JP5907754B2 - Piezoelectric device - Google Patents

Description

  The present invention relates to a piezoelectric device used in electronic equipment and the like.

  Electronic devices such as cellular phones are equipped with a signal source such as a reference signal source or a clock signal source. As such a signal source, a piezoelectric device having a piezoelectric vibration element and an IC element is known.

  The piezoelectric device needs to output a signal corresponding to an application required in an electronic device. The difference in output signal includes a difference in frequency or a difference in waveform. The output signals having different frequencies are, for example, a source frequency signal and a frequency-divided signal, and the output signals having different waveforms are, for example, a sine wave and a rectangular wave.

JP 2008-289139 A

  Conventionally, in order to realize a piezoelectric device that outputs different signals, it is necessary to prepare a dedicated IC element according to the output signal, and it has been difficult to reduce production costs.

A piezoelectric device according to one aspect of the present invention includes an element mounting member having an output external terminal, an IC element mounted on the element mounting member by a bump, and a piezoelectric vibration element mounted on the element mounting member. The IC element has a first output electrode from which a first signal is output and a second output electrode from which a second signal different from the first signal is output. The piezoelectric vibration element is electrically connected to the IC element. By selectively providing a bump on either the first output electrode or the second output electrode, either the first output electrode or the second output electrode is electrically connected to the output external terminal. The element mounting member has a common output pad for mounting an IC element electrically connected to the output external terminal, and any one of the first output electrode and the second output electrode is formed by the bump. Are electrically connected to the common output pad .

  In the piezoelectric device according to one aspect of the present invention, the bump is selectively provided on either the first output electrode or the second output electrode, and either the first output electrode or the second output electrode is provided. Is electrically connected to the output external terminal so that the piezoelectric device can output different signals depending on the selection of the electrical connection relationship between the plurality of output electrodes of the IC element and the output external terminal. Thus, there is no need to prepare a dedicated IC element, and the production cost is improved.

It is a longitudinal cross-sectional view which shows the piezoelectric device in the 1st Embodiment of this invention. It is a bottom view which shows the state which removed the IC element in the piezoelectric device shown by FIG. It is a bottom view which shows the IC element in the piezoelectric device shown by FIG. It is a bottom view which shows one example of the electrical connection of the IC element in the piezoelectric device shown by FIG. It is a bottom view which shows the other example of the electrical connection of the IC element in the piezoelectric device shown by FIG. It is a bottom view which shows the state which removed the IC element in the piezoelectric device in the 2nd Embodiment of this invention. It is a bottom view which shows one example of the electrical connection of the IC element in the 2nd Embodiment of this invention. It is a bottom view which shows the other example of the electrical connection of the IC element in the 2nd Embodiment of this invention.

  Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
As shown in FIG. 1, the piezoelectric device 100 according to the first embodiment of the present invention is mounted on the element mounting member 110, the IC element 120 mounted on the element mounting member 110, and the element mounting member 110. And a piezoelectric vibration element 130 electrically connected to the IC element 120. FIG. 1 is a longitudinal sectional view taken along line AA of the piezoelectric device 100 shown in FIG.

  The element mounting member 110 includes an insulating base including a substrate portion 110a, a first frame portion 110b provided on the lower surface of the substrate portion 110a, and a second frame portion 110c provided on the upper surface of the substrate portion 110a, and a substrate portion. A plurality of IC element mounting pads 113 provided on the lower surface of 110a and a plurality of external terminals 116 provided on the lower surface of the first frame portion 110b are included. Here, the recessed space on the lower surface of the element mounting member 110 is defined as a first recessed space K1, and the recessed space on the upper surface is defined as a second recessed space K2.

  In FIG. 2, the plurality of IC element mounting pads 113 are indicated as 113 a to 113 f by adding alphabet letters a to f after the reference numeral 113. The plurality of external terminals 116 are indicated as 116a to 116d by adding alphabetic letters a to d after the reference numeral 116. The plurality of external terminals 116a to 116d are, for example, an output external terminal 116a, a ground external terminal 116b, a control external terminal 116c, and a power supply external terminal 116d.

  The substrate part 110a, the first frame part 110b, and the second frame part 110c are made of a ceramic material such as alumina ceramics or glass-ceramics. In addition, the board | substrate part 110a is a rectangular flat plate shape as FIG. 1 and FIG. 2 show, for example. The first frame portion 110b is provided along the edge portion of the lower surface of the substrate portion 110a. The second frame part 110c is provided along the edge part of the upper surface of the substrate part 110a.

  The plurality of IC element mounting pads 113 are provided on the bottom surface of the first recess space K1 and include a common output pad 113a. Here, the common output pad refers to an output pad that is commonly arranged corresponding to a plurality of electrodes of the IC element 120 described later. The common output pad 113a is a pad to which a signal output from the IC element 120 is applied, and is electrically connected to the output external terminal 116a.

  The plurality of IC element mounting pads 113 also include pads 113b to 113f. Here, an example of the plurality of IC element mounting pads 113b to 113f will be described. The plurality of IC element mounting pads 113b to 113f are, for example, a ground pad 113b, a first input pad 113c and a second input pad 113d, a control pad 113e, and a power supply pad 113f. The ground pad 113b is electrically connected to the ground external terminal 116b, and a ground voltage is applied. The first and second input pads 113 b and 113 d are electrically connected to the piezoelectric vibration element 130. The control pad 113e is electrically connected to the control external terminal 116c, and a signal (that is, a control signal) for controlling the output state of the IC element 120 is applied. Here, the control signal is a signal for selectively determining a signal output from the IC element 120 when a plurality of different types of signals can be output from the IC element 120. The power supply pad 113f is electrically connected to the power supply external terminal 116d and is applied with a power supply voltage.

The IC element 120 is provided in the first recess space K1 and is electrically connected to the plurality of IC element mounting pads 113 of the element mounting member 110 by bumps 122 such as solder. As shown in FIG. 3, the IC element 120 has a plurality of electrodes 121. In FIG. 3, the plurality of electrodes 121 are indicated by broken lines in a state where a part of the IC element 120 is transmitted. In FIG. 3, the plurality of electrodes 121 are indicated as 121 a to 121 f by adding alphabets a to f after the reference numeral 121. The electrode 121a further by reference numeral behind the alphabet a, shown as electrodes 121a ₁ and 121a _2.

Here, an example of the plurality of electrodes 121a to 121f will be described. The plurality of electrodes 121 are, for example, a first output electrode 121a ₁ , a second output electrode 121a ₂ , a ground electrode 121b, a first input electrode 121c, a second input electrode 121d, a control electrode 121e, and a power supply electrode 121f. is there.

From the first output electrode 121a ₁ and the second output electrodes 121a _2, different types of signals can be output. The output state of signals from the first output electrode 121a ₁ and the second output electrode 121a ₂ is determined by a control signal input to the control electrode 121e. The different types of signals are, for example, signals having different frequencies or signals having different waveforms. The output signals having different frequencies are, for example, a source frequency signal and a frequency-divided signal, and the output signals having different waveforms are, for example, a sine wave and a rectangular wave.

One of the first output electrode 121 a ₁ and the second output electrode 121 a ₂ is selectively electrically connected to the common output pad 113 a by the bump 122. That is, the bump 122 is provided on either one of the first output electrode 121a ₁ and the second output electrodes 121a _2, one either of the first output electrode 121a ₁ and the second output electrode 121a ₂ is common output Bonded to the pad 113a.

The ground electrode 121b is electrically connected to the ground pad 113b and is applied with a ground voltage. The first input electrode 121c and the second input electrode 121d are electrically connected to the piezoelectric vibration element 130 via the first input pad 113c and the second input pad 113d. The control electrode 121e is electrically connected to the control pad 113e, the signal for controlling the output state of the first output electrode 121a ₁ and a second signal from the output electrode 121a ₂ are inputted. The power supply electrode 121f is electrically connected to the power supply pad 113f and applied with a power supply voltage.

  The piezoelectric vibration element 130 is provided in the second recess space K2, and the first input electrode 121c and the second input electrode 121d of the IC element 120 are provided via the first and second input pads 113c and 113d. Is electrically connected. The piezoelectric vibration element 130 includes a piezoelectric element plate cut along a predetermined crystal axis, and a connection electrode and an excitation electrode formed on the piezoelectric element plate. The piezoelectric vibration element 130 causes thickness-shear vibration at a predetermined frequency when an external variable voltage is applied to the piezoelectric element plate via the connection electrode and the excitation electrode. As the piezoelectric element plate, for example, AT-cut quartz is used. The second recessed space K2 of the element mounting member 110 in which the piezoelectric vibration element 130 is accommodated is hermetically sealed by the lid member 140.

  Here, an example of electrical connection between the IC element 120 and the element mounting member 110 in the piezoelectric device 100 of the present embodiment will be described with reference to FIGS. 4 and 5.

First, as shown in FIG. 4, the common first output electrode 121a ₁ and the second of the first output electrode 121a ₁ is selectively element mounting member 110 of the output electrode 121a ₂ of the IC element 120 An example in which the output pad 113a is electrically connected will be described. Among the first output electrode 121a ₁ and the second output electrode 121a ₂ , the first output electrode 121a ₁ is provided with a bump 122, and among the first output electrode 121a ₁ and the second output electrode 121a ₂ , The first output electrode 121a ₁ is joined to the common output pad 113a.

In the electrical connection example shown in FIG. 4 is transmitted to the first output signal output from the electrode 121a ₁ via a common output pad 113a output external terminal 116a. In the electrical connection example shown in FIG. 4, a signal output from the first output electrode 121a ₁ is applied to the output external terminal 116a via a common output pad 113a.

If different types of signals output from the first output electrode 121a ₁ and the second output electrode 121a ₂ are signals having different frequencies, for example, the source output frequency signal or the frequency division is output from the first output electrode 121a _1. A signal is output and applied to the output external terminal 116a. If different types of signals output from the first output electrode 121a ₁ and the second output electrode 121a ₂ have different waveforms, for example, a sine wave or a rectangular wave is output from the first output electrode 121a _1. And applied to the output external terminal 116a.

Note that in the electrical connection example shown in FIG. 4, a control signal input to the control electrode 121e of the IC element 120, the second from the output electrode 121a ₂ by outputting a signal from the first output electrode 121a ₁ Does not output a signal.

Next, as shown in Figure 5, the first output electrode 121a ₁ and the second of the second output electrode 121a ₂ is selectively element mounting member 110 of the output electrode 121a ₂ of the IC element 120 An example of being electrically connected to the common output pad 113a will be described. Among the first output electrode 121a ₁ and the second output electrode 121a ₂ , the second output electrode 121a ₂ is provided with a bump 122, and among the first output electrode 121a ₁ and the second output electrode 121a ₂ , The second output electrode 121a ₂ is joined to the common output pad 113a.

In the electrical connection example shown in Figure 5, the signal output from the second output electrode 121a ₂ is transmitted to the external output terminal 116a via a common output pad 113a. In electrical connection example shown in FIG. 5, the signal output from the second output electrode 121a ₂ is applied to the output external terminal 116a via a common output pad 113a.

If the first output electrode 121a ₁ and a second different signal is, for example, a frequency different from the signal output from the output electrode 121a _2, from the second output electrode 121a ₂ example source oscillation frequency signal or divider A signal is output and applied to the output external terminal 116a. If different types of signals output from the first output electrode 121a ₁ and the second output electrode 121a ₂ have different waveforms, for example, a sine wave or a rectangular wave is output from the second output electrode 121a _2. And applied to the output external terminal 116a.

Note that in the electrical connection example shown in FIG. 5, the control signal input to the control electrode 121e of the IC element 120, from the first output electrode 121a ₁ outputs a signal from the second output electrode 121a ₂ Does not output a signal.

As described above, in the piezoelectric device 100 of this embodiment, IC device 120 has selectively bump 122 is provided on either the first output electrode 121a ₁ and the second output electrodes 121a _2, first by any of the output electrode 121a ₁ and the second output electrode 121a ₂ are electrically connected to the output external terminal 116a, the piezoelectric device 100 includes a plurality of outputs of the IC element 120 electrodes 121a ₁ and 121a ₂ By selecting the electrical connection relationship between the output external terminal 116a and the output external terminal 116a, different signals can be output, so that it is not necessary to prepare a dedicated IC element, and the production cost is improved.

Further, in the piezoelectric device 100 of this embodiment, the pads 113 of either the first output electrode 121a ₁ and the second output electrode 121a ₂ are electrically connected to the first output electrode 121a ₁ and a second by a common output pad 113a, which is commonly arranged in correspondence to the output electrodes 121a ₂ of, for may be realized by electrical paths one wiring from the common output pad 113a to the output external terminal 116a, the embodiment The piezoelectric device 100 according to the embodiment is improved with respect to the degree of freedom in wiring design, and for example, can be reduced in height or size.

  Further, since the piezoelectric device 100 according to the present embodiment has the above-described configuration, a via conductor is provided so as to extend from the output pad 113 (that is, the common output pad 113a) to the inside of the substrate portion 110a. In addition, since it can be constituted by one via conductor, the strength of the element mounting member 110 is improved.

  In the piezoelectric device 100 of the present embodiment, for example, a film having low wettability with the bump 122 such as an alumina film is used in order to reduce the unnecessary spread of the bump 122 when the bump 122 made of solder or the like is reflowed. The common output pad 113a may be provided so as to cross the common output pad 113a at the center in the longitudinal direction.

(Second Embodiment)
A piezoelectric device 100 according to a second embodiment of the present invention will be described with reference to FIGS. The piezoelectric device 100 of the second embodiment differs from the piezoelectric device 100 of the first embodiment shown in FIG. 2 and the like in the first output electrode 121a ₁ or the second output electrode 121a of the IC element 120. ₂ IC element mounting pad 113 to be electrically connected, in the second embodiment whereas were common output pad 113a in the first embodiment the first output electrode 121a ₁ and a second The first output pad 113a ₁ and the second output pad 113a ₂ corresponding to the output electrode 121a ₂ of the first output pad 121a ₂ . That is, the piezoelectric device 100 of the second embodiment, instead of the common output pad 113a in the first embodiment, has a first output pad 113a ₁ and a second output pad 113a _2. Other configurations are the same as those of the piezoelectric device 100 according to the first embodiment. Incidentally, it says below, the first output pad 113a ₁ and a second output pad 113a _2, also a first output pad 113a ₁ and a second output pad 113a _2.

The first output pad 113a ₁ and the second output pad 113a ₂ are provided corresponding to the first output electrode 121a ₁ and the second output electrode 121a ₂ of the IC element 120, and the output external terminal 116a. Is electrically connected.

  Here, an example of electrical connection between the IC element 120 and the element mounting member 110 in the piezoelectric device of the present embodiment will be described with reference to FIGS. 7 and 8.

First, as shown in FIG. 7, the first output electrode 121 a ₁ of the first output electrode 121 a ₁ and the second output electrode 121 a ₂ of the IC element 120 is selectively connected to the _first output electrode 121 a ₁ of the element mounting member 110. An example in which _one output pad 113a ₁ is electrically connected will be described. Among the first output electrode 121a ₁ and the second output electrode 121a ₂ , the first output electrode 121a ₁ is provided with a bump 122, and among the first output electrode 121a ₁ and the second output electrode 121a ₂ , The first output electrode 121a ₁ is joined to the _first output pad 113a ₁ .

In the electrical connection example shown in FIG. 7, the signal output from the first output electrode 121a ₁ is transmitted to the external output terminal 116a via a first output pad 113a _1. In the electrical connection example shown in FIG. 7, a signal output from the first output electrode 121a ₁ is applied to the output external terminal 116a via the _first output pad 113a ₁ .

If different types of signals output from the first output electrode 121a ₁ and the second output electrode 121a ₂ are signals having different frequencies, for example, the source output frequency signal or the frequency division is output from the first output electrode 121a _1. A signal is output and applied to the output external terminal 116a. If different types of signals output from the first output electrode 121a ₁ and the second output electrode 121a ₂ have different waveforms, for example, a sine wave or a rectangular wave is output from the first output electrode 121a _1. And applied to the output external terminal 116a.

Note that in the electrical connection example shown in FIG. 7, a control signal input to the control electrode 121e of the IC element 120, the second from the output electrode 121a ₂ by outputting a signal from the first output electrode 121a ₁ Does not output a signal.

Next, as shown in Figure 8, the first output electrode 121a ₁ and the second of the second output electrode 121a ₂ is selectively element mounting member 110 of the output electrode 121a ₂ of the IC element 120 An example in which the second output pad 113a ₂ is electrically connected will be described. Among the first output electrode 121a ₁ and the second output electrode 121a ₂ , the second output electrode 121a ₂ is provided with a bump 122, and among the first output electrode 121a ₁ and the second output electrode 121a ₂ , The second output electrode 121a ₂ is joined to the _second output pad 113a ₂ .

In electrical connection example shown in FIG. 8, the signal output from the second output electrode 121a ₂ is transmitted to the external output terminal 116a via a second output pad 113a _2. In the example of electrical connection shown in FIG. 8, the signal output from the second output electrode 121a ₂ is applied to the output external terminal 116a via the _second output pad 113a ₂ .

If the first output electrode 121a ₁ and a second different signal is, for example, a frequency different from the signal output from the output electrode 121a _2, from the second output electrode 121a ₂ example source oscillation frequency signal or divider A signal is output and applied to the output external terminal 116a. If different types of signals output from the first output electrode 121a ₁ and the second output electrode 121a ₂ have different waveforms, for example, a sine wave or a rectangular wave is output from the second output electrode 121a _2. And applied to the output external terminal 116a.

Note that in the electrical connection example shown in FIG. 8, control signal input to the control electrode 121e of the IC element 120, from the first output electrode 121a ₁ outputs a second signal from the output electrode 121a ₂ Does not output a signal.

In the piezoelectric device 100 of this embodiment, the first output electrode 121a ₁ and a second selectively bumps 122 to either the output electrodes 121a ₂ of the IC element 120 is provided with a first output electrode 121a ₁ One of the first output electrode 121a ₂ and the second output electrode 121a ₂ is electrically connected to the output external terminal 116a via either the first output pad 113a ₁ or the second output pad 113a _2. 100, will be able to output different signals by selective electrical connection of a plurality of output electrodes 121a ₁ and 121a ₂ and the output external terminal 116a of the IC element 120 is improved with respect to production costs .

In addition, the piezoelectric device 100 of the present embodiment has a first output pad 113a ₁ and a second output pad 113a ₂ that are individually provided in place of the common output pad 113a in the first embodiment. Accordingly, when the bump 122 is made of for example solder, common to the output pad 113a, as compared to the structure in which the bump 122 is provided, at the first output pad 113a ₁ or the second output pad 113a ₂ of the first embodiment The spread of the bumps 122 is reduced, and the mounting reliability of the IC element 120 is improved. More specifically, in the piezoelectric device 100 according to the first embodiment, the bump 122 may spread out in the extending direction of the common output pad 113a when the bump 122 is reflowed. the range that could bump 122 spreads during reflow of the bump 122 is limited to the first output pad 113a ₁ or second range of output pads 113a _2.

  In the above-described embodiment, various changes and improvements can be made without departing from the scope of the present invention. For example, in the above-described embodiment, the AT-cut piezoelectric vibration element 130 is shown as an element mounted in the second recessed space K2 of the piezoelectric device 100. However, the present invention is not limited to this, and for example, a tuning fork type vibration element or an elastic surface is used. A wave element may be used.

DESCRIPTION OF SYMBOLS 100 ... Piezoelectric device 110 ... Element mounting member 110a ... Substrate part 110b ... 1st frame part 110c ... 2nd frame part 113 ... IC element mounting pad 116 ... External Terminal 120 ... IC element 121 ... Electrode 122 ... Bump 130 ... Piezoelectric vibration element 140 ... Cover member

Claims (1)

An element mounting member having an output external terminal;
A first output electrode that is mounted on the element mounting member by a bump and can output a first signal, and a second output electrode that can output a second signal different from the first signal. An IC element,
A piezoelectric vibration element mounted on the element mounting member and electrically connected to the IC element;
Since the bump is selectively provided on either the first output electrode or the second output electrode, either the first output electrode or the second output electrode can be connected to the outside of the output. Is electrically connected to the terminal ,
The element mounting member has a common output pad for mounting the IC element electrically connected to the output external terminal, and any one of the first output electrode and the second output electrode is formed by the bump. Is electrically connected to the common output pad .

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