, the adhesiveness with the interface with the silicon nitride film is improved while suppressing the fluctuation of the resistance value between the circuit electrodes when subjected to the high temperature and high humidity treatment. It is possible to exhibit excellent connection reliability.

  Examples of the polyfunctional (meth) acrylate compound include polyfunctional (meth) acrylate monomers, polyfunctional (meth) acrylate oligomers, polyfunctional (meth) acrylate polymers, and the like.

  Bifunctional (meth) acrylates include bisphenol F-EO-modified di (meth) acrylate, bisphenol A-EO-modified di (meth) acrylate, polypropylene glycol di (meth) acrylate, polyethylene glycol (meth) acrylate, and tricyclodecanedi. Examples include methylol di (meth) acrylate and dicyclopentadiene (meth) acrylate.

  Examples of the trifunctional (meth) acrylate include trimethylolpropane tri (meth) acrylate, trimethylolpropane PO-modified (meth) acrylate, and isocyanuric acid EO-modified tri (meth) acrylate.

  Examples of tetrafunctional or higher functional (meth) acrylates include dipentaerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, pentaerythritol tetra (meth) acrylate, and ditrimethylolpropane tetraacrylate. In addition, polyfunctional urethane (meth) acrylates can also be used.

  The radical polymerization initiator is a curing agent that generates a free radical by being decomposed by heat or light, and a known radical polymerization initiator can be selected. For example, peroxide polymerization initiators such as diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, azo polymerization initiator such as azobisbutyronitrile, redox System polymerization initiators and the like.

  If the blending amount of the radical polymerization initiator in the insulating adhesive composition is too small, the curing becomes insufficient, and if it is too large, the cohesive force of the anisotropic conductive film decreases, and therefore the (meth) acrylate compound 100 mass. The amount is preferably 1 to 10 parts by mass, more preferably 3 to 7 parts by mass with respect to parts.

  As the film forming resin, for example, a thermoplastic elastomer such as an epoxy resin, a polyester resin, a polyurethane resin, a phenoxy resin, polyamide, EVA, or the like can be used. Among them, for heat resistance and adhesiveness, polyester resins, polyurethane resins, phenoxy resins, particularly phenoxy resins such as bis A type epoxy resins and phenoxy resins having a fluorene skeleton can be mentioned.

  If the amount of the film-forming resin is too small, a film is not formed. If the amount is too large, the resin elimination for obtaining electrical connection tends to be low. Adhesive composition) It is 80-30 mass parts with respect to 100 mass parts, More preferably, it is 70-40 mass parts.

  As the conductive particles, the conductive particles used in conventional anisotropic conductive films can be used. For example, metal particles such as gold particles, silver particles, and nickel particles, benzoguanamine resins, styrene resins, etc. Examples thereof include metal-coated resin particles whose surfaces are coated with a metal such as gold, nickel, and zinc. The average particle diameter of the conductive particles is preferably 1 to 20 μm, more preferably 2 to 10 μm, from the viewpoint of connection reliability.

The average particle density of the conductive particles in the insulating adhesive composition is preferably 500 to 50000 / mm ² , more preferably 1000 to 30000 / mm ² from the viewpoint of connection reliability and insulation reliability. .

  The insulating adhesive composition can contain a phosphate acrylate in order to improve the adhesion to metal.

  In addition, the insulating adhesive composition includes other additive compositions such as dilution monomers such as various acrylic monomers, fillers, softeners, colorants, flame retardants, thixotropic agents, silane coupling agents. Further, silica fine particles and the like can be contained.

  By including the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved. By including silica fine particles, the storage elastic modulus, the linear expansion coefficient, etc. can be adjusted to improve the connection reliability.

  The anisotropic conductive film of the present embodiment is a radically polymerizable resin, a polyfunctional (meth) acrylate compound, a monofunctional (meth) acrylate monomer represented by the chemical formula (1), a (meth) acrylate compound, In the insulating adhesive composition containing the radical polymerization initiator and the film-forming resin, the conductive particles are uniformly dispersed and mixed by a known dispersion method, and the resulting mixture is used as a silicone release treatment polyester film or the like. It can manufacture by apply | coating to a peeling film so that it may become 10-50 micrometers in dry thickness by well-known application | coating methods, such as a bar coater, for example, putting in a 50-90 degreeC thermostat, and drying. When an insulating adhesive film is laminated on this anisotropic conductive film, it can be obtained by applying an insulating adhesive composition on the anisotropic conductive film and drying it.

  As the release film, for example, a release agent such as silicone is applied to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene), etc. While preventing the conductive conductive film from drying, the shape of the anisotropic conductive film is maintained.

According to the anisotropic conductive film of the present embodiment, by including the monofunctional (meth) acrylic monomer having the structure represented by the chemical formula (1), between the circuit electrodes when subjected to high temperature and high humidity treatment While suppressing the fluctuation of the resistance value, it is possible to improve the adhesion with the interface with the silicon nitride film and to exhibit excellent connection reliability.
<2. Connection method>

  Provided is a connection method in which a glass substrate constituting an LCD (Liquid Crystal Display) panel and a COF (Chip On Film) as a wiring material are connected by pressure bonding through the anisotropic conductive film of the present embodiment. Wiring electrodes are formed on the glass substrate at a fine pitch. Further, terminal electrodes are formed on the COF according to the wiring pattern of the wiring electrodes. And by this connection method, the connection structure is obtained by anisotropically connecting the wiring electrode of the glass substrate and the terminal electrode of the COF.

  Hereinafter, a connection method in which the glass substrate and the COF are crimped and connected via an anisotropic conductive film will be specifically described. First, a surface on which a wiring electrode on a glass substrate is formed and an anisotropic conductive film are temporarily attached to the glass substrate (temporary attaching step). In this temporary bonding, the pressure surface of the head part heated to a low temperature of the pressure bonder is lightly pressed against the upper surface of the conductive particle-containing layer and pressed at a low pressure. The heating temperature is a low temperature (for example, a predetermined value of 60 to 80 ° C.) such that the insulating adhesive composition flows but does not cure. Moreover, the pressurization pressure in a temporary sticking process is a predetermined value in 0.5 MPa-2 MPa, for example. Moreover, the heat pressurization time in a temporary sticking process is predetermined time in 1-3 seconds (sec), for example.

  After temporarily sticking the anisotropic conductive film in the temporary sticking step, check the alignment state of the anisotropic conductive film, and if there is a problem such as misalignment, after this temporary sticking step, anisotropic The repair process which peels a conductive conductive film and temporarily sticks an anisotropic conductive film in a correct position again is performed (repair process).

  Next, the COF is disposed on the anisotropic conductive film so that the bump and the wiring electrode face each other (arrangement step).

  Then, the pressure surface (not shown) of the heated head part of the pressure bonder is pressed against the upper surface of the COF, and the glass substrate and the COF are connected by pressure bonding (connection process).

  The pressurizing pressure in the connecting step is, for example, a predetermined value from 1 MPa to 5 MPa. The heating temperature in the connecting step is a temperature (for example, a predetermined value of 160 to 210 ° C.) at which the insulating particles are melted and the insulating adhesive composition is cured. Moreover, the heat pressurization time in a connection process is predetermined time in 3 to 10 seconds, for example.

  In this way, the conductive particles are sandwiched between the wiring electrode and the bump, and the adhesive composition is cured. Thereby, a glass substrate and COF are electrically and mechanically connected. Then, a connection structure in which the glass substrate and the COF are anisotropically conductively connected is obtained. As described above, the obtained connection structure can exhibit excellent connection reliability and conduction reliability while maintaining good insulation reliability.

  As mentioned above, although this Embodiment was described, it cannot be overemphasized that this invention is not limited to the above-mentioned embodiment, A various change is possible in the range which does not deviate from the summary of this invention.

  In the above-described embodiment, an anisotropic conductive film is used as the anisotropic conductive adhesive member. However, the structure of the anisotropic conductive adhesive member is not limited to this, and may be, for example, a two-layer anisotropic conductive film in which an insulating adhesive layer is further laminated. In addition, for example, a conductive adhesive paste in which conductive particles are contained in an insulating adhesive composition, and an insulating adhesive paste made of an insulating adhesive composition, these are applied in layers. By doing so, it is good also as two adhesive layers.

  In the above-described embodiment, the case where a glass substrate constituting an LCD (Liquid Crystal Display) panel is used as the glass substrate has been described. However, the glass substrate is not limited to this, for example, a PDP substrate (PDP panel) ), A glass substrate constituting an organic EL substrate (organic EL panel) or the like.

  Moreover, although the above-mentioned embodiment demonstrated the case where a glass substrate was used as a board | substrate, other board | substrates, such as a rigid board | substrate and a flexible substrate, may be sufficient. In the above-described embodiment, the case where COF is used as an electronic component has been described. However, other electronic components such as an IC chip and TAB may be used.

  Moreover, although the case where the present invention is applied to FOG (Film On Glass) has been described in the above embodiment, the present invention is not limited to other mounting methods such as COG (Chip On Glass) and FOB (Film On Board). It can also be applied.

  Hereinafter, specific examples of the present invention will be described based on experimental results.

<Example 1>
Polyester urethane resin (trade name: UR8200, manufactured by Toyobo Co., Ltd., dissolved in 20% by mass in a mixed solvent of methyl ethyl ketone / toluene = 50: 50) as a film-forming resin is 60 parts by mass (insulating) 60% by mass with respect to the adhesive composition), 33 parts by mass (33% by mass) of radically polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) and ethoxylated o-phenylphenol acrylate ( Product name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd. 1 part by mass (1% by mass), silane coupling agent (trade name: KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.) 1 part by mass (1 mass) %), Phosphoric acid acrylate (trade name: P-1M, manufactured by Kyoei Chemical Co., Ltd.) 1 part by mass (1% by weight), radical polymerization initiator (trade name: Perheki) C, manufactured by Nippon Oil & Fats Co., Ltd.) In an insulating adhesive composition containing 4 parts by mass (4% by mass), conductive particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) have a particle density of 10,000. / Mm ² was uniformly dispersed, and the conductive particle-containing composition was applied onto a release film by a bar coater and dried to prepare a circuit connection material having a thickness of 15 μm.

  Next, the process which connects a glass substrate and COF (50 micrometer P, Cu8 micrometer-Sn plating, 38 micrometer-S'perflex base material) was performed through the produced anisotropic conductive film. Here, as a glass substrate, an IZO coated glass substrate (all surface IZO coating, glass thickness 0.7 mm) is used for subsequent conduction resistance measurement, and an SiN coated glass substrate (all surface SiN coating) is used for connection strength measurement. It was. First, an anisotropic conductive film was slit to a width of 1.5 mm on the surface of the glass substrate on which the wiring electrodes were formed, and temporarily pasted on the glass substrate (temporary pasting step). In this temporary attachment, the pressure surface of the head part heated to a low temperature of the pressure bonder was lightly pressed against the upper surface of the conductive particle-containing layer and pressed at a low pressure. The heating temperature was set to 70 ° C., which is a low temperature such that the insulating particles do not dissolve and the insulating adhesive composition flows but does not cure. Moreover, the pressurization pressure in the temporary sticking process was 1 MPa. Moreover, the heat-pressing time in the temporary sticking process was 2 seconds.

  Next, the COF was disposed on the anisotropic conductive film so that the terminal electrode of the COF and the wiring electrode of the glass substrate were opposed to each other (arrangement step).

  Then, the pressure surface (1.5 mm width) of the heated head part of the pressure bonder was pressed against the upper surface of the COF through a buffer material (100 μmt Teflon (registered trademark)) to press-connect the glass substrate and the COF. (Connection process).

  The pressurizing pressure in the connecting step was 4 MPa. The heating temperature in the connection process was 190 ° C. Further, the heat pressurizing time in the connecting step was 5 seconds.

  In this way, conductive particles were sandwiched between the wiring electrodes and the bumps, the adhesive composition was cured, and the glass substrate and the COF were electrically and mechanically connected to obtain a connection structure.

<Example 2>
32 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.), ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.) A circuit connection material was produced under the same conditions as in Example 1 except that the amount was 2 parts by mass.

<Example 3>
31 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.), ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.) A circuit connecting material was produced under the same conditions as in Example 1 except that the amount was 3 parts by mass.

<Example 4>
30 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.), ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.) A circuit connection material was produced under the same conditions as in Example 1 except that the amount was 4 parts by mass.

<Example 5>
29 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.), ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.) A circuit connection material was produced under the same conditions as in Example 1 except that the amount was 5 parts by mass.

<Example 6>
19 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.), ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.) A circuit connection material was produced under the same conditions as in Example 1 except that the amount was 15 parts by mass.

<Example 7>
14 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.), ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.) A circuit connecting material was produced under the same conditions as in Example 1 except that the amount was 20 parts by mass.

<Example 8>
9 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.), ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.) A circuit connection material was produced under the same conditions as in Example 1 except that the amount was 25 parts by mass.

<Comparative Example 1>
Circuit connection under the same conditions as in Example 1 except that 34 parts by mass of a radically polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) is contained and no ethoxylated o-phenylphenol acrylate is contained. The material was made.

[Measurement of conduction resistance]
For the connection structures manufactured in Examples 1 to 8 and Comparative Example 1, the initial resistance and the resistance after a TH test (Thermal Humidity Test) at a temperature of 85 ° C. and a humidity of 85% RH for 500 hours were measured. . The measurement was performed using a digital multimeter (digital multimeter 7561, manufactured by Yokogawa Electric Corporation) to measure the connection resistance when a current of 1 mA was passed by the four-terminal method.

[Measurement of adhesive strength]
The connection structures of Examples 1 to 8 and Comparative Example 1 were pulled up to 90 degrees (Y-axis direction) at a peeling rate of 50 mm / min using a tensile tester (Tensilon, manufactured by Orientec Corp.), and the adhesive strength (N / cm).

  Table 1 summarizes the measurement results of the conditions, conduction resistance values, and connection strengths of Examples 1 to 8 and Comparative Example 1.

Since the anisotropic conductive films of Examples 1 to 8 contain ethoxylated o-phenylphenol acrylate, bulky biphenyl groups, (CH ₂ CH ₂ 0) _n (n = 1), and radical polymerization. It is considered that the structure consisting of —COCH═CH ₂ is reduced in curing shrinkage during polymerization, and also reduced in internal stress after curing. Thereby, it is considered that bubbles are suppressed from being generated at the interface between the adhesive layer and the silicon nitride film of the substrate at the time of connection, and high adhesive strength (connection reliability) can be obtained with excellent adhesion.

  Among them, in Examples 3 to 7 containing 3 to 20% by weight of ethoxylated o-phenylphenol acrylate, good values in conduction resistance value and adhesive strength could be obtained.

  On the other hand, in Comparative Example 1, since no ethoxylated o-phenylphenol acrylate is contained, curing shrinkage during polymerization increases, and internal stress after curing also increases, thereby nitriding the adhesive layer and the substrate during connection. It is considered that bubbles were generated at the interface with the silicon film, resulting in a decrease in adhesive strength.

Claims (4)

(1) a polyfunctional (meth) acrylate monomer;
(2) a radical polymerization initiator that generates free radicals by heat or light;
(3) a monofunctional (meth) acrylate monomer whose blending amount in the insulating adhesive composition is 3 to 20% by mass;
(4) containing metal-coated resin particles,
The monofunctional (meth) acrylate monomer is represented by the chemical formula (1),
In the chemical formula (1), R is a biphenyl group or a naphthalene group, the bonding position of R and the oxygen atom bonded thereto is ortho, meta, or para, and n is 1 to 10 Conductive film.   The anisotropic conductive film according to claim 1, wherein the monofunctional (meth) acrylate monomer is ethoxylated o-phenylphenol acrylate. In a connection structure in which an anisotropic conductive film is interposed between a pair of circuit members arranged so that circuit electrodes face each other, and the facing circuit members are electrically and mechanically connected.
One of the circuit members has a surface covered with a silicon nitride film,
The anisotropic conductive film is
(1) a polyfunctional (meth) acrylate monomer;
(2) a radical polymerization initiator that generates free radicals by heat or light;
(3) a monofunctional (meth) acrylate monomer whose blending amount in the insulating adhesive composition is 3 to 20% by mass;
(4) containing metal-coated resin particles,
The monofunctional (meth) acrylate monomer is represented by the following chemical formula (1):
In the chemical formula (1), R is a biphenyl group or a naphthalene group, the bonding position between R and an oxygen atom bonded thereto is an ortho position, a meta position, or a para position, and n is 1 to 10 body. A connection method in which an anisotropic conductive film is interposed between a pair of circuit members arranged so that circuit electrodes are opposed to each other, and the facing circuit members are electrically and mechanically connected by heat and pressure. In
One of the circuit members has a surface covered with a silicon nitride film,
The anisotropic conductive film is
(1) a polyfunctional (meth) acrylate monomer;
(2) a radical polymerization initiator that generates free radicals by heat or light;
(3) a monofunctional (meth) acrylate monomer whose blending amount in the insulating adhesive composition is 3 to 20% by mass;
(4) containing metal-coated resin particles,
The monofunctional (meth) acrylate monomer is represented by the following chemical formula (1):
In the chemical formula (1), R is a biphenyl group or a naphthalene group, a bonding position between R and an oxygen atom bonded thereto is an ortho position, a meta position, or a para position, and n is 1 to 10 .