JP5918316B2 - 揮発性ジヒドロピラジニル及びジヒドロピラジン金属錯体 - Google Patents
揮発性ジヒドロピラジニル及びジヒドロピラジン金属錯体 Download PDFInfo
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- JP5918316B2 JP5918316B2 JP2014151758A JP2014151758A JP5918316B2 JP 5918316 B2 JP5918316 B2 JP 5918316B2 JP 2014151758 A JP2014151758 A JP 2014151758A JP 2014151758 A JP2014151758 A JP 2014151758A JP 5918316 B2 JP5918316 B2 JP 5918316B2
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- branched
- independently
- cyclic alkyl
- linear
- alkyl group
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- 229910052751 metal Inorganic materials 0.000 title claims description 120
- 239000002184 metal Substances 0.000 title claims description 120
- 125000005051 dihydropyrazinyl group Chemical group N1(CC=NC=C1)* 0.000 title description 40
- QYMGRIFMUQCAJW-UHFFFAOYSA-N 1,2-dihydropyrazine Chemical compound C1NC=CN=C1 QYMGRIFMUQCAJW-UHFFFAOYSA-N 0.000 title description 26
- 238000000034 method Methods 0.000 claims description 73
- -1 pentamethylpentadienyl Chemical group 0.000 claims description 61
- 238000000231 atomic layer deposition Methods 0.000 claims description 49
- 239000000203 mixture Substances 0.000 claims description 45
- 229910052760 oxygen Inorganic materials 0.000 claims description 42
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 41
- 239000001301 oxygen Substances 0.000 claims description 41
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 38
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 38
- 230000008569 process Effects 0.000 claims description 38
- 229910052707 ruthenium Inorganic materials 0.000 claims description 36
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 30
- 239000003446 ligand Substances 0.000 claims description 29
- 238000010926 purge Methods 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 29
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 28
- 239000007789 gas Substances 0.000 claims description 19
- 150000001450 anions Chemical class 0.000 claims description 18
- 229910017052 cobalt Inorganic materials 0.000 claims description 17
- 239000010941 cobalt Substances 0.000 claims description 17
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 17
- 239000003638 chemical reducing agent Substances 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 15
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 14
- 125000002097 pentamethylcyclopentadienyl group Chemical group 0.000 claims description 14
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- 230000007935 neutral effect Effects 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 11
- 125000004122 cyclic group Chemical group 0.000 claims description 11
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- 229910044991 metal oxide Inorganic materials 0.000 claims description 9
- 150000004706 metal oxides Chemical class 0.000 claims description 9
- 125000000168 pyrrolyl group Chemical group 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 125000002883 imidazolyl group Chemical group 0.000 claims description 8
- 229910021529 ammonia Inorganic materials 0.000 claims description 7
- 150000001555 benzenes Chemical class 0.000 claims description 5
- 150000002431 hydrogen Chemical group 0.000 claims description 5
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 150000004696 coordination complex Chemical class 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 150000001343 alkyl silanes Chemical class 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 12
- 239000010931 gold Substances 0.000 claims 12
- 229910052737 gold Inorganic materials 0.000 claims 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- 239000002243 precursor Substances 0.000 description 80
- 239000010408 film Substances 0.000 description 66
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 46
- 238000005229 chemical vapour deposition Methods 0.000 description 34
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 23
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 20
- 238000000151 deposition Methods 0.000 description 19
- 239000003153 chemical reaction reagent Substances 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000002904 solvent Substances 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000007788 liquid Substances 0.000 description 12
- 230000008021 deposition Effects 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 229910052786 argon Inorganic materials 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 150000005838 radical anions Chemical class 0.000 description 9
- 229930195733 hydrocarbon Natural products 0.000 description 8
- 150000002430 hydrocarbons Chemical class 0.000 description 8
- 239000004215 Carbon black (E152) Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000005137 deposition process Methods 0.000 description 6
- 238000006722 reduction reaction Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 5
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 5
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229910052700 potassium Inorganic materials 0.000 description 5
- 239000011591 potassium Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 238000002411 thermogravimetry Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 229910000085 borane Inorganic materials 0.000 description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 4
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 4
- 238000002424 x-ray crystallography Methods 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 230000005587 bubbling Effects 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 150000001868 cobalt Chemical class 0.000 description 3
- 230000005595 deprotonation Effects 0.000 description 3
- 238000010537 deprotonation reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 230000006911 nucleation Effects 0.000 description 3
- 238000010899 nucleation Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- VCJPCEVERINRSG-UHFFFAOYSA-N 1,2,4-trimethylcyclohexane Chemical compound CC1CCC(C)C(C)C1 VCJPCEVERINRSG-UHFFFAOYSA-N 0.000 description 2
- KVFQMAZOBTXCAZ-UHFFFAOYSA-N 3,4-Hexanedione Chemical compound CCC(=O)C(=O)CC KVFQMAZOBTXCAZ-UHFFFAOYSA-N 0.000 description 2
- 0 CC1C(CC2CC2)C2C(C3*C3)C2C1 Chemical compound CC1C(CC2CC2)C2C(C3*C3)C2C1 0.000 description 2
- WHPRBDHYPKOTET-UHFFFAOYSA-N CCC1=NCC(C)(C)N=C1CC Chemical compound CCC1=NCC(C)(C)N=C1CC WHPRBDHYPKOTET-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- 229910000086 alane Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 238000011534 incubation Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
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- 230000001737 promoting effect Effects 0.000 description 2
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- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- 239000006200 vaporizer Substances 0.000 description 2
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- UNEATYXSUBPPKP-UHFFFAOYSA-N 1,3-Diisopropylbenzene Chemical compound CC(C)C1=CC=CC(C(C)C)=C1 UNEATYXSUBPPKP-UHFFFAOYSA-N 0.000 description 1
- RLXAQIXESOWNGY-UHFFFAOYSA-N 1-methyl-4-propan-2-ylbenzene Chemical compound CC(C)C1=CC=C(C)C=C1.CC(C)C1=CC=C(C)C=C1 RLXAQIXESOWNGY-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-WFVSFCRTSA-N 2-deuteriooxolane Chemical compound [2H]C1CCCO1 WYURNTSHIVDZCO-WFVSFCRTSA-N 0.000 description 1
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 1
- JFVFWGHEKXGTAA-UHFFFAOYSA-N CCC1NCC(C)(C)NC1CC Chemical compound CCC1NCC(C)(C)NC1CC JFVFWGHEKXGTAA-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- OZNAYWCPPWVXMP-UHFFFAOYSA-M Cl[Ru+2]C1(C(=C(C(=C1C)C)C)C)C Chemical compound Cl[Ru+2]C1(C(=C(C(=C1C)C)C)C)C OZNAYWCPPWVXMP-UHFFFAOYSA-M 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 238000004616 Pyrometry Methods 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- FYJKEHKQUPSJDH-UHFFFAOYSA-N [dimethyl-(trimethylsilylamino)silyl]methane;potassium Chemical compound [K].C[Si](C)(C)N[Si](C)(C)C FYJKEHKQUPSJDH-UHFFFAOYSA-N 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229940045348 brown mixture Drugs 0.000 description 1
- GGBJHURWWWLEQH-UHFFFAOYSA-N butylcyclohexane Chemical compound CCCCC1CCCCC1 GGBJHURWWWLEQH-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical compound C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- 239000004914 cyclooctane Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- UCXUKTLCVSGCNR-UHFFFAOYSA-N diethylsilane Chemical compound CC[SiH2]CC UCXUKTLCVSGCNR-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- KCWYOFZQRFCIIE-UHFFFAOYSA-N ethylsilane Chemical compound CC[SiH3] KCWYOFZQRFCIIE-UHFFFAOYSA-N 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000004050 hot filament vapor deposition Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- SBOJXQVPLKSXOG-UHFFFAOYSA-N o-amino-hydroxylamine Chemical class NON SBOJXQVPLKSXOG-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 230000004792 oxidative damage Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- WQIQNKQYEUMPBM-UHFFFAOYSA-N pentamethylcyclopentadiene Chemical compound CC1C(C)=C(C)C(C)=C1C WQIQNKQYEUMPBM-UHFFFAOYSA-N 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- NTTOTNSKUYCDAV-UHFFFAOYSA-N potassium hydride Chemical compound [KH] NTTOTNSKUYCDAV-UHFFFAOYSA-N 0.000 description 1
- 229910000105 potassium hydride Inorganic materials 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 125000003373 pyrazinyl group Chemical group 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003303 ruthenium Chemical class 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C07D241/12—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/408—Oxides of copper or solid solutions thereof
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- C23C16/45523—Pulsed gas flow or change of composition over time
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Description
本願は、2013年7月26日出願の米国仮特許出願第61/858799号の利益を主張するものである。この仮特許出願の開示は、その参照により全体として本明細書に含められる。
a.式3A、3B、3C、3D、3E、3F、3G及び3Hの錯体又はそれらの組み合わせから選択される金属ジヒドロピラジニル錯体を導入する工程、
b.前記金属ジヒドロピラジニル錯体を前記基材上に化学吸着させる工程、
c.前記金属ジヒドロピラジニル錯体をパージガスを用いてパージする工程、
d.加熱された基材上の前記金属ジヒドロピラジニル錯体に酸素源を提供して、吸着した金属ジヒドロピラジニル錯体と反応させる工程、並びに
e.任意選択で全ての未反応の酸素源をパージする工程
を含み、前記工程a〜dが、膜の所望の厚さが得られるまで繰り返される方法が提供される。
基材を反応器に提供する工程、
式3A、3B、3C、3D、3Eの化合物又はそれらの組み合わせから選択される金属ジヒドロピラジニル錯体含有前駆体を含む含有組成物を前記反応器に導入する工程、
前記金属ジヒドロピラジニル錯体含有前駆体を前記基材上に化学吸着させる工程、
未反応の金属ジヒドロピラジニル錯体金属含有前駆体をパージガスを用いて除去する工程、
加熱された基材上の前記金属ジヒドロピラジニル錯体金属含有前駆体に酸素源を提供して、吸着した少なくとも1つの金属ジヒドロピラジニル錯体含有前駆体と反応させる工程、並びに
任意選択で全ての未反応の酸素源を除去する工程
を含むALD堆積方法を用いて形成される。
a.式3A、3B、3C、3D、3Eの化合物又はそれらの組み合わせから選択される少なくとも1つを含む金属ジヒドロピラジニル錯体を導入する工程、
b.前記金属ジヒドロピラジニル錯体を前記基材上に化学吸着させる工程、
c.前記金属ジヒドロピラジニル錯体をパージガスを用いてパージする工程、
d.任意選択で、加熱された基材上の前記金属ジヒドロピラジニル錯体に還元剤を提供して、吸着した金属ジヒドロピラジニル錯体と反応させる工程、並びに
e.任意選択で全ての未反応の還元剤をパージする工程
を含み、前記還元剤が、水素、水素プラズマ、アンモニア、アンモニアプラズマ、水素/窒素プラズマ、アルキルシラン及びそれらの混合物から選択することができ、前記工程a〜dが、金属膜の所望の厚さが得られるまで繰り返されるALD堆積方法を用いて基材上に形成される。
周囲温度から約700℃の温度に加熱されかつ1Torr以下の圧力で維持される反応器に1つ又は複数の基材を配置する工程、
式3A、3B、3C、3D、3Eの化合物又はそれらの組み合わせから選択される少なくとも1つを含む金属ジヒドロピラジニル錯体を含む組成物を導入する工程、並びに
前記反応器に酸素源を提供して、前記金属ジヒドロピラジニル錯体と少なくとも部分的に反応させ、前記1つ又は複数の基材上に金属膜を堆積させる工程
を含む。このCVD法の幾つかの実施態様では、反応器は、導入工程の際に100mTorr〜600mTorrの圧力で維持される。
50.0g(0.438mole)の3,4−ヘキサンジオンを、250ミリリットル(ml)のテトラヒドロフラン(THF)中に溶解し、そして、38.6g(0.438mole)のH2NC(Me)2CH2NH2を、氷浴冷却によって20〜25℃を維持し、30分間にわたって撹拌しながら加えた。そして、混合物を一晩撹拌した。次に、混合物を、20グラム(g)の無水硫酸マグネシウムとともに一晩撹拌し、濾過し、そして、真空によってTHFを除去して、やまぶき色の液体(58g)を得た。そして、これを、20gの乾燥させた分子篩上で2日間保存した。次に、分子篩を取り除き、原料を65℃/100mTorrにてバルブからバルブへと移動させ、非常に明るい黄緑色の液体として最終生成物を得た。生成物の収量は47g(65%)であった。ガスクロマトグラフィー−質量分析法(GCMS)は166muに親イオンを示した。
アルゴン通気雰囲気下、20mlのテトラヒドロフラン中に溶解した9.3g(0.056mole)のHDMDEPを、−78℃に冷やした200mlのテトラヒドロフラン中に溶解した10.66g(0.053mole)のカリウムヘキサメチルジシラザンに、10分間かけて滴下して加えた。得られた混合物を−78℃にて30分間撹拌し、その後、2時間かけてゆっくり室温まで温めた。そして、得られたKDMDEPの溶液を、室温にて300mlのテトラヒドロフラン中で撹拌しながら、20分間かけてカニューレを通して14.25gのクロロ(ペンタメチルシクロペンタジエニル)ルテニウム(+2)四量体(例えば、RuCp*Cl)(0.052moleのルテニウム)に加えた。そして、混合物を2日間還流した。そして、溶媒を真空によって除去し、300mlのヘキサンをアルゴン下で加えた。得られた混合物を20分間振盪撹拌し、次に、濾過して、こげ茶色の濾液を得た。ヘキサンを真空によって除去して、こげ茶色のタールを得た。タールを次に、140°C/100mTorrの圧力にてバルブ間で蒸留して、やまぶき色の液体を得、2日間かけて凝固させて結晶塊を得た。上清の液体を冷凍庫に移し、−20℃にて3日間で、2回目の結晶形成を得た。次に、2バッチの結晶を合わせ、140℃にて真空で再び蒸留し、過剰なジヒドロピラジンが微量存在する最初の画分を捨て、2日間かけて琥珀色の結晶に凝固する琥珀色の油状物質として主要な画分を得た。収量=11.0g(52%)。54℃の融点、図2に示されているとおり、TGAによると2.08wt%の残留である。X線結晶学では、単量体のRuCp*(DMDEP)と構造を確認した。
窒素雰囲気下、0.68g(0.005mole)のペンタメチルシクロペンタジエンを、20mlのTHF中の0.2g(0.005mole)の水素化カリウムに加え、窒素下、45℃に温めて2時間混合して、淡黄色の懸濁液を得た。次に、0.65g(0.005mole)のコバルトジクロリドを加え、そして、混合物を室温にて一晩撹拌して、こげ茶色の混合物を得た。5mlのTHF中に溶解した1.02g(0.005mole)のKDMDEP(THF)の固体を加え、そして、混合物を一晩を撹拌した。THFを次に、真空によって除去し、30mlのヘキサンによって暗色の油状物質塊を抽出し、そして、濾過した。ヘキサンを真空によって除去し、こげ茶色の油状物質を120℃/100mTorrにてバルブ間で蒸留して、初めに赤褐色の油状物質を得、続いて深い暗赤色の結晶性生成物を得た。収量=0.4g(22%)、MPt126.5℃、図4に示されているとおり、TGA残留8.12wt%。GCMSは360muに親イオンを示した。1H NMR:(500MHz、D8トルエン):δ=0.95(s,3H)、δ=0.97(s,3H)、δ=1.01(t,3H)δ=1.42(t,3H)、δ=1、45(m,1H)、δ=1.71(s、15H)、δ=1.73(m,1H)、δ=2.20(m,1H)、δ=2.4(m,1H)、δ=3.29(s,1H)。
アルゴン雰囲気下、5mlのTHF中の1.7g(0.01mole)のHDMDEPを、0mlのTHF中の1.8g(0.0090mole)のKHMDZにドライアイス上で2分間かけて加え、ドライアイス上で90分間撹拌し、その後、90分間室温まで温めた。溶媒であるヘキサメチルジシラザン及び非脱プロトン化HDMDEPを減圧下で除去し、未精製の固体を得た。少量のサンプルを沸騰させたヘキサン中に懸濁し、懸濁液が溶解するまでTHFを滴下して加えた。室温まで冷まして時点で、X線結晶学(図5)によってK1がC9、N1、C12、C11及びN2に結合している、カリウムに対してη5配位結合している所望の2,2−ジヒドロ−3,3−ジメチル−5,6−ジエチルピラジルアニオンであることが示された少量の結晶を形成した。1分子のTHFもまた、各カリウムイオンに対して配位結合されている。NMRサンプルのために、すべてのTHFを送り出し、そして、サンプルをデウテロテトラヒドロフラン(deuterotetrahydrofuran)中で調製した。1H NMR:(500MHz、D8 THF):δ=0.78(t,3H)、δ=0.94(t,3H)、δ=1.04(t,3H)、δ=2.03(q,2H)、δ=2.31(q,2H)、δ=4.85(s,1H)。
5mlのTHF中の1.33g(0.006mole)のHDMDEPを、−78℃にて50mlのTHF中の1.6g(0.0054mole)のカリウムヘキサメチルジシラザンに加え、その後、2時間かけて室温まで温めた。そして、この溶液を、50mlのTHF中の1.0g(0.004moleのRu)のRuCl2ベンゼンに加えた。混合物を8時間還流し、次に、溶媒を減圧下で除去し、得られた塊を100mlのヘキサンで抽出し、濾過した。ヘキサンを減圧下で除去し、得られた茶色の油状物質を、150°C/100mTorrにてバルブ間で蒸留し、琥珀色の油状蒸留物を得た。GCMSは346muにRu(HDMEP)(ベンゼン)親イオンを示した。
ルテニウム膜を、CN−1シャワーヘッド型ALD反応器を使用したALD条件下で酸化チタン及び窒化チタン被覆シリコンウェハ上に成長させた。使用したプロセスサイクルは、それぞれ5/20/5/20秒のサイクルタイムを使用した、138°Cにて50sccmのアルゴンをRuCp*DMDEPにバブリング/600sccmのアルゴンをパージ/100sccmの酸素/600sccmのアルゴンをパージを使用した。600sccmのアルゴンパージには、前駆体ラインの300sccmのパージ及び試薬ラインの300sccmのパージも含まれた。ウェハ温度は300℃であった。ALDチャンバー圧は3Torrであった。このサイクルの450回の繰り返しで、〜15nmのRu膜が得られ、そのXPS分析は図6に示されている。300プロセスサイクルにわたる同一条件下で成長させたルテニウム膜の二次イオン質量(SIMS)分析では、<1.0原子%の炭素及び酸素レベルを示した。
Claims (13)
- 以下の式3A、3B及び3C
を有し、式中、R1、R2、R3、R4がそれぞれ独立してC1−C6の直鎖、分岐又は環状のアルキル基から選択され、R5が独立してH原子及びC1−C6の直鎖、分岐又は環状のアルキル基から選択され、(L)がシクロペンタジエニル、ペンタアルキルシクロペンタジエニル、ペンタメチルペンタジエニル、ジメチルペンタジエニル、トリメチルペンタジエニル、メチルシクロペンタジエニル、エチルシクロペンタジエニル、イミダゾリル、トリアルキルイミダゾリル、ピロリル、及びアルキルピロリルから選択されるアニオンであり、Mが二価金属であり、x=1又は2であり、x+y=2であり、Xが独立してH原子、C1−C6の直鎖、分岐又は環状のアルキル基、及びSiR6(式中、R6は独立してC1−C3の直鎖又は分岐のアルキル基から選択される)から選択される1つ又は複数の化合物を含む、組成物。 - 以下の式3D
を有し、式中、R1、R2、R3、R4がそれぞれ独立してC1−C6の直鎖、分岐又は環状のアルキル基から選択され、R5が独立してH原子及びC1−C6の直鎖、分岐又は環状のアルキル基から選択され、(L)がシクロペンタジエニル、ペンタアルキルシクロペンタジエニル、ペンタメチルペンタジエニル、ジメチルペンタジエニル、トリメチルペンタジエニル、メチルシクロペンタジエニル、エチルシクロペンタジエニル、イミダゾリル、トリアルキルイミダゾリル、ピロリル、及びアルキルピロリルから選択されるアニオンであり、Mが一価金属であり、x=1であり、y=1又は2であり、Zが独立してH原子、C1−C6の直鎖、分岐又は環状のアルキル基、及びSiR6(式中、R6は独立してC1−C6の直鎖又は分岐のC1−C3アルキル基から選択される)から選択される化合物を含む、組成物。 - ある厚さを有する金属酸化物膜を基材上に形成するための方法であって、
a.式3A、3B、3C、3D、3E、3F、3G及び3Hの化合物又はそれらの組み合わせから選択される少なくとも1つを含む金属錯体であって、
式3A〜3C中、R 1 、R 2 、R 3 、R 4 がそれぞれ独立してC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、R 5 が独立してH原子及びC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、(L)がシクロペンタジエニル、ペンタアルキルシクロペンタジエニル、ペンタメチルペンタジエニル、ジメチルペンタジエニル、トリメチルペンタジエニル、メチルシクロペンタジエニル、エチルシクロペンタジエニル、イミダゾリル、トリアルキルイミダゾリル、ピロリル、及びアルキルピロリルから選択されるアニオンであり、Mが二価金属であり、x=1又は2であり、x+y=2であり、Xが独立してH原子、C 1 −C 6 の直鎖、分岐又は環状のアルキル基、及びSiR 6 (式中、R 6 は独立してC 1 −C 3 の直鎖又は分岐のアルキル基から選択される)から選択され、
式3D中、R 1 、R 2 、R 3 、R 4 がそれぞれ独立してC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、R 5 が独立してH原子及びC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、(L)がシクロペンタジエニル、ペンタアルキルシクロペンタジエニル、ペンタメチルペンタジエニル、ジメチルペンタジエニル、トリメチルペンタジエニル、メチルシクロペンタジエニル、エチルシクロペンタジエニル、イミダゾリル、トリアルキルイミダゾリル、ピロリル、及びアルキルピロリルから選択されるアニオンであり、Mが一価金属であり、x=1であり、y=1又は2であり、Zが独立してH原子、C 1 −C 6 の直鎖、分岐又は環状のアルキル基、及びSiR 6 (式中、R 6 は独立してC 1 −C 6 の直鎖又は分岐のC 1 −C 3 アルキル基から選択される)から選択され、
式3E中、R 1 、R 2 、R 3 、R 4 がそれぞれ独立してC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、R 5 がH原子及びC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、(Q)がベンゼン及びアルキル化ベンゼンから選択され、Mが金属であり、xが1又は2であり、y=1であり、Zが独立してH原子及びC 1 −C 6 の直鎖、分岐又は環状のC 1 −C 6 アルキル基、及びSiR 6 (式中、R 6 はC 1 −C 3 の直鎖又は分岐のアルキル基である)から選択され、
式3F〜3H中、R 1 、R 2 、R 3 、R 4 がそれぞれ独立してC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、R 5 が独立してH原子及びC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、(Q)が中性配位子であり、Mが一価金属であり、y=1であり、Xが独立してH原子、C 1 −C 6 の直鎖、分岐又は環状のアルキル基、及びSiR 6 (式中、R 6 は独立してC 1 −C 3 の直鎖又は分岐のアルキル基から選択される)から選択される金属錯体を導入する工程、
b.前記金属錯体を前記基材上に化学吸着させる工程、
c.前記金属錯体をパージガスを用いてパージする工程、
d.加熱された基材上の前記金属錯体に酸素源を提供して、吸着した金属錯体を含有する組成物と反応させる工程、並びに
e.任意選択で全ての未反応の酸素源をパージする工程
を含む、方法。 - 前記工程a〜d及び任意選択の工程eが、膜の前記厚さが確立されるまで繰り返される、請求項4に記載の方法。
- 原子層堆積プロセスである、請求項4に記載の方法。
- 前記金属錯体が、ルテニウム(ペンタメチルシクロペンタジエニル)(2,2−ジヒドロ−3,3−ジメチル−5,6−ジエチルピラジニル)、コバルト(ペンタメチルシクロペンタジエニル)(2,2−ジヒドロ−3,3−ジメチル−5,6−ジエチルピラジン)、ルテニウム(2,2−ジヒドロ−3,3−ジメチル−5,6−ジエチルピラジン)(ベンゼン)及びそれらの組み合わせから選択される少なくとも1つを含む、請求項4に記載の方法。
- ある厚さを有する金属膜を基材上に形成するための方法であって、
a.式3A、3B、3C、3D、3E、3F、3G及び3Hの化合物又はそれらの組み合わせから選択される少なくとも1つを含む金属錯体であって、
式3A〜3C中、R 1 、R 2 、R 3 、R 4 がそれぞれ独立してC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、R 5 が独立してH原子及びC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、(L)がシクロペンタジエニル、ペンタアルキルシクロペンタジエニル、ペンタメチルペンタジエニル、ジメチルペンタジエニル、トリメチルペンタジエニル、メチルシクロペンタジエニル、エチルシクロペンタジエニル、イミダゾリル、トリアルキルイミダゾリル、ピロリル、及びアルキルピロリルから選択されるアニオンであり、Mが二価金属であり、x=1又は2であり、x+y=2であり、Xが独立してH原子、C 1 −C 6 の直鎖、分岐又は環状のアルキル基、及びSiR 6 (式中、R 6 は独立してC 1 −C 3 の直鎖又は分岐のアルキル基から選択される)から選択され、
式3D中、R 1 、R 2 、R 3 、R 4 がそれぞれ独立してC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、R 5 が独立してH原子及びC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、(L)がシクロペンタジエニル、ペンタアルキルシクロペンタジエニル、ペンタメチルペンタジエニル、ジメチルペンタジエニル、トリメチルペンタジエニル、メチルシクロペンタジエニル、エチルシクロペンタジエニル、イミダゾリル、トリアルキルイミダゾリル、ピロリル、及びアルキルピロリルから選択されるアニオンであり、Mが一価金属であり、x=1であり、y=1又は2であり、Zが独立してH原子、C 1 −C 6 の直鎖、分岐又は環状のアルキル基、及びSiR 6 (式中、R 6 は独立してC 1 −C 6 の直鎖又は分岐のC 1 −C 3 アルキル基から選択される)から選択され、
式3E中、R 1 、R 2 、R 3 、R 4 がそれぞれ独立してC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、R 5 がH原子及びC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、(Q)がベンゼン及びアルキル化ベンゼンから選択され、Mが金属であり、xが1又は2であり、y=1であり、Zが独立してH原子及びC 1 −C 6 の直鎖、分岐又は環状のC 1 −C 6 アルキル基、及びSiR 6 (式中、R 6 はC 1 −C 3 の直鎖又は分岐のアルキル基である)から選択され、
式3F〜3H中、R 1 、R 2 、R 3 、R 4 がそれぞれ独立してC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、R 5 が独立してH原子及びC 1 −C 6 の直鎖、分岐又は環状のアルキル基から選択され、(Q)が中性配位子であり、Mが一価金属であり、y=1であり、Xが独立してH原子、C 1 −C 6 の直鎖、分岐又は環状のアルキル基、及びSiR 6 (式中、R 6 は独立してC 1 −C 3 の直鎖又は分岐のアルキル基から選択される)から選択される金属錯体を導入する工程、
b.前記金属錯体を前記基材上に化学吸着させる工程、
c.前記金属錯体をパージガスを用いてパージする工程、
d.加熱された基材上の前記金属錯体に還元剤を提供して、吸着した金属錯体と反応させる工程、並びに
e.任意選択で全ての未反応の還元剤をパージする工程
を含む、方法。 - 前記工程a〜d及び任意選択の工程eが、膜の前記厚さが確立されるまで繰り返される、請求項8に記載の方法。
- 原子層堆積プロセスである、請求項8に記載の方法。
- 前記金属錯体が、ルテニウム(ペンタメチルシクロペンタジエニル)(2,2−ジヒドロ−3,3−ジメチル−5,6−ジエチルピラジニル)、コバルト(ペンタメチルシクロペンタジエニル)(2,2−ジヒドロ−3,3−ジメチル−5,6−ジエチルピラジン)、ルテニウム(2,2−ジヒドロ−3,3−ジメチル−5,6−ジエチルピラジン)(ベンゼン)及びそれらの組み合わせから選択される少なくとも1つを含む、請求項8に記載の方法。
- 前記還元剤が、水素、水素プラズマ、アンモニア、アンモニアプラズマ、水素/窒素プラズマ、アルキルシラン及びそれらの混合物から選択される、請求項8に記載の方法。
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| US20150030782A1 (en) | 2015-01-29 |
| KR101659725B1 (ko) | 2016-09-26 |
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