JP5884471B2 - Module substrate manufacturing method and manufacturing apparatus thereof - Google Patents

Description

  The present invention relates to a module substrate used for a non-contact type IC card or booklet, and in particular, an opening is provided in a paper base material in which a wire conductor is laid in a coil shape at the peripheral portion thereof, and a resin substrate for IC mounting is fitted. The present invention relates to a method of connecting an end portion of a wire conductor to an electrode pad on a resin substrate and an apparatus therefor.

  A non-contact IC card is basically a card in which a transmitting / receiving antenna and an information recording IC chip are electrically connected and embedded in a paper base or plastic base. In general, as shown in FIG. 2, a wire conductor 4 having a diameter of about 0.1 mm is laid in a coil shape, and a paper substrate 1 having a thickness of about 0.2 mm is provided with an opening of a predetermined size. The module substrate 10 in which the IC mounting resin substrate 2 of about 0.17 mm is fitted into the opening is further laminated from both sides with a plastic base material to provide design.

  As shown in FIG. 1, the paper base 1 constituting the module substrate 10 includes an antenna (not shown in FIG. 1) in which wire conductors 4 are laid in a coil shape and an opening 3 for accommodating an IC mounting resin substrate 2. However, in order to lay the wire conductor in the form of a coil on the periphery of the paper substrate 1, the wire conductor 4 is placed on the thermoplastic resin 6 (adhesive layer) applied to the antenna laying position on the substrate surface. The wire conductor is fixed to the peripheral edge portion of the paper base 2 excluding the opening 3 by feeding out the resin and melting the thermoplastic resin 6 by the laying head.

  The IC mounting resin substrate 2 is such that the IC chip 5 is mounted on the substrate so as to straddle the slit between the paired electrode pads 7A and 7B, and further, the IC chip is covered with a molding resin and molded into a predetermined shape. It is. The completed IC mounting resin substrate (hereinafter also referred to as “resin substrate”) may be electrically connected to the wire conductor end 4 ′ after being accommodated in the opening 3 of the paper base, or the resin substrate 2. In some cases, only the IC chip 5 is mounted and the wire conductor 4 is connected after being accommodated in the opening 3 of the paper substrate 1 and then covered with a mold resin. In the latter case, the thickness of the resin substrate 2 is set to be smaller than the thickness of the paper base material 1 in consideration of the thickness of the wire conductor so that the mold layer does not protrude greatly from the surface of the paper base material 1. It is normal (see FIG. 1C).

  The connection between the electrode pads 7A and 7B formed on the resin substrate 2 and the wire conductor terminal 4 ′ on the paper base is performed by connecting the wire conductor terminal 4 ′ to the electrode pad of the resin substrate 2 as shown in FIG. 7A and 7B, the wire conductor 4 'is pressed against the electrodes 7A and 7B of the resin substrate 2 by a thermocompression bonding head, and the wire conductor 4' is used as an electrode pad. It is fixed by thermocompression bonding.

  At that time, as described above, if the thickness of the resin substrate 2 for mounting IC is smaller than the thickness of the paper base material, the resin substrate sinks into the opening 3 in processing on a normal flat stage, so that the wire conductor Needs to be brought into contact with the electrode surface 7. When loosened, there is a problem that a portion of the wire conductor straddling on the electrode is displaced or meanders.

Further, since the opening 3 is generally set larger than the IC mounting resin substrate 2 (clearance), the resin substrate is not fixed and has a margin of movement. In this case, for example, if the size of the thermocompression bonding head is not appropriate, an error occurs in the alignment between the electrode pads 7A and 7B and the wire conductor 4 ′, the wire conductor 4 ′ is distorted or curved, and the thermocompression bonding cannot be performed well. There is a problem that the occupied position in the opening 3 of the resin substrate 2 suspended from the conductor 4 ′ is not stable. If the position of the resin substrate 2 is not stable, there is also a problem that the chip cannot be mounted in the subsequent mounting process of the IC chip 5.

  Specifically, after the wire end 4 'is thermocompression bonded to the electrode pads 7A and 7B of the IC mounting resin substrate 2, the IC chip 5 is flip-chip mounted so as to bridge the electrode pads. This processing is performed with 2 being fixed to the wire conductor 4 '. Since the thickness of the paper base material 1 is thicker than that of the resin substrate 2, a gap is formed between the resin substrate 2 and the stage on which the substrate is placed, and it becomes difficult to fix to the stage by suction. There is a problem that the IC chip 5 cannot be mounted reliably, such as incomplete bonding.

  Increasing the thickness of the resin substrate for IC mounting improves the above problem, but adjusting the thickness is not easy, and increasing the thickness increases the cost of the substrate, contrary to the demand for cost reduction. is there.

Japanese Patent No. 3721520

  The present invention has been made in view of the above-described problems, and even when the substantial thickness of the resin substrate for mounting an IC is smaller than the thickness of the paper base, the wire conductor laid on the paper base can be accurately used for the resin. An object of the present invention is to provide a method and an apparatus therefor that can reliably define and fix the occupied position of the resin substrate in the paper base opening so that it can be disposed on the electrode of the substrate.

  The invention described in claim 1 for achieving the above object is to form an opening for accommodating an IC chip mounting resin substrate at a predetermined position of a paper base, and apply a thermoplastic resin to the peripheral portion. A step of forming an electrode pad on a resin substrate for mounting an IC chip, and a stage having a pedestal on which a frame-like protrusion is erected along the outer periphery so that the resin substrate is accommodated in the frame-like protrusion. The step of placing, the step of placing the paper substrate on the stage so that the pedestal is accommodated in the opening of the paper substrate, and laying and fixing the wire conductor in a loop shape on the thermoplastic resin at the periphery of the paper substrate The step of placing the end of the wire conductor on the electrode pad in such a manner that the opening of the paper substrate is linearly traversed through the slit formed in the frame-shaped protrusion and in contact with the end of the wire conductor; And electrode pads are thermocompression bonded using a thermocompression bonding head. Step, step of mounting the IC chip in place of the resin substrate is obtained by the manufacturing method of the module substrate characterized by having a city.

  The invention according to claim 2 is characterized in that the opening provided in the paper base material has a size having a clearance of 0.3 mm or more with respect to the resin substrate for mounting IC chip. This is a manufacturing method of the described module substrate.

  According to a third aspect of the present invention, the clearance is set so that the clearance in the grain direction of the paper substrate when the paper substrate is placed is larger than the clearance in the direction perpendicular thereto. The method for manufacturing a module substrate according to claim 2, wherein:

According to a fourth aspect of the present invention, an IC chip mounting resin substrate is disposed in an opening provided in a paper base so that the IC chip mounting resin substrate is accommodated in parallel with the paper base. A module substrate manufacturing apparatus for thermocompression bonding an end portion and an electrode pad formed on a resin substrate, comprising at least a thermocompression bonding head and a stage, and the stage compensates for a difference in thickness between the paper base and the resin substrate. For this purpose, a base for raising the bottom of the resin substrate that can penetrate the opening is provided, the base has a tapered frame-like projection standing along the outer periphery, and the frame-like projection has a slit for allowing the wire conductor to pass therethrough. A module substrate manufacturing apparatus characterized by the above.

The invention according to claim 5 is the module substrate manufacturing apparatus according to claim 4 , wherein the stage has a vacuum drawing hole for adsorbing and fixing the paper base material around the base for raising the bottom. It is.

A sixth aspect of the present invention is the module substrate manufacturing apparatus according to the fourth or fifth aspect , wherein the base for raising the bottom has a vacuum drawing hole for adsorbing and fixing the resin substrate. is there.

Invention according to claim 7, vacuum holes of the resin substrate adsorbing fixing is 請 Motomeko the wire conductor and the electrode you characterized in that it is arranged at a position separated from the site of thermocompression 6. The module substrate manufacturing apparatus according to 6 .

The invention according to claim 8, evacuation hole of the resin substrate adsorbing fixing the claim 6 or claim 7, characterized in that it is arranged at a position separated from the IC chip mounting part 1 The module substrate manufacturing apparatus according to the item is provided.

According to the first and fourth aspects of the invention, it becomes easy to accurately fix the relative positional relationship between the resin substrate, the wire conductor, and the paper base material, and the wire is bonded when the wire conductor and the resin substrate are thermocompression bonded. It is possible to stabilize the positional relationship between the resin substrate after thermocompression bonding and the paper base material (substrate insertion hole) because the conductor is almost free of tension and the wire conductor is hardly loosened after crimping. This makes it possible to reduce the improper fixing position of the resin substrate, such as the resin substrate getting on the paper base material or being submerged.

  According to the third and fourth aspects of the present invention, the paper base and the resin substrate can be securely fixed and adsorbed on the stage, and the wire conductor and the thermocompression bonding with the substrate or the resin substrate can be performed. It is possible to reliably mount the IC chip.

  According to the invention of claim 5 and claim 6, when the paper base material absorbs moisture or dries and expands and contracts in a direction particularly perpendicular to the paper grain, the board insertion hole of the paper base material is formed with respect to the stage protrusion. It becomes possible to reduce the case where it does not fit.

According to the invention described in claim 5 , when the wire conductor is thermocompression bonded to the resin substrate, the thermocompression bonding head is provided on the stage protrusion when the thermocompression bonding head is pressed against the wire conductor and the substrate in the vicinity of the bonding pad to be thermocompression bonded. It is possible to solve the problem that the applied pressure of the crimping decreases due to the effect that the resin substrate is distorted and sinks into the hole side, and it is possible to reliably perform the thermocompression bonding of the wire conductor to the resin substrate. .

  According to the seventh and eighth aspects of the invention, when the IC chip is mounted on the resin substrate, when the chip mounting head is pressed against the chip and the substrate in the vicinity of the IC chip mounting portion to be mounted, the stage protrusion It is possible to solve the problem that the pressure applied to the chip mounting decreases due to the distortion of the resin substrate sinking into the hole side provided in the hole, and to ensure that the IC chip is mounted on the resin substrate. It becomes possible.

The perspective view (a), (b) explaining the structure of a module board | substrate, and the figure (c) of a sectional view. (A) A state in which an IC mounting resin substrate is set on the paper base material opening. (B) A state in which a resin substrate is fitted into the opening. The figure of the sectional view in the AA 'line of (b). It is a figure of the top view explaining arrangement | positioning of the wire conductor and IC chip on a module board | substrate. It is a figure of the sectional view explaining the composition and operation of the module substrate manufacturing device concerning the present invention typically. (A) At the time of thermocompression bonding, (b) It is the figure which removed the module board | substrate from the thermocompression bonding apparatus. (A), (b) is a perspective view which illustrates typically a part of manufacturing process of the module substrate which becomes this invention. It is a top view (a) explaining an example of the position of the clearance and the resin substrate suction hole when the module substrate is placed on the module substrate manufacturing apparatus according to the present invention. (B) is a top view of another example of the shape of the bank.

  The form of the module substrate that is the subject of the present invention is the same as that of the conventional configuration shown in FIG. 1 or FIG. 2, but a predetermined IC mounting resin substrate 2 is provided in the opening 3 of the paper base 1. It is limited to those manufactured by connecting the wire conductor (antenna wire) end 4 'and the IC chip 5 to the electrode pads 7A and 7B formed in advance on the resin substrate after being fitted.

  In this case, the substantial thickness of the resin substrate 2 is usually set to be thinner than the substantial thickness of the paper base 1. In that case, various disadvantages occur when the wire conductor end 4 'and the IC chip 5 are connected to the electrode pads 7A and 7B of the substrate, respectively.

  Specifically, the wire end 4 ′ laid on the paper base material 1 is securely crimped to the electrode 7, and the resin substrate 2 stays at a predetermined position in the opening 3 at a predetermined height by the connection. In order to do so, it is necessary to make the surface of the paper substrate 1 and the surface of the resin 2 flush with each other as shown in FIG. In order to make it flush, it is necessary to lift the thinner resin substrate 2 from the bottom by the thickness difference. That is, as shown in FIG. 3 (a), it is necessary to provide a pedestal 14 for putting clogs on the stage 13 and press-bond on the pedestal.

  If the wire end 4 'is connected to the electrode pads 7A and 7B in this manner, the resin substrate 2 is suspended from the wire end and floats and stays on the stage. Chip connection is not possible. Therefore, also in this case, the suspended resin 2 is supported by a flat base from below.

  Use the same pedestal (working stage) for the same purpose of lifting and supporting from below. This is because the device 12 (TCB) for pressing the wire conductor 4 ′ against the electrode 7 is different from the device for connecting the IC chip 5 between the electrodes (ultrasonic mounting head; not shown). If the TCB and the ultrasonic mounting head can be interchanged while fixing the base material side, the stage can be made common.

  In the present invention, the height and parallelism are adjusted by introducing the pedestal 14 in order to more reliably define the staying position of the resin substrate 2 in the paper base opening 3 in the vertical direction and the horizontal direction. The shape of the part was improved. That is, as shown in FIGS. 3A, 4 (not easy to see), and FIG. 5, a frame-like protrusion 11 (hereinafter also referred to as a bank) is erected along the outer periphery of the base 14 protruding from the stage 13. I let you. It is desirable that the area surrounded by the bank 11 has a clearance that is the same as or slightly smaller than the area in which the resin substrate 2 is completely accommodated. In the top view of FIG. 5, the resin substrate 2 is drawn so as to fit in the bank 11, but actually, it is not tight but has room.

As for the height of the bank 11, as shown in FIG. 3A, the height of the base 14 is adjusted so that the surface of the paper base 1 and the electrode pad surface of the resin substrate 2 are flush with each other. As long as the thickness is equal to or greater than the thickness of the resin substrate 2. However, in the present invention, the thickness is set higher than the thickness of the resin substrate 2. This is inconvenient because the wire conductor 7 climbs over the bank, so that a slit 16 is provided at a portion where the bank 11 can be climbed over with the wire conductor so that the wire can be extended linearly. By allowing the wire conductor 7 to pass through the slit 16, the movement of the wire conductor is restricted and the position can be made constant.

  The outer shape of the protrusion 11 is preferably tapered. This can easily accommodate the resin substrate in the bank. Further, the protrusion does not need to be formed in a complete frame shape around the base. For example, a middle drop type as shown in FIG. 5B may be used.

  Hereinafter, the present invention will be briefly described based on examples.

  As shown in FIG. 4, the module substrate according to the present embodiment includes at least a paper base 1, wire conductors 4, 4 ′, an IC mounting resin substrate 2, and an IC chip mounted on the substrate, as shown in FIG. 4. ing. However, in FIG. 4, the wire conductor 4 laid on the periphery of the paper base material is omitted, and only the end 4 'is shown. Eventually, the module substrate is covered with an overcoat material and becomes a booklet such as a non-contact IC card or a passbook.

(Paper substrate)
The paper base material 1 (hereinafter also simply referred to as a base material) is a high-quality flat paper or resin having a thickness of about 0.20 mm, and at least the surface layer is made of a non-conductive material. At the position where the wire conductor 4 on the surface of the paper base material is laid as an antenna, the paper base material 1 in which the thermoplastic resin layer 6 is previously provided as an adhesive layer by coating or the like is used. Further, the paper base 1 is formed with an opening 3 having substantially the same shape as an IC mounting resin substrate 2 (hereinafter also simply referred to as a resin substrate) as shown in FIG. 4 so as to maintain a predetermined clearance. Thus, the resin substrate 2 is fitted into the opening 3.

(Resin substrate for IC mounting)
The IC mounting resin substrate 2 is formed in a plate shape from a nonconductive material such as resin represented by FR-4, polyimide, PET, and PEN. A pair of electrodes 7A and 7B is formed on at least the front surface (upper surface) and back surface (lower surface) of the substrate 2 as shown in FIG. 4 (a) or FIG. The electrode 7 is made of a conductive material such as Cu or Al. In FIG. 5, the IC chip 5 is illustrated as being mounted, but at this time, the chip mounting position is shown.

  As shown in FIGS. 4 and 5, the electrodes each include bonding pad portions 7 </ b> A and 7 </ b> B and an IC chip mounting portion 8. The electrode pads 7A and 7B are portions for connecting the wire conductors 4. The mounting part 8 is a part for mounting the IC chip 5 so as to straddle the slits of the electrodes. As shown in FIGS. 4 and 5, the electrodes 7 forming a pair of the present embodiment are formed symmetrically in a plan view, and the mounting portions 8 are opposed to each other across a predetermined slit, and rectangular on each of the left and right sides. Shaped bonding pad portions 7A and 7B are formed. The electrode pad is arranged with the long side facing in the same direction as the slit. However, the shape of the electrode itself is not limited to that shown in the figure, and it is sufficient that the pair of electrodes are within a range that can be connected to the IC chip.

  And in this embodiment, as shown in FIG.3 (b), the total thickness a of the resin substrate 2 containing the electrode 7 is made from the thickness b of the paper base material 1 (except the thickness of the thermoplastic resin layer 8). It is adjusted to be thinner. In the case of manufacturing an IC card, the difference between the total thickness a and the thickness b of the base material 2 is preferably within 0.2 mm.

"Manufacturing method of module board"
The paper substrate 1 is set on a stage 13 having a TCB 12 on the top. At the same time, it is sucked and fixed from a suction hole 20 provided around the base 14 of the stage 13 (see FIG. 5). The stage 13 has a cross section shown in FIG. 3A, and a pedestal 14 that protrudes from the stage 13 is provided at the center. The size of the pedestal flat end is slightly smaller than the opening 3 of the paper substrate 1 and the pedestal 14 penetrates the opening 3 slightly from the bottom of the substrate with a certain clearance. The protruding height of the pedestal 14 is about the difference between the thickness of the paper base 1 and the thickness of the substrate 2 accommodated in the opening 3, and the upper surface of the paper base 1 and the surface of the substrate 2 are just flush with each other. Is the height.

  The height of the frame-shaped protrusion 11 around the pedestal was processed to be thicker than the thickness of the resin substrate 2, and the slit 16 was formed in advance at the passage position of the wire conductor. The slits 16 were formed at opposite portions of the protrusions running in parallel. Further, although the thickness of the thermoplastic resin 6 applied to the paper base 1 is not taken into consideration, the electrode 7 on the resin substrate 2 is included in the thickness of the substrate.

  Next, the IC mounting resin substrate 2 on which the pair of electrodes 7 are formed is fitted into the opening 3 formed in the base material 1. The fitting is performed so that the protrusion 11 of the base is inserted into the notch 9 of the resin substrate 2. At the same time as the fitting, the suction hole 21 provided in the base 14 is sucked and fixed (see FIG. 4B and FIG. 5). The order in which the paper base 1 and the resin substrate 2 are placed on the stage is not limited to the order described above, and may be switched as appropriate.

  Next, the thermoplastic resin layer 6 applied to the upper surface of the base material 1 is melted by the laying head while the wire conductor 4 is sent out from the laying head (not shown) to the surface of the base material 1. Then, the wire conductor 4 is laid and fixed to the loop antenna shape. At this time, even on the resin substrate 2 arranged in the opening 3 of the base material 1, the wire conductor 4 is sent out from the laying head and passes through the pad portions 7A and 7B of the electrodes 7 so as to pass through the wire end 4 ′. Is laid (FIG. 4B). Then, the wire conductor 4 is fixed to the electrode 7 by pressing the wire conductor 4 against the electrode 7 with the thermocompression bonding head 12 and thermocompression bonding.

  At this time, when the paper base 1 is placed at a predetermined position of the flat stage 13 without a pedestal, the total thickness a of the IC mounting resin substrate 2 including the electrodes 6 is thinner than the thickness b of the base 1. The electrode 7 of the resin substrate 2 is recessed downward from the upper surface of the substrate 1 (excluding the thickness of the thermoplastic resin layer 8). In this state, when the wire conductor 4 is sent and laid so as to cross the opening 3, the wire conductor 4 may be laid in a relaxed state, and the retained form in the opening 3 of the resin substrate 2 after the pressure bonding is provided. And the position is not stable. Providing the protruding pedestal 14 and further providing the frame-shaped protrusion 11 eliminates such instability.

  Next, the paper substrate is moved to another stage having an ultrasonic mounting head (not shown). Then, the IC chip 5 is disposed so as to straddle the mounting portion 8 of the paired electrodes 7A and 7B. Further, the base 11 and the IC mounting resin substrate 2 are sucked and fixed to the pedestal and the stage by evacuating from the pedestal 11 and the suction holes 20 and 21 formed in the periphery thereof. In this state, an ultrasonic mounting head (not shown) is brought into contact with the IC chip 5 from the upper side to apply ultrasonic waves, so that the IC chip 5 is bonded and fixed to the pair of mounting portions 8. The height of the base 14 in this case is the same as that in the case where the wire 4 is thermocompression bonded.

  If the paper substrate is lifted and supported in this way, and the resin substrate for mounting IC is placed in the frame-shaped protrusion, the resin substrate can be adsorbed and fixed at a predetermined position. Ultrasonic energy can be used effectively when mounting. That is, the IC chip can be reliably mounted in a state where the back surface (lower surface) of the IC mounting resin substrate 2 is adsorbed so as to be in close contact with the pedestal 14.

  Finally, the arrangement and clearance of suction holes for tightly fixing the paper base and the IC mounting resin substrate to the stage will be described. FIG. 5 illustrates an example of the arrangement of the suction holes on and near the pedestal 14 protruding from the stage in a top view. At least suction holes 20 for sucking the paper substrate 1 need to be arranged around the base 11. About a position, it arrange | positions suitably according to the magnitude | size of a paper base material single-piece | unit.

  The suction hole 21 for sucking the resin substrate is disposed on the base 11. With respect to this position, a position away from the position immediately below the position where the IC chip 5 is mounted (FIG. 5) and also from the position immediately below where the wire ends 4A and 4B run is preferable. This is because the temperature directly above the suction hole may cause the temperature of the substrate to be lowered or the distortion of the substrate at the time of pressurization to reliably prevent thermocompression bonding and ultrasonic mounting.

  About the clearance of the opening part 3 of the paper base material 1 and the resin substrate 2 accommodated therein, as shown in FIG. 5, the clearance a between sides substantially parallel to the paper pattern (flow line) of the paper base material. In comparison, it is preferable that the clearance b between the substantially orthogonal sides is large. In particular, it is preferable to satisfy the relationship of b> a ≧ 0.3 mm.

1, paper base 2, resin substrate (for IC mounting)
3, opening 4, wire conductor (antenna)
4 ', 4A, 4B, wire conductor end 5, IC chip 6, thermoplastic resin 7, (for connection) electrodes 7A, 7B, electrode pad 8, IC chip mounting part (inter-electrode slit)
9, clip 10, module board 11, protrusion (frame-shaped bank)
12, TCB
13, stage 14, pedestal 15, paper (flow)
16, slit (on the protrusion)
20, suction hole (for paper base material)
21, suction hole (for board)

Claims (8)

Forming an opening for accommodating an IC chip mounting resin substrate at a predetermined position of the paper base material, and applying a thermoplastic resin to the peripheral edge;
Forming electrode pads on an IC chip mounting resin substrate;
A step of placing the resin substrate on the pedestal of the stage having a pedestal on which the frame-shaped protrusion is erected along the outer periphery so that the resin substrate is accommodated in the frame-shaped protrusion;
Placing the paper substrate on the stage so that the pedestal is accommodated in the opening of the paper substrate,
A step of laying and fixing a wire conductor in a loop on the thermoplastic resin at the periphery of the paper substrate;
Placing the end of the wire conductor on the electrode pad in a manner that linearly traverses the opening of the paper substrate through the slit formed in the frame-shaped protrusion and makes contact therewith,
A step of thermocompression bonding the end of the wire conductor and the electrode pad using a thermocompression bonding head;
And a step of mounting the IC chip at a predetermined position of the resin substrate.   2. The method of manufacturing a module substrate according to claim 1, wherein the opening provided in the paper base has a size having a clearance of 0.3 MM or more with respect to the IC chip mounting resin substrate.   The clearance is set so that a clearance in a grain direction of the paper substrate when the paper substrate is placed is larger than a clearance in a direction perpendicular to the clearance. Manufacturing method of the module substrate.   In the opening provided in the paper base, the IC chip mounting resin substrate is arranged so as to be accommodated in parallel with the paper base, and the end of the wire conductor laid on the paper base and the electrode formed on the resin substrate A module substrate manufacturing apparatus for thermocompression bonding with a pad, comprising at least a thermocompression bonding head and a stage, wherein the stage is a resin that can penetrate the opening to compensate for the difference in thickness between the paper base and the resin substrate. An apparatus for manufacturing a module substrate, comprising: a base for raising the substrate bottom, the base having a tapered frame-like projection standing up along the outer periphery, and the frame-like projection having a slit through which a wire conductor passes. . 5. The module substrate manufacturing apparatus according to claim 4, wherein the stage has a vacuum pulling hole for adsorbing and fixing a paper base material around a base for raising the bottom. 6. The module substrate manufacturing apparatus according to claim 4, wherein the bottom raising base has a vacuum drawing hole for resin substrate adsorption fixing. Evacuation hole of the resin substrate adsorbing fixing the wire conductor and the electrode and the manufacturing apparatus of a module board according to 請 Motomeko 6 characterized in that it is arranged at a position separated from the site of thermocompression . 8. The module substrate manufacturing apparatus according to claim 6, wherein the vacuum pulling hole for adsorbing and fixing the resin substrate is disposed at a position spaced apart from the IC chip mounting portion. 9. .