JP5884465B2 - Non-contact IC medium manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing a non-contact IC medium such as an IC card capable of adjusting a communication frequency by trimming a capacitor.

  Conventionally, in a non-contact IC medium that performs predetermined communication using a method such as FeliCa (registered trademark), trimming can be performed in an antenna pattern in order to correct frequency characteristic variation for each medium depending on variation in IC chip capacity. A trimming capacitor is provided. The trimming capacitor can adjust the frequency by trimming a part of the wiring by laser irradiation or the like and adjusting the capacitance (see Reference 1).

  In the case of a card-type non-contact IC medium, an inlay in which an antenna and a trimming capacitor are formed is formed on an antenna sheet substrate, and the resonance frequency is adjusted to a predetermined resonance frequency by trimming the trimming capacitor. Thereafter, one or a plurality of exterior base materials or the like are laminated on both surfaces to obtain an IC card.

JP2004-120055

  However, in the above-described method, since the frequency is adjusted in the inlay state before card formation, the frequency characteristics change after the exterior base material is laminated. In particular, when the base material is laminated and laminated, the frequency drops due to the base material. For this reason, the amount of trimming cut in the above-described inlay state is estimated and calculated after sufficient data is taken at the time of trial manufacture to estimate the average drop amount. However, since there is a large variation in IC chip capacity, the accuracy of the calculated frequency drop cannot be dealt with uniformly, and there is a risk of deviating from the ideal resonance frequency in the final IC card state. there were.

  Accordingly, an object of the present invention is to provide a non-contact IC medium manufacturing method that can easily adjust the resonance frequency of an antenna by trimming a capacitor and is highly accurate.

The invention according to claim 1, which has been made to solve the above problems, includes an IC chip, a pattern of an antenna coil electrically connected to the IC chip, and an electrode pattern of a capacitor that can be trimmed by laser light irradiation. An upper card substrate made of a resin material that transmits the wavelength of the laser beam and has a glass transition temperature of 150 or higher is provided on the side of the inlay on which the electrode pattern is formed. After laminating and laminating a lower card base on the opposite side of the side on which the electrode pattern is formed, and then laminating the inlay, the upper card base and the lower card base, the upper card base of the IC card A method of manufacturing an IC card, wherein the electrode pattern is trimmed by laser irradiation from above the material.
The invention according to claim 2 is the IC card manufacturing method according to claim 1, wherein after the electrode pattern is trimmed, a pattern layer is provided on the card substrate.
The invention according to claim 3 is the IC card manufacturing method according to claim 1 or 2, characterized in that the material used for the upper card substrate is made of engineering plastic .

  According to the present invention, by performing trimming by laser irradiation after laminating card bases via a card base that transmits laser light, it is not necessary to consider changes in frequency characteristics due to laminating, etc. The accuracy of adjustment can be improved.

It is a schematic diagram which shows the laminated structure of the non-contact IC medium concerning this invention. It is a schematic diagram which shows the example of the electrode pattern of the trimming capacitor concerning this invention. It is a schematic diagram which shows the example of trimming in the non-contact IC medium concerning this invention.

  FIG. 1 is a schematic diagram showing a laminated structure of a non-contact IC medium according to the present invention. The non-contact IC medium 10 is formed by forming an antenna pattern 11 and a trimming capacitor electrode pattern on an antenna base 12 and sandwiching an inlay mounted with an IC chip 15 between upper and lower card bases (13, 14). It becomes. The card substrate may be laminated in multiple layers such as a core substrate, an intermediate substrate, and an exterior substrate.

  FIG. 2 is a schematic diagram showing an example of the antenna pattern 11 on the antenna substrate 12 and the electrode pattern 21 of the trimming capacitor. In the example of FIG. 2, the trimming capacitor includes a comb-shaped electrode 21, a counter electrode 24 formed on the surface opposite to the comb-shaped electrode of the antenna base, a jumper wire connected to the antenna pattern, and the like. Further, an electrode 23 for mounting the IC 15 is formed. A plurality of trimming capacitors are arranged so as to be connected in parallel so that the frequency can be adjusted in the range of about 2 to 3 MHz. The antenna coil, the comb electrode of the trimming capacitor, and the pattern of the counter electrode are carbonized by etching of metal foil such as aluminum or copper, metal plating, or laser irradiation using ink containing silver paste or metal fine particles, respectively. It can be formed by various printing methods such as a printing method. If the antenna pattern and the electrode pattern of the trimming capacitor are formed simultaneously, the manufacturing process can be reduced.

  As shown in FIG. 3, the non-contact IC medium 10 can adjust the frequency characteristics by removing or insulating a part of the electrode pattern 21 of the trimming capacitor by trimming. Trimming is performed by irradiating the trimming position with laser light from the card substrate side laminated on the electrode pattern 21 of the trimming capacitor. As the type of laser to be used, a laser having a wavelength of about 1 μm, which has little absorption by the resin material used for the card substrate and has absorption by metal, is preferable. Specifically, a YAG laser (1064 nm), a YVO4 laser (1064 nm), or the like can be preferably used.

  The card base includes an upper card base 13 stacked on the antenna base 12 on which the pattern of the comb-shaped electrode 21 of the trimming capacitor is formed, and a lower card base 14 stacked on the opposite surface. It consists of and. Among these, it is preferable to select a material having as high a transmittance as possible with respect to the laser irradiated for trimming at least for the upper card substrate. If the transmittance of the laser beam is low, the laser beam is absorbed by the card base material, and the laser beam is blocked by the carbonized card base material and may not reach the electrode to be trimmed.

  The material used for the upper card base material 13 is not particularly limited as long as it is a base material such as Bayer MaterialScience Makrofol Transparent laser 750061, which is a laser transmitting base material transparent at the wavelength of the laser beam. Moreover, it is preferable that the layer which is contacting the electrode pattern among the upper card base materials is excellent in heat resistance. This is because the metal is heated by being irradiated with laser light. For example, a resin material having a glass transition temperature of 150 ° C. or higher is used. Specific examples of the material for the upper card substrate include engineering plastics having improved translucency and heat resistance, such as polycarbonate.

  Further, when the upper card base 13 is composed of a plurality of base materials, in order to suppress reflection at the interface of each base material layer, it is preferable to use a material having a close refractive index and to integrate by base material fusion. . For example, when polycarbonate is used as the main material of each layer, it can be fused and integrated by thermal lamination, so that reflection at each layer can be eliminated.

  In addition to materials that can be used for the upper card, the antenna substrate 12 and the lower card substrate 14 are polycarbonate, plant-derived polycarbonate, polyethylene terephthalate (PET), polyethylene naphthalate, polysiloxane 1,4-dimethylphthalate, polystyrene ( PS), polymethyl methacrylate, transparent acrylonitrile butadiene styrene copolymer synthetic resin, polyvinyl chloride, polypropylene, polyethylene, polyacetal, vinyl chloride material, vinyl chloride-vinyl acetate copolymer material, terephthalic acid, cyclohexanedimethanol and ethylene glycol Amorphous polyester material, acrylonitrile-butadiene comprising a polymer alloy of the above-mentioned copolymer and polycarbonate and / or polyarylate Down - can be used styrene copolymer synthetic resin material. In addition, a paper or a synthetic paper base made of natural or artificial fibers may be used.

  The upper card substrate 13, the antenna substrate 12, and the lower card substrate 14 have good adhesiveness and suppress peeling by integrating the layers by selecting a resin material that self-fuses at each interface. Can do. For this, for example, a material having self-bonding properties such as polycarbonate may be used as described above.

  As described above, after the upper card substrate 13 and the lower card substrate 14 are laminated on the inlay, the amount of trimming capacitors to be trimmed is calculated from the frequency deviation actually measured with respect to the allowable frequency range, and the IC card The card substrate is irradiated with laser to trim the electrode pattern of a predetermined number of trimming capacitors. According to the present invention, since trimming is performed after the card base material is laminated, it is not necessary to consider the change in frequency characteristics due to lamination or the like, and the accuracy of frequency adjustment can be improved.

  As a further merit of improving the accuracy of frequency adjustment, the allowable frequency characteristic can be further limited. By limiting the allowable frequency characteristics, it becomes severe with respect to the change of the frequency characteristics due to the replacement of the IC chip, which contributes to the improvement of security. In addition, it is possible to eliminate the trouble of preparing a display module inlay jig or the like by carrying out trimming processing after forming a card for those for which transport of mounting the display module is more difficult than conventional inlays.

  After the trimming capacitor is trimmed, a concealing layer, a picture layer, a protective layer, and the like may be provided on the upper card base 13 and the lower card base 14. The concealing layer is a layer formed of a material that is non-transparent in the visible light region such as white, in order to conceal the inside when the card base material is light transmissive or to reflect the pattern of the pattern layer. . The pattern layer is a layer on which information such as characters and figures is printed. The protective layer is a layer formed on the card surface for the purpose of wear resistance, chemical resistance and the like. Further, these layers may be provided only on the lower card base material before trimming, and may be formed on the upper card base material after trimming. Further, these layers may be provided on the upper card substrate and the lower card substrate before trimming as long as the transmittance at the laser beam wavelength at the time of trimming is high.

  The antenna pattern 11 and the trimming capacitor electrode pattern 21 were formed on one side of the base material made of a PET film having a thickness of 50 μm by etching aluminum with the structure shown in FIG. Furthermore, after the jumper wire of the antenna coil and the counter electrode 24 of the trimming capacitor were formed on the back surface of the base material, the antenna pattern and the jumper wire were connected and the IC chip was mounted.

  An IC card was produced by laminating a 100 μm thick crystalline polycarbonate (manufactured by Bayer MaterialScience) on both surfaces of the substrate on which the antenna coil, trimming capacitor, and IC chip were formed.

  The frequency of the carded product was measured, the difference from the target value was calculated, and then the capacitor was trimmed by irradiating laser light from the surface of the laminated IC card trimming capacitor on which the electrode pattern 21 was formed. . For the laser, a YVO4 laser marker (manufactured by Keyence) with a wavelength of 1064 nm was used. The irradiation conditions were a scanning speed of 10 mm / s, a laser output current of 20 A, and a Q switch frequency of 10 kHz.

  No trace of laser irradiation was visually recognized on the surface of the IC card. Further, when the resonance frequency before and after trimming was measured, it was confirmed that the resonance frequency before trimming was 13.35 MHz, whereas the resonance frequency after trimming was 13.58 MHz.

DESCRIPTION OF SYMBOLS 10 ... IC card 11 ... Antenna pattern 12 ... Antenna base material 13 ... Upper card base material 14 ... Lower card base material

Claims (3)

Prepare an inlay comprising an IC chip, an antenna coil pattern electrically connected to the IC chip, and a plurality of trimming capacitor electrode patterns that can be trimmed by laser light irradiation,
On the side of the inlay on which the electrode pattern is formed , an upper card substrate made of a resin material that transmits the wavelength of the laser light and has a glass transition temperature of 150 or more is laminated,
Laminating the lower card base on the opposite side of the side where the electrode pattern was formed before and after,
After laminating the inlay and an upper card substrate and the lower card substrate, and the laser irradiation from the upper card substrate of the IC card, IC card manufacturing method, characterized by trimming the electrode patterns.   2. The IC card manufacturing method according to claim 1, wherein a pattern layer is provided on the card substrate after trimming the electrode pattern. 3. The IC card manufacturing method according to claim 1, wherein a material used for the upper card base is made of engineering plastic .