JP5889382B2 - Electronic component and semiconductor device having the same - Google Patents

Description

  The present invention relates to an electronic component and a semiconductor device including the electronic component, and more particularly to an electronic component supported on a substrate by a lead and a semiconductor device including the electronic component.

  Generally, in a semiconductor device, a semiconductor element and an electrical element are attached to a substrate. An example of a semiconductor device is a GCT (Gate Committed Turn-off) thyristor unit. In this GCT thyristor unit, a GCT thyristor as a semiconductor element and a capacitor as an electrical element are attached to a printed circuit board.

  This capacitor is for electrically switching the GCT thyristor. As the capacitor, for example, a plurality of aluminum electrolytic capacitors necessary for the switching operation are used. Usually, this aluminum electrolytic capacitor is attached to a printed circuit board by soldering the lead portion of the aluminum electrolytic capacitor to the printed circuit board.

  Vibration may occur during transportation and operation of the GCT thyristor unit. When a force due to the vibration is applied to the aluminum electrolytic capacitor, the force due to the vibration acts as a shearing force on the lead portion of the aluminum electrolytic capacitor. As a result, the lead portion of the aluminum electrolytic capacitor may be broken.

  For the purpose of preventing breakage of the lead portion, for example, a chip capacitor disclosed in Japanese Patent Laid-Open No. 2001-68371 (Patent Document 1) has been proposed. In the chip-type capacitor of this publication, a support piece that comes into contact with the outer peripheral side surface of the capacitor body is provided on an insulating plate placed in contact with the sealing end of the capacitor body.

JP 2001-68371 A

  As the distance from the printed circuit board increases, the vibration due to vibration increases. Therefore, the vibration above the capacitor body is larger than the lower part due to vibration. In the above publication, since the support piece is in contact with the outer peripheral surface of the capacitor body below the capacitor body, vibration above the capacitor body cannot be sufficiently suppressed. Therefore, there is a problem that it is not possible to sufficiently suppress the force due to vibration acting on the lead terminal.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component whose vibration resistance is improved by reducing a force caused by vibration applied to a lead portion of an electrical element, and a semiconductor device including the same. Is to provide.

The electronic component of the present invention includes a substrate having a through hole, a main body, and a lead portion protruding from the lower surface of the main body to the substrate side, and the lead portion is inserted into the through hole of the substrate. An electrical element configured to be supported by soldering, a support portion supported by the substrate, and a pressing portion connected to the supporting portion, and the pressing portion contacts the upper surface of the main body portion. And a fixing portion configured to stably support the electrical element on the substrate by pressing the electrical element toward the substrate. The electrical element is melted when the tip of the lead portion is inserted into the through hole from the surface side of the substrate and protrudes from the surface on the opposite side of the substrate surface, sucking up the through hole from the opposite surface and reaching the surface When the solder is solidified, it is supported on the substrate by soldering. The support part protrudes outside the pressing part and then extends toward the substrate, and is disposed with a gap between the support part and the main body part. The pressing part is either a rectangular parallelepiped or a cylinder. The portion of the pressing portion that contacts the main body is a flat surface. The width of the portion of the support portion connected to the pressing portion is wider than that of the portion supported by the substrate.

  According to the electronic component of the present invention, the pressing portion connected to the support portion supported by the substrate includes the fixing portion configured to contact the upper surface of the main body portion and press the electrical element toward the substrate side. Therefore, the upper surface of the main body portion that is the farthest from the substrate is fixed. Since the upper surface of the main body portion that is the farthest from the substrate swings most greatly due to vibration, the effect of suppressing the vibration of the electrical element can be enhanced by fixing the upper surface of the main body portion. Therefore, the shearing force applied to the lead portion can be reduced by reducing the force caused by the vibration applied to the lead portion of the electrical element. Thereby, vibration resistance can be improved.

1 is a schematic perspective view of a semiconductor device according to a first embodiment of the present invention. 1 is a schematic plan view of a semiconductor device according to a first embodiment of the present invention. It is a schematic plan view which shows the P1 part of FIG. 1 and FIG. It is a schematic sectional drawing which follows the IV-IV line of FIG. It is a schematic perspective view of the fixing | fixed part in Embodiment 1 of this invention. It is a schematic perspective view of the fixing | fixed part of the modification in Embodiment 1 of this invention. 6 is a schematic plan view of a semiconductor device of Comparative Example 1. FIG. It is a schematic sectional drawing which follows the VIII-VIII line of FIG. It is a schematic sectional drawing of the electrical element of the comparative example 2, Comprising: The cross-sectional position respond | corresponds to the cross-sectional position of FIG. It is a schematic perspective view of the electronic component in Embodiment 2 of this invention. It is a schematic sectional drawing which follows the XI-XI line of FIG. It is a schematic perspective view of the electronic component of the modification in Embodiment 2 of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
First, the configuration of the semiconductor device according to the first embodiment of the present invention will be described.

  Referring to FIGS. 1 and 2, semiconductor device 100 of the present embodiment mainly includes electronic component 10 and semiconductor element 101. The electronic component 10 mainly has a substrate 1, an electrical element 2, and a fixing portion 3.

  Hereinafter, a GCT thyristor unit will be described as an example of the semiconductor device 100. Therefore, the semiconductor element 101 is a GCT thyristor. The substrate 1 is, for example, a printed circuit board, and the electrical element 2 is, for example, an electrolytic capacitor. Furthermore, this electrolytic capacitor is, for example, an aluminum electrolytic capacitor.

  In the semiconductor device 100, the semiconductor element 101 is electrically connected to the substrate 1, and the electronic component 10 is electrically connected to the semiconductor element 101 through the substrate 1. A semiconductor element 101, an electrical element 2, and a fixing portion 3 are attached to the surface 1 p of the substrate 1. The electrical element 2 that is an aluminum electrolytic capacitor is for electrically switching the semiconductor element 101 that is a GCT thyristor. A plurality of electrical elements 2 which are a plurality of aluminum electrolytic capacitors necessary for the switching operation are attached.

  With reference to FIGS. 3-5, the board | substrate 1 which is a printed circuit board has the through-hole 1a. The through hole 1a is provided so as to penetrate from the surface 1p to the opposite surface. This through-hole 1a is comprised by the through hole, for example.

  The electrical element 2 has a main body portion 21 and a lead portion 22. The main body 21 has, for example, an aluminum case and an element in which an anode aluminum foil impregnated with an electrolytic solution, electrolytic paper, and a cathode aluminum foil are laminated and wound. The upper surface 21b of the main body 21 is formed with a notch 7 for inducing rupture when the internal pressure rises and ruptures in an abnormal state.

  The lead portion 22 is provided so as to protrude from the lower surface 21 a of the main body portion 21 to the substrate 1 side. The lower surface 21 a of the main body 21 is a surface facing the surface 1 p of the substrate 1 of the main body 21. The lead portion 22 is inserted into the through hole 1 a of the substrate 1 from the surface 1 p of the substrate 1. The lead part 22 is inserted so that the tip of the lead part 22 protrudes from the surface opposite to the surface 1p of the substrate 1. The electrical element 2 is soldered with solder 6 in a state where the lead portion 22 is inserted into the through hole 1 a of the substrate 1. Thereby, the electrical element 2 is supported by the substrate 1.

  The fixed part 3 includes a support part 31 supported by the substrate 1 and a pressing part 32 connected to the support part 31. The fixing part 3 is for fixing the electric element 2 to the substrate 1. The tip of the support portion 31 is inserted into a through hole 1 a different from the through hole 1 a into which the lead portion 22 is inserted from the surface 1 p side of the substrate 1. The tip of the support portion 31 is soldered with solder 6. As a result, the support portion 31 is supported by the substrate 1. The method for supporting the support portion 31 on the substrate 1 is not limited to this. As another support method, for example, the support portion 31 may be bonded to the surface 1p of the substrate 1.

  The pressing portion 32 is configured to contact the upper surface 21 b of the main body portion 21 and press the electrical element 2 toward the substrate 1 side. The pressing portion 32 is configured to stably support the electrical element 2 on the substrate 1 by contacting the upper surface 21 b of the main body portion 21 and pressing the electrical element 2 toward the substrate 1. The pressing portion 32 may be in contact with a part of the upper surface 21b of the main body portion 21 or may be in contact with the entire upper surface 21b. In addition, the press part 32 may be formed in the rectangular parallelepiped, for example, and may be formed in the cylinder, for example.

  A portion 32p of the pressing portion 32 that contacts the main body portion 21 may be made of at least one of plastic and rubber. Since the portion 32p of the pressing portion 32 that contacts the main body portion 21 is made of plastic or rubber, the portion 32p of the pressing portion 32 that contacts the main body portion 21 has a lower hardness than the upper surface 21b of the main body portion 21 of the electrical element 2. It consists of

  The support part 31 may include a first support member 31a and a second support member 31b arranged so as to sandwich the side surface 21c of the main body part 21. In this case, the pressing portion 32 is disposed between the first support member 31a and the second support member 31b.

  Since the upper surface 21b of the main body portion 21 is pressed by the pressing portion 32 disposed between the first support member 31a and the second support member 31b disposed so as to sandwich the side surface 21c of the main body portion 21, electric The target element 2 is supported on the substrate 1 by both the first support member 31a and the second support member 31b.

  The lead part 22 may include two lead members 22a. In this case, the support portion 31 is fixed to the surface 1p of the substrate 1 at a position different from the virtual straight line VL extending in the direction in which the two lead members 22a are arranged on the surface 1p of the substrate 1.

  Compared with the direction in which the two lead members 22a are arranged on the surface 1p of the substrate 1, the other direction is more likely to swing due to the force of vibration. Therefore, the vibration resistance is improved by fixing the support portion 31 to the surface 1p of the substrate 1 in a direction in which it can easily be swung.

  The electrical element 2 is configured such that the dimension HM between the upper surface 21 b and the lower surface 21 a of the main body 21 in a state supported by the substrate 1 is larger than the length dimension LM of the lower surface 21 a of the main body 21. It may be. In this case, since the height of the upper surface 21b of the main body 21 is larger than the length of the lower surface 21a, the electrical element 2 is configured in a vertically long shape.

  Referring to FIG. 6, as shown in the modification of the present embodiment, opening 32 a may be formed in pressing portion 32 so as to expose upper surface 21 b of main body portion 21. In the modification shown in FIG. 6, since the opening 32a is formed in the pressing part 32 so as to expose the upper surface 21b of the main body part 21, the upper surface 21b of the main body part 21 is exposed upward. The opening 32a is formed in a circular shape when viewed from above. The shape of the opening 32a is not limited to this. For example, the opening 32a may be formed in a rectangular shape when viewed from above.

Next, the manufacturing method of the electronic component of this Embodiment is demonstrated.
Referring to FIGS. 3 and 4, the tip of lead portion 22 of electrical element 2 is inserted into through hole 1 a from the surface 1 p side of substrate 1. In addition, the tip of the support portion 31 of the fixing portion 3 is inserted into a through hole 1 a different from the through hole 1 a into which the lead portion 22 is inserted from the surface 1 p side of the substrate 1. At this time, after the solder 6 is solidified, the electrical element 2 and the support portion 31 are against the substrate 1 so that the pressing portion 32 contacts the upper surface 21b against the main body portion 21 and presses the electrical element 2 toward the substrate 1 side. Positioned.

  Lead ends of the lead portion 22 and the support portion 31 are soldered with the solder 6 in a state of being inserted so as to protrude from the surface opposite to the surface 1 p of the substrate 1. The lead part 22 and the support part 31 are soldered by being immersed in the molten solder 6 from the surface opposite to the surface 1p of the substrate 1. Thereby, the melted solder 6 is sucked up through the through-hole 1a, and the melted solder 6 reaches the surface 1p of the substrate 1. Soldering is completed by solidifying the molten solder 6 in this state. Thus, the electronic component 10 is manufactured by supporting the electrical element 2 and the fixing portion 3 on the substrate 1.

Next, the effect of this embodiment will be described in comparison with a comparative example.
Referring to FIG. 7, semiconductor device 100 of Comparative Example 1 is mainly different from the present embodiment in that it does not have fixing portion 3. Referring to FIG. 8, in electronic component 10 of Comparative Example 1, vibration may occur when semiconductor device 100 is transported and operated. In this case, a force in the direction of arrow A in the figure may be generated by this vibration. In this figure, the force in the direction of arrow A acts as a shearing force in the direction along the surface 1 p of the substrate 1 on the lead portion 22. The lead portion 22 may be broken by this shearing force.

  Further, as shown in FIG. 8, in Comparative Example 1, when the force in the direction of arrow A in the figure is generated by the vibration in the direction in which the two lead members 22a are arranged on the surface 1p of the substrate 1, the two lead members 22a are A force by vibration is applied in the direction of alignment.

  On the other hand, referring to FIG. 9, in Comparative Example 2, the direction in which the two lead members 22a are arranged on the surface 1p of the substrate 1 intersects the direction of the force generated by vibration (the direction of arrow A in the figure). Compared with the comparative example 1 in which the two lead members 22a are arranged side by side, it is easy to move in the direction of arrow A in the figure. For this reason, in the comparative example 2, compared with the comparative example 1, the intensity | strength with respect to the force by the vibration of the arrow A direction in a figure becomes low. Therefore, in Comparative Example 2, the lead portion 22 is more easily broken than in Comparative Example 1.

  On the other hand, in the electronic component 10 according to the present embodiment, the pressing portion 32 connected to the support portion 31 supported by the substrate 1 contacts the upper surface 21b of the main body portion 21 so that the electrical element 2 is placed on the substrate 1 side. The upper surface 21b of the main body 21 that is farthest from the substrate 1 is fixed. Since the upper surface 21b of the main body 21 that is the farthest from the substrate 1 is swung most greatly by vibration, the effect of suppressing the vibration of the electrical element 2 is enhanced by fixing the upper surface 21b of the main body 21. be able to.

  Further, by fixing the upper surface 21b of the main body 21, it is possible to suppress vertical vibrations in addition to the horizontal vibrations of the electrical element 2.

  Therefore, the shearing force applied to the lead part 22 can be reduced by reducing the force caused by the vibration applied to the lead part 22 of the electrical element 2. Thereby, vibration resistance can be improved.

  According to the electronic component 10 of the present embodiment, the support portion 31 includes the first support member 31a and the second support member 31b that are disposed so as to sandwich the side surface 21c of the main body portion 21, and includes the first support member 31b. The pressing portion 32 may be disposed between the support member 31a and the second support member 31b.

  The upper surface 21b of the main body portion 21 is pressed by the pressing portion 32 disposed between the first support member 31a and the second support member 31b disposed so as to sandwich the side surface 21c of the main body portion 21. Thereby, since the electrical element 2 is supported on the substrate 1 by both the first support member 31a and the second support member 31b, the electrical element 2 can be supported on the substrate 1 in a more stable state. it can.

  According to the electronic component 10 of the present embodiment, the pressing portion 32 may have the opening 32a so as to expose the upper surface 21b of the main body portion 21. Thereby, the upper surface 21b of the main-body part 21 is exposed upward. Therefore, it is possible to eliminate the possibility that the electrolytic capacitor rupture is hindered by the pressing portion 32 at the time of abnormality.

  According to the electronic component 10 of the present embodiment, the portion 32p of the pressing portion 32 that contacts the main body portion 21 may be made of at least one of plastic and rubber. Since the portion 32p of the pressing portion 32 that contacts the main body portion 21 is made of plastic or rubber, the portion 32p of the pressing portion 32 that contacts the main body portion 21 is made of a material having a lower hardness than the upper surface 21b of the main body portion 21 of the electrical element 2. Can be configured. Therefore, it is possible to prevent the upper surface 21b of the main body portion 21 from being damaged by the portion 32p of the pressing portion 32 that contacts the main body portion 21 coming into contact with the upper surface 21b of the main body portion 21.

  According to the electronic component 10 of the present embodiment, the lead portion 22 includes two lead members 22a, and the support portion 31 is an imaginary straight line VL extending in the direction in which the two lead members 22a are aligned on the surface 1p of the substrate 1. It may be fixed to the surface 1p of the substrate 1 at a position different from the above.

  In the direction in which the two lead members 22a are arranged on the surface 1p of the substrate 1, since the two lead members 22a are arranged side by side, the strength against the force caused by vibration is higher than in the other directions. On the other hand, compared to the direction in which the two lead members 22a are arranged on the surface 1p of the substrate 1, the other direction is more likely to swing due to the force of vibration.

  For this reason, the support part 31 is fixed to the surface 1p of the substrate 1 at a position different from the virtual straight line VL extending in the direction in which the two lead members 22a are arranged on the surface 1p of the substrate 1, thereby supporting the substrate 1 in a direction in which it can easily swing. The part 31 is fixed to improve vibration resistance. Thereby, since vibration resistance can be improved when the intensity | strength with respect to the force by a vibration is low, vibration resistance can be improved more effectively.

  According to the electronic component 10 of the present embodiment, the electrical element 2 is such that the dimension HM between the upper surface 21b and the lower surface 21a of the main body 21 in the state supported by the substrate 1 is equal to the lower surface 21a of the main body 21. You may be comprised so that it may become larger than the dimension LM of length.

  Since the electrical element 2 is configured in a vertically long shape, the upper surface 21b of the main body 21 that swings most greatly by vibration is disposed at a high position. For this reason, the effect which suppresses the vibration of the electrical element 2 can be further heightened by fixing the upper surface 21b of the main-body part 21. FIG.

  According to the electronic component 10 of the present embodiment, the electrical element 2 may be an electrolytic capacitor. Since the electrolytic capacitor has a large mass of the main body portion 21, the lead portion 22 is easily broken by the force of vibration. Therefore, the effect of suppressing the vibration of the electrical element 2 can be further enhanced by pressing the electrolytic capacitor toward the substrate 1 with the fixing portion 3.

  According to the electronic component 10 of the present embodiment, the electrical element 2 may be an aluminum electrolytic capacitor. Since the aluminum electrolytic capacitor has a large mass due to the component parts such as the anode and cathode aluminum foil of the main body portion 21, the lead portion 22 is easily broken by the force of vibration. Moreover, the mass of the main body part 21 tends to increase as the capacity of the aluminum electrolytic capacitor increases. For this reason, the effect which suppresses the vibration of the electric element 2 can be further heightened by pressing an electrolytic capacitor to the board | substrate 1 side with the fixing | fixed part 3. FIG.

  The semiconductor device 100 according to the present embodiment includes the semiconductor element 101 that is electrically connected to the substrate 1 and the electronic component 10 that is electrically connected to the semiconductor element 101 via the substrate 1. Yes. Since the electronic component 10 is provided, vibration resistance can be improved. In addition, since vibration resistance during transportation and operation can be improved, a highly reliable semiconductor device can be provided.

(Embodiment 2)
Next, the configuration of the electronic component 10 according to the second embodiment of the present invention will be described.

  Referring to FIGS. 10 and 11, electronic component 10 of the present embodiment includes substrate 1, electrical element 2, first holding part 51, second holding part 52, and binding tool 53. It has mainly. The substrate 1 which is a printed circuit board has a through hole 1a. The substrate 1 may have a first insertion hole 1f and a second insertion hole 1s. The through hole 1a, the first insertion hole 1f, and the second insertion hole 1s are constituted by through holes, for example.

  The electrical element 2 has a main body portion 21 and a lead portion 22. The lead portion 22 is provided so as to protrude from the lower surface 21 a of the main body portion 21 to the substrate 1 side. The electrical element 2 is soldered with solder 6 in a state where the lead portion 22 is inserted into the through hole 1 a of the substrate 1. Thereby, the electrical element 2 is supported by the substrate 1.

  The first holding part 51 and the second holding part 52 are supported by the substrate 1 so as to be in contact with the side surface 21 c of the main body part 21. The first holding part 51 and the second holding part 52 are for fixing the electrical element 2 to the substrate 1. The 1st holding | maintenance part 51 and the 2nd holding | maintenance part 52 may be comprised so that it may contact the side surface 21c of the main-body part 21, and may pinch | interpose the main-body part 21 mutually. The portions 51p and 52p of the first holding part 51 and the second holding part 52 that are in contact with the side surface 21c of the main body part 21 may each have an arc shape along the shape of the side surface 21c of the main body part 21. .

The first holding part 51 may include a first holding member 51a and a first holding lead part 51b protruding from the lower surface 51a1 of the _first holding member 51a toward the substrate 1 side. The second holding portion 52, a second holding member 52a, may be from the bottom surface 52a ₁ of the second holding member 52a and a second holding lead portions 52b protruding toward the substrate 1. In this case, the first holding member 51 a and the second holding member 52 a are in contact with the side surface 21 c of the main body 21.

  The first holding lead portion 51b is inserted from the surface 1p of the substrate 1 into the first insertion hole 1f. The second holding lead portion 52b is inserted from the surface 1p of the substrate 1 into the second insertion hole 1s. That is, the first holding member 51a and the second holding lead portion 51b and the second holding lead portion 52b are inserted into the first insertion hole 1f and the second insertion hole 1s, respectively. Each of the holding members 52 a is configured to contact the side surface 21 c of the main body 21.

  Each of the part 51p which contacts the main-body part 21 of the 1st holding | maintenance part 51 and the part 52p which contacts the main-body part 21 of the 2nd holding | maintenance part 52 may be comprised from at least any one of a plastic and rubber | gum. Since the part 51p of the first holding part 51 that contacts the main body part 21 and the part 52p of the second holding part 52 that contacts the main body part 21 are made of plastic or rubber, the main body part of the electrical element 2 is used. 21 is made of a material having a lower hardness than the upper surface 21b.

  The binding tool 53 binds the first holding part 51, the second holding part 52 and the main body part 21 so that the first holding part 51 and the second holding part 52 do not separate from the side surface 21 c of the main body part 21. Is to do. The binding tool 53 is attached to each of the first holding part 51 and the second holding part 52 so as to bind the upper end part 51u of the first holding part 51 and the upper end part 52u of the second holding part 52. Yes.

  The upper end portions 51u and 52u are portions at the tips of the first holding portion 51 and the second holding portion 52, respectively, and are portions located above the upper surface 21b of the main body portion 21. The binding tool 53 may be attached to each of the first holding part 51 and the second holding part 52 so as to include the upper end parts 51u and 52u. That is, the binding tool 53 may be attached together with the upper end portions 51u and 52u to a portion different from the upper end portions 51u and 52u, that is, a portion below the upper end portions 51u and 52u. In addition, as shown in FIG. 11, the binding tool 53 may be formed in U shape in sectional view.

The binding tool 53 may include an upper member 53 a located above the main body portion 21. In this case, the upper member 53 a may have an opening 53 a ₁ above the upper surface 21 b of the main body 21. Since the opening 53a ₁ is formed in the upper member 53a above the upper surface 21b of the main body 21, the upper surface 21b of the main body 21 is exposed upward. The opening 53a ₁ is formed in a rectangular shape when viewed from above. The shape of the opening 53a ₁ is not limited to this. For example, the opening 53a ₁ may be formed in a circular shape when viewed from above.

  A first groove portion 51 d may be provided on the outer peripheral surface of the first holding portion 51, and a second groove portion 52 d may be provided on the outer peripheral surface of the second holding portion 52. In this case, the binding tool 53 is configured to be fitted into each of the first groove 51d and the second groove 52d. For example, the binding tool 53 may have a protrusion configured to fit in the first groove 51d and the second groove 52d. In this case, the convex shape of the protrusion is configured to be fitted to the concave shapes of the first groove 51d and the second groove 52d.

  In addition, since the structure and method other than this of this Embodiment are the same as that of Embodiment 1 mentioned above, the same code | symbol is attached | subjected about the same element and the description is abbreviate | omitted.

Next, the manufacturing method of the electronic component of this Embodiment is demonstrated.
Referring to FIGS. 10 and 11, the tip of lead portion 22 of electrical element 2 is inserted into through hole 1 a from the surface 1 p side of substrate 1. The first holding lead portion 51b and the second holding lead portion 52b are inserted from the surface 1p of the substrate 1 into the first insertion hole 1f and the second insertion hole 1s.

At this time, after the solder 6 is solidified, the first holding part 51 and the second holding part 52 come into contact with the side surface 21c of the main body part 21 to support the electrical element 2 and The second holding part 52 and the electrical element 2 are positioned with respect to the substrate 1. In this state, the binding tool 53 is attached to the first holding part 51 and the second holding part 52 so as to bind the upper end part 51u of the first holding part 51 and the upper end part 52u of the second holding part 52.

  Lead ends of the lead part 22, the first holding lead part 51b, and the second holding lead part 52b are soldered with the solder 6 in a state of being inserted so as to protrude from the surface opposite to the surface 1p of the substrate 1. The The lead part 22, the first holding lead part 51b and the second holding lead part 52b are soldered by being immersed in the molten solder 6 from the surface opposite to the surface 1p of the substrate 1.

  Thereby, the molten solder 6 is sucked up through the through hole 1a, the first insertion hole 1f, and the second insertion hole 1s, and the molten solder 6 reaches the surface 1p of the substrate 1. Soldering is completed by solidifying the molten solder 6 in this state. Thus, the electronic component 10 is manufactured by supporting the electrical element 2, the first holding part 51, and the second holding part 52, which are bound by the binding tool 53, on the substrate 1.

  The binding tool 53 may be attached after the first holding part 51 and the second holding part 52 are soldered to the substrate 1.

  In addition, referring to FIG. 12, as shown in a modification of the present embodiment, a plurality of electrical elements 2 are supported by a pair of first holding portion 51 and second holding portion 52, and It may be bound by the binding tool 53.

  As shown in FIG. 12, for example, the plurality of electrical elements 2 are arranged in a line. The side surface 21 c of each main body 21 of the plurality of electrical elements 2 may be sandwiched between a pair of first holding part 51 and second holding part 52. The first holding member 51 a and the second holding member 52 a are in contact with the side surfaces 21 c of the main body portions 21 of the plurality of electrical elements 2.

  The first holding part 51 may have a plurality of first holding lead parts 51b. The plurality of first holding lead portions 51 b may be soldered to the substrate 1 with solder 6. The second holding part 52 may have a plurality of second holding lead parts 52b. The plurality of second holding lead portions 52 b may be soldered to the substrate 1 with solder 6.

  In this state, the pair of the first holding part 51 and the second holding part 52 may be bound together by one binding tool 53. The binding tool 53 may be configured to extend in a direction in which the plurality of electrical elements 2 are arranged in a row.

  Thereby, since the plurality of electrical elements 2 are respectively supported by the first holding part 51, the second holding part 52, and the binding tool 53, the electrical elements 2 are supported more stably on the substrate 1. The Moreover, since the 1st holding | maintenance part 51, the 2nd holding | maintenance part 52, and the binding tool 53 are each comprised by one member, since the number of members can be decreased, productivity can be improved.

  The method for supporting the plurality of electrical elements 2 is not limited to the above method. For example, each of the plurality of electrical elements 2 may be supported by a plurality of first holding portions 51 and a plurality of second holding portions 52, and these may be bound by one binding tool 53. Thereby, since the binding tool 53 is comprised by one member, since the number of members can be decreased, productivity can be improved.

  In addition, each of the plurality of electrical elements 2 is supported by one first holding part 51 and one second holding part 52, and the plurality of electrical elements 2 are arranged in accordance with the respective positions of the plurality of electrical elements 2. You may be restrained with the binding tool 53. Thereby, since the 1st holding | maintenance part 51 and the 2nd holding | maintenance part 52 are each comprised by one member, since the number of members can be decreased, productivity can be improved. Further, since the plurality of binding tools 53 can be arranged in accordance with the respective positions of the plurality of electrical elements 2, the binding tools 53 can be easily attached.

Next, the function and effect of this embodiment will be described.
According to the electronic component 10 of the present embodiment, the first and second holding portions supported by the substrate 1 so as to contact the side surface 21c of the main body portion 21, and the first holding portion 51 and the second holding portion. A binding tool 53 attached to each of the first holding part 51 and the second holding part 52 so as to bind the upper end parts 51u and 52u of the holding part 52 is provided.

  The upper end portions 51u and 52u of the first holding portion 51 and the second holding portion 52 that are separated from the substrate 1 are largely swung by vibration. Since the upper end portions 51u and 52u are bound by the binding tool 53, it is possible to prevent the first holding portion 51 and the second holding portion 52 from being pushed apart from each other by being largely swung. For this reason, the contact between the electrical element 2 and the first holding part 51 and the second holding part 52 can be maintained.

  Therefore, the shearing force applied to the lead part 22 can be reduced by reducing the force caused by the vibration applied to the lead part 22 of the electrical element 2. Thereby, vibration resistance can be improved.

According to the electronic component 10 of the present embodiment, the first holding unit 51 includes the first holding member 51a and the first holding member protruding from the lower surface 51a1 of the _first holding member 51a toward the substrate 1 side. and a lead portion 51b, the second holding portion 52, a second holding member 52a, and a second holding lead portions 52b projecting from the lower surface 52a ₁ of the second holding member 52a toward the substrate 1 You may have. The substrate 1 has first and second insertion holes 1f and 1s, and the first and second holding lead portions 51b and 52b are inserted into the first and second insertion holes 1f and 1s, respectively. Thus, each of the first and second holding members 51 a and 52 a may be configured to contact the side surface 21 c of the main body 21.

  As a result, each of the first holding lead portion 51b and the second holding lead portion 52b is inserted into the first insertion hole 1f and the second insertion hole 1s, which are through holes, so that the electrical element 2 is placed on the substrate. 1 can be supported. Therefore, since the first holding part 51 and the second holding part 52 can be fixed to the through holes, normal soldering or the like can be used, so that productivity can be improved.

According to the electronic component 10 of this embodiment, closure 53 includes an upper member 53a located above the main body portion 21, the upper member 53a has an opening 53a ₁ above the upper surface 21b of the main body portion 21 It may be. Thereby, the upper surface 21b of the main-body part 21 is exposed upward. Therefore, it is possible to eliminate the possibility that the rupturing of the electrolytic capacitor is hindered by the tying member 53 at the time of abnormality.

  According to the electronic component 10 of the present embodiment, even if the portions 51p and 52p of the first and second holding portions 51 and 52 that are in contact with the main body portion 21 are made of at least one of plastic and rubber. Good. As a result, the upper surfaces 21b of the main body 21 are damaged by the portions 51p, 52p of the first and second holding portions 51, 52 coming into contact with the main body 21 contacting the upper surface 21b of the main body 21. Can be prevented.

  According to the electronic component 10 of the present embodiment, the lead portion 22 includes two lead members 22a, and each of the first and second holding portions 51 and 52 has two lead members on the surface 1p of the substrate 1. It may be fixed to the surface 1p of the substrate 1 at a position different from the virtual straight line VL extending in the direction in which 22a is arranged. For this reason, the 1st and 2nd holding | maintenance parts 51 and 52 can be fixed to the surface 1p of the board | substrate 1 in the direction which is easy to rock | fluctuate. Thereby, since vibration resistance can be improved when the intensity | strength with respect to the force by a vibration is low, vibration resistance can be improved more effectively.

  According to the electronic component 10 of the present embodiment, the first and second holding portions 51 and 52 include the first and second groove portions 51d and 52d provided on the outer peripheral surface, respectively. You may be comprised so that it may fit in each of the 1st and 2nd groove parts 51d and 52d. Thereby, since the binding tool 53 is fitted in the first and second groove portions 51d and 52d, it is possible to suppress the dropping of the binding tool 53.

  The electric element is not limited to the above electrolytic capacitor, and may be a diode, a transistor, or the like, for example.

The above embodiments can be combined in a timely manner.
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 substrate, 1a through hole, 1p surface, 1f first insertion hole, 1s second insertion hole, 2
Electrical element, 3 fixing part, 6 solder, 7 notch, 10 electronic component, 21 body part, 21a bottom surface of body part, 21b top surface of body part, 21c side surface of body part, 22 lead part, 22a lead member, 31 Part, 31a 1st support member, 31b 2nd support member, 32 press part, 32a opening, 32p The part which contacts the main-body part of a press part, 51 1st holding part, 51a 1st holding member, 51a ₁ The lower surface of the first holding member, 51b, the first holding lead portion, 51c, the outer peripheral surface of the first holding portion, 51p, the portion in contact with the main body portion of the first holding portion, 51u, the upper end portion of the first holding portion, 52 second holding portion, 52a second holding member, 52a ₁ lower surface of second holding member, 52b second holding lead portion, 52c outer peripheral surface of second holding portion, 52p main body of first holding portion Part in contact with the part, 52u second The upper end of the holding portion, 53 closure, 53a upper member, the opening of the 53a ₁ upper member, 100 a semiconductor device, 101 a semiconductor element, VL imaginary straight line.

Claims (9)

A substrate having a through hole;
A main body portion and a lead portion protruding from the lower surface of the main body portion toward the substrate side, and the lead portion is supported by soldering on the substrate in a state of being inserted into the through hole of the substrate. An electrical element configured to:
A supporting portion supported by the substrate; and a pressing portion connected to the supporting portion; and the pressing portion contacts an upper surface of the main body portion to press the electrical element toward the substrate side. And a fixing portion configured to stably support the electrical element on the substrate,
The electrical element has the tip of the lead portion inserted into the through-hole from the surface side of the substrate and protrudes from the surface on the opposite side of the surface of the substrate. Is supported by soldering to the substrate by solidifying the molten solder that has reached the surface and sucked up,
The support portion protrudes outside the pressing portion and then extends toward the substrate, and is disposed with a gap between the main body portion ,
The pressing portion is either a rectangular parallelepiped or a cylinder,
The portion of the pressing portion that contacts the main body is a flat surface,
The support part is an electronic component in which a part connected to the pressing part is wider than a part supported by the substrate . The support part includes a first support member and a second support member arranged so as to sandwich a side surface of the main body part,
The electronic component according to claim 1, wherein the pressing portion is disposed between the first support member and the second support member.   The electronic component according to claim 1, wherein an opening is formed in the pressing portion so as to expose the upper surface of the main body portion.   The electronic component according to claim 1, wherein a portion of the pressing portion that comes into contact with the main body portion is made of at least one of plastic and rubber. The lead portion includes two lead members,
The said support part is fixed to the said surface of the said board | substrate in the position different from the virtual straight line extended in the direction in which the said 2 lead member is located in the surface of the said board | substrate. Electronic components.   The electrical element is configured such that a dimension between the upper surface and the lower surface of the main body portion in a state supported by the substrate is larger than a length dimension of the lower surface of the main body portion. The electronic component according to claim 1.   The electronic component according to claim 1, wherein the electrical element is an electrolytic capacitor.   The electronic component according to claim 7, wherein the electrical element is an aluminum electrolytic capacitor. A semiconductor element electrically connected to the substrate;
The semiconductor device provided with the electronic component in any one of Claims 1-8 electrically connected with the said semiconductor element through the said board | substrate.

Images