JP5923014B2 - Resin coating device - Google Patents

Description

  The present invention relates to a resin coating apparatus for applying a liquid resin to a thin plate workpiece such as a semiconductor wafer to obtain a resin film having a uniform thickness.

  Semiconductor wafers, which are used as materials for semiconductors and electronic components, are obtained by slicing cylindrical ingots made of raw materials such as silicon with a wire saw to obtain a disk-shaped material, which is then ground to a predetermined thickness. ing. By the way, a workpiece such as a wafer material obtained by slicing in this way often has undulation, warpage, etc., and therefore, a flat surface can be obtained by coating one side of the workpiece with a liquid resin. The process which forms is performed. In order to coat the workpiece with the liquid resin, for example, the liquid resin is supplied to a sheet placed on a flat surface, and the workpiece is pressed against the liquid resin so that one side is coated with the liquid resin. Then, a method of curing the liquid resin is employed. Then, by grinding the workpiece on the basis of the flat sheet surface, it is possible to finally form both sides of the workpiece flat and uniformly. As a conventional apparatus for supplying a liquid resin to one surface of a workpiece, for example, Patent Document 1 is known.

JP 2009-148866 A

  However, the liquid resin supplied onto the sheet varies in viscosity depending on the temperature. For example, when the operation time of the resin coating apparatus becomes long, the temperature in the apparatus rises, and as a result, the temperature of the liquid resin in the piping path for transporting the liquid resin rises and the viscosity changes. Such a change in the viscosity of the liquid resin affects the uniformity of the thickness of the resin film formed by pressing the liquid resin applied to one surface of the workpiece. That is, in a liquid resin having a high viscosity, the resin does not easily spread even when pressed with the same load, and the film thickness tends to be thick. On the other hand, in a liquid resin having a low viscosity, the resin tends to spread even when pressed with the same load. It tends to be thin.

  As a countermeasure against this problem, it is conceivable to keep the temperature in the apparatus constant and prevent the temperature of the liquid resin conveyed in the piping path from changing, but in order to control the temperature in the apparatus, temperature adjustment It is necessary to separately provide a high-capacity device, which leads to a reduction in productivity.

  The present invention has been made in view of the above points, and its main technical problem is that the viscosity of the liquid resin is kept constant by efficiently adjusting the temperature of the liquid resin even when the temperature in the apparatus changes. It is intended to provide a liquid resin coating apparatus capable of obtaining a resin film having a uniform thickness.

  The resin coating apparatus of the present invention supplies a liquid resin to the upper surface of a sheet member held on a stage, places a plate-like workpiece on the liquid resin, and presses the liquid resin on the lower surface of the workpiece. A resin coating apparatus that spreads and forms a resin film having a predetermined thickness sandwiched between the sheet member and the work, and bonds the work and the sheet member, the stage holding the sheet member, and the stage A liquid resin discharging means for discharging a liquid resin onto the upper surface of the sheet member held by the sheet member, a pressing means for placing and pressing the work on the liquid resin discharged on the upper surface of the sheet member, and the pressing means. The stage has a holding surface for sucking and holding the sheet member, and the liquid resin discharge means is stored in the resin tank and the resin tank. A piping path for transporting the liquid resin; a discharge nozzle for discharging the liquid resin; a pump for sending the liquid resin to the discharge nozzle by a predetermined amount; and the pipe path in the piping path connecting the pump and the discharge nozzle. A resin temperature measuring means for measuring the temperature of the liquid resin and sending it to the control means; and the piping path connecting the pump and the discharge nozzle by cooling or heating the piping path connecting the pump and the discharge nozzle. And a resin temperature adjusting means for adjusting the temperature of the liquid resin, and the pressing means is disposed above the stage, and a pressing surface is formed on the lower surface for sucking and holding the work against the stage. A pressing member, a moving means for moving the pressing member in the direction perpendicular to the holding surface of the stage, or the liquid tree discharged on the upper surface of the sheet member held by the stage. And a pressing load measuring means for measuring the pressing load value when the pressing member places and presses the workpiece and sending it to the control means, and the control means is sent from the resin temperature measuring means. Storage means for storing the temperature of the liquid resin and the pressing load value sent from the pressing load measuring means, and a resin having a predetermined thickness by pressing the liquid resin discharged on the upper surface of the sheet member. Based on the relationship between the pressure load value when forming the film and the viscosity of the liquid resin, and the relationship between the temperature of the liquid resin and the change in viscosity accompanying the change in temperature, the pressure load is set to a predetermined value. And calculating means for calculating the temperature of the liquid resin at which the liquid resin has an appropriate viscosity when a resin film having a predetermined thickness is formed, and a pressing load at the time of pressing by the pressing means is set. Measured to the predetermined value and measured by the resin temperature measuring means. Then, the resin temperature adjusting means is controlled so that the temperature of the liquid resin sent to the control means becomes equal to the temperature calculated by the calculating means.

  In the present invention, the temperature of the liquid resin conveyed through the piping path is measured, and the temperature is efficiently adjusted to be constant by the resin temperature adjusting means so that the viscosity of the liquid resin discharged from the discharge nozzle is constant. The liquid resin having a constant viscosity is a viscosity at which a resin film having a predetermined thickness is formed on the upper surface of the sheet member with a predetermined pressing load. As a result, the viscosity of the liquid resin applied to the sheet member is always maintained even in a situation where the temperature of the piping path changes due to a temperature change in the apparatus and the viscosity of the liquid resin changes accordingly. Therefore, the liquid resin having a predetermined viscosity can be pressed with a predetermined pressing load. As a result, a resin film having a uniform thickness can be obtained at all times.

  In the present invention, the liquid resin discharge means is selected between a discharge position at which the liquid resin can be discharged onto the upper surface of the sheet member held by the stage and a retreat position that does not interfere with the pressing means. A mode having discharge nozzle moving means positioned at a specific location.

  In the present invention, the liquid resin is an external stimulus-curable liquid resin that is cured by an external stimulus, and the stage is provided with an external stimulus applying means for applying an external stimulus, The stimulus applying means is configured such that the pressing means presses the workpiece on the stage, and the liquid resin is spread on the lower surface of the workpiece to form a resin film having a predetermined thickness sandwiched between the sheet member and the workpiece. In this state, the liquid resin is cured by applying an external stimulus.

  According to the present invention, even if the temperature in the apparatus changes, the liquid resin can maintain a constant viscosity of the liquid resin by efficiently adjusting the temperature of the liquid resin, thereby obtaining a resin film having a uniform thickness. There is an effect that a coating apparatus is provided.

It is a perspective view of the resin coating apparatus which concerns on one Embodiment of this invention. It is a side view which shows typically the structure of the resin coating device. It is a side view which shows typically the structure of the liquid resin discharge means of the resin coating device. It is a side view showing resin application operation of the resin application device. It is a block diagram which shows the structure of the control means of the resin coating apparatus. It is a diagram which shows an example of the control table with which the control means of the resin application apparatus is provided.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 schematically shows the appearance of a resin coating apparatus 1 according to an embodiment. Reference numeral 11 in FIG. 1 is an apparatus base 11 in which a post 12 is erected on one end side. A disk-shaped stage 20 is disposed on the post 12 side on the apparatus base 11, and a transparent sheet member made of a long strip-shaped polyolefin rolls on the other end opposite to the post 12. The sheet member roll SR accumulated in a shape is rotatably arranged so that the sheet member can be supplied in the direction of the stage 20. As will be described later, the stage 20 is formed of a transparent member that can transmit ultraviolet rays.

  From the sheet member roll SR, the sheet member is unwound to the stage 20 side. The unwound sheet member is cut into a predetermined rectangular shape by the cutter unit 31, and the cut sheet member S is conveyed onto the stage 20 by the sheet member conveying unit 32 as shown in FIG. It is supposed to be placed. The stage 20 has a horizontal upper surface that serves as a holding surface 21 for the sheet member S. The sheet member S is placed on the holding surface 21 and is sucked from below by a negative pressure means (not shown). Is sucked in.

  As shown in FIGS. 1 and 2, a discharge nozzle 42 is disposed at a predetermined location on the apparatus base 11. The discharge nozzle 42 constitutes a part of the liquid resin discharge means 40 shown in FIG. The liquid resin discharge means 40 supplies the liquid resin P from the discharge nozzle 42 to the upper surface of the sheet member S held on the stage 20, and the discharge nozzle 42 is connected to the downstream end as shown in FIG. A piping path 41 having a resin tank 43 connected to the upstream end is provided. In the middle of the piping path 41, a buffer tank 44 and a pump 45 are arranged from the upstream side toward the downstream side. The liquid resin P is, for example, a cured resin that has a viscosity of 500 to 5000 mPa and is solvent-free. In the present embodiment, an ultraviolet curable resin is preferably used.

  In the buffer tank 44, the liquid resin P is supplied from the resin tank 43 and stored in a predetermined range, and the liquid resin P in the buffer tank 44 is sent to the discharge nozzle 42 by the pump 45. The pump 45 is of a type that sucks and discharges a predetermined amount of liquid resin such as a bellows pump.

  The liquid resin discharge means 40 includes a resin temperature measurement means 46 that measures the temperature of the liquid resin P that is transported through the temperature adjustment region 41a that connects the pump 45 and the discharge nozzle 42, and a temperature adjustment region 41a. And a resin temperature adjusting means 47 for adjusting the temperature of the liquid resin P in the region 41a. For example, the resin temperature adjusting means 47 cools the temperature adjusting region 41a by flowing cooling water inside the tubular body surrounding the temperature adjusting region 41a of the piping path 41, and the temperature of the liquid resin P is adjusted by the flow rate. The form of is applied.

  The discharge nozzle 42 is supported by the apparatus base 11 so that turning is possible. The discharge nozzle 42 is swung by discharge nozzle moving means 421 housed in the apparatus base 11 and constituting the liquid resin discharge means 40, and can discharge liquid resin on the upper surface of the sheet member S above the stage 20. It is selectively positioned at the discharge position and the retracted position that does not interfere with the pressing means 50 disposed above the stage 20.

  The pressing means 50 places and presses a disk-shaped workpiece W such as a semiconductor wafer on the liquid resin P discharged and supplied from the discharge nozzle 42 on the upper surface of the sheet member S, as shown in FIG. Further, a pressing member 51 disposed above the stage 20 and having a horizontal lower surface facing the stage 20 formed as a pressing surface 511, and a direction in which the pressing member 51 is perpendicular to the holding surface 21 of the stage 20, that is, It has a moving means 52 that moves up and down along the vertical direction and moves it closer to or away from the holding surface 21, and a pressing load measuring means 53 that measures the pressing load value of the pressing member 51.

  As shown in FIGS. 1 and 2, the moving means 52 is supported by a front surface of the post 12 so as to be vertically movable via a guide 13, and a slider 521 having a nut member 521a fixed to the back surface, and a vertical direction. And a ball screw 522 that is rotatably supported by being screwed into the nut member 521a, and a motor 523 that rotationally drives the ball screw 522, and the pressing means 50 is fixed to the front surface of the slider 521. . In the moving means 52, when the ball screw 522 is rotationally driven by the motor 523, the slider 521 moves up and down in accordance with the rotation direction, and thereby the pressing member 51 moves up and down. Similar to the holding surface 21 of the stage 20, the workpiece W is sucked and held by the negative pressure means on the pressing surface 511 of the pressing member 51.

  In the resin coating apparatus 1 according to the present embodiment, the discharge nozzle positioned at the discharge position on the upper surface of the sheet member S as shown in FIG. 4A in a state where the sheet member S is sucked and held on the holding surface 21 of the stage 20. A predetermined amount of liquid resin P is supplied from 42, and then the discharge nozzle 42 is positioned at a retracted position outside the stage 20. Next, as shown in FIG. 4B, the pressing member 51 is lowered by the moving means 52, and the liquid resin P on the sheet member S is pressed by the work W, and the liquid resin P spreads on the lower surface of the work W and the resin film P1 is formed.

  As shown in FIG. 4B, an ultraviolet irradiation means (external stimulus applying means) 60 for irradiating ultraviolet rays toward the upper stage 20 is accommodated in the apparatus base 11. The irradiated ultraviolet rays pass through the transparent stage 20 and the sheet member S and are irradiated to the resin film P1. As a result, the resin film P1 is cured, and a resin film P1 that covers the lower surface of the workpiece W is formed. Thereafter, the pressing member 51 is raised and the workpiece W is peeled from the pressing surface 511, thereby obtaining the workpiece W having the sheet member S adhered to one surface via the resin film P1.

  The resin coating apparatus 1 according to the present embodiment includes a control unit 70 shown in FIG. The control unit 70 controls the resin temperature adjusting unit 47 and the moving unit 52. The control unit 70 includes the temperature measurement value of the liquid resin P measured by the resin temperature measuring unit 46 and the pressing load measuring unit 53. And the pressing load value measured in step (b).

  The control unit 70 includes a CPU (calculation unit) 71 that performs arithmetic processing according to a control program, a ROM 72 that stores a control program and the like, a readable / writable RAM (storage unit) 73 that stores calculation results and the like, an input interface 74 and An output interface 75 is provided. The input interface 74 receives the temperature measurement value signal of the liquid resin P measured by the resin temperature measurement means 46 and the pressure load value signal measured by the pressure load measurement means 53. Further, a control signal is sent from the output interface 55 to the motor 523 of the moving means 52 and the resin temperature adjusting means 47.

  In the RAM 73 of the control means 70, as a control table, pressing means for pressing the liquid resin P discharged on the upper surface of the sheet member S shown in FIG. 6A to form a resin film P1 having a predetermined thickness. The relationship between the pressure load value by 50 and the viscosity of the liquid resin P and the relationship between the temperature of the liquid resin P shown in FIG. 6B and the change in the viscosity of the liquid resin P accompanying the change in the temperature are stored in advance. Has been.

  The control means 70 performs the following control when the liquid resin P supplied to the upper surface of the sheet member S is pressed by the pressing means 50 as described above. That is, the temperature measurement value of the liquid resin P conveyed from the temperature adjustment region 41 a of the piping path 41 sent from the resin temperature measurement means 46 and the pressure load value sent from the pressure load measurement means 53 are stored in the RAM 73. . Then, when the liquid resin P discharged on the upper surface of the sheet member S is pressed to form the resin film P1 having a predetermined thickness, the pressing load value and the viscosity of the liquid resin P shown in FIG. And the relationship between the temperature of the liquid resin P shown in FIG. 6B and the change in the viscosity accompanying the change in the temperature, the pressing load that changes due to the operation of the moving means 52 is set to a predetermined value. Then, a resin film P1 having a predetermined thickness is formed.

  For this purpose, the CPU 71 calculates the temperature of the liquid resin P at which the liquid resin P has an appropriate viscosity, and the temperature of the liquid resin P sent to the control means 70 is equal to the temperature calculated by the CPU 71. The temperature adjusting means 47 is controlled. As a result, the temperature of the liquid resin P transported through the temperature adjustment region 41a of the piping path 41 is always constant, and the viscosity of the liquid resin P is a predetermined value that can form a resin film P1 having a predetermined thickness when pressed with a predetermined pressing load. The viscosity is controlled.

  According to the resin coating apparatus 1 of the present embodiment, the temperature of the liquid resin P conveyed through the temperature adjustment region 41a immediately before the liquid resin P is discharged from the discharge nozzle 42 in the piping path 41 is measured, and the temperature is determined as the resin temperature. Control is performed to make the viscosity of the liquid resin P discharged from the discharge nozzle 42 constant by efficiently adjusting the adjustment unit 47 to be constant. The constant viscosity of the liquid resin P is a viscosity at which the resin film P1 having a predetermined thickness is formed on the upper surface of the sheet member S with a predetermined pressing load. Thereby, even if the temperature in the apparatus changes, the viscosity of the liquid resin P applied to the sheet member S can always be constant, so that the liquid resin P having a predetermined viscosity is pressed with a predetermined pressing load. be able to. As a result, the resin film P1 formed on the sheet member S is always formed with a uniform thickness.

  The liquid resin P in the above embodiment is an ultraviolet curable resin that cures by using ultraviolet light as an external stimulus. Alternatively, for example, a thermosetting resin that cures by using heat as an external stimulus may be used. In that case, a heating unit is used instead of the ultraviolet irradiation unit 60.

DESCRIPTION OF SYMBOLS 1 ... Resin coating device 20 ... Stage 21 ... Holding surface 40 ... Liquid resin discharge means 41 ... Piping path 42 ... Discharge nozzle 421 ... Discharge nozzle moving means 43 ... Resin tank 45 ... Pump 46 ... Resin temperature measurement means 47 ... Resin temperature adjustment Means 50 ... Pressing means 51 ... Pressing member 511 ... Pressing surface of pressing member 52 ... Moving means 53 ... Pressure load measuring means 60 ... Ultraviolet irradiation means (external stimulus applying means)
70 ... Control means 71 ... CPU (calculation means)
73 ... RAM (storage means)
P ... Liquid resin P1 ... Resin film S ... Sheet member W ... Workpiece

Claims (3)

A liquid resin is supplied to the upper surface of the sheet member held on the stage, a plate-like workpiece is placed on the liquid resin and pressed, and the liquid resin is spread on the lower surface of the workpiece to spread the sheet member and the workpiece. A resin coating apparatus that forms a resin film having a predetermined thickness sandwiched between the workpiece and the sheet member,
A stage for holding the sheet member, a liquid resin discharging means for discharging a liquid resin on the upper surface of the sheet member held on the stage, and the work placed on the liquid resin discharged on the upper surface of the sheet member A pressing means for pressing, and a control means for controlling the pressing means,
The stage has a holding surface for sucking and holding the sheet member,
The liquid resin discharge means includes a resin tank that stores the liquid resin, a piping path that conveys the liquid resin stored in the resin tank, a discharge nozzle that discharges the liquid resin, and a predetermined amount of the liquid resin. A pump to be sent to the discharge nozzle, a resin temperature measuring means for measuring the temperature of the liquid resin in the piping path connecting the pump and the discharge nozzle and sending it to the control means, and the pump and the discharge nozzle. Resin temperature adjusting means for adjusting the temperature of the liquid resin in the piping path for cooling or heating the piping path to be connected to connect the pump and the discharge nozzle;
The pressing means includes a pressing member disposed above the stage and having a pressing surface formed on the lower surface for sucking and holding the work against the stage, and the pressing member with respect to the holding surface of the stage. A moving means for moving the workpiece toward or away from the vertical direction, and a pressing load value when the pressing member places and presses the workpiece on the liquid resin discharged on the upper surface of the sheet member held on the stage. Pressing load measuring means for measuring and sending to the control means,
The control means is a memory means for storing the temperature of the liquid resin sent from the resin temperature measuring means and a pressing load value sent from the pressing load measuring means, and is discharged onto the upper surface of the sheet member. The relationship between the pressure load value when the liquid resin is pressed to form a resin film having a predetermined thickness and the viscosity of the liquid resin, and the temperature of the liquid resin and the change in viscosity accompanying the change in temperature. And calculating means for calculating the temperature of the liquid resin at which the liquid resin exhibits an appropriate viscosity when the pressure load is set to a predetermined value to form a resin film having a predetermined thickness. The pressure load during pressing by the pressing means is controlled to a predetermined value, and the temperature of the liquid resin measured by the resin temperature measuring means and sent to the control means is calculated by the calculating means. The resin temperature is adjusted to be equal to the measured temperature. Resin coating apparatus and controls the means. The liquid resin discharge means is a discharge that selectively positions the discharge nozzle at a discharge position where the liquid resin can be discharged onto the upper surface of the sheet member held by the stage and a retreat position where the liquid resin does not interfere with the pressing means. The resin coating apparatus according to claim 1, further comprising a nozzle moving unit. The liquid resin is an external stimulus curable liquid resin that is cured by an external stimulus, and an external stimulus applying means for adding an external stimulus is disposed on the stage,
The external stimulus applying means is a resin having a predetermined thickness sandwiched between the sheet member and the work by the pressing means pressing the work on the stage and spreading the liquid resin on the lower surface of the work. 3. The resin coating apparatus according to claim 1, wherein after the film is formed, the liquid resin is cured by applying an external stimulus.

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