JP5918928B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method for peeling an adhesive sheet affixed to an adherend.

  Conventionally, in a semiconductor manufacturing process, there is a process of grinding and thinning the back surface of a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) in order to reduce the size of a semiconductor chip. In this grinding process, an adhesive sheet is bonded to the wafer surface (surface on which the circuit is formed), and after the grinding process, the adhesive sheet is peeled off from the wafer. And as such a peeling method of the adhesive sheet, a method is proposed in which a peeling tape is bonded to an end of the adhesive sheet, and the peeling sheet is pulled from the wafer by pulling the peeling tape (for example, a patent) Reference 1).

Japanese Patent Laid-Open No. 11-16862

By the way, in the conventional peeling method as described in Patent Document 1, the length of the circumferential direction along the outer periphery of the wafer and the diameter toward the center of the wafer are used as the adhesive region of the peeling tape at the end of the adhesive sheet. The length in the direction (in Patent Document 1, it is the distance d and d ≦ 3 mm), and this adhesion region is set based on the surplus region in the outer peripheral portion where the circuit surface is not formed. .
Further, the conventional peeling apparatus has a table for holding the wafer, and holds the wafer by suction by a suction means such as a suction port provided on the table.

Here, as shown in FIG. 5A, when the adhesive sheet 91 is peeled off using the peeling tape T having a heat-sensitive adhesive, the adhesive is deposited over time when the adhesive is welded to the adhesive region 90. There is a tendency to harden together. When the adhesive sheet 91 is peeled off by pulling the release tape T thus cured, as shown in FIG. 5B, the adhesive region 90 pulled by the release tape T tends to rise simultaneously in a plane shape. . As a result, the stress acting on the boundary portion W1 of the wafer W adjacent to the adhesion region 90 becomes large, and the wafer W rises together with the peeling tape T at the boundary portion W1. Further, when the rising of the wafer W is increased, the wafer W may be broken in some cases.
In order to prevent such rising and cracking of the wafer W, the problem can be solved by shortening the length (distance d0) in the radial direction toward the center of the wafer W in the bonding region 90, but from the entire surface of the wafer W. The adhesive force cannot be withstood by the tension for peeling the adhesive sheet 91, and the peeling tape T is separated from the adhesive sheet 91 in the middle of peeling, which causes a disadvantage that peeling failure occurs. In particular, as the wafer outer diameter increases in recent years, the tension required for peeling off the adhesive sheet tends to increase.

  The objective of this invention is providing the sheet | seat peeling apparatus and peeling method which can peel an adhesive sheet smoothly from a to-be-adhered body, suppressing the rise and crack of to-be-adhered bodies, such as a wafer.

In order to achieve the above object, the sheet peeling apparatus of the present invention is configured such that the adherend is adhered to the adherend by relative movement between an adherend having an adhesive sheet affixed on one surface and a peeling tape affixed to the adhesive sheet. A sheet peeling apparatus for peeling a sheet, the holding means for holding the adherend from the other surface, the feeding means for feeding out the peeling tape, and affixing the fed-off peeling tape to the adhesive sheet And a moving means for relatively moving the adherend and the peeling tape, wherein the sticking means is a peeling start side in the relative movement direction by the moving means, and is an outer edge of the adhesive sheet. the pasting area having a predetermined length is formed between the peeling tape and the adhesive sheet along the provided and the peeling tape with the adhesive sheet to be stuck, the sticking area is less when One has two sides constituted by inclined side inclined to the peeling direction, comprises at least one protrusion having a tip angle portion formed by the two sides, front end corner of the projecting portion Is configured to be positioned at the outer edge of the adhesive sheet .

At this time, in the sheet peeling apparatus of the present invention, the peeling tape is a heat-sensitive adhesive tape, and the sticking means has a pressing head heated by a heating means. the sticking area is formed in accordance with the shape of the pressing surface is preferred.
Moreover, in the sheet peeling apparatus of this invention, it is formed that the one protrusion part in the said sticking area | region is located so that the front-end | tip corner | angular part may be located in the outermost edge of the peeling start side of the said relative movement direction in the said adhesive sheet. preferable.

On the other hand, the sheet peeling method of the present invention is a sheet that peels off the adhesive sheet from the adherend by relative movement between an adherend having an adhesive sheet affixed on one surface and a peeling tape affixed to the adhesive sheet. This is a peeling method in which the adherend is held from the other surface and the peeling tape is fed out, and at least one has two sides that are inclined with respect to the peeling direction. At least one protrusion having a tip corner formed by two sides, the tip corner of the protrusion is configured to be located at the outer edge of the adhesive sheet, and along the outer edge of the adhesive sheet the peeling tape is stuck to the adhesive sheet to form a pasting area having a predetermined length, the said peeling tape by relatively moving the adherend of the adhesive sheet from the front end corner of the attaching area Characterized in that it starts the release.

According to the present invention as described above, a pasting region having at least one projecting portion located on the outer edge of the adhesive sheet is formed, and peeling of the adhesive sheet is started using this projecting portion as a starting point. The tip corner of the protruding portion, which has a relatively small area compared to the entire area, can be used as a peeling cut, and the adhesive sheet at the cut portion can be reliably peeled from the adherend. Thereafter, by continuing the separation from front end corner of the patch area, sticking area she can be suppressed rising adherend end due to causes pulling the adhesive sheet as a surface, rising Ya adherends The adhesive sheet can be reliably and smoothly peeled from the adherend while preventing cracking.

In addition, if the peeling tape is a heat-sensitive adhesive tape, a higher adhesive force can be obtained compared to a pressure-sensitive adhesive tape, so the area of the affixed area can be reduced, and the adherend Can be further suppressed, and by using a heat-sensitive adhesive tape, it is possible to accurately adhere only the predetermined pasting area, it is possible to form the tip shape of the protrusion sharply, The adhesive sheet can be reliably peeled from the tip corner of the protrusion. Furthermore, since heat-sensitive adhesive tape does not have adhesive strength at room temperature, it is necessary to pay attention to the configuration of the device, such as applying non-adhesive treatment to various parts of the device, as when using pressure-sensitive adhesive tape. Disappear.
Furthermore, if the tip corner of one protrusion is formed at the outermost edge on the peeling start side in the moving direction of the adhesive sheet, peeling can be started more reliably from the tip corner .

The side view which shows the sheet peeling apparatus which concerns on one Embodiment. (A), (B) is operation | movement explanatory drawing of the sheet peeling apparatus of FIG. Operation | movement explanatory drawing of the sheet peeling apparatus following FIG. (A)-(D) is operation | movement explanatory drawing of the sheet peeling apparatus which concerns on a modification. (A), (B) is explanatory drawing which shows the example of a conventional malfunction.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
For example, when a direction such as up, down, left, right, near side, or back side is shown without referring to a reference figure in this embodiment, FIG. 1 is used as a reference.
In FIG. 1, a sheet peeling apparatus 1 is an apparatus for peeling an adhesive sheet S affixed to the surface of a wafer W as an adherend using a peeling tape T, and is a holding means for holding the wafer W. The table 2, the feeding means 3 for feeding the peeling tape T, the sticking means 4 for sticking the fed peeling tape T to the adhesive sheet S, and the moving means 5 for moving the wafer W and the peeling tape T relative to each other. And is configured. Here, the wafer W is, for example, a semiconductor wafer in which an inner peripheral portion is thinly ground and a circuit is formed on one surface (upper surface) thereof, and a ring-shaped convex portion WA is formed on the outer peripheral portion of the wafer W. Is formed.
The table 2 includes a flat table main body 21 that sucks and holds the convex portion WA of the wafer W from the other surface (lower surface) through a suction port (not shown).

  The feeding means 3 is supported by a separating device (not shown) and is provided so as to be movable in the vertical direction, support rollers 32 and guide rollers 33 and 34 provided on the frame 31, and provided below the frame 31. A tape support portion 35 for supporting the peeling tape T from below, a chuck member 37 including a pair of gripping claws 36 for gripping the peeling tape T, and a peeling tape provided above the tape support portion 35 and fed out. And a tape cutting unit 38 for cutting T. The peeling tape T is a heat-sensitive adhesive tape, and is supported by the support roller 32 in a state of being wound in a roll shape.

  The tape support portion 35 includes a bush 351 fixed to the frame 31, a rod 352 supported by the bush 351 so as to be able to advance and retreat, and a tape receiving plate 354 fixed to the tip of the rod 352 and having a cutter groove 353. And a coil spring 355 that biases the tape receiving plate 354 in a direction protruding from the bush 351. The tape cutting unit 38 drives the cutter blade 381 for cutting the peeling tape T, and drives the cutter blade 381 in the vertical direction when cutting the peeling tape T to guide the cutter blade 381 into the cutter groove 353. An upper and lower cylinder 382 that is a device and a cutting cylinder 383 that is a driving device that drives the cutter blade 381 in the direction orthogonal to the paper surface in FIG. 1 to cut the peeling tape T are configured.

  The sticking means 4 is supported on a frame (not shown) and provided on the left side of the feeding means 3. The affixing means 4 includes a pressing head 42 provided at a lower end portion of an output shaft 41 of a pressing motor which is a driving device (not shown), and a heater 44 as a heating means for heating the pressing surface portion 43 at the lower end of the pressing head 42. It is prepared for. As shown in FIGS. 2 (A) and 2 (B), the pressing head 42 has the pressing surface portion 43 pressed and affixed the peeling tape T to the end of the adhesive sheet S along the outer peripheral edge of the wafer W. A sticking region R1 having a predetermined length L along the outer edge of the adhesive sheet S is formed between the peeling tape T and the adhesive sheet S so attached.

  The moving unit 5 includes a single-axis robot 51 that is a driving device provided on the back side of the drawing unit 3 and its slider 52, a single-axis robot 53 that is a driving device provided below the table 2, and its And a slider 54. The single-axis robot 51 is supported by a driving device (not shown) and can move in the vertical direction. A chuck member 37 as a driving device is attached to the slider 52. The slider 52 is movable in the left-right direction, and the table body 21 is fixed to the slider 54. The slider 54 is moved in the left-right direction. It can be moved to. As a result, the chuck member 37 grips the peeling tape T affixed to the adhesive sheet S to enable relative movement with the wafer W, and this relative movement direction is the peeling direction A of the adhesive sheet S.

  The pasting region R1 formed by the above sheet peeling apparatus 1 is formed in a substantially pentagonal shape in plan view having substantially the same shape as the pressing surface portion 43 of the pressing head 42, and as shown in FIG. Retreat which is provided in a range corresponding to the convex portion WA of the wafer W and has moved back to the peeling end side (right side in the drawing) from the outer edge of the adhesive sheet S on the peeling start side (left side in the drawing) in the peeling direction A by the moving means 5 It is formed to have a portion Ra and one projecting portion P1 which is a projecting tip projecting toward the peeling start side from the retreating portion Ra and located at the outer edge of the adhesive sheet S. That is, in the pasting region R1, on the peeling start side in the peeling direction A, the receding portion Ra is configured by a pair of inclined sides that are inclined with respect to the peeling direction A, and the protruding portion P1 is configured by an intersection where the pair of inclined sides intersect. The tip of the projecting portion P1 is formed so as to contact the outer edge of the adhesive sheet S as a point.

Next, as a method for peeling the adhesive sheet S in the present embodiment, the operation of the sheet peeling apparatus 1 will be described with reference to FIG.
As a procedure for peeling the adhesive sheet S from the wafer W, first, as shown in FIG. 1, while holding the wafer W at a predetermined position of the table 2 and setting each part of the sheet peeling apparatus 1 to the initial position, the tape After the cutting unit 38 and the pasting means 4 move upward and retract, the chuck member 37 moves toward the feeding means 3 via the single-axis robot 51. When the gripping claws 36 located below contact the tape receiving plate 354, the tape receiving plate 354 is pushed in the direction of the bush 351, and the leading end of the peeling tape T is received between the upper and lower gripping claws 36. The chuck member 37 closes the gripping claws 36 to grip the tip of the peeling tape T and moves away from the feeding means 3 while holding the peeling tape T, so that the peeling tape T has a predetermined length. The peeling tape T is fed out from the feeding means 3 by being pulled out and stopped.

  Next, as shown in FIGS. 2 (A) and 2 (B), the sticking means 4 operates the pressing motor to push down the pressing head 42, and the intermediate portion of the peeling tape T is pressed by the pressing surface portion 43 of the pressing head 42. Is pressed against the adhesive sheet S. At this time, the pressing surface portion 43 is heated by the heater 44, and the sticking region R1 of the peeling tape T is stuck on the adhesive sheet S. When the peeling tape T is affixed to the adhesive sheet S, the tape cutting portion 38 lowers the cutter blade 381 into the cutter groove 353 by the up and down cylinder 382, and the cutting cylinder 383 is driven to release the peeling tape T by the cutter blade 381. After cutting, the sticking means 4 operates the pressing motor to raise the pressing head 42.

Next, after retracting the feeding means 3 and the sticking means 4 upward, the single-axis robot 51 moves the chuck member 37 in a state of gripping the tip of the peeling tape T to the right in the peeling direction A, and protrudes. The peeling tape T is folded back so as to be able to be peeled off starting from the tip corner portion P of the portion P1.
Next, the single-axis robots 51 and 53 are synchronized to move the wafer W and the peeling tape T simultaneously at the same speed in the opposite direction, that is, by moving the table 2 to the left and the chuck member 37 to the right. The adhesive sheet S is sequentially peeled from the wafer W, and the entire adhesive sheet S is peeled off. Thereafter, the peeling tape T to which the peeled adhesive sheet S is bonded is separated from the chuck member 37 and collected, and the wafer W from which the adhesive sheet S has been peeled is unloaded from the table 2 by an appropriate transport device, and the sheet is peeled off. Each part of the apparatus 1 is returned to the initial position, and the peeling procedure of the adhesive sheet S is completed.

According to this embodiment as described above, the following effects are obtained.
That is, by pulling the pasting region R1 starting from the tip of the protrusion P1 and peeling the end of the adhesive sheet S from the wafer W, it is possible to suppress the wafer W from rising together with the peeling tape T. The end of S can be reliably peeled off from the wafer W.

  As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to particular embodiments, but with respect to the embodiments described above, such as shape and the like, without departing from the scope and spirit of the invention. In the detailed configuration, various modifications can be made by those skilled in the art. Moreover, since the description which limited the shape etc. which were disclosed above was illustrated in order to make an understanding of this invention easy, it does not limit this invention, Therefore The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, in the above embodiment, the case where the adherend is a semiconductor wafer is shown, but the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate are used. The substrate can also be a target, and the semiconductor wafer can be exemplified by a silicon wafer, a compound wafer, and the like, and a peeling apparatus and a peeling method for peeling an adhesive sheet (sheet, film, tape, etc.) affixed to the adherend The present invention can also be applied to.
Moreover, in the said embodiment, although the heat-sensitive adhesive tape T was used as a peeling tape, it is not restricted to this, The peeling tape may be comprised with a pressure-sensitive adhesive tape etc. Although the adhesive sheet S is shown as an adhesive sheet to be peeled off, the present invention is not limited to this, and an appropriate sheet, film, tape, or the like may be used. In addition, the stripping tape T is illustrated and described as feeding means, but the stripping tape T is not limited to the strip shape, for example, a sheet obtained by cutting the stripping tape T to an appropriate length. Leaf tape may be employed.

  In addition, in the above-described embodiment, the attachment region R1 having a substantially pentagonal shape in plan view is formed. However, as shown in FIG. 4 (A), the arc-shaped receding portion Ra substantially along the outer edge of the adhesive sheet S, You may form sticking area | region R2 which has one protrusion part P2 which protruded from the approximate center of part Ra in planar view substantially triangular shape. In the case of this pasting region R2, the end of the adhesive sheet S can be peeled off from the wafer W starting from the tip of the protrusion P2 as in the above embodiment. Further, as shown in FIG. 4 (B), a linear receding portion Ra separated from the outer edge of the adhesive sheet S and substantially orthogonal to the peeling direction A, and a substantially triangular shape in plan view from both ends of the receding portion Ra. You may form sticking area | region R3 which has two protrusion part P3 which protruded. In the case of this pasting region R3, the end portions of the adhesive sheet S can be peeled off from the wafer W with the two protruding portions P3 almost simultaneously at their tips.

  Further, as shown in FIG. 4C, an arcuate receding portion Ra substantially along the outer edge of the adhesive sheet S, and a projecting portion P4 projecting in a substantially triangular shape in plan view from the approximate center of the receding portion Ra, You may form sticking area | region R4 which has the three protrusion parts P4 which consist of the protrusion part P4 which protruded in planar view substantially triangle shape from the both ends of retreat part Ra. In the case of this pasting region R4, the protrusion P4 at the center is preceded and its tip is set as the starting point, and subsequently, at the three points where the tips of the protrusions P4 at the two ends are combined, The end of the sheet S can be peeled from the wafer W. Further, as shown in FIG. 4 (D), a linear receding portion Ra inclined in the peeling direction A and a projecting portion constituted by one end portion of the receding portion Ra and a corner portion in contact with the outer edge of the adhesive sheet S. P5 and a paste region R5 having a substantially trapezoidal shape in plan view may be formed. In the case of this pasting region R5, the end of the adhesive sheet S is peeled from the wafer W while starting from the tip of the protruding portion P5 and subsequently expanding the peeling position along the retracted portion Ra. can do.

Moreover, in the said embodiment, although the moving means 5 which moves both the wafer W and the peeling tape T and moves relatively is comprised, it is not restricted to this, Only either one of the wafer W and the peeling tape T is comprised. You may comprise so that it may move.
Further, in order to enable peeling starting from the tip corner P of the protrusion P1, an appropriate rotation motor or the like that rotates and moves the table body 21 and the moving means 5 in the same plane as the surface of the wafer W, etc. A driving device may be provided. In this case, it can also be configured so that it can be recognized that the tip corner P of the protrusion P1 is arranged at a predetermined position by a sensor such as a camera or an optical sensor (not shown).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

1 Sheet sticking device 2 Table (holding means)
3 Feeding means 4 Sticking means 5 Moving means 42 Pressing head 43 Pressing surface portion 44 Heater (heating means)
P1, P2, P3, P4, P5 Protrusion R1, R2, R3, R4, R5 Attached area S Adhesive sheet T Stripping tape W Wafer (Substrate)

Claims (4)

A sheet peeling apparatus for peeling the adhesive sheet from the adherend by relative movement between an adherend having an adhesive sheet attached to one surface and a peeling tape attached to the adhesive sheet,
Holding means for holding the adherend from the other surface;
A feeding means for feeding out the peeling tape;
A sticking means for sticking the fed peeling tape to the adhesive sheet;
A moving means for relatively moving the adherend and the peeling tape;
The sticking means is a peeling start side in a relative movement direction by the moving means, and forms a sticking region having a predetermined length along an outer edge of the adhesive sheet between the adhesive sheet and the peeling tape. The adhesive sheet and the peeling tape are provided so as to be pastable,
The affixing region has at least one projecting portion having a tip corner formed by the two sides , at least one of which is composed of inclined sides inclined with respect to the peeling direction , A sheet peeling device, characterized in that the tip corner of the protruding portion is positioned on the outer edge of the adhesive sheet . The peeling tape is a heat-sensitive adhesive tape,
Said attaching means is configured to have a pressing head which is heated by the heating means, the sheet peeling according to claim 1, characterized in that the sticking area is formed according to the shape of the pressing surface of the press head apparatus. The one protrusion part in the said sticking area | region is formed so that the front-end | tip corner | angular part may be located in the outermost edge of the peeling start side of the said relative movement direction in the said adhesive sheet. The sheet peeling apparatus as described in. A sheet peeling method for peeling the adhesive sheet from the adherend by relative movement between an adherend having an adhesive sheet attached to one surface and a peeling tape attached to the adhesive sheet,
Holding the adherend from the other surface and feeding out the peeling tape,
At least one of which has two sides formed by inclined sides inclined with respect to the peeling direction, and has at least one projection having a tip corner formed by the two sides, the tip angle of the projection The part is configured to be located at the outer edge of the adhesive sheet, and forms a sticking area having a predetermined length along the outer edge of the adhesive sheet to stick the peeling tape to the adhesive sheet,
A sheet peeling method, wherein the peeling tape and the adherend are moved relative to each other to start peeling of the adhesive sheet from a tip corner of the pasting region.

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