JP5851552B2 - Substrate having copper foil layer and manufacturing method thereof - Google Patents

Description

  The present invention relates to a substrate on which a copper foil layer is formed and a method for producing a printed circuit board, and more specifically, a copper foil layer for producing a printed circuit board having a circuit having a fine pattern is formed. The present invention relates to a method for manufacturing a printed circuit board and a printed circuit board.

Printed Circuit Board (PCB) is a means of fixing various electronic components so that they are electrically connected to form a circuit. A conductive pattern is formed on an insulating substrate and the components are fixed. In general, a large number of through holes for electrical connection are formed.
The printed circuit board is a rigid printed circuit board (rigid PCB) in which copper foil is bonded to a core material in which a reinforcing material such as glass fiber is added to epoxy resin, and flexible in which copper foil is bonded on polyimide. It can be divided into a printed circuit board (Flexible Printed Circuit Board, FPCB) and a rigid-flexible printed circuit board (Rigid-Flexible Printed Circuit Board, R-F PCB) that combines the advantages of a rigid printed circuit board and a flexible printed circuit board. Each printed circuit board is used in accordance with its characteristics. In addition, due to the recent trend toward lighter, thinner and smaller electronic devices, the space occupied by the printed circuit board is also required to be reduced. In order to reduce the size of the printed circuit board, the circuit pattern can be multilayered or the circuit wiring can be reduced. The interval must be reduced.

  The conventional method of forming a circuit pattern on a printed circuit board is a method of forming a circuit pattern by forming a mask pattern on a copper foil with a dry film or the like and etching the copper foil. There is a limit in controlling the distance to 60 micrometers or less. As a method for overcoming the limitations of fine circuit pattern formation by the above-described method, recently, a new technique such as a semi-additive process (SAP) has been tried, but the semi-additive process is different from the conventional etching method. Is an opposite concept, in which a region excluding a circuit forming portion is masked with a dry film or the like, and a conductive pattern is formed on a region requiring circuit formation by direct plating.

  Even when the semi-additive method is applied, in order to form a fine pattern, the thickness of the copper foil serving as the base surface layer serving as an electrode for direct plating must be thin. However, since thin copper foil is difficult to manufacture, has few suppliers, and is very expensive, the supplier purchases thick copper foil cheaply and uses it after etching it to have the required thickness. This method has a problem of an increase in manufacturing cost and environmental pollution due to the addition of an etching process.

The manufacturing process of the copper foil which comprises a printed circuit board is widely known.
For example, Patent Document 1 discloses a technique relating to a copper foil film for producing a copper foil laminate having an aluminum carrier layer and a copper foil laminate having the copper foil film. However, when the copper foil is laminated by the technique disclosed in the above-mentioned prior document, diffusion occurs between the aluminum used as the carrier and the copper, and it becomes difficult to peel off the aluminum layer which is the carrier layer. There is a disadvantage that it is difficult to get.
Patent Document 2 introduces technology for simplifying the manufacturing process, improving production efficiency, and reducing the thickness of the substrate by sputter deposition of copper particles. Is not included.

Korean Patent Publication No. 2012-0084441 Korean registered patent No. 728774

  The first problem to be solved by one embodiment of the present invention is that a copper foil layer is formed which prevents diffusion at the interface between the carrier and the copper foil layer and facilitates separation of the carrier and the copper foil layer. It is to provide a method for manufacturing a substrate.

  A second problem to be solved by an embodiment of the present invention is to provide a method for manufacturing a printed circuit board using the method for manufacturing a substrate on which the copper foil layer is formed.

  A third problem to be solved by an embodiment of the present invention is to provide a printed circuit board manufactured by the method for manufacturing a printed circuit board.

  A fourth problem to be solved by an embodiment of the present invention is to provide a substrate on which a copper foil layer manufactured by the method for manufacturing a substrate on which the copper foil layer is formed is formed.

  In order to achieve the first object, an embodiment of the present invention includes a step of providing a carrier, a step of forming a separation induction layer on a surface of the carrier, and a copper foil layer on the separation induction layer. And a method of manufacturing a substrate on which a copper foil layer is formed, including the step of bonding a core on the copper foil layer.

  According to an embodiment of the present invention, the carrier is made of aluminum, and the step of forming the separation inducing layer on the surface of the carrier includes forming a porous layer on the surface of the carrier, and the carrier having the porous layer formed thereon. This can be accomplished by applying a sealing agent to the surface of the substrate.

  According to another embodiment of the present invention, the method for forming a porous layer on the carrier surface utilizes a solution containing at least one selected from the group consisting of an alkali compound, an iron compound, and a carbonate compound. can do.

  According to another embodiment of the present invention, the method of forming a porous layer on the surface of the carrier can be performed by an electroless corrosion method.

  According to another embodiment of the present invention, the porous layer formed on the carrier surface may be made of aluminum.

  According to another embodiment of the present invention, the sealing agent applied to the surface of the carrier on which the porous layer is formed is composed of a metal polymer, cobalt chromium, boron nitride, molybdenum disulfide and polytetrafluoroethylene. And at least one selected from the group.

  According to an embodiment of the present invention, in order to achieve the second object, a step of providing a substrate on which a copper foil layer is formed by a method of manufacturing a substrate on which the copper foil layer is formed; Forming a mask for pattern formation on the copper foil layer from which the induction layer is separated, forming a copper pattern on the copper foil layer by electroplating, and removing the mask for pattern formation; A method of manufacturing a printed circuit board including the step of forming a circuit comprising a copper pattern by removing the copper foil layer is provided.

  In order to achieve the third object, an embodiment of the present invention provides a printed circuit board manufactured by the method for manufacturing a printed circuit board.

  In order to achieve the fourth object, an embodiment of the present invention provides a carrier made of aluminum, a separation induction layer formed on the carrier surface, a copper foil layer formed on the separation induction layer, and the copper Provided is a substrate on which a copper foil layer is formed, comprising a core bonded to a foil layer, wherein the separation-inducing layer includes a porous aluminum layer and a sealing layer formed of the porous aluminum layer. .

The manufacturing method of the board | substrate with which the copper foil layer which concerns on one Example of this invention was formed, and the manufacturing method of a printed circuit board have the following effects.
1. A separation induction layer is formed between the carrier layer and the copper foil layer, and diffusion between the carrier layer and the copper plating layer can be prevented in the process of attaching the core to the copper foil by a thermocompression bonding process. Therefore, the carrier and the copper foil layer can be easily separated, and the thickness and surface roughness of the separated copper foil layer can be maintained constant.

  2. The separation-inducing layer includes a process of forming a porous layer on the surface of a carrier made of aluminum. Since the porous layer is mainly made of aluminum instead of aluminum oxide, the separation inducing layer is simply formed in the carrier removal process using chemical etching. Carriers can be removed with only one type of etching solution.

  3. The substrate on which the copper foil layer manufactured according to an embodiment of the present invention is formed can be formed with a sufficiently thin copper foil, so that the surface to be etched when the semi-additive method is applied. The thickness of the copper foil layer is small, which is advantageous for forming a fine circuit pattern.

Cross-sectional structure diagram of a general printed circuit board 1 is a cross-sectional structural view of a substrate on which a copper foil layer manufactured according to an embodiment of the present invention is formed. Process flowchart for explaining the manufacturing process of the multilayer printed circuit board of the prior art 1 is a process flowchart for explaining a printed circuit board manufacturing process according to an embodiment of the present invention;

  A method of manufacturing a substrate on which a copper foil layer according to an embodiment of the present invention includes a step of providing a carrier, a step of forming a separation induction layer on a surface of the carrier, and a copper foil on the separation induction layer. Forming a layer and bonding a core onto the copper foil layer.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings attached to the specification. The described embodiments of the present invention are provided as examples for sufficiently conveying the technical idea of the present invention to those skilled in the art. The present invention is not limited to the embodiments described below, and may be embodied in other forms. The width, length, thickness, and the like of components shown in the attached drawings are exaggerated for convenience of explanation, and one component may be expressed as another component “above”. "Or" on "includes not only when it is" immediately above "another component, but also when there is another component in between. In addition, even in the case of the method described with the steps listed, another step may be interposed between the steps described in succession, and in some cases, the steps may not be limited to the listed order. is there.

  FIG. 1 illustrates a cross-sectional structure of a general printed circuit board. Referring to FIG. 1, the printed circuit board (100) includes a core (110), an adhesive layer (120), and a copper foil layer (130). The core (110) can be made of a rigid or flexible material, which is used in each case to manufacture a rigid printed circuit board and a flexible printed circuit board. The core of the rigid printed circuit board can be made of a composite in which glass fibers are bonded to epoxy resin, and the core of the flexible circuit board can be made of polyimide resin or the like. The adhesive layer functions to bond the core and the copper foil layer, and the copper foil layer can constitute a circuit in a patterned form.

  There are various methods for configuring a circuit using a copper foil layer on a printed circuit board, but according to an embodiment of the present invention, the thickness of the copper foil layer can be sufficiently thin and uniform. By applying the semi-additive construction method, it becomes easy to form a circuit with a fine pattern.

  FIG. 2 illustrates a cross-sectional structure of a substrate on which a copper foil layer manufactured according to an embodiment of the present invention is formed. Referring to FIG. 2, a copper foil film substrate (200) according to an embodiment of the present invention includes a core (210), an adhesive layer (220), a copper foil layer (230), a sealing layer (242), and a porous layer. (241) and carrier (240). The core (210) may be made of a rigid epoxy / glass fiber composite or a flexible polyimide resin at a portion to be a base material of the printed circuit board. Although not shown in the drawings, the core (210) may be bonded. A thermoplastic resin layer can be included on the surface on which the layer (220) is formed. The adhesive layer functions to bond the copper foil layer (230) and the core (210), and various types of polymer resin adhesives can be used. When the core is made of polyimide, the adhesive layer has compatibility with polyimide. Good adhesive can be used. The copper foil layer (230) is a portion constituting the circuit pattern of the printed circuit board, and the circuit pattern can be formed by an etching process or a semi-additive method. When the semi-additive method is applied, the copper foil layer (230) A copper foil layer having a predetermined pattern can be additionally formed thereon. A carrier (240) is bonded onto the copper foil layer (230), and includes a porous layer (241) and a sealing layer (242) between the copper foil layer (230) and the carrier (240). A layer can be formed. The separation induction layer functions to prevent the metal component of the carrier and the copper of the copper foil layer from interdiffusing during the thermocompression bonding process of joining the copper foil layer and the core. The separation of the layers occurs easily so that the thickness and surface roughness of the copper foil layer are kept uniform.

  A process of manufacturing a substrate on which a copper foil layer is formed according to an embodiment of the present invention will be described below according to the steps.

  First, provide a career. As the carrier, a sheet made of aluminum can be used, and the carrier can be provided in a form in which a release paper is bonded to one surface with an adhesive.

  Subsequently, a porous layer is formed on at least one surface of the carrier. In the process of forming the porous layer, an aluminum sheet is made of an alkali compound such as sodium hydroxide (NaOH) or potassium hydroxide (KOH), an iron compound such as iron cyanide or iron citrate, or a carbonate such as potassium carbonate or sodium carbonate. It progresses by processing with a solution containing a functional additive having a systemic compound or the like as a main component and acting as a chelate or the like. Unlike the anodizing process using electricity, such a porous layer forming process is a process in which the surface of aluminum is treated with an electroless chemical, and is a concept of forming voids together with microetching on the aluminum surface. . The electroless chemical treatment step may be a step of forming a porous layer while corroding the surface of aluminum. A specific process can be performed by immersing the aluminum carrier in a chemical at a temperature of about 40 to 60 ° C. for about 3 to 10 minutes. In general, the layer formed by anodic oxidation using electricity is an insulator, whereas the porous layer formed in the above process has a structure in which only a pore is formed in the substrate. Therefore, there is a characteristic that the properties of the conductor are maintained as they are and the current is not affected at all. Since the main component of the porous layer is not aluminum oxide but aluminum, the carrier can be removed using only an etching solution for removing aluminum when the carrier is separated from the copper foil layer by a chemical method. It has the advantages of Since aluminum hydroxide or the like partially existing in the porous layer is thin, it is separated into a solution during the aluminum etching process and can be removed together.

  Subsequently, a sealing layer is formed on the porous layer. The step of forming the sealing layer is an optional step. The sealing layer functions as a lubrication material so that the carrier and the copper foil layer can be easily separated, and at the same time, the void of the porous layer is filled to smooth the surface of the copper foil layer to be formed later. In the process of bonding the core to the copper foil layer by thermocompression bonding, the carrier aluminum and the copper of the copper foil layer are diffused to prevent a kind of alloy layer from being formed. The sealing layer can be made of an inorganic or organic material or a polymer resin, and can be made of, for example, boron nitride (BN), molybdenum disulfide (MoS2), Teflon, polytetrafluoroethylene (PTFE), or the like. Or a metal layer such as cobalt chrome. In addition, a metal polymer composite material can be used as the sealing layer. Examples of the metal compound for forming the composite material include nickel acetate, nickel carbonate, nickel fluoride. ), Nickel sulfate, CrF3 · 3H2O, and the like, and as the polymer, urethane (urethane), polyvinyl acetate (Poly Vinyl Acetate, PVAC), polyethylene glycol (Poly Ethylene Glycol, PEG), nylon 6 (Nylon 6, NA6) or the like can be used. Although the porous layer and the sealing layer are illustrated as being sequentially stacked in FIG. 2, the porous layer and the sealing layer may have a configuration in which voids included in the porous layer are filled with a substance constituting the sealing layer. The separation-inducing layer thus formed is composed of a porous layer and a sealing layer. The porous layer is composed of an aluminum layer containing voids, and the sealing layer is formed in a form to be applied on the porous layer. The Therefore, the separation induction layer includes a porous aluminum layer and a sealing layer formed on the porous aluminum layer.

  The porous layer and the sealing layer form a separation inducing layer between the carrier and the copper foil layer. When this separation induction layer is not formed, diffusion occurs at the interface between the carrier and the copper foil layer at a high temperature of 350 ° C. or higher in the process of thermocompression bonding of the copper foil layer and the core, and the carrier and the copper foil layer Separation becomes difficult. However, if a separation inducing layer is formed between the carrier and the copper foil layer, the carrier aluminum and the copper of the copper foil layer are prevented from forming a diffusion layer at a high temperature. Even when separating from the layers, only the aluminum etchant can be used without the aluminum oxide etchant, which simplifies the process and reduces costs.

  Subsequently, a copper foil layer is formed on the sealing layer. The copper foil layer can be formed using an electroless copper plating method, but the copper foil layer formed by the electroless copper plating method is formed by a chemical reaction mechanism without using electricity. From a thin thickness of 1 micrometer or less to a thick plating layer of several tens of micrometers can be obtained uniformly. As described above, a method of forming a circuit pattern by etching by adjusting the thickness of the copper foil layer or a method of forming a circuit pattern by a semi-additive method can be selected. For the formation method of such electroless copper plating layer, two types are selectively used: electroless copper plating in which plating proceeds by the difference in ionization tendency and electroless reduced copper plating in which plating proceeds by the function of the reducing agent. A suitable plating method can be applied according to the field to be applied.

  Subsequently, the core is bonded onto the copper foil layer. In order to bond the core to the copper foil layer, an adhesive layer or primer layer can be formed therebetween. The adhesive layer or primer layer can be made of a material having good compatibility with polyethylene terephthalate (PET), which is a polymer material that can be used as a core, polyimide, flexible epoxy, and the like. Substances such as organic silane can be used, or can be produced as a mixture containing a resin as a main component. Such an adhesive layer or primer layer can perform not only the bonding function with the core material but also the role of rust prevention to prevent oxidation of the copper foil, and has the adhesion performance that is the function of the primer layer. In order to achieve this, it is possible not only to apply a primer but also to attach an adhesive tape.

  A substrate including a copper foil layer manufactured according to an embodiment of the present invention can be used as a material for a printed circuit board, and more specifically, used for manufacturing a multilayer printed circuit board. Can do. Hereinafter, a method for manufacturing a multilayer printed circuit board using the prior art and a method for manufacturing a multilayer printed circuit board manufactured according to an embodiment of the present invention will be described in order.

  FIG. 3 is a process flowchart for explaining a manufacturing process of a multilayer printed circuit board according to the prior art. Referring to FIG. 3, first, a flexible laminate (Flexible PCB Copper Clad Laminate, FCCL) in which a copper foil film and a polyimide core are joined is cut into a predetermined size (S1). Subsequently, an etching process is performed to form an inner layer circuit on the cut flexible laminate film (S2). Subsequently, a protective layer is bonded thereon (S3). Subsequently, a flexible laminate is laminated on the protective layer with a bonding sheet (S4). Subsequently, electrolytic copper plating is performed on the laminated flexible laminate to form a copper plating layer (S5). Then, a drilling process is performed on the copper plating layer to form a plurality of through holes (S6). Subsequently, residues such as processing chips remaining on the inner walls of the through holes are removed by a desmear process (S7). Subsequently, electroless copper and electrolytic copper plating are sequentially performed to form a copper plating layer (S8, S9). Subsequently, an etching process for forming an outer layer circuit on the copper plating layer is performed (S10), and a PSR printing layer is formed by performing a printing process on the outer layer circuit (S11).

  As described above, the conventional method for manufacturing a multilayer printed circuit board uses a copper foil laminate using a copper foil film that is complicated and expensive, resulting in an increase in cost and a complicated lamination process. There is a problem that the use of materials increases and the thickness of the multilayer printed circuit board increases. If a multilayer printed circuit board is manufactured using the board | substrate with which the copper foil layer of this invention was formed, it has the effect of simplifying a process and reducing manufacturing cost. Hereinafter, a method for manufacturing a multilayer printed circuit board according to the present invention will be described in detail.

  FIG. 4 is a process flowchart for explaining a printed circuit board manufacturing process according to an embodiment of the present invention. Referring to FIG. 4, first, a substrate on which a copper foil layer manufactured by the manufacturing method described with reference to FIG. 2 is formed is used as a flexible laminate and cut into a required size (S1). Subsequently, a drilling process for processing a plurality of through holes in the cut substrate is performed as required (S2). Subsequently, as a pretreatment for plating the inner wall of the through hole formed in the drilling process, a conductive polymer treatment or an electroless copper plating treatment is performed (S3). Subsequently, a dry film is laminated on the substrate, and the positive image is exposed and developed (S4). Subsequently, a copper-plated layer is formed on the substrate that has been subjected to conductive polymer treatment or chemical copper plating to form a copper plating layer (S5), and then the dry film remaining after the circuit is formed by copper plating is peeled off. (S6). Subsequently, the thin copper foil remaining on the underlying layer where the dry film has been peeled is etched (S7). Subsequently, the process is performed as a step of applying a coverlay to a portion excluding the exposed circuit (S8).

  As described above, a process of manufacturing a printed circuit board using a substrate on which a copper foil layer manufactured according to an embodiment of the present invention is formed is performed by copper plating on the entire panel as in a conventional method. However, it is not a method of etching only by leaving only the circuit formation part, but on the contrary, the part where the circuit is to be formed is exposed and only the part is filled with plating to form a circuit. It is economical and suitable for the implementation of fine circuits. In particular, due to the recent trend of technological development, there is a demand for fine circuits that are difficult to implement with existing etching methods. Thus, the development of a semi-additive method for filling circuit parts with plating is indispensable.

  The manufacturing process of the printed circuit board according to one embodiment of the present invention described with reference to FIG. 4 will be described in more detail with the process of applying a polyimide core as follows. First, the copper foil laminated board using the board | substrate with which the copper foil layer manufactured based on one Example of this invention was formed is cut | disconnected to required size. Subsequently, drilling is performed on the copper foil laminate selectively cut as necessary. Hole processing is for making circuits formed on both sides of the board mutually conductive. Generally, machining is performed using a CNC drill or laser drill, but polyimide etching chemicals are used. Chemical processing is also possible. At this time, the aluminum carrier used according to the embodiment of the present invention has an advantage that it can be used as an entry board that increases the positional accuracy of the hole and performs a heat dissipation function when processed using a drill. . Such drilling can also be omitted. Subsequently, the aluminum carrier and the copper foil after drilling are separated. A physical method and a chemical method can be used for separation of the aluminum carrier and the copper foil layer. Since aluminum and copper are dissimilar metals, they can be easily separated and generally separated by physical methods. However, the bonding process between the core material polyimide and the copper foil layer is about 350 ° C or higher. When it is carried out, diffusion occurs between the carrier aluminum and copper foil, making uniform peeling difficult, so it is necessary to use a method of removing only aluminum chemically using chemicals such as caustic soda. There is. At this time, according to the present invention, since the porous layer is formed on the surface of the aluminum carrier, the thickness of the naturally oxidized aluminum oxide or aluminum hydroxide is negligible. Therefore, only the aluminum etchant is used. Thus, the aluminum carrier can be removed. Subsequently, conductive polymer treatment and electroless copper plating are performed. This is because the polyimide that forms the inner wall of the hole-processed portion of the copper foil laminate from which the aluminum carrier has been removed is an insulator. This is a step of forming a conductive layer on the inner wall of the hole for electrical conduction. At this time, a process using carbon particles such as a black hole or a shadow method may be applied instead of the conductive polymer treatment or the electroless copper plating. In addition, chemical copper plating or direct electrolytic copper plating can be additionally performed after the conductive layer is formed by conductive polymer treatment, electroless copper plating, or the like. Subsequently, exposure and phenomenon processes are performed by a positive image method in which a dry film is adhered on a conductive substrate to expose only a portion where a circuit is formed. Subsequently, the exposed circuit formation site is subjected to copper plating to form a circuit, and then the remaining dry film is peeled off. Subsequently, the thin copper foil remaining on the base layer of the dry film is etched. Subsequently, a cover lay is applied to a portion excluding the circuit formed by the above process to complete a printed circuit board.

  Hereinafter, the present invention will be described more specifically with reference to examples.

(1) Aluminum carrier surface degreasing (cleaning and porous layer formation)
In order to effectively remove contaminants such as organic substances on the surface of the aluminum carrier, a degreasing agent (Al clean 193) from YMT was prepared by dilution, and degreased at a temperature of 30 to 50 ° C. for 2 to 5 minutes. At this time, due to the treatment with the degreasing agent, the surface of the aluminum carrier is partially corroded to form a porous layer.

(2) Chromium-polymer layer formation (sealing layer formation)
In order to easily separate the copper plating layer and the aluminum underlayer, a thin chromium-polymer film (Cr-polymer) was formed on the degreased aluminum (on the porous layer). At this time, the chromium-polymer post-treatment agent is an acidic aqueous solution having a ratio within 1 wt% of chromium, and is a mixture of CrF3.3H2O and polyethylene glycol (PEG, alcohol-based polymer). The chromium-polymer post-treatment agent was dipped at a temperature of 50 to 70 ° C. for 10 to 15 minutes.

(3) Copper plating Electroless copper plating was performed on the chromium-polymer layer. The conditions for the copper plating treatment were plating at a temperature of 30 to 50 ° C. for 5 to 15 minutes, and the thickness of the copper plating layer was adjusted by adjusting the time.

(4) Resin coating (adhesion layer formation)
In order to fabricate a copper foil laminate using a copper-plated aluminum carrier, a resin was coated on the copper-plated surface with a thickness of about 79 um. The resin used is polyethylene (PE), epoxy (Epoxy), etc., depending on the base material to be used, and after coating the resin, the resin is removed at a temperature of 80-100 ° C. to remove the solvent on the resin. Dry in oven for more than a minute.

(5) Insert paper (core connection)
As described above, the resin-coated material is interleaved with various base materials such as PET, PEN, PI, Pre-preg, etc. depending on the application, and in the case of a flexible substrate, roll to roll (roll to roll) In the case of a rigid base material, a hot-press system was used.

(6) Aluminum carrier removal An unnecessary aluminum carrier portion is removed from the interleaving material. When removing the aluminum carrier, the release force of the carrier was within 100 gf / cm due to the release layer formed in the step (2).

Evaluation example:
In the manufacturing process of the copper foil substrate manufactured based on the example, the peeling force between the copper foil and the carrier was measured by a 90 ° peel test for the peeling test between the carrier and the copper foil. .

  As a result, an untreated product having no separation-inducing layer shows a peeling force of about 300 gf / cm, but in a product in which a separation-inducing layer is formed by treatment at about 30 ° C. for 3 minutes, the copper foil and the carrier The peel strength between them was low at about 100 gf / cm or less. Therefore, after transfer of the copper foil, peeling between the copper foil and the carrier could be made smooth.

  In addition, there is a difference in peel strength from the copper foil depending on the carrier surface roughness, and when an alkaline component etchant is used, the surface roughness (Ra) is 1.5 to 2 with only about 0.1 μm etching. A value of about 0.0 is shown, and by adding a functional additive serving as a corrosion inhibitor and performing fine etching, the surface roughness (Ra) is 0.4 with an etching amount of about 0.1 μm. A value of about ˜0.5 could be obtained.

  Also, when the carrier material is aluminum, the surface roughness is low if the material is thin, and the peel force between the carrier and the copper foil after electroless copper plating is as low as about 300 gf / cm to about 200 gf / cm. Easily peeled off.

  The above explanation has explained the technical idea of the present invention by using one embodiment, and a person who has ordinary knowledge in the technical field to which the present invention belongs does not depart from the essential characteristics of the present invention. Thus, various changes and modifications are possible. The embodiments described in the present invention are not intended to limit the technical idea of the present invention, but are for explanation. The scope of the technical idea of the present invention is not limited by these examples. The protection scope of the present invention is specified by the claims, and all technical ideas within the scope equivalent thereto are included in the scope of the right of the present invention.

100: printed circuit board 110: core 120: adhesive layer 130: copper foil layer 200: copper foil film substrate 210: core 220: adhesive layer 230: copper foil layer 240: carrier 241: porous layer 242: sealing layer

Claims (6)

Providing a career,
Forming a separation inducing layer on the surface of the carrier;
Forming a copper foil layer on the separation induction layer;
Possess a step of bonding the core onto the copper foil layer,
The carrier is made of aluminum;
Forming a separation-inducing layer on the surface of the carrier,
A method for producing a substrate having a copper foil layer , wherein a porous layer is formed on the surface of the carrier, and a sealing agent is applied to the surface of the carrier on which the porous layer is formed . The method for forming a porous layer on the carrier surface uses a solution containing at least one selected from the group consisting of an alkali compound, an iron compound, and a carbonate compound.
The manufacturing method of the board | substrate which has a copper foil layer of Claim 1 . The method of forming a porous layer on the carrier surface is performed by electroless corrosion.
The manufacturing method of the board | substrate which has a copper foil layer of Claim 1 . The porous layer formed on the carrier surface is made of aluminum.
The manufacturing method of the board | substrate which has a copper foil layer of Claim 1 . The sealing agent applied to the surface of the carrier on which the porous layer is formed includes at least one selected from the group consisting of cobalt chromium, metal polymer, boron nitride, molybdenum disulfide, and polytetrafluoroethylene.
The manufacturing method of the board | substrate which has a copper foil layer of Claim 1 . A carrier made of aluminum;
A separation-inducing layer formed on the carrier surface;
A copper foil layer formed on the separation induction layer;
A core coupled to the copper foil layer,
The separation induction layer includes a porous aluminum layer and a sealing layer formed on the porous aluminum layer. A substrate having a copper foil layer.

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