JP5874501B2 - High frequency module - Google Patents

Description

  The present invention relates to a high-frequency module that transmits and receives a plurality of communication signals using a common antenna.

  Various high-frequency modules that transmit and receive a plurality of communication signals with a common antenna to the plurality of communication signals have been devised by the multiband communication signal in the communication terminal.

  For example, the high-frequency module described in Patent Document 1 uses a common antenna for a first communication signal composed of a first transmission signal and a first reception signal, and a second communication signal composed of a second transmission signal and a second reception signal. Sending and receiving.

  In the high frequency module of Patent Document 1, the antenna connection terminal is connected to the common terminal of the switch IC. The first switching terminal of the switch IC is connected to the receiving diplexer. The second switching terminal of the switch IC is connected to the transmission side diplexer.

  A first reception terminal and a second reception terminal are connected to the reception-side diplexer. The reception-side diplexer outputs the first reception signal input from the switch IC to the first reception terminal, and outputs the second reception signal to the second reception signal.

  A first transmission terminal and a second transmission terminal are connected to the transmission-side diplexer. The transmission-side diplexer outputs a first transmission signal input from the first transmission terminal to the switch IC, and outputs a second transmission signal input from the second transmission terminal to the switch IC.

  Such a high-frequency module has a laminated body in which an inductor and a capacitor are formed by an internal conductor pattern, and has a structure in which a switch IC or the like that is not incorporated is mounted on the top surface of the laminated body. Since the transmission-side diplexer and the reception-side diplexer are composed of inductors and capacitors, the whole or most of the transmission-side diplexer and the reception-side diplexer are often formed by the internal conductor pattern of the multilayer body.

JP 2003-318773 A

  However, with the miniaturization of communication terminals, high frequency modules are also miniaturized. When the high-frequency module is downsized, the distance between the internal conductor patterns formed in the multilayer body is also shortened. Therefore, the distance between the inductors formed by the internal conductor pattern is also shortened. For this reason, for example, in the transmission diplexer, unnecessary electromagnetic coupling occurs between the inductor that transmits the first transmission signal and the inductor that transmits the second transmission signal, and the first transmission terminal and the second transmission terminal Isolation with the transmission terminal may deteriorate.

  Such a phenomenon may also occur in a reception-side diplexer or a duplexer that demultiplexes a transmission signal and a reception signal. However, since the transmission signal has higher power than the reception signal, the first transmission terminal and the first transmission terminal Isolation between two transmission terminals is most likely to deteriorate.

  The objective of this invention is providing the high frequency module which improved the isolation between each transmission terminal for performing transmission / reception using a common antenna.

  The present invention provides a high-frequency module for transmitting a first transmission signal and a second transmission signal using an antenna common to the first transmission signal and a laminated body in which a plurality of insulator layers each having a predetermined conductor pattern are laminated. The laminate has the following characteristics.

  The laminate includes a common antenna terminal connected to a common antenna, a first transmission terminal to which a first transmission signal is input, a second transmission terminal to which a second transmission signal is input, a first transmission terminal, and a common antenna. At least a part of a first filter circuit connected between the terminal and a second filter circuit connected between the second transmission terminal and the common antenna terminal.

  A first internal conductor pattern, a second internal conductor pattern, and a third internal conductor pattern are formed inside the multilayer body. The first inner conductor pattern constitutes a first filter circuit, and includes a first inductor closest to the first transmission terminal on an equivalent circuit in the first filter circuit. The second inner conductor pattern constitutes a second filter circuit and includes a second inductor closest to the second transmission terminal on the equivalent circuit in the second filter circuit. The third inner conductor pattern is disposed between the first inner conductor pattern and the second inner conductor pattern, and constitutes a circuit element different from the circuit elements constituting the first filter circuit and the second filter circuit.

  In this configuration, the distance between the first inductor that transmits the first transmission signal and the second inductor that transmits the second transmission signal is increased. Therefore, the electromagnetic coupling between the first inductor and the second inductor is difficult to occur, and the isolation between the first transmission terminal and the second transmission terminal is improved.

  In the high frequency module of the present invention, the first inner conductor pattern, the second inner conductor pattern, and the third inner conductor pattern are arranged so as not to overlap each other when viewed from the main surface of the multilayer body. Preferably it is.

  With this configuration, the isolation can be further improved.

  In the high frequency module of the present invention, the end of the first filter circuit on the common antenna terminal side and the end of the second filter circuit on the common antenna terminal side are connected, and the first filter circuit, the second filter circuit, It is preferable to provide the 1st diplexer containing.

  This configuration shows a specific configuration example of the present invention. Usually, when a diplexer (first diplexer) is configured by the first filter circuit and the second filter circuit as described above, the interval between the first filter circuit and the second filter circuit tends to be narrowed. By using it, the isolation between the first transmission terminal connected to the first filter circuit and the second transmission terminal connected to the second filter circuit can be improved.

  Moreover, in the high frequency module of this invention, it is preferable that it is the following structure. The high-frequency module includes a first reception terminal that outputs a first reception signal that forms a pair with the first transmission signal, a second reception terminal that outputs a second reception signal that forms a pair with the second transmission signal, and a first reception terminal And a third filter circuit connected between the common antenna terminal and a fourth filter circuit connected between the second reception terminal and the common antenna terminal. At least a part of the third filter circuit is formed by a fourth internal conductor pattern formed inside the multilayer body. At least a part of the fourth filter circuit is formed of a fifth internal conductor pattern formed inside the multilayer body. The third inner conductor pattern includes a fourth inner conductor pattern and a fifth inner conductor pattern.

  In this configuration, since the internal conductor patterns constituting the plurality of filter circuits are arranged between the first inductor and the second inductor, the isolation between the first transmission terminal and the second transmission terminal is further improved. Can be made.

  Moreover, in the high frequency module of this invention, it is preferable that the 4th internal conductor pattern is formed in the 1st internal conductor pattern side rather than the 5th internal conductor pattern.

  Since the first transmission signal transmitted with the first inner conductor pattern and the first reception signal transmitted with the fourth inner conductor pattern are a pair of signals constituting one type of communication signal, the fundamental frequency band and the second harmonic wave The frequency band and the third harmonic frequency band hardly overlap each other. On the other hand, since the second received signal that transmits the fifth inner conductor pattern constitutes a communication signal different from the first transmitted signal, the fundamental frequency band, the second harmonic frequency band, and the third harmonic frequency band may overlap. . However, by using this configuration, it is possible to increase the distance between the internal conductor pattern that transmits two types of signals that may overlap the frequency band and improve the isolation between the terminals that input and output these signals. Can be made.

  Further, the high frequency module of the present invention may have the following configuration. The high frequency module includes a second diplexer and a switch element. The second diplexer is connected to the common antenna terminal side end of the third filter circuit and the common antenna terminal side end of the fourth filter circuit, and includes a third filter circuit and a fourth filter circuit. The switch element includes a first connection point where an end of the first filter circuit on the common antenna terminal side of the first filter circuit and an end of the second filter circuit on the side of the common antenna terminal are connected, and a second connection point in the second diplexer. The second connection point where the end of the third filter circuit on the common antenna terminal side and the end of the fourth filter circuit on the common antenna terminal side are connected is switched to connect to the common antenna terminal.

  In this configuration, a more specific configuration example of the high-frequency module that transmits the first and second transmission signals and receives the first and second reception signals with a common antenna is shown.

  Moreover, in the high frequency module of this invention, it is preferable that the fundamental frequency of a 2nd transmission signal is a 2nd harmonic frequency or a 3rd harmonic frequency of a 1st transmission signal.

  This configuration shows a specific example of the relationship between the frequency of the first transmission signal and the frequency of the second transmission signal. In such a configuration, the pass band of the second filter circuit overlaps the second harmonic frequency and the third harmonic frequency of the first transmission signal, and the second harmonic signal or the third harmonic signal of the first transmission signal becomes the first harmonic signal. 2 Easy to leak to the transmission terminal side. Accordingly, as long as at least the electromagnetic coupling between the first inductor close to the first transmission terminal and the second inductor close to the second transmission terminal can be suppressed as described above, the first transmission terminal and the second transmission terminal The effect of improving the isolation with the transmission terminal is great.

  Moreover, in the high frequency module of this invention, it is preferable that it is the following structure. The multilayer body includes a plurality of conductive via holes and internal ground conductors arranged in an array. The conductive via hole has a shape that is continuous in the stacking direction of the multilayer body, and is formed with a first region in which the inner conductor pattern that forms the first filter circuit is formed and an inner conductor pattern that forms the second filter circuit. It is formed between the second region. The internal ground conductor is formed in a predetermined insulator layer and connected to the external ground. The plurality of arrayed conductive via holes are connected to the internal ground conductor.

  In this configuration, the electromagnetic coupling between the internal conductor pattern forming the first filter circuit and the internal conductor pattern forming the second filter circuit is suppressed by the plurality of conductive via holes. Thereby, the isolation between a 1st transmission terminal and a 2nd transmission terminal can further be improved.

  According to this invention, the isolation between each transmission terminal and reception terminal of a high frequency module can be improved.

1 is a circuit diagram of a high-frequency module 10 according to an embodiment of the present invention. 1 is an external perspective view of a high-frequency module 10 according to an embodiment of the present invention. It is a lamination figure of high frequency module 10 concerning the embodiment of the present invention. It is the isolation characteristic figure of the high frequency module 10 which concerns on embodiment of this invention, and the high frequency module of conventional structure.

  A high-frequency module according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an equivalent circuit diagram of the high-frequency module 10 of the present embodiment.

  The high-frequency module 10 includes a common antenna terminal P (ANT), a first transmission terminal P (TxG), a second transmission terminal P (TxA), a first reception terminal P (RxG), and a second reception terminal P (RxA). Prepare.

  The common terminal P (ANT) is connected to the switch common terminal of the switch element SW via the matching capacitor C1.

  The switch element SW includes a switch common terminal, a first switching terminal, and a second switching terminal, and connects the switch common terminal to either the first switching terminal or the second switching terminal by an external control signal.

  The first switching terminal of the switch element SW is connected to the diplexer DIPt via the capacitor C2. The second switching terminal of the switch element SW is connected to the diplexer DIPr via the capacitor C3. The diplexer DIPt corresponds to the “first diplexer” of the present invention. The diplexer DIPr corresponds to the “second diplexer” of the present invention.

  The diplexer DIPt includes a low pass filter LPF1 and a band pass filter BPF1. The low-pass filter LPF1 corresponds to the “first filter circuit” of the present invention. The band pass filter BPF1 corresponds to the “second filter circuit” of the present invention.

  The low-pass filter LPF1 has one end connected to the first transmission terminal P (TxG) and the other end connected to the capacitor C2 and the band-pass filter BPF1. The band pass filter BPF1 has one end connected to the second transmission terminal P (TxA) and the other end connected to the capacitor C2 and the low-pass filter LPF1. A connection point between the low-pass filter LPF1 and the band-pass filter BPF1 corresponds to the “first connection point” of the present invention.

  The low-pass filter LPF1 includes inductors L11, L13, and L15 connected in series between the first transmission terminal P (TxG) and the first connection point. At this time, the inductor L15, the inductor L13, and the inductor L11 are connected in this order from the first transmission terminal P (TxG) side toward the first connection point.

  A connection point between the inductor L11 and the inductor L13 is connected to the ground through a series circuit of the inductor L12 and the capacitor C11. A connection point between the inductor L13 and the inductor L15 is connected to the ground through a series circuit of the inductor L14 and the capacitor C12. The first transmission terminal P (TxG) side of the inductor L15 is connected to the ground through a series circuit of an inductor L16 and a capacitor C13.

  The inductors L15 and L16 closest to the first transmission terminal P (TxG) in the low-pass filter LPF1 correspond to the “first inductor” of the present invention.

  The low-pass filter LPF1 sets the inductances of the inductors L11, L12, L13, L14, L15, and L16 and the capacitances of the capacitors C11, C12, and C13 as appropriate, so that the first input from the first transmission terminal P (TxG). A low-pass filter (low-pass filter) that passes the fundamental frequency band of one transmission signal and obtains a predetermined amount of attenuation in the second harmonic frequency band and the third harmonic frequency band is configured.

  The band pass filter BPF1 includes an inductor L23 and capacitors C22 and C21 connected in series between the second transmission terminal P (TxA) and the first connection point. At this time, the inductor L23, the capacitor C22, and the capacitor C21 are connected in this order from the second transmission terminal P (TxA) side toward the first connection point.

  An inductor L22 is connected in parallel to the capacitor C22. A connection point between the capacitor C21 and the capacitor C22 is connected to the ground via a series circuit of an inductor L21 and a capacitor C23.

  The inductor L23 closest to the second transmission terminal P (TxA) in the bandpass filter BPF1 corresponds to the “second inductor” of the present invention.

  The band pass filter BPF1 appropriately sets the inductances of the inductors L21, L22, and L23 and the capacitances of the capacitors C21, C22, and C23, so that the basic of the second transmission signal input from the second transmission terminal P (TxA) is set. A band pass filter (band pass filter) that passes the frequency band and obtains a predetermined attenuation amount in the second frequency band, the third frequency band, and the fundamental frequency band of the first transmission signal is configured.

  The diplexer DIPr includes a low-pass filter LPF2 and a high-pass filter HPF1. The low-pass filter LPF2 corresponds to the “third filter circuit” of the present invention. The high pass filter HPF1 corresponds to the “fourth filter circuit” of the present invention.

  The low-pass filter LPF2 has one end connected to the first receiving terminal P (RxG) and the other end connected to the capacitor C3 and the high-pass filter HPF1. The high-pass filter HPF1 has one end connected to the second receiving terminal P (RxA) and the other end connected to the capacitor C3 and the low-pass filter LPF2. A connection point between the low-pass filter LPF2 and the high-pass filter BPF1 corresponds to the “second connection point” of the present invention.

  The low-pass filter LPF2 includes an inductor L31 connected in series between the first reception terminal P (RxG) and the second connection point. The first receiving terminal (RxG) side of the inductor L31 is connected to the ground via a series circuit of an inductor L32 and a capacitor C31.

  The low-pass filter LPF2 appropriately sets the inductances of the inductors L31 and L32 and the capacitance of the capacitor C31, thereby passing the fundamental frequency band of the first reception signal output to the first reception terminal P (RxG). A low-pass filter (low-pass filter) capable of obtaining a predetermined attenuation with respect to the fundamental frequency band of the received signal is configured.

  The high pass filter HPF1 includes capacitors C41 and C42 connected in series between the second reception terminal P (RxA) and the second connection point. A connection point between the capacitor C41 and the capacitor C42 is connected to the ground through a series circuit of the inductor L41 and the capacitor C43.

  The high-pass filter HPF1 allows the fundamental frequency band of the second reception signal to be output to the second reception terminal P (RxA) to pass through by appropriately setting the inductance of the inductor L41 and the capacitances of the capacitors C41, C42, and C43. A high-pass filter (high-pass filter) that provides a predetermined attenuation with respect to the fundamental frequency band of the first received signal is configured.

  The high frequency module 10 having such a circuit configuration is realized by the following structure. FIG. 2 is an external perspective view of the high-frequency module 10 according to the embodiment of the present invention. FIG. 3 is a stack diagram of the high-frequency module 10 according to the embodiment of the present invention. In addition, the small circle mark of each insulator layer in FIG. 3 has shown the conductive via hole.

  As shown in FIG. 2, the high-frequency module 10 includes a laminate 100 and mounted circuit components 201, 202, 203, and 204.

  The laminate 100 is formed by laminating a plurality of insulator layers 101-119 as shown in FIG. At this time, the layers are stacked so that the insulator layer 101 is the lowermost layer and the insulator layer 119 is the uppermost layer.

  External connection lands 301 and 302 for connecting the high-frequency module 10 to an external circuit or an external ground are formed in a predetermined arrangement pattern on the bottom surface side of the insulating layer 101 which is the lowest layer of the multilayer body 100. .

  An internal ground conductor 401 is formed on the insulator layer 102. The internal ground conductor 401 is formed on substantially the entire surface of the insulator layer 102.

  The insulator layer 103 is formed with flat conductors 501, 502, 503, and 504 having a rectangular shape when the insulator layer 103 and the laminate 100 are viewed along the lamination direction. Hereinafter, a rectangular conductor when the multilayer body 100 is viewed along the stacking direction is referred to as a flat conductor. The flat conductors 501, 502, 503, and 504 have a predetermined area, and are formed so as to face the internal ground conductor 401 and the internal ground conductor 402 of the insulator layer 104.

  An internal ground conductor 402 is formed on the insulator layer 104. The internal ground conductor 402 is formed on substantially the entire surface of the insulator layer 104.

  In the insulator layer 105, flat conductors 504, 505, 506, 507, and 508 are formed. The flat conductors 504, 505, 506, 507 and 508 are formed to face the internal ground conductor 402. Capacitors C11, C12, C13, C23, C31, and C43 are formed from the configuration of the conductor pattern of these insulator layers 102-105.

  In the insulator layer 106, linear conductor patterns 601 and 602 are formed.

  On the insulator layer 107, linear conductor patterns 601, 602, 603, 604, and 607 are formed.

  On the insulator layer 108, linear conductor patterns 601, 603, 604, 607, 611 are formed.

  On the insulator layer 109, linear conductor patterns 603, 607, 608, 609, 610, 611, and 612 are formed.

  On the insulator layer 110, linear conductor patterns 603, 607, 608, 609, 610, 611, and 612 are formed.

  On the insulator layer 111, linear conductor patterns 603, 607, 608, 609, 610, 611, and 612 are formed.

  On the insulator layer 112, linear conductor patterns 603, 607, 608, 609, 611, and 612 are formed.

  All of the inductors L11, L12, L13, L14, L15, L16, L21, L22, L23, L31, L32 constituting the high-frequency module 10 are formed by the conductive patterns and conductive via holes formed in these insulator layers 106-112. , L41 are formed.

  In the insulator layer 113, only conductive via holes are formed.

  An inner ground conductor 403 and flat conductors 509 and 510 are formed on the insulator layer 114.

  Flat conductors 511, 512 and 513 are formed on the insulator layer 115. The flat conductor 511 is formed to face the flat conductor 509 of the insulator layer 114. The flat conductor 512 is formed to face the internal ground conductor 403 of the insulator layer 114.

  In the insulator layer 116, an internal ground conductor 404 and flat conductors 514 and 515 are formed. The internal ground conductor 404 is formed to face the flat conductor 512 of the insulator layer 115. The flat conductor 514 is formed to face the flat conductor 511 of the insulator layer 115. The flat conductor 515 is formed to face the flat conductor 513 of the insulator layer 115.

  A flat conductor 516 is formed on the insulator layer 117. The flat conductor 516 is formed to face the flat conductor 509 of the insulator layer 114.

  Capacitors C21, C22, C41, and C42 are formed from the configuration of the conductor pattern of these insulator layers 114-117.

  A connection conductor 700 is formed on the insulator layer 118. A mounting land 800 is formed in a predetermined pattern on the top surface of the insulator layer 119 (the top surface of the multilayer body 100). The connection conductor 700 connects the switching element or other circuit component mounted on the mounting land formed on the top surface of the insulator layer 119 and the above-described inductor or capacitor with the circuit pattern shown in FIG. Is formed. Mounting circuit components 201, 202, 203, and 204 are mounted on the mounting land 800.

  The mounted circuit component 201 is a switch IC that forms a switch element SW, and the mounted circuit components 202, 203, and 204 are mounted capacitors that form capacitors C1, C2, and C3, respectively.

  More specifically, each inductor is formed as follows.

  The inductor L11 is formed by a conductor pattern 609 formed from the insulator layer 109 to the insulator layer 112 and conductive via holes that connect the conductor patterns 609 of the respective layers in order.

  The inductor L12 is formed by the insulator layer 107, the conductor pattern 604 formed in the insulator layer 108, and conductive via holes that connect the conductor patterns 604 of the respective layers in order.

  The inductor L13 is formed by a conductor pattern 608 formed from the insulator layer 109 to the insulator layer 112 and conductive via holes that connect the conductor patterns 608 of the respective layers in order.

  The inductor L14 is formed by a conductor pattern 601 formed from the insulator layer 106 to the insulator layer 108 and conductive via holes that connect the conductor patterns 601 of the respective layers in order.

  The inductor L15 is formed by a conductor pattern 603 formed from the insulator layer 109 to the insulator layer 112 and conductive via holes that connect the conductor patterns 603 of the respective layers in order.

  The inductor L16 is formed by a conductor pattern 603 formed from the insulator layer 107 to the insulator layer 109 and conductive via holes that connect the conductor patterns 603 of the respective layers in order. The conductor pattern 603 forming the inductors L15 and L16 corresponds to the “first inner conductor pattern” of the present invention.

  The inductor L21 is formed by a conductor pattern 610 formed from the insulator layer 109 to the insulator layer 111 and conductive via holes that connect the conductor patterns 610 of each layer in order.

  The inductor L22 is formed by a conductor pattern 607 formed from the insulator layer 109 to the insulator layer 112 and conductive via holes that connect the conductor patterns 607 of the respective layers in order.

  The inductor L23 is formed by a conductor pattern 607 formed from the insulator layer 107 to the insulator layer 109 and conductive via holes that connect the conductor patterns 607 of the respective layers in order. The conductor pattern 607 forming the inductor L23 corresponds to the “second inner conductor pattern” of the present invention.

  The inductor L31 is formed by a conductor pattern 612 formed from the insulator layer 109 to the insulator layer 112 and conductive via holes that connect the conductor patterns 612 of the respective layers in order.

  The inductor L32 is formed by a conductor pattern 602 formed in the insulator layer 106 and the insulator layer 107, and conductive via holes that connect the conductor patterns 602 of the respective layers in order. The conductor patterns 602 and 612 forming the inductors L31 and L32 correspond to the “fourth inner conductor pattern (third inner conductor pattern)” of the present invention.

  The inductor L41 is formed by a conductor pattern 611 formed from the insulator layer 108 to the insulator layer 112 and conductive via holes that connect the conductor patterns 611 of the respective layers in order. The conductor pattern 611 forming the inductor L41 corresponds to the “fifth inner conductor pattern (third inner conductor pattern)” of the present invention.

  With such a configuration, the inductors L11, L12, L13, L14, L15, L16, L21, L22, L23, L31, L32, and L41 have an axis along the stacking direction and have a spiral shape. It becomes an inductor.

  Regions where the inductors L11, L12, L13, L14, L15, and L16 are formed (regions where the low pass filter LPF1 is formed) and regions where the inductors L21, L22, and L23 are formed (regions where the band pass filter BPF1 is formed) Means that the stacked body 100 is arranged in a different position without overlapping when viewed from the top (viewing the stacked body 100 along the stacking direction).

  The region where the inductors L15 and L16 of the low-pass filter LPF1 are formed is in the vicinity of one side surface of the multilayer body 100, and the region where the inductor L23 of the bandpass filter BPF1 is formed is the other side surface (one side surface) of the multilayer body 100. Near the opposite side). Such an arrangement is realized over all the insulator layers on which the conductor patterns of the inductors L15, L16, and L23 are formed. By adopting such a configuration, the distance between the conductor pattern of the inductors L15 and L16 and the conductor pattern of the inductor L23 is increased, so that electromagnetic field coupling between the inductors L15 and L16 and the inductor L23 can be suppressed. . Thereby, the isolation between the first transmission terminal P (TxG) close to the inductors L15 and L16 on the equivalent circuit and the second transmission terminal P (TxA) close to the inductor L23 on the equivalent circuit is improved. be able to.

  Furthermore, between the region where the inductors L15 and L16 of the low-pass filter LPF1 are formed and the region where the inductor L23 of the bandpass filter BPF1 is formed, the inductors L31 and L32 are formed in a plan view of the multilayer body 100. Region (inductor forming region of the low-pass filter LPF2) and the inductor L41 (inductor forming region of the high-pass filter HPF1) are arranged. Such an arrangement is also realized over all the insulating layers where the conductor patterns of the inductors L15, L16, and L23 are formed. With this configuration, the conductor pattern of the other circuit element is interposed between the conductor pattern of the inductors L15 and L16 and the conductor pattern of the inductor L23, and the electromagnetic coupling between the inductors L15 and L16 and the inductor L23 is further increased. Can be suppressed. This further improves the isolation between the first transmission terminal P (TxG) close to the inductors L15 and L16 on the equivalent circuit and the second transmission terminal P (TxA) close to the inductor L23 on the equivalent circuit. Can be made.

  Further, as shown in FIG. 3, between the inductor formation region of the low-pass filter LPF1, the inductor formation region of the bandpass filter BPF1, and the inductor formation region of the low-pass filter LPF2 and the high-pass filter HPF1, A plurality of conductive via holes VHG that are electrically connected to the internal ground conductor 402 are formed. In FIG. 3, the symbol “VHG” is attached only to the representative conductive via hole for easy understanding of the drawing, but this configuration is clear from the arrangement of the conductive via hole in the laminated diagram.

  Thus, by forming a plurality of conductive via holes VHG between the inductor formation regions of each filter, it is possible to suppress electromagnetic field coupling between conductor patterns in each region. Thereby, the electromagnetic coupling between the inductor formation region of the low-pass filter LPF1 and the inductor formation region of the bandpass filter BPF1 can be suppressed. Therefore, the isolation between the first transmission terminal P (TxG) close to the inductors L15 and L16 on the equivalent circuit and the second transmission terminal P (TxA) close to the inductor L23 on the equivalent circuit is further improved. Can be made.

  As shown in FIG. 3, there may be a portion where the inductor formation region of the low-pass filter LPF1 and the inductor formation region of the bandpass filter BPF1 are close to each other. In this case, as shown in FIG. 3, an inductor L11 closest to the first connection point in the low-pass filter LPF1 on the equivalent circuit and an inductor L21 closest to the first connection point in the bandpass filter BPF1 on the equivalent circuit are It may be arranged so as to be closer than other inductors. As a result, even if these inductors are electromagnetically coupled and the transmission signal leaks, it is attenuated by the low-pass filter LPF1 and the band-pass filter BPF1, so the first transmission terminal P (TxG) and the second transmission terminal P ( Isolation with TxA) can be ensured at a predetermined level or higher.

  FIG. 4 is an isolation characteristic diagram of the high-frequency module 10 according to the embodiment of the present invention and a conventional high-frequency module. FIG. 4 shows the pass characteristic of a signal from the first transmission terminal P (TxG) to the second transmission terminal P (TxA). FIG. 4 is a simulation result when each circuit element value is set on the assumption that the second harmonic frequency band of the first transmission signal overlaps the fundamental frequency band of the second transmission signal. As shown in FIG. 4, by using the configuration of the high frequency module 10 of the present embodiment, the second transmission frequency band of the first transmission signal is attenuated near 5.0 GHz, which is the fundamental frequency band of the second transmission signal. It can be seen that the amount increases and the isolation between the first transmission terminal P (TxG) and the second transmission terminal P (TxA) in the band is improved.

  Further, as shown in FIG. 3, the conductor pattern forming the inductor of the low-pass filter LPF2 is close to the conductor pattern forming the inductor of the low-pass filter LPF1, and is arranged far from the conductor pattern forming the inductor of the band-pass filter BPF1. To do. The conductor pattern forming the inductor of the high-pass filter HPF1 is arranged close to the conductor pattern forming the inductor of the band-pass filter BPF1, and far from the conductor pattern forming the inductor of the low-pass filter LPF1. That is, when the laminate 100 is viewed in plan, a conductor pattern that forms an inductor of the low-pass filter LPF1, a conductor pattern that forms an inductor of the low-pass filter LPF2, a conductor pattern that forms an inductor of the high-pass filter HPF1, and an inductor of the band-pass filter BPF1 The conductor patterns are formed so as to be arranged in the order of the conductor patterns.

  Here, the first transmission signal and the first reception signal are set to be a pair constituting the first communication signal. Further, the second transmission signal and the second reception signal are set so as to form a pair constituting the second communication signal. In this case, the fundamental frequency band of the first transmission signal and the fundamental frequency band of the first reception signal hardly overlap each other. Similarly, the fundamental frequency band of the second transmission signal and the fundamental frequency band of the second reception signal hardly overlap each other. On the other hand, the fundamental frequency band of the first transmission signal and the fundamental frequency band of the second reception signal may overlap, and the fundamental frequency band of the second transmission signal and the fundamental frequency band of the first reception signal may overlap. There is.

  Therefore, in this communication specification, the inductor of the low-pass filter LPF1 is close to the inductor of the low-pass filter LPF2, is separated from the inductor of the high-pass filter HPF1, and the inductor of the band-pass filter BPF1 is close to the inductor of the high-pass filter HPF1. By separating from the inductor of the low-pass filter LPF2, the distance between the conductor patterns of the inductor that transmits two types of signals that may overlap the frequency bands can be increased, and terminals for inputting and outputting these signals Isolation between the two can be improved.

  In the configuration of the above-described embodiment, the second transmission frequency band or the third harmonic frequency band of the first transmission signal (for example, the fundamental frequency band of the first transmission signal: about 2.4 GHz to about 2.5 GHz) and the second This is effective when the fundamental frequency band (for example, about 4.9 GHz to about 5.0 GHz) of the transmission signal overlaps, but is not limited to such a case. When the second or third harmonic frequency band of the first transmission signal and the fundamental frequency band of the second transmission signal overlap, the passband of the bandpass filter BPF1 and the second harmonic frequency or third of the first transmission signal Wave frequencies overlap, and the second or third harmonic signal of the first transmission signal is likely to leak to the second transmission terminal side. Therefore, if the electromagnetic coupling between the first inductor close to the first transmission terminal and the second inductor close to the second transmission terminal can be suppressed, the first transmission terminal P (TxG) and the second transmission terminal P ( The effect of improving the isolation with TxA) is increased.

  In the above-described embodiment, an example in which the diplexer DIPt is configured by the low-pass filter LPF1 to which the first transmission terminal P (TxG) is connected and the band-pass filter BPF1 to which the second transmission terminal P (TxA) is connected. However, the low-pass filter LPF1 to which the first transmission terminal P (TxG) is connected and the band-pass filter BPF1 to which the second transmission terminal P (TxA) is connected constitute different duplexers for transmission / reception switching, respectively. Even in such a case, the above-described configuration of the conductor pattern can be applied.

10: high frequency module,
100: laminate,
101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 114, 115, 116, 117, 118, 119: insulator layer,
201, 202, 203, 204: mounted circuit components,
301, 302: Land for external connection,
401, 402, 403, 404: internal ground conductor,
501, 502, 503, 504, 505, 506, 507, 508, 509, 510, 511, 512, 513, 514, 515, 516: flat plate conductors,
601, 602, 603, 604, 607, 608, 609, 610, 611, 612: conductor pattern,
700: connecting conductor,
800: mounting land,
BPF1: band pass filter, LPF1, LPF2: low pass filter, HPF1: high pass filter, DIPt, DIPr: diplexer,
L11, L12, L13, L14, L15, L16, L21, L22, L23, L31, L32, L41: inductors,
C1, C2, C11, C12, C13, C21, C22, C23, C31, C41, C42, C43: capacitors,
SW: Switch element,
VHG: Conductive via hole,
P (ANT): common antenna terminal, P (TxG): first transmission terminal, P (TxA): second transmission terminal, P (RxG): first reception terminal, P (RxA): second reception terminal

Claims (7)

A high-frequency module comprising a laminated body in which a plurality of insulator layers on which a predetermined conductor pattern is formed is laminated, and for transmitting a first transmission signal and a second transmission signal with an antenna common to them,
The laminate is
A common antenna terminal connected to the common antenna ;
A first transmission terminal to which the first transmission signal is input ;
A second transmission terminal to which the second transmission signal is input ;
A first reception terminal that outputs a first reception signal that is paired with the first transmission signal;
A second reception terminal that outputs a second reception signal that is paired with the second transmission signal;
With
Inside the laminate,
A first inductor that constitutes at least a part of a first filter circuit connected between the first transmission terminal and the common antenna terminal and is closest to the first transmission terminal on an equivalent circuit in the first filter circuit A first inner conductor pattern forming
A second inductor that forms at least a part of a second filter circuit connected between the second transmission terminal and the common antenna terminal, and is closest to the second transmission terminal on an equivalent circuit in the second filter circuit; A second inner conductor pattern forming
Forming at least part of a third filter circuit connected between the first receiving terminal and the common antenna terminal, and disposed between the first inner conductor pattern and the second inner conductor pattern; 4 internal conductor patterns;
Forming at least part of a fourth filter circuit connected between the second receiving terminal and the common antenna terminal, and disposed between the first inner conductor pattern and the second inner conductor pattern; 5 internal conductor patterns;
A high frequency module is formed. The first internal conductor pattern, the second internal conductor pattern, and the fourth internal conductor pattern are arranged so as not to overlap each other when viewed from the main surface of the multilayer body , and the first The internal conductor pattern, the second internal conductor pattern, and the fifth internal conductor pattern are arranged so as not to overlap each other when viewed from the main surface of the multilayer body . High frequency module.   An end of the first filter circuit on the common antenna terminal side is connected to an end of the second filter circuit on the common antenna terminal side, and includes a first filter circuit and a second filter circuit. The high frequency module according to claim 1 or 2, comprising one diplexer. An end of the third filter circuit on the common antenna terminal side is connected to an end of the fourth filter circuit on the common antenna terminal side, and includes a third filter circuit and a fourth filter circuit. 2 diplexers,
A first connection point in the first diplexer where an end of the first filter circuit on the common antenna terminal side and an end of the second filter circuit on the common antenna terminal side are connected; and the third filter A switching element connected to the common antenna terminal by switching between a second connection point to which an end of the circuit on the common antenna terminal side and an end of the fourth filter circuit on the common antenna terminal side are connected ,
The high frequency module according to claim 3 , comprising: 5. The high-frequency module according to claim 1 , wherein the fourth inner conductor pattern is formed closer to the first inner conductor pattern than the fifth inner conductor pattern. The high frequency module according to claim 1 , wherein a fundamental frequency of the second transmission signal is a second harmonic frequency or a third harmonic frequency of the first transmission signal. The multilayer body has a shape that is continuous in the stacking direction of the multilayer body, and a first region in which an internal conductor pattern constituting the first filter circuit is formed and an internal conductor pattern that constitutes the second filter circuit are provided. A plurality of conductive via holes arranged between the second region to be formed;
An internal ground conductor formed in a predetermined insulator layer and connected to an external ground, and
The high frequency module according to claim 1, wherein the plurality of conductive via holes are connected to the internal ground conductor.

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