JP5876837B2 - 二重トレイ運搬装置 - Google Patents
二重トレイ運搬装置 Download PDFInfo
- Publication number
- JP5876837B2 JP5876837B2 JP2012548083A JP2012548083A JP5876837B2 JP 5876837 B2 JP5876837 B2 JP 5876837B2 JP 2012548083 A JP2012548083 A JP 2012548083A JP 2012548083 A JP2012548083 A JP 2012548083A JP 5876837 B2 JP5876837 B2 JP 5876837B2
- Authority
- JP
- Japan
- Prior art keywords
- tray
- integrated circuit
- transporter
- transport
- taping system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/16—Trays for chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3222—Loading to or unloading from a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
- B65G37/005—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes comprising two or more co-operating conveying elements with parallel longitudinal axes
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Intermediate Stations On Conveyors (AREA)
- Discharge Of Articles From Conveyors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
Claims (12)
- トレイ積み位置と、
トレイ降ろし位置と、
トレイ積み位置からトレイ降ろし位置に延伸する4本の並行レールと、
各レールに搭載され、各々がトレイ積み位置とトレイ降ろし位置との間に配置され、レールに沿って移動するように構成されたトレイ運搬基台と、
を備えた、トレイ運搬システムであって、
前記トレイ運搬基台は、
レールと係合する往復台と、
往復台に取り付けられた対をなす旋回アームであって、並行レールが延びる方向に垂直な方向に延びる旋回軸回りに各々が旋回する、対をなす旋回アームと、
選択的にトレイを保持および解放するための、対をなす旋回アームのそれぞれに取付けられた保持ピースと、
対をなす旋回アームを、開き位置と閉じ位置との間で移動するように旋回軸回りに下向きに及び上向きに旋回させる手段と、
を備え、
保持ピースは、旋回アームが閉じ位置のときにトレイ高さにてトレイを保持し、保持ピースは、旋回アームが開き位置のときに、トレイを解放し、完全に前記トレイ高さより下に配置され、
第1のトレイを共に運搬するための2つのトレイ運搬基台が第1トレイ運搬装置を構成し、第2のトレイを共に運搬するための他の2つの前記トレイ運搬基台が第2トレイ運搬装置を構成し、
第1トレイ運搬装置は、当該第1トレイ運搬装置が開き位置のときに、閉じ位置にある第2トレイ運搬装置が運搬するトレイの下部を通過することができる、
トレイ運搬システム、
を含む集積回路のテーピングシステム。 - 第1トレイ運搬装置の2本のレールと、第2トレイ運搬装置の2本のレールとは、交互に配置される、請求項1に記載の集積回路のテーピングシステム。
- 各トレイ運搬装置のトレイ運搬基台の一方は、同一のトレイ運搬装置の他方のトレイ運搬基台よりも大きい、請求項1に記載の集積回路のテーピングシステム。
- 第1トレイ運搬装置は、トレイ降ろし位置で空のトレイを処理し、トレイを保持する第2トレイ運搬装置を通過し、第2トレイ運搬装置に保持されたトレイから集積回路が空になる前に、トレイ積み位置で満杯のトレイを受け取るように構成されている、請求項1に記載の集積回路のテーピングシステム。
- 旋回アームを動かす手段は空気圧シリンダである、請求項1に記載の集積回路のテーピングシステム。
- 旋回アームを動かす手段がモータである、請求項1に記載の集積回路のテーピングシステム。
- 旋回アームと往復台との間に配置され、旋回アームを動かす手段が機能しない場合に、閉じ位置で前記保持ピースを保持するように構成されたばねをさらに備える、請求項1に記載の集積回路のテーピングシステム。
- 保持ピースは、トレイの底部を支持するための水平部と、既知の位置にトレイを整列させる垂直部とを備える、請求項1に記載の集積回路のテーピングシステム。
- 前記垂直部は、トレイの上面よりも上側に延伸する、請求項8に記載の集積回路のテーピングシステム。
- 前記垂直部は、トレイの上面よりも上側に延伸しない、請求項8に記載の集積回路のテーピングシステム。
- 保持ピースは、トレイの底面、側面、および上面と係合するための切り込みを備える、請求項1に記載の集積回路のテーピングシステム。
- 集積回路を満杯にしたトレイを、トレイ積み位置にあるトレイ運搬装置に渡すためのトレイ積み場所と、
トレイ降ろし位置にあるトレイ運搬装置から空のトレイを取り去るためのトレイ降ろし場所と、
トレイ積み位置とトレイ降ろし位置との間の中間位置に配置され、トレイ運搬装置のトレイから集積回路を取り出すためのピックアンドプレース部と、
をさらに備えた請求項1に記載の集積回路のテーピングシステム。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29333910P | 2010-01-08 | 2010-01-08 | |
| US61/293,339 | 2010-01-08 | ||
| PCT/US2011/020166 WO2011084972A2 (en) | 2010-01-08 | 2011-01-05 | Dual tray carrier unit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013516792A JP2013516792A (ja) | 2013-05-13 |
| JP2013516792A5 JP2013516792A5 (ja) | 2014-02-20 |
| JP5876837B2 true JP5876837B2 (ja) | 2016-03-02 |
Family
ID=44306117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012548083A Active JP5876837B2 (ja) | 2010-01-08 | 2011-01-05 | 二重トレイ運搬装置 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9099509B2 (ja) |
| EP (1) | EP2522028B1 (ja) |
| JP (1) | JP5876837B2 (ja) |
| KR (1) | KR101803111B1 (ja) |
| CN (1) | CN102939647B (ja) |
| MY (1) | MY159800A (ja) |
| PH (1) | PH12012501360A1 (ja) |
| SG (1) | SG181807A1 (ja) |
| WO (1) | WO2011084972A2 (ja) |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3286324A (en) * | 1964-12-21 | 1966-11-22 | Black Clawson Co | Machine tool |
| JPS6050535B2 (ja) * | 1981-08-21 | 1985-11-08 | 株式会社オリイ自動機製作所 | 搬送装置 |
| JPH0344576U (ja) * | 1989-09-06 | 1991-04-25 | ||
| JPH06246656A (ja) * | 1993-02-26 | 1994-09-06 | Motoda Electron Co Ltd | 農作業用ロボット |
| JPH0750334A (ja) * | 1993-08-03 | 1995-02-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| US5588797A (en) * | 1994-07-18 | 1996-12-31 | Advantek, Inc. | IC tray handling apparatus and method |
| JPH08175641A (ja) * | 1994-12-22 | 1996-07-09 | Rohm Co Ltd | 搬送装置 |
| US6471460B1 (en) * | 1996-07-15 | 2002-10-29 | Semitool, Inc. | Apparatus for processing a microelectronic workpiece including a workpiece cassette inventory assembly |
| JPH10107114A (ja) * | 1996-09-27 | 1998-04-24 | Kokusai Electric Co Ltd | 基板搬送装置 |
| JPH10261699A (ja) * | 1997-03-21 | 1998-09-29 | Sankyo Seiki Mfg Co Ltd | 円板状基板のチャック装置 |
| JPH1159829A (ja) * | 1997-08-08 | 1999-03-02 | Mitsubishi Electric Corp | 半導体ウェハカセット搬送装置、半導体ウェハカセット搬送装置で用いられるストッカ、ならびに半導体ウェハカセット搬送装置で用いられるストッカ入庫作業制御方法、ストッカ出庫作業制御方法、自動搬送車制御方法、およびストッカ在庫照合方法 |
| US6183186B1 (en) * | 1997-08-29 | 2001-02-06 | Daitron, Inc. | Wafer handling system and method |
| JP2000232050A (ja) * | 1999-02-09 | 2000-08-22 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2000232080A (ja) * | 1999-02-10 | 2000-08-22 | Disco Abrasive Syst Ltd | 被加工物の分割システム及びペレットの移し替え装置 |
| JP2004001833A (ja) * | 2002-05-31 | 2004-01-08 | Toyo Seiki Kogyo Co Ltd | テーピング装置 |
| US7798764B2 (en) * | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
| KR100960765B1 (ko) | 2005-04-22 | 2010-06-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 직교 좌표형 로봇 클러스터 툴 아키텍쳐 |
| US8529185B2 (en) * | 2005-08-31 | 2013-09-10 | Hirata Corporation | Work handling apparatus |
| JP2008060513A (ja) * | 2006-09-04 | 2008-03-13 | Tokyo Electron Ltd | 処理装置及び処理方法 |
| FR2912600B1 (fr) * | 2007-02-16 | 2010-03-12 | Ceva Sante Animale | Methode et systeme de retassage d'un plateau d'oeufs |
| KR100938172B1 (ko) * | 2007-12-28 | 2010-01-21 | 미래산업 주식회사 | 핸들러, 반도체 소자 로딩방법, 테스트트레이 이송방법, 및반도체 소자 제조방법 |
| KR100938466B1 (ko) * | 2008-04-21 | 2010-01-25 | 미래산업 주식회사 | 핸들러, 반도체 소자 언로딩방법, 테스트트레이 이송방법,및 반도체 소자 제조방법 |
| KR100885877B1 (ko) | 2008-07-11 | 2009-02-26 | 주식회사 인아텍 | 기판 이송장치 |
| US8079139B1 (en) * | 2010-08-27 | 2011-12-20 | I-Chiun Precision Industry Co., Ltd. | Method for producing electro-thermal separation type light emitting diode support structure |
-
2011
- 2011-01-05 PH PH1/2012/501360A patent/PH12012501360A1/en unknown
- 2011-01-05 CN CN201180005551.1A patent/CN102939647B/zh active Active
- 2011-01-05 WO PCT/US2011/020166 patent/WO2011084972A2/en not_active Ceased
- 2011-01-05 KR KR1020127019736A patent/KR101803111B1/ko active Active
- 2011-01-05 MY MYPI2012002985A patent/MY159800A/en unknown
- 2011-01-05 SG SG2012045167A patent/SG181807A1/en unknown
- 2011-01-05 EP EP11732061.4A patent/EP2522028B1/en active Active
- 2011-01-05 JP JP2012548083A patent/JP5876837B2/ja active Active
- 2011-09-23 US US13/259,343 patent/US9099509B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9099509B2 (en) | 2015-08-04 |
| MY159800A (en) | 2017-01-31 |
| KR101803111B1 (ko) | 2017-11-29 |
| WO2011084972A2 (en) | 2011-07-14 |
| WO2011084972A3 (en) | 2011-11-24 |
| PH12012501360A1 (en) | 2012-10-22 |
| EP2522028A2 (en) | 2012-11-14 |
| CN102939647A (zh) | 2013-02-20 |
| SG181807A1 (en) | 2012-07-30 |
| CN102939647B (zh) | 2015-09-02 |
| JP2013516792A (ja) | 2013-05-13 |
| EP2522028B1 (en) | 2018-03-28 |
| KR20120113762A (ko) | 2012-10-15 |
| US20120090495A1 (en) | 2012-04-19 |
| EP2522028A4 (en) | 2016-12-07 |
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