JP5887829B2 - Grinding apparatus and grinding method - Google Patents

Description

  The present invention relates to a grinding apparatus and a grinding method.

  Conventionally, in order to reduce the height of an electronic component, a grinding apparatus has been widely used for thinning a wafer such as a semiconductor or a resin portion of a CSP (chip size package).

  For example, Patent Document 1 discloses a grinding apparatus that thins a wafer supported by an annular frame via an adhesive tape. In the grinding apparatus described in Patent Document 1, an annular frame that supports the peripheral portion of the adhesive tape to which the wafer is adhered is fixed by a clamp, a magnet, or the like, and the wafer is attracted to the adsorption portion via the adhesive tape. In a held state, the wafer is ground by rotating a grinding wheel disposed facing the wafer. During grinding, the annular frame is held so that the upper surface of the annular frame is lower than the upper surface of the suction portion.

JP 2011-125988 A

  However, if the annular frame is not securely fixed, the position of the annular frame may be higher than the suction portion. Moreover, even when an annular frame thicker than a predetermined thickness is used by mistake, the position of the annular frame may be higher than the suction portion. In such a case, an annular frame and a grindstone may contact and an annular frame and a grindstone may be damaged. Further, when the annular frame and the grindstone come into contact with each other, the annular frame may fall off, resulting in serious damage to the apparatus.

  The main object of the present invention is to provide a grinding apparatus in which an annular frame and the apparatus are not easily damaged.

  A grinding device according to the present invention is a grinding device for grinding an object to be ground supported by an annular frame via an adhesive tape. The grinding device according to the present invention includes a fixed portion, a suction portion, a grindstone, a drive portion, a detection portion, and a control portion. The fixing portion fixes the annular frame. The adsorbing part supports the object to be ground supported by the annular frame fixed to the fixing part by adsorbing it via the adhesive tape. The grindstone is arranged to face the suction part. The grindstone grinds the object to be ground supported by the suction portion. The drive unit drives the grindstone. The detection unit detects the height position of the upper surface of the annular frame. The control unit controls the drive unit and the detection unit. The control unit causes the detection unit to detect the height position of the upper surface of the annular frame fixed to the fixing unit, and when the detected height position of the upper surface of the annular frame is lower than the height position of the upper surface of the suction unit. Drive the drive unit.

  In a specific aspect of the grinding apparatus according to the present invention, the control unit causes the detection unit to detect the height positions of a plurality of portions in the circumferential direction of the upper surface of the annular frame fixed to the fixing unit, and the detected annular frame The drive unit is driven when all the height positions of the upper surface of the are lower than the height position of the upper surface of the suction unit.

  In another specific aspect of the grinding apparatus according to the present invention, the grinding apparatus further includes a moving mechanism. The moving mechanism moves the fixed portion between the first position and the second position where the suction portion and the grindstone are arranged. The control unit fixes the annular frame to the fixed part at the first position, and then moves the fixed part to which the annular frame is fixed to the second position to the moving mechanism, and then the annular part fixed to the fixed part. The detection unit detects the height position of the upper surface of the frame.

  The grinding method according to the present invention prepares an object to be ground supported by an annular frame via an adhesive tape. A fixing / adsorption process is performed in which the annular frame on which the object to be ground is supported is fixed to the fixing part, and the object to be ground is adsorbed to the adsorption part via the adhesive tape. A detection step of detecting the height position of the upper surface of the annular frame fixed to the fixing portion is performed. When the detected height position of the upper surface of the annular frame is lower than the height position of the upper surface of the suction portion, a grinding process is performed for grinding the workpiece with a grindstone arranged facing the suction portion.

  In a specific aspect of the grinding method according to the present invention, in the detection step, the height positions of a plurality of portions in the circumferential direction of the upper surface of the annular frame fixed to the fixing portion are detected. In the grinding process, when all the height positions of the detected upper surface of the annular frame are lower than the height position of the upper surface of the suction portion, the object to be ground is ground with a grindstone.

  In another specific aspect of the grinding method according to the present invention, in the fixing / sucking step, a fixing step of fixing the annular frame on which the workpiece is supported at the first position to the fixing portion is performed. After the fixing step, a moving step of moving the fixing portion and the annular frame from the first position to the second position is performed. After the moving process, an adsorption process is performed in which the object to be ground is adsorbed to the adsorption unit via the adhesive tape at the second position. A grinding process is performed in the second position.

  According to the present invention, it is possible to provide a grinding apparatus in which the annular frame and the apparatus are hardly damaged.

It is a typical top view of the annular frame in one embodiment of the present invention. It is a typical side view of the grinding device in one embodiment of the present invention. It is the typical side view which expanded a part of grinding device in one embodiment of the present invention.

  Hereinafter, an example of the preferable form which implemented this invention is demonstrated. However, the following embodiment is merely an example. The present invention is not limited to the following embodiments.

  The drawings referred to in the embodiments and the like are schematically described, and the ratio of dimensions of objects drawn in the drawings may be different from the ratio of dimensions of actual objects. The dimensional ratio of the object may be different between the drawings. The specific dimensional ratio of the object should be determined in consideration of the following description.

  FIG. 1 is a schematic plan view of an annular frame in the present embodiment. FIG. 2 is a schematic side view of the grinding apparatus in the present embodiment. FIG. 3 is an enlarged schematic side view of a part of the grinding apparatus according to the present embodiment.

  The grinding device 1 is a device for grinding an object to be ground 10. The kind of the workpiece 10 is not particularly limited. The workpiece 10 may be, for example, an acoustic wave chip, a semiconductor substrate, or the like. Specifically, in this embodiment, the workpiece 10 is constituted by a CSP aggregate before being divided into a plurality of CSPs (Chip Size Packages).

  The workpiece 10 is supported by the annular frame 12 via the adhesive tape 11. Specifically, the peripheral edge of the adhesive tape 11 is fixed to the annular frame 12 over the entire circumference. Then, at least one workpiece 10 is adhered and fixed on the adhesive tape 11. In addition, since the adhesive tape 11 consists of resin, it has flexibility.

  The grinding apparatus 1 includes a fixed unit 21, a moving mechanism 22, a suction unit 23, a grindstone 24, a drive unit 25, a detection unit 26 (see FIG. 3), and a control unit 27.

  The fixing portion 21 fixes the annular frame 12 to which the adhesive tape 11 and the workpiece 10 are fixed. Specifically, four fixing portions 21 are provided and fix the four sides of the annular frame 12. The fixing part 21 is not particularly limited as long as the annular frame 12 can be fixed. The fixing | fixed part 21 can be comprised by the clamp which clamps the cyclic | annular flame | frame 12 in the thickness direction, for example. Further, when the annular frame 12 is made of a magnetic material, the fixing portion 21 can be formed of a magnet.

  The moving mechanism 22 moves the fixed portion 21 between the first position P1 and the second position P2. The first position P <b> 1 is a position where the annular frame 12 is attached / detached by the fixing portion 21. The second position P2 is a position where the suction portion 23 and the grindstone 24 are provided, and is a position where the workpiece 10 is ground. The moving mechanism 22 can be constituted by, for example, an actuator such as a motor, an air pump, or the like.

  The suction portion (chuck table) 23 is disposed so as to be positioned below the workpiece 10 when the fixing portion 21 is positioned at the second position P2. The suction portion 23 supports the object to be ground 10 supported by the annular frame 12 fixed to the fixing portion 21 located at the second position P <b> 2 by sucking the workpiece 10 through the adhesive tape 11. The adsorption part 23 can be comprised by the porous body etc. which were connected to the suction pump etc., for example.

  The grindstone 24 is disposed so as to face the suction portion 23. The grindstone 24 is a member for grinding the workpiece 10. The grindstone 24 is connected to the drive unit 25. The drive unit 25 drives the grindstone 24. Specifically, the drive unit 25 rotates the grindstone 24. The drive unit 25 can be configured by, for example, a motor to which a spindle is connected.

  The detection unit 26 shown in FIG. 3 detects the height position of the upper surface 12a of the annular frame 12 located at the second position P2. Specifically, the detection unit 26 detects the height position of the upper surface 12a of the annular frame 12 in the regions A1 to A4 shown in FIG. The detection unit 26 can be configured by a contact sensor such as a height gauge, an optical sensor having a laser light emitting device and a laser light detector, or the like.

  The control unit 27 controls the drive unit 25 and the detection unit 26. The control unit 27 can be configured by a CPU or the like, for example.

  Next, a method for grinding the workpiece 10 using the grinding apparatus 1 will be described.

(Preparation process of workpiece 10)
First, an object to be ground 10 supported by an annular frame 12 via an adhesive tape 11 is prepared. Specifically, the peripheral edge of the adhesive tape 11 is adhered to the annular frame 12 over the entire circumference. Next, the adhesive tape 11 is supported by adhering at least one workpiece 10 to be ground.

(Fixing / adsorption process)
Next, the control unit 27 fixes the annular frame 12 to the fixing unit 21 at the first position P1 (fixing step). Next, the control unit 27 causes the moving mechanism 22 to move the fixed unit 21 to which the annular frame 12 is fixed to the second position P2 (moving step). Next, the control unit 27 raises the suction unit 23 and fixes the workpiece 10 by suctioning the workpiece 10 to the suction unit 23 via the adhesive tape 11 at the second position P2 (suction). Process).

(Detection process)
Next, the control unit 27 causes the detection unit 26 to detect the height position of the upper surface 12 a of the annular frame 12 fixed to the fixing unit 21. Specifically, the control unit 27 causes the detection unit 26 to detect the height position of the upper surface 12a of the annular frame 12 fixed to the fixing unit 21 in each of the regions A1 to A4.

(Grinding process)
Next, the control unit 27 determines whether or not each detected height position of the upper surface 12a of the annular frame 12 is lower than the height position of the upper surface 23a of the suction unit 23. As a result, when the control unit 27 determines that the detected height positions of the upper surface 12a of the annular frame 12 are lower than the height position of the upper surface 23a of the suction unit 23, the control unit 27 drives the driving unit 25 to drive the grindstone 24. Then, the workpiece 10 is ground at the second position P2. On the other hand, when the control unit 27 determines that at least one of the detected height positions of the upper surface 12 a of the annular frame 12 is higher than the height position of the upper surface 23 a of the suction unit 23, the control unit 27 causes the driving unit 25 to send the grindstone 24. Do not drive. That is, grinding is not performed. In this case, the control unit 27 sounds an error warning sound and causes the moving mechanism 22 to return the fixing unit 21 to the first position P1. Thereafter, the control unit 27 repeats the fixing / suction process, the moving process, and the grinding process until the detected height positions of the upper surface 12a of the annular frame 12 become lower than the height position of the upper surface 23a of the suction part 23. Do.

  As described above, in the present embodiment, after the annular frame 12 is fixed to the fixing portion 21, before the grinding is started, the height position of the upper surface 12a of the annular frame 12 is the height of the upper surface 23a of the suction portion 23. Whether the position is lower than the vertical position is detected, and grinding is performed only when the position is lower. For this reason, the annular frame 12 does not contact the grindstone 24, or grinding is not started in a state where the annular frame 12 is not securely fixed. Therefore, damage to the annular frame 12 and the grinding device 1 can be suppressed.

  From the viewpoint of more effectively suppressing damage to the annular frame 12 and the grinding apparatus 1, it is preferable to detect the height position of the upper surface 12a of the annular frame 12 at a plurality of locations in the circumferential direction as in this embodiment. However, if the number of detection points is too large, the time required for grinding becomes long. For this reason, it is preferable that the number of search locations is about 3-4.

  The detection unit 26 may also serve as a detection unit that measures the height position of the upper surface 23a of the suction unit 23, and the like.

DESCRIPTION OF SYMBOLS 1 ... Grinding apparatus P1 ... 1st position P2 ... 2nd position 10 ... To-be-ground object 11 ... Adhesive tape 12 ... Ring frame 12a ... Ring frame upper surface 21 ... Fixing part 22 ... Moving mechanism 23 ... Adsorption part 23a ... Adsorption Upper surface 24 of the unit ... Whetstone 25 ... Drive unit 26 ... Detection unit 27 ... Control unit

Claims (4)

A grinding device for grinding an object to be ground supported by an annular frame via an adhesive tape,
A fixing portion for fixing the annular frame;
An adsorbing part that supports an object to be ground supported by an annular frame fixed to the fixing part by adsorbing the object to be ground through the adhesive tape;
A grindstone that is disposed to face the suction portion and grinds the workpiece to be ground supported by the suction portion;
A drive unit for driving the grindstone;
A detection unit for detecting the height position of the upper surface of the annular frame;
A control unit for controlling the drive unit and the detection unit;
With
The control unit causes the detection unit to detect the height position of the upper surface of the annular frame fixed to the fixing unit, and the height position of the upper surface of the detected annular frame is the height position of the upper surface of the suction unit. Drive the drive when lower than ,
A moving mechanism for moving the fixed portion between a first position and a second position where the suction portion and the grindstone are arranged;
The control unit, after fixing the annular frame to the fixed portion in the first position, to move the fixed portion to which the annular frame is fixed to the second position in the moving mechanism, the height position of the upper surface of the annular frame fixed to the fixing portion Ru is detected in the detection unit, the grinding apparatus.   The control unit causes the detection unit to detect height positions of a plurality of portions in the circumferential direction of the upper surface of the annular frame fixed to the fixing unit, and to detect all height positions of the detected upper surface of the annular frame. The grinding apparatus according to claim 1, wherein the driving unit is driven when the height is lower than a height position of the upper surface of the suction unit. Preparing an object to be ground supported by an annular frame via an adhesive tape;
A fixing / adsorption step of fixing the annular frame on which the object to be ground is supported to a fixing part, and adsorbing the object to be ground to an adsorption part via the adhesive tape;
A detection step of detecting the height position of the upper surface of the annular frame fixed to the fixing portion;
When the detected height position of the upper surface of the annular frame is lower than the height position of the upper surface of the suction part, a grinding step of grinding the object to be ground with a grindstone arranged facing the suction part;
Equipped with a,
The fixing / adsorption process includes:
A fixing step of fixing the annular frame on which the workpiece is supported in the first position to the fixing portion;
A moving step of moving the fixing portion and the annular frame from the first position to the second position after the fixing step;
An adsorption step of adsorbing the object to be ground to the adsorption portion via the adhesive tape at the second position after the moving step;
Have
A grinding method in which the grinding step is performed in the second position . In the detection step, the height positions of a plurality of portions in the circumferential direction of the upper surface of the annular frame fixed to the fixing portion are detected,
In the grinding step, if all the height position of the upper surface of the detected annular frame is lower than the height position of the upper surface of the suction unit, grinding the object to be ground by the grinding wheel, in claim 3 The grinding method as described.

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